CN117580311A - Heat dissipation device and control method for surface temperature of circuit board - Google Patents
Heat dissipation device and control method for surface temperature of circuit board Download PDFInfo
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- CN117580311A CN117580311A CN202210953195.6A CN202210953195A CN117580311A CN 117580311 A CN117580311 A CN 117580311A CN 202210953195 A CN202210953195 A CN 202210953195A CN 117580311 A CN117580311 A CN 117580311A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000000903 blocking effect Effects 0.000 claims abstract description 10
- 238000007664 blowing Methods 0.000 claims abstract description 10
- 238000004590 computer program Methods 0.000 claims description 13
- 238000011144 upstream manufacturing Methods 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 25
- 230000007797 corrosion Effects 0.000 abstract description 25
- 238000004891 communication Methods 0.000 abstract description 21
- 239000000428 dust Substances 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 238000005536 corrosion prevention Methods 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 6
- 239000007789 gas Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 4
- 239000007787 solid Substances 0.000 abstract description 4
- 230000002265 prevention Effects 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 12
- 230000006870 function Effects 0.000 description 11
- 238000009833 condensation Methods 0.000 description 10
- 230000005494 condensation Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000002918 waste heat Substances 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
Abstract
The embodiment of the invention provides a heat dissipation device and a control method of surface temperature of a circuit board. The device comprises: the heat dissipation structure is arranged above the circuit board in parallel and is used for dissipating heat of components on the circuit board; and the wind shielding structure is arranged in the air inlet area of the circuit board and used for blocking air flow directly blowing to the surface of the circuit board and guiding the air flow to the surface of the heat dissipation structure. According to the invention, the heat dissipation structure is arranged on the circuit board to dissipate heat of the circuit board, and meanwhile, the wind shielding structure is also arranged to block the air flow directly blowing the surface of the circuit board, so that the surface of the circuit board is prevented from generating a water film and accumulating dust, and corrosive gases, liquids and solid particles are prevented from invading the core functional circuit board and components of the communication equipment. Therefore, the problem that heat dissipation of the circuit board can be affected when the circuit board is subjected to corrosion prevention and water prevention through a sealing technology in the related technology can be solved, and the effect of reducing the corrosion risk of the circuit board is achieved.
Description
Technical Field
The embodiment of the invention relates to the technical field of corrosion prevention of circuit boards of communication network equipment, in particular to a heat dissipation device and a control method of surface temperature of a circuit board.
Background
Communication network equipment is usually installed in a machine room or a cabinet, and is composed of a cabinet and a circuit board installed in the cabinet to realize various functions, wherein the circuit board is composed of a printed circuit board, components, structural members and the like, and a lot of metal materials are inevitably used in the structures. Components on the circuit board, such as various chips, module power supplies and optical modules, emit a large amount of heat during operation, and in order to ensure reliable operation of the circuit board, a forced air cooling mode is the most economical and widely used mode for meeting the junction temperature requirements of the components.
Along with the continuous expansion of equipment application scenes, more and more communication network equipment is installed in places with uncontrolled humiture (such as a garage, a corridor, a direct ventilation cabinet and a simple machine room), even if the equipment is installed in an air conditioner room with controlled humiture, an air conditioner outdoor cabinet and a heat exchange cabinet, because the air conditioner and the heat exchange fan are poor in use reliability in an outdoor environment, the bad machine rate is very high, the air conditioner can not be timely maintained after being damaged, the cabinet door is often directly opened for heat dissipation, so that the original humiture-controlled machine room and the cabinet also become the simple machine room with uncontrolled humiture and dust, the machine room and the cabinet lose the effect of protecting a circuit board under the scenes, dust, high-humidity air, condensation, corrosive gas are introduced under the driving of a cooling fan, the circuit board is corroded, and the like are invalid, the reliability of the communication network equipment is affected, and huge economic loss is brought.
To address this problem, corrosion protection and water protection schemes commonly employed by existing designs include: the control circuit board is sealed in the protective shell, and the technology can isolate the surface of the single board from the air of the external environment, so that the humidity of the surface of the single board is prevented from being influenced by the air of the external environment as much as possible. However, the volume of the control circuit board is increased by the mode, so that the compact design is not facilitated, and the technical cost of the sealing technology is high; meanwhile, the heat dissipation of the circuit board is directly affected by sealing, and if the temperature of the circuit board is high in the daytime, the temperature of the circuit board may be too high, so that the single board can be caused to be abnormal.
