CN117600177A - Atmospheric plasma cleaning device for cleaning semiconductor in large area - Google Patents
Atmospheric plasma cleaning device for cleaning semiconductor in large area Download PDFInfo
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- CN117600177A CN117600177A CN202311807600.4A CN202311807600A CN117600177A CN 117600177 A CN117600177 A CN 117600177A CN 202311807600 A CN202311807600 A CN 202311807600A CN 117600177 A CN117600177 A CN 117600177A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 146
- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 239000007921 spray Substances 0.000 claims abstract description 63
- 230000001681 protective effect Effects 0.000 claims abstract description 43
- 239000000725 suspension Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims description 29
- 229910052782 aluminium Inorganic materials 0.000 claims description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 26
- 230000008569 process Effects 0.000 claims description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 229910052799 carbon Inorganic materials 0.000 claims description 16
- 239000013307 optical fiber Substances 0.000 claims description 16
- 238000011084 recovery Methods 0.000 claims description 15
- 230000000903 blocking effect Effects 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 6
- 239000011324 bead Substances 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 210000002381 plasma Anatomy 0.000 description 29
- 239000000428 dust Substances 0.000 description 20
- 230000000694 effects Effects 0.000 description 15
- 239000012535 impurity Substances 0.000 description 8
- 230000009471 action Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005108 dry cleaning Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000752 ionisation method Methods 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses an atmospheric plasma cleaning device for cleaning a semiconductor in a large area, which belongs to the technical field of cleaning devices and comprises a fixed base, a protective cover arranged at the top of the fixed base, a magnetic suspension motor driving system, a double gun head structure and a gas rotating structure, wherein the double gun head structure is driven to rotate by the magnetic suspension motor driving system; according to the invention, by arranging two or more spray heads, the two spray heads can rotate to spray out plasma to clean the semiconductor surface, and by adjusting the distance between the two spray heads, the treatment area is larger, and the treatment efficiency is higher.
Description
Technical Field
The invention relates to the technical field of cleaning devices, in particular to an atmospheric plasma cleaning device for cleaning a semiconductor in a large area.
Background
Semiconductors occupy a very important role in the information age nowadays, and particulate matters, organic matters, metal pollutants, oxides and other pollutants exist on the surface of the semiconductors in the processing process, so that the subsequent normal use of the semiconductors can be influenced, and therefore, the surface cleaning of the semiconductors is an essential process in the processing process.
Common methods for cleaning semiconductors include wet cleaning and dry cleaning. Dry cleaning is the removal of impurities from the wafer surface according to chemical vapor techniques, with thermal oxidation and plasma cleaning being the two most common chemical vapor techniques.
The plasma cleaning is to change the surface property of a sample through physical and chemical reactions such as oxidation, reduction, cracking, crosslinking, polymerization and the like by utilizing the properties of the active components, so as to optimize the surface property of the material and realize the cleaning purpose; in the prior art, a plasma cleaning gun is generally used for cleaning a semiconductor, and the conventional plasma cleaning gun drives a plasma gun head to rotate by using a common motor, but the cleaning effect is uneven and the stability is low due to low rotation speed of the common motor in the process of cleaning the semiconductor; the treatment width of a single plasma gun head is limited, and the plasma is reduced due to the increase of the treatment width, so that the treatment effect is poor; the main shaft of the rotary gun head is driven by a common motor, belt transmission needs to be added, the belt is easy to wear, periodic replacement is needed, and the main shaft is high in manufacturing cost and maintenance cost.
Disclosure of Invention
The present invention is directed to an atmospheric plasma cleaning device for cleaning a semiconductor over a large area, which solves the problems set forth in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: an atmospheric plasma cleaning device for cleaning a semiconductor in a large area comprises a fixed base, a protective cover arranged on the top of the fixed base, and also comprises,
the magnetic suspension motor driving system comprises an aluminum shell, the aluminum shell is fixedly connected to the surface of the fixed base, a power-on wire is arranged on the surface of the aluminum shell, a rotating shaft is rotatably connected inside the aluminum shell, the rotating shaft is connected with the aluminum shell through a bearing, permanent magnet steel is fixedly connected to the surface of the rotating shaft, the permanent magnet steel is positioned inside the aluminum shell, the rotating shaft penetrates through the protective cover, a driver is fixedly connected to the protective cover, and the power-on wire is electrically connected with the driver;
the double-gun-head structure is arranged on one side surface of the protective cover, which is close to the magnetic suspension motor driving system, and comprises a rotating disc, wherein the rotating disc is fixedly connected to the surface of the rotating shaft, the rotating disc is positioned on the outer side of the protective cover, two spray heads are arranged on the surface of the rotating disc, the inside of each spray head is hollow, an electrode for ionizing process gas is fixedly connected to the inside of each spray head, a protective cylinder is arranged on the surface of the rotating disc, and each spray head is positioned in the protective cylinder;
the gas rotating structure is arranged on one side, far away from the double-gun-head structure, of the magnetic suspension motor driving system and is used for providing process gas for the double-gun-head structure in the rotating process;
the double gun head mechanism is driven to rotate by a magnetic suspension motor driving system.
