CN117664020A - Measurement data compensation method and related device of visual imaging detection equipment - Google Patents

Measurement data compensation method and related device of visual imaging detection equipment Download PDF

Info

Publication number
CN117664020A
CN117664020A CN202211010264.6A CN202211010264A CN117664020A CN 117664020 A CN117664020 A CN 117664020A CN 202211010264 A CN202211010264 A CN 202211010264A CN 117664020 A CN117664020 A CN 117664020A
Authority
CN
China
Prior art keywords
measurement data
data
measurement
compensation
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211010264.6A
Other languages
Chinese (zh)
Inventor
胡剑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seizet Technology Shenzhen Co Ltd
Original Assignee
Seizet Technology Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seizet Technology Shenzhen Co Ltd filed Critical Seizet Technology Shenzhen Co Ltd
Priority to CN202211010264.6A priority Critical patent/CN117664020A/en
Publication of CN117664020A publication Critical patent/CN117664020A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Abstract

The application discloses a measurement data compensation method of visual imaging detection equipment and a related device. The measurement data compensation method comprises the following steps: measuring an object to be measured by adopting visual imaging detection equipment to obtain point cloud data of the object to be measured; acquiring measurement data corresponding to the set measurement parameters on the object to be measured according to the point cloud data; respectively calculating compensation values corresponding to the measurement parameters according to standard data and measurement data corresponding to different measurement parameters; the measurement data is compensated with the compensation value to obtain compensated measurement data corresponding to the measurement data. By adopting the scheme, the problem of overall data deviation when the visual imaging detection equipment performs data measurement can be reduced.

