CN117687676A - Material and software management method and related equipment thereof - Google Patents
Material and software management method and related equipment thereof Download PDFInfo
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- CN117687676A CN117687676A CN202311519233.8A CN202311519233A CN117687676A CN 117687676 A CN117687676 A CN 117687676A CN 202311519233 A CN202311519233 A CN 202311519233A CN 117687676 A CN117687676 A CN 117687676A
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- 239000000463 material Substances 0.000 title claims abstract description 132
- 239000013077 target material Substances 0.000 claims abstract description 111
- 238000000034 method Methods 0.000 claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 claims abstract description 29
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract 8
- 230000008569 process Effects 0.000 claims description 14
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 229910052705 radium Inorganic materials 0.000 claims description 4
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 claims description 4
- 238000004590 computer program Methods 0.000 claims description 3
- 230000006870 function Effects 0.000 abstract description 12
- 238000007726 management method Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000000638 solvent extraction Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Abstract
The application provides a material and software management method, which comprises the following steps: determining a target ID corresponding to the target PCBA, wherein the target ID comprises a PCB category field and a target material field; determining a target material information corresponding table based on the PCB type field, wherein the target material information corresponding table records the corresponding relation between different characters in the material field and the material information; analyzing the target material field based on the target material information corresponding table to obtain target material information; and adjusting software parameters according to the target material information. The method provides a way to correlate material information with software parameters. The system can automatically identify the current material model and configure corresponding software to meet the requirements of product functions. This solves the problem of requiring a significant amount of labor to coordinate and manage multiple hardware and software versions during the production process, thereby significantly reducing the cost of hardware, software development, and version management. The application also provides equipment corresponding to the method, and the equipment has the same beneficial effects as the method.
Description
Technical Field
The application belongs to the field of software, and particularly relates to a material and software management method and related equipment thereof.
Background
As consumer electronics and electric vehicles demand increases rapidly, electronic materials, particularly Integrated Circuits (ICs), become increasingly scarce. This shortage of material can threaten production and delivery schedules, and therefore, measures need to be taken to address this problem. The primary challenge of this problem is to ensure that the manufacture of the product is not affected by the risk of delivery delays due to insufficient material. Accordingly, manufacturers are required to consider the use of a variety of alternative materials on PCBA (Printed Circuit Board Assembly printed circuit board), which consists of a base PCB board and a variety of materials mounted thereon.
Therefore, in order to reduce the risk of delivery due to insufficient material during the manufacture of the product, it is necessary to consider the use of multiple alternative materials of the same grade. This means that in addition to the preferred material, a plan of spare material is required to ensure that production is not disturbed too much because some material is not available.
However, different alternatives, in particular components such as ICs (integrated circuits), often require different software or drivers to support their functions. This makes it more complex to select and configure alternative materials, as different materials need to be adapted to different software to ensure proper product performance and function.
Disclosure of Invention
An embodiment of the present application provides a method for managing materials and software, including:
determining a target ID corresponding to a target PCBA, wherein the target ID comprises a PCB category field and a target material field;
determining a target material information corresponding table based on the PCB category field, wherein the target material information corresponding table records the corresponding relation between the material field content and the material information;
analyzing the target material field based on the target material information corresponding table to obtain target material information;
and adjusting software parameters according to the target material information.
Based on the material and software management method provided in the first aspect of the embodiments of the present application, optionally, the adjusting the software parameter according to the target material information includes:
and changing the software version and/or the software driving setting according to the target material information.
Based on the material and software management method provided in the first aspect of the embodiment of the present application, optionally, the target ID further includes:
any one or more of an ID rule field, a product home information field, a product model field, a PCB version field, a date of manufacture field, and a serial number of manufacture field.
Based on the material and software management method provided in the first aspect of the embodiment of the present application, optionally, before determining the target ID corresponding to the target PCBA, the method further includes:
radium etching the target ID on the target PCBA in the form of a target two-dimensional code;
identifying the target two-dimensional code in a software burning process to obtain the target ID, and burning the target ID into a memory;
the determining the target ID corresponding to the target PCBA includes:
and reading the target ID corresponding to the target PCBA stored in the memory.
