CN117557619A - Wafer image size determining method, device, computer equipment and storage medium - Google Patents
Wafer image size determining method, device, computer equipment and storage medium Download PDFInfo
- Publication number
- CN117557619A CN117557619A CN202311369042.8A CN202311369042A CN117557619A CN 117557619 A CN117557619 A CN 117557619A CN 202311369042 A CN202311369042 A CN 202311369042A CN 117557619 A CN117557619 A CN 117557619A
- Authority
- CN
- China
- Prior art keywords
- edge pixel
- pixel points
- determining
- pixel point
- candidate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 54
- 238000012216 screening Methods 0.000 claims abstract description 35
- 230000015654 memory Effects 0.000 claims description 26
- 238000004891 communication Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 abstract description 5
- 238000011161 development Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229940095676 wafer product Drugs 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/13—Edge detection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The invention relates to the technical field of image detection, and discloses a method and a device for determining the size of a wafer image, computer equipment and a computer readable storage medium, wherein the method comprises the following steps: acquiring an original image, and determining each edge pixel point of a wafer image in the original image; screening the edge pixel points based on a first preset condition to obtain candidate edge pixel points; screening the candidate edge pixel points based on a second preset condition to obtain target candidate edge pixel points; determining a target angular vertex of the wafer image based on the target candidate edge pixel point; wafer image size is determined based on the target angular vertices. The invention can detect the sizes of the microchips in different shapes.
Description
Technical Field
The present invention relates to the field of image detection technology, and in particular, to a method and apparatus for determining a wafer image size, a computer device, and a computer readable storage medium.
Background
In industrial processes, it is often necessary to use machine vision to determine whether defects exist on the surface of a product. For a wafer product, it is necessary to detect the length of each side, each angle, etc. to determine whether the wafer product has defects.
In the prior art, most of the detected microchips are parallelograms. Among them, the same wafer (parallelogram microchip) can be inspected by developing a corresponding inspection program for the parallelogram microchip. For detecting the microchip with other polygonal shapes, a corresponding detection program needs to be custom developed to detect the microchip with other polygonal shapes.
However, the development of the corresponding inspection program for each microchip of a specific shape reduces the versatility of the program and increases the development cost and development cycle.
Disclosure of Invention
In view of the above, the present invention provides a method, apparatus, computer device and computer readable storage medium for determining a wafer image size, so as to solve the problems of reducing the versatility of the program and increasing the development cost and development period in a manner of developing a corresponding inspection program for each microchip of a specific shape.
In a first aspect, the present invention provides a method for determining a size of a wafer image, the method comprising: acquiring an original image, and determining each edge pixel point of a wafer image in the original image; screening the edge pixel points based on a first preset condition to obtain candidate edge pixel points; screening the candidate edge pixel points based on a second preset condition to obtain target candidate edge pixel points; determining a target angular vertex of the wafer image based on the target candidate edge pixel point; wafer image size is determined based on the target angular vertices.
According to the method for determining the size of the wafer image, the edge pixel points meeting the first preset condition and the second preset condition in the edge pixel points of the wafer image are screened out to obtain target candidate edge pixel points, and the target angle vertex is determined according to the target candidate pixel points, so that the angle vertex of any polygonal wafer image can be determined. The method solves the problems that in the prior art, corresponding detection programs are developed aiming at each microchip with a specific shape, the universality of the programs is reduced, and the development cost and the development period are increased.
In an alternative embodiment, the original image further comprises: an original image frame; wherein determining each edge pixel point of the wafer image in the original image comprises: acquiring any vertex in a frame of an original image and an edge threshold of a wafer image; determining a straight line comprising the vertex based on the vertex; moving the straight line along the direction towards the wafer image to obtain a first pixel point reaching an edge threshold value for the first time in an original image through which the straight line passes, and taking the first pixel point as an initial edge pixel point; each edge pixel point of the wafer image is determined based on the initial edge pixel point.
According to the method for determining the size of the wafer image, a straight line passing through any vertex in the frame of the original image is moved in the direction towards the wafer image, so that the straight line can pass through the wafer image, and the edge threshold value of the wafer image is combined, so that an initial edge pixel point can be accurately determined in the wafer image, and then all edge pixel points of the wafer image can be determined through the initial edge pixel point.
In an alternative embodiment, determining edge pixels of the wafer image based on the initial edge pixels comprises: determining adjacent edge pixel points which are adjacent to the initial edge pixel point and reach an edge threshold value; and determining adjacent edge pixel points which are adjacent to the new initial edge pixel point and reach an edge threshold value by taking the adjacent edge pixel points as new initial edge pixel points until the determined adjacent edge pixel points are the initial edge pixel points so as to determine each edge pixel point.
According to the method for determining the size of the wafer image, through the edge pixel points which are adjacent to the initial edge pixel point and reach the edge threshold value, all the edge pixel points in the wafer image can be determined, and then the target angle vertex can be determined more accurately and rapidly through all the edge pixel points.
In an optional embodiment, the filtering the edge pixel points based on the first preset condition to obtain candidate edge pixel points includes: acquiring the position of each edge pixel point; determining two first edge pixel points, the distance between the two first edge pixel points and the edge pixel point reaching a preset distance, based on the positions; determining an angle formed by edges from two first edge pixel points to the edge pixel points; wherein the angle is the angle corresponding to the edge pixel point; taking edge pixel points with angles larger than a first preset angle and smaller than a second preset angle as candidate edge pixel points, or taking edge pixel points with a plurality of angles which deviate from the average value of the first preset angle and the second preset angle most as candidate edge pixel points; wherein the first preset angle is larger than the second preset angle.
According to the method for determining the size of the wafer image, because each target angle vertex is located at the vertex position of the wafer image, the angle corresponding to each target angle vertex is greatly deviated from 180 degrees. Therefore, the target angle vertex can be accurately and rapidly determined by calculating the angle corresponding to the edge pixel point and comparing and screening the angle with the first preset angle and the second preset angle.
In an optional embodiment, screening the candidate edge pixel points based on the second preset condition to obtain a target candidate edge pixel point includes: obtaining the number of the target angle vertexes; acquiring the position of each candidate edge pixel point; determining two first candidate edge pixel points which are nearest and adjacent to each other based on the positions; determining edge pixel points positioned between the two first candidate edge pixel points based on the positions of the two first candidate edge pixel points to obtain a second candidate edge pixel point; classifying the second candidate edge pixel points into candidate edge pixel points, and removing the two first candidate edge pixel points from the candidate edge pixel points; repeatedly executing the steps of determining two first candidate edge pixel points which are closest and adjacent to each other based on the positions, determining edge pixel points positioned between the two first candidate edge pixel points based on the positions of the two first candidate edge pixel points to obtain second candidate edge pixel points, classifying the second candidate edge pixel points into the candidate edge pixel points, and removing the two first candidate edge pixel points from the candidate edge pixel points until the number of the candidate edge pixel points is the same as that of the target angle vertices; and taking the candidate edge pixel point as a target candidate edge pixel point.
The method for determining the size of the wafer image according to the present embodiment is not very close to each other due to the distance between the vertices of the target angles. Thus, two first candidate edge pixel points closest and adjacent to each other are actually located near the same target angular vertex, and need to be merged. And classifying the second candidate edge pixel points into candidate edge pixel points, and removing the two first candidate edge pixel points from the candidate edge pixel points, namely combining the two first candidate edge pixel points into the second candidate edge pixel points, so that the target angle vertex can be accurately and rapidly determined.
In an alternative embodiment, determining a target angular vertex of the wafer image based on the target candidate edge pixel point includes: acquiring coordinate positions of all edge pixel points between every two adjacent target candidate edge pixel points; fitting is carried out based on the coordinate positions of the edge pixel points, and a plurality of straight line fitting results are obtained; and determining a target angular vertex of the wafer image based on two adjacent straight line fitting results in the plurality of straight line fitting results.
According to the method for determining the size of the wafer image, since all edge pixel points between every two adjacent target candidate edge pixel points are located on the same edge of the wafer, a straight line fitting result obtained by fitting the coordinate positions of the edge pixel points is the mathematical description of the edge; because the intersection point of the edges is the target angle vertex, the target angle vertex can be determined based on two adjacent straight line fitting results. In addition, the fitting algorithm such as a least square method has certain anti-interference capability, and the obtained target angle vertex can be more accurate.
In a second aspect, the present invention provides an apparatus for determining a size of a wafer image, the apparatus comprising: the acquisition module is used for acquiring the original image and determining each edge pixel point of the wafer image in the original image; the first screening module is used for screening the edge pixel points based on a first preset condition to obtain candidate edge pixel points; the second screening module is used for screening the candidate edge pixel points based on a second preset condition to obtain target candidate edge pixel points; the first determining module is used for determining a target angle vertex of the wafer image based on the target candidate edge pixel point; and a second determining module for determining the wafer image size based on the target angular vertex.
In a third aspect, the present invention provides a computer device comprising: the wafer image size determining device comprises a memory and a processor, wherein the memory and the processor are in communication connection, the memory stores computer instructions, and the processor executes the computer instructions, so that the wafer image size determining method of the first aspect or any corresponding implementation mode is executed.
In a fourth aspect, the present invention provides a computer-readable storage medium having stored thereon computer instructions for causing a computer to perform the method for determining a wafer image size of the first aspect or any of its corresponding embodiments.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for determining wafer image size according to an embodiment of the present invention;
FIG. 2 is a flow chart of another method for determining wafer image size according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a wafer image according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of another wafer image in accordance with an embodiment of the present invention;
FIG. 5 is a schematic structural view of yet another wafer image according to an embodiment of the present invention;
FIG. 6 is a flow chart of a method of determining a wafer image size according to an embodiment of the present invention;
FIG. 7 is a schematic view of the structure of one of the wafer images according to an embodiment of the present invention;
FIG. 8 is a schematic structural view of yet another wafer image in accordance with an embodiment of the present invention;
FIG. 9 is a schematic structural view of yet another wafer image in accordance with an embodiment of the present invention;
FIG. 10 is a flow chart of a method for determining the image size of yet another wafer in accordance with an embodiment of the present invention;
FIG. 11 is a schematic view of the structure of yet another wafer image in accordance with an embodiment of the present invention;
fig. 12 is a block diagram of a wafer image size determining apparatus according to an embodiment of the present invention;
fig. 13 is a schematic diagram of a hardware structure of a computer device according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Based on the related art, most of the currently detected microchips are parallelograms. Among them, the same wafer (parallelogram microchip) can be inspected by developing a corresponding inspection program for the parallelogram microchip. For detecting the microchip with other polygonal shapes, a corresponding detection program needs to be custom developed to detect the microchip with other polygonal shapes.
However, the development of the corresponding inspection program for each microchip of a specific shape reduces the versatility of the program and increases the development cost and development cycle.
Based on the above, the invention provides a method for determining the size of a wafer image, which comprises the steps of screening out edge pixel points meeting a first preset condition and a second preset condition in all edge pixel points of the wafer image to obtain target candidate edge pixel points, and determining target angular vertexes according to the target candidate pixel points, so that the angular vertexes of any polygonal wafer image can be determined. The method solves the problems that in the prior art, corresponding detection programs are developed aiming at each microchip with a specific shape, the universality of the programs is reduced, and the development cost and the development period are increased.
In accordance with an embodiment of the present invention, there is provided a method embodiment for determining wafer image size, it being noted that the steps shown in the flowchart of the figures may be performed in a computer system, such as a set of computer executable instructions, and, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in an order other than that shown or described herein.
In this embodiment, a method for determining a wafer image size is provided, which may be used in a computer device, such as a computer, a server, etc., and fig. 1 is a flowchart of a method for determining a wafer image size according to an embodiment of the present invention, as shown in fig. 1, where the flowchart includes the following steps:
step S101, acquiring an original image, and determining each edge pixel point of the wafer image in the original image.
The original image may include a wafer image corresponding to the wafer under test. After the original image is acquired, each edge pixel point of the wafer image can be determined according to each pixel point of the wafer image in the original image.
It should be noted that, a photographing device (such as a camera, radar scan, etc.) may be used to obtain an original image of the wafer to be tested, and then the original image is sent to a computer device.
Alternatively, the wafer to be measured may be in the shape of a parallelogram, a square or other polygons, or may be in the shape of an irregular polygon, and the specific shape will not be described herein, and may be implemented by those skilled in the art.
Step S102, screening the edge pixel points based on a first preset condition to obtain candidate edge pixel points.
To determine the target angular vertices of the wafer image, each edge pixel needs to be screened. And screening out the edge pixel points meeting the first preset condition from the edge pixel points to serve as candidate edge pixel points.
Optionally, the first preset condition may be used to characterize an edge pixel point that meets the target angular vertex in the edge pixel points.
It should be noted that the target angular vertices may be used to characterize the points at which the edges intersect in the wafer image.
And step S103, screening the candidate edge pixel points based on a second preset condition to obtain target candidate edge pixel points.
After primary screening is carried out on the edge pixel points, a plurality of candidate edge pixel points can be obtained. In order to determine the target angular vertex of the wafer image more accurately, a plurality of candidate edge pixel points need to be screened to obtain target candidate edge pixel points. The candidate edge pixel points can be screened based on a second preset condition to obtain target candidate edge pixel points.
Optionally, the second preset condition may be used to characterize a candidate edge pixel point that meets the target angular vertex among the plurality of candidate edge pixel points.
Step S104, determining a target angular vertex of the wafer image based on the target candidate edge pixel point.
The target candidate edge pixel points and the target angle vertex point are corresponding one by one, but a certain deviation exists between the target candidate edge pixel points and the target angle vertex point. Therefore, it is necessary to process the target candidate edge pixel points to determine the target angular vertices of the wafer image. Specific processing steps are described in detail below.
Step S105, determining the wafer image size based on the target angular vertex.
Based on the coordinates of the target angular vertices in the original image, various sizes of the wafer image can be calculated, for example, the distance between two adjacent target angular vertices can be calculated to obtain the side length of the wafer image, and the included angle formed by the three adjacent target angular vertices can also be calculated to obtain the angle of the wafer image.
According to the method for determining the size of the wafer image, the edge pixel points which do not meet the first preset condition and the second preset condition in the edge pixel points of the wafer image are eliminated, the target candidate edge pixel points are obtained, and the target angular vertex is determined according to the target candidate pixel points, so that the angular vertex of any polygonal wafer image can be determined. The method solves the problems that in the prior art, corresponding detection programs are developed aiming at each microchip with a specific shape, the universality of the programs is reduced, and the development cost and the development period are increased.
In this embodiment, a method for determining a wafer image size is provided, which may be used in the above-mentioned computer device, such as a computer, a server, etc., and fig. 2 is a flowchart of a method for determining a wafer image size according to an embodiment of the present invention, as shown in fig. 2, where the flowchart includes the following steps:
Step S201, acquiring an original image, and determining each edge pixel point of the wafer image in the original image. Please refer to step S101 in the embodiment shown in fig. 1 in detail, which is not described herein.
Specifically, the determining each edge pixel point of the wafer image in the original image in the step S201 includes:
step S2011, any one vertex in the frame of the original image and the edge threshold of the wafer image are obtained.
The original image includes a wafer image and an original image frame. The original image frame is an edge frame of the original image, and the wafer image is used for representing the shape of the wafer in the original image. For example: for a photograph, it has a square frame. In which there may be images in the photograph (e.g., a bottle of water, a stick, etc.) within a square frame.
It should be noted that the edge threshold of the wafer image may be used to characterize the boundary value (i.e., the minimum value) of the corresponding wafer image. In this embodiment, the original image is an 8-bit gray scale image, the pixel value of the pixel point is a gray scale value, and the edge threshold of the wafer image is 20 between 0 and 255.
In step S2012, a straight line including the vertex is determined based on the vertex.
In step S2013, the straight line is moved along the direction towards the wafer image, so as to obtain a first pixel point reaching the edge threshold for the first time in the original image through which the straight line passes, and the first pixel point is used as an initial edge pixel point.
Fig. 3 shows a schematic structure of a wafer image. Referring to fig. 3, a vertex (a in fig. 3) on the frame of the original image may be determined, a straight line (L in fig. 3) including the vertex may be determined according to the position of the vertex, and the straight line may be moved in a direction toward the wafer image (arrow direction in fig. 3), so that an intersection point may exist between the straight line and the wafer image. Therefore, among the pixels of the original image through which the straight line passes, the first pixel reaching the edge threshold value is taken as the first pixel (e.g., a in fig. 3), and the movement of the straight line is stopped. The first pixel point may be an initial edge pixel point. The coordinate position of the first pixel point may be 72 th row and 154 th column.
In step S2014, each edge pixel of the wafer image is determined based on the initial edge pixel.
Each edge pixel point in the wafer image may be determined based on the location of the initial edge pixel point. The manner in which each edge pixel in the wafer image is determined based on the location of the initial edge pixel is described in detail below.
Specifically, the step S2014 may include:
and a step a1, determining adjacent edge pixel points which are adjacent to the initial edge pixel point and reach an edge threshold value.
There may be multiple edge pixels in the wafer image. The pixel value of each edge pixel point exceeds the edge threshold value, and after the initial edge pixel point is determined, the edge pixel point adjacent to the initial edge pixel point can be determined according to the edge threshold value.
Specifically, the step a1 may include:
step b1, determining a second pixel point adjacent to the initial edge pixel point; wherein the pixel value of the second pixel point does not reach the edge threshold.
And b2, in the first preset range, taking the second pixel point as an initial pixel point, carrying out rotation searching around the initial edge pixel point, and determining a third pixel point and a fourth pixel point, wherein the obtained fourth pixel point is the adjacent edge pixel point of the initial edge pixel point. The fourth pixel point is a pixel point with the first pixel value reaching the edge threshold value in the searching process, the third pixel point is adjacent to the fourth pixel point, and the third pixel point is positioned in front of the fourth pixel point. Wherein the direction of the rotational search may be selected to be either clockwise or counter-clockwise.
Fig. 4 shows a schematic structure of a wafer image. Referring to fig. 4, a may be an initial edge pixel, the coordinate position of a may be 72 th row, 154 th column, b may be a second pixel, then b is taken as a starting pixel, and a clockwise rotation search is performed around the initial edge pixel a within a first preset range to determine a third pixel (i.e., bb in fig. 4) and a fourth pixel (i.e., aa in fig. 4, the adjacent edge pixel of a) whose first pixel value reaches an edge threshold.
Alternatively, the first preset range may be a range formed by three rows and three columns centered on the initial edge pixel point.
The second pixel point may be any pixel point adjacent to a.
And a2, determining adjacent edge pixel points which are adjacent to the new initial edge pixel point and reach an edge threshold value by taking the adjacent edge pixel points as new initial edge pixel points until the determined adjacent edge pixel points are the initial edge pixel points, so as to determine each edge pixel point.
And determining an edge pixel point adjacent to the initial edge pixel point according to the edge threshold value, taking the adjacent edge pixel point as a new initial edge pixel point, and determining another new initial edge pixel point according to the edge threshold value and the new initial edge pixel point. Wherein, since the wafer edge is closed (i.e. cycled), until when the new initial edge pixel is the initial edge pixel, the wafer edge is characterized as having been cycled, i.e. each edge pixel corresponding to the wafer image is determined.
Specifically, the step a2 may include: and taking the fourth pixel point as a new initial edge pixel point, and in a first preset range, taking the third pixel point as a starting pixel point, carrying out rotation searching around the fourth pixel point, determining a fifth pixel point and a sixth pixel point which is next to the fifth pixel point and has the first pixel value reaching an edge threshold value, wherein the sixth pixel point is an adjacent edge pixel point of the new initial edge pixel point. And repeatedly executing the steps of rotating and searching around the fourth pixel point by taking the third pixel point as the starting pixel point, and determining the fifth pixel point and the sixth pixel point until the finally determined coordinate positions of the adjacent edge pixel points are the same as the coordinate positions of the first pixel point so as to determine each edge pixel point.
Fig. 5 shows a schematic structure of a wafer image. As shown in connection with fig. 5, the frame B2 is an edge frame of the wafer. By repeatedly executing the step a2, each edge pixel point corresponding to the wafer may be determined, and in this embodiment, 1816 edge pixel points are combined, and all 1816 edge pixel points form a closed curve B1 in fig. 5.
Step S202, screening the edge pixel points based on a first preset condition to obtain candidate edge pixel points. Please refer to step S102 in the embodiment shown in fig. 1 in detail, which is not described herein.
Step S203, screening the candidate edge pixel points based on a second preset condition to obtain target candidate edge pixel points; please refer to step S103 in the embodiment shown in fig. 1 in detail, which is not described herein.
Step S204, determining a target angular vertex of the wafer image based on the target candidate edge pixel point. Please refer to step S104 in the embodiment shown in fig. 1 in detail, which is not described herein.
Step S205, determining the wafer image size based on the target angular vertex. Please refer to step S105 in the embodiment shown in fig. 1 in detail, which is not described herein.
According to the method for determining the size of the wafer image, through the edge pixel points which are adjacent to the initial edge pixel point and reach the edge threshold value, all the edge pixel points in the wafer image can be determined, and then the target angle vertex can be determined more accurately and rapidly through all the edge pixel points.
In this embodiment, a method for determining a wafer image size is provided, which may be used in the above-mentioned computer device, such as a computer, a server, etc., and fig. 6 is a flowchart of a method for determining a wafer image size according to an embodiment of the present invention, as shown in fig. 6, where the flowchart includes the following steps:
step S301, acquiring an original image, and determining each edge pixel point of the wafer image in the original image. Please refer to step S201 in the embodiment shown in fig. 2 in detail, which is not described herein.
Step S302, screening the edge pixel points based on a first preset condition to obtain candidate edge pixel points.
Specifically, the step S302 includes:
in step S3021, the positions of the edge pixel points are obtained.
The position of each edge pixel point may be represented by a coordinate position, i.e., (x, y). Where x is the row and y is the column. When each edge pixel point is obtained according to the step S201, a coordinate position corresponding to each edge pixel point can be obtained. For example: the initial edge pixel point a shown in fig. 4 is located in row 72 and column 154, and the coordinate position of a is (72, 154).
Alternatively, the positions of the edge pixel points may be represented in the form of numbered positions, for example: the initial edge pixel point a shown in fig. 4 is the first acquired edge pixel point, and the number position is 1; the fourth pixel aa is an adjacent edge pixel of a, namely, the second acquired edge pixel, and the number position of the fourth pixel aa is 2.
In step S3022, two first edge pixel points whose distances from the edge pixel point reach a preset distance are determined based on the positions.
After determining the position of each edge pixel, the distance between the edge pixels may also be determined. For example: the coordinate position of an edge pixel 1 is (25, 130), the number position is 20, the coordinate position of an edge pixel 2 is (25, 120), the number position is 10, the coordinate position of an edge pixel 3 is (25, 140), and the number position is 30. In the case of using the coordinate position, the distance between the edge pixel point 1 and the edge pixel point 2 isThe distance between the edge pixel point 1 and the edge pixel point 3 is 10 in the same way. If the preset distance is 10, two first edge pixel points with the distance reaching the preset distance 10 from the edge pixel point 1 are the edge pixel point 2 and the edge pixel point 3. In the case of using numbered coordinates, the distance between the edge pixel point 1 and the edge pixel point 2 is |20-10|=10, and similarly, the distance between the edge pixel point 1 and the edge pixel point 3 is 10. If the preset distance is 10, two first edge pixel points with the distance reaching the preset distance 10 from the edge pixel point 1 are the edge pixel point 2 and the edge pixel point 3.
It should be noted that, since all edge pixel points form a closed curve, the first acquired edge pixel point and the last acquired edge pixel point are adjacent, and if N edge pixel points are combined, the distance between the edge pixel point with the number position of 1 and the edge pixel point with the number position of N is 1.
Step S3023, determining an angle formed by the edges from the two first edge pixel points to the edge pixel point; the angle is the angle corresponding to the edge pixel point.
Fig. 7 shows a schematic structure of a wafer image. Referring to fig. 7, an angle corresponding to one edge pixel point can be formed by using the edge pixel point as a starting point and connecting the two first edge pixel points, so that the angle corresponding to each edge pixel point can be obtained. For example: in the present embodiment, there are 1816 edge pixels in total, d in FIG. 7 1 ～d 1816 Is an edge pixel point, the number position is 1-1816, if the preset distance is 10, the number position is d 1807 And d 11 Is d 1 Two corresponding first edge pixel points, then +.d 1807 d 1 d 11 Is w of 1 。
Step S3024, using edge pixels with angles greater than a first preset angle and angles less than a second preset angle as candidate edge pixels, or using edge pixels with a plurality of angles most deviated from the average of the first preset angle and the second preset angle as candidate edge pixels; wherein the first preset angle is larger than the second preset angle.
Fig. 8 shows a schematic structure of a wafer image. In the wafer image, 180 ° can be used as the screening criterion, since the angle corresponding to the true target angle vertex cannot be a flat angle, as shown in fig. 8. In addition, considering the interference of errors, the requirement of 180 degrees can be properly relaxed, for example, a first preset angle is 195 degrees, a second preset angle is 165 degrees, and the edge pixel points with the angles larger than the first preset angle and smaller than the second preset angle are taken as candidate edge pixel points. For example, B3 of fig. 8 is a plurality of curves composed of candidate edge pixels, most of which are seen to be distributed near the target corner vertices. The candidate edge pixel points can be distributed near the vertex of the target angle completely by adjusting the preset distance, the first preset angle and the second preset angle.
The edge pixel point with the largest average value of a plurality of angles deviating from the first preset angle and the second preset angle can be used as the candidate edge pixel point, for example, the average value of the first preset angle and the second preset angle is 180 degrees, one fifth of 1816 edge pixel points is taken, and the edge pixel point with the largest N/5 angles deviating from 180 degrees is used as the candidate edge pixel point.
Step S303, screening the candidate edge pixel points based on the second preset condition to obtain target candidate edge pixel points.
Specifically, the step S303 includes:
in step S3031, the number of target corner vertices is obtained.
The shape of the wafer is determined and the number of target corner vertices is known. For example: a 12-sided wafer corresponds to 12 target corner vertices.
In step S3032, the positions of the candidate edge pixel points are obtained.
The position of the candidate edge pixel point may be a coordinate position or a number position, that is, the position of the edge pixel point in step S3021, which is not described herein.
Step S3033, two first candidate edge pixel points that are nearest and adjacent to each other are determined based on the positions.
The calculation method of the distance is specifically described in step S3022, which is not described herein.
Step S3034, determining an edge pixel point located between the two first candidate edge pixel points based on the positions of the two first candidate edge pixel points, to obtain a second candidate edge pixel point.
The second candidate edge pixel point is the edge pixel point which has the same distance as the two first candidate edge pixel points and the shortest distance.
Step S3035, classifying the second candidate edge pixel points into candidate edge pixel points, and eliminating the two first candidate edge pixel points from the candidate edge pixel points.
Fig. 9 shows a schematic structure of a wafer image. D, as shown in FIG. 9 31 ～d 48 Is an edge pixel point, and d 31 、d 35 、d 41 、d 48 Is a candidate edge pixel point, d 31 And d 35 、d 35 And d 41 And d 41 And d 48 Is two adjacent candidate edge pixel points due tod 31 And d 35 Is d 31 And d 35 、d 35 And d 41 And d 41 And d 48 Is nearest among the distances, thus d 31 And d 35 Is the first candidate edge pixel point, d 31 And d 35 Is d 33 D is then 33 Is the second candidate edge pixel point. The second candidate edge pixel point d 33 Classifying into candidate edge pixel points, and classifying two first candidate edge pixel points d 31 And d 35 Removing candidate edge pixel points, wherein the candidate edge pixel points are finally d 33 、d 41 、d 48 。
Step S3036, step S3033 to step S3035 are repeatedly executed until the number of the obtained candidate edge pixel points is the same as the number of the target angle vertices.
Referring to FIG. 9, d 33 Categorizing into candidate edge pixels and classifying d 31 And d 35 After the candidate edge pixel point is removed, the candidate edge pixel point is d 33 、d 41 、d 48 . And then re-determining d 33 And d 41 、d 41 And d 48 And determining two first candidate edge pixel points closest to the distance between the two first candidate edge pixel points, and taking the edge pixel point between the two first candidate edge pixel points closest to the distance as a second candidate edge pixel point, so that one candidate edge pixel point is reduced every time the two first candidate edge pixel points are repeated until the number of the candidate edge pixel points is the same as the number of the target angle vertexes.
In step S3037, the obtained candidate edge pixel point is taken as the target candidate edge pixel point.
The number of the candidate edge pixel points is the same as the number of the target angle vertexes, the deviation is not too large, and the candidate edge pixel points can be used as target candidate edge pixel points.
In the method for determining the size of the wafer image according to the present embodiment, the distances between the target angular vertices are not very close, and the candidate edge pixel points are distributed near the target angular vertices. Therefore, two first candidate edge pixel points which are nearest and adjacent to each other are repeatedly found, an edge pixel point positioned between the two first candidate edge pixel points is found to be a second candidate edge pixel point, the second candidate edge pixel point is classified into the candidate edge pixel points, the two first candidate edge pixel points are removed from the candidate edge pixel points, namely, the two nearest candidate edge pixel points are recombined, and therefore the target angle vertex can be accurately and rapidly determined.
Step S304, determining a target angular vertex of the wafer image based on the target candidate edge pixel point. Please refer to step S204 in the embodiment shown in fig. 2 in detail, which is not described herein.
Step S305, determining the wafer image size based on the target angular vertex. Please refer to step S205 in the embodiment shown in fig. 2 in detail, which is not described herein.
In this embodiment, a method for determining a wafer image size is provided, which may be used in the above-mentioned computer device, such as a computer, a server, etc., and fig. 10 is a flowchart of a method for determining a wafer image size according to an embodiment of the present invention, as shown in fig. 10, where the flowchart includes the following steps:
step S401, an original image is acquired, and each edge pixel point of the wafer image in the original image is determined. Please refer to step S301 in the embodiment shown in fig. 6 in detail, which is not described herein.
Step S402, screening the edge pixel points based on a first preset condition to obtain candidate edge pixel points. Please refer to step S302 in the embodiment shown in fig. 6 in detail, which is not described herein.
Step S403, screening the candidate edge pixel points based on the second preset condition to obtain target candidate edge pixel points. Please refer to step S303 in the embodiment shown in fig. 6, which is not described herein.
Step S404, determining a target angular vertex of the wafer image based on the target candidate edge pixel point.
Specifically, the step S404 may include:
in step S4041, the coordinate positions of all edge pixel points between every two adjacent target candidate edge pixel points are acquired.
Fig. 11 shows a schematic structure of a wafer image. As shown in connection with fig. 11, for example: in FIG. 11, there are 1816 edge pixels d 1 ～d 1816 ，d 1816 And d 58 Is the adjacent target candidate edge pixel point, the number of the edge pixel points between the adjacent target candidate edge pixel points is 57, namely d 1 ～d 57 A total of 57, coordinate positions of (x i ，y i )，i＝1～57。
And step S4042, fitting is performed based on the coordinate positions of the edge pixel points, and a plurality of straight line fitting results are obtained.
Since the target candidate edge pixel point is close to the target angular vertex, the target edge pixel point may be approximated as the target angular vertex; since the edge pixels are all at or near the wafer image edge, all edge pixels between two adjacent target candidate edge pixels may be approximated as edges between corresponding target corner vertices. Fitting is performed based on the coordinate positions of all edge pixel points between two adjacent target candidate edge pixel points, and a straight line determined by edges between corresponding target angle vertexes can be obtained. As shown in connection with fig. 11, for example: d, d 1816 And d 58 Edge pixel point d between 1 ～d 57 Can be approximated as a straight line F determined by the edge between the vertices of the corresponding target angle 1 . Straight line F is set 1 Equation of (2) is y=e 1 ×x+f 1 Wherein e is 1 、f 1 Is a pending parameter. Fitting F by least squares 1 I.e. solving for the objective functionMinimum e 1 、f 1 Thereby fitting to obtain a straight line F 1 Is a function of the equation (c). F (F) 1 Is d 1816 And d 58 The linear equation of the edge between, i.e. the linear fitting result. For another example: taking d 58 And d 237 All wafer edge pixels in between, i.e. d 59 ～d 236 178, fit to get straight line F 2 Equation (d) 58 And d 237 Straight line equations of the sides in between. So repeated that the corresponding target angle peak can be obtainedA number of straight line fitting results.
Step S4043, determining a target angular vertex of the wafer image based on two adjacent straight line fitting results among the plurality of straight line fitting results.
Each line fit may represent an edge of the wafer image, and then the target angular vertex may be determined by taking the intersection of each two adjacent line fits.
Step S405, determining a wafer image size based on the target angular vertex. Please refer to step S305 in the embodiment shown in fig. 6 in detail, which is not described herein.
According to the method for determining the size of the wafer image, after the target candidate edge pixel points corresponding to the number of the target corner vertices are determined, the positions of all edge pixel points between every two adjacent target candidate edge pixel points are fitted, so that the positions of all edge pixel points between the two adjacent target candidate edge pixel points are reflected on a straight line fitting result as much as possible, and then the target corner vertices can be determined more accurately through a plurality of straight line fitting results.
The embodiment also provides a device for determining the size of the wafer image, which is used for implementing the above embodiment and the preferred implementation, and is not described in detail. As used below, the term "module" may be a combination of software and/or hardware that implements a predetermined function. While the means described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware, is also possible and contemplated.
The present embodiment provides a wafer image size determining apparatus, as shown in fig. 12, including:
an acquiring module 1201 is configured to acquire an original image, and determine each edge pixel point of the wafer image in the original image.
The first filtering module 1202 is configured to filter the edge pixel points based on a first preset condition, so as to obtain candidate edge pixel points.
The second screening module 1203 is configured to screen the candidate edge pixel points based on a second preset condition, so as to obtain a target candidate edge pixel point.
A first determining module 1204 is configured to determine a target angular vertex of the wafer image based on the target candidate edge pixel point.
A second determination module 1205 is configured to determine a wafer image size based on the target angular vertex.
In an alternative embodiment, the obtaining module 1201 includes: the first acquisition unit is used for acquiring any vertex in the frame of the original image and the edge threshold value of the wafer image. And a first determining unit configured to determine a straight line including the vertex based on the vertex. The moving unit is used for moving the straight line along the direction facing the wafer image so as to obtain a first pixel point reaching an edge threshold value for the first time in the original image through which the straight line passes, and taking the first pixel point as an initial edge pixel point; and a second determining unit for determining each edge pixel point of the wafer image based on the initial edge pixel point.
In an alternative embodiment, the second determining unit comprises: a first determining subunit, configured to determine adjacent edge pixel points that are adjacent to the initial edge pixel point and reach an edge threshold; and the second determining subunit is used for determining adjacent edge pixel points which are adjacent to the new initial edge pixel point and reach the edge threshold value by taking the adjacent edge pixel points as the new initial edge pixel points until the determined adjacent edge pixel points are the initial edge pixel points so as to determine each edge pixel point.
In an alternative embodiment, the first screening module includes: the second acquisition unit is used for acquiring the position of each edge pixel point; the third determining unit is used for determining two first edge pixel points, the distance between the first edge pixel point and the edge pixel point reaches a preset distance, based on the positions; a fourth determining unit, configured to determine an angle formed by edges from the two first edge pixel points to the edge pixel points; wherein the angle is the angle corresponding to the edge pixel point; the first screening unit is used for taking edge pixel points with angles larger than a first preset angle and smaller than a second preset angle as candidate edge pixel points, or taking edge pixel points with a plurality of angles which deviate from the average value of the first preset angle and the second preset angle most as candidate edge pixel points; wherein the first preset angle is larger than the second preset angle.
In an alternative embodiment, the second screening module includes: a third acquisition unit configured to acquire the number of target angle vertices; a fourth obtaining unit, configured to obtain a position of each candidate edge pixel point; a fifth determining unit configured to determine, based on the positions, two first candidate edge pixel points that are closest and adjacent to each other; a sixth determining unit, configured to determine an edge pixel point located between the two first candidate edge pixel points based on the positions of the two first candidate edge pixel points, to obtain a second candidate edge pixel point; the second screening unit is used for classifying the second candidate edge pixel points into candidate edge pixel points and removing the two first candidate edge pixel points from the candidate edge pixel points; the first repeated execution unit repeatedly executes the steps of determining two first candidate edge pixel points which are nearest and adjacent to each other based on the positions, determining the edge pixel point positioned between the two first candidate edge pixel points based on the positions of the two first candidate edge pixel points to obtain a second candidate edge pixel point, classifying the second candidate edge pixel point into the candidate edge pixel points, and removing the two first candidate edge pixel points from the candidate edge pixel points until the number of the candidate edge pixel points is the same as that of the target angle vertices; and a seventh determining unit, configured to take the candidate edge pixel point as a target candidate edge pixel point.
In an alternative embodiment, the first determining module includes: a fifth obtaining unit, configured to obtain coordinate positions of all edge pixel points between every two adjacent target candidate edge pixel points; the fitting unit is used for fitting based on the coordinate positions of the edge pixel points to obtain a plurality of straight line fitting results; and an eighth determining unit for determining a target angular vertex of the wafer image based on two adjacent straight line fitting results among the plurality of straight line fitting results.
Further functional descriptions of the above respective modules and units are the same as those of the above corresponding embodiments, and are not repeated here.
The wafer image size determining means in this embodiment is presented in the form of functional units, here referred to as ASIC (Application Specific Integrated Circuit ) circuits, processors and memories executing one or more software or fixed programs, and/or other devices that can provide the above described functionality.
The embodiment of the invention also provides computer equipment, which is provided with the device for determining the wafer image size shown in the figure 13.
Referring to fig. 13, fig. 13 is a schematic structural diagram of a computer device according to an alternative embodiment of the present invention, as shown in fig. 13, the computer device includes: one or more processors 10, memory 20, and interfaces for connecting the various components, including high-speed interfaces and low-speed interfaces. The various components are communicatively coupled to each other using different buses and may be mounted on a common motherboard or in other manners as desired. The processor may process instructions executing within the computer device, including instructions stored in or on memory to display graphical information of the GUI on an external input/output device, such as a display device coupled to the interface. In some alternative embodiments, multiple processors and/or multiple buses may be used, if desired, along with multiple memories and multiple memories. Also, multiple computer devices may be connected, each providing a portion of the necessary operations (e.g., as a server array, a set of blade servers, or a multiprocessor system). One processor 10 is illustrated in fig. 13.
The processor 10 may be a central processor, a network processor, or a combination thereof. The processor 10 may further include a hardware chip, among others. The hardware chip may be an application specific integrated circuit, a programmable logic device, or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general-purpose array logic, or any combination thereof.
Wherein the memory 20 stores instructions executable by the at least one processor 10 to cause the at least one processor 10 to perform the methods shown in implementing the above embodiments.
The memory 20 may include a storage program area that may store an operating system, at least one application program required for functions, and a storage data area; the storage data area may store data created according to the use of the computer device, etc. In addition, the memory 20 may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid-state storage device. In some alternative embodiments, memory 20 may optionally include memory located remotely from processor 10, which may be connected to the computer device via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
Memory 20 may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk, or solid state disk; the memory 20 may also comprise a combination of the above types of memories.
The computer device also includes a communication interface 30 for the computer device to communicate with other devices or communication networks.
The embodiments of the present invention also provide a computer readable storage medium, and the method according to the embodiments of the present invention described above may be implemented in hardware, firmware, or as a computer code which may be recorded on a storage medium, or as original stored in a remote storage medium or a non-transitory machine readable storage medium downloaded through a network and to be stored in a local storage medium, so that the method described herein may be stored on such software process on a storage medium using a general purpose computer, a special purpose processor, or programmable or special purpose hardware. The storage medium can be a magnetic disk, an optical disk, a read-only memory, a random access memory, a flash memory, a hard disk, a solid state disk or the like; further, the storage medium may also comprise a combination of memories of the kind described above. It will be appreciated that a computer, processor, microprocessor controller or programmable hardware includes a storage element that can store or receive software or computer code that, when accessed and executed by the computer, processor or hardware, implements the methods illustrated by the above embodiments.
Although embodiments of the present invention have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope of the invention as defined by the appended claims.
Claims (9)
1. A method for determining a wafer image size, the method comprising:
acquiring an original image, and determining each edge pixel point of a wafer image in the original image;
screening the edge pixel points based on a first preset condition to obtain candidate edge pixel points;
screening the candidate edge pixel points based on a second preset condition to obtain target candidate edge pixel points;
determining a target angular vertex of the wafer image based on the target candidate edge pixel point;
the wafer image size is determined based on the target angular vertex.
2. The method of claim 1, wherein the raw image further comprises: an original image frame; wherein the determining each edge pixel point of the wafer image in the original image includes:
acquiring any vertex in the original image frame and an edge threshold of the wafer image;
Determining a straight line comprising the vertex based on the vertex;
moving the straight line along the direction towards the wafer image so as to obtain a first pixel point reaching the edge threshold value for the first time in the original image through which the straight line passes, and taking the first pixel point as an initial edge pixel point;
and determining each edge pixel point of the wafer image based on the initial edge pixel point.
3. The method of claim 2, wherein determining each edge pixel of the wafer image based on the initial edge pixel comprises:
determining adjacent edge pixel points which are adjacent to the initial edge pixel point and reach the edge threshold value;
and determining adjacent edge pixel points which are adjacent to the new initial edge pixel point and reach the edge threshold value by taking the adjacent edge pixel points as new initial edge pixel points until the determined adjacent edge pixel points are the initial edge pixel points so as to determine each edge pixel point.
4. The method for determining a wafer image size according to claim 1, wherein the screening the edge pixel points based on the first preset condition to obtain candidate edge pixel points includes:
Acquiring the position of each edge pixel point;
determining two first edge pixel points, the distance between the two first edge pixel points and the edge pixel point reaches a preset distance, based on the positions;
determining an angle formed by the edges from the two first edge pixel points to the edge pixel points; wherein the angle is the angle corresponding to the edge pixel point;
taking the edge pixel points with the angles larger than a first preset angle and the angles smaller than a second preset angle as the candidate edge pixel points, or taking the edge pixel points with the angles most deviated from the average value of the first preset angle and the second preset angle as the candidate edge pixel points; wherein the first preset angle is greater than the second preset angle.
5. The method for determining a wafer image size according to any one of claims 1 to 4, wherein the screening the candidate edge pixel points based on the second preset condition to obtain a target candidate edge pixel point includes:
obtaining the number of the target angle vertexes;
acquiring the position of each candidate edge pixel point;
determining two first candidate edge pixel points which are nearest and adjacent to each other based on the positions;
Determining an edge pixel point positioned between the two first candidate edge pixel points based on the positions of the two first candidate edge pixel points, and obtaining a second candidate edge pixel point;
classifying the second candidate edge pixel points into the candidate edge pixel points, and removing the two first candidate edge pixel points from the candidate edge pixel points;
repeatedly executing the steps of determining two nearest and adjacent first candidate edge pixel points based on the positions, determining edge pixel points positioned between the two first candidate edge pixel points based on the positions of the two first candidate edge pixel points to obtain second candidate edge pixel points, classifying the second candidate edge pixel points into the candidate edge pixel points, and removing the two first candidate edge pixel points from the candidate edge pixel points until the number of the candidate edge pixel points is the same as the number of the target angle vertices;
and taking the candidate edge pixel point as the target candidate edge pixel point.
6. The method of claim 1, wherein determining a target angular vertex of the wafer image based on the target candidate edge pixel point comprises:
Acquiring coordinate positions of all edge pixel points between every two adjacent target candidate edge pixel points;
fitting is carried out based on the coordinate positions of the edge pixel points, and a plurality of straight line fitting results are obtained;
and determining a target angular vertex of the wafer image based on two adjacent straight line fitting results in the plurality of straight line fitting results.
7. A wafer image size determining apparatus, the apparatus comprising:
the acquisition module is used for acquiring an original image and determining each edge pixel point of the wafer image in the original image;
the first screening module is used for screening the edge pixel points based on a first preset condition to obtain candidate edge pixel points;
the second screening module is used for screening the candidate edge pixel points based on a second preset condition to obtain target candidate edge pixel points;
the first determining module is used for determining a target angle vertex of the wafer image based on the target candidate edge pixel point;
and the second determining module is used for determining the wafer image size based on the target angle vertex.
8. A computer device, comprising:
a memory and a processor in communication with each other, the memory having stored therein computer instructions which, upon execution, perform the method of determining the size of a wafer image as claimed in any one of claims 1 to 6.
9. A computer-readable storage medium having stored thereon computer instructions for causing a computer to perform the method of determining a wafer image size according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311369042.8A CN117557619A (en) | 2023-10-20 | 2023-10-20 | Wafer image size determining method, device, computer equipment and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311369042.8A CN117557619A (en) | 2023-10-20 | 2023-10-20 | Wafer image size determining method, device, computer equipment and storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117557619A true CN117557619A (en) | 2024-02-13 |
Family
ID=89817509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311369042.8A Pending CN117557619A (en) | 2023-10-20 | 2023-10-20 | Wafer image size determining method, device, computer equipment and storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117557619A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102184878A (en) * | 2011-04-01 | 2011-09-14 | 无锡睿当科技有限公司 | System and method for feeding back image quality of template for wafer alignment |
| CN106846412A (en) * | 2017-01-23 | 2017-06-13 | 上海兴芯微电子科技有限公司 | A kind of checkerboard angle point detection process and device |
| WO2022057607A1 (en) * | 2020-09-21 | 2022-03-24 | 杭州睿琪软件有限公司 | Object edge recognition method and system, and computer readable storage medium |
| CN114664722A (en) * | 2022-03-22 | 2022-06-24 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Square wafer pre-alignment method and system, electronic equipment and storage medium |
| CN114897799A (en) * | 2022-04-25 | 2022-08-12 | 长江存储科技有限责任公司 | Defect detection method and device for wafer, detection equipment and storage medium |
| CN115060162A (en) * | 2022-06-02 | 2022-09-16 | 浙江华睿科技股份有限公司 | Chamfer dimension measuring method and device, electronic equipment and storage medium |
| CN115096206A (en) * | 2022-05-18 | 2022-09-23 | 西北工业大学 | Part size high-precision measurement method based on machine vision |
| CN115578383A (en) * | 2022-11-23 | 2023-01-06 | 惠州威尔高电子有限公司 | Thick copper PCB detection method based on panoramic image |
| CN115760693A (en) * | 2022-10-11 | 2023-03-07 | 五邑大学 | PCB (printed circuit board) patch element positioning method, device, equipment and medium |
| CN115984170A (en) * | 2022-11-28 | 2023-04-18 | 广州航海学院 | Quadrilateral wafer corner vertex positioning method |
-
2023
- 2023-10-20 CN CN202311369042.8A patent/CN117557619A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102184878A (en) * | 2011-04-01 | 2011-09-14 | 无锡睿当科技有限公司 | System and method for feeding back image quality of template for wafer alignment |
| CN106846412A (en) * | 2017-01-23 | 2017-06-13 | 上海兴芯微电子科技有限公司 | A kind of checkerboard angle point detection process and device |
| WO2022057607A1 (en) * | 2020-09-21 | 2022-03-24 | 杭州睿琪软件有限公司 | Object edge recognition method and system, and computer readable storage medium |
| CN114664722A (en) * | 2022-03-22 | 2022-06-24 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Square wafer pre-alignment method and system, electronic equipment and storage medium |
| CN114897799A (en) * | 2022-04-25 | 2022-08-12 | 长江存储科技有限责任公司 | Defect detection method and device for wafer, detection equipment and storage medium |
| CN115096206A (en) * | 2022-05-18 | 2022-09-23 | 西北工业大学 | Part size high-precision measurement method based on machine vision |
| CN115060162A (en) * | 2022-06-02 | 2022-09-16 | 浙江华睿科技股份有限公司 | Chamfer dimension measuring method and device, electronic equipment and storage medium |
| CN115760693A (en) * | 2022-10-11 | 2023-03-07 | 五邑大学 | PCB (printed circuit board) patch element positioning method, device, equipment and medium |
| CN115578383A (en) * | 2022-11-23 | 2023-01-06 | 惠州威尔高电子有限公司 | Thick copper PCB detection method based on panoramic image |
| CN115984170A (en) * | 2022-11-28 | 2023-04-18 | 广州航海学院 | Quadrilateral wafer corner vertex positioning method |
Non-Patent Citations (4)
| Title |
|---|
| 伍济钢;宾鸿赞;: "薄片零件尺寸机器视觉检测系统研究与开发", 机床与液压, no. 17, 15 September 2010 (2010-09-15) * |
| 席伟;陈广锋;管观洋;: "一种应用在高精度贴片机上的视觉纠偏算法", 应用光学, no. 01, 15 January 2018 (2018-01-15) * |
| 李鹏飞;郑明智;景军锋;: "图像处理在衣服尺寸在线测量中的应用", 电子测量与仪器学报, no. 08, 15 August 2016 (2016-08-15) * |
| 陆在旺: "基于机器视觉的工业视觉导引系统研究与开发", 中国优秀硕士电子期刊网, no. 03, 15 March 2020 (2020-03-15) * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108074267B (en) | Intersection point detection device and method, camera correction system and method, and recording medium | |
| CN107705328B (en) | Balanced probe position selection for 3D alignment algorithms | |
| JP2019079553A (en) | System and method for detecting line in vision system | |
| CN111044522A (en) | Defect detection method and device and terminal equipment | |
| CN109919971B (en) | Image processing method, image processing device, electronic equipment and computer readable storage medium | |
| JP2019518276A (en) | Failure analysis device and method | |
| CN112686950B (en) | Pose estimation method, pose estimation device, terminal equipment and computer readable storage medium | |
| WO2022222291A1 (en) | Optical axis calibration method and apparatus of optical axis detection system, terminal, system, and medium | |
| TWI765442B (en) | Method for defect level determination and computer readable storage medium thereof | |
| CN112001841A (en) | Image to-be-detected region extraction method and device and product defect detection system | |
| CN115060162A (en) | Chamfer dimension measuring method and device, electronic equipment and storage medium | |
| CN110673607A (en) | Feature point extraction method and device in dynamic scene and terminal equipment | |
| CN109496326B (en) | Image processing method, device and system | |
| CN111354038A (en) | Anchor object detection method and device, electronic equipment and storage medium | |
| CN117557619A (en) | Wafer image size determining method, device, computer equipment and storage medium | |
| JP6906177B2 (en) | Intersection detection device, camera calibration system, intersection detection method, camera calibration method, program and recording medium | |
| CN117011376A (en) | Industrial part comprehensive positioning method and system based on edge contour and feature moment | |
| WO2023060927A1 (en) | 3d grating detection method and apparatus, computer device, and readable storage medium | |
| CN115082552A (en) | Marking hole positioning method and device, assembly equipment and storage medium | |
| TWI748184B (en) | Defect detecting method, electronic device, and computer readable storage medium | |
| CN113822883A (en) | Wafer alignment method and system based on searching of straight edge of wafer | |
| CN110930344B (en) | Target quality determination method, device and system and electronic equipment | |
| CN116503387B (en) | Image detection method, device, equipment, system and readable storage medium | |
| RU2351091C2 (en) | Method of automatic detection and correction of radial distortion on digital images | |
| CN117058066A (en) | Camera data quality detection method and device and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |