CN117673700A

CN117673700A - Antenna device and wireless electronic device

Info

Publication number: CN117673700A
Application number: CN202311543884.0A
Authority: CN
Inventors: 黄奂衢; 武杰; 崔霜
Original assignee: Yungu Guan Technology Co Ltd; Hefei Visionox Technology Co Ltd
Current assignee: Yungu Guan Technology Co Ltd; Hefei Visionox Technology Co Ltd
Priority date: 2023-11-17
Filing date: 2023-11-17
Publication date: 2024-03-08
Anticipated expiration: 2043-11-17
Also published as: CN117673700B

Abstract

The embodiment of the application provides an antenna device and wireless electronic equipment, the antenna device includes: the frame body comprises a frame and a hollow space formed by surrounding the frame; the support is connected to the frame and extends to form towards the hollow space, the support comprises a first surface, a second surface and a side surface, the first surface and the second surface are opposite in the thickness direction, the side surface is connected with the first surface and the second surface, the antenna assembly comprises a base material and a first antenna module arranged on the base material, the first antenna module comprises a plurality of first antenna units distributed on the base material at intervals, and the base material is arranged on at least one of the first surface and the second surface. The performance of first antenna module can be improved, and then the wireless communication performance of antenna device is promoted.

Description

Antenna device and wireless electronic device

Technical Field

The present disclosure relates to the field of wireless electronic devices, and particularly to an antenna device and a wireless electronic device.

Background

The functionality of wireless communication devices (e.g., cell phones, smart watches, etc.) is changing day by day, and the market demands for device appearance and wireless communication performance are increasing. How to improve the communication performance of a wireless electronic device is a technical problem to be solved.

Disclosure of Invention

The embodiment of the application provides an antenna device and wireless electronic equipment, and aims to improve wireless communication performance of the antenna device.

An embodiment of a first aspect of the present application provides an antenna apparatus, including: the frame body comprises a frame and a hollow space formed by surrounding the frame; the support, connect in the frame and extend towards the cavity space, the support includes along the relative first surface of thickness direction, second surface and connect the side surface of first surface and second surface, antenna assembly, including the substrate, set up in the first antenna module of substrate, first antenna module includes a plurality of first antenna units of interval distribution on the substrate, and the substrate sets up on at least one of first surface and second surface.

According to an embodiment of the first aspect of the present application, the first antenna module further includes a first integrated circuit and a first feeding portion, where the first feeding portion is disposed on the substrate and electrically connected to the first integrated circuit and the first antenna unit.

According to any of the foregoing embodiments of the first aspect of the present application, the substrate includes a first portion and a second portion, the first antenna unit is disposed in the first portion, and the first integrated circuit is disposed in the second portion.

According to any of the foregoing embodiments of the first aspect of the present application, the first section is disposed on the first surface, the second section is disposed on the second surface, and the bracket includes a side surface connecting the first surface and the second surface;

The substrate further comprises a bending part connected with the first part and the second part, the bending part is arranged on the side surface, the plurality of first antenna units are arranged on the first part, and the first integrated circuit is arranged on the second part.

According to any of the foregoing embodiments of the first aspect of the present application, the antenna device further includes a shielding cover, and the shielding cover is covered on a side of the first integrated circuit facing away from the bracket, and the shielding cover and the second sub-portion are connected to each other and enclose to form a cavity for accommodating the first integrated circuit.

According to any of the foregoing embodiments of the first aspect of the present application, the antenna assembly further includes a connector disposed on the second section and connected to the first integrated circuit, so that the first integrated circuit can be electrically connected to the external device via the connector, and the connector and the shielding case are disposed on the same side of the bracket and are spaced apart from each other.

According to any of the foregoing embodiments of the first aspect of the present application, the first antenna element is disposed on a surface of the first section facing away from the bracket.

According to any of the foregoing embodiments of the first aspect of the present application, the first surface is provided with at least one first groove, and a projection of the at least one first antenna element in the thickness direction and a projection of the first groove in the thickness direction are at least partially overlapping.

According to any of the foregoing embodiments of the first aspect of the present application, the number of the first grooves is plural, and the projection of each first antenna unit in the thickness direction is located within the projection of each first groove in the thickness direction.

According to any of the foregoing embodiments of the first aspect of the present application, the first groove penetrates through the support along the thickness direction, and the second portion is provided with a conductive layer, and the projection of the first antenna unit along the thickness direction is located within the projection of the conductive layer along the thickness direction.

According to any of the foregoing embodiments of the first aspect of the present application, the second surface is provided with at least one second groove, and a projection of the second groove along the thickness direction and a projection of the first groove along the thickness direction are arranged in a staggered manner.

According to any one of the foregoing embodiments of the first aspect of the present application, the plurality of first grooves are spaced apart along the first direction, and projections of the second grooves along the thickness direction are located between projections of two adjacent first grooves along the thickness direction, and the first direction intersects the thickness direction.

According to any of the embodiments described in the first aspect of the present application, the second groove penetrates the support along the second direction, and the second direction intersects the thickness direction and the first direction two by two.

According to any of the foregoing embodiments of the first aspect of the present application, the first portion and the second portion are two opposite surfaces of the substrate, and the substrate further includes a communication hole penetrating through the first portion and the second portion, and the first feeding portion is electrically connected to the first integrated circuit and the first antenna module through the communication hole.

According to any of the preceding embodiments of the first aspect of the present application, the first portion is located on a surface of the substrate facing away from the support, and the second portion is located on a surface of the substrate facing toward the support.

According to any of the foregoing embodiments of the first aspect of the present application, the substrate is disposed on the first surface, and the antenna device further includes a shielding case, where the shielding case and the second surface are connected to each other and enclose to form a cavity for accommodating the first integrated circuit.

According to any of the foregoing embodiments of the first aspect of the present application, the antenna assembly further includes a connector disposed on the second surface and connected to the first integrated circuit, so that the first integrated circuit can be electrically connected to the external device via the connector, and the connector and the shielding case are spaced apart.

According to any of the foregoing embodiments of the first aspect of the present application, at least a portion of the substrate extends out of the support, and the connector is disposed on a second surface of the extending support.

According to any of the foregoing embodiments of the first aspect of the present application, the frame further includes a bottom plate, the bottom plate is connected to the frame and encloses with the frame to form a hollow space, the bracket and the bottom plate are arranged at intervals, and the first antenna unit is located at one side of the bracket away from the bottom plate.

According to any of the foregoing embodiments of the first aspect of the present application, the support is provided with a support portion, and the support portion extends from the support toward the base plate and is connected to the base plate.

According to any of the foregoing embodiments of the first aspect of the present application, the bracket includes opposite first and second ends, the first end being electrically connected to the segment, the second end being provided with a support portion extending from the second end toward the base plate and interconnecting the base plate.

According to any of the preceding embodiments of the first aspect of the present application, the cross-section of the support portion gradually decreases in the direction of the bracket to the base plate.

According to any of the foregoing embodiments of the first aspect of the present application, the chassis includes a ground layer, and the support portion is electrically connected to the ground layer.

According to any of the foregoing embodiments of the first aspect of the present application, the bracket is directly connected to the frame through the first end;

or, the first end is provided with an abutting part, and the abutting part extends from the first end towards the bottom plate and is connected with the frame.

According to any of the foregoing embodiments of the first aspect of the present application, the support is provided with a second feeding portion, and the second feeding portion is electrically connected to the support.

According to any of the foregoing embodiments of the first aspect of the present application, the frame further includes a bottom plate connected to the frame, the support and the bottom plate are disposed at intervals, and the second feeding portion extends from the support toward the bottom plate.

According to any of the foregoing embodiments of the first aspect of the present application, the second feeding portion and the bottom plate abut against each other.

According to any of the foregoing embodiments of the first aspect of the present application, the cross-sectional area of the second feeding portion gradually decreases in the bracket-to-base plate direction;

and/or, the second feed-in part extends along the bending path;

and/or the second feed-in part is connected with a conductive flat plate, the conductive flat plate comprises a conductive plane facing the bottom plate, and the conductive plane and the bottom plate are intersected with the interval setting direction of the bracket.

According to any one of the foregoing embodiments of the first aspect of the present application, the first integrated circuit is disposed on the bottom plate and located on a side of the second end away from the first end, the substrate includes a first segment disposed on the support and a second segment disposed on the support, the plurality of first antenna units are disposed on the first segment, and the first feeding portion is connected to the plurality of first antenna units and the first integrated circuit by the first antenna module via the second segment.

According to any of the foregoing embodiments of the first aspect of the present application, the substrate further comprises a third segment connected to one end of the second segment and extending toward the first integrated circuit,

the third section is provided with a connector lug electrically connected with the first feed-in part, and the first integrated circuit and the connector lug are connected with each other, or the first feed-in part and the first integrated circuit are mutually bound and connected in the third section.

According to any of the foregoing embodiments of the first aspect of the present application, the antenna assembly further includes a second antenna module including a plurality of second antenna units,

the first antenna module and the bracket are mutually insulated, and the bracket comprises a conductive material and is multiplexed into at least part of the second antenna unit.

According to any one of the foregoing embodiments of the first aspect of the present application, the first antenna module is a millimeter wave antenna module, and the first antenna unit is configured to receive and transmit millimeter wave antenna signals;

and/or the second antenna module is a non-millimeter wave antenna module, and the second antenna unit is used for receiving and transmitting non-millimeter wave antenna signals.

According to any of the foregoing embodiments of the first aspect of the present application, the frame is provided with a grounding portion, and the bracket and the grounding portion are connected to each other.

According to any of the foregoing embodiments of the first aspect of the present application, the bezel comprises a plurality of segments, at least one segment comprising a conductive material and multiplexed into at least a portion of the second antenna element, the bracket and the segment multiplexed into the second antenna element being electrically connected to each other.

Embodiments of the second aspect of the present application also provide a wireless electronic device, including: the antenna device of any of the embodiments of the first aspect described above.

In the antenna device that this application provided, antenna device includes framework, support and antenna assembly, and the frame of framework can enclose to close and form the cavity space, and the cavity space can be used for holding the support. The bracket is used for supporting the antenna assembly. The antenna assembly comprises a base material and a first antenna module arranged on the base material, so that the plurality of first antenna units can be arranged on the base material, and then the base material provided with the plurality of first antenna units is arranged on the support, and the assembly efficiency of the antenna device can be improved. The first antenna module comprises a plurality of first antenna units, so that the performance of the first antenna module can be improved, and the wireless communication performance of the antenna device is further improved.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings, in which like or similar reference characters designate like or similar features.

Fig. 1 is a schematic structural diagram of an antenna device according to an embodiment of the present application;

fig. 2 is a schematic diagram of a partial enlarged structure of an antenna device according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a bracket of an antenna device according to an embodiment of the present application;

fig. 4 is a schematic diagram of a bracket structure with an antenna assembly of an antenna device according to an embodiment of the present application;

fig. 5 is a schematic structural view of the antenna device shown in fig. 4 at another view angle;

fig. 6 is a schematic structural diagram of an antenna assembly of an antenna device according to an embodiment of the present disclosure;

fig. 7 is a schematic structural view of an antenna assembly of the antenna device shown in fig. 6 at another view angle;

fig. 8 is a schematic structural diagram of a bracket of an antenna device according to another embodiment of the present disclosure;

fig. 9 is a schematic structural view of a stand of an antenna device according to still another embodiment of the present disclosure;

fig. 10 is a schematic structural view of a stand of an antenna device according to still another embodiment of the present disclosure;

Fig. 11 is a schematic structural view of the bracket of the antenna device shown in fig. 10 at another view angle;

fig. 12 is a schematic diagram of a bracket structure with an antenna assembly of an antenna device according to another embodiment of the present disclosure;

fig. 13 is a schematic structural view of the antenna device shown in fig. 14 at another view angle;

fig. 14 is a schematic structural diagram of an antenna assembly of an antenna device according to another embodiment of the present disclosure;

fig. 15 is a schematic structural view of an antenna assembly of the antenna device shown in fig. 14 at another viewing angle;

fig. 16 is a schematic structural view of a stand of an antenna device according to another embodiment of the present disclosure;

fig. 17 is a schematic structural view of a stand of an antenna device according to another embodiment of the present disclosure;

fig. 18 is a schematic structural view of a stand of an antenna device according to another embodiment of the present disclosure;

fig. 19 is a schematic structural view of a stand of an antenna device according to another embodiment of the present disclosure;

fig. 20 is a schematic structural view of a stand of an antenna device according to another embodiment of the present disclosure;

fig. 21 is a schematic view of a partial enlarged structure of an antenna device according to still another embodiment of the present application;

fig. 22 is a schematic structural diagram of an antenna assembly of an antenna device according to another embodiment of the present disclosure;

Fig. 23 is a schematic structural view of the antenna device shown in fig. 22 at another viewing angle;

fig. 24 is a schematic structural view of an antenna assembly of an antenna device in another example.

