CN117606647A - Sensor temperature compensation method, device and storage medium - Google Patents
Sensor temperature compensation method, device and storage medium Download PDFInfo
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- CN117606647A CN117606647A CN202311348113.6A CN202311348113A CN117606647A CN 117606647 A CN117606647 A CN 117606647A CN 202311348113 A CN202311348113 A CN 202311348113A CN 117606647 A CN117606647 A CN 117606647A
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- G—PHYSICS
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Abstract
The invention relates to the technical field of equipment detection, in particular to a sensor temperature compensation method, a sensor temperature compensation device and a storage medium. A method of sensor temperature compensation, comprising: acquiring a first temperature, a second temperature, a first distance, a second distance, a bottom area of a sensor base, thermal resistance of the sensor magnetic base, thermal conductivity of the sensor base and environmental temperature; respectively obtaining a first total thermal resistance and a second total thermal resistance according to the first distance, the bottom area of the sensor base, the heat conductivity coefficient of the sensor base, the thermal resistance of the sensor magnetic base and the second distance; obtaining equipment measurement temperature according to the first temperature, the second temperature, the first total thermal resistance and the second total thermal resistance; obtaining a temperature difference of the equipment according to a difference value between the measured temperature of the equipment and the ambient temperature; judging whether to perform temperature compensation according to the equipment temperature difference; if yes, temperature compensation is carried out on the measured temperature of the equipment, and if not, the temperature compensation is not carried out. The technical scheme of the invention can effectively improve the accuracy of the temperature detection of the sensor.
Description
Technical Field
The invention relates to the technical field of equipment detection, in particular to a sensor temperature compensation method, a sensor temperature compensation device and a storage medium.
Background
With the continuous progress of technology and the rapid development of industry, the normal operation of equipment is critical for smooth production and work. However, equipment may malfunction or be damaged for various reasons, resulting in delays in production, interruption of work, and even injury. In order to discover equipment faults in time and take necessary measures, equipment vibration detection techniques have been developed.
The wireless vibration sensor is used as a sensing unit of the equipment state monitoring system, integrates vibration signals and temperature signal detection functions, does not need large-area and long-distance wiring, has great advantages in the industrial fields of coal mines, nuclear power, water service and the like, but has great heat loss in the temperature conduction process, the temperature acquired by the sensor is not the real temperature of the surface of the equipment, and the temperature acquired by the sensor is different from the real temperature of the equipment.
Disclosure of Invention
The invention solves the problem how to improve the accuracy of the temperature detection of the sensor.
In order to solve the above problems, the present invention provides a sensor temperature compensation method, device and storage medium.
In a first aspect, the present invention provides a method for temperature compensation of a sensor, comprising:
acquiring a first temperature detected by a first temperature measuring unit 6, a second temperature detected by a second temperature measuring unit 7, a first distance between the first temperature measuring unit 6 and a sensor magnetic seat 4, a second distance between the second temperature measuring unit 7 and the sensor magnetic seat 4, a bottom area of a sensor base, thermal resistance of the sensor magnetic seat, thermal conductivity of the sensor base and environmental temperature, wherein the first distance is smaller than the second distance;
obtaining a first total thermal resistance according to the first distance, the bottom area of the sensor base, the thermal conductivity of the sensor base and the thermal resistance of the sensor magnetic base;
obtaining a second total thermal resistance according to the second distance, the bottom area of the sensor base, the thermal conductivity of the sensor base and the thermal resistance of the sensor magnetic base;
obtaining a device measurement temperature according to the first temperature, the second temperature, the first total thermal resistance, the second total thermal resistance and the device temperature relation;
obtaining a device temperature difference according to the difference between the device measurement temperature and the ambient temperature;
judging whether to perform temperature compensation on the equipment measured temperature according to a comparison result of the equipment temperature difference and a preset temperature threshold;
if yes, determining a compensation temperature according to the sensor magnetic seat thermal resistance, the first total thermal resistance, the second total thermal resistance and the equipment temperature difference, determining an equipment actual temperature according to the compensation temperature and the equipment measurement temperature, and if not, determining the equipment measurement temperature as the equipment actual temperature.
Optionally, the obtaining a first total thermal resistance according to the first distance, the sensor base bottom area, the sensor base thermal conductivity and the sensor magnetic base thermal resistance includes:
obtaining first base thermal resistance according to the first distance, the sensor base bottom area, the sensor base thermal conductivity and a first thermal resistance relation;
and adding and summing the first base thermal resistance and the sensor magnetic base thermal resistance to obtain the first total thermal resistance.
Optionally, the first thermal resistance relationship satisfies:
wherein R is b For the first base thermal resistance, L b And for the first distance, K is the heat conductivity coefficient of the sensor base, and A is the bottom area of the sensor base.
Optionally, the obtaining a second total thermal resistance according to the second distance, the bottom area of the sensor base, the thermal conductivity of the sensor base, and the thermal resistance of the sensor magnetic base includes:
obtaining a second base thermal resistance according to the second distance, the sensor base bottom area, the sensor base thermal conductivity and a second thermal resistance relationship;
and adding and summing the second base thermal resistance and the sensor magnetic base thermal resistance to obtain the second total thermal resistance.
Optionally, the second thermal resistance relationship satisfies:
wherein R is c For the second base thermal resistance, L c And for the second distance, K is the heat conductivity coefficient of the sensor base, and A is the bottom area of the sensor base.
Optionally, the determining whether to perform temperature compensation on the measured temperature of the device according to a comparison result of the temperature difference of the device and a preset temperature threshold includes:
when the temperature difference of the equipment is larger than the upper limit of the temperature threshold or smaller than the lower limit of the temperature threshold, judging that the deviation exists between the measured temperature of the equipment and the actual temperature of the equipment, and performing temperature compensation on the measured temperature of the equipment;
otherwise, judging that the measured temperature of the equipment does not deviate from the actual temperature of the equipment, and not performing temperature compensation on the measured temperature of the equipment.
Optionally, the device temperature relationship satisfies:
wherein T is the temperature measured by the equipment and T 1 For the first temperature, T 2 For the second temperature, R 1 For the first total thermal resistance, R 2 Is the first total thermal resistance.
Optionally, the determining the compensation temperature according to the sensor magnet holder thermal resistance, the first total thermal resistance, the second total thermal resistance, and the device temperature difference includes:
obtaining the compensation temperature according to a temperature compensation coefficient, the sensor magnetic seat thermal resistance, the first total thermal resistance, the second total thermal resistance, the equipment temperature difference and a temperature compensation relation;
the temperature compensation relationship satisfies:
T w ＝β×(R 1 +R 2 )×T c ；
wherein T is w For the compensation temperature, beta is the temperature compensation coefficient, R 1 For the first total thermal resistance, R 2 T being the second total thermal resistance c For the equipment temperature difference.
In a second aspect, an electronic device includes a memory and a processor;
the memory is used for storing a computer program;
the processor is configured to implement the sensor temperature compensation method according to the first aspect when executing the computer program.
In a third aspect, a computer readable storage medium has stored thereon a computer program which, when executed by a processor, implements the sensor temperature compensation method according to the first aspect.
The sensor temperature compensation method, the device and the storage medium have the beneficial effects that: obtaining the first temperature and the second temperature of different positions of the sensor base 3, obtaining the thermal resistance of the sensor base, the bottom surface of the sensor base and the thermal conductivity coefficient of the sensor base according to the materials and the size structures of the sensor base 3 and the sensor base 4, finally combining the first distance between the first temperature measuring unit 6 and the sensor base 4, the second distance between the second temperature measuring unit 7 and the sensor base 4, respectively calculating the first total thermal resistance corresponding to the first temperature and the second total thermal resistance corresponding to the second temperature, wherein the thermal resistance can reflect the obstruction degree of heat conduction in the thermal resistance, obtaining the device measurement temperature of the surface of the device to be detected 5 by combining the difference between the first temperature and the second temperature and the difference between the first total thermal resistance and the second total thermal resistance corresponding to the first temperature and the second temperature, the real temperature of the equipment can be accurately obtained under the condition that no interference of external environmental factors exists, the equipment temperature difference is further obtained according to the temperature difference between the equipment measured temperature and the field environmental temperature, the equipment temperature difference is compared with a preset temperature threshold value, the image degree of the external environmental temperature to the obtained equipment measured temperature is judged according to the comparison result, if the temperature exceeds Xu Fanwei, the temperature compensation is carried out on the equipment measured temperature, the compensation temperature required to be compensated is determined through the first total thermal resistance, the second total thermal resistance and the equipment temperature difference, then the actual temperature of the equipment is determined according to the compensation temperature and the equipment measured temperature, if the allowable range is not exceeded, the influence of the environmental temperature on the equipment measured temperature is small, and the equipment measured temperature is determined to be the actual temperature of the equipment. According to the temperatures of different positions of the sensor base 3 and corresponding different thermal resistances, the device measurement temperature without the influence of the external environment temperature is accurately pushed out, and the obtained device actual temperature is always kept in a specified range by carrying out temperature compensation on the device measurement temperature, so that the obtained device actual temperature is close to the actual temperature value of the detected device surface, the influence of the external environment factors on temperature detection is avoided, and the accuracy and the stability of the sensor temperature detection are improved.
Drawings
FIG. 1 is a schematic diagram of a sensor temperature compensation method according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a sensor according to an embodiment of the present invention.
Reference numerals illustrate:
1-a sensor housing; 2-a sensor motherboard; 3-a sensor base; 4-a sensor magnet holder; 5-a detected device; 6-a first temperature measuring unit; 7-a second temperature measuring unit; 8-main board temperature measuring unit.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. While the invention is susceptible of embodiment in the drawings, it is to be understood that the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided to provide a more thorough and complete understanding of the invention. It should be understood that the drawings and embodiments of the invention are for illustration purposes only and are not intended to limit the scope of the present invention.
It should be understood that the various steps recited in the method embodiments of the present invention may be performed in a different order and/or performed in parallel. Furthermore, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the invention is not limited in this respect.
The term "including" and variations thereof as used herein are intended to be open-ended, i.e., including, but not limited to. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "alternative embodiments". Related definitions of other terms will be given in the description below. It should be noted that the terms "first," "second," and the like herein are merely used for distinguishing between different devices, modules, or units and not for limiting the order or interdependence of the functions performed by such devices, modules, or units.
It should be noted that references to "one", "a plurality" and "a plurality" in this disclosure are intended to be illustrative rather than limiting, and those skilled in the art will appreciate that "one or more" is intended to be construed as "one or more" unless the context clearly indicates otherwise.
The sensor according to the present embodiment can detect vibration of the device and surface temperature of the device at the same time, and as shown in fig. 2, the sensor body includes a sensor base 3 and a sensor magnet holder 4, and the sensor base 3 and the sensor magnet holder 4 are connected, and are connected with the surface of the device 5 to be detected through the sensor magnet holder 4, thereby realizing vibration and surface temperature detection of the device. The sensor magnetic base thermal resistance can be obtained according to the material and the dimensional structure of the sensor magnetic base 4, and the sensor base thermal conductivity can be obtained according to the material of the sensor base 3, and the bottom area of the sensor base 3 can be obtained according to the size of the sensor base 3. The first temperature measuring unit 6 and the second temperature measuring unit 7 are respectively arranged inside the sensor base 3, and the first temperature is obtained through the first temperature measuring unit 6, and the second temperature is obtained through the second temperature measuring unit. The sensor base 3 is provided with the first blind hole and the second blind hole at different positions, the first temperature measuring unit 6 is buried in the first blind hole, the opening is sealed through heat conduction silicone grease, the second temperature measuring unit 7 is buried in the first blind hole in the same way, the opening is sealed through heat conduction silicone grease, the heat conduction silicone grease can enable the temperature in the sensor base 3 to be evenly distributed, meanwhile, the temperature measuring unit can be prevented from being in contact with the external environment, the accuracy of temperature measurement of the sensor base 3 is guaranteed, wherein the first distance is obtained according to the vertical distance from the first temperature measuring unit 6 to the sensor magnetic seat 4, the second distance is obtained according to the vertical distance from the second temperature measuring unit 7 to the sensor magnetic seat 4, and the first temperature measuring unit 6 is arranged below the second temperature measuring unit 7, so that the first distance is smaller than the second distance, and the temperature difference is generated between the first temperature and the second temperature. The sensor main board 2 is arranged inside the sensor housing 1, the main board temperature measuring unit 8 is used for detecting the on-site ambient temperature, the main board temperature measuring unit 8 is arranged on the sensor housing 1, and the temperature measuring element of the main board temperature measuring unit 8 is fully contacted with on-site air, so that the detected ambient temperature is more accurate.
As shown in fig. 1, in order to solve the above technical problem, an embodiment of the present invention provides a sensor temperature compensation method, including:
step S1, acquiring a first temperature detected by a first temperature measuring unit 6, a second temperature detected by a second temperature measuring unit 7, a first distance between the first temperature measuring unit 6 and a sensor magnetic seat 4, a second distance between the second temperature measuring unit 7 and the sensor magnetic seat 4, a bottom area of a sensor base, thermal resistance of the sensor magnetic seat, thermal conductivity of the sensor base and environmental temperature, wherein the first distance is smaller than the second distance;
specifically, the actual on-site environmental temperature is obtained through the main board temperature measuring unit 8 arranged on the sensor housing 1, the first temperature and the second temperature corresponding to different embedded positions are obtained according to the first temperature measuring unit 6 and the second temperature measuring unit 7 embedded on the sensor base 3, the first distance is obtained through measuring the vertical distance from the first temperature measuring unit 6 to the sensor magnetic base 4, the second distance is obtained through measuring the vertical distance from the second temperature measuring unit 7 to the sensor magnetic base 4, the first distance is smaller than the second distance because the first temperature measuring unit 6 is embedded below the second temperature measuring unit 7, and a temperature difference exists between the obtained first temperature and the second temperature due to the effect of the thermal resistance of the sensor base, in order to obtain a larger temperature difference, the calculated device temperature can be accurately set as close to the sensor magnetic base 4 as possible, the second temperature measuring unit 7 is set as far as possible, and the distance between the first temperature measuring unit 6 and the second temperature measuring unit 7 is further increased, so that the temperature difference between the first temperature and the second temperature is further increased.
Further, since the materials and dimensional structures of the sensor base 3 and the sensor are known, the sensor base bottom area, the sensor base thermal conductivity, and the sensor base thermal conductivity length can be directly obtained, and the sensor base thermal resistance can be obtained by the sensor base bottom area, the sensor base thermal conductivity, and the sensor base thermal conductivity length and the sensor base thermal resistance relationship.
Illustratively, the sensor magnet holder thermal resistance relationship satisfies:
wherein R is a For the thermal resistance of the sensor magnetic seat, L a K is the heat conduction length of the sensor magnetic seat a Is the heat conductivity coefficient of the sensor magnetic seat, A a Is the area of the sensor magnetic base.
Step S2, obtaining a first total thermal resistance according to the first distance, the bottom area of the sensor base, the heat conductivity coefficient of the sensor base and the thermal resistance of the sensor magnetic base;
step S3, obtaining a second total thermal resistance according to the second distance, the bottom area of the sensor base, the heat conductivity coefficient of the sensor base and the thermal resistance of the sensor magnetic base;
specifically, the heat conduction length of the temperature at the first temperature measuring unit 6 in the sensor base 3 is obtained through the first distance, the bottom surface of the sensor base and the heat conduction coefficient of the sensor base are used for obtaining first sensor base thermal resistance, the sensor base thermal resistance is thermal resistance corresponding to the first temperature in the sensor base 3, finally, first total thermal resistance corresponding to the first temperature is obtained according to the first sensor base thermal resistance and the sensor magnetic base thermal resistance, and similarly, second sensor base thermal resistance is obtained through the second distance, the bottom surface of the sensor base and the heat conduction coefficient of the sensor base, and second total thermal resistance corresponding to the second temperature is obtained according to the second sensor base thermal resistance and the sensor magnetic base thermal resistance. Different resistances of heat flowing to the first temperature measuring unit 6 and the second temperature measuring unit 7 can be obtained through the first total thermal resistance and the second total thermal resistance, and due to the difference of the heat flow blocking capacity of the first total thermal resistance and the second total thermal resistance, the temperature of the surface of the detected equipment 5 is conducted to the first temperature measuring unit 6 through the first total thermal resistance and is different from the temperature conducted to the second temperature measuring unit 7 through the second total thermal resistance, namely, a temperature difference exists between the first temperature and the second temperature, the loss value of the flowing of the temperature in different positions of the sensor base 3 and the sensor magnetic base 4 can be further reflected through the temperature difference, and the accurate initial temperature value of the surface of the detected equipment 5 can be further calculated according to the loss condition.
Step S4, obtaining equipment measurement temperature according to the relation among the first temperature, the second temperature, the first total thermal resistance, the second total thermal resistance and the equipment temperature;
specifically, according to the first temperature and the second temperature obtained by the first temperature measuring unit 6 and the second temperature measuring unit 7, the temperature when the initial temperature of the surface of the tested device reaches the first temperature measuring unit 6 and the second temperature measuring unit 7 in the process of passing through the first total thermal resistance and the second total thermal resistance can be obtained, and the device measurement temperature of the surface of the tested device 5 can be accurately obtained through the temperature relation of the device and the temperature loss between different thermal resistances, wherein the device measurement temperature represents the temperature of the surface of the device which is calculated under the condition of no interference of external environmental factors.
S5, obtaining a device temperature difference according to the difference between the device measurement temperature and the environment temperature;
specifically, the difference between the measured temperature of the device and the on-site ambient temperature detected by the main board temperature measuring unit 8 is used as a color number difference, the deviation between the temperature of the detected device 5 and the ambient temperature can be accurately judged by the device difference, when the deviation is larger, the accurate fixing sound of the ambient temperature to the detected temperature of the device is larger, so that the temperature loss caused by the ambient temperature to the transmission process in the sensor is estimated by the device difference, and the compensated temperature value is determined by the device difference, so that the finally obtained actual temperature of the device is closer to the actual temperature of the surface of the device, and the accuracy of detecting the temperature of the device is improved.
Step S6, judging whether to perform temperature compensation on the equipment measured temperature according to a comparison result of the equipment temperature difference and a preset temperature threshold;
and S7, if yes, determining a compensation temperature according to the sensor magnetic seat thermal resistance, the first total thermal resistance, the second total thermal resistance and the equipment temperature difference, and determining an equipment actual temperature according to the compensation temperature and the equipment measurement temperature, and if not, determining the equipment measurement temperature as the equipment actual temperature.
Specifically, according to the comparison result of the temperature difference of the equipment and the preset temperature threshold value, the influence degree of the external environment temperature on the heat loss in the heat transfer process is judged, when the temperature difference exceeds the allowable range, the temperature detection result deviation caused by the environment temperature is larger, the equipment measurement temperature is required to be compensated, the compensated temperature is taken as the detected equipment actual temperature, if the equipment temperature difference is within the allowable range, the influence of the external environment temperature on the detected temperature is smaller, the influence of the external environment temperature can be ignored, the equipment measurement temperature is taken as the detected equipment actual temperature, and therefore, the measured temperature and the equipment actual temperature are always kept in a reasonable acceptable range in a temperature compensation mode, and the accuracy of temperature detection is ensured.
In this embodiment, by obtaining the first temperature and the second temperature at different positions of the sensor base 3, and according to the materials and the dimensional structures of the sensor base 3 and the sensor magnetic base 4, obtaining the thermal resistance of the sensor magnetic base, the bottom surface of the sensor base and the thermal conductivity coefficient of the sensor base, finally combining the first distance between the first temperature measuring unit 6 and the sensor magnetic base 4, the second distance between the second temperature measuring unit 7 and the sensor magnetic base 4, respectively calculating the first total thermal resistance corresponding to the first temperature and the second total thermal resistance corresponding to the second temperature, the thermal resistance can embody the obstruction degree of heat conduction in the thermal resistance, the difference between the first temperature and the second temperature is used for obtaining the device measured temperature of the surface of the detected device 5 by combining the difference between the first total thermal resistance and the second total thermal resistance, the device measured temperature can accurately obtain the real temperature of the device under the condition that no external environment factor is interfered, further comparing the device temperature difference with the field environment temperature according to the device temperature difference, judging the external environment temperature according to the device temperature difference and the comparison result, if the device temperature difference exceeds the real temperature by the device measured temperature, and the device temperature difference is more than the real temperature, if the device temperature is not required to be compensated, the device temperature is determined to be more than the real temperature, and if the device temperature is not required to be compensated, and the device temperature is not required to be compensated by the real temperature is determined to be the device temperature. According to the temperatures of different positions of the sensor base 3 and corresponding different thermal resistances, the device measurement temperature without the influence of the external environment temperature is accurately pushed out, and the obtained device actual temperature is always kept in a specified range by carrying out temperature compensation on the device measurement temperature, so that the obtained device actual temperature is close to the actual temperature value of the detected device surface, the influence of the external environment factors on temperature detection is avoided, and the accuracy and the stability of the sensor temperature detection are improved.
In an alternative embodiment, the obtaining a first total thermal resistance according to the first distance, the sensor base bottom area, the sensor base thermal conductivity, and the sensor magnetic base thermal resistance includes:
obtaining first base thermal resistance according to the first distance, the sensor base bottom area, the sensor base thermal conductivity and a first thermal resistance relation;
and adding and summing the first base thermal resistance and the sensor magnetic base thermal resistance to obtain the first total thermal resistance.
In an alternative embodiment, the first thermal resistance relationship satisfies:
wherein R is b For the first base thermal resistance, L b And for the first distance, K is the heat conductivity coefficient of the sensor base, and A is the bottom area of the sensor base.
Specifically, according to the first distance, the area of the sensor base and the coefficient of heat conductivity of the sensor base, a first base thermal resistance corresponding to the first temperature in the sensor base 3 is obtained, the obstruction of the conduction of the temperature to the first temperature measuring unit 6 in the sensor base 3 can be measured through the first base thermal resistance, and further, according to the addition and summation of the first base thermal resistance and the pre-obtained sensor magnetic base thermal resistance, a first total thermal resistance between the surface of the detected equipment 5 and the first temperature measuring unit 6 is obtained, so that the loss condition of the conduction of the temperature from the surface of the detected equipment 5 to the first temperature measuring unit 6 can be accurately judged through the first total thermal resistance, and the measured temperature of the equipment calculated through the first total thermal resistance is more accurate.
In an alternative embodiment, the obtaining a second total thermal resistance according to the second distance, the sensor base bottom area, the sensor base thermal conductivity, and the sensor magnetic base thermal resistance includes:
obtaining a second base thermal resistance according to the second distance, the sensor base bottom area, the sensor base thermal conductivity and a second thermal resistance relationship;
and adding and summing the second base thermal resistance and the sensor magnetic base thermal resistance to obtain the second total thermal resistance.
In an alternative embodiment, the second thermal resistance relationship satisfies:
wherein R is c For the second base thermal resistance, L c And for the second distance, K is the heat conductivity coefficient of the sensor base, and A is the bottom area of the sensor base.
Specifically, according to the second distance, the area of the sensor base and the coefficient of heat conductivity of the sensor base, a second base thermal resistance corresponding to the second temperature measuring unit 7 in the sensor base 3 is obtained, and then according to the addition and summation of the second base thermal resistance and the pre-obtained sensor magnetic base thermal resistance, a second total thermal resistance is obtained, and the loss condition of the temperature conducted from the surface of the detected device 5 to the second temperature measuring unit 7 can be accurately judged through the second total thermal resistance, so that the measured temperature of the device obtained through calculation of the second total thermal resistance is more accurate.
In an optional embodiment, the determining whether to perform temperature compensation on the measured temperature of the device according to the comparison result of the temperature difference of the device and a preset temperature threshold value includes:
when the temperature difference of the equipment is larger than the upper limit of the temperature threshold or smaller than the lower limit of the temperature threshold, judging that the deviation exists between the measured temperature of the equipment and the actual temperature of the equipment, and performing temperature compensation on the measured temperature of the equipment;
otherwise, judging that the measured temperature of the equipment does not deviate from the actual temperature of the equipment, and not performing temperature compensation on the measured temperature of the equipment.
Illustratively, the set temperature threshold is (-5, 5) and the device temperature difference exceeds the upper and lower limits of the temperature threshold when the device temperature difference is 10 ℃, so that the device measured temperature is judged to deviate from the true temperature of the device and temperature compensation is required for the device measured temperature, whereas the device temperature difference does not exceed the temperature threshold range when the device temperature difference is 3 ℃, and the device measured temperature is judged to deviate from the true temperature of the device or the deviation is negligible and temperature compensation is not required for the device measured temperature.
In the optional embodiment, the accuracy of equipment temperature detection is improved by performing temperature compensation on equipment measurement temperature with larger deviation, the influence of environmental temperature on the equipment measurement temperature is avoided, and the stability of temperature measurement is further ensured.
In an alternative embodiment, the device temperature relationship satisfies:
wherein T is the temperature measured by the equipment and T 1 For the first temperature, T 2 For the second temperature, R 1 For the first total thermal resistance, R 2 Is the first total thermal resistance.
In an alternative embodiment, said determining a compensation temperature based on said sensor mount thermal resistance, said first total thermal resistance, said second total thermal resistance, and said device temperature difference comprises:
obtaining the compensation temperature according to a temperature compensation coefficient, the sensor magnetic seat thermal resistance, the first total thermal resistance, the second total thermal resistance, the equipment temperature difference and a temperature compensation relation;
the temperature compensation relationship satisfies:
T w ＝β×(R 1 +R 2 )×T c ；
wherein T is w For the compensation temperature, beta isThe temperature compensation coefficient, R 1 For the first total thermal resistance, R 2 T being the second total thermal resistance c For the equipment temperature difference.
Specifically, according to the temperature compensation coefficient, the first total thermal resistance, the second total thermal resistance and the equipment temperature difference, the compensation temperature is obtained through calculation according to a temperature compensation relation, wherein the temperature compensation coefficient is obtained through repeated experiments on different application scenes, and the equipment detection temperature is compensated according to the compensation temperature, so that the finally obtained temperature is closer to the real temperature of the surface of the equipment, and the temperature detected by the sensor is more accurate.
The sensor temperature compensation device in the embodiment of the invention has similar technical effects to those of the sensor temperature compensation method, and is not described herein.
The embodiment of the invention provides an electronic device, which comprises a memory and a processor;
the memory is used for storing a computer program;
the processor is configured to implement the sensor temperature compensation method as described above when executing the computer program.
The electronic device in the embodiment of the invention has similar technical effects to those of the sensor temperature compensation method, and will not be described herein.
A computer readable storage medium provided by an embodiment of the present invention stores a computer program thereon, which when executed by a processor, implements the sensor temperature compensation method as described above.
The computer readable storage medium in the embodiments of the present invention has similar technical effects to those of the above-mentioned sensor temperature compensation method, and will not be described herein.
Those skilled in the art will appreciate that implementing all or part of the above-described methods in accordance with the embodiments may be accomplished by way of a computer program stored on a computer readable storage medium, which when executed may comprise the steps of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), or the like. In this application, the units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment of the present invention. In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
Although the invention is disclosed above, the scope of the invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications will fall within the scope of the invention.
Claims (10)
1. A method of temperature compensation for a sensor, comprising:
acquiring a first temperature detected by a first temperature measuring unit (6), a second temperature detected by a second temperature measuring unit (7), a first distance between the first temperature measuring unit (6) and a sensor magnetic seat (4), a second distance between the second temperature measuring unit (7) and the sensor magnetic seat (4), a bottom area of the sensor base, thermal resistance of the sensor magnetic seat, thermal conductivity of the sensor base and environmental temperature, wherein the first distance is smaller than the second distance;
obtaining a first total thermal resistance according to the first distance, the bottom area of the sensor base, the thermal conductivity of the sensor base and the thermal resistance of the sensor magnetic base;
obtaining a second total thermal resistance according to the second distance, the bottom area of the sensor base, the thermal conductivity of the sensor base and the thermal resistance of the sensor magnetic base;
obtaining a device measurement temperature according to the first temperature, the second temperature, the first total thermal resistance, the second total thermal resistance and the device temperature relation;
obtaining a device temperature difference according to the difference between the device measurement temperature and the ambient temperature;
judging whether to perform temperature compensation on the equipment measured temperature according to a comparison result of the equipment temperature difference and a preset temperature threshold;
if yes, determining a compensation temperature according to the sensor magnetic seat thermal resistance, the first total thermal resistance, the second total thermal resistance and the equipment temperature difference, determining an equipment actual temperature according to the compensation temperature and the equipment measurement temperature, and if not, determining the equipment measurement temperature as the equipment actual temperature.
2. The method of claim 1, wherein the obtaining a first total thermal resistance based on the first distance, the sensor base bottom area, the sensor base thermal conductivity, and the sensor magnetic base thermal resistance comprises:
obtaining first base thermal resistance according to the first distance, the sensor base bottom area, the sensor base thermal conductivity and a first thermal resistance relation;
and adding and summing the first base thermal resistance and the sensor magnetic base thermal resistance to obtain the first total thermal resistance.
3. The sensor temperature compensation method of claim 2, wherein the first thermal resistance relationship satisfies:
wherein R is b For the first base thermal resistance, L b And for the first distance, K is the heat conductivity coefficient of the sensor base, and A is the bottom area of the sensor base.
4. The method of claim 1, wherein the obtaining a second total thermal resistance based on the second distance, the sensor base bottom area, the sensor base thermal conductivity, and the sensor magnetic base thermal resistance comprises:
obtaining a second base thermal resistance according to the second distance, the sensor base bottom area, the sensor base thermal conductivity and a second thermal resistance relationship;
and adding and summing the second base thermal resistance and the sensor magnetic base thermal resistance to obtain the second total thermal resistance.
5. The sensor temperature compensation method of claim 4, wherein the second thermal resistance relationship satisfies:
wherein R is c For the second base thermal resistance, L c And for the second distance, K is the heat conductivity coefficient of the sensor base, and A is the bottom area of the sensor base.
6. The method for temperature compensation of a sensor according to claim 1, wherein the determining whether to perform temperature compensation on the measured temperature of the device according to a comparison result between the temperature difference of the device and a preset temperature threshold value comprises:
when the temperature difference of the equipment is larger than the upper limit of the temperature threshold or smaller than the lower limit of the temperature threshold, judging that the deviation exists between the measured temperature of the equipment and the actual temperature of the equipment, and performing temperature compensation on the measured temperature of the equipment;
otherwise, judging that the measured temperature of the equipment does not deviate from the actual temperature of the equipment, and not performing temperature compensation on the measured temperature of the equipment.
7. The sensor temperature compensation method of claim 1, wherein the device temperature relationship satisfies:
wherein T is the temperature measured by the equipment and T 1 For the first temperature, T 2 For the second temperature, R 1 For the first total thermal resistance, R 2 Is the first total thermal resistance.
8. The method of claim 1, wherein said determining a compensation temperature based on said sensor mount thermal resistance, said first total thermal resistance, said second total thermal resistance, and said device temperature difference comprises:
obtaining the compensation temperature according to a temperature compensation coefficient, the sensor magnetic seat thermal resistance, the first total thermal resistance, the second total thermal resistance, the equipment temperature difference and a temperature compensation relation;
the temperature compensation relationship satisfies:
T w ＝β×(R 1 +R 2 )×T c ；
wherein T is w For the compensation temperature, beta is the temperature compensation coefficient, R 1 For the first total thermal resistance, R 2 T being the second total thermal resistance c For the equipment temperature difference.
9. An electronic device comprising a memory and a processor; the method comprises the steps of carrying out a first treatment on the surface of the
The memory is used for storing a computer program;
the processor being adapted to implement the sensor temperature compensation method according to any one of claims 1 to 8 when executing the computer program.
10. A computer readable storage medium, characterized in that the storage medium has stored thereon a computer program which, when executed by a processor, implements the sensor temperature compensation method according to any of claims 1 to 8.
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