CN1175975C - Ink-jet printing head able to accurately measure temp of heating element and its measuring method - Google Patents
Ink-jet printing head able to accurately measure temp of heating element and its measuring method Download PDFInfo
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- CN1175975C CN1175975C CNB001008978A CN00100897A CN1175975C CN 1175975 C CN1175975 C CN 1175975C CN B001008978 A CNB001008978 A CN B001008978A CN 00100897 A CN00100897 A CN 00100897A CN 1175975 C CN1175975 C CN 1175975C
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- heating element
- temperature sensing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14354—Sensor in each pressure chamber
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ink Jet (AREA)
Abstract
The present invention relates to an ink jet print head which can precisely measure the temperature of a heating element. The present invention comprises a heating element for jetting ink, a semiconductor drive element and a temperature sensing resistance layer, wherein the element for jetting ink comprises a heating resistor used for heating ink; the drive element is used for driving a semiconductor so as to control whether the heating element for jetting ink is heated or not; one end of the resistance layer is connected with the semiconductor and the other end is connected with an electrode contact which is connected with a printer. The heating element is connected with the semiconductor drive element through the temperature sensing resistance layer. The present invention also relates to a method for precisely measuring the temperature of a heating element of an ink jet print head.
Description
Technical field
The present invention relates to have the ink jet-print head of each temp of heating element function of accurate measurement; The invention still further relates to the method that the temperature of each heating element heater of ink jetting head is measured.
Background technology
With regard to present printer, topmost have laser printer and ink-jet printer, and the printing technique of these two kinds of printers respectively has its pluses and minuses, wherein, aspect colour print, main still based on inkjet technology.In inkjet technology, the hot bubble type ink jet printhead is to utilize heating element heater (heating resistor) that ink moment is imposed Gao Re and produce bubble, and and then ejection ink.The uniformity of ink spray volume has very big influence to the quality that is printed product, and is particularly all the more so concerning the ink jet-print head of high-res.And what of ejection quantity of ink are also relevant with the original temperature before heating element heater applies energy except relevant with the energy of being bestowed.Because the temperature of heating element heater can be subjected to the influence of surrounding environment and operating position, for example, temperature just can improve during continous inkjet, therefore need adjust the mode that drives ink-jet according to this temperature.
The known practice only is to measure the mean temperature of ink-jet chip 10 as shown in Figure 1, wherein, label 102 expression electrode contact districts, 103 expression temperature sensing resistance, 104 expression ink-jet circuit regions, 105 expression driving element districts, 106 expression heating element heater districts, 107 expression ink replenishing openings.This ink-jet chip is to produce a fine rule around chip periphery on original metal level, and with this as temperature sensing resistance 103, this resistance 103 can vary with temperature and change, thereby can extrapolate the change of chip 10 mean temperatures according to the variation of this fine rule resistance 103.
Documents such as at present general product or patent are as United States Patent (USP) 4,791,435,4,910,528,5,107,276,5,168,284,5,175,565,5,475,405 and 5,736,995 etc.) sensing and the control mode of temperature are all only considered mean temperature, it all is the feedback according to the ink-jet chip mean temperature, and then makes heating element heater can maintain on certain temperature in use by the mode of preheating; As for temperature when too high, also can allow printer pause with the temperature of cooling printhead, as United States Patent (USP) 4,910, shown in 528.This shortcoming of considering the mode of mean temperature is, because the behaviour in service of each heating element heater may be different, so mean temperature may not be representative.
In the ink jet-print head of high-res, have more heating element heater usually, also therefore regular meeting makes drive circuit on ink-jet chip, also is the semiconductor switch circuit of MOS class, as United States Patent (USP) 5,045,870 and 5,211, shown in 812.As shown in Figure 2, it is near the cutaway view the MOS semiconductor in the device of known measurement ink jet-print head temp of heating element.Wherein, label 21 expression silicon grounds, 22 expression field oxides, 23 expression thermal oxide layers, 24 expression polysilicon gates, 27 expression heating resistor layers, 28 expression conductive layers.The known practice is to make the MOS driving element under ink-jetting member earlier, an end of ink-jet circuit can be costed the drain electrode of MOS then, another termination driving voltage can make this heating element heater circuit unobstructed when the grid at MOS gives high potential, and then produces high heat ejection ink droplet.In order to obtain good print quality, this type of ink jet-print head also is to utilize temperature survey to feed back suitably to drive heating resistor usually, and can produce a certain size ink droplet like this.
