CN117576344A - Three-dimensional grid model generation method and device, equipment and storage medium - Google Patents

Three-dimensional grid model generation method and device, equipment and storage medium Download PDF

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Publication number
CN117576344A
CN117576344A CN202311624860.8A CN202311624860A CN117576344A CN 117576344 A CN117576344 A CN 117576344A CN 202311624860 A CN202311624860 A CN 202311624860A CN 117576344 A CN117576344 A CN 117576344A
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dimensional
grid
parameters
dimensional grid
modeled
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张驰
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Xian Wingtech Information Technology Co Ltd
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Xian Wingtech Information Technology Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T17/00Three dimensional [3D] modelling, e.g. data description of 3D objects
    • G06T17/20Finite element generation, e.g. wire-frame surface description, tesselation
    • G06T17/205Re-meshing
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00Details relating to CAD techniques
    • G06F2111/20Configuration CAD, e.g. designing by assembling or positioning modules selected from libraries of predesigned modules

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  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Computer Graphics (AREA)
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  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
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Abstract

The embodiment of the application discloses a method, a device, equipment and a storage medium for generating a three-dimensional grid model, which comprise the following steps: obtaining an object to be modeled and grid parameters, carrying out two-dimensional grid division on each surface of the object to be modeled according to the grid parameters, obtaining two-dimensional grids to be optimized from the divided two-dimensional grids, carrying out optimization treatment on the two-dimensional grids to be optimized to obtain target two-dimensional grids of each surface of the object to be modeled, and generating a three-dimensional grid model of the object to be modeled according to the target two-dimensional grids of each surface of the object to be modeled. The method has the advantages that the two-dimensional grid can be optimized, the quality and the accuracy of the three-dimensional grid model are improved, grid parameters can be input according to actual requirements through a parameter setting interface, the applicability and the expandability of the method are enhanced, the whole generation process is automatic, the possibility of human errors is reduced, the time and the workload are saved, and the complex three-dimensional grid model can be quickly and efficiently generated.

Description

Three-dimensional grid model generation method and device, equipment and storage medium
Technical Field
The embodiment of the application relates to a three-dimensional modeling technology, and relates to a method, a device, equipment and a storage medium for generating a three-dimensional grid model.
Background
With the development of the electronic industry, the market puts forward higher requirements on the design and production of electronic products, such as high quality, intelligence, environmental protection and the like. Meanwhile, the iteration speed of the electronic product is continuously accelerated, so that how to realize faster and more accurate design and manufacture becomes an important research field, and the current method for processing complex appearance and complex internal structural parts in the whole machine model pretreatment process of the electronic product by using Hypermesh mainly depends on manually setting modeling parameters, performing grid division by using a 2D modeling function, and adjusting grids by manually dividing and merging nodes. While these methods may implement corresponding processes, there is also some complexity and time consuming.
Therefore, how to intelligently perform grid cleaning to improve processing efficiency, reduce human errors, and improve consistency and repeatability of modeling is a problem to be solved.
Disclosure of Invention
In view of this, the method, device, equipment and storage medium for generating a three-dimensional grid model provided by the embodiments of the present application can intelligently perform grid cleaning, so as to improve processing efficiency, reduce human errors, and promote consistency and repeatability of modeling. The method, the device, the equipment and the storage medium for generating the three-dimensional grid model are realized in the following way:
The method for generating the three-dimensional grid model provided by the embodiment of the application comprises the following steps:
obtaining an object to be modeled and grid parameters, wherein the object to be modeled comprises a plurality of surfaces;
performing two-dimensional grid division on each surface of the object to be modeled according to the grid parameters;
obtaining a two-dimensional grid to be optimized from the divided two-dimensional grid, wherein the two-dimensional grid to be optimized comprises two-dimensional grids of which the two-dimensional grid parameters do not meet preset length parameters and/or preset angle parameters;
performing optimization treatment on the two-dimensional grid to be optimized to obtain target two-dimensional grids of all surfaces of the object to be molded, wherein grid parameters of the target two-dimensional grids meet the preset length parameters and the preset angle parameters;
and generating a three-dimensional grid model of the object to be modeled according to the target two-dimensional grids of the surfaces of the object to be modeled.
In some embodiments, the obtaining the two-dimensional grid to be optimized from the divided two-dimensional grid includes:
traversing the divided two-dimensional grids to obtain two-dimensional grids which do not meet the preset length parameters and/or the preset angle parameters;
acquiring adjacent two-dimensional grids with the distance from the two-dimensional grids which do not meet the preset length parameter and/or the preset angle parameter within a preset range;
The two-dimensional grid to be optimized comprises the two-dimensional grid which does not meet the preset length parameter and/or the preset angle parameter and the adjacent two-dimensional grid.
In some embodiments, the optimizing the two-dimensional grid to be optimized to obtain a target two-dimensional grid of each surface of the object to be modeled includes:
and re-dividing the two-dimensional network to be optimized according to the grid parameters to obtain target two-dimensional grids of the surfaces of the object to be modeled.
In some embodiments, the re-dividing the two-dimensional network to be optimized according to the grid parameters to obtain a target two-dimensional grid of each surface of the object to be modeled includes:
after the two-dimensional networks to be optimized are re-divided according to the grid parameters, traversing each two-dimensional network, and judging whether the two-dimensional grid parameters of each two-dimensional grid meet the preset length parameters and the preset angle parameters;
and under the condition that the two-dimensional grid parameters of each two-dimensional grid meet the preset length parameters and the preset angle parameters, obtaining the target two-dimensional grid of each surface of the object to be molded.
