CN117555369B - Temperature control system and method and electronic equipment - Google Patents
Temperature control system and method and electronic equipment Download PDFInfo
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- CN117555369B CN117555369B CN202311858831.8A CN202311858831A CN117555369B CN 117555369 B CN117555369 B CN 117555369B CN 202311858831 A CN202311858831 A CN 202311858831A CN 117555369 B CN117555369 B CN 117555369B
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- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
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Abstract
The application relates to a temperature control system, a temperature control method and electronic equipment, which comprise the following steps: the device comprises a direct current power supply module, a first temperature control assembly, a second temperature control assembly, a first feedback assembly, a second feedback assembly, an operational amplifier and a control module; the control module is used for acquiring a first electric signal and a second electric signal after the direct-current power supply module is started for a preset time; determining whether the shell temperature of the direct current power supply module is a target control temperature according to the first electric signal and the second electric signal; and if the first electric signal and the second electric signal do not meet the preset condition, adjusting the environmental temperature of the second space according to the magnitude of the preset temperature value until the first electric signal and the second electric signal meet the preset condition. According to the application, the control condition of the shell temperature of the direct current power supply module is monitored in real time through the negative feedback circuit, and the environment temperature of the first space is regulated in real time through the temperature control equipment, so that the shell temperature of the direct current power supply module can be accurately controlled.
Description
Technical Field
The present application relates to the field of electronic circuits, and in particular, to a temperature control system, a temperature control method, and an electronic device.
Background
The direct current power supply module is widely applied in the fields of communication, network, industrial control, railway, military and the like by the characteristics of small volume, good performance and convenient use. The power of the dc power supply module is typically greater than 5 watts. In the use process, the direct current power supply module can generate heat to cause the temperature of the shell to rise, and the temperature of the shell can influence the electrical performance of the direct current power supply module.
The method for measuring the temperature curve of the direct current power supply module commonly used at the present stage is to heat the direct current power supply module through a heat flow cover or an incubator, and measure the electrical parameters of the direct current power supply module after a certain time. Because the DC power module heats up during operation, the shell temperature of the DC power module is substantially higher than the ambient temperature. This results in a certain error between the actual tested temperature point and the temperature point to be tested in the course of plotting the temperature curve.
In general, researchers can calculate the temperature rise of the direct current power supply module by using the thermal group characteristics of the direct current power supply module, and properly reduce the environmental temperature according to the calculation result so as to offset the temperature rise caused by the operation of the direct current power supply module. However, such calculation processes are relatively complex, and the actual temperature rise is not necessarily equal to the calculated theoretical value.
Therefore, a temperature control scheme capable of precisely controlling the temperature of the housing of the dc power module is needed.
Disclosure of Invention
Accordingly, it is desirable to provide a temperature control system, a temperature control method, and an electronic device capable of precisely controlling the temperature of a dc power module case.
In a first aspect, the present application provides a temperature control system comprising: the device comprises a direct current power supply module, a first temperature control assembly, a second temperature control assembly, a first feedback assembly, a second feedback assembly, an operational amplifier and a control module;
The direct current power supply module comprises a first feedback component, a second feedback component, a direct current power supply module, a first space, a second space and a first control unit, wherein the first feedback component and the direct current power supply module are arranged in the first space; the first temperature control component is used for adjusting the ambient temperature of the first space, and the second temperature control component is used for adjusting the ambient temperature of the second space; the output end of the control module is connected with the first input end of the operational amplifier through the second feedback component, the first input end of the operational amplifier is also connected with the output end of the operational amplifier through the first feedback component, the output end of the operational amplifier is connected with the input end of the control module, the second input end of the operational amplifier is grounded, and the output end of the control module is also connected with the first temperature control component;
the control module is used for controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to the target temperature;
after the direct current power supply module is started for a preset time, a first electric signal and a second electric signal are obtained, wherein the first electric signal is an output signal of the control module, and the second electric signal is an output signal of the operational amplifier;
judging whether the first electric signal and the second electric signal meet preset conditions or not;
If the first electric signal and the second electric signal meet preset conditions, determining that the shell temperature of the direct current power supply module is the target control temperature;
and if the first electric signal and the second electric signal do not meet the preset condition, adjusting the environmental temperature of the first space according to the magnitude of the preset temperature value until the first electric signal and the second electric signal meet the preset condition.
In one embodiment, the first feedback assembly comprises a first thermistor, and the housing of the direct current power supply module is attached to the surface of the first thermistor.
In one embodiment, the second feedback assembly includes a second thermistor, wherein the second thermistor has the same temperature coefficient as the first thermistor.
In one embodiment, the first thermistor and the second thermistor are both positive temperature coefficient thermistors.
In one embodiment, the control module is specifically configured to adjust, by the first temperature control component, an ambient temperature of the first space to a first temperature; and adjusting the ambient temperature of the second space to a second temperature through the second temperature control assembly.
In one embodiment, the control module is configured to determine whether the absolute value of the first electrical signal and the absolute value of the second electrical signal are equal;
If the absolute value of the first electric signal is equal to the absolute value of the second electric signal, determining the shell temperature of the direct current power supply module as a target control temperature;
And if the absolute value of the first electric signal is different from the absolute value of the second electric signal, adjusting the ambient temperature of the first space according to the magnitude of the preset temperature value, and judging whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal or not again after the preset time.
In a second aspect, the present application further provides a temperature control method, which is applied to the control module of the temperature control system in the first aspect, and includes:
controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to a target temperature;
after the direct current power supply module is started for a preset time, a first electric signal and a second electric signal are obtained, wherein the first electric signal is an output signal of the control module, and the second electric signal is an output signal of the operational amplifier;
judging whether the first electric signal and the second electric signal meet preset conditions or not;
If the first electric signal and the second electric signal meet preset conditions, determining that the shell temperature of the direct current power supply module is the target control temperature;
and if the first electric signal and the second electric signal do not meet the preset condition, adjusting the environmental temperature of the first space according to the magnitude of the preset temperature value until the first electric signal and the second electric signal meet the preset condition.
In one embodiment, the controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to the target temperature includes:
adjusting the ambient temperature of the first space to a first temperature by the first temperature control assembly;
and adjusting the ambient temperature of the second space to a second temperature through the second temperature control assembly.
In one embodiment, the method further comprises:
judging whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal;
If the absolute value of the first electric signal is equal to the absolute value of the second electric signal, determining the shell temperature of the direct current power supply module as a target control temperature;
And if the absolute value of the first electric signal is different from the absolute value of the second electric signal, adjusting the ambient temperature of the first space according to the magnitude of the preset temperature value, and judging whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal or not again after the preset time.
In a third aspect, the present application further provides an electronic device, including the temperature control system according to the first aspect.
In summary, the application provides a temperature control system, a temperature control method and electronic equipment, comprising: the device comprises a direct current power supply module, a first temperature control assembly, a second temperature control assembly, a first feedback assembly, a second feedback assembly, an operational amplifier and a control module; the control module is used for acquiring a first electric signal and a second electric signal after the direct-current power supply module is started for a preset time; determining whether the shell temperature of the direct current power supply module is a target control temperature according to the first electric signal and the second electric signal; and if the first electric signal and the second electric signal do not meet the preset condition, adjusting the environmental temperature of the second space according to the magnitude of the preset temperature value until the first electric signal and the second electric signal meet the preset condition. According to the application, the control condition of the shell temperature of the direct current power supply module is monitored in real time through the negative feedback circuit, and the environment temperature of the first space is regulated in real time through the temperature control equipment, so that the shell temperature of the direct current power supply module can be accurately controlled.
Drawings
FIG. 1 is a block diagram of a temperature control system in one embodiment;
FIG. 2 is a schematic circuit diagram of a temperature control system in one embodiment;
FIG. 3 is a flow chart of a temperature control method in one embodiment;
FIG. 4 is a schematic flow chart of a temperature control method in another embodiment;
FIG. 5 is a block diagram of the temperature control module in one embodiment.
Summarizing the reference numerals:
A DC power module-110; a first temperature control assembly-120; a second temperature control assembly-130; a first feedback component-140; a second feedback component-150; an operational amplifier-160; a control module-170; a first space-200; and a second space-300.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
The temperature control system provided by the embodiment of the application, as shown in fig. 1, comprises: the device comprises a direct current power module 110, a first temperature control component 120, a second temperature control component 130, a first feedback component 140, a second feedback component 150, an operational amplifier 160 and a control module 170.
Specifically, the DC power module 110 may be a DC/DC power module, and it should be noted that the specific type of the DC power module 110 is not limited in this embodiment, and the DC power module may be configured according to the needs of the actual application scenario, and the temperature control system provided in this embodiment may also be used to implement temperature control.
The first feedback assembly 140 and the dc power module 110 are disposed in the first space 200, and the second feedback assembly 150 is disposed in the second space 300. The temperature of the outer surface of the first feedback assembly 140 and the housing temperature of the dc power module 110 are affected by the ambient temperature in the first space 200, and the temperature of the outer surface of the second feedback assembly 150 is affected by the ambient temperature in the second space 300. It should be noted that, the first space 200 and the second space 300 are both closed physical spaces, and the first space 200 and the second space 300 may be accommodating spaces formed by heat conducting materials, which are not limited by the composition structure or shape of the first space 200 and the second space 300 in this embodiment, and may be adaptively configured according to the needs of the practical application scenario. For example, as shown in fig. 1, the first space 200 and the second space 300 are each configured as a spherical space.
The housing of the dc power module 110 in this embodiment is attached to the surface of the first feedback component 140. In a specific embodiment, the housing of the dc power module 110 is closely attached to the outer surface of the first feedback assembly 140, and the housing of the dc power module 110 and the outer surface of the first feedback assembly 140 may be thermally conductive to each other, such that the temperature of the housing of the dc power module 110 is equal to the temperature of the outer surface of the first feedback assembly 140. It should be noted that, in the temperature control process of the present embodiment, a period of time is set between the first feedback assembly 140 and the housing of the dc power module 110, so as to more accurately control the ambient temperature in the first space 200.
Specifically, the first temperature control component 120 is connected to the first space 200, and the first temperature control component 120 is used for adjusting the ambient temperature of the first space 200. The second temperature control assembly 130 is connected to the second space 300, and the second temperature control assembly 130 is used for adjusting the ambient temperature of the second space 300. In an actual application scenario, the first temperature control component 120 and the second temperature control component 130 may be heating devices, so that the environmental temperature in the enclosed space can be accurately adjusted. It should be appreciated that, the specific device types of the first temperature control component 120 and the second temperature control component 130 are not limited in this embodiment, and the adaptive configuration may be performed according to the needs of the actual application scenario. For example, the first temperature control component 120 and the second temperature control component 130 may be heating wires, heat shields, or temperature control boxes, which raise the ambient temperature of the first space 200 and the second space 300 when the first temperature control component 120 and the second temperature control component 130 are activated. The first space 200 and the second space 300 may be the inner accommodating spaces of the heat flux cover or the temperature control box.
In a specific embodiment, the first temperature control component 120 and the second temperature control component 130 are temperature control devices with the same type and the same performance, so as to ensure that when the first temperature control component 120 and the second temperature control component 130 are started, the control effect on the environmental temperature of the first space 200 and the control effect on the environmental temperature of the second space 300 are the same, and thus, the error of the control module 170 when acquiring the electrical signal is reduced.
Specifically, the output end of the control module 170 is connected to the first input end of the operational amplifier 160 through the second feedback component 150, the first input end of the operational amplifier 160 is further connected to the output end of the operational amplifier 160 through the first feedback component 140, the output end of the operational amplifier 160 is connected to the input end of the control module 170, the second input end of the operational amplifier 160 is grounded, and the output end of the control module 170 is further connected to the first temperature control component.
In the practical application process, the first feedback component 140, the second feedback component 150 and the operational amplifier 160 form a negative feedback circuit. According to kirchhoff's law, the relationship between the output voltage and the input voltage of the negative feedback circuit of the operational amplifier 160 is |vout/vin|= | -R1/R2|, where Vout is the output voltage of the operational amplifier 160, vin is the input voltage of the operational amplifier 160, R1 is the resistance of the first feedback component 140, and R2 is the resistance of the second feedback component 150.
In an actual application scene, whether the I-R1/R2I is 1 can be judged by judging whether the I Vout/Vin I is 1. When R1/r2 is 1, it indicates that the resistance of the first feedback component 140 and the resistance of the second feedback component 150 are equal, i.e., the outer surface temperature of the first feedback component 140 is equal to the outer surface temperature of the second feedback component 150, i.e., the housing temperature of the dc power module 110 is equal to the outer surface temperature of the second feedback component 150.
Specifically, the second feedback assembly 150 and the second space 300 are references for temperature control in the present embodiment.
In the specific temperature control process of the present embodiment, the control module 170 first controls the ambient temperature of the first space 200 and the ambient temperature of the second space 300 to be adjusted to the target temperature, so as to ensure that the outer surface of the second feedback assembly 150 in the second space 300 serving as the reference is raised to the target temperature to be controlled.
After the dc power module 110 is started for a preset time, a first electrical signal and a second electrical signal are obtained, where the first electrical signal is an output signal of the control module 170, and the second electrical signal is an output signal of the operational amplifier 160. In an embodiment, the temperature of the housing of the dc power module 110 is raised after the dc power module 110 is started, so as to affect the actual temperature of the outer surface of the first feedback assembly 140. In this embodiment, the influence on the shell temperature after the start of the dc power module 110 needs to be determined by the electrical signal, so that the first electrical signal and the second electrical signal are obtained after the dc power module 110 is started and stably operates for a preset time. It should be noted that the preset time may be determined according to an actual application scenario, and specific time of the preset time is not limited herein.
Specifically, the first electrical signal is an output signal of the control module 170, that is, vin, and the control module 170 may acquire by recording a value of the output signal. The second electrical signal is an output signal of the operational amplifier 160, i.e., vout, and the control module 170 receives the output signal of the operational amplifier 160 through an input terminal. It should be appreciated that the manner in which the control module 170 obtains the first electrical signal and the second electrical signal may be adaptively changed according to the actual application scenario.
After acquiring the first electrical signal and the second electrical signal, the control module 170 further determines whether the first electrical signal and the second electrical signal satisfy a preset condition. The preset condition may be to determine whether the first electrical signal and the second electrical signal are equal. When the first electrical signal and the second electrical signal are equal, it means that the outer surface temperature of the first feedback assembly 140 and the outer surface temperature of the second feedback assembly 150 are equal, that is, the housing temperature of the dc power module 110 is equal to the target temperature of the reference object.
If the first electrical signal and the second electrical signal satisfy the preset condition, the housing temperature of the dc power module 110 is determined as the target control temperature.
Specifically, the control module 170 determines the housing temperature of the dc power module 110 to be the target control temperature when determining that the first electrical signal and the second electrical signal are equal. The target control temperature is a temperature value reached by a user through the control module 170 to control the housing of the dc power module 110.
If the first electrical signal and the second electrical signal do not meet the preset condition, the environmental temperature of the first space 200 is adjusted according to the magnitude of the preset temperature value until the first electrical signal and the second electrical signal meet the preset condition.
Specifically, when the control module 170 determines that the first electrical signal and the second electrical signal are not equal, it may determine that the outer surface temperature of the first feedback assembly 140 and the outer surface temperature of the second feedback assembly 150 are not equal, that is, the housing temperature of the dc power module 110 is not equal to the target temperature of the reference object.
At this time, it is necessary to adjust the ambient temperature of the first space 200 according to a certain temperature value so that the housing temperature of the dc power module 110 is equal to the target temperature of the reference object. In a specific embodiment, the preset temperature magnitude may be configured according to the needs of the actual application scenario, for example, the preset temperature magnitude may be configured to be 1 ℃. When the control module 170 determines that the first electrical signal and the second electrical signal are not equal, the output power of the first temperature control module is controlled to reduce the environmental temperature in the first space 200, and if the environmental temperature is reduced by 1 ℃, it is determined whether the first electrical signal and the second electrical signal meet the preset condition again.
Specifically, the present embodiment adjusts the ambient temperature in the first space 200 through one or more temperature adjustment processes, so that the housing temperature of the dc power module 110 in the first space 200 is equal to the target temperature of the reference object.
In summary, this embodiment discloses a temperature control system, which can comprehensively consider the influence of the first temperature control component on the shell temperature of the dc power module and the influence of the working state of the dc power module on the shell temperature, and form a temperature control reference object for controlling the shell temperature of the dc power module in the control process of the shell temperature of the dc power module by configuring the second space and the second feedback component, so as to realize real-time monitoring and accurate control on the shell temperature of the dc power module, and realize accurate control on the shell temperature of the dc power module by automatic acquisition, automatic judgment and automatic adjustment of the control module, thereby effectively improving the accuracy of the efficiency of temperature control.
In one embodiment, as shown in fig. 2, the first feedback component 140 includes a first thermistor, and the housing of the dc power module 110 is attached to a surface of the first thermistor.
Specifically, the first thermistor may be a resistor R1. In an actual application scenario, the resistor R1 is closely attached to the housing of the dc power module 110, and the temperature of the surface of the resistor R1 may be equal to the temperature of the housing of the dc power module 110.
In a specific embodiment, the first thermistor and the dc power module 110 are disposed together in the first space 200, and both the external surface temperature of the first thermistor and the external surface temperature of the dc power module 110 vary with the ambient temperature in the first space 200. The housing temperature of the dc power module 110 also varies with the internal heating state of the dc power module 110 when in operation.
It should be noted that, the dc power module 110 may be attached to the outer surface of the resistor R1, and the setting direction of the dc power module 110 relative to the first thermistor is not limited in this embodiment, and may be determined according to an actual application scenario.
In one embodiment, the second feedback assembly 150 includes a second thermistor, wherein the second thermistor has the same temperature coefficient as the first thermistor.
Specifically, as shown in fig. 2, the second thermistor may be a resistor R2. In an actual application scenario, the second thermistor is separately disposed in the second space 300, and the temperature of the outer surface of the second thermistor changes with the temperature change in the second space 300.
It should be noted that the second thermistor and the first thermistor need to be thermistors with identical specifications and have identical temperature coefficients. According to the embodiment, the first thermistor and the second thermistor which are identical in specification are adopted, so that a reference object for controlling the shell temperature of the direct-current power supply module 110 can be simply realized, and the accurate control of the shell temperature of the direct-current power supply module 110 is realized through lower cost and fewer control resources.
In a possible embodiment, the second thermistor and the first thermistor may be different specifications of thermistors, and the control parameters of the second temperature control assembly 130 and the first temperature control assembly 120 are also adaptively adjusted, which is not limited in this embodiment.
In one embodiment, the first thermistor and the second thermistor are both positive temperature coefficient thermistors.
In a specific embodiment, the first thermistor and the second thermistor are both configured as thermistors with positive temperature coefficients, so that the change of the resistance values of the first feedback component 140 and the second feedback component 150 can be more intuitively judged through the negative feedback circuit, and the change of the voltage values of the voltage signals at the output end and the input end of the operational amplifier 160 is compared. The control module 170 can more precisely control the heating temperature of the first temperature component.
In one embodiment, the control module 170 is specifically configured to adjust the ambient temperature of the first space 200 to the first temperature through the first temperature control component 120; the ambient temperature of the second space 300 is adjusted to the second temperature by the second temperature control assembly 130.
In a specific embodiment, the first temperature and the second temperature have equal temperature values. In this embodiment, the first temperature control component 120 and the second temperature control component 130 control the ambient temperatures of the first space 200 and the second space 300 to reach the same temperature, so that a simpler control logic can be implemented. The control module 170 may reduce the ambient temperature in the first space 200 only through the first temperature control component 120, so that the housing temperature of the dc power module 110 may reach the target temperature of the reference object.
It should be appreciated that the first temperature and the second temperature may also be controlled to be different, where the first temperature should be slightly less than the second temperature, so as to achieve faster control of the housing temperature of the dc power module 110 in the first space 200 to the target temperature. The specific range in which the first temperature is smaller than the second temperature may be adaptively configured according to experience in an actual application scenario, which is not limited in this embodiment.
In one embodiment, the control module 170 is configured to determine whether the absolute value of the first electrical signal and the absolute value of the second electrical signal are equal;
if the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal, determining the shell temperature of the direct current power supply module 110 as the target control temperature;
If the absolute value of the first electrical signal is different from the absolute value of the second electrical signal, the environmental temperature of the first space 200 is adjusted according to the magnitude of the preset temperature value, and whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal is judged again after the preset time.
Specifically, in making a specific determination, the control module 170 may determine whether the case temperature of the dc power supply module 110 is the target control temperature by determining whether |vout|/|vin| is 1. In a specific embodiment, after adjusting the ambient temperature of the first space 200 according to the preset temperature magnitude, a preset time is required to wait for the first feedback component 140 to exchange heat with the housing of the dc power module 110, so as to determine the temperature of the outer surface of the first feedback component 140, i.e. the housing temperature of the dc power module 110, by collecting the second electrical signal, i.e. the output signal of the operational amplifier 160.
It should be appreciated that if it is determined that the absolute value of the first electrical signal and the absolute value of the second electrical signal are still not equal, the environmental temperature of the first space 200 needs to be continuously adjusted until the absolute value of the first electrical signal and the absolute value of the second electrical signal are equal.
In a specific embodiment, the magnitude relation between the first electrical signal and the second electrical signal may determine the magnitude relation between the outer surface temperature of the first feedback component 140 and the outer surface temperature of the second feedback component 150, that is, may determine the magnitude relation between the housing temperature of the dc power module 110 and the target temperature of the reference object.
When the first electrical signal is greater than the second electrical signal, i.e., |vout|/|vin| is less than 1, it is indicated that the outer surface temperature of the first feedback assembly 140 is less than the outer surface temperature of the second feedback assembly 150 at this time, and the outer surface temperature of the first feedback assembly 140 is required to be equal to the outer surface temperature of the second feedback assembly 150 by raising the ambient temperature in the first space 200.
When the first electrical signal is smaller than the second electrical signal, i.e., |vout|/|vin| is greater than 1, it is indicated that the outer surface temperature of the first feedback assembly 140 is greater than the outer surface temperature of the second feedback assembly 150 at this time, and the outer surface temperature of the first feedback assembly 140 is required to be equal to the outer surface temperature of the second feedback assembly 150 by reducing the ambient temperature in the first space 200.
Specifically, the adjusting process of the first space 200 according to this embodiment may be determined based on the magnitude relation between the first electrical signal and the second electrical signal.
In summary, the embodiment provides a temperature control system, by controlling the shell temperature of the dc power module in real time, when a temperature curve is drawn, the preset condition judgment process implemented based on the negative feedback circuit can effectively offset the shell temperature rising effect caused by the heating of the dc power module, and the temperature control implemented by the temperature control system of the embodiment obviously reduces the measurement error when the temperature curve is drawn, thereby being beneficial to judging the real performance of the dc power module at a specific temperature point. Meanwhile, the temperature control system has simple composition structure and wide application range, and can be used for automatically controlling the shell temperature of various types of direct current power supply modules under various load conditions and various temperature ranges.
In one embodiment, as shown in fig. 3, a temperature control method is provided, and the control module of the temperature control system in fig. 1 is taken as an example to illustrate the method, and the method includes the following steps:
S301, controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to the target temperature;
s302, after a direct current power supply module is started for a preset time, a first electric signal and a second electric signal are obtained, wherein the first electric signal is an output signal of a control module, and the second electric signal is an output signal of an operational amplifier;
s303, judging whether the first electric signal and the second electric signal meet preset conditions;
S304, if the first electric signal and the second electric signal meet preset conditions, determining the shell temperature of the direct current power supply module as a target control temperature;
s305, if the first electric signal and the second electric signal do not meet the preset condition, adjusting the environmental temperature of the second space according to the magnitude of the preset temperature value until the first electric signal and the second electric signal meet the preset condition.
Specifically, reference may be made to the specific implementation manner in the foregoing system embodiment for the specific implementation manner of the temperature control method provided in this embodiment, which is not described in detail herein.
In one embodiment, controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to the target temperature includes:
adjusting the ambient temperature of the first space to a first temperature through the first temperature control assembly;
and adjusting the ambient temperature of the second space to a second temperature through the second temperature control assembly.
In one embodiment, as shown in fig. 4, the temperature control method further includes:
S401, judging whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal;
s402, if the absolute value of the first electric signal is equal to the absolute value of the second electric signal, determining the shell temperature of the direct current power supply module as a target control temperature;
S403, if the absolute value of the first electric signal is different from the absolute value of the second electric signal, adjusting the environmental temperature of the second space according to the magnitude of the preset temperature value, and re-judging whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal after the preset time.
In summary, by providing a temperature control method, by controlling the shell temperature of the dc power module in real time, when a temperature curve is drawn, the preset condition judgment process implemented based on the negative feedback circuit can effectively offset the shell temperature rising effect caused by the heating of the dc power module, and the temperature control implemented by the temperature control system of the embodiment obviously reduces the measurement error when the temperature curve is drawn, thereby being beneficial to judging the real performance of the dc power module at a specific temperature point. Meanwhile, the temperature control system has simple composition structure and wide application range, and can be used for automatically controlling the shell temperature of various types of direct current power supply modules under various load conditions and various temperature ranges.
It should be understood that, although the steps in the flowcharts related to the above embodiments are sequentially shown as indicated by arrows, these steps are not necessarily sequentially performed in the order indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in the flowcharts described in the above embodiments may include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of the steps or stages is not necessarily performed sequentially, but may be performed alternately or alternately with at least some of the other steps or stages.
Based on the same inventive concept, the embodiment of the application also provides a temperature control device for realizing the above-mentioned temperature control method. The implementation of the solution provided by the device is similar to that described in the above method, so the specific limitation of one or more embodiments of the temperature control device provided below may be referred to above for the limitation of the temperature control method, which is not repeated here.
In one embodiment, as shown in fig. 5, there is provided a temperature control apparatus 500 comprising: the control module 510, the acquisition module 520, the judgment module 530, the first execution module 540, and the second execution module 550, wherein:
a control module 510 for controlling the environmental temperature of the first space and the environmental temperature of the second space to be adjusted to a target temperature;
The obtaining module 520 is configured to obtain a first electrical signal and a second electrical signal after the dc power module is started for a preset time, where the first electrical signal is an output signal of the control module, and the second electrical signal is an output signal of the operational amplifier;
A judging module 530, configured to judge whether the first electrical signal and the second electrical signal meet a preset condition;
the first execution module 540 is configured to determine that the housing temperature of the dc power module is the target control temperature if the first electrical signal and the second electrical signal meet a preset condition;
and the second execution module 550 is configured to adjust the environmental temperature of the second space according to the magnitude of the preset temperature value if the first electrical signal and the second electrical signal do not satisfy the preset condition, until the first electrical signal and the second electrical signal satisfy the preset condition.
The respective modules in the above-described temperature control apparatus may be implemented in whole or in part by software, hardware, and combinations thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.
In one embodiment, an electronic device is provided that includes the temperature control system of the foregoing system embodiments.
Specifically, the electronic device may be provided with a driving signal by a dc power module in the temperature control system, so that the electronic device may operate normally. It should be noted that, the specific type of the electronic device is not limited in this embodiment, and may be any device on which the temperature control system provided in this embodiment is mounted, and the specific type of the electronic device may be determined according to the needs of the actual application scenario.
Those skilled in the art will appreciate that implementing all or part of the above-described methods in accordance with the embodiments may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed may comprise the steps of the embodiments of the methods described above. Any reference to memory, database, or other medium used in embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high density embedded nonvolatile Memory, resistive random access Memory (ReRAM), magneto-resistive random access Memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric Memory (Ferroelectric Random Access Memory, FRAM), phase change Memory (PHASE CHANGE Memory, PCM), graphene Memory, and the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, and the like. By way of illustration, and not limitation, RAM can be in various forms such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), etc. The databases referred to in the embodiments provided herein may include at least one of a relational database and a non-relational database. The non-relational database may include, but is not limited to, a blockchain-based distributed database, and the like. The processor referred to in the embodiments provided in the present application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic unit, a data processing logic unit based on quantum computing, or the like, but is not limited thereto.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be assessed as that of the appended claims.
Claims (8)
1. A temperature control system, comprising: the device comprises a direct current power supply module, a first temperature control assembly, a second temperature control assembly, a first feedback assembly, a second feedback assembly, an operational amplifier and a control module;
The direct current power supply module comprises a first feedback component, a second feedback component, a direct current power supply module, a first space, a second space and a first control unit, wherein the first feedback component and the direct current power supply module are arranged in the first space; the first temperature control component is used for adjusting the ambient temperature of the first space, and the second temperature control component is used for adjusting the ambient temperature of the second space; the output end of the control module is connected with the first input end of the operational amplifier through the second feedback component, the first input end of the operational amplifier is also connected with the output end of the operational amplifier through the first feedback component, the output end of the operational amplifier is connected with the input end of the control module, the second input end of the operational amplifier is grounded, and the output end of the control module is also connected with the first temperature control component;
The first feedback component, the second feedback component and the operational amplifier form a negative feedback circuit; the relation between the output voltage and the input voltage of the negative feedback circuit is |Vout/vin|= | -R1/R2|, wherein Vout is the output voltage of the operational amplifier, vin is the input voltage of the operational amplifier, R1 is the resistance value of the first feedback component, and R2 is the resistance value of the second feedback component;
the control module is used for controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to the target temperature;
After the direct current power supply module is started for a preset time, a first electric signal and a second electric signal are obtained, wherein the first electric signal is an output signal of the control module, namely an input voltage Vin of the operational amplifier, and the second electric signal is an output signal of the operational amplifier, namely an output voltage Vout of the operational amplifier;
judging whether the first electric signal and the second electric signal meet preset conditions or not;
If the first electric signal and the second electric signal meet preset conditions, determining that the shell temperature of the direct current power supply module is the target control temperature;
If the first electric signal and the second electric signal do not meet the preset condition, adjusting the environmental temperature of the first space according to the magnitude of the preset temperature value until the first electric signal and the second electric signal meet the preset condition;
The preset condition is whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal, and the control module is used for judging whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal;
If the absolute value of the first electric signal is equal to the absolute value of the second electric signal, determining the shell temperature of the direct current power supply module as a target control temperature;
And if the absolute value of the first electric signal is different from the absolute value of the second electric signal, adjusting the ambient temperature of the first space according to the magnitude of the preset temperature value, and judging whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal or not again after the preset time.
2. The system of claim 1, wherein the first feedback assembly comprises a first thermistor, and wherein the housing of the dc power module is attached to a surface of the first thermistor.
3. The system of claim 2, wherein the second feedback assembly comprises a second thermistor, wherein the second thermistor has the same temperature coefficient as the first thermistor.
4. The system of claim 3, wherein the first thermistor and the second thermistor are both positive temperature coefficient thermistors.
5. The system of claim 1, wherein the control module is specifically configured to regulate an ambient temperature of the first space to a first temperature via the first temperature control assembly; and adjusting the ambient temperature of the second space to a second temperature through the second temperature control assembly.
6. A temperature control method, characterized by being applied to the control module of the temperature control system according to any one of claims 1 to 5, comprising:
controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to a target temperature;
After the direct current power supply module is started for a preset time, a first electric signal and a second electric signal are obtained, wherein the first electric signal is an output signal of the control module, namely an input voltage Vin of the operational amplifier, and the second electric signal is an output signal of the operational amplifier, namely an output voltage Vout of the operational amplifier;
judging whether the first electric signal and the second electric signal meet preset conditions or not;
If the first electric signal and the second electric signal meet preset conditions, determining that the shell temperature of the direct current power supply module is the target control temperature;
If the first electric signal and the second electric signal do not meet the preset condition, adjusting the environmental temperature of the first space according to the magnitude of the preset temperature value until the first electric signal and the second electric signal meet the preset condition;
judging whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal;
If the absolute value of the first electric signal is equal to the absolute value of the second electric signal, determining the shell temperature of the direct current power supply module as a target control temperature;
And if the absolute value of the first electric signal is different from the absolute value of the second electric signal, adjusting the ambient temperature of the first space according to the magnitude of the preset temperature value, and judging whether the absolute value of the first electric signal is equal to the absolute value of the second electric signal or not again after the preset time.
7. The method of claim 6, wherein controlling the ambient temperature of the first space and the ambient temperature of the second space to adjust to the target temperature comprises:
adjusting the ambient temperature of the first space to a first temperature by the first temperature control assembly;
and adjusting the ambient temperature of the second space to a second temperature through the second temperature control assembly.
8. An electronic device comprising the temperature control system of any one of claims 1-5.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202502423U (en) * | 2012-01-20 | 2012-10-24 | 张家港市华为电子有限公司 | Temperature control circuit used in DC-DC direct current converter |
| CN115200191A (en) * | 2022-07-20 | 2022-10-18 | 广东万颗子智控科技有限公司 | Air conditioner control method and device, storage medium and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2042214U (en) * | 1988-08-06 | 1989-08-02 | 刘永康 | Temperature controller |
| KR100304795B1 (en) * | 1998-10-01 | 2001-09-24 | 손성택 | Semiconductor cooler temperature controller |
| CN2724069Y (en) * | 2004-08-23 | 2005-09-07 | 北京集天众合科技开发有限公司 | Electronic temperature controller |
| CN113037255A (en) * | 2021-03-12 | 2021-06-25 | 维沃移动通信有限公司 | Laser sensor control circuit, method and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202502423U (en) * | 2012-01-20 | 2012-10-24 | 张家港市华为电子有限公司 | Temperature control circuit used in DC-DC direct current converter |
| CN115200191A (en) * | 2022-07-20 | 2022-10-18 | 广东万颗子智控科技有限公司 | Air conditioner control method and device, storage medium and electronic equipment |
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