CN117572569A - Optical module integrated equipment and communication system - Google Patents

Abstract

The embodiment of the application discloses optical module integrated equipment and a communication system, wherein the equipment comprises an optical module, a heat dissipation module and a power supply, and the power supply is respectively and electrically connected with the optical module and the heat dissipation module; the power supply is used for supplying power to the optical module and the heat dissipation module; the heat dissipation module is used for dissipating heat of the optical module; the optical module is provided with a first interface and a second interface; the first interface of the optical module is used for connecting with a network port of the first communication equipment; the second interface of the optical module is used for connecting with the transmission network equipment. The optical module is deployed outside the server through the optical module integrated equipment, so that hardware decoupling of the server and the optical module is realized, the server does not need to carry out hardware design change for meeting the heat dissipation requirement of the optical module, the optical module can independently carry out heat dissipation design, and the design difficulty of the server and the optical module is reduced; in addition, the optical module can dissipate heat through the independent heat dissipation module, so that the energy efficiency ratio is higher, and the energy consumption is smaller.

Description

Optical module integrated equipment and communication system

Technical Field

The application relates to the technical field of servers, in particular to optical module integrated equipment and a communication system.

Background

With the continuous development of optical communication technology, the data transmission rate of the network card is higher and higher, and the network card with the data transmission rate as high as 400Gbps/s is commercialized at present. The higher the data transmission rate, the higher the power of a photoelectric conversion module (optical module for short) supporting data transmission, and the more heat the optical module emits during operation. Therefore, the optical module product also puts higher demands on heat dissipation.

The communication architecture of the server communication scenario may refer to fig. 1, where an optical module of the server is disposed downstream of an internal air duct of the server, and incoming air at the optical module may be heated by an upstream central processing unit (central processing unit, CPU) or other components; in addition, when the optical module performs electro-optic conversion, a large amount of accumulated heat is generated at the optical module when the CPU of the server and the optical module work simultaneously due to heat generated by partial current which is not completely converted into photoelectrons.

In the current heat dissipation solutions, more or more power fans are deployed in the server to meet the heat dissipation requirement of the optical module. However, due to the relationship between the position and the distance between the fan and the optical module in the server, the heat dissipation efficiency of the fan to the optical module is low, and the system energy consumption is high. Therefore, in the server communication scenario, how to perform heat dissipation design for the high-speed optical module in the server has become a difficulty in the heat dissipation design of the server.

Disclosure of Invention

The embodiment of the application provides optical module integrated equipment and a communication system, which can realize hardware decoupling of a server and an optical module, and the hardware decoupling are designed independently of each other, so that the design difficulty of the server and the optical module is reduced; meanwhile, the optical module can radiate heat through the independent heat radiation module, so that the heat radiation efficiency is higher, and the energy consumption of the system is smaller.

A first aspect of embodiments of the present application provides an optical module integration device, including: the device comprises an optical module, a heat dissipation module and a power supply; the power supply is respectively and electrically connected with the optical module and the heat dissipation module; the power supply is used for supplying power to the light module and the heat dissipation module; the heat dissipation module is used for dissipating heat of the optical module; the optical module is provided with a first interface and a second interface; the first interface of the optical module is used for connecting with a network port of first communication equipment; the first communication device is a server or a switch; the second interface of the optical module is used for connecting with transmission network equipment; the transmission network device is configured to implement long-range optical communication of the first communication device.

Wherein the first interface is an electrical signal interface; the second interface is an optical signal interface.

In the embodiment of the application, the optical module is deployed outside the server through the optical module integrated equipment, so that the hardware decoupling of the server and the optical module is realized, the server does not need to carry out hardware design improvement for meeting the heat dissipation requirement of the optical module, the optical module can independently carry out heat dissipation design, and the design difficulty of the server and the optical module is reduced; in addition, the optical module can dissipate heat through the independent heat dissipation module, so that the energy efficiency ratio is higher, and the energy consumption is smaller.

In one possible implementation, the first interface is a direct connect cable DAC interface.

According to the embodiment of the application, the optical module in the optical module integrated equipment is connected with the server or the switch through the DAC interface, the optical module can be supported to communicate at a high transmission rate, meanwhile, compared with an active optical cable (active optical cables, AOC), the connector module of the DAC cable is free of an optical laser and other electronic elements, and cost and power consumption are saved on the premise that the DAC cable can keep high-speed communication quality in a short-distance communication scene such as a machine room.

In one possible implementation, the heat dissipation module is an air-cooled heat dissipation module or a liquid-cooled heat dissipation module.

In this embodiment of the application, can select forced air cooling heat dissipation module or liquid cooling heat dissipation module to dispel the heat to the optical module according to the actual condition and the heat dissipation demand of optical module integrated equipment place environment, design flexibility is higher.

In one possible implementation, the heat dissipation module is a fan; the optical module integrated device further comprises a control module; the control module is respectively and electrically connected with the power supply and the fan; the power supply supplies power to the control module; the control module is used for controlling the fan to radiate heat for the light module.

In this embodiment of the application, through setting up control module in optical module integrated equipment to control fan dispels the heat to optical module, can dispel the heat to optical module according to different heat dissipation strategies, the flexibility is higher.

In one possible implementation, the light module integration device further comprises a temperature sensor; the temperature sensor is electrically connected with the power supply; the temperature sensor is used for acquiring temperature information of the optical module; the control module is used for controlling the heat radiation mode of the fan to the optical module according to the temperature information acquired by the temperature sensor.

In this embodiment of the application, the temperature information of the optical module is obtained by setting the temperature sensor in the optical module integrated device, so that the control module can control the fan to conduct targeted heat dissipation according to the temperature information, the heat dissipation efficiency can be improved, and the energy consumption can be reduced.

In one possible implementation, the temperature sensor is provided inside, outside or on the surface of the light module.

In this embodiment of the application, the temperature sensor can be arranged at different positions in the optical module integrated device, and the design flexibility is higher.

In one possible implementation, the light module integration device further comprises a first indicator light; the first indicator light is electrically connected with the light module; the first indicator light is used for indicating the working state of the optical module.

In this embodiment of the present application, through setting up first pilot lamp in order to instruct the operating condition of optical module in the optical module integrated equipment for managers or fortune dimension personnel can confirm the operating condition of this optical module at present fast, can in time maintain when optical module trouble.

In one possible implementation, the control module is further configured to monitor an operation state of the optical module integrated device, and report the operation state to the management system.

In the embodiment of the application, the control module can report the abnormal information of the optical module integrated equipment in operation to the management system in time so that operation and maintenance personnel can identify and process faults in time.

A second aspect of embodiments of the present application provides a communication system, including: a cabinet, a first communication device and an optical module integration device as may be implemented in any one of the first aspects; the first communication device and the optical module integrated device are arranged in the cabinet; the optical module integrated device communicates with a network port of the first communication device through a first interface.

In one possible implementation, the communication system further includes a cable backplane; the first interface of the optical module integrated equipment is connected with the first interface of the cable backboard; the second interface of the cable backboard is connected with the network port of the first communication equipment.

In one possible implementation, the enclosure is a rack and the first communication device includes a rack server.

In one possible implementation, the first communication device is a high-density server; the high-density server includes a plurality of computing nodes, each computing node including the portal.

In one possible implementation, the communication system is a whole cabinet server, and the first communication device may be a server node or a switch in the whole cabinet server; in other words, when the communication system is a whole cabinet server, the optical module set of the server node and the switch node may be configured as an optical module integrated device.

Drawings

FIG. 1 is a schematic diagram of a communication architecture in a server communication scenario;

fig. 2 is a connection schematic diagram of an optical module integrated device and a first communication device provided in an embodiment of the present application;

fig. 3 is a schematic structural diagram of an optical module integrated device according to an embodiment of the present application;

fig. 4 is a schematic flow chart of controlling heat dissipation of an optical module integrated device according to an embodiment of the present application;

FIG. 5 is a schematic view of a front panel according to an embodiment of the present disclosure;

FIG. 6 is a schematic view of a back panel according to an embodiment of the present disclosure;

Fig. 7 is a schematic structural diagram of an optical module according to an embodiment of the present application;

FIG. 8 is a data flow diagram of a server communication process according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a communication system according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of another communication system according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of another communication system according to an embodiment of the present application.

Detailed Description

Embodiments of the present application will now be described with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some, but not all embodiments of the present application. As a person of ordinary skill in the art can know, with the development of technology and the appearance of new scenes, the technical solutions provided in the embodiments of the present application are applicable to similar technical problems.

The terms first, second and the like in the description and in the claims of the present application and in the above-described figures, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments described herein may be implemented in other sequences than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Optical modules are widely used in optical communication devices as an important component in optical fiber communications. For example, in a machine room of a data center, optical modules are arranged inside a network switch and a server so as to realize data intercommunication of communication between the network switch and the server, between the network switches and between the servers; in a mobile communication base station, for example, an optical module is arranged inside a remote radio unit (remote radio unit, RRU) and an indoor baseband processing unit (building baseband unit, BBU), and the remote radio unit and the indoor baseband processing unit are communicated through optical fibers.

During operation of the light module, it is difficult for the light module to convert the percent of input current into photoelectrons, and unconverted current will be dissipated in the form of heat; if this heat builds up in large amounts in the server, it will reduce the life of the internal components of the server, material degradation, reliability degradation and even damage. Therefore, heat emitted from the optical module needs to be dissipated by a fan provided in the server.

In the heat radiation design of the server, the heat radiation priority of the CPU is higher, and the heat radiation effect of the CPU needs to be guaranteed preferentially; the CPU needs to be connected with each component in the server and is usually arranged in the middle of the server; the optical module needs to be connected with external equipment through optical fibers and is arranged at the edge position of the server; the fan is required to maximize heat exchange between the inside and the outside of the push server, and thus is also provided at the air inlet and outlet of the edge position of the server. Therefore, except for the server with customized design, the heat dissipation design of the fan in the common server is shown as the server structure in fig. 1, the fan pushes air flow to form an air channel when working, the CPU is positioned at the upstream of the air channel, the optical module is positioned at the downstream of the air channel, and the hot air heated by the CPU is transported to the outside for heat exchange after passing through the optical module.

In the server structure shown in fig. 1, the incoming air of the optical module is heated not only by the heat emitted from the CPU, but also due to the distance relation with the fan, the wind speed is reduced after the incoming air reaches the optical module, and the heat dissipation effect is reduced. Therefore, to meet the heat dissipation requirement of the optical module, one method is to modify the hardware layout inside the server and customize the development server so that part of fans inside the server can be dedicated to the heat dissipation of the optical module, and correspondingly, the production cost of the server will be increased; the other mode is that under the condition that the structure of the server is unchanged, the fan power is increased, or more fans are added to meet the heat dissipation requirement of the optical module, so that the scheme has lower energy efficiency and high energy consumption.

In order to solve the above-mentioned problems, referring to fig. 2, fig. 2 is a schematic connection diagram of an optical module integrated device and a first communication device provided in an embodiment of the present application, and decoupling of the first communication device 20 and the optical module 110 in terms of a hardware structure is achieved by deploying optical modules 110a to 110c (hereinafter collectively referred to as optical modules 110) outside the first communication devices 20a to 20c (hereinafter Wen Tongchen first communication device 20). Wherein the optical module integration device 10 comprises at least one optical module 110, the first communication device 20 comprises a network card 210. It should be noted that, the optical module integrated device 110 further includes a heat dissipation module 120 and a power supply 130, and the power supply 130 is electrically connected to the optical module 110 and the heat dissipation module 120, respectively. It will be appreciated that the connection between the power supply 130 and the optical module 110 is not shown in fig. 2 for simplicity of the drawing.