In some embodiments, after said determining whether the two-dimensional grid parameters of each two-dimensional grid meet the preset length parameters and the preset angle parameters, the method further comprises:
Marking the partial two-dimensional network under the condition that the two-dimensional grid parameters of the partial two-dimensional grid do not meet the preset length parameters and/or the preset angle parameters, wherein each marked two-dimensional network comprises at least three marking points;
determining a two-dimensional grid to be combined according to the distance between every two marking points in at least three marking points of each marked two-dimensional network, wherein the two-dimensional grid to be combined comprises at least three marking points, and the distance between two target marking points of the at least three marking points is smaller than a preset distance;
and merging target mark points in the two-dimensional grids to be merged.
The obtaining the target two-dimensional grids of the surfaces of the object to be molded comprises the following steps:
and after merging the target mark points in the two-dimensional grids to be merged, obtaining target two-dimensional grids of each surface of the object to be modeled.
In some embodiments, the obtaining the object to be modeled includes:
outputting a modeling interface, wherein the modeling interface comprises at least one modeling object;
and determining the object to be modeled in response to the selection operation on the modeling interface.
In some embodiments, the acquiring grid parameters includes:
outputting a parameter setting interface;
In response to an input operation at the parameter setting interface, the grid parameters are determined, including a grid maximum size and a grid minimum size.
The device for generating the three-dimensional grid model provided by the embodiment of the application comprises:
the system comprises an acquisition unit, a storage unit and a storage unit, wherein the acquisition unit is used for acquiring an object to be modeled and grid parameters, and the object to be modeled comprises a plurality of surfaces;
the dividing unit is used for carrying out two-dimensional grid division on each surface of the object to be modeled according to the grid parameters;
the acquisition unit is also used for acquiring the two-dimensional grid to be optimized from the divided two-dimensional grid, wherein the two-dimensional grid to be optimized comprises two-dimensional grids of which the two-dimensional grid parameters do not meet preset length parameters and/or preset angle parameters;
the optimizing unit is used for optimizing the two-dimensional grids to be optimized to obtain target two-dimensional grids of each surface of the object to be modeled, and grid parameters of the target two-dimensional grids meet the preset length parameters and the preset angle parameters;
and the generating unit is used for generating a three-dimensional grid model of the object to be molded according to the target two-dimensional grids of the surfaces of the object to be molded.
The computer device provided by the embodiment of the application comprises a memory and a processor, wherein the memory stores a computer program capable of running on the processor, and the processor realizes the method described by the embodiment of the application when executing the program.
The computer readable storage medium provided in the embodiments of the present application stores a computer program thereon, which when executed by a processor implements the method provided in the embodiments of the present application.
According to the method, the device, the computer equipment and the computer readable storage medium for generating the three-dimensional grid model, through obtaining the object to be modeled and grid parameters, carrying out two-dimensional grid division on each surface of the object to be modeled according to the grid parameters, obtaining the two-dimensional grid to be optimized from the divided two-dimensional grids, carrying out optimization treatment on the two-dimensional grid to be optimized to obtain the target two-dimensional grid of each surface of the object to be modeled, and generating the three-dimensional grid model of the object to be modeled according to the target two-dimensional grid of each surface of the object to be modeled. Therefore, the whole generation process is automated, the possibility of human errors is reduced, time and workload are saved, a complex three-dimensional grid model can be quickly and efficiently generated, intelligent grid cleaning is realized, the processing efficiency is improved, the human errors are reduced, and the consistency and the repeatability of modeling are improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the technical aspects of the application.
FIG. 1 is a schematic flow chart of a method for generating a three-dimensional mesh model according to an embodiment of the present application;
FIG. 2 is a flow chart of another method for generating a three-dimensional mesh model disclosed in an embodiment of the present application;
FIG. 3 is a single mesh schematic of a method of generating a three-dimensional mesh model disclosed in an embodiment of the present application;
FIG. 4 is a schematic diagram of a grid before optimization of a method for generating a three-dimensional grid model according to an embodiment of the present application;
FIG. 5 is an optimized mesh schematic of a method for generating a three-dimensional mesh model disclosed in an embodiment of the present application;
FIG. 6 is a schematic structural diagram of a three-dimensional mesh model generating device according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
For the purposes, technical solutions and advantages of the embodiments of the present application to be more apparent, the specific technical solutions of the present application will be described in further detail below with reference to the accompanying drawings in the embodiments of the present application. The following examples are illustrative of the present application, but are not intended to limit the scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the present application.
In the following description, reference is made to "some embodiments" which describe a subset of all possible embodiments, but it is to be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments and can be combined with one another without conflict.
It should be noted that the term "first/second/third" in reference to the embodiments of the present application is used to distinguish similar or different objects, and does not represent a specific ordering of the objects, it being understood that the "first/second/third" may be interchanged with a specific order or sequence, as permitted, to enable the embodiments of the present application described herein to be implemented in an order other than that illustrated or described herein.
In view of this, the embodiment of the application provides a method for generating a three-dimensional grid model. Fig. 1 is a schematic implementation flow diagram of a method for generating a three-dimensional mesh model according to an embodiment of the present application. As shown in fig. 1, the method may include the following steps 101 to 105:
Step 101, obtaining an object to be modeled and grid parameters, wherein the object to be modeled comprises a plurality of surfaces.
