CN117557072B - Photomask scheduling and advanced scheduling algorithm, equipment and medium - Google Patents
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Abstract
The application provides a photomask scheduling and advanced scheduling algorithm, equipment and medium, comprising the following steps: configuring an average handling operation time of the photomask; calculating the remaining time and the remaining wafer processing number from the next inspection mask; acquiring a production operation plan of each photomask; traversing target wafer processing batches of the photomask on time and generating a transport scheduling task; detecting the time interval and the processing place of the processing batch of the adjacent wafers; accumulating the number of wafers processed by the photomask; and summarizing all photomask inspection tasks, and simultaneously creating an illumination inspection scheduling task. When the system execution time reaches the activation time in the illumination scheduling task table, a photomask carrying scheduling instruction is created by the photomask carrying system, and carrying tasks are allocated and executed. The method can at least be used for solving the technical problem that the photomask cannot continue to execute the photoetching production task and needs to carry out defect inspection after the photomask reaches the inspection condition.
Description
Technical Field
The present disclosure relates to the field of information technologies, and in particular, to a photomask scheduling and advanced scheduling algorithm, device, and medium.
Background
Wafer fab production typically requires the use of numerous reticles, a critical component for the lithographic process, which typically require transportation between different production steps and tools. To ensure that the reticle is not contaminated during shipping and storage, a container known as a SMIF (Standard Mechanical Interface) box is typically used to house the reticle. A Reticle SMIF Pod (reticles SMIF Pod) is a type of SMIF Pod specifically designed for reticles. It not only provides physical protection against damage from dropping or impact, but also provides an airtight enclosure to prevent ingress of particulates or other contaminants. These SMIF pods are also typically equipped with specific mechanical interfaces to enable seamless interfacing with other equipment on the production line (e.g., load ports, transport systems, etc.). The use of such highly standardized containers helps to reduce the manual operations required during production, thereby reducing the risk of mistakes and contamination. At the same time, because these containers are of standard size and interface, they also facilitate automated transportation and storage.
Wafer factories require bare reticle reservoirs to be located in clean rooms. The reticle pod storage may be installed if the space is sufficient to accommodate all of the reticles and reticle SMIF pods. Without the bare reticle storage, the mode of handling operation is relatively simple. When the bare mask reservoir is installed, the transportation mode of operation of the mask becomes complex. It is contemplated that empty reticle pods may be transported from the reticle pod storage to the bare reticle storage and then the reticle may be moved to the lithography tool. When the mask on the lithography tool is removed, it is necessary to determine whether to move the mask-attached mask box back to the mask box reservoir or to move to the bare mask reservoir. This would require complex logic to determine the most appropriate mode of transportation.
Whether the mask is moved out of the mask stock to the tool or the mask is loaded from the lithography tool to be removed from the lithography process, it is necessary to request an empty mask box from the mask box stock, which requires a certain working time, and if not planned and scheduled, it may result in waiting of the tool, affecting the tool discharging, resulting in loss of productivity, even requiring human intervention, and having a risk of erroneous operation.
The reticle needs to be periodically inspected by inspection equipment such as IRIS (Integrated Reticle Inspection System integrated mask inspection system) and Starlight (reticle defect scanning system) to ensure that there are no defects on the reticle during photolithography. For this reason, the fab may set inspection conditions for the reticle, such as receiving inspection vehicles at intervals or after processing a certain number of wafers. When the photomask reaches the inspection condition, the photomask cannot continue to execute the photolithography production task, and defect inspection is needed.
