CN117542643A - Preparation method of iron-based nanocrystalline patch common-mode inductor and patch common-mode inductor device - Google Patents

Abstract

The invention relates to the technical field of inductance magnetic cores, in particular to a preparation method of an iron-based nanocrystalline patch common-mode inductance and a patch common-mode inductance device, and the method comprises the following steps of S1, winding an iron-based nanocrystalline strip into a magnetic ring and performing heat treatment; step S2, a magnetic layer is grown on the surface of the magnetic core; step S3, attaching a thermosetting adhesive film and performing surface treatment; s4, fixing and hot-pressing the surface-treated magnetic core into a planar structure, and then baking and curing; s5, cutting the cured magnetic core; s6, spraying a protective layer; and S7, winding a coil on the target magnetic core, and packaging the target magnetic core. According to the invention, the magnetic layer is grown on the surface of the strip material to improve the nanocrystalline characteristic, the strip material is broken and divided into mutually independent insulating shielding units through surface treatment to improve the application under high frequency, and the thermosetting adhesive is adopted to replace the traditional curing mode so as to save the cost.

Description

Preparation method of iron-based nanocrystalline patch common-mode inductor and patch common-mode inductor device

Technical Field

The invention relates to the technical field of inductance magnetic cores, in particular to a preparation method of an iron-based nanocrystalline patch common-mode inductance and a patch common-mode inductance device.

Background

The iron-based nanocrystalline alloy has excellent soft magnetic properties of high magnetic conductivity, low coercive force, high conductivity, low loss and the like, and has good application prospects in various soft magnetic electronic devices such as transformers, switching power supplies, motors and the like. The nanocrystalline thin ribbon is fragile and easy to break, so that the nanocrystalline thin ribbon is difficult to directly apply to electronic devices. In industrial use, amorphous strips are bonded and cured to obtain different shapes suitable for various devices.

Electromagnetic interference clutter of electronic equipment can enter a power grid and pollute the power grid, meanwhile, the clutter in the power grid enters the electronic equipment, and the electronic equipment can also cause unstable work, so that the electronic equipment is standardized for the limitation. Common mode interference is an interference noise signal with similar amplitude and phase to a pair of transmission lines. Common mode inductances require high self-resonant frequencies, which are characterized by high initial permeability and low loss for the core material, above which the device becomes capacitive, thus requiring high impedance values and good temperature resistance.

Disclosure of Invention

The invention aims to provide a preparation method of an iron-based nanocrystalline patch common-mode inductor, which solves the technical problems;

the invention also aims to provide a patch common mode inductance device, which solves the technical problems.

The technical problems solved by the invention can be realized by adopting the following technical scheme:

the preparation method of the iron-based nanocrystalline patch common-mode inductor comprises the steps of,

step S1, winding an iron-based nanocrystalline strip into a magnetic ring and performing heat treatment to obtain a primary magnetic core;

step S2, a magnetic layer is grown on the surface of the preliminary magnetic core;

step S3, attaching a thermosetting adhesive film on the preliminary magnetic core and performing surface treatment to obtain a surface-treated magnetic core;

s4, fixing and hot-pressing the surface-treated magnetic core into a planar structure, and putting the planar structure into a pressure baking oven for baking and curing to obtain a cured magnetic core;

s5, cutting the cured magnetic core to obtain a cut magnetic core;

s6, spraying a protective layer on the cut magnetic core to obtain a target magnetic core;

and S7, winding a coil on the target magnetic core, and packaging the target magnetic core.

Preferably, in the step S1, the heat treatment temperature is 545-585 ℃, and the heat preservation time is 90-200 min.

Preferably, in step S2, the growth of the magnetic layer is performed by using a magnetic layer deposition solution, wherein the solute in the magnetic layer deposition solution includes sodium hydroxide and sodium nitrite, and the solvent in the magnetic layer deposition solution includes deionized water.

Preferably, the molar concentration of the sodium hydroxide is 17.5mol/L-27.5mol/L, and the molar concentration of the sodium nitrite is 1.18mol/L-2.94mol/L.

Preferably, the temperature of the magnetic layer deposition solution is 130-140 ℃ and the growth time is 10-20 min.

Preferably, in step S3, the thermosetting adhesive film is a modified acrylic epoxy resin, and the thickness of the thermosetting adhesive film is 3um-10um.

Preferably, in step S3, the surface treatment is to break and divide the thermosetting adhesive film into separate shielding units.

Preferably, in the step S4, the baking and curing temperature is 150-180 ℃, the time is 160-200 min, and the pressure is 6Kg/cm-10Kg/cm.

Preferably, in step S5, the cured magnetic core is cut by one of water jet cutting, wire cutting and laser cutting.

The patch common mode inductance device is prepared by adopting the preparation method of the iron-based nanocrystalline patch common mode inductance, and comprises the following steps of,

the target core;

the coil is wound on the target magnetic core and comprises a first coil and a second coil which are positioned at two sides of the target magnetic core;

the target magnetic core and the coil are arranged in the packaging shell in a sealing mode, and the lead end point of the first coil and the lead end point of the second coil are respectively connected with pins on the packaging shell.

The invention has the beneficial effects that: by adopting the technical scheme, the nano-crystalline characteristic is improved by growing the magnetic layer on the surface of the strip, the application of the strip under high frequency is improved by crushing and dividing the strip into mutually independent insulating shielding units through surface treatment, and the cost is saved by adopting thermosetting adhesive to replace the traditional curing mode.

Drawings

FIG. 1 is a schematic diagram of steps of a method for manufacturing a common-mode inductor of an iron-based nanocrystalline patch according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a jig for a hot press according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a patch common mode inductor device according to an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.

The invention is further described below with reference to the drawings and specific examples, which are not intended to be limiting.

The preparation method of the iron-based nanocrystalline patch common-mode inductor, as shown in figure 1 and figure 2, comprises the following steps,

step S1, winding an iron-based nanocrystalline strip into a magnetic ring and performing heat treatment to obtain a primary magnetic core;

step S2, a magnetic layer is grown on the surface of the preliminary magnetic core; specifically, the growth of the magnetic layer is a high temperature oxidation process to produce a ferroferric oxide magnetic layer.

Step S3, attaching a thermosetting adhesive film on the preliminary magnetic core and performing surface treatment to obtain a surface-treated magnetic core;

s4, fixing and hot-pressing the surface-treated magnetic core into a planar structure, and putting the planar structure into a pressure baking oven for baking and curing to obtain a cured magnetic core;

s5, cutting the cured magnetic core to obtain a cut magnetic core;

step S6, spraying a protective layer on the cut magnetic core to obtain a target magnetic core 1;

step S7, winding a coil around the target core 1, and packaging the target core 1.

In a preferred embodiment, in step S1, the heat treatment temperature is 545-585 ℃ and the heat preservation time is 90-200 min.

Specifically, the heating system is started to close the furnace chamber door to heat to a set temperature, for example 250 ℃, then the magnetic ring is placed into a heat treatment furnace to perform heat treatment of multi-stage heating and heat preservation, for example, heating to 490 ℃ and preserving heat for 60-80min, heating to 565 ℃ and preserving heat for 120-200min, and after cooling, the magnetic core is taken out of the furnace, for example, cooling to 180 ℃.

In a preferred embodiment, in step S2, the growth of the magnetic layer is performed using a magnetic layer deposition solution, wherein the solute in the magnetic layer deposition solution includes sodium hydroxide and sodium nitrite, and the solvent in the magnetic layer deposition solution includes deionized water.

In a preferred embodiment, the molar concentration of sodium hydroxide is 17.5mol/L to 27.5mol/L and the molar concentration of sodium nitrite is 1.18mol/L to 2.94mol/L.

In a preferred embodiment, the temperature of the magnetic layer deposition solution is 130-140 ℃ and the growth time is 10-20 min.

In a preferred embodiment, in step S3, the thermosetting adhesive film is a modified acrylic epoxy resin, and the thickness of the thermosetting adhesive film is 3um to 10um.

In a preferred embodiment, in step S3, the surface treatment is to break and divide the thermosetting adhesive film into separate shielding units.

Specifically, a thermosetting adhesive film with the initial adhesiveness of a support film is coated on one surface of a primary magnetic core, and then the primary magnetic core is crushed by crushing equipment to form a magnetic ring semi-finished product with a specified size, wherein the magnetic ring semi-finished product is formed by winding a regular mutually independent insulating magnet unit, and the surface-treated magnetic core is obtained.

In a preferred embodiment, in the step S4, the baking and curing temperature is 150-180 ℃, the time is 160-200 min, and the pressure is 6Kg/cm-10Kg/cm; preferably, the baking and curing temperature is 160 ℃, the time is 180min, and the pressure is 8Kg/cm.

Specifically, the magnetic core after surface treatment is placed on a hot press jig to be subjected to fixed magnetic ring heat flattening treatment, as shown in fig. 3, the hot press jig comprises an upper cover plate 51 and a lower cover plate 52, the upper cover plate 51 and the lower cover plate 52 correspond to each other in position through a positioning column 53, in the use process, a nanocrystalline magnetic material 6 to be pressed is placed between the upper cover plate 51 and the lower cover plate 52, the nanocrystalline magnetic material 6 is pressed into a planar structure through hot pressing, preferably, the parameter temperature of the hot press jig is 120-130 ℃, the pressing time is 8-12min, and the pressure is 2-100MPa. After the treatment, the mixture is put into a pressure baking oven, the curing temperature is 160 ℃ and the curing time is 180min. The pressure was 8Kg/cm.

In a preferred embodiment, in step S5, the cured magnetic core is cut by one of water jet cutting, wire cutting and laser cutting.

In the preferred water jet cutting in this embodiment, the water jet cutting device includes a high-pressure water pump, a core device for generating high-pressure water, a numerical control machine (CNC) motion control platform, an abrasive material storage device and a transmission system, a water switching control system, and a nozzle, when the water jet cutting device is used, a drawing is guided into a control program, a cured magnetic core is placed on the CNC motion control platform, the position of the nozzle is adjusted, the water switching control system is turned on, the abrasive material storage device and the transmission system are turned on, the high-pressure water pump is turned on, the processing and the forming are started, preferably, the abrasive material granularity for water cutting is 80-120 meshes of garnet particles, the abrasive material flow rate is 240-680g/min, the high pressure of the nozzle is 416MPa, the low pressure is 230MPa, and the cutting and the forming are performed.

Drawing is led into a control program, the materials are placed on a CNC motion control platform, the position of a nozzle is adjusted, a water switching control system, an abrasive storage device and a transmission system are turned on, a high-pressure water pump is turned on, and processing and forming are started, wherein the abrasive grain size for water cutting is 80-120 meshes of garnet particles, the abrasive flow rate is 240-680g/min, the high pressure of the nozzle is set to 416MPa, and the low pressure is set to 230MPa for cutting and forming.

The patch common mode inductor device is manufactured by the method for manufacturing an iron-based nanocrystalline patch common mode inductor as described in any one of the embodiments, and further referring to fig. 2, including,

a target core 1;

the coil is wound on the target magnetic core 1 and comprises a first coil 2 and a second coil 3 which are positioned on two sides of the target magnetic core 1;

the packaging shell 4, the target magnetic core 1 and the coil are arranged in the packaging shell 4 in a sealing mode, and the lead terminal points of the first coil 2 and the lead terminal points of the second coil 3 are respectively connected with the pins 41 on the packaging shell 4.

Example 1, comprising the following steps,

step 1, winding an iron-based nanocrystalline strip into a magnetic ring and performing heat treatment to form a primary magnetic core; specifically, the heating system is started to close the furnace chamber door to heat up to 250 ℃, further, the magnetic ring is placed into a heat treatment furnace to heat up to 490 ℃ for 60-80min, the heat preservation time at 565 ℃ is 120-200min, and then the magnetic core is cooled to 180 ℃ to discharge the magnetic core.

Step 2, a magnetic layer is grown on the surface of the preliminary magnetic core; among the magnetic layer deposition solutions, the solute, the concentration, the temperature and the time are shown in Table 1, and the iron-based nanocrystalline magnetic core is obtained by drying.

Step 3, attaching a thermosetting adhesive film and performing surface treatment to form a surface-treated magnetic core; specifically, a primary adhesive thermosetting adhesive film with a support film is coated on one surface of a primary magnetic core, broken by a breaking device to form regular mutually independent insulating magnet units, and then the magnetic core is wound into a magnetic ring semi-finished product with a specified size.

Step 4, fixing and hot-pressing the second magnetic core into a plane shape, and putting the plane shape into a pressure oven for baking and curing; and (3) placing the magnetic ring subjected to surface treatment on a hot press tool to fix the magnetic ring for heat flattening treatment, wherein the implementation parameter temperature is 120-130 ℃, the time is 8-12min, and the pressure is 2-100MPa. After the treatment, the mixture is put into a pressure baking oven, the curing temperature is 160 ℃ and the curing time is 180min. The pressure was 8Kg/cm.

Step 5, cutting to form a cut magnetic core; specifically, water jet cutting is adopted, the abrasive grain size of the water jet cutting is 80-120 meshes of garnet particles, the abrasive flow rate is 240-680g/min, the high pressure of the nozzle is 416MPa, and the low pressure is 230MPa, so that cutting molding is carried out.

Step 6, spraying a protective layer to form a target magnetic core 1;

and 7, winding the first coil 2 and the second coil 3 respectively, and connecting the lead terminals of the first coil 2 and the second coil 3 with PINs 41, such as PIN PINs, of the packaging shell 4 to form a closed patch common mode inductance device.

Example 2, example 3 and comparative example 1 employ different solutes, different concentrations, different temperatures, and different times of the magnetic layer deposition solutions;

the performance tests of the magnetic layer deposition solutions of example 1, example 2, example 3 and comparative example 1 for different solutes, different concentrations, different temperatures and different times on the single turn inductance, the direct current power supply loading inductance, the saturation induction (Bs), and the resistance and coercivity (Hc) of the device are shown in table 1:

TABLE 1

Obviously, the examples are superior to comparative example 1, demonstrating that growing a magnetic layer, such as ferroferric oxide, reduces the coercivity while improving the resistance, dc resistance and saturation induction of the device while reducing the coercivity; at the same temperature and time, example 1 has the best performance, so the solute and its molar concentration are preferred for example 1.

Examples 4 to 8 were prepared with the preparation example 1 by changing only garnet abrasive materials in water cutting molding at a water pressure of 375MPa of 80 mesh, performance tests are shown in table 2,

TABLE 2

As is clear from comparative examples 4-8, the roughness gradually becomes smaller with increasing abrasive flow rate under the same number of punica granatum Dan Mu and water pressure, because the increase of abrasive flow rate increases the number of abrasive particles removed from the workpiece per unit time, enhancing the cutting ability of the jet. The flow rate of the abrasive is further increased, and the probability of collision and breakage of abrasive particles in the sand pipe is increased; the number of abrasive particles is increased, the kinetic energy of single abrasive particles is reduced, the total cutting kinetic energy of the abrasive particles is reduced or even not increased, and the roughness is not changed greatly. The abrasive flow is preferably 240g/min-680g/min.

Preparation of examples 9-10 by varying the cutting pattern of step 5 on the basis of example 1 as shown in table 3,

TABLE 3 Table 3

As is clear from the comparison of example 1 and examples 9 to 10, the example 1 has the lowest coercive force and loss and the highest inductance under soft magnetic alternating current. From the data in Table 3, it can be seen that example 10 has the lowest laser cutting performance. It is explained that laser cutting generates high temperature to cause excessive crystallization of the nano-crystal of the magnetic material layer to deteriorate magnetic performance. The water jet cutting mode is preferred.

The performance tests of examples 11-16 prepared using the crushing mode in step 3 to produce different permeability on the basis of example 1 are shown in table 4,

TABLE 4 Table 4

The skilled person is familiar with the fact that the larger the width of the air gap is, the better the insulation is, and the graph shows that the total loss and the eddy current loss show an increasing trend with the increase of the magnetic permeability. Since eddy current losses are dominant at high frequencies, different permeability can be chosen depending on the application.

In summary, the invention improves the nanocrystalline characteristic by growing the magnetic layer on the surface of the strip, improves the application under high frequency by crushing and dividing the strip into mutually independent insulating shielding units through surface treatment, and saves the strip by adopting thermosetting adhesive to replace the traditional curing mode.

The foregoing description is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, and it will be appreciated by those skilled in the art that equivalent substitutions and obvious variations may be made using the description and illustrations of the present invention, and are intended to be included within the scope of the present invention.

Claims (10)

1. The method for preparing the iron-based nanocrystalline patch common-mode inductor is characterized by comprising the steps of,

step S1, winding an iron-based nanocrystalline strip into a magnetic ring and performing heat treatment to obtain a primary magnetic core;

step S2, a magnetic layer is grown on the surface of the preliminary magnetic core;

step S3, attaching a thermosetting adhesive film on the preliminary magnetic core and performing surface treatment to obtain a surface-treated magnetic core;

s4, fixing and hot-pressing the surface-treated magnetic core into a planar structure, and putting the planar structure into a pressure baking oven for baking and curing to obtain a cured magnetic core;

s5, cutting the cured magnetic core to obtain a cut magnetic core;

s6, spraying a protective layer on the cut magnetic core to obtain a target magnetic core;

and S7, winding a coil on the target magnetic core, and packaging the target magnetic core.

2. The method for preparing the common-mode inductor of the iron-based nanocrystalline patch according to claim 1, wherein in the step S1, the heat treatment temperature is 545-585 ℃, and the heat preservation time is 90-200 min.

3. The method for preparing the common-mode inductance of the iron-based nanocrystalline patch according to claim 1, wherein in step S2, the growth of the magnetic layer is performed by using a magnetic layer deposition solution, solutes in the magnetic layer deposition solution include sodium hydroxide and sodium nitrite, and solvents in the magnetic layer deposition solution include deionized water.

4. The method for preparing the common-mode inductance of the iron-based nanocrystalline patch according to claim 3, wherein the molar concentration of sodium hydroxide is 17.5mol/L-27.5mol/L, and the molar concentration of sodium nitrite is 1.18mol/L-2.94mol/L.

5. The method for preparing the common-mode inductor of the iron-based nanocrystalline patch according to claim 3, wherein the temperature of the magnetic layer deposition solution is 130-140 ℃ and the growth time is 10-20 min.

6. The method for preparing an iron-based nanocrystalline patch common-mode inductor according to claim 1, wherein in step S3, the thermosetting adhesive film is modified acrylic epoxy resin, and the thickness of the thermosetting adhesive film is 3um-10um.

7. The method for manufacturing an iron-based nanocrystalline chip common-mode inductor according to claim 1, wherein in step S3, the surface treatment is to break and divide the thermosetting adhesive film into shielding units independent of each other.

8. The method for preparing the common-mode inductor of the iron-based nanocrystalline patch according to claim 1, wherein in the step S4, the baking and curing temperature is 150-180 ℃, the time is 160-200 min, and the pressure is 6-10 Kg/cm.

9. The method for preparing an iron-based nanocrystalline chip common-mode inductor according to claim 1, wherein in step S5, the cured magnetic core is cut by one of water jet cutting, wire cutting and laser cutting.

10. A patch common mode inductance device is characterized in that the patch common mode inductance device is manufactured by adopting the method for manufacturing the iron-based nanocrystalline patch common mode inductance according to any one of claims 1 to 9, comprising,

the target core;

the coil is wound on the target magnetic core and comprises a first coil and a second coil which are positioned at two sides of the target magnetic core;

the target magnetic core and the coil are arranged in the packaging shell in a sealing mode, and the lead end point of the first coil and the lead end point of the second coil are respectively connected with pins on the packaging shell.