Description

Measurement data compensation method and related device of visual imaging detection equipment
Technical Field
The present disclosure relates to the field of vision imaging measurement technologies, and in particular, to a measurement data compensation method and related apparatus based on a vision imaging detection device.
Background
At present, in the field of semiconductor measurement such as wafers, three-dimensional morphology of the semiconductor such as the wafers can be detected by adopting 3D visual imaging equipment, and further measurement of corresponding dimensional parameters is carried out according to the three-dimensional morphology. The existing 3D visual imaging apparatus is usually an optical measurement apparatus, which can emit detection light through a light source, and then send a formed modulated light beam to the surface of an object to be measured after the detection light modulation, so that the surface of the object to be measured emits corresponding excitation light (reflection light corresponding to the modulated light beam or fluorescence generated by excitation of the modulated light beam), and further obtains an optical signal corresponding to the excitation light by using a sensor, converts the optical signal into a corresponding electrical signal, and sends the electrical signal to a corresponding processor for processing, thereby obtaining a three-dimensional shape corresponding to semiconductor measurement such as a wafer.
However, the existing sensor may cause problems of overall bigger or smaller measurement of the measured dimension parameters of the semiconductor such as the wafer, or bigger data band due to the problems of the existing sensor.
Disclosure of Invention
The main objective of the present application is to provide a method for compensating measurement data of a visual imaging detection device and a related device, which aim to solve the above technical problems.
To achieve the above object, the present application proposes a measurement data compensation method of a visual imaging detection apparatus, the measurement data compensation method comprising:
measuring an object to be measured by adopting visual imaging detection equipment to obtain point cloud data of the object to be measured;
acquiring measurement data corresponding to the set measurement parameters on the object to be measured according to the point cloud data;
respectively calculating compensation values corresponding to the measurement parameters according to standard data and the measurement data corresponding to different measurement parameters;
and compensating the measurement data by adopting the compensation value to obtain compensation measurement data corresponding to the measurement data.
Optionally, the step of obtaining measurement data corresponding to the set measurement parameters on the object to be measured according to the point cloud data includes:
acquiring a plurality of measurement data corresponding to the set measurement parameters on a plurality of objects to be measured; or alternatively
And acquiring a plurality of measurement data corresponding to the set measurement parameters of a plurality of targets to be measured on the object to be measured.
Optionally, if the measurement parameter is a height dimension of the object to be measured, calculating compensation values corresponding to the measurement parameter according to standard data and the measurement data corresponding to different measurement parameters respectively includes:
calculating a measurement data average value corresponding to the set measurement parameters according to a plurality of measurement data;
obtaining the compensation value according to the difference value between the average value of the measured data and the standard data;
wherein the compensation value d=davg-Dstd; davg is expressed as the average of the measured data and Dstd is expressed as standard data.
Optionally, if the measurement parameter is a diameter size of the object to be measured, calculating compensation values corresponding to the measurement parameter according to the standard data and the measurement data corresponding to different measurement parameters respectively includes:
calculating a measurement data average value corresponding to the set measurement parameters according to a plurality of measurement data;
obtaining the compensation value according to the average value of the measurement data, the standard data and the maximum value and the minimum value in the measurement data;
the compensation value d=k is Davg-Dstd; davg is expressed as the average of the measured data and Dstd is expressed as the standard data;
wherein k is a compensation coefficient, and k= (Dstdmax-Dstdmin)/(Dmax-Dmin)Dstdmax is the upper tolerance limit of the standard data, dstdmin is the lower tolerance limit of the standard data, dmax is the maximum value of the measured data, and Dmin is the minimum value of the measured data.
Optionally, the calculating, according to the plurality of measurement data, a measurement data average value corresponding to the set measurement parameter includes:
sequentially arranging a plurality of measurement data according to the order of magnitude;
and selecting a set number of the measurement data close to the median of the measurement data, and calculating to obtain the average value of the measurement data.
Optionally, the set number is 60% -80% of the total number of the measurement data.
Optionally, the compensating the measurement data with the compensation value to obtain compensated measurement data corresponding to the measurement data includes:
and summing up the compensation measurement data according to the measurement data and the complement value corresponding to the measurement data.
To achieve the above object, the present application also proposes a measurement data compensation apparatus for a visual imaging detection device, the measurement data compensation apparatus comprising: sequentially coupled data receiving module, measuring module, data processing module and compensating module
The data receiving module is used for receiving point cloud data of the object to be detected;
the measuring module is used for acquiring measuring data corresponding to the set measuring parameters on the object to be measured according to the point cloud data;
the data processing module is used for respectively calculating compensation values corresponding to the measurement parameters according to standard data and the measurement data corresponding to different measurement parameters;
the compensation module is used for compensating the measurement data by adopting the compensation value to obtain compensation measurement data corresponding to the measurement data.