In the embodiment of the application, the electronic device provides a modeling interface, and selectable modeling objects, such as spheres, cubes, complex curved surfaces and the like, are displayed on the modeling interface, and a user can select an object to be modeled through clicking or other operations.
The modeling interface also includes a parameter settings interface on which adjustable grid parameter options, such as maximum and minimum dimensions, are provided. Alternatively, the user may perform parameter setting through a slider, an input box, or other means.
And 102, carrying out two-dimensional meshing on each surface of the object to be modeled according to the mesh parameters. Alternatively, a Delaunay triangulation algorithm may be applied to each surface. The algorithm adaptively generates a continuous triangular mesh based on the location of the point set. May be implemented using an existing Delaunay triangulation library.
Further, for complex surfaces, the surface may be discretized first, converted to a series of discrete points, and then triangulated.
Step 103, obtaining a two-dimensional grid to be optimized from the divided two-dimensional grid, wherein the two-dimensional grid to be optimized comprises two-dimensional grids of which the two-dimensional grid parameters do not meet preset length parameters and/or preset angle parameters. Optionally, the electronic device traverses all the two-dimensional grids, calculates the length of each edge and the angle of each grid inner angle, and compares the length with the preset length parameter and the angle parameter. And collecting the two-dimensional grids which do not meet the preset length parameters and/or the angle parameters to form a two-dimensional grid set to be optimized.
In some embodiments, the partitioned two-dimensional grid is traversed to obtain a two-dimensional grid that does not satisfy the preset length parameter and/or the preset angle parameter. Alternatively, for each two-dimensional grid, its side length and minimum interior angle are calculated. Checking whether the side length of the two-dimensional grid is smaller than a preset minimum length or whether the minimum internal angle deviates from a preset angle range. If the side length of one two-dimensional grid is smaller than the preset minimum length or the minimum internal angle deviates from the preset angle range, the two-dimensional grid is added into the two-dimensional grid set which does not meet the preset parameters.
In some embodiments, an adjacent two-dimensional grid having a distance within a preset range from a two-dimensional grid that does not satisfy a preset length parameter and/or a preset angle parameter is obtained. Optionally, for each grid in the two-dimensional grid set which does not meet the preset parameters, other two-dimensional grids within a certain distance around the grid are searched to serve as adjacent grids. Alternatively, the distance may be defined by a preset radius. It is ensured that the collected two-dimensional meshes are not repeatedly processed, and only neighboring two-dimensional meshes that have not been added to the set are collected.
In some embodiments, the two-dimensional grid to be optimized comprises a two-dimensional grid and an adjacent two-dimensional grid that do not meet the preset length parameter and/or the preset angle parameter. Optionally, in the embodiment of the present application, the two-dimensional grid that does not meet the preset parameters and the adjacent two-dimensional grid thereof are combined into a two-dimensional grid set to be optimized.
Further, in the merging process, it is possible to confirm whether the mesh should be merged by calculating the distance between the mark points. If the distance between at least three marker points is less than the preset distance threshold, they are considered as the target mesh to be merged. And merging marked points in the target to-be-merged grids, and adding the marked points as a new two-dimensional grid into the to-be-optimized two-dimensional grid set.
Step 104, optimizing the two-dimensional grid to be optimized to obtain target two-dimensional grids of all surfaces of the object to be modeled, wherein grid parameters of the target two-dimensional grids meet preset length parameters and preset angle parameters. Alternatively, a Laplacian algorithm may be used to optimize the two-dimensional grid to be optimized. The Laplacian algorithm makes the side length and angle inside the grid gradually approach the preset parameters by iteratively adjusting the points on the grid. Optionally, in the optimization process, the number of iterations and the step length of the optimization can be adjusted as required to balance the effect of the optimization and the calculation performance.
In some embodiments, the two-dimensional network to be optimized is repartitioned according to the grid parameters to obtain target two-dimensional grids of the surfaces of the object to be modeled. Optionally, the two-dimensional grid to be optimized is re-divided according to the grid parameters, and the preliminary division of the target two-dimensional grid is obtained. For each two-dimensional grid, judging whether the two-dimensional grid parameters meet preset length parameters and preset angle parameters. If the two-dimensional grid parameters meet the preset parameters, the two-dimensional grid is a part of the target two-dimensional grid, and the target two-dimensional grid is reserved. If the two-dimensional grid parameters do not meet the preset parameters, optimization processing is needed. For the two-dimensional grid which does not meet the preset parameters, optionally, the vertex positions of the two-dimensional grid are adjusted to meet the preset length parameters and the preset angle parameters. An optimization algorithm may be employed, alternatively, an iterative algorithm may be selected to automatically adjust the mesh shape. Consistency with neighboring grids needs to be considered in tuning to maintain overall consistency of the model.
Optionally, adjacent grids meeting the preset parameters are found around the two-dimensional grids not meeting the preset parameters, and merging operation is performed. The new mesh after merging should meet preset parameter requirements and maintain surface smoothness and shape continuity with the original mesh.
Alternatively, for a two-dimensional grid that does not meet preset parameters, a local optimization algorithm may be used to adjust its shape, such as a smoothing operation, a surface fit, and the like. And the two-dimensional grid meets the preset parameter requirement by changing the vertex position or the topological structure on the grid. And obtaining the target two-dimensional grids of each surface of the object to be molded after optimization treatment.
