CN117570398A - Wavelength conversion module and light emitting device - Google Patents
Wavelength conversion module and light emitting device Download PDFInfo
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- CN117570398A CN117570398A CN202210945360.3A CN202210945360A CN117570398A CN 117570398 A CN117570398 A CN 117570398A CN 202210945360 A CN202210945360 A CN 202210945360A CN 117570398 A CN117570398 A CN 117570398A
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
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- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The application discloses a wavelength conversion component and a light-emitting device, and relates to the technical field of light sources. The wavelength conversion component comprises a heat dissipation substrate, a wavelength conversion piece, a first reflecting layer and a first protective layer; the wavelength conversion piece is arranged on the heat dissipation substrate and is provided with a first main surface of the conversion piece, a second main surface of the conversion piece and an outer peripheral surface of the conversion piece; the first main surface of the conversion piece faces away from the heat dissipation substrate and is used as a light receiving surface of excitation light and a light emitting surface of laser, the second main surface of the conversion piece faces towards the heat dissipation substrate and is connected with the heat dissipation substrate, and the outer peripheral surface of the conversion piece is connected with the first main surface of the conversion piece and the second main surface of the conversion piece; the first reflecting layer covers the peripheral surface of the conversion piece; and the first protective layer covers the outer peripheral surface of the first reflecting layer, which faces away from the wavelength conversion member. The wavelength conversion component can reduce light loss and improve light extraction efficiency and utilization rate.
Description
Technical Field
The application relates to the technical field of light sources, in particular to a wavelength conversion component and a light-emitting device.
Background
Currently, laser illumination display technology is gradually becoming a trend in the field of illumination display. The laser illumination display technology mainly obtains fluorescence of other wave bands by exciting luminescent materials through blue laser, and further, the luminescent devices can be divided into two main types of dynamic luminescent modules and static luminescent modules according to the working state of the luminescent devices after the luminescent devices are packaged.
For dynamic light emitting modules and static light emitting modules, fluorescent materials are often used as the light emitting materials. However, the existing fluorescent materials are difficult to effectively limit the diffusion of light spots, so that the quantity of the excited light with a large angle is large, and the light extraction efficiency and the light utilization rate are low.
Therefore, it is necessary to develop a wavelength conversion module having advantages of high extraction efficiency and small light loss.
Disclosure of Invention
In view of the above, the present application provides a wavelength conversion device and a light emitting apparatus.
To achieve the above object, the present application provides a wavelength conversion assembly including:
a heat-dissipating substrate;
a wavelength conversion member disposed on the heat-dissipating substrate and having a first main surface, a second main surface, and an outer peripheral surface; the first main surface of the conversion piece faces away from the heat dissipation substrate and is used as a light receiving surface of excitation light and a light emitting surface of laser, the second main surface of the conversion piece faces towards the heat dissipation substrate and is connected with the heat dissipation substrate, and the outer peripheral surface of the conversion piece is connected with the first main surface of the conversion piece and the second main surface of the conversion piece;
a first reflection layer covering the outer peripheral surface of the conversion member; and
the first protective layer covers the outer peripheral surface of the first reflecting layer, which faces away from the wavelength conversion element.
In order to solve the above technical problem, another technical solution adopted in the present application is to provide a light emitting device, which includes an excitation light source and a wavelength conversion component as described above; the excitation light source is used for providing excitation light to the wavelength conversion component;
the difference between the dimension of the wavelength conversion member in the direction perpendicular to the optical axis of the wavelength conversion member and the corresponding dimension of the excitation light spot formed by the excitation light incident on the first main surface of the conversion member is + -10% of the dimension of the wavelength conversion member in the direction perpendicular to the optical axis of the wavelength conversion member.