On traditional ink jet-print head, though might near each heating element heater, make temperature-sensing device, yet desire to read the temperature of each element, still need on ink-jet chip, provide the contact that equates with number of elements to join with printer circuitry, this is very unpractiaca for having the moving ink jet-print head that rolls dozens of so that hundreds of heating element heaters.
Summary of the invention
For this reason, the purpose of this invention is to provide ink jet-print head with each temp of heating element function of accurate measurement;
Another purpose of the present invention provides the method that each temp of heating element of ink jet-print head is measured.
In order to reach above-mentioned purpose, the present invention mainly is having extra metal level or the semiconductor layer of making on the ink-jet chip of driving element, so that accurately measure each temp of heating element.Metal that this is extra or semiconductor can wind the line to heating resistor below or near, cooperate live width control and with being connected of original driving element, this ink jet-print head can be measured the temperature of arbitrary heating element heater when being about to ink-jet, and on ink-jet chip, only need a contact that is communicated with printing, allow the temperature sensing signal of arbitrary heating element heater be delivered to printer with regard to being enough to.And with this technology is the droplet size that the basis can be controlled each heating element heater more accurately and sprayed, and then obtains high-quality printing effect.
A kind of ink jet-print head of measuring each temp of heating element function that has of the present invention, it comprises:
One ink-jetting member, this ink-jetting member comprise one in order to the heating element heater to the ink heating;
The semiconductor driving element, whether this driving element heats with heating element heater thereby control described ink-jet in order to drive semiconductor; And
One temperature sensing resistive layer, this resistive layer is between described semiconductor driving element and described ink-jetting member, and this temperature sensing resistive layer mainly is the below that is positioned at heating element heater, one termination semiconductor, the other end with link to each other with electrode contact that printer joins, described ink-jetting member joins by described temperature sensing resistive layer and described semiconductor driving element.
Another kind of the present invention has the ink jet-print head of measuring each temp of heating element function, and it comprises:
One ink-jetting member, this ink-jetting member comprise one in order to the heating element heater to the ink heating;
The semiconductor driving element, whether this driving element heats with heating element heater thereby control described ink-jet in order to drive semiconductor; And
One temperature sensing resistive layer, this resistive layer is between described semiconductor driving element and described ink-jetting member, and this temperature sensing resistive layer mainly is positioned near the heating element heater, one termination semiconductor, the other end with link to each other with electrode contact that printer joins, described ink-jetting member joins by described temperature sensing resistive layer and described semiconductor driving element.
Of the present invention another have the ink jet-print head of measuring each temp of heating element function, it has on the equipment that the driving element of ink jet-print head and ink-jetting member can be assigned to different live width levels and material speciality or the characteristic of making in the factory, it comprises:
One ink-jetting member, this ink-jetting member is in order to the ejection ink droplet;
The semiconductor driving element, whether this driving element sprays ink droplet in order to control described ink-jetting member; And
One interface layer of using as interface, this interface layer are between semiconductor driving element and ink-jetting member, and it sentences thinner live width and the semiconductor driving element joins one, joins with the live width and the ink-jetting member of broad at another place again.
A kind of method that the temperature of each heating element heater of ink jet-print head is measured of the present invention, it may further comprise the steps:
(i) below the heating element heater or near making temperature sensing resistance;
(ii) make a termination semiconductor of described temperature sensing resistance, the other end with link to each other with temperature sensing electrode contact that printer joins, make the semi-conductive other end receive ground connection control end points, when semiconductor conducting and ground connection control end points ground connection, promptly form a loop;
(iii) for each temperature sensing resistance, its corresponding semiconductor is received different semiconductor actuating switch contacts and ground connection control contact with matrix structure, wherein, each only can constitute one from the temperature sensing electrode contact to semiconductor actuating switch contact and ground connection control contact, through temperature sensing resistance, receive the loop on ground then; And
(iv) by the selection to semiconductor actuating switch contact and ground connection control contact, thereby the resistance that can measure the specified temp sensing resistor on the temperature sensing electrode contact is learnt the temperature of heating element heater.
The method that another kind of the present invention is measured the temperature of each heating element heater of ink jet-print head, it may further comprise the steps:
(i) below the heating element heater or near making temperature sensing resistance;
(ii) make a termination semiconductor of described temperature sensing resistance, the other end with link to each other with temperature sensing electrode contact that printer joins, make the semi-conductive other end receive the power electrode end points, when semiconductor conducting and power electrode end points ground connection, promptly form a loop through heating element heater;
(iii) for each temperature sensing resistance, its corresponding semiconductor is received different semiconductor actuating switch contacts and is received the power electrode contact through heating element heater with matrix structure, wherein, each only can constitute one from the temperature sensing electrode contact to semiconductor actuating switch contact and power electrode contact, through temperature sensing resistance, receive the loop on ground then; And
(iv) by to the selection of semiconductor actuating switch contact and power electrode contact, thereby the resistance that can measure the specified temp sensing resistor on the temperature sensing electrode contact is learnt the temperature of heating element heater.
Description of drawings
Below in conjunction with drawings and Examples ink jet-print head and the measuring method thereof that can accurately measure each temp of heating element of the present invention done description further.
Fig. 1 is the schematic representation of apparatus of known measurement ink jet-print head temp of heating element;
Fig. 2 is near the cutaway view the semiconductor in the device of known measurement ink jet-print head temp of heating element;
Fig. 3 a is near the cutaway view the semiconductor in the ink jet-print head of able to accurately measure temp of heating element of one embodiment of the present of invention;
Fig. 3 b is near the cutaway view the semiconductor in the ink jet-print head of able to accurately measure temp of heating element of an alternative embodiment of the invention;
Fig. 4 a is near the layout the heating element heater in the ink jet-print head shown in Fig. 3 a;
Fig. 4 b is near the layout the heating element heater in the ink jet-print head shown in Fig. 3 b;
Fig. 5 is an equivalent circuit diagram of the ink jet-print head of able to accurately measure temp of heating element of the present invention;
Fig. 6 is another equivalent circuit diagram of the ink jet-print head of able to accurately measure temp of heating element of the present invention;
Fig. 7 is the another equivalent circuit diagram of the ink jet-print head of able to accurately measure temp of heating element of the present invention;
Fig. 8 is an equivalent circuit diagram again of the ink jet-print head of able to accurately measure temp of heating element of the present invention.
The specific embodiment
Embodiment
The of the present invention a kind of ink jet-print head that can accurately measure each temp of heating element shown in Fig. 3 a, it comprises: an ink-jetting member 310a, this ink-jetting member comprise a heating resistor 37a and a conductive layer 38a who is used for the ink heating; Semiconductor driving element 300, whether this driving element heats thereby control described ink-jetting member 310a in order to drive semiconductor; An and temperature sensing resistive layer 35a, this resistive layer is between described semiconductor driving element 300 and described ink-jetting member 310a, and this temperature sensing resistive layer 35a mainly is the below that is positioned at heating resistor 37a, one termination semiconductor (MOS), the other end with link to each other with electrode contact (TSR) that printer joins, described ink-jetting member 310a joins by temperature sensing resistive layer 35a and semiconductor driving element 300.
Wherein, described temperature sensing layer 35a is formed in extra metal level or the semiconductor layer of one deck between ink-jetting member 310a and the driving element 300.Described ink-jetting member 310a comprises heating resistor layer 37a and conductive layer 38a.Described driving element 300 comprises field oxide 32, thermal oxide layer 33 and the polysilicon gate 34 that is formed on the silicon ground 31.And be formed with a dielectric layer 36a between described temperature sensing layer 35a and ink-jetting member 310a, it can be constituted by in silicon nitride, silica, lucite, boron-phosphorosilicate glass, aluminium oxide, tantalum oxide and the titanium oxide one or more layers.Owing at different layers, therefore can produce around resistance circuit to the heating element heater below as the metal level of temperature sensing layer 35a or semiconductor layer and ink-jetting member 310a.And for example shown in Fig. 4 a, temperature sensing layer 35a is thin and long than the temperature sensing layer of other positions with the circuit below the heating element heater 320a in ink-jet, so the resistance variations of temperature sensing layer 35a is mainly determined with the circuit below the heating element heater 320a in ink-jet by it.But can make ink-jet not good with the flatness on heating element heater 320a surface owing to make the temperature sensing layer in ink-jet below with heating element heater 320a, thereby have influence on the uniformity that sprays ink droplet, this is the shortcoming of this embodiment.
Shown in Fig. 3 b of the present invention another can accurately measure the ink jet-print head of each temp of heating element, it comprises: an ink-jetting member 310b, this ink-jetting member comprise in order to a heating resistor 37b and a conductive layer 38b to ink heating; Semiconductor driving element 300, whether this driving element heats thereby control described ink-jetting member 310b in order to drive semiconductor; An and temperature sensing resistive layer 35b, this resistive layer is between described semiconductor driving element 300 and described ink-jetting member 310b, and this temperature sensing resistive layer 35b mainly is positioned near the heating resistor 37b, one termination semiconductor, the other end with link to each other with electrode that printer joins, described ink-jetting member 310b joins by temperature sensing resistive layer 35b and semiconductor driving element 300.
Wherein, described temperature sensing layer 35b is formed in extra metal level or the semiconductor layer of one deck between ink-jetting member 310b and the driving element 300.Described ink-jetting member 310b comprises heating resistor layer 37b and conductive layer 38b.Described driving element 300 comprises field oxide 32, thermal oxide layer 33 and the polysilicon gate 34 that is formed on the silicon ground 31.And be formed with a dielectric layer 36b between described temperature sensing layer 35b and ink-jetting member 310b, it is identical with dielectric layer 36a.Owing to be positioned at different layers, therefore can produce the resistance circuit around the heating element heater as the metal level of temperature sensing layer 35b or semiconductor layer and ink-jetting member 310b.And for example shown in Fig. 4 b, temperature sensing layer 35b is thin and long than the temperature sensing layer of other positions with near the circuit the heating element heater 320b in ink-jet, so the resistance variations of temperature sensing layer 35b is mainly by its circuit decision around heating element heater 320b is used in ink-jet.
The present invention adopts additional metal levels or semiconductor layer, and it has the benefit that driving element and ink-jetting member can divide the work to make.Generally speaking, the processing procedure linewidth requirements of MOS driving element is thinner, though and the live width broad of ink-jetting member need use the material that general semiconductor factory used or be not suitable for usefulness less.By this extra metal level or semiconductor layer, can between driving element and ink-jetting member, introduce an interface, make general semiconductor factory after having finished this extra thin layer or the dielectric layer on it, again it to be given other professional ink-jetting member manufactories and to make.Because the contact of this extra metal level or semiconductor layer and ink-jetting member is very big, so the back segment ink-jetting member can be aimed at an easy rate, and this operation can be finished on more cheap equipment.Here it is uses the benefit of bringing after this extra interface layer on making.
The measuring method of each temp of heating element of ink jet-print head of the present invention, its comprise the following steps: (i) below the heating element heater or near making temperature sensing resistance; (ii) make a termination semiconductor of described temperature sensing resistance, the other end with link to each other with temperature sensing electrode contact that printer joins, make the semi-conductive other end receive ground connection control end points, when semiconductor conducting and ground connection control end points ground connection, promptly form a loop and form; (iii) for each temperature sensing resistance, its corresponding semiconductor is received on different semiconductor actuating switch contacts and the ground connection control contact with matrix structure, wherein, each only can cause one from the temperature sensing electrode contact to semiconductor actuating switch contact and ground connection control contact, through temperature sensing resistance, receive the loop on ground then; And (iv) by the selection to semiconductor actuating switch contact and ground connection control contact, thereby the resistance that can measure the specified temp sensing resistor on the temperature sensing electrode contact is learnt the temperature of heating element heater.
For reduce and printer between contact, can utilize existing MOS driver circuit 300, make extra temperature sensing layer 35a or 35b directly and the electrode of MOS join, so can utilize the temperature measuring resistors of the selection of the ground connection of the high electronegative potential of the mos gate utmost point and source electrode or open circuit being measured correspondence.The logic circuit of whole ink-jet chip is shown in the matrix structure of Fig. 5, if wherein having only gate electrode A1 is high potential, other gate electrode A2-An is an electronegative potential, and earth electrode G1 is a ground connection, other earth electrode G2-Gm is open circuit, then can be by the measurement of temperature sensing resistance T11 being learnt the temperature of single heating element H11.
In the design of circuit layout, near temperature sensing layer 35a or 35b its live width heating element heater that desire is measured is less, and it is bigger in other local live widths, the resistance major part is dropped near the heating element heater that desire measures, and what make that the variation of temperature and resistance roughly reacts is heating element heater but not other local variation of temperature.Temperature and resistance resistance at room temperature is more than 50 ohm, is preferably more than 100 ohm.
Only being preferred embodiment of the present invention below, is not in order to restriction the present invention, and those skilled in the art can be developed thus and a lot of different embodiments.For example, temperature sensing layer 35a shown in Fig. 3 a or Fig. 3 b or 35b are connected to temperature sensing electrode contact (TSR) and earth electrode contact (G) on the chip respectively, yet this does not represent that temperature sensing layer 35a or 35b must directly receive on those two electrode contacts, and in fact ink-jetting member metal level (as 37a, 37b or 38a, 38b) that also can be by some fragment or its make up and receive on the electrode contact.
And for example, heating resistor must be not as shown in Figure 5 yet will be between power electrode P and MOS drain electrode, it also can be between MOS source electrode and earth electrode.In the case, an end of temperature sensing resistance (TSR) will move to source electrode from MOS drain electrode, the measurement of temperature then be according to the grid of correspondence when the high potential, by TSR to the resistance decision between the corresponding P, as shown in Figure 6.
In another embodiment, in order to make slowing down of measuring circuit speed that synchronization brings owing to measurable heating resistor increases, we can increase the quantity of TSR.For example, the measuring cell that we can make each earth electrode G be controlled is all received and the pairing TSR of this earth electrode G, as shown in Figure 7, then select a gate electrode A be high potential and at the most m earth electrode G be ground connection, just can measure the temperature of m heating element heater at the most simultaneously.And for example we receive by measuring cell that each gate electrode A is controlled and the TSR of this gate electrode correspondence, as shown in Figure 8, then select an earth electrode G be ground connection and to a plurality of n gate electrode A be high potential, just can measure the temperature of n heating element heater at the most simultaneously.
Advantage of the present invention is as follows: at first, utilize the existing drive circuit of high-res ink jet-print head, on a single electrode, can obtain the temperature of any one heating element heater, therefore make to be achieved according to the accurate control of the temperature of each heating element heater being carried out ink-jet; Moreover, use extra metal level or semiconductor layer under the bigger alignment precision that allows, driving element and ink-jetting member to be made by the chip factory of different specialities respectively, have the benefit of giving full play to the existing equipment advantage.
Claims (13)
1. one kind has the ink jet-print head of measuring each temp of heating element function, and it comprises:
One ink-jetting member, this ink-jetting member comprise one in order to the heating element heater to the ink heating;
The semiconductor driving element, whether this driving element heats with heating element heater thereby control described ink-jet in order to drive semiconductor; And
One temperature sensing resistive layer, this resistive layer is between described semiconductor driving element and described ink-jetting member, and this temperature sensing resistive layer is positioned at the below of heating element heater, one termination semiconductor, the other end with link to each other with electrode contact that printer joins, described ink-jetting member joins by described temperature sensing resistive layer and described semiconductor driving element.
2. one kind has the ink jet-print head of measuring each temp of heating element function, and it comprises:
One ink-jetting member, this ink-jetting member comprise one in order to the heating element heater to the ink heating;
The semiconductor driving element, whether this driving element heats with heating element heater thereby control described ink-jet in order to drive semiconductor; And
One temperature sensing resistive layer, this resistive layer is between described semiconductor driving element and described ink-jetting member, and this temperature sensing resistive layer be positioned at heating element heater near, one termination semiconductor, the other end with link to each other with electrode contact that printer joins, described ink-jetting member joins by described temperature sensing resistive layer and described semiconductor driving element.
3. ink jet-print head according to claim 1 and 2 is characterized in that, described temperature sensing resistive layer is made of metal.
4. ink jet-print head according to claim 1 and 2 is characterized in that, described temperature sensing resistive layer is made of semiconductor.
5. ink jet-print head according to claim 1 and 2 is characterized in that, described temperature sensing resistive layer is thinner with near the live width heating element heater in described ink-jet, at other position live width broads.
6. ink jet-print head according to claim 1 and 2 is characterized in that, between described temperature sensing resistive layer and the described ink-jetting member dielectric layer is arranged.
7. ink jet-print head according to claim 6 is characterized in that, described dielectric layer comprises one or more layers combination of silicon nitride, silica, lucite, boron-phosphorosilicate glass, aluminium oxide, tantalum oxide and titanium oxide.
8. method that the temperature of each heating element heater of ink jet-print head is measured, it may further comprise the steps:
(i) below the heating element heater or near making temperature sensing resistance;
(ii) make a termination semiconductor of described temperature sensing resistance, the other end with link to each other with temperature sensing electrode contact that printer joins, make the semi-conductive other end receive ground connection control end points, when semiconductor conducting and ground connection control end points ground connection, promptly form a loop;
(iii) for each temperature sensing resistance, its corresponding semiconductor is received different semiconductor actuating switch contacts and ground connection control contact with matrix structure, wherein, each only can constitute one from the temperature sensing electrode contact to semiconductor actuating switch contact and ground connection control contact, through temperature sensing resistance, receive the loop on ground then; And
(iv), on the temperature sensing electrode contact, can measure the resistance of specified temp sensing resistor, thereby learn the temperature of heating element heater by selection to semiconductor actuating switch contact and ground connection control contact.
9. the method that each temp of heating element of ink jet-print head is measured according to claim 8 is characterized in that, described temperature measuring resistors when room temperature resistance more than 50 ohm.
10. the method that each temp of heating element of ink jet-print head is measured according to claim 8, it is characterized in that, have a temperature sensing electrode contact at least, identical at the contact number of the maximum number of the measurable heating element heater of synchronization and temperature sensing electrode.
11. the method that the temperature of each heating element heater of ink jet-print head is measured, it may further comprise the steps:
(i) below the heating element heater or near making temperature sensing resistance;
(ii) make a termination semiconductor of described temperature sensing resistance, the other end with link to each other with temperature sensing electrode contact that printer joins, make the semi-conductive other end receive the power electrode end points, when semiconductor conducting and power electrode end points ground connection, promptly have a loop to form through heating element heater;
(iii) for each temperature sensing resistance, its corresponding semiconductor is received different semiconductor actuating switch contacts and is received the power electrode contact through heating element heater with matrix structure, wherein, each only can constitute one from the temperature sensing electrode contact to semiconductor actuating switch contact and power electrode contact, through temperature sensing resistance, receive the loop on ground then; And
(iv), on the temperature sensing electrode contact, can measure the resistance of specified temp sensing resistor, thereby learn the temperature of heating element heater by selection to semiconductor actuating switch contact and power electrode contact.
12. the method that each temp of heating element of ink jet-print head is measured according to claim 11 is characterized in that the resistance of described temperature measuring resistors when room temperature is more than 50 ohm.
13. the method that each temp of heating element of ink jet-print head is measured according to claim 11, it is characterized in that, have a temperature sensing electrode contact at least, identical at the contact number of the maximum number of the measurable heating element heater of synchronization and temperature sensing electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001008978A CN1175975C (en) | 2000-02-18 | 2000-02-18 | Ink-jet printing head able to accurately measure temp of heating element and its measuring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001008978A CN1175975C (en) | 2000-02-18 | 2000-02-18 | Ink-jet printing head able to accurately measure temp of heating element and its measuring method |
Publications (2)
| Publication Number | Publication Date |
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| CN1309020A CN1309020A (en) | 2001-08-22 |
| CN1175975C true CN1175975C (en) | 2004-11-17 |
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| CNB001008978A Expired - Fee Related CN1175975C (en) | 2000-02-18 | 2000-02-18 | Ink-jet printing head able to accurately measure temp of heating element and its measuring method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW479022B (en) | 2000-08-29 | 2002-03-11 | Acer Peripherals Inc | Drive circuit of ink-jet head with temperature detection function |
| CA2602714C (en) * | 2005-04-04 | 2013-07-30 | Silverbrook Research Pty Ltd | Mems fluid sensor |
| JP4890960B2 (en) * | 2006-06-19 | 2012-03-07 | キヤノン株式会社 | Recording device |
| US7802866B2 (en) * | 2006-06-19 | 2010-09-28 | Canon Kabushiki Kaisha | Recording head that detects temperature information corresponding to a plurality of electro-thermal transducers on the recording head and recording apparatus using the recording head |
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2000
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