As a further scheme of the invention, the gas rotating structure comprises an air passage, the air passage is arranged in the rotating shaft, the air passage penetrates through the rotating shaft, one end of the rotating shaft far away from the spray head is rotationally communicated with a hollow rotating joint, the surface of the fixed base is fixedly connected with a mounting box, the mounting box is positioned on one side of the aluminum shell, the rotating shaft penetrates through the mounting box, the top of the inner wall of the mounting box is fixedly connected with two groups of high-voltage carbon brushes, the surface of the rotating shaft is fixedly connected with a rotating block, the rotating block is positioned in the mounting box, the surface of the rotating block is fixedly connected with two annular insulating fixed plates, the surface of the rotating block is fixedly connected with two high-voltage conducting rings, the two groups of high-voltage carbon brushes are respectively contacted with the surfaces of the two high-voltage conducting rings, the high-voltage carbon brushes are provided with power by an external power supply, and the surface of the rotating shaft is fixedly connected with a grounding conducting ring, the grounding conducting ring is positioned on one side of the installation box far away from the aluminum shell, the installation box is fixedly connected with a grounding carbon brush close to the surface of the grounding conducting ring, the air passage penetrates through the rotating disc, the surface of the rotating disc is fixedly connected with an air guide disc, two spray heads are fixedly connected to the surface of the air guide disc, the surface of the air guide disc is provided with an air guide groove, the end parts of the air passage are positioned at the middle position of the air guide groove, the two ends of the air guide groove respectively extend to the two spray head positions, the two ends of the air guide groove respectively penetrate through the air guide disc and are communicated with the spray heads, a connecting groove is jointly formed in the rotating block and the rotating shaft, one end of the connecting groove, close to the high-voltage conducting ring, penetrates through the rotating block and extends to the lower part of the high-voltage conducting ring, the other end of the connecting groove penetrates through the rotating shaft, the rotating disc and the air guide disc and is extended to the position of the spray heads, the high-voltage conducting ring is connected with the electrodes through connecting wires, the connecting wire passes through the connecting groove, the protective cylinder is fixedly connected to the surface of the air guide disc.
As a further scheme of the invention, the rotating speed detection system comprises a rotating speed detection sensor which is fixedly connected to the surface of the mounting box, and a magnet for detecting the rotating speed is embedded and mounted on the surface of the insulating fixing plate.
As a further scheme of the invention, the plasma monitoring system comprises a light guide rod, wherein the light guide rod is fixedly connected to the surface of the electrode, the light guide rod penetrates through the rotating disc and the air guide disc, an optical fiber sensor is fixedly connected to the inside of the protective cover, an optical fiber wire is fixedly connected to the surface of the optical fiber sensor, and the optical fiber wire penetrates through the protective cover corresponding to the position of the light guide rod.
As a further scheme of the invention, the surface of the protective cover is fixedly connected with a fan, the surface of one side of the fan, which is close to the spray head, is communicated with a recovery pipe, two sides of the recovery pipe are respectively and elastically communicated with a telescopic connecting cylinder in a sliding way, one end, which is far away from the recovery pipe, of the connecting cylinder is communicated with a sliding cylinder, the surface of the sliding cylinder is communicated with a cleaning cylinder, the cleaning cylinder extends to one side, which is far away from the protective cover, of the spray head, a plurality of cleaning holes are formed in the surface of one side, which is far away from the spray head, of the cleaning cylinder, and a plurality of rotating beads are arranged on the surface of the cleaning cylinder.
As a further scheme of the invention, the surface of the protective cover is fixedly connected with a triangular collecting box, the collecting box is communicated with the fan, the inside of the fan is fixedly connected with a guide plate, a filter plate is arranged on the surface of one side of the collecting box, which is far away from the cleaning cylinder, the sliding cylinder moves along the surface of the collecting box when moving to the position of the collecting box, a plurality of expansion plates are arranged on the surface of the sliding cylinder, and the expansion plates are connected with the connecting cylinder.
As a further scheme of the invention, the surface of the collecting box is fixedly connected with a guide block, one side of the guide block, which is close to the sliding cylinder, is an inclined plane, and one side of the guide block, which is close to the sliding cylinder, is positioned below the sliding cylinder.
