CN117650354A - Antenna module - Google Patents

Abstract

The embodiment of the application provides an antenna module. The antenna module comprises a dielectric substrate, a radio frequency integrated circuit and a first number of first antennas. The radio frequency integrated circuit is arranged on the dielectric substrate, wherein the radio frequency integrated circuit comprises a single first antenna port group and a plurality of second antenna port groups so as to receive or transmit a plurality of signals. A first number of first antennas is arranged in a first row on a dielectric substrate, wherein at least two of the first antennas are connected to a first antenna port group of the radio frequency integrated circuit.

Description

Antenna module

Technical Field

The present disclosure relates to an antenna module, and more particularly, to an antenna array of an antenna module.

Background

Antennas are an important component of all modern electronic devices requiring radio frequency functionality, such as smartphones, tablets and notebooks. As communication standards continue to evolve to provide faster data transmission rates and higher productivity, the requirements for antennas become more challenging. For example, in order to meet the requirements of the fifth generation (5G) mobile communication with dual-polarized diversity (dual-polarization diversity) and multiple-input multiple-output (MIMO) in the FR2 (frequency range type-ii) band, the antenna needs to provide a wider bandwidth. There is also a need to be able to send and receive independent signals of different polarizations (e.g. two signals carrying two different data streams by horizontal and vertical polarization) and with a high signal isolation between these different polarizations, providing a high cross polarization discrimination (XPD).

Furthermore, because modern electronic devices need to be slim, lightweight, and portable, and because of the limited space in which these devices can accommodate antennas, antennas need to be compact in size. Thus, antennas require a high bandwidth to volume ratio (expressed in terms of bandwidth per unit volume (e.g., measured in Hz/(mm 3)) and an enhanced effective Equivalent Isotropic Radiated Power (EIRP). In order to improve communication for high-end smart phone applications, antenna modules with enhanced performance and small size are needed.

Disclosure of Invention

In view of the above, the present application provides a semiconductor package assembly to solve the above-mentioned problems.

The embodiment of the application provides an antenna module. The antenna module comprises a dielectric substrate, a radio frequency integrated circuit and a first number of first antennas. The radio frequency integrated circuit is arranged on the dielectric substrate, wherein the radio frequency integrated circuit comprises a first antenna port group and a plurality of second antenna port groups so as to receive or transmit a plurality of signals. A first number of first antennas are arranged in a first column on the dielectric substrate, wherein all of the first antennas are connected to a first antenna port group of the radio frequency integrated circuit.

The embodiment of the application provides an antenna module. The antenna module comprises a dielectric substrate, a radio frequency integrated circuit and a plurality of antennas. The radio frequency integrated circuit is disposed on the dielectric substrate. The radio frequency integrated circuit includes a single first antenna port group and a plurality of second antenna port groups to receive or transmit a plurality of signals. The antennas are arranged in a row on the dielectric substrate and opposite the radio frequency integrated circuit. The first portions of the plurality of antennas are each connected to a first antenna port group of the radio frequency integrated circuit by a single first conductor group. The second portions of the plurality of antennas are respectively connected to different second antenna port groups of the radio frequency integrated circuit by second conductor sets.

In addition, the embodiment of the application provides an antenna module. The antenna module comprises a dielectric substrate, a radio frequency integrated circuit, a first antenna array and a second antenna array. The dielectric substrate includes a first planar portion, a second planar portion, and a curved portion. The first planar portion and the second planar portion face in different directions. The curved portion is connected between the first planar portion and the second planar portion. The radio frequency integrated circuit is arranged on the dielectric substrate, wherein the radio frequency integrated circuit comprises a single first antenna port group and a plurality of second antenna port groups for receiving or transmitting a plurality of signals. The first antenna array includes a plurality of first antennas arranged in a first row on a first plane portion and connected to a first antenna port group and a second antenna port group. The first antenna array comprises a sub-array consisting of at least two first antennas connected to a first antenna port group of the radio frequency integrated circuit. The second antenna array includes a plurality of second antennas arranged in a second row at a second plane portion. In the antenna module of the embodiment of the application, the antennas of the same subarray are all connected to the same antenna port group of the radio frequency integrated circuit. Thus, even if the radio frequency integrated circuit has a limited number of antenna port groups, the antenna module may be composed of a 1×5 antenna array and a 1×n antenna array, where n is an integer equal to or greater than 5. The equivalent omni-directional radiation power and gain of the antenna module including the sub-array can be improved.

Drawings

The present application will be more fully understood from a reading of the following detailed description and examples, which are given with reference to the accompanying drawings in which:

fig. 1 is a perspective view of an antenna module of some embodiments of the present application;

fig. 2A is a side view of the antenna module of fig. 1, showing a configuration of an antenna array and a Radio Frequency Integrated Circuit (RFIC), according to some embodiments of the application;

FIG. 2B is a top view of the antenna module of FIG. 1 according to some embodiments of the present application, showing connections between an antenna array disposed on a planar portion of a dielectric substrate and corresponding antenna port groups of a radio frequency integrated circuit;

fig. 2C is a top view of the antenna module of fig. 1 according to some embodiments of the present application, showing connections between an antenna array disposed on another planar portion of a dielectric substrate and a corresponding antenna port group of a radio frequency integrated circuit;

fig. 3-13 are top views of a portion of an antenna module according to some embodiments of the present application, showing the configuration of an antenna array disposed on another planar portion of a dielectric substrate and its connection to a corresponding antenna port set of a radio frequency integrated circuit.

[ description of the symbols ]

100,110, 120. Directions

200 dielectric substrate

202,206 planar portions

202B,206B bottom surface

202T,206T top surface

204 bending portion

216P1,216P2,216P3 protruding part

220,230 antenna array

220-1,220-2,220-3,220-4,220-5,230-1,230-2,230-3,230-4,230-5,230A-1,230A-2,230A-3,230A-4,230A-5,230B-1,230B-2,230B-3,230B-4,230B-5,230B-6,230C-1,230C-2,230C-3,230C-4,230C-5230D-1,230D-2,230D-3,230D-4,230D-5,230E-1,230E-2,230E-3,230E-4,230E-5,230F-1,230F-2,230F-3,230F-4,230F-5,230H-1,230H-2,230H-3,230H-4,230H-5,230I-1,230I-2,230I-3,230I-4,230I-5,230J-1,230J-2,230J-3,230J-4,230J-5,230K-1,230K-2,230K-2,230K-2,230K-5, antenna

230S1,230S2,230SA1,230SA2,230SB1,230SB2,230SB3,230SC1,230SC2,230SD1,230SD2,230SE1,230SE2,230SF1,230SF2,230SG1,230SG2,230SH1,230SH2,230SI1,230SI2,230SJ1,230SJ2,230SK1,230SK2 subarrays

230E-1S,206S1,206S2,230E-2S,230E-4S,230E-5S,206S2,230H-1S,230H-2S,230H-3S,230H-4S,230H-5S: edge

240-1,240-2,240-3,240-4 conductive dummy element

250 radio frequency integrated circuit

250P1,250P2,250P3,250P4,250P5,250P6,250P7,250P8 antenna port group

252 power management integrated circuit

260,260-1,260-2,260-3,260-4,260-5,260-6,260-7,260-8 conductor set

270,270-1,270-2,270A-1,270A-2,270B-1,270B-2,270B-3,270C-1,270C-2,270D-1,270D-2,270E-1,270E-2,270F-1,270F-2,270G-1,270G-2,270H-1,270H-2,270I-1,270I-2,270J-1,270J-2,270K-1,270K-2 connector assembly

500,500A,500B,500C,500D,500E,500F,500G,500H,500I,500J,500K, antenna module

D1, D3, PL1, PL2, PL3: length

D2, d4 size

S1, S2, S3, S4 interval

Detailed Description

The following description is made for the purpose of illustrating the general principles of the present application and should not be taken in a limiting sense. The scope of embodiments of the present application is limited only by the appended claims.

In the following detailed description of the embodiments of the present application, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific preferred embodiments in which the application may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice them. It should be noted, however, that the present application concept may be implemented in various forms and is not limited to the following exemplary embodiments. Accordingly, the exemplary embodiments are provided only for the purpose of disclosing the present application concept and making a person having ordinary skill in the art aware of the category of the present application concept. Moreover, the drawings described are only schematic and are non-limiting. In the drawings, the size of some of the elements may be exaggerated and not drawn on scale for illustrative purposes. The dimensions and relative dimensions do not correspond to actual dimensions in the embodiments of the application.

Conventional L-shaped antenna modules are typically composed of two one-dimensional antenna arrays (i.e., 1×m arrays, where m is an integer equal to or greater than 2) arranged on two planar portions to enhance equivalent omni-directional radiated power (EIRP). However, due to the limited number of antenna ports of a Radio Frequency Integrated Circuit (RFIC) (e.g. a total of 32 antenna ports). For example, a one-dimensional antenna array may be combined from a 1×3 array and a 1×5 array antenna array, or from two 1×4 array antenna arrays. In the combination of the 1×3 array and the 1×5 array, although the 1×5 antenna array may have improved equivalent omni-directional radiation power due to an increase in the number of antennas and one more Power Amplifier (PA) designated for the 1×5 antenna array in a Radio Frequency Integrated Circuit (RFIC), the 1×3 antenna array may decrease the gain of the antenna array due to a smaller number of antennas. In order to increase both the equivalent omni-directional radiated power and the gain, there is a need for an antenna module with a novel antenna array arrangement.

Fig. 1 is a perspective view of an antenna module 500 (including antenna modules 500A, 500B, 500C, 500D, 500E, 500F, 500G, 500H, 500I, 500J, and 500K shown in the following figures) for multi-broadband (e.g., dual-broadband) and multi-polarized (e.g., dual-polarized) communications according to some embodiments of the present application. Fig. 2A is a side view of the antenna module 500 of fig. 1 along direction 100, showing the configuration of the antenna arrays 220, 230 and the Radio Frequency Integrated Circuit (RFIC) 250, according to some embodiments of the application. Fig. 2B is a side view of the antenna module 500 of fig. 1 along the direction 120, showing electrical connections between the antenna array 220 disposed on the planar portion 202 of the dielectric substrate 200 and the respective antenna port groups 250P1, 250P2, 250P3, 250P4, and 250P5 of the radio frequency integrated circuit 250, according to some embodiments of the present application. Fig. 2C is a side view of the antenna module 500 of fig. 1 along the direction 110, showing the connection between the antenna array 230 disposed on the planar portion 206 of the dielectric substrate 200 and the corresponding antenna port groups 250P6, 250P7, and 250P8 of the radio frequency integrated circuit 250, according to some embodiments of the present application. For purposes of illustration of the reference directions indicated in the figures, the direction 100 is defined as the column direction (row direction) of the antenna arrays 220, 230. The direction 110 is defined as a normal direction (normal direction) of the planar portion 206 of the dielectric substrate 200. In addition, the direction 120 is defined as a normal direction of the planar portion 202 of the dielectric substrate 200. Direction 100 is substantially perpendicular to directions 110 and 120. Direction 110 is substantially perpendicular to directions 100 and 120. Direction 120 is substantially perpendicular to directions 100 and 110. In addition, to illustrate the relationship of the electrical connections between the antenna arrays 220, 230 and the corresponding antenna port sets of the radio frequency integrated circuit 250, portions of the dielectric substrate 200 (drawn in phantom) may be hidden in the side views of fig. 2B and 2C to expose portions of the radio frequency integrated circuit 250 and the conductor sets (drawn in solid lines).

As shown in fig. 1, the antenna module 500 includes a dielectric substrate 200, antenna arrays 220, 230, and a radio frequency integrated circuit 250. In a side view (fig. 2A), the dielectric substrate 200 may have an L-shape. In some embodiments, the dielectric substrate 200 includes planar portions 202, 206 and a curved portion 204. The planar portion 202 may face in the direction 120. The planar portion 206 may face the direction 110. In other words, the normal direction of planar portions 202 and 206 may be parallel to direction 120 and direction 110, respectively. In addition, the planar portions 202 and 206 may be substantially rectangular and extend along the direction 100 such that the antenna arrays 220, 230 are disposed on the top surfaces 202T, 206T of the planar portions 202, 206. Further, the curved portion 204 is connected between the planar portion 202 and the planar surface 206. The dielectric substrate 200 may have a single-layer structure or a multi-layer structure. In some embodiments, the material of the dielectric substrate 200 includes an organic material or an inorganic material, such as FR4 material, FR5 material, bismaleimide-triazene (BT) resin material, glass, ceramic, molding material, liquid crystal polymer, glass cloth substrate, epoxy, ferrite, silicon, other suitable material, or a combination thereof.

In some embodiments, the dielectric substrate 200 includes a set of conductive lines 260, the set of conductive lines 260 being comprised of conductive layers and vias (not shown) formed in the dielectric substrate 200 and being used for electrical connection between the antenna arrays 220, 230 and corresponding sets of antenna ports 250P 1-250P 8 of the radio frequency integrated circuit 250.

The antenna array 220 is disposed on the top surface 202T of the planar portion 202. In some embodiments, antenna array 220 is a one-dimensional array (i.e., a 1×m array, where m is an integer equal to or greater than 2) that includes a first number of separate antennas, such as five antennas 220-1, 220-2, 220-3, 220-4, and 220-5, periodically aligned along direction 100 (column direction). The antenna array 220 may cover a portion of the top surface 202T of the planar portion 202. In addition, the antenna 220 may be spaced apart from an edge (not shown) of the top surface 202T of the planar portion 202. In some embodiments, antennas 220-1, 220-2, 220-3, 220-4, and 220-5 include various antenna types, such as patch antennas (patch antenna), dipole antennas (dipole antenna), monopole antennas (monopole antenna), loop antennas (loop antenna), slot antennas (slot antenna), dielectric resonator antennas (dielectric resonator antenna, DRA), or combinations thereof. It should be noted that the types of antennas 220-1, 220-2, 220-3, 220-4, and 220-5 are not limited to embodiments of the present application. In some embodiments, antennas 220-1, 220-2, 220-3, 220-4, and 220-5 radiate signals only in direction 120.

The antenna array 230 is disposed on the top surface 206T of the planar portion 206. In some embodiments, antenna array 230 is a one-dimensional array (i.e., a 1 n array, where n is an integer equal to or greater than 1) that includes a second number of separate antennas, such as five antennas 230-1, 230-2, 230-3, 230-4, and 230-5, periodically aligned along direction 100 (row direction). In some embodiments, the first number is the same as or different from the second number. The antenna array 230 may cover a portion of the top surface 206T of the planar portion 206 of the antenna array. In addition, the antenna 230 may be spaced apart from an edge (not shown) of the top surface 206T of the planar portion 206. In some embodiments, antennas 230-1, 230-2, 230-3, 230-4, and 230-5 include various antenna types, such as patch antennas, dipole antennas, monopole antennas, loop antennas, slot antennas, dielectric resonator antennas, or combinations thereof. It should be noted that the types of antennas 230-1, 230-2, 230-3, 230-4, and 230-5 are not limited to embodiments of the present application. In some embodiments, antennas 230-1, 230-2, 230-3, 230-4, and 230-5 radiate signals only in direction 110 or in the opposite direction of direction 110.

In some embodiments, the antenna module 500 includes a ground layer (not shown) disposed in the dielectric substrate 200 and below the antenna arrays 220 and 230. A ground layer may be formed between dielectric layers (not shown) of dielectric substrate 200 and spaced apart from antenna arrays 220 and 230. In addition, a ground layer may be formed inside the dielectric substrate 200 and not exposed from the surface of the dielectric substrate 200. In some embodiments, the ground layer may be exposed from the surface of the dielectric substrate 200. In some embodiments, a ground layer may be disposed on the bottom surface 202B of the planar portion 202 (or the bottom surface 206B of the planar portion 206 of the dielectric substrate 200). In some embodiments, the ground plane may be isolated from the antenna arrays 220 and 230. In some embodiments, the ground plane 210 may connect the antenna array 220 and/or the antenna array 230, depending on the antenna type or antenna design requirements. For example, antenna array 230 is a planar inverted-F (PIFA) antenna.

As shown in fig. 1, a Radio Frequency Integrated Circuit (RFIC) 250 is disposed on a dielectric substrate 200. In addition, the radio frequency integrated circuit 250 is disposed on the bottom surface 202B of the planar portion 202 (or the bottom surface 206B of the planar portion 206) opposite the antenna array 220 (or the antenna array 230). In addition, a ground plane (not shown) may be interposed between antenna array 220 (or antenna array 230) and radio frequency integrated circuit 250.

In some embodiments, the radio frequency integrated circuit 250 may be packaged as a die that includes Radio Frequency (RF) circuitry (not shown) and a plurality of antenna ports (e.g., 32 antenna ports) connected to the respective RF circuitry. The antenna ports of the radio frequency integrated circuit 250 may be configured as a third number of antenna port groups. The antenna ports of each antenna port group may be configured to receive or transmit different bandwidth/polarization signals from or to the respective antenna. For example, the 32 antenna ports of the radio frequency integrated circuit 250 may be configured into eight antenna port groups 250P1, 250P2, 250P3, 250P4, 250P5, 250P6, 250P7, and 250P8 to correspond to eight antennas. Each of the antenna port groups 250P1, 250P2, 250P3, 250P4, 250P5, 250P6, 250P7, and 250P8 may have four ports corresponding to one designated antenna. In some embodiments, the third number is limited by the design. For example, the third number may be less than the sum of the first number and the second number. Antenna port groups 250P1 through 250P8 may be disposed along an edge of rf integrated circuit 250. The antenna port sets 250P 1-250P 8 may be connected and electrically coupled to the rf integrated circuit 250. Antenna arrays 220 and 230 are formed of conductor sets 260 (including conductor sets 260-1, 260-2, 260-3, 260-4, 260-5, 260-6, 260-7, and 260-8) to receive signals from antenna arrays 220 and 230 or to transmit signals to antenna arrays 220 and 230. Each wire set 260 may include a plurality of wires connected to respective antenna ports of the same antenna port set. The radio frequency circuitry of the radio frequency integrated circuit 250 may be comprised of transformers, mixers, power amplifiers, attenuators, phase shifters and switches to receive signals from the respective antenna port groups 250P1 through 250P8 or to transmit signals to the respective antenna port groups 250P1 through 250P 8. The connections between the antenna port groups 250P1 to 250P8 of the radio frequency integrated circuit 250 and the respective antennas of the antenna arrays 220 and 230 will be described in more detail with reference to the accompanying drawings.

As shown in fig. 1, the antenna module 500 further includes a Power Management Integrated Circuit (PMIC) 252 disposed on the dielectric substrate 200 and beside the rf integrated circuit 250. In addition, the power management integrated circuit 252 is disposed on the bottom surface 202B of the planar portion 202 (or the bottom surface 206B of the planar portion 206) and is opposite to the antenna array 220 (or the antenna array 230). In some embodiments, the power management integrated circuit 252 may be packaged as a die.

In some embodiments, all of the antennas 220-1, 220-2, 220-3, 220-4, and 220-5 of the antenna array 220 on the planar portion 202 of the dielectric substrate 200 are connected to different sets of antenna ports 250P1, 250P2, 250P3, 250P4, and 250P5 of the radio frequency integrated circuit 250, respectively, by separate sets of conductive lines 260-1, 260-2, 260-3, 260-4, and 260-5, as shown in FIG. 2B. In some embodiments, antennas 220-1, 220-2, 220-3, 220-4, and 220-5 of antenna array 220 are in a one-to-one relationship with antenna port groups 250P1, 250P2, 250P3, 250P4, and 250P5 of radio frequency integrated circuit 250. For example, antenna 220-1 is connected by wire set 260-1 and electrically coupled to a single corresponding antenna port set 250P1. Antenna 220-2 is connected by conductor set 260-2 and electrically coupled to a single corresponding antenna port set 250P2. Antenna 220-3 is connected by conductor set 260-3 and electrically coupled to a single corresponding antenna port set 250P3. Antenna 220-4 is connected by conductor set 260-4 and electrically coupled to a single corresponding antenna port set 250P4. Antenna 220-5 is connected by conductor set 260-5 and electrically coupled to a single corresponding antenna port set 250P5. It should be noted that the connection relationship between the antenna array 220 and the corresponding antenna port groups 250P1 to 250P5 of the rf integrated circuit 250 is not limited to the embodiment of the present application.

In some embodiments, the antenna array 230 on the planar portion 206 of the dielectric substrate 200 of the radio frequency integrated circuit 250 may be configured to include at least one sub-array (sub-array) to ensure that all antennas of the antenna array 230 are connected to the limited antenna port groups 250P6, 250P7, and 250P8 of the radio frequency integrated circuit 250. The sub-arrays (e.g., sub-arrays 230S1 and 230S 2) comprised of at least two of antennas 230-1, 230-2, 230-3, 230-4 and 230-5 may be connected to the same antenna port group (e.g., antenna port group 250P6 or 250P 8) of rf integrated circuit 250 through the same wire group (e.g., wire group 260-6 or 260-8), as shown in fig. 2C. In some embodiments, antennas 230-1, 230-2, 230-3, 230-4, and 230-5 of antenna array 230 and corresponding antenna port groups 250P6, 250P7, and 250P8 of RF integrated circuit 250 may be in a many-to-one or one-to-one relationship. For example, sub-array 230S1 is comprised of a portion of antennas 230-1, 230-2, 230-3, 230-4, and 230-5, such as antennas 230-1 and 230-2, with both antennas 230-1 and 230-2 connected by a single wire set 260-6 and electrically coupled to the same antenna port set 250P6. Sub-array 230S2 is comprised of another portion of antennas 230-1, 230-2, 230-3, 230-4 and 230-5, such as antennas 230-4 and 230-5, with antennas 230-4 and 230-5 both connected by a single wire set 260-8 and electrically coupled to the same antenna port set 250P8. Thus, a greater number of antennas (including ten antennas 220-1 through 220-5, 230-1 through 230-5) of antenna arrays 220 and 230 may be connected to a lesser number of antenna port groups (including eight antenna port groups 250P1 through 250P 8) of radio frequency integrated circuit 250. It should be noted that the number of antennas in the same sub-array is not limited to the embodiments of the present application.

In some embodiments, the antennas of the antenna array 230 having a many-to-one relationship with the antenna port group of the radio frequency integrated circuit 250 are connected to each other by a connector assembly 270 (including connector assemblies 270-1 and 270-2). For example, antennas 230-1 and 230-2 of the same antenna sub-array 230S1 may first be connected to each other by connector assembly 270-1, and then connector assembly 270-1 may be connected to antenna port group 250P6 of RF integrated circuit 250 by conductor set 260-6. In addition, the ends of the conductive trace sets 260-6 may be directly connected to the connector assembly 270-1 and the antenna port set 250P6 of the radio frequency integrated circuit 250. For example, antennas 230-4 and 230-5 of the same antenna sub-array 230S2 may first be connected to each other through connector assembly 270-2, and then connector assembly 270-2 may be connected to antenna port group 250P8 of RF integrated circuit 250 through conductor set 260-8. In addition, the ends of the wire set 260-8 may be directly connected to the connector assembly 270-2 and the antenna port set 250P8 of the radio frequency integrated circuit 250. In some embodiments, connector assembly 270 includes a dispenser/combiner.

In some embodiments, other portions of antennas 230-1, 230-2, 230-3, 230-4, and 230-5, such as antenna 230-3, may be in a one-to-one relationship with corresponding port 250P7 of RF integrated circuit 250. For example, antenna 230-3 is connected by a single wire set 260-7 and electrically coupled to a corresponding antenna port set 250P7. In addition, the ends of the wire set 260-7 may be directly connected to the antenna 230-3 and the antenna port set 250P7 of the radio frequency integrated circuit 250. It should be noted that the connection relationship between the antenna array 230 and the corresponding antenna port groups 250P6, 250P7, and 250P8 is not limited to the embodiment of the present application.

Fig. 3-13 are side views of antenna modules 500A, 500B, 500C, 500D, 500E, 500F, 500G, 500H, 500I, 500J, and 500K along direction 110 according to some embodiments of the present application. The configuration and connection between the antenna array 230 disposed on the planar portion 206 of the dielectric substrate 200 and the corresponding antenna port set of the radio frequency integrated circuit 250 is shown. The elements of the following embodiments are the same as or similar to those previously described with reference to fig. 1 and 2A-2C. For brevity, this is not repeated.

In some embodiments, antennas of the same sub-array in antenna array 230 have different antenna types from each other. As shown in fig. 3, in the antenna module 500A, the antenna array 230 includes antennas 230A-1, 230A-2, 230A-3, 230A-4 and 230A-5 corresponding to three antenna port groups 250P6 to 250P8 of the radio frequency integrated circuit 250. In addition, antenna array 230 includes sub-array 230SA1, which is comprised of antennas 230A-1 and 230A-2, and sub-array 230SA2, which is comprised of antennas 230A-4 and 230A-5. Antennas 230A-1 and 230A-2 of the same antenna sub-array 230SA1 are both connected to the same antenna port group 250P6 of the radio frequency integrated circuit 250 through connector assembly 270A-1 and conductor set 260-6. Antennas 230A-4 and 230A-5 of the same antenna sub-array 230SA2 are both connected to the same antenna port group 250P8 of the radio frequency integrated circuit 250 through connector assembly 270A-2 and conductor set 260-8. In some embodiments, antennas 230A-4 and 230A-5 of the same antenna sub-array 230SA2 may have different antenna types. For example, antenna 230A-1 may be a patch antenna and antenna 230A-2 may be a dipole antenna. In addition, antennas 230A-1 and 230A-2 of the same antenna sub-array 230SA1 may operate in the same or different radiation directions and/or polarizations. Antennas 230A-1 and 230A-2 of the same antenna sub-array 230SA1 may operate in the same frequency band. Similarly, antennas 230A-4 and 230A-5 of the same antenna sub-array 230SA2 may have different antenna types. For example, antenna 230A-4 may be a loop antenna and antenna 230A-5 may be a slot antenna. In addition, antennas 230A-4 and 230A-5 of the same antenna sub-array 230SA2 may operate in the same or different radiation directions and/or polarizations. Antennas 230A-4 and 230A-5 of the same antenna sub-array 230SA2 may operate in the same frequency band. In some embodiments, the antenna type of antenna 230A-3 of antenna port group 250P7 connected to RF integrated circuit 250 may be the same or different than the antenna types of antennas 230A-1, 230A-2, 230A-4, and 230A-5 of the same antenna array 230. It should be noted that the types of antennas 230A-1, 230A-2, 230A-3, 230A-4, and 230A-5 are not limited to the embodiments of the present application.

In some embodiments, antenna array 230 may have any number of antennas corresponding to a limited set of antenna ports of radio frequency integrated circuit 250. As shown in fig. 4, in the antenna module 500B, the antenna array 230 includes six antennas 230B-1, 230B-2, 230B-3, 230B-4, 230B-5, and 230B-6 corresponding to the three antenna port groups 250P6 to 250P8 of the antenna module 500B. In addition, antenna array 230 includes sub-array 230SB1, which is comprised of antennas 230B-1 and 230B-2, sub-array 230SB2, which is comprised of antennas 230B-3 and 230B-4, and array 230SB3, which is comprised of antennas 230B-5 and 230B-6. Antennas 230B-1 and 230B-2 of the same antenna sub-array 230SB1 are both connected to the same antenna port group 250P6 of rf integrated circuit 250 through connector assembly 270B-1 and conductor set 260-6. Antennas 230B-3 and 230B-4 of the same antenna sub-array 230SB2 are both connected to the same antenna port group 250P7 of rf integrated circuit 250 through connector assembly 270B-2 and conductor set 260-7. In addition, antennas 230B-5 and 230B-6 of the same antenna sub-array 230SB3 are both connected to the same antenna port group 250P8 of the radio frequency integrated circuit 250 through connector assembly 270B-3 and conductor set 260-8. It should be understood that while some features are shown in some embodiments but not others, these features may (or may not) be present in other embodiments whenever possible. For example, while each of the illustrated exemplary embodiments shows a particular configuration of sub-arrays of antenna array 230, any other combination of configurations of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of sub-arrays of antenna array 230 of antenna module 500A may be implemented in antenna module 500B, as applicable.

In some embodiments, the sub-arrays of antenna array 230 may be comprised of any number of antennas. As shown in fig. 5, in the antenna module 500C, the antenna array 230 includes antennas 230C-1, 230C-2, 230C-3, 230C-4, and 230C-5 corresponding to the two antenna port groups 250P6 and 250P7 of the radio frequency integrated circuit 250. In addition, antenna array 230 includes sub-array 230SC1, which is made up of three antennas 230C-1, 230C-2, and 230C-3, and sub-array 230SC2, which is made up of two antennas 230C-4 and 230C-5. Antennas 230C-1, 230C-2, and 230C-3 of the same antenna sub-array 230SC1 are all connected to the same antenna port group 250P6 of the radio frequency integrated circuit 250 through connector assembly 270C-1 and conductor set 260-6. Antennas 230C-4 and 230C-5 of the same antenna sub-array 230SC2 are both connected to the same antenna port group 250P7 of the radio frequency integrated circuit 250 through connector assembly 270C-2 and conductor set 260-7. In the present embodiment, the antenna of the antenna array 230 of the antenna module 500C and the antenna port set of the radio frequency integrated circuit 250 may not have a one-to-one relationship. It should be understood that while some embodiments are shown, some features are not shown in other embodiments, which may (or may not) be present in other embodiments whenever possible. For example, while each of the illustrated exemplary embodiments shows a particular configuration of sub-arrays of antenna array 230, any other combination of configurations of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of subarrays of antenna array 230 of antenna modules 500A and 500B may be implemented in antenna module 500C, as applicable.

In some embodiments, the sub-arrays may be disposed at any location of the antenna array 230. As shown in fig. 6, in the antenna module 500D, the antenna array 230 includes antennas 230D-1, 230D-2, 230D-3, 230D-4, and 230D-5 corresponding to the three ports 250P6 to 250P8 of the radio frequency integrated circuit 250. The antenna 230D-1 of the antenna array 230 has a one-to-one correspondence with the corresponding antenna port group 250P6 of the radio frequency integrated circuit 250. In addition, the antenna array 230 includes subarrays 230SD1 and 230SD2 arranged in the middle and right of the antenna array 230. In some embodiments, subarrays 230SD1 and 230SD2 are arranged side-by-side. Sub-array 230SD1 may be comprised of antennas 230D-2 and 230D-3. Sub-array 230SD2 may be comprised of antennas 230D-4 and 230D-5. Antennas 230D-4 and 230D-5 may be disposed outside antennas 230D-2 and 230D-3 of sub-array 230SD 1. Antennas 230D-2 and 230D-3 of the same antenna sub-array 230SD1 are each connected to the same antenna port group 250P7 of the radio frequency integrated circuit 250 through connector assembly 270D-1 and conductor set 260-7. Antennas 230D-4 and 230D-5 of the same antenna sub-array 230SD2 are each connected to the same antenna port group 250P8 of the radio frequency integrated circuit 250 through connector assembly 270D-2 and conductor set 260-8. It should be understood that while some features are shown in some embodiments but not others, these features may (or may not) be present in other embodiments whenever possible. For example, while each of the illustrated exemplary embodiments shows a particular arrangement of sub-arrays of antenna array 230, any other combination of arrangements of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of sub-arrays of the antenna array 230 of the antenna modules 500A-500C may be implemented in the antenna module 500D, as applicable.

In some embodiments, antennas of the same sub-array may be configured in different orientations. Thus, antennas having subarrays of different sizes (for operation in different frequency bands) may be configured in planar portions 206 having a limited area. As shown in fig. 7, in the antenna module 500E, the antenna array 230 includes antennas 230E-1, 230E-2, 230E-3, 230E-4 and 230E-5 corresponding to the three antenna port groups 250P6 to 250P8 of the radio frequency integrated circuit 250. The antenna array 230 includes subarrays 230SE1 and 230SE2 arranged on the left and right sides of the one-dimensional antenna array 230. Sub-array 230SE1 may be comprised of antennas 230E-1 and 230E-2, with antennas 230E-1 and 230E-2 both connected to the same antenna port group 250P6 of RF integrated circuit 250 through connector assembly 270E-1 and conductor set 260-6. Sub-array 230SE2 may be comprised of antennas 230E-4 and 230E-5, with antennas 230E-4 and 230E-5 both connected to the same antenna port group 250P8 of RF integrated circuit 250 through connector assembly 270E-2 and conductor set 260-8. In some embodiments, subarrays 230SE1 and 230SE2 are separated from each other by antenna 230E-3. In addition, the antenna 230E-3 of the antenna array 230 having a one-to-one relationship with the corresponding antenna port group 250P7 of the radio frequency integrated circuit 250 may be disposed in the middle of the one-dimensional antenna array 230.

In some embodiments, antennas 230E-1 and 230E-2 of subarray 230SE1 may be configured in different orientations. For example, both antennas 230E-1 and 230E-2 may be square and have the same length D1. A pair of opposing edges 230E-1S of the antenna 230E-1 may be configured to be substantially parallel to the corresponding edges 206S1 and 206S2 of the planar portion 206, as shown in fig. 7. Antenna 230E-2 may be rotated 45 degrees clockwise or counterclockwise relative to antenna 230E-1. Thus, a pair of opposing edges 230E-2S of antenna 230E-2 may not be parallel to edges 206S1 and 206S2 of planar portion 206. In the direction 100 (column direction). Antenna 230E-2 may have a dimension D2 that is different than the dimension (i.e., length D1) of antenna 230E-1. In addition, adjacent edges 230E-1S and 230E-2S of antennas 230E-1 and 230E-2 of sub-array 230SE1 may not be parallel to each other. In some other embodiments, antennas 230E-1 and 230E-2 may have different lengths. For example, the length of antenna 230E-2 may be greater than the length D1 of antenna 230E-1 such that the operating frequency of antenna 230E-2 may be lower than the operating frequency of antenna 230E-1.

Similarly, antennas 230E-4 and 230E-5 may both be square and have the same length D3, with length D3 being the same as or different from length D1. Antenna 230E-5 may have the same orientation as antenna 230E-1. Antenna 230E-4 may be rotated 45 degrees clockwise or counterclockwise relative to antenna 230E-5. In direction 100 (the column direction), antenna 230E-4 may have a dimension D4, with dimension D4 being different from the dimension (i.e., length D3) of antenna 230E-5. In addition, adjacent edges 230E-4S and 230E-5S of antennas 230E-4 and 230E-5 of sub-array 230SE2 may not be parallel to each other. In some other embodiments, antennas 230E-4 and 230E-5 may have different lengths. For example, the length of antenna 230E-4 may be greater than the length D3 of antenna 230E-5 such that the operating frequency of antenna 230E-4 may be lower than the operating frequency of antenna 230E-5. It should be understood that while some features are shown in some embodiments but not others, these features may (or may not) be present in other embodiments whenever possible. For example, while each of the illustrated exemplary embodiments shows a particular configuration of sub-arrays of antenna array 230, any other combination of configurations of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of sub-arrays of the antenna array 230 of the antenna modules 500A-500D may be implemented in the antenna module 500E, as applicable.

In some embodiments, antennas of different sub-arrays may operate in different frequency bands including low frequency bands, medium frequency bands, high frequency bands, or ultra-high frequency bands. As shown in fig. 8, in the antenna module 500F, the antenna array 230 includes antennas 230F-1, 230F-2, 230F-3, 230F-4 and 230F-5 corresponding to the three antenna port groups 250P6 to 250P8 of the radio frequency integrated circuit 250. The antenna array 230 includes subarrays 230SF1 and 230SF2 arranged on the left and right sides of the one-dimensional antenna array 230. Sub-array 230SF1 may be comprised of antennas 230F-1 and 230F-2, with both antennas 230F-1 and 230F-2 connected to the same antenna port group 250P6 of RF integrated circuit 250 through connector assembly 270F-1 and conductor set 260-6. Sub-array 230SF2 may be comprised of antennas 230F-4 and 230F-5, with both antennas 230F-4 and 230F-5 connected to the same antenna port group 250P8 of RF integrated circuit 250 through connector assembly 270F-2 and conductor set 260-8. In addition, the antenna 230F-3 of the antenna array 230 having a one-to-one relationship with the corresponding antenna port group 250P7 of the radio frequency integrated circuit 250 may be disposed in the middle of the one-dimensional antenna array 230. For example, antennas 230F-1 and 230F-2 of sub-array 230SF1 and antennas 230F-4 and 230F-5 of sub-array 230SF2 may operate in different frequency bands. For example, antennas 230F-1 and 230F-2 of subarray 230SF1 may each be square and have the same length D1, and operate at low frequencies. In addition, antennas 230F-4 and 230F-5 of sub-array 230SF2 may each be square and have the same length D5, and operate at high frequencies. In some embodiments, length D1 is greater than length D5. It should be noted that the operating frequency band of the antenna of each sub-array is not limited to the embodiments of the present application. It should be understood that while some features are shown in some embodiments but not others, these features may (or may not) be present in other embodiments whenever possible. For example, while each of the illustrated exemplary embodiments shows a particular configuration of sub-arrays of antenna array 230, any other combination of configurations of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of sub-arrays of the antenna array 230 of the antenna modules 500A-500E may be implemented in the antenna module 500F, as applicable.

In some embodiments, a first spacing between adjacent antennas of a same sub-array may be different than a second spacing between antennas external to the sub-array and antennas of its adjacent sub-array. The first pitch and the second pitch may be individually optimized by the geometry of the planar portion 206 (e.g., the shape of the planar portion 206) or the gain of the antenna. As shown in fig. 9, in the antenna module 500G, the planar portion 206G may include protruding portions 216P1, 216P2, and 216P3 protruding in the direction 120. The protruding portions 216P1, 216P2, and 216P3 may have lengths PL1, PL2, and PL3 along the direction 100. In some embodiments, lengths PL1, PL2, and PL3 may be the same as each other or different from each other.

As shown in fig. 9, antenna array 230 includes antennas 230G-1, 230G-2, 230G-3, 230G-4, and 230G-5 corresponding to three antenna port groups 250P6 through 250P8 of radio frequency integrated circuit 250. The antenna array 230 includes subarrays 230SG1 and 230SG2, and subarrays 230SG1 and 230SG2 are arranged on the left and right sides of the one-dimensional antenna array 230. Further, sub-arrays 230SG1 and 230SG2 are arranged in protruding portions 216P1 and 216P3, respectively. Sub-array 230SG1 may be comprised of antennas 230G-1 and 230G-2, both antennas 230G-1 and 230G-2 being connected to the same antenna port group 250P6 of rf integrated circuit 250 through connector assembly 270G-1 and conductor set 260-6. Sub-array 230SG2 may be comprised of antennas 230G-4 and 230G-5, both antennas 230G-4 and 230G-5 being connected to the same antenna port group 250P8 of rf integrated circuit 250 through connector assembly 270G-2 and conductor set 260-8. In addition, the antennas 230G-3 of the antenna array 230 having a one-to-one relationship with the corresponding antenna port group 250P7 of the radio frequency integrated circuit 250 may be configured in the protruding portion 216P 2.

As shown in FIG. 9, the spacing S1 between adjacent antennas 230G-1 and 230G-2 of sub-array 230SG1 may be defined by the length PL1 of protruding portion 216P1 and/or the size (length) of antennas 230G-1 and 230G-2. The spacing S2 between the antenna 230G-3 located outside the sub-array 230SG1 and the antenna 230G-2 of its adjacent sub-array 230SG1 may be defined by the length PL2 of the protruding portion 216P2, the spacing (not shown) between the protruding portions 216P1 and 216P2 along the direction 100, and/or the size (length) of the antennas 230G-2 and 230G-3. In some embodiments, interval S1 is the same as or different from interval S2.

Similarly, the spacing S3 between adjacent antennas 230G-4 and 230G-5 of sub-array 230SG2 may be defined by the length PL3 of protruding portion 216P3 and/or the size (length) of antennas 230G-4 and 230G-5. The spacing S4 between the antenna 230G-3 located outside the sub-array 230SG1 and the antenna 230G-4 of its neighboring sub-array 230SG2 may be defined by the length PL2 of the protruding portion 216P2, the spacing (not shown) between the protruding portions 216P2 and 216P3 along the direction 100, and/or the size (length) of the antennas 230G-3 and 230G-4. In some embodiments, interval S3 is the same as or different from interval S4. In some embodiments, interval S3 is the same or different than interval S1, and interval S2 is the same or different than interval S4.

In some embodiments, antennas 230G-1, 230G-2, 230G-3, 230G-4, and 230G-5 configured at specific spacings S1 through S4 may be provided on the rectangular planar portion 206 without protruding portions to provide specific operating frequency bands. It should be understood that while some features are shown in some embodiments but not others, these features may (or may not) be present in other embodiments whenever possible. For example, while each of the illustrated exemplary embodiments shows a specific configuration of sub-arrays of antenna array 230, any other combination of arrangements of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of sub-arrays of the antenna array 230 of the antenna modules 500A to 500F may be implemented in the antenna module 500G, as applicable.

In some embodiments, the antennas of the same sub-array are staggered along the column direction to increase design flexibility. As shown in fig. 10, in the antenna module 500H, the antenna array 230 includes antennas 230H-1, 230H-2, 230H-3, 230H-4, and 230H-5 corresponding to the three antenna port groups 250P6 to 250P8 of the radio frequency integrated circuit 250. The antenna array 230 includes subarrays 230SH1 and 230SH2 arranged on the left and right sides of the one-dimensional antenna array 230. Sub-array 230SH1 may be comprised of antennas 230H-1 and 230H-2, with antennas 230H-1 and 230H-2 both connected to the same antenna port group 250P6 of RF integrated circuit 250 through connector assembly 270H-1 and conductor group 260-6. Sub-array 230SH2 may be comprised of antennas 230H-4 and 230H-5, with antennas 230H-4 and 230H-5 both connected to the same antenna port group 250P8 of RF integrated circuit 250 through connector assembly 270H-2 and conductor set 260-8. In addition, the antenna 230H-3 of the antenna array 230 having a one-to-one relationship with the corresponding antenna port group 250P7 of the radio frequency integrated circuit 250 may be disposed in the middle of the one-dimensional antenna array 230 and outside the sub-arrays 230SH1 and 230SH2. In some embodiments, antennas 230SH1 and 230SH2 of the same sub-array 230SH1 are configured in a staggered manner along direction 100. Thus, the spacing S5 in the direction 120 between the edge 206S2 and the edge 230H-1S of the adjacent antenna 230H-1 may be different than the spacing S6 in the direction 120 between the edge 206S2 and the edge 230H-2S of the adjacent antenna 230H-2. Similarly, antennas 230SH4 and 230SH5 of the same sub-array 230SH2 are arranged in a staggered fashion along direction 100. Thus, the spacing S7 in the direction 120 between the edge 206S2 and the edge 230H-4S of the adjacent antenna 230H-4 may be different than the spacing S6 in the direction 120 between the edge 206S2 and the edge 230H-5S of the adjacent antenna 230H-5. It should be understood that while some features are shown in some embodiments but not others, these features may (or may not) be present in other embodiments whenever possible. For example, while each of the illustrated exemplary embodiments shows a specific configuration of sub-arrays of antenna array 230, any other combination of arrangements of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of sub-arrays of the antenna array 230 of the antenna modules 500A-500G may be implemented in the antenna module 500H, as applicable.

In some embodiments, the antennas of the same sub-array are located at different levels. As shown in fig. 11, in the antenna module 500I, the antenna array 230 includes antennas 230I-1, 230I-2, 230I-3, 230I-4 and 230I-5 corresponding to the three antenna port groups 250P6 to 250P8 of the radio frequency integrated circuit 250. The antenna array 230 includes subarrays 230SI1 and 230SI2 arranged on the left and right sides of the one-dimensional antenna array 230. Sub-array 230SI1 may be comprised of antennas 230I-1 and 230I-2, with both antennas 230I-1 and 230I-2 connected to via connector assembly 270I-1 and conductor set 260-6. The same antenna port group 250P6 of the rf integrated circuit 250. Sub-array 230SI2 may be comprised of antennas 230I-4 and 230I-5, where antennas 230I-4 and 230I-5 are both connected to the same antenna port group 250P8 of RF integrated circuit 250 through connector assembly 270I-2 and conductor set 260-8. In addition, the antenna 230I-3 of the antenna array 230 having a one-to-one relationship with the corresponding antenna port group 250P7 of the radio frequency integrated circuit 250 may be disposed in the middle of the one-dimensional antenna array 230 and outside of the sub-arrays 230SI1 and 230SI2. In some embodiments, antennas 230I-1 and 230I-2 of the same sub-array 230SI1 may be located at different levels. For example, in sub-array 230SI1, antenna 230I-1 may be disposed on top surface 206T of planar portion 206 and cover top surface 206T of planar portion 206, and antenna 230I-2 may be disposed embedded in planar portion 206 (below top surface 206T of planar portion 206 (fig. 1)). Thus, antennas 230I-1 and 230I-2 may not be coplanar with each other such that top surface 206T (FIG. 1) of planar portion 206 is located between antennas 230I-1 and 230I-2 along direction 110. Similarly, in sub-array 230SI2, antenna 230I-4 may be disposed embedded in planar portion 206 (below top surface 206T of planar portion 206 (fig. 1)) and antenna 230I-5 may be disposed on top surface 206T of planar portion 206 and cover top surface 206T of planar portion 206. Thus, antennas 230I-4 and 230I-5 may not be coplanar with each other such that top surface 206T (FIG. 1) of planar portion 206 is located between antennas 230I-4 and 230I-5 along direction 110. In addition, antennas 230I-2 and 230I-4 may be located at different layers of planar portion 206 of dielectric substrate 200. In other words, antennas 230I-2 and 230I-4 may not be coplanar with each other. It should be understood that while some features are shown in some embodiments but not others, these features may (or may not) be present in other embodiments whenever possible. For example, while each of the illustrated exemplary embodiments shows a particular configuration of sub-arrays of antenna array 230, any other combination of configurations of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of sub-arrays of antenna array 230 of antenna modules 500A-500H may be implemented in antenna module 500I, as applicable.

In some embodiments, the sub-arrays may be comprised of non-adjacent antennas. Any number of antennas may be interposed between antennas of the same sub-array 230SJ1 in the column direction. As shown in fig. 12, in the antenna module 500J, the antenna array 230 includes antennas 230J-1, 230J-2, 230J-3, 230J-4 and 230J-5 corresponding to the three antenna port groups 250P6 to 250P8 of the radio frequency integrated circuit 250. The antenna array 230 includes subarrays 230SJ1 and 230SJ2 arranged on the left and right sides of the one-dimensional antenna array 230. Sub-array 230SJ1 may be comprised of antennas 230J-1 and 230J-3, with antennas 230J-1 and 230J-3 both connected to the same antenna port group 250P7 of RF integrated circuit 250 through connector assembly 270J-1 and conductor set 260-7. Sub-array 230SJ2 may be comprised of antennas 230J-4 and 230J-5, with antennas 230J-4 and 230J-5 both connected to the same antenna port group 250P8 of RF integrated circuit 250 through connector assembly 270J-2 and conductor set 260-8. For example, antenna 230J-2 of antenna array 230, which has a one-to-one relationship with the corresponding antenna port group 250P6 of radio frequency integrated circuit 250, may be interposed between antennas 230J-1 and 230J-3 of the same sub-array 230SJ1 along direction 100. It should be understood that while some features are shown in some embodiments but not others, these features may (or may not) be present in other embodiments whenever possible. For example, while each of the illustrated exemplary embodiments shows a particular configuration of sub-arrays of antenna array 230, any other combination of configurations of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of sub-arrays of antenna array 230 of antenna modules 500A-500I may be implemented in antenna module 500J, as applicable.

In some embodiments, the antenna module may further include conductive dummy elements (conductive dummy element) disposed on the dielectric substrate between antennas of the same antenna array. As shown in fig. 13, in the antenna module 500K, the antenna array 230 includes antennas 230K-1, 230K-2, 230K-3, 230K-4 and 230K-5 corresponding to the three antenna port groups 250P6 to 250P8 of the radio frequency integrated circuit 250. The antenna array 230 includes subarrays 230SK1 and 230SK2 arranged on the left and right sides of the one-dimensional antenna array 230. Sub-array 230SK1 may be comprised of antennas 230K-1 and 230K-2, with antennas 230K-1 and 230K-2 both connected to the same antenna port group 250P6 of RF integrated circuit 250 through connector assembly 270K-1 and conductor set 260-6. Sub-array 230SK2 may be comprised of antennas 230K-4 and 230K-5, with antennas 230K-4 and 230K-5 each connected to the same antenna port group 250P8 of RF integrated circuit 250 through connector assembly 270K-2 and conductor set 260-8. In addition, the antenna 230K-3 of the antenna array 230 having a one-to-one relationship with the corresponding antenna port group 250P7 of the radio frequency integrated circuit 250 may be disposed in the middle of the one-dimensional antenna array 230 and outside the sub-arrays 230SK1 and 230SK2. In some embodiments, antenna module 500K may also include conductive dummy elements 240-1, 240-2, 240-3, and 240-4. Conductive dummy elements 240-1, 240-2, 240-3, and 240-4 are disposed on the planar portion 206 of the dielectric substrate and are located along the direction 100 (column direction) between the antennas 230K-1 through 230K-5 of the same antenna array 230. More specifically, conductive dummy element 240-1 is interposed between antennas 230K-1, 230K-2 of sub-array 230SK1 and is separate from antennas 230K-1, 230K-2 of sub-array 230SK 1. Conductive dummy element 240-2 is interposed between antennas 230K-2 and 230K-3 of sub-array 230SK1 and is separate from antennas 230K-2 and 230K-3 of sub-array 230SK 1. Conductive dummy element 240-2 is interposed between antenna 230K-3 and antenna 230K-4 of sub-array 230SK2 and is separate from antenna 230K-3 and antenna 230K-4 of sub-array 230SK2. Conductive dummy element 240-4 is interposed between antennas 230K-4, 230K-5 of sub-array 230SK2 and is separate from antennas 230K-4, 230K-5 of sub-array 230SK2. In some embodiments, conductive dummy elements 240-1 through 240-4 may be located at the same level as antennas 230K-1 through 230K-5. In some embodiments, antenna module 500K may also include other separate conductive dummy elements (not shown) surrounding antennas 230K-1 through 230K-5, depending on design requirements. It should be noted that the number, size and shape of the conductive dummy elements can be designed according to the design rule, and are not limited to the disclosed embodiments.

In some embodiments, the conductive dummy elements 240-1 to 240-4 may be electrically floating (electrically floating) as stress buffers to balance stress and minimize warpage of the dielectric substrate 200. In some embodiments, the conductive dummy elements may be electrically connected to a control element (not shown), such as a switch or a diode, to control the phase and operating frequency of the antennas 230K-1 through 230K-5 of the same antenna array 230. It is to be understood that while some features are shown in some embodiments but in others, these features may (or may not) be present in other embodiments as possible. For example, while each of the illustrated exemplary embodiments shows a particular configuration of sub-arrays of antenna array 230, any other combination of configurations of sub-arrays of antenna array 230 may be used as applicable. In addition, other combinations of sub-arrays of the antenna array 230 of the antenna modules 500A to 500J may be implemented in the antenna module 500K, as applicable.

The embodiment of the application provides an antenna module. The antenna module comprises a dielectric substrate, a Radio Frequency Integrated Circuit (RFIC) and a one-dimensional antenna array consisting of at least two antennas. The radio frequency integrated circuit and the antenna array are disposed on opposite surfaces of the dielectric substrate. In addition, at least one antenna array may include a sub-array consisting of at least two adjacent or non-adjacent antennas. The antennas of the same sub-array are all connected to the same antenna port group of the radio frequency integrated circuit. Thus, even if the radio frequency integrated circuit has a limited number of antenna port groups, the antenna module may be composed of a 1×5 antenna array and a 1×n antenna array, where n is an integer equal to or greater than 5. The Equivalent Isotropic Radiated Power (EIRP) and gain of an antenna module including the sub-array may be improved.

In some embodiments, the antennas of the same sub-array have different antenna types from each other. The antenna array may have any number of antennas corresponding to a limited set of antenna ports of the radio frequency integrated circuit. The sub-arrays of the antenna array may be comprised of any number of antennas. The sub-arrays may be arranged at any position of the antenna array. Antennas of the same sub-array may be arranged in different directions. Thus, antennas operating in the high frequency band and the low frequency band may be arranged in the same column. Antennas of different subarrays may operate in different frequency bands including low frequency bands, medium frequency bands, high frequency bands, or ultra high frequency bands. The first spacing between adjacent antennas of the same sub-array may be different from the second spacing between antennas located outside the sub-array and antennas of its adjacent sub-array. The first pitch and the second pitch may be individually optimized by the geometry of the planar portion of the dielectric substrate or the gain of the antenna. The antennas of the same sub-array can be staggered along the column direction to increase the design flexibility. Antennas of the same sub-array are located at different levels. The sub-arrays may be comprised of non-adjacent antennas. The antenna module may further include conductive dummy elements disposed on the dielectric substrate between the antennas of the same antenna array. The conductive dummy elements may be electrically floating to act as stress buffers to balance stress and minimize warpage of the dielectric substrate. The conductive dummy elements may be electrically connected to control elements (not shown), such as switches or diodes, to control the phase and operating frequency of the antennas of the same antenna array.

Although the embodiments of the present application and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit of the application and the scope as defined by the appended claims. The described embodiments are to be considered in all respects only as illustrative and not restrictive. The scope of the present application is defined by the appended claims. Those skilled in the art will appreciate that many modifications, substitutions, changes, and substitutions can be made without departing from the spirit and scope of the present application.

Claims (20)

1. An antenna module, comprising:

a dielectric substrate;

the radio frequency integrated circuit is arranged on the dielectric substrate and comprises a first antenna port group and a plurality of second antenna port groups so as to receive or transmit a plurality of signals; and

a first plurality of first antennas arranged in a first column on the dielectric substrate, wherein all of the first antennas are connected to the first antenna port group of the radio frequency integrated circuit.

2. The antenna module of claim 1, further comprising:

a second plurality of second antennas arranged in a second row on the dielectric substrate, wherein the second antennas are respectively connected to different ones of the second antenna port groups of the radio frequency integrated circuit.

3. The antenna module of claim 1, wherein the dielectric substrate comprises:

a first planar portion and a second planar portion, wherein the first planar portion and the second planar portion face in different directions; and

and the bending part is connected between the first plane part and the second plane part, wherein the first antenna is arranged on the first plane part, and the second antenna is arranged on the second plane part.

4. The antenna module of claim 1, wherein the first antennas are interconnected by a connector assembly, wherein the connector assembly is connected to the first antenna port group of the radio frequency integrated circuit by a single first conductor set.

5. The antenna module of claim 2, further comprising:

a third plurality of third antennas arranged in a first row with the first antennas, wherein all of the third antennas are connected to a third antenna port group of the radio frequency integrated circuit.

6. The antenna module of claim 5 wherein the radio frequency integrated circuit comprises a fourth number of groups of antenna ports comprised of the first group of antenna ports and the second group of antenna ports, wherein the fourth number is less than a sum of the first number, the second number, and the third number.

7. The antenna module of claim 5, wherein the third antenna is disposed outside of the first antenna.

8. The antenna module of claim 7, wherein a first spacing between adjacent ones of the first antennas is different from a second spacing between the third antenna and the adjacent ones of the first antennas.

9. The antenna module of claim 5, wherein the third antenna is interposed between the first antennas.

10. The antenna module of claim 5, wherein the first antenna operates in a first frequency band and the third antenna operates in a third frequency band different from the first frequency band.

11. The antenna module of claim 1, wherein the first antennas have different dimensions along a column direction.

12. The antenna module of claim 1, wherein a plurality of adjacent sides of the first antenna are non-parallel to one another.

13. The antenna module of claim 1, wherein the first antennas are staggered along a column direction.

14. The antenna module of claim 1, wherein the first antenna is located at a different level.

15. The antenna module of claim 1, further comprising:

and a conductive dummy element arranged on the dielectric substrate and located between the second antennas.

16. The antenna module of claim 15, wherein the conductive dummy element is electrically floating.

17. The antenna module of claim 15, wherein the conductive dummy element is electrically connected to a control element.

18. An antenna module, comprising:

a dielectric substrate;

the radio frequency integrated circuit is arranged on the dielectric substrate and comprises a single first antenna port group and a plurality of second antenna port groups so as to receive or transmit a plurality of signals; and

and a plurality of antennas arranged in a row on the dielectric substrate and opposite to the radio frequency integrated circuit, wherein a first portion of the antennas are connected to the first antenna port group of the radio frequency integrated circuit through a single first wire group, and wherein a second portion of the antennas are respectively connected to different second antenna port groups of the radio frequency integrated circuit through second wire groups.

19. An antenna module, comprising:

a dielectric substrate, comprising:

a first plane part and a second plane part, wherein the first plane part and the second plane part face different directions; and

a bending part connected between the first plane part and the second plane part;

the radio frequency integrated circuit is arranged on the dielectric substrate and comprises a single first antenna port group and a plurality of second antenna port groups so as to receive or transmit a plurality of signals;

a first antenna array comprising a plurality of first antennas arranged in a first row on the first plane portion and connected to the first antenna port group and the second antenna port group, wherein the first antenna array comprises a sub-array composed of at least two of the first antennas connected to the first antenna port group of the radio frequency integrated circuit; and

a second antenna array includes a plurality of second antennas arranged in a second row on the second plane portion.

20. The antenna module of claim 19, wherein the second antennas are each connected to a different one of the second antenna port groups of the radio frequency integrated circuit.