CN117634065A - Molded line conductor structure design method - Google Patents

Abstract

The invention discloses a design method of a molded line conductor structure, which relates to the field of power cables, and comprises the following steps: obtaining single-wire combinations forming the preset line conductor based on the nominal section of the preset line conductor; calculating based on the model of each layer of single-wire corresponding molded line conductor to obtain the standard cross section area of each layer of single-wire corresponding molded line conductor and the standard diameter of each layer of single-wire corresponding molded line conductor; selecting the diameter of a central wire and the number of single wires of each layer; calculating to obtain single-line specification parameters of each layer; and when judging whether the single-wire specification parameters of each layer reach the inspection standard, re-selecting the diameter of the central wire and the number of single wires of each layer, calculating the single-wire specification parameters of each layer, and outputting the single-wire specification parameters of each layer until the single-wire specification parameters of each layer reach the inspection standard. According to the invention, the diameter compression amount of each layer of single wire is calculated, and the compression amount of each layer is used as an inspection standard, so that the specification parameters of the designed single wire are adopted, the cross-sectional area for designing the molded line conductor is reduced, the molded line conductor is stable in structure, and the surface is flat and difficult to loosen.

Description

Molded line conductor structure design method

Technical Field

The invention relates to the field of power cables, in particular to a method for designing a molded line conductor structure.

Background

At present, a round single wire stranding structure is generally selected for a copper conductor of a power cable, and the copper conductor is in a round, sector, tile-shaped and other compacting stranding structures, and because the conductor is formed by compacting and stranding round single wires, the compacting process belongs to metal cold working, the round single wires are large in deformation, the single wires are hardened, the resistivity is increased, and the section of the cable conductor cannot be further reduced and the cost of the cable cannot be reduced in the prior art. Therefore, the technology of the power cable molded line conductor is researched, the special-shaped single line replaces a round single line to be twisted, the single line is small in deformation in the twisting process, the influence on the single line resistivity is small, and therefore the required section of the cable conductor can be reduced. The existing related patent and literature do not see the design methods such as compression of each layer, the calculated sum of single-line sections of the molded lines is the section required by the cable conductor, and the phenomena such as small section, unqualified resistance and the like are easily caused by the fact that the single-line extension of the molded lines is reduced due to the tension of the single-line lines in the production process.

Disclosure of Invention

The invention aims to provide a design method of a molded line conductor structure, which is characterized in that the diameter compression amount of each layer of molded line is calculated, each layer of compression amount is used as a test standard, the specification parameters of the molded line are designed, the cross-section area for the design of the molded line conductor is reduced, the molded line conductor structure is stable, and the surface is smooth and is not easy to loose.

In order to achieve the above object, the present invention provides the following solutions:

a method of designing a molded line conductor structure, the method comprising:

obtaining the model number and the layer number of the model single line combination forming the preset line conductor based on the nominal section of the preset line conductor, wherein the layer number of the model single line combination is I, and I is more than or equal to 1;

obtaining the resistance value R of the i-layer type single-wire corresponding molded line conductor based on the type of the i-layer type single-wire corresponding molded line conductor _i Resistance value R based on i-th layer type single line corresponding molded line conductor _i Calculating to obtain standard sectional area S of i-th layer single line corresponding molded line conductor _{i label} ；

Standard sectional area S based on ith layer type single line corresponding molded line conductor _{i label} Calculating to obtain the standard diameter D of the i-th layer single line corresponding molded line conductor _{i label} ；

Selecting the diameter d of the central wire ₀ And the number n of single lines of the ith layer _i ；

Standard sectional area S based on ith layer type single line corresponding molded line conductor _{i label} Standard diameter D of i-th layer single line corresponding molded line conductor _{i label} Diameter d of center wire ₀ And the number n of single lines of the ith layer _i Calculating to obtain an i-th layer single-wire specification parameter, wherein the single-wire specification parameter specifically comprises the following components: diameter compression delta D of i-th layer type single-wire corresponding molded line conductor _i Angle θ of single i-th layer specification type single line _i Aspect ratio Γ of single i-th layer specification single line _i Filling factor eta of i-th layer specification type single line _i And the elongation coefficient epsilon of a single i-th layer specification type single wire _i ；

Judging whether the i-th layer single wire specification parameter meets the inspection standard or not to obtain a judging result, and if not, re-selecting the diameter d of the central wire ₀ And the number n of single lines of the ith layer _i And calculating the specification parameters of the ith layer type single wire, and if the judgment result is yes, outputting the specification parameters of the ith layer type single wire.

Optionally, the diameter compression delta D of the i-th layer single-wire corresponding molded line conductor _i The calculation process of (2) is as follows:

calculating the design diameter D of the i-th layer single line corresponding molded line conductor _{i is provided with} ：

Wherein eta is the filling coefficient of the molded line conductor, and t is the filling coefficient reduction value of the molded line conductor;

calculating the diameter compression delta D of the i-th layer type single-wire corresponding molded line conductor _i ：

ΔD _i ＝D _{i is provided with} -D _{i label} 。

Optionally, calculating the angle theta of the single i-th layer specification type single line _i The method specifically comprises the following steps:

calculating the stranding coefficient lambda of the ith layer of single wire _i The calculation formula is as follows:

wherein m is _i The pitch diameter ratio of the i-th layer single wire;

stranding coefficient lambda based on ith layer of single wire _i Calculating the angle theta of a single i-th layer specification type single line _i The calculation formula is as follows:

optionally, the aspect ratio Γ of the single i-th layer specification type single line _i And the filling factor eta of the i-th layer specification type single line _i The calculation process of (2) is as follows:

calculating the inner circle radius R of the ith layer type single line _{i is in} And an i-th layer single line outer circle radius R _{i is outside} The calculation formula is as follows:

when i is equal to 1,

when i is greater than 1, the number of the units,

based on the i-th layer type single line inner circle radius R _{i is in} And an i-th layer single line outer circle radius R _{i is outside} Calculating to obtain the filling coefficient eta of the i-th layer specification single line _i And the aspect ratio Γ of a single i-th layer specification single line _i ；

Filling factor eta of i-th layer specification type single line _i The calculation formula of (2) is as follows:

wherein alpha is _{i is in} Is a single i-th layer single line inner chamfer angle alpha _{i is outside} R is the angle of single i-th layer single line external chamfer _{i inner chamfer} For the single i-th layer single line inner chamfer radius, R _{i outer chamfer} Is the single i-th layer type single line outer chamfer radius, S _{in i single sheet} Is the external area of the inner chamfer of a single ith layer type single line, S _{i single outside} The outer chamfer external area of the single i-th layer single line is formed;

aspect ratio Γ of a single i-th layer specification single line _i The calculation formula of (2) is as follows:

wherein T is _i Height of single i-th layer specification single line, W _i Width of a single i-th layer specification type single wire.

Optionally, the test standard specifically includes:

diameter compression delta D of i-th layer type single-wire corresponding molded line conductor _i Within a first preset range; and the aspect ratio Γ of a single i-th layer specification type single line _i Within a second preset range; and the filling coefficient eta of the i-th layer specification type single line _i Is larger than the filling coefficient eta of the molded line conductor; and the extension coefficient epsilon of single i-th layer specification type single wire _i Is greater than the elongation coefficient epsilon of the profile conductor.

Optionally, the nominal cross section of the preset line conductor is 25-400.

Optionally, the model of the type single line combination is as follows:

the first group of single wires has the following types: 25T, 70T, 150T;

the type of the second group of single wires is: 35T, 95T, 185T, 300T;

the third group of single wires has the following model numbers: 50T, 120T, 240T, 400T.

Optionally, the first preset range is 0.08-0.6mm.

Optionally, the second preset range is 1.5-2.0.

According to the specific embodiment provided by the invention, the invention discloses the following technical effects:

according to the invention, the diameter compression amount of each layer of single wire is calculated, and the compression amount of each layer is used as an inspection standard, so that the specification parameters of the designed single wire are adopted, the cross-sectional area for designing the molded line conductor is reduced, the molded line conductor is stable in structure, and the surface is flat and difficult to loosen.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a flow chart of a method for designing a molded line conductor structure according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a seed-line conductor according to an embodiment of the present invention;

FIG. 3 is a schematic view of the inside and outside chamfer of a single wire provided by an embodiment of the present invention;

FIG. 4a is a single line cross-sectional view of a model number 50T provided by an embodiment of the present invention;

FIG. 4b is a single line cross-sectional view of model 120T provided by an embodiment of the present invention;

FIG. 4c is a single line cross-sectional view of model 240T provided by an embodiment of the present invention;

fig. 4d is a single line cross-sectional view of model 400T provided by an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

The invention aims to provide a design method of a molded line conductor structure, which is characterized in that the diameter compression amount of each layer of molded line is calculated, each layer of compression amount is used as a test standard, the specification parameters of the molded line are designed, the cross-section area for designing the molded line conductor is reduced, the molded line conductor structure is stable, and the surface is smooth and not easy to loosen.

In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.

Example 1

As shown in fig. 1, the present invention provides a method for designing a molded line conductor structure, the method comprising:

step 101, obtaining the model number and the layer number of single wire combinations forming the preset line conductor based on the nominal section of the preset line conductor, wherein the layer number of the single wire combinations is I, and I is more than or equal to 1; the nominal section of the preset molded line conductor is 25-400mm ² The method comprises the steps of carrying out a first treatment on the surface of the As shown in fig. 2, the model of the single wire combination is as follows: the first group of single wires has the following types: 25T, 70T, 150T; the type of the second group of single wires is: 35T, 95T, 185T, 300T; the third group of single wires has the following model numbers: 50T, 120T, 240T, 400T.

102, obtaining a resistance value R of the i-layer type single-wire corresponding molded line conductor based on the type of the i-layer type single-wire corresponding molded line conductor _i Based on the ith layerResistance value R of single-wire corresponding molded line conductor _i Calculating to obtain standard sectional area S of i-th layer single line corresponding molded line conductor _{i label} The resistance value R of the i-th layer single-wire corresponding molded line conductor _i The type of the i-th layer single line corresponding molded line conductor is the maximum direct current resistance of the conductor at 20 ℃ specified by national standard GB/T3956-2008; standard section S of i-th layer single line corresponding molded line conductor _{i label} The calculation formula of (2) is as follows:

wherein: ρ is the single-wire resistivity; l is the length of the molded line conductor; k (K) ₁ Coefficients introduced by the increase of the resistivity of the metal caused by the single line during the processing; k (K) ₂ The method comprises the steps of twisting a plurality of single wires to increase the length of the single wires by an introduced coefficient; k (K) ₃ For cabling twisting, the length of the single-wire core is increased by an introduced coefficient; r is R _i Resistance value R of line conductor corresponding to ith layer type single line _i 。

Step 103, based on standard sectional area S of i-th layer single line corresponding molded line conductor _{i label} Calculating to obtain the standard diameter D of the i-th layer single line corresponding molded line conductor _{i label} The method comprises the steps of carrying out a first treatment on the surface of the Standard diameter D of i-th layer single line corresponding molded line conductor _{i label} The calculation formula of (2) is as follows:

where η is the fill factor of the line conductor.

Step 104, selecting the diameter d of the central wire ₀ And the number n of single lines of the ith layer _i The method comprises the steps of carrying out a first treatment on the surface of the Diameter d of center wire ₀ The range of the value of (2.0-3.5 mm).

Step 105, based on standard sectional area S of the i-th layer single line corresponding molded line conductor _{i label} Standard diameter D of i-th layer single line corresponding molded line conductor _{i label} Diameter d of center wire ₀ And the number n of single lines of the ith layer _i Calculating to obtain the i-th layer single-line specification parameterThe number of the single-wire specification parameters specifically comprises: diameter compression delta D of i-th layer type single-wire corresponding molded line conductor _i Angle θ of single i-th layer specification type single line _i Aspect ratio Γ of single i-th layer specification single line _i Filling factor eta of i-th layer specification type single line _i And the elongation coefficient epsilon of a single i-th layer specification type single wire _i 。

The diameter compression delta D of the i-th layer type single-wire corresponding molded line conductor _i The calculation process of (2) is as follows:

calculating the design diameter D of the i-th layer single line corresponding molded line conductor _{i is provided with} ：

Wherein eta is the filling coefficient of the molded line conductor, and t is the filling coefficient reduction value of the molded line conductor; the value range of t is 0.3-0.6.

Calculating the diameter compression delta D of the i-th layer type single-wire corresponding molded line conductor _i ：

ΔD _i ＝D _{i is provided with} -D _{i label} 。

Calculating the angle theta of the single i-th layer specification type single line _i The method specifically comprises the following steps:

calculating the stranding coefficient lambda of the ith layer of single wire _i The calculation formula is as follows:

wherein m is _i Is the pitch diameter ratio of the i-th layer single wire.

Stranding coefficient lambda based on ith layer of single wire _i Calculating the angle theta of a single i-th layer specification type single line _i The calculation formula is as follows:

the single firstAspect ratio Γ of i-layer specification type single line _i And the filling factor eta of the i-th layer specification type single line _i The calculation process of (2) is as follows:

as shown in FIG. 3, the inner circle radius R of the ith layer single line is calculated _{i is in} And an i-th layer single line outer circle radius R _{i is outside} The calculation formula is as follows:

when i is equal to 1,

when i is greater than 1, the number of the units,

based on the i-th layer type single line inner circle radius R _{i is in} And an i-th layer single line outer circle radius R _{i is outside} Calculating to obtain the filling coefficient eta of the i-th layer specification single line _i And the aspect ratio Γ of a single i-th layer specification single line _i 。

As shown in fig. 4 a-4 d, the filling factor η of the i-th layer specification type single line _i The calculation formula of (2) is as follows:

wherein alpha is _{i is in} Is a single i-th layer single line inner chamfer angle alpha _{i is outside} R is the angle of single i-th layer single line external chamfer _{i inner chamfer} For the single i-th layer single line inner chamfer radius, R _{i outer chamfer} Is the single i-th layer type single line outer chamfer radius, S _{in i single sheet} Is the external area of the inner chamfer of a single ith layer type single line, S _{i single outside} The outer chamfer external area of the single i-th layer single line is formed; single i-th layer type single line inner chamfer radius R _{i inner chamfer} And a single i-th layer single line outer chamfer radius R _{i outer chamfer} The value range of R is 0.2-0.8mm _{i inner chamfer} And R is _{i outer chamfer} The smaller the value, the smaller the gap between single lines, and the flatter the conductor surface, which is related to the processing precision of the die.

Single i-th layer specification type single wireAspect ratio Γ of (a) _i The calculation formula of (2) is as follows:

wherein T is _i Height of single i-th layer specification single line, W _i Width of a single i-th layer specification type single wire.

Step 106, judging whether the i-th layer single wire specification parameter reaches the inspection standard or not, obtaining a judging result, and if the judging result is negative, re-selecting the diameter d of the central wire ₀ And the number n of single lines of the ith layer _i And calculating the specification parameters of the ith layer type single wire, and if the judgment result is yes, outputting the specification parameters of the ith layer type single wire. The test standard specifically comprises the following steps: diameter compression delta D of i-th layer type single-wire corresponding molded line conductor _i Within a first preset range; and the aspect ratio Γ of a single i-th layer specification type single line _i Within a second preset range; and the filling coefficient eta of the i-th layer specification type single line _i Is larger than the filling coefficient eta of the molded line conductor; and the extension coefficient epsilon of single i-th layer specification type single wire _i Is greater than the elongation coefficient epsilon of the profile conductor. The first preset range is 0.08-0.6mm; the second preset range is 1.5-2.0. And when the second preset range is exceeded, the stranded wire production type single wire is easy to turn over.

The invention also provides a process for designing the molded line conductor structure, which comprises the following steps:

the model numbers of the single wire combinations forming the preset line conductor are 50T, 120T, 240T and 400T, and the number of layers is 4 based on the nominal section of the preset line conductor being 400. However, the model numbers of all types of single wires were calculated for comparison effects as follows.

Finding the resistance value R of the ith layer type single line corresponding molded line conductor through table 1 _i And pass through the formulaCalculating standard sectional area S of i-th layer single line corresponding molded line conductor _{i label} At this time ρ= 17.241 Ω·mm ² /m；L＝1.006。

TABLE 1

By the formulaCalculating to obtain the standard diameter D of the i-th layer single line corresponding molded line conductor _{i label} The method comprises the steps of carrying out a first treatment on the surface of the Where η=0.98, the results are shown in table 2:

TABLE 2

Selecting the diameter d of the central wire ₀ =2.6 mm and i-th layer single line number n _i 。

Calculating the diameter compression delta D of the i-th layer type single-wire corresponding molded line conductor _i The process is as follows:

calculating the design diameter D of the i-th layer single line corresponding molded line conductor _{i is provided with} ：

Where t=0.4, the results are shown in table 3:

TABLE 3 Table 3

Calculating an i-th layer single lineDiameter compression amount delta D of corresponding molded line conductor _i The calculation results are shown in table 4:

TABLE 4 Table 4

Diameter compression delta D of i-th layer type single-wire corresponding molded line conductor _i The size is mainly controlled according to t, the compression amount is amplified, the design section of the single wire can be effectively improved, the bad result brought by the compression amount is that the processing deformation amount of the single wire in the stranding process is large, the resistivity of the single wire is large, and the filling coefficient of the wire conductor is reduced by a value t of 0.4, so that the relatively satisfactory effect can be achieved.

Calculating the angle theta of the single i-th layer specification type single line _i Aspect ratio Γ of the single i-th layer specification single line _i And the filling factor eta of the i-th layer specification type single line _i Wherein R is _{i inner chamfer} ＝0.3mm，R _{i outer chamfer} =0.3 mm. All parameters of the layer type single line are shown in table 5.

TABLE 5

Extension coefficient epsilon of single i-th layer specification type single wire _i The calculation results are shown in table 6:

TABLE 6

And judging whether the i-th layer single-wire specification parameters reach the inspection standard.

The molded line conductors meeting the detection standards were also detected, and the results are shown in table 7.

TABLE 7

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According to the invention, the diameter compression amount of each layer of single wire is calculated, and the compression amount of each layer is used as an inspection standard, so that the specification parameters of the designed single wire are adopted, the cross-sectional area for designing the molded line conductor is reduced, the molded line conductor is stable in structure, and the surface is flat and difficult to loosen. The design method adopts the special-shaped single wire to design the cable conductor, the design value of the compression coefficient of the conductor is 0.98, the design scheme of each layer of compression quantity can ensure that the cold working deformation and work hardening of the single wire in the stranding production process are reduced on the premise that the resistance of the molded wire conductor meets the standard, the surface of the conductor is flat and the single wire is free from dislocation, the resistivity change rate of the single wire is reduced, the required section of the conductor is further reduced, and the purposes of saving materials and reducing consumption are achieved. The specific specification is 25mm ² -400mm ² Has the characteristics of high flexibility, simplicity, convenience and the like. The influence of single line angle and compression on conductor performance is fully considered in the design process.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.

The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to assist in understanding the methods of the present invention and the core ideas thereof; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.

Claims (9)

1. A method of designing a molded line conductor structure, the method comprising:

obtaining the model number and the layer number of the model single line combination forming the preset line conductor based on the nominal section of the preset line conductor, wherein the layer number of the model single line combination is I, and I is more than or equal to 1;

obtaining the resistance value R of the i-layer type single-wire corresponding molded line conductor based on the type of the i-layer type single-wire corresponding molded line conductor _i Resistance value R based on i-th layer type single line corresponding molded line conductor _i Calculating to obtain standard sectional area S of i-th layer single line corresponding molded line conductor _{i label} ；

Standard sectional area S based on ith layer type single line corresponding molded line conductor _{i label} Calculating to obtain the standard diameter D of the i-th layer single line corresponding molded line conductor _{i label} ；

Selecting the diameter d of the central wire ₀ And the number n of single lines of the ith layer _i ；

Standard sectional area S based on ith layer type single line corresponding molded line conductor _{i label} Standard diameter D of i-th layer single line corresponding molded line conductor _{i label} Diameter d of center wire ₀ And the number n of single lines of the ith layer _i Calculating to obtain an i-th layer single-wire specification parameter, wherein the single-wire specification parameter specifically comprises the following components: diameter compression delta D of i-th layer type single-wire corresponding molded line conductor _i Angle θ of single i-th layer specification type single line _i Aspect ratio Γ of single i-th layer specification single line _i Filling factor eta of i-th layer specification type single line _i And the elongation coefficient epsilon of a single i-th layer specification type single wire _i ；

Judging whether the i-th layer single wire specification parameter meets the inspection standard or not to obtain a judging result, and if not, re-selecting the diameter d of the central wire ₀ And the number n of single lines of the ith layer _i And calculating the specification parameters of the ith layer type single wire, and if the judgment result is yes, outputting the specification parameters of the ith layer type single wire.

2. The method for designing a molded line conductor structure according to claim 1, wherein the i-th layer single line corresponds to a diameter compression amount Δd of the molded line conductor _i The calculation process of (2) is as follows:

calculation of the ith layer sheetDiameter D for designing wire-corresponding molded line conductor _{i is provided with} ：

Wherein eta is the filling coefficient of the molded line conductor, and t is the filling coefficient reduction value of the molded line conductor;

calculating the diameter compression delta D of the i-th layer type single-wire corresponding molded line conductor _i ：

ΔD _i ＝D _{i is provided with} -D _{i label} 。

3. The method for designing a molded line conductor structure according to claim 1, wherein an angle θ of the single i-th layer specification type element line is calculated _i The method specifically comprises the following steps:

calculating the stranding coefficient lambda of the ith layer of single wire _i The calculation formula is as follows:

wherein m is _i The pitch diameter ratio of the i-th layer single wire;

stranding coefficient lambda based on ith layer of single wire _i Calculating the angle theta of a single i-th layer specification type single line _i The calculation formula is as follows:

4. a method of designing a molded line conductor structure as claimed in claim 3, wherein the single i-th layer specification type single line has an aspect ratio Γ _i And the filling factor eta of the i-th layer specification type single line _i The calculation process of (2) is as follows:

calculating the inner circle radius R of the ith layer type single line _{i is in} And i-th layer single line outer circle radiusR _{i is outside} The calculation formula is as follows:

when i is equal to 1,

when i is greater than 1, the number of the units,

based on the i-th layer type single line inner circle radius R _{i is in} And an i-th layer single line outer circle radius R _{i is outside} Calculating to obtain the filling coefficient eta of the i-th layer specification single line _i And the aspect ratio Γ of a single i-th layer specification single line _i ；

Filling factor eta of i-th layer specification type single line _i The calculation formula of (2) is as follows:

wherein alpha is _{i is in} Is a single i-th layer single line inner chamfer angle alpha _{i is outside} R is the angle of single i-th layer single line external chamfer _{i inner chamfer} For the single i-th layer single line inner chamfer radius, R _{i outer chamfer} Is the single i-th layer type single line outer chamfer radius, S _{in i single sheet} Is the external area of the inner chamfer of a single ith layer type single line, S _{i single outside} The outer chamfer external area of the single i-th layer single line is formed;

aspect ratio Γ of a single i-th layer specification single line _i The calculation formula of (2) is as follows:

wherein T is _i Height of single i-th layer specification single line, W _i Width of a single i-th layer specification type single wire.

5. The method for designing a molded line conductor structure according to claim 1, wherein the inspection criteria specifically include:

diameter compression delta D of i-th layer type single-wire corresponding molded line conductor _i Within a first preset range; and the aspect ratio Γ of a single i-th layer specification type single line _i Within a second preset range; and the filling coefficient eta of the i-th layer specification type single line _i Is larger than the filling coefficient eta of the molded line conductor; and the extension coefficient epsilon of single i-th layer specification type single wire _i Is greater than the elongation coefficient epsilon of the profile conductor.

6. A method of designing a profile conductor structure according to claim 1, wherein the predetermined profile conductor has a nominal cross-section of 25-400.

7. The method of claim 1, wherein the single wire combination is of the type:

the first group of single wires has the following types: 25T, 70T, 150T;

the type of the second group of single wires is: 35T, 95T, 185T, 300T;

the third group of single wires has the following model numbers: 50T, 120T, 240T, 400T.

8. The method of claim 5, wherein the first predetermined range is 0.08-0.6mm.

9. The method of claim 5, wherein the second predetermined range is 1.5-2.0.