As a further scheme of the invention, the surface of one side of the cleaning cylinder, which is close to the cleaning hole, is elastically and slidably connected with an L-shaped blocking plate, and the blocking plate is used for blocking part of the cleaning hole.
The beneficial effects of the invention are as follows:
1. according to the invention, the current motion state of the magnetic suspension motor is accurately judged through the position signals sent by the Hall element of the motor, the motor position signals are rapidly and stably obtained, the phase of the motor rotor can be accurately judged and the accurate phase change time is provided by the Hall element-containing BLDC driver, so that the electric energy conversion efficiency of the motor is optimal, the rotating speed of the magnetic suspension motor is higher, the cleaning effect is better, the stability is stronger, the service life is longer, the magnetic suspension motor is more suitable for long-time stable cleaning work, two spray heads or a plurality of spray heads are arranged, the two spray heads can rotate and spray out plasmas to clean the semiconductor surface, the processing area is larger by adjusting the distance between the two spray heads, the processing efficiency is higher, the spray head moving mechanisms are arranged on the magnetic suspension motor, the belt and gear transmission are not needed, the problem of the old loss and replacement of the belt gear is solved, and the shutdown maintenance time is greatly reduced.
2. In the invention, when the cleaning device approaches to the semiconductor, the cleaning cylinder moves to the surface of the semiconductor, the fan can form negative pressure, impurities such as dust on the surface of the semiconductor are adsorbed and cleaned through the recovery pipe, the connecting cylinder, the sliding cylinder and the cleaning cylinder, and then the rotating column can be contacted with the semiconductor, so that the cleaning cylinder can move conveniently, impurities such as dust visible to the naked eye on the surface of the semiconductor can be cleaned before the semiconductor is cleaned by plasma, the effect of plasma cleaning is ensured, and the effect that the efficiency and quality of plasma cleaning can be influenced by the impurities such as dust on the surface of the semiconductor when the semiconductor is cleaned by plasma is avoided.
3. When the cleaning device is used for cleaning sundries such as dust on the surface of a semiconductor, the dust adsorbed and cleaned can pass through the cleaning hole, the cleaning cylinder, the sliding cylinder, the connecting cylinder, the recovery pipe and the fan, the guide plate in the fan can guide air flow into the collecting box and finally enter the collecting box, so that the dust adsorbed and cleaned sundries can be collected, the dust cleaned sundries cannot be timely collected, the dust cleaned sundries cannot fall on the surface of a product along with air scattering, the cleaning effect is affected, the sliding cylinder can move away from the protective cover under the action of the inclined surface of the collecting box, the sliding cylinder can move to two sides after the range of the spray head on the surface of the semiconductor is cleaned, the cleaning range of the spray head can be ensured to be kept large enough, the sliding cylinder and the cleaning cylinder can be prevented from blocking the cleaning range of the spray head, the cleaning range is reduced, and the cleaning efficiency is reduced.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of the present invention in general section;
FIG. 3 is a schematic view of the structure of the inside of the protective cover in the present invention;
FIG. 4 is a schematic view showing the structure of the installation box and the inside of the aluminum shell in the invention;
FIG. 5 is a schematic diagram of the position relationship between the rotating shaft, the rotating block and the connecting groove in the present invention;
FIG. 6 is a schematic view of the structure of the spindle, the rotary block and the spray head of the present invention after being cut away;
FIG. 7 is a schematic view of the structure of the air guiding plate in the present invention;
FIG. 8 is a schematic diagram of the structure of the air guiding disc and the rotating disc after explosion;
FIG. 9 is a schematic view of the connection relationship between the recovery tube, the connecting cylinder, the sliding cylinder and the cleaning cylinder;
fig. 10 is a schematic structural view of a connection relationship between a fan and a guide plate in the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
the device comprises a fixed base 1, a protective cover 2, an aluminum shell 3, an energizing line 4, a rotating shaft 5, a bearing 6, permanent magnet magnetic steel 7, a BLDC driver 8 with Hall, a rotating disc 9, a spray head 10, an electrode 11, a protective cylinder 12, an air passage 13, a rotary joint 14, a mounting box 15, a high-voltage carbon brush 16, a rotating block 17, an insulating fixed plate 18, a high-voltage conducting ring 19, a grounding conducting ring 20, a grounding carbon brush 21, an air guide disc 22, an air guide groove 23, a connecting groove 24, a connecting line 25, a rotation speed detection sensor 26, a magnet 27, a light guide rod 28, an optical fiber sensor 29, an optical fiber line 30, a fan 31, a recovery tube 32, a connecting cylinder 33, a sliding cylinder 34, a cleaning cylinder 35, a cleaning hole 36, a rotating bead 37, a collecting box 38, a guide plate 39, a filter plate 40, a telescopic plate 41, a guide block 42 and a blocking plate 43.
Detailed Description
The preferred embodiments of the present invention are described with reference to fig. 1-10 for a full understanding of the present invention. The embodiments of the present invention can be modified into various forms, and the scope of the present invention is not limited to the embodiments described in detail below. The present embodiments are provided to more fully explain the present invention to those skilled in the art to which the present invention pertains. Accordingly, the shapes of elements and the like in the drawings may be exaggerated for further emphasis on the clear description. Like parts are given like reference numerals throughout the various figures. Detailed descriptions of known functions and configurations that are determined to be likely to obscure the gist of the present invention will be omitted.
The invention provides a technical scheme that: an atmospheric plasma cleaning device for cleaning a semiconductor in a large area comprises a fixed base 1, a protective cover 2 arranged on the top of the fixed base 1, and also comprises,
the magnetic suspension motor driving system comprises an aluminum shell 3, wherein the aluminum shell 3 is fixedly connected to the surface of a fixed base 1, a power-on wire 4 is arranged on the surface of the aluminum shell 3, a rotating shaft 5 is rotatably connected inside the aluminum shell 3, the rotating shaft 5 is connected with the aluminum shell 3 through a bearing 6, permanent magnet steel 7 is fixedly connected to the surface of the rotating shaft 5, the permanent magnet steel 7 is positioned inside the aluminum shell 3, the rotating shaft 5 penetrates through a protective cover 2, a driver 8 is fixedly connected to the protective cover 2, and the power-on wire 4 is electrically connected with the driver 8;
the double-gun-head structure is arranged on one side surface of the protective cover 2, which is close to the magnetic suspension motor driving system, and comprises a rotating disc 9, wherein the rotating disc 9 is fixedly connected to the surface of the rotating shaft 5, the rotating disc 9 is positioned on the outer side of the protective cover 2, two spray heads 10 are arranged on the surface of the rotating disc 9, the inside of each spray head 10 is hollow, an electrode 11 for ionizing process gas is fixedly connected to the inside of each spray head 10, a protective cylinder 12 is arranged on the surface of the rotating disc 9, and each spray head 10 is positioned in the protective cylinder 12;
the gas rotating structure is arranged on one side of the magnetic suspension motor driving system, which is far away from the double-gun-head structure, and is used for providing process gas for the double-gun-head structure in the rotating process;
the double gun head mechanism is driven to rotate by a magnetic suspension motor driving system;
the gas rotating structure comprises an air passage 13, the air passage 13 is arranged in the rotating shaft 5, the air passage 13 penetrates through the rotating shaft 5, one end of the rotating shaft 5 far away from the spray head 10 is rotationally communicated with a hollow rotating joint 14, the surface of the fixed base 1 is fixedly connected with a mounting box 15, the mounting box 15 is positioned on one side of the aluminum shell 3, the rotating shaft 5 penetrates through the mounting box 15, the top of the inner wall of the mounting box 15 is fixedly connected with two groups of high-voltage carbon brushes 16, the surface of the rotating shaft 5 is fixedly connected with a rotating block 17, the rotating block 17 is positioned in the mounting box 15, the surface of the rotating block 17 is fixedly connected with two annular insulating fixed plates 18, the surface of the rotating block 17 is fixedly connected with two high-voltage conducting rings 19, the two groups of the high-voltage carbon brushes 16 are respectively contacted with the surfaces of the two high-voltage conducting rings 19, the high-voltage carbon brushes 16 are powered by an external high-voltage power supply, the surface of the rotating shaft 5 is fixedly connected with a grounding conducting ring 20, the grounding conducting ring 20 is positioned on one side of the mounting box 15 far away from the aluminum shell 3, the installation box 15 is fixedly connected with a grounding carbon brush 21 near the surface of a grounding conducting ring 20, an air passage 13 penetrates through a rotating disc 9, the surface of the rotating disc 9 is fixedly connected with an air guide disc 22, two spray heads 10 are fixedly connected to the surface of the air guide disc 22, air guide grooves 23 are formed in the surface of the air guide disc 22, the end parts of the air passages 13 are positioned at the middle positions of the air guide grooves 23, the two ends of the air guide grooves 23 respectively extend to the positions of the two spray heads 10, the two ends of the air guide grooves 23 penetrate through the air guide disc 22 and are communicated with the spray heads 10, a connecting groove 24 is formed in the rotating block 17 and the rotating shaft 5, one end of the connecting groove 24 near the high-voltage conducting ring 19 penetrates through the rotating block 17 and extends to the lower part of the high-voltage conducting ring 19, the other end of the connecting groove 24 penetrates through the rotating disc 5, the rotating disc 9 and the air guide disc 22 extend to the positions of the spray heads 10, the high-voltage conducting ring 19 is connected with the electrodes 11 through a connecting wire 25, the connecting wire 25 penetrates through the connecting groove 24, the protective cylinder 12 is fixedly connected to the surface of the air guide plate 22;
