CN117579917A - AF subassembly, module and intelligent terminal make a video recording - Google Patents

Abstract

The application provides an AF component which is used for a camera module and comprises an AF stator part and an AF rotor part, wherein the AF stator part comprises a top plate, a bracket and a guide rod connected between the top plate and the bracket, and the guide rod is used for being matched with an image sensing component of the camera module so as to movably mount the image sensing component between the top plate and the bracket; the AF rotor part is arranged on the chip carrier, and the AF component is used for driving the AF rotor part and the image sensing component to move along the guide rod relative to the AF stator part so as to realize AF. The application also provides a camera module with the AF component and an intelligent terminal.

Description

AF subassembly, module and intelligent terminal make a video recording

Technical Field

The application belongs to the technical field of shooting, and particularly relates to an AF assembly, a shooting module with the AF assembly and an intelligent terminal.

Background

Nowadays, various intelligent terminals, such as mobile phones, tablet computers, etc., are usually built with a camera module. Such built-in camera modules are generally configured with a voice coil motor for driving a lens assembly thereof to move so as to implement an Auto Focus (AF) function and an optical anti-shake (Optical Image Stabilization, OIS) function.

In the existing built-in camera module of the intelligent terminal, in order to apply the power of the voice coil motor to the lens assembly, a corresponding AF driving mechanism and OIS driving mechanism are generally required to be respectively arranged, and at least a part of the two driving mechanisms are fixedly connected with the lens assembly for transmission. Thus, when the lens assembly is driven by the AF driving mechanism to realize AF, the lens assembly and at least a part of OIS driving mechanism connected with the lens assembly need to be driven to move simultaneously; when the lens assembly is driven by the OIS driving mechanism to realize anti-shake, it is also necessary to simultaneously drive the lens assembly and at least a part of the AF driving mechanism connected thereto to move. This causes additional load to the voice coil motor, further increasing the power consumption, and further increasing the inertia that needs to be overcome when driving the lens assembly.

Furthermore, the specific connection structure of the AF driving mechanism and the OIS driving mechanism in the prior art is generally complex, and the implementation is complex, and the assembly is time-consuming and labor-consuming, no matter the connection structure is a mechanical transmission connection structure or an electrical conduction connection structure.

Therefore, it is necessary to provide an AF assembly with a more novel structure, and a camera module and an intelligent terminal having the AF assembly, so as to solve the above-mentioned drawbacks of the prior art, obtain a better shooting effect, reduce energy consumption, and simplify a specific connection structure of the camera module.

Disclosure of Invention

Based on the above-mentioned problem among the prior art, the aim of the present application is to provide an AF subassembly and have module and intelligent terminal of making a video recording of this AF subassembly, and it compares in prior art and can reduce the load when focusing and anti-shake operation, improves the shooting effect, reduces the energy consumption to simplify the concrete connection structure of module of making a video recording.

In order to solve the above problems, an embodiment of an aspect of the present application provides an AF assembly for an image pickup module, the AF assembly including an AF stator portion and an AF mover portion, the AF stator portion including a top plate, a bracket, and a guide bar connected between the top plate and the bracket, the guide bar being for cooperating with an image sensing assembly of the image pickup module to movably mount the image sensing assembly between the top plate and the bracket; the AF rotor part is arranged on the chip carrier, and the AF component is used for driving the AF rotor part and the image sensing component to move along the guide rod relative to the AF stator part so as to realize AF.

In some embodiments, the AF mover part includes an AF coil fixedly mounted on the image sensing assembly, the AF stator part further includes an AF magnet fixed on the AF support, and the AF coil and the AF magnet are used to generate electromagnetic thrust to drive the AF mover part and the image sensing assembly to move along the guide bar relative to the AF stator part.

In some embodiments, the AF mover part further includes a magnetic attraction sheet fixedly mounted on the image sensing assembly, and the AF magnet is further configured to attract the magnetic attraction sheet.

In some embodiments, the AF stator part further includes a base on which the top plate is fixed for accommodating the AF mover part, the holder, the AF magnet, and the image sensing assembly between the top plate and the base.

An embodiment of another aspect of the present application provides a camera module, including an AF assembly as described above, and an image sensing assembly; the AF component is used for driving the AF rotor part and the image sensing component to move along the guide rod relative to the AF stator part so as to realize AF.

In some embodiments, the image sensing assembly includes a chip carrier and a sensor module mounted in the chip carrier; the chip carrier is provided with two guide rod holes and guide rod grooves corresponding to the guide rods, one guide rod is sleeved in the guide rod holes, and the other guide rod is clamped with the guide rod grooves.