In order to achieve the above object, the present application further proposes a visual imaging detection apparatus comprising a memory, a processor and a measurement data compensation program stored on the memory and executable on the processor, which when executed by the processor implements the steps of the measurement data compensation method of the visual imaging detection apparatus as described above.
To achieve the above object, the present application also proposes a computer-readable storage medium having stored thereon a measurement data compensation program which, when executed by a processor, implements the steps of the measurement data compensation method as described above.
According to the technical scheme, the compensation measurement data corresponding to each measurement data can be obtained and output by compensating the measurement parameter matching compensation value, so that the problem that the measurement data are subjected to integral deviation due to hardware reasons can be reduced. In addition, by respectively matching the compensation values for different measurement parameters to compensate, the accuracy of measurement data corresponding to the different measurement parameters can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from the structures shown in these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a flow chart of an embodiment of a method for compensating measurement data of a visual imaging detection apparatus according to the present application;
FIG. 2 is a schematic structural view of an embodiment of a compensation device for measurement data of a visual imaging detection apparatus provided in the present application;
FIG. 3 is a schematic structural view of an embodiment of a visual imaging detection apparatus provided in the present application;
FIG. 4 is a schematic diagram of a framework of one embodiment of the computer-readable storage medium of the present application.
The realization, functional characteristics and advantages of the present application will be further described with reference to the embodiments, referring to the attached drawings.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
In the present embodiment, if a directional instruction is referred to, the directional instruction is merely used to explain the relative positional relationship, movement condition, etc. between the components in a specific posture, and if the specific posture is changed, the directional instruction is changed accordingly.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.
In the prior art, a wafer can be detected through a visual imaging detection device so as to detect the size of a tin ball on the wafer. The existing visual imaging detection equipment generally has the defect that the data output after measurement can have overall size deviation due to the limitation of hardware, so that the output data is inaccurate. For the size of solder balls on a wafer, at least the height and diameter of each solder ball is inspected. And the size offset of the height size and the diameter size of the solder balls are different.
Fig. 1 is a schematic flow chart of an embodiment of a method for compensating measurement data of a visual imaging detection apparatus.
The measuring data compensation method of the visual imaging detection equipment specifically comprises the following steps:
s110: and measuring the object to be measured by adopting visual imaging detection equipment so as to acquire the point cloud data of the object to be measured.
In the step, the visual imaging detection equipment can be adopted to measure the object to be measured, so that point cloud data of the object to be measured are obtained, and the morphology data of the measuring surface of the object to be measured can be obtained through the point cloud data.
Taking wafer detection as an example, the point cloud data of one side of the wafer, on which the solder balls are arranged, can be obtained through the visual imaging detection equipment, and then the size of the solder balls on the wafer is measured. Hereinafter, the sample is taken as a wafer for illustration.
S120: and acquiring measurement data corresponding to the set measurement parameters on the object to be measured according to the point cloud data.
In this step, measurement data corresponding to the set measurement parameters on the object to be measured can be obtained according to the obtained point cloud data of the object to be measured.
When the object to be measured is a wafer, the measurement parameters of the object to be measured can be the height dimension and the diameter dimension of the solder balls on the wafer. The height dimension may be expressed as a distance between a side of the solder ball on the wafer away from the mounting surface of the solder ball on the wafer and the mounting surface.
Generally, when a wafer is placed, the wafer can be placed on an object carrying platform, and the visual imaging detection equipment can calibrate the coordinate system of the object carrying platform, so that the position of an object to be detected in the coordinate system can be positioned when the object to be detected on the object carrying platform is detected, and the coordinates of each point in the point cloud in the coordinate system can be simultaneously determined when the point cloud of the object to be detected on the object carrying platform is obtained. The coordinate system may be an XYZ coordinate system. The bearing surface of the carrying platform can be parallel to a X, Y axis of the XYZ coordinate system, wherein when the wafer to be tested is placed on the carrying platform, the Z axis direction of the XYZ coordinate system can correspond to the height direction of the solder balls on the wafer.
The height dimension and the diameter dimension of the solder balls on the wafer can be measured by the point cloud data of the wafer obtained through the visual imaging detection equipment.
The height dimension of the solder ball can be obtained through measurement of the point cloud coordinates of the solder ball and the coordinates of the setting surface in the point cloud data. Specifically, the point cloud data of the wafer includes a plurality of points, and each point in the point cloud data has a corresponding spatial coordinate. And obtaining a fitting surface corresponding to the setting surface by the point cloud corresponding to the setting surface, and obtaining the height dimension of the solder ball by calculating the maximum distance between the point cloud of the solder ball and the fitting surface.
