CN117666045A - Airtight through sealing method for optoelectronic device packaging tube shell and optical fiber assembly - Google Patents
Airtight through sealing method for optoelectronic device packaging tube shell and optical fiber assembly Download PDFInfo
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- CN117666045A CN117666045A CN202311721862.9A CN202311721862A CN117666045A CN 117666045 A CN117666045 A CN 117666045A CN 202311721862 A CN202311721862 A CN 202311721862A CN 117666045 A CN117666045 A CN 117666045A
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- optical fiber
- shape memory
- memory alloy
- tube shell
- sealing
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 120
- 238000007789 sealing Methods 0.000 title claims abstract description 83
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 52
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 50
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 230000008859 change Effects 0.000 claims abstract description 5
- 230000002427 irreversible effect Effects 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229920006332 epoxy adhesive Polymers 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
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- 239000010410 layer Substances 0.000 description 2
- 230000003446 memory effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
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Abstract
The invention belongs to the field of manufacturing of optoelectronic devices, and particularly relates to an airtight through sealing method of an optoelectronic device packaging tube shell and an optical fiber assembly, which comprises the following steps: the optical fiber package comprises a package tube shell containing an optical fiber tail tube, a supporting base, an optoelectronic chip, a cover plate, an optical fiber sealing assembly and a one-way shape memory alloy sleeve; the one-way shape memory alloy sleeve is arranged between the optical fiber tail pipe of the packaging tube shell and the metal sleeve of the optical fiber sealing assembly, the inner wall of the one-way shape memory alloy sleeve is contacted with the outer wall of the metal sleeve in the optical fiber sealing assembly, and the outer wall of the one-way shape memory alloy sleeve is contacted with the inner wall of the optical fiber tail pipe in the packaging tube shell; heating the one-way shape memory alloy sleeve, wherein the one-way shape memory alloy sleeve generates irreversible phase change and volume expansion, and forms tight contact between the inner wall of the optical fiber tail pipe in the packaging tube shell and the outer wall of the metal sleeve in the optical fiber sealing assembly, so that the pressure fixation and airtight sealing of the optical fiber sealing assembly in the optical fiber tail pipe in the packaging tube shell are realized; the method has good air tightness and reliability, simple process and low implementation cost.
Description
Technical Field
The invention belongs to the technical field of manufacturing of optoelectronic devices, and particularly relates to an airtight through sealing method for an optoelectronic device packaging tube shell and an optical fiber assembly.
Background
Optoelectronic devices are devices with the functions of light emission and receiving, image acquisition and display, light signal transmission and processing and the like based on the effects of light-electricity, electricity-light conversion and the like, and are widely applied to the fields of optical fiber communication, laser technology, photoelectric detection, photoelectric sensing and the like. Optoelectronic devices are typically composed of an optoelectronic chip, a package envelope (containing an optical fiber tailpipe), a cover plate, a support base (heat sink, thermoelectric cooler, etc.), and an optical fiber assembly. The photoelectric chip is the core of an optoelectronic device, integrates optical and electronic elements, and can realize the functions of interconversion between optical signals and electric signals, signal amplification, signal modulation and the like; the packaging tube shell (containing the optical fiber tail tube), the cover plate and the supporting base are external protection and supporting structures of the optoelectronic device, and play roles in mechanical support, electrical connection and sealing protection of the optoelectronic chip; optical fibers are transmission media in optoelectronic devices for transmitting optical signals. Under the non-sealing protection condition, the photoelectric chip is easy to be influenced by water vapor, dust and the like to cause failure, so that the sealing performance of the sealing cover is required to be good, the sealing performance of the tail pipe of the optical fiber is required to be good, the air tightness of any one of the two parts is not up to the standard, and the device has higher failure risk. At present, a high-performance, high-reliability and long-life optoelectronic device is generally hermetically packaged by adopting a metal tube shell, wherein the sealing of a cover plate and the tube shell adopts a mature parallel seam welding process, and the air tightness can reach 1 multiplied by 10 -5 Pa·cm 3 /s。
The difficulty in sealing optoelectronic devices is the sealing of the fiber optic assembly within the tail tube of the package, and currently two main processes are adhesive sealing and metallic solder sealing, respectively. The device sealed by the adhesive has poor stability, high temperature resistance and larger expansion coefficient, and is easy to crack when the ambient temperature changes widely, so that leakage is caused, and the sealing effect is not achieved. The device sealed by the metal solder has the advantages of high reliability, good air tightness and the like, but the competitiveness of the metal solder sealing process in certain application scenes is affected due to the problems of complex process, high cost, large limitation, environmental pollution and the like.
These two major process problems seriously hamper the development of integration of fiber optic assemblies and optoelectronic devices; and because the photoelectronic device used in the aerospace environment has higher requirements on vibration resistance, high and low temperature, air tightness and packaging material selection, the conventional adhesive sealing and metal solder sealing methods are difficult to be applied.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides an airtight feedthrough sealing method for an optoelectronic device package case and an optical fiber assembly, comprising: a package tube shell (containing an optical fiber tail tube), an optical fiber sealing assembly and a one-way shape memory alloy sleeve of an optoelectronic device; the single-pass shape memory alloy sleeve is arranged between the optical fiber tail pipe of the packaging tube shell and the metal sleeve of the optical fiber sealing assembly; the inner wall of the one-way shape memory alloy sleeve is contacted with the outer wall of the metal sleeve in the optical fiber sealing assembly, and the outer wall of the one-way shape memory alloy sleeve is contacted with the inner wall of the optical fiber tail pipe in the packaging tube shell; the one-way shape memory alloy sleeve is heated, irreversible phase change and volume expansion are generated on the one-way shape memory alloy sleeve, tight contact is formed between the inner wall of the optical fiber tail pipe in the packaging tube shell and the outer wall of the metal sleeve in the optical fiber sealing assembly, and pressure fixation and airtight sealing of the optical fiber sealing assembly in the optical fiber tail pipe in the packaging tube shell are realized.
Preferably, a supporting base and a photoelectric chip are arranged in the packaging tube shell; the photoelectric chip and the supporting base are arranged inside the packaging tube shell, and the photoelectric chip is arranged on the supporting base; the top of the package is sealed by a cover plate.
Preferably, the optical fiber sealing assembly comprises an optical fiber, a metal sleeve, a metal solder and an epoxy adhesive; fixing and sealing the optical fiber in the metal sleeve by adopting metal solder; and filling gaps in the metal sleeve by using an epoxy resin adhesive to form the optical fiber sealing assembly.
Further, the surface of the optical fiber in the metal sleeve is coated with a gold layer after the original coating layer is removed, so that the weldability and the welding strength with the metal solder are enhanced.
Preferably, the single pass shape memory alloy is comprised of the metallic elements nickel and titanium.
Preferably, heating the one-way shape memory alloy sleeve comprises: coupling and aligning the coupling end of the optical fiber sealing assembly with the photoelectric chip in the packaging tube shell, clamping the optical fiber tail pipe of the packaging tube shell by adopting a graphite clamp, electrifying the graphite clamp, and heating the one-way shape memory alloy sleeve to perform one-way expansion deformation to realize filling and sealing of a gap between the optical fiber tail pipe in the packaging tube shell and the metal sleeve in the optical fiber sealing assembly; and cutting off the power supply and cooling the packaging tube shell.
Preferably, the single pass shape memory alloy sleeve is heated to a temperature in the range of 40 ℃ to 160 ℃.
The invention has the beneficial effects that:
the airtight through sealing method for the packaging tube shell of the optoelectronic device and the optical fiber assembly based on the single-pass shape memory alloy has the advantages of compact structure, simple process, convenient installation, good air tightness and reliability, can realize the airtight sealing between the packaging tube shell and the optical fiber assembly with relatively low cost, and meets the requirements of harsh working environments such as moisture resistance, vibration resistance, mechanical impact resistance, thermal circulation resistance and the like. The method has small heat affected zone, can reduce the influence on the internal assembly of the module and the optical fiber structure, is convenient for the internal structural design of the module, and realizes the sealing of various shapes and materials.
Drawings
FIG. 1 is a block diagram of an optoelectronic device in an embodiment of the invention;
FIG. 2 is a diagram of the hermetic feed-through seal structure of a single pass shape memory alloy based optoelectronic device package and fiber optic assembly in an embodiment of the present invention;
FIG. 3 is a cross-sectional view of an optical fiber seal assembly according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
An optoelectronic device package structure, as shown in fig. 1, the package structure comprising: the packaging tube shell (comprising an optical fiber tail tube), a supporting base, an optoelectronic chip, a cover plate and an optical fiber sealing assembly; the photoelectric chip is arranged on the supporting base, the photoelectric chip and the supporting base are both arranged inside the packaging tube shell, the cover plate is arranged at the top of the packaging tube shell, and the optical fiber sealing component is embedded into the optical fiber tube tail of the packaging tube shell; the optical fiber sealing assembly comprises an optical fiber, a metal sleeve, metal solder and an epoxy resin adhesive; arranging metal solder in the metal sleeve, hermetically sealing and fixing the optical fiber in the metal sleeve by the metal solder, and filling gaps in the metal sleeve by using an epoxy resin adhesive; and fixing the filled optical fiber sealing assembly in the optical fiber tail of the packaging tube shell through metal solder, and completing the airtight packaging of the device.