Reference numerals illustrate:

10. an antenna device;

100. a frame; 110. a frame; 110a, segmentation; 120. a hollow space; 130. a bottom plate;

200. a bracket; 201. a first end; 202. a second end; 203. a first surface; 204. a second surface; 205. a side surface; 210. a first groove; 220. a second groove; 240. a support part; 250. an abutting portion; 260. a second feed-in part; 270. a conductive plate;

300. an antenna assembly; 301. a first antenna module; 302. a second antenna module; 310. a first antenna unit; 320. a second antenna unit; 330. a first integrated circuit; 340. a first feed-in part; 350. a substrate; 351. a first subsection; 352. a second subsection; 353. a bending part; 354. a first segment; 355. a second segment; 356. a third segment; 360. a conductive layer;

400. a shield;

500. a connector;

y, first direction; x, second direction; z, thickness direction.

Detailed Description

Features and exemplary embodiments of various aspects of the present application are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing an example of the present application. In the drawings and the following description, at least some well-known structures and techniques are not shown in order to avoid unnecessarily obscuring the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the description of the present application, it is to be noted that, unless otherwise indicated, the meaning of "plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The directional terms appearing in the following description are all directions shown in the drawings and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected. The specific meaning of the terms in the present application can be understood as appropriate by one of ordinary skill in the art.

For a better understanding of the present application, the antenna device and the wireless electronic apparatus according to the embodiments of the present application are described in detail below with reference to fig. 1 to 24.

Referring to fig. 1 to 5, fig. 1 is a schematic structural diagram of an antenna device according to an embodiment of the present disclosure; fig. 2 is a schematic diagram of a partial enlarged structure of an antenna device according to an embodiment of the present application; fig. 3 is a schematic structural diagram of a bracket of an antenna device according to an embodiment of the present application. Fig. 4 is a schematic structural diagram of a bracket with an antenna assembly of the antenna device according to the embodiment of the present application, and fig. 5 is a schematic structural diagram of the antenna device provided in fig. 4 at another view angle.

As shown in fig. 1 to 5, an embodiment of a first aspect of the present application provides an antenna device 10, where the antenna device 10 includes a frame 100, a bracket 200, and an antenna assembly 300, and the frame 100 includes a frame 110 and a hollow space 120 surrounded by the frame 110; the bracket 200 is connected to the frame 110 and extends toward the hollow space 120, the bracket 200 includes a first surface 203 and a second surface 204 opposite to each other in a thickness direction, the antenna assembly 300 includes a substrate 350, a first antenna module 301 disposed on the substrate 350, the first antenna module 301 includes a plurality of first antenna units 310 spaced apart on the substrate 350, and the substrate 350 is disposed on at least one of the first surface 203 and the second surface 204.

In the antenna device 10 provided in the present application, the antenna device 10 includes a frame 100, a bracket 200, and an antenna assembly 300, where the frame 110 of the frame 100 can enclose to form a hollow space 120, and the hollow space 120 can be used to accommodate the bracket 200. The stand 200 is used to support the antenna assembly 300. The antenna assembly 300 includes a substrate 350 and a first antenna module 301 disposed on the substrate 350, so that the plurality of first antenna units 310 can be disposed on the substrate 350, and then the substrate 350 with the plurality of first antenna units 310 disposed thereon is disposed on the bracket 200, so as to improve the assembly efficiency of the antenna device 10, and reduce the assembly cost. The first antenna module 301 includes a plurality of first antenna units 310, which can improve the performance of the first antenna module 301, and further improve the wireless communication performance of the antenna device 10.

Optionally, the antenna apparatus 10 is used in a wireless electronic device, where the wireless electronic device may further include a control main board, and the control main board may be disposed in the hollow space 120. Alternatively, the frame 110 may be a middle frame of the wireless electronic device, and the frame 110 is disposed around the wireless electronic device.

Alternatively, the frame 110 may be integrally formed, that is, the integrally formed closed annular frame 110 surrounds the hollow space 120.

In other embodiments, the bezel 110 may also include a plurality of segments 110a, the plurality of segments 110a disposed around the hollow space 120. Optionally, adjacent segments 110a are disposed in insulation, for example, an insulation spacer is disposed between adjacent segments 110a to improve the influence of the frame 110 on wireless signal transmission of the wireless electronic device.

The bracket 200 may be provided in various manners, and the bracket 200 may have a plate-like or columnar shape. Optionally, the stand 200 has a plate shape, so as to reduce the space occupied by the stand 200, and facilitate the antenna assembly 300 being disposed on the stand 200. Optionally, the frame 100 further includes a bottom plate 130, and the frame 110 is connected to a peripheral side of the bottom plate 130 and encloses a hollow space 120 with the bottom plate 130. Optionally, the distance between the surface of the support 200 facing away from the bottom plate 130 and the bottom plate 130 is less than or equal to the distance between the surface of the frame 110 facing away from the bottom plate 130 and the bottom plate 130, i.e. the support 200 is disposed closer to the bottom plate 130 than the frame 110, and the support 200 does not protrude from the frame 110 in a direction away from the bottom plate 130, so that the overall volume of the housing assembly can be reduced.

Alternatively, the backplane 130 and the control motherboard of the wireless electronic device may be multiplexed with each other. Alternatively, the base plate 130 and the control main plate may be provided separately from each other.

The material of the bracket 200 may be various, and the material of the bracket 200 may be an insulating material, so as to ensure mutual insulation between the antenna assembly 300 and other components. Alternatively, the material of the bracket 200 includes a conductive material. At this time, the stand 200 may be used as a reflection surface component of the first antenna module 301, and the stand 200 may reflect the wireless signal received by and transmitted from the first antenna unit 310, thereby improving the wireless communication performance of the first antenna module 301 and improving the wireless communication performance of the antenna device 10.

Optionally, the plurality of first antenna elements 310 may also be arranged in a plurality of rows and columns on the stand 200. The first antenna elements 310 of two adjacent rows may be aligned or offset from each other. The present embodiment is illustrated with the first antenna elements 310 in a single row arrangement.

In some alternative embodiments, referring to fig. 1 to fig. 7, the first antenna module 301 further includes a first integrated circuit 330 and a first feeding portion 340, where the first feeding portion 340 is disposed on the substrate 350 and electrically connects the first integrated circuit 330 and the first antenna unit 310. In these embodiments, the first integrated circuit 330 can be connected to the plurality of first antenna units 310 through the first feeding portion 340, so that the first integrated circuit 330 can control the operating state of the first antenna units 310 through the first feeding portion 340.

The first integrated circuit 330 and the first antenna unit 310 may be disposed in various manners, for example, the first integrated circuit 330 and the first antenna unit 310 may be disposed on the substrate 350, or the first antenna unit 310 may be disposed on the substrate 350, and the first integrated circuit 330 may be disposed on the base plate 130, and the base plate 130 is often provided with a main control circuit of a wireless electronic device, so that the distance between the first integrated circuit 330 and the main control circuit of the wireless electronic device can be reduced.

Alternatively, the first integrated circuit 330 may include a first radio frequency integrated circuit and a first battery management integrated circuit, the first radio frequency integrated circuit being connected to the first antenna unit 310 to transmit radio frequency signals to the first antenna unit 310. Alternatively, the first integrated circuit 330 may also include only the first radio frequency integrated circuit.

As an alternative embodiment, the first integrated circuit 330 and the first antenna unit 310 may be disposed on the substrate 350, where the substrate 350 includes a first portion 351 and a second portion 352; the first antenna unit 310 is disposed on the first sub-portion 351, the first integrated circuit 330 is disposed on the second sub-portion 352, and the first feeding portion 340 is disposed on the substrate 350 and electrically connects the first integrated circuit 330 and the first antenna unit 310.

In these alternative embodiments, the first integrated circuit 330 and the first feeding portion 340 of the antenna assembly 300 are also disposed on the substrate 350, so that the assembly of the antenna device 10 can be simplified. The positioning of the first integrated circuit 330 and the first antenna element 310 at different locations of the substrate 350 can improve interference at both locations.

Alternatively, the first integrated circuit 330 and the plurality of first antenna units 310 may be disposed on the same side of the stand 200 through the substrate 350. I.e. the first 351 and the second 352 sections are both located on the same side of the holder 200. Alternatively, the first integrated circuit 330 and the plurality of first antenna units 310 may be separately provided at both sides of the stand 200.

As an alternative embodiment, the bracket 200 includes a side surface 205 connecting the first surface 203 and the second surface 204; the substrate 350 includes a bending portion 353 connecting the first portion 351 and the second portion 352, the first portion 351 is disposed on the first surface 203, the second portion 352 is disposed on the second surface 204, and the bending portion 353 is disposed on the side surface 205.

In these alternative embodiments, the substrate 350 includes a first portion 351, a second portion 352, and a bent portion 353, and the substrate 350 is generally U-shaped, such that the antenna assembly 300 is capable of breaking through the metal shield by the substrate 350, for example, such that the antenna assembly 300 is capable of being disposed on a bezel of a wireless electronic device, such that the substrate 350 covers an inner surface and an outer surface of the bezel, respectively, to break through the metal shield. And the distance between the antenna assembly 300 and the first integrated circuit 330 can be ensured to be closer, so that the middle loss is minimized, and the performance of the antenna module 300 is optimized. .

The first antenna unit 310 and the first integrated circuit 330 are disposed on the first sub 351 and the second sub 352, that is, the first antenna unit 310 and the first integrated circuit 330 are disposed on two sides of the stand 200, so that the overall size of the antenna assembly 300 can be reduced, and the distance between the first antenna unit 310 and the first integrated circuit 330 can be reduced, which is convenient for the mutual electrical connection of the first antenna unit 310 and the first integrated circuit 330.

In some alternative embodiments, the antenna device 10 further includes a shielding case 400, where the shielding case 400 is disposed on a side of the first integrated circuit 330 facing away from the stand 200, and the shielding case 400 is connected to the second section 352 and encloses a cavity for accommodating the first integrated circuit 330.

In these alternative embodiments, the antenna device 10 is further provided with a shielding case 400, the shielding case 400 and the second subsection 352 jointly enclose a cavity, and the second subsection 352 is provided to the bracket 200, so that the shielding case 400 and the bracket 200 jointly enclose a cavity. The first integrated circuit 330 is located in the cavity, so that the second portion 352 and the shielding case 400 can provide comprehensive protection for the first integrated circuit 330, electromagnetic interference of the first integrated circuit 330 from the external environment can be reduced, or electromagnetic interference of the first integrated circuit 330 to the external environment can be reduced, and protection of the first integrated circuit 330 against water, dust, collision, etc. can be provided.

In addition, the shield 400 is directly connected to the second section 352, so that the shield 400 can be disposed on the second section 352 before the antenna assembly 300 is disposed on the bracket 200, which can simplify the installation of the antenna assembly 300.

Optionally, the antenna assembly 300 further includes a connector 500 disposed on the second portion 352 and connected to the first integrated circuit 330, so that the first integrated circuit 330 can be electrically connected to the external device via the connector 500 for signal transmission. The connector 500 and the first integrated circuit 330 are spaced apart on the same side of the bracket 200, and the connector 500 and the shield 400 are spaced apart. For example, the connector 500 and the shield case 400 are spaced apart along the extending direction of the bracket 200.

In these alternative embodiments, the first integrated circuit 330 may be electrically connected to the outside through the connector 500, for example, the first integrated circuit 330 may be electrically connected to a control motherboard of the wireless electronic device through the connector 500. The connector 500 and the first integrated circuit 330 are disposed on the same side of the bracket 200 to reduce the distance between the connector 500 and the first integrated circuit 330, thereby facilitating the electrical connection between the first integrated circuit 330 and the connector 500. The connector 500 and the shield case 400 are arranged at intervals along the extending direction of the bracket 200, and when the shield case 400 is continuously covered after the first integrated circuit 330 is arranged, the situation that the shield case 400 is not covered at the correct position and collides with the connector 500 can be improved.

Referring to fig. 1 to 8, fig. 8 is a schematic structural diagram of a bracket 200 of an antenna device 10 according to another embodiment of the present disclosure.

In some alternative embodiments, as shown in fig. 1 to 8, the first surface 203 is provided with at least one first groove 210, and the projection of the at least one first antenna element 310 in the thickness direction and the projection of the first groove 210 in the thickness direction are at least partially overlapping.

In these alternative embodiments, the first surface 203 of the support 200 is provided with the first groove 210, and the projection of at least one first antenna unit 310 and the projection of the first groove 210 at least partially overlap, so that the distance between the first antenna unit 310 and the bottom wall surface of the first groove 210 can be increased, and the distance between the support 200 and the first antenna unit 310 can be reduced to affect the transceiver of the first antenna unit 310 to wireless signals, thereby improving the performance of the first antenna unit 310.

Optionally, the number of the first grooves 210 is multiple, and the projection of each first antenna unit 310 along the thickness direction is located within the projection of each first groove 210 along the thickness direction, so that the performance of each first antenna unit 310 can be improved, and the overall performance of the antenna assembly 300 can be improved.

Alternatively, as shown in fig. 8, the first recess 210 has a bottom wall, and the first recess 210 may not be provided through the bracket 200. Alternatively, as shown in fig. 9, the first groove 210 is provided through the bracket 200 in the thickness direction. Referring to fig. 6 and fig. 9 together, optionally, the second portion 352 is provided with a conductive layer 360, and a projection of the first antenna unit 310 along the thickness direction is located within a projection of the conductive layer 360 along the thickness direction. To embody the distinction between fig. 8 and 9, the bottom wall of the first recess 210 is filled with a cross-sectional line in fig. 8.