the rotation speed detection system comprises a rotation speed detection sensor 26, wherein the rotation speed detection sensor 26 is fixedly connected to the surface of the installation box 15, and a magnet 27 for detecting the rotation speed is embedded and installed on the surface of the insulating fixing plate 18;
the plasma monitoring system comprises a light guide rod 28, wherein the light guide rod 28 is fixedly connected to the surface of an electrode 11, the light guide rod 28 penetrates through a rotating disc 9 and an air guide disc 22, an optical fiber sensor 29 is fixedly connected inside a protective cover 2, an optical fiber wire 30 is fixedly connected to the surface of the optical fiber sensor 29, and the optical fiber wire 30 penetrates through the protective cover 2 corresponding to the position of the light guide rod 28;
before cleaning the semiconductor, the rotary joint 14 is connected with an external process gas supply pipe, when the semiconductor is cleaned, after the semiconductor large-area cleaning atmospheric plasma cleaning device is electrified, the repulsive force generated between the magnetic field formed by the electrified wire 4 and the magnetic field of the permanent magnet steel 7 drives the rotating shaft 5 to rotate, the Hall BLDC driver 8 can control the rotating shaft 5 to rotate, the current motion state of the magnetic levitation motor is accurately judged through the position signal sent by the Hall element of the motor, the motor position signal is quickly and stably obtained, the Hall BLDC driver 8 can accurately judge the phase of the motor rotor and provide accurate phase change time, so that the motor electric energy conversion efficiency is optimal, the rotating speed of the motor is higher, the cleaning effect is better, the stability is stronger, the service life is longer, the semiconductor large-area cleaning device is more suitable for long-time stable cleaning work, the rotation of the rotating shaft 5 drives the rotating disc 9, the air guide disc 22 and the protective cylinder 12 to rotate together, when process gas flows to the spray heads 10 through the rotating joint 14 and the air passage 13, external high-voltage power is connected with the high-voltage brushes, the high-voltage brushes are connected with the spray heads 10 through the high-voltage conducting rings 19 and the connecting wires 25 to provide positive poles for high-voltage electric fields, the ground wires are connected with the grounding carbon brushes 21, the grounding conducting rings 20, the rotating shaft 5 and the spray heads 10 are conducted to provide negative poles for the high-voltage electric fields, the high-voltage electric power can be normally discharged after being supplied, the process gas flows into the spray heads 10 through the air passage 13 and the air guide grooves 23, stable supply of the process gas to the inner parts of the two spray heads 10 in the cleaning process is ensured through the arrangement of the rotating joint 14, the ionization effect is ensured, the high-voltage electric field discharge ionizes the process gas, ionized plasma is sprayed out of the spray heads 10, the invention sets two or more spray heads 10 and adjusts the interval between the spray heads 10, which makes the treatment area of spray heads 10 bigger and the treatment efficiency higher when cleaning the semiconductor, and the spray heads 10 moving mechanism is set on the magnetic suspension motor, which doesn't need belt and gear transmission, solves the problem of the belt and gear wearing and changing, greatly reduces the machine halt maintenance time, in the cleaning course, the rotation speed detecting sensor 26 can detect the rotation speed of the rotation shaft 5 through the rotation of the magnet 27, and can timely find whether the rotation speed of the rotation shaft 5 is abnormal, which avoids the abnormal rotation speed of the rotation shaft 5 not finding timely, which affects the cleaning effect, in the cleaning course, the arc light can be generated when the spray heads 10 discharge ionization process gas, and the arc light can be transmitted to the optical fiber sensor 29 through the conductive rod and the optical fiber wire 30, which detects whether the discharge is abnormal, which is beneficial to finding the discharge abnormality timely, and guaranteeing the ionization effect.
When a semiconductor is cleaned, dust and other impurities exist on the surface of the semiconductor, as a further scheme of the invention, a fan 31 is fixedly connected to the surface of the protective cover 2, a recovery pipe 32 is communicated with the surface of one side of the fan 31 close to the spray head 10, telescopic connecting cylinders 33 are elastically and slidingly communicated with both sides of the recovery pipe 32, one end of the connecting cylinder 33, far from the recovery pipe 32, is communicated with a sliding cylinder 34, the surface of the sliding cylinder 34 is communicated with a cleaning cylinder 35, the cleaning cylinder 35 extends to the side, far from the protective cover 2, of the spray head 10, a plurality of cleaning holes 36 are formed in the surface of the cleaning cylinder 35, and a plurality of rotating beads 37 are arranged on the surface of the cleaning cylinder 35;
in the process of cleaning the semiconductor, when the cleaning device approaches the semiconductor, the cleaning cylinder 35 moves to the surface of the semiconductor, the fan 31 forms negative pressure, impurities such as dust on the surface of the semiconductor are adsorbed and cleaned through the recovery pipe 32, the connecting cylinder 33, the sliding cylinder 34, the cleaning cylinder 35 and the cleaning hole 36, and then the rotating column is contacted with the semiconductor, so that the cleaning cylinder 35 is convenient to move, the impurities such as dust visible to the naked eye on the surface of the semiconductor are cleaned before the semiconductor is subjected to plasma cleaning, the effect of plasma cleaning is ensured, and the effect that the efficiency and the quality of plasma cleaning are influenced by the impurities such as dust on the surface of the semiconductor are avoided when the semiconductor is subjected to plasma cleaning.
When cleaning sundries such as dust on the surface of a semiconductor, the cleaned sundries such as dust cannot be timely collected, and after cleaning by a cleaning pipe, the cleaning pipe can influence the subsequent cleaning, as a further scheme of the invention, the surface of the protective cover 2 is fixedly connected with a triangular collecting box 38, the collecting box 38 is communicated with a fan 31, a guide plate 39 is fixedly connected inside the fan 31, a filter plate 40 is arranged on the surface of the collecting box 38, which is far away from a cleaning cylinder 35, a sliding cylinder 34 moves along the surface of the collecting box 38 when moving to the position of the collecting box 38, a plurality of expansion plates 41 are arranged on the surface of the sliding cylinder 34, and the expansion plates 41 are connected with a connecting cylinder 33;
when debris such as dust on the semiconductor surface is cleaned, the dust absorbed and cleaned can pass through the cleaning hole 36, the cleaning barrel 35, the sliding barrel 34, the connecting barrel 33, the recovery pipe 32 and the fan 31, the guide plate 39 in the fan 31 can guide airflow into the collecting box 38, finally, the dust enters into the collecting box 38, the dust absorbed and cleaned debris can be collected, the cleaned dust and the like can not be timely collected, the dust can fall on the surface of a product along with air drift again, thereby affecting the cleaning effect, after the cleaning barrel approaches the semiconductor, the cleaning barrel 10 is contacted with the semiconductor, the cleaning barrel 35 and the sliding barrel 34 can be pushed to the side close to the fan 31, the connecting barrel 33 can move on the surface of the sliding barrel 34, then the sliding barrel 34 can move to the surface of the collecting box 38, the sliding barrel 34 can move away from the protective cover 2 under the action of the inclined surface of the collecting box 38, the sliding barrel 34 can move to two sides after the range opposite to the semiconductor surface 10 is cleaned, the cleaning range of the shower nozzle 10 can be ensured to be kept enough, the cleaning range 10 can be kept, the cleaning efficiency of the shower nozzle 10 can be prevented from being reduced, and the cleaning range of the shower nozzle 10 can be prevented from being lowered, and the cleaning efficiency can be reduced.
In the process of cleaning the semiconductor surface, the cleaning cylinder 35 cannot timely clean the surface of the cleaning path, and as a further scheme of the invention, the surface of the collecting box 38 is fixedly connected with a guide block 42, one side of the guide block 42, which is close to the sliding cylinder 34, is an inclined surface, and one side of the guide block 42, which is close to the sliding cylinder 34, is positioned below the sliding cylinder 34;
when the semiconductor surface is cleaned, after the rotating beads 37 are in contact with the semiconductor, the spray head 10 continuously moves, the cleaning barrel 35 and the sliding barrel 34 can move towards the collecting box 38, the sliding barrel 34 can move away from the protective cover 2 under the action of the collecting box 38, the bottom of the sliding barrel 34 can be in contact with the guide block 42 in the process of moving the sliding barrel 34 along the surface of the collecting box 38, the guide block 42 can act on the sliding barrel 34 to move upwards with the cleaning barrel 35, and then in the process of moving the spray head 10, the cleaning barrel 35 can firstly absorb and clean the moving path of the spray head 10 on the semiconductor surface, so that the subsequent plasma cleaning effect is ensured.
In the process of cleaning the semiconductor, the cleaning holes 36 near one side of the spray head 10 can influence the cleaning of the surface dirt of the semiconductor by the plasma, and as a further scheme of the invention, the surface of the cleaning cylinder 35 near one side of the cleaning holes 36 is elastically and slidably connected with an L-shaped blocking plate 43, and the blocking plate 43 is used for blocking part of the cleaning holes 36;
in the process of cleaning the semiconductor surface, the sliding cylinder 34 and the cleaning cylinder 35 can move upwards under the action of the guide block 42, and when the cleaning cylinder 35 moves to the position of the guide block 42, the blocking plate 43 can move upwards under the action of the guide block 42, and the blocking block can block the part of the cleaning hole 36 close to the spray head 10, so that the part of the cleaning hole 36 close to the spray head 10 is blocked in the process of cleaning the semiconductor by plasma, and the cleaning effect of the plasma on the semiconductor is prevented from being influenced by the adsorption force of the cleaning hole 36.
The embodiments of the present invention described above are merely examples, and those skilled in the art to which the present invention pertains may make various modifications or derive equivalent other embodiments. Accordingly, the present invention is not limited to the embodiments mentioned in the above detailed description. Therefore, the true technical scope of the present invention should be determined according to the technical ideas of the scope of the appended claims. Moreover, it should be understood that the invention includes all modifications, equivalents and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. The utility model provides a semiconductor large tracts of land washs with atmospheric plasma belt cleaning device, includes unable adjustment base (1) and installs protection casing (2) at unable adjustment base (1) top, its characterized in that: also included is a method of manufacturing a semiconductor device,
the magnetic suspension motor driving system comprises an aluminum casing (3), the aluminum casing (3) is fixedly connected to the surface of the fixed base (1), a power-on wire (4) is arranged on the surface of the aluminum casing (3), a rotating shaft (5) is rotatably connected inside the aluminum casing (3), the rotating shaft (5) is connected with the aluminum casing (3) through a bearing (6), permanent magnet steel (7) is fixedly connected to the surface of the rotating shaft (5), the permanent magnet steel (7) is located inside the aluminum casing (3), the rotating shaft (5) penetrates through the protective cover (2), a driver (8) is fixedly connected to the protective cover (2), and the power-on wire (4) is electrically connected with the driver (8).
The double-gun-head structure is arranged on one side surface of the protective cover (2) close to the magnetic suspension motor driving system, the double-gun-head structure comprises a rotating disc (9), the rotating disc (9) is fixedly connected to the surface of the rotating shaft (5), the rotating disc (9) is positioned on the outer side of the protective cover (2), two spray heads (10) are arranged on the surface of the rotating disc (9), the spray heads (10) are hollow, electrodes (11) for ionizing process gas are fixedly connected to the spray heads (10), a protective cylinder (12) is arranged on the surface of the rotating disc (9), and the spray heads (10) are positioned in the protective cylinder (12);
the gas rotating structure is arranged on one side, far away from the double-gun-head structure, of the magnetic suspension motor driving system and is used for providing process gas for the double-gun-head structure in the rotating process;
the double gun head mechanism is driven to rotate by a magnetic suspension motor driving system.
2. The atmospheric plasma cleaning apparatus for cleaning a large area of a semiconductor according to claim 1, wherein: the gas rotating structure comprises an air passage (13), the air passage (13) is arranged in the rotating shaft (5), the air passage (13) penetrates through the rotating shaft (5), one end of the rotating shaft (5) is far away from the spray head (10) and is rotationally communicated with a hollow rotating joint (14), a mounting box (15) is fixedly connected to the surface of the fixing base (1), the mounting box (15) is positioned on one side of the aluminum shell (3), the rotating shaft (5) penetrates through the mounting box (15), two groups of high-voltage carbon brushes (16) are fixedly connected to the top of the inner wall of the mounting box (15), a rotating block (17) is positioned in the mounting box (15), two annular insulating fixing plates (18) are fixedly connected to the surface of the rotating block (17), two groups of high-voltage carbon brushes (16) are respectively contacted with the surfaces of the two high-voltage conducting rings (19), the high-voltage carbon brushes (16) are provided by an external power supply, the high-voltage carbon brushes (5) are fixedly connected with rotating blocks (17), the rotating shaft (20) is far away from the surface of the aluminum shell (20), the installation box (15) is close to the grounded carbon brush (21) fixedly connected with the surface of the grounded conducting ring (20), the air channels (13) penetrate through the rotating disc (9), the surface of the rotating disc (9) is fixedly connected with the air guide disc (22), the two spray heads (10) are fixedly connected with the surface of the air guide disc (22), the air guide grooves (23) are formed in the surface of the air guide disc (22), the end parts of the air channels (13) are positioned in the middle of the air guide grooves (23), the two ends of the air guide grooves (23) respectively extend to the two spray heads (10), the two ends of the air guide grooves (23) are communicated with the spray heads (10) through the air guide disc (22), the inside of the rotating block (17) and the inside of the rotating shaft (5) are jointly provided with connecting grooves (24), one end of each connecting groove (24) close to the high-voltage conducting ring (19) penetrates through the rotating block (17) to extend to the lower part of the high-voltage conducting ring (19), the other end parts (24) of the connecting grooves (5), the rotating disc (9) and the connecting wire (22) extend to the positions between the connecting wire (25) and the high-voltage conducting ring (25) through the connecting wire (25), the protective cylinder (12) is fixedly connected to the surface of the air guide disc (22).
3. The atmospheric plasma cleaning apparatus for cleaning a large area of a semiconductor according to claim 2, wherein: still include rotational speed detecting system, rotational speed detecting system includes rotational speed detection sensor (26), rotational speed detection sensor (26) fixed connection is in the surface of mounting box (15), magnet (27) that are used for detecting the rotational speed are installed in insulating fixed plate (18) surface embedding.
4. The atmospheric plasma cleaning device for cleaning a large area of a semiconductor according to claim 2 or 3, wherein: the plasma monitoring system comprises a light guide rod (28), the light guide rod (28) is fixedly connected to the surface of the electrode (11), the light guide rod (28) penetrates through the rotating disc (9) and the air guide disc (22), an optical fiber sensor (29) is fixedly connected to the inside of the protective cover (2), an optical fiber wire (30) is fixedly connected to the surface of the optical fiber sensor (29), and the optical fiber wire (30) penetrates through the protective cover (2) corresponding to the position of the light guide rod (28).
5. The atmospheric plasma cleaning apparatus for cleaning a large area of a semiconductor according to claim 2, wherein: the utility model discloses a cleaning device for a shower nozzle, including protection casing (2) surface fixedly connected with fan (31), fan (31) are close to shower nozzle (10) one side surface intercommunication has recovery pipe (32), the equal elastic sliding intercommunication in recovery pipe (32) both sides has telescopic connecting cylinder (33), connecting cylinder (33) are kept away from recovery pipe (32) one end intercommunication and are had sliding cylinder (34), sliding cylinder (34) surface intercommunication has cleaning cylinder (35), cleaning cylinder (35) extend to shower nozzle (10) and keep away from protection casing (2) one side, cleaning cylinder (35) are kept away from shower nozzle (10) one side surface and are seted up a plurality of clearance holes (36), cleaning cylinder (35) surface is equipped with a plurality of rotating beads (37).
6. The atmospheric plasma cleaning device for cleaning a large area of a semiconductor according to claim 5, wherein: the utility model discloses a cleaning device, including protection casing (2) surface fixedly connected with triangle-shaped collecting box (38), collecting box (38) with fan (31) intercommunication, inside fixedly connected with guide board (39) of fan (31), collecting box (38) are kept away from cleaning cylinder (35) one side surface is equipped with filter plate (40), can remove along collecting box (38) surface when sliding cylinder (34) remove to collecting box (38) position, sliding cylinder (34) surface is equipped with a plurality of expansion plates (41), expansion plates (41) with connecting cylinder (33) are connected.
7. The atmospheric plasma cleaning device for cleaning a large area of a semiconductor according to claim 6, wherein: the collecting box (38) is fixedly connected with a guide block (42) on the surface, one side, close to the sliding cylinder (34), of the guide block (42) is an inclined plane, and one side, close to the sliding cylinder (34), of the guide block (42) is located below the sliding cylinder (34).
8. The atmospheric plasma cleaning apparatus for cleaning a large area of a semiconductor according to claim 7, wherein: the cleaning cylinder (35) is elastically and slidably connected with an L-shaped blocking plate (43) on one side surface of the cleaning hole (36), and the blocking plate (43) is used for blocking part of the cleaning hole (36).
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| CN202311807600.4A CN117600177B (en) | 2023-12-26 | 2023-12-26 | Atmospheric plasma cleaning device for cleaning semiconductor in large area |
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| CN202311807600.4A CN117600177B (en) | 2023-12-26 | 2023-12-26 | Atmospheric plasma cleaning device for cleaning semiconductor in large area |
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| CN117600177B CN117600177B (en) | 2024-06-18 |
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| JPH08173885A (en) * | 1994-12-26 | 1996-07-09 | Matsushita Electric Ind Co Ltd | Fluid supplying device |
| DE202008017836U1 (en) * | 2008-03-05 | 2010-08-12 | Arcoron Gmbh | plasma nozzle |
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| CN117600177B (en) | 2024-06-18 |
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