In the domestic published patent, the Yangtze river storage proposes a photomask resource processing method, which comprises the following steps: responding to a photomask dispatching instruction, acquiring a plurality of photomask process machine stations with photomask boxes, wherein the photomask dispatching instruction is generated based on a photomask dispatching task of a photomask; determining the total amount of empty photomask boxes corresponding to a plurality of photolithography process machines; under the condition that the total amount of the empty mask boxes is larger than zero, selecting a target mask box from a plurality of photoetching process machines, and temporarily storing a mask by adopting the target mask box; in the case where the total number of empty reticle pods is equal to zero, the reticle is stored to a reticle storage device. The method for processing the photomask resources states that under the condition that the total quantity of the empty photomask boxes of the photoetching process machine is larger than zero, the photomask is stored in the target photomask box of the photoetching process machine, so that the times of entering photomask resources into the photomask storage equipment can be reduced, and the load of the photomask storage equipment is lightened. On the other hand, the photolithography processing machine is adopted as the photomask temporary storage equipment, so that the photomask conveying efficiency can be improved, the photomask resource waiting for a long time is avoided, and the production efficiency is improved.
However, the inventors found that there are at least the following technical problems in the related art:
the reticle schedule instruction is generated based on reticle schedule tasks of the reticle. Traditionally, reticle dispatching tasks are triggered when wafer lots are dispatched to a photolithography tool, which we call pull-type triggering. This may result in a waiting of the machine and a loss of productivity. Therefore, the application provides a push-type triggering method for triggering the photomask to schedule tasks in advance according to future use conditions and maintenance periods of the photomask. The dispatch scheduling algorithm has in fact predicted and locked the dispatch of wafer lots on the lithography tool, and during the scheduling period of the dispatch scheduling, mask scheduling tasks are generated throughout the scheduling period based on mask usage and maintenance lifecycle. Defects in the reticle can seriously affect the quality of the lithography. The method and the device are based on the result of the scheduling algorithm of the lithography machine, the time that the photomask needs to be checked is predicted in the planning period of the scheduling algorithm, and the checking schedule of the photomask is generated.
Disclosure of Invention
An objective of the present invention is to provide a photomask scheduling and advanced scheduling algorithm, apparatus and medium, which at least solve the above-mentioned drawbacks of the related art.
To achieve the above object, some embodiments of the present application provide the following aspects:
in a first aspect, some embodiments of the present application further provide a photomask scheduling and early scheduling algorithm, including:
the operation time of carrying operation by configuring the photomask;
respectively calculating the residual time and the residual wafer processing number of the mask to be inspected by the next integrated mask detection system and the mask defect scanning system;
acquiring a production operation plan of each photomask according to a scheduling result of the photoetching machine;
traversing future wafer processing batches and processing positions of the photomask according to time sequence, and generating a carrying scheduling task according to the traversing result;
detecting the time interval and the processing place between the front wafer processing batch and the rear wafer processing batch;
when traversing all the photoetching operation tasks of the photomask, the integrated mask detection system and the mask defect scanning system accumulate the number of wafers processed by the photomask respectively;
summarizing all the photomask inspection tasks, outputting the inspection machine and the inspection starting time of each photomask inspection task, and simultaneously creating a photomask inspection scheduling task.
When the system execution time reaches the activation time in the illumination scheduling task table, a photomask carrying scheduling instruction is created by the photomask carrying system, and carrying tasks are allocated and executed.
As a preferred technical scheme of the present application: the mask is carried among the photoetching machine, the inspection machine and the mask memory.
As a preferred technical scheme of the present application: the production operation plan includes the operation time of the photomask, the operation machine and the type of the processed wafer batch.
As a preferred technical scheme of the present application: in the step of traversing the target wafer processing lot of the photomask according to the time sequence and generating the carrying and dispatching task according to the traversing result, analysis is performed according to the traversing result if the processing machine of the next wafer lot is different from the previous waferInquiring the rough handling time and the net handling time required by the process machine where the wafer batch is located when the previous process machine is moved to the next process machine, subtracting the rough handling time from the photoetching step operation starting time of the next wafer batch to obtain the recommended handling time, and subtracting the net handling time from the photoetching step operation starting time of the next wafer batch to obtain the latest handling time. Then generating a carrying scheduling task;
the handling scheduling task comprises a photomask number, an outgoing point number, a destination number, a task activation time, a recommended handling time and a latest handling time.
As a preferred technical scheme of the present application: in the step of detecting the time interval and the processing place between the front and rear wafer processing batches, if the time interval between the front and rear wafer processing batches exceeds the user configuration time and the processing places are different, two dispatching tasks are respectively generated;
the first task calls out the photomask from the position of the previous wafer batch, calls in the photomask storage near the next photoetching place, and the activation time and the recommended carrying time are the photoetching operation ending time of the previous wafer batch, and the latest carrying time is 1 hour after the recommended carrying time; the second dispatch task dispatches the photomask from the photomask storage to the next lithography location, the recommended handling time is dehairing handling operation time before the lithography step operation start time of the next wafer lot, the latest handling time is equal to the lithography step operation start time minus the net handling operation time of the next wafer lot, and the activation time is half an hour earlier than the recommended handling time.
As a preferred technical scheme of the present application: in the step of accumulating the number of wafers processed by the photomask respectively, when traversing all the photolithography operation tasks of the photomask, the integrated mask detection system and the mask defect scanning system create a photomask inspection task according to the accumulation result, wherein the photomask inspection task comprises the following information: starting from the starting point, the type, the activation time, the number of wafer lots remaining to be processed, the number of wafers remaining to be processed and the most urgent process waiting time among the wafer lots remaining to be processed.
As a preferred technical scheme of the present application: the illumination inspection scheduling task comprises a starting point, an inspection type, an activation time, the number of wafer batches to be processed, the number of wafers to be processed, the most urgent process waiting time in the wafer batches to be processed, a destination machine, an inspection starting time, a recommended carrying time and a latest carrying time.
As a preferred technical scheme of the present application: the dispense execution handling task is completed before the machining/inspection task begins.
In a second aspect, some embodiments of the present application further provide a computer device, the device comprising:
one or more processors; and a memory storing computer program instructions that, when executed, cause the processor to perform the system as described above.
In a third aspect, some embodiments of the present application also provide a computer readable medium having stored thereon computer program instructions executable by a processor to implement a system as described above.
Compared with the prior art, in the scheme provided by the embodiment of the application, the method has the following beneficial effects:
1. efficiency is improved: by pre-planning the scheduling of the masks, the manufacturing process can avoid downtime due to waiting for the required masks, thereby improving overall efficiency.
2. Error reduction: the pre-planned and automated scheduling process may reduce human error that may occur when a fast decision is required.
3. The utilization rate of equipment is improved: ensuring that the photomask is always in the correct place and in the correct time means that the idle time of the lithographic apparatus is reduced, further improving the utilization rate of the apparatus.
4. Optimizing inventory management: by predicting reticle scheduling, reticle inventory can be better managed, reducing unnecessary storage and movement, and thus saving cost.
5. Providing a clear visualization: such algorithms may provide a clear production and scheduling view for the management team, helping them to better understand the progress and possible bottlenecks of the production flow.
6. Response speed is improved: when production changes or emergency occurs, the scheduling tasks generated in advance can be quickly adjusted, so that the flexibility of the manufacturing process is improved.
7. Optimizing resource allocation: according to the predicted scheduling requirements, manpower and other resources can be distributed more reasonably, so that smoothness of the flow is ensured.
8. Early warning in advance: if a potential problem or bottleneck is identified in the pre-generated schedule, steps may be taken in advance to correct or adjust, rather than reacting after the problem occurs.
9. Waste is reduced: by ensuring that the mask is always used in the correct place, waste, both time and material, due to misscheduling can be reduced.
10. Enhancing production predictive ability: in the long term, such algorithms can provide a large amount of data about the production flow, which can be used to further optimize and improve the accuracy of the production predictions.
Drawings
FIG. 1 is a flowchart of an algorithm provided in an embodiment of the present application;
FIG. 2 is a wafer processing inspection reticle schedule provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of a computer device according to an embodiment of the present application.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Example 1
The process comprises the following steps:
step S1, configuring the average operation time of carrying operation of a photomask;
s2, respectively calculating the residual time and the processing number of the residual wafers from the next inspection photomask of the integrated mask detection system and the mask defect scanning system;
step S3, obtaining a production operation plan of each photomask according to a scheduling result of the photoetching machine;
step S4, traversing future target wafer processing batches and processing positions of the photomask according to time sequence, and generating a transport scheduling task according to the traversing result;
step S5, detecting the time interval and the processing place between the front wafer processing batch and the rear wafer processing batch;
step S6, when traversing all the photoetching operation tasks of the photomask, accumulating the number of wafers processed by the photomask by the integrated mask detection system and the mask defect scanning system respectively;
step S7, summarizing all the photomask inspection tasks, outputting the inspection machine and the inspection starting time of each photomask inspection task, and simultaneously creating a photomask inspection scheduling task.
Step S8, when the system execution time reaches the activation time in the illumination scheduling task list, a photomask carrying scheduling instruction is created by the photomask carrying system, and carrying tasks are allocated and executed.
In some embodiments of the present application, the mask in S1 is carried out between a photolithography tool, an inspection tool, and a mask memory.
In some embodiments of the present application, the production schedule in S3 includes a mask working time, a work station, and a process wafer lot type.
In some embodiments of the present application, in S4, the analysis is performed according to the result of the traversal, if the processing machine of the subsequent wafer lot is different from the processing machine of the previous wafer lotThe work machine is used for inquiring the rough handling time and the clean handling time required by the previous work machine to be moved to the next work machine, subtracting the rough handling time from the photoetching step operation starting time of the next wafer batch to obtain the recommended handling time, and subtracting the clean handling time from the photoetching step operation starting time of the next wafer batch to obtain the latest handling time. Then generating a carrying scheduling task;
the handling scheduling task comprises a photomask number, an outgoing point number, a destination number, a task activation time, a recommended handling time and a latest handling time.
In some embodiments of the present application, in S5, if the time interval between the front and rear wafer processing lots exceeds the user configuration time and the processing sites are different, two scheduling tasks are respectively generated;
the first task calls out the photomask from the position of the previous wafer batch, calls in the photomask storage near the next photoetching place, and the activation time and the recommended carrying time are the photoetching operation ending time of the previous wafer batch, and the latest carrying time is 1 hour after the recommended carrying time; the second dispatch task dispatches the photomask from the photomask storage to the next lithography location, the recommended handling time is dehairing handling operation time before the lithography step operation start time of the next wafer lot, the latest handling time is equal to the lithography step operation start time minus the net handling operation time of the next wafer lot, and the activation time is half an hour earlier than the recommended handling time.
In some embodiments of the present application, in S6, a mask inspection task is created according to the accumulated result, where the mask inspection task includes the following information: starting from the starting point, the type, the activation time, the number of wafer lots remaining to be processed, the number of wafers remaining to be processed and the most urgent process waiting time among the wafer lots remaining to be processed.
In some embodiments of the present application, the task for light inspection and dispatch in S7 includes a start point, an inspection type, an activation time, a number of wafer lots remaining to be processed, a number of wafers remaining to be processed, a most urgent process waiting time in the wafer lots remaining to be processed, a destination machine, an inspection start time, a recommended handling time, and a latest handling time.
In some embodiments of the present application, the distributing and executing the transporting task in S8 is completed before the processing/inspection task starts.
Example two
The average working time required for carrying the photomask between the photoetching machine, the inspection machine and the photomask storage is configured (or calculated according to the distance matrix), and the working time required for carrying the photomask is divided into the wool working time and the net working time. The net working time is the time required to simply transport the mask from the departure point to the destination, and if two or more transport methods exist at the same time, such as automated transport and manual transport, the mask is taken for a longer time. Since there is also fluctuation in the net working time, the average statistics result is obtained, and the average time of the mask box is required to be adjusted on the basis of the net working time, the mask box is used as a public resource, and the specific adjustment time depends on the position of the mask box, so that the average statistics result is obtained in advance.
And calculating the residual time and the residual wafer processing number of the mask inspected by the next integrated mask inspection system and the mask defect scanning system at the current distance, wherein the interval time and the wafer processing number between the two inspections can be configured by a user or input by an external system.
The production operation plan of each photomask is obtained from the scheduling result of the photoetching machine, and the operation plan describes the time and the machine for processing the wafer batch of the photomask. The operation plan is characterized in that if the processing positions of two adjacent wafer lots are different, enough time is reserved between the two adjacent lots for carrying the photomask. In addition, the operation plan strictly follows the inspection requirements of the mask, and if the mask is expected to meet the inspection requirements at a certain time, then the production wafer lot must not be scheduled after that time.
Taking the production plan of any photomask as an example, traversing the wafer batch to be processed of the photomask along the time axis from the early to the late, and inquiring the wool conveying time required by conveying the wafer batch from the former processing machine to the latter processing machine if the processing machine of the latter wafer batch is different from the processing machine of the former wafer batchAnd net handling time->Operation start time of photolithography step using the latter wafer lot +.>Minus wool carrying operation time->Obtaining recommended handling time->Operation start time of photolithography step using the latter wafer lot +.>Minus the net handling time->Obtaining the latest transportation time->A handling scheduling task is then generated, the task containing the following information: the photomask number, the originating point number, the destination number, the task activation time, the recommended transportation time and the latest transportation time. The starting point number is the number of the previous photoetching machine, and the destination number is the number of the next photoetching machine; the task activation time is the end time of the lithography job for the previous wafer lot. The created scheduling task write-back database photomask scheduling task table.
If the time interval between the front wafer processing batch and the rear wafer processing batch exceeds the user configuration time and the processing places are different, two dispatching tasks are generated, wherein a photomask of the first task is called out from the position of the front wafer batch and is called into a photomask memory near the rear photoetching place, the activation time and the recommended carrying time are the photoetching operation ending time of the front wafer batch, and the latest carrying time is 1 hour after the recommended carrying time; the second dispatching task dispatches the photomask from the photomask storage to a later photoetching place, the recommended carrying time is dehairing carrying operation time before the photoetching step operation starting time of the later wafer batch, the latest carrying time is equal to the photoetching step operation starting time minus the net carrying operation time of the later wafer batch, and the activating time is half an hour before the recommended carrying time.
Taking the production plan of any photomask as an example, the integrated mask inspection system and the mask defect scanning system accumulate the number of wafers processed by the photomask respectively when traversing all the lithography operation tasks of the photomask. After traversing all the lithography job tasks, if the number of reticles cumulatively processed by the reticle is near the cumulative amount specified by the reticle inspection conditions, creating a reticle inspection task comprising the following information: starting point, checking type, activation time, number of wafer lots remaining to be processed, number of wafers remaining to be processed, and latest Q-time in wafer lots remaining to be processed. The inspection type is determined by the triggered inspection condition, the activation time is the time for triggering the inspection condition, and the remaining wafer information to be processed is provided by a photoetching machine scheduling algorithm. If the mask does not trigger the inspection conditions determined by the number of wafer processes, the time to be inspected is accumulated along the time axis, and when the accumulated time reaches the vicinity of the time specified by the wafer inspection conditions, a mask inspection task triggered by the time accumulated conditions is created. The created inspection task write back the mask inspection task table in the database.
Summarizing all photomask inspection scheduling tasks, outputting inspection machine stations and inspection starting time of each photomask inspection task as data input for detection of an integrated mask detection system and detection of a mask defect scanning system, and simultaneously creating illumination inspection scheduling tasks. The task includes adding the following information: starting point, checking type, activating time, number of wafer batches to be processed, nearest Q-time in the wafer batches to be processed, destination machine, checking starting time, recommended conveying time and latest conveying time. Starting point, checking type, activating time, remaining wafer information to be processed is directly from mask checking task information, destination machine and checking starting time are from planning algorithm of mask integrated mask detection system detection and mask defect scanning system detection, recommended carrying time is checking starting time minus gross carrying operation time of the carrying task, and latest carrying time is checking starting time minus net carrying operation time. The created scheduling task write-back database is used for writing back the illumination scheduling task list.
When the system execution time (the natural time of a factory) reaches the activation time in the illumination scheduling task list, a photomask carrying system creates a photomask carrying scheduling instruction, a specific person or a machine is allocated to execute a specific carrying task, and the recommended carrying time and the latest carrying time in the photomask scheduling task are required to be referred to ensure that the carrying task is completed before the processing/checking task starts.
Example III
Obtaining a production operation plan of the 563 th photomask from a production scheduling result of the photoetching machine: the 6 th wafer lot is processed at 14 point on the photolithography tool.
Traversing the wafer lot to be processed of the 563 th photomask according to the time sequence, and inquiring the wool conveying time required by conveying the wafer lot from the 5 th processing machine to the 6 th processing machine if the processing machine of the 6 th wafer lot is different from the processing machine of the 5 th wafer lotAnd net handling time->Work start time of photolithography step with wafer lot 6 +.>Subtracting woolHandling operation time->Obtaining recommended handling time->Operation start time of photolithography step using wafer lot 6Minus the net handling time->Obtaining the latest transportation time->. A handling scheduling task is then generated, the task containing the following information: mask number: 1963, starting point number: 5 th lithography tool, destination number: the 6 th photoetching machine, task activation time: the 5 th wafer lot lithography job end time, recommended handling time: />The latest carrying time:。
the time interval between the front and back wafer processing batches does not exceed 6 hours configured by a user, the mask defect scanning system photomask inspection task is triggered by the number of wafers, and the integrated mask inspection system photomask inspection task is triggered by time.
Taking the 985 photomask production plan as an example, when traversing all the photolithography tasks of the photomask, the integrated mask inspection system and the mask defect scanning system accumulate the number of wafers processed by the photomask to an amount near the accumulated amount specified by the photomask inspection conditions, respectively, and create a photomask inspection task including a departure point, an inspection type, an activation time, the number of wafer lots to be processed remaining, the number of wafers to be processed remaining, and the nearest Q-time in the wafer lots to be processed remaining.
Summarizing inspection tasks of 1000 photomasks, outputting inspection machine and inspection start time of each photomask inspection task as data input of an integrated mask inspection system detection and mask defect scanning system detection scheduling algorithm module, and simultaneously creating transport tasks to a destination machine, and the inspection start timeRecommended handling time +.>Late handling time->Is used for checking the scheduling task.
When the factory time reaches the activation time in the photomask dispatching task list, a photomask carrying dispatching instruction is created by the photomask carrying system, and a worker or a carrying machine is allocated to execute the carrying task.
Example IV
And calculating the remaining time of the photomask from the next integrated mask detection system and the mask defect scanning system to check the photomask and the remaining wafer processing number in the planning period according to the historical use record of the photomask, and acquiring the production operation plan of each photomask from the scheduling result of the photoetching machine. Taking the production plan of any photomask as an example, the wafer batch to be processed of the photomask is traversed along the time axis from the early to the late direction. Referring to fig. 2, the photolithography tool 1 is used for the wafer lot 1 and the photolithography tool 2 is used for the wafer lot 2, but the interval time between the wafer lot 1 and the wafer lot 2 and between the wafer lot 3 is shorter than the user configuration time, so that the mask is dispatched from the photolithography tool 1 to the photolithography tool 2, while the interval time between the wafer lot 4 using the photolithography tool 3 and the wafer lot 5 using the photolithography tool 4 is longer than the user configuration time, two dispatching tasks are generated, and the mask is dispatched from the photolithography tool 3 to the mask memory and then from the mask memory to the photolithography tool 4. After traversing, the number of the processed wafers of the photomask is found to be close to the number standard of the wafers inspected by the integrated mask inspection system, and then an integrated mask inspection system inspection task of the photomask is generated; and meanwhile, if the photomask meets the processing time standard checked by the mask defect scanning system, generating a mask defect scanning system checking task of the photomask. And checking whether the photomask has wafer production batches which are not dispatched, if so, calculating the number of the wafer batches to be processed, the number of the wafer to be processed, and the latest process waiting time in the wafer batches to be processed, and including the information in a photomask checking task.
And summarizing all photomask inspection scheduling tasks, outputting inspection machine stations and inspection starting time of each photomask inspection task as data input for detection of an integrated mask detection system and detection of a mask defect scanning system, and simultaneously creating illumination inspection scheduling tasks.
When the natural time of the system execution factory reaches the activation time in the illumination scheduling task list, a photomask carrying system creates a photomask carrying scheduling instruction, and a specific person or machine is allocated to execute a specific carrying task, so that the recommended carrying time and the latest carrying time in the photomask scheduling task are required to be referred to, and the carrying task is ensured to be completed before the processing/checking task starts.
Example five
In addition, the embodiment of the application further provides a computer device, the structure of which is shown in fig. 3, the device comprises a memory 1 for storing computer readable instructions and a processor 2 for executing the computer readable instructions, wherein the computer readable instructions, when executed by the processor, trigger the processor to execute the method.
The methods and/or embodiments of the present application may be implemented as a computer software program. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising program code for performing the method shown in the flowcharts. The above-described functions defined in the method of the present application are performed when the computer program is executed by a processing unit.
It should be noted that, the computer readable medium described in the present application may be a computer readable signal medium or a computer readable storage medium, or any combination of the two. The computer readable medium can be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples of the computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.
In the present application, however, a computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, with computer-readable program code embodied therein. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.
Computer program code for carrying out operations of the present application may be written in one or more programming languages, including an object oriented programming language such as Java, smalltalk, C ++ and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any kind of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or may be connected to an external computer (for example, through the Internet using an Internet service provider).
The flowchart or block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of devices, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
As another aspect, the present application also provides a computer-readable medium, which may be contained in the apparatus described in the above embodiments; or may be present alone without being fitted into the device. The computer readable medium carries one or more computer readable instructions executable by a processor to implement the steps of the methods and/or techniques of the various embodiments of the present application described above.
In a typical configuration of the present application, the terminals, the devices of the services network each include one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
The memory may include volatile memory in a computer-readable medium, random Access Memory (RAM) and/or nonvolatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). Memory is an example of computer-readable media.
Computer-readable media include both permanent and non-permanent, removable and non-removable media, and information storage may be implemented by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of storage media for a computer include, but are not limited to, phase change memory (PRAM), static Random Access Memory (SRAM), dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape storage or other magnetic storage devices, or any other non-transmission medium which can be used to store information that can be accessed by a computing device.
In addition, the embodiment of the application also provides a computer program which is stored in the computer equipment, so that the computer equipment executes the method for executing the control code.
It should be noted that the present application may be implemented in software and/or a combination of software and hardware, for example, using Application Specific Integrated Circuits (ASIC), a general purpose computer or any other similar hardware device. In some embodiments, the software programs of the present application may be executed by a processor to implement the above steps or functions. Likewise, the software programs of the present application (including associated data structures) may be stored on a computer readable recording medium, such as RAM memory, magnetic or optical drive or diskette and the like. In addition, some steps or functions of the present application may be implemented in hardware, for example, as circuitry that cooperates with the processor to perform various steps or functions.
It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned. Furthermore, it is evident that the word "comprising" does not exclude other elements or steps, and that the singular does not exclude a plurality. A plurality of units or means recited in the apparatus claims can also be implemented by means of one unit or means in software or hardware. The terms first, second, etc. are used to denote a name, but not any particular order.
Claims (5)
1. A method for scheduling and pre-scheduling a photomask, comprising:
the average operation time of carrying operation by configuring the photomask;
respectively calculating the residual time and the processing number of the residual wafers from the integrated mask detection system and the mask defect scanning system for next inspection of the photomask;
acquiring a production operation plan of each photomask according to a scheduling result of the photoetching machine;
traversing future wafer processing batches and processing positions of the photomask according to time sequence, and generating a carrying scheduling task according to the traversing result;
the photomask carries out carrying operation among the photoetching machine table, the inspection machine table and the photomask storage;
in the step of traversing the target wafer processing batch of the photomask according to time sequence and generating a carrying scheduling task according to the traversing result, analyzing according to the traversing result, if the processing machine where the next wafer batch is located is different from the processing machine where the previous wafer batch is located, inquiring the gross carrying time and the net carrying time required by carrying the next wafer batch from the previous processing machine, subtracting the gross carrying operation time from the photoetching step operation starting time of the next wafer batch to obtain recommended carrying time, subtracting the net carrying operation time from the photoetching step operation starting time of the next wafer batch to obtain latest carrying time, and then generating the carrying scheduling task;
the handling scheduling task comprises a photomask number, an outgoing point number, a destination number, a task activation time, a recommended handling time and a latest handling time;
detecting the time interval and the processing place between the front wafer processing batch and the rear wafer processing batch;
in the step of detecting the time interval and the processing place between the front and rear wafer processing batches, if the time interval between the front and rear wafer processing batches exceeds the user configuration time and the processing places are different, two carrying dispatching tasks are respectively generated;
in the two carrying and dispatching tasks, a first task is used for dispatching a photomask from the position of the previous wafer batch and dispatching the photomask into a photomask memory near the next photoetching place, the task activation time and the recommended carrying time are the photoetching operation ending time of the previous wafer batch, and the latest carrying time is 1 hour after the recommended carrying time; the second dispatching task dispatches the photomask from the photomask storage to a later photoetching place, the recommended carrying time is dehairing carrying operation time before the photoetching step operation starting time of the later wafer batch, the latest carrying time is equal to the photoetching step operation starting time minus the net carrying operation time of the later wafer batch, and the task activation time is half an hour before the recommended carrying time;
when traversing all the photoetching operation tasks of the photomask, the integrated mask detection system and the mask defect scanning system accumulate the number of wafers processed by the photomask respectively;
creating a photomask inspection task according to the accumulated result, wherein the photomask inspection task comprises the following information: starting point, checking type, checking activation time, the number of wafer batches to be processed, the number of wafers to be processed and the most urgent process waiting time in the wafer batches to be processed, wherein the checking activation time is time for triggering checking conditions, if a photomask cannot trigger the checking conditions determined by the number of the wafers to be processed, accumulating the time to be checked along a time axis, and when the accumulated time reaches the vicinity of the time specified by the wafer checking conditions, creating a photomask checking task triggered by the time accumulating condition, and writing back a photomask checking task table in a database by the created photomask checking task;
summarizing all photomask inspection tasks, inputting data detected by an integrated mask detection system and a mask defect scanning system, outputting an inspection machine and an inspection start time of each photomask inspection task, and simultaneously creating a photomask inspection scheduling task, wherein the photomask inspection scheduling task comprises a starting point, an inspection type, an activation time, the number of wafer batches to be processed, the number of wafers to be processed, the most urgent process waiting time in the wafer batches to be processed, a destination machine, the inspection start time, a recommended carrying time and the latest carrying time, wherein the starting point, the inspection type, the activation time, the number of wafer batches to be processed, the number of wafers to be processed and the most urgent process waiting time in the wafer batches to be processed are from the photomask inspection task, and the created photomask inspection scheduling task is written back into a photomask scheduling task table in a database;
when the system execution time reaches the activation time in the photomask dispatching task list, a photomask carrying system creates a carrying dispatching instruction of the photomask to be inspected, and the photomask carrying task which goes to the inspection machine is allocated and executed.
2. The method of claim 1, wherein the production schedule includes mask time, work tools, and lot types.
3. The reticle scheduling and advance scheduling method according to claim 1 wherein the allocating the execution of the handling tasks is completed before the start of the processing/inspection tasks.
4. A computer device, the device comprising: one or more processors; and a memory storing computer program instructions that, when executed, cause the processor to perform the method of any of claims 1-3.
5. A computer readable medium having stored thereon computer program instructions executable by a processor to implement the method of any of claims 1-3.
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