CN117612578A - RDT high temperature device test equipment - Google Patents

Abstract

A test device for an RDT high-temperature device belongs to the technical field of RDT high-temperature tests and aims to solve the problem that heat dissipation of a high-temperature test machine body cannot be utilized to quickly cool a solid state disk and the machine body when a test bin and heat dissipation equipment cannot switch cooling objects and the temperature of the test machine body is abnormal. Including the test equipment main part, the equipment chamber has been seted up to the inside of test equipment main part, the inside in equipment chamber is provided with the cooling mechanism of being convenient for cool down the test equipment main part, the bottom of test equipment main part is provided with the cooling mechanism of being convenient for descend test equipment main part inner chamber temperature fast, the top of cooling mechanism is provided with the closing mechanism of being convenient for supplementary cooling mechanism to cool down and open and close. RDT high temperature device test equipment is connected with the fan through bellows and third air-out pipe through the first air-out pipe that sets up in the equipment chamber, is convenient for take out the interior air of test equipment main part and realizes the cooling function.

Description

RDT high temperature device test equipment

Technical Field

The invention relates to the technical field of RDT high-temperature testing, in particular to testing equipment of an RDT high-temperature device.

Background

The solid state disk is also called a solid state drive, is a hard disk made of a solid state electronic memory chip array, and the whole solid state disk is composed of electronic chips and circuit boards, is widely applied to various fields such as military, vehicle-mounted, industrial control, video monitoring, network terminals, electric power, medical treatment, aviation, navigation equipment and the like, so that the quality requirement on the solid state disk is particularly strict, and in order to meet the strict quality control of the solid state disk, all mass manufacturers need RDT detection after producing core components of the solid state disk.

The conventional RDT testing device does not have the structure of an integral switchable object cooling, a testing cabin rapid cooling and a temperature abnormal rapid cooling testing cabin when in use, so that the RDT testing device only supports the internal heat dissipation of a testing machine body, the solid state disk is taken out after being naturally cooled after being detected at a high temperature, the cooling time is long, if the solid state disk is taken out after being forcibly opened, the high temperature in the testing machine body is extremely easy to swell and scald operators, and the testing machine body is cooled when the temperature is abnormal and is mostly powered off in the use process, the rapid cooling testing cabin cannot rescue the solid state disk after the power off, the use is inconvenient, and the testing equipment for the RDT high temperature device is designed based on the defects of the prior art.

Disclosure of Invention

The invention provides RDT high-temperature device testing equipment, which has the advantages of integral switchable object cooling, rapid cooling of a testing cabin and abnormal temperature rapid cooling of the testing cabin, and solves the problem that a high-temperature testing machine body cannot cool a solid state disk and the machine body rapidly when the testing cabin and heat dissipation equipment cannot switch a cooling object and the temperature of the testing machine body is abnormal.

The invention provides the following technical scheme: the utility model provides a RDT high temperature device test equipment, includes the test equipment main part, the inside equipment chamber of having seted up of test equipment main part, the inside of equipment chamber is provided with the cooling mechanism of being convenient for to test equipment main part cooling, the bottom of test equipment main part is provided with the cooling mechanism of being convenient for descend test equipment main part inner chamber temperature fast, the top of cooling mechanism is provided with the closing mechanism of being convenient for supplementary cooling mechanism to cool down and open and close;

the heat dissipation mechanism comprises a first air outlet pipe, an air box, a second air outlet pipe, connecting strips, sealing plates, rotating rods, a first sealing plate, a second sealing plate and traction springs, wherein the first air outlet pipe penetrates through the bottom of an inner cavity of an equipment cavity, the air box is fixedly connected to one end of the first air outlet pipe, the second air outlet pipe is fixedly connected to two sides of the air box, the inner cavity of the second air outlet pipe is communicated with the air box, the connecting strips are fixedly connected to the inner cavity wall of the air box, which is close to one side of the first air outlet pipe, the sealing plates are fixedly connected to the connecting strips, the rotating rods are fixedly connected to the inner cavity wall of the second air outlet pipe, the first sealing plates are rotationally connected to the surface of the rotating rods, and the traction springs are fixedly connected to one sides of the first sealing plates and the second sealing plates, which face the air box.

As a preferable technical scheme of the invention, the heat radiation mechanism further comprises a third air outlet pipe, a fan housing and a fan, wherein the third air outlet pipe is fixedly connected to one side of the air box, which is far away from the first air outlet pipe, the fan housing is fixedly connected to the outer end of the third air outlet pipe, and the fan is arranged in the fan housing.

As a preferable technical scheme of the invention, the cooling mechanism comprises an air inlet channel, two guide air channels, fins, a semiconductor temperature control sheet, a heat conduction copper pipe, a filter plate and an air inlet plate, wherein the air inlet channel is fixedly connected to the bottom of a main body of the testing device in a penetrating manner, the two guide air channels are fixedly connected to the inner sides of the air inlet channel, the fins are fixedly connected to the inner sides of the guide air channels, the semiconductor temperature control sheet is fixedly connected to the inner sides of the air inlet channel, the heat conduction copper pipe is fixedly connected to the inner sides of the fins, the filter plate is fixedly connected to the inner sides of the air inlet channel, the air inlet plate is fixedly connected to the back of the main body of the testing device, and the air inlet plate is connected with the air inlet channel.

As a preferable technical scheme of the invention, the opening and closing mechanism comprises an elliptical wheel, a traction arm, a side sliding plate, an opening and closing plate hinge block and a control motor, wherein the elliptical wheel is connected to the bottom of an inner cavity of a main body of the testing equipment in a penetrating and rotating mode, the traction arm is movably hinged to the inside of the elliptical wheel, the side sliding plate is fixedly connected to the bottom of the inner cavity of the main body of the testing equipment, the opening and closing plate is slidably connected to the inner side of the side sliding plate, the hinge block is fixedly connected to one side of the opening and closing plate, which faces the elliptical wheel, and the control motor is fixedly connected to the lower surface of the main body of the testing equipment.

As a preferable technical scheme of the invention, a control panel is arranged on the front surface of the testing equipment main body, an exhaust passage is formed in the side surface of the testing equipment main body, a protection door is rotatably connected to the front surface of the testing equipment main body, a handle is fixedly connected to the protection door, a buckle is fixedly connected to the front surface of the testing equipment main body, a sliding rail is fixedly connected to the side wall of an inner cavity of the testing equipment main body, tested equipment is connected to the inner portion of the sliding rail in a sliding manner, and a ventilation groove is formed in the bottom of the inner cavity of the testing equipment main body in a penetrating manner.

As a preferable technical scheme of the invention, the inner diameter of the second air outlet pipe near one end of the air box is smaller than the inner diameter of the end far away from the air box, the circumference of the first closing plate and the rotating rod after being fully expanded is larger than the inner diameter of the second air outlet pipe near one end of the air box, the closing plate is contacted with one end of the first air outlet pipe, and the bottom end of the first air outlet pipe is communicated with the inner cavity of the main body of the testing equipment.

As a preferable technical scheme of the invention, the number of the fins is a plurality, the shorter the fins are from the air inlet channel, and the two ends of the temperature-conducting copper pipe are respectively connected with a semiconductor temperature control sheet and the fins.

As a preferable technical scheme of the invention, the top of the control motor is rotationally connected with an elliptical wheel, the opening and closing plate is slidingly connected above the ventilation groove, and the inside of the hinge block is movably hinged with a traction arm.

As a preferable technical scheme of the invention, the handle is movably clamped in the buckle, and the inner cavity of the exhaust passage is communicated with the inner cavity of the equipment cavity.

As a preferable technical scheme of the invention, the lower part of the ventilation groove is fixedly connected with the top surface of the diversion air duct, and the inner cavity of the testing equipment main body is communicated with the inner cavity of the diversion air duct through the ventilation groove.

The invention has the following beneficial effects:

1. according to the RDT high-temperature device testing equipment, after the SSD high-temperature testing is completed by the testing equipment main body, the control motor is controlled to rotate through the control panel, the control motor drives the elliptical wheel connected with the control motor to rotate, and the pulling arm is connected with the opening and closing plate through the hinging block when the elliptical wheel rotates, so that the pulling arm can pull the opening and closing plate to inwards slide under the limit of the side sliding plate to expand the ventilation groove when the elliptical wheel rotates, at the moment, the control fan clockwise rotates to reduce the pressure in the bellows, the first closing plate expands the second air outlet pipe under the action of the pulling spring and the pressure, the first air outlet pipe is opened under the action of the pressure, relatively hot air in the testing equipment main body is discharged from the third air outlet pipe through the first air outlet pipe, the relatively hot air in the testing equipment main body is reduced in pressure while the relatively hot air in the testing equipment main body is discharged, at the moment, the outside air is sucked down through the air inlet channel, the air guide channel and the groove in the side sliding plate are arranged in the testing equipment main body, the air in the testing equipment main body is accelerated, the second air outlet pipe is closed under the action of the pulling spring and the pressure, the first air outlet pipe is opened, the temperature of the testing equipment main body is fast, the testing equipment is cooled down, and the testing equipment is convenient to quickly cooled, and the testing equipment is convenient to test the temperature.

2. This RDT high temperature device test equipment, it is great to give off heat through equipment chamber electrical components, and equipment intracavity heated radiation temperature is also rising along with it, control fan upset is bloied in the bellows this moment, the increase of bellows internal pressure makes the closure plate prevent that air from entering into test equipment main part test storehouse from first tuber pipe internal-end is hugged closely, simultaneously after the increase of bellows internal pressure air promotes first closure plate and bull stick closure, make the passageway of second tuber pipe unblocked, the lower air of temperature enters into equipment intracavity fast in the bellows, and equipment intracavity is because cooler air's entering, make original air discharge from exhaust passage department, can realize the air cycle in the equipment chamber and reach the radiating purpose, the device is convenient for cool down equipment intracavity electrical components.

3. According to the RDT high-temperature device testing equipment, the opening and closing plate is opened through the control panel control motor when the temperature is abnormal, at the moment, the temperature of the fins is reduced to minus 15 ℃ through the temperature-conducting copper pipe by the semiconductor temperature control piece, the fan is started to drive air in the testing equipment main body to flow after adjustment is finished, external air firstly contacts with the fins when entering the bellows through the first air outlet pipe, cold air is formed after heat exchange between the normal-temperature air and the fins, the internal temperature of the testing equipment main body is rapidly reduced, damage to SSD or equipment due to excessive temperature after the temperature abnormality in the testing equipment main body is prevented, and the device is convenient for rapidly reducing the temperature when the temperature in the testing equipment main body is abnormal.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present invention;

FIG. 2 is a schematic view of the bottom structure of the test apparatus of the present invention;

FIG. 3 is a schematic diagram showing the internal structure of the test apparatus according to the present invention;

FIG. 4 is a schematic view of the opening and closing mechanism of the present invention;

FIG. 5 is a schematic view of an air inlet plate structure of the present invention;

FIG. 6 is a schematic diagram of a cooling mechanism according to the present invention;

FIG. 7 is a schematic side sectional view of a fin according to the present invention;

FIG. 8 is a schematic view of the device cavity and heat dissipation mechanism of the present invention;

FIG. 9 is a schematic diagram of a heat dissipating mechanism according to the present invention;

FIG. 10 is a schematic view of the unfolded structure of the closure plate of the present invention.

In the figure: 1. a testing device body; 101. a control panel; 102. an exhaust passage; 103. a protective door; 104. a grip; 105. a buckle; 106. a slide rail; 107. a device under test; 108. a ventilation groove; 109. an equipment chamber; 3. an opening and closing mechanism; 301. an elliptical wheel; 302. a pulling arm; 303. a side slide plate; 304. an opening/closing plate; 305. a hinge block; 306. controlling a motor; 4. a cooling mechanism; 401. an air inlet channel; 402. a diversion air duct; 403. a fin; 404. a semiconductor temperature control sheet; 405. a temperature-conducting copper pipe; 406. a filter plate; 407. an air inlet plate; 5. a heat dissipation mechanism; 501. a first air outlet pipe; 502. a wind box; 503. a second air outlet pipe; 504. a connecting strip; 505. a closing plate; 506. a third air outlet pipe; 507. a fan housing; 508. a blower; 509. a rotating rod; 510. a first closing plate; 511. a second closing plate; 512. and a traction spring.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Referring to fig. 1-10, an RDT high temperature device testing apparatus includes a testing apparatus main body 1, an apparatus cavity 109 is formed inside the testing apparatus main body 1, a heat dissipation mechanism 5 for cooling the testing apparatus main body 1 is disposed inside the apparatus cavity 109, a cooling mechanism 4 for cooling the temperature of the inner cavity of the testing apparatus main body 1 is disposed at the bottom of the testing apparatus main body 1, an opening and closing mechanism 3 for cooling the cooling mechanism 4 is disposed above the cooling mechanism 4, a control panel 101 is disposed on the front surface of the testing apparatus main body 1, an exhaust passage 102 is disposed on a side surface of the testing apparatus main body 1, a protection door 103 is rotatably connected to the front surface of the testing apparatus main body 1, a grip 104 is fixedly connected to the protection door 103, a buckle 105 is fixedly connected to the front surface of the testing apparatus main body 1, a slide rail 106 is fixedly connected to the inner cavity side wall of the testing apparatus 106, a tested apparatus 107 is slidably connected to the inner cavity bottom of the testing apparatus main body 1, a ventilation slot 108 is disposed through the inner cavity bottom of the testing apparatus main body 1, the grip 104 is movably clamped inside the buckle 105, the inner cavity 102 is communicated with the inner cavity of the apparatus cavity 109, the upper surface of the ventilation slot 108 is fixedly connected to the inner cavity 402 of the testing apparatus main body through the ventilation slot 402.

Referring to fig. 8-10, the heat dissipation mechanism 5 includes a first air outlet pipe 501, a bellows 502, a second air outlet pipe 503, a connecting bar 504, a closing plate 505, a rotating rod 509, a first closing plate 510, a second closing plate 511 and a traction spring 512, where the first air outlet pipe 501 is fixedly connected to the bottom of the cavity of the equipment cavity 109, the bellows 502 is fixedly connected to one end of the first air outlet pipe 501, the second air outlet pipe 503 is fixedly connected to two sides of the bellows 502, the cavity of the second air outlet pipe 503 is communicated with the bellows 502, the connecting bar 504 is fixedly connected to the cavity wall of the bellows 502 near one side of the first air outlet pipe 501, the closing plate 505 is fixedly connected to the connecting bar 504, the rotating rod 509 is fixedly connected to the cavity wall of the second air outlet pipe 503, the first closing plate 510 is rotatably connected to the surface of the rotating rod 509, the second closure plate 511 rotates to be connected on the surface of bull stick 509, traction spring 512 fixed connection is in the one side of first closure plate 510 and second closure plate 511 towards bellows 502, heat dissipation mechanism 5 still includes third tuber pipe 506, fan housing 507 and fan 508, third tuber pipe 506 fixed connection is in bellows 502 one side of keeping away from first tuber pipe 501, fan housing 507 fixed connection is in the outer end of third tuber pipe 506, fan 508 installs in the inside of fan housing 507, the internal diameter that second tuber pipe 503 is close to bellows 502 one end is less than the internal diameter that is kept away from bellows 502 one end, circumference is greater than the internal diameter that second tuber pipe 503 is close to bellows 502 one end after first closure plate 510 and bull stick 509 are fully expanded, closure plate 505 contacts with one end of first tuber pipe 501, the bottom of first tuber pipe 501 communicates with each other with the inner chamber of test equipment main part 1.

Through setting up closure plate 505, first closure plate 510 and second closure plate 511, be convenient for when fan 508 corotation, first closure plate 510 and second closure plate 511 are closed second tuber pipe 503, closure plate 505 is opened first tuber pipe 501 through connecting strip 504, and the nature of connecting strip 504 is the shell fragment, make the hotter air in the test equipment main part 1 discharge in from first tuber pipe 501, when fan 508 reversal, first closure plate 510 and second closure plate 511 are opened second tuber pipe 503, closure plate 505 is closed first tuber pipe 501, make outside colder air enter into equipment chamber 109 through bellows 502 and second tuber pipe 503, carry out the heat dissipation to the electrical components in the equipment chamber 109.

Referring to fig. 5-7, the cooling mechanism 4 includes an air inlet channel 401, a guide air channel 402, fins 403, a semiconductor temperature control sheet 404, a heat conduction copper tube 405, a filter plate 406 and an air inlet plate 407, wherein the air inlet channel 401 is fixedly connected to the bottom of the test device main body 1 in a penetrating manner, the guide air channel 402 is fixedly connected to the inner side of the air inlet channel 401, the number of the guide air channels 402 is two, the fins 403 are fixedly connected to the inner side of the guide air channel 402, the semiconductor temperature control sheet 404 is fixedly connected to the inner side of the air inlet channel 401, the heat conduction copper tube 405 is fixedly connected to the inner side of the fins 403, the filter plate 406 is fixedly connected to the inner side of the air inlet channel 401, the air inlet plate 407 is fixedly connected to the back of the test device main body 1, the air inlet plate 407 is connected to the air inlet channel 401, the fins 403 are a plurality of fins 403, and the fins 403 are shorter the closer to the air inlet channel 401, and the semiconductor temperature control sheets 404 and the fins 403 are respectively connected to two ends of the heat conduction copper tube 405.

Through setting up air inlet channel 401 and water conservancy diversion wind channel 402, be convenient for with the leading-in inner chamber of test equipment main part 1 of outside colder air, thereby carry out the cooling treatment to test equipment main part 1 inner chamber, through setting up fin 403, semiconductor temperature accuse piece 404 and heat conduction copper pipe 405, be convenient for carry out quick cooling with outside air, make in the lower air of temperature get into test equipment main part 1, carry out quick cooling treatment to the test equipment main part 1 that the temperature is unusual, be shorter more closely the height apart from air inlet channel 401 through setting up fin 403, be convenient for with the air evenly dispersed with fin 403 contact, thereby improve the cooling effect of fin 403 to the air.

Referring to fig. 3-4, the opening and closing mechanism 3 includes an elliptical wheel 301, a pulling arm 302, a side sliding plate 303, an opening and closing plate 304 hinge block 305 and a control motor 306, wherein the elliptical wheel 301 is connected to the bottom of the inner cavity of the main body 1 in a penetrating and rotating manner, the pulling arm 302 is movably hinged to the inside of the elliptical wheel 301, the side sliding plate 303 is fixedly connected to the bottom of the inner cavity of the main body 1, the opening and closing plate 304 is slidably connected to the inside of the side sliding plate 303, the hinge block 305 is fixedly connected to one side of the opening and closing plate 304 facing the elliptical wheel 301, the control motor 306 is fixedly connected to the lower surface of the main body 1, an output shaft of the control motor 306 is fixedly connected to the bottom end of the elliptical wheel 301, the opening and closing plate 304 is slidably connected to the upper portion of the ventilation groove 108, and the inside of the hinge block 305 is hinged to the pulling arm 302.

By arranging the opening and closing plate 304, the ventilation groove 108 is convenient to seal, and by arranging the elliptical wheel 301 and the pulling arm 302, the opening and closing plate 304 is convenient to move, and the auxiliary heat dissipation mechanism 5 and the cooling mechanism 4 perform any temperature control operation on the test equipment main body 1.

The working principle is that when the RDT high-temperature device testing equipment is in an initial state, the protective door 103 is arranged on the front surface of the testing equipment main body 1, the grip 104 on the protective door 103 is clamped in the buckle 105, so that an operator can be protected conveniently, the oval wheel 301 arranged in the inner cavity of the testing equipment main body 1 is connected with the control motor 306, the two opening and closing plates 304 arranged above the ventilation slot 108 are connected with the oval wheel 301 through the pulling arm 302, so that the opening and closing of the ventilation slot 108 are controlled conveniently, and therefore, external air is controlled to enter the testing equipment main body 1, the diversion air flue 402 is further arranged below the ventilation slot 108 and connected with the air inlet channel 401, the fin 403 is connected with the semiconductor temperature control piece 404 through the temperature-guiding copper pipe 405, so that the air flow temperature entering the testing equipment main body 1 can be controlled, and the first air outlet pipe 501 arranged in the equipment cavity 109 is connected with the fan 508 through the bellows 502 and the third air outlet pipe 506, so that the air in the testing equipment main body 1 can be pumped conveniently;

when the electrical components in the equipment cavity 109 need to be cooled, firstly, when the testing equipment main body 1 is in testing work, the electrical components in the equipment cavity 109 emit larger heat, and the heated radiation temperature in the equipment cavity 109 is also increased along with the heat radiation temperature, at the moment, the fan 508 is controlled to turn over and blow the air into the air box 502, the pressure in the air box 502 is increased to enable the sealing plate 505 to be tightly attached to one end of the first air outlet pipe 501, so that the air is prevented from entering the testing equipment main body 1 from the first air outlet pipe 501 to influence the testing temperature, meanwhile, after the pressure in the air box 502 is increased, the air pushes the first sealing plate 510 and the rotating rod 509 to be closed, so that the channel of the second air outlet pipe 503 is smooth, the air with lower temperature in the air box 502 rapidly enters the equipment cavity 109, and the original air is discharged from the exhaust passage 102, so that the air circulation in the equipment cavity 109 can achieve the purpose of heat radiation.

When the temperature of the inner cavity of the testing device main body 1 needs to be quickly reduced after the testing is finished, firstly, after the testing device main body 1 finishes the high-temperature testing of SSD, the control panel 101 controls the control motor 306 to rotate, the control motor 306 drives the elliptical wheel 301 connected with the control motor to rotate, as the pulling arm 302 is connected to the elliptical wheel 301 and the pulling arm 302 is connected with the opening and closing plate 304 through the hinging block 305, when the elliptical wheel 301 rotates, the pulling arm 302 pulls the opening and closing plate 304 to inwards slide under the limit of the sideslip plate 303 to expand the ventilation slot 108, at this time, the control fan 508 clockwise rotates the bellows 502, the pressure is reduced, the first closing plate 510 expands to close the second air outlet pipe 503 under the action of the pulling spring 512 and the pressure, and simultaneously the closing plate 505 opens the first air outlet pipe 501 under the action of the pressure, so that hotter air in the testing device main body 1 is discharged from the third air outlet pipe 506 through the first air outlet pipe 501 and the bellows 502, and the hotter air in the testing device main body 1 is reduced while the elliptical wheel 301 rotates, the outside air is rapidly sucked into the inner cavity of the testing device main body 1 through the air inlet duct 401 and the air inlet duct 1 after the testing device main body 1 falls down, the pressure is quickly sucked into the inner cavity of the testing device main body 1, and the testing device main body 1 is quickly cooled down, and the temperature of the testing device main body 1 is quickly reduced, and the temperature of the testing device main body 1 is quickly sucked into the inner cavity of the testing device main body 1 is tested, and the testing device 1 is quickly cooled down, after the testing device is cooled down, and the temperature device is tested.

When the temperature in the test equipment main body 1 needs to be rapidly reduced when the temperature is abnormal, firstly, the control panel 101 controls the control motor 306 to open the opening and closing plate 304 when the temperature is abnormal, at this time, the semiconductor temperature control sheet 404 starts to reduce the temperature of the fins 403 to-15 ℃ through the temperature guide copper pipe 405, after adjustment, the fan 508 is started to drive the air in the test equipment main body 1 to flow, the external air firstly contacts with the fins 403 when entering the bellows 502 through the first air outlet pipe 501, and the normal temperature air and the fins 403 form colder air after heat exchange, so that the internal temperature of the test equipment main body 1 is rapidly reduced, thereby preventing damage to SSD or equipment caused by excessive temperature after the temperature is abnormal in the test equipment main body 1.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. RDT high temperature device test equipment, including test equipment main part (1), its characterized in that: the testing device comprises a testing device main body (1), wherein a device cavity (109) is formed in the testing device main body (1), a heat dissipation mechanism (5) which is convenient for cooling the testing device main body (1) is arranged in the device cavity (109), a cooling mechanism (4) which is convenient for rapidly cooling the temperature of the inner cavity of the testing device main body (1) is arranged at the bottom of the testing device main body (1), and an opening and closing mechanism (3) which is convenient for assisting the cooling mechanism (4) to cool and open is arranged above the cooling mechanism (4);

the utility model provides a cooling mechanism (5) is including first tuber pipe (501), bellows (502), second tuber pipe (503), connecting strip (504), closure plate (505), bull stick (509), first closure plate (510), second closure plate (511) and traction spring (512), first tuber pipe (501) run through fixed connection in the inner chamber bottom of equipment chamber (109), bellows (502) fixed connection is in the one end of first tuber pipe (501), second tuber pipe (503) fixed connection is in the both sides of bellows (502), and second tuber pipe (503) inner chamber communicates with each other with bellows (502), connecting strip (504) fixed connection is close to the inner chamber wall of first tuber pipe (501) one side at bellows (502), closure plate (505) fixed connection is on connecting strip (504), bull stick (509) fixed connection is at the inner chamber wall of second tuber pipe (503), first closure plate (510) rotate the surface of connecting at bull stick (509), second closure plate (511) rotate the connection is at the surface of first closure plate (511) and traction spring (512) fixed connection is in first closure plate (510).

2. An RDT high temperature device testing apparatus in accordance with claim 1, wherein: the heat dissipation mechanism (5) further comprises a third air outlet pipe (506), a fan cover (507) and a fan (508), wherein the third air outlet pipe (506) is fixedly connected to one side, far away from the first air outlet pipe (501), of the air box (502), the fan cover (507) is fixedly connected to the outer end of the third air outlet pipe (506), and the fan (508) is installed inside the fan cover (507).

3. An RDT high temperature device testing apparatus in accordance with claim 1, wherein: the cooling mechanism (4) comprises an air inlet channel (401), a flow guide air channel (402), fins (403), a semiconductor temperature control sheet (404), a heat guide copper pipe (405), a filter plate (406) and an air inlet plate (407), wherein the air inlet channel (401) is fixedly connected to the bottom of the main body (1) of the test equipment in a penetrating manner, the flow guide air channel (402) is fixedly connected to the inner side of the air inlet channel (401), the number of the flow guide air channels (402) is two, the fins (403) are fixedly connected to the inner side of the flow guide air channel (402), the semiconductor temperature control sheet (404) is fixedly connected to the inner side of the air inlet channel (401), the heat guide copper pipe (405) is fixedly connected to the inner side of the fins (403), the filter plate (406) is fixedly connected to the inner side of the air inlet channel (401), and the air inlet plate (407) is fixedly connected to the back of the main body (1) of the test equipment.

4. An RDT high temperature device testing apparatus in accordance with claim 1, wherein: the utility model provides a testing equipment body (1), including opening and closing mechanism (3), including oval wheel (301), tractive arm (302), sideslip board (303), shutter plate (304) articulated piece (305) and control motor (306), oval wheel (301) run through and rotate the inner chamber bottom of connecting at testing equipment body (1), tractive arm (302) activity articulates in the inside of oval wheel (301), sideslip board (303) fixed connection is in the inner chamber bottom of testing equipment body (1), shutter plate (304) sliding connection is in the inboard of sideslip board (303), articulated piece (305) fixed connection is in shutter plate (304) one side towards oval wheel (301), control motor (306) fixed connection is at the lower surface of testing equipment body (1).

5. A RDT high temperature device testing apparatus in accordance with claim 3, wherein: the front of test equipment main part (1) is provided with control panel (101), exhaust passage (102) have been seted up to the side of test equipment main part (1), the front of test equipment main part (1) rotates and is connected with guard gate (103), fixedly connected with handle (104) on guard gate (103), the front fixedly connected with buckle (105) of test equipment main part (1), the inner chamber lateral wall fixedly connected with slide rail (106) of test equipment main part (1), the inside sliding connection of slide rail (106) has tested equipment (107), ventilation groove (108) have been seted up in the inner chamber bottom of test equipment main part (1) running through.

6. An RDT high temperature device testing apparatus in accordance with claim 1, wherein: the inner diameter of one end of the second air outlet pipe (503) close to the air box (502) is smaller than the inner diameter of one end far away from the air box (502), the circumference of the first closing plate (510) and the rotating rod (509) are larger than the inner diameter of one end of the second air outlet pipe (503) close to the air box (502) after the first closing plate and the rotating rod (509) are completely expanded, the closing plate (505) is in contact with one end of the first air outlet pipe (501), and the bottom end of the first air outlet pipe (501) is communicated with the inner cavity of the main body (1) of the testing equipment.

7. A RDT high temperature device testing apparatus in accordance with claim 3, wherein: the number of the fins (403) is a plurality, the shorter the fins (403) are from the air inlet channel (401), and the two ends of the temperature-conducting copper pipe (405) are respectively connected with a semiconductor temperature control sheet (404) and the fins (403).

8. An RDT high temperature device testing apparatus in accordance with claim 4, wherein: the top of control motor (306) rotates and is connected with oval wheel (301), shutter plate (304) sliding connection is in the top of ventilation groove (108), the inside activity of articulated piece (305) articulates there is tractive arm (302).

9. An RDT high temperature device testing apparatus in accordance with claim 5, wherein: the handle (104) is movably clamped in the buckle (105), and the inner cavity of the exhaust passage (102) is communicated with the inner cavity of the equipment cavity (109).

10. An RDT high temperature device testing apparatus in accordance with claim 5, wherein: the lower part of the ventilation groove (108) is fixedly connected with the top surface of the diversion air duct (402), and the inner cavity of the testing equipment main body (1) is communicated with the inner cavity of the diversion air duct (402) through the ventilation groove (108).