A preferred embodiment of an optoelectronic device package structure, as shown in fig. 2-3, includes: the optical fiber package comprises a package tube shell containing an optical fiber tail tube, a supporting base, an optoelectronic chip, a cover plate, an optical fiber sealing assembly and a one-way shape memory alloy sleeve; the support base and the photoelectric chip are arranged inside the packaging tube shell, and the photoelectric chip is arranged on the support base; the cover plate is arranged at the top of the packaging tube shell; the one-way shape memory alloy sleeve is arranged inside the optical fiber pipe tail of the packaging pipe shell, the optical fiber sealing assembly is embedded into the one-way shape memory alloy sleeve, and the one-way shape memory alloy sleeve is heated, so that the inside of the packaging pipe shell is in a sealing environment. The optical fiber sealing assembly comprises an optical fiber, a metal sleeve, metal solder and an epoxy resin adhesive; the metal solder is arranged in the metal sleeve, the optical fiber is inserted into the metal sleeve, the optical fiber in the metal sleeve is coated with a gold layer after the original coating layer is removed, and the metal solder performs airtight sealing and fixing on the optical fiber in the metal sleeve; and filling gaps in the metal sleeve by using an epoxy resin adhesive.
In this embodiment, the principle of the one-way shape memory alloy is the thermoelastic martensitic transformation effect. The atomic vibrations within the material are enhanced when the single pass shape memory alloy is heated, resulting in an increase in the lattice constant, which causes the volume of the material to expand. And the phase change characteristic is irreversible, so that the phase change memory effect is achieved by a single-pass memory effect.
In this embodiment, the single pass shape memory alloy sleeve is heated to a temperature in the range of 40 ℃ to 160 ℃. Through a large number of experiments and comparison data, the optimal heating temperature range of the single-pass shape memory alloy sleeve is 50-60 ℃.
The optical fiber sealing component consists of an optical fiber, a metal sleeve, metal solder and an epoxy resin adhesive, can ensure that the optical fiber is hermetically sealed and fixed in the metal sleeve, and can effectively isolate the invasion of outside water vapor, dust and other harmful substances.
Based on the one-way shape memory alloy, when the optical fiber tail pipe of the packaging tube shell is heated, the one-way shape memory alloy sleeve is subjected to one-way expansion deformation, deformation pressure causes close contact between the inner wall of the optical fiber tail pipe in the packaging tube shell and the outer wall of the one-way shape memory alloy sleeve, the inner wall of the one-way shape memory alloy sleeve and the outer wall of the metal sleeve in the optical fiber sealing assembly, and when the optical fiber tail pipe of the packaging tube shell and the one-way shape memory alloy sleeve in the optical fiber tail pipe are cooled to normal temperature, the deformation of the one-way shape memory alloy sleeve is not changed, so that the packaging tube shell and the optical fiber assembly are sealed with high air tightness and high reliability.
In one embodiment of the present invention, a method for hermetically sealing a package of an optoelectronic device and an optical fiber assembly based on a single pass shape memory alloy comprises: the optical fiber package comprises a package tube shell containing an optical fiber tail tube, a supporting base, an optoelectronic chip, an optical fiber sealing assembly and a one-way shape memory alloy sleeve. The one-way shape memory alloy sleeve is composed of metal elements nickel and titanium, the one-way shape memory alloy sleeve is pre-installed in an optical fiber tail pipe of an encapsulation tube shell, a step structure can be arranged in the optical fiber tail pipe to limit the one-way shape memory alloy sleeve, then an optical fiber sealing component penetrates through the shape memory alloy sleeve in the optical fiber tail pipe in the encapsulation tube shell, a coupling end of the optical fiber sealing component is aligned with a photoelectric chip in the encapsulation tube shell in a coupling way, the optical fiber tail pipe of the encapsulation tube shell is clamped by a graphite clamp, the graphite clamp is electrified, the one-way shape memory alloy sleeve is heated to generate one-way expansion deformation, gap filling and sealing between the optical fiber tail pipe in the encapsulation tube shell and the metal sleeve in the optical fiber sealing component are realized, finally, a power supply is cut off, the encapsulation tube shell is cooled, and pressure fixing and airtight sealing of the optical fiber component in the optical fiber tail pipe in the encapsulation tube shell are completed.