The optical module 110 is configured to perform conversion of an optical signal, specifically, receive an electrical signal sent by the network card 210, convert the electrical signal into an optical signal, and send the optical signal through the transmission network device 30, so that information carried by the electrical signal can be remotely transmitted to a corresponding second communication device; and is further configured to receive an optical signal sent by the remote second communication device through the transmission network device 30, convert the optical signal into an electrical signal, and send the electrical signal to the network card 210 of the first communication device 20.

The first communication device 20 may be a server or a switch.

Wherein the first communication device 20 and the second communication device are connected through the optical module integration device 10 and the transmission network device 30.

The power supply 130 is used for supplying power to the optical module 110 and the heat dissipation module 120 so that the optical module 110 and the heat dissipation module 120 can operate; the heat dissipation module 120 is configured to dissipate heat of the optical module 110, so that the optical module 110 can maintain a good working state.

In the embodiment of the present application, the optical module integrated device 10 has an independent power supply 130 for supplying power to the optical module 110 and the heat dissipation module 120; in the case where the optical module 110 decoupled from the server and/or the switch is integrated in the optical module integrated device 10, the overall power consumption of the server and/or the switch can be reduced.

Optionally, the heat dissipation module 120 is an air-cooled heat dissipation module; illustratively, the heat dissipating module 120 may be a fan.

Optionally, the heat dissipation module 120 is a liquid-cooled heat dissipation module; the heat dissipation may be performed by a liquid-cooled working fluid, for example, deionized water, an alcohol-based solution, a fluorocarbon working fluid, mineral, oil, or silicone oil.

The optical module 110 may be connected to the network card 210 of the first communication device 20 through a direct connection cable (direct attach cable, DAC), and the first communication device 20 may be connected to the transmission network device 30 through the optical module integrated device 10, so as to implement remote communication with a remote second communication device.

Wherein the transmission network device 30 is used for enabling long-range optical communication of the first communication device, in particular, the transmission network device 30 is used for enabling communication of the first communication device 20 and the second communication device which are far apart. Illustratively, the transport network device 30 may include a fiber channel through which the optical module 110 may connect to the second communication device; the transport network device may further include one or more transit devices, and the optical module 110 may be connected to one of the transit devices through an optical fiber, and then connected to the second communication device through the one or more transit devices.

The transit device may be any one of a router, a base station, a digital subscriber line access multiplexer (digital subscriber line access multiplexer, DSLAM), a switch, and a digital subscriber line (digital subscriber line, DSL) gateway.

In this embodiment of the present application, the first communication device 20 is connected to the optical module integrated device 10 through a DAC cable, and the optical module 110 capable of supporting a high transmission rate performs communication at a high rate, for example, the optical module 110 supporting 400Gbps/800Gbps performs communication at its highest transmission rate; meanwhile, compared with an active optical cable (active optical cables, AOC), the connector module of the DAC cable does not have an optical laser and other electronic elements, and the DAC cable can save cost and power consumption on the premise that communication quality is kept in a short-distance communication scene such as a machine room.

Optionally, as shown in fig. 2, the optical module integrated device 10 includes a plurality of optical modules 110, where each optical module 110 is connected to a network card of the first communication device 20 respectively.

Optionally, the optical module integrated device 10 includes an optical module 110, where the optical module 110 is connected to the network cards 210 of the plurality of first communication devices 20 through the branching device at the same time; the plurality of first communication devices 20 may alternately use the optical module 110 for optical communication by specifying an occupied time, an occupied time period, or an occupied order.

After the first communication device 20 and the optical module 110 are subjected to hardware decoupling, from the perspective of the first communication device 20, the heat dissipation requirement of the optical module 110 is not required to be considered in the heat dissipation design of the first communication device 20, so that heat dissipation components additionally arranged for meeting the heat dissipation requirement of the optical module 110 can be reduced, a server is not required to be customized, the hardware layout design of the server is not required to be changed, the problem of coupling difficulty between the hardware layout design of the server and the heat dissipation design of the optical module can be solved, and the cost is saved; meanwhile, since the optical module 110 is disposed outside the first communication device 20, a design space inside the first communication device 20 is larger, and more design schemes can be compatible.

From the perspective of the optical module 110, the optical module integrated device 10 can be provided with a heat dissipation module 120 which is specially used for dissipating heat of the optical module 110, so that the optical module integrated device has better heat dissipation effect and higher energy efficiency ratio, and is beneficial to energy conservation; meanwhile, the design of the heat dissipation module 120 is not limited by the internal space of the first communication device 20, so that the design space is wider and the degree of freedom is higher.

Therefore, in the embodiment of the present application, by implementing hardware decoupling between the first communication device 20 and the optical module 110, the design requirements and the design difficulties of the first communication device 20 and the optical module 110 can be reduced.

Optionally, the light module integrated device 10 further comprises a housing 140.

The housing 140 is provided with a receiving cavity, which may be a closed space formed by the housing 140. For example, the housing 140 may be a hollow box, that is, the housing 140 is rectangular parallelepiped, and the receiving cavity is a hollow space inside the box.

Wherein the light module 110 and the power supply 130 may be disposed in the receiving cavity. Alternatively, the heat dissipation module 120 may be disposed in the accommodating cavity.

It can be appreciated that when the heat dissipation module 120 is a liquid cooling heat dissipation module, the heat dissipation module 120 may be wound around the housing 140, or pass through a receiving cavity of the housing 140, and exchange heat with hot air in the receiving cavity by using a cooling liquid circulating in the liquid cooling heat dissipation module, so as to carry away heat generated by the light removal module 110.

Where the first communication device 20 is a server, it may be a blade server, a high-density server, a rack server, a general server, a graphics processor (graphics processing unit, GPU) server, a data processor (data processing unit, DPU) server, or an artificial intelligence (artificial intelligence, AI) server. The first communication device 20 is internally provided with a network card 210, the network card 210 is connected to the optical module 110, and the network card 210 is used for communicating with a second communication device, which may be another server by way of example, through the optical module integrated device 10 and the transmission network device 30. Optionally, the second communication device is an optical communication device.

It will be appreciated that in some other possible implementations, the first communication device 20 may also be other communication devices or terminals provided with a network card 210.

Referring to fig. 3 on the basis of the structure shown in fig. 2, fig. 3 is a schematic structural diagram of an optical module integrated device according to an embodiment of the present application.

As shown in fig. 3, the light module integrated device 10 includes a light module 110, a heat dissipation module 120, and a power supply 130.

In one implementation, the light module integrated device 10 further includes a control module 150, the control module 150 being electrically connected to the power supply 130 and the heat dissipation module 120, respectively, the power supply 120 being further configured to supply power to the control module 150. The control module 150 is configured to control the heat dissipation module 120 to dissipate heat from the optical module 110, and illustratively, the control module 150 may control a heat dissipation mode of the heat dissipation module 120 to match the heat dissipation mode with a current temperature of the optical module. The heat dissipation mode may be set by parameters of the heat dissipation module 120, such as operation power, fan rotation speed, liquid flow rate, etc.; different heat dissipation modes can dissipate heat at different temperatures.

In one implementation, the light module integrated device 10 further includes a temperature sensor 160, the temperature sensor 160 being electrically connected to the control module 150. The temperature sensor 160 is used for acquiring temperature information of the optical module 110; the control module 150 is configured to control a heat dissipation mode of the heat dissipation module 120 according to the temperature information acquired by the temperature sensor 160.

In one implementation, the light module integrated device 10 further includes a housing 140. The components of the light module integrated device 10 are located inside the housing. The housing 140 protects the various components of the optical module integrated device 10.

In one implementation, the light module integrated device 10 further includes a first indicator light 170.

The optical module 110 is provided with a first interface 111 and a second interface 112, the network card 210 of the first communication device 20 is provided with a network port 211, and the transmission network device 30 includes an optical fiber interface; the first interface 111 is used for connecting the network port 211, that is, the first interface 111 is an electrical signal interface of the optical module 110, and is specifically used for transmitting an electrical signal with the network port 211; the second interface 112 is used for connecting an optical fiber interface, and the second interface 112 is an optical signal interface of the optical module 110, specifically used for connecting the transmission network device 30, and transmitting optical signals with the transmission network device 30.

Optionally, the first interface 111 is a direct connection cable (direct attach cable, DAC) interface.

In the case that the first interface 111 is a DAC interface, the network port 211 may be a DAC interface, and the network port 211 and the first interface 111 are directly connected through a DAC cable; the network port 211 may be another type of interface, and the network port 211 and the first interface 111 are connected through a converter.

It should be understood that the number of optical modules 110 in the optical module integrated device 10 shown in fig. 3 is merely exemplary and not limiting, and the number of optical modules 110 in the optical module integrated device 10 may be greater in practical applications.

Wherein the number of power sources 130 may be one or more; the power supply 130 may be a single-input power supply or a dual-input power supply 130, which is not specifically limited in this embodiment of the present application, and may be flexibly designed according to practical requirements.

Optionally, the light module integrated device 10 further comprises a power interface 131. The power supply 130 is connected to the power supply interface 131, and an external power supply supplies power to the power supply 130 through the power supply interface 131. Specifically, the power interface 131 is provided with a plurality of connection connectors, for example, pluggable connectors such as metal pins, metal sheets, metal columns, and the like. The power cables of different types that the different wiring connecting pieces connect, the type of power cable has 3 kinds, is live wire, zero line and ground wire respectively. The current and voltage provided by the live wire form a loop through the zero line, and the current can only pass through the loop. The ground wire is used for directly flowing current into the ground when the circuit is short-circuited, so that the safety can be ensured, and the danger of electric shock can be avoided. In practical applications, the plurality of connection connectors at least includes a connection connector of a live wire and a connection connector of a neutral wire, and further, the plurality of connection connectors may further include a connection connector of a ground wire. Illustratively, the power interface 131 includes a wired connection for a live wire, which is single-phase power.

If the power interface 131 is directly connected to the outside by adopting a wiring connector, the power interface 131 is a plug connector. A plug connector is understood to mean a relatively bulky connector. For example, the plug connector may be header C20 or C14 of IEC 60320 power cord. If the wiring connection piece of the power interface 131 adopts a jack mode to be externally connected; correspondingly, the power interface 131 is a jack connector. A receptacle connector is understood here to mean a relatively bulky connector. For example, the receptacle connector may be the header C10 or C13 of an IEC 60320 power cord. It should be noted that, in practical applications, the power interface 131 is generally required to be connected to the power strip through a power cable.

It will be appreciated that without the control module 150, the heat dissipation module 120 may operate at a constant power to dissipate heat from the optical module 110, and that the optical module integration apparatus 10 does not need to have the temperature sensor 160.

Wherein, the control module 150, the temperature sensor 160 and the first indicator light 170 are all disposed in the receiving cavity of the housing 140.

The control module 150 may be a central processing unit (central processing unit, CPU), a microprocessor, a field programmable gate array (field programmable gate array, FPGA), or other processing unit with computing capabilities. By way of example, the control module 150 may be a baseboard management controller (baseboard management controller, BMC).

The control module 150 is connected to the temperature sensor 160 through a sensor signal line, and is connected to the heat dissipation module 120 and the power supply 130 through a control signal line. The control module 150 is configured to receive temperature information acquired by the temperature sensor 160, and control a heat dissipation mode of the light module 110 by the heat dissipation module 120 according to the temperature information; the control module 150 is further configured to control the power supply 130 to supply power to the optical module 110, the heat dissipation module 120, and the control module 150 itself.

The temperature sensor 160 may be disposed inside or on the surface of the optical module 110, and collect temperature information of the corresponding optical module 110; may also be disposed on the inner surface of the accommodating cavity of the housing 140, or at other positions in the accommodating cavity, so as to collect the overall temperature information of the accommodating cavity.

The temperature sensor 160 may be directly connected to the power supply 130, and is powered by the power supply 130; the light module 110 or the control module 150 may also be connected and indirectly powered by the power supply 130.

Referring to fig. 4, as shown in fig. 4, in step 401, the optical module 110 starts to work, and the optical-electrical conversion performed inside the optical module 110 generates heat, and the temperature inside and on the surface of the optical module increases to drive the temperature inside the accommodating cavity to increase; in step 402, the temperature sensor 160 may monitor the temperature change, acquire temperature information, and transmit the temperature information back to the control module 150; in step 403, the control module 150 sends a heat dissipation instruction to the heat dissipation module 120 according to the temperature information; in step 404, the heat dissipation module 120 switches to a heat dissipation mode for enhancing heat dissipation according to the heat dissipation command, so as to enhance heat dissipation of the optical module 110; at this time, returning to step 402, after the heat dissipation module 120 strengthens heat dissipation, the temperature sensor detects the temperature of the optical module 110 or the inside of the accommodating cavity, and performs a new heat dissipation control. In this way, the temperature inside the receiving cavity and the temperature of the light module 110 are maintained within a preset acceptable temperature range.

Illustratively, the control module 150 may control the heat dissipation mode of the connected heat dissipation module 120 based on a preset heat dissipation policy, so as to better dissipate heat for the optical module integrated device 10; different heat dissipation modes may correspond to different values of the operating parameters of the various components in the heat dissipation module 120, such as the fan speed in an air-cooled heat dissipation module, and the coolant flow rate in a liquid-cooled heat dissipation module.

In one implementation, the number of the optical modules 110 is plural, and the heat dissipation module 120 includes a plurality of fans; the control module 150 may obtain temperature data of each optical module 110 through the temperature sensor 160 disposed on each optical module 110, and then adjust the operation power of each fan in real time according to the temperature data and the distance relationship between the fan and the optical module 110, so that the power consumption of the heat dissipation module 120 is as low as possible under the condition of meeting the overall heat dissipation requirement.

Optionally, the control module 150 is connected to the light module 110.

The control module 150 may run pre-developed control management software to intelligently manage the optical module integrated device 10; for example, the heat dissipation module 120 is intelligently controlled according to temperature data collected by the temperature sensor 160, and the power output of the power supply 130 is controlled according to the power requirements of the optical module 110 and the heat dissipation module 120.

The control module 150 may also be provided with a network port (not shown in the drawing), through which the control module 150 accesses the management network, and the management network is connected to the network management system, so that the overall operation condition of the optical module integrated device 10 may be reported to the management system through the management network, so that the operation and maintenance personnel can timely process the fault, and the business is guaranteed to be lossless.

Wherein the management network is composed of several network devices (e.g., switches, routers, gateways, etc.) and links connecting these network devices. Any electronic device in the plurality of electronic devices accessed to the management network can communicate with the management system; in the embodiment of the present application, the plurality of electronic devices may include one or more optical module integration devices 10, and one or more first communication devices 20.

Specifically, the control module 150 may be connected to a controller of a chassis or a cabinet in which the optical module integrated device 10 is located through the network port and the network cable; the control module 150 may be connected to a management network through the controller; the control module 150 may also connect to electronic devices in the management network through the portal and the network cable, thereby accessing the management network.

The network cable may be an RJ45 network cable, for example. The RJ45 network cable is one of connectors of an information socket (i.e., a communication outlet) in the wiring system, and the network port of the control module 150 is an RJ45 network port.

In this embodiment, the control module 150 is further configured to detect health states such as temperature, voltage, etc. of each component (e.g., the optical module 110, the heat dissipation module 120, the power supply 130) of the optical module integrated device 10, and if the components are abnormal, the control module 150 can report corresponding abnormal information to the management system in time through the management network, so that the operation and maintenance personnel can process in time, and service continuity is ensured. Illustratively, the information may be reported to the management system by two means, the first being that the control module 150 may provide various interface-upper management system queries, such as web, command line, etc.; the second is active reporting, when the control module 150 detects that a fault occurs, the control module 150 can report abnormal information to the management system through the management network in time through various industry universal specifications such as a network management protocol (simple network management protocol, SNMP), a simple mail transfer protocol (simple mail transfer protocol, SMTP), a Redfish protocol, etc., so that an operation and maintenance person can identify and process the fault in time.

Optionally, the housing 140 includes a front panel 141 and a rear panel 142. The first indicator light 170 is disposed on the front panel 141, and the first indicator light 170 is electrically connected to the light module 110; the first indicator light 170 is used for indicating the working state of the optical module 110. Specifically, the light module 110 may indicate different operation states of the light module 110 through the first indicator lights 170 of different colors, different numbers, or different frequencies.

It can be appreciated that, in the front panel 141, the position of the first indicator light 170 is hollowed out or transparent, so that the light of the first indicator light 170 can be observed from the outside of the housing 140.

It will be appreciated that in other possible implementations, the first indicator light 170 may be provided on the rear panel 142, or at other locations on the housing 140, as long as it is convenient for the service personnel to observe.

Referring specifically to fig. 5 and 6, fig. 5 and 6 are schematic views of a front panel and a rear panel of a housing according to an embodiment of the present application, respectively.

As shown in fig. 5, the front panel 141 includes an air inlet 1411, a first interface 111, and a first indicator light 170.

The air inlet 1411 is used as an inlet of external air, and is opposite to the fan 121 disposed on the rear panel 142, an air channel is formed between the air inlet 1411 and the fan 121, and hot air in the accommodating cavity of the housing 140 is transported to the outside along the air channel.

The first indicator light 170 is connected to the optical module 110, and the first indicator light 170 may be used to indicate an operating state of the first interface 111. Specifically, one first indicator light 170 may correspond to one or more first interfaces 111, and one first interface 111 may correspond to one or more first indicator lights 170, where each first indicator light 170 is configured to indicate an operating state of the corresponding first interface 111. The number of the first indicator lamps 170, the number of the first interfaces 111, and the correspondence relationship therebetween are not particularly limited in the embodiment of the present application.

Alternatively, the number of the first indicator lights 170 and the number of the first interfaces 111 may be the same and correspond to each other.

For example, when the first indicator light 170 is normally on, the corresponding first interface 111 is powered on, and the working state is normal; when the first indicator light 170 is turned off, the corresponding first interface 111 may be indicated to be powered off; when the first indicator light 170 blinks, it may indicate that the corresponding first interface 111 is forwarding data.

Alternatively, as shown in fig. 5, each first interface 111 corresponds to two first indicator lights 170.

For example, when two first indicator lights 170 corresponding to one first interface 111 are all normally on, it indicates that the working state of the first interface 111 is normal; when only one of the two first indicator lights 170 is normally on, it indicates that the working state of the first interface 111 is abnormal; when both the first indicator lights 170 are off, it indicates that the first interface 111 is powered off.

For example, one of the two first indicator lamps 170 corresponding to the first interface 111 is used as a status indicator lamp, where the status indicator lamp indicates that the first interface 111 is powered on when the status indicator lamp is normally on and indicates that the first interface 111 is powered off when the status indicator lamp is off; the other is used as a data indicator lamp, and when the data indicator lamp is normally on or blinks, the first interface 111 forwards data, and when the data indicator lamp is off, the first interface 111 is in a dormant state.

Optionally, as shown in fig. 6, the heat dissipation module 120 includes a fan 121; the rear panel 142 includes a fan 121, a second interface 112, and second indicator lamps 180 to 182.

The second indicator light 180 is connected to the power source 130, and is used for indicating an operating state of the power source 130. Illustratively, the second indicator light 180 when normally on indicates that the power supply 130 is connected and powered normally; when the power supply 130 flashes, the working state of the power supply 130 is abnormal, such as unstable power line connection, overhigh temperature or overhigh voltage and current; the extinction indicates the power supply 130 is powered off.

The second indicator light 181 is connected to the control module 150 and is used for indicating a system state of the light module integrated device 10. Illustratively, the second indicator light 181 when normally illuminated with green light indicates that the system is functioning properly; when the system blinks with green light, the system is started; when the yellow light is normally bright, the system is in fault or overheat; and when the system is extinguished, the system is powered off.

Wherein the second indicator light 182 is connected to the control module 150 for helping a maintenance person or a management person locate the light module integration apparatus 10. For example, when the control module 150 receives a management instruction, the second indicator light 182 may be caused to blink in blue light in order for a maintenance person or a management person to locate the light module integration device 10 from the server system.

It can be understood that the indicator light can be powered by the corresponding connected component, and when the indicator light is powered normally, the indicator light always lights up to indicate that the working state of the corresponding connected component is normal; when the power supply of the indicator lamp is abnormal, the indicator lamp does not emit light or flashes to emit light, and the working state of the corresponding connected component is abnormal.

In some more complex components, a logic processing unit with computing capability may be provided, which may determine its own operating state, and control one or more indicator lights connected according to the current operating state to emit lights of different colors or different frequencies to indicate the own operating state.

Referring to fig. 7, fig. 7 is a schematic structural diagram of an optical module according to an embodiment of the present application. As shown in fig. 7, the optical module 110 includes a first interface 111, a second interface 112, an electro-optical conversion unit 113, a photoelectric conversion unit 114, and a printed circuit board assembly (printed circuit board assembly, PCBA) 115. The first interface 111, the second interface 112, the electro-optical conversion unit 113, and the photoelectric conversion unit 114 are all disposed on the PCBA component 115.

The electro-optical conversion unit 113 comprises an optical transmitter 1131 and a laser 1132, the first interface 111 is connected with the optical transmitter 1131, the optical transmitter 1131 is connected with the laser 1132, and the laser 1132 is connected with the second interface 112; the photoelectric conversion unit 114 includes an optical receiver 1142 and a detector 1141, the second interface 112 is connected to the optical receiver 1142, the optical receiver 1142 is connected to the detector 1141, and the detector 1141 is connected to the first interface 111.

The optical module 110 transmits an optical signal by: the optical transmitter 1131 receives the modulated electrical signal transmitted from the network card 210 through the first interface 111, drives the laser 1132 according to the modulated electrical signal, and outputs an optical signal through the second interface 112.

The optical module 110 receives the optical signal by: the optical receiver 1142 receives, through the second interface 112, an optical signal sent by the second communication device through the transmission network device 30, and the detector 1141 generates an electrical signal by stimulated absorption of the optical signal, and then sends the electrical signal to the network card 210 through the first interface 111.

In one possible implementation, the optical module integration apparatus 10 includes a PCB board (not shown in the drawings) on which the above-described optical module 110, the heat dissipation module 120, and the control module 150 may be disposed; a power supply 130 is connected to the PCB for supplying power to the PCB.

The PCB is used to connect the optical module 110, the heat dissipation module 120 and the control module 150 with the power supply 130; but also for enabling connection of both the light module 110 and the heat dissipation module 120 to the control module 150.

In this embodiment, the optical module 110 is deployed outside the first communication device 20 through the optical module integrated device 10, so that the hardware decoupling of the first communication device 20 and the optical module 110 is achieved, the first communication device 20 does not need to perform hardware design improvement in order to meet the heat dissipation requirement of the optical module 110, the optical module 110 can perform heat dissipation design independently, and the design difficulty of the first communication device 20 and the optical module 110 is reduced; in addition, the optical module 110 can dissipate heat through an independent heat dissipation module, so that the energy efficiency ratio is higher and the energy consumption is smaller.

In the embodiment of the present application, when the optical module 110 is integrated in the optical module integrated device 10, the first communication device 20 may perform short-distance communication with the optical module 110 in the optical module integrated device 10 through the DAC cable when sending information to the second communication device at the far end, and then the optical module 110 converts the information into an optical signal, and performs long-distance transmission through the optical fiber and the transmission network device 30; the remote optical module 110 may be integrated in the optical module integrated device 10, and after receiving the optical signal forwarded by the transmission network device 30 through the optical fiber, the remote optical module integrated device 10 converts the optical signal to restore the information, and then transmits the information to the second communication device through short-distance communication, thereby implementing remote information transmission.

Referring specifically to fig. 8, fig. 8 is a data flow chart of a server communication process based on the optical module integrated device according to an embodiment of the present application. As shown in fig. 8, in the process of transmitting data from the server a to the server B, the data needs to start from the server a, pass through the optical module integrated device a, the transmission network device 30 and the optical module integrated device B, and reach the server B.

During the transmission of the data, the flow of the data is as follows:

The method comprises the steps that a processor A of a server A generates target data to be transmitted, and a target IP address of the target data is an IP address of a server B; the processor A sends the target data to the network card A, and the network card A forwards the target data to an optical module A in the optical module integrated equipment A through a DAC cable.

The optical module a modulates the target data into an electrical signal with a certain code rate, and then the electro-optical conversion module in the optical module a transmits an optical signal to the transmission network device 30 through an optical fiber according to the electrical signal.

The transmission network device 30 may be an optical fiber, i.e. the connection between the optical module a and the optical module B is made by an optical fiber, for example.

Illustratively, the transport network device 30 may also be one or more transit devices; the optical module a or the optical module B is connected to one of the one or more relay devices through an optical fiber.

After receiving the optical signal forwarded by the transmission network device 30, the photoelectric conversion module in the optical module B converts the optical signal into an electrical signal with a certain code rate; demodulating the electric signal into the target data; the target data is then sent to network card B of server B via DAC cable.

After receiving the target data, the network card B sends the target data to the processor B for processing, and the remote information transmission is completed.

According to the embodiment of the application, the DAC cable is adopted to conduct data transmission between the server and the optical module integrated equipment, the connection problem of the optical module and the server after decoupling can be solved, the data quality received by the optical module after hardware decoupling is guaranteed, and therefore the difficult problem of heat dissipation design of the optical module can be solved under the condition of maintaining the communication quality level.

The embodiment of the application further provides a communication system, referring to fig. 9, and as shown in fig. 9, the communication system includes an optical module integrated device 10 and a first communication device 20. In the specific example of fig. 9, the first communication device 20 includes a server 20a, a server 20b, and a switch 20c. Wherein each first communication device 20 comprises a portal 1 and a portal 2; the optical module integration device 10 includes network ports 1 to 3.

The network ports 1 of the first communication equipment 20 are connected with the network ports 1 of the optical module integrated equipment 10 through DAC cables, and the network ports 2 of the first communication equipment 20 are connected with the network ports 2 of the optical module integrated equipment 10 through DAC cables; the network port 3 of the optical module integrated device 10 is used for connecting transmission network devices through optical fibers, so as to connect second communication devices outside the communication system.

It will be appreciated that the portal 1 and the portal 2 of the first communication device 20 correspond to the portal 211 of the first communication device 20 in the embodiment of fig. 3 described above; the network port 1 and the network port 2 of the optical module integration apparatus 10 correspond to the first interface 111, and the network port 3 corresponds to the second interface 112.

The network port 1 and the network port 2 of the optical module integrated device 10 may be second interfaces of two optical modules in the optical module integrated device 10, that is, electrical interfaces of two optical modules. In some other possible implementations, the optical module integration device 10 includes a plurality of optical modules, and the second interface of each optical module is configured to connect to one of the ports of the first communication device 20.

The number of the network ports 3 of the optical module integrated device 10 may be one or more, and each network port 3 is used for connecting to one transmission network device.

It will be appreciated that in fig. 9, the number of network ports in the first communication device 20 connected to the optical module integration device 10 is merely exemplary and not limiting. In the communication system provided in the embodiment of the present application, the first communication device 20 includes at least one network port for connecting with the optical module integrated device 10.

In one possible implementation, the first communication device 20 includes a high-density server that includes a plurality of computing nodes, each computing node including a portal, and the portal of each computing node is connected to the portal 1 or the portal 2 of the optical module integrated device 10, respectively.

In one possible implementation, the communication system includes a cabinet, a first communication device, and the optical module integration device described in fig. 2-8 above; the first communication device and the optical module integrated device are arranged in the cabinet; the optical module integrated device communicates with a network port of the first communication device through a first interface.

In one specific possible implementation, as shown in fig. 10, the first communication device 20 includes a rack server 21; the optical module integrated device 10 and the rack server 21 are provided in the cabinet 60, and the optical module integrated device 10 is connected to the rack server 21.

Optionally, the first communication device 20 further comprises a switch 23, the switch 23 being arranged in the cabinet 60.

Alternatively, as shown in fig. 10, the optical module integration device 10, the rack server 21, and the switch 31 are connected by a first cable back plane 71.

The first cable backboard 71 may be disposed in the cabinet 60, or may be used as a backboard of the cabinet 60.

The first cable backboard 71 is provided with a first interface, and the first interface of the first cable backboard 71 is used for connecting the first interface of the optical module in the optical module integrated device 10 (namely, the network port 1 and the network port 2 of the optical module integrated device 10 in fig. 9); the first cable back plate 71 is further provided with a second interface, the second interface of the first cable back plate 71 and a network port for connecting the rack server 21 (i.e., the network port 1 and the network port 2 of the first communication device 20 in fig. 9), and the first interface and the second interface in the first cable back plate 71 are connected. In this way, after the optical module of the optical module integrated device 10 is connected to the first interface of the first cable back plate 71 and the network card of the first communication device 20 is connected to the second interface of the first cable back plate 71, the optical module of the optical module integrated device 10 and the network card of the first communication device 20 can be electrically connected through the first cable back plate 71.

It will be appreciated that the positional relationship of the optical module integration apparatus 10, the rack server 21, and the switch 23 shown in fig. 10 is merely exemplary and not limiting, and the optical module integration apparatus 10 may be disposed at the bottom or middle of the cabinet 60, and the switch 23 may be disposed at the top or bottom of the cabinet 60.

In a specific possible implementation, as shown in fig. 11, the first communication device 20 includes a blade server, the cabinet is a blade server chassis 80, and the optical module integrated device 10 and the blade server are disposed inside the blade server chassis 80.

Optionally, the first communication device 20 further includes a switch 23, and the switch 23 is disposed inside the blade server chassis 80.

Optionally, as shown in fig. 11, the communication system further includes a second cable back 72, and the blade server and the optical module integrated device 10 are connected through the second cable back 72.

The blade server may be a horizontal blade server or a vertical blade server.

In the specific example shown in fig. 11, 1 optical module integrated device 10, 8 horizontal blade servers 22, and a second cable backplane 72 are provided in the blade server chassis 80; the second cable backboard 72 is provided with a first interface and a second interface, the first interface of the second cable backboard 72 is used for connecting the first interface of the optical module in the optical module integrated device 10, the second interface of the second cable backboard 72 is used for connecting the network ports of the 8 horizontal inserting blade servers 22, and the first interface of the second cable backboard 72 is connected with the second interface, namely, the second cable backboard 72 is used for realizing the connection of the optical module integrated device 10 and the 8 horizontal inserting blade servers 22. Alternatively, 1 optical module in the optical module integrated device 10 is connected to one horizontal blade server 22. Optionally, 1 optical module in the optical module integrated device 10 connects 8 horizontal blade servers 22.

It should be noted that, the connection manner of the optical module integrated device 10 and the transverse blade server 22 is merely an example, and is not limited to a specific manner, and the flexible design can be specifically performed according to the actual requirements. In this example, the optical module integrated device 10 and the transversal blade server 22 are inserted in the blade server chassis 80, and the optical module integrated device 10 and the transversal blade server 22 are disposed on the same side of the second cable backplane 72.

It will be appreciated that in some other possible implementations, the first communication device 20 includes a vertical plug-in blade server, and the blade server chassis 80 is a chassis for housing the vertical plug-in blade server.

It should be noted that, the first cable backboard 71 and the second cable backboard 72 are specific possible implementations of the connection between the first communication device 20 and the optical module integrated device 10 through the PCB circuit board, and in practical applications, other circuit boards may be used to implement the connection between the first communication device 20 and the optical module integrated device 10.

In this embodiment of the present application, the optical module integrated device 10 is convenient for deployment, and may be disposed in a cabinet together with a plurality of first communication devices 20, so that the plurality of first communication devices 20 in the cabinet perform optical communication nearby through the optical module integrated device 10, and avoid that the DAC cable between the first communication device 20 and the optical module integrated device 10 is too long, which results in a greater degree of distortion of communication data. It should be noted that, in the embodiment of the present application, the optical module integrated device 10 may be adaptively changed according to the actual cabinet form and the form of the first communication device 20, so as to meet different service requirements.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the embodiments of the present application.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.

In the several embodiments provided in the embodiments of the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the embodiments of the present application may be essentially or, what contributes to the prior art, or part of the technical solution may be embodied in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

Claims (10)

1. An optical module integration device, comprising: the device comprises an optical module, a heat dissipation module and a power supply;

the power supply is respectively and electrically connected with the optical module and the heat dissipation module; the power supply is used for supplying power to the optical module and the heat dissipation module;

the heat dissipation module is used for dissipating heat of the optical module;

the optical module is provided with a first interface and a second interface; wherein the first interface is an electrical signal interface; the second interface is an optical signal interface;

the first interface of the optical module is used for connecting with a network port of first communication equipment; the first communication equipment is a server or a switch;

the second interface of the optical module is used for connecting with transmission network equipment; the transmission network device is configured to implement remote optical communication of the first communication device.

2. The apparatus of claim 1, wherein the first interface is a direct connect cable DAC interface.

3. The apparatus of claim 1 or 2, wherein the heat dissipation module is an air-cooled heat dissipation module or a liquid-cooled heat dissipation module.

4. A device according to any one of claims 1-3, wherein the heat dissipation module is a fan; the optical module integrated equipment further comprises a control module;

The control module is respectively and electrically connected with the power supply and the fan;

the power supply is also used for supplying power to the control module;

the control module is used for controlling the fan to radiate heat for the light module.

5. The device of claim 4, wherein the light module integrated device further comprises a temperature sensor; the temperature sensor is respectively and electrically connected with the power supply and the control module; the temperature sensor is used for acquiring temperature information of the optical module;

the control module is used for controlling the heat radiation mode of the fan to the optical module according to the temperature information acquired by the temperature sensor.

6. The device of claim 5, wherein the temperature sensor is disposed inside, outside, or on a surface of the light module.

7. The device of any of claims 4-6, wherein the control module is further configured to monitor an operational status of the light module integrated device and report the operational status to a management system.

8. The device of any of claims 1-7, wherein the light module integrated device further comprises a first indicator light;

the first indicator light is electrically connected with the optical module; the first indicator light is used for indicating the working state of the optical module.

9. A communication system, the communication system comprising: a cabinet, a first communication device and an optical module integration device as claimed in any one of claims 1-8; the first communication device and the optical module integrated device are arranged in the cabinet;

and the optical module integrated equipment communicates with the network port of the first communication equipment through a first interface.

10. The system of claim 9, wherein the communication system further comprises a cable backplane; the first interface of the optical module integrated equipment is connected with the first interface of the cable backboard; the second interface of the cable backboard is connected with the network port of the first communication equipment.