The diameter size of the solder ball can be further calculated and obtained by converting the point cloud data of the wafer into two-dimensional image data and further according to the projection of the solder ball in the two-dimensional image data. Specifically, the diameter size corresponding to the solder ball may be obtained by obtaining the projected area of the solder ball in the two-dimensional image data and performing the squaring calculation.
S130: and respectively calculating compensation values corresponding to the measurement parameters according to the standard data and the measurement data corresponding to different measurement parameters.
In this step, further, according to the standard data and the measurement data corresponding to different measurement parameters, compensation values corresponding to the measurement parameters are calculated respectively.
That is, when the measurement parameter is the height dimension, then the compensation value of the measurement parameter corresponding to the height dimension is calculated from the standard data and the measurement data of the height dimension; when the measurement parameter is a diameter size, a compensation value of the measurement parameter corresponding to the diameter size is calculated from the standard data and the measurement data of the diameter size.
Specifically, for the height dimension, the measurement data corresponding to the height dimension is obtained through coordinate calculation, and the offset of the measurement data is small, so that a plurality of measurement data can be generally used to calculate and set the average value of the measurement data corresponding to the measurement parameter, and then the compensation value is obtained according to the difference value between the average value of the measurement data and the standard data.
Specifically, a plurality of measurement data corresponding to the height dimension are selected to calculate the average value of the measurement data. Further measuring the difference value between the data average value and the standard data to obtain a compensation value; wherein the compensation value d1=davg-Dstd; davg is expressed as the average of the measured data and Dstd is expressed as standard data.
The plurality of measurement data corresponding to the height dimension may be the height dimension of the set area for the plurality of wafers, or the plurality of measurement data may be the height dimension of the plurality of targets to be measured on the same wafer. Taking a wafer as an example, the plurality of measurement data corresponding to the height dimension may be the height dimension of a plurality of solder balls on the wafer, or may also be the height dimension of a plurality of solder balls on different wafers.
In addition, for the diameter size, measurement calculation of the diameter size of the solder ball on the wafer is generally performed by adopting a mode of acquiring an area and dividing the area, wherein the point cloud data can be converted into two-dimensional image data, and then the projection area of the solder ball on the wafer can be acquired according to the projection of the solder ball in the two-dimensional image data, and then the diameter size on the wafer can be calculated according to the projection area.
Specifically, an average value of measurement data corresponding to the diameter size may be calculated from the plurality of measurement data; obtaining a compensation value according to the average value of the measurement data, the standard data and the maximum value and the minimum value in the measurement data; compensation value d2=k x Davg-Dstd; davg is expressed as the average of the measured data and Dstd is expressed as the standard data; wherein k is a compensation coefficient, and k= (Dstdmax-Dstdmin)/(Dmax-Dmin)Dstdmax is the upper tolerance limit of the standard data, dstdmin is the lower tolerance limit of the standard data, dmax is the maximum value of the plurality of measurement data, and Dmin is the minimum value of the plurality of measurement data.
That is, when calculating the compensation value corresponding to the diameter size, the compensation coefficient k needs to be calculated according to the average value of the measurement data, the standard data, and the maximum value and the minimum value in the measurement data, and then the compensation value D2 corresponding to the diameter size is obtained by combining the compensation coefficient k.
S140: the measurement data is compensated with the compensation value to obtain compensated measurement data corresponding to the measurement data.
After step S130 is completed, a compensation value D (D1 or D2) corresponding to the set measurement parameter can be obtained, and the measurement data can be further compensated according to the compensation value D to obtain compensated measurement data corresponding to the measurement data. Wherein, the compensation measurement data db=dce+d, dce is a compensation value corresponding to the set measurement parameter and D is a compensation value corresponding to the set measurement parameter. The compensation measurement data Db is the data of the measurement output of the visual imaging detection device.
Therefore, in this embodiment, by compensating the measurement parameter matching compensation value, the compensation measurement data corresponding to each measurement data can be obtained and output, so that the problem that the measurement data is shifted as a whole due to hardware reasons can be reduced. In addition, by respectively matching the compensation values for different measurement parameters to compensate, the accuracy of measurement data corresponding to the different measurement parameters can be improved.
Further, in this embodiment, when calculating the average value of the measurement data corresponding to the set measurement parameter according to the plurality of measurement data, the plurality of measurement data may be sequentially arranged according to the order of magnitude, and then the set number of the plurality of measurement data close to the median of the measurement data may be selected to calculate the average value of the measurement data.
Specifically, the plurality of measurement data may be sequentially arranged according to the size sequence, so that a certain number of minimum and maximum measurement data may be removed, so as to reduce the interference of the extremum. For example, if n pieces of measurement data are arranged in order from large to small to obtain A1, A2, a3. Wherein, the certain proportion can be 10% -20% of the total amount of the measured data. That is, the measurement data accounting for 10% -20% of the total number of measurement data from the start data A1 (maximum data) may be removed, and the measurement data accounting for 10% -20% of the total number of measurement data from the end data An (minimum data) may be removed, and the measurement data which is close to the intermediate value of the plurality of measurement data and accounts for 60% -80% of the total number of measurement data may remain. Wherein the number of measurement data removed from both the start data A1 and the end data An is the same.