In some embodiments, after the two-dimensional networks to be optimized are repartitioned according to the grid parameters, traversing each two-dimensional network, and judging whether the two-dimensional grid parameters of each two-dimensional grid meet the preset length parameters and the preset angle parameters. Optionally, traversing each two-dimensional grid, and judging whether the two-dimensional grid parameters of each two-dimensional grid meet preset length parameters and preset angle parameters. For each two-dimensional grid, the side length and angle are calculated and compared with preset length parameters and preset angle parameters. And if the side length and the angle meet the preset parameter requirements, the two-dimensional grid is regarded as a part of the target two-dimensional grid meeting the conditions. And marking the two-dimensional grids which do not meet the preset length parameters and/or the preset angle parameters, so that the two-dimensional grids become grids to be combined. Alternatively, to be merged, each marked two-dimensional grid must contain at least three mark points. The points may be selected to be located anywhere on the vertices or boundaries of the two-dimensional mesh.
In some embodiments, the target two-dimensional grid of each surface of the object to be modeled is obtained in case the two-dimensional grid parameters of each two-dimensional grid satisfy the preset length parameters and the preset angle parameters. Optionally, the two-dimensional grids to be combined are determined according to the distance between every two marking points in each marked two-dimensional grid. The distance between two target marking points of at least three marking points in the two-dimensional grid to be combined is smaller than a preset distance. And traversing the two-dimensional grids after each mark, and calculating the distance between every two mark points. If the distance between two marking points is smaller than the preset distance, classifying the two-dimensional grids where the marking points are positioned into the same two-dimensional grid to be combined. And merging target mark points in the two-dimensional grids to be merged. For each two-dimensional grid to be combined, determining target marking points in the two-dimensional grids, wherein the target marking points are required to meet preset length parameters and preset angle parameters. And merging the target mark points to form a new target two-dimensional grid. And after the merging is completed, obtaining the target two-dimensional grids of each surface of the object to be modeled.
In some embodiments, the partial two-dimensional network is marked, each marked two-dimensional network comprising at least three marking points, in case the two-dimensional grid parameters of the partial two-dimensional grid do not meet the preset length parameters and/or the preset angle parameters. Optionally, judging whether the two-dimensional grid parameters meet preset length parameters and preset angle parameters: traversing the divided two-dimensional grids, calculating the side length and angle of each two-dimensional grid, and comparing the side length and angle with the preset length parameter and the preset angle parameter.
Optionally, if the side length and the angle of the two-dimensional grid do not meet the preset parameter requirements, marking the two-dimensional grid as the two-dimensional grid to be optimized. Marking a part of the two-dimensional grid which does not meet the preset length parameter and/or the preset angle parameter:
optionally, for each marked two-dimensional grid in the two-dimensional grid to be optimized, at least three marking points are ensured, and the marking points can be vertexes of the two-dimensional grid.
Alternatively, if the number of marked points in one two-dimensional grid is less than three, it is combined with the adjacent two-dimensional grid that is not marked until the condition of at least three marked points is satisfied.
In some embodiments, the two-dimensional grid to be combined is determined according to the distance between every two marking points in at least three marking points of each marked two-dimensional network, and the distance between two target marking points of at least three marking points included in the two-dimensional grid to be combined is smaller than the preset distance. Optionally, determining the two-dimensional grids to be combined, and determining the two-dimensional grids to be combined, wherein the distance between the target mark points is smaller than the preset distance according to the distance between the mark points in each marked two-dimensional grid. And selecting two marker points closest to the two marker points as merging target marker points, and adding the two-dimensional grids where the two marker points are positioned into a two-dimensional grid list to be merged.
In some embodiments, the target marker points in the two-dimensional grid to be merged are merged. Optionally, merging target mark points in the two-dimensional grid to be merged: and traversing each two-dimensional grid in the two-dimensional grid list to be combined, and combining all the two-dimensional grids adjacent to the target mark point. The merged two-dimensional mesh will contain all vertices and edges of the original two-dimensional mesh and form new target marker points.
In some embodiments, obtaining a target two-dimensional grid of respective surfaces of an object to be modeled includes:
and after merging the target mark points in the two-dimensional grids to be merged, obtaining the target two-dimensional grids of each surface of the object to be modeled. Optionally, finally obtaining a target two-dimensional grid of each surface of the object to be modeled: after the merging of the target mark points is completed, the optimized target two-dimensional grids of the surfaces of the object to be molded are obtained. The target two-dimensional grid meets the requirements of preset length parameters and preset angle parameters and can be used for generating a three-dimensional grid model of an object to be modeled.
Step 105, generating a three-dimensional grid model of the object to be modeled according to the target two-dimensional grids of the surfaces of the object to be modeled.
In the embodiment of the application, a curved surface reconstruction algorithm is applied to the optimized target two-dimensional grid, and optionally, a Poisson reconstruction algorithm can be used for curved surface reconstruction. The Poisson reconstruction is performed on the basis of a gradient field of discrete data, a smooth three-dimensional curved surface can be obtained, the Poisson reconstruction can be realized by using the existing Poisson reconstruction library, the Poisson reconstruction is input into a target two-dimensional grid of each surface, and the Poisson reconstruction is output into a corresponding three-dimensional surface grid.
And splicing or jointly generating the three-dimensional grids of each surface to obtain a complete three-dimensional grid model.