Disclosure of Invention
The embodiment of the invention provides a heat dissipation device and a control method of the surface temperature of a circuit board, which are used for at least solving the problem that the heat dissipation of the circuit board is affected by corrosion resistance and water resistance of the circuit board through a sealing technology in the related technology.
According to an embodiment of the present invention, there is provided a heat dissipating device applied to a circuit board mounted to a chassis, including: the heat dissipation structure is arranged above the circuit board in parallel and is used for dissipating heat of components on the circuit board; and the wind shielding structure is arranged in the air inlet area of the circuit board and used for blocking air flow directly blowing to the surface of the circuit board and guiding the air flow to the surface of the heat dissipation structure.
In one exemplary embodiment, the heat dissipating structure and the wind shielding structure are a unitary structure or the heat dissipating structure and the wind shielding structure are separate structures.
In one exemplary embodiment, further comprising: the wind shielding structure is vertically arranged at the part of the circuit board located at the air inlet, and the wind shielding structure is tightly attached to the part of the circuit board located at the air inlet.
In one exemplary embodiment, further comprising: the wind shielding structure is vertically arranged at the part of the circuit board, which is positioned at the air inlet and the air outlet, and the wind shielding structure is tightly attached to the part of the circuit board, which is positioned at the air inlet.
In one exemplary embodiment, further comprising: the wind shielding structure is vertically arranged around the circuit board.
In one exemplary embodiment, further comprising: the heat dissipation structure is arranged on the front surface and the back surface of the circuit board in parallel, wherein the heat dissipation structure arranged on the front surface of the circuit board partially covers the front surface of the circuit board, and the heat dissipation structure arranged on the back surface of the circuit board completely or partially covers the back surface of the circuit board.
In one exemplary embodiment, further comprising: in the case where multiple circuit boards are installed in the chassis, the scattering structure is disposed on the circuit board upstream of the jack box or chassis air duct.
In one exemplary embodiment, wherein the material of the wind shielding structure is one of: metal, ceramic, plastic.
In one exemplary embodiment, wherein the wind shielding structure includes: the wind shielding surface is perpendicular to the circuit board and is used for blocking air flow directly blowing to the surface of the circuit board; and the air channel surface is parallel to the circuit board and is used for guiding the air flow to the surface of the heat dissipation structure.
In one exemplary embodiment, the wind shielding structure is L-shaped or U-shaped.
In one exemplary embodiment, the wind blocking surface is provided with a plurality of holes.
According to another embodiment of the present invention, there is provided a control method of a surface temperature of a circuit board, including: monitoring the ambient temperature value T at the air inlet in Surface temperature value T of the circuit board on Air temperature value T of exhaust duct of heat radiation structure out The method comprises the steps of carrying out a first treatment on the surface of the By adjusting the rotation speed of the fan to make T on And T is in Is greater than a first threshold, and T out And T is in Is greater than a second threshold.
According to a further embodiment of the invention, there is also provided a computer readable storage medium having stored therein a computer program, wherein the computer program is arranged to perform the steps of any of the method embodiments described above when run.
According to a further embodiment of the invention, there is also provided an electronic device comprising a memory having stored therein a computer program and a processor arranged to run the computer program to perform the steps of any of the method embodiments described above.
According to the invention, the heat dissipation structure is arranged on the circuit board to dissipate heat of the circuit board, and meanwhile, the wind shielding structure is also arranged to block the air flow directly blowing the surface of the circuit board, so that the surface of the circuit board is prevented from generating a water film and accumulating dust, and corrosive gases, liquids and solid particles are prevented from invading the core functional circuit board and components of the communication equipment. Therefore, the problem that heat dissipation of the circuit board can be affected when the circuit board is subjected to corrosion prevention and water prevention through a sealing technology in the related technology can be solved, and the effect of reducing the corrosion risk of the circuit board is achieved.
Drawings
FIG. 1 is a block diagram of a heat sink according to an embodiment of the present invention;
FIG. 2 is a flow chart of a method of controlling the surface temperature of a circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a chassis structure according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a heat dissipation structure for a circuit board in a chassis according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an air duct in a chassis according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a heat dissipation structure within a chassis covering a circuit board according to an embodiment of the present invention;
fig. 7 is a flowchart of a control method of a surface temperature of a circuit board according to another embodiment of the present invention.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings in conjunction with the embodiments.
An embodiment of the present invention proposes a heat dissipating device applied to a circuit board in an enclosure or a case of a communication device, and fig. 1 is a block diagram of a heat dissipating device according to an embodiment of the present invention, as shown in fig. 1, where the heat dissipating device includes: a heat dissipating structure 101 and a wind shielding structure 102.
The heat dissipation structure 101 is arranged above the circuit board in parallel and is used for dissipating heat of components on the circuit board;
and the wind shielding structure 102 is arranged in the air inlet area of the circuit board and used for blocking air flow directly blowing to the surface of the circuit board and guiding the air flow to the surface of the heat dissipation structure.
In an exemplary embodiment, the heat dissipating structure 101 and the wind shielding structure 102 are a unitary structure, or the heat dissipating structure 101 and the wind shielding structure 102 are separate structures.
In one exemplary embodiment, further comprising: the wind shielding structure 102 is vertically arranged at the part of the circuit board located at the air inlet, and the wind shielding structure 102 is tightly attached to the part of the circuit board located at the air inlet.
In one exemplary embodiment, further comprising: the wind shielding structure 102 is vertically arranged at the part of the circuit board located at the air inlet and the air outlet, and the wind shielding structure 102 is tightly attached to the part of the circuit board located at the air inlet.
In one exemplary embodiment, further comprising: the wind shielding structure 102 is vertically disposed around the circuit board.
In one exemplary embodiment, further comprising: the heat dissipation structure 101 is disposed in parallel on the front surface and the back surface of the circuit board, wherein the heat dissipation structure 101 disposed on the front surface of the circuit board partially covers the front surface of the circuit board, and the heat dissipation structure 101 disposed on the back surface of the circuit board completely or partially covers the back surface of the circuit board.
In one exemplary embodiment, further comprising: in the case where a plurality of circuit boards are installed in the chassis, the scattering structure 101 is disposed on the circuit board upstream of the jack box or the chassis air duct.
In one exemplary embodiment, the material of the wind shielding structure 102 is one of the following: metal, ceramic, plastic.
In one exemplary embodiment, the wind shielding structure 102 includes: the wind shielding surface is perpendicular to the circuit board and is used for blocking air flow directly blowing to the surface of the circuit board; and the air channel surface is parallel to the circuit board and is used for guiding the air flow to the surface of the heat dissipation structure.
In one exemplary embodiment, the wind shielding structure 102 is L-shaped or U-shaped.
In one exemplary embodiment, the windshield is provided with a plurality of apertures.
Through the embodiment, as the heat dissipation structure is arranged on the circuit board to dissipate heat of the circuit board, and meanwhile, the wind shielding structure is also arranged to block the air flow directly blowing the surface of the circuit board, so that the surface of the circuit board is prevented from generating water films and accumulating dust, and corrosive gases, liquids and solid particles are prevented from invading the core functional circuit board and components of the communication equipment. Therefore, the problem that heat dissipation of the circuit board can be affected when the circuit board is subjected to corrosion prevention and water prevention through a sealing technology in the related technology can be solved, and the effect of reducing the corrosion risk of the circuit board is achieved.
In this embodiment, a method for controlling a surface temperature of a circuit board based on a heat dissipating device is provided, and fig. 2 is a flowchart of a method for controlling a surface temperature of a circuit board according to an embodiment of the present invention, as shown in fig. 2, the flowchart includes the following steps:
step S202, monitoring an ambient temperature value Tin at the air inlet, a surface temperature value Ton of the circuit board and an air temperature value Tout of an exhaust duct of the heat dissipation structure;
in step S204, the rotation speed of the fan is adjusted such that the temperature difference between Ton and Tin is greater than the first threshold value, and the temperature difference between Tout and Tin is greater than the second threshold value.
Through the steps, the working waste heat of the circuit board is utilized, and the temperature, the relative humidity and the trend of cooling airflow in the plug box or the chassis equipment are controlled by virtue of the heat dissipation structure with the wind shielding device, so that the corrosion risk of the circuit board can be further reduced.
From the description of the above embodiments, it will be clear to a person skilled in the art that the method according to the above embodiments may be implemented by means of software plus the necessary general hardware platform, but of course also by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (e.g. Read-Only Memory/Random Access Memory, ROM/RAM), magnetic disk, optical disk) comprising instructions for causing a terminal device (which may be a mobile phone, a computer, a server, or a network device, etc.) to perform the method according to the embodiments of the present invention.
In order to facilitate understanding of the technical solutions provided by the present invention, the following details will be described in connection with embodiments of specific scenarios.
An embodiment of the invention provides a heat dissipation system of a communication equipment plug box or chassis, the communication equipment plug box or chassis, and fig. 3 is a schematic diagram of a chassis structure according to an embodiment of the invention, in this embodiment, a water film can be prevented from being generated on a surface of a circuit board in the communication equipment plug box or chassis by the heat dissipation system, dust is accumulated, and corrosive gas, liquid and solid particles are prevented from invading a core function circuit board and components of the communication equipment.
Specifically, a heat dissipation system of a communications device jack or chassis includes: the front and back sides of the circuit board installed in the jack box or the chassis are provided with the heat dissipation structure with the wind shielding function device (i.e. wind shielding device), and fig. 4 is a schematic diagram of the heat dissipation structure of the circuit board in the chassis according to the embodiment of the invention.
Fig. 5 is a schematic view of an air duct in a chassis according to an embodiment of the present invention, and as shown in fig. 5, a fan is disposed at one end of the chassis, and the fan guides cooling air from one end of the chassis to the other end. In this embodiment, the wind shielding function device of the heat dissipation structure is disposed in the air inlet area of the circuit board, and the wind shielding function device is closely attached to the circuit board, so as to block the air blown out from the cooling fan from directly and quickly flowing to the surface of the circuit board, where the wind shielding function device is functionally equivalent to the wind shielding structure in the above embodiment; the heat dissipation structure covers the whole circuit board area, so that the air duct for cooling air can conveniently walk on the surface of the heat dissipation structure, but not on the surface of the circuit board, as shown in fig. 6; the heat radiation structure is used as a common heat radiator of the heating device on the circuit board, waste heat generated by the operation of the circuit board is uniformly and quickly transmitted to each position of the heat radiator by means of the quick heat transmission capability of the heat radiator, the temperature rise of the heat radiator is integrally improved, the temperature rise of air in an inner space between the heat radiator and the circuit board is improved, the relative humidity of the air in the inner space is further reduced, and the corrosion risk of the circuit board is further reduced.
In one exemplary embodiment, the wind deflector and the heat dissipation structure are preferably designed as a unitary structure.
In an exemplary embodiment, in order to further reduce the air flow speed on the surface of the circuit board, besides the wind shielding device closely attached to the circuit board in the air inlet area, the wind shielding device may be simultaneously arranged at the air outlet, and the wind shielding device may also be arranged around the circuit board, so as to reduce the wind speed on the surface of the circuit board and the external air entering to the greatest extent.
In one exemplary embodiment, the wind shield and the heat dissipation structure may also be designed as discrete structures according to actual needs.
In one exemplary embodiment, the wind shielding device may be made of various materials such as metal, ceramic, plastic, glue, etc., and is matched with a heat dissipation structure to prevent cooling air from the cooling fan from directly flowing through the surface of the circuit board at a high wind speed.
In one exemplary embodiment, the wind shield is a thick metal plate that is resistant to corrosion.
In one exemplary embodiment, the circuit board may be provided with heat dissipating structures on both sides, the heat dissipating structures being sized as large as or close to the circuit board, preferably to completely cover all devices, lines, and vias of the circuit board.
In an exemplary embodiment, when the heat generated by the operation of the circuit board is large enough, the size of the heat dissipation structure can be reduced according to the requirement to reduce the cost, and the complexity of the internal structure of the chassis is reduced, so that the whole circuit board is not required to be provided with the heat dissipation structure, the heat dissipation structure with the wind shielding function device is only required to be arranged at the air inlet of the circuit board and the upstream of the air channel, the circuit board at the upstream of the air channel is protected by the heat dissipation structure, the circuit board at the downstream of the air channel is protected by the heated air, the temperature rise of the air flowing through the heat dissipation structure and the heat dissipation structure after heat exchange is separated from the heat dissipation structure reaches the target value, and researches show that the temperature rise of the circuit board exceeds 10 degrees, and the corrosion can be effectively prevented.
