CN117537930B - Array temperature measurement method and management system based on infrared thermal imaging - Google Patents
Array temperature measurement method and management system based on infrared thermal imaging Download PDFInfo
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
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Abstract
The invention discloses an array temperature measurement method and an array temperature measurement management system based on infrared thermal imaging, and belongs to the technical field of infrared thermal imaging. The invention comprises the following steps: s10: determining the array shape of the infrared detector array; s20: acquiring an infrared thermal image of a target object; s30: predicting the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array; s40: judging whether the target object is faulty or not based on the predicted temperature gradient, and predicting the fault degree of the target object; s50: and maintaining the target object according to the predicted failure degree of the target object. The invention eliminates the influence of the radiation heat gathered by the target object on the calculation result, improves the temperature measurement precision of the system, and improves the temperature measurement effect of the system by considering the radiation heat exchange between the target object and the adjacent object.
Description
Technical Field
The invention relates to the technical field of infrared thermal imaging, in particular to an array temperature measurement method and an array temperature measurement management system based on infrared thermal imaging.
Background
Due to the existence of blackbody radiation, any object radiates electromagnetic waves to the outside according to the difference of temperature. The portion having a wavelength of 2.0 to 1000 μm is called thermal infrared. The thermal infrared imaging images the object through the thermal infrared sensitive CCD, and can reflect the temperature field on the surface of the object. Thermal infrared has wide application in military, industrial, automotive assisted driving and medical fields.
The prior array temperature measurement system acquires an infrared thermal image of a target object by utilizing an infrared detector array with a fixed shape, measures the temperature of the target object according to the acquired infrared thermal image, and can not effectively calculate the radiation heat exchange quantity in the infrared thermal image acquired according to the prior art due to the possible radiation heat exchange condition around the target object, so that the measured temperature has a large difference from an actual value, the influence of the radiation heat collected by the target object on a calculation result cannot be eliminated in the process of calculating the radiation heat exchange quantity by utilizing the prior art, and the temperature value of the target object is predicted by only depending on the color change condition of a corresponding area in the infrared thermal image in the prior art, so that the influence of the color difference problem of the corresponding color on the prediction result is not considered.
Disclosure of Invention
The invention aims to provide an array temperature measurement method and an array temperature measurement management system based on infrared thermal imaging so as to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme: an array thermometry method based on infrared thermal imaging, the method comprising:
s10: determining adjacent objects of the target object, respectively calculating end face distance values between each adjacent object and the target object, and determining the array shape of the infrared detector array by combining azimuth information of each adjacent object compared with the target object;
S20: focusing the thermal radiation of the target object on a main body infrared detector array, converting a radiation signal into a corresponding electric signal by the infrared detector, amplifying and converting the electric signal to obtain an infrared thermal image of the target object, wherein the main body infrared detector array is an infrared detector array constructed based on the shape of a main body;
S30: determining an infrared thermal image obtained by each rectangular infrared detector array based on the infrared thermal image of the target object, and predicting the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array according to the determination result;
s40: judging whether the target object is faulty or not based on the predicted temperature gradient, and predicting the fault degree of the target object;
s50: and maintaining the target object according to the predicted failure degree of the target object.
Further, the specific method for determining the array shape of the infrared detector array in S10 is as follows:
Calculating end face distance values between each adjacent object and the target object by using a distance calculation formula, constructing a plane rectangular coordinate system by taking the midpoint of the target object as an origin, determining azimuth information of each adjacent object compared with the target object based on the constructed plane rectangular coordinate system, wherein the adjacent object refers to an object adjacent to the target object, no other object exists on a connecting line of the adjacent object and the target object, and the object can be electronic equipment;
The method comprises the steps of determining adjacent objects by taking a shape corresponding to an acquisition surface of an infrared thermal image of a target object as a main body shape of an array and taking a plane in which the acquisition surface is located as an observation surface, if the corresponding adjacent objects can be observed on the observation surface, reserving the corresponding adjacent objects, otherwise, rejecting the corresponding adjacent objects;
determining the azimuth information of each reserved adjacent object compared with the target object, adding a rectangular infrared detector array in the corresponding direction, wherein the array length of the added rectangular infrared detector array is an end face distance value between the corresponding adjacent object and the target object, the array width of the added rectangular infrared detector array is the width of a single infrared detector, and the rectangle is an auxiliary shape;
the array shape of the infrared detector array is determined according to the added rectangular infrared detector array and the main body shape of the array.
