CN117613636B - Processing method of charging spring piece in Bluetooth headset charging bin - Google Patents
Processing method of charging spring piece in Bluetooth headset charging bin Download PDFInfo
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- CN117613636B CN117613636B CN202311636946.2A CN202311636946A CN117613636B CN 117613636 B CN117613636 B CN 117613636B CN 202311636946 A CN202311636946 A CN 202311636946A CN 117613636 B CN117613636 B CN 117613636B
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- electroplating
- punching
- material belt
- stamping
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- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 51
- 238000009713 electroplating Methods 0.000 claims abstract description 40
- 238000004080 punching Methods 0.000 claims abstract description 36
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 17
- 239000000178 monomer Substances 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 230000004048 modification Effects 0.000 claims description 7
- 238000012986 modification Methods 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 239000012634 fragment Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
- H02J7/0045—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction concerning the insertion or the connection of the batteries
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Computer Networks & Wireless Communication (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a processing method of a charging spring piece in a charging bin of a Bluetooth headset, which comprises the following steps: step a: punching a positioning hole; step b: detecting a punching belt; step c: a blue film is adhered to the punching belt; step d: electroplating a film pasting material belt; step e: detecting an electroplating material belt; step f: secondary stamping of the electroplating material belt; step g: detecting a second punching belt; step h: and cutting the second punching belt. The invention provides a processing method of a charging spring piece in a Bluetooth headset charging bin, which is characterized in that a base material is punched once, then a product after punching is subjected to film pasting, and electroplating is performed after film pasting, and only an electroplating area is exposed, so that a film pasting protection area cannot participate in electroplating, and the film is torn off after electroplating to perform secondary punching forming.
Description
Technical Field
The invention belongs to the technical field of digital product processing, and particularly relates to a processing method of a charging spring piece in a Bluetooth headset charging bin.
Background
With the progress and market change of the times, the connector industry breaks through, so that intelligent products such as Bluetooth headphones and smart watches are derived, and new breakthroughs and challenges are also brought to the process and product assembly process.
The product of this example is divided into the piece about bluetooth headset charges the shell fragment (negative pole shell fragment and anodal shell fragment), and positive and negative pole shell fragment common mode punching press, and the material is the stainless steel, and thickness is 0.12mm, shell fragment-negative pole overall dimension: 7.76 x 2.40 x 2.80mm, external dimensions of shrapnel-positive electrode: 3.35 x 2.40 x 4.95mm.
As shown in fig. 1 and fig. 2, on the negative pole shell fragment and the positive pole shell fragment, 1,4 are respectively negative pole welded area and positive pole welded area, namely negative pole electroplate area and positive pole electroplate area, and other areas except the electroplate area need not electroplate, and 2,5 are respectively negative pole shell fragment warhead, positive pole shell fragment warhead, this region is with earphone bottom metal circle contact to realize charging effect, and 3, 6 are respectively negative pole shell fragment barricade, positive pole shell fragment barricade, play the protection shell fragment when main purpose prevents that earphone from being pressed and being led to plastic deformation by the excessive pressure, the shell fragment can't rebound. If the traditional processing method is adopted, the following flow is generally adopted: in the processing flow, the negative pole shrapnel and the positive pole shrapnel are all electroplated, so that the cost is high, if selective electroplating is used, only a welding area is electroplated, other areas are not electroplated, and the electroplating cannot be performed by adopting the traditional mode for processing, so that the product requirement cannot be met.
Disclosure of Invention
The invention aims to overcome the problems existing in the prior art, reduce the production cost, ensure the product performance requirement, provide a processing method of a charging spring piece in a charging bin of a Bluetooth headset, through carrying out primary stamping and secondary stamping forming to the substrate, not only broken through and puzzled the unable electroplated difficult problem of this kind of structure in the trade, reduced electroplating cost simultaneously, reduce the wasting of resources, and its production efficiency is very high, and manufacturing cost also greatly reduced.
In order to achieve the technical purpose and the technical effect, the invention is realized by the following technical scheme:
A processing method of a charging spring piece in a charging bin of a Bluetooth headset comprises the following steps:
Step a: punching locating hole
Providing a substrate plate, designing a continuous stamping die according to basic parameters of the substrate plate required and determined by production, stamping the substrate plate by using stamping die equipment after the design is finished to obtain a stamping belt, and respectively punching holes along two edges of the stamping belt to form a first positioning hole group and a second positioning hole group, wherein the first positioning hole group and the second positioning hole group are respectively formed by uniformly distributed positioning holes along the length direction of the stamping belt;
An intermediate area is formed between the first positioning hole group and the second positioning hole group, a plurality of uniformly distributed positive positioning groove groups and negative positioning groove groups are formed at two edges of the intermediate area in the length direction, and a film pasting area is formed between the positive positioning groove groups and the negative positioning groove groups;
Step b: c, detecting whether the size of a punching belt in the step a is qualified or not by using detection equipment, returning to the step a for modification if the size is not qualified, and executing the step c if the size is qualified;
Step c: b, placing the qualified punched material belt in the step b into film pasting equipment, and pulling the material belt through a positioning hole by a film pasting and pulling mechanism, and pasting a blue film on film pasting areas on the upper surface and the lower surface of the punched material belt by a film pasting machine to obtain a film pasting material belt;
Step d: electroplating the film-sticking material belt to prepare an electroplating material belt;
step e: detecting whether the electroplated material belt is qualified or not by using detection equipment, if so, executing the step f, and if not, scrapping the electroplated material belt;
Step f: c, carrying out secondary stamping on two long edge areas on the electroplating material belt which is detected to be qualified in the step e according to production requirements to form a plurality of anode shrapnel shapes which are arranged in parallel and a plurality of cathode shrapnel shapes which are arranged in parallel, and synchronously and automatically tearing a blue film on the electroplating material belt in the process of stamping and discharging the electroplating material belt, so as to obtain a secondary stamping material belt after the secondary stamping is finished;
Step g: detecting whether the size of the two punching belts is qualified or not by using detection equipment, if not, returning to the step f for modification, and if so, executing the step h;
Step h: and d, cutting the two qualified punching belts detected in the step g by using an automatic cutting machine to obtain an anode shrapnel monomer and a cathode shrapnel monomer, and sending the anode shrapnel monomer and the cathode shrapnel monomer into an automatic packaging machine for packaging.
Further, the stroke frequency of the stamping die equipment is 280-320 times/min.
Further, the positive electrode positioning groove group comprises two first slotted holes, the two first slotted holes are positioned between two adjacent positioning holes in the first positioning hole group, and a first electroplating area is formed between the two first slotted holes;
The negative electrode positioning groove group comprises two second groove holes, the two second groove holes are positioned between two adjacent positioning holes in the second positioning hole group, and a second electroplating area is formed between the two second groove holes.
Further, the detection device is a two-dimensional measurement device.
Compared with the prior art, the invention has the beneficial effects that:
The invention provides a processing method of a charging spring piece in a Bluetooth headset charging bin, which is characterized in that a base material is punched once, then a product after punching is subjected to film pasting, and electroplating is performed after film pasting, and only an electroplating area is exposed, so that a film pasting protection area cannot participate in electroplating, and the film is torn off after electroplating to perform secondary punching forming.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
fig. 1 is a schematic structural diagram of a negative electrode shrapnel in the background art provided by the invention;
fig. 2 is a schematic structural diagram of a positive electrode spring sheet in the background art provided by the invention;
FIG. 3 is a schematic view of the structure of the material belt provided by the invention;
fig. 4 is a flowchart of a processing method of a charging spring piece in a charging bin of a bluetooth headset.
Wherein, the reference numerals are as follows: 1. a negative electrode plating region; 2. a negative pole shrapnel warhead; 3. a negative pole shrapnel retaining wall; 4. a positive electrode plating region; 5. a positive pole spring leaf warhead; 6. positive pole shrapnel retaining wall; 10. a substrate plate; 101. a first positioning hole group; 102. a second positioning hole group; 103. a middle region; 104. a negative electrode positioning groove group; 105. an anode positioning groove group; 106. a film pasting area; 107. a second slot; 108. a first plating region; 109. a first slot; 110. a second plating region; 20. blue film.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The processing method of the charging spring piece in the charging bin of the Bluetooth headset as shown in fig. 1 to 4 comprises the following steps:
Step a: punching locating hole
Providing a substrate plate 10, designing a continuous stamping die according to basic parameters of the substrate plate 10 required and determined by production, stamping the substrate plate 10 by using stamping die equipment after the design is finished to obtain a stamping belt, and respectively punching two edges of the stamping belt to form a first positioning hole group 101 and a second positioning hole group 102, wherein the first positioning hole group 101 and the second positioning hole group 102 are composed of positioning holes uniformly distributed along the length direction of the stamping belt;
The stroke times of the stamping die equipment are 280-320 times/min;
An intermediate region 103 is formed between the first positioning hole group 101 and the second positioning hole group 102, a plurality of uniformly distributed positive positioning groove groups 105 and negative positioning groove groups 104 are arranged at two edges of the intermediate region 103 in the length direction, and a film pasting region 106 is formed between the positive positioning groove groups 105 and the negative positioning groove groups 104;
The positive positioning slot group 105 comprises two first slot holes 109, wherein the two first slot holes 109 are positioned between two adjacent positioning holes in the first positioning hole group 101, and a first electroplating area 108 is formed between the two first slot holes 109;
the negative positioning slot set 104 comprises two second slot holes 107, wherein the two second slot holes 107 are positioned between two adjacent positioning holes in the second positioning hole set 102, and a second electroplating area 110 is formed between the two second slot holes 107;
Step b: c, detecting whether the size of a punching belt in the step a is qualified or not by using detection equipment, returning to the step a for modification if the size is not qualified, and executing the step c if the size is qualified;
The method comprises the steps of (a) detecting whether the size of a punching belt in the step (a) is qualified or not by using secondary element measuring equipment, wherein the size of the punching belt mainly comprises the width of the punching belt, the diameter of a positioning hole, the distance between the circle centers of two adjacent positioning holes in a first positioning hole group 101, the distance between the circle centers of two adjacent positioning holes in a second positioning hole group 102, the distance between the first positioning hole group 101 and the second positioning hole group 102 and the like;
Step c: b, placing the qualified punched material belt in the step b into film pasting equipment, and pulling the material belt through a positioning hole by a film pasting and pulling mechanism, and pasting a blue film 20 on film pasting areas 106 on the upper surface and the lower surface of the punched material belt by a film pasting machine to obtain a film pasting material belt;
Step d: electroplating the film-sticking material belt to prepare an electroplating material belt;
in this process, the blue film 20 is attached to the film attaching region 106, so that the film attaching region 106 on a punching belt is not electroplated;
step e: detecting whether the electroplated material belt is qualified or not by using detection equipment, if so, executing the step f, and if not, scrapping the electroplated material belt;
in the process of detecting the electroplated material belt by using secondary element measuring equipment, the size of the electroplated product is mainly detected;
Step f: c, carrying out secondary stamping on two long edge areas on the electroplating material belt which is detected to be qualified in the step e according to production requirements to form a plurality of anode shrapnel shapes which are arranged in parallel and a plurality of cathode shrapnel shapes which are arranged in parallel, and synchronously and automatically tearing the blue film 20 on the electroplating material belt in the process of stamping and discharging the electroplating material belt, and obtaining a secondary stamping material belt after the secondary stamping is finished;
Step g: detecting whether the size of the two punching belts is qualified or not by using detection equipment, if not, returning to the step f for modification, and if so, executing the step h;
The detection equipment is two-dimensional measurement equipment;
in the process of detecting the secondary punching belt by using secondary element measuring equipment, the size of a product after secondary punching is mainly detected;
Step h: cutting the two qualified punching belts detected in the step g by using an automatic cutting machine to obtain an anode shrapnel monomer and a cathode shrapnel monomer, and sending the anode shrapnel monomer and the cathode shrapnel monomer into an automatic packaging machine for packaging;
the positive pole spring plate monomer and the negative pole spring plate monomer are respectively prepared into a positive pole spring plate and a negative pole spring plate through a molding process.
The invention provides a processing method of a charging spring piece in a Bluetooth headset charging bin, which is characterized in that a base material is punched once, then a product after punching is subjected to film pasting, and electroplating is performed after film pasting, and only an electroplating area is exposed, so that a film pasting protection area cannot participate in electroplating, and the film is torn off after electroplating to perform secondary punching forming.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims.
Claims (4)
1. A processing method of a charging spring piece in a charging bin of a Bluetooth headset is characterized by comprising the following steps of: the method comprises the following steps:
Step a: punching locating hole
Providing a substrate plate, designing a continuous stamping die according to basic parameters of the substrate plate required and determined by production, stamping the substrate plate by using stamping die equipment after the design is finished to obtain a stamping belt, and respectively punching holes along two edges of the stamping belt to form a first positioning hole group and a second positioning hole group, wherein the first positioning hole group and the second positioning hole group are respectively formed by uniformly distributed positioning holes along the length direction of the stamping belt;
An intermediate area is formed between the first positioning hole group and the second positioning hole group, a plurality of uniformly distributed positive positioning groove groups and negative positioning groove groups are formed at two edges of the intermediate area in the length direction, and a film pasting area is formed between the positive positioning groove groups and the negative positioning groove groups;
Step b: detecting a punching belt
C, detecting whether the size of a punching belt in the step a is qualified or not by using detection equipment, returning to the step a for modification if the size is not qualified, and executing the step c if the size is qualified;
Step c: blue film is pasted to dashing material area
B, placing the qualified punched material belt in the step b into film pasting equipment, and pulling the material belt through a positioning hole by a film pasting and pulling mechanism, and pasting a blue film on film pasting areas on the upper surface and the lower surface of the punched material belt by a film pasting machine to obtain a film pasting material belt;
Step d: film-sticking material hot-line plating
Electroplating the film-sticking material belt to prepare an electroplating material belt;
Step e: detecting electroplating material belt
Detecting whether the electroplated material belt is qualified or not by using detection equipment, if so, executing the step f, and if not, scrapping the electroplated material belt;
Step f: secondary stamping of electroplated material strip
C, carrying out secondary stamping on two long edge areas on the electroplating material belt which is detected to be qualified in the step e according to production requirements to form a plurality of anode shrapnel shapes which are arranged in parallel and a plurality of cathode shrapnel shapes which are arranged in parallel, and synchronously and automatically tearing a blue film on the electroplating material belt in the process of stamping and discharging the electroplating material belt, so as to obtain a secondary stamping material belt after the secondary stamping is finished;
Step g: detecting two-punching belt
Detecting whether the size of the two punching belts is qualified or not by using detection equipment, if not, returning to the step f for modification, and if so, executing the step h;
Step h: cutting the two punching belts
And d, cutting the two qualified punching belts detected in the step g by using an automatic cutting machine to obtain an anode shrapnel monomer and a cathode shrapnel monomer, and sending the anode shrapnel monomer and the cathode shrapnel monomer into an automatic packaging machine for packaging.
2. The method for processing the charging spring piece in the charging bin of the Bluetooth headset according to claim 1, wherein the method comprises the following steps: the stroke times of the stamping die equipment are 280-320 times/min.
3. The method for processing the charging spring piece in the charging bin of the Bluetooth headset according to claim 1, wherein the method comprises the following steps: the positive electrode positioning groove group comprises two first slotted holes, the two first slotted holes are positioned between two adjacent positioning holes in the first positioning hole group, and a first electroplating area is formed between the two first slotted holes;
The negative electrode positioning groove group comprises two second groove holes, the two second groove holes are positioned between two adjacent positioning holes in the second positioning hole group, and a second electroplating area is formed between the two second groove holes.
4. The method for processing the charging spring piece in the charging bin of the Bluetooth headset according to claim 1, wherein the method comprises the following steps: the detection equipment is secondary element measurement equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311636946.2A CN117613636B (en) | 2023-12-01 | 2023-12-01 | Processing method of charging spring piece in Bluetooth headset charging bin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311636946.2A CN117613636B (en) | 2023-12-01 | 2023-12-01 | Processing method of charging spring piece in Bluetooth headset charging bin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117613636A CN117613636A (en) | 2024-02-27 |
| CN117613636B true CN117613636B (en) | 2024-08-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311636946.2A Active CN117613636B (en) | 2023-12-01 | 2023-12-01 | Processing method of charging spring piece in Bluetooth headset charging bin |
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| Country | Link |
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| CN (1) | CN117613636B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427181A (en) * | 2011-07-27 | 2012-04-25 | 温州意华通讯接插件有限公司 | Plastic-packaged electric connection insertion piece and manufacturing method thereof |
| CN104228299A (en) * | 2013-06-17 | 2014-12-24 | 成都宏明双新科技股份有限公司 | Production process for film pasting workpiece |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE8901230D0 (en) * | 1988-08-01 | 1989-04-07 | Aweidmueller Gmbh & Co C | PROCEDURES FOR PREPARING THE CONTACT BODY PROVIDED WITH AN INSULATION ELEMENT, SUCH AS CONTACT SHELTS AND CABLES AND THEIR APPLICATION OF DISOLATED LEADERS, AND ACCORDING TO THE PROCEDURE |
| US6439975B1 (en) * | 2000-01-28 | 2002-08-27 | Hon Hai Precision Ind. Co., Ltd. | Method for forming contact of electrical connector and press die for practicing the method |
| CN214589328U (en) * | 2021-04-29 | 2021-11-02 | 铜陵铜峰精密科技有限公司 | Antenna shell fragment stamping workpiece |
-
2023
- 2023-12-01 CN CN202311636946.2A patent/CN117613636B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427181A (en) * | 2011-07-27 | 2012-04-25 | 温州意华通讯接插件有限公司 | Plastic-packaged electric connection insertion piece and manufacturing method thereof |
| CN104228299A (en) * | 2013-06-17 | 2014-12-24 | 成都宏明双新科技股份有限公司 | Production process for film pasting workpiece |
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| CN117613636A (en) | 2024-02-27 |
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