CN117683350A - Polyetherimide-based energy storage composite medium film and preparation method and application thereof - Google Patents
Polyetherimide-based energy storage composite medium film and preparation method and application thereof Download PDFInfo
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- 239000002131 composite material Substances 0.000 title claims abstract description 72
- 239000004697 Polyetherimide Substances 0.000 title claims abstract description 71
- 229920001601 polyetherimide Polymers 0.000 title claims abstract description 71
- 238000004146 energy storage Methods 0.000 title claims abstract description 42
- 238000002360 preparation method Methods 0.000 title abstract description 11
- 230000005540 biological transmission Effects 0.000 claims abstract description 7
- RIIPFHVHLXPMHQ-UHFFFAOYSA-N [4-(dimethylamino)phenyl]boronic acid Chemical compound CN(C)C1=CC=C(B(O)O)C=C1 RIIPFHVHLXPMHQ-UHFFFAOYSA-N 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 21
- 239000011259 mixed solution Substances 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
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- 238000000576 coating method Methods 0.000 claims description 2
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- 239000005871 repellent Substances 0.000 abstract description 10
- 150000003384 small molecules Chemical class 0.000 abstract description 8
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- 238000009825 accumulation Methods 0.000 abstract description 5
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 4
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- 239000000945 filler Substances 0.000 description 9
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- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
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- 239000007888 film coating Substances 0.000 description 2
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- 238000012360 testing method Methods 0.000 description 2
- IXHWGNYCZPISET-UHFFFAOYSA-N 2-[4-(dicyanomethylidene)-2,3,5,6-tetrafluorocyclohexa-2,5-dien-1-ylidene]propanedinitrile Chemical compound FC1=C(F)C(=C(C#N)C#N)C(F)=C(F)C1=C(C#N)C#N IXHWGNYCZPISET-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses a polyetherimide-based energy storage composite dielectric film and a preparation method and application thereof, and belongs to the technical field of energy storage dielectric materials and preparation thereof. The invention solves the problems of poor high-temperature energy storage characteristic, high dielectric loss and the like of the existing polyetherimide-based energy storage composite medium. According to the invention, the organic electron-repellent small molecule semiconductor 4-NND is introduced into the polyetherimide polymer, the lowest unoccupied molecular orbit of the organic small molecule semiconductor with higher height can establish an organic carrier barrier in the polyetherimide body, the larger band gap of the small molecule can further ensure the insulating property of the composite medium, the carrier transmission obstruction is finally realized, and the carrier accumulation in the medium body can be avoided. Simultaneous leadingThe 4-NND contains abundant hydroxyl groups, so that the dielectric property of the energy storage medium can be improved. The result shows that when the charge-discharge efficiency of the prepared composite medium is 90% at 150 ℃ and 580kV/mm, the discharge energy density reaches 5.21J/cm 3 。
Description
Technical Field
The invention relates to a polyetherimide-based energy storage composite dielectric film and a preparation method and application thereof, and belongs to the technical field of energy storage dielectric materials and preparation thereof.
Background
The dielectric capacitor has the characteristics of high power density, high charge and discharge rate and the like, and has huge demand in industries such as high-voltage flexible direct-current transmission, new energy automobiles and the like. However, there are many bottleneck problems in the research of the energy storage characteristics and the temperature stability of the dielectric material for the capacitor, especially in the high Wen Gaochang severe service environments such as high-voltage flexible direct-current transmission converter valves, new energy automobile electric automobile inverters and the like.
Polyetherimide (PEI) has good thermal stability and is often used as a high temperature energy storage dielectric, but the lower dielectric constant limits further applications. The existing research shows that the method for preparing the inorganic/organic composite material by filling the polymer with the high dielectric constant ceramic particles or the conductive particles can not effectively improve the high-temperature energy storage performance of the dielectric film. And at present, based on research introduced by organic electrophiles, most of the research does not consider that deep traps can bind charges under long-term service conditions, and then charge accumulation and electric field distribution distortion are caused. Therefore, how to cooperatively enhance the energy storage performance and effectively avoid the accumulation of charges is a challenge facing the energy storage dielectric industry, and development of dielectric materials with high energy storage characteristics suitable for long-term use in service environments is needed.
