CN117577693B - Planar schottky rectifying device and manufacturing method - Google Patents
Planar schottky rectifying device and manufacturing method Download PDFInfo
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- CN117577693B CN117577693B CN202410058808.9A CN202410058808A CN117577693B CN 117577693 B CN117577693 B CN 117577693B CN 202410058808 A CN202410058808 A CN 202410058808A CN 117577693 B CN117577693 B CN 117577693B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 160
- 239000004065 semiconductor Substances 0.000 claims abstract description 44
- 239000011159 matrix material Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000003754 machining Methods 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 10
- 230000004308 accommodation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
- H01L29/66143—Schottky diodes
Abstract
The invention relates to a planar Schottky rectifying device and a manufacturing method thereof, which are characterized in that: comprises a flexible base, a flexible matrix and a flexible semiconductor; the top surface of one end of the flexible semiconductor is provided with a first metal block, and a second metal block is arranged above the first metal block, the first metal block is fixed and connected with the flexible semiconductor, and the second metal block is fixed and connected with the first metal block; a third metal block is arranged on the top surface of the other end of the flexible semiconductor, a fourth metal block is arranged above the third metal block, the third metal block is fixed and connected with the flexible semiconductor, and the fourth metal block is fixed and connected with the third metal block; the first pin and the second pin are also included. The whole schottky rectifying device has better flexibility, can be bent freely on two sides in a certain range, and can be suitable for flexible circuits. In addition, the Schottky rectifying device has high overall structural stability, and can not be loosened or stripped.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to a planar Schottky rectifying device and a manufacturing method thereof.
Background
A Schottky diode, also called a Schottky barrier diode, belongs to a low-power consumption and ultra-high speed semiconductor device. The most remarkable characteristic is that the reverse recovery time is extremely short, and the forward conduction voltage drop is only about 0.4V. Schottky diodes are used as high-frequency, low-voltage, high-current rectifier diodes, flywheel diodes, and protection diodes, and are also used as rectifier diodes and small-signal detector diodes in circuits for microwave communication.
With the development and the gradual popularization of flexible circuits, flexible electronic components applied to the flexible circuits have larger market demands.
The conventional schottky rectifying device is not flexible in a hard structure, and cannot be bent, so that the conventional schottky rectifying device cannot be integrated into a flexible circuit. No flexible schottky rectifying device is currently available on the market.
For the above reasons, it is necessary to design a flexible schottky rectifying device having flexibility.
Disclosure of Invention
Based on the above description, the invention provides a planar schottky rectifying device and a manufacturing method thereof, so as to solve the problem that the conventional planar schottky rectifying device cannot be bent.
The technical scheme for solving the technical problems is as follows:
a planar Schottky rectifying device comprises a flexible base, a flexible substrate arranged above the base, and a flexible semiconductor arranged above the substrate; the top surface of the base is adhered and fixed with the bottom surface of the matrix; the top surface of the matrix is adhered and fixed with the bottom surface of the flexible semiconductor, and the matrix is made of insulating materials; the top surface and the bottom surface of the base body are provided with notches, and the notches are arranged along the width direction of the base body; the top surface of one end of the flexible semiconductor is provided with a first metal block, and a second metal block is arranged above the first metal block, the first metal block is fixed and connected with the flexible semiconductor, and the second metal block is fixed and connected with the first metal block; the top surface of the other end of the flexible semiconductor is provided with a third metal block, a fourth metal block is arranged above the third metal block, the third metal block is fixedly connected and communicated with the flexible semiconductor, the fourth metal block is fixedly connected and communicated with the third metal block, and one end of the fourth metal block is bent downwards and connected and communicated with the flexible semiconductor; the flexible circuit board further comprises a first pin and a second pin, wherein one end of the first pin is in contact with and fixed with the first metal block and the second metal block, and the other end of the first pin is used for being welded and fixed with a bonding pad on the flexible circuit board; one end of the second pin is in contact with and fixed with the third metal block and the fourth metal block, and the other end of the second pin is used for being welded and fixed with a bonding pad on the flexible circuit board.
As a preferable scheme: the notches on the top surface and the bottom surface of the substrate are staggered.
As a preferable scheme: the flexible semiconductor is a P-type semiconductor, the work function of the first metal block is lower than that of the second metal block, and the work function of the third metal block is lower than that of the fourth metal block.
As a preferable scheme: the top surface of the first metal block is provided with a sunk first accommodating groove, the end part of the first pin enters the first accommodating groove and is compressed by the first metal block and the second metal block, the top surface of the first metal block is also provided with a sunk first positioning groove, and the top surface of the end part of the first pin is provided with a sunk second positioning groove; the bottom surface of the second metal block is provided with a first positioning block and a second positioning block which are downwards convex, and the first positioning block and the second positioning block respectively enter the first positioning groove and the second positioning groove; the top surface of the end part of the second pin is provided with a concave third positioning groove, the bottom surface of the fourth metal block is provided with a downward convex third positioning block, and the third positioning block enters the third positioning groove.
As a preferable scheme: the locking device also comprises a pair of locking pieces, wherein the locking pieces are in a door shape, and an upper lock catch and a lower lock catch are arranged on the two inner sides of the locking pieces; the two side surfaces of the second metal block are provided with first bayonets, and the side surface of the base is provided with second bayonets; the two side surfaces of the fourth metal block are provided with third bayonets, and the side surface of the base is provided with a fourth bayonet; the two groups of locking pieces are respectively sleeved at two ends of the Schottky rectifying device, wherein an upper lock catch and a lower lock catch at the inner side of one group of locking pieces are respectively clamped into a first bayonet at the side part of the second metal block and a second bayonet at the side part of the base; and the upper lock catch and the lower lock catch at the inner side of the other group of locking pieces are respectively clamped into the third bayonet at the side part of the fourth metal block and the fourth bayonet at the side part of the base.
As a preferable scheme: the novel Schottky rectifier device comprises a front end and a rear end, and is characterized by further comprising four groups of push-pull pieces which are in an L shape, wherein the four groups of push-pull pieces are distributed in an axisymmetric mode, the four groups of push-pull pieces surround the Schottky rectifier device in a rectangular mode, the rear end of each push-pull piece is connected with the outer side of each locking piece, a recessed embedded opening is formed in the end face of the front end of each push-pull piece, and the side portions of the pins enter the embedded opening.
As a preferable scheme: the device also comprises two groups of strain mechanisms, wherein each strain mechanism comprises a pair of movable blocks, and the two movable blocks are connected through a strip-shaped elastic piece; the strain mechanism further comprises guide rails arranged on the side surfaces of the two groups of locking pieces, the guide rails are arranged transversely, the movable blocks are connected with the guide rails in a sliding manner, and concave connecting grooves are formed in the outer side surfaces of the movable blocks; the rear end of the push-pull piece is also provided with a convex connecting block; the connecting block enters the connecting groove and is clamped and fixed.
A manufacturing approach of the rectifying device of the plane Schottky, is used for making the rectifying device of said plane Schottky, process the second bayonet and fourth bayonet on the base, process the breach on the basal body; coating an adhesive on the top surface of the base, and adhering and fixing the bottom surface of the base and the top surface of the base; coating an adhesive on the top surface of the substrate, and adhering and fixing the bottom surface of the flexible semiconductor with the top surface of the substrate; forming a first metal block and a third metal block on the flexible semiconductor in an electroplating mode, forming a first accommodating groove and a first positioning groove on the first metal block, and forming a second accommodating groove on the third metal block; a second positioning groove is formed in the first pin, and a third positioning groove is formed in the second pin; machining a first positioning block and a second positioning block on the bottom surface of the second metal block, machining a first bayonet on the side surface of the second metal block, machining a third positioning block on the bottom surface of the fourth metal block, and machining a third bayonet on the side surface of the fourth metal block; loading the end part of the first pin into a first accommodating groove, smearing conductive adhesive on a second metal block, and fixing the second metal block on the first metal block, so that the first positioning block and the second positioning block respectively enter the first positioning groove and the second positioning groove; loading the end part of the second pin into a second accommodating groove, smearing conductive adhesive on the third metal block, fixing the fourth metal block on the third metal block, and enabling the third positioning block to enter the third positioning groove; the two groups of locking pieces are respectively buckled at two ends of the Schottky rectifying device, so that an upper lock catch and a lower lock catch of the two groups of locking pieces are respectively buckled in the first bayonet, the second bayonet, the third bayonet and the fourth bayonet; the two groups of movable blocks are respectively arranged on the guide rails of the two groups of locking pieces, and the connecting blocks at the rear ends of the four groups of push-pull pieces are respectively pressed and arranged in the connecting grooves of the corresponding movable blocks, so that the side parts of the pins enter the embedded openings at the front ends of the push-pull pieces.
Compared with the prior art, the technical scheme of the application has the following beneficial technical effects: the whole schottky rectifying device has better flexibility, can be bent freely on two sides in a certain range, and can be suitable for flexible circuits. In addition, the Schottky rectifying device has high overall structural stability, and can not be loosened or stripped.
Drawings
Fig. 1 is a cross-sectional view of a schottky rectifying device in a first embodiment;
FIG. 2 is a schematic structural diagram of a substrate according to the first embodiment;
fig. 3 is an enlarged view of a portion a in fig. 1;
fig. 4 is an enlarged view of a portion B in fig. 1;
fig. 5 is a schematic diagram showing an external structure of a schottky rectifying device according to the first embodiment;
fig. 6 is a schematic structural view of the locking member and the push-pull member in the first embodiment.
In the drawings, the list of components represented by the various numbers is as follows:
1. a base; 2. a base; 3. a flexible semiconductor; 4. a first metal block; 5. a second metal block; 6. a third metal block; 7. a fourth metal block; 8. a first pin; 9. a second pin; 10. a notch; 11. a first accommodating groove; 12. a first positioning groove; 13. a first positioning block; 14. a second positioning groove; 15. a second positioning block; 16. a first bayonet; 17. a second accommodating groove; 18. a third positioning groove; 19. a third positioning block; 20. a second bayonet; 21. a third bayonet; 22. a fourth bayonet; 23. a locking member; 24. a lock catch is arranged; 25. a lower lock catch; 26. a guide rail; 27. a movable block; 28. a connecting groove; 29. an elastic member; 30. a push-pull member; 31. a connecting block; 32. and (5) embedding an inlet.
Detailed Description
Embodiment one:
referring to fig. 1 and 2, a planar schottky rectifying device includes a flexible base 1, a flexible substrate 2 disposed over the base 1, and a flexible semiconductor 3 disposed over the substrate 2.
The top surface of the base 1 is fixed to the bottom surface of the base 2, and the top surface of the base 2 is fixed to the bottom surface of the flexible semiconductor 3. The base body 2 is made of insulating material.
The top and bottom surfaces of the base 2 are provided with notches 10, and the notches 10 are arranged along the width direction of the base 2. The notch 10 makes the substrate 2 more easily bend and deform, and the notch 10 provides a stress relief space, so that the stress applied to the substrate 2 during bending can be reduced. The existence of the notch 10 can weaken the pulling force between the base body 2 and the base 1 and between the base body 2 and the flexible semiconductor 3 in the bending state of the schottky rectifying device, so that the situation that the base body 2 and the base 1 and the base body 2 and the flexible semiconductor 3 are not easy to tear and crack is avoided, the schottky rectifying device can be subjected to more times of bending, and the service life of the schottky rectifying device is prolonged.
The notches 10 on the top and bottom surfaces of the base 2 in this embodiment are staggered, so that the bending stress of the base 2 can be uniformly released.
Referring to fig. 1 and 3, a first metal block 4 is provided on a top surface of one end of the flexible semiconductor 3 and a second metal block 5 is provided above the first metal block 4. The first metal block 4 is fixed and connected with the flexible semiconductor 3, and the second metal block 5 is fixed and connected with the first metal block 4.
Referring to fig. 1 and 4, a third metal block 6 is provided on the top surface of the other end of the flexible semiconductor 3 and a fourth metal block 7 is provided above the third metal block 6. The third metal block 6 is fixed and connected with the flexible semiconductor 3, the fourth metal block 7 is fixed and connected with the third metal block 6, and one end of the fourth metal block 7 is bent downwards and connected with the flexible semiconductor 3.
The flexible semiconductor 3 in this embodiment is a P-type semiconductor, the work function of the first metal block 4 is lower than that of the second metal block 5, and the work function of the third metal block 6 is lower than that of the fourth metal block 7.
The schottky rectifying device further comprises a first leg 8 and a second leg 9. One end of the first pin 8 is in contact with and fixed with the first metal block 4 and the second metal block 5, and the other end of the first pin 8 is used for being welded and fixed with a bonding pad on the flexible circuit board; one end of the second pin 9 is in contact with and fixed to the third metal block 6 and the fourth metal block 7, and the other end of the second pin 9 is used for being welded and fixed to a bonding pad on the flexible circuit board.
As shown in fig. 3, a first accommodation groove 11 is provided on the top surface of the first metal block 4, and the end of the first pin 8 enters into the first accommodation groove 11 and is pressed by the first metal block 4 and the second metal block 5. The top surface of the first metal block 4 is also provided with a concave first positioning groove 12, the top surface of the end part of the first pin 8 is provided with a concave second positioning groove 14, the bottom surface of the second metal block 5 is provided with a downward convex first positioning block 13 and a downward convex second positioning block 15, and the first positioning block 13 and the second positioning block 15 respectively enter the first positioning groove 12 and the second positioning groove 14. The structure ensures that the first pin 8 is firmly connected with the first metal block 4 and the second metal block 5, and the loosening can not happen.
As shown in fig. 4, a second accommodation groove 17 is provided on the top surface of the third metal block 6, and the end of the second pin 9 enters into the second accommodation groove 17 and is pressed by the third metal block 6 and the fourth metal block 7. A third positioning groove 18 which is concave is arranged on the top surface of the end part of the second pin 9, a third positioning block 19 which is convex downwards is arranged on the bottom surface of the fourth metal block 7, and the third positioning block 19 enters the third positioning groove 18.
The schottky rectifying device in this embodiment further includes a pair of locking members 23.
Referring to fig. 6, the locker 23 has a "door" shape, and a pair of latches are provided at both inner sides of the locker 23, that is, a protruding upper latch 24 and lower latch 25 are provided at both inner sides of the locker 23.
Referring to fig. 1 and 3, first bayonet 16 is provided on both side surfaces of the second metal block 5, and second bayonet 20 is provided on the side surface of the base 1 and directly below the first bayonet 16.
Referring to fig. 1 and 4, third bayonet holes 21 are provided on both side surfaces of the fourth metal block 7, and fourth bayonet holes 22 are provided on the side surface of the base 1 directly below the third bayonet holes 21.
Referring to fig. 5, two sets of locking members 23 are respectively sleeved at two ends of the schottky rectifying device, wherein an upper lock catch 24 and a lower lock catch 25 at the inner side of one set of locking members 23 are respectively clamped into a first bayonet 16 at the side part of the second metal block 5 and a second bayonet 20 at the side part of the base 1; and the upper lock catch 24 and the lower lock catch 25 on the inner side of the other group of locking pieces 23 are respectively clamped into the third bayonet 21 on the side part of the fourth metal block 7 and the fourth bayonet 22 on the side part of the base 1.
The left end of the first metal block 4, the second metal block 5, the left end of the flexible semiconductor 3, the left end of the base body 2 and the left end of the base 1 can be bound into a whole through the left locking piece 23, so that the stability of the whole structure of the left end of the schottky rectifying device is higher, and the loosening and stripping situations can not occur.
Likewise, the third metal block 6, the fourth metal block 7, the right end of the flexible semiconductor 3, the right end of the base body 2 and the right end of the base 1 can be bound into a whole through the locking piece 23 on the right side, so that the stability of the whole structure of the right end of the schottky rectifying device is higher, and the loosening and stripping situations can not occur.
Through the structural design, the whole schottky rectifying device has better flexibility, can be bent freely on two sides within a certain range, and can be suitable for a flexible circuit.
Referring to fig. 5 and 6, the schottky rectifying device in the present embodiment further includes four sets of push-pull members 30 having an "L" shape. The four groups of push-pull members 30 are in axisymmetric distribution, the schottky rectifying device is surrounded by the rectangle formed by surrounding the four groups of push-pull members 30, the rear end of the push-pull member 30 is connected with the outer side part of the locking member 23, the end face of the front end of the push-pull member 30 is provided with a concave embedded opening 32, and the side parts of the pins enter the embedded opening 32.
The push-pull member 30 has the function of forming additional support for the pins, and after the schottky rectifying device is welded and fixed on the flexible circuit board, the supporting force provided by the push-pull member 30 can offset the torsion stress received by the pins when the schottky rectifying device is bent and deformed along with the flexible circuit board, so that the pins are prevented from being subjected to excessive concentrated stress, the effect of protecting the pins is achieved, and the service life of the pins can be prolonged.
Referring to fig. 6, the schottky rectifying device in the present embodiment further includes two sets of strain mechanisms.
The strain mechanism comprises a pair of movable blocks 27, and the two movable blocks 27 are connected through a strip-shaped elastic piece 29. The strain mechanism further comprises guide rails 26 arranged on the sides of the two sets of locking members 23, the guide rails 26 being arranged in the transverse direction. The movable block 27 is slidably connected to the guide rail 26 such that the movable block 27 can move back and forth along the guide rail 26. A recessed connection groove 28 is provided on the outer side surface of the movable block 27.
In this embodiment, a convex connection block 31 is further disposed at the rear end of the push-pull member 30. The connection block 31 enters the connection groove 28 and is clamped.
The above structure is actually to connect the push-pull member 30 with the movable block 27.
When the schottky rectifying device is not bent, the elastic member 29 is in a flat state; when the schottky rectifying device is bent downward (i.e., both ends are lowered), the elastic member 29 is bent downward accordingly; the two ends of the elastic piece 29 are mutually close after being bent downwards, so that the two groups of movable blocks 27 are driven to mutually close, and the movable blocks 27 apply a backward pulling force to the push-pull piece 30, so that the push-pull piece 30 applies a backward pulling force to the pins. In this bending state, the pins are subjected to forward bending stress, and the backward pulling force of the push-pull member 30 counteracts the forward bending stress, so that the influence of the bending stress on the pins can be effectively weakened. And the higher the bending degree of the schottky rectifying device is, the larger the backward pulling force generated by the elastic member 29 is, and the effect is that the larger the bending stress applied to the pin is, the larger the reverse counteracting pulling force of the push-pull member 30 is.
When the schottky rectifying device returns to the flat state, the elastic member 29 also returns to the flat state, and the two sets of movable blocks 27 are reset.
Embodiment two:
a method for manufacturing a planar Schottky rectifying device is used for manufacturing the planar Schottky rectifying device in the first embodiment.
The method comprises the following steps: a second bayonet 20 and a fourth bayonet 22 are processed on the base 1, and a notch 10 is processed on the base 2; coating an adhesive on the top surface of the base 1, and adhering and fixing the bottom surface of the base 2 and the top surface of the base 1; coating an adhesive on the top surface of the substrate 2, and adhering and fixing the bottom surface of the flexible semiconductor 3 and the top surface of the substrate 2; forming a first metal block 4 and a third metal block 6 on the flexible semiconductor 3 in an electroplating manner, forming a first accommodating groove 11 and a first positioning groove 12 on the first metal block 4, and forming a second accommodating groove 17 on the third metal block 6; a second positioning groove 14 is formed in the first pin 8, and a third positioning groove 18 is formed in the second pin 9; a first positioning block 13 and a second positioning block 15 are processed on the bottom surface of the second metal block 5, a first bayonet 16 is processed on the side surface of the second metal block 5, a third positioning block 19 is processed on the bottom surface of the fourth metal block 7, and a third bayonet 21 is processed on the side surface of the fourth metal block 7; the end part of the first pin 8 is arranged in a first accommodating groove 11, conductive adhesive is smeared on the second metal block 5, the second metal block 5 is fixed on the first metal block 4, and the first positioning block 13 and the second positioning block 15 respectively enter into a first positioning groove 12 and a second positioning groove 14; the end part of the second pin 9 is put into the second accommodating groove 17, conductive adhesive is smeared on the third metal block 6, the fourth metal block 7 is fixed on the third metal block 6, and the third positioning block 19 enters the third positioning groove 18; the two groups of locking pieces 23 are respectively buckled at two ends of the Schottky rectifying device, so that an upper lock catch 24 and a lower lock catch 25 of the two groups of locking pieces 23 are respectively buckled in the first bayonet 22, the second bayonet 22, the third bayonet 22 and the fourth bayonet 22; the two groups of movable blocks 27 are respectively arranged on the guide rails 26 of the two groups of locking pieces 23, and the connecting blocks 31 at the rear ends of the four groups of push-pull pieces 30 are respectively pressed and arranged in the connecting grooves 28 of the corresponding movable blocks 27, so that the side parts of the pins enter the embedded openings 32 at the front ends of the push-pull pieces 30.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (8)
1. A planar Schottky rectifying device is characterized in that: comprises a flexible base, a flexible matrix arranged above the base and a flexible semiconductor arranged above the matrix; the top surface of the base is adhered and fixed with the bottom surface of the matrix; the top surface of the matrix is adhered and fixed with the bottom surface of the flexible semiconductor, and the matrix is made of insulating materials; the top surface and the bottom surface of the base body are provided with notches, and the notches are arranged along the width direction of the base body; the top surface of one end of the flexible semiconductor is provided with a first metal block, and a second metal block is arranged above the first metal block, the first metal block is fixed and connected with the flexible semiconductor, and the second metal block is fixed and connected with the first metal block; the top surface of the other end of the flexible semiconductor is provided with a third metal block, a fourth metal block is arranged above the third metal block, the third metal block is fixedly connected and communicated with the flexible semiconductor, the fourth metal block is fixedly connected and communicated with the third metal block, and one end of the fourth metal block is bent downwards and connected and communicated with the flexible semiconductor; the flexible circuit board further comprises a first pin and a second pin, wherein one end of the first pin is in contact with and fixed with the first metal block and the second metal block, and the other end of the first pin is used for being welded and fixed with a bonding pad on the flexible circuit board; one end of the second pin is in contact with and fixed with the third metal block and the fourth metal block, and the other end of the second pin is used for being welded and fixed with a bonding pad on the flexible circuit board.
2. The planar schottky rectifying device of claim 1, wherein: the notches on the top surface and the bottom surface of the substrate are staggered.
3. The planar schottky rectifying device of claim 1, wherein: the flexible semiconductor is a P-type semiconductor, the work function of the first metal block is lower than that of the second metal block, and the work function of the third metal block is lower than that of the fourth metal block.
4. The planar schottky rectifying device of claim 1, wherein: the top surface of the first metal block is provided with a sunk first accommodating groove, the end part of the first pin enters the first accommodating groove and is compressed by the first metal block and the second metal block, the top surface of the first metal block is also provided with a sunk first positioning groove, and the top surface of the end part of the first pin is provided with a sunk second positioning groove; the bottom surface of the second metal block is provided with a first positioning block and a second positioning block which are downwards convex, and the first positioning block and the second positioning block respectively enter the first positioning groove and the second positioning groove; the top surface of the end part of the second pin is provided with a concave third positioning groove, the bottom surface of the fourth metal block is provided with a downward convex third positioning block, and the third positioning block enters the third positioning groove.
5. The planar schottky rectifying device of claim 1, wherein: the locking device also comprises a pair of locking pieces, wherein the locking pieces are in a door shape, and an upper lock catch and a lower lock catch are arranged on the two inner sides of the locking pieces; the two side surfaces of the second metal block are provided with first bayonets, and the side surface of the base is provided with second bayonets; the two side surfaces of the fourth metal block are provided with third bayonets, and the side surface of the base is provided with a fourth bayonet; the two groups of locking pieces are respectively sleeved at two ends of the Schottky rectifying device, wherein an upper lock catch and a lower lock catch at the inner side of one group of locking pieces are respectively clamped into a first bayonet at the side part of the second metal block and a second bayonet at the side part of the base; and the upper lock catch and the lower lock catch at the inner side of the other group of locking pieces are respectively clamped into the third bayonet at the side part of the fourth metal block and the fourth bayonet at the side part of the base.
6. The planar schottky rectifying device of claim 5, wherein: the novel Schottky rectifier device comprises a front end and a rear end, and is characterized by further comprising four groups of push-pull pieces which are in an L shape, wherein the four groups of push-pull pieces are distributed in an axisymmetric mode, the four groups of push-pull pieces surround the Schottky rectifier device in a rectangular mode, the rear end of each push-pull piece is connected with the outer side of each locking piece, a recessed embedded opening is formed in the end face of the front end of each push-pull piece, and the side portions of the pins enter the embedded opening.
7. The planar schottky rectifying device of claim 6, wherein: the device also comprises two groups of strain mechanisms, wherein each strain mechanism comprises a pair of movable blocks, and the two movable blocks are connected through a strip-shaped elastic piece; the strain mechanism further comprises guide rails arranged on the side surfaces of the two groups of locking pieces, the guide rails are arranged transversely, the movable blocks are connected with the guide rails in a sliding manner, and concave connecting grooves are formed in the outer side surfaces of the movable blocks; the rear end of the push-pull piece is also provided with a convex connecting block; the connecting block enters the connecting groove and is clamped and fixed.
8. A method for manufacturing a planar schottky rectifying device, for manufacturing the planar schottky rectifying device according to claim 7, characterized by: machining a second bayonet and a fourth bayonet on the base, and machining a notch on the base; coating an adhesive on the top surface of the base, and adhering and fixing the bottom surface of the base and the top surface of the base; coating an adhesive on the top surface of the substrate, and adhering and fixing the bottom surface of the flexible semiconductor with the top surface of the substrate; forming a first metal block and a third metal block on the flexible semiconductor in an electroplating mode, forming a first accommodating groove and a first positioning groove on the first metal block, and forming a second accommodating groove on the third metal block; a second positioning groove is formed in the first pin, and a third positioning groove is formed in the second pin; machining a first positioning block and a second positioning block on the bottom surface of the second metal block, machining a first bayonet on the side surface of the second metal block, machining a third positioning block on the bottom surface of the fourth metal block, and machining a third bayonet on the side surface of the fourth metal block; loading the end part of the first pin into a first accommodating groove, smearing conductive adhesive on a second metal block, and fixing the second metal block on the first metal block, so that the first positioning block and the second positioning block respectively enter the first positioning groove and the second positioning groove; loading the end part of the second pin into a second accommodating groove, smearing conductive adhesive on the third metal block, fixing the fourth metal block on the third metal block, and enabling the third positioning block to enter the third positioning groove; the two groups of locking pieces are respectively buckled at two ends of the Schottky rectifying device, so that an upper lock catch and a lower lock catch of the two groups of locking pieces are respectively buckled in the first bayonet, the second bayonet, the third bayonet and the fourth bayonet; the two groups of movable blocks are respectively arranged on the guide rails of the two groups of locking pieces, and the connecting blocks at the rear ends of the four groups of push-pull pieces are respectively pressed and arranged in the connecting grooves of the corresponding movable blocks, so that the side parts of the pins enter the embedded openings at the front ends of the push-pull pieces.
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| KR20190040564A (en) * | 2017-10-11 | 2019-04-19 | 세종대학교산학협력단 | Flexible light emitting device and method for manufacturing the same |
| CN111446302A (en) * | 2020-01-17 | 2020-07-24 | 华中科技大学 | Flexible transverse Schottky rectifier diode, preparation method and system |
| CN111834293A (en) * | 2020-07-29 | 2020-10-27 | 山东傲晟智能科技有限公司 | Stretchable OLED panel and preparation method thereof |
| WO2021066137A1 (en) * | 2019-10-03 | 2021-04-08 | 株式会社Flosfia | Semiconductor element and semiconductor device |
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| KR20190040564A (en) * | 2017-10-11 | 2019-04-19 | 세종대학교산학협력단 | Flexible light emitting device and method for manufacturing the same |
| WO2021066137A1 (en) * | 2019-10-03 | 2021-04-08 | 株式会社Flosfia | Semiconductor element and semiconductor device |
| CN111446302A (en) * | 2020-01-17 | 2020-07-24 | 华中科技大学 | Flexible transverse Schottky rectifier diode, preparation method and system |
| CN111834293A (en) * | 2020-07-29 | 2020-10-27 | 山东傲晟智能科技有限公司 | Stretchable OLED panel and preparation method thereof |
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