Based on the material and software management method provided in the first aspect of the embodiment of the present application, optionally, the material includes: a chip, an application specific integrated circuit, or a capacitor.
Based on the material and software management method provided in the first aspect of the embodiment of the present application, optionally, the number of bits of the target material field is consistent with the number of materials on the target PCBA.
A second aspect of the embodiments of the present application provides a material and software management device, including:
the target ID determining unit is used for determining a target ID corresponding to the target PCBA, wherein the target ID comprises a PCB category field and a target material field;
the target material information corresponding table determining unit is used for determining a target material information corresponding table based on the PCB category field, and the target material information corresponding table records the corresponding relation between the material field content and the material information;
the analyzing unit is used for analyzing the target material field based on the target material information corresponding table to obtain target material information;
and the adjusting unit is used for adjusting the software parameters according to the target material information.
Based on the seed material and software management apparatus provided in the second aspect of the embodiments of the present application, optionally, the adjusting unit is specifically configured to:
and changing the software version and/or the software driving setting according to the target material information.
Based on the seed material and software management device provided in the second aspect of the embodiment of the present application, optionally, the target ID further includes:
any one or more of an ID rule field, a product home information field, a product model field, a PCB version field, a date of manufacture field, and a serial number of manufacture field.
Based on the seed material and software management apparatus provided in the second aspect of the embodiments of the present application, optionally, the target ID determining unit is further configured to:
radium etching the target ID on the target PCBA in the form of a target two-dimensional code;
identifying the target two-dimensional code in a software burning process to obtain the target ID, and burning the target ID into a memory;
the determining the target ID corresponding to the target PCBA includes:
and reading the target ID corresponding to the target PCBA stored in the memory.
Based on the seed material and software management device provided in the second aspect of the embodiment of the present application, optionally, the material includes: a chip, an application specific integrated circuit, or a capacitor.
Based on the seed material and software management device provided in the second aspect of the embodiment of the present application, optionally, the number of bits of the target material field is consistent with the number of materials on the target PCBA.
A third aspect of the embodiments of the present application provides a material and software management apparatus, including:
a processor, a memory;
the processor is configured to communicate with the memory, and to execute instruction operations in the memory on the item and software management device to perform the method according to any one of the first aspects of the embodiments of the present application.
A fourth aspect of the embodiments provides a computer readable storage medium comprising instructions which, when run on a computer, cause the computer to perform a method according to any of the first aspects of the embodiments of the application.
A fifth aspect of the embodiments of the present application provides a computer program product comprising instructions which, when run on a computer, cause the computer to perform the method according to any one of the first aspects of the embodiments of the present application.
From the above technical solutions, the embodiments of the present application have the following advantages: the application provides a material and software management method, which comprises the following steps: determining a target ID corresponding to a target PCBA, wherein the target ID comprises a PCB category field and a target material field; determining a target material information corresponding table based on the PCB category field, wherein the target material information corresponding table records the corresponding relation between different characters in the material field and the material information; analyzing the target material field based on the target material information corresponding table to obtain target material information; and adjusting software parameters according to the target material information. The method provides a way to correlate material information with software parameters. The system can automatically identify the current material model and configure corresponding software to meet the requirements of product functions. The method solves the problem that a large amount of manpower is required to coordinate and manage a plurality of hardware versions and software versions in the production process, thereby obviously reducing the cost of hardware, software development and version management and realizing targeted upgrading of product software.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings may be obtained according to the provided drawings without inventive effort to a person skilled in the art. It is to be understood that the drawings presented in this section are for purposes of illustration only and not of limitation.
FIG. 1 is a schematic flow chart of an embodiment of a method for managing materials and software provided in the present application;
FIG. 2 is a schematic flow chart of another embodiment of a method for managing materials and software provided in the present application;
FIG. 3 is a schematic diagram of the object ID components provided herein;
FIG. 4 is a schematic diagram of an embodiment of a material and software management apparatus provided herein;
fig. 5 is a schematic diagram of another embodiment of a material and software management device provided in the present application.