Disclosure of Invention
The invention provides a polyetherimide-based energy storage composite medium film, a preparation method and application thereof, and aims to solve the problems of poor high-temperature energy storage characteristic, high dielectric loss and the like of the conventional polyetherimide-based energy storage composite medium, and particularly, an electron-repellent filler 4-dimethylaminophenylboronic acid (4 NND) is introduced into Polyetherimide (PEI) to construct a carrier transport barrier.
The technical scheme of the invention is as follows:
the invention aims to provide a polyetherimide-based energy storage composite medium film, which is formed by compounding polyetherimide and 4-dimethylaminophenylboronic acid, wherein the volume ratio of the 4-dimethylaminophenylboronic acid to the polyetherimide is (0.002-0.012): 1.
further defined, the film thickness is 10 to 12 μm.
The second object of the invention is to provide a preparation method of the polyetherimide-based energy storage composite medium film, which comprises the following steps:
(1) Dissolving polyetherimide and 4-dimethylaminophenylboronic acid in N-methylpyrrolidone, and performing bubble removal treatment to obtain a bubble-free mixed solution;
(2) Carrying out blade coating treatment on the bubble-free mixed solution to obtain a composite wet film;
(3) And carrying out gradient heating and drying treatment on the composite wet film to obtain the composite dielectric film.
Further defined, the volume ratio of the total mass of polyetherimide and 4-dimethylaminophenylboronic acid in (1) to N-methylpyrrolidone is 0.16g:1mL. .
Further defined, the volume ratio of polyetherimide to 4-dimethylaminophenylboronic acid in (1) is (0.002-0.012): 1.
further defined, the volume ratio of polyetherimide to 4-dimethylaminophenylboronic acid in (1) is 0.002:1.
Further defined, the volume ratio of polyetherimide to 4-dimethylaminophenylboronic acid in (1) is 0.004:1.
Further defined, the volume ratio of polyetherimide to 4-dimethylaminophenylboronic acid in (1) is 0.006:1.
Further defined, the volume ratio of polyetherimide to 4-dimethylaminophenylboronic acid in (1) is 0.008:1.
Further defined, the volume ratio of polyetherimide to 4-dimethylaminophenylboronic acid in (1) is 0.01:1.
Further defined, the volume ratio of polyetherimide to 4-dimethylaminophenylboronic acid in (1) is 0.012:1.
Further limited, the defoaming treatment mode in (1) is vacuum treatment, the temperature is 30 ℃, and the time is 20min.
Further limiting, the gradient heating and drying treatment process in the step (3) is as follows: the heat preservation is carried out for 4 hours at 70 ℃, for 2 hours at 120 ℃, for 2 hours at 150 ℃, for 2 hours at 200 ℃, and finally for 4 hours under the condition of vacuum 200 ℃.
Further limiting, the composite wet film in the step (3) is taken out and naturally cooled at the ambient temperature after being dried.
The second purpose of the invention is to provide an application of the polyetherimide-based energy storage composite dielectric film, and the film is particularly used for preparing a dielectric capacitor.
Further defined, the dielectric capacitor is used for a high voltage flexible direct current power transmission converter valve or a new energy automobile electric automobile inverter.
Compared with the prior art, the invention has the following beneficial effects:
(1) According to the invention, the organic electron-repellent small-molecule semiconductor 4-dimethylaminophenylboronic acid is introduced into the polyetherimide polymer, the Lowest Unoccupied Molecular Orbital (LUMO) of the organic small-molecule semiconductor is higher, an organic carrier barrier can be established in the polyetherimide body, the insulation characteristic of a composite medium can be further ensured by the larger forbidden band gap of the small molecule, the carrier transmission obstruction can be finally realized, and the carrier accumulation in the medium body can be avoided. The results of the final example show that the full-organic energy storage composite medium prepared by the invention has the discharge energy density of 5.21J/cm when the charge-discharge efficiency is 90% at 150 ℃ and 580kV/mm 3 。
(2) According to the invention, the 4-dimethylaminophenylboronic acid with high electron-repellent groups is introduced into the polyetherimide polymer, and the introduced small molecule semiconductor contains abundant hydroxyl groups, so that contribution can be provided for improving the dielectric property of the energy storage medium.
(3) The invention is based on the electrical property of the full-organic composite regulation energy storage dielectric, and the electron-repellent filler 4-dimethylaminophenylboronic acid is introduced to build a high potential barrier which can prevent charge migration and secondary ionization, and the built high potential barrier only prevents charge migration without binding the charge, so that the accumulation of in-vivo charges is avoided, and the problems of poor high-temperature energy storage characteristic and high dielectric loss of the conventional polyetherimide are solved.
(4) The invention has simple process, mature large-scale preparation technology and capability of meeting the production technology requirement of the existing industrial equipment. And can maintain inherent flexibility, electrostriction property, etc. of the polymer-based material. The method can also effectively solve the series of industrial problems of inorganic filling degradation mechanical property, mismatching of the molding technology of the changed polymer matrix and the like, and provides a guiding thought for the research and development of the energy storage full-organic composite film for large-scale preparation of high Wen Gaochang.
Drawings
FIG. 1 is a LUMO-HOMO comparison graph of polyetherimide and 4-dimethylaminophenylboronic acid;
FIG. 2 is an XRD contrast pattern of the composite medium and polyetherimide film and 4-dimethylaminophenylboronic acid obtained in the various examples;
FIG. 3 is a graph showing the IR spectrum of the composite medium and polyetherimide film and 4-dimethylaminophenylboronic acid obtained in the various examples;
FIG. 4 is a differential scanning calorimetry plot of the composite media and polyetherimide film obtained from the various examples;
FIG. 5 is a graph showing the dielectric constant and dielectric loss versus frequency for the composite media and polyetherimide films obtained in the various examples at 150 ℃;
FIG. 6 is a Weibull plot of the breakdown field strength of the composite media and polyetherimide films obtained in the various examples at 150 ℃;
FIG. 7 is a graph showing the comparison of energy storage characteristics of the composite media and polyetherimide films obtained in the various examples at 150 ℃;
FIG. 8 is a graph showing the surface potential profiles of the composite medium obtained in example 4, the composite medium obtained in comparative example 2, and the polyetherimide film.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.
Further, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic can be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
The experimental methods used in the following examples are conventional methods unless otherwise specified. The materials, reagents, methods and apparatus used, without any particular description, are those conventional in the art and are commercially available to those skilled in the art.
Example 1
Step one, preparing a composite medium mixed solution:
the 4NND particle and PEI particle were weighed in a volume ratio of 0.002:1 and mixed in 0.16g:1mL of the solution is fully dissolved in the N-methyl pyrrolidone solution, and the solution is stirred until the solution is fully dissolved and transparent under the conditions of a stirring temperature of 60 ℃ and a stirring speed of 300 r/min.
Step two, obtaining a bubble-free mixed solution:
and (3) placing the mixed solution obtained in the step (A) in vacuum equipment, standing for 20min in a vacuum environment, setting the temperature to 30 ℃, and fully removing bubbles introduced by stirring in the solution to obtain the bubble-free mixed solution.
Step three, preparing a composite medium:
the glass plate is horizontally placed on a film coater, the mixed solution is uniformly poured on the clean and flat glass plate, a film coating knife is lifted to a height of 15 mu m, and the film coating knife is horizontally scraped and coated at a speed of 5cm/s, so that the composite wet film is obtained.