In some embodiments, the image sensing assembly further includes a chip circuit board, the chip circuit board includes a central board, a peripheral board and a lead-out board, the central board and the sensor module are fixed to each other and establish electrical connection, the peripheral board is disposed around the central board, and the lead-out board is led out from the AF assembly and is used for establishing electrical connection with the outside.

In some embodiments, the central panel is a rigid panel and the peripheral panel is a flexible panel.

In some embodiments, a gap is provided inside the peripheral plate, the gap dividing a portion of the peripheral plate into a double-layer structure.

An embodiment of another aspect of the present application further provides an intelligent terminal, including the camera module as described above.

The camera module and the intelligent terminal with the camera module provided by the preferred embodiment of the application are used for disassembling the AF rotor part of the AF component from the lens component and the OIS component and assembling the image sensing component and the AF rotor part of the AF component together. Thus, only the lens assembly and the OIS mover portion of the OIS assembly need to be driven to move when OIS operation is performed, and no portion of the AF assembly need to be driven; when the AF operation is carried out, only the AF sub-part of the image sensing component and the AF component is required to be driven to move, and any part of the lens component and the OIS component is not required to be driven. Therefore, compared with the prior art, the camera module can reduce the load required to be driven during OIS operation and AF operation, can reduce energy consumption, reduces inertia required to be overcome during OIS operation and AF operation, has a good compensation effect especially for high-frequency shake, and can effectively improve the shooting effect. Furthermore, the structural design also simplifies the respective mechanical and electrical connection modes of the AF component and the OIS component, and is beneficial to simplifying the specific connection structure of the camera module.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an imaging module after preliminary decomposition according to a preferred embodiment of the present application.

Fig. 2A is a schematic structural diagram of the lens assembly and OIS assembly of the camera module shown in fig. 1 after further disassembly.

Fig. 2B is a schematic structural diagram of the image sensing assembly and the AF assembly of the camera module shown in fig. 1 after further disassembly.

Fig. 3 is a schematic structural diagram of an assembled optical anti-shake module in the camera module shown in fig. 1.

Fig. 4 is an enlarged schematic view of section IV of fig. 3.

Fig. 5 is a schematic plan view of the camera module shown in fig. 1 after assembly.

Fig. 6 is a schematic cross-sectional view of a part of the structure of the first circuit board in the camera module shown in fig. 1.

Fig. 7 is a schematic diagram showing a stressed state when the chip carrier in the camera module shown in fig. 1 is assembled with the magnetic attraction piece, assembled on the bracket and attracted by the AF magnet.

Fig. 8 is a schematic plan view of the camera module shown in fig. 1 after assembly.

Fig. 9A is a schematic cross-sectional view of the camera module shown in fig. 8 along the line A-A in fig. 8.

Fig. 9B is a schematic sectional view of the image capturing module shown in fig. 8 along the line B-B in fig. 8.

Detailed Description

Specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

The main purpose of the present application is: aiming at the problems that an imaging module built in an intelligent terminal in the prior art is large in load during focusing and anti-shake operation, imaging effect is influenced and energy consumption is increased, the AF assembly, the imaging module with the AF assembly and the intelligent terminal are provided, compared with the prior art, the load during focusing and anti-shake operation can be reduced, imaging effect is improved, energy consumption is reduced, and a specific connection structure of the imaging module is simplified.

Referring to fig. 1, fig. 2A, and fig. 2B, an embodiment of an aspect of the present application provides a camera module, which may be a built-in camera module of an intelligent terminal, and may be built-in an intelligent terminal such as an intelligent mobile phone, a tablet computer, a personal computer, a wearable device, and the like. The camera module comprises a lens assembly 1, an OIS assembly 2, an image sensing assembly 3 and an AF assembly 4.

The lens assembly 1 may be a conventional camera module lens assembly, and includes a generally cylindrical or truncated cone-shaped lens barrel and at least one lens mounted inside the lens barrel. The specific features of the lens barrel and the lens can refer to the prior art, and need not be described herein.

The OIS assembly 2 includes an OIS housing 21, OIS carrier 22, OIS coil 23, dome unit 24, suspension unit 25, OIS magnet 26, OIS base 27.

The OIS housing 21 is a rectangular box with an open bottom, and a lens hole 210 is formed in the center of the top of the OIS housing, and the lens hole 210 corresponds to the lens assembly 1 in shape and size, and is used for accommodating the lens assembly 1. The OIS carrier 22 is preferably in the shape of a frame with a rectangular outer contour and a circular central opening contour. The OIS coil 23 has a coil base body, preferably in the shape of a flat plate with a rectangular outer contour and a circular central opening contour, on which a coil (not shown in the drawings) can be formed by a method of the prior art such as winding, printing, or the like. The shape and size of the coil windings of the OIS coil 23 correspond to the OIS carrier 22 such that the coil windings may be adapted to be secured to one side surface of the OIS carrier 22 with the central opening of the OIS carrier 22 aligned with the central opening of the coil base of the OIS coil 23. Preferably, the coil windings of the OIS coil 23 may be attached to the bottom surface of the OIS carrier 22 by means of an embedded form, and particularly preferably the bottom surface of the OIS carrier 22 should be flush with the bottom surface of the coil windings of the OIS coil 23. This helps to reduce the overall size of the OIS carrier 22 and OIS coil 23 when assembled, and also helps to reduce the mass of the mover component when the OIS carrier 22 and OIS coil 23 are used as part of the mover portion of the OIS assembly 2. The OIS carrier 22 and the coil base of the OIS coil 23 each have an outer shape corresponding to the shape of the inner space of the OIS housing 21, and each have an outer dimension slightly smaller than the inner space of the OIS housing 21.

The spring plate unit 24 may include a plurality of spring plates, and the suspension wire unit 25 may include a plurality of suspension wires, wherein the number of spring plates and suspension wires corresponds to each other, and in this embodiment, the number of spring plates and suspension wires is preferably four. The spring plate and the suspension wire are made of elastic and conductive materials, such as metal or conductive rubber. One end of each elastic sheet is fixedly connected to the OIS carrier 22, and the other end of each elastic sheet is fixedly connected with the corresponding suspension wire in a welding mode. One end of each suspension wire is fixedly connected with the corresponding elastic piece in a welding mode, and the other end of each suspension wire is fixedly connected to the OIS base 27, so that the OIS carrier 22 is suspended on the OIS base 27 through the elastic piece unit 24 and the suspension wire unit 25. Further, due to the elasticity of the spring plate and the suspension wire, the OIS carrier 22 and the OIS coil 23 fixed thereon can move within a certain range relative to the OIS base 27 under the action of external force, and the OIS carrier 22 and the OIS coil 23 can be restored to the initial positions after the external force is eliminated. In addition, the OIS carrier 22 and OIS coil 23 may also be electrically connected to the OIS base 27 by the spring and suspension wires based on the electrical conductivity of the spring and suspension wires.

The OIS base 27 is preferably a frame having a rectangular outer shape and a circular central opening, and has an outer dimension corresponding to the outer dimension of the OIS housing 21. The OIS magnets 26 are bar magnets in this embodiment, preferably four sets in number. Four sets of OIS magnets 26 are fixedly mounted on the surface of the OIS base 27 on the side facing the OIS coil 23, and the four sets of OIS magnets 26 are aligned substantially with the four sides of the rectangular OIS carrier 22 to facilitate application of a magnetic field to the OIS coil 23. The OIS housing 21 is mounted on the OIS base 27 and secured to the OIS base 27, and houses the OIS carrier 22, OIS coil 23, spring 24, suspension wires 25, and OIS magnet 26 between the OIS housing 21 and the OIS base 27. It will be appreciated that since the outside dimensions of the OIS carrier 22 and the coil base of the OIS coil 23 are slightly smaller than the dimensions of the interior space of the OIS housing 21, the OIS carrier 22 and the OIS coil 23 secured thereto are able to move within a certain range within the OIS housing 21 and after movement are also able to return to their original state under the resilience of the spring 24 and suspension wire 25.

In the present embodiment, the OIS carrier 22, the coil base of the OIS coil 23, and the central opening of the OIS mount 27 are each shaped and sized to correspond to the lens assembly 1, and are used to house the lens assembly 1. In addition, the OIS base 27 may further be provided with a flat cable 270, and the flat cable 270 may be used for establishing electrical connection with the outside, and the OIS carrier 22 and the OIS coil 23 may also be electrically connected with the outside through an electrical connection path formed by the elastic sheet unit 24, the suspension unit 25, the OIS base 27 and the flat cable 270.

In accordance with the specific structure described above, in the OIS assembly 2, the OIS housing 21, OIS magnet 26 and OIS base 27 constitute an OIS stator portion, and the OIS carrier 22, OIS coil 23 and damper 28 constitute an OIS mover portion; the lens assembly 1 is thus fixedly mounted in the OIS mover portion, which is connected to the OIS stator portion by means of the spring and suspension wires. When the camera module needs to perform OIS operation, the OIS coil 23 of the OIS assembly 2 may be energized, and the energized OIS coil 23 is driven by a first electromagnetic thrust under the action of the magnetic field of the OIS magnet 26, so as to drive the OIS mover portion and the lens assembly 1 fixedly installed therein to move. By adjusting the current direction and magnitude of the OIS coil 23 when being electrified, the moving direction and magnitude of the lens assembly 1 can be correspondingly controlled, so that the offset of the lens assembly 1 caused by shaking is compensated, and the purpose of optical shaking prevention is achieved. In this embodiment, the OIS coil 23 is preferably disposed in two directions perpendicular to each other in a plane perpendicular to the optical axis direction of the lens assembly 1, for example, in the X-axis direction and the Y-axis direction shown in fig. 1, 2A, and 2B, in which the OIS mover portion and the lens assembly 1 can be moved. On the other hand, when the lens assembly 1 moves under the drive of the first electromagnetic thrust, the elastic sheet and the suspension wire are elastically deformed; when the lens assembly 1 needs to be reset after the shake is eliminated, the power on the OIS coil 23 is stopped, the OIS coil 23 is not subjected to first electromagnetic thrust any more, and the elastic sheet and the suspension wire can restore to the original shape, so that the OIS rotor part and the lens assembly 1 are driven to return to the original positions.

Referring to fig. 3 and fig. 4 together, in order to further improve OIS performance of the camera module, in this embodiment, the OIS module 2 further includes a damping member 28 connected to the OIS carrier 22, a damping groove 271 corresponding to the damping member 28 is formed on the OIS base 27, and a damping gel 272 is accommodated in the damping groove 271; the damping member 28 is inserted into the damping gel 272 in the damping groove 271, so that the vibration and shock of the OIS carrier 22 and other components connected thereto can be transmitted to the damping gel 272 through the damping member 28 and absorbed by the damping gel 272, thereby achieving a buffering effect. The number of the damping members 28 and the corresponding damping grooves 271 is preferably plural, in this embodiment, four damping members 28 and four damping grooves 271 are included, and the four damping members 28 are preferably damping needles made of metal material and are respectively connected to four corners of the OIS carrier 22; the four damping grooves 271 are preferably circular grooves formed at four corners of the OIS base 27, respectively; one end of each damping member 28 is fixedly connected to the OIS carrier 22, and the other end is movably inserted into a damping gel 272 in a corresponding damping groove 271. In this way, when the camera module shakes, the shake and vibration of the OIS carrier 22 and other components connected with the OIS carrier in the OIS mover portion are transmitted to the damping gel 272 through the damping member 28 and absorbed by the damping gel 272, so as to realize a buffering effect. This also significantly helps to directly reduce the offset of the lens assembly 1 due to shake, reducing the effort for OIS operation achieved by driving the lens assembly 1. In this embodiment, the damping member 28 employs a very thin damping pin, and even if the damping gel 272 is selected to have a very large elastic modulus, the damping member 28 will not be hindered from moving in the damping gel 272, and the OIS performance of the camera module will not be adversely affected. Therefore, the damping gel 272 in this embodiment may be selected as much as possible from damping gels with a larger elastic modulus, so as to better absorb shake and vibration generated in the shooting process of the lens assembly 1.

The image sensing assembly 3 includes a chip carrier 31, a sensor module 32, and a first circuit board 33. The AF assembly 4 includes a top plate 41, a second circuit board 42, a guide rod 43, a bracket 44, an AF magnet 45, an AF coil 46, a magnetic sheet 47, and a base 48.

Referring to fig. 5, the chip carrier 31 is preferably a rectangular frame with four frame edges 31a, 31b, 31c, 31d. The four rims 31a, 31b, 31c, 31d are connected end to end in sequence, adjacent rims being perpendicular to each other and opposite rims being parallel to each other. One corner of the chip carrier 33 is provided with a guide rod hole 311 which is at least partially communicated along the height direction of the chip carrier 31, and the other corner is provided with a guide rod groove 312 which is recessed towards the middle direction of the chip carrier 31; the corner provided with the guide hole 311 and the corner provided with the guide groove 312 are preferably two corners respectively located at both ends of the same diagonal line of the chip carrier 31, for example, in this embodiment, the guide hole 311 is opened at a corner where the frame side 31a and the frame side 31b intersect, and the guide groove 312 is opened at a corner where the frame side 31c and the frame side 31d intersect, and is formed by a partial outer side surface depression of the frame side 31d. The guide hole 311 and the guide groove 312 are used to cooperate with a guide 43 (described in detail below) of the AF assembly 4 to movably mount the chip carrier 31 in the AF assembly 4 along the guide 43.

The sensor module 32 is preferably an image sensor Chip module formed by mounting an image sensor Chip on some circuit boards and establishing electrical connection with the circuit boards using a Chip On Board (COB) process, which helps to further simplify the overall structure and reduce the size and weight. In the present embodiment, the sensor module 32 is embedded and fixed in the chip carrier 31. The first circuit board 33 includes a center board 331, a peripheral board 332, and a lead-out board 333. The center plate 331 is a rigid electrical connection plate; one side surface of the center plate 331 and one side surface of the sensor module 32 are attached and fixed to each other in parallel, and the sensor module 32 and the center plate 331 are electrically connected by, for example, various conventional means. The peripheral plate 332 is a flexible plate body, and may be made of, for example, a flexible circuit board (Flexible printed circuit, abbreviated as FPC), and is a plate body having a substantially rectangular frame shape, disposed around the center plate 331, and connected at one end to the center plate 331; such an arrangement helps to maximize the length of peripheral plate 332 in such a way as to make peripheral plate 332 overall more flexible, minimizing the resistance that needs to be overcome when driving movement of sensor module 32. The lead plate 333 is a substantially rectangular flat plate, and may be formed of a flexible circuit board or a circuit board having a rigid-flex structure, and is connected to the other end of the peripheral plate 332. The center plate 331, peripheral plate 332, and exit plate 333 are preferably all disposed in the same plane to reduce overall thickness. Further, referring to fig. 6, in the present embodiment, a gap 330 is formed inside the peripheral plate 332, and the gap 330 separates most of the plate body of the peripheral plate 332 except the edge into a double-layer structure. Such a structural design can reduce the spring rate of peripheral plate 332, making peripheral plate 332 more flexible to reduce the resistance that needs to be overcome when driving sensor module 32 to move, while also reducing the weight of peripheral plate 332, helping to reduce the force required to drive image sensing assembly 3.

The top plate 41 is preferably a flat plate having a rectangular outer contour and a circular central opening contour, preferably made of a rigid material such as a metal material, and the central opening has a shape and size corresponding to those of the lens assembly 1, and is adapted to receive the lens assembly 1. One side surface of the top plate 41 is fixed on the top surface of the chip carrier 31 while also being used for fixing the guide rods 43. The second circuit board 42 includes a bonding portion 421, a connection portion 422, and a flat cable portion 423, which are sequentially connected. The bonding portion 421 is preferably in a flat shape, the connecting portion 422 is in a long strip shape, the flat wire portion 423 is preferably in a rectangular flat plate shape, and a flat wire (not shown) for electrical connection is provided in the flat wire portion 423. The fitting portion 421 and the flat wire portion 423 are connected to both ends of the connection portion 422, respectively, and are preferably arranged perpendicular to a plane in which the connection portion 422 is located. In the present embodiment, the attaching portion 421 is attached to and fixed to the outer side of the frame 31d of the chip carrier 31, and the flat wire portion 423 is attached to and fixed to the outer side of the frame 31b of the chip carrier 31. Preferably, the fitting portion 421 may be wholly or partially embedded in the frame edge 31d, and the flat wire portion 423 may be wholly or partially embedded in the frame edge 31b to improve assembly firmness and reduce the overall volume. The connection portion 422 is arranged to interconnect the fitting portion 421 and the flat wire portion 423 across a portion of the surface of the chip carrier 31, preferably across the top surface of the chip carrier 31, and at least a portion of the connection portion 422 preferably extends along the rim 31c, and an outer side edge of the portion of the connection portion 422 is preferably flush with an outer side surface of the rim 31 c.

In the present embodiment, the number of the guide rods 43 is two, and the shape of the guide rods is a cylindrical rod, the length of the guide rods corresponds to the thickness of the chip carrier 31, and the diameter of the guide rod holes 311 and the guide rod grooves 312 correspond to each other. The bracket 44 is preferably rectangular frame in shape, and two corners thereof at both ends of the same diagonal line are provided with flat plate-shaped guide bar fitting portions 440 extending toward the inside of the frame, bottom ends of the two guide bars 43 are respectively and vertically fixedly connected to the guide bar fitting portions 440, thereby fixing the two guide bars 43 inside the bracket 44, and a length direction of the guide bars 43 is arranged to coincide with a height direction of the bracket 44. In some embodiments, the guide 43 may also be integrally formed with the bracket 44. Referring to fig. 7, one guide rod 43 is axially slidably sleeved in the guide rod hole 311 of the chip carrier 31, and the other guide rod 43 is axially slidably embedded in the guide rod slot 312 of the chip carrier 31, so that the chip carrier 31 can move along the axial direction of the guide rod 43 relative to the bracket 44. Compared with the assembly mode that two guide rods 43 are directly sleeved in the through holes formed in the chip carrier 31, the assembly structure adopted in the embodiment only needs to accurately align at the position of the guide rod hole 311, the side surfaces of the guide rod grooves 312 are open, and certain alignment deviation can be allowed when the guide rods are clamped with the corresponding guide rods 43, so that the operation difficulty when the chip carrier 31 and the guide rods 43 are assembled can be reduced, and the precision requirements for manufacturing the chip carrier 31 and the guide rods 43 are reduced. The top ends of the two guide rods 43 are fixedly connected with the bottom surface of the top plate 41.

The chip carrier 31, the sensor module 32, and the central plate 331 and the peripheral plate 332 of the first circuit board 33 are all accommodated in the accommodating space defined by the top plate 41 and the bracket 44, and the lead-out plate 333 of the first circuit board 33 is led out from the bottom of the bracket 44 to the outside of the bracket 44 for electrical connection with the outside, where the flat cable 270 provided on the OIS base 27 may also be led to electrical connection with the outside. In the present embodiment, it is preferable that the lead-out plate 333 is provided so as to be led out from the side where the frame edge 31b of the chip carrier 31 is located, and the flat wire portion 423 of the second circuit board 42 is embedded in the chip carrier 31 to be connected to the lead-out plate 333, so that the second circuit board 42 can also be electrically connected to the outside through the lead-out plate 333, whereby the AF module 4 can be powered from the outside through the lead-out plate 333.

In the present embodiment, the AF magnet 45 is a bar magnet and is fixedly mounted on the inner side of one frame side of the holder 44. The AF coil 46 is a racetrack coil fixedly mounted on the outer side surface of one frame side of the chip carrier 31 facing the AF magnet 45 mounted on the holder 44, for example, the AF coil 46 is mounted on the outer side surface of the frame side 31a of the chip carrier 31 in this embodiment, and the AF coil 46 is spaced apart from the AF magnet 45 by a certain gap. The AF coil 46 may be electrically connected to the bonding portion 422 of the second circuit board 42 by means of, for example, a conventional lead wire, buried wire, printed circuit, or the like, so that power is externally supplied through the lead plate 333. The magnetic sheet 47 is preferably a rectangular steel sheet fixedly installed between the outer side surface of the rim 31a and the AF coil 46. Preferably, both the magnetic sheet 47 and the AF coil 46 may be fitted in a recessed portion formed on the rim 31a such that the outer side surface of the AF coil 46 is flush with the outer side surface of the rim 31 a. The magnetic force of the AF magnet 45 can attract the magnetic attraction piece 47, so that the magnetic attraction piece 47 drives the chip carrier 31 to move towards the AF magnet 45, as shown in fig. 7, at this time, the chip carrier 31 as a whole will form a trend (as shown by an arrow R in the figure) of rotating towards the AF magnet with the guide rod 43 inserted into the guide rod hole 311 as an axis, thereby making the guide rod groove 312 firmly abut against the other guide rod 43, and preventing the guide rod 43 from being pulled out of the guide rod groove 312.

The base 48 is generally in the shape of a rectangular box with an open top, the top plate 41 is fixed on top of the base 48, and the second circuit board 42, the guide bar 43, the bracket 44, the AF magnet 45, the AF coil 46, the magnetic attraction sheet 47, and the chip carrier 31, the sensor module 32, the center plate 331 and the peripheral plate 332 of the first circuit board 33, which are housed inside the bracket 44, assembled according to the above-described specific structure, are enclosed in a space enclosed by the top plate 41 and the base 48. An opening 480 is formed in one side wall of the base 48, and the lead-out plate 333 of the first circuit board 33 is led out from the opening 480 to the outside for establishing electrical connection with the outside.

In the AF module 4, according to the above-described specific structure, the top plate 41, the guide bar 43, the bracket 44, the AF magnet 45, and the base 48 constitute an AF stator portion, and the second circuit board 42, the AF coil 46, and the magnetic attraction sheet 47 constitute an AF mover portion, so that the AF mover portion is fixedly mounted on the image sensing module 3. The top plate 41 and OIS base 27 are fixed to each other such that the AF stator portion and OIS stator portion are fixedly connected to each other. When the camera module needs to perform the AF operation, the AF coil 46 of the AF module 4 may be energized, and the energized AF coil 46 is driven by the second electromagnetic thrust under the action of the magnetic field of the AF magnet 45, so as to drive the AF mover portion and the image sensing module 3 to move, so that the sensor module 32 moves relative to the lens module 1. In this embodiment, the direction in which the AF coil 46 can drive the AF mover portion and the image sensing device 3 to move is preferably set to coincide with the optical axis direction of the lens assembly 1, for example, the Z-axis direction shown in fig. 1, 2A, and 2B, and the guide rod 43 may be used to limit the moving direction of the AF mover portion and the image sensing device 3 to the Z-axis direction. By adjusting the current direction and magnitude of the AF coil 46 when being energized, the direction and magnitude of the movement of the AF mover part and the image sensing assembly 3 relative to the lens assembly 1 can be controlled accordingly, so that the distance between the sensor module 32 and the lens of the lens assembly 1 in the optical axis direction of the lens assembly 1 is adjusted, and the surface of the sensor module 32 facing the lens assembly 1 keeps coincident with the focal plane of the lens assembly 1, so as to achieve the optimal imaging effect, namely, achieve focusing. During the above AF operation, the peripheral plate 332 and the take-out plate 333 are flexible, and thus do not cause obstruction to the movement of the AF mover portion and the image sensing assembly 3.

Referring to fig. 8, 9A and 9B, when assembling the camera module, the OIS housing 21, the OIS carrier 22, the OIS coil 23, the spring plate 24, the suspension wire 25, the OIS magnet 26, and the OIS base 27 are assembled into the integral OIS module 2 according to the specific structure described above, and the chip carrier 31, the sensor module 32, the first circuit board 33, the top board 41, the second circuit board 42, the guide bar 43, the support 44, the AF magnet 45, the AF coil 46, the magnetic attraction sheet 47, and the base 48 are assembled into the integrated image sensor module 3 and the AF module 4. The lens assembly 1 is sequentially passed through the OIS base 27, the coil base of the OIS coil 23, the central opening of the OIS carrier 22, and the lens aperture 210 of the OIS housing 21, so that the lens assembly 1 protrudes from the lens aperture 210, and the lens assembly 1 and the OIS carrier 22 are fixed to each other. The OIS mount 27 is aligned with the top plate 41, the bottom of the lens assembly 1 is inserted into the central opening of the top plate 41, the lens assembly 1 is aligned with the sensor module 32, and the top plate 41 and OIS mount 27 are fixed to each other, thereby completing the assembly of the camera module. In this embodiment, when the top plate 41 and the OIS base 27 are fixed to each other, the flat cable 270 provided on the OIS base 27 is preferably disposed on the side where the flat cable 333 is led out, that is, the side where the frame edge 31b of the chip carrier 31 and the opening 480 of the base 48 are located, and the flat cable 270 is connected to the flat cable 333, so that the OIS assembly 2 can also be electrically connected to the outside through the flat cable 333, so that the OIS coil 23 can also obtain power from the outside, for example, an electrical connection path to the outside can be formed through the flat cable 333, the flat cable 270, the OIS base 27, the suspension wires 25 and the elastic pieces 24 to obtain power. The flat cable 270 may also preferably be embedded in the rim 31b of the chip carrier 31 to improve assembly robustness and reduce overall bulk. In other embodiments, the OIS housing 21 may be further secured to the top plate 41 as well as at least one of the OIS housing 21 and OIS base 27 to the base 48.

When the camera module works, according to the above connection manner, the OIS component 2, the image sensing component 3 and the AF component 4 can be electrically connected with the outside through the lead-out plate 333 of the first circuit board 33, which is helpful for simplifying the electrical connection structure and reducing the overall weight. The lens assembly 1 protruding from the lens hole 210 collects an external optical image signal, and the collected optical image signal is transmitted to the sensor module 32 after passing through the lens assembly 1, and the sensor module 32 converts the optical image signal into an electronic image signal, and the electronic image signal may be transmitted to an external data processing device, such as an existing processor in the intelligent terminal, through the center plate 331, the peripheral plate 332, and the outlet plate 333, and then subjected to subsequent processing according to the related art. When the camera module needs to perform OIS operation and AF operation, corresponding operations are performed according to the specific working principles of the OIS component 2 and the AF component 4.

Compared with the prior art, the imaging module provided in the above embodiment has more superior technical effects in various aspects, for example: (1) The camera module is designed by the novel structure, the AF rotor part of the AF component 4 is detached from the lens component 1 and the OIS component 2, and the image sensing component 3 and the AF rotor part of the AF component 4 are assembled together. Thus, only the OIS mover portions of the lens assembly 1 and OIS assembly 2 need to be driven to move when OIS operation is performed, and no portion of the AF assembly 4 need to be driven; the AF operation is performed by driving only the AF mover portions of the image sensing unit 3 and the AF unit 4, and driving no portions of the lens unit 1 and the OIS unit 2 is required. Therefore, compared with the prior art, the camera module can reduce the load required to be driven during OIS operation and AF operation, can reduce energy consumption, reduces inertia required to be overcome during OIS operation and AF operation, has a good compensation effect especially for high-frequency shake, and can effectively improve the shooting effect. (2) The damping structure formed by the damping member 28 and the damping gel 272 is effective in absorbing the vibration and shock of the OIS carrier 22 and other components connected thereto, further enhancing OIS effects, and is particularly useful for rapidly eliminating relatively high frequency vibrations. (3) The peripheral plate 332 is internally provided with a gap 330, and most plate bodies except edges of the peripheral plate 332 are separated into a double-layer structure by the gap 330. Such a structural design can reduce the spring rate of peripheral plate 332 while also reducing the weight of peripheral plate 332, helping to reduce the force required to drive image sensing assembly 3. (4) The sensor module 32 is embedded in the chip carrier 31, and is assembled with the AF component 4 through the chip carrier 31, so that the operation is convenient, and the sensor module 32 can be suitable for different use environments by adjusting the shape and the size of the chip carrier 31. (5) The AF magnet 45 and the AF coil 46 in the AF assembly 4 are provided on only a single side of the bracket 44, contributing to simplification of the apparatus structure, reduction of the overall weight, and reduction of the cost. (6) The above structural design also simplifies the respective mechanical and electrical connection modes of the OIS assembly 2 and the AF assembly 4, which is helpful for simplifying the specific connection structure of the camera module.