An embodiment of a method of hermetically sealing a package of optoelectronic devices to an optical fiber assembly, the method comprising:
s1, arranging a supporting base on the bottom surface of the inside of a packaging tube shell, and arranging a photoelectric chip on the supporting base;
s2, loading the single-pass shape memory alloy sleeve into an optical fiber tail pipe of the packaging tube shell, and enabling the optical fiber sealing assembly to pass through the shape memory alloy sleeve in the optical fiber tail pipe of the packaging tube shell;
s3, coupling and aligning the coupling end of the optical fiber sealing assembly with the photoelectric chip in the packaging tube shell, clamping the optical fiber tail pipe of the packaging tube shell by adopting a graphite clamp, electrifying the graphite clamp, and heating the one-way shape memory alloy sleeve to generate one-way expansion deformation to realize filling and sealing of a gap between the optical fiber tail pipe in the packaging tube shell and the metal sleeve in the optical fiber sealing assembly;
s4, cutting off the power supply and cooling the packaging tube shell.
S5, sealing the top of the packaging tube shell by adopting a cover plate.
In this example, the implementation of the method is the same as the implementation of the device.
While the foregoing is directed to embodiments, aspects and advantages of the present invention, other and further details of the invention may be had by the foregoing description, it will be understood that the foregoing embodiments are merely exemplary of the invention, and that any changes, substitutions, alterations, etc. which may be made herein without departing from the spirit and principles of the invention.
Claims (7)
1. A method of hermetically sealing a package of optoelectronic devices to an optical fiber assembly, comprising: an optoelectronic device package shell containing an optical fiber tail pipe, an optical fiber sealing assembly and a one-way shape memory alloy sleeve; the single-pass shape memory alloy sleeve is arranged between the optical fiber tail pipe of the packaging tube shell and the metal sleeve of the optical fiber sealing assembly; the inner wall of the one-way shape memory alloy sleeve is contacted with the outer wall of the metal sleeve in the optical fiber sealing assembly, and the outer wall of the one-way shape memory alloy sleeve is contacted with the inner wall of the optical fiber tail pipe in the packaging tube shell; the one-way shape memory alloy sleeve is heated to cause irreversible phase change and volume expansion of the one-way shape memory alloy sleeve, and tight contact is formed between the inner wall of the optical fiber tail pipe in the packaging tube shell and the outer wall of the metal sleeve in the optical fiber sealing assembly, so that the pressure fixation and airtight sealing of the optical fiber sealing assembly in the optical fiber tail pipe in the packaging tube shell are realized.
2. The method of hermetically sealing a package of optoelectronic devices with an optical fiber assembly of claim 1, wherein the package is internally provided with a support base and an optoelectronic chip; the support base and the photoelectric chip are arranged inside the packaging tube shell, and the photoelectric chip is arranged on the support base; the top of the package is sealed by a cover plate.
3. The method of claim 1, wherein the optical fiber sealing assembly comprises an optical fiber, a metal ferrule, a metal solder, and an epoxy adhesive; fixing and sealing the optical fiber in the metal sleeve by adopting metal solder; and filling gaps in the metal sleeve by using an epoxy resin adhesive to form the optical fiber sealing assembly.
4. A method of hermetically sealing a package housing for an optoelectronic device and an optical fiber assembly according to claim 3 wherein the surface of the optical fiber in the metal ferrule is coated with a gold layer after removal of the original coating.
5. The method of hermetically sealing a package of optoelectronic devices with an optical fiber assembly of claim 1 wherein the single pass shape memory alloy is comprised of metallic elements nickel and titanium.
6. The method of hermetically sealing a package for an optoelectronic device with an optical fiber assembly of claim 1, wherein heating the one-way shape memory alloy ferrule comprises: coupling and aligning the coupling end of the optical fiber sealing assembly with a photoelectric chip in the packaging tube shell, clamping an optical fiber tail pipe of the packaging tube shell by adopting a graphite clamp, electrifying the graphite clamp, and heating the one-way shape memory alloy sleeve to perform one-way expansion deformation to realize pressure fixation and airtight sealing of the optical fiber sealing assembly in the optical fiber tail pipe in the packaging tube shell; and cutting off the power supply and cooling the packaging tube shell.
7. The method of hermetically sealing a package of optoelectronic devices with an optical fiber assembly of claim 6 wherein the single pass shape memory alloy ferrule is heated at a temperature in the range of 40 ℃ to 160 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311721862.9A CN117666045A (en) | 2023-12-14 | 2023-12-14 | Airtight through sealing method for optoelectronic device packaging tube shell and optical fiber assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311721862.9A CN117666045A (en) | 2023-12-14 | 2023-12-14 | Airtight through sealing method for optoelectronic device packaging tube shell and optical fiber assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117666045A true CN117666045A (en) | 2024-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311721862.9A Pending CN117666045A (en) | 2023-12-14 | 2023-12-14 | Airtight through sealing method for optoelectronic device packaging tube shell and optical fiber assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117666045A (en) |
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2023
- 2023-12-14 CN CN202311721862.9A patent/CN117666045A/en active Pending
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