And fourthly, placing the prepared wet film in a baking oven to be dried for 4 hours at 70 ℃, to be dried for 2 hours at 120 ℃, to be dried for 2 hours at 150 ℃, to be dried for 2 hours at 200 ℃, and finally to be dried for 4 hours in a vacuum 200 ℃. The dried composite film needs to be naturally cooled at the ambient temperature. Obtaining a compact structure with a thickness of about 10-12 mu mComposite dielectric film, abbreviated as N 0.2 。
Example 2
This embodiment differs from embodiment 1 in that: in the first step, the volume ratio of the 4NND particle to the PEI particle is 0.004:1, the rest of the procedure and parameter settings were the same as in example 1. Obtaining a compact-structure composite medium film with the thickness of about 10-12 mu m, which is called N for short 0.4 。
Example 3
This embodiment differs from embodiment 1 in that: in the first step, the volume ratio of the 4NND particle to the PEI particle is 0.006:1, the rest of the procedure and parameter settings were the same as in example 1. Obtaining a compact-structure composite medium film with the thickness of about 10-12 mu m, which is called N for short 0.6 。
Example 4
This embodiment differs from embodiment 1 in that: in the first step, the volume ratio of the 4NND particle to the PEI particle is 0.008:1, the rest of the procedure and parameter settings were the same as in example 1. Obtaining a compact-structure composite medium film with the thickness of about 10-12 mu m, which is called N for short 0.8 。
Example 5
This embodiment differs from embodiment 1 in that: in the first step, the volume ratio of the 4NND particle to the PEI particle is 0.010:1, the rest of the procedure and parameter settings were the same as in example 1. Obtaining a compact-structure composite medium film with the thickness of about 10-12 mu m, which is called N for short 1.0 。
Example 6
This embodiment differs from embodiment 1 in that: in the first step, the volume ratio of the 4NND particle to the PEI particle is 0.012:1, the rest of the procedure and parameter settings were the same as in example 1. Obtaining a compact-structure composite medium film with the thickness of about 10-12 mu m, which is called N for short 1.2 。
Comparative example 1
This comparative example differs from example 1 in that: in the first step, the mixed solution was only PEI solution, and the other procedures and parameter settings were the same as in example 1. The polyetherimide film with a compact structure, namely PEI for short, with the thickness of about 10-12 mu m is obtained.
Comparative example 2
This embodiment differs from embodiment 1 in that: the filler in the first step is electrophilic type 2,3,5, 6-tetrafluoro-7, 7', 8' -tetracyanodimethyl p-benzoquinone (F4 TCNQ), and the volume ratio of F4TCNQ particles to PEI particles is 0.006:1, the rest of the procedure and parameter settings were the same as in example 1. Obtaining a compact-structure composite medium film with the thickness of about 10-12 mu m, which is called F for short 0.6 。
Effect example
The composite media obtained in examples 1-6, comparative example 1 and comparative example 2 were subjected to structural and performance characterization as follows:
FIG. 1 shows LUMO-HOMO spectra of a comparative polyetherimide and 4-dimethylaminophenylboronic acid, and it can be seen from FIG. 1 that the LUMO level of PEI is-3.2 eV, the LUMO level of 4NND is +0.14eV, and the forbidden band width of 4NND is 5.08eV. The 4NND has higher LUMO energy level than PEI, can effectively block carrier transmission, can form peak LUMO barrier between polymer material and organic filler, and has wide forbidden band to promote the insulating property of the composite material.
FIG. 2 is an XRD comparison of the seven composite media prepared in examples 1-6 and comparative example 1, and the 4NND filler, and as can be seen in FIG. 2, the composite media exhibited steamed bread peaks between 15 and 20, with no other characteristic peaks, and slow scattering peaks offset somewhat, indicating successful filler incorporation. Examples 1-6 are offset to the left compared to the steamed bun peak of comparative example 1 because the characteristic peak of the 4NND filler is in this interval and the electron-repellent group of the 4NND would make the chain spacing of the polyetherimide larger.