In these alternative embodiments, the conductive layer 360 on the second portion 352 can shield and reflect the signal of the first antenna unit 310, and thus can serve as a reference ground and a reflective surface of the first antenna unit 310, so that the first antenna unit 310 can radiate a directional beam, and also can avoid the signal of the first antenna unit 310 from affecting the signal transmission of the first integrated circuit 330. Through making the first groove 210 penetrate through the bracket 200 and setting the conductive layer 360 on the second partition 352, the distance between the first antenna unit 310 and the conductive layer 360 can be increased, so that the transmission and reception of the wireless signal by the first antenna unit 310 can be affected by the too small distance between the conductive layer 360 and the first antenna unit 310, and the performance of the first antenna unit 310 can be improved.

Optionally, the material of the stand 200 includes a conductive material, and the conductive layer 360 and the stand 200 are connected to each other so that the stand 200 can serve as a reference ground and a heat sink for the antenna assembly 300.

In some alternative embodiments, the antenna assembly 300 further comprises a second antenna module 302, the second antenna module 302 comprising a plurality of second antenna elements 320, wherein the first antenna module 301 and the stand 200 are arranged insulated from each other, the stand 200 comprising a conductive material and being multiplexed into at least part of the second antenna elements.

In these alternative embodiments, the antenna assembly 300 further includes a second antenna module 302 that can enrich the antenna function and improve the wireless communication performance of the wireless electronic device when the antenna apparatus 10 is used in the wireless electronic device. The stand 200 comprises a conductive material, and the stand 200 can be reused as at least part of the second antenna unit 320, so that functions of the stand 200 can be further enriched, and space occupied by the whole second antenna module 302 can be reduced.

In some alternative embodiments, as shown in fig. 10 and 11, the second surface 204 is provided with at least one second groove 220, and the projection of the second groove 220 in the thickness direction and the projection of the first groove 210 in the thickness direction are offset.

In these alternative embodiments, when the stand 200 is multiplexed as a part of the second antenna unit 320, the second groove 220 can increase the distance between the outer surface of the stand 200 and the base plate 130, so as to improve the influence of the base plate 130 on the second antenna unit 320 to transmit and receive wireless signals, and improve the performance of the second antenna module 302.

Alternatively, if no misalignment is performed, the first recess 210 is shallow, so that the first antenna element 310 is close to the ground plane 130, and the performance of the first antenna element 310 is affected. In the embodiment of the present application, the first groove 210 and the second groove 220 are dislocated, so that the depth of the first groove 210 can be properly increased, the distance between the first antenna unit 310 and the power supply 130 is increased, and the structural strength of the bracket 200 can be improved by arranging the second groove 220 and the first groove 210 at different positions of the bracket 200.

In some alternative embodiments, the first grooves 210 are spaced apart along the first direction, the projections of the second grooves 220 along the thickness direction are located between the projections of two adjacent first grooves 210 along the thickness direction, and the first directions intersect with the thickness direction, so that the first grooves 210 and the second grooves 220 are both arranged in a staggered manner, and the structural strength of the bracket 200 can be ensured. Optionally, the first direction is an extending direction of the bracket 200, so that a plurality of first grooves 210 spaced along the first direction can be disposed on the bracket 200.

Optionally, the second groove 220 is disposed along the second direction X and penetrates through the bracket 200, so as to increase the distribution area of the second groove 220, and further increase the distribution area of the surface of the bracket 200 that is farther from the bottom plate 130, so that the performance of the second antenna module 302 can be further improved. The second direction intersects with the thickness direction Z and the first direction Y in pairs.

In other embodiments, as shown in fig. 12-15, the first antenna element 310 and the first integrated circuit 330 may be located on the same side of the stand 200. For example, the first portion 351 and the second portion 352 are opposite surfaces of the substrate 350, the substrate 350 further includes a via penetrating the first portion 351 and the second portion 352, and the first feeding portion 340 is electrically connected to the first integrated circuit 330 and the first antenna unit 310 through the via.

In these alternative embodiments, the first portion 351 and the second portion 352 are opposite surfaces of the substrate 350, so that the distance between the two surfaces can be reduced, and thus the path loss can be reduced, so that the performance of the first antenna unit 310 can be improved, the assembly difficulty can be reduced, and thus the assembly cost can be reduced, and the overall volume of the first antenna module 301 can be reduced. That is, the antenna assembly 300 may be directly disposed on the stand 200 as a whole, for example, the antenna assembly 300 may be directly disposed on a side of the stand 200 facing away from the base plate 130 as a whole, and the antenna assembly 300 may be directly attached to a surface of the stand 200 facing away from the base plate 130 through the base material 350, so that the assembly process of the antenna assembly 300 may be further simplified.

Optionally, the first portion 351 is located on a surface of the substrate 350 facing away from the stand 200, and the substrate 350 is located on a surface of the stand 200 facing away from the bottom plate 130. So that the first antenna element 310 is exposed, and the first antenna element 310 is prevented from being blocked to affect the performance thereof.

Optionally, the second portion 352 is located on a surface of the substrate 350 facing the support 200, i.e., the first integrated circuit 330 is located between the substrate 350 and the support 200, such that the support 200 and the substrate 350 are capable of providing protection to the first integrated circuit 330.

In alternative embodiments, when the antenna device 10 includes the shielding case 400, the shielding case 400 may be directly connected to the bracket 200, and when the material of the bracket 200 includes a metal material, the bracket 200 may serve as a heat sink of the first integrated circuit 330, so as to improve the heat dissipation effect of the first integrated circuit 330, reduce the space required by the conventional heat sink, and improve the product polarity and competitiveness.

Optionally, the antenna assembly 300 further comprises a connector 500, the first integrated circuit 330 being electrically connectable via the connector 500 to an external device, e.g. the first integrated circuit 330 being electrically connectable via the connector 500 to a motherboard of a wireless electronic device.

Alternatively, when the first portion 351 and the second portion 352 are opposite surfaces of the substrate 350, at least a portion of the substrate 350 extends out of the support 200, and the connector 500 may be disposed on the second surface 204 extending out of the support 200, i.e., the connector 500 is exposed from the support 200, so that the first integrated circuit 330 is electrically connected to the outside through the connector 500.