Further, the specific method for predicting the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array in S30 includes:
the infrared thermal image corresponding to each rectangular infrared detector array is subjected to region division according to colors, and the temperature average value of each divided region is calculated according to the change condition of the brightness of the corresponding color in each divided region, wherein the specific calculation method comprises the following steps:
carrying out gray processing on the infrared thermal image corresponding to each rectangular infrared detector array, and calculating the temperature average value of each divided area according to the gray processing result, wherein a specific calculation formula is as follows:
T＝{{[(1/G)*∑2 i 5 ＝ 6 1(gi*s*i)]/256}+1}*Dj;
wherein i=1, 2, …,256, represents a gray value, j=1, 2, …, m, a number corresponding to each color in the infrared thermal image, m represents a total number of colors, D j represents a temperature value corresponding to a j-th color when the gray value is 1, G i represents a number of pixels of which the gray value is i, s represents an area corresponding to a single pixel, G represents a total area corresponding to the divided area, and T represents a temperature average value corresponding to the divided area;
calculating the temperature average value of each divided area according to the brightness change condition of the infrared thermal image, wherein compared with the process of calculating the temperature average value of each divided area through the color change condition, the error is smaller, and the accuracy is higher;
According to the temperature average value corresponding to each divided area, predicting the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array, wherein a specific prediction formula is as follows:
F＝[1/(q-1)]*∑p q ＝1|(Tp-Tp+1)/dp|；
Wherein p=1, 2, …, q represents the number corresponding to each divided region in the infrared thermal image, q represents the total number of divided regions, T p represents the temperature average value corresponding to the divided region with the number p, T p+1 represents the temperature average value corresponding to the divided region with the number p+1, d p represents the distance value between the midpoint of the divided region with the number p and the midpoint of the divided region with the number p+1, F represents the temperature gradient of the infrared thermal image corresponding to the rectangular infrared detector array, the direction of the temperature gradient is determined by the sign of T p-Tp+1, if the sign is positive, the temperature gradient direction is the direction that the target object points to the corresponding adjacent object, and if the sign is negative, the direction of the temperature gradient is the direction that the corresponding adjacent object points to the target object;
The number sequence of the divided areas is as follows: and calculating the distance value from the middle point of each divided area to the middle point of the infrared thermal image corresponding to the main body array, and numbering each divided area sequentially according to the sequence from the large distance value to the small distance value.
Further, the step S40 includes:
S401: calculating a temperature average value T' of an infrared thermal image corresponding to the main infrared detector array (the calculation method of the temperature average value of the infrared thermal image corresponding to the main infrared detector array is the same as that of the infrared thermal image corresponding to each rectangular infrared detector array), and predicting the actual working temperature of a target object by combining the temperature gradient and the temperature gradient direction of the infrared thermal image corresponding to each rectangular infrared detector array, wherein a specific prediction formula is as follows:
L＝T′-∑c v ＝1[Tck(1+Fc)p-1]*(-1)r；
Wherein c=1, 2, …, v denotes the number corresponding to the infrared thermal image map corresponding to the rectangular infrared detector array, F c denotes the total number of the rectangular infrared detector arrays, F c denotes the temperature gradient of the infrared thermal image map corresponding to the rectangular infrared detector array with the number c, r denotes the direction of the temperature gradient, r=2 when the direction of the temperature gradient is positive r=1, t ck denotes the temperature average value of the dividing region with the number k in the infrared thermal image map corresponding to the rectangular infrared detector array with the number c, k=q when r=1, k=1, l denotes the actual working temperature of the target object when r=2;
when the target object radiates outwards to exchange heat, the position close to the target object is influenced by the heat gathered by the target object, so that the radiation heat exchange quantity calculated according to the corresponding position is higher than the actual radiation heat exchange quantity of the target object, and if the radiation heat exchange quantity of the target object is calculated at the position far away from the target object, the influence is eliminated;
S402: comparing L with the highest working temperature L ' of the target object, if L is more than L ', indicating that the target object fails, and if L is less than or equal to L ', indicating that the target object does not fail;
s403: the fault degree of the target object is predicted by using (L-L ')/L'.
Further, the step S50 is to compare the predicted failure probability of the target object with a set threshold, if the failure probability is greater than or equal to the set threshold, immediately cut off the working power supply of the target object, and notify the worker to repair the target object, and if the failure probability is less than the set threshold, cut off the working power supply of the target object before the worker repairs the target object.