FIG. 3 is a graph showing the comparison of the IR spectra of seven composite media prepared in examples 1-6 and comparative example 1, as can be seen from FIG. 3, at 3480cm -1 The hydroxyl absorption peak at this location was enhanced, which represents a successful introduction of a 4 NND. Infrared testing also showed that the carbonyl and nitrile group characteristic peaks broadened, becoming less sharp, primarily because of the broader corresponding characteristic peaks of the 4NND filler incorporated, and degenerated behavior with polyetherimide characteristic peaks during testing.
FIG. 4 is a differential scanning calorimetry plot of seven composite media prepared in examples 1-6 and comparative example 1, where it is seen from FIG. 4 that the introduction of 4NND did not affect the thermal performance of the composite media.
FIG. 5 is a graph showing the variation of dielectric constants and dielectric losses with frequency at 150℃for the seven composite media prepared in examples 1-6 and comparative example 1. As can be seen from FIG. 5, the relative dielectric constants of the composite media increase after the introduction of the 4NND, because the 4NND has hydroxyl groups, the polarization is enhanced due to the stronger polarity, and the molecular chain spacing is increased due to the presence of electron-repellent groups, making dipole steering easier. With the addition of 4NND, the dielectric loss of the composite medium still keeps low, which indicates that the electron-repellent small molecule semiconductor does not have great influence on the dielectric loss of the composite medium.
Fig. 6 is a weibull plot of the breakdown field strength at 150 ℃ for the seven composite media prepared in examples 1-6 and comparative example 1. As can be seen from fig. 6, the composite media prepared in example 4 can reach a breakdown strength of 637.0kV/mm, indicating that the organic barrier successfully impedes the transport of carriers within the media. The dielectric strength of the dielectric prepared in example 5 and example 6 was reduced compared to comparative example 1, mainly because excessive doping resulted in agglomeration of the filler in the polymer, and thus in a reduced quality of the composite dielectric preparation.
FIG. 7 is a graph showing the comparison of the energy storage characteristics at 150℃of the seven composite media prepared in examples 1 to 6 and comparative example 1, in which the composite medium prepared in example 4 has a discharge energy density of 5.21J/cm at an energy storage efficiency of 90% 3 . This is mainly due to the high breakdown field strength and the higher polarization performance enhancing the energy storage density, while the organic carrier barrier reduces the conductance loss, thereby greatly improving the energy storage efficiency.
Fig. 8 is a depolarized surface potential map of the three composite media prepared in example 4, comparative example 1, and comparative example 2, and it can be seen from the graph that the composite media prepared in example 4 possess a high initial surface potential, and a fast potential recovery rate. This is mainly due to the fact that the introduced electron-repellent filler is able to build up a high potential barrier, which can block charge injection and can further prevent the transport of carriers within the medium. Because the established potential barrier is a unidirectional potential barrier, no constraint is generated on charges in the depolarization process, and the dissipation of the charges can be quickened.
In conclusion, the organic electron-repellent body/polyetherimide energy storage composite medium prepared by the invention has better dielectric property and higher breakdown strength.
While the invention has been described in terms of preferred embodiments, it is not intended to be limited thereto, but rather to enable any person skilled in the art to make various changes and modifications without departing from the spirit and scope of the present invention, which is therefore to be limited only by the appended claims.
Claims (10)
1. The polyetherimide-based energy storage composite dielectric film is characterized by being formed by compounding polyetherimide and 4-dimethylaminophenylboronic acid, wherein the volume ratio of the 4-dimethylaminophenylboronic acid to the polyetherimide is (0.002-0.012): 1.
2. the polyetherimide based energy storage composite dielectric film of claim 1 wherein the film has a thickness of 10 to 12 μm.
