CN117625117A - Polyamide imide adhesive, polyimide screen printing film and preparation method and application thereof - Google Patents
Polyamide imide adhesive, polyimide screen printing film and preparation method and application thereof Download PDFInfo
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- CN117625117A CN117625117A CN202311783457.XA CN202311783457A CN117625117A CN 117625117 A CN117625117 A CN 117625117A CN 202311783457 A CN202311783457 A CN 202311783457A CN 117625117 A CN117625117 A CN 117625117A
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- 229920002312 polyamide-imide Polymers 0.000 title claims abstract description 95
- 239000004962 Polyamide-imide Substances 0.000 title claims abstract description 94
- 229920001721 polyimide Polymers 0.000 title claims abstract description 58
- 239000000853 adhesive Substances 0.000 title claims abstract description 57
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 57
- 239000004642 Polyimide Substances 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title abstract description 18
- 238000007650 screen-printing Methods 0.000 title description 5
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 239000011347 resin Substances 0.000 claims abstract description 47
- 238000007639 printing Methods 0.000 claims abstract description 36
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- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 18
- 229920000459 Nitrile rubber Polymers 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 229920001971 elastomer Polymers 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 238000007731 hot pressing Methods 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 10
- 229920006287 phenoxy resin Polymers 0.000 claims description 9
- 239000013034 phenoxy resin Substances 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 9
- 239000010935 stainless steel Substances 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
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- 239000011230 binding agent Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000003495 polar organic solvent Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 5
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- -1 carboxyl modified acrylate Chemical class 0.000 claims description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 4
- JRQJLSWAMYZFGP-UHFFFAOYSA-N 1,1'-biphenyl;phenol Chemical group OC1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 JRQJLSWAMYZFGP-UHFFFAOYSA-N 0.000 claims description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical class C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 claims description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 abstract description 11
- 239000004952 Polyamide Substances 0.000 abstract description 10
- 239000002904 solvent Substances 0.000 abstract description 7
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 6
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- 230000000052 comparative effect Effects 0.000 description 10
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention provides a polyamide imide adhesive, a polyimide screen plate film and a preparation method and application thereof, wherein the polyamide imide adhesive comprises polyamide imide resin, epoxy resin and toughening resin, the three resins are adopted for matching, so that the obtained polyamide imide adhesive has excellent solvent resistance and chemical resistance, and a glue layer of the polyamide screen plate film prepared by further matching with a polyamide base film has no touch adhesion, is convenient to position on the screen plate, can be stored at normal temperature, and can achieve better laser effect without adding an ultraviolet absorber because the absorption wave bands of the polyamide imide resin and the polyimide base film to ultraviolet laser are the same, so that the printing screen plate further prepared by adopting the polyamide screen plate film has the advantages of high laser etching precision and high efficiency.
Description
Technical Field
The invention belongs to the technical field of adhesives, and particularly relates to a polyamide-imide adhesive, a polyimide screen printing film, a preparation method and application thereof.
Background
The traditional printing screen adopts photosensitive ink to coat on a stainless steel screen, and then a wanted circuit is obtained through an exposure and development mode, but the traditional printing screen process is large in pollution, the service life of the printing screen is not long, the screen is required to be replaced frequently, the production efficiency is affected, and the production cost is increased.
In order to solve the above problems of the conventional screen, a composite film structure using a polyimide film and an epoxy adhesive or a polyurethane adhesive has been proposed.
CN112778937a discloses an epoxy adhesive, a cover film and a printing screen, the epoxy adhesive comprises the following components in percentage by mass: 20-60% of epoxy resin, 20-40% of film-forming resin, 5-20% of tackifying resin, 1-20% of curing agent and 0.1-2% of curing accelerator; the invention improves the adhesive formula and the cover film, so that the cover film provided by the invention can be molded at low temperature, and the cover film provided by the invention has good bonding performance with the screen plate body, is not easy to overflow and delaminate, and has good chemical resistance.
CN114479732a discloses an epoxy adhesive, a polyimide coverlay film and a printing screen. The epoxy adhesive comprises 45-60% of epoxy resin, 15-30% of tackifying resin, 20-30% of film-forming resin, 0.5-1.5% of ultraviolet absorbent and 0.2-1% of curing accelerator, wherein the tackifying resin at least comprises rosin resin and phenolic resin; when the polyimide cover film is subjected to laser hollowed-out on the printing screen, the cutting gradient of the polyimide film and the bonding layer is small, a finer circuit diagram is formed, the service life of the printing screen is effectively prolonged, the cost of materials is saved, and the replacement working hours of a production line are saved.
CN111605300a discloses a polyimide solar screen and a preparation method, which comprises the following steps: (1) net drawing and compounding: firstly stretching a polyester silk screen, standing, fixing the polyester silk screen on a screen frame to form a polyester mesh, compositing the metal silk screen on a compositing area in the middle of the polyester mesh by using a hot melt adhesive film to form a composite gauze, and fixing the composite gauze on another screen frame to obtain a composite white plate; (2) adhesive layer coating: uniformly coating an adhesive on the surface of a composite white plate or a polyimide film to form an adhesive layer; (3) film coating: spreading a polyimide film with corresponding size and film thickness into a coating area of the composite white plate, spreading the composite white plate on a heating platform, wherein the area of the heating platform is equal to that of the composite white plate, and laminating the polyimide film and the composite white plate by using 1-10 kg of pressure at 70-130 ℃ so as to form a polymer composite layer on the composite white plate; (4) drying; (5) laser; (6) washing and detecting the package.
However, it is found that the solvent resistance of the screen cover film provided in the prior art including the above invention is generally not higher than 20 ten thousand times, and the absorption band of the epoxy adhesive or polyurethane adhesive used for laser is in the infrared region, which is different from the absorption band of the polyimide base film for laser, so that the ultraviolet absorber is added to achieve better laser effect.
Therefore, in order to solve the above-mentioned technical problems, there is an urgent need to develop a polyamideimide adhesive having excellent solvent resistance without the need of additional addition of an ultraviolet light absorber.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a polyamide imide adhesive, a polyamide screen printing film, a preparation method and application thereof, wherein the polyamide imide adhesive is insoluble in silver paste or similar organic solvents, has excellent solvent resistance, has the same absorption wave band of ultraviolet laser as that of a polyimide base film (about 355 nm), can achieve a better laser effect without adding an ultraviolet absorber, and further has the advantages of high laser etching precision and high efficiency.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
in a first aspect, the invention provides a polyamideimide adhesive, which comprises the following components in parts by weight:
50-90 parts by weight of polyamide imide resin;
1-20 parts of epoxy resin;
5-40 parts of toughening resin.
Wherein the polyamideimide resin may be 55 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight, 75 parts by weight, 80 parts by weight, 85 parts by weight, or the like.
The epoxy resin may be 2 parts by weight, 4 parts by weight, 6 parts by weight, 8 parts by weight, 10 parts by weight, 12 parts by weight, 14 parts by weight, 16 parts by weight, 18 parts by weight, or the like.
The toughening resin may be 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, or the like.
According to the invention, the polyamide imide resin is taken as the main resin, the epoxy resin and the toughening resin are added in a matching way, so that the obtained polyamide imide adhesive has excellent solvent resistance and chemical resistance, and the adhesive layer of the polyamide screen film prepared by further matching with the polyamide base film is free from touch adhesion, is convenient to position on the screen, has excellent solvent resistance, can be stored at normal temperature, and can achieve a better laser effect without adding an additional ultraviolet absorber because the absorption wave bands of the polyamide imide resin and the polyimide base film to ultraviolet laser are the same (355 nm), so that the printing screen plate further prepared by adopting the polyamide screen film has the advantages of high laser etching precision and high efficiency.
Preferably, the polyamideimide resin has a glass transition temperature (Tg) of 130 to 200 ℃, for example, 140 ℃, 150 ℃, 160 ℃, 170 ℃, 180 ℃, 190 ℃, or the like.
Preferably, the viscosity of the polyamideimide resin is 0.5 to 10pa·s (25 ℃), for example 1pa·s, 2pa·s, 3pa·s, 4pa·s, 5pa·s, 6pa·s, 7pa·s, 8pa·s, 9pa·s, or the like.
In the present invention, the polyamideimide resin may specifically be selected from T065 of Mitsubishi, HR-71DD of Toyo-spinning or D400 of Toyo-spinning.
Preferably, the epoxy resin includes any one or a combination of at least two of bisphenol a type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, o-cresol novolac type epoxy resin, bisphenol a novolac type epoxy resin, or phenol biphenyl type epoxy resin.
In the present invention, the epoxy resin may be specifically selected from any two or more of bisphenol a novolac epoxy resins SQAN203, SQAN201, ai Dike of san eastern holy spring, bisphenol a novolac epoxy resins EP4910P2, and tin-blue star-free novolac epoxy resin N740S.
Preferably, the toughening resin comprises any one or a combination of at least two of nitrile rubber, carboxyl modified nitrile rubber, epoxy modified nitrile rubber, phenoxy resin, carboxyl modified phenoxy resin, epoxy modified phenoxy resin, acrylate rubber, carboxyl modified acrylate rubber, epoxy modified acrylate rubber, ethylene acrylate rubber, carboxyl modified ethylene acrylate rubber or epoxy modified ethylene acrylate rubber.
In the present invention, the toughening resin may specifically be selected from the nitrile rubber XER-32 of JSR, the nitrile rubber RK84L of huntsman or the phenoxy resin YP50 of Nippon iron.
Preferably, the polyamideimide adhesive material further comprises a polar organic solvent.
Preferably, the polar organic solvent comprises any one or a combination of at least two of dimethylformamide, dimethylacetamide or N-methylpyrrolidone.
Preferably, the mass ratio of the polyamideimide resin, the epoxy resin and the toughening resin to the polar organic solvent is 1 (2-9), such as 1:3, 1:4, 1:5, 1:6, 1:7 or 1:8.
In a second aspect, the invention provides a polyimide screen film, which comprises a polyimide base film, a polyamide-imide adhesive layer and a release film which are sequentially arranged;
the starting material for the polyamideimide glue layer comprises the polyamideimide binder according to the first aspect.
Preferably, the polyimide base film has a thickness of 1 to 10 μm, for example, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or the like.
Preferably, the thickness of the polyamideimide glue layer is 1 to 10 μm, for example 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm or 9 μm, etc.
In a third aspect, the present invention provides a method for preparing a polyimide screen film according to the second aspect, the method comprising: and (3) coating the polyamide imide adhesive according to the first aspect on a polyamide-based film, and attaching a release film after drying to obtain the polyimide screen plate film.
Preferably, the drying temperature is 80 to 150 ℃, for example 90 ℃, 100 ℃, 110 ℃, 120 ℃, 130 ℃, 140 ℃, or the like.
Preferably, the drying time is 2 to 5min, for example 2.5min, 3min, 3.5min, 4min or 4.5min, etc.
Preferably, the pressure of the attached release film is 0.1 to 0.5MPa, for example, 0.15MPa, 0.2MPa, 0.25MPa, 0.3MPa, 0.35MPa, 0.4MPa, 0.45MPa, or the like.
In a fourth aspect, the present invention provides a printing screen produced using the polyimide screen film of the second aspect.
In a fifth aspect, the present invention provides a method for producing a printing screen according to the fourth aspect, the method comprising: and (3) tearing off the release film of the polyimide screen film according to the second aspect, attaching the release film to one surface of the stainless steel screen, and then carrying out hot pressing and ultraviolet laser to obtain the printing screen.
Preferably, the hot pressing temperature is 150-200deg.C, such as 155 deg.C, 160 deg.C, 165 deg.C, 170 deg.C, 175 deg.C, 180 deg.C, 185 deg.C, 190 deg.C or 195 deg.C.
Preferably, the pressure of the hot pressing is 0.5 to 3MPa, for example, 0.7MPa, 0.9MPa, 1.1MPa, 1.3MPa, 1.5MPa, 1.7MPa, 1.9MPa, 2.3MPa, 2.6MPa, 2.9MPa, or the like.
Preferably, the hot pressing time is 10 to 30min, for example 12min, 14min, 16min, 18min, 20min, 22min, 24min, 26min or 28min, etc.
In a sixth aspect, the present invention provides the use of a polyamideimide binder according to the first aspect in printing screens.
Compared with the prior art, the invention has the following beneficial effects:
the material of the polyamide imide adhesive provided by the invention comprises polyamide imide resin, epoxy resin and toughening resin, the three resins are adopted for matching, so that the obtained polyamide imide adhesive has excellent solvent resistance and chemical resistance, and the adhesive layer of a polyamide screen plate film prepared by further matching with a polyamide base film is free from touch adhesion, so that the polyamide imide adhesive is convenient to position on the screen plate and can be stored at normal temperature, and meanwhile, the polyamide imide resin and the polyimide base film have the same absorption wave band of ultraviolet laser, so that a better laser effect can be achieved without adding an ultraviolet absorbent, and the printing screen plate further prepared by adopting the polyamide screen plate film has the advantages of high laser etching precision and high efficiency.
Drawings
FIG. 1 is a schematic cross-sectional view of a polyimide screen film according to the present invention;
wherein, the adhesive comprises a 1-polyimide base film, a 2-polyamide imide adhesive layer and a 3-release film.
Detailed Description
The technical scheme of the invention is further described by the following specific embodiments. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
The information of part of raw materials involved in the specific embodiment of the invention is as follows:
polyamideimide (PAI) resin: selected from HR-71DD of eastern yoshine, T065 of mitsubishi or D400 up to eastern guan;
epoxy resin: bisphenol a epoxy resin EP4910P2 selected from the group consisting of tin-blue star-free phenol novolac epoxy resin N740S, bisphenol a novolac epoxy resin squin 203, squin 201 or Ai Dike of san francisco;
nitrile rubber: RK84L selected from XER-32 of JSR or Huntsman;
phenoxy resin: YP50 of japanese new japanese iron living gold.
Example 1
The polyamide imide adhesive comprises the following components in parts by weight:
the preparation method of the polyamideimide adhesive provided by the embodiment comprises the following steps: and uniformly mixing PAI resin HR-71DD, phenol novolac epoxy resin N740S and nitrile rubber XER-32 in N, N-dimethylformamide to obtain the polyamide-imide adhesive.
Example 2
The polyamide imide adhesive comprises the following components in parts by weight:
the preparation method of the polyamideimide adhesive provided by the embodiment comprises the following steps: and uniformly mixing PAI resin HR-71DD, bisphenol A novolac epoxy resin SQAN201 and nitrile rubber RK84L in N, N-dimethylformamide to obtain the polyamide-imide adhesive.
Example 3
The polyamide imide adhesive comprises the following components in parts by weight:
the preparation method of the polyamideimide adhesive provided by the embodiment comprises the following steps: PAI resin D400, bisphenol A epoxy resin EP4910P2 and nitrile rubber XER-32 are uniformly mixed in N, N-dimethylformamide to obtain the polyamide-imide adhesive.
Example 4
The material of the polyimide adhesive comprises the following components in parts by weight:
the preparation method of the polyamideimide adhesive provided by the embodiment comprises the following steps: and uniformly mixing PAI resin HR-71DD, phenol novolac epoxy resin N740S and nitrile rubber XER-32 in N, N-dimethylformamide to obtain the polyamide-imide adhesive.
Example 5
A polyamideimide adhesive was different from example 1 only in that the PAI resin HR-71DD was replaced with Mitsubishi PAI resin T065, and the other components, amounts and preparation methods were the same as example 1.
Example 6
A polyamideimide adhesive was different from example 1 only in that bisphenol a epoxy novolac resin SQAN203 was used instead of phenol epoxy novolac resin N740S, and other components, amounts and preparation methods were the same as example 1.
Example 7
A polyamideimide adhesive was different from example 1 only in that a phenoxy resin YP50 was used instead of nitrile rubber XER-32, and other components, amounts and preparation methods were the same as in example 1.
Comparative example 1
A polyamide-imide adhesive was different from example 1 only in that the PAI resin HR-71DD was added in an amount of 20 parts by weight, and the other components, amounts and preparation methods were the same as those of example 1.
Comparative example 2
A polyamide-imide adhesive was different from example 1 only in that the PAI resin HR-71DD was added in an amount of 300 parts by weight, and the other components, amounts and preparation methods were the same as those of example 1.
Comparative example 3
A polyamideimide adhesive was different from example 1 only in that no phenol novolac epoxy resin N740S was added, and other components, amounts and preparation methods were the same as example 1.
Comparative example 4
A polyamideimide adhesive was different from example 1 only in that nitrile rubber XER-32 was not added, and other components, amounts and preparation methods were the same as those of example 1.
Application example 1
A printing screen, its preparation method includes the following steps:
(1) Coating a polyamide-imide adhesive (example 1) on the corona surface of a polyimide base film, firstly drying at 130 ℃ for 5min, and then attaching release paper at 60 ℃ and 0.4MPa to obtain a polyimide screen film;
(2) Tearing the release film on the polyimide screen plate film obtained in the step (1), attaching the polyimide-imide adhesive layer to one surface of the stainless steel screen plate, pressing for 30min in a hot press with the temperature of 180 ℃ and the pressure of 0.8MPa, and finally engraving a line in an ultraviolet laser mode to obtain the printing screen plate;
the schematic cross-sectional structure of the polyimide screen film obtained in the step (1) is shown in fig. 1, and the polyimide screen film comprises a polyimide base film (with the thickness of 5 mu m), a polyamide-imide adhesive layer (with the thickness of 5 mu m) and a release film which are sequentially arranged; .
Application examples 2 to 7
A printing screen was different from application example 1 only in that the polyamideimide binder obtained in example 1 was replaced with the polyamideimide binder obtained in examples 2 to 7, respectively, and the other materials and process parameters were the same as those of application example 1.
Comparative application examples 1 to 4
A printing screen was different from application example 1 only in that the polyamideimide binder obtained in example 1 was replaced with the polyamideimide binder obtained in comparative examples 1 to 4, respectively, and the other materials and process parameters were the same as those of application example 1.
Performance test:
(1) Adhesive strength: after hot-pressing a polyimide screen film and a stainless steel screen, cutting into 10mm sample strips, and stripping at a speed of 100mm/min for 180 degrees;
(2) Touch-and-tack: before hot pressing, pasting a polyamide-imide adhesive layer pair of a polyimide screen plate film of the tearing-off type film, wherein the polyimide screen plate film has no viscosity at normal temperature, or pasting the polyamide-imide adhesive layer pair to a screen plate, the polyamide-imide adhesive layer can move freely, and represents touch viscosity OK, otherwise, touch viscosity NG;
(3) Resistance to chemical transformation: soaking the printing screen in silver paste for 24 hours, then wiping, observing whether the silver paste permeates between a polyimide base film and a polyamide imide adhesive layer or not through a microscope, or whether bulge or layering occurs between the polyamide imide adhesive layer and the screen, if so, NG, and if not, OK;
(4) Glue overflow amount: punching 5 holes on a polyimide screen film by using a puncher with the diameter of 10mm, then hot-pressing the polyimide screen film and the screen under the conditions of 180 ℃ and 0.8MPa for 30min, and measuring the overflow glue amount overflowed from the round holes by using a microscope;
(5) Storage at room temperature: placing the polyimide screen film at normal temperature for 6 months, wherein the performance of the polyimide screen film is still kept above the specification value, and the normal-temperature storability is OK;
(6) Etching gradient: observing the opening width of the polyimide base film surface in the printing screen plate as L1 by a microscope, turning over the printing screen plate, observing the opening width of the polyamide-imide adhesive surface at the same position as L2, and obtaining the etching gradient by the difference L1-L2 between the opening widths of the polyimide base film surface and the polyamide-imide adhesive surface;
(7) Service life is as follows: pouring one end of a printing screen plate with patterns etched by laser into the paste, applying a certain pressure on the paste part of a silk screen by using a scraper, simultaneously moving towards the other end of the silk screen, lifting the silk screen after the scraper scrapes the whole printing area, separating the silk screen from a substrate, lightly scraping the paste back to an initial position by using an ink returning knife, and returning the workbench to a feeding position, so that the printing screen plate is a complete printing stroke; wherein, printing parameters: the scraper angle is 55 degrees, the scraper hardness is 75A, the screen printing space printing pressure is 55N, the printing speed is 230mm/s, and the printing times of printing patterns until the abnormalities such as virtual printing, broken lines, screen blocking, slurry leakage, covering film breakage or delamination and the like appear are the service life of the printing screen.
The printing screen panels provided in application examples 1 to 7 and comparative application examples 1 to 4 were tested according to the above test methods, and the test results are shown in table 1:
TABLE 1
From the data in table 1, it can be seen that:
the bonding strength of the polyimide screen film and the stainless steel screen provided in application examples 1-7 is 8.1-10.2N/cm, the touch viscosity is qualified, the chemical resistance is qualified, the glue overflow amount is 0.02-0.05 mm, the normal-temperature storage box is qualified, the etching gradient is 4.7-5.0, and the service life is as long as 29-35 ten thousand times;
compared with the application example 1, the addition amount of PAI resin in the polyamide-imide adhesive adopted in the comparison application example 1 is too low, so that the touch viscosity and chemical resistance of the prepared polyimide screen film are not qualified, the glue overflow amount is too high, and the service life is shorter; however, if the addition amount of PAI resin in the polyamide-imide adhesive adopted in the comparative application example 2 is too low, the bonding strength between the prepared polyimide screen film and the stainless steel screen is low, and the use requirement is not met;
compared with application example 1, the polyimide screen film prepared by the comparative application example 3 has lower bonding strength with the stainless steel screen and excessively high glue overflow amount due to the fact that phenol novolac epoxy resin is not added into the polyamide imide adhesive;
compared with application example 1, the polyamide-imide adhesive used in comparative application example 4 is free of nitrile rubber, so that the bonding strength between the prepared polyimide screen film and the stainless steel screen is high, but the adhesive overflow amount is too high, and the service life is short.
The applicant states that the present invention is illustrated by the above examples as a polyamideimide adhesive, a polyimide screen film, and methods of making and using the same, but the present invention is not limited to the above process steps, i.e., it is not meant that the present invention must be practiced in dependence upon the above process steps. It should be apparent to those skilled in the art that any modification of the present invention, equivalent substitution of selected raw materials, addition of auxiliary components, selection of specific modes, etc. fall within the scope of the present invention and the scope of disclosure.
Claims (10)
1. The polyamide imide adhesive is characterized by comprising the following components in parts by weight:
50-90 parts by weight of polyamide imide resin;
1-20 parts of epoxy resin;
5-40 parts of toughening resin.
2. The polyamideimide adhesive according to claim 1, wherein the polyamideimide resin has a glass transition temperature of 130 to 200 ℃;
preferably, the viscosity of the polyamideimide resin is 0.5 to 10pa·s;
preferably, the epoxy resin includes any one or a combination of at least two of bisphenol a type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, o-cresol novolac type epoxy resin, bisphenol a novolac type epoxy resin, or phenol biphenyl type epoxy resin;
preferably, the toughening resin comprises any one or a combination of at least two of nitrile rubber, carboxyl modified nitrile rubber, epoxy modified nitrile rubber, phenoxy resin, carboxyl modified phenoxy resin, epoxy modified phenoxy resin, acrylate rubber, carboxyl modified acrylate rubber, epoxy modified acrylate rubber, ethylene acrylate rubber, carboxyl modified ethylene acrylate rubber or epoxy modified ethylene acrylate rubber.
3. The polyamideimide adhesive according to claim 1 or 2, wherein the polyamideimide adhesive material further comprises a polar organic solvent;
preferably, the polar organic solvent comprises any one or a combination of at least two of dimethylformamide, dimethylacetamide or N-methylpyrrolidone;
preferably, the mass ratio of the sum of the polyamideimide resin, the epoxy resin and the toughening resin to the polar organic solvent is 1 (2-9).
4. The polyimide screen film is characterized by comprising a polyimide base film, a polyamide-imide adhesive layer and a release film which are sequentially arranged;
the polyamideimide adhesive layer is prepared from the polyamideimide adhesive according to any one of claims 1 to 3.
5. The polyimide screen film according to claim 4, wherein the polyimide base film has a thickness of 1 to 10 μm;
preferably, the thickness of the polyamideimide glue layer is 1-10 μm.
6. A method of producing the polyimide screen film according to claim 4 or 5, comprising: coating the polyamide-imide adhesive as claimed in any one of claims 1 to 3 on a polyimide base film, and attaching a release film after drying to obtain the polyimide screen film.
7. The method according to claim 6, wherein the drying temperature is 80 to 150 ℃;
preferably, the drying time is 2-5 min;
preferably, the pressure of the attaching release film is 0.1-0.5 MPa.
8. A printing screen produced using the polyimide screen film according to claim 4 or 5.
9. A method of preparing a printing screen of claim 8, comprising: the release film of the polyimide screen film according to claim 4 or 5 is removed and then is attached to one surface of a stainless steel screen plate, and then the printing screen plate is obtained through hot pressing and ultraviolet laser;
preferably, the temperature of the hot pressing is 150-200 ℃;
preferably, the pressure intensity of the hot pressing is 0.5-3 MPa;
preferably, the hot pressing time is 10-30 min.
10. Use of the polyamideimide binder according to claims 1 to 5 in printing screens.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311783457.XA CN117625117A (en) | 2023-12-22 | 2023-12-22 | Polyamide imide adhesive, polyimide screen printing film and preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311783457.XA CN117625117A (en) | 2023-12-22 | 2023-12-22 | Polyamide imide adhesive, polyimide screen printing film and preparation method and application thereof |
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