The beneficial effects are that: in the wavelength conversion component, the wavelength conversion element is arranged on the heat dissipation substrate and is provided with a first main surface of the conversion element, a second main surface of the conversion element and an outer peripheral surface of the conversion element; the first main surface of the conversion piece faces away from the heat dissipation substrate and is used as a light receiving surface of excitation light and a light emitting surface of laser, the second main surface of the conversion piece faces towards the heat dissipation substrate and is connected with the heat dissipation substrate, and the outer peripheral surface of the conversion piece is connected with the first main surface of the conversion piece and the second main surface of the conversion piece; the first reflecting layer covers the peripheral surface of the conversion piece; and the first protective layer covers the outer peripheral surface of the first reflecting layer, which faces away from the wavelength conversion member. By the mode, the light rays emitted from the peripheral surface of the conversion piece are converged after being reflected by the first reflecting layer and emitted through the first main surface of the conversion piece, so that light loss caused by transverse light guiding of the laser in the wavelength conversion piece is reduced, and light extraction efficiency and utilization rate are improved.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a wavelength conversion component according to the present application;
FIG. 2 is a schematic illustration of the incidence of an excitation beam in an embodiment of a wavelength conversion device according to the present application;
FIG. 3 is a schematic diagram of a top view of a portion of a wavelength conversion element, a first reflective layer, and a second reflective layer according to an embodiment of the wavelength conversion component of the present application;
FIG. 4 is a schematic diagram illustrating the dimensions of a wavelength conversion element and the corresponding dimensions of an excitation light spot according to an embodiment of the wavelength conversion device of the present application;
FIG. 5 is a schematic view of an optical path of an embodiment of a wavelength conversion component of the present application;
FIG. 6 is a schematic diagram illustrating a structural division of a heat dissipating substrate according to an embodiment of the wavelength conversion device of the present application;
FIG. 7 is a schematic diagram of an embodiment of a wavelength conversion component according to the present application;
FIG. 8 is a schematic view of an optical path of an embodiment of a wavelength conversion component of the present application;
FIG. 9 is a schematic diagram of an embodiment of a wavelength conversion component according to the present application;
FIG. 10 is a schematic diagram of an embodiment of a wavelength conversion component of the present application;
FIG. 11 is a schematic diagram of an embodiment of a wavelength conversion component according to the present application;
fig. 12 is a schematic structural view of the light emitting device of the present application.
Reference numerals illustrate:
10. a light emitting device; 100. a wavelength conversion component; 110. a heat-dissipating substrate; 111. connecting the corresponding parts; 112. an extension part; 120. a wavelength conversion member; 130. a first reflective layer; 140. a first protective layer; 150. a second reflective layer; 160. a second protective layer; 170. an adhesive layer; z, optical axis of wavelength conversion component; y, converting the first direction of the piece; x, converting the second direction of the piece; l, exciting light beam; l10, excitation light; l20, laser; s10, exciting light spots; a1, the size of the wavelength conversion element; a2, the corresponding size of the excitation light spot;
121. a first major face of the conversion element; 122. a second major face of the conversion element; 123. the outer peripheral surface of the conversion piece; 1231. a first side of the conversion member; 1232 transition piece second side; 1233 transition piece third side; 1234. and a fourth side of the conversion member.
Detailed Description
In order to better understand the technical solutions of the present application, the following describes the present application in further detail with reference to the drawings and the detailed description. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, based on the embodiments herein, which would be apparent to one of ordinary skill in the art without undue burden are within the scope of the present application.
Referring to fig. 1-5, fig. 1 is a schematic structural diagram of an embodiment of a wavelength conversion component according to the present application; FIG. 2 is a schematic illustration of the incidence of an excitation beam in an embodiment of a wavelength conversion device according to the present application; FIG. 3 is a schematic diagram of a top view of a portion of a wavelength conversion element, a first reflective layer, and a second reflective layer according to an embodiment of the wavelength conversion component of the present application; FIG. 4 is a schematic diagram illustrating the dimensions of a wavelength conversion element and the corresponding dimensions of an excitation light spot according to an embodiment of the wavelength conversion device of the present application; fig. 5 is a schematic view of an optical path of an embodiment of a wavelength conversion component according to the present application.
As shown in fig. 1-5, the wavelength conversion component 100 is configured to receive incident excitation light L10 and convert the incident excitation light L10 into laser light L20. The excitation light L10 may be incident on the wavelength conversion component 100 in the form of an excitation light beam L. The wavelength conversion assembly 100 includes a heat dissipation substrate 110, a wavelength conversion member 120, a first reflective layer 130, and a first protective layer 140.
The wavelength conversion member 120 has a conversion member first main surface 121, a conversion member second main surface 122, and a conversion member outer peripheral surface 123; the first main surface 121 of the conversion element faces away from the heat dissipation substrate 110 and serves as a light receiving surface of the excitation light L10 and a light emitting surface of the excitation light L20, and the second main surface 122 of the conversion element faces toward the heat dissipation substrate 110 and is connected to the heat dissipation substrate 110, and the outer peripheral surface 123 of the conversion element connects the first main surface 121 of the conversion element and the second main surface 122 of the conversion element. The excitation light L10 incident on the wavelength conversion element 100 enters the wavelength conversion element 120 through the first main surface 121 of the conversion element, and the wavelength conversion element 120 contains a wavelength conversion material (not shown) for converting the excitation light L10 incident on the wavelength conversion element 100 into the excitation light L20.
The first reflecting layer 130 covers the outer peripheral surface 123 of the conversion element, and the light rays emitted from the outer peripheral surface 123 of the conversion element are converged and emitted through the first main surface 121 of the conversion element after being reflected by the first reflecting layer 130, so that light loss caused by light guiding in the transverse direction (transverse direction, i.e., the direction perpendicular to the optical axis Z of the wavelength conversion assembly 100) of the wavelength conversion element 120 is reduced, light extraction efficiency and utilization rate are improved, and further, the intensity of the laser light L20 emitted from the first main surface of the wavelength conversion assembly 100 is improved.
The first protection layer 140 covers an outer circumferential surface of the first reflection layer 130 facing away from the wavelength conversion member 120. Thus, the first protection layer 140 can isolate the corrosion of the first reflection layer 130 caused by the external environmental factors passing through the outer side Zhou Miandui of the first reflection layer 130 facing away from the wavelength conversion element 120, so that the first protection layer 140 protects the first reflection layer 130.
In addition, the heat collected in the first reflective layer 130 is immediately conducted out by the first protective layer 140 due to the lateral light guiding of the reflective wavelength conversion element 120 and the heat received by the wavelength conversion element 120, so as to prevent the first reflective layer 130 from being too hot.
In one embodiment, the excitation light L10 may be a laser light including, but not limited to, a blue laser light, and the excitation light L20 may be a fluorescent light including, but not limited to, yellow fluorescent light.
In an embodiment, as shown in fig. 1 to 5, in the practical application of the wavelength conversion device 100, the excitation light L10 enters the wavelength conversion device 100 through the first main surface 121 of the conversion member, specifically, the excitation light L10 enters the wavelength conversion member 120 after passing through the first main surface 121 of the conversion member, the wavelength conversion member 120 converts the excitation light L10 into the excitation light L20, and the excitation light L20 and the excitation light L10 that is not excited are combined after being reflected by the first reflective layer 130 disposed on the outer peripheral surface 123 of the conversion member and exit from the first main surface 121 of the conversion member.
In an embodiment, the heat dissipation substrate 110 may include, but is not limited to, a copper substrate, a ceramic substrate, or an aluminum substrate. The aluminum substrate may be an aluminum reflective substrate, for example, a high-reflection aluminum substrate.
In one embodiment, the heat dissipation substrate 110 is a copper substrate, and the copper substrate is plated with gold.
In one embodiment, the heat dissipation substrate 110 is a projection substrate, and a portion of the light emitted from the second main surface 122 of the conversion element is emitted through the heat dissipation substrate 110.
In one embodiment, the heat dissipating substrate 110 is a reflective substrate, and the light emitted from the second main surface 122 of the conversion element is reflected by the heat dissipating substrate 110 back into the long conversion element 120.
In an embodiment, as shown in fig. 1-5, the first reflective layer 130 extends along the optical axis Z direction of the wavelength conversion component 100 and towards the heat dissipation substrate 110 until being attached to the heat dissipation substrate 110; and in the direction along the optical axis Z of the wavelength conversion component 120, the first main surface 121 of the conversion element does not exceed an end of the first reflective layer 130 away from the heat dissipation substrate 110. This can sufficiently reduce the light loss due to the lateral light guiding of the wavelength conversion member 120.
Further, referring to fig. 6 on the basis of fig. 1-5, fig. 6 is a schematic structural diagram of a heat dissipating substrate according to an embodiment of the wavelength conversion component of the present application.
As shown in fig. 1 to 6, the heat dissipating substrate 110 includes a connection counterpart 111 and an extension 112.
The connection counterpart 111 is a collection of a portion of the heat dissipation substrate 110 for connecting the wavelength conversion member 120, a portion of the first reflective layer 130, and a portion of the first protective layer 140. The connection counterpart 111 is further identical in size to an integrated structure formed by connecting the wavelength conversion element 100, the first reflective layer 130, and the first protective layer 140 in a direction perpendicular to the optical axis Z of the wavelength conversion element 100.
The extension 112 removes the remaining portion of the connection counterpart 111 from the heat dissipation substrate 110.
The projection formed by taking the optical axis Z direction of the wavelength conversion device 100 as the projection direction may be an orthographic projection.
In this way, the convection between the wavelength conversion device 100 and the external environment can be accelerated by using the extension portion 112, so as to accelerate the heat dissipation rate of the wavelength conversion device 100.
It should be noted that in other embodiments of the present application, the incident excitation light L10 may be non-perpendicular to the wavelength conversion member 120.
In one embodiment, the extension 112 is provided with screw holes (not shown). In this way, other optical components (not shown) may be mounted on the outer extension 112 by using screw holes through screw fasteners (not shown), or the heat dissipating substrate 110 may be mounted and fixed through the screw holes by using screw fasteners.
In an embodiment, in case of satisfying high thermal conductivity, the wavelength conversion member 120 may be a fluorescent resin, a fluorescent silica gel, a fluorescent glass, a fluorescent ceramic, a fluorescent single crystal, or the like, which is not limited in this embodiment. Further, the common fluorescent ceramics may be pure phase fluorescent ceramics such as YAG: ce ceramics or LuAGCe ceramic, the ceramic forming phase and the luminescent phase of which are the same phase and can be sintered into ceramic with higher transparency; or complex-phase fluorescent ceramics, such as YAG: ce + Al 2 O 3 Ceramic or AlN-YAG-Ce ceramic, etc., the bonding phase is Al 2 O 3 Or AlN, and the luminous phase is YAG/Ce fluorescent powder. Of course, in other embodiments, other fluorescent materials such as fluorescent silica gel or fluorescent glass may be used for the wavelength conversion member 120.
The above-mentioned complex phase ceramic means a ceramic matrix composite material, which is a small branch of the "composite material" in a large category. The term "complex phase" mainly means that two or more species "phases" exist in a material component, and is also called "multiphase ceramic". The wavelength conversion member 120 made of such a complex-phase fluorescent ceramic material has a large amount of scattering phases inside. Here, the "scattering phase" refers to a second phase material different from the main phase material, and functions to form a scattering effect on the incident excitation light L10, thereby increasing the absorption rate of the excitation light L10 and further increasing the light conversion efficiency of the excitation light L10. Thus, the ceramic main phase and the scattering phase together constitute a complex phase ceramic material, and the scattering phase is dispersed as a second phase species in the ceramic main phase. Due to the presence of a large number of such scattering phases, the light beam is scattered multiple times as it propagates inside the wavelength conversion member 120.
Further, in the case of satisfying high thermal conductivity, the wavelength conversion member 120 is Al 2 O 3 YAG ceramic, al 2 O 3 /LuAG ceramic, YAG ceramic or LuAG ceramic.
Further, the thickness of the wavelength conversion member 120 may range from 60 μm to 150 μm in consideration of luminous efficiency and thermal conductivity. For example, the thickness of the wavelength conversion member 120 may be, but is not limited to, 60 μm, 100 μm, or 150 μm. Further, the thickness of the wavelength converting element 120 may range from 80 μm to 100 μm. For example, the thickness of the wavelength conversion member 120 may be, but is not limited to, 80 μm, 86 μm, 90 μm, 94 μm, 100 μm. Preferably, the wavelength conversion member 120 may have a thickness of 90 μm. It can be appreciated that when the thickness is too small, the wavelength conversion member 120 is insufficient to sufficiently convert the excitation light L10, and when the thickness is too large, the thermal resistance of the wavelength conversion member 120 is increased and the light extraction efficiency is adversely affected.
In an embodiment, as shown in fig. 1 to 5, a1 is a dimension of the wavelength conversion element 120 in a direction perpendicular to the optical axis Z of the wavelength conversion element 100, a2 is a corresponding dimension of an excitation light spot S10 formed by the excitation light beam L incident on the first main surface 121 of the conversion element, where a1 is greater than or equal to a2, and the arrangement is such that the excitation light L10 incident on the wavelength conversion element 100 does not directly strike the first reflective layer 130, so as to avoid burning loss of the first reflective layer 130 caused by the direct incidence of the excitation light L10 incident on the wavelength conversion element 100 on the first reflective layer 130, and further avoid wastage of the excitation light L0 and improve the utilization rate of the incident excitation light L10.
It should be noted that, when the reflective layer material of the first reflective layer 130 is metal, the first reflective layer 130 is not easily burned out, and when the reflective layer material of the first reflective layer 130 is a diffuse reflective coating such as a carrier and reflective particles, there is a concern that the first reflective layer 130 is burned out.
In order that the size of the first main surface 121 of the conversion member is not too large to cause low emission intensity, the difference between the size a1 of the wavelength conversion member 120 and the corresponding size a2 of the excitation light spot S10 is within ±10% of the size a1 of the wavelength conversion member 120. In this way, the first main surface 121 of the conversion element can be limited to a smaller size, so that the wavelength conversion element 120 has a smaller light emitting surface, while avoiding the first reflective layer 130 from being burned by the excitation light L10.
In an exemplary embodiment, the size a1 of the wavelength conversion member 120 is 1mm, and the difference between the size a1 of the wavelength conversion member 120 and the corresponding size a2 of the excitation light spot S10 is within 100 μm.
In some embodiments, the excitation light spot S10 may be circular, rectangular or polygonal. Further, the projection of the wavelength conversion member 120 in the projection direction with respect to the optical axis Z direction of the wavelength conversion element 100 may be circular, rectangular or polygonal, which is not particularly limited in the embodiment of the present application.
Optionally, the excitation light spot S10 and the wavelength conversion element 120 are configured to have the same shape in the projection formed by taking the direction of the optical axis Z of the wavelength conversion element 100 as the projection direction, so that when the excitation light L10 is incident on the wavelength conversion element 120, no or less dead angle is formed in the wavelength conversion element 120, which is not directly irradiated by the excitation light L10, so as to fully utilize the wavelength conversion capability of the wavelength conversion element 120. The light spot spreading can be effectively suppressed, and the light extraction performance of the wavelength conversion assembly 100 can be greatly improved.
In one embodiment, as shown in fig. 1-5, the wavelength conversion member 120 has a conversion member first direction Y and a conversion member second direction X perpendicular to the optical axis Z of the wavelength conversion member 100; the first direction Y of the conversion element and the second direction X of the conversion element are perpendicular to each other.
Wherein the wavelength converting element 120 has dimensions in the first direction Y of the converting element and the second direction X of the converting element in the range of 0.3mm-1mm (e.g. 0.3mm, 0.5mm, 0.8mm, 1 mm).
In one example and not limitation, the dimension a1 of the wavelength conversion member 120 is the side length of the wavelength conversion member 120, and the side length of the wavelength conversion member 120 may be, but is not limited to, 0.3mm-1mm. For example 0.3mm, 0.5mm, 0.8mm, 1mm.
Alternatively, the wavelength conversion element 120 is square, the excitation light spot S10 is square, the first direction Y of the conversion element and the second direction X of the conversion element are respectively extending directions of two adjacent sides of the outer periphery of the square of the wavelength conversion element 120, and then the dimension a1 of the wavelength conversion element 120 is the side length of the wavelength conversion element 120, and the corresponding dimension a2 of the excitation light spot S10 is the side length of the excitation light spot S10.
Alternatively, the wavelength conversion member 120 is rectangular, the excitation light spot S10 is rectangular, the first direction Y of the conversion member is the width direction of the wavelength conversion member, and the second direction X of the conversion member is the length direction of the wavelength conversion member, so that the dimension a1 of the wavelength conversion member 120 includes the length of the wavelength conversion member 120 and the width of the wavelength conversion member 120, and the corresponding dimension a2 of the excitation light spot S10 includes the length of the excitation light spot S10 and the width of the excitation light spot S10. For example, the corresponding dimension a2 of the excitation light spot S10 is the length of the excitation light spot S10 for the length of the wavelength conversion member 120, and the corresponding dimension a2 of the excitation light spot S10 is the width of the excitation light spot S10 for the width of the wavelength conversion member 120.
Alternatively, the wavelength conversion member 120 is circular, the excitation light spot S10 is circular, the first direction Y of the conversion member and the second direction X of the conversion member are extending directions of two mutually perpendicular diameters of the wavelength conversion member 120, respectively, and then the dimension a1 of the wavelength conversion member 120 is the length of the diameter of the wavelength conversion member 120, and the corresponding dimension a2 of the excitation light spot S10 is the length of the diameter of the excitation light spot S10.
In one embodiment, as shown in fig. 1-5, the wavelength conversion member 120 has a conversion member first direction Y and a conversion member second direction X perpendicular to the optical axis Z of the wavelength conversion member 100; the first direction Y of the conversion element and the second direction X of the conversion element are perpendicular to each other.
Wherein the transition piece outer circumferential surface 123 includes a transition piece first side surface 1231 and a transition piece second side surface 1232 that are disposed at intervals along the transition piece first direction Y, and a transition piece third side surface 1233 and a transition piece fourth side surface 1234 that are disposed at intervals along the transition piece second direction X; the first reflective layer 130 covers the conversion member first side 1231, the conversion member second side 1232, the conversion member third side 1233, and the conversion member fourth side 1234, respectively.
In one embodiment, the heat dissipation substrate 110 is a copper substrate (not shown), and the thickness of the copper substrate ranges from 2mm to 4mm (e.g., 1mm, 2mm, 3 mm), and the dimensions of the copper substrate in the first direction Y and the second direction of the conversion element range from 7mm to 13mm (e.g., 7mm, 10mm, 13 mm). An exemplary copper substrate has a thickness of 3mm, a dimension of the copper substrate in the first direction Y of the conversion element of 10mm, and a dimension of the copper substrate in the second direction X of the conversion element of 10mm.
In one embodiment, referring to fig. 7-8, fig. 7 is a schematic structural diagram of an embodiment of a wavelength conversion component according to the present application; fig. 8 is a schematic view of an optical path of an embodiment of a wavelength conversion component according to the present application. The wavelength conversion component 100 includes a second reflective layer 150, where the second reflective layer 150 is disposed between the second main surface 122 of the conversion element and the heat dissipation substrate 110, and the second reflective layer 150 covers the second main surface 122 of the conversion element. In comparison with the structure in which the reflecting layer is covered only on the conversion-material outer peripheral surface 123, in the above-described manner, the second reflecting layer 150 cooperates with the first reflecting layer 130 to reflect and combine the light emitted from the conversion-material outer peripheral surface 123 and the light emitted from the conversion-material second main surface 122 and emit the light through the conversion-material first main surface 121, thereby further increasing the intensity of the laser light L20 emitted from the conversion-material first main surface 121.
In an embodiment, as shown in fig. 7-8, the wavelength conversion component 100 includes a second protection layer 160, where the second protection layer 160 is disposed between the second reflective layer 150 and the heat dissipation substrate 110, and the second protection layer 160 covers a side of the second reflective layer 150 facing away from the wavelength conversion element 120. Thus, the second protection layer 160 isolates the corrosion of the external environment to the side surface of the second reflection layer 150 facing away from the wavelength conversion element 120, and protects the second reflection layer 150.
In addition, the second reflective layer 150 receives the heat of the wavelength conversion element 120 and reflects the light, so that the heat is collected in the second reflective layer 150, and the heat collected in the second reflective layer 150 can be immediately conducted away by the second protective layer 160, so as to prevent the second reflective layer 150 from being over-heated.
In an embodiment, as shown in fig. 7, the dimension of the second reflective layer 150 in the direction perpendicular to the optical axis Z of the wavelength conversion element 100 is the same as the dimension of the wavelength conversion element 120 in the direction perpendicular to the optical axis Z of the wavelength conversion element 100, and the first reflective layer 130 is disposed around the outer periphery of the second reflective layer 150.
Specifically, the outer peripheral edge of the second reflective layer 150 may be flush with the conversion member outer peripheral surface 123, for example, when having the second reflective layer 150, the first reflective layer 130 covers a side surface of the second reflective layer 150 extending in the direction of the optical axis Z of the wavelength conversion member 100, and covers a side surface of the wavelength conversion member 120 extending in the direction of the optical axis Z of the wavelength conversion member 100.
In an embodiment, the outer periphery of the second protection layer 160 is flush with the outer periphery of the first reflection layer 130 facing away from the wavelength conversion element 120, and the first protection layer 140 is disposed around the outer periphery of the second protection layer 160.
Specifically, in order to reduce the manufacturing difficulty and the product structure precision, the first reflective layer 130 and the second reflective layer 150 are integrally arranged, so that no connection gap is formed between the first reflective layer 130 and the second reflective layer 150, and the lateral light guide in the wavelength conversion member 120 is prevented from leaking from the connection gap, thereby improving the reflectivity; the first protective layer 140 and the second protective layer 160 are integrally arranged, and the same is arranged, so that a connection gap between the first protective layer 140 and the second protective layer 160 is avoided, and the protective effect is improved.
In an embodiment, the reflective layer material of the first reflective layer 130 and the reflective layer material of the second reflective layer 150 may be metals. Including, for example, but not limited to, at least one of metallic silver or metallic aluminum. The reflective layer material may be integrally formed by magnetron sputtering or vapor deposition to form the first reflective layer 130 on the outer peripheral surface 123 of the conversion element and the second reflective layer 150 on the second main surface 122 of the conversion element. This makes it possible to make the thicknesses of the first and second reflective layers 130 and 150 uniform and to have high compactness and surface flatness, thereby having high reflectivity.
It should be noted that magnetron sputtering is one type of physical vapor deposition. The general sputtering method can be used for preparing various materials such as metal, semiconductor, insulator and the like, and has the advantages of simple equipment, easy control, large coating area, strong adhesive force and the like, and the ionization rate of gas must be effectively improved because the sputtering is performed at a low air pressure at a high speed. Magnetron sputtering increases the sputtering rate by introducing a magnetic field at the target cathode surface, and increasing the plasma density by confining the charged particles by the magnetic field.
In an embodiment, the first and second reflective layers 130 and 150 may be coated with a coating, including but not limited to a carrier and reflective particles, which may be one or more of spray coating, brush coating, dip coating, and electrophoretic coating.
Specifically, the materials of the first and second reflective layers 130 and 150 include carriers and reflective particles. Wherein the carrier comprises one or more of an organic carrier and an inorganic carrier; reflective particles include, but are not limited to, one or more of titanium oxide, zinc oxide, yttrium oxide, zirconium oxide, aluminum oxide, barium sulfate, and aluminum silicate. By adding reflective particles in the first reflective layer 130 and the second reflective layer 150, the laser light L20 emitted from the other surfaces of the wavelength conversion member 120 except for the first main surface 121 of the conversion member can be reflected by the reflective particles into the laser light L20 emitted through the first main surface 121 of the conversion member, so that light energy lost due to the lateral light guiding emitted from the other surfaces of the wavelength conversion member 120 except for the first main surface 121 of the conversion member is reduced, and the light utilization efficiency of the wavelength conversion assembly 100 is further improved.
In one example and not limitation, the organic carrier includes, but is not limited to, silica gel, and the inorganic carrier includes, but is not limited to, glass.
In an embodiment, the protective layer material of the first protective layer 140 and the second protective layer 160 is at least one of metallic nickel, metallic titanium and metallic gold, or the material of the first protective layer 140 and the second protective layer 160 includes an alloy of at least two of metallic nickel, metallic titanium and metallic gold. The protective layer material may be integrally formed by magnetron sputtering or vapor deposition on the outer peripheral surface of the first reflective layer 130 facing away from the wavelength conversion member 120 and the side surface of the second reflective layer 150 facing away from the wavelength conversion member 120, so as to form the first protective layer 140 on the outer periphery of the first reflective layer 130 facing away from the wavelength conversion member 120 and form the second protective layer 160 on the side surface of the second reflective layer 150 facing away from the wavelength conversion member 120.
In an embodiment, as shown in fig. 7, the wavelength conversion component 100 includes an adhesive layer 170, where the adhesive layer 170 is disposed between a side of the second protective layer 160 facing away from the wavelength conversion element 120 and the heat dissipation substrate 110, and bonds the second protective layer 160 to the heat dissipation substrate 110. By the above way, the thermal resistance between the wavelength conversion element 120 and the heat dissipation substrate 110 is low, and the heat conduction channel is smooth, so that the heat in the wavelength conversion element 120 can be conducted away in real time.
The adhesive layer 170 may be, but is not limited to, a silicone adhesive layer, a silver adhesive layer. The material of the silver colloid bonding layer is, for example, nano silver colloid.
In addition, as shown in fig. 9, fig. 9 is a schematic structural diagram of an embodiment of the wavelength conversion component of the present application. The wavelength conversion assembly 100 may include a heat dissipation substrate 110, a wavelength conversion member 120, a first reflective layer 130, a first protective layer 140, and an adhesive layer 170 without including a second reflective layer 150 and a second protective layer 160, the adhesive layer 170 bonding the wavelength conversion member 120 to the heat dissipation substrate 110. As shown in fig. 10, fig. 10 is a schematic structural diagram of an embodiment of a wavelength conversion component of the present application. The wavelength conversion assembly 100 may include a heat dissipation substrate 110, a wavelength conversion member 120, a first reflective layer 130, a second reflective layer 150, and a first protective layer 140 without including a second protective layer 160 and an adhesive layer 170, the second reflective layer 150 being directly connected to the heat dissipation substrate 110. Fig. 11 is a schematic structural view of an embodiment of a wavelength conversion component according to the present application, as shown in fig. 11. The wavelength conversion assembly 100 may include the heat dissipation substrate 110, the wavelength conversion member 120, the first reflective layer 130, the second reflective layer 150, and the adhesive layer 170 without including the second protective layer 160, the adhesive layer 170 bonding the second reflective layer 150 to the heat dissipation substrate 110.
Referring to fig. 12, fig. 12 is a schematic structural view of a light emitting device of the present application. It should be noted that in some embodiments of the present application, the wavelength conversion assembly 100 described above is not limited to be applied to static light emitting devices, and in some other embodiments of the present application, the wavelength conversion assembly 100 described above may also be applied to dynamic light emitting devices, such as color wheels.
As shown in fig. 12, the light emitting device 10 includes a wavelength conversion device 100 and an excitation light source (not shown), and the wavelength conversion device 100 is any one of the wavelength conversion devices 100 described in the foregoing embodiments of the wavelength conversion device, which is not described herein. The excitation light source is configured to provide excitation light to the wavelength conversion component, and the wavelength conversion component 100 is configured to convert the excitation light to lasing light.
Wherein the excitation light source may include, but is not limited to, a laser diode and/or an LED. The lighting device may be, but not limited to, a lighting device or a projection device, and the lighting device may be, but not limited to, a car light, a stage light, a searchlight, and the like.
It should be noted that, the various optional implementations described in the embodiments of the present application may be implemented in combination with each other, or may be implemented separately, which is not limited to the embodiments of the present application.
In the description of the present application, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description of the present application and for simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, as well as a specific orientation configuration and operation. Therefore, it is not to be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
The embodiments described above are described with reference to the drawings, and other different forms and embodiments are possible without departing from the principles of the present application, and thus the present application should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will convey the scope of the application to those skilled in the art. In the drawings, component dimensions and relative dimensions may be exaggerated for clarity. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. The terms "comprises," "comprising," and/or "includes," when used in this specification, specify the presence of stated features, integers, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, components, and/or groups thereof. Unless otherwise indicated, numerical ranges are stated to include the upper and lower limits of the range and any subranges therebetween.
The foregoing is only a part of the embodiments of the present application, and is not intended to limit the scope of the present application, and all equivalent devices or equivalent processes using the descriptions and the contents of the present application, or direct or indirect application in other related technical fields are included in the scope of patent protection of the present application.
Claims (14)
1. A wavelength conversion assembly, the wavelength conversion assembly comprising:
a heat-dissipating substrate;
a wavelength conversion member disposed on the heat dissipation substrate and having a first main surface, a second main surface, and an outer peripheral surface; the first main surface of the conversion piece faces away from the heat dissipation substrate and is used as a light receiving surface of excitation light and a light emitting surface of stimulated light, the second main surface of the conversion piece faces towards the heat dissipation substrate and is connected with the heat dissipation substrate, and the outer peripheral surface of the conversion piece is connected with the first main surface of the conversion piece and the second main surface of the conversion piece;
a first reflection layer covering the conversion member outer peripheral surface; and
and the first protective layer covers the outer peripheral surface of the first reflecting layer, which is opposite to the wavelength conversion piece.
2. The wavelength conversion component according to claim 1, wherein the first reflective layer extends along an optical axis direction of the wavelength conversion component and in a direction approaching the heat dissipating substrate until being bonded to the heat dissipating substrate.
3. The wavelength conversion component of claim 1, comprising a second reflective layer disposed between the conversion member second major face and the heat sink substrate, the second reflective layer covering the wavelength conversion member second major face.
4. The wavelength conversion component according to claim 3, wherein the wavelength conversion component comprises a second protective layer disposed between the second reflective layer and the heat dissipating substrate, and wherein the second protective layer covers a side of the second reflective layer facing away from the wavelength conversion member.
5. The wavelength conversion assembly according to claim 4, wherein,
the second reflecting layer has the same size in the direction perpendicular to the optical axis of the wavelength conversion component as the wavelength conversion member, and the first reflecting layer is surrounded on the outer periphery of the second reflecting layer.
6. The wavelength conversion component according to claim 5, wherein an outer periphery of the second protective layer is flush with an outer periphery of the first reflective layer facing away from the wavelength conversion member, and the first protective layer is disposed around the outer periphery of the second protective layer.
7. The wavelength conversion assembly according to claim 6, wherein,
the first reflecting layer and the second reflecting layer are integrally arranged; the first protective layer and the second protective layer are integrally arranged.
8. The wavelength conversion component of claim 7, wherein the material of the first and second reflective layers is metallic silver; alternatively, the materials of the first reflective layer and the second reflective layer include a carrier and reflective particles, and the carrier includes at least one of an organic carrier and an inorganic carrier; the reflective particles include at least one of titanium oxide, zinc oxide, yttrium oxide, zirconium oxide, aluminum oxide, barium sulfate, and aluminum silicate.
9. The wavelength conversion component according to claim 5, wherein the material of the first and second protective layers comprises at least one of metallic nickel, metallic titanium, and metallic gold, or the material of the first and second protective layers comprises an alloy of at least two of metallic nickel, metallic titanium, and metallic gold.
10. The wavelength conversion component of claim 5, wherein the material of the wavelength conversion member is Al 2 O 3 YAG ceramic, al 2 O 3 /LuAG ceramic, YAG ceramic or LuAG ceramic.
11. The wavelength conversion component of claim 5, wherein the wavelength conversion member has a thickness in the range of 60 μm to 150 μm.
12. The wavelength conversion component of claim 5, wherein the wavelength conversion member has a first direction of the conversion member and a second direction of the conversion member perpendicular to an optical axis of the wavelength conversion component; the first direction of the conversion piece and the second direction of the conversion piece are perpendicular to each other;
wherein the wavelength conversion member has a size range of 0.3mm to 1mm in the first direction of the conversion member and in the second direction of the conversion member.
13. The wavelength conversion component according to claim 5, wherein the wavelength conversion component comprises an adhesive layer disposed between a side of the second protective layer facing away from the wavelength conversion member and the heat dissipating substrate, and adhering the second protective layer to the heat dissipating substrate.
14. A light emitting device comprising an excitation light source and a wavelength conversion component according to any one of claims 1-13; the excitation light source is used for providing excitation light to the wavelength conversion component;
the difference between the size of the wavelength conversion member in the direction perpendicular to the optical axis of the wavelength conversion member and the corresponding size of the excitation light spot formed by the excitation light incident on the first main surface of the conversion member is + -10% of the size of the wavelength conversion member in the direction perpendicular to the optical axis of the wavelength conversion member.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210945360.3A CN117570398A (en) | 2022-08-08 | 2022-08-08 | Wavelength conversion module and light emitting device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210945360.3A CN117570398A (en) | 2022-08-08 | 2022-08-08 | Wavelength conversion module and light emitting device |
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| CN117570398A true CN117570398A (en) | 2024-02-20 |
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| CN202210945360.3A Pending CN117570398A (en) | 2022-08-08 | 2022-08-08 | Wavelength conversion module and light emitting device |
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