3. A method for preparing the polyetherimide based energy storage composite dielectric film of claim 1, comprising:
(1) Dissolving polyetherimide and 4-dimethylaminophenylboronic acid in N-methylpyrrolidone, and performing bubble removal treatment to obtain a bubble-free mixed solution;
(2) Carrying out blade coating treatment on the bubble-free mixed solution to obtain a composite wet film;
(3) And carrying out gradient heating and drying treatment on the composite wet film to obtain the composite dielectric film.
4. The method for preparing a polyetherimide based energy storage composite dielectric film of claim 3 wherein the volume ratio of the total mass of polyetherimide and 4-dimethylaminophenylboronic acid in (1) to N-methylpyrrolidone is 0.16g:1mL.
5. The method for preparing a polyetherimide-based energy storage composite dielectric film according to claim 3, wherein the volume ratio of polyetherimide to 4-dimethylaminophenylboronic acid in (1) is (0.002-0.012): 1.
6. the method for preparing a polyetherimide-based energy storage composite dielectric film of claim 3, wherein the volume ratio of polyetherimide to 4-dimethylaminophenylboronic acid in (1) is 0.002:1, 0.004:1, 0.006:1, 0.008:1, 0.01:1, or 0.012:1.
7. The method for preparing a polyetherimide-based energy storage composite medium film according to claim 3, wherein the defoaming treatment mode in (1) is vacuum treatment, the temperature is 30 ℃, and the time is 20min.
8. The method for preparing the polyetherimide-based energy storage composite dielectric film according to claim 3, wherein the gradient heating and drying treatment process in (3) is as follows: the temperature is kept at 70 ℃ for 4 hours, 120 ℃ for 2 hours, 150 ℃ for 2 hours, 200 ℃ for 2 hours, and finally vacuum 200 ℃ for 4 hours.
9. The method for preparing a polyetherimide-based energy storage composite dielectric film according to claim 3, wherein the composite wet film in (3) is taken out and naturally cooled at ambient temperature after being dried.
10. The application of the polyetherimide-based energy storage composite dielectric film according to claim 1, wherein the film is used for preparing a dielectric capacitor, and the dielectric capacitor is used for a high-voltage flexible direct-current power transmission converter valve or a new energy automobile electric automobile inverter.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080160225A1 (en) * | 2005-01-31 | 2008-07-03 | Cambridge Enterprise Limited | Sensor Molecules Incorporating a Boronic Acid Sensor Group |
| US20190136091A1 (en) * | 2016-04-20 | 2019-05-09 | Nitto Denko Corporation | Active-energy-ray-curable adhesive composition, laminated polarizing film, method for producing same, laminated optical film, and image display device |
| CN111961241A (en) * | 2020-08-24 | 2020-11-20 | 电子科技大学 | Preparation method of high-energy-storage low-loss double-layer composite film |
| CN112662057A (en) * | 2020-12-10 | 2021-04-16 | 宁波捷安达电子绝缘材料有限公司 | High-temperature-resistant high-energy-storage composite insulating material and preparation method thereof |
-
2023
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080160225A1 (en) * | 2005-01-31 | 2008-07-03 | Cambridge Enterprise Limited | Sensor Molecules Incorporating a Boronic Acid Sensor Group |
| US20190136091A1 (en) * | 2016-04-20 | 2019-05-09 | Nitto Denko Corporation | Active-energy-ray-curable adhesive composition, laminated polarizing film, method for producing same, laminated optical film, and image display device |
| CN111961241A (en) * | 2020-08-24 | 2020-11-20 | 电子科技大学 | Preparation method of high-energy-storage low-loss double-layer composite film |
| CN112662057A (en) * | 2020-12-10 | 2021-04-16 | 宁波捷安达电子绝缘材料有限公司 | High-temperature-resistant high-energy-storage composite insulating material and preparation method thereof |
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