According to the method and the device, the two-dimensional grid division is carried out on each surface of the object to be modeled according to the grid parameters, the size and the shape of each grid can be accurately controlled, and the divided grids are closer to the surface characteristics of the actual object. The method can effectively avoid the problem of discontinuity or detail loss caused by overlarge or overlarge grids, and improves the accuracy and the sense of reality of the model. Aiming at the two-dimensional grid which does not meet the preset length parameter and angle parameter, the two-dimensional grid is optimized to meet the expected parameter requirement. By adjusting the vertex position, the length and the angle of the edge and other attributes of the grid, the two-dimensional grid can keep the continuity of the original shape and the topological structure as much as possible while meeting the parameter requirements, so as to obtain smoother and more consistent grid layout. The target two-dimensional grid generated after the optimization processing has more reasonable and satisfactory grid parameters. The method can be better adapted to the shape and structure of the actual object, is more accurate and fine in terms of expression details and curvature of the curved surface, and improves the quality and visual effect of the model. Based on the target two-dimensional grid, the target two-dimensional grid is converted into a three-dimensional grid model by using a generating algorithm, so that the consistency of the finally generated model and the shape of the original object can be ensured. The generated three-dimensional model has realism, continuity and renderability.
Fig. 2 is a schematic implementation flow diagram of another method for generating a three-dimensional mesh model according to an embodiment of the present application. As shown in fig. 2, the method may include the following steps 201 to 205:
201. outputting a modeling interface, wherein the modeling interface comprises at least one modeling object.
In the embodiment of the application, the electronic device provides a user-friendly modeling interface, which may be a graphical interface or a Web-based application program, so that a user can easily browse and select an object to be modeled. And displaying a plurality of objects to be modeled in a list or thumbnail form in the modeling interface. Each object to be modeled should contain a name, thumbnail or other visual representation, as well as other relevant information.
202. And determining an object to be modeled in response to the selection operation of the modeling interface.
In the embodiment of the application, the user can select the object to be molded through clicking, dragging or using a keyboard operation. Alternatively, the user may click on a thumbnail or check box of an object to select one or more objects. When the user performs the selection operation, the selection state of the user is fed back on the interface. The selected objects may be identified by highlighting them, changing their color, or displaying a tick mark aside, etc. The user may cancel the selection by clicking on the selected object or pressing a delete button on the keyboard to delete the selected object. The interface should provide some additional functionality to help the user better manage the object to be modeled. Alternatively, a search bar, filter, or class tab may be provided to enable the user to quickly find the desired object. The interface may also support batch selection and operation. Alternatively, the user may hold the Shift key and click on multiple objects, or select all objects using a full selection function. After the user has selected the object to be modeled, the user may click a confirmation button or perform other appropriate operations so that the system uses the selected object for the subsequent modeling process.
203. And outputting a parameter setting interface.
In the embodiment of the application, a parameter setting interface is output, and a parameter setting interface is added in a modeling interface, wherein the interface can comprise a grid maximum size input box: for the user to input the maximum size of the grid. Grid minimum size input box: for the user to input the minimum size of the grid. A confirm button: after the user clicks the confirm button, the electronic device will acquire and verify the entered grid parameters.
204. In response to an input operation at the parameter setting interface, a grid parameter is determined, the grid parameter including a grid maximum size and a grid minimum size.
In the embodiment of the application, an input operation is received: the system monitors the input operation of the user on the parameter setting interface and records the input content of the user. Determining grid parameters: after the confirm button is clicked, the electronic device processes and validates the grid maximum size and the grid minimum size entered by the user. Optionally, the method comprises the steps of: checking whether the user input is legal: the system checks whether the maximum size of the grid and the minimum size of the grid input by the user are positive integers and the maximum size should be equal to or greater than the minimum size. Processing user input: if the user input is legal, the system will extract and save the grid maximum size and the grid minimum size of the user input. Storing grid parameters: the system stores the processed and verified grid parameters, which can be optionally stored in a database or configuration file for later use. Modeling operation is carried out: and carrying out two-dimensional grid division on each surface of the object to be modeled according to the determined grid parameters, and obtaining the two-dimensional grid to be optimized. The method comprises the following specific steps: traversing the surface of an object to be modeled: traversing each surface of the object to be modeled. Two-dimensional meshing is performed according to the meshing parameters: and according to the maximum size and the minimum size of the grid input by the user, carrying out two-dimensional grid division on each surface to generate a preliminary two-dimensional grid. Acquiring a two-dimensional grid to be optimized: and checking and acquiring the two-dimensional grids which do not meet the preset length parameters and/or the preset angle parameters from the divided two-dimensional grids.
205. And acquiring an object to be molded and grid parameters, wherein the object to be molded comprises a plurality of surfaces.
For the description of step 205, please refer to the description of step 101 in the embodiment shown in fig. 1, and the description is omitted here.
According to the method and the device, through the output modeling interface, a user can intuitively browse and select the modeling object. The interface design can provide better visual effect, so that a user can clearly know the appearance, shape and structure of an object to be molded. In response to a user's selection operation at the modeling interface, the system may accurately determine the object to be modeled selected by the user. The design enables a user to flexibly select an interesting model for modeling, and meets personalized requirements and authoring intentions. Through the output parameter setting interface, the user can conveniently adjust grid parameters. The interface design can provide an intuitive operation mode, so that a user can easily input required grid parameters without deep knowledge of algorithms or programming languages. In response to user input operations at the parameter setting interface, the system can accurately acquire desired grid parameters, such as maximum and minimum dimensions of the grid. The design enables a user to flexibly adjust the accuracy and the detail level of the grid according to specific requirements and application scenes.
It should be understood that, although the steps in the flowcharts described above are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in the flowcharts described above may include a plurality of sub-steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of execution of the sub-steps or stages is not necessarily sequential, but may be performed alternately or alternately with at least a part of the sub-steps or stages of other steps or other steps.
Fig. 3 is a single mesh schematic diagram of a method for generating a three-dimensional mesh model according to an embodiment of the present application. As shown in fig. 3:
in the embodiment of the present application, a, b, and c are three vertices of a mesh, when judging whether the mesh meets preset parameters, lengths of ab, ac, and bc are respectively obtained, whether minimum lengths in ab, ac, and bc meet minimum length parameters is judged, angles of inner angles corresponding to the three vertices a, b, and c are respectively obtained, whether angles of inner angles corresponding to the three vertices a, b, and c meet minimum angle parameters is judged, and if the minimum lengths or the minimum angles are not met, the mesh is judged to be the mesh to be optimized.
Fig. 4 is a schematic diagram of a grid before optimization of a method for generating a three-dimensional grid model according to an embodiment of the present application, and fig. 5 is a schematic diagram of a grid after optimization of a method for generating a three-dimensional grid model according to an embodiment of the present application. As shown in fig. 4 and 5:
in this embodiment of the present application, each grid of an object to be modeled is determined according to the method illustrated in fig. 3, all grids and adjacent grids of a preset parameter that are not satisfied are obtained, fig. 4 is a two-dimensional grid before optimization, where the two-dimensional grid before optimization includes a plurality of grids, the plurality of grids include a grid to be optimized and a grid adjacent to the grid to be optimized, the grid to be optimized shown in fig. 4 is optimized, after the grids adjacent to the grid to be optimized are combined and divided with the grid to be optimized, grid points are reduced, and the grid after optimization is obtained, as shown in fig. 5, and becomes two grid points in fig. 5.
Based on the foregoing embodiments, the embodiments of the present application provide a generating device of a three-dimensional mesh model, where the generating device includes each module included, and each unit included in each module may be implemented by a processor; of course, the method can also be realized by a specific logic circuit; in an implementation, the processor may be a Central Processing Unit (CPU), a Microprocessor (MPU), a Digital Signal Processor (DSP), a Field Programmable Gate Array (FPGA), or the like.
Fig. 6 is a schematic structural diagram of a generating device of a three-dimensional mesh model according to an embodiment of the present application, as shown in fig. 6, the device 600 includes an obtaining unit 601, a dividing unit 602, an optimizing unit 603, and a generating unit 604, where:
an obtaining unit 601, configured to obtain an object to be modeled and grid parameters, where the object to be modeled includes a plurality of surfaces;
a dividing unit 602, configured to perform two-dimensional meshing on each surface of the object to be modeled according to the mesh parameters;
further, the obtaining unit 601 is further configured to obtain a two-dimensional grid to be optimized from the divided two-dimensional grid, where the two-dimensional grid to be optimized includes two-dimensional grids whose two-dimensional grid parameters do not satisfy the preset length parameter and/or the preset angle parameter;
the optimizing unit 603 is configured to perform optimization processing on the two-dimensional grid to be optimized to obtain target two-dimensional grids of each surface of the object to be modeled, where grid parameters of the target two-dimensional grids meet preset length parameters and preset angle parameters;
the generating unit 604 is configured to generate a three-dimensional grid model of the object to be modeled according to the target two-dimensional grids of the surfaces of the object to be modeled.
In some embodiments, the obtaining unit 601 is specifically configured to traverse the divided two-dimensional grid, and obtain a two-dimensional grid that does not meet the preset length parameter and/or the preset angle parameter;
Further, the acquiring unit 601 is specifically configured to acquire an adjacent two-dimensional grid whose distance from the two-dimensional grid that does not satisfy the preset length parameter and/or the preset angle parameter is within a preset range;
the two-dimensional grid to be optimized comprises a two-dimensional grid and an adjacent two-dimensional grid which do not meet preset length parameters and/or preset angle parameters.
In some embodiments, the dividing unit 602 is specifically configured to re-divide the two-dimensional network to be optimized according to the grid parameters, to obtain the target two-dimensional grid of each surface of the object to be modeled.
In some embodiments, the obtaining unit 601 is specifically configured to, after repartitioning the two-dimensional network to be optimized according to the grid parameters, traverse each two-dimensional network, and determine whether the two-dimensional grid parameters of each two-dimensional grid meet the preset length parameters and the preset angle parameters;
further, the obtaining unit 601 is further specifically configured to obtain the target two-dimensional grid of each surface of the object to be molded when the two-dimensional grid parameter of each two-dimensional grid meets the preset length parameter and the preset angle parameter.
In some embodiments, the optimizing unit 603 is specifically configured to mark a portion of the two-dimensional network, where the two-dimensional grid parameters of the portion of the two-dimensional grid do not meet the preset length parameter and/or the preset angle parameter, and each marked two-dimensional network includes at least three mark points;
Further, the optimizing unit 603 is further specifically configured to determine, according to a distance between each two marking points in at least three marking points of each marked two-dimensional network, a two-dimensional grid to be combined, where a distance between two target marking points of at least three marking points included in the two-dimensional grid to be combined is smaller than a preset distance;
further, the optimizing unit 603 is further specifically configured to merge target mark points in the two-dimensional grid to be merged;
further, the optimizing unit 603 is further specifically configured to obtain, after merging the target mark points in the two-dimensional grids to be merged, a target two-dimensional grid of each surface of the object to be modeled.
In some embodiments, the obtaining unit 601 is specifically configured to output a modeling interface, where the modeling interface includes at least one modeling object;
further, the obtaining unit 601 is further specifically configured to determine an object to be modeled in response to a selection operation of the modeling interface.
In some embodiments, the obtaining unit 601 is specifically configured to output a parameter setting interface;
further, the obtaining unit 601 is further specifically configured to determine a grid parameter in response to an input operation at the parameter setting interface, where the grid parameter includes a grid maximum size and a grid minimum size.
The description of the apparatus embodiments above is similar to that of the method embodiments above, with similar advantageous effects as the method embodiments. For technical details not disclosed in the device embodiments of the present application, please refer to the description of the method embodiments of the present application for understanding.
It should be noted that, in the embodiment of the present application, the division of the modules by the three-dimensional grid model generating device shown in fig. 6 is schematic, and is merely a logic function division, and there may be another division manner in actual implementation. In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units. Or in a combination of software and hardware.
It should be noted that, in the embodiment of the present application, if the method is implemented in the form of a software functional module, and sold or used as a separate product, the method may also be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially or part contributing to the related art, and the computer software product may be stored in a storage medium, including several instructions for causing an electronic device to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read Only Memory (ROM), a magnetic disk, an optical disk, or other various media capable of storing program codes. Thus, embodiments of the present application are not limited to any specific combination of hardware and software.
The embodiment of the application provides a computer device, which may be a server, and an internal structure diagram thereof may be shown in fig. 7. The computer device includes a processor, a memory, and a network interface connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database of the computer device is for storing data. The network interface of the computer device is used for communicating with an external terminal through a network connection. Which computer program, when being executed by a processor, carries out the above-mentioned method.
The present embodiment provides a computer-readable storage medium, on which a computer program is stored, which when executed by a processor, implements the steps of the method provided in the above embodiment.
The present application provides a computer program product comprising instructions which, when run on a computer, cause the computer to perform the steps of the method provided by the method embodiments described above.
It will be appreciated by those skilled in the art that the structure shown in fig. 7 is merely a block diagram of some of the structures associated with the present application and is not limiting of the computer device to which the present application may be applied, and that a particular computer device may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, the three-dimensional mesh model generating apparatus provided in the present application may be implemented in the form of a computer program, which may be executed on a computer device as shown in fig. 7. The memory of the computer device may store the various program modules that make up the apparatus. The computer program of each program module causes a processor to perform the steps in the methods of each embodiment of the present application described in the present specification.
It should be noted here that: the description of the storage medium and apparatus embodiments above is similar to that of the method embodiments described above, with similar benefits as the method embodiments. For technical details not disclosed in the storage medium, storage medium and device embodiments of the present application, please refer to the description of the method embodiments of the present application for understanding.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" or "some embodiments" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" or "in some embodiments" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in various embodiments of the present application, the sequence numbers of the foregoing processes do not mean the order of execution, and the order of execution of the processes should be determined by the functions and internal logic thereof, and should not constitute any limitation on the implementation process of the embodiments of the present application. The foregoing embodiment numbers of the present application are merely for describing, and do not represent advantages or disadvantages of the embodiments. The foregoing description of various embodiments is intended to highlight differences between the various embodiments, which may be the same or similar to each other by reference, and is not repeated herein for the sake of brevity.
The term "and/or" is herein merely an association relation describing associated objects, meaning that there may be three relations, e.g. object a and/or object B, may represent: there are three cases where object a alone exists, object a and object B together, and object B alone exists.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the several embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described embodiments are merely illustrative, and the division of the modules is merely a logical function division, and other divisions may be implemented in practice, such as: multiple modules or components may be combined, or may be integrated into another system, or some features may be omitted, or not performed. In addition, the various components shown or discussed may be coupled or directly coupled or communicatively coupled to each other via some interface, whether indirectly coupled or communicatively coupled to devices or modules, whether electrically, mechanically, or otherwise.
The modules described above as separate components may or may not be physically separate, and components shown as modules may or may not be physical modules; can be located in one place or distributed to a plurality of network units; some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional module in each embodiment of the present application may be integrated in one processing unit, or each module may be separately used as one unit, or two or more modules may be integrated in one unit; the integrated modules may be implemented in hardware or in hardware plus software functional units.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the above method embodiments may be implemented by hardware related to program instructions, and the foregoing program may be stored in a computer readable storage medium, where the program, when executed, performs steps including the above method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read Only Memory (ROM), a magnetic disk or an optical disk, or the like, which can store program codes.
Alternatively, the integrated units described above may be stored in a computer readable storage medium if implemented in the form of software functional modules and sold or used as a stand-alone product. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially or part contributing to the related art, and the computer software product may be stored in a storage medium, including several instructions for causing an electronic device to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a removable storage device, a ROM, a magnetic disk, or an optical disk.
The methods disclosed in the several method embodiments provided in the present application may be arbitrarily combined without collision to obtain a new method embodiment.