In other embodiments, OIS coil 23 and AF coil 46 may take other forms of coils, such as air coils, and the like. The damping groove 41 may have a shape other than a circular shape. The damping member 28 may be formed of an injection molding insert, a metal sheet, or the like, in addition to the above-described form of the damping pin, so long as it can cooperate with the damping gel 272 to produce a corresponding damping effect. The guide rod 43 in the AF module 4 may be replaced with a ball, and the ball may be mounted between the chip carrier 31 and the holder 44 so that the chip carrier 31 can move in the Z-axis direction with respect to the holder 44 by rolling of the ball.

An embodiment of another aspect of the present application provides an AF assembly, such as AF assembly 4 described in the above-described image capturing apparatus embodiment. The specific features, operating principles and advantages of the AF assembly 4 are described in detail above.

Embodiments of another aspect of the present application also provide a smart terminal, which may be, for example, a smart phone, a tablet computer, a personal computer, a wearable device, etc., and which includes a camera module as described in the foregoing embodiments. Obviously, compared with the prior art, the intelligent terminal has the beneficial technical effects in various aspects as described above.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Accordingly, the scope of protection of the present application shall be subject to the appended claims.

Claims (10)

1. An AF assembly for a camera module, wherein the AF assembly comprises an AF stator part and an AF rotor part, the AF stator part comprises a top plate, a bracket and a guide rod connected between the top plate and the bracket, and the guide rod is used for being matched with an image sensing assembly of the camera module to movably mount the image sensing assembly between the top plate and the bracket; the AF rotor part is arranged on the chip carrier, and the AF component is used for driving the AF rotor part and the image sensing component to move along the guide rod relative to the AF stator part so as to realize AF.

2. The AF assembly of claim 1, wherein the AF mover part includes an AF coil fixedly mounted on the image sensing assembly, the AF stator part further includes an AF magnet fixed on the AF holder, the AF coil and the AF magnet for generating electromagnetic thrust to drive the AF mover part and the image sensing assembly to move along the guide bar relative to the AF stator part.

3. The AF module according to claim 2, wherein said AF mover portion further comprises a magnetic attraction piece fixedly mounted on said image sensing module, said AF magnet further serving to attract said magnetic attraction piece.

4. The AF assembly of claim 2, wherein the AF stator portion further comprises a base to which the top plate is fixed for receiving the AF mover portion, the holder, the AF magnet, and the image sensing assembly between the top plate and the base.

5. A camera module comprising the AF module of any one of claims 1-4, and an image sensing assembly; the AF component is used for driving the AF rotor part and the image sensing component to move along the guide rod relative to the AF stator part so as to realize AF.

6. The camera module of claim 5, wherein the image sensing assembly comprises a chip carrier and a sensor module, the sensor module being mounted in the chip carrier; the chip carrier is provided with two guide rod holes and guide rod grooves corresponding to the guide rods, one guide rod is sleeved in the guide rod holes, and the other guide rod is clamped with the guide rod grooves.

7. The camera module of claim 6, wherein the image sensor assembly further comprises a chip circuit board comprising a center plate, a peripheral plate and a lead-out plate connected in sequence, wherein the center plate and the sensor module are fixed to each other and establish electrical connection, the peripheral plate is disposed around the center plate, and the lead-out plate is led out of the AF assembly and is used for establishing electrical connection with the outside.

8. The camera module of claim 7, wherein the center plate is a rigid plate and the peripheral plate is a flexible plate.

9. The camera module of claim 7, wherein a gap is provided inside the peripheral plate, the gap dividing a portion of the peripheral plate into a double-layered structure.

10. An intelligent terminal comprising a camera module according to any one of claims 5-9.