CN117651901A

CN117651901A - Image pickup apparatus and optical apparatus

Info

Publication number: CN117651901A
Application number: CN202280045977.8A
Authority: CN
Inventors: 朴相沃; 金中喆
Original assignee: LG Innotek Co Ltd
Current assignee: LG Innotek Co Ltd
Priority date: 2021-05-28
Filing date: 2022-05-16
Publication date: 2024-03-05
Also published as: KR20220160836A

Abstract

The embodiment comprises the following steps: a fixing portion; a first magnet provided in the fixed portion; a first movable portion that includes a first coil and moves in an optical axis direction by interaction between a first magnet and the first coil; a second movable portion including a first substrate portion spaced apart from the fixed portion, a second coil opposing the first magnet in the optical axis direction, and an image sensor provided in the first substrate portion; and a first yoke provided in the fixed portion and arranged to oppose the first magnet in the optical axis direction, wherein the second movable portion is moved in a direction perpendicular to the optical axis direction by an interaction between the first magnet and the second coil.

Description

Image pickup apparatus and optical apparatus

Technical Field

Embodiments relate to an image pickup apparatus and an optical instrument including the same.

Background

The Voice Coil Motor (VCM) technology used in the conventional general image pickup apparatus is difficult to apply to the micro image pickup apparatus intended to exhibit low power consumption, and researches related to the micro image pickup apparatus have been actively conducted.

There is an increasing demand and production of electronic products equipped with camera devices, such as smart phones and cellular phones. The resolution of the camera device for cellular phones is higher and the size is smaller and smaller, and therefore, the actuator for cellular phones is smaller, larger in diameter and more functional. In order to realize a high-resolution cellular phone image pickup apparatus, improvement in performance of the cellular phone image pickup apparatus and additional functions such as auto-focusing, shutter anti-shake, and zooming are required.

Disclosure of Invention

[ technical problem ]

The embodiment provides an image pickup apparatus capable of improving electromagnetic force for AF operation and electromagnetic force for OIS operation and an optical instrument including the image pickup apparatus.

[ technical solution ]

An image pickup apparatus according to an embodiment includes: a fixing unit; a first magnet provided at the fixing unit; a first moving unit including a first coil and configured to move in an optical axis direction by an interaction between the first magnet and the first coil; a second mobile unit, the second mobile unit comprising: a first plate unit disposed to be spaced apart from the fixing unit, a second coil facing the first magnet in an optical axis direction, and an image sensor disposed on the first plate unit; and a first yoke provided at the fixing unit to oppose the first magnet in the optical axis direction. The second moving unit moves in a direction perpendicular to the optical axis direction by interaction between the first magnet and the second coil.

The first magnet may be disposed on the second coil, and the first yoke may be disposed under the second coil. The first magnet may include: a first magnet portion including a first N pole and a first S pole; and a second magnet portion including a second N pole and a second S pole, and disposed under the first magnet portion. A partition wall may be included that is disposed between the first magnet portion and the second magnet portion, and the partition wall may be a neutral region. The first magnet portion and the second magnet portion may be spaced apart from each other. The first N-pole may be in contact with the second S-pole and the first S-pole may be in contact with the second N-pole.

The image pickup apparatus may include a second yoke disposed between the first magnet portion and the second magnet portion. The image pickup apparatus may include a third yoke disposed on a side surface of the first magnet. The image pickup apparatus may include a fourth yoke disposed on an upper surface of the second magnet. The first yoke may be a magnetic body. The image pickup apparatus may include a fifth yoke provided on a side surface of at least one of the first magnet portion or the second magnet portion. The first yoke may overlap at least a portion of the first magnet in the optical axis direction.

The first magnet may be spaced apart from the second coil in the optical axis direction by a distance shorter than the first magnet. The fixing unit may include a second plate unit disposed to be spaced apart from the first plate unit, and a support plate conductively connecting the first plate unit to the second plate unit. The first yoke may be disposed between the second coil and the second plate unit. The first yoke may be disposed on an upper surface of the second plate unit.

An image pickup apparatus according to another embodiment includes: a fixing unit; a first magnet and a yoke disposed to be spaced apart from each other in the fixing unit; a first moving unit including a first coil facing the first magnet in a direction perpendicular to the optical axis; and a second mobile unit including: the image sensor includes a first plate unit disposed to be spaced apart from the fixing unit, an image sensor disposed on the first plate unit, and a second coil facing the first magnet in an optical axis direction. The second coil is disposed between the first magnet and the yoke, and moves the second moving unit in a direction perpendicular to the optical axis direction by interaction with the first magnet.

An image pickup apparatus according to still another embodiment includes: a fixing unit; a first magnet provided in the fixing unit; a first moving unit including a first coil and configured to move in an optical axis direction by an interaction between the first magnet and the first coil; a second moving unit including a first plate unit disposed to be spaced apart from the fixed unit, a second coil facing the first magnet in an optical axis direction, and an image sensor disposed on the first plate unit; and a second magnet provided in the fixing unit so as to face the second coil in the optical axis direction. The second moving unit moves in a direction perpendicular to the optical axis direction by interaction between each of the first magnet and the second coil.

The first magnet may be disposed above the second coil, and the second magnet may be disposed below the second coil. The first magnet may include: a first magnet portion including a first N pole and a first S pole; and a second magnet portion including a second N pole and a second S pole, and disposed under the first magnet portion. A partition wall may be included that is disposed between the first magnet portion and the second magnet portion, and the partition wall may be a neutral region. The first magnet portion and the second magnet portion may be spaced apart from each other.

The first N-pole may be in contact with the second S-pole and the first S-pole may be in contact with the second N-pole. At least a part of the first magnet portion may overlap with the first coil in a direction perpendicular to the optical axis direction. The length of the first magnet portion in the optical axis direction may be longer than the length of the second magnet portion in the optical axis direction.

The second coil may be disposed under the second magnet portion, and the second magnet portion may be disposed under the second coil.

Each of the first and second magnet portions may include a long side and a short side when viewed from above, and a length of the short side of the first magnet portion may be longer than a length of the short side of the second magnet portion. Each of the first and second magnet portions may include a long side and a short side when viewed from above, and the length of the long side of the first magnet portion may be longer than the length of the long side of the second magnet portion. Each of the first and second magnet portions may include a long side and a short side when viewed from above, and a length of the long side of each of the first and second magnet portions may be longer than a length of the long side of the coil.

The image pickup apparatus may include a third magnet disposed between the first magnet and the second coil and facing the second coil in the optical axis direction.

The volume of the first magnet may be greater than the volume of the second magnet. The first magnet and the second magnet may be disposed with opposite polarities thereof facing each other in the optical axis direction. The fixing unit may include a second plate unit disposed to be spaced apart from the first plate unit, and a support plate conductively connecting the first plate unit to the second plate unit. The second magnet may be disposed on the second plate unit. The first magnet may be a unipolar magnetized magnet including one N pole and one S pole.

An image pickup apparatus according to still another embodiment includes: a fixing unit; a first magnet and a second magnet disposed to be spaced apart from each other in the fixing unit; a first moving unit including a first coil facing the first magnet in a direction perpendicular to the optical axis; and a second moving unit including a first plate unit disposed to be spaced apart from the fixed unit, an image sensor disposed on the first plate unit, and a second coil facing the first magnet and the second magnet in an optical axis direction. The second coil is disposed between the first magnet and the second magnet, and moves the second moving unit in a direction perpendicular to the optical axis direction by interaction with each of the first magnet and the second magnet.

An image pickup apparatus according to still another embodiment includes: a fixing unit including a cover member and a first magnet disposed in the cover member; a first moving unit including a bobbin provided in the cover member and a first coil provided on the bobbin, and configured to move in an optical axis direction; and a second moving unit including a first plate unit disposed to be spaced apart from the fixed unit, a second coil facing the first magnet, and an image sensor disposed on the first plate unit, and configured to move in a direction perpendicular to the optical axis direction by an interaction between the first magnet and the second coil. The cover member includes a protruding portion protruding from the cover member toward the bobbin, and at least a part of the protruding portion overlaps the first magnet in a direction perpendicular to the optical axis direction.

The protruding portion may be formed of a metal material or a magnetic material. The cover member may be formed of a metallic material or a magnetic material. The cover member may include an oxidation-resistant metal plated on a surface thereof to prevent oxidation. The cover member may include an upper plate, a side plate connected to the upper plate, and an aperture formed in the upper plate, and the protruding portion may extend from a region adjacent to the aperture.

The protruding portion may be formed in a plate shape, and at least a portion of the protruding portion may include a curved portion. The bobbin may include a groove corresponding to the protruding portion, and at least a portion of the protruding portion may be inserted and disposed in the groove of the bobbin. The first magnet may include a plurality of magnets, and the cover member may include a plurality of protruding portions corresponding to the plurality of magnets. The first coil may have a ring shape wound around an outer surface of the bobbin, and the protruding portion may be located inside the first coil. At least a portion of the first coil may be disposed between the protruding portion and the first magnet. The second coil may be disposed under the first magnet. The first magnet may include: a first magnet portion including a first N pole and a first S pole; and a second magnet portion including a second N pole and a second S pole, and disposed below the first magnet portion, and at least a part of the protruding portion may overlap the first magnet portion in a direction perpendicular to the optical axis direction. The image pickup apparatus may include a yoke disposed below the second coil. The image pickup apparatus may include a second magnet disposed below the second coil.

An image pickup apparatus according to another embodiment includes: a fixing unit including a cover member and a first magnet disposed in the cover member; a first moving unit including a bobbin provided in the cover member and a first coil provided on the bobbin and configured to move in an optical axis direction, and

and a second moving unit including a first plate unit disposed to be spaced apart from the fixed unit, a second coil facing the first magnet, and an image sensor disposed on the first plate unit, and configured to move in a direction perpendicular to the optical axis direction by an interaction between the first magnet and the second coil. The cover member may be formed of a metal material.

[ advantageous effects ]

Embodiments may use a yoke disposed under the second coil to increase electromagnetic force caused by interaction between the first magnet and the second coil, may increase OIS driving force or electromagnetic force for OIS operation, and may prevent an increase in power consumption.

In addition, the embodiment may use a yoke provided on the first magnet to enhance electromagnetic force caused by interaction between the first magnet and the first coil and electromagnetic force caused by interaction between the first magnet and the second coil.

In addition, in the embodiment, since the first magnet is implemented as a bipolar magnetized magnet, OIS electromagnetic force can be improved.

In addition, in the embodiment, since the length of the first magnet portion of the first magnet is set longer than the length of the second magnet portion of the first magnet, electromagnetic force for AF operation can be increased, and an increase in power consumption can be prevented.

In addition, in the embodiment, since the length of the first magnet portion of the first magnet is set longer than the length of the second magnet portion of the first magnet, the linearity of the correlation between the displacement of the bobbin and the output from the first position sensor can be improved.

In addition, the embodiment may use the first magnet and the second magnet to increase electromagnetic force caused by interaction with the second coil, may increase OIS driving force or electromagnetic force for OIS operation, and may prevent an increase in power consumption.

Embodiments may use a cover member formed of a metal material or a magnetic material to increase electromagnetic force caused by interaction between a first magnet and a first coil, may increase AF driving force, and may prevent an increase in power consumption.

In addition, since the protruding portion provided on the cover member provided to face the first magnet serves as a yoke, electromagnetic force for AF operation can be increased, and an increase in power consumption can be prevented.

Drawings

Fig. 1 is a perspective view of an image pickup apparatus according to an embodiment.

Fig. 2 is a perspective view of the image pickup apparatus, with the cover member removed from the image pickup apparatus.

Fig. 3 is an exploded perspective view of the image pickup apparatus in fig. 1.

Fig. 4A is a sectional view taken along a line AB in the image pickup apparatus of fig. 1.

Fig. 4B is a sectional view taken along a line CD in the image pickup apparatus of fig. 1.

Fig. 4C is a sectional view taken along a line EF in the image pickup apparatus of fig. 1.

Fig. 5 is an exploded perspective view of the AF mobile unit in fig. 3.

Fig. 6 is a perspective view of the bobbin, sensing magnet, balancing magnet, first coil, circuit board, first position sensor, and capacitor.

Fig. 7 is a perspective view of the bobbin, the case, the circuit board, the upper elastic member, the sensing magnet, and the balancing magnet.

Fig. 8 is a bottom perspective view of the housing, coil former, lower elastic member, magnet and circuit board.

Fig. 9 is a perspective view of the image sensor unit.

Fig. 10A is a first exploded perspective view of the image sensor unit in fig. 9.

Fig. 10B is a second exploded perspective view of the image sensor unit in fig. 9.

Fig. 11 is a perspective view of the holder, the second coil, the image sensor, the OIS position sensor, and the first board unit in fig. 10A.

Fig. 12 is a first perspective view of the first circuit board and the second circuit board of the first board unit.

Fig. 13 is a second perspective view of the first circuit board and the second circuit board of the first board unit.

Fig. 14A is a bottom perspective view of the retainer.

Fig. 14B shows the holder, the first plate unit, and the support plate.

Fig. 15 is a perspective view of the holder, the second coil, the first plate unit, the image sensor, and the support plate.

Fig. 16 shows an embodiment of the elastic unit of the support plate.

Fig. 17 is a bottom perspective view of the first circuit board and the support plate.

Fig. 18A is a first perspective view of a support plate coupled to a retainer and a base.

Fig. 18B is a second perspective view of the support plate coupled to the retainer and the base.

Fig. 19 is a top view of the first plate unit, the retainer, the support plate, and the elastic member.

Fig. 20A is a perspective view of the first coil, the first magnet, the second coil, the yoke, and the first and second plate units.

Fig. 20B is an enlarged view of a part of the image pickup apparatus.

Fig. 20C shows the distance between the first magnet and the first coil, the distance between the first magnet and the yoke, and the distance between the second coil and the yoke.

Fig. 21A shows an embodiment of the first magnet, the first coil, the second coil, and the yoke.

Fig. 21B shows another embodiment of the first magnet.

Fig. 21C shows yet another embodiment of the first magnet.

Fig. 21D shows yet another embodiment of the first magnet.

Fig. 21E is a modified example of fig. 21B.

Fig. 22A shows yet another embodiment of the first magnet.

Fig. 22B shows an embodiment of the length of the long side of each of the first magnet, the second coil, and the yoke.

Fig. 22C shows another embodiment of the length of the long side of the second magnet portion in fig. 22B.

Fig. 23A shows another embodiment of fig. 21E.

Fig. 23B shows another embodiment of fig. 21C.

Fig. 23C shows another embodiment of fig. 23B.

Fig. 24 illustrates placement of a third magnet according to an embodiment.

Fig. 25 is a perspective view of the cover member, the first magnet, the first coil, the second coil, and the second position sensor according to the embodiment.

Fig. 26 is a cross-sectional view of an image pickup apparatus according to another embodiment.

Fig. 27A is a first exploded perspective view of an image sensor unit according to another embodiment shown in fig. 26.

Fig. 27B is a second exploded perspective view of the image sensor unit according to another embodiment shown in fig. 26.

Fig. 28 is a perspective view of a holder, a second coil, a first plate unit, an image sensor, a support plate, and a magnet according to another embodiment shown in fig. 26.

Fig. 29A is a perspective view of a first coil, a magnet, a second coil, a magnet, a yoke, a first plate unit, and a second plate unit of the image pickup apparatus device according to another embodiment shown in fig. 26.

Fig. 29B is an enlarged view of a part of the image pickup apparatus according to another embodiment shown in fig. 26.

Fig. 29C shows a distance between a magnet and a second coil and a distance between the magnet and the second coil in the image pickup apparatus device according to another embodiment shown in fig. 26.

Fig. 30A shows a first magnet, a first coil, a second magnet, and a yoke according to the embodiment shown in fig. 26.

Fig. 30B shows another embodiment of the first magnet according to the embodiment shown in fig. 26.

Fig. 30D shows yet another embodiment of the first magnet according to the embodiment shown in fig. 26.

Fig. 30E is a modified example of fig. 30B.

Fig. 30F is another modified example of fig. 30A.

Fig. 31A shows yet another embodiment of the first magnet shown in fig. 16.

Fig. 31B shows an embodiment of the length of the long side of each of the first magnet, the first coil, the second magnet, and the yoke according to the embodiment shown in fig. 26.

Fig. 31C shows another embodiment of the length of the long side of each of the second magnet and the second magnet portion shown in fig. 31B.

Fig. 32A shows another embodiment of fig. 30E.

Fig. 32B shows another embodiment of fig. 30C.

Fig. 32C shows another embodiment of fig. 32B.

Fig. 33 shows the placement of a third magnet according to another embodiment of fig. 26.

Fig. 34 is a perspective view of an optical instrument according to an embodiment.

Fig. 35 is a configuration diagram of the optical instrument shown in fig. 34.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

The technical idea of the present disclosure is not limited to the embodiment to be described, but may be implemented in various other forms, and one or more of the constituent parts may be selectively combined and substituted without departing from the scope of the technical idea of the present disclosure.

In addition, unless specifically defined and explicitly described, terms (including technical and scientific terms) used in the embodiments of the present disclosure should be interpreted as having meanings that are commonly understood by one of ordinary skill in the art to which the present disclosure belongs, and meanings of commonly used terms (e.g., terms defined in dictionaries) should be interpreted in view of the context of the related art.

Furthermore, the terminology used in the embodiments of the present disclosure is for the purpose of describing the embodiments and is not intended to be limiting of the present disclosure. In this specification, unless specifically stated otherwise in the phrase, singular forms may also include plural forms, and where "at least one (or one or more) of A, B or C" is stated, it may include one or more of all possible combinations of A, B and C.

In addition, in describing components of embodiments of the present disclosure, terms such as "first", "second", "a", "B", "a", and "(B)" may be used. Such terminology is used only to distinguish one component from another component and does not determine the nature, order, or procedure of the corresponding constituent elements.

In addition, when one component is described as being "connected," "coupled," or "joined" to another component, the description may include not only the direct "connection," "coupling," or "joining" to the other component, but also the "connection," "coupling," or "joining" of the other component with the other component. In addition, in the case where it is described as being formed or disposed "above (upper)" or "below (lower)" another member, the description includes not only the case where two members are in direct contact with each other but also the case where one or more other members are formed or disposed between the two members. In addition, when expressed as "above (upper)" or "below (lower)", it may refer to a downward direction as well as an upward direction with respect to one element.

Hereinafter, the AF moving unit may be alternatively referred to as a lens moving apparatus, a lens moving unit, a Voice Coil Motor (VCM), an actuator, or a lens moving device. Hereinafter, the "coil" may be alternatively referred to as a coil unit, and the "elastic member" may be alternatively referred to as an elastic unit or a spring.

In addition, in the following description, the "terminal" may be alternatively referred to as a pad, an electrode, a conductive layer, or a bonding unit.

For convenience of description, the image pickup apparatus according to the embodiment will be described using a cartesian coordinate system (x, y, z), but the embodiment is not limited thereto, and the image pickup apparatus may be described using other coordinate systems. In the respective figures, the x-axis and the y-axis may be directions perpendicular to the z-axis, which is an optical axis direction, the z-axis direction, which is a direction of the optical axis OA, may be referred to as a "first direction", the x-axis direction may be referred to as a "second direction", and the y-axis direction may be referred to as a "third direction". For example, the first direction may be a direction perpendicular to an image capturing area of the image sensor.

The image pickup apparatus according to the embodiment can perform the "autofocus function". Here, the autofocus function is a function of automatically focusing an image of a subject on the surface of the image sensor.

Hereinafter, the image pickup apparatus may be alternatively referred to as an "image pickup apparatus module", "image pickup apparatus", "camera", or "lens moving apparatus".

In addition, the image pickup apparatus according to the embodiment can perform the "shake compensation function". Here, the hand shake compensation function is a function of suppressing blurring of the outline of a captured still image due to vibration caused by shake of the hand when the user captures the still image.