For example, from the start data A1, and from the end data An, both of which are removed from the measurement data accounting for 20% of the total amount of measurement data, the measurement data accounting for 60% of the total amount of measurement data may be left for the average calculation. From the start data A1 and from the end data An, both of which are removed from the measurement data accounting for 10% of the total amount of measurement data, the measurement data accounting for 80% of the total amount of measurement data may be left for the average calculation. The scheme has the advantages that by removing the largest part of measurement data and the smallest part of measurement data, the abrupt change of the measurement data can be reduced, the subsequent mean value calculation is interfered, and the accuracy and the stability of the finally formed compensation value D can be improved.
In this embodiment, the standard data may be given standard values, wherein the given standard values may be design standard data, and the tolerance upper limit value and the tolerance lower limit value of the standard data may be obtained by the design standard data and the design tolerance. Or the standard data can also be measured by using a measuring device with higher precision, and then the obtained measured data.
In this embodiment, a high-precision 2D camera may be used to capture a wafer, and further calculate the diameter of a solder ball according to the profile information of the solder ball on the captured image, and calculate the diameter of the solder ball by calculating the profile information of each solder ball on the wafer, so that the maximum value and the minimum value of the diameter of each solder ball can be obtained by comparing the diameters of the solder balls by statistics, and the maximum value and the minimum value of the diameter correspond to the tolerance upper limit value and the tolerance lower limit value of the diameter standard data, respectively.
Further, after the step S140 is completed to compensate the measurement data, the present application further provides a calibration method to calibrate the compensation value D.
The calibration can be performed by using multiple sets of accurate measurement data obtained after data compensation by the method. Specifically, taking the measurement parameter as the diameter size as an example, the compensation coefficient k can be calibrated to further calibrate the output data of the diameter size.
In this embodiment, the calibration method specifically includes the following steps:
s210: multiple sets of compensated measurement data are invoked.
Wherein, the plurality of sets of compensated measurement data can be obtained by the measurement data compensation method in the previous embodiment. For example, compensating the measurement data on each wafer may obtain a set of compensated measurement data; and compensating the measurement data on the plurality of groups of wafers to obtain a plurality of groups of compensated measurement data. The plurality of groups of compensation measurement data finally obtained by measurement of the visual imaging detection equipment can be stored in a setting memory, and can be selected and called from the memory when data calling is needed.
And each group of compensation measurement data can synchronously store a compensation formula for carrying out data compensation on the compensation measurement data. When the corresponding compensation measurement data is called, the corresponding compensation formula can be synchronously called. In this step, the plurality of sets of compensation measurement data that are called are the plurality of sets of compensation measurement data that use the same compensation formula to perform data compensation. When diameter measurement is carried out, the compensation formula is a compensation value D2=k, davg-Dstd; compensation coefficient k= (Dstdmax-Dstdmin)/(Dmax-Dmin); compensating measurement data db=dce+d.
S220: and obtaining measurement data for setting the measurement parameters according to the compensation measurement data.
In this step, the foregoing formula may be adopted to calculate reversely to obtain actual measurement data corresponding to each compensation measurement data. Specific values of the compensation coefficients k, dstdmax, dstdmin, dmax, dmin and Dstd can be obtained.
Wherein, the qualified data and the unqualified data in the plurality of groups of compensation measurement data can be processed separately. Firstly, qualified data in a plurality of groups of compensation measurement data can be processed, so that actual measurement data corresponding to each qualified compensation measurement data can be obtained. And unqualified data in the plurality of groups of compensation measurement data can be processed, so that actual measurement data corresponding to each unqualified compensation measurement data is obtained.
S220: and adjusting the compensation coefficient in the compensation formula according to the actual measurement data.
In this step, the compensation coefficient in the compensation formula is further adjusted according to the actual measurement data.
Specifically, for the foregoing plural sets of compensated measurement data, each set of compensated measurement data includes plural compensated measurement data, whether each of the compensated measurement data is qualified as actual measurement data, and a qualification rate of the plural compensated measurement data.
The value of the compensation coefficient k in the compensation formula can be finely adjusted to form a modulated compensation formula, and each actual measurement data is substituted into the modulated compensation formula for calculation, so that a plurality of groups of modulation measurement data corresponding to a plurality of groups of compensation measurement data are obtained.
And then, carrying out clamping judgment according to the data specification (Dstd, dmax, dmin and other numerical values) according to each modulation measurement data in each group of modulation measurement data so as to judge whether each modulation measurement data is qualified or not, and counting the qualification rate of a plurality of modulation measurement data in each group of modulation measurement data.
Further, in the foregoing embodiment, the profile of the object to be measured may be stored according to the point cloud data of the object to be measured. Each group of compensation measurement data can be respectively and correspondingly stored with a corresponding topography map.
In this step, whether the modified compensation coefficient k is qualified or not may be determined according to the qualification rate of the plurality of sets of modulation measurement data, that is, the corresponding topography map, for example, the qualification rate of the plurality of sets of modulation measurement data calculated by using the modified compensation coefficient k is improved relative to the qualification rate of the plurality of sets of compensation measurement data (that is, the qualified data is newly added in the plurality of sets of modulation measurement data), so that the newly added qualified data may be confirmed on the topography map, and if the shape and size of the corresponding object to be measured on the topography map are basically consistent with the shape and size of the corresponding object to be measured on the corresponding compensation measurement data, the newly obtained compensation coefficient k is qualified, otherwise, the newly obtained compensation coefficient k is not qualified. After the compensation coefficient k is adjusted for a plurality of times, the optimal compensation coefficient k value is selected so as to form a new compensation formula.
Further, in other embodiments, the qualified data and the unqualified data in the multiple sets of compensated measurement data may be separately processed.
For example, the compensation coefficient k is modified to obtain a modulated compensation formula, and the actual measurement data corresponding to all the qualified compensation measurement data is substituted into the modulated compensation formula to perform calculation, so as to obtain the modulated measurement data corresponding to all the qualified compensation measurement data, and then the modulated measurement data and the corresponding topography diagram are used for judging, so as to determine whether the compensation coefficient k is qualified.
After judging that the compensation coefficient k is qualified, substituting the actual measurement data corresponding to all unqualified compensation measurement data into the modulated compensation formula to calculate, and further judging according to the modulation measurement data and the corresponding topography map to determine whether the compensation coefficient k is qualified.
And repeating the steps for a plurality of times, namely modifying the compensation coefficient k for a plurality of times, performing data processing, and then judging to obtain the optimal value of the compensation coefficient k. And then the optimal value of the compensation coefficient k is substituted for the compensation coefficient k in the original compensation formula to form a new compensation formula so as to compensate the measurement data.
Further, the application also provides a compensation device for the measurement data of the visual imaging detection equipment. Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of a compensation device for measurement data of a visual imaging detection apparatus provided in the present application.
The measurement data compensation device 20 includes: the data receiving module 210, the measuring module 220, the data processing module 230 and the compensating module 240 are sequentially coupled.
The data receiving module 210 is configured to receive point cloud data of an object to be detected; the measurement module 220 is configured to obtain measurement data corresponding to a set measurement parameter on the object to be measured according to the point cloud data; the data processing module 230 is configured to calculate compensation values corresponding to the measurement parameters according to standard data and measurement data corresponding to different measurement parameters, respectively; the compensation module 240 is configured to compensate the measurement data using the compensation value to obtain compensated measurement data corresponding to the measurement data.
The measurement data compensation device 20 can then implement the method for compensating measurement data for a visual imaging detection apparatus described in the previous embodiments.
Further, referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of the visual imaging detection apparatus provided in the present application.
The visual imaging detection apparatus 30 includes a memory 310, a processor 320, and a measurement data compensation program 311 stored in the memory and executable on the processor 320, wherein the measurement data compensation program 311, when executed by the processor 320, implements the steps of the measurement data compensation method of the visual imaging detection apparatus as described above.
Referring to fig. 4, fig. 4 is a schematic diagram illustrating an embodiment of a computer readable storage medium according to the present application. The computer readable storage medium 40 stores program instructions 410 that can be executed by a processor, the program instructions 410 may be a measurement data compensation program for implementing the steps of the measurement data compensation method of the visual imaging detection apparatus described above.
In the several embodiments provided in the present application, it should be understood that the disclosed methods and apparatuses may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of modules or units is merely a logical functional division, and there may be additional divisions of actual implementation, e.g., units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical, or other forms.
The elements illustrated as separate elements may or may not be physically separate, and elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over network elements. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present application, or a part or all of the technical solution contributing to the prior art, may be embodied in the form of a software product stored in a computer-readable storage medium, including several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor (processor) to perform all or part of the steps of the methods of the embodiments of the present application. And the aforementioned computer-readable storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the scope of the claims, and all equivalent structural changes made in the present application and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the present application.