Detailed Description
In order to better understand the embodiments of the present application, the following description will clearly and completely describe the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application. Meanwhile, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness of the description.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims of this application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments described herein may be implemented in other sequences than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As consumer electronics and electric vehicles demand increases rapidly, electronic materials, particularly Integrated Circuits (ICs), become increasingly scarce. This shortage of material can threaten production and delivery schedules, and therefore, measures need to be taken to address this problem. The primary challenge of this problem is to ensure that the manufacture of the product is not affected by the risk of delivery delays due to insufficient material. Thus, manufacturers need to consider using a variety of alternative materials on PCBs (printed circuit boards).
Therefore, in order to reduce the risk of delivery due to insufficient material during the manufacture of the product, it is necessary to consider the use of multiple alternative materials of the same grade. This means that in addition to the preferred material, a plan of spare material is required to ensure that production is not disturbed too much because some material is not available. However, different alternatives, in particular components such as ICs (integrated circuits), often require different software or drivers to support their functions. This makes it more complex to select and configure alternative materials, as different materials need to be adapted to different software to ensure proper product performance and function. To solve the above problems, a first aspect of the embodiments of the present application provides a method for managing materials and software, referring to fig. 1, and one embodiment of the method for managing materials and software provided in the present application includes: step 101-step 104.
101. And determining a target ID corresponding to the target PCBA, wherein the target ID comprises a PCB category field and a target material field.
Specifically, the target PCBA is assigned a target ID that includes two main fields: a PCB category field and a target material field. The PCB category field is used to identify the type or category of circuit board (PCBA) in question, while the target material field is used to identify the specific material used on the PCBA, which may include a material model, version, or other relevant identification information. Such a target ID may help the system identify and distinguish between combinations of different PCBAs and materials, thereby more effectively managing and configuring the corresponding software and parameters to ensure proper functioning of the product, the target PCBA representing Printed Circuit Board Assembly, i.e., printed circuit board assembly, being a component of an electronic product, typically including electronic components (e.g., integrated circuits, resistors, capacitors, etc.) soldered to the printed circuit board and assembled integrally with other components (e.g., connectors, cables, etc.). The target PCBA may refer to the target of a particular circuit board assembly, which contains certain electronic components and hardware. In practical implementation, the materials to be managed and controlled are generally chips, but there may be multiple chips on one PCBA, and for supply reasons, even PCBAs of the same product and model may be different in the chips used, so that information about specific materials used on the PCBAs needs to be identified by using the target material fields.
102. And determining a target material information corresponding table based on the PCB category field.
Specifically, a target material information corresponding table is determined based on the PCB category field, and the target material information corresponding table records the corresponding relation between the material field content and the material information. Based on the values of the PCB category field, the system will determine a material information correspondence table that contains associations between different characters or values and material information. The table is helpful for the system category field to quickly find out related material information after determining the PCB category of the target PCBA, and different category fields correspond to different target material information corresponding tables.
103. And analyzing the target material field based on the target material information corresponding table to obtain target material information.
Specifically, the target material field is analyzed based on the target material information corresponding table, and target material information is obtained. After determining the comparison table, the target material field is parsed based on the target material information correspondence table, for example, a certain bit in the target material information is recorded as 1, and the corresponding target material information correspondence table is recorded as, when the position record is 0, the corresponding material is the material A, and when the position record is 1, the corresponding material is the material B, based on this, the material used on the PCBA can be determined to be the material B, and thus the rule can determine the target material information corresponding to the target PCBA. The specific rules of interest may depend on the actual situation, and are not limited herein.
104. And adjusting software parameters according to the target material information.
Specifically, the software parameters are adjusted according to the target material information, so that the software and hardware of the equipment are completely coordinated, and the normal operation of the functions of the equipment is ensured. For example, if the particular target material is a particular processor chip, and different processor chips may require different clock frequencies or other configuration parameters, the system may automatically set these parameters based on the target material information. This helps to ensure that the device is properly configured to meet the requirements of a particular material and to ensure that the device performance reaches a desired level.