Fig. 1 is a perspective view of an image pickup apparatus 10 according to an embodiment, fig. 2 is a perspective view of the image pickup apparatus 10 from which a cover member 300 is removed, fig. 3 is an exploded perspective view of the image pickup apparatus 10 in fig. 1, fig. 4A is a sectional view of the image pickup apparatus 10 of fig. 1 taken along a line AB, fig. 4B is a sectional view of the image pickup apparatus 10 of fig. 1 taken along a line CD, fig. 4C is a sectional view of the image pickup apparatus 10 of fig. 1 taken along a line EF, fig. 5 is an exploded perspective view of the AF moving unit 100 in fig. 3, fig. 6 is a perspective view of a bobbin 110, a sensing magnet 180, a balance magnet 185, a first coil 120, a circuit board 190, a first position sensor 170, and a capacitor 195, fig. 7 is a perspective view of the bobbin 110, the case 140, the circuit board 190, an upper elastic member 150, the sensing magnet 180, a lower elastic member 160, 130, and a bottom perspective view of the circuit board 190.

Referring to fig. 1 to 8, the image pickup apparatus 10 may include an AF moving unit 100 and an image sensor unit 350.

The image pickup apparatus 10 may further include at least one of the cover member 300 or the lens module 400. The cover member 300 and the base 210 to be described later may constitute a case.

The AF moving unit 100 may be coupled to the lens module 400, and may move the lens module in the direction of the optical axis OA or in a direction parallel to the optical axis, thereby performing an auto-focusing function of the image pickup apparatus device 10.

The image sensor unit 350 may include an image sensor 810. The image sensor unit 350 may move the image sensor 810 in a direction perpendicular to the optical axis. In addition, the image sensor unit 350 may tilt the image sensor 810 with respect to the optical axis, or may rotate the image sensor 810 around the optical axis. The image sensor unit 350 may perform a camera shake compensation function of the image pickup apparatus 10.

In an example, the image sensor 810 may include an image capturing area for sensing light that has passed through the lens module 400. Here, the image capturing area may alternatively be referred to as an effective area, a light receiving area, or an active (active) area. For example, the image capturing area of the image sensor 810 may be a portion where light having passed through the filter 610 is introduced to form an image contained in the light, and may include at least one pixel.

The AF moving unit 100 may alternatively be referred to as a "lens moving unit" or a "lens moving apparatus". Alternatively, the AF moving unit 100 may be referred to as a "first moving unit (or a second moving unit)", "first actuator (or a second actuator)", or "AF driving unit".

In addition, the image sensor unit 350 may alternatively be referred to as an "image sensor moving unit", "image sensor shifting unit", "sensor moving unit", or "sensor shifting unit". Alternatively, the image sensor unit 350 may be referred to as a "second moving unit (or first moving unit)", "second actuator (or first actuator)", or "OIS driving unit".

Referring to fig. 5, the af moving unit 100 may include a bobbin 110, a first coil 120, a magnet 130, and a case 140.

The AF moving unit 100 may further include an upper elastic member 150 and a lower elastic member 160.

In addition, the AF mobile unit 100 may further include a first position sensor 170, a circuit board 190, and a sensing magnet 180 to implement AF feedback. In addition, the AF mobile unit 100 may further include at least one of a balance magnet 185 or a capacitor 195.

The bobbin 110 may be disposed in the case 140 and may be movable in a direction of the optical axis OA or a first direction (e.g., a Z-axis direction) by electromagnetic interaction between the first coil 120 and the magnet 130.

The bobbin 110 may have an opening formed therein to be coupled to the lens module 400 or to mount the lens module 400 in the opening. In an example, the opening in the bobbin 110 may be a through hole formed through the bobbin 110 in the optical axis direction, and may have a circular shape, an elliptical shape, or a polygonal shape, but is not limited thereto.

The lens module 400 may include at least one lens and/or a lens barrel.

For example, the lens module 400 may include one or more lenses and a lens barrel accommodating the one or more lenses. However, the present disclosure is not limited thereto. Any of various holding structures may be used instead of the lens barrel as long as the holding structure is capable of supporting one or more lenses.

In an example, the lens module 400 may be screwed to the bobbin 110. Alternatively, in another example, the lens module 400 may be coupled to the coil former 110 by means of an adhesive (not shown). Meanwhile, light that has passed through the lens module 400 may pass through the filter 610 and may be introduced into the image sensor 810.

The bobbin 110 may be provided with a protruding portion 111 on an outer surface thereof. In an example, the protruding portion 111 may protrude in a direction parallel to a line perpendicular to the optical axis OA. However, the present disclosure is not limited thereto.

The protruding portion 111 of the bobbin 110 may correspond to the recessed portion 25a in the case 140, and may be inserted or disposed in the recessed portion 25a in the case 140. The protruding portion 111 may inhibit or prevent the bobbin 110 from rotating about the optical axis beyond a predetermined range. In addition, the protruding portion 111 may serve as a stopper for preventing the bobbin 110 from moving beyond a predetermined range in the optical axis direction (e.g., a direction from the upper elastic member 150 toward the lower elastic member 160) due to an external impact or the like.

The bobbin 110 may have a first escape groove 112a formed in an upper surface thereof to avoid spatial interference with the first frame connection portion 153 of the upper elastic member 150. In addition, the bobbin 110 may have a second escape groove 112b formed in a lower surface thereof to avoid spatial interference with the second frame connection part 163 of the lower elastic member 160.

The bobbin 110 may include a first coupling portion 116a to be coupled or fixed to the upper elastic member 150. In an example, the first coupling portion of the bobbin 110 may take the form of a protrusion, but the present disclosure is not limited thereto. In another embodiment, the first coupling portion of the coil former may take the form of a flat surface or recess.

In addition, the bobbin 110 may include a second coupling portion 116b to be connected or fixed to the lower elastic member 160. In an example, the second coupling portion 116b may take the form of a protrusion, but the present disclosure is not limited thereto. In another embodiment, the second coupling part may take the form of a flat surface or a recess.

Referring to fig. 6, the bobbin 110 may have a recess formed in an outer surface thereof to allow the first coil 120 to be seated in, inserted into, or disposed in the recess. The recess in the bobbin 110 may have a closed curve shape (e.g., a ring shape) that conforms to the shape of the first coil 120.

In addition, the bobbin 110 may have a first seating recess 26a formed therein to allow the sensing magnet 180 to be seated in, inserted into, fixed to, or disposed in the first seating recess. In addition, the bobbin 110 may have a second seating recess 26b formed in an outer surface thereof to allow the balance magnet 185 to be seated in, inserted into, fixed to, or disposed in the second seating recess. In an example, the first and second seating recesses 26a and 26b in the bobbin 110 may be formed in outer surfaces of the bobbin 110 facing each other.

Referring to fig. 5 and 7, the bobbin 110 may be provided with a protrusion 104 protruding from an upper surface thereof to correspond to the first frame connection portion 153 of the upper elastic member 150. In an example, the protrusion 104 may protrude from a bottom surface of the first escape slot in the bobbin 110.

The damper 48 may be disposed between the protrusion 104 and the first frame connection portion 153 of the upper elastic member 150. The damper 48 may be in contact with the protrusion 104 and the first frame connection portion 153 in the bobbin 110 and attached to the protrusion 104 and the first frame connection portion 153 in the bobbin 110, and may serve to reduce or absorb vibration of the bobbin 110. For example, the damper 48 may be implemented as a damping member (e.g., silicone). The tab 104 may be used to guide the damper 48.

The bobbin 110 may have a groove 119 or a groove portion formed in an upper surface thereof, the groove 119 or the groove portion being at a position corresponding to the protruding portion 305 of the cover member 300, the protruding portion 305 facing the cover member 300, or overlapping the protruding portion 305 of the cover member 300 in the first direction (or the optical axis direction). In an example, the groove 119 may be formed to be recessed into the bottom surface of the first escape groove 112 a. In another embodiment, the groove 119 may be formed to be recessed into the upper surface of the bobbin 110.

The first coil 120 may be disposed on the bobbin 110 or coupled to the bobbin 110. In an example, the first coil 120 may be disposed on an outer surface of the bobbin 110. In an example, the first coil 120 may surround the outer surface of the bobbin 110 in a rotation direction around the optical axis OA, but the present disclosure is not limited thereto.

The first coil 120 may be directly wound around the outer surface of the bobbin 110, but the present disclosure is not limited thereto. In another embodiment, the first coil 120 may be wound around the bobbin 110 using a coil loop, or may be implemented as a coil block having an angled loop shape.

Power or a drive signal may be provided to the first coil 120. The power or driving signal supplied to the first coil 120 may be a DC signal, an AC signal, or a signal containing both a DC component and an AC component, and may be a voltage type or a current type.

When a driving signal (e.g., a driving current) is supplied to the first coil 120, an electromagnetic force may be generated by electromagnetic interaction with the magnet 130, and the bobbin 110 may be moved in the direction of the optical axis OA by the generated electromagnetic force.

At the initial position of the AF operation unit, the bobbin 110 may be movable upward or downward, which is referred to as bidirectional driving of the AF operation unit. Alternatively, at the initial position of the AF operation unit, the bobbin 110 may be movable upward, which is referred to as unidirectional driving of the AF operation unit.

For example, the maximum stroke of the bobbin 110 in the upward direction from its initial position may be 400 micrometers to 500 micrometers, and the maximum stroke of the bobbin 110 in the downward direction from its initial position may be 100 micrometers to 200 micrometers.

At an initial position of the AF operation unit, the first coil 120 may be disposed to correspond to or overlap with the magnet 130 disposed in the case 140 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis.

In an example, the AF operation unit may include a bobbin 110 and components (e.g., the first coil 120, the sensing magnet 180, and the balancing magnets 180 and 185) coupled to the bobbin 110. In addition, the AF operation unit may further include a lens module 400.

The initial position of the AF operation unit may be an original position of the AF operation unit in a state where power is not supplied to the first coil 120, or a position where the AF operation unit is located due to elastic deformation of the upper and lower elastic members 150 and 160 only due to the weight of the AF operation unit. In addition, the initial position of the bobbin 110 may be a position where the AF operation unit is located when gravity acts in a direction from the bobbin 110 toward the base 210 or when gravity acts in a direction from the base 210 toward the bobbin 110.

The sensing magnet 180 may provide a magnetic field detected by the first position sensor 170, and the balancing magnet 185 may counteract the effect of the magnetic field of the sensing magnet 180, and may establish a weight balance with the sensing magnet 180.

The sensing magnet 180 may alternatively be referred to as a "sensor magnet" or a "second magnet". The sensing magnet 180 may be disposed on the bobbin 110 or may be coupled to the bobbin 110. The sensing magnet 180 may be disposed to face the first position sensor 170. The balancing magnet 185 may be provided on the bobbin 110 or may be coupled to the bobbin 110. In an example, the balancing magnet 185 may be disposed opposite the sensing magnet 180.

In an example, each of the sensing magnet 180 and the balancing magnet 185 may be a unipolar magnetized magnet having one N pole and one S pole, but the present disclosure is not limited thereto. In another embodiment, each of the sensing magnet 180 and the balancing magnet 185 may be a bipolar magnetized magnet or a quadrupole magnet including two N poles and two S poles.

The sensing magnet 180 may move in the optical axis direction together with the bobbin 110, and the first position sensor 170 may detect the magnetic field strength or magnetic force of the sensing magnet 180 moving in the optical axis direction, and may output an output signal corresponding to the detection result.

In an example, the magnetic field strength or magnetic force detected by the first position sensor 170 may vary according to the displacement of the bobbin 110 in the optical axis direction. The first position sensor 170 may output an output signal proportional to the detected magnetic field strength, and the displacement of the bobbin 110 in the optical axis direction may be detected using the output signal from the first position sensor 170.

The case 140 is disposed inside the cover member 300. The case 140 may house the bobbin 110 and may support the magnet 130, the first position sensor 170, and the circuit board 190.

Referring to fig. 5, 7 and 8, the case 140 may be formed to take the overall shape of a hollow column. In an example, the case 140 may have a polygonal (e.g., quadrangular or octagonal) or circular opening formed therein, and the opening in the case 140 may take the form of a through hole formed through the case 140 in the optical axis direction.

The case 140 may include side portions corresponding to or facing the side plates 302 of the cover member 300, and corners corresponding to or facing the corners of the cover member 300.

The case 140 may be provided at an upper portion, an upper surface, or an upper end thereof with a stopper 145 to prevent direct collision with an inner surface of the upper plate 301 of the cover member 300.

Referring to fig. 5, the case 140 may include a mounting groove (or seating groove) 14a formed therein to accommodate the circuit board 190. The mounting groove 14a may have a shape conforming to the shape of the circuit board 190.

Referring to fig. 7, the case 140 may include an opening formed therein such that the terminals B1 to B4 of the terminal unit 95 of the circuit board 190 are exposed through the opening. An opening may be formed in a side portion of the case 140.

The case 140 may be provided at least one first coupling portion on an upper portion, an upper end or an upper surface thereof for coupling to the first outer frame 152 of the upper elastic member 150. The case 140 may be provided at a lower portion, a lower end, or a lower surface thereof with a second coupling portion for coupling and fixing to the second outer frame 162 of the lower elastic member 160. For example, each of the first and second coupling parts of the case 140 may be formed in a flat surface, a protruding shape, or a concave shape.

The magnet 130 may be disposed on the case 140. In an example, the magnet 130 may be disposed on a side portion of the case 140. The magnet 130 may be a driving magnet for AF operation.

For example, the magnet 130 may include a plurality of magnet units. In an example, the magnet 130 may include first to fourth magnet units 130-1 to 130-4 disposed on the case 140. In another embodiment, the magnet 130 may include two or more magnet units.

The magnet 130 may be disposed on at least one of a side portion or a corner of the case 140. In an example, at least a portion of the magnet 130 may be disposed on a side portion or corner of the case 140.

For example, each of the magnet units 130-1 to 130-4 may include first portions disposed on corresponding corners of the four corners of the case 130. In addition, each of the magnet units 130-1 to 130-4 may include a second portion disposed on a side portion of the case 140 adjacent to a corresponding corner of the case 140.

At an initial position of the AF operation unit, the magnet 130 may be disposed on the case 140 such that at least a portion of the magnet 130 overlaps the first coil 120 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis OA.

The magnet 130 may be a unipolar magnetized magnet. In another embodiment, the magnet 130 may be a bipolar magnetized magnet or a quadrupole magnet including two N poles and two S poles.

In an example, the magnet 130 may be a common magnet for implementing an AF operation and an OIS operation, which will be described later.

The circuit board 190 may be disposed in the case 140. The first position sensor 170 may be disposed or mounted on the circuit board 190 and may be conductively connected to the circuit board 190. In an example, the circuit board 190 may be disposed in the mounting groove 14a in the case 140, and the terminals 95 of the circuit board 190 may be exposed to the outside of the case 140.

The circuit board 190 may be provided with a terminal unit (or terminal portion) 95, the terminal unit 95 including a plurality of terminals B1 to B4 for electrically conductive connection to an external terminal or an external device. The plurality of terminals B1 to B4 of the circuit board 1900 may be conductively connected to the first position sensor 170.

The first position sensor 170 may be disposed on a first surface of the circuit board 190, and the plurality of terminals B1 to B4 may be disposed on a second surface of the circuit board 190. Here, the second surface of the circuit board 190 may be a surface opposite to the first surface of the circuit board 190. For example, the first surface of the circuit board 190 may be a surface of the circuit board 190 facing the bobbin 110 or the sensing magnet 180.

For example, the circuit board 190 may be a printed circuit board or FPCB.

The circuit board 190 may include circuit patterns or wirings (not shown) for conductively connecting the first to fourth terminals B1 to B4 to the first position sensor 170.

In an example, at least a portion of the first position sensor 170 may face the sensing magnet 180 or overlap the sensing magnet 180 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis OA at an initial position of the AF operation unit. In another embodiment, at the initial position of the AF operation unit, the first position sensor may not face the sensing magnet or overlap the sensing magnet.

When the bobbin 110 moves, the first position sensor 170 may detect a magnetic field or a magnetic field strength of the sensing magnet 180 mounted to the bobbin 110 and may output an output signal corresponding to the detection result.

The first position sensor 170 may be a driver IC including a hall sensor and a driver. The first position sensor 170 may include: first to fourth terminals for transmitting and receiving data to and from the outside by data communication using a protocol (e.g., I2C communication), and fifth and sixth terminals for directly providing a driving signal to the first coil 120.

The first position sensor 170 may be conductively connected to the first to fourth terminals B1 to B4 of the circuit board 190. In an example, each of the first to fourth terminals of the first position sensor 170 may be conductively connected to a corresponding one of the first to fourth terminals of the circuit board 190.

The fifth and sixth terminals of the first position sensor 170 may be conductively connected to the first coil 120 via at least one of the upper elastic member 150 or the lower elastic member 160, and may provide a driving signal to the first coil 120. In an example, a portion of the first lower elastic member 160-1 may be connected to one end of the first coil 120, and another portion of the first lower elastic member 160-1 may be conductively connected to the circuit board 190. A portion of the second lower elastic member 160-2 may be connected to the other end of the first coil 120, and another portion of the second lower elastic member 160-2 may be conductively connected to the circuit board 190. In another embodiment, the first coil may be conductively connected to the circuit board 190 and the fifth and sixth terminals of the first position sensor 170 via two upper elastic members.

For example, in an embodiment in which the first position sensor 170 is a driver IC, the first and second terminals B1 and B2 of the circuit board 190 may be power terminals for supplying power, the third terminal may be terminals for transmitting and receiving a clock signal, and the fourth terminal may be terminals for transmitting and receiving a data signal.

In another embodiment, the first position sensor 170 may be a hall sensor. The first position sensor 170 may include two input terminals for receiving a driving signal or power supplied to the first position sensor and two output terminals for outputting a sensing voltage (or an output voltage). In an example, the driving signal may be provided to the first position sensor 170 through the first and second terminals B1 and B2 of the circuit board 190, and the output from the first position sensor 170 may be output to the outside through the third and fourth terminals B3 and B4. In addition, the first coil 120 may be conductively connected to the circuit board 190, and a driving signal may be externally provided to the first coil 120 through the circuit board 190. In this case, the circuit board 190 may further include two separate terminals to receive a driving signal to be supplied to the first coil 120.

In an example, among the power terminals of the first position sensor 170, a ground terminal may be conductively connected to the cover member 300.

The capacitor 195 may be disposed or mounted on a first surface of the circuit board 190. The capacitor 195 may be chip-type. In this case, the chip may include a first terminal corresponding to one end of the capacitor 195 and a second terminal corresponding to the other end of the capacitor 195. The capacitor 195 may alternatively be referred to as a "capacitive element" or capacitor (capacitor).

The capacitor 195 may be conductively connected in parallel to the first and second terminals B1 and B2 of the circuit board 190, through which power (or a driving signal) is supplied from the outside to the first position sensor 170. Alternatively, the capacitor 195 may be conductively connected in parallel to a terminal of the first position sensor 170, the terminal of the first position sensor 170 being conductively connected to the first and second terminals B1 and B2 of the circuit board 190.

Since the capacitor 195 is conductively connected in parallel to the first and second terminals B1 and B2 of the circuit board 190, the capacitor 195 may serve as a smoothing circuit for removing ripple components included in the power signals GND and VDD externally supplied to the first position sensor 170, and thus may provide a stable and uniform power signal to the first position sensor 170.

The upper elastic member 150 may be coupled to an upper portion, end, or surface of the bobbin 110 and to an upper portion, end, or surface of the case 140, and the lower elastic member 160 may be coupled to a lower portion, end, or surface of the bobbin 110 and to a lower portion, end, or surface of the case 140.

The upper and lower elastic members 150 and 160 may elastically support the bobbin 110 with respect to the case 140.

The upper elastic member 150 may include a plurality of upper elastic units (e.g., upper elastic unit 150-1 and upper elastic unit 150-2) that are electrically separated or isolated from each other, and the lower elastic member 160 may include a plurality of lower elastic units (e.g., lower elastic unit 160-1 and lower elastic unit 160-2) that are electrically separated or isolated from each other.

Each of the upper and lower elastic members is described as including two elastic units. However, in another embodiment, at least one of the upper elastic member or the lower elastic member may be implemented as a single unit or a single structure.

The upper elastic member 150 may further include: a first inner frame 151 coupled or fixed to an upper portion, an upper surface or an upper end of the bobbin 110, a second inner frame 152 coupled or fixed to an upper portion, an upper surface or an upper end of the case 140, and a first frame connection portion 153 interconnecting the first inner frame 151 and the first outer frame 152.

