CN117544077B - BIPV intelligent chip photovoltaic module and packaging technology thereof - Google Patents
BIPV intelligent chip photovoltaic module and packaging technology thereof Download PDFInfo
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- CN117544077B CN117544077B CN202410026922.3A CN202410026922A CN117544077B CN 117544077 B CN117544077 B CN 117544077B CN 202410026922 A CN202410026922 A CN 202410026922A CN 117544077 B CN117544077 B CN 117544077B
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- 238000013084 building-integrated photovoltaic technology Methods 0.000 title claims abstract description 24
- 238000012536 packaging technology Methods 0.000 title description 3
- 238000012858 packaging process Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000005341 toughened glass Substances 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 2
- 239000004566 building material Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Abstract
The invention belongs to the technical field of photovoltaic building integrated solar photovoltaic modules and intelligent photoelectric building materials, and particularly relates to a BIPV intelligent chip photovoltaic module and a packaging process thereof. The auxiliary chip is arranged, so that the main chip can be replaced conveniently and quickly; the rectangular box is arranged, so that the storage of the main chip is facilitated; by the arrangement of the connecting terminals, the two tiles are more compact.
Description
Technical Field
The invention belongs to the technical field of photovoltaic building integrated solar photovoltaic modules and intelligent photoelectric building materials, and particularly relates to a BIPV intelligent chip photovoltaic module and a packaging process thereof.
Background
The photovoltaic integrated product combines the photovoltaic building integrated products to realize the maximum utilization of energy sources; the application scene can effectively reduce the dependence on the traditional energy source and improve the reliability and safety of the energy source. Specifically, the application scenario mainly includes: roof high-safety photovoltaic tiles, heat-preservation integrated photovoltaic walls, photovoltaic photo-thermal electricity and heat storage integrated products, wind, solar and diesel energy storage and charging integrated power supply systems and the like; for example, chinese patent application No. CN202111567082.4, mentions a BIPV intelligent chip photovoltaic module and its packaging technology, including a BIPV module, front plate tempered glass, intelligent chip box and back plate tempered glass, where the BIPV module includes multiple strings of battery strings, each string of battery strings is formed by connecting several solar cells in series, an intelligent chip box is arranged between two adjacent strings of battery strings on the left, and an intelligent chip box is also arranged between two adjacent strings of battery strings on the right; the intelligent chip box is internally provided with an intelligent chip, the left end of the intelligent chip is provided with a bus bar extending out of the intelligent chip box to be connected with the adjacent solar cell, and the right end of the intelligent chip is provided with a bus bar extending out of the intelligent chip box to be connected with the adjacent solar cell.
However, the existing BIPV intelligent chip photovoltaic module is produced through a packaging process, and when the BIPV intelligent chip is used, the BIPV intelligent chip cannot be replaced after the BIPV intelligent chip fails.
Disclosure of Invention
Aiming at the problem that the BIPV intelligent chip inside the prior art cannot be replaced after the BIPV intelligent chip fails, the invention provides the following technical scheme:
the utility model provides a BIPV intelligent chip photovoltaic module, includes tile, first connecting block, second connecting block, third connecting block, fourth connecting block, main chip, vice chip and binding post, the top of tile is provided with intelligent circuit box, the wiring hole has all been seted up to intelligent circuit box's top both sides, wiring hole and the mutual block of wiring contact, wiring contact top fixedly connected with photovoltaic cell piece, the top of tile is provided with toughened glass frame, main chip and vice chip all set up inside intelligent circuit box.
As the preference of above-mentioned technical scheme, the inside fixedly connected with platform of intelligent circuit box, the inner wall both sides of intelligent circuit box just are located the platform top and all set up flutedly, and the recess is linked together with the wiring hole, and the inside of two recesses is all fixedly connected with first spring.
As the preference of above-mentioned technical scheme, the one end fixedly connected with that the recess was kept away from to first spring supports the piece, the bottom that supports the piece contacts with the top of platform, the main chip sets up on the top of platform and is located between two supports the piece, two the first spout has all been seted up on the opposite face top that supports the piece.
As the preference of above-mentioned technical scheme, two the inside of first spout is all sliding connection has first slider, two the equal fixed mounting of first slider is on vice chip, the equal fixedly connected with second slider in the bottom both sides of vice chip, the bottom of vice chip just is located between two second sliders fixedly connected with metal sheet.
As the optimization of the technical scheme, the two sides of the top end of the platform are provided with the second sliding grooves, the second sliding grooves are matched with the second sliding blocks, the top end of the platform is provided with the square grooves which are matched with the metal plates, and the square grooves are positioned between the two second sliding grooves.
As the preference of above-mentioned technical scheme, the standing groove has been seted up to the inner wall bottom of intelligent circuit box and be located vice chip below, standing groove bottom fixedly connected with second spring, four fixedly connected with rectangle case between the top of second spring.
As the optimization of the technical scheme, one side of the rectangular box is provided with two rotating blocks, the two rotating blocks are connected with the rectangular box through hinges, and third springs are fixedly connected between the two rotating blocks and the inner wall of the rectangular box.
As the preference of above-mentioned technical scheme, one side fixedly connected with terminal box that is close to the second connecting block of bottom of tile board, the terminal box has two, two the through-hole has all been seted up to the opposite side of terminal box, and the through-hole is linked together with the inside of terminal box, two the inside of terminal box just is located equal sliding connection has the direct current connecting wire between the through-hole, the direct current connecting wire with fixedly connected with fourth spring between the terminal box.
The invention also provides a packaging process of the BIPV intelligent chip photovoltaic module, which is characterized by comprising the following steps of,
step one: stamping the tile plate to enable four sides of the tile plate to sequentially form a first connecting block, a second connecting block, a third connecting block and a fourth connecting block;
step two: the intelligent circuit box and the junction box are welded on the top and the bottom of the tile in sequence;
step three: injecting soft rubber into the top of the tile, keeping the height of the soft rubber flush with that of the intelligent circuit box, sequentially inserting two photovoltaic cell pieces into the intelligent circuit box through wiring contacts at the bottom, covering a toughened glass frame, and sealing edges through welding;
step four: when the two tiles are spliced, the two tiles are placed together, and then the wiring terminal is rotated to enable the two direct current connecting wires to move towards the opposite surfaces and stretch the fourth spring;
step five: when the main chip breaks down, the magnet is placed at the bottom of the tile plate, the auxiliary chip is enabled to move through the metal plate at the bottom through magnetic force, and then the main chip is gradually pushed out and replaced;
step six: the magnet also can produce magnetic force to the second spring when adsorbing the metal sheet for the rectangle case descends to the standing groove in, will the landing to the rectangle incasement after the main chip replacement.
Step seven: the magnet is turned over, and the second spring drives the rectangular box to reset through repulsive force.
The beneficial effects of the invention are as follows:
(1) Through the arrangement of the auxiliary chip, when the main chip fails, the magnet generates magnetic force to the metal plate at the bottom of the auxiliary chip, so that the metal plate drives the auxiliary chip to move, and the main chip is pushed to be replaced, thereby being beneficial to replacing the main chip conveniently and rapidly;
(2) Through being provided with the rectangle case, the main chip after the change can follow intelligent circuit box's inner wall bottom and slide and collect to the rectangle incasement, is favorable to storing the main chip.
(3) Through being provided with binding post, when two tiles splice, place binding post between two direct current connecting wires of two adjacent tiles and make two direct current connecting wires be located binding post inside, then rotate binding post and make two direct current connecting wires remove towards opposite face, and then stretch the fourth spring, make electric current between two tiles switch on through the pulling force of fourth spring to make the connection inseparabler, be favorable to making compacter between two tiles.
Drawings
Fig. 1 shows a front view;
fig. 2 shows a bottom view;
FIG. 3 shows a schematic view of an exploded construction of a tile;
fig. 4 shows a schematic structural view of a photovoltaic cell;
FIG. 5 is a schematic diagram of the structure of the smart circuit box;
FIG. 6 is a schematic diagram of an exploded view of the smart circuit box;
FIG. 7 is a schematic diagram showing the structure of a sub-chip;
FIG. 8 is a schematic view showing the structure of a rectangular box;
FIG. 9 shows a cross-sectional view of the smart circuit box;
FIG. 10 is a schematic view showing the structure of a rectangular box;
fig. 11 shows a splice of tiles.
In the figure: 1. a tile; 2. a first connection block; 3. a second connection block; 4. a third connecting block; 5. a fourth connecting block; 6. an intelligent circuit box; 7. a wiring contact; 8. a photovoltaic cell; 9. tempered glass frames; 10. a platform; 11. a first spring; 12. abutting blocks; 13. a main chip; 14. a first chute; 15. a first slider; 16. a secondary chip; 17. a second slider; 18. a metal plate; 19. a second chute; 20. a placement groove; 21. a second spring; 22. a rectangular box; 23. a rotating block; 24. a third spring; 25. a junction box; 26. a direct current connecting wire; 27. a fourth spring; 28. and a connection terminal.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments.
Example 1
The invention provides a BIPV intelligent chip photovoltaic module, as shown in figures 1-5, which comprises a tile plate 1, a first connecting block 2, a second connecting block 3, a third connecting block 4, a fourth connecting block 5, a main chip 13, an auxiliary chip 16 and a connecting terminal 28, wherein the third connecting block 4 and the fourth connecting block 5 are mutually clamped, the main chip 13 and the auxiliary chip 16 are BIPV intelligent chips, an intelligent circuit box 6 is arranged at the top end of the tile plate 1, wiring holes are formed in two sides of the top end of the intelligent circuit box 6, the wiring holes are mutually clamped with wiring contacts 7, a photovoltaic cell 8 is fixedly connected to the top end of the wiring contacts 7, a toughened glass frame 9 is arranged at the top end of the tile plate 1, an aluminum frame is arranged at the edge of the toughened glass frame 9, the main chip 13 and the auxiliary chip 16 are all arranged inside the intelligent circuit box 6, the four sides of the tile plate 1 are formed into the shapes of the first connecting block 2, the second connecting block 3, the third chip 4 and the fourth connecting block 5 through punching, then the intelligent circuit box 6 and the wiring box 25 are welded on the top of the tile plate 1, the photovoltaic cell 8 is arranged on the top of the soft contact box 1, the soft contact is welded on the top of the soft contact 8, and the soft contact is sealed by the soft contact 8, and the soft contact is sealed on the top of the soft contact 8.
As shown in fig. 5 to 7, the inside of the intelligent circuit box 6 is fixedly connected with a platform 10, the platform 10 is arranged in the middle of the intelligent circuit box 6, so that spaces are reserved on two sides of the intelligent circuit box 6, the right space is consistent with the main chip 13 in size, the main chip 13 can fall from the platform 10, the left space is consistent with the rectangular box 22 in size, grooves are formed on two sides of the inner wall of the intelligent circuit box 6 and above the platform 10, the grooves are communicated with wiring holes, first springs 11 are fixedly connected in the two grooves, one end of each first spring 11 far away from the groove is fixedly connected with a supporting block 12, an electrode is arranged on the supporting block 12, the electrode is contacted with the main chip 13, two first springs 11 are arranged on each supporting block 12, the bottom ends of the supporting blocks 12 are contacted with the top end of the platform 10, the main chip 13 is arranged on the top end of the platform 10 and between the two supporting blocks 12, the top ends of the opposite surfaces of the two propping blocks 12 are respectively provided with a first sliding groove 14, the interiors of the two first sliding grooves 14 are respectively connected with a first sliding block 15 in a sliding way, the two first sliding blocks 15 are respectively fixedly arranged on the auxiliary chip 16, the auxiliary chip 16 is limited by the first sliding blocks 15, the two sides of the bottom end of the auxiliary chip 16 are respectively fixedly connected with a second sliding block 17, the bottom end of the auxiliary chip 16 is positioned between the two second sliding blocks 17 and is fixedly connected with a metal plate 18, the two sides of the top end of the platform 10 are respectively provided with a second sliding groove 19, the second sliding grooves 19 are matched with the second sliding blocks 17, the top end of the platform 10 is provided with a square groove between the two second sliding grooves 19, the square groove is matched with the metal plate 18, when the main chip 13 needs to be replaced, a maintainer is arranged at the bottom of the tile plate 1 and below the intelligent circuit box 6 which needs to replace the main chip 13, the metal plate 18 drives the auxiliary chip 16 to move by the magnetic force of the magnet, so that the main chip 13 is pushed forward for replacement, and the auxiliary chip 16 plays a limiting and stabilizing role through the two first sliding blocks 15 and the two second sliding blocks 17.
As shown in fig. 8-9, a placing groove 20 is formed at the bottom end of the inner wall of the intelligent circuit box 6 and is positioned below the secondary chip 16, the bottom end of the placing groove 20 is fixedly connected with four second springs 21, rectangular boxes 22 are fixedly connected between the top ends of the four second springs 21, the rectangular boxes 22 are made of stainless steel, the stainless steel can resist magnetism, further the inner main chip 13 is protected, the magnet is prevented from demagnetizing, rotating blocks 23 are arranged at one side of the rectangular boxes 22, two rotating blocks 23 are connected with the rectangular boxes 22 through hinges, a third spring 24 is fixedly connected between the two rotating blocks 23 and the inner wall of the rectangular boxes 22, after the main chip 13 falls down from the platform 10, the intelligent circuit box 6 is in an inclined state at the moment, the main chip 13 slides downwards from the platform 10, the magnet can absorb the metal plate 18 and generate magnetic force to the second spring 21, so that the second spring 21 drives the rectangular box 22 to descend to the placing groove 20, the main chip 13 can slide into the rectangular box 22, the two rotating blocks 23 can be contacted and extruded before the main chip 13 enters the rectangular box 22, the rotating blocks 23 reset the rotating blocks 23 to block the internal main chip 13 after the main chip 13 completely enters the rectangular box 22 through the third spring 24, then the second spring 21 is pushed to reset by the reverse magnet through repulsive force, the auxiliary chip 16 is propped against and prevented from moving, and the magnet can play a role of marking, so that the main chip 13 is replaced.
As shown in fig. 10, the bottom of the tile 1 is close to the junction box 25 on one side of the second connection block 3, two junction boxes 25 are fixedly connected, through holes are formed in opposite sides of the two junction boxes 25, the through holes are communicated with the inside of the junction box 25, direct-current connection wires 26 are slidably connected between the inside of the two junction boxes 25 and between the through holes, a fourth spring 27 is fixedly connected between the direct-current connection wires 26 and the junction box 25, the tile 1 is integrally and obliquely arranged (as shown in fig. 11) during splicing, and then when the two tiles 1 are spliced, the two tiles 1 are placed together first, so that the direct-current connection wires 26 at the bottoms of the two tiles 1 are located on opposite sides, then the junction terminal 28 is placed between the two direct-current connection wires 26, one end of the direct-current connection wires 26 is located in the junction terminal 28, at the moment, the fourth spring 27 is in an extrusion state, and then the junction terminal 28 (the junction terminal 28 is in threaded connection with the direct-current connection wires 26) is rotated, so that the two direct-current connection wires 26 gradually move towards the opposite sides inside the junction wires 28, and then the fourth spring 27 gradually stretches tightly to enable the tension between the two tiles 1 through the fourth spring 27.
Working principle: through punching press to tile 1 for the four sides of tile 1 form the shape of first linkage block 2 in proper order, second linkage block 3, third linkage block 4, fourth linkage block 5, with intelligent circuit box 6 and terminal box 25 welding in proper order at the top and the bottom of tile 1, pour into the flexible glue into the top of tile 1, the height flushes with intelligent circuit box 6, insert the wiring contact 7 of two photovoltaic cell pieces 8 through the bottom on intelligent circuit box 6 in proper order again, then cover toughened glass frame 9 and seal the edge through the welding, two tile 1 is when the concatenation, place two tile 1 together, then rotate binding post 28 and make two direct current connecting wire 26 remove and stretch to fourth spring 27 towards opposite face, when main chip 13 breaks down, through placing magnet in tile 1 bottom, make by magnetic force vice chip 16 remove through the metal plate 18 of bottom, then release and replace main chip 13, magnet also can produce magnetic force to second spring 21 when adsorbing metal plate 18, make rectangle case 22 drop to rectangle case 20, place the rectangle case 22 and put the rectangle case 22 into the repulsion, replace the rectangle case 22 and will be replaced the rectangle case.
Example two
As shown in fig. 1-11, the present invention also provides a packaging process of a BIPV intelligent chip photovoltaic module, which is characterized in that the process comprises the following steps,
step one: stamping the tile board 1 to enable four sides of the tile board 1 to sequentially form a first connecting block 2, a second connecting block 3, a third connecting block 4 and a fourth connecting block 5;
step two: the intelligent circuit box 6 and the junction box 25 are welded on the top and the bottom of the tile 1 in sequence;
step three: injecting soft rubber into the top of the tile plate 1, flushing with the intelligent circuit box 6, sequentially inserting two photovoltaic battery pieces 8 into the intelligent circuit box 6 through wiring contacts 7 at the bottom, covering a toughened glass frame 9, and sealing edges through welding;
step four: when the two tiles 1 are spliced, the two tiles 1 are put together, and then the connecting terminal 28 is rotated so that the two direct-current connecting wires 26 move towards opposite surfaces and the fourth springs 27 are stretched;
step five: when the main chip 13 fails, the magnet is placed at the bottom of the tile plate 1, the auxiliary chip 16 moves through the metal plate 18 at the bottom by magnetic force, and then the main chip 13 is gradually pushed out and replaced;
step six: the magnet can also generate magnetic force to the second spring 21 when the metal plate 18 is adsorbed, so that the rectangular box 22 descends into the placing groove 20, and the main chip 13 slides into the rectangular box 22 after being replaced;
step seven: the magnet is turned over, and the second spring 21 drives the rectangular box 22 to reset through repulsive force.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting.
Claims (5)
1. The BIPV intelligent chip photovoltaic module is characterized by comprising a tile plate (1), a first connecting block (2), a second connecting block (3), a third connecting block (4), a fourth connecting block (5), a main chip (13), an auxiliary chip (16) and a wiring terminal (28), wherein an intelligent circuit box (6) is arranged at the top end of the tile plate (1), wiring holes are formed in two sides of the top end of the intelligent circuit box (6), the wiring holes are mutually clamped with wiring contacts (7), photovoltaic cells (8) are fixedly connected to the top ends of the wiring contacts (7), a toughened glass frame (9) is arranged at the top end of the tile plate (1), and the main chip (13) and the auxiliary chip (16) are arranged inside the intelligent circuit box (6);
the intelligent circuit box is characterized in that a platform (10) is fixedly connected to the inside of the intelligent circuit box (6), grooves are formed in two sides of the inner wall of the intelligent circuit box (6) and located above the platform (10), the grooves are communicated with wiring holes, and first springs (11) are fixedly connected to the inside of the two grooves;
one end, far away from the groove, of the first spring (11) is fixedly connected with a supporting block (12), the bottom end of the supporting block (12) is contacted with the top end of the platform (10), the main chip (13) is arranged at the top end of the platform (10) and is positioned between the two supporting blocks (12), and the top ends of opposite surfaces of the two supporting blocks (12) are provided with first sliding grooves (14);
the inside of the two first sliding grooves (14) is slidably connected with first sliding blocks (15), the two first sliding blocks (15) are fixedly arranged on the auxiliary chip (16), the two sides of the bottom end of the auxiliary chip (16) are fixedly connected with second sliding blocks (17), and a metal plate (18) is fixedly connected between the two second sliding blocks (17) at the bottom end of the auxiliary chip (16);
second sliding grooves (19) are formed in two sides of the top end of the platform (10), the second sliding grooves (19) are matched with the second sliding blocks (17), square grooves are formed in the top end of the platform (10) and located between the two second sliding grooves (19), and the square grooves are matched with the metal plates (18).
2. The BIPV intelligent chip photovoltaic module according to claim 1, wherein a placement groove (20) is formed in the bottom end of the inner wall of the intelligent circuit box (6) and below the auxiliary chip (16), a second spring (21) is fixedly connected to the bottom end of the placement groove (20), and a rectangular box (22) is fixedly connected between the top ends of the four second springs (21).
3. The BIPV intelligent chip photovoltaic module according to claim 2, wherein one side of the rectangular box (22) is provided with two rotating blocks (23), the two rotating blocks (23) are connected with the rectangular box (22) through hinges, and a third spring (24) is fixedly connected between the two rotating blocks (23) and the inner wall of the rectangular box (22).
4. The BIPV intelligent chip photovoltaic module according to claim 3, wherein one side of the bottom end of the tile plate (1) close to the second connecting block (3) is fixedly connected with a junction box (25), two junction boxes (25) are provided with through holes, opposite surfaces of the two junction boxes (25) are provided with through holes, the through holes are communicated with the inside of the junction boxes (25), the inside of the two junction boxes (25) is provided with a direct current connecting wire (26) which is positioned between the through holes and is in sliding connection with a fourth spring (27) which is fixedly connected between the direct current connecting wire (26) and the junction boxes (25).
5. A packaging process for a BIPV intelligent chip photovoltaic module using the BIPV intelligent chip as set forth in claim 4, which comprises the following steps,
step one: stamping the tile plate (1) to enable four sides of the tile plate (1) to sequentially form a first connecting block (2), a second connecting block (3), a third connecting block (4) and a fourth connecting block (5);
step two: the intelligent circuit box (6) and the junction box (25) are welded on the top and the bottom of the tile (1) in sequence;
step three: injecting soft rubber into the top of the tile plate (1), flushing the height of the soft rubber with the intelligent circuit box (6), sequentially inserting two photovoltaic cell pieces (8) into the intelligent circuit box (6) through wiring contacts (7) at the bottom, covering a toughened glass frame (9), and sealing edges through welding;
step four: when the two tiles (1) are spliced, the two tiles (1) are put together, and then the connecting terminal (28) is rotated so that the two direct current connecting wires (26) move towards the opposite surfaces and stretch the fourth spring (27);
step five: when the main chip (13) fails, a magnet is placed at the bottom of the tile plate (1), the auxiliary chip (16) is enabled to move through a metal plate (18) at the bottom through magnetic force, and then the main chip (13) is gradually pushed out and replaced;
step six: the magnet can generate magnetic force to the second spring (21) when the metal plate (18) is adsorbed, so that the rectangular box (22) descends into the placing groove (20), and the main chip (13) slides into the rectangular box (22) after being replaced;
step seven: the magnet is turned over, and the second spring (21) drives the rectangular box (22) to reset through repulsive force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202410026922.3A CN117544077B (en) | 2024-01-09 | 2024-01-09 | BIPV intelligent chip photovoltaic module and packaging technology thereof |
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| CN202410026922.3A CN117544077B (en) | 2024-01-09 | 2024-01-09 | BIPV intelligent chip photovoltaic module and packaging technology thereof |
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| CN117544077B true CN117544077B (en) | 2024-04-02 |
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| CN104460482A (en) * | 2014-12-18 | 2015-03-25 | 中国电子科技集团公司第三十九研究所 | CPLD-based double-computer thermal-switching controller |
| WO2016187654A1 (en) * | 2015-05-25 | 2016-12-01 | Mc2 Energy Pty Ltd | A photovoltaic device |
| KR20190110709A (en) * | 2018-03-21 | 2019-10-01 | 전현수 | Juction Box of Photovoltaic Module Used for Building Integrated Photovoltaic System |
| CN210403775U (en) * | 2019-11-05 | 2020-04-24 | 北京金茂绿建科技有限公司 | BIPV assembly |
| CN216213496U (en) * | 2021-11-08 | 2022-04-05 | 横店集团东磁股份有限公司 | Intelligent solar photovoltaic module |
| KR102444225B1 (en) * | 2021-12-22 | 2022-09-16 | 주식회사 한국항공조명 | Bipv media integrated module and method of manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US10505493B2 (en) * | 2017-07-18 | 2019-12-10 | Tesla, Inc. | Building integrated photovoltaic tile mounting system |
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2024
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| US6360497B1 (en) * | 1999-07-21 | 2002-03-26 | Kaneka Corporation | Photovoltaic cell module tile |
| CN103004070A (en) * | 2010-06-01 | 2013-03-27 | 科罗拉多州立大学董事会法人团体 | Low profile power conversion system for rooftop photovoltaic power systems |
| CN104460482A (en) * | 2014-12-18 | 2015-03-25 | 中国电子科技集团公司第三十九研究所 | CPLD-based double-computer thermal-switching controller |
| WO2016187654A1 (en) * | 2015-05-25 | 2016-12-01 | Mc2 Energy Pty Ltd | A photovoltaic device |
| KR20190110709A (en) * | 2018-03-21 | 2019-10-01 | 전현수 | Juction Box of Photovoltaic Module Used for Building Integrated Photovoltaic System |
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| KR102444225B1 (en) * | 2021-12-22 | 2022-09-16 | 주식회사 한국항공조명 | Bipv media integrated module and method of manufacturing method |
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| CN117544077A (en) | 2024-02-09 |
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