Claims (10)

1. A method of compensating measurement data for a visual imaging inspection apparatus, the method comprising:
measuring an object to be measured by adopting visual imaging detection equipment to obtain point cloud data of the object to be measured;
acquiring measurement data corresponding to the set measurement parameters on the object to be measured according to the point cloud data;
respectively calculating compensation values corresponding to the measurement parameters according to standard data and the measurement data corresponding to different measurement parameters;
and compensating the measurement data by adopting the compensation value to obtain compensation measurement data corresponding to the measurement data.
2. The method for compensating measurement data of a visual imaging inspection apparatus according to claim 1, wherein,
the step of obtaining the measurement data corresponding to the set measurement parameters on the object to be measured according to the point cloud data comprises the following steps:
acquiring a plurality of measurement data corresponding to the set measurement parameters on a plurality of objects to be measured; or alternatively
And acquiring a plurality of measurement data corresponding to the set measurement parameters of a plurality of targets to be measured on the object to be measured.
3. The method for compensating measurement data of a visual imaging inspection apparatus according to claim 2, wherein,
if the measurement parameter is the height of the object to be measured, calculating compensation values corresponding to the measurement parameter according to the standard data and the measurement data corresponding to different measurement parameters, respectively, including:
calculating a measurement data average value corresponding to the set measurement parameters according to a plurality of measurement data;
obtaining the compensation value according to the difference value between the average value of the measured data and the standard data;
wherein the compensation value d=davg-Dstd; davg is expressed as the average of the measured data and Dstd is expressed as standard data.
4. The method for compensating measurement data of a visual imaging inspection apparatus according to claim 2, wherein,
if the measurement parameter is the diameter of the object to be measured, calculating compensation values corresponding to the measurement parameter according to the standard data and the measurement data corresponding to different measurement parameters, respectively, including:
calculating a measurement data average value corresponding to the set measurement parameters according to a plurality of measurement data;
obtaining the compensation value according to the average value of the measurement data, the standard data and the maximum value and the minimum value in the measurement data;
the compensation value d=k is Davg-Dstd; davg is expressed as the average of the measured data and Dstd is expressed as the standard data;
wherein k is a compensation coefficient, and k= (Dstdmax-Dstdmin)/(Dmax-Dmin); dstdmax is the upper tolerance limit of the standard data, dstdmin is the lower tolerance limit of the standard data, dmax is the maximum value of the measured data, and Dmin is the minimum value of the measured data.
5. The measurement data compensation method of the visual imaging detection apparatus according to claim 3 or 4, wherein the calculating of the measurement data average value corresponding to the set measurement parameter from the plurality of measurement data includes:
sequentially arranging a plurality of measurement data according to the order of magnitude;
and selecting a set number of the measurement data close to the median of the measurement data, and calculating to obtain the average value of the measurement data.
6. The method for compensating measurement data of a visual imaging inspection apparatus according to claim 5, wherein,
the set number is 60% -80% of the total number of the measurement data.
7. The method for compensating measurement data of a visual imaging inspection apparatus according to claim 5, wherein,
said compensating said measurement data with said compensation value to obtain compensated measurement data corresponding to said measurement data, comprising:
and summing up the compensation measurement data according to the measurement data and the complement value corresponding to the measurement data.
8. A measurement data compensation apparatus for a visual imaging inspection device, the measurement data compensation apparatus comprising: sequentially coupled data receiving module, measuring module, data processing module and compensating module
The data receiving module is used for receiving point cloud data of the object to be detected;
the measuring module is used for acquiring measuring data corresponding to the set measuring parameters on the object to be measured according to the point cloud data;
the data processing module is used for respectively calculating compensation values corresponding to the measurement parameters according to standard data and the measurement data corresponding to different measurement parameters;
the compensation module is used for compensating the measurement data by adopting the compensation value to obtain compensation measurement data corresponding to the measurement data.
9. A visual imaging detection apparatus comprising a memory, a processor and a measurement data compensation program stored on the memory and executable on the processor, the measurement data compensation program when executed by the processor implementing the steps of the measurement data compensation method of a visual imaging detection apparatus as claimed in any one of claims 1 to 7.
10. A computer-readable storage medium, on which a measurement data compensation program is stored, which, when executed by a processor, implements the steps of the measurement data compensation method according to any one of claims 1 to 7.
CN202211010264.6A 2022-08-23 2022-08-23 Measurement data compensation method and related device of visual imaging detection equipment Pending CN117664020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211010264.6A CN117664020A (en) 2022-08-23 2022-08-23 Measurement data compensation method and related device of visual imaging detection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211010264.6A CN117664020A (en) 2022-08-23 2022-08-23 Measurement data compensation method and related device of visual imaging detection equipment