The lower elastic member 160 may further include: a second inner frame 161, a second outer frame 162, and a second frame connection part 163, the second inner frame 161 being coupled or fixed to a lower portion, a lower surface, or a lower end of the bobbin 110, the second outer frame 162 being coupled or fixed to a lower portion, a lower surface, or a lower end of the case 140, the second frame connection part 163 interconnecting the second inner frame 161 and the second outer frame 162. The inner frame may alternatively be referred to as an inner portion, the outer frame may alternatively be referred to as an outer portion, and the frame connecting portion may alternatively be referred to as a connecting portion.

Each of the first and second frame connection parts 153 and 163 may be formed to be bent or curved (or twisted) at least once to form a predetermined pattern.

Each of the upper and lower elastic members 150 and 160 may be formed of a conductive material.

Referring to fig. 8, the circuit board 190 may be provided with two pads 5a and 5b. The two pads 5a and 5b may be conductively connected to the first position sensor 170. In addition, the first pads 5a of the circuit board 190 may be conductively connected to the first lower elastic units 160-1, and the second pads 5b of the circuit board 190 may be conductively connected to the second lower elastic units 160-2.

In an example, the second outer frame 162 of the first lower elastic unit 160-1 may include a first coupling portion 4a coupled or conductively connected to the first pad 5a of the circuit board 190, and the second outer frame 162 of the second lower elastic unit 160-2 may include a second coupling unit 4b conductively connected to the second pad 5b of the circuit board 190.

In another embodiment, at least one of the upper elastic member 150 or the lower elastic member 160 may include two elastic members. In an example, each of the two elastic members of any one of the upper and lower elastic members 150 and 160 may be coupled or conductively connected to a corresponding one of the first and second pads of the circuit board 190, and the first coil 120 may be conductively connected to the two elastic members.

Fig. 9 is a perspective view of the image sensor unit 350, fig. 10A is a first exploded perspective view of the image sensor unit 350 in fig. 9, fig. 10B is a second exploded perspective view of the image sensor unit 350 in fig. 9, fig. 11 is a perspective view of the holder 270, the second coil 230, the image sensor 810, the OIS position sensor 240, and the first board unit 255 in fig. 10A, fig. 12 is a first perspective view of the first circuit board 250 and the second circuit board 260 of the first board unit 255, fig. 13 is a second perspective view of the first circuit board 250 and the second circuit board 260 of the first board unit 255, fig. 14A is a bottom perspective view of the holder 270, fig. 14B shows the holder 270, the first plate unit 255, and the support plate 310, fig. 15 is a perspective view of the holder 270, the second coil 230, the first plate unit 255, the image sensor 810, and the support plate 310, fig. 16 shows an embodiment of the support plate, fig. 17 is a bottom perspective view of the first circuit board 250 and the support plate 310, fig. 18A is a first perspective view of the support plate 310 coupled to the holder 270 and the base 210, fig. 18B is a second perspective view of the support plate 310 coupled to the holder 270 and the base 210, and fig. 19 is a bottom view of the first plate unit 255, the holder 270, the support plate 310, and the elastic member 315.

Referring to fig. 9 to 19, the image sensor unit 350 may include a fixed unit and an OIS moving unit spaced apart from the fixed unit. The image sensor unit 350 may include a support plate 310 that connects a fixed unit and an OIS mobile unit to each other. The image sensor unit 350 may further include an elastic member 315 to elastically support the OIS moving unit with respect to the fixed unit.

The support plate 310 may support the OIS moving unit with respect to the fixed unit such that the OIS moving unit can move in a direction perpendicular to the optical axis, or such that the OIS moving unit can rotate or tilt about the optical axis within a predetermined range.

The OIS moving unit may include a first board unit 255, an image sensor 810 disposed on the first board unit 255, a second coil 230 disposed to face the magnet 130 in the optical axis direction, and a second position sensor 240 disposed on the first board unit 255.

The OIS moving unit may further include a holder 270, which holder 270 is disposed between the second coil 230 and the first board unit 255 and accommodates the first board unit 255. Retainer 270 may alternatively be referred to as a "spacer member".

OIS mobile unit may also include an optical filter 610. The OIS mobile unit may also include a filter holder 600, the filter holder 600 configured to receive a filter 610.

The fixing unit may include a second plate unit 800 spaced apart from the first plate unit 255 and conductively connected to the first plate unit 255. The fixing unit may further include a base 210 coupled to the second plate unit 800. In addition, the fixing unit may include a cover member 300 coupled to the base 210. In addition, the fixing unit may include a case 140 of the AF moving unit and a magnet 130 provided in the case 140.

The fixing unit may further include a base 210 accommodating the second plate unit 800 and coupled to the cover member 300. The fixing unit may further include a yoke 410 provided on the second plate unit.

The holder 270 may be disposed under the AF moving unit. In an example, the retainer 270 may be implemented as a non-conductive member. In an example, the retainer 270 may be made of an injection molding material that is easily implemented by an injection molding process. In addition, the holder 27 may be formed of an insulating material. In addition, for example, the holder 270 may be formed of resin or plastic.

Referring to fig. 11, 14A, 14B, and 15, the holder 270 may include an upper surface 42A, a lower surface 42B formed opposite to the upper surface 42A, and a side surface 42C interconnecting the upper surface 42A and the lower surface 42B. In an example, the lower surface 42B of the retainer 270 may face the second plate unit 800 or be positioned opposite the second plate unit 800.

The holder 270 may support the first plate unit 255, and may be coupled to the first plate unit 255. In an example, the first plate unit 255 may be disposed under the holder 270. In an example, a lower portion, surface, or end of the retainer 270 may be coupled to an upper portion, surface, or end of the first plate unit 255.

Referring to fig. 14A, lower surface 42B of retainer 270 may include first surface 36A and second surface 36B. The second surface 36B may have a height difference with respect to the first surface 36A in the optical axis direction. In an example, the second surface 36B may be located above the first surface 36 (or at a higher position than the first surface 36A). In an example, second surface 36B may be positioned closer to upper surface 42A of retainer 270 than first surface 36A. In an example, the distance between upper surface 42A of retainer 270 and second surface 36B may be shorter than the distance between upper surface 42A of retainer 270 and first surface 36A.

Retainer 270 may include a third surface 36C that interconnects first surface 36A and second surface 36B. In an example, the first surface 36A and the second surface 36B may be parallel to each other, and the third surface 36C may be perpendicular to the first surface 36A and/or the second surface 36B, but the disclosure is not limited thereto. In another embodiment, the angle between the third surface 36C and the first surface 36A (or the second surface 36B) may be an acute angle or an obtuse angle. In an example, first surface 36A and second surface 36B may be located on edges of lower surface 42B of retainer 270.

The holder 270 may house or support the second coil 230. The holder 270 may support the second coil 230 such that the second coil 230 is spaced apart from the first plate unit 255.

The holder 270 may include an opening (bore) 70 formed therein to correspond to one region of the first plate unit 255. In an example, the aperture 70 in the holder 270 may be a through hole formed through the holder 270 in the optical axis direction. In an example, the aperture 70 in the retainer 270 may correspond to, face or overlap with the image sensor 810 in the optical axis direction.

The shape of the opening 70 in the holder 270 viewed from above may be a polygonal shape such as a quadrangular shape, a circular shape, or an elliptical shape, but the present disclosure is not limited thereto. The openings may be formed in any of a variety of shapes.

In an example, the aperture 70 in the retainer 270 may have a shape or size suitable for exposing the image sensor 810, a portion of the upper surface of the first circuit board 250, a portion of the upper surface of the second circuit board 260, and the components. In an example, the area of the aperture 70 in the retainer 270 may be greater than the area of the image sensor 810 and may be less than the area of the first surface of the first circuit board 250. In an example, the aperture 70 may be formed in the second surface 36B of the lower surface 42B of the retainer 270.

The holder 270 may have holes 41A, 41B, and 41C formed therein to correspond to the second position sensor 240. In an example, the holder 270 may have holes 41A, 41B, and 41C formed in the holder 270 at positions corresponding to the first to third sensors 240a, 240B, and 240C of the second position sensor 240.

In an example, holes 41A, 41B, and 41C may be disposed adjacent to corners of retainer 270. The holder 270 may have a dummy hole 41D formed therein at a position that does not correspond to the second position sensor 240 and is adjacent to a corner of the holder 270 that does not correspond to the second position sensor 240. The dummy holes 41D may be formed to achieve weight balance of the OIS mobile unit during OIS operation. In another embodiment, the dummy holes 41D may not be formed.

The holes 41A, 41B, and 41C may be through holes formed through the holder 270 in the optical axis direction. In an example, the holes 41A, 41B, and 41C may be formed in the second surface 36B of the lower surface 42B of the holder 270, but the disclosure is not limited thereto. In another embodiment, the hole may be formed in a first surface of the lower surface of the holder 270. In yet another embodiment, holes 41A, 41B, and 41C in retainer 270 may be omitted.

The holder 270 may be provided on the upper surface 42A thereof with at least one coupling protrusion 51 for coupling to the second coil 230. The coupling protrusion 51 may protrude from the upper surface 42A of the holder 270 toward the AF moving unit. In an example, the coupling protrusion 51 may be formed adjacent to each of the holes 41A to 41D in the holder 270.

In an example, two coupling protrusions 51A and 51B may be provided or arranged to correspond to respective holes 41A, 41B, 41C, and 41D in retainer 270. In an example, each of the holes 41A, 41B, 41C, and 41D in the retainer 270 may be located between two coupling protrusions 51A and 51B.

The first board unit 255 may include a first circuit board 250 and a second circuit board 260 conductively connected to each other. The second circuit board 260 may alternatively be referred to as a "sensor board".

The first plate unit 255 may be disposed on the lower surface 42B of the holder 260. In an example, the first plate unit 255 may be disposed on the second surface 36B of the lower surface 42B of the holder 260. In an example, the first circuit board 250 may be disposed on the second surface 36B of the lower surface 42B of the holder 270. In an example, the first surface 60A (referring to fig. 12) of the first circuit board 250 may be coupled or attached to the second surface 36B of the lower surface 42B of the retainer 270 by means of an adhesive member.

In this case, the first surface 60A of the first circuit board 250 may be a surface facing the AF moving unit, and the second position sensor 240 is provided on the surface. In addition, the second surface 60B of the first circuit board 250 may be a surface formed opposite to the first surface 60A of the first circuit board 250.

The first circuit board 250 may alternatively be referred to as a sensor board, a motherboard, a main circuit board, a sensor circuit board, or a mobile circuit board. In all embodiments, the first circuit board 250 may alternatively be referred to as a "second board" or "second circuit board", and the second circuit board 260 may alternatively be referred to as a "first board" or "first circuit board".

The position sensors 240A, 240B, and 240C may be disposed on the first circuit board 250. In addition, the controller 830 and/or circuit elements (e.g., capacitors) may be disposed on the first circuit board 250. The image sensor 810 may be disposed on the second circuit board 260.

The first circuit board 250 may include first terminals E1 to E8 conductively connected to the second coil 230. Here, the first terminals E1 to E8 may alternatively be referred to as "first pads" or "first bonding portions". The first terminals E1 to E8 of the first circuit board 250 may be disposed or arranged on the first surface 60A of the first circuit board 250. For example, the first circuit board 250 may be a printed circuit board or a Flexible Printed Circuit Board (FPCB).

The first circuit board 250 may include an aperture 250A formed therein to correspond to or face the aperture in the lens module 400 and the bobbin 110. In an example, the opening 250A in the first circuit board 250 may be a through hole formed through the first circuit board 250 in the optical axis direction, and may be formed in the center of the first circuit board 250.

The shape of the first circuit board 250 (e.g., its outer peripheral shape) may be a shape conforming to or corresponding to the shape of the holder 270, such as a quadrangular shape, when viewed from above. In addition, the shape of the opening 501 in the first circuit board 250 may be a polygonal shape such as a quadrangular shape, a circular shape, or an elliptical shape when viewed from above.

In addition, the first circuit board 250 may include at least one second terminal 251 conductively connected to the second circuit board 260. Here, the second terminal 251 may be alternatively referred to as a "second pad" or a "second bonding portion". The second terminals 251 of the first circuit board 250 may be disposed or arranged on the second surface 60B of the first circuit board 250.

In an example, the at least one second terminal 251 may be provided in plurality, and the plurality of second terminals 251 may be provided or arranged in a region between the opening 250A in the first circuit board 250 and any one side of the first circuit board 250 in a direction parallel to the side of the first circuit board 250. In an example, the plurality of second terminals 251 may be disposed around the opening 250A.

The second circuit board 260 may be disposed under the first circuit board 250.

The shape of the second circuit board 260 may be a polygonal shape (e.g., a quadrangular shape, a square shape, or a rectangular shape) when viewed from above, but the present disclosure is not limited thereto. In another embodiment, the shape of the second circuit board may be a circular shape or an elliptical shape.

In an example, when the shape of the second circuit board 260 is a quadrangular shape, the area of the front surface of the second circuit board 260 may be larger than the area of the opening 250A in the first circuit board 250. In an example, the lower side of the aperture 250A in the first circuit board 250 may be shielded or blocked by the second circuit board 260.

In an example, an outside surface (or side) of the second circuit board 260 may be located between the outside surface (or side) of the second circuit board 260 and the aperture 250A in the second circuit board 260 when viewed from above or below.

The image sensor 810 may be disposed on the first surface 260A (e.g., upper surface) of the second circuit board 260 or coupled to the first surface 260A of the second circuit board 260. Referring to fig. 12 and 13, the second circuit board 260 may include at least one terminal 261 conductively connected to at least one second terminal 251 of the first circuit board 250. In an example, the terminals 261 of the second circuit board 260 may be provided in plurality.

In an example, at least one terminal 261 of the second circuit board 260 may be formed on a side surface or an outer side surface of the second circuit board 260 connecting the first surface 260A of the second circuit board 260 to the second surface 260B of the second circuit board 260. The first surface 260A may be a surface facing the first circuit board 250, and the second surface 260B may be a surface formed opposite to the first surface 260A. In an example, the terminal 261 may take the form of a recess recessed into a side surface of the second circuit board 260. Alternatively, in an example, the terminal 261 may take the form of a semicircular or semi-elliptical via (via) formed in a side surface of the second circuit board 260. In another embodiment, at least one terminal of the second circuit board 260 conductively connected to the second terminal 251 of the first circuit board 250 may be formed on the first surface 260A of the second circuit board 260.

In an example, the terminal 261 of the second circuit board 260 may be coupled to the terminal 251 of the first circuit board 250 by means of solder or a conductive adhesive member. The first circuit board 250 and the second circuit board 260 may be printed circuit boards or FPCBs.

The second coil 230 may be disposed on the holder 270. The second coil 230 may be disposed on the upper surface 42A of the holder 270. The second coil 230 may be disposed under the first magnet 130.

The second coil 230 may be coupled to a holder 270. In an example, the second coil 230 may be coupled to the upper surface 42A of the retainer 270. In an example, the second coil 230 may be coupled to the coupling protrusion 51 of the holder 270.

In an example, the second coil 230 may correspond to, face, or overlap with the first magnet 130 disposed on the fixing unit in the direction of the optical axis OA. In another embodiment, the fixing unit may include an OIS-specific magnet provided separately from the magnet of the AF moving unit, and the second coil may correspond to, face, or overlap with the OIS-specific magnet. In this case, the number of OIS-specific magnets may be the same as the number of coil units included in the second coil 230.

In an example, the second coil 230 may include a plurality of coil units 230-1 to 230-4. In an example, the second coil 230 may include four coil units 230-1 to 230-4 disposed on four corners of the holder 270.

Each of the coil units 230-1 to 230-4 may take the form of coil blocks having a closed curve shape or a ring shape. In an example, each coil unit may have a cavity or bore formed therein. In an example, the coil unit may be implemented as a Fine Pattern (FP) coil.

In another embodiment, the second coil 230 may be disposed on the first circuit board 250, or may be coupled to the first circuit board 250.

The second coil 230 may be conductively connected to the first circuit board 250. In an example, the first coil unit 230-1 may be conductively connected to two first terminals E1 and E2 of the first circuit board 250, the second coil unit 230-2 may be conductively connected to two other first terminals E3 and E4 of the first circuit board 250, the third coil unit 230-3 may be conductively connected to two other first terminals E5 and E6 of the first circuit board 250, and the fourth coil unit 230-4 may be conductively connected to two other first terminals E7 and E8 of the first circuit board 250.

The first to fourth coil units 230-1 to 230-4 may be supplied with power or driving signals through the first circuit board 250. The power or driving signal supplied to the second coil 230 may be a DC signal, an AC signal, or a signal containing both a DC component and an AC component, and may be a current type or a voltage type.

In an example, current may be independently applied to at least three coil units among the four coil units 230-1 to 230-4.

The second position sensor 240 may be disposed on, coupled to, or mounted to the first surface 60A (e.g., upper surface) of the first circuit board 250. The second position sensor 240 may detect a displacement of the OIS moving unit in a direction perpendicular to the optical axis OA (e.g., a displacement or movement of the OIS moving unit in a direction perpendicular to the optical axis). In addition, the second position sensor 240 may detect rotation, rolling or tilting of the OIS moving unit with respect to or about the optical axis within a predetermined range. The first position sensor 170 may alternatively be referred to as an "AF position sensor" and the second position sensor 240 may alternatively be referred to as an "OIS position sensor".

In an example, the second position sensor 240 may be disposed below the second coil 230.

In an example, the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. In an example, the sensing element of the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. The sensing element may be a component that detects a magnetic field.

In an example, the center of the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. In an example, the center of the second position sensor 240 may be a spatial center in the x-axis direction and the y-axis direction in the xy-coordinate plane perpendicular to the optical axis. Alternatively, the center of the second position sensor 240 may be a spatial center in the x-axis, y-axis, and z-axis directions.

In another embodiment, at least a portion of the second position sensor 240 may overlap the second coil 230 in a direction perpendicular to the optical axis.

In an example, the second position sensor 240 may overlap the holes 41A to 41C in the holder 270 in the optical axis direction. In addition, in an example, the second position sensor 240 may overlap with a cavity in the second coil 230 in the optical axis direction. In addition, in an example, at least some of the holes 41A to 41C in the holder 270 may overlap with the cavity in the second coil 230 in the optical axis direction.

In an example, the second position sensor 240 may include a first sensor 240A, a second sensor 240B, and a third sensor 240C that are spaced apart from one another.

For example, each of the first to third sensors 240A to 240C may be a hall sensor. In another embodiment, each of the first to third sensors 240A to 240C may be a driver IC including a hall sensor and a driver. The description of the first position sensor 170 may be equally or similarly applied to the first to third sensors 240A to 240C.

In yet another embodiment, each of the first sensor 240A and the second sensor 240B may be a hall sensor or a driver IC including a hall sensor, and the third sensor 240C may be a sensor different from or of a different type from the first sensor 240A and/or the second sensor 240C. For example, each of the first sensor 240A and the second sensor 240C may be a displacement detection sensor, and the third sensor 240C may be an angle sensor configured to detect rotation, tilting, or rolling. For example, the third sensor 240C may be a rotation (roll) detection sensor configured to detect rotation, tilting, or rolling of the OIS moving unit around the optical axis. For example, the third sensor 240C may be a magnetic angle sensor. For example, the third sensor 240C may be a tunneling magneto-resistive (TMR) sensor. For example, the TMR sensor may be a TMR magnetic angle sensor.

In another embodiment, each of the first to third sensors 240A to 240C may be a magnetic sensor. For example, each of the first to third sensors 240A to 240C may be a Tunnel Magnetoresistance (TMR) sensor.

Each of the first to third sensors 240A, 240B and 240C may be electrically connected to the first circuit board 250.

In an example, each of the first to third sensors 240A, 240B, and 240C may be disposed below a cavity in a corresponding one of the coil units 230-1 to 230-3. In an example, each of the first to third sensors 240A, 240B, and 240C may be disposed in a corresponding one of the holes 41A to 41C in the holder 270.

In an example, each of the first to third sensors 240A, 240B, and 240C may not overlap a corresponding one of the coil units 230-1 to 230-3 in a direction perpendicular to the optical axis. The first to third sensors 240A, 240B and 240C may overlap the holder 270 in a direction perpendicular to the optical axis.

Since the first to third sensors 240A, 240B and 240C are disposed so as not to overlap the OIS coil 230 in a direction perpendicular to the optical axis, an influence of a magnetic field of the OIS coil 230 on an output of the OIS position sensor 240 may be reduced, and thus, an OIS feedback operation may be accurately performed and reliability of the OIS operation may be ensured.

The OIS position sensor 240 may face, correspond to, or overlap with the first magnet 130 in the optical axis direction.

In an example, at least a portion of the first sensor 240A may overlap at least one of the first magnet unit 130-1 or the yoke 410 of the first magnet 130 in the optical axis direction, and the first sensor 240A may output a first output signal (e.g., a first output voltage) corresponding to a detection result of the magnetic field of the first magnet unit 130-1.

In an example, at least a portion of the second sensor 240B may overlap at least one of the second magnet unit 130-2 or the yoke 410 of the first magnet 130 in the optical axis direction, and the second sensor 240B may output a second output signal (e.g., a second output voltage) corresponding to a detection result of the magnetic field of the second magnet unit 130-2.

In addition, in an example, at least a portion of the third sensor 240C may overlap at least one of the third magnet unit 130-3 or the yoke 410 of the first magnet 130 in the optical axis direction, and the third sensor 240C may output a third output signal (e.g., a third output voltage) corresponding to a detection result of the magnetic field of the third magnet unit 130-3.

In an example, at the initial position of the OIS moving unit, the center of the first sensor 240A may correspond to, face or overlap with the center of the first magnet unit 130-1 in the optical axis direction, the center of the second sensor 240B may correspond to, face or overlap with the center of the second magnet unit 130-2 in the optical axis direction, and the center of the third sensor 240C may correspond to, face or overlap with the center of the third magnet unit 130-3 in the optical axis direction.

In an example, the center of each of the first to third sensors 240A to 240C may be the center of the magnetic detection area of each of the first to third sensors 240A to 240C. Alternatively, in an example, the center of each of the first to third magnet units 130-1 to 130-4 may be the center of a boundary region between the N pole and the S pole. In another embodiment, the center of the third sensor 240C may not overlap with the center of the third magnet unit 130-3 in the optical axis direction.

The base 210 may be disposed under the first plate unit 255. The base 210 may have a polygonal shape, for example, a quadrangular shape, which corresponds to or corresponds to the shape of the cover member 300 or the first plate unit 255.

In an example, the base 210 may include a lower plate 21A and a side plate 21B protruding from an edge of the lower plate 21A. The lower plate 21A may correspond to or face the first region 801 of the second plate unit 800, and the side plate 21B may protrude or extend from the lower plate 21A toward the side plate 302 of the cover member 300. In an example, the base 210 may include an aperture 210A formed in its lower plate 21B. The opening 210A in the base 210 may be a through hole formed through the base 210 in the optical axis direction. In another embodiment, the base may not have an aperture.

In an example, the side plate 21B of the base 210 may be coupled to the side plate 302 of the cover member 300. The base 210 may include a step 211 (refer to fig. 18A), and an adhesive is applied to the step 211 to be coupled to the side plate 302 of the cover member 300. In this case, the step 211 may guide the side plate 302 of the cover member 300 so as to be coupled to the upper side of the step 211. The step 211 of the base 210 and the lower end of the side plate 302 of the cover member 300 may be engaged and fixed with each other by means of an adhesive or the like.

The base 210 may include at least one protruding portion 216A to 216D protruding from the lower plate 21A. In an example, at least one protruding portion 216A to 216D may protrude from the side plate 21B of the base 210.

In an example, the side plate 21B of the base 210 may include four side plates, and each of the protruding portions 216A to 216D may be formed on a corresponding side plate of the four side plates. In an example, each of the protruding portions 216A-216D may be disposed or located on a center of a respective one of the four side plates.

The second plate unit 800 may be disposed under the base 210. In an example, the second plate unit 800 may be disposed under the lower plate 21A of the base 210. The second plate unit 800 may be coupled to the base 210. In an example, the second plate unit 800 may be coupled to the lower plate 21A of the base 210. In an example, the second plate unit 800 may be coupled to a lower surface of the lower plate 21A of the base 210.

The second board unit 800 may be used to provide a signal to the image sensor unit 350 from the outside or output a signal from the image sensor unit 350 to the outside.

The second board unit 800 may include a first region (or first board) 801 corresponding to the AF moving unit 100 or the image sensor 810, a second region (or second board) 802 in which a connector 804 is provided, and a third region (or third board) 803 connecting the first region 801 and the second region 802 to each other. The connector 804 may be provided with a port to be conductively connected to the second region 802 of the second board unit 800 and to an external device (e.g., the optical instrument 200A). The aperture 210A in the base 210 may be closed or blocked by the first region 801 of the second plate unit 800.

Each of the first region 801 and the second region 802 of the second plate unit 800 may include a rigid substrate, and the third region 803 may include a flexible substrate. In addition, each of the first region 801 and the third region 802 may further include a flexible substrate.

In another embodiment, at least one of the first region 801 to the third region 803 of the circuit board 800 may include at least one of a rigid substrate or a flexible substrate.

The second plate unit 800 may be disposed behind the first plate unit 255. In an example, the first plate unit 255 may be disposed between the AF moving unit 100 and the second plate unit 800.

The first region 801 of the second plate unit 800 may have a polygonal shape (e.g., a quadrangular shape, a square shape, or a rectangular shape) when viewed from above, but the present disclosure is not limited thereto. In another embodiment, the first region of the second plate unit may have a circular shape.

The second board unit 800 may include a plurality of pads 800B corresponding to the terminals 311 of the support board 220. The pad 800B may alternatively be referred to herein as a "terminal".

Referring to fig. 10A, a plurality of pads 800B may be formed in a first region 801 of the second board unit 800. In an example, the second board unit 800 may include first pads disposed or arranged on one side of the first region 801 to be spaced apart from each other in a third direction (e.g., y-axis direction), and second pads disposed or arranged on the opposite side of the first region 801 to be spaced apart from each other in the third direction (e.g., y-axis direction).

In an example, a plurality of pads 800B may be formed on a first surface (e.g., first region 801) of the second board unit 800 facing the first board unit 255.

The second plate unit 800 may include at least one coupling hole 800C formed therein to be coupled to the coupling protrusion 45B of the base 210. The coupling hole 800C may be a through hole formed through the second plate unit 800 in the optical axis direction. In another embodiment, the coupling hole may take the form of a recess.

In an example, the coupling protrusions 45B may protrude from the lower surface of the base 210, and may be formed on each of corners of the lower surface of the base 210, the coupling protrusions 45B facing each other in an inclined direction. In addition, coupling holes 800C may be formed on each of the corners of the second plate unit 800, the coupling holes 800C facing each other in an oblique direction. In another embodiment, the coupling hole in the second plate unit 800 may be disposed adjacent to at least one of the side or corner of the first region 801.

The support plate 310 may conductively connect the first plate unit 255 to the second plate unit 800. The support plate 310 may alternatively be referred to as a "support member," connection plate, "or" connection.

The support plate 310 may include a flexible substrate, or may be implemented as a flexible substrate. In an example, the support plate 310 may include a Flexible Printed Circuit Board (FPCB). At least a portion of the support plate 310 may be flexible. The first circuit board 250 and the support plate 310 may be connected to each other.

In an example, the support plate 310 may include a connection portion 320 connected to the first circuit board 250. In an example, the first circuit board 250 and the support plate 310 may be integrally formed with each other. In another embodiment, the first circuit board 250 and the support plate 310 may be provided to be separated from each other, not to be integral, and may be connected to each other via the connection portion 320, and may be conductively connected to each other.

In addition, the support plate 310 may be conductively connected to the first circuit board 250. The support plate 310 may be conductively connected to the second plate unit 800.

The support plate 310 may guide the movement of the OIS mobile unit. The support plate 310 may guide the OIS moving unit to move in a direction perpendicular to the optical axis direction. The support plate 310 may guide the OIS moving unit to rotate about the optical axis. The support plate 310 may restrict movement of the OIS moving unit in the optical axis direction.

A portion of the support plate 310 may be connected to the first circuit board 250 as an OIS mobile unit, and another portion of the support plate 310 may be coupled to the base 210 as a fixed unit. In an example, the connection portion 320 of the support plate 310 may be coupled to the first circuit board 250. In addition, the bodies 86 and 87 of the support plate 310 may be coupled to the protruding portions of the base 210, and the terminal units 7A, 7B, 8A, and 8B of the support plate 310 may be coupled to the second plate unit 800.

Referring to fig. 15 to 18B, the support plate 310 may include an elastic unit 310A and a circuit member 310B. The elastic unit 310A is for elastically supporting the OIS moving unit, and may be implemented as an elastic body such as a spring. The elastic unit 310A may include metal, or may be made of an elastic material.

Fig. 16 shows an embodiment of the elastic unit 310A.

The elastic unit 310A1 shown in fig. 16 (a) may include a flat portion 371A and an uneven portion 371B. The flat portion 371A may be provided in plurality, and the uneven portion 371B may be formed between two flat portions. In an example, the uneven portion 371B may include at least one of the first and second projections 371B1 and 371B 2. In an example, the first and second projections 371B1 and 371B2 may be formed to be symmetrical to each other in a vertical direction.

The elastic unit 310A2 shown in fig. 16 (B) may include a flat portion 372A and an uneven portion 372B. The flat portion 372A may be provided in plurality, and the uneven portion 372B may be formed between the two flat portions 372A. For example, the uneven portion 372B may take the form of a sine curve, a saw tooth, or a zigzag.

The elastic unit 310A3 shown in fig. 16 (c) may include a first flat portion 373A and a second flat portion 373B. The length of the first flat portion 373A in the first direction (or the optical axis direction) may be different from the length of the second flat portion 373B in the first direction (or the optical axis direction). In an example, the length of the first flat portion 373A in the first direction may be longer than the length of the second flat portion 373B in the first direction. The first flat portion 373A may be provided in plurality, and the second flat portion 273B may be provided in plurality. In an example, the first and second flat portions 273A and 373B may be formed to be uneven.

The elastic unit 310A4 shown in fig. 16 (d) may include a first flat portion 373A, a second flat portion 373B, and a protruding portion (or an extending portion) protruding or extending from the first flat portion 373A.

In another embodiment, only a corner portion of each of the elastic units shown in fig. 16 (a) to 16 (d) may be included.

The elastic unit 310A may include at least one of the elastic units 310A1 to 310A4 shown in fig. 16 (a) to 16 (b).

The circuit member 310B serves to conductively connect the first circuit board 250 to the second circuit board unit 800, and may be implemented as a flexible substrate or may include at least one of a flexible substrate or a rigid substrate. The circuit member 310B may be, for example, an FPCB.

The elastic unit 310A may be coupled to the circuit member 310B, and may serve to increase the strength of the circuit member 310B. Referring to fig. 15 and 17, the elastic unit 310A may be disposed outside the circuit member 310B, and an outer side surface of the circuit member 310B may be coupled to an inner side surface of the elastic unit 310A. In another embodiment, the circuit member may be disposed outside the elastic unit.

The support plate 310 may be connected to the first board unit 255 (e.g., the first circuit board 250), and may include one or more connection portions 320A and 320B conductively connected to the first board unit 255 (e.g., the first circuit board 250). In addition, the support plate 310 may be connected to the second plate unit 800, and may include one or more terminal units 7A, 7B, 8A, and 8B electrically connected to the second plate unit 800. Each of the terminals 7A, 7B, 8A, and 8B may include a plurality of terminals 311.

Referring to fig. 15 and 17, the support plate 310 may include a first support plate 310-1 and a second support plate 310-2 spaced apart from each other. The first support plate 310-1 and the second support plate 310-2 may be formed to be bilaterally symmetrical to each other. In another embodiment, the first support plate 310-1 and the second support plate 310-2 may be integrated into a single plate.

As shown in fig. 17, the first support plate 310-1 and the second support plate 310-2 may be disposed on respective sides of the first circuit board 250. In an example, the first support plate 310-1 may include a first body 86 and at least one terminal unit 7A and 7B extending from the first body 86. At least one of the terminal units 7A and 7B of the first support plate 310-1 may include a plurality of terminals 311.

The second support plate 310-2 may include a second body 87 and at least one terminal unit 8A and 8B extending from the second body 87. At least one of the terminal units 8A and 8B of the second support plate 310-2 may include a plurality of terminals 311.

The first circuit board 250 may include first and second side portions 33A and 33B positioned opposite to each other, and may include third and fourth side portions 33C and 33C positioned between the first and second side portions 33A and 33B and positioned opposite to each other.

The first body 86 may include: a first portion 6A, a second portion 6B, and a third portion 6C, the first portion 6A corresponding to the first side portion 33A of the first circuit board 250 or facing the first side portion 33A of the first circuit board 250, the second portion 6B corresponding to a portion (or side) of the third side portion 33C of the first circuit board 250, and the third portion 6C corresponding to a portion (or side) of the fourth side portion 44C of the first circuit board 250. In addition, the first body 86 may include a first bending portion 6D and a second bending portion 6E, the first bending portion 6D connecting the first portion 6A and the second portion 6B to each other and bending from one end of the first portion 6A, the second bending portion 6E connecting the first portion 6A and the third portion 6C to each other and bending from the other end of the first portion 6A.

The first support plate 310-1 may include a first terminal unit 7A and a second terminal unit 7B, the first terminal unit 7A extending or protruding from the second portion 6B of the first body 86 toward the second plate unit 800, and the second terminal unit 7B extending or protruding from the third portion 6C of the first body 86 toward the second plate unit 800. The first terminal unit 7B may be positioned opposite to the first terminal unit 7A.

The first support plate 310-1 may include a first connection portion 320A, the first connection portion 320A interconnecting the first portion 6A of the first body 86 and the first side portion 33A of the first circuit board 250. The first connection portion 320A may include a bent portion.

The second body 87 may include: a first portion 9A, a second portion 9B, and a third portion 9C, the first portion 9A corresponding to the second side portion 33B of the first circuit board 250 or facing the second side portion 33B of the first circuit board 250, the second portion 9B corresponding to another portion (or opposite side) of the third side portion 33C of the first circuit board 250, and the third portion 9C corresponding to another portion (or opposite side) of the fourth side portion 44C of the first circuit board 250. In addition, the second body 87 may include a first bent portion 9D and a second bent portion 9E, the first bent portion 9D connecting the first portion 9A and the second portion 9B to each other and bent from one end of the first portion 9A, and the second bent portion 9E connecting the first portion 9A and the third portion 9C to each other and bent from the other end of the first portion 9A.

The second support plate 310-2 may include a third terminal unit 8A extending or protruding from the second portion 9B of the second body 87 toward the second plate unit 800 and a fourth terminal unit 8B extending or protruding from the third portion 9C of the second body 87 toward the second plate unit 800. The fourth terminal unit 8B may be positioned opposite the third terminal unit 8A.

The second support plate 310-2 may include a second connection portion 320B, and the second connection portion 320B connects the first portion 9A of the second body 87 and the second side portion 33B of the first circuit board 250 to each other. The second connection portion 320B may include a bent portion.

In addition, the first support plate 310-1 may include a first flexible plate 31A and a first elastic member 30A, the first flexible plate 31A conductively connecting the first plate unit 255 (e.g., the first circuit board 250) to the second plate unit 800, the first elastic member 30A being coupled to the first flexible plate 31A.

The second support plate 310-2 may include a second flexible plate 31B and a second elastic member 30B, the second flexible plate 31B conductively connecting the first plate unit 255 (e.g., the first circuit board 250) to the second plate unit 800, and the second elastic member 30B is coupled to the second flexible plate 31B.

The terminal units (e.g., 8B) of the support plate 310 may be provided with terminals P1 to P4 to be conductively connected to the terminals B1 to B4 of the terminal unit 95 of the circuit board 190 of the AF moving unit 100. The terminals B1 to B4 of the terminal unit 95 of the circuit board 190 and the terminals P1 to P4 of the terminal unit 8B of the support plate 310 may be conductively connected to each other by means of solder or conductive adhesive. That is, the circuit board 190 of the AF moving unit 100 may be conductively connected to the second board unit 800 via the support plate 310.

Referring to fig. 17, the circuit member 310B of the support plate 310 may include a first insulating layer 29A, a second insulating layer 29B, and a conductive layer 29C formed between the first insulating layer 29A and the second insulating layer 29B. The conductive layer 29C may be a wiring layer for transmitting an electrical signal. In an example, the second layer 29B may be located outside of the first layer 29A.

Each of the first insulating layer 29A and the second insulating layer 29B may be formed of an insulating material such as polyimide, and the conductive layer 29C may be formed of a conductive material such as copper, gold, or aluminum, or may be formed of an alloy including copper, gold, or aluminum.

The elastic unit 310A may be disposed on the second layer 29B. The elastic unit 310A may include at least one of copper, titanium, or nickel, or may be formed of an alloy including at least one of copper, titanium, or nickel to serve as a spring. In an example, the elastic unit 310A may be formed of an alloy of copper and titanium or an alloy of copper and nickel.

The elastic unit 310A may be conductively connected to the ground of the first plate unit 255 or the ground of the second plate unit 800. The elastic unit 310A may be used for impedance matching of transmission lines (or wires) of the board units 255, 310, and 800, and loss of transmission signals may be reduced by impedance matching to reduce the influence of noise.

The support plate 310 may further include a protective material or an insulating material surrounding or covering the elastic unit 310A.

In an example, the thickness T11 of the conductive layer 29C between the first layer 29A and the second layer 29C may be 7 micrometers to 50 micrometers. In another embodiment, the thickness T11 may be 15 micrometers to 30 micrometers.

In addition, in an example, the thickness T12 of the elastic unit 310A may be 20 micrometers to 150 micrometers. In another embodiment, the thickness T12 may be 30 micrometers to 100 micrometers. In an example, the thickness T11 of the elastic unit 310A may be greater than the thickness T12 of the conductive layer 29C. In another embodiment, T11 may be equal to or less than T12.

Referring to fig. 14B, 15, 17, 18A and 18B, the holder 270 may include first to fourth side portions corresponding to the first to fourth side portions 33A to 33D of the first circuit board 250. At least one connection portion 320A and 320B of the support plate 310 may be coupled to at least one of the first to fourth side portions of the holder 270 by means of an adhesive. In an example, first connection portion 320A may be coupled to a first side portion of retainer 270 by means of an adhesive, and second connection portion 320B may be coupled to a second side portion of retainer 270 by means of an adhesive.

The first to fourth side portions of the holder 270 may be provided with protruding portions 4A to 4D. In an example, the first connection portion 320A and the first protruding portion 4A formed on the first side portion of the holder 270 may form a first coupling region (38A in fig. 18A) in which the first connection portion 320A and the first protruding portion 4A are coupled to each other. The second connection portion 320A and the second protruding portion 4B formed on the second side portion of the holder 270 may form a second coupling region (38B in fig. 18A) in which the second connection portion 320A and the second protruding portion 4B are coupled to each other.

In addition, the base 210 may include first to fourth side portions corresponding to the first to fourth side portions 33A to 33D of the first circuit board 250. In an example, the side plate 21B of the base 210 may include first to fourth side portions of the base 210. The first to fourth side portions of the base 210 may be provided with protruding portions 216A to 216D.

At least a portion of the support plate 310 may be coupled to the base 210. In an example, the bodies 86 and 87 of the support plate 310 may be coupled to the base 210 by means of an adhesive. In an example, a portion of each of the bodies 86 and 87 of the support plates 310 connected to the terminal units 7A, 7B, 8A, and 8B may be coupled to the base 210.

In an example, the first terminal unit 7A and/or the second portion 6B of the first support plate 310-1 may be coupled to one region of the third side portion (or the third protruding portion 216C) of the base 210, and the second terminal unit 7B and/or the third portion 6C of the first support plate 310-1 may be coupled to one region of the fourth side portion (or the fourth protruding portion 216D) of the base 210.

In an example, the third terminal unit 8A and the second portion 9B of the second support plate 310-2 may be coupled to another region of the third side portion (or the third protruding portion 216C) of the base 210, and the fourth terminal unit 8B and the third portion 9C of the second support plate 310-2 may be coupled to another region of the fourth side portion (or the fourth protruding portion 216D) of the base 210.

A third coupling region (39A in fig. 18A) may be formed between the first terminal unit 7A and the third terminal unit 8A of the support plate 310 and the third side portion (or the third protruding portion 216C) of the base 210, and a fourth coupling region (39B in fig. 18A) may be formed between the second terminal unit 7B and the fourth terminal unit 8B and the fourth side portion (or the fourth protruding portion 216D) of the base 210. The OIS moving unit may be elastically supported with respect to the fixed unit by the support plate 310 and the first to fourth coupling regions 38A, 38B, 39a, and 39B. The terminals 311 of the support plate 310 may be coupled and conductively connected to the terminals of the second plate unit 800 by means of solder or conductive adhesive.

In another embodiment, the support member may be a resilient member that does not include a substrate, such as a spring, wire, shape memory alloy, or ball member.

The elastic member 315 may elastically support the first plate unit 255 with respect to the base 210. In an example, one end of the elastic member 315 may be coupled to the first plate unit 255, and the other end of the elastic member 315 may be coupled to the base 210.

Referring to fig. 18A, 18B, and 19, the elastic member 315 may include: a first coupling portion 315A, a second coupling portion 315B, and a connection portion 315C, the first coupling portion 315A being coupled to the first circuit board 250 of the first board unit 255, the second coupling portion 315B being coupled to the base 210, the connection portion 315C interconnecting the first coupling portion 315A and the second coupling portion 315B.

In an example, the first coupling portion 315A may be coupled to at least a portion of the lower surface of the first circuit board 250. Alternatively, the first coupling portion 315A may be coupled to at least a portion of the lower surface of the holder 270. In an example, the first coupling portion 315A may be coupled to at least one of the lower surface of the first circuit board 250 or the lower surface of the holder 270 by means of an adhesive.

In an example, the second coupling portion 315B can be coupled to at least a portion of the upper surface of the base 210. In an example, the base 210 may be provided with at least one protrusion 210-1 on an upper surface thereof, and the second coupling portion 315B may have a hole 315-1 formed therein for coupling to the at least one protrusion 210-1 of the base 210. The protrusion 210-1 may be formed on a corner of the upper surface of the base 210, and the hole 315-1 may be formed in a corner of the second coupling portion 315B.

In an example, each of the first coupling portion 315A and the second coupling portion 315B may have a polygonal shape such as a quadrangular shape when viewed in the first direction or from below, and may take the form of a closed curve. In an example, the shape of the first coupling portion 315A may be a quadrilateral ring shape when viewed in the first direction or from below.

In an example, the first coupling portion 315A may be disposed inside the second coupling portion 315B when viewed in a first direction or from below. Each of the first coupling portion 315A and the second coupling portion 315B may take the form of a plate.

The connection portion 315C may include at least one of at least one linear portion or at least one bent portion. In an example, the connection portion 315C may take the form of a wire. In another embodiment, the connection portion 315C may take the form of a plate.

The connection portion 316C may include a plurality of connection portions or connection lines spaced apart from each other. Each of the plurality of connection portions (or connection lines) may include at least one of at least one linear portion or at least one bent portion. In an example, the connection portion 316C may extend in a direction perpendicular to the optical axis.

The image sensor unit 350 may include at least one of a motion sensor 820, a controller 830, a memory 512, or a capacitor 514.

The motion sensor 820, the controller 830, and the memory 512 may be provided on any one of the first board unit 255 and the second board unit 800. The capacitor 514 may be disposed on at least one of the first plate unit 255 or the second plate unit 800.

In an example, the motion sensor 820 and the memory 512 may be disposed on the second board unit 800 (e.g., the first region 801). In an example, the controller 830 may be disposed or mounted on the first circuit board 250 of the first board unit 255.

In another embodiment, the controller 830 may be provided on the second board unit 800. Because heat generated from the image sensor 810 may cause a malfunction or error of the controller 830, it is preferable for the controller 830 to be remote from the image sensor 810.

The motion sensor 820 may be conductively connected to the controller 830 via wiring or circuit patterns formed on the first and second board units 255 and 800. The motion sensor 820 may output rotational angular velocity information about the movement of the image pickup apparatus device 10. The motion sensor 820 may be implemented as a two-axis or three-axis gyro sensor or an angular velocity sensor. In an example, the motion sensor 820 may output information about a movement amount in the X-axis direction, a movement amount in the y-axis direction, and a rotation amount in response to movement of the image pickup apparatus device 10.

In another embodiment, the motion sensor 820 may be omitted from the image pickup apparatus 10, or the motion sensor 820 may be provided in another region of the second board unit 800. In the case where the motion sensor 820 is omitted from the image pickup device module, the image pickup apparatus 10 may receive position information from the motion sensor provided in the optical instrument 200A in response to the movement of the image pickup apparatus 10.

The memory 512 may store a first data value (or code value) corresponding to an output from the second position sensor 240 according to a displacement (or stroke) of the OIS moving unit in a second direction (e.g., X-axis direction) perpendicular to the optical axis to implement the OIS feedback operation.

In addition, the memory 512 may store a second data value (or code value) corresponding to an output from the first position sensor 170 according to a displacement (or stroke) of the bobbin 110 in a first direction (e.g., an optical axis direction or a Z-axis direction) to implement an AF feedback operation.

In an example, each of the first data value and the second data value may be stored in the memory 512 in the form of a lookup table. Alternatively, each of the first data value and the second data value may be stored in the memory 512 in the form of an equation or algorithm. In addition, the memory 512 may store equations, algorithms or programs for the operation of the controller 830. In an example, the memory 512 may be a non-volatile memory, such as an Electrically Erasable Programmable Read Only Memory (EEPROM).

The controller 830 may be conductively coupled to the first position sensor 170 and the second position sensor 240.

The controller 830 may control a driving signal provided to the second coil 230 using the output signal received from the second position sensor 240 and the first data value stored in the memory 512, and may perform a feedback OIS operation.

In addition, the controller 830 may control a driving signal provided to the first coil 120 using the output signal from the first position sensor 170 and the second data value stored in the memory 512, and may perform a feedback autofocus operation.

The controller 830 may be implemented as a driver IC, but the present disclosure is not limited thereto. In an example, the controller 830 may be conductively connected to the terminal 251 of the first circuit board 250 of the first board unit 255.

The image sensor unit 350 may further include a filter 610. In addition, the image sensor unit 350 may further include a filter holder 600 in which the filter 610 is disposed, mounted, or accommodated. The filter holder 600 may alternatively be referred to as a "sensor base".

The optical filter 610 may be used to block or allow light within a specific wavelength range among light having passed through the lens barrel 400 to be introduced into the image sensor 810.

The filter 610 may be, for example, an infrared cut filter. In an example, the filter 610 may be disposed parallel to an xy plane, which is perpendicular to the optical axis OA. The optical filter 610 may be disposed under the lens module 400.

The filter holder 600 may be disposed under the AF moving unit 100. In an example, the filter holder 600 may be disposed on the first plate unit 255. In an example, the filter holder 600 may be disposed on the first surface 260A of the second circuit board 260 of the first board unit 255.

The filter holder 600 may be coupled to one region of the second circuit board 260 around the image sensor 810 by an adhesive, and may be exposed through an opening 250A in the first circuit board 250. In an example, the filter holder 600 may be visible through the aperture 250A in the first circuit board 250 of the first board unit 255. In an example, the aperture 250A in the first circuit board 250 may expose the filter holder 600 disposed on the second circuit board 260 and the filter 610 disposed on the filter holder 600. In another embodiment, the filter holder may be coupled to the holder 270 or the AF moving unit 100.

The filter holder 600 may have an opening 61A formed in a portion thereof, and the filter 610 is mounted or disposed in the opening 61A so as to allow light passing through the filter 610 to be introduced into the image sensor 810. The opening 61A in the filter holder 600 may be a through hole formed through the filter holder 600 in the optical axis direction. In an example, the aperture 61A in the filter holder 600 may be formed through the center of the filter holder 600 and may be disposed to correspond to or face the image sensor 810.

The filter holder 600 may include a seating part 500 recessed in an upper surface thereof to allow the filter 610 to be seated in the seating part 500. The optical filter 610 may be provided, mounted or installed in the mounting part 500. The seating portion 500 may be formed to surround the opening 61A. In another embodiment, the seating portion of the filter holder may take the form of a protruding portion protruding from the upper surface of the filter.

The image sensor unit 350 may further include an adhesive disposed between the filter 610 and the mount 500, and the filter 610 may be coupled or attached to the filter holder 600 by the adhesive.

The cover member 300 may take the form of a box having an open lower portion and including an upper plate 301 and side plates 302. A lower portion of the side plate 302 of the cover member 300 may be coupled to the base 210. The shape of the upper plate 301 of the cover member 300 may be a polygonal shape, for example, a quadrangular shape or an octagonal shape. The cover member 300 may have an opening 303 formed in an upper plate 301 thereof to expose lenses of the lens module 400 coupled to the bobbin 110 to external light.

Referring to fig. 1 and 3, any one of the side plates 302 of the cover member 300 may have a concave portion 304 formed therein to expose the terminals 95 of the circuit board 190 and the terminals 800B of the second plate unit corresponding thereto.

The cover member 300 may include a protruding portion 305 extending from the upper plate 301 toward the recess 119 in the bobbin 110. The protruding portion 305 may alternatively be referred to as an "extension portion". In an example, the cover member 300 may include at least one protruding portion 305, the protruding portion 305 extending from a region adjacent to the opening 303 formed in the upper plate 301 toward the upper surface of the bobbin 110. The protruding portion 305 may be integrally formed with the upper plate 301 and the side plate 302, and may be made of the same material as the upper plate 301 and the side plate 302.

In an example, the cover member 300 may include four protruding portions corresponding to four corners of the upper plate 301. In another embodiment, the number of protruding portions 305 may be one or two or more.

In an example, the protruding portion 305 may take the form of a polygonal plate, for example, a quadrilateral plate. In an example, at least a portion of the protruding portion 305 may include a curved portion.

At least a portion of the protruding portion 305 of the cover member 300 may be disposed in or inserted into the recess 119 in the bobbin 110. In an example, one or distal ends of the protruding portions 305 may be disposed in the grooves 119 in the coil former 110. In an example, at an initial position of the bobbin 110, the protrusion 305 and a bottom surface of the groove 119 in the bobbin 110 may be spaced apart from each other.

When the bobbin 110 moves in the optical axis direction during the AF operation, the protrusion 305 of the cover member 300 may contact the bottom surface of the groove 119 in the bobbin 110. Therefore, the protruding portion 305 may serve as a stopper limiting the movement of the bobbin 110 in the upward direction within a predetermined range. In addition, since at least a portion of the protrusion 305 is provided in the groove 119 in the bobbin 110, the protrusion 305 can suppress or prevent the bobbin 110 from rotating around the optical axis by impact beyond a predetermined range.

In an example, the cover member 300 may be formed of an injection molding material, such as plastic or resin. In addition, the cover member 300 may be made of an insulating material or a material capable of blocking electromagnetic waves.

The cover member 300 and the base 210 may house the AF moving unit 100 and the image sensor unit 350, may protect the AF moving unit 100 and the image sensor unit 350 from external impact, and may prevent foreign substances from being introduced therein.

The OIS moving unit may move relative to the fixed unit in a direction perpendicular to the optical axis OA. The OIS mobile unit is spaced apart from the fixed unit by a predetermined distance. That is, the OIS moving unit may be suspended (suspended) from the fixed unit by the support plate 310. The OIS moving unit may move relative to the fixed unit by a first electromagnetic force generated by the first magnet 130 and the second coil 230.

In an example, at an initial position of the OIS mobile unit, an outer surface of the retainer 270 may be spaced a predetermined distance from an inner surface of the base 210. In addition, in an example, at an initial position of the OIS moving unit, the retainer 270 and the lower surface of the first plate unit 255 may be spaced apart from the base 210 by a predetermined distance.

The initial position of the OIS moving unit may be an original position of the OIS moving unit in a state where no power is applied to the second coil 230, or a position where the OIS moving element is located due to elastic deformation of the support plate only by the weight of the OIS moving unit.

In addition, the initial position of the OIS moving unit may be a position where the OIS moving unit is located when gravity acts in a direction from the first board unit 255 toward the second board unit 800, or when gravity acts in the opposite direction.

In an example, the first to fourth coil units 230-1 to 230-4 of the second coil 230 may be controlled by four channels. In this case, the four coil units 230-1 to 230-4 may be controlled in a state of being conductively separated from each other. In an example, any one of the forward current and the reverse current may be selectively applied to each of the coil units 230-1 to 230-4. In this case, four pairs of leads, i.e., eight total leads, may be led out from the second coil 230.

In another embodiment, the first to fourth coil units 230-1 to 230-4 of the second coil 230 may be controlled through three channels so as to implement OIS operation. In an example, the first to third coil units 230-1 to 230-4 may be conductively separated from each other, and the fourth coil unit 230-4 may be conductively connected in series with any one of the first to third coil units. In this case, three pairs of leads, i.e., six total leads, may be drawn from the second coil 230.

In an example, the second coil unit 230-2 and the fourth coil unit 230-4 may be connected in series with each other. The magnetization direction of the second magnet unit 130-2 corresponding to or facing the second coil unit 230-2 and the magnetization direction of the fourth magnet unit 120-4 corresponding to or facing the fourth coil unit 230-4 may be identical to each other. In an example, the magnetization direction of the first magnet unit 130-1 and the magnetization direction of the third magnet 130-2 may be identical to each other. In addition, in an example, the magnetization direction of the second magnet unit 130-2 may be different from the magnetization direction of the first magnet unit 130-1. In an example, the magnetization direction of the second magnet unit 130-2 may be perpendicular to the magnetization direction of the first magnet unit 130-1.

The controller 830 may provide at least one driving signal to at least one of the first to fourth coil units 230-1 to 230-4 and may control the at least one driving signal to move the OIS moving unit in the X-axis direction and/or in the Y-axis direction or to rotate the OIS moving unit around the optical axis within a predetermined angular range.

Fig. 20A is a perspective view of the first coil 120, the first magnet 130, the second coil 230, the yoke 410, the first plate unit 255, and the second plate unit 800, fig. 20B is an enlarged view of a part of the image pickup apparatus 10, and fig. 20C shows a distance D11 between the first magnet 130 and the first coil 230, a distance D13 between the first magnet 130 and the yoke 410, and a distance D14 between the second coil 230 and the yoke 410.

Referring to fig. 10A, 10B, and 20A to 20C, the first magnet 130 may be disposed on a first board unit 255 (e.g., a first circuit board 250). The first magnet 130 may maximally affect the electromagnetic force for the AF operation and the electromagnetic force for the OIS operation.

In an embodiment, the electromagnetic force for the movement of the OIS moving unit may be an electromagnetic force caused by an interaction between the second coil 230 and the first magnet 130 disposed on the second coil 230.

Embodiments may include a yoke 410 to enhance electromagnetic force caused by interaction between the first magnet 130 and the second coil 230.

The yoke 410 may be disposed on the second plate unit 800. The yoke 410 may be disposed on an upper surface of the first region 801 of the second plate unit 800. In an example, the yoke 410 may be disposed between the second plate unit 800 and the second coil 230. In an example, the yoke 410 may be disposed between the second board unit 800 and the first circuit board 250 of the first board unit 255. In another embodiment, the yoke may be disposed under the second plate unit 800. In an example, in another embodiment, a yoke may be disposed on a lower surface of the first region 801.

For example, the yoke 410 may be made of metal or a magnetic material.

For example, the yoke 410 may include stainless steel (steel use stainless, SUS). For example, the yoke 410 may include iron (Fe). For example, the yoke 410 may be a magnetic member.

In an example, the yoke 410 may face the first magnet 130 in a first direction (or the optical axis direction) or overlap with the first magnet 130. In an example, the yoke 410 may have a plate shape, may include a cavity formed therein, and may be formed as a single body. In another embodiment, the yoke 410 may include a plurality of yokes corresponding to the magnet units 130-1 to 130-4 of the first magnet 130.

In an example, the yoke 410 may be disposed on an edge of an upper surface of the first region 801 of the second plate unit 800. In an example, the yoke 410 may be disposed on an edge of an upper surface of the first region 801 of the second plate unit 800 to have a predetermined width.

In an example, the yoke 410 may be in contact with an upper surface of the second plate unit 800.

The yoke 410 may serve to enhance electromagnetic force between the second coil 230 and the first magnet 130. In addition, the yoke 410 may be used to dissipate heat from the second plate unit 800. In an example, the yoke 410 may suppress the temperature increase of the image sensor 810 by dissipating heat generated from the image sensor 810.

Fig. 21A shows an embodiment of the first magnet 130, the first coil 120, the second coil 230, and the yoke 410. Although one of the magnet units of the first magnet 130 and one of the coil units of the second coil 230 will be described with reference to fig. 21A, the description given with reference to fig. 21A may be equally or similarly applied to the remaining magnet units of the first magnet 130 and the remaining coil units of the second coil 230.

Referring to fig. 21A, the first magnet 130 may include a first magnet portion 71A, a second magnet portion 71B, and a partition wall 71C disposed between the first magnet portion 71A and the second magnet portion 71B. In an example, the first magnet portion 71A and the second magnet portion 71B may be spaced apart from each other in the first direction (or the optical axis direction).

The first magnet portion 71A may include a first N pole and a first S pole. The first interface may be formed between the first N-pole and the first S-pole. The second magnet portion 71B may include a second N pole and a second S pole. The second interface may be formed between the second N-pole and the second S-pole. In an example, the first N pole and the first S pole may face each other in a direction perpendicular to the first direction, and the second N pole and the second S pole may face each other in a direction perpendicular to the first direction.

Each of the first interface and the second interface may be a portion having substantially no magnetism and including a region having little polarity, and may be a portion naturally generated to form a magnet composed of one N pole and one S pole. In an example, the first N-pole may face or overlap the second S-pole in the first direction (or optical axis direction), and the first S-pole may face or overlap the second N-pole in the first direction (or optical axis direction).

The partition wall 71C may be a portion that separates or isolates the first magnet portion 71A and the second magnet portion 71B from each other and has substantially no magnetism or little polarity. For example, the partition wall 71C may be implemented as a non-magnetic material or air. The partition wall 71C may be referred to as a "neutral region" or a "neutral zone". In an example, the width of the partition wall 71C may be greater than the width of the first interface (or the second interface). The width of the partition wall 71C may be the length of the partition wall in the first direction (or the optical axis direction), and the width of the first interface (or the second interface) may be the length of the first interface between the first N-pole (or the second N-pole) and the first S-pole (or the second S-pole). In the embodiment, since the first magnet 130 is a bipolar magnetized magnet, the AF electromagnetic force and OIS electromagnetic force may be enhanced.

At the initial position of the AF moving unit, the first coil 120 may face the first magnet portion 71A in a direction perpendicular to the first direction (or the optical axis direction) or overlap the first magnet portion 71A. Referring to fig. 21A, the first S pole of the first magnet portion 71A may be disposed to face the first coil 120, or the first S pole of the first magnet portion 71A may be located closer to the first coil 120 than the first N pole. However, in another embodiment, the position of the first S pole and the position of the first N pole may be interchanged.

In an example, at least a portion of the first magnet 130 may overlap with at least a portion of the second coil 230 in the first direction (or the optical axis direction) at the initial position of the OIS moving unit. In an example, at least a portion of the first magnet 130 may overlap with at least a portion of the yoke 410 in the first direction (or the optical axis direction) at an initial position of the OIS moving unit. The first magnet 130 and the yoke 410 may face each other in a first direction (or an optical axis direction).

The length L1 of the short side of the first magnet portion 71A and the length L2 of the short side of the second magnet portion 71B of the first magnet 130 may be equal to each other when viewed from the first direction or from above. When L1 and L2 are equal to each other, the length of the short side of the first magnet 130 is defined as L1.

The length L1 of the short side of the first magnet 130 may be smaller than the length L2 of the short side of the second coil 230. In another embodiment, the length L1 of the short side of the first magnet 130 may be greater than or equal to the length L3 of the short side of the second coil 230.

In an example, the length L5 of the yoke 410 in the longitudinal direction of the short side of the first magnet 130 may be greater than L1, L3, and L4 when viewed from the first direction or from above. In another embodiment, L5 may be less than at least one of L1, L3, or L4, or may be equal to at least one of L1, L3, or L4.

In an example, a length L6 of the first coil 120 in a longitudinal direction of a short side of the first magnet 130 may be smaller than a length L1 of the short side of the first magnet 130 when viewed from the first direction or from above.

In an example, the length M1 of the first magnet portion 71A in the first direction (or the optical axis direction) may be greater than the length M2 of the second magnet portion 71B in the first direction (or the optical axis direction) (M1 > M2).

In an example, the length d1 of the partition wall 71C in the first direction (or the optical axis direction) may be smaller than M1 and M2.

In an example, a length d1 of the first coil 120 in the first direction (or the optical axis direction) may be smaller than a length M1 of the first magnet portion 71A in the first direction (or the optical axis direction).

In a stroke section in which the bobbin 110 moves in the optical axis direction, the first coil 120 may at least partially overlap with the first magnet 130 in a direction perpendicular to the optical axis direction.

In an example, at least a part or all of the first coil 120 may overlap with the first magnet portion 71A in a direction perpendicular to the optical axis direction in a stroke section in which the coil bobbin 110 moves in the optical axis direction. In an example, at least a portion or all of the first coil 120 may overlap the first magnet portion 71A in a direction perpendicular to the optical axis direction at a maximum stroke position of the coil holder 110 in the upward direction. In addition, in an example, at least a part or all of the first coil 120 may overlap with the first magnet portion 71A in a direction perpendicular to the optical axis direction at the maximum stroke position of the coil holder 110 in the downward direction. Thus, a linear correlation between the displacement (or stroke) of the bobbin 110 and the output from the first position sensor 170 may be maintained or improved.

A length M3 of the second coil 230 in the first direction (or the optical axis direction) may be smaller than a length M2 of the second magnet portion 71B in the first direction (or the optical axis direction). In another embodiment, M3 may be equal to or greater than M2.

Most of the electromagnetic force for the AF operation may be generated by electromagnetic force caused by the interaction between the first coil 120 and the first magnet 130.

The electromagnetic force for OIS operation may be generated by the electromagnetic force caused by the interaction between the second coil 230 and the first magnet 130. The electromagnetic force may be enhanced by the yoke 410 disposed under the second coil 230. In an embodiment, electromagnetic force for OIS operation may be improved.

As the distance D11 between the first magnet 130 and the second coil in the optical axis direction decreases, the electromagnetic force between the first magnet 130 and the second coil 230 may increase. Further, as the separation distance D13 between the first magnet 130 and the yoke 410 decreases, the electromagnetic force may be more effectively increased. However, a space where at least one of the second coil 230, the second position sensor 240, or the first plate unit 255 is provided needs to be secured between the first magnet 130 and the yoke 410, and thus D13 may be greater than D11.

For example, D11 may be 0.05mm to 0.2 mm. Alternatively, D11 may be 0.05mm to 0.15 mm, for example. Alternatively, D11 may be 0.09 mm to 0.12 mm, for example.

When D11 is less than 0.05mm, the margin for avoiding the spatial interference between the first magnet 130 and the second coil 230 is too small, so that the spatial interference between the first magnet 130 and the second coil 230 may occur even due to a small impact, making it difficult to perform a normal OIS operation. In addition, when D11 exceeds 0.2mm, the electromagnetic force between the first magnet 130 and the second coil 230 may decrease, and the size of the image pickup device module in the optical axis direction may increase.

In an example, a separation distance D13 between the first magnet 130 and the yoke 410 in the optical axis direction may be greater than D11 (D13 > D11). In addition, in an example, a separation distance D14 between the second coil 230 and the yoke 410 in the optical axis direction may be greater than D11 (D14 > D11). Additionally, in an example, D13 may be greater than D14 (D13 > D14).

For example, D13 may be 1.5 mm to 2.5 mm. Alternatively, D13 may be 1.6 mm to 2 mm, for example. Alternatively, D13 may be 1.5 mm to 1.8 mm, for example.

Alternatively, D14 may be 1.2 mm to 2 mm, for example. Alternatively, D14 may be 1.2 mm to 1.55 mm, for example. Alternatively, D14 may be 1.3 mm to 1.5 mm, for example.

The value obtained by dividing D13 by D11 (D13/D11) may be 7.5 to 50. Alternatively, for example, the division value (D13/D11) may be 15 to 25. In another embodiment, the divisor value (D13/D11) may be 17 to 22.

When the division value (D13/D11) is less than 7.5, D13 is too small to ensure a sufficient space for placing the second coil 230, the second position sensor 240, and the first plate unit 255. In addition, when the division value (D13/D11) exceeds 50, D13 is too large to obtain the electromagnetic force enhancing effect of the yoke 410. Therefore, OIS driving force enhancing effect may not be obtained, and the size of the image pickup device module in the optical axis direction may increase.

In addition, when the division value (D13/D11) is 15 to 25, a sufficient space for placing the second position sensor 240 and the first board unit 255 can be ensured, and OIS driving force can be enhanced.

In addition, the value obtained by dividing D14 by D11 (D14/D11) may be 6 to 40. Alternatively, for example, the division value (D14/D11) may be 10 to 20. Alternatively, for example, the divisor value (D14/D11) may be 14 to 18.

When the division value (D14/D11) is less than 6, D14 is too small to ensure a sufficient space for placing the second coil 230, the second position sensor 240, and the first board unit 255. In addition, when the division value (D14/D11) exceeds 40, D14 is too large to obtain the electromagnetic force enhancing effect of the yoke 410. Therefore, OIS driving force enhancing effect may not be obtained, and the size of the image pickup device module in the optical axis direction may increase.

In addition, when the division value (D14/D11) is 14 to 18, a sufficient space for placing the second position sensor 240 and the first board unit 255 can be ensured, and OIS driving force can be enhanced.

The descriptions of D11, D12, D13, D14 and the division value (D13/D11 or D14/D11) may be equally or similarly applied to fig. 21B to 21E, fig. 22A to 22C, and fig. 23A to 23C, which will be described later. In addition, the description of the division value (D13/D11 or D14/D11) given with reference to fig. 21A can be applied equally or similarly to fig. 24.

Fig. 21B shows another embodiment 130A of the first magnet 130. In fig. 21B, the same reference numerals as those in fig. 21A denote the same components, and a description of the same components will be omitted.

Referring to fig. 21B, the first magnet 130A shown in fig. 21B may be formed such that the partition wall 71C of the first magnet 130 shown in fig. 21A is removed, and the first magnet portion 71A and the second magnet portion 71B are spaced apart from each other. In an example, a portion of the housing 140 may be interposed, disposed, or interposed between the first magnet portion 71A and the second magnet portion 71B. That is, the first magnet portion 71A and the second magnet portion 71B may be separated from each other by a portion of the case 140. In this case, a neutral region may be formed between the first magnet portion 71A and the second magnet portion 71B. In another embodiment, a neutral region may not be formed between the first magnet portion 71A and the second magnet portion 71B.

Fig. 21C shows yet another embodiment 130B of the first magnet 130.

Referring to fig. 21C, the first magnet 130B shown in fig. 21C may be formed such that the partition wall 71C of the first magnet 130 shown in fig. 21A is removed and the first magnet portion 71A and the second magnet portion 71B are in contact with each other.

In an example, the first N pole of the first magnet portion 71A may be in contact with the second S pole of the second magnet portion 71B, and the first S pole of the first magnet portion 71A may be in contact with the second N pole of the second magnet portion 71B.

Fig. 21D shows yet another embodiment 130C of the first magnet 130.

Referring to fig. 21D, the first magnet 130 may be a unipolar magnetized magnet including one N pole and one S pole.

In an example, the length M7 of the first magnet 130 in the first direction (or the optical axis direction) may be a sum of M1 and M2 in fig. 21A. Alternatively, in an example, M7 may be the sum of M1, M2, and d1 in fig. 21A.

Fig. 21E is a modified example of fig. 21B.

Referring to fig. 21E, a yoke 420A may be disposed between the first magnet portion 71A and the second magnet portion 71B. The yoke 420A may correspond to, face, or overlap each of the first and second magnet portions 71A and 71B in the first direction (or the optical axis direction).

The yoke 420A may enhance electromagnetic force caused by interaction between the first magnet portion 71A and the first coil 120, thereby enhancing electromagnetic force for AF operation. In addition, the yoke 420A may increase electromagnetic force caused by interaction between the second magnet portion 71B and the second coil 230, thereby increasing electromagnetic force for OIS operation.

Fig. 22A shows yet another embodiment 130D of the first magnet 130. The embodiment shown in fig. 22A is a modified example of the first magnet shown in fig. 21B. In another embodiment, the first magnet 130D shown in fig. 22A may be equally or similarly applied to fig. 21A and 21C to 21E.

Referring to fig. 22A, the length L11 of the short side of the first magnet portion 71A1 may be greater than the length L2 of the short side of the second magnet portion 71B1 (L11 > L2). The reason for this is: the AF electromagnetic force caused by the interaction with the first coil 120 is increased by increasing the size of the first magnet portion 71 A1. In another embodiment, in order to increase OIS electromagnetic force, the length of the short side of the second magnet portion may be greater than the length of the short side of the first magnet portion.

In an example, the length L11 of the short side of the first magnet portion 71A1 may be greater than at least one of L3, L4, or L5.

Fig. 21A to 22A may be sectional views taken in a direction parallel to a short side of the first magnet 130.

Fig. 22B illustrates an embodiment of the length of the long side of each of the first magnet 130, the first coil 120, the second coil 230, and the yoke 410.

Referring to fig. 22B, when viewed from the first direction or from above, the length K1 of the long side of the first magnet portion 71A and the length K2 of the long side of the second magnet portion 71B of the first magnet 130 may be different from each other. In an example, the length K1 of the long side of the first magnet portion 71A of the first magnet 130 may be greater than the length K2 of the long side of the second magnet portion 71B. When K1 is greater than K2, electromagnetic force caused by interaction between the first coil 120 and the first magnet portion 71A may be increased, and thus, AF driving force may be increased.

The length K2 of the long side of the second magnet portion 71B may be different from the length K3 of the long side of the second coil 230. In an example, the length K2 of the long side of the second magnet portion 71B may be greater than the length K3 of the long side of the second coil 230. In another embodiment, the length of the long side of the second magnet portion 71B may be equal to or less than the length of the long side of the second coil 230.

In an example, one end of each of the first and second magnet portions 71A and 71B may be located inside the second coil 230, and the other end of each of the first and second magnet portions 71A and 71B may be located outside the second coil 230. In another embodiment, one end and the other end of each of the first and second magnet portions 71A and 71B may be located outside the second coil 230.

Each of the first and second magnet portions 71A and 71B may include a first portion overlapping the second coil 230 in the first direction or the optical axis direction. In addition, each of the first and second magnet portions 71A and 71B may include a second portion that does not overlap the second coil 230 in the first direction or the optical axis direction.

The length of the long side of the first magnet 130 may be different from the length K5 of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 when viewed from the first direction or from above.

In an example, the length K5 of the yoke in the longitudinal direction of the long side of the first magnet 130 may be greater than the length K2 of the long side of the second magnet portion 71B of the first magnet 130 (K5 > K2). In another embodiment, the length of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be equal to or less than the length of the long side of the second magnet portion 71B.

Alternatively, in an example, the length K5 of the yoke in the longitudinal direction of the long side of the first magnet 130 may be smaller than the length K1 of the long side of the first magnet portion 71A of the first magnet 130 (K5 < K1). In another embodiment, the length of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be equal to or greater than K1.

In addition, the length K5 of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be different from the length K3 of the long side of the second coil 230 when viewed from the first direction or from above. In an example, the length K5 of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be greater than the length K3 of the long side of the second coil 230 when viewed from the first direction or from above. In another embodiment, the length of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be equal to or less than the length of the long side of the second coil 230.

In an example, one end and the other end of the second magnet portion 71B of the first magnet 130, which are opposite to each other in the longitudinal direction of the long side of the first magnet 130, may be located inside the yoke 410 when viewed from the first direction or from above. In another embodiment, at least one of one end and the other end of the second magnet portion 71B of the first magnet 130, which are opposite to each other in the longitudinal direction of the long side of the first magnet 130, may be located outside the yoke 410 when viewed from the first direction or from above.

Alternatively, in an example, among one end and the other end of the first magnet portion 71A of the first magnet 130 that are opposite to each other in the longitudinal direction of the long side of the first magnet 130, one end of the first magnet portion 71 may be located inside the yoke 410 and the other end of the first magnet portion 71A may be located outside the yoke 410, when viewed from the first direction or from above. In another embodiment, one end and the other end of the first magnet portion 71A of the first magnet 130, which are opposite to each other in the longitudinal direction of the long side of the first magnet 130, may be located inside or outside the yoke 410 when viewed from the first direction or from above.

In an example, the yoke 410 may include a first portion overlapping the first magnet 130 when viewed from a first direction or from above. In addition, the yoke 410 may include a second portion that does not overlap the first magnet 130 when viewed from the first direction or from above.

In an example, the yoke 410 may include a first portion overlapping the second coil 230 when viewed from a first direction or from above. In addition, the yoke 410 may include a second portion that does not overlap the second coil 230 when viewed from the first direction or from above.

Fig. 22C shows another embodiment of the length of the long side of the second magnet portion 71B in fig. 22B.

Referring to fig. 22C, the length K21 of the long side of the second magnet portion 71B may be smaller than the length K3 of the long side of the second coil 230. In an example, one end and the other end of the second magnet portion 71B may be located inside the second coil 230 when viewed from the first direction or from above.

In another embodiment, the length of the long side of the first magnet portion 71A may be smaller than the length of the long side of the second coil 230. In addition, one end and the other end of the first magnet portion 71A may be located inside the second coil 230 when viewed from the first direction or from above.

Fig. 22A and 22B may be sectional views taken in a direction parallel to the long side of the first magnet 130. The description given with reference to fig. 22B and 22C may be equally or similarly applied to fig. 21A to 21E and 22A.

The image pickup apparatus 10 may further include a yoke provided separately from the yoke 410 to be provided on the first magnet 130 to increase or enhance the electromagnetic force for the AF operation and the electromagnetic force for the OIS operation.

Fig. 23A shows another embodiment of fig. 21E.

Referring to fig. 23A, the image pickup apparatus 10 may include a yoke 420B provided on at least one of side surfaces of the second magnet portion 71B.

In an example, the yoke 420B may be disposed on at least one of the long side surface or the short side surface of the second magnet portion 71B. In an example, the yoke 420B may be in contact with at least one of the long side surface or the short side surface of the second magnet portion 71B.

The yoke 420B may be in contact with the yoke 420A described with reference to fig. 21E. In another embodiment, the yoke 420B may be spaced apart from the yoke 420A described with reference to fig. 21E.

In an example, the yoke 420B may be disposed on a long side surface of the second magnet portion 71B. In an example, the yoke 420B may be disposed on a second long side surface of the first long side surface and the second long side surface. In this case, the first long side surface may be closer to the first coil 120 than the second long side surface, and the first long side surface and the second long side surface may be positioned opposite to each other.

At the initial position of the bobbin 110, the yoke 420B may not overlap the first coil 120 in a direction perpendicular to the optical axis direction. Alternatively, in an example, at least a portion of the yoke 420B may overlap the first coil 120 in a direction perpendicular to the optical axis direction when the bobbin 110 moves.

At least one of the electromagnetic force caused by the interaction between the first magnet 130 and the first coil 120 or the electromagnetic force caused by the interaction between the first magnet 130 and the second coil 230 may be increased or raised by the yoke 420B.

The yoke 420B shown in fig. 23A may be equally or similarly applied to the embodiments shown in fig. 21A to 21D and fig. 22A to 22C.

Fig. 23B shows another embodiment of fig. 21C.

Referring to fig. 23B, the image pickup apparatus 10 may include a yoke 420C disposed on an upper surface of the first magnet portion 71A. In an example, the yoke 420C may be disposed on upper surfaces of the N and S poles of the first magnet portion 71A. In an example, the yoke 420C may be in contact with an upper surface of the first magnet portion 71A.

At least a portion of the yoke 420C may correspond to, face or overlap with the first magnet 130 and the second coil 230 in the optical axis direction.

At least one of the electromagnetic force caused by the interaction between the first magnet 130 and the first coil or the electromagnetic force caused by the interaction between the first magnet 130 and the second coil 230 may be increased or raised by the yoke 420C.

Fig. 23C shows another embodiment of fig. 23B.

Referring to fig. 23C, the image pickup apparatus 10 may include a yoke 420B1 provided on a side surface of at least one of the first magnet portion 71A or the second magnet portion 71B.

At least a portion of the yoke 420B1 may correspond to, face or overlap with the first coil 120 in a direction perpendicular to the optical axis direction.

In an example, the yoke 420B1 may be disposed on a side surface of the N pole or the S pole of the first magnet portion 71A. In addition, the yoke 420B1 may be disposed on a side surface of the N pole or the S pole of the second magnet portion 72A.

In an example, the yoke 420B1 may be disposed on at least one of the long side surface or the short side surface of the first magnet portion 71A, and may be in contact with at least one of the long side surface or the short side surface of the first magnet portion 71A. In addition, in an example, the yoke 420B1 may be disposed on at least one of the long side surface or the short side surface of the second magnet portion 71B, and may be in contact with at least one of the long side surface or the short side surface of the second magnet portion 71B.

In an example, the yoke 420B1 may be disposed on a long side surface of the first magnet portion 71A and a long side surface of the second magnet portion 71B. In an example, the yoke 420B1 may be disposed on a second long side surface of the first and second long side surfaces of the first magnet portion 71A, and may be disposed on a fourth long side surface of the third and fourth long side surfaces of the second magnet portion 71B. In this case, the first long side surface may be closer to the first coil 120 than the second long side surface, and the first long side surface and the second long side surface may be positioned opposite to each other. In addition, the third long side surface may be closer to the first coil 120 than the fourth long side surface, and the third long side surface and the fourth long side surface may be positioned opposite to each other.

At least one of the electromagnetic force caused by the interaction between the first magnet 130 and the first coil or the electromagnetic force caused by the interaction between the first magnet 130 and the second coil 230 may be increased or raised by the yoke 420B 1.

The yoke 420B1 may be in contact with the yoke 420A described with reference to fig. 23B. In another embodiment, the yoke 420B1 may be spaced apart from the yoke 420A described with reference to fig. 23B.

The yokes 420C and 420B1 shown in fig. 23B and 23C may be equally or similarly applied to the embodiments shown in fig. 21A to 21E, 22A to 22C, and 23A.

The image pickup apparatus according to another embodiment may further include a second magnet provided on the yoke 410 and corresponding to, facing, or overlapping the second coil 230.

Fig. 24 illustrates the placement of the third magnet 72 according to an embodiment.

Referring to fig. 24, the image pickup apparatus 10 may further include a third magnet 72 disposed between the first magnet 130 and the second coil 230 to enhance OIS driving force.

The third magnet 72 may be provided on the fixed unit. In an example, the third magnet 72 may be disposed in the case 140 and may be disposed under the first magnet 130. In an example, the third magnet 72 may be spaced apart from the first magnet.

In another embodiment, the third magnet 72 may be in contact with the first magnet 130. In an example, an upper surface of the third magnet 72 may be in contact with a lower surface of the first magnet 130.

The third magnet 72 may include magnet units corresponding to the magnet units 130-1 to 130-4 of the first magnet 130. Each of the magnet units of the third magnet 72 may correspond to, face or overlap a corresponding one of the magnet units 130-1 to 130-4 of the first magnet 130 in the first direction (or the optical axis direction).

In an example, the third magnet 72 may be a unipolar magnetized magnet including one N pole and one S pole. In another embodiment, the third magnet 72 may be a bipolar magnetized magnet including two N poles and two S poles.

The N pole of the third magnet 72 may face the S pole of the first magnet 130 (e.g., the second magnet portion 71B) in the first direction (or the optical axis direction), and the S pole of the third magnet 72 may face the N pole of the first magnet 130 (e.g., the second magnet portion 71B) in the first direction (or the optical axis direction).

The length L7 of the short side of the third magnet 72 may be smaller than the length L3 of the short side of the second coil 230 when viewed from the first direction or from above. In another embodiment, the length L7 of the short side of the third magnet 72 may be greater than or equal to the length L3 of the short side of the second coil 230.

The length L7 of the short side of the third magnet 72 may be smaller than the length L1 of the short side of the first magnet 130 when viewed from the first direction or from above. In another embodiment, the length L7 of the short side of the third magnet 72 may be greater than or equal to the length L1 of the short side of the first magnet 130.

In an example, the length L7 of the short side of the third magnet 72 may be less than or equal to the length L1 of the short side of the first magnet 130. In another embodiment, the length L7 of the short side of the third magnet 72 may be greater than the length of the short side of the first magnet 130.

In addition, the length M8 of the third magnet 72 in the first direction (or the optical axis direction) may be less than or equal to the length of the first magnet portion 71B of the first magnet 130 in the first direction. In another embodiment, the length M8 of the third magnet 72 in the first direction (or the optical axis direction) may be greater than the length of the first magnet portion 71B of the first magnet 130 in the first direction.

The length of the long side of the third magnet 72 may be greater than or equal to the length of the long side of the second magnet portion 71B of the first magnet 130 when viewed from the first direction or from above. In another embodiment, the length of the long side of the third magnet 72 may be smaller than the length of the long side of the second magnet portion 71B of the first magnet 130.

The length of the long side of the third magnet 72 may be smaller than the length of the long side of the first magnet portion 71A of the first magnet 130 when viewed from the first direction or from above. In another embodiment, the length of the long side of the third magnet 72 may be greater than or equal to the length of the long side of the first magnet portion 71A of the first magnet 130.

The third magnet 72 shown in fig. 24 may be equally or similarly applied to fig. 21A to 23C.

Referring to fig. 24, the OIS driving force for moving the OIS moving unit may include electromagnetic force caused by the interaction between the second coil 230 and each of the first and third magnets 130 and 72. Accordingly, the embodiment shown in fig. 24 can increase electromagnetic force for OIS operation.

Fig. 25 is a perspective view of the cover member 300, the first magnet 130, the first coil 120, the second coil 230, and the second position sensor 240 according to an embodiment.

Referring to fig. 25, the cover member 300A may take the form of a case including an upper plate 301A and a side plate 302A and having an open lower portion, and the lower portion of the side plate 302A of the cover member 300A may be coupled to the base 210. The cover member 300A may have an aperture 303 formed in the upper plate 301 thereof to expose at least a portion of the lens module 400. The description of the structure of the cover member 300 shown in fig. 1 and 3 may be equally or similarly applied to the cover member 300A shown in fig. 25.

The cover member 300A may include a protrusion 305A extending from the upper plate 301A toward the recess 119 in the coil former 110. The structure of the protruding portion 305 of the cover member 300 shown in fig. 1 and 3 and the description of its function as a stopper can be equally or similarly applied to the protruding portion 305A of the cover member 300A shown in fig. 25.

The cover member 300A shown in fig. 25 may be formed of metal. For example, the cover member 300A may be formed of stainless steel (steel use stainless, SUS) (e.g., SUS-4 based material). In addition, the cover member 300 may be formed of a cold-rolled steel sheet (steel plate cold commercial, SPC). For example, the cover member 300A may be formed of SUS containing iron (Fe) in an amount of 50 percent (%) or more.

In addition, in an example, an oxidation-resistant metal (e.g., nickel) may be plated on the surface of the cover member 300A to prevent oxidation.

In addition, in another embodiment, the cover member 300A may be formed of a magnetic material or a magnetic metal.

The protrusion 305A may be formed of the same metal material and/or magnetic material as the cover member 300A, and may serve to concentrate the magnetic field of the first magnet 130 on the first coil 120. At least a portion of the protruding portion 305A may overlap the first magnet 130 in a direction perpendicular to the first direction (or the optical axis direction).

The protrusion 305A may include a plurality of protruding portions corresponding to the plurality of magnet units 130-1 to 130-4 of the first magnet 130. In an example, at least a portion of each of the plurality of protruding portions of the cover member 300 may overlap a corresponding one of the plurality of magnet units 130-1 to 130-4 in a direction perpendicular to the first direction (or the optical axis direction).

In an example, the protrusion 305A may overlap the first magnet portion 71A of the first magnet 130 in a direction perpendicular to the first direction (or the optical axis direction).

At least a portion of the first magnet portion 71A may overlap the protruding portion 305A in a direction perpendicular to the first direction (or the optical axis direction).

The length of the portion of the first magnet portion 71A overlapping the protrusion 305A in the first direction may be 20% to 100% of the length M1 of the first magnet portion 71A in the first direction. Alternatively, in an example, the length of the portion of the first magnet portion 71A overlapping the protruding portion 305A in the first direction may be 50% to 100% of the length M1 of the first magnet portion 71A in the first direction. When the length of the overlapped portion is less than 20% of M1, an effect of improving electromagnetic force caused by interaction with the first coil 120 due to the yoke function may be low. When the length of the overlapped part is 100% of M1, the electromagnetic force caused by the interaction with the first coil 120 may be maximally increased.

In another embodiment, the length of the portion of the first magnet 130 overlapping the protrusion 305A in the first direction may be 20% to 100% of the length of the first magnet 130 in the first direction. Alternatively, in an example, the length of the portion of the first magnet 130 overlapping the protrusion 305A in the first direction may be 50% to 100% of the length of the first magnet 130 in the first direction.

The protruding portion 305A may be located inside the first coil 120 (as shown in fig. 25) when viewed from the first direction or from above. In an example, at least a portion of the first coil 120 may be disposed between the first magnet 130 and the protrusion 305A. The reason for this is: the magnetic field of the first magnet 130 is concentrated on the first coil 120 by allowing the magnetic field of the first magnet 130 to pass through the first coil 120 in a direction perpendicular to the optical axis. That is, the protruding portion 305A may serve as an inner yoke. The tab 305A may alternatively be referred to as an inner yoke or yoke.

The length of the protrusion 305A in the first direction (or the optical axis direction) may be greater than the entire stroke of the bobbin 110. The reason for this is: in order to prevent the protrusion 305A from escaping from the groove 119 in the bobbin 110 and to maximize electromagnetic force caused by interaction between the first magnet 130 and the first coil 120.

In an example, at an initial position of the bobbin 110, the length of the protrusion 305A inserted into the groove 119 in the bobbin 110 may be greater than or equal to the entire stroke of the bobbin 110. In addition, in an example, at the initial position of the bobbin 110, the length of the protrusion 305A inserted into the groove 119 in the bobbin 110 may be greater than the stroke of the bobbin in the downward direction from the initial position of the bobbin 110.

The embodiment may increase electromagnetic force caused by interaction between the first magnet 130 and the first coil 120 by about 20% due to the yoke function of the protrusion 305A, compared to when the protrusion 305A is not provided.

The yoke 410 may face, correspond to, or overlap with the first magnet 130 in a first direction (or the optical axis direction). In an example, at least a portion of the yoke 410 may overlap the first magnet 130 in a first direction (or optical axis direction). In an example, at least a portion of the yoke 410 may overlap the second magnet portion 71B of the first magnet 130 in the first direction (or the optical axis direction).

In an example, the area of the portion of the first magnet 130 overlapping the yoke 410 may be 50% to 100% of the area of the first magnet 130 when viewed from the first direction or from above. When the area of the overlapped portion is less than 50%, the effect of the increase in electromagnetic force due to the yoke function may be low. In addition, when the area of the overlapped portion is 100% of the area of the first magnet 130, the maximum electromagnetic force may be obtained.

When the area of the overlapped part is equal to or greater than 50% of the entire area of the first magnet 130, an electromagnetic force of 90% or more of the maximum electromagnetic force obtained when the overlapped part area is 100% may be obtained.

In an image pickup device module that performs OIS operation by moving a housing and a lens module coupled to a coil bobbin provided in the housing in a direction perpendicular to an optical axis, if the cover member is made of metal, the cover member may be attached to the housing by a magnet provided in the housing. Therefore, OIS operation may not be performed normally. In contrast, in the embodiment, since the case 140 belongs to a fixed unit and the first plate unit 255 moves in a direction perpendicular to the optical axis to perform OIS operation, OIS operation can be normally performed even when the cover member 300A is formed of a metal material having a yoke function, and electromagnetic force for AF operation can be increased by the protrusion 305A of the cover member 300A.

As the sizes of the image sensor and the lens of the lens module are increased, larger AF driving force and OIS driving force may be required, and thus power consumption may be increased. In order to prevent an increase in power consumption, it is necessary to increase electromagnetic force for AF operation and OIS operation.

In an embodiment, the yoke 410 may be used to increase electromagnetic force caused by interaction between the first magnet 130 and the second coil 230, OIS driving force or electromagnetic force for OIS operation may be increased, and increase of power consumption may be prevented.

In addition, in the embodiment, the electromagnetic force for the AF operation may be increased by the metal cover member 300A having the protruding portion 305A serving as the yoke, so that an increase in power consumption may be prevented.

In addition, as shown in fig. 21E and 23A to 23C, due to various types of yokes 420A, 420B, 420C, and 420B1 provided on the first magnet 130, electromagnetic force for AF operation caused by interaction between the first coil 120 and the first magnet 130 can be increased. In addition, since the yokes 420A, 420B, 420C, and 420B1, electromagnetic force for OIS operation caused by interaction between the second coil 120 and the first magnet 130 may be increased.

Fig. 26 is a sectional view of an image pickup apparatus 10-1 according to another embodiment, fig. 27A is a first exploded perspective view of an image sensor unit according to another embodiment shown in fig. 26, fig. 27B is a second exploded perspective view of an image sensor unit according to another embodiment shown in fig. 26, fig. 28 is a perspective view of a holder 270, a second coil 230, a first plate unit 255, an image sensor 810, a support plate 310, and a magnet 24 according to another embodiment shown in fig. 26, fig. 29A is a perspective view of a first coil 120, a magnet 130, a second coil 230, a magnet 24, a yoke 410, a first plate unit 255, and a second plate unit 800 of an image pickup apparatus according to another embodiment shown in fig. 26, and fig. 29B is an enlarged view of a portion of an image pickup apparatus according to another embodiment shown in fig. 26, fig. 29C shows a distance between a magnet 130 and a second coil 230 and a distance between a magnet 24 and a second coil 230 in an image pickup apparatus according to another embodiment shown in fig. 26. In fig. 26 to 29C, the same reference numerals as those in fig. 1 to 25 denote the same components, and the above description may be equally or similarly applied to the same components.

Referring to fig. 26 to 29C, the image pickup apparatus 10-1 may additionally include a magnet 24 as compared to the image pickup apparatus 10 shown in fig. 1. Accordingly, the description given with reference to fig. 1 to 25 may be equally or similarly applied to the embodiment shown in fig. 26.

The fixing unit may include a base 210, the base 210 accommodating the second plate unit 800 and coupled to the cover member 300. The fixing unit may include a yoke 410 provided on the second plate unit 800. In addition, the fixing unit may include a magnet 24 disposed on the base 210.

In an example, the magnet 130 may be represented as one of a first magnet and a second magnet, and the magnet 24 may be represented as the other of the first magnet and the second magnet. Hereinafter, for convenience of description, the magnet 130 will be referred to as "first magnet" and the magnet 24 will be referred to as "second magnet".

The OIS position sensor 240 may face, correspond to, or overlap with the first magnet 130 and the second magnet 24 in the optical axis direction. In an example, at least a portion of the first sensor 240A may overlap at least one of the first magnet unit 130-1 of the first magnet 130 or the first magnet unit 24A of the second magnet 24 in the optical axis direction; and the first sensor 240A may output a first output signal (e.g., a first output voltage) corresponding to a result of the detection of the magnetic fields of the first magnet unit 130-1 and the first magnet unit 24A.

In an example, at least a portion of the second sensor 240B may overlap at least one of the second magnet unit 130-2 of the first magnet 130 or the second magnet unit 24B of the second magnet 24 in the optical axis direction, and the second sensor 240B may output a second output signal (e.g., a second output voltage) corresponding to a result of detection of the magnetic fields of the second magnet unit 130-2 and the second magnet unit 24B.

In addition, in an example, at least a portion of the third sensor 240C may overlap at least one of the third magnet unit 130-3 of the first magnet 130 or the third magnet unit 24C of the second magnet 24 in the optical axis direction, and the third sensor 240C may output a third output signal (e.g., a third output voltage) corresponding to a detection result of the magnetic fields of the third magnet unit 130-3 and the third magnet unit 24C.

The OIS moving unit may move relative to the fixed unit by a first electromagnetic force generated by the first magnet 130 and the second coil 230 and a second electromagnetic force generated by the second magnet 24 and the second coil 230.

The second magnet 24 may be disposed under the second coil 230, and may correspond to, face, or overlap the second coil 230 in the first direction or the optical axis direction.

Referring to fig. 27A, 27B, and 29A to 29C, the first magnet 130 may be disposed on the first board unit 255 (e.g., the first circuit board 250), and the second magnet 24 may be disposed under the first board unit 255 (e.g., the first circuit board 250). The first magnet 130 may have the greatest influence on the electromagnetic force for the AF operation and the electromagnetic force for the OIS operation, and the second magnet 24 may have an additional influence on the electromagnetic force for the OIS operation.

In an example, the second magnet 24 may include magnet units 23A to 24D corresponding to the coil units 230-1 to 230-4 of the second coil 230. Each of the magnet units 23A to 24D may correspond to, face or overlap a corresponding one of the first to fourth coil units 230-1 to 230-4 in the first direction or the optical axis direction.

In an example, the second magnet 24 may be provided on the fixed unit. In an example, the second magnet 24 may be disposed on the second plate unit 800. In an example, the second magnet 24 may be disposed on the first region 801 of the second plate unit 800. In another embodiment, the second magnet 24 may be disposed on the base 210. In an example, in another embodiment, the second magnet 24 may be disposed on the lower plate 21A of the base 210.

In an example, each of the magnet units 24A to 24D of the second magnet 24 may be disposed on at least one of a side portion or a corner of the second plate unit 800 (or the base 210). In an example, at least a portion of the second magnet 24 may be disposed on a side portion or corner of the second plate unit 800 (or the base 210).

In an example, each of the magnet units 24A to 24D of the second magnet 24 may include first portions disposed on corresponding ones of four corners of the first region 801 of the second plate unit 800. In addition, each of the magnet units 24A to 24D may include a second portion disposed on a side portion of the first region 801, which is adjacent to a corresponding corner of the first region 801 of the second plate unit 800.

The second magnet 24 may be a single pole magnetized magnet. In another embodiment, the second magnet 24 may be a bipolar magnetized magnet or a 4-pole magnet including two N poles and two S poles.

In an embodiment, the electromagnetic force for moving the OIS moving unit may include a first electromagnetic force and a second electromagnetic force. The first electromagnetic force may be an electromagnetic force caused by an interaction between the second coil 230 and the first magnet 130 disposed on the second coil 230.

The second electromagnetic force may be an electromagnetic force caused by an interaction between the second coil 230 and the second magnet 24 disposed under the second coil 230. Accordingly, the embodiment may increase or enhance electromagnetic force for moving the OIS moving unit.

In addition, the yoke 410 may serve to enhance the second electromagnetic force caused by the interaction between the second magnet 24 and the second coil 230. In an example, the yoke 410 may be disposed between the second plate unit 800 and the second magnet 24. In an example, the yoke 410 may be disposed on an upper surface of the first region 801 of the second plate unit 800. In another embodiment, the yoke may be disposed under the second plate unit 800. In an example, in another embodiment, a yoke may be disposed on a lower surface of the first region 801.

In an example, the yoke 410 may face or overlap the second magnet 24 in the first direction (or the optical axis direction). In an example, the yoke 410 may have a plate shape, may include a cavity formed therein, and may be formed as a single body. In another embodiment, the yoke 410 may include a plurality of yokes corresponding to the magnet units 24A to 24D of the second magnet 24.

In an example, the yoke 410 may be in contact with a lower surface of the second magnet 24. In an example, the yoke 410 may be used to increase the electromagnetic force between the second coil 230 and the second magnet 24.

Fig. 30A illustrates an embodiment of the first magnet 130, the first coil 120, the second coil 230, the second magnet 24, and the yoke 410 according to the embodiment illustrated in fig. 26. Although one of the magnet units of the first magnet 130, one of the coil units of the second coil 230, and one of the magnet units of the second magnet 24 will be described with reference to fig. 30A, the description given with reference to fig. 30A may be equally or similarly applied to the remaining magnet units of the first magnet 130, the remaining coil units of the second coil 230, and the remaining magnet units of the second magnet 24.

Referring to fig. 30A, in an example, at least a portion of the first magnet 130 may overlap with at least a portion of the second coil 230 in a first direction (or an optical axis direction) at an initial position of the OIS moving unit. In an example, at least a portion of the second magnet 24 may overlap at least a portion of the second coil 230 in the first direction (or the optical axis direction) at the initial position of the OIS moving unit. In an example, at least a portion of the first magnet 130 may overlap with at least a portion of the second magnet 24 in the first direction (or the optical axis direction).

In an example, the second magnet 24 may be a unipolar magnetized magnet including an N-pole and an S-pole. An interface may be formed between the N and S poles of the second magnet 24. The N pole and S pole of the second magnet 24 may face each other in a direction perpendicular to the optical axis.

The first magnet 130 and the second magnet 24 may be disposed such that their opposite polarities face each other in a first direction (or optical axis direction). In an example, the N pole of the second magnet 24 may face the second S pole of the second magnet portion 71B of the first magnet 130 in the first direction (or the optical axis direction), and the S pole of the second magnet 24 may face the second N pole of the second magnet portion 71B of the first magnet 130 in the first direction (or the optical axis direction).

The volume of the first magnet 130 may be greater than the volume of the second magnet 24. This is because the first magnet 130 has a structure that generates electromagnetic force by interaction with the first coil 120 and generates electromagnetic force by interaction with the second coil 230. In addition, in order to maintain linearity of the output of the first position sensor 170 according to the AF operation, the first magnet 130 overlaps the first coil 120 in a stroke section of the first coil 120.

The length L4 of the short side of the second magnet 24 may be smaller than the length L3 of the short side of the second coil 230 when viewed from the first direction or from above. In another embodiment, the length L4 of the short side of the second magnet 24 may be greater than or equal to the length L3 of the short side of the second coil 230.

The length L4 of the short side of the second magnet 24 may be smaller than the length L1 of the short side of the first magnet 130 when viewed from the first direction or from above. In another embodiment, the length L4 of the short side of the second magnet 24 may be greater than or equal to the length L1 of the short side of the first magnet 130.

In an example, the length of the first magnet 130 in the first direction (or the optical axis direction) may be greater than the length M4 of the second magnet 130 in the first direction (or the optical axis direction).

The length M4 of the second magnet 24 in the first direction (or the optical axis direction) may be smaller than M1, M2, and M3. In another embodiment, M4 may be equal to or greater than at least one of M1, M2, or M3. The length M5 of the yoke 410 in the first direction (or the optical axis direction) may be equal to or greater than the length M4 of the second magnet 24 in the first direction (or the optical axis direction). In another embodiment, M5 may be less than M4.

The length M4 of the second magnet 24 in the first direction (or the optical axis direction) may be smaller than the length L4 of the short side of the second magnet 24. When M4 is greater than or equal to L4, the height of the image pickup apparatus 10 in the optical axis direction may increase, and thus the size of the image pickup apparatus may increase. Therefore, the thickness of the optical instrument 200A mounted with the image pickup apparatus 10 may increase.

In another embodiment, the length of the second magnet 24 in the first direction (or the optical axis direction) may be greater than or equal to the length of the short side of the second magnet 24.

The electromagnetic force for OIS operation may be generated by a first electromagnetic force caused by an interaction between the second coil 230 and the first magnet 130 and a second electromagnetic force caused by an interaction between the second coil 230 and the second magnet 24. In this way, in the embodiment, since the electromagnetic force for OIS operation is generated by the two magnets 130 and 24 disposed above and below the second coil 230, the electromagnetic force for OIS operation can be improved.