From the above technical solutions, the embodiments of the present application have the following advantages: the application provides a material and software management method, which comprises the following steps: determining a target ID corresponding to a target PCBA, wherein the target ID comprises a PCB category field and a target material field; determining a target material information corresponding table based on the PCB category field, wherein the target material information corresponding table records the corresponding relation between different characters in the material field and the material information; analyzing the target material field based on the target material information corresponding table to obtain target material information; and adjusting software parameters according to the target material information. The method provides a way to correlate material information with software parameters. The system can automatically identify the current material model and configure corresponding software to meet the requirements of product functions. The method solves the problem that a large amount of manpower is required to coordinate and manage a plurality of hardware versions and software versions in the production process, thereby obviously reducing the cost of hardware, software development and version management and realizing targeted upgrading of product software.
In order to facilitate the use of the method in a practical process, the present application further provides an alternative implementation of a more detailed embodiment, referring to fig. 2, an embodiment of the material and software management method provided in the present application includes: step 201-step 206.
201. And carrying out laser etching on the target ID on the target PCBA in the form of a target two-dimensional code.
Specifically, the target ID is laser etched on the target PCBA in the form of a target two-dimensional code. In the production process, the process of determining the target ID occurs in the hardware production process according to the production plan, and after the production is completed, the target ID is laser etched on the target PCBA in the form of a target two-dimensional code, so that the software etching and testing process can determine the target ID through the two-dimensional code.
In particular, the complete form of the target ID can be seen with reference to fig. 3. Comprising the following steps:
(1) ID rule field: the first bit is represented by a two-bit byte, and 02 represents the ID rule version number.
(2) Product attribution information field: including the product owner and the product manufacturer.
Product owners: the second bit is represented by a one-bit byte, Y representing the xxx clients.
Product manufacturer: the third bit is represented by a two-bit byte, FD representing manufacturer perpetration.
(3) Product model field: the fourth bit is represented by a two-bit byte, representing the product model, example: 52 represents an xxx item
(4) PCB category field: the fifth bit is represented by a two-bit byte, representing the PCBA identification number, example: 01 represents xxxPCB plate
(5) PCB version field: the sixth bit is represented by a nibble, representing the PCB version number, example: 2.1.2.A
(6) Target material field: according to the condition of the materials to be controlled, the number of the bits is determined according to the change of the number of the materials to be controlled on the PCBA board, specifically, each bit represents one material to be controlled, the number of the bits is 0, the used material is one supply, namely the materials supplied in a first sequence, 1 represents the used material is two supplies, namely the materials supplied in a second sequence, and the like until F is sixteen supplies.
(7) Date of manufacture field: determining according to actual production conditions
(8) Production sequence number field: i.e. PCBA SN number, CBA production serial number consisting of six bytes, e.g. 000001.
It will be appreciated that the form of the PCBA ID in the actual implementation may be dependent on the actual situation, and is not limited in this specific context.
202. And identifying the target two-dimensional code in the software burning process to obtain the target ID, and burning the target ID into a memory.
Specifically, in the software burning process, the target two-dimensional code is identified, then the target ID is extracted from the two-dimensional code, and the target ID is written into a corresponding memory. This process has the following steps:
scanning a target two-dimensional code: in the software burning process, a target two-dimensional code on a target PCBA is scanned or read. Because the target ID of each PCBA is laser etched on the target PCBA in the form of a two-dimensional code, the target ID can be directly scanned and obtained without worrying about confusion among different PCBA.
By scanning the target two-dimensional code, the system can extract a target ID, including an ID rule field, a product attribution information field, a product model field, a PCB category field, a PCB version field, a target material field, a production date field and a PCBA SN number. This target ID may be used to identify details of a particular PCBA.
Burning the target ID to a memory: after the target ID is obtained, the system writes it to a specific memory location, typically a non-volatile memory (e.g., EEPROM, electrically Erasable Programmable read only memory)/Electrically Erasable Programmable Read Only Memory (EEPROM) on the PCBA or Flash memory). This facilitates associating the target ID with the PCBA for software reference and identification.