An array temperature measurement management system based on infrared thermal imaging comprises an infrared detector array construction module, an infrared thermal image acquisition module, a temperature measurement module, a target object fault degree prediction module and a management module;
the infrared detector array construction module is used for determining the array shape of the infrared detector array and constructing the infrared detector array based on the determined array shape;
The infrared thermal image acquisition module acquires an infrared thermal image of a target object by using the constructed infrared detector array;
the temperature measurement module predicts the temperature average value and the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array;
the target object fault degree prediction module is used for predicting the fault degree of the target object;
and the management module is used for carrying out maintenance management on the target object according to the fault degree of the target object.
Further, the infrared detector array construction module comprises an information acquisition unit, a main body shape determination unit, a nearby object screening unit, an auxiliary shape determination unit and an infrared detector array construction unit;
the information acquisition unit calculates end face distance values between each adjacent object and the target object by using a distance calculation formula, determines azimuth information of each adjacent object compared with the target object according to the constructed plane rectangular coordinate system, and transmits the end face distance values and the azimuth information to the auxiliary shape determination unit;
The main body shape determining unit takes the shape corresponding to the acquisition surface of the infrared thermal image of the target object as the main body shape of the array, and transmits the determined main body shape to the infrared detector array constructing unit;
the adjacent object screening unit screens adjacent objects by taking the plane of the acquisition surface as an observation surface, and transmits the reserved adjacent objects to the auxiliary shape determining unit;
The auxiliary shape determining unit receives the end face distance value and the azimuth information transmitted by the information acquisition unit and the adjacent object transmitted by the adjacent object screening unit, determines the azimuth information of the received adjacent object compared with the target object, adds a rectangle in the corresponding direction, wherein the length of the rectangle is the end face distance value in the corresponding direction, the width of the rectangle is the width of a single infrared detector, and transmits the added rectangle information to the infrared detector array constructing unit;
the infrared detector array constructing unit receives the main body shape transmitted by the main body shape determining unit and the added rectangular information transmitted by the auxiliary shape determining unit, constructs an infrared detector array according to the received information, and transmits the constructed infrared detector array to the infrared thermal image acquisition module.
Further, the temperature measurement module comprises an infrared thermal image matching unit, a temperature average value prediction unit and a temperature gradient prediction unit;
The infrared thermal image matching unit receives the infrared thermal image transmitted by the infrared thermal image acquisition module, matches the infrared thermal image acquired by each rectangular infrared detector array according to the receiving information, and transmits the matching result to the temperature average value prediction unit;
The temperature average value prediction unit receives the matching result transmitted by the infrared thermal image matching unit, performs region division on the infrared thermal image matched by each rectangular infrared detector array according to colors based on the receiving information, predicts the temperature average value of each divided region according to the change condition of the corresponding color brightness in each divided region, and transmits the prediction result to the temperature gradient prediction unit and the target object fault degree prediction module;
the temperature gradient prediction unit receives the prediction result transmitted by the temperature average value prediction unit, predicts the temperature gradient of the infrared thermal image matched with each rectangular infrared detector array based on the received information, and transmits the prediction result to the target object fault degree prediction module.
Further, the target object fault degree prediction module comprises a target object working temperature prediction unit, a fault judgment unit and a fault degree prediction unit;
The target object working temperature prediction unit receives the prediction results transmitted by the temperature average value prediction unit and the temperature gradient prediction unit, predicts the working temperature of the target object by combining the temperature average value of the infrared thermal image matched with the main infrared detector array, and transmits the predicted working temperature to the fault judgment unit;
The fault judging unit receives the working temperature transmitted by the target object working temperature predicting unit, compares the received working temperature with the highest working temperature of the target object, judges whether the target object is faulty according to a comparison result, and transmits the judgment result to the fault degree predicting unit;
The fault degree prediction unit receives the judging result transmitted by the fault judging unit, predicts the fault degree of the target object by combining the highest working temperature of the target object, and transmits the predicting result to the management module.
Further, the management module receives the prediction result transmitted by the fault degree prediction unit, and notifies a worker to repair the target object based on the received information.
Compared with the prior art, the invention has the following beneficial effects:
1. In the process of predicting the working temperature of the target object, the temperature average value of each divided area is calculated according to the brightness change condition of the infrared thermal image, and compared with the process of calculating the temperature average value of each divided area through the color change condition, the calculation accuracy is further improved;
2. When the temperature of the target object is measured, the invention considers that radiation heat exchange exists between the target object and the adjacent object, determines the array shape of the infrared detector array according to the heat exchange path and the radiation heat collection surface shape of the target object, predicts the actual working temperature of the target object according to the infrared thermal image obtained by the infrared detector array with the determined shape, has better prediction effect, and further improves the temperature measurement effect of the system.
3. In the process of predicting the actual working temperature of the target object, the radiation heat exchange quantity of the target object is calculated at a position far away from the target object, so that the influence of the radiation heat gathered by the target object on a calculation result is eliminated, and the temperature measurement precision of the system is further improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic diagram of a workflow of an array temperature measurement method and management system based on infrared thermal imaging according to the present invention;
FIG. 2 is a schematic diagram of the working principle structure of an array temperature measurement method and a management system based on infrared thermal imaging;
FIG. 3 is a schematic diagram of an array temperature measurement method and an end face distance analysis of a management system based on infrared thermal imaging according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1,2 and 3, the present invention provides the following technical solutions:
An array temperature measurement method based on infrared thermal imaging, the method comprises the following steps:
S10: determining adjacent objects of the target object, respectively calculating end face distance values between each adjacent object and the target object, and determining the array shape of the infrared detector array by combining azimuth information of each adjacent object compared with the target object, wherein the specific determination method comprises the following steps:
Calculating end face distance values between each adjacent object and the target object by using a distance calculation formula, constructing a plane rectangular coordinate system by taking the midpoint of the target object as an origin, determining azimuth information of each adjacent object compared with the target object based on the constructed plane rectangular coordinate system, wherein the adjacent object refers to an object adjacent to the target object, and no other objects exist on a connecting line of the adjacent object and the target object;
The method comprises the steps of determining adjacent objects by taking a shape corresponding to an acquisition surface of an infrared thermal image of a target object as a main body shape of an array and taking a plane in which the acquisition surface is located as an observation surface, if the corresponding adjacent objects can be observed on the observation surface, reserving the corresponding adjacent objects, otherwise, rejecting the corresponding adjacent objects;
determining the azimuth information of each reserved adjacent object compared with the target object, adding a rectangular infrared detector array in the corresponding direction, wherein the array length of the added rectangular infrared detector array is an end face distance value between the corresponding adjacent object and the target object, the array width of the added rectangular infrared detector array is the width of a single infrared detector, and the rectangle is an auxiliary shape;
Determining the array shape of the infrared detector array according to the added rectangular infrared detector array and the main body shape of the array;
S20: focusing the thermal radiation of the target object on a main body infrared detector array, converting a radiation signal into a corresponding electric signal by the infrared detector, amplifying and converting the electric signal to obtain an infrared thermal image of the target object, wherein the main body infrared detector array is an infrared detector array constructed based on the shape of a main body;
S30: based on the infrared thermal image of the target object, determining the infrared thermal image obtained by each rectangular infrared detector array, and predicting the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array according to the determination result, wherein the specific method comprises the following steps:
the infrared thermal image corresponding to each rectangular infrared detector array is subjected to region division according to colors, and the temperature average value of each divided region is calculated according to the change condition of the brightness of the corresponding color in each divided region, wherein the specific calculation method comprises the following steps:
carrying out gray processing on the infrared thermal image corresponding to each rectangular infrared detector array, and calculating the temperature average value of each divided area according to the gray processing result, wherein a specific calculation formula is as follows:
T＝{{[(1/G)*∑2 i 5 ＝ 6 1(gi*s*i)]/256}+1}*Dj;
wherein i=1, 2, …,256, represents a gray value, j=1, 2, …, m, a number corresponding to each color in the infrared thermal image, m represents a total number of colors, D j represents a temperature value corresponding to a j-th color when the gray value is 1, G i represents a number of pixels of which the gray value is i, s represents an area corresponding to a single pixel, G represents a total area corresponding to the divided area, and T represents a temperature average value corresponding to the divided area;
calculating the temperature average value of each divided area according to the brightness change condition of the infrared thermal image, wherein compared with the process of calculating the temperature average value of each divided area through the color change condition, the error is smaller, and the accuracy is higher;
According to the temperature average value corresponding to each divided area, predicting the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array, wherein a specific prediction formula is as follows:
F＝[1/(q-1)]*∑p q ＝1|(Tp-Tp+1)/dp|；
Wherein p=1, 2, …, q represents the number corresponding to each divided region in the infrared thermal image, q represents the total number of divided regions, T p represents the temperature average value corresponding to the divided region with the number p, T p+1 represents the temperature average value corresponding to the divided region with the number p+1, d p represents the distance value between the midpoint of the divided region with the number p and the midpoint of the divided region with the number p+1, F represents the temperature gradient of the infrared thermal image corresponding to the rectangular infrared detector array, the direction of the temperature gradient is determined by the sign of T p-Tp+1, if the sign is positive, the temperature gradient direction is the direction that the target object points to the corresponding adjacent object, and if the sign is negative, the direction of the temperature gradient is the direction that the corresponding adjacent object points to the target object;
the number sequence of the divided areas is as follows: calculating the distance value from the middle point of each divided area to the middle point of the infrared thermal image corresponding to the main body array, and numbering each divided area in sequence according to the sequence from the large distance value to the small distance value;
s40: judging whether the target object is faulty or not based on the predicted temperature gradient, and predicting the fault degree of the target object;
S40 includes:
S401: calculating a temperature average value T' of an infrared thermal image corresponding to the main infrared detector array (the calculation method of the temperature average value of the infrared thermal image corresponding to the main infrared detector array is the same as that of the infrared thermal image corresponding to each rectangular infrared detector array), and predicting the actual working temperature of a target object by combining the temperature gradient and the temperature gradient direction of the infrared thermal image corresponding to each rectangular infrared detector array, wherein a specific prediction formula is as follows:
L＝T′-∑c v ＝1[Tck(1+Fc)p-1]*(-1)r；
Wherein c=1, 2, …, v denotes the number corresponding to the infrared thermal image map corresponding to the rectangular infrared detector array, F c denotes the total number of the rectangular infrared detector arrays, F c denotes the temperature gradient of the infrared thermal image map corresponding to the rectangular infrared detector array with the number c, r denotes the direction of the temperature gradient, r=2 when the direction of the temperature gradient is positive r=1, t ck denotes the temperature average value of the dividing region with the number k in the infrared thermal image map corresponding to the rectangular infrared detector array with the number c, k=q when r=1, k=1, l denotes the actual working temperature of the target object when r=2;
when the target object radiates outwards to exchange heat, the position close to the target object is influenced by the heat gathered by the target object, so that the radiation heat exchange quantity calculated according to the corresponding position is higher than the actual radiation heat exchange quantity of the target object, and if the radiation heat exchange quantity of the target object is calculated at the position far away from the target object, the influence is eliminated;
S402: comparing L with the highest working temperature L ' of the target object, if L is more than L ', indicating that the target object fails, and if L is less than or equal to L ', indicating that the target object does not fail;
s403: predicting the fault degree of the target object by using (L-L ')/L';
s50: maintaining the target object according to the predicted failure degree of the target object;
S50, comparing the predicted fault probability of the target object with a set threshold, if the fault probability is greater than or equal to the set threshold, immediately cutting off the working power supply of the target object, informing a worker to repair the target object, and if the fault probability is less than the set threshold, cutting off the working power supply of the target object before the worker repairs the target object.
An array temperature measurement management system based on infrared thermal imaging comprises an infrared detector array construction module, an infrared thermal image acquisition module, a temperature measurement module, a target object fault degree prediction module and a management module;
the infrared detector array construction module is used for determining the array shape of the infrared detector array and constructing the infrared detector array based on the determined array shape;
The infrared detector array construction module comprises an information acquisition unit, a main body shape determination unit, a nearby object screening unit, an auxiliary shape determination unit and an infrared detector array construction unit;
The information acquisition unit calculates end face distance values between each adjacent object and the target object by using a distance calculation formula, determines azimuth information of each adjacent object compared with the target object according to the constructed plane rectangular coordinate system, and transmits the end face distance values and the azimuth information to the auxiliary shape determination unit;
the main body shape determining unit takes the shape corresponding to the acquisition surface of the infrared thermal image of the target object as the main body shape of the array, and transmits the determined main body shape to the infrared detector array constructing unit;
the adjacent object screening unit screens the adjacent objects by taking the plane of the acquisition surface as an observation surface, and transmits the reserved adjacent objects to the auxiliary shape determining unit;
The auxiliary shape determining unit receives the end face distance value and the azimuth information transmitted by the information acquisition unit and the adjacent object transmitted by the adjacent object screening unit, determines the azimuth information of the received adjacent object compared with the target object, adds a rectangle in the corresponding direction, wherein the length of the rectangle is the end face distance value in the corresponding direction, the width of the rectangle is the width of a single infrared detector, and transmits the added rectangle information to the infrared detector array constructing unit;
The infrared detector array constructing unit receives the main body shape transmitted by the main body shape determining unit and the added rectangular information transmitted by the auxiliary shape determining unit, constructs an infrared detector array according to the received information, and transmits the constructed infrared detector array to the infrared thermal image acquisition module;
The infrared thermal image acquisition module acquires an infrared thermal image of the target object by using the constructed infrared detector array;
the temperature measurement module predicts the temperature average value and the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array;
The temperature measurement module comprises an infrared thermal image matching unit, a temperature average value prediction unit and a temperature gradient prediction unit;
The infrared thermal image matching unit receives the infrared thermal image transmitted by the infrared thermal image acquisition module, matches the infrared thermal image acquired by each rectangular infrared detector array according to the receiving information, and transmits the matching result to the temperature average value prediction unit;
The temperature average value prediction unit receives the matching result transmitted by the infrared thermal image matching unit, performs region division on the infrared thermal image matched by each rectangular infrared detector array according to colors based on the receiving information, predicts the temperature average value of each divided region according to the change condition of the corresponding color brightness in each divided region, and transmits the prediction result to the temperature gradient prediction unit and the target object fault degree prediction module;
the temperature gradient prediction unit receives the prediction result transmitted by the temperature mean value prediction unit, predicts the temperature gradient of the infrared thermal image matched with each rectangular infrared detector array based on the receiving information, and transmits the prediction result to the target object fault degree prediction module;
The target object fault degree prediction module is used for predicting the fault degree of the target object;
the target object fault degree prediction module comprises a target object working temperature prediction unit, a fault judgment unit and a fault degree prediction unit;
The target object working temperature prediction unit receives the prediction results transmitted by the temperature average value prediction unit and the temperature gradient prediction unit, predicts the working temperature of the target object by combining the temperature average value of the infrared thermal image matched with the main infrared detector array, and transmits the predicted working temperature to the fault judgment unit;
The fault judging unit receives the working temperature transmitted by the target object working temperature predicting unit, compares the received working temperature with the highest working temperature of the target object, judges whether the target object is faulty according to a comparison result, and transmits the judgment result to the fault degree predicting unit;
the fault degree prediction unit receives the judging result transmitted by the fault judging unit, predicts the fault degree of the target object by combining the highest working temperature of the target object, and transmits the predicting result to the management module;
the management module receives the prediction result transmitted by the fault degree prediction unit, and notifies a worker to repair the target object based on the received information.
Example 1: let the corresponding divided areas include gray values 1,20,70 and 160, wherein the number of pixels with gray value of 1 is 20, the number of pixels with gray value of 20 is 50, the number of pixels with gray value of 70 is 100, the number of pixels with gray value of 160 is 60, the area corresponding to each pixel is 1, the color of the corresponding divided area is red, the temperature value corresponding to red is 40 ℃ when the gray value is 0, and the temperature average value of the corresponding divided area is:
T＝{[(1/G)*∑2 i 5 ＝ 6 1(gi*s*i)]/256}*Dj
＝{[(1/230)*(20*1*1+50*1*20+100*1*70+60*1*160)]/256}*40
＝51.97℃；
Therefore, the temperature average value of the corresponding divided region is 51.97 ℃.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. An array temperature measurement method based on infrared thermal imaging is characterized in that: the method comprises the following steps:
s10: determining adjacent objects of the target object, respectively calculating end face distance values between each adjacent object and the target object, and determining the array shape of the infrared detector array by combining azimuth information of each adjacent object compared with the target object;
The specific method for determining the array shape of the infrared detector array in the S10 is as follows:
Calculating end face distance values between each adjacent object and the target object by using a distance calculation formula, constructing a plane rectangular coordinate system by taking the midpoint of the target object as an origin, determining azimuth information of each adjacent object compared with the target object based on the constructed plane rectangular coordinate system, wherein the adjacent object refers to an object adjacent to the target object, and no other objects exist on a connecting line of the adjacent object and the target object;
The method comprises the steps of determining adjacent objects by taking a shape corresponding to an acquisition surface of an infrared thermal image of a target object as a main body shape of an array and taking a plane in which the acquisition surface is located as an observation surface, if the corresponding adjacent objects can be observed on the observation surface, reserving the corresponding adjacent objects, otherwise, rejecting the corresponding adjacent objects;
determining the azimuth information of each reserved adjacent object compared with the target object, adding a rectangular infrared detector array in the corresponding direction, wherein the array length of the added rectangular infrared detector array is an end face distance value between the corresponding adjacent object and the target object, the array width of the added rectangular infrared detector array is the width of a single infrared detector, and the rectangle is an auxiliary shape;
Determining the array shape of the infrared detector array according to the added rectangular infrared detector array and the main body shape of the array;
s20: focusing the thermal radiation of the target object on a main infrared detector array, converting a radiation signal into a corresponding electric signal by an infrared detector, and amplifying and converting the electric signal to obtain an infrared thermal image of the target object;
S30: determining an infrared thermal image obtained by each rectangular infrared detector array based on the infrared thermal image of the target object, and predicting the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array according to the determination result;
The specific method for predicting the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array in S30 is as follows:
the infrared thermal image corresponding to each rectangular infrared detector array is subjected to region division according to colors, and the temperature average value of each divided region is calculated according to the change condition of the brightness of the corresponding color in each divided region, wherein the specific calculation method comprises the following steps:
carrying out gray processing on the infrared thermal image corresponding to each rectangular infrared detector array, and calculating the temperature average value of each divided area according to the gray processing result, wherein a specific calculation formula is as follows:
T＝{{[(1/G)*∑2 i 5 ＝ 6 1(gi*s*i)]/256}+1}*Dj;
wherein i=1, 2, …,256, represents a gray value, j=1, 2, …, m, a number corresponding to each color in the infrared thermal image, m represents a total number of colors, D j represents a temperature value corresponding to a j-th color when the gray value is 1, G i represents a number of pixels of which the gray value is i, s represents an area corresponding to a single pixel, G represents a total area corresponding to the divided area, and T represents a temperature average value corresponding to the divided area;
According to the temperature average value corresponding to each divided area, predicting the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array, wherein a specific prediction formula is as follows:
F＝[1/(q-1)]*∑p q ＝1|(Tp-Tp+1)/dp|；
Wherein p=1, 2, …, q represents the number corresponding to each divided region in the infrared thermal image, q represents the total number of divided regions, T p represents the temperature average value corresponding to the divided region with the number p, T p+1 represents the temperature average value corresponding to the divided region with the number p+1, d p represents the distance value between the midpoint of the divided region with the number p and the midpoint of the divided region with the number p+1, F represents the temperature gradient of the infrared thermal image corresponding to the rectangular infrared detector array, the direction of the temperature gradient is determined by the sign of T p-Tp+1, if the sign is positive, the temperature gradient direction is the direction that the target object points to the corresponding adjacent object, and if the sign is negative, the direction of the temperature gradient is the direction that the corresponding adjacent object points to the target object;
s40: judging whether the target object is faulty or not based on the predicted temperature gradient, and predicting the fault degree of the target object;
s50: and maintaining the target object according to the predicted failure degree of the target object.
2. An infrared thermal imaging-based array thermometry method according to claim 1, characterized in that: the S40 includes:
S401: calculating a temperature mean value T' of an infrared thermal image corresponding to the main infrared detector array, and predicting the actual working temperature of a target object by combining the temperature gradient and the temperature gradient direction of the infrared thermal image corresponding to each rectangular infrared detector array, wherein a specific prediction formula is as follows:
L＝T′-∑c v ＝1[Tck(1+Fc)p-1]*(-1)r；
Wherein c=1, 2, …, v denotes the number corresponding to the infrared thermal image map corresponding to the rectangular infrared detector array, F c denotes the total number of the rectangular infrared detector arrays, F c denotes the temperature gradient of the infrared thermal image map corresponding to the rectangular infrared detector array with the number c, r denotes the direction of the temperature gradient, r=2 when the direction of the temperature gradient is positive r=1, t ck denotes the temperature average value of the dividing region with the number k in the infrared thermal image map corresponding to the rectangular infrared detector array with the number c, k=q when r=1, k=1, l denotes the actual working temperature of the target object when r=2;
S402: comparing L with the highest working temperature L ' of the target object, if L is more than L ', indicating that the target object fails, and if L is less than or equal to L ', indicating that the target object does not fail;
s403: the fault degree of the target object is predicted by using (L-L ')/L'.
3. An infrared thermal imaging-based array thermometry method according to claim 2, characterized in that: and S50, comparing the predicted fault probability of the target object with a set threshold, immediately cutting off the working power supply of the target object if the fault probability is more than or equal to the set threshold, informing a worker to repair the target object, and cutting off the working power supply of the target object before the worker repairs the target object if the fault probability is less than the set threshold.
4. An infrared thermal imaging-based array thermometry management system applied to the infrared thermal imaging-based array thermometry method of any one of claims 1-3, characterized in that: the system comprises an infrared detector array construction module, an infrared thermal image acquisition module, a temperature measurement module, a target object fault degree prediction module and a management module;
the infrared detector array construction module is used for determining the array shape of the infrared detector array and constructing the infrared detector array based on the determined array shape;
The infrared thermal image acquisition module acquires an infrared thermal image of a target object by using the constructed infrared detector array;
the temperature measurement module predicts the temperature average value and the temperature gradient of the infrared thermal image corresponding to each rectangular infrared detector array;
the target object fault degree prediction module is used for predicting the fault degree of the target object;
and the management module is used for carrying out maintenance management on the target object according to the fault degree of the target object.
5. An infrared thermal imaging-based array thermometry management system of claim 4, wherein: the infrared detector array construction module comprises an information acquisition unit, a main body shape determination unit, a nearby object screening unit, an auxiliary shape determination unit and an infrared detector array construction unit;
the information acquisition unit calculates end face distance values between each adjacent object and the target object by using a distance calculation formula, determines azimuth information of each adjacent object compared with the target object according to the constructed plane rectangular coordinate system, and transmits the end face distance values and the azimuth information to the auxiliary shape determination unit;
The main body shape determining unit takes the shape corresponding to the acquisition surface of the infrared thermal image of the target object as the main body shape of the array, and transmits the determined main body shape to the infrared detector array constructing unit;
the adjacent object screening unit screens adjacent objects by taking the plane of the acquisition surface as an observation surface, and transmits the reserved adjacent objects to the auxiliary shape determining unit;
The auxiliary shape determining unit receives the end face distance value and the azimuth information transmitted by the information acquisition unit and the adjacent object transmitted by the adjacent object screening unit, determines the azimuth information of the received adjacent object compared with the target object, adds a rectangle in the corresponding direction, wherein the length of the rectangle is the end face distance value in the corresponding direction, the width of the rectangle is the width of a single infrared detector, and transmits the added rectangle information to the infrared detector array constructing unit;
the infrared detector array constructing unit receives the main body shape transmitted by the main body shape determining unit and the added rectangular information transmitted by the auxiliary shape determining unit, constructs an infrared detector array according to the received information, and transmits the constructed infrared detector array to the infrared thermal image acquisition module.
6. An infrared thermal imaging-based array thermometry management system of claim 5, wherein: the temperature measurement module comprises an infrared thermal image matching unit, a temperature average value prediction unit and a temperature gradient prediction unit;
The infrared thermal image matching unit receives the infrared thermal image transmitted by the infrared thermal image acquisition module, matches the infrared thermal image acquired by each rectangular infrared detector array according to the receiving information, and transmits the matching result to the temperature average value prediction unit;
The temperature average value prediction unit receives the matching result transmitted by the infrared thermal image matching unit, performs region division on the infrared thermal image matched by each rectangular infrared detector array according to colors based on the receiving information, predicts the temperature average value of each divided region according to the change condition of the corresponding color brightness in each divided region, and transmits the prediction result to the temperature gradient prediction unit and the target object fault degree prediction module;
the temperature gradient prediction unit receives the prediction result transmitted by the temperature average value prediction unit, predicts the temperature gradient of the infrared thermal image matched with each rectangular infrared detector array based on the received information, and transmits the prediction result to the target object fault degree prediction module.
7. The infrared thermal imaging-based array thermometry management system of claim 6, wherein: the target object fault degree prediction module comprises a target object working temperature prediction unit, a fault judgment unit and a fault degree prediction unit;
The target object working temperature prediction unit receives the prediction results transmitted by the temperature average value prediction unit and the temperature gradient prediction unit, predicts the working temperature of the target object by combining the temperature average value of the infrared thermal image matched with the main infrared detector array, and transmits the predicted working temperature to the fault judgment unit;
The fault judging unit receives the working temperature transmitted by the target object working temperature predicting unit, compares the received working temperature with the highest working temperature of the target object, judges whether the target object is faulty according to a comparison result, and transmits the judgment result to the fault degree predicting unit;
The fault degree prediction unit receives the judging result transmitted by the fault judging unit, predicts the fault degree of the target object by combining the highest working temperature of the target object, and transmits the predicting result to the management module.
8. The infrared thermal imaging-based array thermometry management system of claim 7, wherein: and the management module receives the prediction result transmitted by the fault degree prediction unit and informs a worker of maintaining the target object based on the received information.
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