The separation distance D12 between the second magnet 24 and the second coil 230 in the optical axis direction may be greater than the separation distance D11 between the first magnet 130A and the second coil 230 in the optical axis direction (D12 > D11). As D11 decreases, the electromagnetic force between the first magnet 130 and the second coil 230 may increase, and as D12 decreases, the electromagnetic force between the second magnet 24 and the second coil 230 may increase. However, a space for disposing the second position sensor 240 and the first plate unit 255 needs to be secured between the second magnet 24 and the second coil 230, and thus D12 may be greater than D11.

For example, D12 may be 0.5mm to 1.5 mm. In another embodiment, D12 may be 0.5mm to 1.25 mm. Alternatively, in another embodiment, D12 may be 0.7 mm to 1 mm.

When D12 is less than 0.5mm, a sufficient space for placing the second position sensor 240 and the first plate unit 255 cannot be ensured, and thus spatial interference may occur between the second magnet 24 and each of the first plate unit 255 and the second position sensor 240. On the other hand, when D12 exceeds 1.5mm, the electromagnetic force between the second magnet 24 and the second coil 230 may be low, and thus OIS driving force increasing effect may not be obtained, and the size of the image pickup device module in the optical axis direction may increase.

The value obtained by dividing D12 by D11 (D12/D11) may be 2.5 to 30. Alternatively, for example, the value obtained by dividing D12 by D11 (D12/D11) may be 5 to 15. Alternatively, for example, the value obtained by dividing D12 by D11 (D12/D11) may be 10 to 15.

When the division value (D12/D11) is less than 2.5, D12 is too small to ensure a sufficient space for placing the second position sensor 240 and the first plate unit 255. In addition, when the division value (D12/D11) exceeds 30, D12 is too large, so that the electromagnetic force caused by the interaction with the second coil 230 is low, and thus the OIS driving force increasing effect may not be obtained, and the size of the image pickup device module in the optical axis direction may increase.

In addition, when the division value (D12/D11) is 10 to 15, a sufficient space for placing the second position sensor 240 and the first board unit 255 can be ensured, and OIS driving force can be increased.

In addition, in an example, a separation distance D13 between the first magnet 130 and the yoke 410 in the optical axis direction may be greater than D12 (D13 > D12). In addition, in an example, a separation distance D14 between the second coil 230 and the yoke 410 in the optical axis direction may be greater than D12 (D14 > D12).

The descriptions of D11, D12, D13, D14 and the divisor value (D12/D11) may be equally or similarly applied to fig. 30B to 30F, fig. 31A to 31C, and fig. 32A to 32C, which will be described later. In addition, the description of the division value (D12/D11) given with reference to fig. 30A can be applied equally or similarly to fig. 33.

Fig. 30B shows another embodiment 130A of the first magnet 130 according to the embodiment shown in fig. 26. In fig. 30B, the same reference numerals as those in fig. 30A denote the same components, and a description of the same components will be omitted.

Referring to fig. 30B, the first magnet 130A shown in fig. 30B may be formed such that the partition wall 71C of the first magnet 130 shown in fig. 30A is removed, and the first magnet portion 71A and the second magnet portion 71B are spaced apart from each other. In an example, a portion of the housing 140 may be interposed, disposed, or interposed between the first magnet portion 71A and the second magnet portion 71B. That is, the first magnet portion 71A and the second magnet portion 71B may be separated from each other by a portion of the case 140. In this case, a neutral region may be formed between the first magnet portion 71A and the second magnet portion 71B. In another embodiment, a neutral region may not be formed between the first magnet portion 71A and the second magnet portion 71B.

Fig. 30C shows yet another embodiment 130B of the first magnet 130 according to the embodiment shown in fig. 26.

Referring to fig. 30C, the first magnet 130B shown in fig. 30C may be formed such that the partition wall 71C of the first magnet 130 shown in fig. 30A is removed and the first magnet portion 71A and the second magnet portion 71B are in contact with each other.

Fig. 30D shows yet another embodiment 130C of the first magnet 130 according to the embodiment shown in fig. 26.

Referring to fig. 30D, the first magnet 130 may be a unipolar magnetized magnet including one N pole and one S pole.

In an example, the length M7 of the first magnet 130 in the first direction (or the optical axis direction) may be a sum of M1 and M2 in fig. 30A. Alternatively, in an example, M7 may be the sum of M1, M2, and d1 in fig. 30A.

Fig. 30E is a modified example of fig. 30B.

Referring to fig. 30E, a yoke 420A may be disposed between the first magnet portion 71A and the second magnet portion 71B. The yoke 420A may correspond to, face, or overlap each of the first and second magnet portions 71A and 71B in the first direction (or the optical axis direction).

Fig. 30F is another modified example of fig. 30A.

Referring to fig. 30F, the second magnet 24-1 may include: a first magnet portion 73A and a second magnet portion 73B, the first magnet portion 73A including a first N pole and a first S pole, and the second magnet portion 73B including a second N pole and a second S pole. In addition, a partition wall 73C may be formed between the first magnet portion 73A and the second magnet portion 73B. In an example, the first magnet portion 73A and the second magnet portion 73B may be spaced apart from each other in the first direction (or the optical axis direction). The first magnet 130 and the second magnet 24 may be disposed such that their opposite polarities face each other in a first direction (or optical axis direction). The description of the bipolar magnetization of the first magnet 130 given with reference to fig. 30A may be equally or similarly applied to the second magnet 24-1 shown in fig. 30F.

Since the second magnet 24-1 is implemented as a bipolar magnetized magnet, the embodiment may enhance electromagnetic force caused by interaction between the second coil 230 and the second magnet 24-1, thereby enhancing electromagnetic force for OIS operation.

Fig. 31A shows yet another embodiment 130D of the first magnet 130 shown in fig. 26. The embodiment shown in fig. 31A is a modified example of the first magnet shown in fig. 30B. In another embodiment, the first magnet 130D shown in fig. 31A may be equally or similarly applied to fig. 30A and 30C to 21F.

Referring to fig. 31A, the length L11 of the short side of the first magnet portion 71A1 may be greater than the length L2 of the short side of the second magnet portion 71B1 (L11 > L2). The reason for this is: the AF electromagnetic force caused by the interaction with the first coil 120 is increased by increasing the size of the first magnet portion 71 A1. In another embodiment, in order to increase OIS electromagnetic force, the length of the short side of the second magnet portion may be greater than the length of the short side of the first magnet portion.

Fig. 30A to 31A may be sectional views taken in a direction parallel to a short side of the first magnet 130.

Fig. 31B illustrates an embodiment of the length of the long side of each of the first magnet 130, the first coil 120, the second coil 230, the second magnet 24, and the yoke 410 according to the embodiment illustrated in fig. 26.

Referring to fig. 31B, the length K1 of the long side of the first magnet portion 71A and the length K2 of the long side of the second magnet portion 71B of the first magnet 130 may be different from each other when viewed from the first direction or from above. In an example, the length K1 of the long side of the first magnet portion 71A of the first magnet 130 may be greater than the length K2 of the long side of the second magnet portion 71B. When K1 is greater than K2, electromagnetic force caused by interaction between the first coil 120 and the first magnet portion 71A may be increased, and thus, AF driving force may be increased.

The length K4 of the long side of the second magnet 24 may be different from the length K3 of the long side of the second coil 230 when viewed from the first direction or from above. In an example, the length K4 of the long side of the second magnet 24 may be greater than the length K3 of the long side of the second coil 230 when viewed from the first direction or from above. In another embodiment, the length of the long side of the second magnet 24 may be equal to or less than the length of the long side of the second coil 230.

In an example, one end of the second magnet 24 may be located inside the second coil 230, and the other end of the second magnet 24 may be located outside the second coil 230. In an example, the second magnet 24 may include a first portion overlapping the second coil 230 in a first direction or an optical axis direction. In addition, the second magnet 24 may include a second portion that does not overlap the second coil 230 in the first direction or the optical axis direction.

In an example, the length K5 of the yoke 410 in the longitudinal direction of the long side of the second magnet 24 may be greater than the length K4 of the long side of the second magnet 24 when viewed from the first direction or from above. In another embodiment, K5 may be equal to or less than K4.

Fig. 31C shows another embodiment of the length of the long side of each of the second magnet portion 71B and the second magnet 24 shown in fig. 31B.

Referring to fig. 31C, the length K21 of the long side of the second magnet portion 71B may be smaller than the length K3 of the long side of the second coil 230. In an example, one end and the other end of the second magnet portion 71B may be located inside the second coil 230 when viewed from the first direction or from above.

In addition, the length K4-1 of the long side of the second magnet 24 may be smaller than the length K3 of the long side of the second coil 230. In an example, one end and the other end of the second magnet 24 may be located inside the second coil 230 when viewed from the first direction or from above.

Fig. 31A and 31B may be sectional views taken in a direction parallel to the long side of the first magnet 130. The description given with reference to fig. 31B and 31C may be equally or similarly applied to fig. 30A to 30F and 31A.

The image pickup apparatus 10 may further include a separate yoke to enhance or increase the electromagnetic force for the AF operation and the electromagnetic force for the OIS operation.

Fig. 32A shows another embodiment of fig. 30E.

Referring to fig. 32A, the image pickup apparatus 10 may include a yoke 420B provided on at least one of side surfaces of the second magnet portion 71B.

The yoke 420B may be in contact with the yoke 420A described with reference to fig. 30E. In another embodiment, the yoke 420B may be spaced apart from the yoke 420A described with reference to fig. 30E.

In an example, the yoke 420B may be disposed on a long side surface of the second magnet portion 71B. In an example, the yoke 420B may be disposed on a second long side surface of the first long side surface and the second long side surface. In this case, the first long side surface may be closer to the first coil 120 than the second long side surface, and the first long side surface and the second long side surface may be positioned opposite to each other. At least one of the electromagnetic force caused by the interaction between the first magnet 130 and the first coil or the electromagnetic force caused by the interaction between the first magnet 130 and the second coil 230 may be increased or raised by the yoke 420B.

The yoke 420B shown in fig. 32A may be equally or similarly applied to the embodiments shown in fig. 30A to 30D and fig. 31A to 31C.

Fig. 32B shows another embodiment of fig. 30C.

Referring to fig. 32B, the image pickup apparatus 10 may include a yoke 420C disposed on an upper surface of the first magnet portion 71A.

In an example, the yoke 420C may be disposed on upper surfaces of the N and S poles of the first magnet portion 71A. In an example, the yoke 420C may be in contact with an upper surface of the first magnet portion 71A. At least one of the electromagnetic force caused by the interaction between the first magnet 130 and the first coil or the electromagnetic force caused by the interaction between the first magnet 130 and the second coil 230 may be increased or raised by the yoke 420C.

Fig. 32C shows another embodiment of fig. 32B.

Referring to fig. 32C, the image pickup apparatus 10 may include a yoke 42B1 provided on a side surface of at least one of the first magnet portion 71A or the second magnet portion 71B.

The yoke 420B1 may be in contact with the yoke 420A described with reference to fig. 32B. In another embodiment, the yoke 420B1 may be spaced apart from the yoke 420A described with reference to fig. 32B.

The yokes 420C and 420B1 shown in fig. 32B and 32C may be equally or similarly applied to the embodiments shown in fig. 30A to 30F, 31A to 31C and 32A.

Fig. 33 shows the placement of a third magnet 72 according to another embodiment of fig. 26.

Referring to fig. 33, the image pickup apparatus 10-1 may further include a third magnet 72 disposed between the first magnet 130 and the second coil 230 to enhance OIS driving force.

The third magnet 72 may be provided on the fixed unit. In an example, the third magnet 72 may be disposed in the case 140 and may be disposed under the first magnet 130. In an example, the third magnet 72 may be spaced apart from the first magnet. In another embodiment, the third magnet 72 may be in contact with the first magnet 130. In an example, an upper surface of the third magnet 72 may be in contact with a lower surface of the first magnet 130.

In an example, the length L7 of the short side of the third magnet 72 may be equal to the length L4 of the short side of the second magnet 24. In addition, the length M8 of the third magnet 72 in the first direction (or the optical axis direction) may be equal to the length of the second magnet 24 in the first direction (or the optical axis direction). The description of the length of the short side of the second magnet 24 and the length of the second magnet 24 in the first direction may be equally or similarly applied to the third magnet 72. In another embodiment, L7 is greater or less than L4.

The length of the long side of the third magnet 72 may be equal to the length of the long side of the second magnet 24 when viewed from the first direction or from above, and the description of the length K4 of the long side of the second magnet 24 shown in fig. 31B and 31C may be equally or similarly applied to the third magnet 72.

The third magnet 72 shown in fig. 33 may be equally or similarly applied to fig. 30A to 32C. In addition, in another embodiment, the second magnet 24 may be omitted from fig. 33.

In fig. 33, the OIS driving force for moving the OIS moving unit may include electromagnetic force caused by the interaction between the second coil 230 and each of the first magnet 130, the second magnet 24, and the third magnet 72. Accordingly, the embodiment shown in fig. 33 may enhance electromagnetic force for OIS operation.

In an embodiment, the electromagnetic force caused by the interaction with the second coil 230 may be increased using the first magnet 130 and the second magnet 24, so that OIS driving force or electromagnetic force for OIS operation may be increased and an increase in power consumption may be prevented.

In addition, in the embodiment, electromagnetic force caused by the interaction between the second coil 230 and the second magnet 240 and/or electromagnetic force caused by the interaction between the second coil 230 and the first magnet 130 may be increased using the yoke 410, and accordingly, an increase in power consumption may be prevented.

In addition, as shown in fig. 30E and 32A to 32C, due to various types of yokes 420A, 420B, 420C, and 420B1 provided on the first magnet 130, electromagnetic force for AF operation caused by interaction between the first coil 120 and the first magnet 130 can be increased. In addition, since the yokes 420A, 420B, 420C, and 420B1, electromagnetic force for OIS operation caused by interaction between the second coil 120 and the first magnet 130 may be increased.

In addition, the image pickup apparatus according to the embodiment may be included in an optical instrument for the purpose of forming an image of an object existing in a space using reflection, refraction, absorption, interference, and diffraction as characteristics of light, for the purpose of increasing visibility, for the purpose of recording and reproducing an image using a lens, or for the purpose of optical measurement or image propagation or transmission. For example, the optical instrument according to the embodiment may be a cellular phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a Personal Digital Assistant (PDA), a Portable Multimedia Player (PMP), a navigation device, or the like, but is not limited thereto and may be any device for capturing an image or a photo.

Fig. 34 is a perspective view of the optical instrument 200A according to the embodiment, and fig. 35 is a configuration diagram of the optical instrument 200A shown in fig. 34.

Referring to fig. 34 and 35, the optical instrument 200A may include a body 850, a wireless communication unit 710, an a/V input unit 720, a sensing unit 740, an input/output unit 750, a memory 760, an interface unit 770, a controller 780, and a power supply unit 790.

The body 850 shown in fig. 34 may have a bar shape, but is not limited thereto, and may be any of various types such as a sliding type, a folding type, a swing type, or a swing type, in which two or more sub-bodies are coupled to be movable with respect to each other.

The body 850 may include a shell (housing, shell, cover, etc.) defining an appearance thereof. In an example, the body 850 may be divided into a front case 851 and a rear case 852. Various electronic components of the terminal may be mounted in a space defined between the front case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules capable of wireless communication between the optical instrument 200A and a wireless communication system or between the optical instrument 200A and a network in which the optical instrument 200A is located. In an example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a near field communication module 714, and a location information module 715.

An audio/video (a/V) input unit 720 is used to input an audio signal or a video signal, and may include a camera 721 and a microphone 722.

The image pickup device 721 may include an image pickup device apparatus according to an embodiment.

The sensing unit 740 may sense a current state of the optical instrument 200A, such as an on or off state of the optical instrument 200A, a position of the optical instrument 200A, the presence or absence of a user touch, an orientation of the optical instrument 200A, or acceleration/deceleration of the optical instrument 200A, and the sensing unit 740 may generate a sensing signal to control an operation of the optical instrument 200A. For example, when the optical instrument 200A is a slide type phone, it is possible to detect whether the slide type phone is open or closed. In addition, the sensor is used to sense whether power is supplied from the power supply unit 790 or whether the interface unit 770 is coupled to an external device.

The input/output unit 750 is used to generate visual, auditory, or tactile inputs or outputs. The input/output unit 750 may generate input data to control the operation of the optical instrument 200A, and may display information processed in the optical instrument 200A.

The input/output unit 750 may include a keyboard unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 730 may generate input data in response to input to a keyboard.

The display module 751 may include a plurality of pixels whose colors change in response to an electrical signal. In an example, the display module 751 may include at least one of a liquid crystal display, a thin film transistor liquid crystal display, an organic light emitting diode, a flexible display, or a 3D display.

The sound output module 752 may output audio data received from the wireless communication unit 710 in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or may output audio data stored in the memory 760.

The touch screen panel 753 may convert a change in capacitance caused by a user's touch to a specific area of the touch screen into an electrical input signal.

The memory 760 may store a program for processing and control of the controller 780, and may temporarily store input/output data (e.g., a phonebook, a message, audio, still images, pictures, and moving images). For example, the memory 760 may store images, such as pictures or moving images, captured by the image pickup device 721.

The interface unit 770 serves as a connection channel between the optical instrument 200A and an external device. The interface unit 770 may receive data or power from an external device and may transmit the data or power to a corresponding part inside the optical instrument 200A or may transmit data inside the optical instrument 200A to an external device. For example, the interface unit 770 may include a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port for connection of a device having an identification module, an audio input/output (I/O) port, a video input/output (I/O) port, and an earphone port.

The controller 780 may control the overall operation of the optical instrument 200A. For example, the controller 780 may perform control and processing related to voice calls, data communications, and video calls.

The controller 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be provided inside the controller 180 or may be provided separately from the controller 780.

The controller 780 may perform a pattern recognition process by which a written or drawn input of the touch screen is perceived as a character or image.

The power supply unit 790 may supply power required to operate the corresponding components upon receiving external power or internal power under the control of the controller 780.

The features, structures, effects, etc. described above in the embodiments are included in at least one embodiment of the present disclosure, and are not necessarily limited to only one embodiment.

Furthermore, the features, structures, effects, etc. illustrated in the respective embodiments may be combined with other embodiments or may be modified by those skilled in the art. Accordingly, matters related to such combinations and modifications are to be interpreted as falling within the scope of the present disclosure.

[ INDUSTRIAL APPLICABILITY ]

Embodiments may be used for an image pickup apparatus capable of improving electromagnetic force for AF operation and electromagnetic force for OIS operation, and an optical instrument including the image pickup apparatus.

Claims

1. An image pickup apparatus comprising:

a fixing unit;

a first magnet provided at the fixing unit;

a first moving unit including a first coil configured to move in an optical axis direction by an interaction between the first magnet and the first coil;

a second moving unit including a first plate unit provided to be spaced apart from the fixed unit, a second coil facing the first magnet in the optical axis direction, and an image sensor provided on the first plate unit; and

a first yoke provided at the fixing unit to be opposed to the first magnet in the optical axis direction,

wherein the second moving unit moves in a direction perpendicular to the optical axis direction by interaction between the first magnet and the second coil.

2. The image pickup apparatus according to claim 1, wherein the first magnet is disposed on the second coil, and the first yoke is disposed below the second coil.

3. The image pickup apparatus according to claim 1, wherein the first magnet includes:

a first magnet portion including a first N pole and a first S pole; and

and a second magnet portion including a second N pole and a second S pole, the second magnet portion being disposed below the first magnet portion.

4. The image pickup apparatus according to claim 3, comprising: a partition wall provided between the first magnet portion and the second magnet portion,

wherein the partition wall is a neutral zone.

5. The image pickup apparatus according to claim 3, wherein the first magnet portion and the second magnet portion are spaced apart from each other.

6. The image pickup apparatus according to claim 3, wherein the first N pole is in contact with the second S pole, and the first S pole is in contact with the second N pole.

7. The image pickup apparatus according to claim 3, comprising: and a second yoke disposed between the first magnet portion and the second magnet portion.

8. The image pickup apparatus according to claim 1, comprising: and a third yoke disposed on a side surface of the first magnet.

9. The image pickup apparatus according to claim 1, comprising: and a fourth yoke disposed on an upper surface of the second magnet.

10. The image pickup apparatus according to claim 1, wherein the first yoke is a magnetic body.