203. And reading the target ID corresponding to the target PCBA stored in the memory.
204. And determining a target material information corresponding table based on the PCB category field.
Specifically, the number of bits of the target material field is consistent with the number of materials on the target PCBA, that is, each bit of the target material field corresponds to one type of control material, and the target material information correspondence table records which material is the first material sequentially supplied and which material is the second material sequentially supplied corresponding to each bit in the target material field of the PCBA.
205. And analyzing the target material field based on the target material information corresponding table to obtain target material information.
Specifically, the steps 203 to 205 are similar to the steps 101 to 103 in the corresponding embodiment of fig. 1, and reference is made to the foregoing for details, which are not repeated here.
206. And changing the software version and/or the software driving setting according to the target material information.
Specifically, the software version and/or the software driving setting are/is changed according to the target material information. Because the material management and control is generally to chip, application specific integrated circuit or electric capacity management and control on the PCB board, therefore to the different chips possible to adopt different software drive setting, in the actual implementation process, all the equipment of the same model can adopt the same software, be provided with the different drives to different chips in the software, and confirm the drive that needs to activate based on the material information that is discerned, this correspondence can write in the software in advance, and the specific here is not limited.
From the above technical solutions, the embodiments of the present application have the following advantages: the application provides a material and software management method, which comprises the following steps: determining a target ID corresponding to a target PCBA, wherein the target ID comprises a PCB category field and a target material field; determining a target material information corresponding table based on the PCB category field, wherein the target material information corresponding table records the corresponding relation between different characters in the material field and the material information; analyzing the target material field based on the target material information corresponding table to obtain target material information; and adjusting software parameters according to the target material information. The method provides a way to correlate material information with software parameters. The system can automatically identify the current material model and configure corresponding software to meet the requirements of product functions. The method solves the problem that a large amount of manpower is required to coordinate and manage a plurality of hardware versions and software versions in the production process, thereby obviously reducing the cost of hardware, software development and version management and realizing targeted upgrading of product software.
The foregoing describes a material and software management method provided in the present application, and in order to support implementation of the foregoing embodiments, the present application further provides a material and software management method, referring to fig. 4, where an embodiment of a material and software management device provided in the present application includes:
a target ID determining unit 401, configured to determine a target ID corresponding to a target PCBA, where the target ID includes a PCB category field and a target material field;
a target material information correspondence table determining unit 402, configured to determine a target material information correspondence table based on the PCB category field, where the target material information correspondence table records a correspondence between material field contents and material information;
the parsing unit 403, configured to parse the target material field based on the target material information correspondence table, to obtain target material information;
the adjusting unit 404 is configured to adjust a software parameter according to the target material information.
In this embodiment, the flow executed by each unit is similar to the flow of the method described in the embodiment corresponding to fig. 1 and 2, and will not be repeated here.
Optionally, the adjusting unit is specifically configured to:
and changing the software version and/or the software driving setting according to the target material information.
Optionally, the target ID further includes:
any one or more of an ID rule field, a product home information field, a product model field, a PCB version field, a date of manufacture field, and a serial number of manufacture field.
Optionally, the target ID determining unit is further configured to:
radium etching the target ID on the target PCBA in the form of a target two-dimensional code;
identifying the target two-dimensional code in a software burning process to obtain the target ID, and burning the target ID into a memory;
the determining the target ID corresponding to the target PCBA includes:
and reading the target ID corresponding to the target PCBA stored in the memory.
Optionally, the material includes: a chip, an application specific integrated circuit, or a capacitor.
Optionally, the number of bits of the target material field is consistent with the number of materials on the target PCBA.
Fig. 5 is a schematic structural diagram of a material and software management device according to an embodiment of the present application, where the material and software management device 500 may include one or more central processing units (central processing units, CPU) 501 and a memory 505, and one or more application programs or data are stored in the memory 505.
In this embodiment, the specific function module division in the cpu 501 may be similar to the function module division of each unit described in fig. 4, and will not be repeated here.
