CN117555369B - Temperature control system and method and electronic equipment - Google Patents

Abstract

The application relates to a temperature control system, a temperature control method and electronic equipment, which comprise the following steps: the device comprises a direct current power supply module, a first temperature control assembly, a second temperature control assembly, a first feedback assembly, a second feedback assembly, an operational amplifier and a control module; the control module is used for acquiring a first electric signal and a second electric signal after the direct-current power supply module is started for a preset time; determining whether the shell temperature of the direct current power supply module is a target control temperature according to the first electric signal and the second electric signal; and if the first electric signal and the second electric signal do not meet the preset condition, adjusting the environmental temperature of the second space according to the magnitude of the preset temperature value until the first electric signal and the second electric signal meet the preset condition. According to the application, the control condition of the shell temperature of the direct current power supply module is monitored in real time through the negative feedback circuit, and the environment temperature of the first space is regulated in real time through the temperature control equipment, so that the shell temperature of the direct current power supply module can be accurately controlled.

Description

Temperature control system, method and electronic equipment

Technical Field

The present application relates to the field of electronic circuit technology, and in particular to a temperature control system, method and electronic equipment.

Background Art

DC power modules are widely used in communication, network, industrial control, railway, military and other fields due to their small size, good performance and convenient use. The power of DC power modules is generally greater than 5 watts. During use, the DC power module will generate heat, causing the shell temperature to rise, and the shell temperature will affect the electrical performance of the DC power module.

At present, the commonly used method for measuring the temperature curve of a DC power module is to heat the DC power module through a heat flow hood or a temperature chamber, and measure its electrical parameters after keeping it for a certain period of time. Since the DC power module generates heat when working, the shell temperature of the DC power module is actually higher than the ambient temperature. This results in a certain error between the actual tested temperature point and the required tested temperature point in the process of drawing the temperature curve.

Normally, researchers can use the thermal characteristics of DC power modules to calculate the temperature rise of DC power modules, and appropriately reduce the ambient temperature based on the calculation results to offset the temperature rise caused by the operation of the DC power modules. However, this type of calculation process is relatively complicated, and the actual temperature rise is not necessarily equal to the calculated theoretical value.

Therefore, there is an urgent need for a temperature control solution that can accurately control the temperature of the DC power module housing.

Summary of the invention

Based on this, it is necessary to provide a temperature control system, method and electronic device that can accurately control the temperature of the DC power module housing in order to solve the above technical problems.

In a first aspect, the present application provides a temperature control system, including: a DC power supply module, a first temperature control component, a second temperature control component, a first feedback component, a second feedback component, an operational amplifier, and a control module;

The housing of the DC power supply module is attached to the surface of the first feedback component, the first feedback component and the DC power supply module are arranged in a first space, and the second feedback component is arranged in a second space; the first temperature control component is used to adjust the ambient temperature of the first space, and the second temperature control component is used to adjust the ambient temperature of the second space; the output end of the control module is connected to the first input end of the operational amplifier through the second feedback component, the first input end of the operational amplifier is also connected to the output end of the operational amplifier through the first feedback component, the output end of the operational amplifier is connected to the input end of the control module, the second input end of the operational amplifier is grounded, and the output end of the control module is also connected to the first temperature control component;

The control module is used to control the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to a target temperature;

After the DC power supply module is started for a preset time, a first electrical signal and a second electrical signal are acquired, wherein the first electrical signal is an output signal of the control module, and the second electrical signal is an output signal of the operational amplifier;

Determining whether the first electrical signal and the second electrical signal meet a preset condition;

If the first electrical signal and the second electrical signal meet a preset condition, determining that the housing temperature of the DC power supply module is a target control temperature;

If the first electrical signal and the second electrical signal do not meet the preset conditions, the ambient temperature of the first space is adjusted according to a preset temperature value amplitude until the first electrical signal and the second electrical signal meet the preset conditions.

In one embodiment, the first feedback component includes a first thermistor, and the housing of the DC power module is attached to a surface of the first thermistor.

In one embodiment, the second feedback component includes a second thermistor, wherein the second thermistor has the same temperature coefficient as the first thermistor.

In one embodiment, the first thermistor and the second thermistor are both positive temperature coefficient thermistors.

In one embodiment, the control module is specifically configured to adjust the ambient temperature of the first space to a first temperature through the first temperature control component; and adjust the ambient temperature of the second space to a second temperature through the second temperature control component.

In one embodiment, the control module is used to determine whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal;

If the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal, determining that the housing temperature of the DC power supply module is the target control temperature;

If the absolute value of the first electrical signal is different from the absolute value of the second electrical signal, the ambient temperature of the first space is adjusted according to a preset temperature value amplitude, and after a preset time, it is re-determined whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal.

In a second aspect, the present application further provides a temperature control method, which is applied to the control module of the temperature control system described in the first aspect, comprising:

Controlling the ambient temperature of the first space and the ambient temperature of the second space to target temperatures;

After the DC power supply module is started for a preset time, a first electrical signal and a second electrical signal are acquired, wherein the first electrical signal is an output signal of the control module, and the second electrical signal is an output signal of the operational amplifier;

Determining whether the first electrical signal and the second electrical signal meet a preset condition;

If the first electrical signal and the second electrical signal meet a preset condition, determining that the housing temperature of the DC power supply module is a target control temperature;

If the first electrical signal and the second electrical signal do not meet the preset conditions, the ambient temperature of the first space is adjusted according to a preset temperature value amplitude until the first electrical signal and the second electrical signal meet the preset conditions.

In one embodiment, controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to a target temperature comprises:

adjusting the ambient temperature of the first space to a first temperature through the first temperature control component;

The ambient temperature of the second space is adjusted to a second temperature by the second temperature control component.

In one embodiment, it also includes:

Determining whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal;

If the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal, determining that the housing temperature of the DC power supply module is the target control temperature;

If the absolute value of the first electrical signal is different from the absolute value of the second electrical signal, the ambient temperature of the first space is adjusted according to a preset temperature value amplitude, and after a preset time, it is re-determined whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal.

In a third aspect, the present application further provides an electronic device, comprising the temperature control system described in the first aspect.

In summary, the present application proposes a temperature control system, method and electronic device, including: a DC power supply module, a first temperature control component, a second temperature control component, a first feedback component, a second feedback component, an operational amplifier and a control module; the control module is used to obtain a first electrical signal and a second electrical signal after the DC power supply module starts for a preset time; determine whether the shell temperature of the DC power supply module is the target control temperature according to the first electrical signal and the second electrical signal; if the first electrical signal and the second electrical signal do not meet the preset conditions, adjust the ambient temperature of the second space according to the preset temperature value amplitude until the first electrical signal and the second electrical signal meet the preset conditions. The present application monitors the control status of the shell temperature of the DC power supply module in real time through a negative feedback circuit, and adjusts the ambient temperature of the first space in real time through a temperature control device, so as to accurately control the shell temperature of the DC power supply module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a block diagram of a temperature control system in one embodiment;

FIG2 is a circuit diagram of a temperature control system in one embodiment;

FIG3 is a schematic flow chart of a temperature control method in one embodiment;

FIG4 is a schematic flow chart of a temperature control method in another embodiment;

FIG. 5 is a structural block diagram of a temperature control module in one embodiment.

Summary of reference numerals:

DC power supply module-110; first temperature control component-120; second temperature control component-130; first feedback component-140; second feedback component-150; operational amplifier-160; control module-170; first space-200; second space-300.

DETAILED DESCRIPTION

In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

The temperature control system provided in the embodiment of the present application, as shown in FIG. 1 , includes: a DC power supply module 110 , a first temperature control component 120 , a second temperature control component 130 , a first feedback component 140 , a second feedback component 150 , an operational amplifier 160 and a control module 170 .

Specifically, the DC power supply module 110 can be a DC/DC direct current power supply module. It should be noted that this embodiment does not limit the specific type of the DC power supply module 110, and can be configured as a DC power supply module that can also use the temperature control system provided in this embodiment to achieve temperature control according to the needs of actual application scenarios.

The first feedback component 140 and the DC power module 110 are arranged in the first space 200, and the second feedback component 150 is arranged in the second space 300. The temperature of the outer surface of the first feedback component 140 and the shell temperature of the DC power module 110 are affected by the ambient temperature in the first space 200, and the temperature of the outer surface of the second feedback component 150 is affected by the ambient temperature in the second space 300. It should be noted that the first space 200 and the second space 300 are both closed physical spaces, and the first space 200 and the second space 300 can both be a receiving space formed by a heat-conducting material. This embodiment does not limit the composition structure or shape of the first space 200 and the second space 300, and can be adaptively configured according to the needs of the actual application scenario. For example, as shown in Figure 1, the first space 200 and the second space 300 are both configured as spherical spaces.

The housing of the DC power module 110 in this embodiment is attached to the surface of the first feedback component 140. In a specific embodiment, the housing of the DC power module 110 is in close contact with the outer surface of the first feedback component 140, and the housing of the DC power module 110 and the outer surface of the first feedback component 140 can conduct heat to each other, so that the housing temperature of the DC power module 110 is equal to the outer surface temperature of the first feedback component 140. It should be noted that in the process of temperature control in this embodiment, a period of time will be allowed to facilitate mutual heat conduction between the housings of the first feedback component 140 and the DC power module 110, so as to more accurately control the ambient temperature in the first space 200.

Specifically, the first temperature control component 120 is connected to the first space 200, and the first temperature control component 120 is used to adjust the ambient temperature of the first space 200. The second temperature control component 130 is connected to the second space 300, and the second temperature control component 130 is used to adjust the ambient temperature of the second space 300. In actual application scenarios, both the first temperature control component 120 and the second temperature control component 130 can be heating devices, which can accurately adjust the ambient temperature in the enclosed space. It should be noted that this embodiment does not limit the specific device type of the first temperature control component 120 and the second temperature control component 130, and can be adaptively configured according to the needs of the actual application scenario. For example, the first temperature control component 120 and the second temperature control component 130 can be a heating wire, a heat flow cover or a temperature control box. When the first temperature control component 120 and the second temperature control component 130 are started, the ambient temperature of the first space 200 and the second space 300 is increased. Both the first space 200 and the second space 300 can be the internal accommodation space of the heat flow cover or the temperature control box.

In a specific embodiment, the first temperature control component 120 and the second temperature control component 130 are temperature control devices of the same type and with the same performance, thereby ensuring that when the first temperature control component 120 and the second temperature control component 130 are started, the control effect on the ambient temperature of the first space 200 and the ambient temperature of the second space 300 is the same, thereby reducing the error of the control module 170 when acquiring electrical signals.

Specifically, the output end of the control module 170 is connected to the first input end of the operational amplifier 160 through the second feedback component 150, and the first input end of the operational amplifier 160 is also connected to the output end of the operational amplifier 160 through the first feedback component 140. The output end of the operational amplifier 160 is connected to the input end of the control module 170, the second input end of the operational amplifier 160 is grounded, and the output end of the control module 170 is also connected to the first temperature control component.

In actual application, the first feedback component 140, the second feedback component 150 and the operational amplifier 160 form a negative feedback circuit. According to Kirchhoff's law, the relationship between the output voltage and the input voltage of the negative feedback circuit of the operational amplifier 160 is |Vout/Vin|=|-R1/R2|, where Vout is the output voltage of the operational amplifier 160, Vin is the input voltage of the operational amplifier 160, R1 is the resistance of the first feedback component 140, and R2 is the resistance of the second feedback component 150.

In actual application scenarios, whether |-R1/R2| is 1 can be determined by determining whether |Vout/Vin| is 1. When |-R1/R2| is 1, it means that the resistance of the first feedback component 140 is equal to the resistance of the second feedback component 150, that is, the outer surface temperature of the first feedback component 140 is equal to the outer surface temperature of the second feedback component 150, that is, the shell temperature of the DC power module 110 is equal to the outer surface temperature of the second feedback component 150.

Specifically, the second feedback component 150 and the second space 300 are reference objects for temperature control in this embodiment.

In the specific temperature control process of this embodiment, the control module 170 first controls the ambient temperature of the first space 200 and the ambient temperature of the second space 300 to be adjusted to the target temperature, thereby ensuring that the outer surface of the second feedback component 150 in the second space 300 serving as a reference object rises to the target temperature that needs to be controlled to achieve.

After the DC power module 110 is started for a preset time, the first electrical signal and the second electrical signal are obtained, wherein the first electrical signal is the output signal of the control module 170, and the second electrical signal is the output signal of the operational amplifier 160. In a specific embodiment, the shell temperature of the DC power module 110 will be increased after the DC power module 110 is started, thereby affecting the actual temperature of the outer surface of the first feedback component 140. This embodiment needs to determine the impact of the DC power module 110 on the shell temperature after it is started through electrical signals. Therefore, this embodiment starts to obtain the first electrical signal and the second electrical signal after the DC power module 110 is started and runs stably for a preset time. It should be noted that the preset time can be determined according to the actual application scenario, and the specific time of the preset time is not limited here.

Specifically, the first electrical signal is the output signal of the control module 170, that is, Vin, and the control module 170 can obtain it by recording the output signal value. The second electrical signal is the output signal of the operational amplifier 160, that is, Vout, and the control module 170 receives the output signal of the operational amplifier 160 through the input terminal. It should be noted that the way in which the control module 170 obtains the first electrical signal and the second electrical signal can be adaptively changed according to the actual application scenario.

After acquiring the first electrical signal and the second electrical signal, the control module 170 further determines whether the first electrical signal and the second electrical signal meet a preset condition. The preset condition may be determining whether the first electrical signal and the second electrical signal are equal. When the first electrical signal and the second electrical signal are equal, it indicates that the outer surface temperature of the first feedback component 140 is equal to the outer surface temperature of the second feedback component 150, that is, the housing temperature of the DC power module 110 is equal to the target temperature of the reference object.

If the first electrical signal and the second electrical signal meet the preset conditions, it is determined that the housing temperature of the DC power module 110 is the target control temperature.

Specifically, when the control module 170 determines that the first electrical signal and the second electrical signal are equal, the shell temperature of the DC power module 110 is determined to be the target control temperature. The target control temperature is the temperature value that the user needs to control the shell of the DC power module 110 to reach through the control module 170.

If the first electrical signal and the second electrical signal do not satisfy the preset conditions, the ambient temperature of the first space 200 is adjusted according to a preset temperature value range until the first electrical signal and the second electrical signal satisfy the preset conditions.

Specifically, when the control module 170 determines that the first electrical signal and the second electrical signal are not equal, it can determine that the outer surface temperature of the first feedback component 140 and the outer surface temperature of the second feedback component 150 are not equal, that is, the shell temperature of the DC power supply module 110 is not equal to the target temperature of the reference object.

At this time, it is necessary to adjust the ambient temperature of the first space 200 according to a certain temperature value so that the shell temperature of the DC power supply module 110 is equal to the target temperature of the reference object. In a specific embodiment, the preset temperature value amplitude can be configured with a specific value according to the needs of the actual application scenario. For example, the preset temperature value amplitude can be configured to 1°C. When the control module 170 determines that the first electrical signal and the second electrical signal are not equal, the output power of the first temperature control module is controlled to achieve a decrease in the ambient temperature in the first space 200. Every time the temperature drops by 1°C, it is re-determined whether the first electrical signal and the second electrical signal meet the preset conditions.

Specifically, this embodiment adjusts the ambient temperature in the first space 200 through one or more temperature adjustment processes, so that the shell temperature of the DC power module 110 in the first space 200 is equal to the target temperature of the reference object.

In summary, the present embodiment discloses a temperature control system, which can comprehensively consider the influence of the ambient temperature controlled by the first temperature control component on the shell temperature of the DC power supply module and the influence of the working state of the DC power supply module on the shell temperature, and form a temperature control reference in the process of controlling the shell temperature of the DC power supply module by configuring the second space and the second feedback component, thereby realizing real-time monitoring and precise control of the shell temperature of the DC power supply module, and realizing precise control of the shell temperature of the DC power supply module through automatic collection, automatic judgment and automatic adjustment of the control module, thereby effectively improving the efficiency and accuracy of temperature control.

In one embodiment, as shown in FIG. 2 , the first feedback component 140 includes a first thermistor, and the housing of the DC power module 110 is attached to the surface of the first thermistor.

Specifically, the first thermistor may be a resistor R1. In an actual application scenario, the resistor R1 is in close contact with the housing of the DC power module 110, and the surface temperature of the resistor R1 may be equal to the housing temperature of the DC power module 110.

In a specific embodiment, the first thermistor and the DC power module 110 are disposed together in the first space 200, and the outer surface temperature of the first thermistor and the shell temperature of the DC power module 110 both change with the change of the ambient temperature in the first space 200. The shell temperature of the DC power module 110 also changes with the change of the internal heating state of the DC power module 110 when the DC power module 110 is in the working state.

It should be noted that the DC power module 110 can be attached to the outer surface of the resistor R1. This embodiment does not limit the setting direction of the DC power module 110 relative to the first thermistor, which can be determined according to the actual application scenario.

In one embodiment, the second feedback component 150 includes a second thermistor, wherein the second thermistor has the same temperature coefficient as the first thermistor.

Specifically, as shown in Fig. 2, the second thermistor may be a resistor R2. In an actual application scenario, the second thermistor is separately disposed in the second space 300, and the temperature of the outer surface of the second thermistor changes with the temperature in the second space 300.

It should be noted that the second thermistor and the first thermistor must be thermistors of exactly the same specifications and have the same temperature coefficient. By using the first thermistor and the second thermistor of exactly the same specifications, this embodiment can more simply realize the reference object for the temperature control of the housing of the DC power module 110, thereby realizing the precise control of the housing temperature of the DC power module 110 with lower cost and fewer control resources.

In a feasible embodiment, the second thermistor and the first thermistor may also be thermistors of different specifications, and the control parameters of the corresponding second temperature control component 130 and the first temperature control component 120 should also be adaptively adjusted, which is not limited in this embodiment.

In one embodiment, the first thermistor and the second thermistor are both positive temperature coefficient thermistors.

In a specific embodiment, the first thermistor and the second thermistor are both configured as thermistors with positive temperature coefficients, so that the resistance change of the first feedback component 140 and the second feedback component 150 can be more intuitively determined through the negative feedback circuit, and the voltage value change of the voltage signal at the output and input of the operational amplifier 160 can be compared. The control module 170 can more accurately control the heating temperature of the first temperature component.

In one embodiment, the control module 170 is specifically configured to adjust the ambient temperature of the first space 200 to a first temperature through the first temperature control component 120 ; and adjust the ambient temperature of the second space 300 to a second temperature through the second temperature control component 130 .

In a specific embodiment, the temperature values of the first temperature and the second temperature are equal. In this embodiment, the first temperature control component 120 and the second temperature control component 130 control the ambient temperature of the first space 200 and the second space 300 to reach the same temperature, which can achieve a simpler control logic. The control module 170 can make the housing temperature of the DC power supply module 110 reach the target temperature of the reference object by only lowering the ambient temperature in the first space 200 through the first temperature control component 120.

It should be noted that the first temperature and the second temperature can also be controlled to be unequal, in which case the first temperature should be slightly lower than the second temperature, so as to more quickly control the shell temperature of the DC power module 110 in the first space 200 to the target temperature. The specific range in which the first temperature is lower than the second temperature can be adaptively configured based on experience in actual application scenarios, and this embodiment does not limit this.

In one embodiment, the control module 170 is used to determine whether the absolute value of the first electrical signal and the absolute value of the second electrical signal are equal;

If the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal, it is determined that the housing temperature of the DC power module 110 is the target control temperature;

If the absolute value of the first electrical signal is different from the absolute value of the second electrical signal, the ambient temperature of the first space 200 is adjusted according to the preset temperature value range, and after a preset time, it is re-determined whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal.

Specifically, during the specific judgment process, the control module 170 can determine whether the shell temperature of the DC power module 110 is the target control temperature by judging whether |Vout|/|Vin| is 1. In a specific embodiment, after adjusting the ambient temperature of the first space 200 according to the preset temperature value amplitude, it is necessary to wait for a preset time to allow the first feedback component 140 to exchange heat with the shell of the DC power module 110, so as to determine the outer surface temperature of the first feedback component 140, that is, the shell temperature of the DC power module 110, by collecting the second electrical signal, that is, the output signal of the operational amplifier 160.

It should be noted that if the absolute value of the first electrical signal and the absolute value of the second electrical signal are still not equal after re-determination, the ambient temperature of the first space 200 needs to be further adjusted until the absolute value of the first electrical signal and the absolute value of the second electrical signal are equal.

In a specific embodiment, the magnitude relationship between the first electrical signal and the second electrical signal can determine the magnitude relationship between the outer surface temperature of the first feedback component 140 and the outer surface temperature of the second feedback component 150, that is, the magnitude relationship between the shell temperature of the DC power supply module 110 and the target temperature of the reference object can be determined.

When the first electrical signal is greater than the second electrical signal, that is, |Vout|/|Vin| is less than 1, it means that the outer surface temperature of the first feedback component 140 is lower than the outer surface temperature of the second feedback component 150. It is necessary to increase the ambient temperature in the first space 200 so that the outer surface temperature of the first feedback component 140 is equal to the outer surface temperature of the second feedback component 150.

When the first electrical signal is smaller than the second electrical signal, that is, |Vout|/|Vin| is greater than 1, it means that the outer surface temperature of the first feedback component 140 is greater than the outer surface temperature of the second feedback component 150. It is necessary to lower the ambient temperature in the first space 200 so that the outer surface temperature of the first feedback component 140 is equal to the outer surface temperature of the second feedback component 150.

Specifically, in this embodiment, the adjustment process of the first space 200 can be determined based on the magnitude relationship between the first electrical signal and the second electrical signal.

In summary, this embodiment provides a temperature control system, which controls the shell temperature of the DC power module in real time. When drawing the temperature curve, the preset condition judgment process based on the negative feedback circuit can effectively offset the shell temperature rise caused by the heat of the DC power module itself. The temperature control implemented by the temperature control system of this embodiment significantly reduces the measurement error when drawing the temperature curve, which is conducive to judging the real performance of the DC power module at a specific temperature point. At the same time, the temperature control system in this application has a simple structure and a wide range of uses. It can be used to automatically control the shell temperature of various types of DC power modules under various load conditions and temperature ranges.

In one embodiment, as shown in FIG3 , a temperature control method is provided, which is described by taking the method applied to the control module of the temperature control system in FIG1 as an example, including the following steps:

S301, controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to target temperatures;

S302, acquiring a first electrical signal and a second electrical signal after the DC power supply module is started for a preset time, wherein the first electrical signal is an output signal of the control module, and the second electrical signal is an output signal of the operational amplifier;

S303, determining whether the first electrical signal and the second electrical signal meet a preset condition;

S304, if the first electrical signal and the second electrical signal meet the preset conditions, determining that the housing temperature of the DC power supply module is the target control temperature;

S305: If the first electrical signal and the second electrical signal do not meet the preset conditions, adjust the ambient temperature of the second space according to the preset temperature value range until the first electrical signal and the second electrical signal meet the preset conditions.

Specifically, the specific implementation methods of the temperature control method proposed in this embodiment can all refer to the specific implementation methods in the aforementioned system embodiments, and this embodiment will not elaborate on them one by one.

In one embodiment, controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to a target temperature includes:

Adjusting the ambient temperature of the first space to a first temperature through a first temperature control component;

The ambient temperature of the second space is adjusted to a second temperature by the second temperature control component.

In one embodiment, as shown in FIG4 , the temperature control method further includes:

S401, determining whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal;

S402: if the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal, determining that the housing temperature of the DC power supply module is the target control temperature;

S403, if the absolute value of the first electrical signal is different from the absolute value of the second electrical signal, adjust the ambient temperature of the second space according to the preset temperature value amplitude, and re-determine whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal after a preset time.

In summary, this embodiment provides a temperature control method, and controls the shell temperature of the DC power module in real time. When drawing the temperature curve, the preset condition judgment process based on the negative feedback circuit can effectively offset the shell temperature rise caused by the heat of the DC power module itself. The temperature control implemented by the temperature control system of this embodiment significantly reduces the measurement error when drawing the temperature curve, which is conducive to judging the real performance of the DC power module at a specific temperature point. At the same time, the temperature control system in this application has a simple structure and a wide range of uses. It can be used to automatically control the shell temperature of various types of DC power modules under various load conditions and temperature ranges.

It should be understood that, although the steps in the flowcharts involved in the above embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

Based on the same inventive concept, the embodiment of the present application also provides a temperature control device for implementing the temperature control method involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more temperature control device embodiments provided below can refer to the limitations on the temperature control method above, and will not be repeated here.

In one embodiment, as shown in FIG. 5 , a temperature control device 500 is provided, comprising: a control module 510, an acquisition module 520, a determination module 530, a first execution module 540 and a second execution module 550, wherein:

The control module 510 is used to control the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to a target temperature;

An acquisition module 520, configured to acquire a first electrical signal and a second electrical signal after the DC power supply module is started for a preset time, wherein the first electrical signal is an output signal of the control module, and the second electrical signal is an output signal of the operational amplifier;

A determination module 530, configured to determine whether the first electrical signal and the second electrical signal meet a preset condition;

A first execution module 540, configured to determine that the housing temperature of the DC power supply module is a target control temperature if the first electrical signal and the second electrical signal meet a preset condition;

The second execution module 550 is used to adjust the ambient temperature of the second space according to a preset temperature value range if the first electrical signal and the second electrical signal do not meet the preset conditions, until the first electrical signal and the second electrical signal meet the preset conditions.

Each module in the above-mentioned temperature control device can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above-mentioned modules can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

In one embodiment, an electronic device is provided, comprising the temperature control system in the aforementioned system embodiment.

Specifically, the electronic device can be provided with a driving signal by the DC power module in the temperature control system so that the electronic device can operate normally. It should be noted that this embodiment does not limit the specific type of the electronic device, and it can be any device equipped with the temperature control system provided by this embodiment. The specific type of the electronic device can be determined according to the needs of the actual application scenario.

Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiments can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims (8)

1. A temperature control system, characterized in that it comprises: a DC power supply module, a first temperature control component, a second temperature control component, a first feedback component, a second feedback component, an operational amplifier and a control module; The housing of the DC power supply module is attached to the surface of the first feedback component, the first feedback component and the DC power supply module are arranged in a first space, and the second feedback component is arranged in a second space; the first temperature control component is used to adjust the ambient temperature of the first space, and the second temperature control component is used to adjust the ambient temperature of the second space; the output end of the control module is connected to the first input end of the operational amplifier through the second feedback component, the first input end of the operational amplifier is also connected to the output end of the operational amplifier through the first feedback component, the output end of the operational amplifier is connected to the input end of the control module, the second input end of the operational amplifier is grounded, and the output end of the control module is also connected to the first temperature control component; The first feedback component, the second feedback component and the operational amplifier form a negative feedback circuit; the relationship between the output voltage and the input voltage of the negative feedback circuit is |Vout/Vin|=|-R1/R2|, wherein Vout is the output voltage of the operational amplifier, Vin is the input voltage of the operational amplifier, R1 is the resistance value of the first feedback component, and R2 is the resistance value of the second feedback component; The control module is used to control the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to a target temperature; After the DC power supply module is started for a preset time, a first electrical signal and a second electrical signal are obtained, wherein the first electrical signal is the output signal of the control module, that is, the input voltage Vin of the operational amplifier, and the second electrical signal is the output signal of the operational amplifier, that is, the output voltage Vout of the operational amplifier; Determining whether the first electrical signal and the second electrical signal meet a preset condition; If the first electrical signal and the second electrical signal meet a preset condition, determining that the housing temperature of the DC power supply module is a target control temperature; If the first electrical signal and the second electrical signal do not meet the preset conditions, adjusting the ambient temperature of the first space according to a preset temperature value amplitude until the first electrical signal and the second electrical signal meet the preset conditions; The preset condition is whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal, and the control module is used to determine whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal; If the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal, determining that the housing temperature of the DC power supply module is the target control temperature; If the absolute value of the first electrical signal is different from the absolute value of the second electrical signal, the ambient temperature of the first space is adjusted according to a preset temperature value amplitude, and after a preset time, it is re-determined whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal. 2. The system according to claim 1, characterized in that the first feedback component comprises a first thermistor, and the housing of the DC power supply module is attached to a surface of the first thermistor. 3 . The system of claim 2 , wherein the second feedback component comprises a second thermistor, wherein the second thermistor has a same temperature coefficient as the first thermistor. 4 . The system according to claim 3 , wherein the first thermistor and the second thermistor are both positive temperature coefficient thermistors. 5. The system according to claim 1 is characterized in that the control module is specifically used to adjust the ambient temperature of the first space to a first temperature through the first temperature control component; and adjust the ambient temperature of the second space to a second temperature through the second temperature control component. 6. A temperature control method, characterized in that the control module applied to the temperature control system according to any one of claims 1 to 5 comprises: Controlling the ambient temperature of the first space and the ambient temperature of the second space to target temperatures; After the DC power supply module is started for a preset time, a first electrical signal and a second electrical signal are obtained, wherein the first electrical signal is the output signal of the control module, that is, the input voltage Vin of the operational amplifier, and the second electrical signal is the output signal of the operational amplifier, that is, the output voltage Vout of the operational amplifier; Determining whether the first electrical signal and the second electrical signal meet a preset condition; If the first electrical signal and the second electrical signal meet a preset condition, determining that the housing temperature of the DC power supply module is a target control temperature; If the first electrical signal and the second electrical signal do not meet the preset conditions, adjusting the ambient temperature of the first space according to a preset temperature value amplitude until the first electrical signal and the second electrical signal meet the preset conditions; Determining whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal; If the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal, determining that the housing temperature of the DC power supply module is the target control temperature; If the absolute value of the first electrical signal is different from the absolute value of the second electrical signal, the ambient temperature of the first space is adjusted according to a preset temperature value amplitude, and after a preset time, it is re-determined whether the absolute value of the first electrical signal is equal to the absolute value of the second electrical signal. 7. The method according to claim 6, characterized in that the step of controlling the ambient temperature of the first space and the ambient temperature of the second space to be adjusted to the target temperature comprises: adjusting the ambient temperature of the first space to a first temperature through the first temperature control component; The ambient temperature of the second space is adjusted to a second temperature by the second temperature control component. 8. An electronic device, characterized by comprising the temperature control system according to any one of claims 1 to 5.