Publications (1)

Publication Number Publication Date
CN117664020A true CN117664020A (en) 2024-03-08

Family

ID=90082956

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211010264.6A Pending CN117664020A (en) 2022-08-23 2022-08-23 Measurement data compensation method and related device of visual imaging detection equipment

Country Status (1)

Country Link
CN (1) CN117664020A (en)

Similar Documents

Publication Publication Date Title
CN112797915B (en) Calibration method, calibration device and system of line structured light measurement system
CN111750804B (en) Object measuring method and device
CN107607294B (en) industrial camera entrance pupil position detection method and system
CN106352806A (en) High-precision calibration method for stereoscopic vision three-dimensional digital image correlation measurement
CN111508011A (en) Depth data calibration method of flight time camera
CN113008158A (en) Multi-line laser tyre pattern depth measuring method
CN113074660A (en) Surface shape measuring method for large-size transparent object
CN109682398B (en) Method, device and system for calibrating orientation elements in complete machine of stereo mapping camera
CN110044266B (en) Photogrammetry system based on speckle projection
CN112116665B (en) Structural light sensor calibration method
CN112945109B (en) Laser displacement meter array system parameter calibration method based on horizontal displacement table
CN117664020A (en) Measurement data compensation method and related device of visual imaging detection equipment
CN116202423A (en) Line laser two-dimensional positioning method based on laser triangulation ranging
CN113983951B (en) Three-dimensional target measuring method, device, imager and storage medium
CN115661268A (en) Camera calibration method using distance difference
CN112184790B (en) Object size high-precision measurement method based on depth camera
CN107741220B (en) Image processing method and device and electronic equipment
CN111536873A (en) Method for positioning and measuring monocular deflection measurement workpiece by using auxiliary camera
CN116576806B (en) Precision control system for thickness detection equipment based on visual analysis
CN110567345A (en) Non-contact type pipe wall thickness measuring method and system based on machine vision
CN114152201B (en) Laser altimeter calibration method and device, electronic equipment and storage medium
CN110020648A (en) Workpiece measures and localization method
JP3369235B2 (en) Calibration method for measuring distortion in three-dimensional measurement
CN111210480B (en) Binocular precision detection method, binocular precision detection system, binocular precision detection equipment and storage medium
El-Hakim Application and performance evaluation of a vision-based automated measurement system

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination