CN117630515A - Noise level detection method and device of temperature measurement system - Google Patents
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Abstract
The embodiment of the application provides a noise level testing method and device of a temperature measuring system, wherein the temperature measuring system comprises a plurality of temperature measuring devices arranged in a specific temperature field, and the method comprises the following steps: acquiring temperature signals acquired by any two temperature measuring devices; according to the temperature signals, calculating the self-power spectral density and the cross-power spectral density of the two temperature measuring devices; according to the self-power spectral density and the cross-power spectral density, calculating the coherence coefficient of the two temperature measuring devices at a specific frequency point; calculating the signal-to-noise ratio relation of the two temperature measuring devices at the specific frequency point according to the coherence coefficient; and determining signal-to-noise ratio estimated values of the two temperature measuring devices at the specific frequency points according to the signal-to-noise ratio relation, thereby evaluating the noise level of the temperature measuring devices in the specific temperature field based on the signal-to-noise ratio estimated values and providing a basis for the design and verification of the high-precision temperature measuring devices in the specific temperature field.
Description
Technical Field
The embodiment of the application relates to the technical field of testing, in particular to a noise level detection method and device of a temperature measurement system.
Background
The operation of the gravitational wave detector core instrument needs the monitoring and regulation of a temperature field under micro-scale, the space on the satellite needs extremely high temperature stability and temperature measurement resolution, the dynamic temperature field of the gravitational wave detector is influenced by the self-noise interference of devices such as sensors, error accumulation generated in the temperature balancing and transmitting process of multiple sensors, the temperature of part of core devices can not be measured directly, and the like, so that the temperature of the dynamic temperature field is difficult to test accurately. In order to detect the stability of a dynamic temperature field under micro scale, a temperature measuring system formed by a plurality of temperature measuring devices with mu K-level temperature measuring resolution is required to be configured in the gravitational wave detector, and the technical problem to be solved is that how to detect the noise level of the temperature measuring devices, evaluate the noise duty ratio of the temperature measuring devices and provide basis for designing the high-precision temperature measuring devices.
Disclosure of Invention
In view of the above, an objective of the embodiments of the present application is to provide a method and an apparatus for detecting a noise level of a temperature measuring system, so as to solve the problem of detecting the noise level of a temperature measuring device.
In view of the above object, an embodiment of the present application provides a noise level detection method of a temperature measurement system, the temperature measurement system including a plurality of temperature measurement devices arranged in a specific temperature field, the method including:
acquiring temperature signals acquired by any two temperature measuring devices;
according to the temperature signals, calculating the self-power spectral density and the cross-power spectral density of the two temperature measuring devices;
according to the self-power spectral density and the cross-power spectral density, calculating the coherence coefficient of the two temperature measuring devices at a specific frequency point;
calculating the signal-to-noise ratio relation of the two temperature measuring devices at the specific frequency point according to the coherence coefficient;
and determining signal-to-noise ratio estimated values of the two temperature measuring devices at the specific frequency point according to the signal-to-noise ratio relation.
Optionally, according to the coherence coefficient, calculating a signal-to-noise ratio relationship of the two temperature measuring devices at the specific frequency point, where the method includes:
wherein C is ij (f) For the coherent coefficient of the ith temperature measuring device and the jth temperature measuring device at frequency point f, SNR Ti (f) Signal-to-noise ratio, SNR, of temperature signal power spectrum for ith temperature measuring device Tj (f) Is the signal to noise ratio of the power spectrum of the temperature signal of the jth temperature measuring device.
Optionally, the temperature stability range of the specific temperature field is 1 mHz-0.1 Hz, and the temperature measurement resolution is mu K level;
according to the signal-to-noise ratio relation, determining signal-to-noise ratio estimated values of the two temperature measuring devices at the specific frequency point comprises the following steps:
and in the specific stable field, the signal to noise ratios of the two temperature measuring devices are the same, and the signal to noise ratios of the two temperature measuring devices are calculated according to a formula (14).
Optionally, the plurality of temperature measuring devices are uniformly distributed on the gravitational wave detector.
The embodiment of the application also provides a noise level detection device of a temperature measurement system, the temperature measurement system comprises a plurality of temperature measurement devices arranged in a specific temperature field, and the device comprises:
the acquisition module is used for acquiring temperature signals acquired by any two temperature measuring devices;
the first calculation module is used for calculating the self power spectrum density and the cross power spectrum density of the two temperature measuring devices according to the temperature signals;
the second calculation module is used for calculating the coherence coefficient of the two temperature measuring devices at a specific frequency point according to the self-power spectral density and the cross-power spectral density;
the third calculation module is used for calculating the signal-to-noise ratio relation of the two temperature measuring devices at the specific frequency point according to the coherence coefficient;
and the determining module is used for determining the signal-to-noise ratio estimated values of the two temperature measuring devices at the specific frequency point according to the signal-to-noise ratio relation.
Optionally, the method for calculating the signal-to-noise ratio relationship by the third calculation module is as follows:
wherein C is ij (f) For the coherent coefficient of the ith temperature measuring device and the jth temperature measuring device at frequency point f, SNR Ti (f) Signal-to-noise ratio, SNR, of temperature signal power spectrum for ith temperature measuring device Tj (f) Is the signal to noise ratio of the power spectrum of the temperature signal of the jth temperature measuring device.
Optionally, the temperature stability range of the specific temperature field is 1 mHz-0.1 Hz, and the temperature measurement resolution is mu K level;
the determining module is configured to calculate the signal-to-noise ratios of the two temperature measurement devices according to formula (14) in the specific stable field, where the signal-to-noise ratios of the two temperature measurement devices are the same.
Optionally, the plurality of temperature measuring devices are uniformly distributed on the gravitational wave detector.
As can be seen from the foregoing, according to the noise level detection method and apparatus for a temperature measurement system provided by the embodiments of the present application, by acquiring temperature signals acquired by any two temperature measurement devices, calculating self-power spectral density and cross-power spectral density of the two temperature measurement devices according to the temperature signals, calculating coherence coefficients of the two temperature measurement devices at specific frequency points according to the self-power spectral density and the cross-power spectral density, calculating a signal-to-noise ratio relationship of the two temperature measurement devices at the specific frequency points according to the coherence coefficients, and determining a signal-to-noise ratio estimated value of the two temperature measurement devices at the specific frequency points according to the signal-to-noise ratio relationship, thereby evaluating noise level of the temperature measurement devices in the specific temperature field based on the signal-to-noise ratio estimated value and providing a basis for design and verification of high-precision temperature measurement devices of the specific temperature field.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a deployment structure of a temperature measurement system according to an embodiment of the present application;
FIG. 2 is a schematic flow chart of a detection method according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a signal system of a temperature measurement system according to an embodiment of the present application;
FIGS. 4A and 4B are diagrams showing the relationship between the coherence factor and the signal-to-noise ratio;
FIG. 5 is a block diagram of a detection device according to an embodiment of the present application;
fig. 6 is a block diagram of an electronic device according to an embodiment of the present application.
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
It should be noted that unless otherwise defined, technical or scientific terms used in the embodiments of the present application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present disclosure pertains. The terms "first," "second," and the like, as used in embodiments of the present application, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
In the related art, the space on the satellite needs to reach the temperature stability within the range of 1 mHz-0.1 Hz and the temperature measurement resolution of mu K level. For a high-resolution temperature measuring device of the order of μk, it is difficult to achieve a noise level that detects the temperature measuring device using zero temperature variation as an input in an ideal constant temperature environment. When a plurality of temperature measuring devices with consistent characteristics are placed in the same temperature equalizing area, the temperature fluctuation of the temperature equalizing area has common and consistent influence on each temperature measuring device, namely, the temperature change is related to the temperature measuring result, and the noise among the temperature measuring devices is uncorrelated. In view of this, the noise level of the temperature measuring device can be detected and evaluated based on a correlation analysis method.
The technical scheme of the application is further described in detail through specific examples.
As shown in fig. 1 and 2, the noise level detection method of the temperature measurement system provided by the embodiment of the application is applied to a high-resolution high-stability temperature field, the temperature stability of the temperature field is in the range of 1 mHz-0.1 Hz, and the temperature measurement resolution reaches the mu K level; the temperature measurement system comprises a plurality of temperature measurement devices which are uniformly distributed in a high-resolution high-stability temperature field, and the detection method comprises the following steps:
s201: acquiring temperature signals acquired by any two temperature measuring devices;
in this embodiment, the temperature signal of each temperature measuring device can be collected by using the temperature collector, and the signal-to-noise ratio of the temperature measuring devices can be detected and estimated based on the temperature signals output by the temperature measuring devices. The temperature measuring device can be a temperature measuring component formed by electronic circuit devices such as a temperature measuring sensor and a temperature measuring circuit, or can be an independent electronic circuit device, and the specific circuit structure of the temperature measuring device is not limited.
S202: according to the temperature signals, calculating the self-power spectral density and the cross-power spectral density of the two temperature measuring devices;
in this embodiment, based on the temperature signals of any two temperature measuring devices in the time domain, the temperature signals in the frequency domain are obtained through fourier transformation, and the self-power spectrum and the cross-power spectrum of the two temperature measuring devices are calculated according to the temperature signals in the frequency domain.
Referring to fig. 3, in the signal system of the temperature measurement system, let T (T) be a temperature change signal that changes with time T, and in the long-period frequency band, it can be regarded as a common input signal for each temperature measurement device in the temperature measurement system; the noise of the ith temperature measuring device and the jth temperature measuring device in the time domain is N respectively i (t)、N j (t) the frequency response of the ith and jth temperature measuring devices is H i (f)、H j (f) The output signals (i.e. the acquired temperature signals) of the ith temperature measuring device and the jth temperature measuring device are Y respectively i (t)、Y j (t), the relationship between the input signal and the output signal of the ith and jth temperature measuring devices in the frequency domain can be expressed as:
Y i (f)＝(T(f)+N i (f))·H i (f) (1)
Y j (f)＝(T(f)+N j (f))·H j (f) (2)
the cross power spectral density of the output signals of the two temperature measuring devices is as follows:
the noise between the two temperature measuring devices is uncorrelated, and the noise is uncorrelated with the measured temperature signal, so that the method can obtainThen equation (3) translates into:
P ij (f)＝T(f)·T * (f)·H i (f)·H j * (j)＝P T (f)·H i (f)·H j * (j) (4)
wherein P is T (f) Is warmThe power spectral density of the degree-varying signal T (T).
Output signal Y to two temperature measuring devices i (t)、Y j After fourier transformation, calculating the self-power spectral densities of the two temperature measuring devices, wherein the self-power spectral densities are respectively as follows:
P Yi (f)＝(P T (f)+P Ni (f))·|H i (f)| 2 (5)
P Yj (f)＝(P T (f)+P Nj (f))·|H j (f)| 2 (6)
wherein P is Yi (f) For the self-power spectral density, P, of the ith temperature measuring device Ni (f) Power spectral density, P, of noise for the ith temperature measurement device Yj (f) For the j-th temperature measuring device, P Nj (f) The power spectral density of the noise of the jth temperature measuring device.
S203: according to the self-power spectral density and the cross-power spectral density, calculating the coherence coefficient of the two temperature measuring devices at a specific frequency point;
s204: calculating the signal-to-noise ratio relation of the two temperature measuring devices at a specific frequency point according to the coherence coefficient;
s205: and determining signal-to-noise ratio estimated values of the two temperature measuring devices at specific frequency points according to the signal-to-noise ratio relation.
In the present embodiment, the coherence function C ij (f) For the output signals Y of two temperature measuring devices i (t)、Y j The square of the amplitude of (t) can reflect the degree of correlation of the two temperature signals at frequency point f. Coherence function C ik (f) Is a function of the self-power spectral density and cross-power spectral density for two temperature signals, expressed as:
the cross-power spectral density P of the output signals of the two temperature measuring devices according to the formula (4) ij (f) The self-power spectral density P of the output signals of the two temperature measuring devices shown in formulas (5) and (6) Yi (f)、P Yj (f) Equation (7) can be converted into:
according to the definition of the power spectral density,and |P T (f)| 2 ＝P T 2 (f) The method can obtain:
equation (9) divided by P T 2 (f) The method comprises the following steps of:
the equation (10) can be converted into:
defining the signal-to-noise ratio of the power spectrum of the temperature measurement signal of the ith temperature measurement device as follows:
the signal-to-noise ratio of the power spectrum of the temperature measurement signal of the j-th temperature measurement device is as follows:
equation (10) can be expressed as:
it can be seen that equation (14) describes the coherence function C of the ith and jth temperature sensing devices ij (f) And the relation between the signal-to-noise ratio of the temperature signal power spectrum of the ith temperature measuring device and the signal-to-noise ratio of the temperature signal power spectrum of the jth temperature measuring device.
The temperature signals output by any two temperature measuring devices are collected and subjected to Fourier transformation to obtain frequency domain temperature signals, the self-power spectral density and the cross-power spectral density of the two temperature measuring devices are calculated based on the temperature signals of the two temperature measuring devices in the frequency domain, and then the coherence coefficient C of the two temperature measuring signals in a specific frequency point f can be calculated according to a coherence function shown in a formula (7) ij (f) The method comprises the steps of carrying out a first treatment on the surface of the Based on the coherence coefficient at the specific frequency point f, the relationship between the signal-to-noise ratios of the temperature signal power spectra of the two temperature measuring devices at the specific frequency point can be determined according to formula (14).
In the temperature field with the temperature stability within the range of 1 mHz-0.1 Hz and the temperature measurement resolution reaching the mu K level, the signal to noise ratios of the two temperature measurement devices can be regarded as the same, and the signal to noise ratio of the two temperature measurement devices can be calculated according to the formula (14), so that the signal to noise ratio estimation of the temperature measurement devices in the temperature field with high stability and high resolution is realized.
As shown in fig. 4A and 4B, in some embodiments, the coherence coefficient C obtained at different frequency points ij (f) The value of (2) is between 0.3 and 0.99, and the relation curve between the signal to noise ratio of the power spectrums of the temperature signals of the two temperature measuring devices is drawn according to the formula (14), when the coherence coefficient C ij (f) And when the signal to noise ratios of the two temperature measuring devices are the same, the signal to noise ratio estimated values of the two temperature measuring devices can be determined. Therefore, according to the determined signal-to-noise ratio estimated value of the temperature measuring device, the ratio of noise in the temperature measuring device can be reflected, and the evaluation of how much the temperature measuring result of the temperature measuring device can reflect the actual temperature change of the temperature field provides a basis for the design and verification of the high-precision temperature measuring device of the specific temperature field.
It should be noted that, the method of the embodiments of the present application may be performed by a single device, for example, a computer or a server. The method of the embodiment can also be applied to a distributed scene, and is completed by mutually matching a plurality of devices. In the case of such a distributed scenario, one of the devices may perform only one or more steps of the methods of embodiments of the present application, and the devices may interact with each other to complete the methods.
It should be noted that the foregoing describes specific embodiments of the present invention. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
As shown in fig. 5, an embodiment of the present application further provides a testing apparatus of a temperature measurement system, where the temperature measurement system includes a plurality of temperature measurement devices disposed in a specific temperature field, and the apparatus includes:
the acquisition module is used for acquiring temperature signals acquired by any two temperature measuring devices;
the first calculation module is used for calculating the self power spectrum density and the cross power spectrum density of the two temperature measuring devices according to the temperature signals;
the second calculation module is used for calculating the coherence coefficient of the two temperature measuring devices at a specific frequency point according to the self-power spectral density and the cross-power spectral density;
the third calculation module is used for calculating the signal-to-noise ratio relation of the two temperature measuring devices at the specific frequency point according to the coherence coefficient;
and the determining module is used for determining the signal-to-noise ratio estimated values of the two temperature measuring devices at the specific frequency point according to the signal-to-noise ratio relation.
For convenience of description, the above devices are described as being functionally divided into various modules, respectively. Of course, the functions of each module may be implemented in one or more pieces of software and/or hardware when implementing the embodiments of the present application.
The device of the foregoing embodiment is configured to implement the corresponding method in the foregoing embodiment, and has the beneficial effects of the corresponding method embodiment, which is not described herein.
Fig. 6 shows a more specific hardware architecture of an electronic device according to this embodiment, where the device may include: a processor 1010, a memory 1020, an input/output interface 1030, a communication interface 1040, and a bus 1050. Wherein processor 1010, memory 1020, input/output interface 1030, and communication interface 1040 implement communication connections therebetween within the device via a bus 1050.
The processor 1010 may be implemented by a general-purpose CPU (Central Processing Unit ), microprocessor, application specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, etc. for executing relevant programs to implement the technical solutions provided in the embodiments of the present disclosure.
The Memory 1020 may be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory ), static storage device, dynamic storage device, or the like. Memory 1020 may store an operating system and other application programs, and when the embodiments of the present specification are implemented in software or firmware, the associated program code is stored in memory 1020 and executed by processor 1010.
The input/output interface 1030 is used to connect with an input/output module for inputting and outputting information. The input/output module may be configured as a component in a device (not shown) or may be external to the device to provide corresponding functionality. Wherein the input devices may include a keyboard, mouse, touch screen, microphone, various types of sensors, etc., and the output devices may include a display, speaker, vibrator, indicator lights, etc.
Communication interface 1040 is used to connect communication modules (not shown) to enable communication interactions of the present device with other devices. The communication module may implement communication through a wired manner (such as USB, network cable, etc.), or may implement communication through a wireless manner (such as mobile network, WIFI, bluetooth, etc.).
Bus 1050 includes a path for transferring information between components of the device (e.g., processor 1010, memory 1020, input/output interface 1030, and communication interface 1040).
It should be noted that although the above-described device only shows processor 1010, memory 1020, input/output interface 1030, communication interface 1040, and bus 1050, in an implementation, the device may include other components necessary to achieve proper operation. Furthermore, it will be understood by those skilled in the art that the above-described apparatus may include only the components necessary to implement the embodiments of the present description, and not all the components shown in the drawings.
The electronic device of the foregoing embodiment is configured to implement the corresponding method in the foregoing embodiment, and has the beneficial effects of the corresponding method embodiment, which is not described herein.
The computer readable media of the present embodiments, including both permanent and non-permanent, removable and non-removable media, may be used to implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of storage media for a computer include, but are not limited to, phase change memory (PRAM), static Random Access Memory (SRAM), dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium, which can be used to store information that can be accessed by a computing device.
Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the disclosure, including the claims, is limited to these examples; the technical features of the above embodiments or in the different embodiments may also be combined under the idea of the present disclosure, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in details for the sake of brevity.
Additionally, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown within the provided figures, in order to simplify the illustration and discussion, and so as not to obscure the embodiments of the present application. Furthermore, the devices may be shown in block diagram form in order to avoid obscuring the embodiments of the present application, and this also takes into account the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform on which the embodiments of the present application are to be implemented (i.e., such specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the disclosure, it should be apparent to one skilled in the art that embodiments of the disclosure can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative in nature and not as restrictive.
While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of those embodiments will be apparent to those skilled in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.
The present embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Accordingly, any omissions, modifications, equivalents, improvements, and the like, which are within the spirit and principles of the embodiments of the present application, are intended to be included within the scope of the present disclosure.
Claims (8)
1. A noise level detection method of a temperature measurement system, wherein the temperature measurement system includes a plurality of temperature measurement devices arranged in a specific temperature field, the method comprising:
acquiring temperature signals acquired by any two temperature measuring devices;
according to the temperature signals, calculating the self-power spectral density and the cross-power spectral density of the two temperature measuring devices;
according to the self-power spectral density and the cross-power spectral density, calculating the coherence coefficient of the two temperature measuring devices at a specific frequency point;
calculating the signal-to-noise ratio relation of the two temperature measuring devices at the specific frequency point according to the coherence coefficient;
and determining signal-to-noise ratio estimated values of the two temperature measuring devices at the specific frequency point according to the signal-to-noise ratio relation.
2. The method according to claim 1, wherein calculating the signal-to-noise ratio relationship of the two temperature measurement devices at the specific frequency point according to the coherence coefficient comprises:
wherein C is ij (f) For the coherent coefficient of the ith temperature measuring device and the jth temperature measuring device at frequency point f, SNR Ti (f) Signal-to-noise ratio, SNR, of temperature signal power spectrum for ith temperature measuring device Tj (f) Is the signal to noise ratio of the power spectrum of the temperature signal of the jth temperature measuring device.
3. The method according to claim 2, wherein the temperature stability of the specific temperature field ranges from 1mHz to 0.1Hz, and the temperature measurement resolution is in the μk level;
according to the signal-to-noise ratio relation, determining signal-to-noise ratio estimated values of the two temperature measuring devices at the specific frequency point comprises the following steps:
and in the specific stable field, the signal to noise ratios of the two temperature measuring devices are the same, and the signal to noise ratios of the two temperature measuring devices are calculated according to a formula (14).
4. A method according to any one of claims 1-3, wherein the plurality of temperature measuring devices are uniformly arranged on the gravitational wave detector.
5. A noise level detection apparatus of a temperature measurement system, the temperature measurement system including a plurality of temperature measurement devices arranged in a specific temperature field, the apparatus comprising:
the acquisition module is used for acquiring temperature signals acquired by any two temperature measuring devices;
the first calculation module is used for calculating the self power spectrum density and the cross power spectrum density of the two temperature measuring devices according to the temperature signals;
the second calculation module is used for calculating the coherence coefficient of the two temperature measuring devices at a specific frequency point according to the self-power spectral density and the cross-power spectral density;
the third calculation module is used for calculating the signal-to-noise ratio relation of the two temperature measuring devices at the specific frequency point according to the coherence coefficient;
and the determining module is used for determining the signal-to-noise ratio estimated values of the two temperature measuring devices at the specific frequency point according to the signal-to-noise ratio relation.
6. The apparatus of claim 5, wherein the device comprises a plurality of sensors,
the third calculation module calculates the signal-to-noise ratio relation by the following steps:
wherein C is ij (f) For the coherent coefficient of the ith temperature measuring device and the jth temperature measuring device at frequency point f, SNR Ti (f) Signal-to-noise ratio, SNR, of temperature signal power spectrum for ith temperature measuring device Tj (f) Is the signal to noise ratio of the power spectrum of the temperature signal of the jth temperature measuring device.
7. The device of claim 6, wherein the temperature stability of the specific temperature field ranges from 1mHz to 0.1Hz, and the temperature measurement resolution is on the order of μk;
the determining module is configured to calculate the signal-to-noise ratios of the two temperature measurement devices according to formula (14) in the specific stable field, where the signal-to-noise ratios of the two temperature measurement devices are the same.
8. The apparatus of any of claims 5-7, wherein the plurality of temperature sensing devices are uniformly disposed on the gravitational wave detector.
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