The features disclosed in the several product embodiments provided in the present application may be combined arbitrarily without conflict to obtain new product embodiments.
The features disclosed in the several method or apparatus embodiments provided in the present application may be arbitrarily combined without conflict to obtain new method embodiments or apparatus embodiments.
The foregoing is merely an embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A method for generating a three-dimensional mesh model, comprising:
obtaining an object to be modeled and grid parameters, wherein the object to be modeled comprises a plurality of surfaces;
performing two-dimensional grid division on each surface of the object to be modeled according to the grid parameters;
obtaining a two-dimensional grid to be optimized from the divided two-dimensional grid, wherein the two-dimensional grid to be optimized comprises two-dimensional grids of which the two-dimensional grid parameters do not meet preset length parameters and/or preset angle parameters;
performing optimization treatment on the two-dimensional grid to be optimized to obtain target two-dimensional grids of all surfaces of the object to be molded, wherein grid parameters of the target two-dimensional grids meet the preset length parameters and the preset angle parameters;
and generating a three-dimensional grid model of the object to be modeled according to the target two-dimensional grids of the surfaces of the object to be modeled.
2. The method of claim 1, wherein the obtaining the two-dimensional grid to be optimized from the divided two-dimensional grid comprises:
traversing the divided two-dimensional grids to obtain two-dimensional grids which do not meet the preset length parameters and/or the preset angle parameters;
acquiring adjacent two-dimensional grids with the distance from the two-dimensional grids which do not meet the preset length parameter and/or the preset angle parameter within a preset range;
the two-dimensional grid to be optimized comprises the two-dimensional grid which does not meet the preset length parameter and/or the preset angle parameter and the adjacent two-dimensional grid.
3. The method according to claim 2, wherein the optimizing the two-dimensional grid to be optimized to obtain the target two-dimensional grid of each surface of the object to be modeled includes:
and re-dividing the two-dimensional network to be optimized according to the grid parameters to obtain target two-dimensional grids of the surfaces of the object to be modeled.
4. A method according to claim 3, wherein said re-dividing the two-dimensional network to be optimized according to the grid parameters to obtain a target two-dimensional grid of each surface of the object to be modeled, comprises:
After the two-dimensional networks to be optimized are re-divided according to the grid parameters, traversing each two-dimensional network, and judging whether the two-dimensional grid parameters of each two-dimensional grid meet the preset length parameters and the preset angle parameters;
and under the condition that the two-dimensional grid parameters of each two-dimensional grid meet the preset length parameters and the preset angle parameters, obtaining the target two-dimensional grid of each surface of the object to be molded.
5. The method of claim 4, wherein after said determining whether the two-dimensional grid parameters of each two-dimensional grid meet the preset length parameters and the preset angle parameters, the method further comprises:
marking the partial two-dimensional network under the condition that the two-dimensional grid parameters of the partial two-dimensional grid do not meet the preset length parameters and/or the preset angle parameters, wherein each marked two-dimensional network comprises at least three marking points;
determining a two-dimensional grid to be combined according to the distance between every two marking points in at least three marking points of each marked two-dimensional network, wherein the two-dimensional grid to be combined comprises at least three marking points, and the distance between two target marking points of the at least three marking points is smaller than a preset distance;
Merging target mark points in the two-dimensional grids to be merged;
the obtaining the target two-dimensional grids of the surfaces of the object to be molded comprises the following steps:
and after merging the target mark points in the two-dimensional grids to be merged, obtaining target two-dimensional grids of each surface of the object to be modeled.
6. The method according to any one of claims 1-5, wherein the obtaining an object to be modeled comprises:
outputting a modeling interface, wherein the modeling interface comprises at least one modeling object;
and determining the object to be modeled in response to the selection operation on the modeling interface.
7. The method of any of claims 1-5, wherein the obtaining grid parameters comprises:
outputting a parameter setting interface;
in response to an input operation at the parameter setting interface, the grid parameters are determined, including a grid maximum size and a grid minimum size.
8. A three-dimensional mesh model generation apparatus, comprising:
the system comprises an acquisition unit, a storage unit and a storage unit, wherein the acquisition unit is used for acquiring an object to be modeled and grid parameters, and the object to be modeled comprises a plurality of surfaces;
the dividing unit is used for carrying out two-dimensional grid division on each surface of the object to be modeled according to the grid parameters;
The acquisition unit is also used for acquiring the two-dimensional grid to be optimized from the divided two-dimensional grid, wherein the two-dimensional grid to be optimized comprises two-dimensional grids of which the two-dimensional grid parameters do not meet preset length parameters and/or preset angle parameters;
the optimizing unit is used for optimizing the two-dimensional grids to be optimized to obtain target two-dimensional grids of each surface of the object to be modeled, and grid parameters of the target two-dimensional grids meet the preset length parameters and the preset angle parameters;
and the generating unit is used for generating a three-dimensional grid model of the object to be molded according to the target two-dimensional grids of the surfaces of the object to be molded.
9. A computer device comprising a memory and a processor, the memory storing a computer program executable on the processor, characterized in that the processor implements the steps of the method of any of claims 1 to 7 when the program is executed.
10. A computer readable storage medium, on which a computer program is stored, which computer program, when being executed by a processor, implements the method according to any one of claims 1 to 7.
CN202311624860.8A 2023-11-30 2023-11-30 Three-dimensional grid model generation method and device, equipment and storage medium Pending CN117576344A (en)

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