CN117688803A - Design method and system of excimer discharge light source - Google Patents
Design method and system of excimer discharge light source Download PDFInfo
- Publication number
- CN117688803A CN117688803A CN202311602169.XA CN202311602169A CN117688803A CN 117688803 A CN117688803 A CN 117688803A CN 202311602169 A CN202311602169 A CN 202311602169A CN 117688803 A CN117688803 A CN 117688803A
- Authority
- CN
- China
- Prior art keywords
- value
- thermal stress
- thermal
- model
- moderate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000013461 design Methods 0.000 title claims abstract description 43
- 230000008646 thermal stress Effects 0.000 claims abstract description 120
- 238000004925 denaturation Methods 0.000 claims abstract description 77
- 230000036425 denaturation Effects 0.000 claims abstract description 77
- 230000005855 radiation Effects 0.000 claims abstract description 68
- 238000009826 distribution Methods 0.000 claims abstract description 34
- 238000010586 diagram Methods 0.000 claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims description 25
- 230000008859 change Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 238000004590 computer program Methods 0.000 claims description 8
- 238000003505 heat denaturation Methods 0.000 claims description 8
- 238000004458 analytical method Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 238000005457 optimization Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000004422 calculation algorithm Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000003708 edge detection Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 238000010183 spectrum analysis Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention belongs to the technical field of auxiliary design of excimer discharge light sources, and provides a design method and a system of an excimer discharge light source, wherein the design method comprises the following steps: acquiring a three-dimensional model of the excimer lamp; the three-dimensional model is imported into thermal stress analysis software, and the three-dimensional model is used as a model to be analyzed; dividing a thermal stress grid into a model to be analyzed to obtain a thermal stress distribution diagram of a heat radiation fin area inside the lamp; graying the thermal stress distribution diagram, and sequentially calculating the thermal denaturation moderate value of the heat radiation fin area; traversing each radiating fin area in sequence to obtain the maximum thermal denaturation moderate value of the model to be analyzed; and adjusting the thickness of the areas of the heat radiation fins with the thermal denaturation moderate values smaller than the maximum thermal denaturation moderate value in the model to be analyzed, so that the thermal denaturation moderate values of the areas of all the heat radiation fins are larger than or equal to the maximum thermal denaturation moderate value. According to the design method provided by the embodiment of the invention, the temperature drift can be reduced, and the photoelectric conversion efficiency of the excimer lamp can be improved.
Description
Technical Field
The invention belongs to the technical field of auxiliary design of excimer discharge light sources, and particularly relates to a design method and a system of an excimer discharge light source.
Background
Excimer lamps are an important light source widely used in spectroscopic analysis, optical measurements, lasers and other scientific research, industrial and medical applications. The principle of an excimer lamp is to excite an excimer by dielectric barrier discharge (DBD, dielectric Barrier Discharge) and to generate narrow-band radiation in the Vacuum Ultraviolet (VUV) and Ultraviolet (UV) regions; however, in the practical application of excimer lamps, problems may arise that threaten the performance and stability thereof, one of the main problems being temperature drift (Temperature Drift). The temperature drift refers to the unstable fluctuation phenomenon of the output spectrum or power of the excimer lamp along with the increase of the working time or the change of the temperature of the lamp. Such fluctuations may lead to inaccurate measurements or unstable production processes, especially in applications requiring high precision measurements or long runs.
One of the main reasons for temperature drift is that the temperature distribution inside the lamp is uneven, and a large amount of heat can be generated inside the lamp under the condition of high-power operation or long-time operation, but if the heat dissipation is insufficient, the local temperature is increased, so that the characteristics and the spectral output of gas are changed, however, the heat dissipation problem is not fully considered in the design of the existing excimer lamp, the temperature gradient is large, and the temperature drift phenomenon is caused. And, the temperature drift is related to the heat sink fin area inside the lamp, which not only serves to conduct the generated heat to the external environment, but also helps to maintain a uniform temperature distribution inside the lamp. When the lamp works, the heat dissipation fins can effectively disperse heat so as to prevent local temperature rise. However, if the design of the heat sink fins is not reasonable or the mounting position is not proper, a large temperature gradient may be caused, which may cause a temperature drift problem.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems in the related art to some extent. Therefore, the first object of the present invention is to propose a design method of an excimer discharge light source, which can reduce temperature drift and improve photoelectric conversion efficiency of an excimer lamp;
a second object of the present invention is to provide a design system of an excimer discharge light source.
To achieve the above object, an embodiment of a first aspect of the present invention provides a method for designing an excimer discharge light source, the method comprising the steps of:
s100, acquiring a three-dimensional model of an excimer lamp;
s200, importing the three-dimensional model into thermal stress analysis software, and taking the three-dimensional model as a model to be analyzed;
s300, dividing a thermal stress grid into a model to be analyzed to obtain a thermal stress distribution diagram of a heat radiation fin area inside the lamp;
s400, graying the thermal stress distribution diagram, and sequentially calculating thermal denaturation moderate values of the heat radiation fin areas;
s500, traversing each radiating fin area in sequence to obtain the maximum thermal denaturation moderate value of the model to be analyzed;
and S600, adjusting the thickness of the areas of the heat radiation fins with the thermal denaturation moderate values smaller than the maximum thermal denaturation moderate value in the model to be analyzed, so that the thermal denaturation moderate values of the areas of all the heat radiation fins are larger than or equal to the maximum thermal denaturation moderate value, and obtaining the adjusted three-dimensional model.
According to the design method, the three-dimensional model manufactured excimer lamp with the thickness difference value to be adjusted dynamically adjusted can better conduct generated heat evenly, avoid the temperature drift effect, and can be kept stable in applications requiring high-precision measurement or long-time operation.
Preferably, the excimer lamp can adopt a planar structure and a flat lamp tube, and is made of quartz glass.
Further, in S200, the thermal stress analysis software is Workbench software.
Further, in S300, the method for obtaining the thermal stress distribution map of the heat dissipation fin area inside the lamp by dividing the thermal stress grid by the model to be analyzed includes: opening a material definition interface of Workbench software, and adding the material on the model to be analyzed with the thermal expansion coefficient, the reference temperature, the linear elastic parameter and the thermal conductivity coefficient attribute of the corresponding material; dividing a model to be analyzed into hexahedral grids by using a Sweep dividing method (Sweep), wherein the grid size is 0.15mm; in Steady-State Thermal, the following boundary conditions are added: the first curved surface applies a temperature boundary: 1100 ℃, the second curved surface applies a heat flow load: 5000W, fin imposed convection boundary: 5W/m 2 The ambient temperature is 36 ℃ and the initial temperature is 36 ℃; calculating the thermal stress of the model to be analyzed, and obtaining the model to be analyzed with thermal stress distribution; and reconstructing structural grids of the analysis model by using an arbitrary Lagrangian-Euler method to obtain thermal stress values of a grid set reconstructed by the analysis model with thermal stress distribution, thereby obtaining a thermal stress distribution diagram.
Further, in S400, the thermal stress distribution map is subjected to gray scale, and the thermal denaturation fitness value of each fin region is sequentially calculated as follows:
s401, dividing a heat radiation fin area in a thermal stress distribution diagram.
Specifically, the thermal stress distribution map is converted into a gray map, the gray map is recorded as a thermal stress gray map, and then edge lines of the image subregions are identified by using an edge detection algorithm, so that each image subregion formed by the edge lines is obtained. Of these image subregions, image subregions provided with heat sink fins are marked as heat sink fin regions to clarify their positions in the image.
S402, calculating the thermal denaturation moderate value of the heat radiation fin area.
Specifically, let the set of heat radiation fin areas in the thermal stress gray scale map be radio= { radio (i 1) }, take variable i1 as the serial number of the heat radiation fin areas in radio, i1 e [1, K1], K1 is the number of the heat radiation fin areas; the Radiati (i 1) is the i1 th radiating fin area, and the thermal denaturation moderate value of the Radiati (i 1) is calculated in the value range of the i 1.
Further, the method for calculating the thermal denaturation fitness value of the radius (i 1) comprises the following steps:
according to the thermal stress distribution diagram, obtaining the thermal stress value of each finite element grid in the radius (i 1); wherein the thermal stress values are obtained by mapping the locations of the finite element mesh to pixels at corresponding locations in the thermal stress profile and calculating an average of the temperature values of the pixels;
obtaining the number K2 of the finite element grids in the raditi (i 1), expressing the thermal stress value in the finite element grid with the serial number i2 in the raditi (i 1) by sigma (i 1, i 2), calculating the thermal stress value with the minimum thermal stress value in each finite element grid in the raditi (i 1) as the minimum thermal stress value Msigma, and obtaining the median number of the raditi (i 1) as the easy-to-float thermal stress value Gsigma;
calculating a thermal denaturation fitness value RX (i 1) of the radius (i 1) by a first equation
Where σ (i 1, i 2) is the thermal stress value of the i2 nd finite element mesh in the i1 st fin region. Thermal stress means stress within the finite element mesh due to temperature changes. K2 is the number of finite element meshes in the region of the fin and represents the number of meshes in that region. Mσ is the minimum of the thermal stress values of all the finite element grids in the fin region, and represents the lowest thermal stress condition in the fin region is also the optimal thermal stress level in an ideal case, gσ is the median of the thermal stress values of all the finite element grids in the fin region, and the thermal stress median is the thermal stress value in which the temperature drift is most likely to occur in the fin region in actual use.Summing the thermal stress values of all the finite element grids in the radiator fin region represents the radiator finThe sum of the thermal stress values in the region.
Specifically, in order to evaluate the extent of influence of each finite element mesh in the heat sink area on the temperature drift problem of the excimer lamp. The embodiment is realized byRepresenting the relative contribution degree of thermal stress, reflecting the contribution degree of each grid to the overall thermal stress by comparing the product of the total finite element grid number in the radiating fin region and the minimum thermal stress value with the sum of the thermal stresses of all grids in the region, then calculating a thermal denaturation moderate value RX (i 1) according to the relative contribution degree of the thermal stress to quantitatively measure the influence of each radiating fin region in the temperature drift problem, and determining which radiating fin regions have greater influence on the excimer lamp temperature drift problem by calculating the thermal denaturation moderate value RX (i 1) value, wherein the regions with lower thermal denaturation moderate value RX (i 1) need more attention and optimization, so that engineers can purposefully improve the design to reduce the temperature drift effect; by optimizing the design of the high thermal denaturation moderate value region, the system can be more easily kept stable in temperature when the excimer lamp runs at high power or for a long time, so that the accuracy and reliability of spectrum analysis and optical measurement are improved; by targeted optimization of the high thermal denaturation fitness value region, unnecessary engineering improvement and material costs can be reduced, which can more effectively allocate resources, focus effort on the region that has the greatest impact on system performance, and avoid design by subjective judgment or experience.
Further, in S500, each heat radiation fin area is traversed in turn, so as to obtain a maximum thermal denaturation moderate value of the model to be analyzed;
specifically, the thermal denaturation moderate value of each heat radiation fin area is obtained through a first equation, the thermal denaturation moderate value of each heat radiation fin area is compared, and the maximum thermal denaturation moderate value is recorded as RXM.
And S600, adjusting the thickness of the areas of the heat radiation fins with the thermal denaturation moderate values smaller than the maximum thermal denaturation moderate value in the model to be analyzed, so that the thermal denaturation moderate values of the areas of all the heat radiation fins are larger than or equal to the maximum thermal denaturation moderate value, and obtaining the adjusted three-dimensional model.
Specifically, the method for adjusting the thickness of the area of the heat radiation fin with the thermal denaturation moderate value larger than or equal to the maximum thermal denaturation moderate value in the model to be analyzed comprises the following steps:
s601, the area of each heat-denaturation moderate value of the heat-dissipation fins in the model to be analyzed is recorded as the area of the heat-dissipation fins to be adjusted, the serial number of the area of the heat-dissipation fins to be adjusted is extracted and recorded as i3, and i3 is the serial number of the area of the heat-dissipation fins to be adjusted.
S602, taking the average thickness value of all the finite element grids in the area of the radiating fin to be adjusted as an original average thickness value HC (i 3);
s603, calculating a thickness difference HX (i 3) of the area of the heat radiation fin to be adjusted, wherein the thickness difference HX is required to be adjusted;
forming a sequence of thermal moderation values of each radiating fin area as a writing sequence RXLST 1; and sequentially and respectively calculating the ratio of the thermal moderation value to RXM in RXLST 1, wherein the thickness difference HX (i 3) to be adjusted is the original average thickness value HC (i 3) multiplied by F of the area of the radiation fin, and F is the absolute value obtained by subtracting the ratio of the corresponding thermal moderation value to RXM from 1.
The ratio between each thermal change moderate value and RXM means the difference between the thermal stress of different heat radiation fin areas, and the difference may occur due to the single thickness of the heat radiation fins in the model, so that the thermal change moderate value is different, the thickness difference is calculated through the thermal change moderate value, the difference of the thermal stress can be well corrected, and the temperature drift is reduced.
However, since the thickness difference value HX (i 3) to be adjusted is calculated to be relatively fixed, in practical use, the thermal stress median is the most likely temperature drift of the heat dissipation fin region, and the thermal stress median is used as a separate reference factor to be more helpful to solve the temperature drift when the thickness difference value HX (i 3) to be adjusted is calculated, the present invention proposes the following preferred method for calculating the thickness difference value HX (i 3) to be adjusted of the heat dissipation fin region to be adjusted:
preferably, the method for calculating the thickness difference HX (i 3) to be adjusted of the area of the heat dissipation fin to be adjusted is as follows:
wherein HX (i 3) is the thickness difference value which needs to be adjusted in the area of the radiation i (i 3) radiating fins, the area of the HC (i 3) radiating fins is the original average thickness value of the area of the radiation i (i 3) radiating fins, and K1 represents the number of the areas of the radiating fins; ln represents the natural logarithm (the logarithm based on e), gσ is the median of the thermal stress values of all the finite element meshes in the heat radiation fin region, and the thermal stress median is the thermal stress value of the heat radiation fin region most prone to temperature drift in actual use; RXM is the maximum thermal denaturation moderate value, wherein the logarithmic treatment of the denaturation moderate values RX (i 3) +RXM and Gsigma can prevent the uneven structure of some heat radiation fins, and the occurrence of larger thermal denaturation moderate values causes the occurrence of great difference in adjustment of each heat radiation fin caused by overlarge thickness interpolation, so that the heat radiation fins become irregular after adjustment, thereby influencing the manufacturing process of the fins. By calculation ofAnd->The thermal denaturation moderate value (RXM) of the areas of all the radiating fins is larger than or equal to the maximum thermal denaturation moderate value, so that the areas of each radiating fin are stable in the aspect of thermal stress balance, and the occurrence probability and influence of whole temperature drift are further reduced.
S604, adjusting the thickness of the area of the heat radiation fin to be adjusted according to the thickness difference value to obtain an adjusted three-dimensional model.
Specifically, the thickness of the area of the radiating fin to be adjusted is adjusted to HC (i 3) +HX (i 3)
The three-dimensional model manufacturing excimer lamp which is dynamically adjusted according to the thickness difference value which is required to be adjusted can better conduct generated heat away uniformly, avoid generating temperature drift effect, and can be kept stable in applications which need high-precision measurement or long-time operation.
To achieve the above object, an embodiment of the second aspect of the present invention further provides a design system of an excimer discharge light source, the design system of the excimer discharge light source comprising: the system comprises a processor, a memory and a computer program which is stored in the memory and can run on the processor, wherein the processor realizes the steps in a design method of an excimer discharge light source when executing the computer program, and the design system of the excimer discharge light source runs in computing equipment of a desktop computer, a notebook computer, a palm computer and a cloud data center.
The design method of the excimer discharge light source is executed by the design system of the excimer discharge light source, so that the temperature drift can be reduced, and the photoelectric conversion efficiency of the excimer lamp can be improved.
Drawings
FIG. 1 is a flow chart of a method for designing an excimer discharge light source;
FIG. 2 is a schematic diagram of a system for designing an excimer discharge light source.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
FIG. 1 is a flow chart of a design method of an excimer discharge light source.
Referring to fig. 1, the present invention proposes a design method of an excimer discharge light source, the method comprising the steps of:
s100, acquiring a three-dimensional model of an excimer lamp;
s200, importing the three-dimensional model into thermal stress analysis software, and taking the three-dimensional model as a model to be analyzed;
s300, dividing a thermal stress grid into a model to be analyzed to obtain a thermal stress distribution diagram of a heat radiation fin area inside the lamp;
s400, graying the thermal stress distribution diagram, and sequentially calculating thermal denaturation moderate values of the heat radiation fin areas;
s500, traversing each radiating fin area in sequence to obtain the maximum thermal denaturation moderate value of the model to be analyzed;
and S600, adjusting the thickness of the areas of the heat radiation fins with the thermal denaturation moderate values smaller than the maximum thermal denaturation moderate value in the model to be analyzed, so that the thermal denaturation moderate values of the areas of all the heat radiation fins are larger than or equal to the maximum thermal denaturation moderate value, and obtaining the adjusted three-dimensional model.
According to the design method, the three-dimensional model manufactured excimer lamp with the thickness difference value to be adjusted dynamically adjusted can better conduct generated heat evenly, avoid the temperature drift effect, and can be kept stable in applications requiring high-precision measurement or long-time operation.
Preferably, the excimer lamp can adopt a planar structure and a flat lamp tube, and is made of quartz glass.
Further, in S200, the thermal stress analysis software is Workbench software.
Further, in S300, the method for obtaining the thermal stress distribution map of the heat dissipation fin area inside the lamp by dividing the thermal stress grid by the model to be analyzed includes: opening a material definition interface of Workbench software, and adding the material on the model to be analyzed with the thermal expansion coefficient, the reference temperature, the linear elastic parameter and the thermal conductivity coefficient attribute of the corresponding material; dividing a model to be analyzed into hexahedral grids by using a Sweep dividing method (Sweep), wherein the grid size is 0.15mm; in Steady-State Thermal, the following boundary conditions are added: the first curved surface applies a temperature boundary: 1100 ℃, the second curved surface applies a heat flow load: 5000W, fin imposed convection boundary: 5W/m 2 The ambient temperature is 36 ℃ and the initial temperature is 36 ℃; calculating the thermal stress of the model to be analyzed, and obtaining the model to be analyzed with thermal stress distribution; then pass through Lagrangian-EuropeAnd carrying out structural grid reconstruction on the analysis model by a pulling method, and obtaining a thermal stress value of a grid set with thermal stress distribution after the reconstruction of the analysis model, thereby obtaining a thermal stress distribution diagram.
Further, in S400, the thermal stress distribution map is subjected to gray scale, and the thermal denaturation fitness value of each fin region is sequentially calculated as follows:
s401, dividing a heat radiation fin area in a thermal stress distribution diagram.
Specifically, the thermal stress distribution map is converted into a gray map, the gray map is recorded as a thermal stress gray map, and then edge lines of the image subregions are identified by using an edge detection algorithm, so that each image subregion formed by the edge lines is obtained. Of these image subregions, image subregions provided with heat sink fins are marked as heat sink fin regions to clarify their positions in the image.
S402, calculating the thermal denaturation moderate value of the heat radiation fin area.
Specifically, let the set of heat radiation fin areas in the thermal stress gray scale map be radio= { radio (i 1) }, take variable i1 as the serial number of the heat radiation fin areas in radio, i1 e [1, K1], K1 is the number of the heat radiation fin areas; the Radiati (i 1) is the i1 th radiating fin area, and the thermal denaturation moderate value of the Radiati (i 1) is calculated in the value range of the i 1.
Further, the method for calculating the thermal denaturation fitness value of the radius (i 1) comprises the following steps:
according to the thermal stress distribution diagram, obtaining the thermal stress value of each finite element grid in the radius (i 1); wherein the thermal stress values are obtained by mapping the locations of the finite element mesh to pixels at corresponding locations in the thermal stress profile and calculating an average of the temperature values of the pixels;
obtaining the number K2 of the finite element grids in the raditi (i 1), expressing the thermal stress value in the finite element grid with the serial number i2 in the raditi (i 1) by sigma (i 1, i 2), calculating the thermal stress value with the minimum thermal stress value in each finite element grid in the raditi (i 1) as the minimum thermal stress value Msigma, and obtaining the median number of the raditi (i 1) as the easy-to-float thermal stress value Gsigma;
calculating a thermal denaturation fitness value RX (i 1) of the radius (i 1) by a first equation
Where σ (i 1, i 2) is the thermal stress value of the i2 nd finite element mesh in the i1 st fin region. Thermal stress means stress within the finite element mesh due to temperature changes. K2 is the number of finite element meshes in the region of the fin and represents the number of meshes in that region. Mσ is the minimum of the thermal stress values of all the finite element grids in the fin region, and represents the lowest thermal stress condition in the fin region is also the optimal thermal stress level in an ideal case, gσ is the median of the thermal stress values of all the finite element grids in the fin region, and the thermal stress median is the thermal stress value in which the temperature drift is most likely to occur in the fin region in actual use.Summing the thermal stress values of all the finite element meshes in the fin region represents the sum of the thermal stress values in the fin region.
Specifically, in order to evaluate the extent of influence of each finite element mesh in the heat sink area on the temperature drift problem of the excimer lamp. The embodiment is realized byRepresenting the relative contribution of thermal stress, reflecting the contribution of each grid to the overall thermal stress by comparing the product of the total finite element grid number and the minimum thermal stress value in the heat sink fin region with the sum of thermal stresses of all grids in the region, then calculating a thermal denaturation fitness value RX (i 1) based on the relative contribution of thermal stress can quantitatively measure the influence of each heat sink fin region in the temperature drift problem, by calculating the thermal denaturation fitness value RX (i 1) values, it can be determined which heat sink fin regions have a greater influence on the excimer lamp temperature drift problem, the region with a lower thermal denaturation fitness value RX (i 1) requires more attention and optimization, and the work can be madeThe engineer can purposefully improve the design to reduce the temperature drift effect; by optimizing the design of the high thermal denaturation moderate value region, the system can be more easily kept stable in temperature when the excimer lamp runs at high power or for a long time, so that the accuracy and reliability of spectrum analysis and optical measurement are improved; by targeted optimization of the high thermal denaturation fitness value region, unnecessary engineering improvement and material costs can be reduced, which can more effectively allocate resources, focus effort on the region that has the greatest impact on system performance, and avoid design by subjective judgment or experience.
Further, in S500, each heat radiation fin area is traversed in turn, so as to obtain a maximum thermal denaturation moderate value of the model to be analyzed;
specifically, the thermal denaturation moderate value of each heat radiation fin area is obtained through a first equation, the thermal denaturation moderate value of each heat radiation fin area is compared, and the maximum thermal denaturation moderate value is recorded as RXM.
And S600, adjusting the thickness of the areas of the heat radiation fins with the thermal denaturation moderate values smaller than the maximum thermal denaturation moderate value in the model to be analyzed, so that the thermal denaturation moderate values of the areas of all the heat radiation fins are larger than or equal to the maximum thermal denaturation moderate value, and obtaining the adjusted three-dimensional model.
Specifically, the method for adjusting the thickness of the area of the heat radiation fin with the thermal denaturation moderate value larger than or equal to the maximum thermal denaturation moderate value in the model to be analyzed comprises the following steps:
s601, the area of each heat-denaturation moderate value of the heat-dissipation fins in the model to be analyzed is recorded as the area of the heat-dissipation fins to be adjusted, the serial number of the area of the heat-dissipation fins to be adjusted is extracted and recorded as i3, and i3 is the serial number of the area of the heat-dissipation fins to be adjusted.
S602, taking the average thickness value of all the finite element grids in the area of the radiating fin to be adjusted as an original average thickness value HC (i 3);
s603, calculating a thickness difference HX (i 3) of the area of the heat radiation fin to be adjusted, wherein the thickness difference HX is required to be adjusted;
forming a sequence of thermal moderation values of each radiating fin area as a writing sequence RXLST 1; and sequentially and respectively calculating the ratio of the thermal moderation value to RXM in RXLST 1, wherein the thickness difference HX (i 3) to be adjusted is the original average thickness value HC (i 3) multiplied by F of the area of the radiation fin, and F is the absolute value obtained by subtracting the ratio of the corresponding thermal moderation value to RXM from 1.
The ratio between each thermal change moderate value and RXM means the difference between the thermal stress of different heat radiation fin areas, and the difference may occur due to the single thickness of the heat radiation fins in the model, so that the thermal change moderate value is different, the thickness difference is calculated through the thermal change moderate value, the difference of the thermal stress can be well corrected, and the temperature drift is reduced.
However, since the thickness difference value HX (i 3) to be adjusted is calculated to be relatively fixed, in practical use, the thermal stress median is the most likely temperature drift of the heat dissipation fin region, and the thermal stress median is used as a separate reference factor to be more helpful to solve the temperature drift when the thickness difference value HX (i 3) to be adjusted is calculated, the present invention proposes the following preferred method for calculating the thickness difference value HX (i 3) to be adjusted of the heat dissipation fin region to be adjusted:
preferably, the method for calculating the thickness difference HX (i 3) to be adjusted of the area of the heat dissipation fin to be adjusted is as follows:
wherein HX (i 3) is the thickness difference value which needs to be adjusted in the area of the radiation i (i 3) radiating fins, the area of the HC (i 3) radiating fins is the original average thickness value of the area of the radiation i (i 3) radiating fins, and K1 represents the number of the areas of the radiating fins; ln represents the natural logarithm (the logarithm based on e), gσ is the median of the thermal stress values of all the finite element meshes in the heat radiation fin region, and the thermal stress median is the thermal stress value of the heat radiation fin region most prone to temperature drift in actual use; RXM is the maximum thermal denaturation fitness value, wherein the logarithmic treatment of denaturation fitness values RX (i 3) +RXM and Gσ prevents someThe heat radiation fins are uneven in structure, larger thermal change moderate value causes the thickness interpolation obtained by the meter to be too large, and great difference occurs in adjustment of each heat radiation fin, so that the heat radiation fins become irregular after adjustment, and the manufacturing process of the fins is affected. By calculation ofAnd->The thermal denaturation moderate value (RXM) of the areas of all the radiating fins is larger than or equal to the maximum thermal denaturation moderate value, so that the areas of each radiating fin are stable in the aspect of thermal stress balance, and the occurrence probability and influence of whole temperature drift are further reduced.
S604, adjusting the thickness of the area of the heat radiation fin to be adjusted according to the thickness difference value to obtain an adjusted three-dimensional model.
Specifically, the thickness of the area of the radiating fin to be adjusted is adjusted to HC (i 3) +HX (i 3)
The three-dimensional model manufacturing excimer lamp which is dynamically adjusted according to the thickness difference value which is required to be adjusted can better conduct generated heat away uniformly, avoid generating temperature drift effect, and can be kept stable in applications which need high-precision measurement or long-time operation.
FIG. 2 is a schematic diagram of a system for designing an excimer discharge light source.
Referring to fig. 2, the present invention further proposes a design system 20 of an excimer discharge light source, the design system 20 of an excimer discharge light source comprising: the system comprises a processor, a memory and a computer program stored in the memory and capable of running on the processor, wherein the processor realizes the steps in a design method of an excimer discharge light source when executing the computer program, and the design system 20 of the excimer discharge light source runs in computing equipment of a desktop computer, a notebook computer, a palm computer and a cloud data center.
The design system includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, the processor executing the computer program to run in the units of the following design system:
a model importing unit 21 for acquiring a three-dimensional model of the excimer lamp;
a thermal stress analysis unit 22 for importing a three-dimensional model into thermal stress analysis software, wherein the three-dimensional model is used as a model to be analyzed;
the heat dissipation analysis unit 23 is used for dividing a thermal stress grid into a model to be analyzed to obtain a thermal stress distribution diagram of a heat dissipation fin area inside the lamp;
a calculating unit 24, configured to gray the thermal stress distribution map, and sequentially calculate thermal denaturation moderate values of the heat dissipation fin areas;
and the processing unit 25 is used for traversing each radiating fin area in turn to obtain the maximum thermal denaturation moderate value of the model to be analyzed.
And a model correction unit 26, configured to adjust the thickness of the area of the heat dissipation fins where each thermal denaturation moderate value is smaller than the maximum thermal denaturation moderate value in the model to be analyzed, so that the thermal denaturation moderate value of the area of all the heat dissipation fins is greater than or equal to the maximum thermal denaturation moderate value, and obtain an adjusted three-dimensional model.
The design system of the excimer discharge light source can be operated in computing equipment such as a desktop computer, a notebook computer, a palm computer, a cloud server and the like. The design system of the excimer discharge light source can include, but is not limited to, a processor and a memory. It will be appreciated by those skilled in the art that the example is merely an example of one excimer discharge light source design system 20 and is not intended to be limiting of one excimer discharge light source design system 20, and may include more or fewer components than an example, or may combine certain components, or different components, e.g., the one excimer discharge light source design system may further include input and output devices, network access devices, buses, etc.
By executing the design method of the excimer discharge light source by the design system 20 of the excimer discharge light source, the temperature drift can be reduced, and the photoelectric conversion efficiency of the excimer lamp can be improved.
It should be noted that the logic and/or steps represented in the flowcharts or otherwise described herein, for example, may be considered as a ordered listing of executable instructions for implementing logical functions, and may be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). In addition, the computer readable medium may even be paper or other suitable medium on which the program is printed, as the program may be electronically captured, via, for instance, optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner, if necessary, and then stored in a computer memory.
It is to be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above-described embodiments, the various steps or methods may be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, may be implemented using any one or combination of the following techniques, as is well known in the art: discrete logic circuits having logic gates for implementing logic functions on data signals, application specific integrated circuits having suitable combinational logic gates, programmable Gate Arrays (PGAs), field Programmable Gate Arrays (FPGAs), and the like.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first," "second," and the like, as used in embodiments of the present invention, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying any particular number of features in the present embodiment. Thus, a feature of an embodiment of the invention that is defined by terms such as "first," "second," etc., may explicitly or implicitly indicate that at least one such feature is included in the embodiment. In the description of the present invention, the word "plurality" means at least two or more, for example, two, three, four, etc., unless explicitly defined otherwise in the embodiments.
In the present invention, unless explicitly stated or limited otherwise in the examples, the terms "mounted," "connected," and "fixed" as used in the examples should be interpreted broadly, e.g., the connection may be a fixed connection, may be a removable connection, or may be integral, and it may be understood that the connection may also be a mechanical connection, an electrical connection, etc.; of course, it may be directly connected, or indirectly connected through an intermediate medium, or may be in communication with each other, or in interaction with each other. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific embodiments.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (8)
1. A method of designing an excimer discharge light source, the method comprising the steps of:
s100, acquiring a three-dimensional model of an excimer lamp;
s200, importing the three-dimensional model into thermal stress analysis software, and taking the three-dimensional model as a model to be analyzed;
s300, dividing a thermal stress grid into a model to be analyzed to obtain a thermal stress distribution diagram of a heat radiation fin area inside the lamp;
s400, graying the thermal stress distribution diagram, and sequentially calculating thermal denaturation moderate values of the heat radiation fin areas;
s500, traversing each radiating fin area in sequence to obtain the maximum thermal denaturation moderate value of the model to be analyzed;
s600, adjusting the thickness of the areas of the heat radiation fins with the heat denaturation moderate values smaller than the maximum heat denaturation moderate value in the model to be analyzed, so that the heat denaturation moderate values of the areas of all the heat radiation fins are larger than or equal to the maximum heat denaturation moderate value, and obtaining an adjusted three-dimensional model;
in step S600, specifically, the method includes: recording the area of each heat denaturation moderate value smaller than the maximum heat denaturation moderate value in the heat radiation fin to be adjusted as the area of the heat radiation fin to be adjusted; taking the average thickness value of all the finite element grids in the area of the radiating fin to be adjusted as an original average thickness value; calculating the thickness difference value to be adjusted of the area of the radiating fin to be adjusted; and adjusting the thickness of the area of the radiating fin to be adjusted according to the thickness difference value to be adjusted, and obtaining the adjusted three-dimensional model.
2. The method for designing an excimer discharge light source according to claim 1, wherein the three-dimensional model of the excimer lamp is obtained by three-dimensional modeling of the excimer lamp by using any one of Blender software, MAYA software and 3ds max software.
3. The method for designing an excimer discharge light source according to claim 2, wherein the excimer discharge lamp adopts a coaxial double-layer quartz sleeve structure, the coaxial double-layer quartz sleeve structure comprises an inner tube and an outer tube and a sealed ionization discharge chamber is formed between the inner tube and the outer tube, and the outer tube comprises a first curved surface and a second curved surface; the first curved surface is a light-emitting surface, the second curved surface is a light-non-emitting reflecting surface, and the light-non-emitting reflecting surface is provided with a plurality of fins for heat dissipation.
4. The method of claim 2, wherein the excimer lamp has a planar structure and a flat lamp tube, and is made of quartz glass.
5. The method for designing an excimer discharge light source according to claim 1, wherein the method for obtaining the thermal stress distribution map of the heat radiation fin area inside the lamp by dividing the thermal stress grid by the model to be analyzed is that the material on the model to be analyzed is added with the thermal expansion coefficient, the reference temperature, the linear elastic parameter and the thermal conductivity attribute of the corresponding material; dividing a model to be analyzed into hexahedral grids by using a sweep dividing method; adding boundary conditions; calculating the thermal stress of the model to be analyzed, and obtaining the model to be analyzed with thermal stress distribution; and carrying out structural grid reconstruction on the analysis model by using an arbitrary Lagrangian-Euler method to obtain a thermal stress value of a grid set reconstructed by the model to be analyzed with thermal stress distribution, thereby obtaining a thermal stress distribution diagram.
6. The method of claim 1, wherein the step of graying the thermal stress distribution map to sequentially calculate the thermal denaturation fitness value of each heat sink fin region comprises:
s401, dividing a heat radiation fin area in a thermal stress distribution diagram;
s402, calculating the thermal denaturation moderate value of the heat radiation fin area.
7. The method for designing an excimer discharge light source according to claim 1, wherein the method for calculating the thickness difference to be adjusted of the area of the heat sink fin to be adjusted is as follows:
forming a sequence of thermal moderation values of each radiating fin area as a writing sequence RXLST 1; and sequentially and respectively calculating the ratio of the thermal change moderate value to the maximum thermal change moderate value in the RXLST 1, wherein the thickness difference to be adjusted is the original average thickness value of the area of the radiating fin multiplied by F, and F is the absolute value obtained by subtracting the ratio of the corresponding thermal change moderate value to the maximum thermal change moderate value from 1.
8. A design system for an excimer discharge light source, the design system comprising: a processor, a memory and a computer program stored in the memory and running on the processor, the processor implementing the steps in the method for designing an excimer discharge light source according to any one of claims 1 to 7 when the computer program is executed, the system for designing an excimer discharge light source running in a desktop computer, a notebook computer, a palm computer or a cloud data center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311602169.XA CN117688803A (en) | 2023-11-27 | 2023-11-27 | Design method and system of excimer discharge light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311602169.XA CN117688803A (en) | 2023-11-27 | 2023-11-27 | Design method and system of excimer discharge light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117688803A true CN117688803A (en) | 2024-03-12 |
Family
ID=90134328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311602169.XA Pending CN117688803A (en) | 2023-11-27 | 2023-11-27 | Design method and system of excimer discharge light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117688803A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090019411A1 (en) * | 2005-12-17 | 2009-01-15 | Rajit Chandra | Thermally Aware Design Modification |
| US8651704B1 (en) * | 2008-12-05 | 2014-02-18 | Musco Corporation | Solid state light fixture with cooling system with heat rejection management |
| KR20190067486A (en) * | 2017-12-07 | 2019-06-17 | 전북대학교산학협력단 | Supersaturated discharge lamp optimized for heat dissipation performance |
| CN112032613A (en) * | 2020-08-11 | 2020-12-04 | 南京嘉视信电子有限公司 | Tunnel lamp capable of dissipating heat quickly and design method thereof |
| CN114611239A (en) * | 2022-03-11 | 2022-06-10 | 华南师范大学 | Design method and application of LED chip radiator adopting hierarchical genetic evolution |
| CN115994428A (en) * | 2023-03-24 | 2023-04-21 | 广东海洋大学 | Computer-aided three-dimensional modeling method and system for intelligent reading furniture |
| CN219476619U (en) * | 2023-01-14 | 2023-08-04 | 朗升光电科技(广东)有限公司 | Excimer discharge lamp |
-
2023
- 2023-11-27 CN CN202311602169.XA patent/CN117688803A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090019411A1 (en) * | 2005-12-17 | 2009-01-15 | Rajit Chandra | Thermally Aware Design Modification |
| US8651704B1 (en) * | 2008-12-05 | 2014-02-18 | Musco Corporation | Solid state light fixture with cooling system with heat rejection management |
| KR20190067486A (en) * | 2017-12-07 | 2019-06-17 | 전북대학교산학협력단 | Supersaturated discharge lamp optimized for heat dissipation performance |
| CN112032613A (en) * | 2020-08-11 | 2020-12-04 | 南京嘉视信电子有限公司 | Tunnel lamp capable of dissipating heat quickly and design method thereof |
| CN114611239A (en) * | 2022-03-11 | 2022-06-10 | 华南师范大学 | Design method and application of LED chip radiator adopting hierarchical genetic evolution |
| CN219476619U (en) * | 2023-01-14 | 2023-08-04 | 朗升光电科技(广东)有限公司 | Excimer discharge lamp |
| CN115994428A (en) * | 2023-03-24 | 2023-04-21 | 广东海洋大学 | Computer-aided three-dimensional modeling method and system for intelligent reading furniture |
Non-Patent Citations (4)
| Title |
|---|
| MOHANTY, S; SOPPET, WK; ET AL.: "Thermal-mechanical stress analysis of pressurized water reactor pressure vessel with/without a preexisting crack under grid load following conditions", 《NUCLEAR ENGINEERING AND DESIGN 》, 15 December 2016 (2016-12-15), pages 112 - 124 * |
| 于岩;王守绪;何为;陈苑明;苏新虹;: "基于COSMOSWORKS有限元分析的HDI板热应力仿真", 印制电路信息, no. 1, 31 December 2012 (2012-12-31), pages 494 - 500 * |
| 全伟;李光慧;陈熙;刘峰;: "一体化半导体激光器的ANSYS热仿真及结构设计", 光学精密工程, no. 05, 15 May 2016 (2016-05-15), pages 1080 - 1085 * |
| 刘维维;张亚;李波;何荣华;苏步鹏;: "基于有限元分析的电子部件热应力仿真方法", 探测与控制学报, no. 02, 26 April 2011 (2011-04-26), pages 45 - 50 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Blondel et al. | An alternative form of the super-Gaussian wind turbine wake model | |
| US11359967B2 (en) | Method for measuring actual temperature of flame by using all information of radiation spectrum and measurement system thereof | |
| US20200358455A1 (en) | Floating point data set compression | |
| Zou et al. | Performance optimization for relative-error-bounded lossy compression on scientific data | |
| CN112818535A (en) | Method and device for establishing electric heating simulation model and obtaining electric heating simulation value | |
| CN117688803A (en) | Design method and system of excimer discharge light source | |
| CN108650768B (en) | Filament current control method and device | |
| CN113158589B (en) | Simulation model calibration method and device of battery management system | |
| CN109657368B (en) | Optimization method of air conditioner radiator | |
| CN116816509A (en) | Correction method and system for variable coefficient characteristic curve of gas turbine | |
| CN111581750B (en) | Multi-disciplinary multi-index product structure optimization design method based on ISIGHT software | |
| Lee et al. | Optimized custom precision function evaluation for embedded processors | |
| CN108595148B (en) | Division function implementation method, circuit, chip and system | |
| CN114996991B (en) | Analysis method and system for two-dimensional structure scattered field | |
| Durojaye et al. | Radial Basis Function-Finite Difference (RBF-FD) Approximations for Two-Dimensional Heat Equations | |
| CN117725807B (en) | Method, system and equipment for calculating heterogeneous reservoir fracture stress based on boundary element | |
| CN113723017B (en) | Method and device for determining temperature field of wall surface of rotary disk of aero-engine | |
| CN118246303A (en) | Ice cloud scattering characteristic sectional calculation method suitable for satellite infrared bright temperature simulation | |
| Zhang et al. | Interface-capturing method for calculating transport equations for a multicomponent heterogeneous system on fixed Eulerian grids | |
| Tsybul’skii | Normalization of Measurement Error of Devices Over a Broad Range of Measurements | |
| CN117666276A (en) | Method for mask process correction, electronic device and storage medium | |
| CN115310328A (en) | Laser tube heating structure optimization design method | |
| JP6826919B2 (en) | Data distribution device and data distribution ratio determination method | |
| CN114912382A (en) | Method and device for correcting standard k-epsilon turbulence model parameters aiming at wind field calculation | |
| Sadatsafavi et al. | Minding non-collapsibility of odds ratios when recalibrating risk prediction models |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: 2701, Building 1, Haichuang Building, No. 7 Qingyi Road, Guicheng Street, Nanhai District, Foshan City, Guangdong Province, 528200 (Residence Declaration) Applicant after: Punomin Medical Technology (Guangdong) Co.,Ltd. Address before: 528200, 5th Floor, Building 1, Haichuang Building, No. 7 Qingyi Road, Guicheng Street, Nanhai District, Guangzhou City, Guangdong Province (Residence Declaration) Applicant before: Guangdong Lecheng Technology Co.,Ltd. Country or region before: China |
|
| CB02 | Change of applicant information |