Wherein the memory 505 may be volatile storage or persistent storage. The program stored in the memory 505 may include one or more modules, each of which may include a series of instruction operations on a server. Still further, the central processor 501 may be configured to communicate with the memory 505 and execute a series of instruction operations in the memory 405 on the materials and software management device 500.
The materials and software management device 500 may also include one or more power supplies 502, one or more wired or wireless network interfaces 503, and one or more input/output interfaces 504.
The cpu 501 may perform operations performed by the material and software management method in the embodiments shown in fig. 1 or fig. 2, and detailed descriptions thereof are omitted herein.
The embodiment of the application also provides a computer storage medium for storing computer software instructions for the material and software management method, which comprises a program for executing the material and software management method.
The material and software management method may be as described in the foregoing embodiments corresponding to fig. 1 or fig. 2.
Embodiments of the present application also provide a computer program product comprising computer software instructions that can be loaded by a processor to implement the flow of the material and software management method of any of the above fig. 1 and 2.
In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods may be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative, e.g., equivalent transformations of circuitry, partitioning of elements is merely one logical functional partitioning, and there may be additional partitioning aspects in actual implementation, e.g., multiple elements or components may be combined or integrated into another system, or some features may be omitted, or not implemented. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, or alternatives falling within the spirit and principles of the invention.
Claims (10)
1. A method for material and software management, comprising:
determining a target ID corresponding to a target PCBA, wherein the target ID comprises a PCB category field and a target material field;
determining a target material information corresponding table based on the PCB category field, wherein the target material information corresponding table records the corresponding relation between the material field content and the material information;
analyzing the target material field based on the target material information corresponding table to obtain target material information;
and adjusting software parameters according to the target material information.
2. The material and software management method according to claim 1, wherein said adjusting software parameters according to the target material information comprises:
and changing the software version and/or the software driving setting according to the target material information.
3. The material and software management method of claim 1, wherein the target ID further comprises:
any one or more of an ID rule field, a product home information field, a product model field, a PCB version field, a date of manufacture field, and a serial number of manufacture field.
4. The method of claim 1, wherein prior to determining the target ID corresponding to the target PCBA, the method further comprises:
radium etching the target ID on the target PCBA in the form of a target two-dimensional code;
identifying the target two-dimensional code in a software burning process to obtain the target ID, and burning the target ID into a memory;
the determining the target ID corresponding to the target PCBA includes:
and reading the target ID corresponding to the target PCBA stored in the memory.
5. The material and software management method of claim 1, wherein the material comprises: a chip, an application specific integrated circuit, or a capacitor.
6. The method of claim 1, wherein the number of bits in the target material field corresponds to the number of materials on the target PCBA.
7. A material and software management apparatus comprising:
the target ID determining unit is used for determining a target ID corresponding to the target PCBA, wherein the target ID comprises a PCB category field and a target material field;
the target material information corresponding table determining unit is used for determining a target material information corresponding table based on the PCB category field, and the target material information corresponding table records the corresponding relation between the material field content and the material information;
the analyzing unit is used for analyzing the target material field based on the target material information corresponding table to obtain target material information;
and the adjusting unit is used for adjusting the software parameters according to the target material information.
8. A material and software management apparatus comprising:
a processor, a memory;
the processor is configured to communicate with the memory, and to execute instruction operations in the memory on the item and software management device to perform the method of any one of claims 1 to 6.
9. A computer readable storage medium comprising instructions which, when run on a computer, cause the computer to perform the method of any one of claims 1 to 6.
10. A computer program product comprising instructions which, when run on a computer, cause the computer to perform the method of any of claims 1 to 6.
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| CN202311519233.8A CN117687676A (en) | 2023-11-14 | 2023-11-14 | Material and software management method and related equipment thereof |
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| CN202311519233.8A CN117687676A (en) | 2023-11-14 | 2023-11-14 | Material and software management method and related equipment thereof |
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| CN117687676A true CN117687676A (en) | 2024-03-12 |
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| CN202311519233.8A Pending CN117687676A (en) | 2023-11-14 | 2023-11-14 | Material and software management method and related equipment thereof |
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