CN117567964A - High-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof - Google Patents
High-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof Download PDFInfo
- Publication number
- CN117567964A CN117567964A CN202311305706.4A CN202311305706A CN117567964A CN 117567964 A CN117567964 A CN 117567964A CN 202311305706 A CN202311305706 A CN 202311305706A CN 117567964 A CN117567964 A CN 117567964A
- Authority
- CN
- China
- Prior art keywords
- acrylate
- sensitive adhesive
- pressure
- reaction kettle
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 97
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title abstract description 20
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 53
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 51
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims abstract description 34
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims abstract description 33
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims abstract description 33
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims abstract description 25
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000003999 initiator Substances 0.000 claims abstract description 16
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 93
- 238000006243 chemical reaction Methods 0.000 claims description 69
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 42
- 238000002156 mixing Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 23
- 229910052757 nitrogen Inorganic materials 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 16
- 239000004925 Acrylic resin Substances 0.000 claims description 14
- -1 aromatic isocyanate Chemical class 0.000 claims description 14
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical group N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000000178 monomer Substances 0.000 claims description 12
- 229920000178 Acrylic resin Polymers 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 11
- 230000002572 peristaltic effect Effects 0.000 claims description 11
- 239000012948 isocyanate Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 abstract description 5
- 125000004122 cyclic group Chemical group 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 19
- 239000000243 solution Substances 0.000 description 19
- 238000004321 preservation Methods 0.000 description 18
- 239000011259 mixed solution Substances 0.000 description 17
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000498 cooling water Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000010907 mechanical stirring Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000011056 performance test Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- GHLZUHZBBNDWHW-UHFFFAOYSA-N nonanamide Chemical compound CCCCCCCCC(N)=O GHLZUHZBBNDWHW-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
The invention discloses a high-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive and a preparation method thereof, wherein the high-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive comprises the following raw materials in parts by weight: 10-20 g of isooctyl acrylate, 40-50 g of butyl acrylate, 10g of styrene, 10g of acryloylmorpholine, 5g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate, 0.5g of initiator and 0.01-0.25g of curing agent. According to the invention, the acrylic morpholine and the styrene with large electron cloud groups are introduced into the acrylic pressure-sensitive adhesive through polymerization reaction, so that the prepared acrylic pressure-sensitive adhesive has good heat conducting property, and meanwhile, the isobornyl acrylate and the cyclohexyl acrylate with the cyclic structures are introduced into the acrylic pressure-sensitive adhesive, so that the prepared acrylic pressure-sensitive adhesive has good high temperature resistance.
Description
Technical Field
The invention relates to a pressure-sensitive adhesive, in particular to a high-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive and a preparation method thereof.
Background
The pressure sensitive adhesive is a self-adhesive substance which can form firm adhesive force under a small acting force. The adhesion force formed by the pressure-sensitive adhesive between the surfaces of two objects is mainly van der waals force, and thus, after the adhesion surface is formed, the structure of the adhesion surface is not broken. Pressure sensitive adhesives are typically pressure sensitive during bonding, but pressure sensitive adhesives are not pressure sensitive after the bonding surface is formed. The adhesive is convenient to use, and the surface of an adherend is not affected after the adhesive is uncovered, so that the adhesive is widely used.
Along with the popularization of 5G networks, more and more electronic devices begin to carry 5G chips, network transmission of the electronic devices is greatly promoted, but due to the higher and higher requirement on the computing power of the chips, the heating value of the chips is continuously increased, so that the internal temperature of the electronic devices is higher, and other electronic components can be damaged even in severe cases, therefore, a pressure-sensitive adhesive with good heat conduction function is required to serve as an intermediate, heat is continuously transferred to a heat dissipation element, and the integral temperature of the device is reduced.
The invention patent of application number 202110570312.6 provides a strippable polyacrylate pressure-sensitive adhesive and a preparation method thereof, wherein the raw materials comprise 30-60g of soft monomer, 5-10g of functional monomer, 10-25g of hard monomer, 30-50g of heat conducting filler, 5-10g of cross-linking agent, 5-15g of tackifier, 0.1-2.0g of anti-aging agent, 1-3g of emulsifier and 20-40g of solvent. The prepared pressure-sensitive adhesive has the characteristics of good viscosity, strong oxidation resistance, strong stripping resistance and good thermal conductivity due to the introduction of the components.
The invention patent of application number 202010938982.4 provides an acrylic pressure-sensitive adhesive tape, wherein the raw materials for preparing the acrylic pressure-sensitive adhesive comprise the following components in percentage by weight: 75-90% of polyacrylic resin, 5-20% of tackifying resin and 1-10% of curing agent. The pressure-sensitive adhesive tape prepared by the invention has the advantages of large cohesive force, good wettability, excellent water resistance and ageing resistance and good invisible effect; compared with the traditional acrylic pressure-sensitive adhesive, the adhesive has more excellent adhesiveness, yellowing resistance, ultraviolet resistance and peel strength.
The invention patent of application number 202111116146.9 provides an acrylic pressure-sensitive adhesive, wherein thienopyrrole molecules are creatively added into acrylic prepolymer, and the acrylic pressure-sensitive adhesive is doped with the thienopyrrole molecules, so that free radicals generated by light, heat, radiation and the like can be effectively eliminated, and chain reaction is prevented, thereby improving the oxidation resistance of the UV pressure-sensitive adhesive, and the preparation method is low in cost, high in efficiency, energy-saving and pollution-free.
None of the above patent applications addresses the improvement of the heat conductive properties of pressure sensitive adhesives while improving the high temperature resistance.
The invention patent application No. 202210462550.X discloses a high-temperature-resistant acrylic pressure-sensitive adhesive and a preparation method thereof, and a pressure-sensitive adhesive tape and a preparation method thereof. The pressure-sensitive adhesive is prepared from the following raw materials in parts by weight: 30-40 parts of acrylic hard monomer; 60-80 parts of acrylic soft monomer; 15-25 parts of acrylic acid functional monomer; 3-7 parts of high-temperature resistant high molecular material modified carbon nano tube; 1-3 parts of an initiator; 2-5 parts of cross-linking agent; 20-30 parts of a solvent. The acrylic pressure-sensitive adhesive with low price and longer heat resistance is obtained by organically combining non-amide polymers with carbon nano tubes and polymerizing the non-amide polymers with common acrylic soft and hard monomers and functional monomers without using an epoxy curing agent and an amide monomer. The carbon nano tube is modified by using high-temperature resistant high-molecular material.
Disclosure of Invention
Aiming at the requirements of electronic equipment on the heat conduction performance and the high temperature resistance performance of the pressure-sensitive adhesive, the invention provides a high-heat conduction high-temperature-resistant acrylate pressure-sensitive adhesive, and simultaneously provides a preparation method of the high-heat conduction high-temperature-resistant acrylate pressure-sensitive adhesive.
The acrylic morpholine and the styrene with large electron cloud groups are introduced into the acrylic pressure-sensitive adhesive through polymerization reaction, so that the prepared acrylic pressure-sensitive adhesive has good heat conducting property, and meanwhile, the isobornyl acrylate and the cyclohexyl acrylate with the cyclic structures are introduced into the acrylic pressure-sensitive adhesive, so that the prepared acrylic pressure-sensitive adhesive has good high temperature resistance.
The invention adopts the technical scheme that:
the high-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive comprises the following raw materials in parts by weight (in g): 10-20 g of isooctyl acrylate, 40-50 g of butyl acrylate, 10-5 g of styrene, 10-5 g of acryloylmorpholine, 5g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate, 0.5g of initiator, and 140g of solvent ethyl acetate. Finally, curing with curing agent, the dosage of the curing agent is 0.01-0.25g.
The initiator is azobisisobutyronitrile. The curing agent adopts isocyanate curing agent, and can be specifically used with the model of Korschk Y75 or L-75 or N75.
The preparation method of the acrylic pressure-sensitive adhesive comprises the following steps:
s1: uniformly mixing isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, isobornyl acrylate, cyclohexyl acrylate and a solvent, adding the mixture into a reaction kettle, and introducing nitrogen into the reaction kettle after the addition is finished;
s2: uniformly mixing the rest monomers, the solvent and the initiator to prepare a dripping solution for later use;
s3: heating the reaction kettle to 70 ℃, preserving heat for 25-35min, adding dropwise liquid into the reaction kettle through a peristaltic pump, and dropwise adding for 3-3.5h;
s4: after the dripping is finished, heating the reaction kettle to 74 ℃, preserving heat for 8 hours, cooling to 45 ℃, and filtering to obtain acrylate resin;
s5: and (3) uniformly mixing the acrylic resin, ethyl acetate and a curing agent obtained in the step (S4), coating the mixture on a release film, and baking the release film after coating in a baking oven to obtain the acrylic pressure-sensitive adhesive, wherein the obtained acrylic pressure-sensitive adhesive needs to be stored in a dark place at a low temperature.
In the step S5, the baking temperature is 85-95 ℃ and the baking time is 25-35min.
The preparation method of the acrylic pressure-sensitive adhesive comprises the following specific weight g of each raw material in the step S1: 6-12 g of isooctyl acrylate, 24-30 g of butyl acrylate, 6g of acryloylmorpholine, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of solvent;
in the step S2, the specific weight g numbers of the raw materials are as follows: 4-8 g of isooctyl acrylate, 16-20 g of butyl acrylate, 10g of styrene, 4g of acryloylmorpholine, 2g of hydroxyethyl acrylate, 0.5g of initiator and 20g of ethyl acetate.
The invention has the beneficial effects that:
1. compared with the conventional high-heat-conductivity acrylate pressure-sensitive adhesive in the market, the high-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive is characterized in that styrene and acryloylmorpholine with conjugated structures are simultaneously introduced into a high-molecular main chain of the acrylate pressure-sensitive adhesive, instead of only one of the acrylate pressure-sensitive adhesive. The test results of comparative examples 2 and 3 and experimental example 2 in the example part of the specification prove that the prepared acrylic pressure-sensitive adhesive has good heat conduction performance by introducing the acryloylmorpholine and the styrene with large electron cloud groups into a main polymer chain through polymerization reaction.
The lateral group of the styrene is benzene ring, the benzene ring is an unsaturated conjugated structure, larger conjugated electron clouds are provided, the movable conjugated electron clouds can effectively convert heat into kinetic energy, the benzene ring structure has a space conjugated effect in space, and benzene rings stacked mutually can mutually influence, so that heat energy can be converted into kinetic energy, and the kinetic energy can be continuously diffused, so that heat transfer is accelerated, and a good heat conduction function is achieved.
The side group morpholine group of the acryloylmorpholine simultaneously contains two polar atoms of oxygen and nitrogen, the electronegativity of the oxygen atoms is high, so that adjacent carbon atoms have positive electricity, and the nitrogen atoms can provide lone pair electrons, so that a conjugation effect is formed, a synergistic effect is achieved with the benzene ring conjugation effect, and the heat conduction function is further improved. And styrene and acryloylmorpholine are used as hard monomers, have higher glass transition temperature, and can improve the temperature resistance of the adhesive film while providing a heat conduction function for the pressure-sensitive adhesive, so that the pressure-sensitive adhesive can be ensured to be normally used in a high-temperature environment.
2. According to the high-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive, the isobornyl acrylate and the cyclohexyl acrylate which have the cyclic structures are simultaneously introduced into the acrylate pressure-sensitive adhesive, and an aromatic isocyanate curing agent is selected in the selection of the curing agent, and the aromatic isocyanate curing agent has a benzene ring structure, so that the rigidity of the pressure-sensitive adhesive can be improved after the aromatic isocyanate curing agent is subjected to chemical reaction with the pressure-sensitive adhesive, and the prepared acrylate pressure-sensitive adhesive has good high-temperature resistance.
Detailed Description
In order to make the technical conception and advantages of the invention to achieve the objects of the invention more apparent, the technical scheme of the invention will be further described in detail with reference to the embodiments. It is to be understood that the following examples are intended to illustrate and describe preferred embodiments of the invention and should not be construed as limiting the scope of the invention as claimed.
Example 1
The high weather resistance acrylic pressure-sensitive adhesive of this example contains, in parts by weight (in g):
isooctyl acrylate 20g
Butyl acrylate 40g
Styrene 5g
5g of acryloylmorpholine
Hydroxyethyl acrylate 5g
Isobornyl acrylate 5g
Cyclohexyl acrylate 5g
Ethyl acetate solvent 140g
Initiator 0.5g
The preparation method comprises the following steps:
s1, weighing 12g of isooctyl acrylate, 24g of butyl acrylate, 3g of acryloylmorpholine, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of ethyl acetate, adding into a reaction kettle, introducing nitrogen, and mechanically stirring and mixing;
s2, weighing 8g of isooctyl acrylate, 16g of butyl acrylate, 5g of styrene, 2g of acryloylmorpholine, 2g of hydroxyethyl acrylate, 20g of ethyl acetate and 0.5g of azodiisobutyronitrile, and uniformly mixing to prepare a dripping liquid for later use;
s3, heating the reaction kettle to 68 ℃, preserving heat for 30min after the heating is finished, and continuously introducing nitrogen in the process; after the heat preservation is finished, adding dropwise liquid into the reaction kettle at a constant speed through a peristaltic pump, and dropwise adding for 3 hours;
s4, after the dripping is finished, heating the reaction kettle to 70 ℃, preserving heat for 10 hours after the temperature is reached, cooling the reaction kettle by using cooling water after the heat preservation is finished, discharging materials when the temperature in the reaction kettle is reduced to 50 ℃, and filtering to obtain an acrylic ester resin solution;
s5, taking 100g of acrylic resin solution, uniformly mixing with 0.1g of a Korsche Y75 curing agent, placing into a vacuum defoaming machine for defoaming treatment, coating the mixed solution on a 25 mu m PET (polyethylene terephthalate) raw film after the bubbles are eliminated, placing into a baking oven, baking at 90 ℃ for 30min, and finally obtaining an acrylic pressure-sensitive adhesive tape for performance test.
Example 2
The high weather resistance acrylic pressure-sensitive adhesive of this example contains, by weight g:
isooctyl acrylate 20g
Butyl acrylate 40g
Styrene 10g
5g of acryloylmorpholine
Hydroxyethyl acrylate 5g
Isobornyl acrylate 5g
Cyclohexyl acrylate 5g
Ethyl acetate solvent 140g
Initiator 0.5g
The preparation method comprises the following steps:
12g of isooctyl acrylate, 24g of butyl acrylate, 3g of acryloylmorpholine, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of ethyl acetate are weighed, added into a reaction kettle, and nitrogen is introduced for mechanical stirring and mixing.
8g of isooctyl acrylate, 16g of butyl acrylate, 10g of styrene, 2g of acryloylmorpholine, 2g of hydroxyethyl acrylate, 20g of ethyl acetate and 0.5g of azodiisobutyronitrile are weighed and uniformly mixed to be used as a dropping liquid for standby.
Heating the reaction kettle to 68 ℃, preserving heat for 30min after the heating is finished, and continuously introducing nitrogen in the process; after the heat preservation is finished, adding the dropwise liquid into the reaction kettle at a constant speed through a peristaltic pump, and dropwise adding for 3 hours.
After the dripping is finished, the reaction kettle is heated to 70 ℃, after the temperature reaches, the heat is preserved for 10 hours, cooling water is used for cooling the reaction kettle after the heat preservation is finished, when the temperature in the reaction kettle is reduced to 50 ℃, materials are discharged, and the materials are filtered, so that an acrylic ester resin solution is obtained for standby.
Taking 100g of the acrylic resin solution obtained in the previous step, curing with 0.1g of a Korscht Y75 curing agent, uniformly mixing, placing into a vacuum defoaming machine for defoaming treatment, coating the mixed solution on a 25 mu m PET original film after the bubbles are eliminated, coating the mixed solution with the thickness of 100 mu m, placing into a baking oven, baking at 90 ℃ for 30min, and finally obtaining an acrylic pressure-sensitive adhesive tape, and performing performance test.
Example 3
The high weather resistance acrylic pressure-sensitive adhesive of the embodiment comprises the following components in parts by weight:
isooctyl acrylate 20g
Butyl acrylate 40g
Styrene 5g
10g of acryloylmorpholine
Hydroxyethyl acrylate 5g
Isobornyl acrylate 5g
Cyclohexyl acrylate 5g
Ethyl acetate solvent 140g
Initiator 0.5g
The preparation method comprises the following steps:
12g of isooctyl acrylate, 24g of butyl acrylate, 6g of acryloylmorpholine, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of ethyl acetate are weighed, added into a reaction kettle, and nitrogen is introduced for mechanical stirring and mixing.
8g of isooctyl acrylate, 16g of butyl acrylate, 5g of styrene, 4g of acryloylmorpholine, 2g of hydroxyethyl acrylate, 20g of ethyl acetate and 0.5g of azodiisobutyronitrile are weighed and uniformly mixed to be used as a dropping liquid for standby.
Heating the reaction kettle to 68 ℃, preserving heat for 30min after the heating is finished, and continuously introducing nitrogen in the process; after the heat preservation is finished, adding the dropwise liquid into the reaction kettle at a constant speed through a peristaltic pump, and dropwise adding for 3 hours.
After the dripping is finished, the reaction kettle is heated to 70 ℃, after the temperature reaches, the heat is preserved for 10 hours, cooling water is used for cooling the reaction kettle after the heat preservation is finished, when the temperature in the reaction kettle is reduced to 50 ℃, materials are discharged, and the materials are filtered, so that an acrylic ester resin solution is obtained for standby.
Taking 100g of the acrylic resin solution obtained in the previous step, taking 0.1g of a Korscht Y75 curing agent, uniformly mixing, putting into a vacuum defoaming machine for defoaming treatment, after the bubbles are eliminated, coating the mixed solution on a 25 mu m PET original film, coating the mixed solution with the thickness of 100 mu m, putting into a baking oven, baking at 90 ℃ for 30min, and finally obtaining an acrylic pressure-sensitive adhesive tape for testing.
Example 4
The high weather resistance acrylic pressure-sensitive adhesive of this example contains, by weight g:
isooctyl acrylate 20g
Butyl acrylate 40g
Styrene 10g
10g of acryloylmorpholine
Hydroxyethyl acrylate 5g
Isobornyl acrylate 5g
Cyclohexyl acrylate 5g
Ethyl acetate solvent 140g
Initiator 0.5g
The preparation method comprises the following steps:
12g of isooctyl acrylate, 24g of butyl acrylate, 6g of acryloylmorpholine, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of ethyl acetate are weighed, added into a reaction kettle, and nitrogen is introduced for mechanical stirring and mixing.
8g of isooctyl acrylate, 16g of butyl acrylate, 10g of styrene, 4g of acryloylmorpholine, 2g of hydroxyethyl acrylate, 20g of ethyl acetate and 0.5g of azodiisobutyronitrile are weighed and uniformly mixed to be used as a dropping liquid for standby.
Heating the reaction kettle to 68 ℃, preserving heat for 30min after the heating is finished, and continuously introducing nitrogen in the process; after the heat preservation is finished, adding the dropwise liquid into the reaction kettle at a constant speed through a peristaltic pump, and dropwise adding for 3 hours.
After the dripping is finished, the reaction kettle is heated to 70 ℃, after the temperature reaches, the heat is preserved for 10 hours, cooling water is used for cooling the reaction kettle after the heat preservation is finished, when the temperature in the reaction kettle is reduced to 50 ℃, materials are discharged, and the materials are filtered, so that an acrylic ester resin solution is obtained for standby.
Taking 100g of the acrylic resin solution obtained in the previous step, taking 0.1g of a Korscht Y75 curing agent, uniformly mixing, putting into a vacuum defoaming machine for defoaming treatment, after the bubbles are eliminated, coating the mixed solution on a 25 mu m PET original film, coating the mixed solution with the thickness of 100 mu m, putting into a baking oven, baking at 90 ℃ for 30min, and finally obtaining an acrylic pressure-sensitive adhesive tape for testing.
Example 5
The high weather resistance acrylic pressure-sensitive adhesive of this example contains, by weight g:
isooctyl acrylate 10g
Butyl acrylate 50g
Styrene 5g
5g of acryloylmorpholine
Hydroxyethyl acrylate 5g
Isobornyl acrylate 5g
Cyclohexyl acrylate 5g
Ethyl acetate solvent 140g
Initiator 0.5g
The preparation method comprises the following steps:
6g of isooctyl acrylate, 30g of butyl acrylate, 3g of acryloylmorpholine, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of ethyl acetate are weighed, added into a reaction kettle, and nitrogen is introduced for mechanical stirring and mixing.
4g of isooctyl acrylate, 20g of butyl acrylate, 5g of styrene, 2g of acryloylmorpholine, 2g of hydroxyethyl acrylate, 20g of ethyl acetate and 0.5g of azodiisobutyronitrile are weighed and uniformly mixed to be used as a dropping liquid for standby.
Heating the reaction kettle to 68 ℃, preserving heat for 30min after the heating is finished, and continuously introducing nitrogen in the process; after the heat preservation is finished, adding the dropwise liquid into the reaction kettle at a constant speed through a peristaltic pump, and dropwise adding for 3 hours.
After the dripping is finished, the reaction kettle is heated to 70 ℃, after the temperature reaches, the heat is preserved for 10 hours, cooling water is used for cooling the reaction kettle after the heat preservation is finished, when the temperature in the reaction kettle is reduced to 50 ℃, materials are discharged, and the materials are filtered, so that an acrylic ester resin solution is obtained for standby.
Taking 100g of the acrylic resin solution obtained in the previous step, taking 0.1g of a Korscht Y75 curing agent, uniformly mixing, putting into a vacuum defoaming machine for defoaming treatment, after the bubbles are eliminated, coating the mixed solution on a 25 mu m PET original film, coating the mixed solution with the thickness of 100 mu m, putting into a baking oven, baking at 90 ℃ for 30min, and finally obtaining an acrylic pressure-sensitive adhesive tape for testing.
Example 6
The high weather resistance acrylic pressure-sensitive adhesive of this example contains, by weight g:
isooctyl acrylate 15g
45g of butyl acrylate
Styrene 7g
Acryloylmorpholine 7g
Hydroxyethyl acrylate 5g
Isobornyl acrylate 5g
Cyclohexyl acrylate 5g
Ethyl acetate solvent 140g
Initiator 0.5g
The preparation method comprises the following steps:
9g of isooctyl acrylate, 27g of butyl acrylate, 4.2g of acryloylmorpholine, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of ethyl acetate are weighed, added into a reaction kettle, and nitrogen is introduced into the reaction kettle for mechanical stirring and mixing.
6g of isooctyl acrylate, 18g of butyl acrylate, 7g of styrene, 2.8g of acryloylmorpholine, 2g of hydroxyethyl acrylate, 20g of ethyl acetate and 0.5g of azodiisobutyronitrile are weighed and uniformly mixed to be used as a dropping liquid for standby.
Heating the reaction kettle to 68 ℃, preserving heat for 30min after the heating is finished, and continuously introducing nitrogen in the process; after the heat preservation is finished, adding the dropwise liquid into the reaction kettle at a constant speed through a peristaltic pump, and dropwise adding for 3 hours.
After the dripping is finished, the reaction kettle is heated to 70 ℃, after the temperature reaches, the heat is preserved for 10 hours, cooling water is used for cooling the reaction kettle after the heat preservation is finished, when the temperature in the reaction kettle is reduced to 50 ℃, materials are discharged, and the materials are filtered, so that an acrylic ester resin solution is obtained for standby.
Taking 100g of the acrylic resin solution obtained in the previous step, taking 0.1g of a Korscht Y75 curing agent, uniformly mixing, putting into a vacuum defoaming machine for defoaming treatment, after the bubbles are eliminated, coating the mixed solution on a 25 mu m PET original film, coating the mixed solution with the thickness of 100 mu m, putting into a baking oven, baking at 90 ℃ for 30min, and finally obtaining an acrylic pressure-sensitive adhesive tape for testing.
Comparative example 1
The acrylic pressure-sensitive adhesive of the comparative example and the preparation method thereof are as follows:
12g of isooctyl acrylate, 24g of butyl acrylate, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of ethyl acetate are weighed, added into a reaction kettle, and nitrogen is introduced into the reaction kettle for mechanical stirring and mixing.
8g of isooctyl acrylate, 16g of butyl acrylate, 2g of hydroxyethyl acrylate, 20g of ethyl acetate and 0.5g of azodiisobutyronitrile are weighed, and the mixture is uniformly mixed to be used as a dropping liquid for standby.
Heating the reaction kettle to 68 ℃, preserving heat for 30min after the heating is finished, and continuously introducing nitrogen in the process; after the heat preservation is finished, adding the dropwise liquid into the reaction kettle at a constant speed through a peristaltic pump, and dropwise adding for 3 hours.
After the dripping is finished, the reaction kettle is heated to 70 ℃, after the temperature reaches, the heat is preserved for 10 hours, cooling water is used for cooling the reaction kettle after the heat preservation is finished, when the temperature in the reaction kettle is reduced to 50 ℃, materials are discharged, and the materials are filtered, so that an acrylic ester resin solution is obtained for standby.
Taking 100g of the acrylic resin solution obtained in the previous step, taking 0.1g of a Korscht Y75 curing agent, uniformly mixing, putting into a vacuum defoaming machine for defoaming treatment, after the bubbles are eliminated, coating the mixed solution on a 25 mu m PET original film, coating the mixed solution with the thickness of 100 mu m, putting into a baking oven, baking at 90 ℃ for 30min, and finally obtaining an acrylic pressure-sensitive adhesive tape for testing.
Comparative example 2
The acrylic pressure-sensitive adhesive of the comparative example and the preparation method thereof comprise the following steps:
12g of isooctyl acrylate, 24g of butyl acrylate, 6g of acryloylmorpholine, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of ethyl acetate are weighed, added into a reaction kettle, and nitrogen is introduced for mechanical stirring and mixing.
8g of isooctyl acrylate, 16g of butyl acrylate, 4g of acryloylmorpholine, 2g of hydroxyethyl acrylate, 20g of ethyl acetate and 0.5g of azodiisobutyronitrile are weighed and uniformly mixed to be used as a dropping liquid for standby.
Heating the reaction kettle to 68 ℃, preserving heat for 30min after the heating is finished, and continuously introducing nitrogen in the process; after the heat preservation is finished, adding the dropwise liquid into the reaction kettle at a constant speed through a peristaltic pump, and dropwise adding for 3 hours.
After the dripping is finished, the reaction kettle is heated to 70 ℃, after the temperature reaches, the heat is preserved for 10 hours, cooling water is used for cooling the reaction kettle after the heat preservation is finished, when the temperature in the reaction kettle is reduced to 50 ℃, materials are discharged, and the materials are filtered, so that an acrylic ester resin solution is obtained for standby.
Taking 100g of the acrylic resin solution obtained in the previous step, taking 0.1g of a Korscht Y75 curing agent, uniformly mixing, putting into a vacuum defoaming machine for defoaming treatment, after the bubbles are eliminated, coating the mixed solution on a 25 mu m PET original film, coating the mixed solution with the thickness of 100 mu m, putting into a baking oven, baking at 90 ℃ for 30min, and finally obtaining an acrylic pressure-sensitive adhesive tape for testing.
Comparative example 3
The acrylic pressure-sensitive adhesive of the comparative example and the preparation method thereof comprise the following steps:
12g of isooctyl acrylate, 24g of butyl acrylate, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of ethyl acetate are weighed, added into a reaction kettle, and nitrogen is introduced into the reaction kettle for mechanical stirring and mixing.
8g of isooctyl acrylate, 16g of butyl acrylate, 10g of styrene, 2g of hydroxyethyl acrylate, 20g of ethyl acetate and 0.5g of azodiisobutyronitrile are weighed and uniformly mixed to be used as a dropping liquid for standby.
Heating the reaction kettle to 68 ℃, preserving heat for 30min after the heating is finished, and continuously introducing nitrogen in the process; after the heat preservation is finished, adding the dropwise liquid into the reaction kettle at a constant speed through a peristaltic pump, and dropwise adding for 3 hours.
After the dripping is finished, the reaction kettle is heated to 70 ℃, after the temperature reaches, the heat is preserved for 10 hours, cooling water is used for cooling the reaction kettle after the heat preservation is finished, when the temperature in the reaction kettle is reduced to 50 ℃, materials are discharged, and the materials are filtered, so that an acrylic ester resin solution is obtained for standby.
Taking 100g of the acrylic resin solution obtained in the previous step, taking 0.1g of a Korscht Y75 curing agent, uniformly mixing, putting into a vacuum defoaming machine for defoaming treatment, after the bubbles are eliminated, coating the mixed solution on a 25 mu m PET original film, coating the mixed solution with the thickness of 100 mu m, putting into a baking oven, baking at 90 ℃ for 30min, and finally obtaining an acrylic pressure-sensitive adhesive tape, and performing performance test.
Performance test:
storage modulus: the modulus of the acrylate pressure sensitive adhesive was measured in flat panel mode at the glass transition temperature using a high performance rheometer (model Anton 302e, available from An Dongpa instruments). The release film was placed in an oven by coating an acrylate pressure sensitive adhesive on the release surface of a silicon-based release film, dried at 120 ℃ for 12 hours, and then the sample was cut into 25mm diameter round samples. And (3) attaching the round sample to a 25mm wide testing jig of the rheometer, tearing off a release film on the other side, fixing the testing jig on the rheometer, and testing. The test temperature is-40 ℃ to 65 ℃, the temperature rising rate is 2 ℃/min, the frequency is 1Hz, the normal force is 0.5n, and the storage modulus and Tan value inflection point temperature (glass transition temperature) at-20 ℃ and 25 ℃ at 60 ℃ are recorded.
High temperature deformation amount: the high temperature deformation of the acrylate pressure sensitive adhesive was measured in a flat panel mode using a high performance rheometer for analysis (model Anton 302e, available from An Dongpa instruments). The release film was placed in an oven by coating an acrylate pressure sensitive adhesive on the release surface of a silicon-based release film, dried at 120 ℃ for 12 hours, and then the sample was cut into 25mm diameter round samples. And (3) attaching the round sample to a 25mm wide testing jig of the rheometer, tearing off a release film on the other side, fixing the testing jig on the rheometer, and testing. Test conditions: shear stress: 10Kpa, test temperature: 60 ℃, application time: and recording deformation values at 10min for 10 min.
Thermal conductivity test: the thermal conductivity coefficient is tested by using a relaxation-resistant NETZSCH LFA 447 laser thermal conductivity meter, the acrylate pressure-sensitive adhesive coated by the double-sided release film is taken, the thickness of the pressure-sensitive adhesive is 1mm, the release films on the two sides are torn off, and the pressure-sensitive adhesive is put into the meter for testing.
The rest of the tests are according to the general test method in the industry: retention force test reference GB/T4851 and peel force test reference GB/T2792 (laminated substrate selection copper plate).
The performance test of the acrylate pressure sensitive adhesives prepared according to examples 1-6 is shown in Table 1.
Table 1: acrylic pressure sensitive adhesive Performance Table prepared in examples 1 to 6
。
The performance characterization of the acrylate pressure sensitive adhesives prepared according to comparative examples 1-3 is shown in Table 2.
Table 2: acrylic pressure-sensitive adhesive performance tables prepared in comparative examples 1 to 3
。
The test data in the first and second tables can be obtained, and when the acryloylmorpholine and the styrene monomer are not introduced, the prepared acrylic acid pressure-sensitive adhesive has low thermal conductivity and low stripping force and cannot play a good heat conduction function; only the acryloylmorpholine is introduced, the styrene monomer is not introduced, the pressure-sensitive adhesive has higher stripping force, but lower thermal conductivity, and the heat conduction function cannot be achieved; in addition, when only styrene monomer is introduced, the heat conductivity of the pressure-sensitive adhesive is improved, but the stripping force is lower. And simultaneously, after the styrene and the acryloylmorpholine are introduced into the pressure-sensitive adhesive, the prepared pressure-sensitive adhesive has high stripping force, and simultaneously, the thermal conductivity is greatly improved, so that the use function requirement can be met.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Other modifications of the practice of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention without the need for inventive faculty, and any modification or substitution of equivalents which fall within the spirit and principles of the invention, or which are obvious to those skilled in the art, are intended to be encompassed within the scope of the invention.
Claims (8)
1. The utility model provides a high heat conduction high temperature resistant acrylate pressure sensitive adhesive which characterized in that: the modified polyurethane is prepared from the following raw materials in parts by weight through polymerization: 10-20 g of isooctyl acrylate, 40-50 g of butyl acrylate, 10-5 g of styrene, 10-5 g of acryloylmorpholine, 5g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate, 140g of ethyl acetate solvent, 0.5g of initiator and 0.01-0.25g of curing agent.
2. The high thermal conductivity and high temperature resistant acrylate pressure sensitive adhesive of claim 1 wherein said initiator is azobisisobutyronitrile.
3. The high thermal conductivity and high temperature resistant acrylate pressure sensitive adhesive according to claim 1 or 2, wherein the curing agent is an aromatic isocyanate curing agent.
4. The method for preparing the high-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive according to claim 1, which is characterized by comprising the following steps:
s1: taking part of isooctyl acrylate, butyl acrylate, hydroxyethyl acrylate, isobornyl acrylate, cyclohexyl acrylate and ethyl acetate solvent, uniformly mixing, adding into a reaction kettle, and introducing nitrogen into the reaction kettle after the adding is finished;
s2: uniformly mixing the rest monomers, the solvent and the initiator to prepare a dripping solution for later use;
s3: heating the reaction kettle to 70 ℃, preserving heat for 25-35min, adding dropwise liquid into the reaction kettle through a peristaltic pump, and dropwise adding for 3-3.5h;
s4: after the dripping is finished, heating the reaction kettle to 74 ℃, preserving heat for 8 hours, cooling to 45 ℃, and filtering to obtain acrylate resin;
s5: and (3) uniformly mixing the acrylic resin, ethyl acetate and a curing agent obtained in the step (S4), coating the mixture on a release film, and baking the release film after coating in a baking oven to obtain the acrylic pressure-sensitive adhesive, wherein the obtained acrylic pressure-sensitive adhesive needs to be stored in a dark place at a low temperature.
5. The method for preparing the vehicle-mounted high-weatherability acrylate pressure-sensitive adhesive according to claim 4, wherein in the step S1, the specific dosage of each raw material is as follows: 6-12 g of isooctyl acrylate, 24-30 g of butyl acrylate, 6g of acryloylmorpholine, 3g of hydroxyethyl acrylate, 5g of isobornyl acrylate, 5g of cyclohexyl acrylate and 120g of solvent.
6. The method for producing a high weather resistance acrylic pressure-sensitive adhesive for vehicle use according to claim 4 or 5, wherein in step S2, the specific weight g number of each raw material is as follows: 4-8 g of isooctyl acrylate, 16-20 g of butyl acrylate, 10g of styrene, 4g of acryloylmorpholine, 2g of hydroxyethyl acrylate, 0.5g of initiator and 20g of ethyl acetate.
7. The method for producing a highly weather-resistant acrylate pressure-sensitive adhesive for vehicle use according to claim 4 or 5, wherein in step S5, the baking temperature is 85 to 95 ℃ and the baking time is 25 to 35 minutes.
8. The method for preparing the vehicle-mounted high-weatherability acrylate pressure-sensitive adhesive according to claim 6, wherein in the step S5, the baking temperature is 85-95 ℃ and the baking time is 25-35min.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311305706.4A CN117567964A (en) | 2023-10-10 | 2023-10-10 | High-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311305706.4A CN117567964A (en) | 2023-10-10 | 2023-10-10 | High-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN117567964A true CN117567964A (en) | 2024-02-20 |
Family
ID=89892432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202311305706.4A Pending CN117567964A (en) | 2023-10-10 | 2023-10-10 | High-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN117567964A (en) |
-
2023
- 2023-10-10 CN CN202311305706.4A patent/CN117567964A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101294622B1 (en) | Pressure-sensitive adhesive composition for pdp front filter and use | |
US8003017B2 (en) | Adhesive composition and anisotropic conductive film using the same | |
CN103911088A (en) | Acrylic ester pressure-sensitive adhesive tape and preparation method thereof and lithium ion battery | |
CN110387199B (en) | Preparation method and application of acrylate pressure-sensitive adhesive for bathroom toughened glass safety film | |
CN114921202B (en) | High-temperature-resistant acrylic pressure-sensitive adhesive and preparation method thereof, pressure-sensitive adhesive tape and preparation method thereof | |
CN115612434A (en) | Low-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof | |
CN114015056B (en) | Voltage-resistant electrolyte-resistant copolymer, tab adhesive and tab tape | |
CN112391134A (en) | Acrylate pressure-sensitive adhesive and preparation process and application thereof | |
CN110041860B (en) | Pressure-sensitive adhesive with high peeling force and preparation method thereof | |
CN117567964A (en) | High-heat-conductivity high-temperature-resistant acrylate pressure-sensitive adhesive and preparation method thereof | |
CN111073558A (en) | High-shear-resistance acrylate pressure-sensitive adhesive, pressure-sensitive adhesive tape and preparation method thereof | |
CN116042107A (en) | Acrylic foam adhesive tape resistant to high-temperature and high-humidity environment and preparation method thereof | |
CN113881365B (en) | Thin-coating high-viscosity solvent acrylic pressure-sensitive adhesive and synthesis method thereof | |
CN114891447B (en) | Acrylate/polyisobutylene rubber hybrid pressure-sensitive adhesive composition | |
CN116200148A (en) | Polyacrylate pressure-sensitive adhesive with high stripping force | |
CN109762486A (en) | A kind of pressure-sensitive adhesive making flexible PVC electrical adhesive tape and its processing method | |
CN115340835A (en) | High-stripping conductive polyacrylate pressure-sensitive adhesive and preparation method thereof | |
CN113831870A (en) | Adhesive, preparation method thereof and adhesive sheet | |
TW202200742A (en) | Adhesive composition and cured product thereof | |
TWI779030B (en) | Electrically conductive adhesive for attaching solar cells and uses thereof | |
CN110791205A (en) | Adhesive and UV (ultraviolet) curing integrally-formed self-adhesive foam adhesive tape and preparation method thereof | |
CN117625095A (en) | Acrylic ester adhesive and preparation method and application thereof | |
CN116004153A (en) | High-viscosity antistatic solvent type acrylic ester pressure-sensitive adhesive and preparation method thereof | |
CN117567965A (en) | UV (ultraviolet) curing acrylic ester pressure-sensitive adhesive and preparation method thereof | |
CN117535021A (en) | Electrolyte-resistant acrylate adhesive and preparation method and application thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |