CN117545817A - Adhesive tape - Google Patents
Adhesive tape Download PDFInfo
- Publication number
- CN117545817A CN117545817A CN202280044643.9A CN202280044643A CN117545817A CN 117545817 A CN117545817 A CN 117545817A CN 202280044643 A CN202280044643 A CN 202280044643A CN 117545817 A CN117545817 A CN 117545817A
- Authority
- CN
- China
- Prior art keywords
- tackifier
- adhesive
- adhesive composition
- styrene
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 58
- 239000000853 adhesive Substances 0.000 claims abstract description 106
- 230000001070 adhesive effect Effects 0.000 claims abstract description 106
- 239000000203 mixture Substances 0.000 claims abstract description 88
- 239000011347 resin Substances 0.000 claims abstract description 58
- 229920005989 resin Polymers 0.000 claims abstract description 58
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 41
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims abstract description 36
- 150000003505 terpenes Chemical class 0.000 claims abstract description 36
- 235000007586 terpenes Nutrition 0.000 claims abstract description 36
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 22
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 22
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 22
- 150000002148 esters Chemical class 0.000 claims abstract description 18
- 239000000155 melt Substances 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- -1 polypropylene Polymers 0.000 claims description 12
- 239000004743 Polypropylene Substances 0.000 claims description 8
- 229920001155 polypropylene Polymers 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 7
- 229920001971 elastomer Polymers 0.000 abstract description 6
- 150000001336 alkenes Chemical class 0.000 abstract description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 abstract description 5
- 239000005060 rubber Substances 0.000 abstract description 5
- 230000014759 maintenance of location Effects 0.000 abstract description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 32
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 30
- 239000003208 petroleum Substances 0.000 description 18
- 239000004014 plasticizer Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 239000000178 monomer Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000005011 phenolic resin Substances 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 239000003963 antioxidant agent Substances 0.000 description 8
- 239000012943 hotmelt Substances 0.000 description 8
- 238000004898 kneading Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000003921 oil Substances 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 7
- 229920001400 block copolymer Polymers 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 239000004745 nonwoven fabric Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 229920000359 diblock copolymer Polymers 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002174 Styrene-butadiene Substances 0.000 description 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 229920001083 polybutene Polymers 0.000 description 3
- 229920006132 styrene block copolymer Polymers 0.000 description 3
- 239000011115 styrene butadiene Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 229940057995 liquid paraffin Drugs 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000008029 phthalate plasticizer Substances 0.000 description 2
- JQCXWCOOWVGKMT-UHFFFAOYSA-N phthalic acid diheptyl ester Natural products CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- BKUSIKGSPSFQAC-RRKCRQDMSA-N 2'-deoxyinosine-5'-diphosphate Chemical compound O1[C@H](CO[P@@](O)(=O)OP(O)(O)=O)[C@@H](O)C[C@@H]1N1C(NC=NC2=O)=C2N=C1 BKUSIKGSPSFQAC-RRKCRQDMSA-N 0.000 description 1
- ATMGUZHGNPDOEM-UHFFFAOYSA-N 2,6-ditert-butyl-4-methyl-3-octadecylphenol Chemical compound C(CCCCCCCCCCCCCCCCC)C=1C(=C(C(=CC=1C)C(C)(C)C)O)C(C)(C)C ATMGUZHGNPDOEM-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- ROHFBIREHKPELA-UHFFFAOYSA-N 2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]prop-2-enoic acid;methane Chemical compound C.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O ROHFBIREHKPELA-UHFFFAOYSA-N 0.000 description 1
- VNWOJVJCRAHBJJ-UHFFFAOYSA-N 2-pentylcyclopentan-1-one Chemical compound CCCCCC1CCCC1=O VNWOJVJCRAHBJJ-UHFFFAOYSA-N 0.000 description 1
- LZHCVNIARUXHAL-UHFFFAOYSA-N 2-tert-butyl-4-ethylphenol Chemical compound CCC1=CC=C(O)C(C(C)(C)C)=C1 LZHCVNIARUXHAL-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- ODJQKYXPKWQWNK-UHFFFAOYSA-L 3-(2-carboxylatoethylsulfanyl)propanoate Chemical compound [O-]C(=O)CCSCCC([O-])=O ODJQKYXPKWQWNK-UHFFFAOYSA-L 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 1
- UYQYTUYNNYZATF-UHFFFAOYSA-N 6-methyl-4,6-bis(octylsulfanylmethyl)cyclohexa-1,3-dien-1-ol Chemical compound CCCCCCCCSCC1=CC=C(O)C(C)(CSCCCCCCCC)C1 UYQYTUYNNYZATF-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 102100035474 DNA polymerase kappa Human genes 0.000 description 1
- 101710108091 DNA polymerase kappa Proteins 0.000 description 1
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 241001649081 Dina Species 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 235000017858 Laurus nobilis Nutrition 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000005212 Terminalia tomentosa Nutrition 0.000 description 1
- 244000125380 Terminalia tomentosa Species 0.000 description 1
- 241000705989 Tetrax Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- IORUEKDKNHHQAL-UHFFFAOYSA-N [2-tert-butyl-6-[(3-tert-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenyl] prop-2-enoate Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)OC(=O)C=C)=C1O IORUEKDKNHHQAL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- WTOOLIQYCQJDBG-BJILWQEISA-N but-1-ene;(e)-but-2-ene Chemical compound CCC=C.C\C=C\C WTOOLIQYCQJDBG-BJILWQEISA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007757 hot melt coating Methods 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- LGOPTUPXVVNJFH-UHFFFAOYSA-N pentadecanethioic s-acid Chemical compound CCCCCCCCCCCCCCC(O)=S LGOPTUPXVVNJFH-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002953 preparative HPLC Methods 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention provides an adhesive tape which has high adhesion to olefin materials at high temperature and retention at high temperature, and which is difficult to use with conventional rubber adhesives, and the adhesive composition of which has a styrene-butadiene copolymer. According to the present invention, there is provided an adhesive tape comprising an adhesive layer containing an adhesive composition comprising: a styrene-butadiene block copolymer, a 1 st tackifier, a 2 nd tackifier and a 3 rd tackifier; the butadiene portion of the styrene-butadiene block copolymer has been partially hydrogenated, the 1 st tackifier is at least 1 of a rosin ester which is liquid at 23 ℃ and a terpene resin which is liquid at 23 ℃, the softening point of the 2 nd tackifier is 70 to 120 ℃, the softening point of the 3 rd tackifier is 140 ℃ or higher, the holding power of the adhesive tape at 70 ℃ according to JIS Z0237 is 100 minutes or higher, and the melt viscosity of the adhesive composition at 200 ℃ is 10 ten thousand cp or lower.
Description
[ field of technology ]
The present invention relates to an adhesive tape.
[ background Art ]
In various industrial fields such as home appliances, automobiles, and buildings, an adhesive tape is used for joining various assembly members.
The pressure-sensitive adhesive used for the pressure-sensitive adhesive tape includes an acrylic pressure-sensitive adhesive and a rubber pressure-sensitive adhesive, and an acrylic pressure-sensitive adhesive is usually used. However, the acrylic adhesive has insufficient adhesion to the olefin-based material.
In the case of rubber-based adhesives, patent document 1 discloses an adhesive composition comprising a base polymer comprising a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, and a tackifying resin (TH) having a hydroxyl value of 80mgKOH/g or more.
Further, patent document 2 discloses a hot-melt composition comprising a styrene-based block copolymer (a) and a liquid softener (B), wherein the styrene-based block copolymer (a) is a hydrogenated product of a styrene-based thermoplastic elastomer, and the melt viscosity at 180 ℃ are within specific ranges, respectively, and the viscosity ratio (. Eta.1/. Eta.2) of the melt viscosity (. Eta.1) at 140 ℃ to the melt viscosity (. Eta.2) at 180 ℃.
Further, patent document 3 discloses a hot melt adhesive comprising a styrene-based thermoplastic elastomer a, a tackifying resin B, a plasticizer C, and an ethylene-carbonyl-bond-containing ethylene copolymer D, wherein the ratio represented by D/C is 0.10 to 0.80 when the mass part of the plasticizer C is C and the mass part of the ethylene-carbonyl-bond-containing ethylene copolymer D is D.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2013-216853
Patent document 2: japanese patent laid-open publication No. 2019-116608
Patent document 3: japanese patent laid-open No. 2020-203977
[ invention ]
Problems to be solved by the invention
Conventional rubber adhesives may exhibit high adhesion to materials which are not easily adhered by an acrylic adhesive, for example, olefin materials, but may have a problem of insufficient heat resistance due to a decrease in adhesion at high temperature. In addition, conventional pressure-sensitive adhesive tapes mainly include a step of applying a pressure-sensitive adhesive composition, which is obtained by dissolving a pressure-sensitive adhesive in a solvent such as a solvent or water, to a substrate and evaporating the solvent or water, and therefore, the pressure-sensitive adhesive tapes require large energy and cost for production and have a long production time. Therefore, it is desirable that the melt viscosity at high temperature is low, and for example, an adhesive composition which can be sufficiently coated by various hot-melt processes is provided.
The present invention has been made in view of the above circumstances, and provides an adhesive tape having high adhesive strength and holding power for olefinic materials at high temperatures, which is difficult for an adhesive tape using a conventional rubber-based adhesive.
Means for solving the problems
According to the present invention, there is provided an adhesive tape comprising an adhesive layer containing an adhesive composition comprising: a styrene-butadiene block copolymer, a 1 st tackifier, a 2 nd tackifier, and a 3 rd tackifier; the butadiene portion of the styrene-butadiene block copolymer has been partially hydrogenated, the 1 st tackifier is at least 1 of a rosin ester which is liquid at 23 ℃ and a terpene resin which is liquid at 23 ℃, the softening point of the 2 nd tackifier is 70 to 120 ℃, the softening point of the 3 rd tackifier is 140 ℃ or more, the holding power at 70 ℃ according to JIS Z0237 is 100 minutes or more, and the melt viscosity of the adhesive composition at 200 ℃ is 10 ten thousand cp or less.
The present inventors have studied intensively and found that an adhesive tape comprising an adhesive layer containing an adhesive composition, wherein a styrene-butadiene block copolymer having a butadiene portion partially hydrogenated and a 1 st tackifier, a 2 nd tackifier and a 3 rd tackifier each having specific physical properties are blended in the adhesive composition, and wherein the holding power of the adhesive tape and the viscosity of the adhesive composition at high temperature are adjusted, thereby obtaining an adhesive tape having sufficiently high holding power and adhesive strength, and completed the present invention.
Various embodiments of the present invention are illustrated below. The embodiments shown below can be combined with each other.
[1] An adhesive tape comprising an adhesive layer containing an adhesive composition, characterized in that the adhesive composition comprises: a styrene-butadiene block copolymer, a 1 st tackifier, a 2 nd tackifier, and a 3 rd tackifier; the styrene-butadiene block copolymer has been partially hydrogenated in the butadiene portion, the 1 st tackifier is at least 1 of a rosin ester which is liquid at 23 ℃ and a terpene resin which is liquid at 23 ℃, the 2 nd tackifier has a softening point of 70 to 120 ℃, the 3 rd tackifier has a softening point of 140 ℃ or higher, the adhesive tape has a holding power of 100 minutes or higher at 70 ℃ according to JIS Z0237, and the adhesive composition has a melt viscosity of 10 ten thousand cp or lower at 200 ℃.
[2] The adhesive tape according to item [1], wherein the adhesive composition contains 45 to 55 parts by mass of the styrene-butadiene block copolymer, 5 to 15 parts by mass of the 1 st tackifier, 10 parts by mass or more of the 2 nd tackifier, and 30 to 50 parts by mass of the total of the 2 nd tackifier and the 3 rd tackifier, based on 100 parts by mass of the adhesive composition.
[3] The adhesive tape according to [1] or [2], wherein the 2 nd tackifier comprises a terpene resin.
[4] The adhesive tape according to any one of [1] to [3], wherein the 3 rd tackifier comprises a rosin-based resin or a terpene-based resin.
[5] The adhesive tape according to any one of [1] to [4], wherein the adhesive force of the adhesive tape to a polypropylene resin at 80℃according to JIS Z0237 is 2.40N/cm or more.
Effects of the invention
According to the adhesive tape of the present invention, an adhesive tape having high adhesion to an olefin-based material at high temperature and retention at high temperature can be obtained. The adhesive tape of the present invention has a low melt viscosity at high temperature, and for example, an adhesive tape having an adhesive layer containing an adhesive composition that can be sufficiently applied by various hot-melt processes can be obtained. The adhesive tape of the present invention can use the characteristics thereof to adhere various members to each other with higher reliability and at low cost in various industrial fields such as home appliances, automobiles, and buildings. The adhesive tape according to an embodiment of the present invention has the above-described characteristics, and therefore can be preferably used for example: fixing peripheral parts of automobile doors, ceilings, luggage cases and instrument panels; fixing of internal parts in the automotive field such as assembly around an air conditioner and car navigation, OA equipment, home appliances, and the like.
[ description of the drawings ]
Fig. 1 is a schematic view of an adhesive tape according to an embodiment of the present invention.
[ detailed description ] of the invention
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to these descriptions. Various features of the embodiments of the invention shown below may be combined with each other. The invention can be independently implemented for all the characteristics.
1. Adhesive composition
The adhesive tape of the present invention is provided with an adhesive layer containing an adhesive composition. The adhesive composition of the present invention contains: a styrene-butadiene block copolymer, a 1 st tackifier, a 2 nd tackifier, and a 3 rd tackifier.
In the present invention, the tackifier means an adhesion promoter, and means a thermoplastic resin which is liquid or solid at ordinary temperature and is added for improving adhesion. Specific examples of the tackifier include: rosin, terpene, petroleum, and the like.
1.1 styrene-butadiene based Block copolymer
The styrene-butadiene block copolymer of the present invention means a block copolymer comprising a block having a monomer unit derived from styrene and a block having a monomer unit derived from butadiene. The styrene-butadiene block copolymer may be used alone or in combination of 1 or more than 2 kinds, for example, in which the content of the monomer units derived from styrene is different or in which the content of the diblock copolymer is different.
The content of the monomer unit derived from styrene in the styrene-butadiene block copolymer is preferably 5 to 50% by mass, more preferably 10 to 40% by mass. The content of the monomer unit derived from styrene is specifically, for example, 5, 10, 15, 20, 25, 30, 35, 40, 45 or 50 mass%, and may be in a range between any 2 of the values exemplified herein. By setting the range as described above, the obtained pressure-sensitive adhesive tape has an appropriate adhesive force and holding force to the adherend. The content of the monomer unit derived from styrene can be measured according to JIS K6383.
The butadiene portion of the styrene-butadiene block copolymer of the present invention has been partially hydrogenated. The butadiene portion of the styrene-butadiene block copolymer is preferably hydrogenated in an amount of 20 to 90% by mass, more preferably 30 to 80% by mass.
Styrene-butadiene block copolymers whose butadiene portion has been partially hydrogenated are specifically exemplified by styrene-butadiene-butylene-styrene block copolymers (SBBS).
The styrene-butadiene block copolymer of the present invention preferably contains a triblock copolymer comprising a block a containing monomer units derived from styrene, a block B containing monomer units derived from butadiene, and a block C containing monomer units derived from styrene.
The styrene-butadiene block copolymer of the present invention preferably contains a diblock copolymer comprising a block a containing monomer units derived from styrene and a block B containing monomer units derived from butadiene.
Here, the block B containing monomer units derived from butadiene is preferably partially hydrogenated. That is, the block B containing a monomer unit derived from butadiene preferably has a butadiene block and a butene block.
In the styrene-butadiene block copolymer of the present invention, the content of the diblock copolymer is preferably 50 to 85% by mass, more preferably 55 to 80% by mass, based on 100% by mass of the styrene-butadiene block copolymer. The content of the diblock copolymer is, for example, specifically 50, 55, 60, 65, 70, 75, 80 or 85 mass%, and may be in a range between any 2 of the values exemplified herein. By setting the content of the diblock copolymer to the above-mentioned numerical range, an adhesive composition having an appropriate tackiness can be obtained. In the present invention, the styrene-butadiene block copolymer used for the adhesive may be 1 kind, or 2 or more kinds may be used in combination. The adhesive force and melt viscosity can be adjusted to appropriate ranges by appropriately selecting resins having different viscosities and styrene contents.
The weight average molecular weight of the styrene-butadiene block copolymer is not particularly limited, but is preferably 3 to 50 tens of thousands, more preferably 6 to 30 tens of thousands, for example. The weight average molecular weight can be determined by Gel Permeation Chromatography (GPC).
1.2 1 st tackifier
The 1 st tackifier of the present invention is at least 1 of a rosin ester which is liquid at 23 ℃ and a terpene resin which is liquid at 23 ℃. As the 1 st tackifier, 1 or 2 or more kinds of rosin esters which are liquid at 23 ℃ or terpene-based resins which are liquid at 23 ℃ may be used alone or in combination.
As examples of such liquid rosin ESTERs, SUPER ESTER A-18, ESTER GUM AT and the like are commercially available from Szechuan chemical Co., ltd.
In particular, terpene resins are preferably used because they reduce the viscosity at the time of application but do not reduce the holding power. Examples of such terpene RESINs are commercially available from Yasuhara Chemical as DAIMALON (liquid terpene RESIN, flash point 174 ℃ C.), YS RESIN CP (liquid terpene RESIN, flash point 178 ℃ C.), YSRESIN PX300N (terpene RESIN, flash point 202 ℃ C.), YSPOLYSTER T30 (terpene phenolic RESIN, flash point 205 ℃ C.), YS RESIN LP (aromatic modified terpene RESIN, flash point 220 ℃ C.), and may be freely selected. Among them, YS RESIN LP is preferably used from the viewpoints of high flash point, low heating loss and high compatibility with the styrene-butadiene block copolymer of the present invention.
The viscosity of the 1 st tackifier is preferably 500 to 150000cp, more preferably 1000 to 100000cp at 25 ℃. The viscosity at 25℃is, for example, 500, 1000, 2000, 5000, 10000, 20000, 50000, 100000, 120000 or 150000cp, and may also be in a range between any 2 of the values exemplified herein.
1.3 No. 2 tackifier
The softening point of the 2 nd tackifier is 70-120 ℃. As the 2 nd tackifier, 1 kind of tackifiers having a softening point of 70 to 120℃may be used alone or 2 or more kinds may be used in combination. The softening point of the 2 nd tackifier is preferably 80 to 120℃and more preferably 85 to 115 ℃. The softening point is, specifically, for example, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115 or 120 ℃, and may be in a range between any 2 of the values exemplified herein.
As the 2 nd tackifier, C9 petroleum resin, hydrogenated C9 petroleum resin, C5 petroleum resin, alicyclic/aromatic petroleum resin, rosin resin (polymerized rosin ester, modified polymerized rosin ester, stabilized rosin ester, etc.), terpene resin (terpene resin, aromatic modified terpene resin, terpene phenol resin, hydrogenated terpene phenol resin, etc.) can be used. In the present invention, at least 1 kind selected from terpene resins is preferable from the viewpoint of good holding power. Further, from the viewpoint of imparting good tackiness, the 2 nd tackifier more preferably contains a terpene resin.
1.4 3 rd tackifier
The softening point of the 3 rd tackifier is 140 ℃ or higher. As the 3 rd tackifier, 1 kind of tackifiers having a softening point of 140℃or more may be used alone or 2 kinds or more may be used in combination. The softening point of the 3 rd tackifier is preferably 140 to 180℃and more preferably 140 to 170 ℃. The softening point is specifically, for example, 140, 145, 150, 155, 160, 165, 170, 175, or 180 ℃, and may be in a range between any 2 of the values exemplified herein.
The softening point of the tackifier can be defined as a value measured based on a softening point test method (ring and ball method) defined in JIS K5902 and JIS K2207. In particular, the sample is melted as rapidly as possible at low temperatures and carefully filled in a ring placed on a flat metal plate in a non-foaming manner. After cooling, the raised portions above the plane containing the ring tips were cut off with a slightly heated knife. Then, the holder (ring seat) was placed in a glass container (heating bath) having a diameter of 85mm or more and a height of 127mm or more, and glycerin was injected so that the depth became 90mm or more. Then, the specimen was immersed in glycerin so that a steel ball (diameter 9.5mm, weight 3.5 g) and the ring filled with the specimen were not in contact with each other, and the temperature of glycerin was maintained at 20.+ -. 5 ℃ for 15 minutes. Then, the steel ball is placed in the center of the surface of the sample in the ring and placed in a fixed position on the holder. Then, the distance from the top of the ring to the glycerin surface was kept at 50mm, a thermometer was placed so that the center position of the bulb of water and the center of the ring of the thermometer were at the same height, and the container was heated. The flame of the Bunsen burner for heating contacts the bottom of the container
The heating is uniform between the center and the edge. The rate of rise in bath temperature from the start of heating to the time when 40℃is reached may be set to 5.0.+ -. 0.5℃per minute. The temperature at which the sample gradually softens from the time it finally contacts the bottom plate under circulation is read as the softening point. The softening point may be measured simultaneously for 2 or more and the average value thereof may be used. Further, since the softening point is a temperature about 50 ℃ higher than the glass transition temperature of the tackifier, the softening point can be inferred by detecting Tg using DSC (differential scanning calorimeter). As a method for identifying the softening point of a tackifier in an adhesive using this method, there is a method in which a tackifier component in an adhesive is separated by using preparative HPLC, tg is measured from the DSC measurement result of the separated sample, and the softening point is estimated.
Examples of the 3 rd tackifier include C9 petroleum resin, hydrogenated C9 petroleum resin, C5 petroleum resin, alicyclic/aromatic petroleum resin, terpene resin (terpene resin, aromatic modified terpene resin, terpene phenol resin, hydrogenated terpene phenol resin, etc.), rosin resin (polymerized rosin ester, modified polymerized rosin ester, stabilized rosin ester, etc.), alkylphenol compound, etc. From the viewpoint of excellent balance between melt viscosity and high-temperature adhesive force, the resin composition preferably contains a rosin-based resin or a terpene-based resin, and more preferably contains a rosin-based resin or a terpene-phenolic resin. From the viewpoint of high softening point and good compatibility with the styrene-based elastomer, a polymerized rosin ester may be contained. In addition, the 3 rd tackifier may comprise a hydrogenated C9 petroleum resin, a C5 petroleum resin, and a terpene-based resin. Hydrogenated C9 petroleum resin and C5 petroleum resin are preferable from the viewpoint of cost. In addition, hydrogenated C9 petroleum resin is more preferable from the viewpoint of less odor than other petroleum resins. From the viewpoint of obtaining an adhesive composition having a low melt viscosity and being easy to apply, it is preferable to include a terpene phenolic resin.
1.5 content of each component
The adhesive composition according to an embodiment of the present invention must contain a styrene-butadiene block copolymer, a 1 st tackifier, a 2 nd tackifier, and a 3 rd tackifier. In the pressure-sensitive adhesive composition according to one embodiment of the present invention, the holding power of the pressure-sensitive adhesive tape having the pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition and the melt viscosity of the pressure-sensitive adhesive composition are not particularly limited as long as the contents of the components are adjusted within the ranges described below. The adhesive composition according to one embodiment of the present invention is, although depending on the types of the components, for example, the following contents of the components make it easier to adjust the holding power of the adhesive tape and the melt viscosity of the adhesive composition, and to control the adhesive force of the adhesive tape.
In the adhesive composition according to one embodiment of the present invention, the styrene-butadiene block copolymer is preferably contained in an amount of 45 to 55 parts by mass based on 100 parts by mass of the adhesive composition. The content of the styrene-butadiene block copolymer is, specifically, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54 or 55 parts by mass, for example, and may be in a range between any 2 of the values exemplified herein.
In the adhesive composition according to one embodiment of the present invention, the 1 st tackifier is preferably contained in an amount of 5 to 15 parts by mass based on 100 parts by mass of the adhesive composition. The content of the 1 st tackifier is specifically, for example, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 or 15 parts by mass, and may be in a range between any 2 of the values exemplified herein.
In the adhesive composition according to an embodiment of the present invention, the amount of the 2 nd tackifier is preferably 10 parts by mass or more, more preferably 10 to 40 parts by mass, and still more preferably 15 to 25 parts by mass, based on 100 parts by mass of the adhesive composition. The content of the 2 nd tackifier is specifically, for example, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39 or 40 parts by mass, and may be in a range between any 2 of the values exemplified herein.
In the adhesive composition according to an embodiment of the present invention, the total content of the 2 nd tackifier and the 3 rd tackifier is preferably 30 to 50 parts by mass based on 100 parts by mass of the adhesive composition. The content of the 2 nd tackifier and the 3 rd tackifier is, for example, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49 or 50 parts by mass, and may be in a range between any 2 of the values exemplified herein.
In the adhesive composition according to an embodiment of the present invention, the 3 rd tackifier is preferably contained in an amount of 10 to 30 parts by mass, more preferably 15 to 25 parts by mass, based on 100 parts by mass of the adhesive composition. The content of the 3 rd tackifier is specifically, for example, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 or 30 parts by mass, and may be in a range between any 2 of the values exemplified herein.
In the adhesive composition according to an embodiment of the present invention, when the adhesive composition is set to 100 parts by mass, it is more preferable that the adhesive composition contains 45 to 55 parts by mass of the styrene-butadiene block copolymer, 5 to 15 parts by mass of the 1 st tackifier, 10 parts by mass or more of the 2 nd tackifier, and 30 to 50 parts by mass of the 2 nd tackifier and the 3 rd tackifier in total; more preferably, the composition comprises 45 to 55 parts by mass of a styrene-butadiene block copolymer, 5 to 15 parts by mass of a 1 st tackifier, 10 parts by mass or more of a 2 nd tackifier, 10 parts by mass or more of a 3 rd tackifier, and 30 to 50 parts by mass of the 2 nd tackifier and the 3 rd tackifier in total. In the adhesive composition according to one embodiment of the present invention, the adhesive composition preferably contains 45 to 55 parts by mass of the styrene-butadiene block copolymer, 5 to 15 parts by mass of the 1 st tackifier, 10 to 40 parts by mass or more of the 2 nd tackifier, and 10 to 30 parts by mass of the 3 rd tackifier, based on 100 parts by mass of the adhesive composition.
In the adhesive composition according to one embodiment of the present invention, the holding power and the adhesive force of the adhesive tape are more appropriately adjusted by setting the content of each component to the above-mentioned numerical range, and the adhesive composition becomes an adhesive tape having a lower melt viscosity at 200 ℃.
1.6 other ingredients
The pressure-sensitive adhesive composition of the present invention may contain various additives such as plasticizers, antioxidants, ultraviolet absorbers, stabilizers, fillers, and modifiers, in addition to the above-mentioned components, within a range that does not inhibit the effects of the present invention.
(plasticizer)
The adhesive composition of an embodiment of the present invention may contain a plasticizer. In the adhesive composition according to an embodiment of the present invention, the content of the plasticizer is preferably less than 4 parts by mass with respect to 100 parts by mass of the adhesive composition. Specifically, the content of the plasticizer is, for example, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0 or 3.5 parts by mass, and may be in a range between any 2 of the values exemplified herein. The adhesive composition of an embodiment of the present invention may also be free of plasticizers.
The adhesive composition according to one embodiment of the present invention comprises the styrene-butadiene block copolymer, the 1 st, 2 nd and 3 rd tackifiers, and the blending amount of these tackifiers is adjusted so that the holding power of the adhesive tape and the melt viscosity of the adhesive composition are appropriate, whereby an adhesive tape having excellent balance of holding power, adhesive strength and melt viscosity at 200 ℃ can be obtained even when the plasticizer content is small or even when the plasticizer is not contained.
Plasticizers can be exemplified by: phthalate plasticizers, polybutenes, paraffin-based processing oils, naphthene-based (napthene-based) processing oils, aromatic-based processing oils, liquid paraffin, hydrocarbon-based synthetic oils, and the like.
Polybutene may be exemplified by, for example: homopolymers of isobutylene, copolymers of isobutylene and n-butene, and the like. Commercially available products include, for example: "10N" manufactured by Japanese fat and oil Co., ltd., "Indopol H-100" manufactured by INEOS Co., ltd., new Japanese Petroleum chemical Co., ltd., and "TETRAX" manufactured by New Japanese Petroleum chemical Co., ltd., nisseki Polybutene "manufactured by New Japanese Petroleum chemical Co., ltd.
Examples of the paraffin-based processing oil include: PW-32 manufactured by Youzhixing Co., ltd., "Diana Fresia S32 manufactured by Youzhixing Co., ltd.," PS-32 manufactured by Youzhixing Co., ltd., "and the like.
Examples of the naphthenic processing oil include: "KN4010" manufactured by petroChina, "Diana Fresia N28" manufactured by Youzhu Xingxing Co., ltd., and "Diana Fresia N90" manufactured by Youzhu Xingxing Co., ltd., and "Diana Process Oil NR" manufactured by Youzhu Xingxing Co., ltd.
Examples of the aromatic processing oil include: "AROMAX" manufactured by New Japanese Petroleum Co. Liquid paraffin can be exemplified by: "P-100" manufactured by MOESCO company, and "Kaydol" manufactured by Sonneborn company.
Examples of hydrocarbon-based synthetic oils include: "LUCANT HC-10" manufactured by Mitsui chemical Co., ltd., and "LUCANT HC-20" manufactured by Mitsui chemical Co., ltd.
The phthalate plasticizer may be exemplified by: DINA (diisononyl adipate), DEHP (di (2-ethylhexyl phthalate)), DBP (dibutyl phthalate), BBP (butyl benzyl phthalate), DINP (diisononyl phthalate), DIDP (diisodecyl phthalate), DNOP (di-n-octyl phthalate).
In the adhesive composition according to an embodiment of the present invention, the total content of the above-exemplified plasticizers preferably falls within the above-mentioned numerical range. In the adhesive composition according to one embodiment of the present invention, the total content of the phthalate plasticizer is particularly preferably within the above-mentioned numerical range.
(antioxidant, ultraviolet absorber)
Antioxidants can be exemplified by, for example: phenolic antioxidants such as n-octadecyl 2, 6-di (t-butyl) -4-methylphenol, 3- (4 ' -hydroxy-3 ',5' -di (t-butyl) phenyl) propionate, 2' -methylenebis (4-methyl-6-t-butylphenol), 2' -methylenebis (4-ethyl-6-t-butylphenol), 2, 4-bis (octylthiomethyl) -o-cresol, 2-t-butyl-6- (3-t-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenyl acrylate, 2, 4-di (t-amyl) -6- [1- (3, 5-di (t-amyl) -2-hydroxyphenyl) ethyl ] phenyl acrylate, 2- [1- (2-hydroxy-3, 5-di (t-amyl) phenyl) ] acrylate, tetrakis [ methylene-3- (3, 5-di (t-butyl) -4-hydroxyphenyl) propionate ] methane, 2, 4-bis [ (dodecylthiomethyl ] -6-methylphenol; a sulfur-based antioxidant such as dilauryl thiodipropionate, laurel thiodipropionate Gui Yingzhi ester, and tetra (3-laurylthiopropionate) pivalol; phosphorus antioxidants such as tris (nonylphenyl) phosphite and tris (2, 4-di (t-butyl) phenyl) phosphite; lactone antioxidants, and the like. Examples of the ultraviolet absorber include: benzotriazole-based ultraviolet absorbers such as 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, 2- (2 '-hydroxy-3', 5 '-di (t-butyl) phenyl) benzotriazole, and 2- (2' -hydroxy-3 ',5' -di (t-butyl) phenyl) -5-chlorobenzotriazole; benzophenone-based ultraviolet absorbers such as 2-hydroxy-4-methoxybenzophenone; salicylate-based ultraviolet absorbers; a cyanoacrylate-based ultraviolet absorber; hindered amine light stabilizers. They may be used alone or in combination.
(filler)
The filler is not particularly limited, and examples thereof include: calcium carbonate, kaolin (kalin), talc (tac), titanium oxide, mica, styrene beads, silica, and the like. These particulate fillers may be used alone or in combination.
1.7 melt viscosity at 200 ℃
In order to perform hot melt coating, the adhesive composition according to an embodiment of the present invention needs to have a melt viscosity of 10 ten thousand cp or less at 200 ℃. Further, the melt viscosity at 200℃is more preferably 2 to 9 ten thousand cp.
Specifically, the melt viscosity at 200℃is, for example, 2 ten thousand, 3 ten thousand, 4 ten thousand, 5 ten thousand, 6 ten thousand, 7 ten thousand, 8 ten thousand, 9 ten thousand or 10 ten thousand cp, and may be in a range between any 2 of the values exemplified herein.
The melt viscosity at 200℃can be controlled by appropriately selecting the kind of the adhesive composition to be blended and adjusting the blending amount thereof.
The melt viscosity of the adhesive composition can be measured at 200℃with a shear rate of 10 (1/s) using a rheometer.
1.8 method of manufacturing
The method for producing the adhesive composition according to one embodiment of the present invention is not particularly limited. For example, the method for producing the adhesive composition according to an embodiment of the present invention may include a kneading step of kneading a raw material containing the 1 st tackifier, the 2 nd tackifier, and the 3 rd tackifier with a kneader. In the above steps, an antioxidant and a plasticizer may be further added.
The kneading step of the thickener and the like may be performed, for example, under conditions of 3 to 30 minutes and 5 to 25 rpm.
In the method for producing an adhesive composition according to an embodiment of the present invention, it is preferable that the method further comprises a styrene-butadiene block copolymer addition-kneading step of adding and kneading the styrene-butadiene block copolymer after the kneading step of the tackifier and the like. The styrene-butadiene block copolymer addition-kneading step may be performed, for example, under conditions of 20 to 200 minutes and 5 to 25 rpm.
2. Pressure-sensitive adhesive layer/pressure-sensitive adhesive tape
The pressure-sensitive adhesive tape of the present invention comprises a pressure-sensitive adhesive layer containing the pressure-sensitive adhesive composition.
The adhesive layer is formed by heating the adhesive composition with, for example, a melter to dissolve and apply it to a substrate. The coating method is not particularly limited, and it is preferable to heat and melt the raw materials of the adhesive, mix them, and apply them by a hot-melt method. That is, the method for producing an adhesive tape according to an embodiment of the present invention preferably includes a coating step of applying the adhesive composition to a substrate by a hot-melt method.
Conventional pressure-sensitive adhesive tapes for use in automobile fields and the like have a step of applying a pressure-sensitive adhesive composition in which a pressure-sensitive adhesive is dissolved in a solvent such as a solvent and water to a substrate and evaporating the solvent and water, and therefore, the energy required for production is large, the cost is high, and the production time is long. The adhesive composition of the present invention has low viscosity at high temperature and can be coated by a hot-melt method, so that an adhesive tape can be manufactured at low energy and low cost in a short time.
The coating method can adopt a non-contact coating mode or a contact mode. Examples of the non-contact coating method include cross coating (cross coat). The contact method may be, for example, slit die coating.
The thickness of the pressure-sensitive adhesive layer is not particularly limited, and is preferably 40 to 100. Mu.m. The thickness of the adhesive layer is specifically, for example, 40, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, or 100 μm, and may also be in a range between any 2 of the values exemplified herein. In the conventional solvent-based adhesive composition, when a thick adhesive layer is to be formed, the drying step is long in accordance with the thickness, and the energy and cost are increased, but the adhesive composition of the present invention has a viscosity falling within a specific range at a high temperature and can be applied by a hot-melt method, so that an adhesive layer having a thicker film thickness can be produced at a lower energy and cost in a shorter time than the conventional one.
The adhesive tape of the present invention is preferably a double-sided adhesive tape having an adhesive layer on both sides of a nonwoven fabric. The pressure-sensitive adhesive tape of the present invention preferably has a pressure-sensitive adhesive layer having the above thickness on both sides of a nonwoven fabric.
The structure of the adhesive tape according to an embodiment of the present invention is shown in fig. 1. The pressure-sensitive adhesive tape has a pressure-sensitive adhesive layer 2 and a pressure-sensitive adhesive layer 4 on both sides of a nonwoven fabric 3. In the pressure-sensitive adhesive layer 2, a double-sided release film 1 is bonded to the surface opposite to the surface in contact with the nonwoven fabric.
2.1 adhesion forces
The adhesive tape of the present invention preferably has an adhesive force to a polypropylene resin at 80℃according to JIS Z0237 of 2.40N/cm or more, more preferably 3.00N/cm or more, still more preferably 3.50N/cm or more. Specifically, the adhesive force is, for example, 2.40, 2.50, 2.60, 2.70, 2.80, 2.90, 3.00, 3.50, 4.00, 4.50, 5.00, 5.50, 6.00, 6.50, 7.00, 7.50, 8.00, 8.50, 9.00, 9.50, or 10.00N/cm, and may be in a range between any 2 of the values exemplified herein.
The adhesive force can be controlled by adjusting the kind and amount of the adhesive composition to be blended, and particularly by adjusting the kind and amount of the adhesive composition to be blended so that the holding power of the adhesive tape and the melt viscosity of the adhesive composition become specific numerical ranges. The adhesive force can be determined by measuring 180℃peel adhesion to a polypropylene resin at 80℃according to JIS Z0237 "10".
2.2 holding force
The adhesive tape of the present invention has a holding power at 70℃according to JIS Z0237 of 100 minutes or more, preferably 150 minutes or more. The holding force is specifically, for example, 100, 150, 200, 250, 300, 350, 400, 450, 500, 550, 600, 650, 700, 750, 800, 850, 900, 950, 1000, 1050, 1100, 1150, 1200, 1250, or 1300 minutes, and may also be in a range between any 2 of the values exemplified herein. The holding power can be controlled by adjusting the kind and amount of blending of the adhesive composition. The holding force can be evaluated by measuring the time from the attachment of an adhesive tape with an adhesive area of 25mm X25 mm to a SUS plate at 70℃under a load of 1kg until the dropping of a weight according to JIS Z0237 "13".
The adhesive tape of the present invention has high adhesive force and high holding power at high temperature for olefin-based materials such as polypropylene, and is low in viscosity at high temperature and can be coated by a hot-melt method, so that the adhesive tape can be manufactured at low energy and low cost in a short time. The pressure-sensitive adhesive tape of the present invention can use such characteristics to bond various members to each other with higher reliability and lower cost in various industrial fields such as home appliances, automobiles, and buildings. The adhesive tape according to an embodiment of the present invention can be desirably used for, for example: fixing peripheral parts of automobile doors, ceilings, luggage cases and instrument panels; fixing of internal parts in the automotive field such as assembly of an air conditioner and the periphery of an automobile navigation, OA equipment, home appliances, and the like.
Examples
Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited thereto.
(preparation of adhesive composition)
The kneading mixer (TOSHIN Co.) was previously heated to 200 ℃. The 1 st tackifier, the 2 nd tackifier, the 3 rd tackifier, the antioxidant and the plasticizer were added to the kneader and kneaded at 15rpm for 10 minutes. Thereafter, a styrene-butadiene block copolymer, the butadiene portion of which had been partially hydrogenated, was added, and the mixture was kneaded at 15rpm for 100 minutes to obtain adhesive compositions 1 to 27. The blending amounts (parts by mass) of the respective components are shown in tables 1 and 2. In addition, the viscosity of the 1 st tackifier in the table is the viscosity at 25 ℃.
The softening point and the like of the component used as the 2 nd tackifier are shown below.
ARKON P-110 (manufactured by Sichuan chemical industry Co., ltd.): completely hydrogenating C9, softening point 110+ -5deg.C
PX1150N (manufactured by Yasuhara Chemical corporation): terpene resin with softening point of 115+ -5 DEG C
Petrotack 90 (manufactured by eastern co.): C5/C9, softening point 95 DEG C
ESCOREZ 1310 (ExxonMobil): c5, softening point 88-98 DEG C
The softening point and the like of the component used as the 3 rd tackifier are shown below.
QUINTONE 2940 (manufactured by Nippon Zeon corporation): c5, softening point 141 DEG C
P-140 (manufactured by Sichuan chemical Co., ltd.): hydrogenation of C9, softening point 140 DEG C
T-145 (manufactured by Yasuhara Chemical Co.): terpene phenolic resin with softening point of 145 DEG C
T-160 (manufactured by Yasuhara Chemical Co.): terpene phenolic resin with softening point of 160 DEG C
DS-816 (manufactured by HARIMA chemical Co., ltd.): polymerized rosin ester with softening point 150 DEG C
DS-822 (manufactured by HARIMA Co., ltd.): polymerized rosin ester, softening point 165 DEG C
The weight average molecular weight of the components used as the styrene-butadiene block copolymer in which the butadiene portion has been partially hydrogenated is as follows.
ASAPRENE N521 (manufactured by Asahi chemical Co., ltd.): SBBS (styrene-butadiene-butylene-styrene block copolymer of styrene-butadiene-based block copolymer of which butadiene-based portion has been partially hydrogenated), weight average molecular weight of 15 ten thousand
TUFTEC P1500 (manufactured by Asahi Kabushiki Kaisha Co., ltd.): SBBS (styrene-butadiene-butylene-styrene block copolymer of styrene-butadiene-based block copolymer of which butadiene-based portion has been partially hydrogenated), weight average molecular weight of 8 ten thousand
(production of adhesive tape (double-sided tape))
The adhesive compositions 1 to 27 were melted by heating to 200℃in a melter, and coated on a cellulose-rayon nonwoven fabric (Dafu paper-making, 520018 g/m) at a thickness of 50 μm by a slit die coater (ITWDynatec Co., ltd.) 2 ) And bonding with the double-sided release paper and winding. The adhesive composition was then coated in a thickness of 50 μm on the surface not coated with the adhesive composition in the same manner using a slot die coater (ITW Dynatec Co.). The film thickness in the present invention is measured by subtracting the base film thickness from the tape thickness, and when the film is a double-sided tape, the film thickness is divided by 2. The film thickness measuring instrument uses a dial gauge (dial gauge) defined in JIS B7503, and the measurement pressure is set to 20 to 60kpa.
(evaluation)
The adhesive composition and the adhesive tape obtained were evaluated as follows.
< viscosity of adhesive composition at 200 >
Viscosity measurements were carried out at a shear rate of 10 (1/s) using a rheometer (MCR 302, manufactured by Anton Paar) using a conical plate (1 °,25mm plate diameter) at 200 ℃. The results are shown in tables 1 and 2.
< adhesive force of adhesive tape >
Adhesive force to polypropylene resin (180℃peel adhesive force) was measured under 80℃environment according to JIS Z0237"10. First, a PET film having a thickness of 25 μm was attached to one side of a double-sided tape, and the other side of the tape was attached to a polypropylene plate, and pressure-bonding was performed at 2 kg. The sample was mounted on A Universal Tester (AUTOGRAPH), and after 30 minutes, the adhesive force was measured. The polypropylene plate used in the measurement was punched out of a thickness of 2mm from KOBE POLYSHEET (model PP-N-BN, manufactured by Showa Denko Materials Co., ltd.) to a thickness of 5 cm. Times.20 cm. The results are shown in tables 1 and 2.
< holding force of adhesive tape >
The holding power at 70℃was measured in accordance with JIS Z0237"13. Holding power". The adhesive tape was attached to the SUS plate at an adhesive area of 25mm by 25mm in an environment of 70 ℃. The time until the weight dropped was measured at a load of 1 kg. The results are shown in tables 1 and 2.
[ Table 1]
[ Table 2]
[ symbolic description ]
1: double-sided release film 2: adhesive layer
3: nonwoven fabric
4: an adhesive layer.
Claims (5)
1. An adhesive tape comprising an adhesive layer containing an adhesive composition, characterized in that
The adhesive composition comprises a styrene-butadiene block copolymer, a 1 st tackifier, a 2 nd tackifier, and a 3 rd tackifier,
the butadiene portion of the styrene-butadiene block copolymer has been partially hydrogenated,
the 1 st tackifier is at least 1 kind of rosin ester which is liquid at 23 ℃ and terpene resin which is liquid at 23 ℃,
the softening point of the 2 nd tackifier is 70-120 ℃,
the softening point of the 3 rd tackifier is above 140 ℃,
the adhesive tape has a holding power of 100 minutes or more at 70 ℃ according to JIS Z0237, and the adhesive composition has a melt viscosity of 10 ten thousand cp or less at 200 ℃.
2. The adhesive tape of claim 1, wherein
The adhesive composition contains 45 to 55 parts by mass of the styrene-butadiene block copolymer per 100 parts by mass of the adhesive composition,
5 to 15 parts by mass of the 1 st tackifier,
10 parts by mass or more of the 2 nd tackifier,
The 2 nd tackifier and the 3 rd tackifier are added together in an amount of 30 to 50 parts by mass.
3. The adhesive tape according to claim 1 or 2, wherein
The 2 nd tackifier comprises a terpene-based resin.
4. The adhesive tape according to claim 1 or 2, wherein
The 3 rd tackifier comprises a rosin-based resin or a terpene-based resin.
5. The adhesive tape according to claim 1 or 2, wherein
The adhesive tape has an adhesive force to a polypropylene resin of 2.40N/cm or more at 80 ℃ in accordance with JIS Z0237.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-114312 | 2021-07-09 | ||
| JP2022-048279 | 2022-03-24 | ||
| JP2022048279 | 2022-03-24 | ||
| PCT/JP2022/026547 WO2023282217A1 (en) | 2021-07-09 | 2022-07-04 | Adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117545817A true CN117545817A (en) | 2024-02-09 |
Family
ID=89794390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280044643.9A Pending CN117545817A (en) | 2021-07-09 | 2022-07-04 | Adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117545817A (en) |
-
2022
- 2022-07-04 CN CN202280044643.9A patent/CN117545817A/en active Pending
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