In an exemplary embodiment, when a plurality of circuit boards are installed in a chassis or an insertion box, a heat dissipation structure with a wind shielding function device can be arranged on the circuit board at the upstream of the air duct according to requirements so as to reduce cost and complexity of the internal structure of the chassis, and therefore, all the circuit boards are not required to be provided with the heat dissipation structure, the heat dissipation structure with the wind shielding function device only needs to be arranged at the air inlet of the circuit board at the upstream of the air duct and the upstream of the air duct, the circuit board at the upstream of the air duct is protected by the heat dissipation structure, the circuit board at the downstream of the air duct is protected by heated air, and the temperature rise of the air flowing through the heat dissipation structure and the heat dissipation structure is guaranteed to reach a target value after heat exchange of the air and the heat dissipation structure is separated from the heat dissipation structure.
In this embodiment, the circuit board provided with the heat dissipation structure with the wind shielding device is placed at the air inlet of the air duct, or the circuit board only locally sets the heat dissipation structure with the wind shielding device on the circuit board at the upstream of the air duct, which is beneficial to improving the overall temperature rise of the chassis and the corrosion resistance of the whole chassis. The heat generated by the heating device on the circuit board is uploaded to the wind shielding device from the device through the heat conducting medium.
In this embodiment, when a plurality of circuit boards are disposed in the chassis of the communication device, the circuit board wind shielding device at the upstream of the air duct uniformly radiates heat, so that air with uniform temperature rise can be provided for the circuit board at the downstream, thereby reducing the humidity of the air at the surface of the circuit board at the downstream and reducing the corrosion risk of the circuit board at the downstream. The wind shielding device on the circuit board not only plays a role in corrosion prevention of the circuit board, but also can be used as a radiator of the circuit board to help the circuit board to radiate heat, and can also uniformly improve the temperature rise of the whole equipment, protect the circuit board at the downstream of the air duct from corrosion and insulation reduction caused by wet dust, and is beneficial to reducing the corrosion prevention cost of the circuit board at the downstream, so that the circuit board at the downstream is likely to be sprayed with a conventional three-proofing coating or is not sprayed with the three-proofing coating, and the corrosion protection requirement can be met.
In one exemplary embodiment, a heat dissipating structure includes: an L-shaped or U-shaped wind shielding device covering the mounting surface of the circuit board, wherein the wind shielding device at least comprises 2 surfaces: the side surface is a wind shielding surface for preventing the wind flow blown out by the fan from directly facing the surface of the circuit board; the plane is an air channel surface, and the air flow direction is guided and changed, so that the air is guided and blown to the downstream of the heat dissipation structure. The heat radiation structure is assembled on the circuit board, the circuit board is positioned on the leeward surface, the wind speed on the surface of the circuit board tends to be in a natural heat radiation state, the influence of air flow on the PCB is limited, and the corrosion of the PCB is reduced.
In one exemplary embodiment, small holes may be formed in the wind shielding surface, and the wind speed to be passed through the surface of the PCB may be reduced by the small holes, so that the high-speed wind blown out by the fan may be converted into the low-speed wind when passing through the surface of the PCB.
In one exemplary embodiment, the wind shielding surface of the wind shielding device is arranged at the air inlet of the circuit board to prevent air accelerated by the fan from entering the circuit board, so that the surface of the circuit board under the protection of the wind shielding device is kept in a natural heat dissipation state, and devices on the surface of the circuit board are positioned on the leeward surface; the air channel surface of the wind shielding device is parallel to the surface of the circuit board, air flows through the wind shielding device, heat generated by the work of the circuit board is taken away, and heat dissipation teeth can be arranged according to requirements; and heat absorption and heat dissipation can be carried out between the circuit board and the wind shielding device by adopting a heat conduction material according to the requirement, and the wind shielding device is used as a common radiator of a plurality of heating devices on the circuit board.
In one exemplary embodiment, functional components are disposed on the front and back surfaces of the circuit board, and the components are interconnected by solder joints, traces and vias.
In an exemplary embodiment, when the circuit board is provided with the wind shielding device on two sides, the wind shielding device can shield the wind of the equipment system, which can affect the heat dissipation of the whole equipment, at this time, the front surface cannot be provided with a complete wind shielding device due to ventilation and heat dissipation requirements, so that the wind shielding device can only be provided with a partial wind shielding device on the front surface, and a partial or complete wind shielding device can be provided on the back surface. In this scenario, it is preferable to transfer devices that are susceptible to corrosion and have poor self-protection capability, such as small-sized chip devices, closely spaced devices, and critical devices, to the back side of the PCB. The front surface of the PCB is provided with a device with strong self corrosion resistance or a certain heating and temperature rising device, such as an MOS tube and a plug-in device.
In one exemplary embodiment, the circuit board is inserted into the chassis slot using a PCB edge.
It should be noted that, in the embodiment of the invention, the wind blown out from the fan of the equipment cabinet has uneven wind speed at the air inlet of the circuit board at the air outlet of the fan, the wind speed at the center of the air duct is large, and the risk of corrosiveness of the air inlet of the circuit board is greatest when the heat dissipation structure is not provided. Therefore, the heat dissipation structure with the wind shielding device is arranged, on one hand, the wind with lower temperature and higher humidity blown out by the fan from the chassis can be prevented from being directly blown to the circuit board at the air inlet of the circuit board; on the other hand, the air speed is reduced and the air quantity at each position is more uniform by friction and blocking through the heat radiation structure and the air at the air inlet.
In the embodiment of the invention, the heat dissipation structure with the wind shielding function device does not block the equipment air duct, so that the wind originally blown to the surface of the circuit board is blown to the surface of the heat dissipation structure, the wind speed of the surface of the air-cooled circuit board is reduced, the heat exchange speed of the surface of the circuit board is reduced, the surface humidity of the circuit board is reduced, and meanwhile, the accumulation of pollutants such as dust, salt fog, oil stains and the like on the surface of the circuit board is reduced, so that the condensation and corrosion risk of the circuit board are reduced. In addition, the heat radiation system and the communication equipment are simple in structure, free of extra consumable, low in energy consumption, environment-friendly, beneficial to reducing manufacturing cost, capable of effectively reducing relative humidity of air blown to the circuit board, beneficial to improving operation reliability of the communication equipment and reducing failure opportunities of the communication equipment.
Research experiments show that in environments with high salt pollution and high relative humidity, circuit boards of electronic equipment such as communication equipment and the like can be corroded rapidly, so that the circuit boards lose communication functions; in order to improve the operational reliability of the communication devices, it is necessary to prevent the relative humidity from being lowered and to prevent the circuit board from being affected by condensation by dust pollution. The condensation is a necessary condition for generating corrosion of the circuit board, and is related to pollution to electronic devices such as the circuit board, and the failure of the electronic device caused by environmental corrosion can be avoided by trying to block the condition for generating the condensation.
Taking sodium chloride (one of the most common contaminant contaminations) as an example:
even circuit board surfaces that meet all electronic assembly factory standards will condense in environments with high relative humidity (greater than 85% rh). A large amount of contaminants carried by the cooling fan are deposited on the circuit board that is in long-term operation, thereby forming a highly contaminated circuit board on which visible condensation is generated even if the ambient relative humidity is less than 65% rh, whereas at a relative humidity greater than 75% rh, visible condensation is generated on the surface of the circuit board at all contamination levels.
Researches show that the condensation phenomenon can be controlled by strictly controlling the pollution degree and the relative humidity of the surface of the circuit board. The heat dissipation system can be used for cooling the circuit board and reducing the environmental pollution and relative mixing degree born by the circuit board, so that the generation of condensation is effectively prevented. Industry standards also indicate that corrosion can be effectively prevented as long as the ambient humidity is below 40% RH.
According to the relation between the temperature and the humidity, the surface humidity of the single board can be maintained within an allowable range as long as the surface temperature of the circuit board is ensured to be higher than the external environment temperature by a certain temperature range, and the environmental adaptability of the circuit board is improved.
The heat radiation structure with the wind shielding device can effectively improve the temperature rise of the circuit board, reduce the humidity of the circuit board, reduce the cooling wind speed and dust accumulation on the surface of the circuit board and effectively inhibit the corrosion factor of the circuit board.
FIG. 7 is a method for controlling the temperature, relative humidity, and cooling air flow direction of the air in an enclosure or housing by means of a heat dissipation structure with a wind shielding device, depending on the residual heat of the circuit board itself, according to an embodiment of the present invention. In the method, the wind shielding device is made of metal, so that the heat generated by the operation of the circuit board can be rapidly dispersed to the surface of the whole wind shielding device, the temperature of air in a cavity formed by combining the wind shielding device and the circuit board can be uniformly increased, the relative humidity of the air in the cavity is further reduced, the temperature rise of the surface of the circuit board is increased, and the purpose of corrosion prevention of the circuit board and the wind shielding device is achieved. The temperature rise of the surface of the circuit board is controlled, so that the relative humidity of the surface of the single board is controlled, and the problem that the metal part of the existing circuit board is easy to corrode when the circuit board operates in a severe environment is solved.
As shown in fig. 7, the method includes the steps of:
in step S702, a heat dissipation structure is disposed on the surface of the circuit board, and the heat dissipation structure absorbs the working waste heat of the circuit board to raise the overall temperature of the equipment cabinet.
In this embodiment, the heat dissipation structure covers a portion of the circuit board.
In step S704, temperature detection points are set on the circuit board and the heat dissipation structure, and temperature comparison is performed.
Specifically, the ambient temperature value T at the air inlet of the chassis device is monitored in Surface temperature value T of circuit board on Air temperature value T of air duct of exhaust heat dissipation structure out ；
Control circuit analysis and comparison T in 、T on 、T out Let Δt1=t on -T in ，ΔT2＝T out -T in Are always greater than the target value.
Research shows that when the temperature rise of the circuit board is more than 3 degrees, the condensation can be effectively avoided, and when the temperature rise of the circuit board is more than 10 degrees, the corrosion can be effectively avoided.
Step S706, controlling the rotation speed of the fan device of the chassis according to the comparison result.
In an exemplary embodiment, when the heat dissipation structure covers the whole circuit board, only the ambient temperature value T at the air inlet is detected and compared in Surface temperature value T of circuit board on And adjusting the wind speed according to the comparison result to ensure that the surface temperature rise of the circuit board reaches the target value.
In the embodiment of the invention, the heat radiating structure on the circuit board is combined, the heating device on the circuit board transmits heat to the heat radiating structure made of the upper metal material through the heat conducting material such as the heat conducting pad, the heat conducting glue and the like to radiate, and the heat radiating structure can rapidly disperse the heat generated by the working of the circuit board to the surface of the whole heat radiating structure, so that the temperature of the air in the cavity formed by combining the heat radiating structure and the circuit board can be uniformly increased, the relative humidity of the air in the cavity is further reduced, the temperature rise of the surface of the circuit board is increased, and the purpose of corrosion resistance of the circuit board and the wind shielding device is achieved. When a plurality of circuit boards are arranged in the case of the communication equipment, the heat which is evenly emitted by the circuit board heat-radiating structure at the upstream of the air duct can provide air with even temperature rise for the circuit boards at the downstream, so that the humidity of the air at the surface of the circuit boards at the downstream is reduced, the corrosion risk of the circuit boards at the downstream is reduced, and the corrosion protection process and cost of the circuits at the downstream of the air duct of the case equipment are further reduced.
Embodiments of the present invention also provide a computer readable storage medium having a computer program stored therein, wherein the computer program is arranged to perform the steps of any of the method embodiments described above when run.
In one exemplary embodiment, the computer readable storage medium may include, but is not limited to: a usb disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing a computer program.
An embodiment of the invention also provides an electronic device comprising a memory having stored therein a computer program and a processor arranged to run the computer program to perform the steps of any of the method embodiments described above.
In an exemplary embodiment, the electronic apparatus may further include a transmission device connected to the processor, and an input/output device connected to the processor.
Specific examples in this embodiment may refer to the examples described in the foregoing embodiments and the exemplary implementation, and this embodiment is not described herein.
It will be appreciated by those skilled in the art that the modules or steps of the invention described above may be implemented in a general purpose computing device, they may be concentrated on a single computing device, or distributed across a network of computing devices, they may be implemented in program code executable by computing devices, so that they may be stored in a storage device for execution by computing devices, and in some cases, the steps shown or described may be performed in a different order than that shown or described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple modules or steps of them may be fabricated into a single integrated circuit module. Thus, the present invention is not limited to any specific combination of hardware and software.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the principle of the present invention should be included in the protection scope of the present invention.
Claims (14)
1. A heat sink, for use with a circuit board mounted to a chassis, comprising:
the heat dissipation structure (101) is arranged above the circuit board in parallel and is used for dissipating heat of components on the circuit board;
and the wind shielding structure (102) is arranged in the air inlet area of the circuit board and used for blocking air flow directly blowing to the surface of the circuit board and guiding the air flow to the surface of the heat dissipation structure.
2. The heat sink according to claim 1, wherein the heat dissipating structure (101) and the wind shielding structure (102) are a unitary structure or the heat dissipating structure (101) and the wind shielding structure (102) are separate structures.
3. The heat sink of claim 1, further comprising:
the wind shielding structure (102) is vertically arranged at the part of the circuit board located at the air inlet, and the wind shielding structure (102) is tightly attached to the part of the circuit board located at the air inlet.
4. The heat sink of claim 1, further comprising:
the wind shielding structure (102) is vertically arranged at the part of the circuit board, which is positioned at the air inlet and the air outlet, and the wind shielding structure (102) is tightly attached to the part of the circuit board, which is positioned at the air inlet.
5. The heat sink of claim 1, further comprising:
the wind shielding structure (102) is vertically arranged around the circuit board.
6. The heat sink of claim 1, further comprising:
the heat dissipation structure (101) is arranged on the front surface and the back surface of the circuit board in parallel, wherein the heat dissipation structure (101) arranged on the front surface of the circuit board partially covers the front surface of the circuit board, and the heat dissipation structure (101) arranged on the back surface of the circuit board completely or partially covers the back surface of the circuit board.
7. The heat sink of claim 1, further comprising:
in the case of multiple circuit boards mounted in the chassis, the scattering structure (101) is disposed on the circuit board upstream of the jack box or chassis air duct.
8. The heat sink according to claim 1, wherein the material of the wind shielding structure (102) is one of the following: metal, ceramic, plastic.
9. The heat sink according to claim 1, wherein the wind shielding structure (102) comprises:
the wind shielding surface is perpendicular to the circuit board and is used for blocking air flow directly blowing to the surface of the circuit board;
and the air channel surface is parallel to the circuit board and is used for guiding the air flow to the surface of the heat dissipation structure.
10. The heat sink according to claim 9, wherein the wind shielding structure (102) is L-shaped or U-shaped.
11. The heat sink of claim 9, wherein the wind blocking surface is provided with a plurality of holes.
12. A method for controlling the surface temperature of a circuit board, which is applied to the heat dissipation structure as claimed in any one of claims 1 to 11, comprising:
monitoring the ambient temperature value T at the air inlet in Surface temperature value T of the circuit board on Air temperature value T of exhaust duct of heat radiation structure out ；
By adjusting the rotation speed of the fan to make T on And T is in Is greater than a first threshold, and T out And T is in Is greater than a second threshold.
13. A computer readable storage medium, characterized in that the computer readable storage medium has stored therein a computer program, wherein the computer program, when being executed by a processor, realizes the steps of the method as claimed in claim 12.
14. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the steps of the method as claimed in claim 12 when executing the computer program.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210953195.6A CN117580311A (en) | 2022-08-08 | 2022-08-08 | Heat dissipation device and control method for surface temperature of circuit board |
| PCT/CN2023/111815 WO2024032630A1 (en) | 2022-08-08 | 2023-08-08 | Heat dissipation device and method for controlling surface temperature of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210953195.6A CN117580311A (en) | 2022-08-08 | 2022-08-08 | Heat dissipation device and control method for surface temperature of circuit board |
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| CN117580311A true CN117580311A (en) | 2024-02-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210953195.6A Pending CN117580311A (en) | 2022-08-08 | 2022-08-08 | Heat dissipation device and control method for surface temperature of circuit board |
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| Country | Link |
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| CN (1) | CN117580311A (en) |
| WO (1) | WO2024032630A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201115064Y (en) * | 2007-09-21 | 2008-09-10 | 中兴通讯股份有限公司 | A machine cabinet |
| CN102467199A (en) * | 2010-11-16 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN108401401B (en) * | 2018-04-03 | 2020-02-04 | 上海斐讯数据通信技术有限公司 | Air-cooled heat dissipation device, heat dissipation method and electronic equipment |
| CN111386003B (en) * | 2018-12-29 | 2022-10-11 | 中兴通讯股份有限公司 | Heat dissipation method of electronic equipment and electronic equipment |
| US11234342B2 (en) * | 2019-10-15 | 2022-01-25 | Cisco Technology, Inc. | Corrosion preventive heatsink for network device |
| CN113038781A (en) * | 2019-12-09 | 2021-06-25 | 清能德创电气技术（北京）有限公司 | Servo driver with independent air duct structure |
| CN212970620U (en) * | 2020-10-19 | 2021-04-13 | 深圳市浩湖网络技术有限公司 | Switch |
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- 2022-08-08 CN CN202210953195.6A patent/CN117580311A/en active Pending
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| WO2024032630A1 (en) | 2024-02-15 |
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