In some alternative embodiments, as above, the frame 100 further includes a bottom plate 130, where the bottom plate 130 is connected to the frame 110 and encloses the hollow space 120 with the frame 110, and the stand 200 and the bottom plate 130 are spaced apart, and the first antenna unit 310 may be located on a side of the stand 200 facing away from the bottom plate 130. For example, when the first antenna unit 310 is disposed on the first portion 351 of the substrate 350, the first portion 351 may be located on a side of the bracket 200 facing away from the base plate 130. When the first subsection 351 is positioned on the first surface 203, the first surface 203 may be a surface of the bracket 200 on a side facing away from the bottom plate 130.

In these alternative embodiments, the first antenna unit 310 is located on the side of the support 200 away from the bottom plate 130, which can improve the shielding of the support 200 from the first antenna unit 310 to affect the wireless signal receiving and transmitting of the first antenna unit 310, so as to further improve the performance of the first antenna module 301.

Optionally, the first antenna unit 310 is disposed on the surface of the substrate 350 facing away from the bracket 200, so that the distance between the first antenna unit 310 and the bracket 200 can be increased, and the first antenna unit 310 is exposed relative to the substrate 350, so that the performance of the first antenna module 301 can be further improved.

In any of the above embodiments, the first antenna module 301 and the second antenna module 302 are arranged in multiple manners, for example, one of the first antenna module 301 and the second antenna module 302 is a millimeter wave antenna module, and the other is a non-millimeter wave antenna module, so that the antenna assembly 300 can receive and transmit millimeter wave signals and non-millimeter wave signals.

In some alternative embodiments, the first antenna module 301 is a millimeter wave antenna module, and the first antenna unit 310 is configured to transmit and receive millimeter wave antenna signals. The first antenna unit 310 disposed on the stand 200 is more freely disposed in size, so that the first antenna unit 310 is disposed in a smaller size and can transmit and receive millimeter wave antenna signals in a proper size. The second antenna module 302 is a non-millimeter wave antenna module, and the second antenna unit 320 is configured to receive and transmit non-millimeter wave antenna signals. When the second antenna module 302 is a non-millimeter wave antenna module, the size of the stand 200 multiplexed to at least a portion of the second antenna unit 320 may be larger, so that the stand 200 can support the plurality of first antenna units 310.

In some alternative embodiments, as described above, when the bezel 110 includes a plurality of segments 110a, at least one segment 110a includes a conductive material and is multiplexed into at least a portion of the second antenna element 320, and the bracket 200 and the segment 110a multiplexed into the second antenna element 320 are electrically connected to each other.

In these alternative embodiments, at least part of the segments 110a are also multiplexed as a part of the second antenna unit 320, so as to further increase the distribution area of the second antenna module 302 and improve the wireless communication performance of the second antenna module 302.

In some alternative embodiments, the support 200 is provided with a support portion 240, and the support portion 240 extends from the support 200 toward the base plate 130 and is connected between the support 200 and the base plate 130. The support part 240 is supported and connected between the bracket 200 and the bottom plate 130, so that the stability of the position of the bracket 200 can be ensured.

In some alternative embodiments, the stand 200 includes a first end 201 and a second end 202 disposed opposite to each other, the first end 201 being coupled to the frame 110, i.e., the first end 201 being coupled to the segment 110a of the frame 110, the second end 202 being coupled to the support 240, the support 240 extending from the second end 202 toward the base 130 and being coupled between the second end 202 and the base 130.

In these alternative embodiments, the first end 201 of the bracket 200 is connected to the frame 110, and the second end 202 remote from the first end 201 is connected to the supporting portion 240, and the supporting portion 240 is supported and connected between the second end 202 and the bottom plate 130, so as to ensure the stability of the position of the bracket 200.

In other embodiments, the support 240 may also be disposed at any location of the stand 200.

Optionally, the first end 201 of the stand 200 and the segment 110a multiplexed into the second antenna element 320 are electrically connected to each other, so that the stand 200 and the segment 110a can be multiplexed together into the second antenna element 320, and the structure of the second antenna element 320 can be evolved.

The supporting portion 240 may be provided in various manners, for example, the supporting portion 240 may be columnar, and the supporting portion 240 may be prismatic, columnar, or the like. The support portion 240 may be disposed in a uniform cross section in a direction from the bracket 200 to the base plate 130.

In other alternative embodiments, the cross-section of the support 240 gradually decreases in the direction of the bracket 200 to the bottom plate 130. The impedance matching of the second antenna module 302 is facilitated, and the stability of the structure can be enhanced. .

Alternatively, the bottom plate 130 includes a ground layer, the bracket 200 is electrically connected to the support 240, and the support 240 is electrically connected to the ground layer, so that the support 240 may be grounded through the ground layer of the bottom plate 130. And the stand 200 is multiplexed into at least a portion of the second antenna unit 320 such that the second antenna unit 320 may be electrically connected through the stand 200, the support 240, and the ground layer of the base plate 130.

In other embodiments, as shown in fig. 16, the support portion 240 may not be provided on the stand 200. In these embodiments, the frame 110 may be provided with a ground portion, and the bracket 200 and the ground portion are connected to each other. That is, the bracket 200 multiplexed to at least a part of the second antenna unit 320 and the ground part on the frame 110 are connected to each other, thereby realizing the ground of the second antenna unit 320. For example, when the frame 110 includes the segment 110a, the segment 110a is provided with a grounding portion, and the bracket 200 and the grounding portion of the segment 110a are connected to each other. For example, the segment 110a is exposed to the ground conductive portion toward the bracket 200, and the bracket 200 is in contact with the ground conductive portion.

In some alternative embodiments, the first end 201 of the bracket 200 may be in direct contact with the bezel 110, i.e., the bracket 200 is in direct contact with the segment 110a multiplexed into the second antenna element 320, and the contact area of the bracket 200 and the segment 110a is the cross-sectional area of the bracket 200. The contact area between the bracket 200 and the segment 110a is smaller, so that the antenna performance of the second antenna unit 320 can be improved, and the occupied area on the bottom plate 130 is smaller, so that the polarity and competitiveness of the product can be improved.

In other embodiments, the first end 201 is provided with an abutment portion 250, and the abutment portion 250 extends from the first end 201 toward the bottom plate 130 and is connected with the frame 110, so that the abutment portion 250 can increase the contact area between the support 200 and the segment 110a of the frame 110, ensure the stability of the position of the support 200, and reduce the resistance.

Alternatively, when the bracket 200 and the ground portion of the frame 110 are connected to each other, the bracket 200 may be directly connected to the ground portion of the frame 110, and the conductive portion is exposed from a cross section of the bracket 200 facing the frame 110, and the bracket 200 is connected to the ground portion of the frame 110 through the conductive portion. Alternatively, the bracket 200 may be connected to each other through the abutting portion 250 and the grounding portion of the bezel 110.

Alternatively, the abutment 250 and the bracket 200 may be integrally formed to simplify the structure of the housing assembly.

Optionally, an end of the abutment 250 facing away from the first end 201 is connected to the bottom plate 130, so as to further ensure stability of the position of the bracket 200.

Optionally, the antenna assembly 300 further includes a second feeding portion 260, and the second feeding portion 260 is electrically connected to the stand 200, so that the second antenna unit 320 can be fed through the second feeding portion 260.

Alternatively, the supporting portion 240 may be reused as the second feeding portion 260, where the supporting portion 240 is not electrically connected to the ground layer of the bottom plate 130. For example, when the chassis 130 and the control motherboard are multiplexed, the chassis 130 is provided with a second integrated circuit, the second feeding portion 260 may be electrically connected to the second integrated circuit on the chassis 130, and the supporting portion 240 multiplexed as the second feeding portion 260 may be electrically connected to the second integrated circuit.

In other embodiments, the second feeding portion 260 and the supporting portion 240 are spaced apart on the stand 200. The second feeding portion 260 may be electrically connected to the second integrated circuit, and the supporting portion 240 may be electrically connected to the ground layer, where the second feeding portion 260 and the supporting portion 240 are used to implement different functions.

Alternatively, the second feeding element 260 may be disposed on a side of the support 200 facing the bottom plate 130, and the second feeding element 260 extends from the support 200 toward the bottom plate 130, so as to reduce the overall structural size of the housing assembly by using a gap between the support 200 and the bottom plate 130 to dispose the second feeding element 260.

Optionally, the second feeding element 260 is connected to the base plate 130, that is, the second feeding element 260 is connected between the base plate 130 and the stand 200, so that the structural stability of the stand 200 can be further improved.

Alternatively, as shown in fig. 17, the second feeding portion 260 may not be disposed on the stand 200.

Optionally, in the direction from the bottom plate 130 to the support 200, as shown in fig. 18, the cross-sectional area of the second feeding portion 260 gradually increases, so as to facilitate matching of the input impedance of the non-millimeter wave antenna, so that the energy fed by the second feeding portion 260 is radiated to a greater extent, that is, the antenna performance of the non-millimeter wave antenna and the non-millimeter wave wireless communication quality are improved.

Alternatively, as shown in fig. 19, the second feeding portion 260 may be formed by extending along a bending path, so as to increase the extension path length of the second feeding portion 260, increase the inductance performance of the second feeding portion 260, and facilitate impedance matching, so that the energy fed by the second feeding portion 260 is radiated to a greater extent. And the length of the first antenna module 301 can be extended to better cover the lower frequency band with the same appearance (like the number and position of the metal breaks).

Optionally, as shown in fig. 20, a conductive plate 270 is connected to the second feeding element 260, where the conductive plate 270 includes a conductive plane facing the bottom plate 130, and the conductive plane intersects the direction in which the bottom plate 130 is spaced from the stand 200. For example, the base plate 130 and the bracket 200 are disposed at intervals in the thickness direction, and the conductive plane intersects the thickness direction. By providing the conductive plate 270, parasitic capacitance can be formed between the conductive plate 270 and the ground layer of the bottom plate 130, so that impedance matching of non-millimeter waves is facilitated, and energy fed by the second feeding portion 260 is radiated to a greater extent, that is, antenna performance of the non-millimeter wave antenna and the non-millimeter wave wireless communication quality conductive plate are improved.

Optionally, the second feeding element 260 may further be provided with a conductive plate 270 extending along the bending path, so that the capacitance and inductance characteristics of the input impedance of the non-millimeter wave antenna can be adjusted with a higher degree of freedom, so that the input impedance is more matched, and the energy fed by the second feeding element 260 is radiated to a greater degree, that is, the antenna performance and the non-millimeter wave wireless communication quality of the non-millimeter wave antenna are improved.

Alternatively, the second feeding element 260 may include straight sections and curved sections distributed along the thickness direction (i.e., the direction in which the support 200 and the base 130 are spaced apart), and when the conductive plate 270 is connected to the second feeding element 260, the conductive plate 270 may be located on a side of the curved section facing or facing away from the base 130. The straight line segment may also be located on the side of the curved segment facing toward or away from the base plate 130.

In any of the above embodiments, the first integrated circuit 330 may be disposed on the substrate 350 or the stand 200. In other embodiments, as shown in fig. 21 to 24, the first integrated circuit 330 is disposed on the bottom board 130 and located on a side of the second end 202 facing away from the first end 201, the substrate 350 includes a first segment 354 disposed on the support 200 and a second segment 355 disposed on the support 240, the plurality of first antenna units 310 are disposed on the first segment 354, and the first feeding portion 340 is connected to the plurality of first antenna units 310 and the first integrated circuit 330 by the first antenna module 301 via the second segment 355.

Optionally, when the first integrated circuit 330 is disposed on the bottom board 130, the shielding case 400 may also be disposed on the bottom board 130, so that the overall size of the first antenna module 301 can be thinned, and the distance between the bracket 200 and the bottom board 130 can be increased appropriately, so that the bracket 200 is further away from the ground, and therefore, the antenna performance and the non-millimeter wave wireless communication quality of the non-millimeter wave antenna can be improved.

Optionally, the substrate 350 further includes a third section 356, the third section 356 being connected to one end of the second section 355 and extending toward the first integrated circuit 330. Optionally, the third segment 356 is provided with a connector lug electrically connected to the first feeding portion 340, where the first integrated circuit 330 and the connector lug are connected to each other, for example, the first integrated circuit 330 and the first feeding portion 340 may be plugged with each other by a plug, which is convenient in connection manner, and is convenient for maintenance and replacement. Alternatively, in other embodiments, the first feeding element 340 and the first integrated circuit 330 are bound to each other in the third segment 356, so that the degree of freedom of material selection can be increased, the volume of the interconnection position between the first feeding element 340 and the first integrated circuit 330 can be reduced, the cost can be reduced, and the reliability of the performance of the wire module 200 can be improved.

Embodiments of the second aspect of the present application also provide a wireless electronic device comprising the housing assembly of any of the embodiments of the first aspect. Since the wireless electronic device provided in the second aspect of the present application includes the housing assembly of any one of the embodiments of the first aspect, the wireless electronic device provided in the second aspect of the present application has the beneficial effects of the housing assembly of any one of the embodiments of the first aspect, which are not described herein.

The wireless electronic device in the embodiment of the application includes, but is not limited to, a mobile phone, a personal digital assistant (Personal Digital Assistant, abbreviated as PDA), a tablet computer, an electronic book, a television, an access control, a smart phone, a console, and other devices with wireless communication function.

While the present application has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the present application. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims

1. An antenna device, comprising:

the frame body comprises a frame and a hollow space formed by enclosing the frame;

the bracket is connected with the frame and extends towards the hollow space, and comprises a first surface and a second surface which are opposite in the thickness direction;

the antenna assembly comprises a substrate and a first antenna module arranged on the substrate, wherein the first antenna module comprises a plurality of first antenna units distributed on the substrate at intervals, and the substrate is arranged on at least one of the first surface and the second surface.

2. The antenna device of claim 1, wherein the first antenna module further comprises a first integrated circuit and a first feed-in portion, the first feed-in portion being disposed on the substrate and electrically connecting the first integrated circuit and the first antenna unit.

3. The antenna device according to claim 2, wherein the substrate comprises a first section and a second section, the first antenna element being disposed in the first section, the first integrated circuit being disposed in the second section;

preferably, the first part is disposed on the first surface, the second part is disposed on the second surface, and the bracket includes a side surface connecting the first surface and the second surface;

Preferably, the substrate further comprises a bending part connecting the first part and the second part, and the bending part is arranged on the side surface;

preferably, the antenna device further comprises a shielding cover, wherein the shielding cover is covered on one side of the first integrated circuit, which is away from the bracket, and the shielding cover is connected with the second sub-part and encloses a cavity for accommodating the first integrated circuit;

preferably, the antenna assembly further comprises a connector disposed at the second sub-section and connected to the first integrated circuit, so that the first integrated circuit can be electrically connected to the outside via the connector, and the connector and the shield are disposed at the same side of the bracket and are spaced apart from each other;

preferably, the first antenna unit is disposed on a surface of the first subsection facing away from the bracket.

4. An antenna arrangement according to claim 3, characterized in that the first surface is provided with at least one first recess, the projection of at least one of the first antenna elements in the thickness direction and the projection of the first recess in the thickness direction being arranged at least partly overlapping;

preferably, the number of the first grooves is a plurality, and the projection of each first antenna unit along the thickness direction is located within the projection of each first groove along the thickness direction;

Preferably, the first groove penetrates through the bracket along the thickness direction, and the second part is provided with a conductive layer, and the projection of the first antenna unit along the thickness direction is positioned in the projection of the conductive layer along the thickness direction;

preferably, the second surface is provided with at least one second groove, and the projection of the second groove along the thickness direction and the projection of the first groove along the thickness direction are arranged in a staggered manner;

preferably, the first grooves are distributed at intervals along a first direction, the projection of the second groove along the thickness direction is located between the projections of two adjacent first grooves along the thickness direction, and the first direction and the thickness direction are intersected;

preferably, the second grooves penetrate through the bracket along a second direction, and the second direction intersects with the thickness direction and the first direction in pairs.

5. The antenna device according to claim 3, wherein the first and second portions are two opposite surfaces of the substrate, the substrate further comprising a communication hole penetrating the first and second portions, the first feed-in portion electrically connecting the first integrated circuit and the first antenna module via the communication hole;

Preferably, the first portion is located on a surface of the substrate facing away from the support, and the second portion is located on a surface of the substrate facing toward the support;

preferably, the substrate is disposed on the first surface, and the antenna device further includes a shielding cover, where the shielding cover and the second surface are connected to each other and enclose to form a cavity for accommodating the first integrated circuit;

preferably, the antenna assembly further comprises a connector disposed on the second surface and connected to the first integrated circuit, so that the first integrated circuit can be electrically connected to the outside via the connector, and the connector and the shielding case are spaced apart;

preferably, at least part of the substrate extends out of the support, and the connector is arranged on the second surface extending out of the support.

6. The antenna assembly of claim 2 wherein the housing further comprises a base plate connected to the rim and enclosing with the rim to form the hollow space, the support and the base plate being spaced apart, the first antenna element being located on a side of the support facing away from the base plate.

7. The antenna device according to claim 6, wherein a support portion is provided on the bracket, the support portion extending from the bracket toward the base plate and being interconnected with the base plate;

Preferably, the bracket includes opposed first and second ends, the first end being electrically connected to the segment and the second end being connected to the support portion, the support portion extending from the second end toward and interconnecting the base plate;

preferably, the cross section of the support portion is gradually reduced in a direction from the bracket to the bottom plate;

preferably, the bottom plate includes a ground layer, and the supporting part is electrically connected with the ground layer;

preferably, the bracket is directly connected with the frame through the first end;

or, the first end is provided with an abutting part, and the abutting part extends from the first end towards the bottom plate and is connected with the frame;

preferably, a second feed-in part is arranged on the bracket, and the second feed-in part is electrically connected with the bracket;

preferably, the frame body further comprises a bottom plate connected to the frame body, the bracket and the bottom plate are arranged at intervals, and the second feed-in part extends from the bracket towards the bottom plate;

preferably, the second feed-in part and the bottom plate are connected with each other;

preferably, the cross-sectional area of the second feed-in part gradually decreases in the direction from the bracket to the bottom plate;

And/or, the second feed-in part extends along the bending path;

and/or, the second feed-in part is connected with a conductive flat plate, the conductive flat plate comprises a conductive plane facing the bottom plate, and the conductive plane and the bottom plate are intersected with the interval setting direction of the bracket.

8. The antenna device according to claim 6, wherein the first integrated circuit is disposed on the bottom plate and on a side of the second end facing away from the first end, the base material includes a first segment disposed on the bracket and a second segment disposed on the supporting portion, the plurality of first antenna units are disposed on the first segment, and the first feeding portion connects the plurality of first antenna units and the first integrated circuit via the second segment by the first antenna module;

preferably, the substrate further comprises a third segment connected to one end of the second segment and extending towards the first integrated circuit,

9. The antenna assembly of claim 1, wherein the antenna assembly further comprises a second antenna module, the second antenna module comprising a plurality of second antenna elements,

the first antenna module and the bracket are mutually insulated, and the bracket comprises a conductive material and is multiplexed into at least part of the second antenna unit;

preferably, the first antenna module is a millimeter wave antenna module, and the first antenna unit is used for receiving and transmitting millimeter wave antenna signals;

and/or the second antenna module is a non-millimeter wave antenna module, and the second antenna unit is used for receiving and transmitting non-millimeter wave antenna signals;

preferably, the frame is provided with a grounding part, and the bracket and the grounding part are connected with each other;

preferably, the frame comprises a plurality of segments, at least one of the segments comprising a conductive material and being multiplexed to at least part of the second antenna element, the frame and the segments multiplexed to the second antenna element being electrically connected to each other.

10. A wireless electronic device comprising the antenna arrangement of any one of claims 1-9.