CN117640804A

CN117640804A - Bonding structure and electronic device

Info

Publication number: CN117640804A
Application number: CN202311440448.0A
Authority: CN
Inventors: 路通
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-10-31
Filing date: 2023-10-31
Publication date: 2024-03-01
Anticipated expiration: 2043-10-31

Abstract

The application provides a bonding structure and electronic equipment relates to electronic product technical field for solve the problem of how to reduce the dismantlement degree of difficulty of bonding structure. The bonding structure comprises a first structural member, a second structural member and a first adhesive layer. The first structural member has a first surface. The second structural member has a second surface including a first region and a second region, a partial edge of the first region forming a partial edge of the second surface, a surface energy of the first region being less than a surface energy of the second region. The first adhesive layer is adhered between the first area and the first surface and between the second area and the first surface. This bonding structure need not to design dedicated anchor clamps and equipment at the in-process of dismantling, can realize dismantling the second structure from first structure, dismantles easy operation, easily realizes. In addition, the first structural member and the second structural member which are detached and separated are good in structure and can be reused, so that maintenance cost is saved.

Description

Bonding structure and electronic device

Technical Field

The application relates to the technical field of electronic products, in particular to an adhesive structure and electronic equipment.

Background

In electronic devices, there are often multiple adhesive structures. For example, the screen is adhered to the middle frame by adhesive to form an adhesive structure, the camera trim is adhered to the back cover by adhesive to form an adhesive structure, and the lens is adhered to the trim fixed relative to the back cover by adhesive to form an adhesive structure.

In the related art, in the disassembling and repairing process, structural members forming the bonding structure are often required to be disassembled in a mode of damaging the structural members, and the disassembling difficulty of the bonding structure is high.

Disclosure of Invention

The embodiment of the application provides a bonding structure and electronic equipment for solve the problem of how to reduce the dismantlement degree of difficulty of bonding structure.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

in a first aspect, embodiments of the present application provide an adhesive structure including a first structural member, a second structural member, and a first adhesive layer. The first structural member has a first surface. The second structural member has a second surface including a first region and a second region, a partial edge of the first region forming a partial edge of the second surface, a surface energy of the first region being less than a surface energy of the second region. The first adhesive layer is adhered between the first area and the first surface and between the second area and the first surface.

According to the bonding structure, the surface energy of the first area of the second surface of the second structural member is smaller than that of the second area, so that the bonding strength between the first area and the first adhesive layer is smaller than that between the second area and the first adhesive layer. When the second structural member is detached from the first structural member, an adsorption force can be applied to the part, corresponding to the first area, of the second structural member through an adsorption tool (such as a sucker), so that the first area is separated from the first adhesive layer to form a detachment gap, and then the end part of the detachment tool (such as a detachment rod or a detachment sheet) is inserted into the detachment gap to apply the force, so that the second structural member is detached from the first structural member. Therefore, the material of the first structural member and the second structural member is not required to be limited, the second structural member can be detached from the first structural member without designing a special fixture and equipment in the detaching process, the detaching operation is simple, the detaching efficiency is high, and the detaching operation is easy to realize. In addition, the first structural member and the second structural member after the disassembly and separation are good in structure and can be reused, so that the maintenance cost is saved, and the safety is high.

In some possible implementations of the first aspect, the second structural member includes a body portion and a first coating. The surface of the body portion includes a first surface region and a second surface region, the second surface region forming a second region. The first coating is arranged on the first surface area, and the surface of the first coating opposite to the first surface area forms the first area. Therefore, the first coating layers with different materials can be selected according to the material of the main body part and the surface energy requirements of different areas of the second surface, so that the method is easy to realize.

In some possible implementations of the first aspect, the first coating includes an anti-fingerprint AF film layer. Therefore, the AF film can be coated on the appearance surface of the main body part and simultaneously coated on the first surface area of the main body part, so that the processing technology of the second structural part is simplified, and the production efficiency is higher.

In some possible implementations of the first aspect, the first coating includes an ultraviolet light cured paint layer. Therefore, the compactness and the glossiness of the first coating are high, the effects of protection and highlight decoration can be achieved, and the second structural member can be detached from the first structural member easily.

In some possible implementations of the first aspect, the second structural member includes a body portion, a third coating, and a fourth coating. The surface of the body portion includes a first surface region and a second surface region. The third coating is arranged on the first surface area, and the surface of the third coating opposite to the first surface area forms the first area. The fourth coating is arranged on the second surface area, and the surface of the fourth coating opposite to the second surface area forms the second area. In this way, the materials or parameters of the third coating and the fourth coating can be selected according to the requirements of the surface energy of different areas of the second surface, so that the differentiation between the surface energy of the first area and the surface energy of the second area can be easily realized.

In some possible implementations of the first aspect, the third coating includes an anti-fingerprint AF film layer and the fourth coating includes an ink layer. Therefore, when the second structural member is easy to detach from the first structural member, the surface energy of the ink layer can be larger, so that the bonding reliability between the first structural member and the second structural member is improved, and the reliability of the whole electronic equipment is further ensured.

In some possible implementations of the first aspect, the third coating includes an ink layer and the fourth coating includes an ink layer. Therefore, the third coating and the fourth coating can be simultaneously printed and formed by using the same printing equipment, and only different liquid inks are needed, so that the forming process of the second surface of the second structural member is simplified.

In some possible implementations of the first aspect, the material of the second structural member forming the first region and the portion of the second region is the same, and the surface roughness of the first region is less than the surface roughness of the second region. Therefore, the surface energy differentiation of the two areas of the second surface can be realized without arranging an extra coating, and the cost of the electronic equipment is saved.

In some possible implementations of the first aspect, the area of the first region is smaller than the area of the second region. The area of bonding with first glue film on the second surface is great, when realizing dismantling the second structure more easily from first structure, can guarantee the reliability that second structure and first structure wholly bond, and then guarantee the reliability of electronic equipment complete machine.

In some possible implementations of the first aspect, the surface energy of the first region is less than or equal to 30 dynes.

In some possible implementations of the first aspect, the surface energy of the second region is greater than or equal to 34 dynes.

In some possible implementations of the first aspect, the surface energy of the first region is less than or equal to 30 dynes and the surface energy of the second region is greater than or equal to 34 dynes. Therefore, the bonding strength between the first area and the first adhesive layer is smaller, and the second structural member is easier to detach from the first structural member. The bonding strength between the second area and the first adhesive layer is high, so that the bonding reliability between the second structural member and the first structural member is ensured, and the reliability of the whole electronic equipment is further ensured.

In some possible implementations of the first aspect, the edge of the second surface includes a first edge segment, a portion of the edge of the first region forming the first edge segment, a distance between two end points of the first edge segment being greater than or equal to 10 millimeters. Therefore, when the second structural member is detached from the first structural member, the second structural member and the first adhesive layer are separated from each other to form the width of the detaching gap, so that the end part of the common length specification detaching tool (such as a detaching rod or a detaching sheet) can be accommodated, and the second structural member is more convenient to detach from the first structural member.

In some possible implementations of the first aspect, the width of the first region is greater than or equal to 1 millimeter along a direction perpendicular to a line along which the two end points of the first edge segment lie. Therefore, when the second structural member is detached from the first structural member, the end part of the common width specification detaching tool (such as a detaching rod or a detaching sheet) can be accommodated by the width of the detaching gap formed by detachment between the second structural member and the first adhesive layer, so that the second structural member is more convenient to detach from the first structural member.

In some possible implementations of the first aspect, the first surface includes a third region and a fourth region, the surface energy of the third region being less than the surface energy of the fourth region. The first adhesive layer is adhered between the third region and the first region, and between the fourth region and the second region. The bonding strength between the first adhesive layer and the third area of the first structural member is also smaller, and the second structural member is easier to detach from the first structural member.

In some possible implementations of the first aspect, the first glue layer includes a first outer side, the first outer side being located between the first region and the first surface; an avoidance space is enclosed by the first outer side surface, a part of the first surface and a part of the first area; the avoidance space is located on one side, facing the first outer side face, of the first outer side face. Thus, when the second structural member is detached from the first structural member, the avoidance space can accommodate the end part of the detaching tool (such as a detaching rod or a detaching sheet), so that the detaching tool can apply a larger acting force to the second structural member, and the second structural member can be detached from the first structural member more conveniently.

In some possible implementations of the first aspect, the edge of the second surface includes a first edge section, and a portion of the edge of the first region forms the first edge section. The edge of the first outer side surface connected with the first area is a second edge section, and the second edge section and the first edge section are intersected at a first intersection point and a second intersection point. The straight line where the first intersection point and the second intersection point are located coincides with the second edge section or is located between the second edge section and the first edge section. The distance between the first intersection point and the second intersection point is greater than or equal to 10 millimeters, and the maximum distance between the second edge section and the first edge section along the direction perpendicular to the straight line where the first intersection point and the second intersection point are located is greater than or equal to 1 millimeter. Therefore, when the second structural member is detached from the first structural member, the avoidance area can accommodate the end parts of the detaching tool (such as a detaching rod or a detaching sheet) with common length specifications and width specifications, and the first structural member and the second structural member are detached and separated more conveniently.

In some possible implementations of the first aspect, the second surface further includes a third edge segment, the third edge segment bordering the first edge segment, a portion of the edge of the second region forming the third edge segment. The first adhesive layer further includes a second outer side surface, the second outer side surface being contiguous with the first outer side surface, at least a portion of an edge of the second outer side surface contiguous with the second surface being coincident with the third edge segment. Therefore, under the condition that the second structural member is easy to detach from the first structural member, the first adhesive layer can enable the bonding seal between the first structural member and the second structural member to be more reliable, and dust or water vapor outside the electronic equipment is prevented from entering between the first structural member and the second structural member, so that the bonding reliability between the first structural member and the second structural member is reduced.

In some possible implementations of the first aspect, the peel strength of the first glue layer is inversely related to the ambient temperature. Therefore, when the second structural member is detached from the first structural member, the electronic equipment comprising the bonding structure can be placed in the detaching environment with the temperature higher than the normal temperature, so that the bonding strength between the first adhesive layer and the first structural member and between the first adhesive layer and the second structural member is reduced, and the first structural member and the second structural member can be detached and separated more easily.

In some possible implementations of the first aspect, the peel strength of the first bond line in an environment of 75 ℃ to 80 ℃ is less than or equal to 0.3 times the peel strength of the first bond line in an environment of 20 ℃ to 25 ℃.

In some possible implementations of the first aspect, the first structure has a first groove, a groove wall of which forms a part of the first surface. The second structural member is located in the first groove, the groove side wall of the first groove is arranged around the second structural member in a circle, and the first adhesive layer is adhered between the second surface and the groove wall of the first groove. Therefore, the groove side wall of the first groove can play a role in limiting and protecting, the first adhesive layer can be prevented from being exposed outside the bonding structure, and under the action of external force, the first adhesive layer is easier to separate from the first structural member or the second structural member, so that dust or water vapor outside the electronic equipment enters into the relevant parts of the electronic equipment to be damaged.

In some possible implementations of the first aspect, the first structural member is a middle frame. The second structural member is a screen.

In some possible implementations of the first aspect, the first structural member is a decorative member, the decorative member having a light-transmitting aperture. The second structure is a first cover body, the first cover body is provided with a light transmission area, and the light transmission area and the light transmission hole are oppositely arranged.

In a second aspect, embodiments of the present application provide an electronic device that includes an adhesive structure and a back cover. The bonding structure is any one of the bonding structures described in the foregoing embodiments, wherein the first structural member is a middle frame, and the second structural member is a screen. The back cover is positioned on one side of the middle frame far away from the screen and is fixed on the middle frame.

In a third aspect, an embodiment of the present application provides an electronic device, including a back cover, an adhesive structure, and a camera module. The back cover is provided with a mounting hole. The bonding structure is any one of the above embodiments, wherein the first structural member is a decorative member, and the decorative member has a light hole. The second structure is a first cover body, the first cover body is provided with a light transmission area, and the light transmission area and the light transmission hole are oppositely arranged. The decorating part is fixed on the back cover and seals the mounting hole; the second surface faces the back cover. The camera module is arranged on one side of the back cover, which is back to the second surface, and the light incident surface of the camera module faces the light transmission area.

Because the electronic device provided in the embodiment of the present application includes the bonding structure according to any of the foregoing embodiments, the two may solve the same technical problem and achieve the same effect, which is not described herein again.

Drawings

Fig. 1 is a perspective view of an electronic device provided in some embodiments of the present application;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

FIG. 3 is a cross-sectional block diagram of the electronic device of FIG. 1 taken along line A-A;

FIG. 4 is a rear view of an electronic device provided in further embodiments of the present application;

FIG. 5 is a rear view of an electronic device provided in further embodiments of the present application;

FIG. 6 is a rear view of an electronic device provided in further embodiments of the present application;

FIG. 7 is a rear view of a portion of the structure of the electronic device shown in FIG. 1;

FIG. 8 is a schematic diagram illustrating a process for disassembling the electronic device shown in FIG. 7;

FIG. 9 is a graph of the effect of testing the surface energy of an object;

FIG. 10 is a schematic cross-sectional view of the electronic device of FIG. 4 at line B-B;

fig. 11 is a schematic structural view of a first cover of the electronic device shown in fig. 9;

FIG. 12 is a schematic diagram illustrating a process for disassembling the electronic device shown in FIG. 9;

FIG. 13 is a cross-sectional view of the first cover of FIG. 11 taken along line E-E;

FIG. 14 is a schematic view of the first coating of FIG. 13;

FIG. 15 is a flow chart of the first coating shown in FIG. 14;

FIG. 16 is another cross-sectional view of the first cover of FIG. 11 taken along line E-E;

FIG. 17 is a schematic view of a second surface of a second structural member provided in accordance with further embodiments of the present application;

FIG. 18 is a rear view of the electronic device of FIG. 4 with the first cover removed;

FIG. 19 is a schematic view illustrating an assembly of the first cover and the first adhesive layer of the electronic device shown in FIG. 4;

FIG. 20 is a schematic view of an assembly of a second cover portion and a first adhesive layer of the electronic device of FIG. 2;

FIG. 21 is a schematic view of a decorative piece of the electronic device of FIG. 1;

FIG. 22 is a front view of a center frame of the electronic device of FIG. 2;

fig. 23 is a rear view of a screen of the electronic device shown in fig. 2.

Reference numerals:

100-an electronic device;

10-screen; 11-cover plate; 12-a display screen;

20-a housing; 21-a back cover; 211-mounting holes; 22-middle frame; 221-frame; 2211-a step; 222-middle plate;

30-a circuit board;

40-a circuit board holder; 41-avoidance port;

50-a camera module;

60-a flash module;

70-a camera trim assembly; 71-a decoration; 711-light holes; 712-a first surface; 7121-third region; 7122-fourth region; 713-a first groove; 72-a first cover; 721-light transmissive region; 722-a second surface; 722 a-a first edge segment; 722 b-a third edge segment; 7221-first region; 7222-a second region; 723-a first cover portion; 724-a second cover portion; 725-body portion; 726—a first coating; 7261-a first primer layer; 7262-a second primer layer; 7263-vacuum coating layer; 7264-a middle paint layer; 7265-topcoat layer; 727-third coating; 728-fourth coating; 73-a first adhesive layer; 73 a-a first outer side; 73a 1-a second edge section; 73 b-a second outer side; 731-a first glue segment; 732-a second glue segment; 733-a third glue segment; 734-a rib connecting section;

80-a fastener;

200-protecting a clamp; 201-a base; 202-a protective cover plate; 2021-tear-open;

300-a first disassembling tool;

400-adsorbing means;

500-disassembling tool;

600-dyne pen.

Detailed Description

In the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and for example, "connected" may be either detachably connected or non-detachably connected; may be directly connected or indirectly connected through an intermediate medium.

In the embodiments of the present application, it is to be understood that references to directional terms, such as "upper", "lower", "left", "right", "inner", "outer", etc., are merely with reference to the orientation of the drawings, and thus, the use of directional terms is intended to better and more clearly illustrate and understand the embodiments of the present application, rather than to indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore, should not be construed as limiting the embodiments of the present application.

In the present embodiments, the terms "first," "second," "third," "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", "a third" and a fourth "may explicitly or implicitly include one or more such feature.

In the present embodiments, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the embodiment of the present application, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the embodiment of the present application, it should be noted that "vertical" and "parallel" are respectively indicated as being substantially vertical and substantially parallel within a range allowing an error, and the error range may be a range in which an angle of deviation is less than or equal to 5 °, 8 °, or 10 ° with respect to absolute vertical and absolute parallel, respectively, and are not particularly limited herein. In addition, the shapes of the respective members described below are "rectangular", "square", etc. which are all indicative of the general shapes, and the adjacent sides may be provided with rounded corners or may not be provided with rounded corners.

The present application provides an electronic device including, but not limited to, a cell phone, a tablet computer (tablet personal computer), a laptop computer (laptop), a personal digital assistant (personal digital assistant, PDA), a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, and the like. Wherein the wearable device includes, but is not limited to, a smart bracelet, a smart watch, a smart head mounted display, smart glasses, and the like.

Referring to fig. 1, fig. 1 is a perspective view of an electronic device 100 according to some embodiments of the present application. The present embodiment and the following embodiments are exemplary illustrations using the electronic device 100 as a mobile phone. The electronic device 100 is approximately rectangular plate-like. On this basis, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established, the width direction of the electronic apparatus 100 is defined as the X-axis direction, the length direction of the electronic apparatus 100 is defined as the Y-axis direction, and the thickness direction of the electronic apparatus 100 is defined as the Z-axis direction. It is to be understood that the coordinate system of the electronic device 100 may be flexibly set according to actual needs, which is not specifically limited herein. In other embodiments, the shape of the electronic device 100 may also be square flat plate, round flat plate, oval flat plate, etc., which is not particularly limited herein.

Referring to fig. 1 and fig. 2 together, fig. 2 is an exploded view of the electronic device 100 shown in fig. 1. The electronic device 100 may include a screen 10, a housing 20, a circuit board 30, a circuit board holder 40, a camera module 50, a flash module 60, and a camera trim assembly 70. It is to be understood that fig. 1 and 2 only schematically illustrate some components included in the electronic device 100, and the actual shape, actual size, actual position, and actual configuration of these components are not limited by fig. 1 and 2.

The screen 10 is used to display images, videos, and the like. The screen 10 includes a cover plate 11 and a display screen 12. The cover plate 11 is a light-transmitting cover plate, and the cover plate 11 is laminated on the display side of the display screen 12. The cover plate 11 is mainly used for protecting and dustproof the display screen 12. The cover plate 11 may be made of glass. In other embodiments, the cover 11 may be made of plastic. For example, the cover plate 11 may be made of polycarbonate, polymethyl methacrylate, or the like.

The display 12 is a main component for displaying images and videos. The display 12 may be a flexible display or a rigid display. For example, the display 12 may be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini-light-emitting diode (mini-emitting diode) display, a micro-organic light-emitting diode (micro organic light-emitting diode) display, a quantum dot light-emitting diode (quantum dot light emitting diode, QLED) display, a liquid crystal display (liquid crystal display, LCD).

The housing 20 is used to protect the internal electronics of the electronic device 100. The housing 20 may include a back cover 21 and a middle frame 22. The back cover 21 is located at a side of the display screen 12 away from the cover plate 11, and is stacked with and spaced from the cover plate 11 and the display screen 12. In some examples, the back cover 21 may be a plastic structural member, or may be a composite plate structural member formed by stacking multiple plastic materials. In other examples, the back cover 21 may be a glass structure. In still other examples, the back cover 21 may be a metallic structural member.

The middle frame 22 serves as a support skeleton for the electronic device 100. The middle frame 22 includes a rim 221 and a middle plate 222. The back cover 21 is located at a side of the middle frame 22 far away from the screen 10, and the back cover 21 and the frame 221 are relatively fixed, specifically, the frame 221 may be fixedly connected with the back cover 21 by an adhesive, a clamping connection or the like. In other embodiments, the bezel 221 may be integrally formed with the back cover 21, i.e., the bezel 221 is integrally formed with the back cover 21. The cover 11 may be fixed on the bezel 221 by gluing, and the cover 11, the back cover 21 and the bezel 221 enclose an internal accommodating space of the electronic device 100. The middle plate 222 is disposed in the inner accommodating space, and the middle plate 222 is located at a side of the display screen 12 away from the cover plate 11. The outer edge of the middle plate 222 is connected to the inner side of the rim 221. In some examples, the outer edge of middle plate 222 is secured to the inner side of bezel 221 by gluing. In other examples, the middle plate 222 may be integrally formed with the frame 221, that is, the middle plate 222 and the frame 221 are integrally formed.

The middle plate 222 divides the inner accommodating space into two spaces independent of each other. Wherein a space is located between the middle plate 222 and the back cover 21, and the circuit board 30, the circuit board holder 40, the camera module 50, the flash module 60, and the battery (not shown) are located in the partial space. Another space is located between the cover plate 11 and the middle plate 222, and the display screen 12 is located in this partial space. In other embodiments, middle frame 22 may not include middle plate 222.

The circuit board 30 may be a main circuit board of the electronic device 100. The circuit board 30 may be a hard circuit board, a flexible circuit board, or a combination of a hard and soft circuit board. The circuit board 30 may be an FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, or the like. Here, FR-4 is a code of a flame resistant material grade, and the Rogers dielectric board is a high frequency board. The circuit board 30 is used for disposing electronic components and for making electrical connection between the electronic components. The electronic components may be, for example, a central processing unit (central processing unit, CPU), a graphics processor (graphics processing unit, GPU), a general purpose memory (universal flash storage, UFS), a headset, etc.

The circuit board 30 may be fixed to the inside of the electronic device 100 by screwing, clamping, gluing, welding, or the like, and stacked and spaced apart from the back cover 21. Referring to fig. 2 and 3 together, fig. 3 is a cross-sectional view of the electronic device 100 shown in fig. 1 at line A-A. The circuit board 30 is fixed to the center 22. Specifically, the circuit board holder 40 is located between the circuit board 30 and the back cover 21, and the circuit board holder 40 is connected to the circuit board 30 and the middle board 222, respectively. Thus, the fixing reliability of the circuit board 30 can be improved by fixing the circuit board 30 to the middle frame 22 by the circuit board holder 40; in addition, the circuit board holder 40 may also separate the electronic device on the circuit board 30 from the back cover 21, so that the back cover 21 may be prevented from deforming to strike the electronic device to cause damage to the electronic device when the electronic device 100 is dropped. In other embodiments, the circuit board support 40 may not be included in the electronic device 100, and the circuit board 30 may be directly fixed to the middle frame 22. In still other embodiments, where the electronic device 100 does not include the midplane 222, the circuit board 30 may also be secured to the surface of the screen 10 proximate the back cover 21.

The camera module 50 is used for taking pictures/video. The flash module 60 is used for supplementing light, so that the camera module 50 can shoot video or images in dim light. The camera module 50 and the flash module 60 may be disposed on the circuit board 30. Referring to fig. 4-6 together, fig. 4 is a back view of an electronic device 100 according to other embodiments of the present application, fig. 5 is a back view of the electronic device 100 according to other embodiments of the present application, and fig. 6 is a back view of the electronic device 100 according to other embodiments of the present application. Along with the improvement of the requirements of users on shooting definition, angle, distance, etc., the number of camera modules 50 in the electronic device 100 is generally not more than one, and the number and arrangement of the camera modules 50 may be different for different types of electronic devices 100. In order to supplement light to the plurality of camera modules 50 at the same time, the distances between the flash module 60 and the plurality of camera modules 50 are as equal as possible.

In the embodiment shown in fig. 4, the number of the camera modules 50 is two, the flash modules 60 and the camera modules 50 are distributed on the same circumference, and the flash modules 60 are located between the two camera modules 50. In the embodiment shown in fig. 5, the number of the camera modules 50 is three, and the flash modules 60 and the three camera modules 50 are equally spaced on the same circumference. In the embodiment shown in fig. 6, the number of camera modules 50 is five, the flash modules 60 and the four camera modules 50 are distributed on the same circumference, and one camera module 50 is located at the center of the circumference. In this way, the backside of the electronic device 100 may have a large annular appearance, so that the whole appearance of the electronic device 100 is more delicate and beautiful. In other embodiments, the camera module 50 and the flash module 60 may be arranged in other ways.

Based on this, referring back to fig. 2 and 3, the circuit board support 40 is provided with a plurality of avoidance ports 41, and the flash module 60 and the plurality of camera modules 50 are respectively located in the plurality of avoidance ports 41 and are abutted against the inner side walls of the avoidance ports 41. In this way, the avoidance port 41 can avoid the camera module 50 and the flash module 60, and can also limit the movement of the camera module 50 and the flash module 60 relative to the circuit board 30 in a direction parallel to the circuit board 30.

On this basis, the back cover 21 has mounting holes 211, and the mounting holes 211 penetrate the back cover 21 in the thickness direction of the back cover 21. The camera decorating assembly 70 is fixedly connected with the back cover 21 and seals the mounting hole 211. In this way, the camera decoration assembly 70 can protect the camera module 50 and the flash module 60, and also can play a role in decorating the electronic device 100.

With continued reference to fig. 2 and 3, the camera trim assembly 70 includes a trim piece 71 and a first cover 72. The material of the decorative piece 71 includes, but is not limited to, one or more of glass, plastic, and metal. The ornament 71 is generally formed in a flat plate shape having a circular outer peripheral outline shape. In other embodiments, the peripheral outline of the decorative piece 71 may be square, rectangular, oval, or contoured.

The decorative member 71 is fixed to the back cover 21, and closes the mounting hole 211. The decoration 71 may also be in direct contact with the camera module 50 or in indirect contact with the camera module 50 through a sealing member (not shown in the drawing) to restrict the camera module 50 from moving in the thickness direction of the electronic device 100 with respect to the circuit board 30. Specifically, the decorative member 71 is provided on the side of the back cover 21 away from the screen 10, and is adhered to the surface of the back cover 21 away from the screen 10 by glue. The decorative piece 71 is further fixed to the circuit board 30 or the circuit board bracket 40 or the middle plate 222 by a fastener 80, wherein the fastener 80 may be a screw or a stud or other fasteners. In this way, when the back cover 21 is a plastic structural member or a composite plate structural member with weak strength, the back cover 21 is easy to deform during long-term use of the electronic device 100, so that the decoration 71 is easy to arch and tilt, and the camera module 50 is not sealed or is not aligned or the decoration 71 is not aligned. In addition, it is possible to prevent the electronic apparatus 100 from falling off the decorative member 71 due to failure of the adhesive between the decorative member 71 and the back cover 21 during long-term use.

The decoration 71 is provided with a plurality of light holes 711, the light holes 711 are in one-to-one correspondence with the camera module 50 and the flash module 60, and the light incident surface of the camera module 50 and the light emergent surface of the flash module 60 can be located in the corresponding light holes 711. In other embodiments, the light incident surface of the camera module 50 and the light emergent surface of the flash module 60 may be disposed opposite to the corresponding light holes 711. In still other embodiments, the end of the decorative member 71 facing the screen 10 may also be positioned in the mounting hole 211, and the decorative member 71 is adhered to the surface of the back cover 21 facing the screen 10 by glue.

The first cover 72 is substantially flat, and the outer shape of the first cover 72 may be substantially the same as the outer shape of the decoration 71, so that the whole appearance of the electronic device 100 is more attractive. The first cover 72 is stacked on a side of the decoration 71 away from the screen 10 to cover the light hole 711 and the fastener 80, thereby protecting the camera module 50 and the flash module 60 from water and dust. That is, the camera module 50 and the flash module 60 are disposed on the side of the back cover 21 opposite to the first cover 72, and in other embodiments, the outer contour shape of the first cover 72 may be different from the outer contour shape of the decoration 71.

The first cover 72 has a light-transmitting area 721, the light-transmitting area 721 is opposite to the light-transmitting hole 711 of the decoration 71, and the light-incident surface of the camera module 50 and the light-emitting surface of the flash module 60 face the light-transmitting area 721, so that the camera module 50 receives the light from the outside of the electronic device 100 through the light-transmitting area 721 and the corresponding light-transmitting hole 711, and the flash module 60 sends the light to the outside of the electronic device 100 through the light-transmitting area 721 and the corresponding light-transmitting hole 711. In some examples, the number of light transmitting areas 721 may be plural, and the light transmitting areas 721 are in one-to-one correspondence with the light transmitting holes 711. In other examples, the number of light transmitting areas 721 may be one, and one light transmitting area 721 is opposite to all the light transmitting holes 711, which is not limited in this application.

On the basis of the above, the camera decorating assembly 70 further includes a first adhesive layer 73, the first cover 72 may be adhesively fixed to the decorating member 71 through the first adhesive layer 73, and the first cover 72, the decorating member 71 and the first adhesive layer 73 form an adhesive structure. Namely, the bonding structure comprises a first structural member, a second structural member and a first adhesive layer, wherein the first structural member is a decoration 71, the second structural member is a first cover 72, and the first adhesive layer is a first adhesive layer 73. Specifically, the decorative piece 71 has a first surface 712, the first surface 712 being a surface of the decorative piece 71 facing away from the screen 10. The first cover 72 has a second surface 722, the second surface 722 being a surface of the first cover 72 facing the screen 10 and the back cover 21, the second surface 722 facing the first surface 712. The first adhesive layer 73 is adhered between the first surface 712 and the second surface 722. The first adhesive layer 73 may be a back adhesive, for example, the first adhesive layer 73 may be a foam adhesive. In other embodiments, the first adhesive layer 73 may be a hot melt adhesive or an ultraviolet light curable adhesive. In other embodiments, the first structural member may be the first cover 72, and the second structural member may be the decorative member 71.

In the embodiment shown in fig. 3, the ornamental piece 71 has a first groove 713, the walls of the first groove 713 forming a portion of the first surface 712. The first cover 72 is located in the first groove 713, the groove side wall of the first groove 713 is disposed around the first cover 72, and the first adhesive layer 73 is adhered between the second surface 722 of the first cover 72 and the groove bottom wall of the first groove 713. In this way, the groove side wall of the first groove 713 can play a role in limiting and protecting, so that the first adhesive layer 73 can be prevented from being exposed outside the camera decoration assembly 70, and under the action of external force, the first adhesive layer 73 is easier to separate from the decoration 71 or the first cover 72, so that dust or water vapor outside the electronic device 100 enters into the relevant components damaged inside the electronic device 100. In other embodiments, the groove side wall of the first groove 713 may be stepped, and the first adhesive layer 73 may be adhered between the second surface 722 and the step surface of the groove side wall of the first groove 713. In still other embodiments, the decorative piece 71 may not have the first groove 713, and the first cover 72 may be adhered directly to the first surface 712 of the decorative piece 71.

Referring to fig. 3 and fig. 7 together, fig. 7 is a rear view of a part of the structure of the electronic device 100 shown in fig. 1. The first cover 72 may be a split structure, with the first cover 72 including a first cover portion 723 and a second cover portion 724. The first cover portion 723 may have a ring shape, and the shape of the outer contour of the first cover portion 723 is adapted to the shape of the outer contour of the first groove 713. The surface of the first cover 72 facing the screen 10 and the back cover 21 forms part of the second surface 722, and part of the first adhesive layer 73 is adhered between the first cover portion 723 and the decorative element 71. The first cover portion 723 is disposed opposite to the light incident surface of the camera module 50 along the thickness direction of the electronic device 100, and the light transmitting region 721 is disposed on the first cover portion 723. The first cover portion 723 may be a glass structure, so that the first cover portion 723 has better light transmittance, so as to ensure the effect of the image/video captured by the camera module 50.

The second cover portion 724 is located in the inner bore of the first cover portion 723, the outer contour of the second cover portion 724 conforming to the contour of the inner bore of the first cover portion 723. The surface of the second cover portion 724 facing the screen 10 and the back cover 21 forms another part of the second surface 722. Another portion of the first adhesive layer 73 is adhered between the second cover portion 724 and the decorative item 71. The second cover portion 724 is disposed opposite the fastener 80 in the thickness direction of the electronic apparatus 100. The second cover portion 724 may be a plastic structural member, a composite plate structural member, a metal structural member, or a glass structural member. Accordingly, when the electronic device 100 is disassembled for maintenance, at least the second cover portion 724 of the first cover 72 needs to be removed from the decoration 71, and then the fastener 80 needs to be removed from the corresponding connecting structure, so that the back cover 21 can be removed from the middle frame 22, and further, the components inside the electronic device 100 can be maintained.

Referring to fig. 7 and fig. 8 together, fig. 8 is a schematic diagram illustrating a process of disassembling the electronic device 100 shown in fig. 7. Referring to fig. 8 (a), a protective clamp 200 is provided, the protective clamp 200 includes a base 201 and a protective cover 202, the protective cover 202 has a disassembling opening 2021 penetrating through the protective cover 202, the electronic device 100 is disposed in an accommodating space defined by the base 201 and the protective cover 202, and a portion of the second cover portion 724 is exposed at the disassembling opening 2021.

Next, referring to fig. 8 (b), the first disassembling tool 300 is passed through the disassembling hole 2021 and then penetrates the edge-near region of the second cover portion 724 to form a hole. Next, the protective cover 202 of the protective clamp 200 is opened, and the end of the first removing tool 300 is inserted into the hole of the second cover portion 724 to lift the second cover portion 724 off the decorative piece 71, so as to expose the fastener 80 and a portion of the first adhesive layer 73. Wherein the first removing tool 300 may include, but is not limited to, tweezers and a pointed cone. It should be noted that, when the second cover portion 724 is perforated, the burr formed on the decorative piece 71 by the first removing machine 300 needs to be lower than the area on the first surface 712 for adhering to the first adhesive layer 73, so as to prevent the new second cover portion 724 from being damaged when the new second cover portion 724 is installed.

Next, the exposed portions of the first adhesive layer 73 are removed and the fasteners 80 are removed from the corresponding attachment structures using a second removal tool to facilitate removal of the back cover 21 from the central frame 22. Wherein, the second disassembling tool can be a manual electric screwdriver or a screw driver.

The disassembling mode of the damaged second cover portion 724 requires development of a special protection clamp 200, and the disassembled second cover portion 724 cannot be reused, which increases the cost of the 0.1-element second cover portion 724, and thus the overall cost is high. In addition, when the method is used for disassembling the cover made of glass, the cover is easy to be broken and damage to other components in the electronic device 100, so that the method is only suitable for disassembling the cover made of plastic, and has a narrow application range, so that the first cover 72 cannot be a complete glass cover integrally formed, and the improvement of the fine aesthetic property of the ID modeling of the whole electronic device 100 is not facilitated.

In order to solve the problem of the aesthetic appearance of the electronic device 100, referring back to fig. 3, the first cover 72 may be an integral structure, the material of the first cover 72 may be glass, so that the light transmittance of the light transmitting area 721 of the first cover portion 723 is ensured, and the effect of the image/video captured by the camera module 50 is ensured, and meanwhile, the texture or the digital graphics may be transferred to the portion of the first cover 72 except for the light transmitting area 721, so as to improve the appearance refinement of the whole electronic device 100. Based on this, when the first cover 72 is removed, the electronic device 100 may be placed in a fixture of a laser engraving machine (such as a red light laser engraving machine), the laser engraving machine is used to perform laser engraving on the portion of the second cover 724 bonded to the first adhesive layer 73, the remaining portion of the second cover 724 is removed by the suction cup, the first adhesive layer 73 remaining on the first surface 712 of the decorative piece 71 is removed by the first removing tool 300, and the fastener 80 is continuously removed by cleaning the first surface 712 with a dust-free cloth dipped with alcohol, so as to remove the back cover 21 from the middle frame 22.

In this disassembling mode, the laser engraving machine needs to be added to the production line of the electronic device 100, and the damaged second cover portion 724 cannot be reused, so that the whole first cover 72 cannot be reused, the cost of the first cover 72 is increased by 0.5 yuan, and the disassembling efficiency is low. It should be noted that, when the first cover 72 is a split structural member, the machine disassembly and maintenance can be performed in a laser etching manner.

In the above manner of detaching the first cover 72 from the decoration 71, a dedicated detaching jig or device is required to be configured, and the structural member forming the bonding structure is damaged during detachment, so that the detachment difficulty is high, the efficiency is low, and the cost is high.

The surface energy of an object directly affects the adhesion of surface substances, the wettability and permeability of liquids to surfaces. The surface energy of a substance can be obtained by calculating the contact angle of a liquid, wherein the contact angle refers to the angle at the boundary of the liquid and a solid, the smaller the contact angle is, the larger the surface energy is, the more moist the surface of an object is, the stronger the hydrophilicity of the surface of the object is, and the better the bonding performance with another material is; the larger the contact angle, the smaller the surface energy, the less wetted the object surface, the more hydrophobic the object surface, and the poorer the bonding properties with another material.

Referring to fig. 9, fig. 9 is a graph showing the effect of testing the surface energy of an object. The surface energy of the object may be measured by the dyne pen 600. The surface energy of the surface area C is greater than the surface energy of the surface area D by drawing the test solution on the test surface with a standard dyne pen 600, as can be seen in fig. 12, without the test solution on the surface area C aggregating into a plurality of beads. If the aggregation effect of the test liquid on the test surface reaches the aggregation effect required by the specification of the dyne pen 600, the surface energy of the test surface reaches the specification value of the dyne pen.

In view of this, referring to fig. 10 and 11, fig. 10 is a schematic cross-sectional view of the electronic device 100 shown in fig. 4 at line B-B, and fig. 11 is a schematic structural view of the first cover 72 of the electronic device 100 shown in fig. 10. The embodiment shown in fig. 10 and 11 differs from the embodiment shown in fig. 3 in that: the first cover 72 is an integral structural member. The second surface 722 of the first cover 72 includes a first region 7221 and a second region 7222, a partial edge of the first region 7221 forming a partial edge of the second surface 722, the surface energy of the first region 7221 being less than the surface energy of the second region 7222. The first adhesive layer 73 is adhered between the first region 7221 and the first surface 712, and between the second region 7222 and the first surface 712.

Thus, by making the surface energy of the first region 7221 of the second surface 722 smaller than the surface energy of the second region 7222, the adhesive strength between the first region 7221 and the first adhesive layer 73 is made smaller than the adhesive strength between the second region 7222 and the first adhesive layer 73. Referring to fig. 12, fig. 12 is a schematic diagram illustrating a process of disassembling the electronic device 100 shown in fig. 9. When the first cover 72 is detached from the decoration 71, an adsorption force can be applied to a portion of the first cover 72 corresponding to the first region 7221 by the adsorption tool 400 (such as a suction cup), so that the first region 7221 is separated from the first adhesive layer 73 to form a detachment gap, and then an end portion of the detaching tool 500 (such as a detaching bar or a detaching sheet) is inserted into the detachment gap to apply a force to detach the first cover 72 from the decoration 71. Therefore, the material of the decoration 71 and the first cover 72 is not limited, and the first cover 72 can be detached from the decoration 71 without designing a special fixture or equipment in the detaching process, so that the detaching operation is simple, the detaching efficiency is high, and the detaching operation is easy to realize. In addition, the disassembled and separated decoration 71 and the first cover 72 are complete in structure and can be reused, so that the maintenance cost of the electronic equipment 100 is saved, and the safety is high.

The surface energy of the first region 7221 may be less than or equal to 30 dynes. For example, the surface energy of the first region 7221 can be 30 dyne or 28 dyne or 24 dyne or 22 dyne or 20 dyne or 18 dyne or 16 dyne, etc. In this way, the adhesive strength between the first region 7221 and the first adhesive layer 73 is small, and the first cover 72 is easily detached from the garnish 71.

The surface energy of the second region 7222 may be greater than or equal to 34 dynes. For example, the surface energy of the second region 7222 can be 34 dynes or 36 dynes or 38 dynes or 40 dynes or 42 dynes, etc. In this way, the bonding strength between the second area 7222 and the first adhesive layer 73 is greater, so that the bonding reliability between the second area 7222 and the first surface 712 is ensured, and the reliability of the whole electronic device 100 is further ensured.

On the basis of the above, the area of the first region 7221 is smaller than the area of the second region 7222. In this way, the area of the second surface 722 bonded to the first adhesive layer 73 is larger, so that the first cover 72 is easy to detach from the decoration 71, and the reliability of the bonding of the first cover 72 and the decoration 71 can be ensured, thereby ensuring the reliability of the whole electronic device 100.

On the basis of the above, referring back to fig. 11, the edge of the second surface 722 includes a first edge section 722a and a third edge section 722b that are connected, a part of the edge of the first region 7221 forms the first edge section 722a, and a part of the edge of the second region 7222 forms the third edge section 722b. The distance L1 between one end point O and the other end point P of the first edge section 722a is greater than or equal to 10 millimeters. On this basis, the width H1 of the first region 7221 is greater than or equal to 1 mm in a direction perpendicular to the line connecting the two end points of the first edge segment 722a (i.e., in a direction perpendicular to the straight line OP). For example, the distance L1 between the end point O and the end point P may be 10 mm or 11 mm or 12 mm or 13 mm or 14 mm or 15 mm or 16 mm or 17 mm or 18 mm or 19 mm or 20 mm. The width H1 of the first region 7221 can be 1 mm or 1.1 mm or 1.2 mm or 1.3 mm or 1.4 mm or 1.5 mm or 1.6 mm or 1.7 mm or 1.8 mm or 1.9 mm or 2.0 mm or 2.1 mm or 2.2 mm or 2.3 mm or 2.4 mm or 2.5 mm.

In this way, when the first cover 72 is detached from the decoration 71, the first cover 72 and the first adhesive layer 73 are separated from each other to form a detachment gap, so that the end of the detaching tool 500 (such as a detaching bar or a detaching sheet) with a common length and a width can be accommodated, and the first cover 72 is more convenient to detach from the decoration 71.

There are various implementations of making the surface energy of the first region 7221 smaller than the surface energy of the second region 7222.

In some embodiments, referring to FIG. 13, FIG. 13 is a cross-sectional view of the first cover 72 of FIG. 11 taken along line E-E. The first cover 72 includes a main body portion 725 and a first coating 726. The shape of the body portion 725 corresponds to the overall shape of the first cover 72. The material of the body portion 725 includes, but is not limited to, glass, plastic having high light transmittance, and the like. The surface of the body portion 725 includes a first surface area 725a and a second surface area 725b. Wherein the second surface area 725b forms a second area 7222 of the second surface 722 of the first cover 72. On this basis, a first coating 726 is provided on the first surface area 725a, and a surface of the first coating 726 facing away from the first surface area 725a forms a first area 7221 of the second surface 722. In this way, the first coating layer with different material can be selected according to the material of the main body 725 and the surface energy requirements of different areas of the second surface 722, which is easy to achieve.

In some examples, the first coating 726 includes an anti-fingerprint AF film layer. The surface energy of the common materials is shown in table 1. The AF film has the smallest surface energy, the largest liquid contact angle, that is, the best antifouling and waterproof properties, and the smallest adhesive strength with the first adhesive layer 73. The titanium oxide film has the greatest surface energy, the smallest liquid contact angle, the worst antifouling and waterproof effects, and the greatest bonding strength with the first bonding adhesive layer 73. The surface energy of aluminum, steel and glass, which are commonly used in the electronic device 100, is relatively large, and the adhesion strength between the aluminum, steel and glass and the first adhesive layer 73 is relatively high. In this way, the AF film can be simultaneously plated on the surface of the main body 725 facing away from the screen 10 and the AF film can be simultaneously plated on the first surface area 725a of the main body 725, thereby simplifying the overall processing of the electronic device 100 and having high production efficiency.

TABLE 1

Surface material	Surface energy	Contact angle of liquid
			AF film	16	115
Polytetrafluoroethylene	18.5	114
			Polypropylene	31	108
Aluminum (Al)	49	60
			Steel and method for producing same	60	53
Glass	78	＜15
			Titanium oxide film	111	＜5

The material of the AF film layer may include fluoride. Since fluorine has a small atomic radius and strong electronegativity, it can generate very low surface energy, and thus, the introduction of fluorine-containing functional groups on the solid surface can effectively reduce the surface energy. The composition of the AF film layer is shown in table 2, the AF film layer can be made of 45-55% concentration of 1,2, 3-heptafluoro-2- (ethoxydifluoromethyl) -propane 1,2,3, 4 at a concentration of 25% to 35%, -nonafluoro-1-ethoxy-butane and a concentration of fluoropolymer of 15% -25%.

TABLE 2

Composition of the components	Concentration (mass%)
		1,2, 3-heptafluoro-2- (ethoxydifluoromethyl) -propane	45-55
1,2,3, 4, -nonafluoro-1-ethoxy-butane	25-35
		Fluorine-containing polymer	15-25

In other examples, the first coating 726 includes an ultraviolet light cured paint layer. Specifically, referring to fig. 14, fig. 14 is a schematic structural diagram of the first coating 726 in fig. 13. The first coating layer 726 includes a first primer layer 7261, a second primer layer 7262, a vacuum-deposited film layer 7263, a middle paint layer 7264, and a top paint layer 7265 which are laminated in this order. The first primer layer 7261 is disposed on the first surface region 725a of the main body portion 725 in a stacked manner, and a surface of the topcoat layer 7265 facing away from the first surface region 725a forms a first region 7221 of the second surface 722. The first primer layer 7261, the second primer layer 7262, the middle primer layer 7264, and the top primer layer 7265 may each be an ultraviolet curable paint layer. Wherein, the second primer layer 7262 can be a colored paint layer, the vacuum coating layer 7263 plays a role of high-brightness edge, the middle paint layer 7264 can be a protective paint layer, and the top paint layer 7265 plays a role of protecting the paint layer below.

The material of the topcoat layer 7265 may include a resin including one or more of acrylic, polyester, acrylate, amino resins, which is a film former of the topcoat layer 7265. The material of the finish paint layer 7265 can also comprise a solvent, and the solvent has the effects of reducing the viscosity of the finish paint system, facilitating atomization and construction. The material of the finish layer 7265 can also comprise additives, wherein the additives are various auxiliary agents, and the effects of improving the performance of the finish and the appearance effect of a paint film are achieved. The material of the topcoat layer 7265 may also include pigments that serve to adjust color and protection. The material of the topcoat layer 7265 may also include a photoinitiator that functions to allow the topcoat layer 7265 to absorb ultraviolet light and cure rapidly.

Because the resin in the finish layer 7265 is basically oily and is insoluble in water, and the organosilicon component and/or the fluorine modified resin component are/is generally added to the auxiliary agent in the finish layer 7265, the finish layer 7265 has better hydrophobicity, so that the liquid contact angle of the surface of the finish layer 7265 is larger, the surface energy of the finish layer 7265 is lower, and the surface energy of the measured finish layer 7265 can reach the effect of less than 30 dynes. Therefore, the first coating 726 has high compactness and high glossiness, and can protect and highlight the decoration effect, and can facilitate the detachment of the first cover 72 from the decoration 71.

Referring to fig. 15, fig. 15 is a flow chart illustrating the fabrication of the first coating 726 shown in fig. 14. First, a base material is provided, and the base material is the main body 725. Next, a primer is sprayed on the first surface area 725a of the body portion 725 to form a first primer layer 7261. Next, a primer is sprayed on the first primer layer 7261 to form a second primer layer 7262. Next, a vacuum plating treatment is performed on the second primer layer 7262 to form a vacuum plating layer 7263. Next, a protective paint is sprayed on the vacuum plating layer 7263 to form a middle paint layer 7264. Next, a topcoat is sprayed over the middle paint layer 7264 to form a topcoat layer 7265.

In other embodiments, referring to FIG. 16, FIG. 16 is another cross-sectional view of the first cover 72 shown in FIG. 11 taken along line E-E. The embodiment shown in fig. 16 differs from the embodiment shown in fig. 13 in that: the first cover 72 includes a third coating 727 and a fourth coating 728, the third coating 727 being disposed on the first surface region 725a, a surface of the third coating 727 facing away from the first surface region 725a forming a first region 7221 of the second surface 722. The fourth coating 728 is disposed on the second surface area 725b, and a surface of the fourth coating 728 opposite the second surface area 725b forms a second area 7222 of the second surface 722. In this way, the materials or parameters of the third coating 727 and the fourth coating 728 can be selected according to the surface energy requirements of the different regions of the second surface 722, so that differentiation between the surface energy of the first region 7221 and the second region 7222 can be easily achieved. In the embodiment shown in fig. 13 and 16, the difference in surface energy between the first region 7221 and the second region 7222 can also be confirmed by testing the difference in composition of the materials forming the first region 7221 and the second region 7222.

In some examples, the third coating 727 includes an anti-fingerprint AF film layer, and the fourth coating 728 includes an ink layer. The ink layer may be a second ink layer. The ink layer may be disposed on the second surface area 725b by silk screening. In this way, the surface energy of the second ink layer can be relatively large while the first cover 72 is easily detached from the decoration 71, which is beneficial to improving the bonding reliability between the first cover 72 and the decoration 71, and further ensuring the reliability of the whole electronic device 100.

In other examples, third coating 727 includes an ink layer, which may be the first ink layer. The fourth coating 728 includes an ink layer, which may be a second ink layer. In this way, the third coating 727 and the fourth coating 728 can be simultaneously printed using the same printing apparatus, and only different liquid inks are required, simplifying the process of forming the second surface 722 of the first cover 72.

The ink may include a solvent and an auxiliary agent. The components and surface tension of the common ink solvents and adjuvants are shown in table 3, and the difference in surface energy between the two coatings can be achieved by adjusting the components and ratios of the solvents of the third coating 727 and the fourth coating 728. For example, the surface energy of the ink layer may be increased by increasing the surface tension of the solvent and/or the adjuvant.

TABLE 3 Table 3

Solvent(s)	Surface tension	Polymers/adjuvants	Surface tension
				Water and its preparation method	72.7	Melamine resin	57.6
Ethylene glycol	48.4	Polyethylene oxide glycol	42.9
				Propylene glycol	36.0	Polystyrene	42.6
Ortho-xylene	30.0	Polyvinyl chloride	41.9
				Toluene (toluene)	28.4	Polyvinyl acetate	36.5
Butyl acetate	25.2	Polytetrafluoroethylene	21.5
				N-butanol	24.6	Polydimethylsiloxane	15.7
Petroleum solvent oil	24.0
				Methyl isobutyl ketone	23.6
Methanol	23.60
				N-octane	21.8

In still other embodiments, the portions of the first cover 72 where the first region 7221 and the second region 7222 are formed are the same material, and the surface roughness of the first region 7221 is less than the surface roughness of the second region 7222. Since the larger the surface roughness is, the larger the effective contact surface area with the liquid is, the smaller the liquid contact angle is, the larger the surface energy of the object is, and the better the bonding performance with other materials is. Therefore, no additional coating is required to be provided, so that the surface energy of the two areas of the second surface 722 can be differentiated, and the cost of the electronic device 100 is saved. In this example, the difference in surface morphology between the first region 7221 and the second region 7222 was also examined by a high-power microscope, and the difference in surface energy between the first region 7221 and the second region 7222 was confirmed.

In some examples, the first cover 72 may be a plastic structural member. The first cover 72 is formed by an injection molding process, and the first region 7221 and the second region 7222 of the second surface 722 are formed with spark lines of different specifications. For example, the first cover 72 may be a polycarbonate structure or a fiberglass reinforced polycarbonate structure and the fire pattern may be a VDI3400 fire pattern. The VDI3400 spark line criteria and roughness are shown in Table 4. Taking polycarbonate with 20% glass fiber added as an example, the surface energy of the surface with the VDI21-VDI28 fire pattern can reach 32 dyne value and the surface energy of the surface with the VDI18 fire pattern can reach 30 dyne value. Based on this, the first region 7221 can be formed with a spark line of any one of VDI3 to VDI6, and the second region 7222 can be formed with a spark line of any one of VDI21 to 24.

TABLE 4 Table 4

In other examples, when the second structural member of the bonding structure is the decorative member 71, the decorative member 71 may be a metallic structural member. Referring to fig. 17, fig. 17 is a schematic view illustrating a second surface 722 of a second structural member according to other embodiments of the present application. The first region 7221 may be surface-treated by a polishing process to reduce the surface roughness of the first region 7221, thereby reducing the surface energy of the first region 7221; the second region 7222 may be surface treated by a wire drawing process to increase the surface roughness of the second region 7222, thereby increasing the surface energy of the second region 7222.

On the basis of the above, please refer to fig. 10 and fig. 18 together, and fig. 18 is a rear view of the electronic device 100 shown in fig. 4 after the first cover 72 is detached. The first surface 712 of the decorative piece 71 includes a third region 7121 and a fourth region 7122, the third region 7121 facing the first region 7221, the fourth region 7122 facing the second region 7222, and the surface energy of the third region 7121 being less than the surface energy of the fourth region 7122. The first adhesive layer 73 is adhered between the third region 7121 and the first region 7221, and between the fourth region 7122 and the second region 7222. The implementation manner and the related parameters for making the surface energy of the third region 7121 and the surface energy of the fourth region 7122 different may refer to the implementation manner and the related parameters for making the surface energy of the first region 7221 and the surface energy of the second region 7222 different, and will not be described herein. In this way, the adhesive strength between the first adhesive layer 73 and the third region 7121 of the decorative member 71 is also small, and the first cover 72 is more easily detached from the decorative member 71.

On the basis of the above, referring to fig. 18 and 19, fig. 18 is a rear view of the electronic device 100 shown in fig. 4 after the first cover 72 is detached, and fig. 19 is an assembly schematic diagram of the first cover 72 and the first adhesive layer 73 of the electronic device 100 shown in fig. 4. The outer side surface of the first adhesive layer 73 includes a first outer side surface 73a and a second outer side surface 73b, which are connected, and the first outer side surface 73a and the second outer side surface 73b are located between the second surface 722 and the first surface 712. Specifically, the first outer side 73a is connected between the first region 7221 and the first surface 712, and an avoidance space is defined by the first outer side 73a, a portion of the first surface 712, and a portion of the first region 7221, where the avoidance space is located on a side facing the first outer side 73a, and a portion of an opening edge of the avoidance space is a portion of an edge of the second surface 722. Thus, when the first cover 72 is detached from the decorative member 71, the escape space can accommodate the end of the detaching tool 500 (such as a detaching bar or a detaching piece), thereby facilitating the detachment of the first cover 72 from the decorative member 71.

Based on this, the edge where the first outer side surface 73a meets the first region 7221 is the second edge segment 73a1, and the second edge segment intersects the first edge segment 722a at the first intersection point M and the second intersection point N. The straight line where the first intersection point M and the second intersection point N are located coincides with the second edge section 73a1 or is located between the second edge section 73a1 and the first edge section 722 a. The distance between the first intersection point M and the second intersection point N is greater than or equal to 10 millimeters, and the maximum distance between each point on the second edge section 73a1 and each point on the first edge section 722a along the direction perpendicular to the line where the first intersection point M and the second intersection point N are located is greater than or equal to 1 millimeter.

In some examples, the distance L2 between the first intersection point M and the second intersection point N may be 10 millimeters or 11 millimeters or 12 millimeters or 13 millimeters or 14 millimeters or 15 millimeters or 16 millimeters or 17 millimeters or 18 millimeters or 19 millimeters or 20 millimeters. The maximum distance H2 between the second edge section 73a1 and the first edge section 722a along a direction perpendicular to the straight line MN may be 1 mm or 1.1 mm or 1.2 mm or 1.3 mm or 1.4 mm or 1.5 mm or 1.6 mm or 1.7 mm or 1.8 mm or 1.9 mm or 2.0 mm. Thus, when the first cover 72 is detached from the decoration 71, the avoiding area can accommodate the end of a detaching tool (such as a detaching bar or a detaching sheet) with a common length specification and a common width specification, so that the decoration 71 and the first cover 72 can be detached and separated more conveniently.

On the basis of this, at least a part of the edge of the second outer side 73b that meets the second surface 722 coincides with the third edge segment 722 b. In some examples, the extension of the edge of the second outer side 73b that meets the second surface 722 may be the same as the extension of the third edge 722b, i.e., the edge of the second outer side 73b that meets the second surface 722 is all coincident with the third edge segment 722 b. In other examples, the edge of the second outer side 73b may also have an extension greater than the extension of the third edge section 722b, i.e., the entirety of the third edge section 722b coincides with a portion of the edge of the second outer side 73b, and another portion of the edge of the second outer side 73b is flush with a portion of the first edge section 722 a. In this way, under the condition that the first cover 72 is easy to detach from the decoration 71, the first adhesive layer 73 can enable the adhesive seal between the decoration 71 and the first cover 72 to be more reliable, and prevent dust or water vapor outside the electronic device 100 from entering between the decoration 71 and the first cover 72, so that the adhesive reliability between the two is reduced.

In some examples, with continued reference to fig. 18 and 19, the first adhesive layer 73 includes a first adhesive segment 731, a second adhesive segment 732, a third adhesive segment 733, and a web segment 734. The first glue segment 731 and the second glue segment 732 extend along the edge extension of the second surface 722 and meet to form a continuous loop. The first glue segment 731 is bonded between the first region 7221 and the first surface 712, and at least a portion of the second glue segment 732, the third glue segment 733 and the web segment 734 are bonded between the second region 7222 and the first surface 712. The outer side surface of the first glue segment 731 forms the first outer side surface 73a, the outer side surface of the second glue segment 732 forms the second outer side surface 73b, and the outer edge of the portion of the first glue segment 731 that meets the second surface 722 forms the second edge segment 73a1. The width of the first glue segment 731 is substantially the same as the width of the second glue segment 732, and the width of the first glue segment 731 is greater than or equal to 0.8 mm and less than or equal to 2 mm. For example, the width of the first glue segment 731 may be 0.8 mm or 1.0 mm or 1.2 mm or 1.4 mm or 1.6 mm or 1.8 mm or 2.0 mm. Based on this, the width H1 of the aforementioned first region 7221 is greater than or equal to 1.8 mm.

The number of the rib connecting sections 734 may be plural, and the rib connecting sections 734 are intersected or arranged in the annular interior surrounded by the first glue section 731 and the second glue section 732 at intervals, and are connected with the first glue section 731 and/or the second glue section 732. The web section 734 has a width less than or equal to 1.5 millimeters. For example, the width of the web section 734 may be 0.3 millimeters or 0.5 millimeters or 0.7 millimeters or 0.9 millimeters or 1.1 millimeters or 1.3 millimeters or 1.5 millimeters. In this way, the adhesive strength between the first adhesive layer 73 and the decorative member 71 and the first cover 72 can be ensured, and the first adhesive segment 731, the second adhesive segment 732, and the connecting rib segment 734 can be prevented from being too wide, which makes it difficult to detach the decorative member 71 and the first cover 72 due to too high adhesive strength between them and the decorative member 71 and the first cover 72.

The number of the third glue sections 733 is the same as that of the camera modules 50 and the flash modules 60, and one third glue section 733 is connected with the second glue section 732 and is arranged around one camera module 50 or one flash module 60 in a circle. In this way, the surrounding areas of the camera module 50 and the flash module 60 can be sealed and protected, so that dust and water vapor outside the electronic device 100 can be prevented from entering the electronic device 100 to damage parts.

In other embodiments, the first adhesive layer 73 may not include the third adhesive section 733 and/or the web section 734. In still other embodiments, the first glue segment 731 and the second glue segment 732 may not form a continuous loop. In other still other embodiments, the outer edges of the portion of the first adhesive layer 73 that meets the second surface 722 may also all overlap the first and third edge segments 722a, 722b of the second surface 722. In other embodiments, the first adhesive layer 73 may also cover the first area 7221 and the second area 7222, and only need to avoid the camera module 50 and the flash module 60.

On the basis of the above, the peel strength of the first adhesive layer 73 is inversely related to the ambient temperature. I.e. the peel strength of the first adhesive layer 73 decreases with increasing ambient temperature. Specifically, the peel strength of the first adhesive layer 73 in the 75 ℃ -80 ℃ (high temperature) environment is less than or equal to 0.3 times the peel strength of the first adhesive layer 73 in the 20 ℃ -25 ℃ (normal temperature) environment.

In some examples, the peel strength of the first adhesive layer 73 in a 75 ℃ (high temperature) environment may be equal to 0.3 times the peel strength of the first adhesive layer 73 in a 20 ℃ (normal temperature) environment. The peel strength of the first adhesive layer 73 in the 77 ℃ (high temperature) environment may be equal to 0.2 times the peel strength of the first adhesive layer 73 in the 23 ℃ (normal temperature) environment. The peel strength of the first adhesive layer 73 in the 80 ℃ (high temperature) environment may be equal to 0.1 times the peel strength of the first adhesive layer 73 in the 25 ℃ (normal temperature) environment. The peel strength of the first adhesive layer 73 in the 75 ℃ (high temperature) environment may be equal to 0.05 times the peel strength of the first adhesive layer 73 in the 25 ℃ (normal temperature) environment. For example, a model of the backsize used to form the first bond line 73 is tested as follows: the thickness of the back adhesive is greater than or equal to 0.05 mm and less than or equal to 0.35 mm, the peel strength of the back adhesive in the environment of 20 ℃ -25 ℃ (normal temperature) is greater than 20 newtons/25 mm, and the peel strength in the environment of 75 ℃ -80 ℃ (high temperature) is less than 1.2 newtons/25 mm. The peel strength can be referred to "method 3" in GB/T2792-2014 "test method for adhesive tape peel Strength": double-sided adhesive tape and test method for 180 ° peel strength of transfer adhesive tape and stainless steel sheet the methods described in section were tested.

In this way, when the first cover 72 is detached from the decoration 71, the electronic device 100 can be placed in a detaching environment having a temperature higher than normal temperature, so that the adhesive strength between the first adhesive layer 73 and the decoration 71, the first cover 72 is reduced, so that the decoration 71 and the first cover 72 can be detached more easily.

In the above embodiment, the first structural member of the bonding structure is taken as the decoration 71, the second structural member of the bonding structure is taken as the first cover 72, and the first adhesive layer of the bonding structure is taken as the first adhesive layer 73, and the bonding structure is described. In other embodiments, referring to fig. 20, fig. 20 is an assembly schematic diagram of the second cover portion 724 and the first adhesive layer 73 of the electronic device 100 shown in fig. 2. The embodiment shown in fig. 20 differs from the embodiment shown in fig. 19 in that: the first cover 72 is in a split structure, the first structural member of the bonding structure is a decoration 71, the second structural member is a second cover portion 724, the surface of the second cover portion 724 facing the screen 10 is a second surface 722, the first adhesive layer is a part of the first adhesive layer 73, and the specific implementation manner may refer to the embodiment of forming the bonding structure between the decoration 71 and the first cover 72, which is not described herein again. In this way, the second cover portion 724 can be easily detached from the decorative member 71 from the region F, so that the back cover 21 can be easily detached from the middle frame 22 for repairing the components inside the electronic device 100.

In other embodiments, please refer to fig. 1 and 21 together, and fig. 21 is a schematic structural diagram of a decoration 71 of the electronic device 100 shown in fig. 1. The first structural member of the bonding structure is the back cover 21, the second structural member is the decoration 71, the surface of the back cover 21 facing away from the screen 10 is the first surface, the surface of the decoration 71 facing the screen 10 is the second surface 722, the bonding adhesive layer between the back cover 21 and the decoration 71 is the first adhesive layer, and the specific embodiment of the bonding structure may refer to the embodiment of forming the bonding structure by the decoration 71 and the first cover 72, which is not described herein again. In this way, the decorative member 71 can be easily detached from the back cover 21 from the G region, so that the components in the electronic device 100 can be repaired.

In other embodiments, please refer to fig. 22 and 23 together, wherein fig. 22 is a front view of the middle frame 22 of the electronic device 100 shown in fig. 2, and fig. 23 is a back view of the screen 10 of the electronic device 100 shown in fig. 2. The first structural member of the bonding structure is a middle frame 22, the second structural member is a screen 10, the surface of the middle frame 22 opposite to the back cover 21 is a first surface 712, specifically, the middle plate 222 and the frame 221 enclose the first groove 713, the inner side of the frame 221 has a step portion 2211, that is, at least part of the groove side wall of the first groove 713 is in a step shape, and the step surface of the step portion 2211 forms a part of the first surface 712. The surface of the screen 10 facing the back cover 21 is a second surface 722, and a portion of the back surface of the cover plate 11 forms a part of the second surface 722, where the portion of the back surface forms a first area 7221 and a second area 7222, and the first adhesive layer of the adhesive structure is an adhesive layer adhered between the step surface and the cover plate 11. For a specific implementation manner of the bonding structure, reference may be made to the implementation manner of forming the bonding structure by the foregoing decoration 71 and the first cover 72, which is not described herein again. In this way, the screen 10 can be easily removed from the center 22 in the K region for servicing the components within the electronic device 100.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. An adhesive structure, comprising:

a first structural member having a first surface;

a second structural member having a second surface, the second surface comprising a first region and a second region, a partial edge of the first region forming a partial edge of the second surface, the surface energy of the first region being less than the surface energy of the second region;

and the first adhesive layer is adhered between the first area and the first surface and between the second area and the first surface.

2. The bonding structure according to claim 1, wherein the second structural member comprises:

a body portion, a surface of the body portion comprising a first surface region and a second surface region, the second surface region forming the second region;

the first coating is arranged on the first surface area, and the surface of the first coating opposite to the first surface area forms the first area.

3. The bonding structure according to claim 2, wherein,

the first coating comprises an anti-fingerprint AF film layer.

4. The bonding structure according to claim 2, wherein,

the first coating includes an ultraviolet cured paint layer.

5. The bonding structure according to claim 1, wherein the second structural member comprises:

a body portion, a surface of the body portion comprising a first surface region and a second surface region;

a third coating layer disposed on the first surface region, the surface of the third coating layer facing away from the first surface region forming the first region;

and the fourth coating is arranged on the second surface area, and the surface of the fourth coating opposite to the second surface area forms the second area.

6. The bonding structure according to claim 5, wherein,

the third coating comprises an anti-fingerprint AF film layer or an ink layer.

7. The bonding structure according to claim 6, wherein,

the fourth coating includes an ink layer.

8. The bonding structure according to claim 1, wherein,

the material forming the first area and the second area on the second structural member is the same, and the surface roughness of the first area is smaller than that of the second area.

9. The bonding structure according to any one of claims 1 to 8, wherein,

the area of the first region is smaller than the area of the second region.

10. The bonding structure according to any one of claims 1 to 9, wherein,

the surface energy of the first region is less than or equal to 30 dyne value; and/or the number of the groups of groups,

the surface energy of the second region is greater than or equal to 34 dynes.

11. The bonding structure according to any of claims 1 to 10, wherein,

the edge of the second surface comprises a first edge section, a part of the edge of the first area forms the first edge section, and the distance between two endpoints of the first edge section is greater than or equal to 10 millimeters.

12. The bonding structure according to claim 11, wherein,

the width of the first region is greater than or equal to 1 millimeter along a direction perpendicular to a line in which two end points of the first edge section are located.

13. The bonding structure according to any one of claims 1 to 12, wherein,

the first surface comprises a third region and a fourth region, and the surface energy of the third region is smaller than the surface energy of the fourth region;

the first glue layer is adhered between the third region and the first region, and between the fourth region and the second region.

14. The bonding structure according to any one of claims 1 to 13, wherein,

the first adhesive layer comprises a first outer side surface, and the first outer side surface is positioned between the first area and the first surface; an avoidance space is defined by the first outer side surface, a part of the first surface and a part of the first area; the avoidance space is located on one side, facing the first outer side face, of the first outer side face.

15. The bonding structure according to claim 14, wherein,

the edge of the second surface comprises a first edge section, a part of the edge of the first area forming the first edge section;

The edge of the first outer side surface connected with the first area is a second edge section, and the second edge section and the first edge section are intersected at a first intersection point and a second intersection point; the straight line where the first intersection point and the second intersection point are located coincides with the second edge section or is located between the second edge section and the first edge section;

the distance between the first intersection point and the second intersection point is greater than or equal to 10 millimeters, and the maximum distance between the second edge section and the first edge section is greater than or equal to 1 millimeter along the direction perpendicular to the straight line where the first intersection point and the second intersection point are located.

16. A bonding structure according to claim 14 or 15, wherein,

the second surface further includes a third edge segment, the third edge segment meeting the first edge segment, a partial edge of the second region forming the third edge segment;

the first adhesive layer further comprises a second outer side surface, the second outer side surface is connected with the first outer side surface, and at least a part of the edge of the second outer side surface connected with the second surface is overlapped with the third edge section.

17. The bonding structure according to any one of claims 1 to 16, wherein,

The peel strength of the first glue line is inversely related to the ambient temperature.

18. The bonding structure according to claim 17, wherein,

the peel strength of the first adhesive layer in the environment of 75-80 ℃ is less than or equal to 0.3 times of the peel strength of the first adhesive layer in the environment of 20-25 ℃.

19. The bonding structure according to any one of claims 1 to 18, wherein,

the first structural member has a first groove, a groove wall of which forms a part of the first surface;

the second structural member is positioned in the first groove, the groove side wall of the first groove is arranged around the second structural member in a circle, and the first adhesive layer is adhered between the second surface and the groove wall of the first groove.

20. The bonding structure according to any one of claims 1 to 19, wherein,

the first structural member is a middle frame;

the second structural member is a screen.

21. The bonding structure according to any one of claims 1 to 19, wherein,

the first structural part is a decoration, and the decoration is provided with a light hole;

the second structural member is a first cover body, the first cover body is provided with a light transmission area, and the light transmission area and the light transmission hole are oppositely arranged.

22. An electronic device, comprising:

a bonding structure, the bonding structure being the bonding structure of claim 20;

the back cover is positioned on one side, far away from the screen, of the middle frame and is fixed on the middle frame.

23. An electronic device, comprising:

the back cover is provided with a mounting hole;

an adhesive structure as claimed in claim 21, wherein the decorative member is fixed to the back cover and closes the mounting hole; the second surface faces the back cover;

the camera module is arranged on one side of the back cover, which is opposite to the second surface, and the light incident surface of the camera module faces the light transmission area.