CN117532141A - Laser beam adjusting mechanism and laser auxiliary bonding equipment - Google Patents

Laser beam adjusting mechanism and laser auxiliary bonding equipment Download PDF

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Publication number
CN117532141A
CN117532141A CN202311395147.0A CN202311395147A CN117532141A CN 117532141 A CN117532141 A CN 117532141A CN 202311395147 A CN202311395147 A CN 202311395147A CN 117532141 A CN117532141 A CN 117532141A
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China
Prior art keywords
laser
laser beam
assembly
shaping
axis
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CN202311395147.0A
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Chinese (zh)
Inventor
请求不公布姓名
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Shenzhen Zhida Xingkong Technology Group Co ltd
Smart Star Shanghai Engineering Technology Co ltd
Original Assignee
Shenzhen Zhida Xingkong Technology Group Co ltd
Smart Star Shanghai Engineering Technology Co ltd
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Application filed by Shenzhen Zhida Xingkong Technology Group Co ltd, Smart Star Shanghai Engineering Technology Co ltd filed Critical Shenzhen Zhida Xingkong Technology Group Co ltd
Priority to CN202311395147.0A priority Critical patent/CN117532141A/en
Publication of CN117532141A publication Critical patent/CN117532141A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75261—Laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)

Abstract

The application provides a laser beam adjusting mechanism and laser auxiliary bonding equipment, which relate to the technical field of chip manufacturing and comprise a laser, a shaping beam expanding assembly, a laser angle adjusting assembly and a beam focusing assembly; the beam shaping and expanding assembly comprises an incidence port, a laser beam receiving port, a beam shaping and expanding port and a beam shaping and expanding port, wherein the incidence port of the shaping and expanding assembly is correspondingly arranged with the outgoing port of the laser to receive the laser beam emitted by the laser and perform beam shaping and zooming and beam expanding on the laser beam; the laser angle adjusting assembly is used for receiving the laser beam emitted by the shaping beam expanding assembly and adjusting the emission angle of the laser beam; the entrance of the beam focusing assembly is correspondingly arranged with the exit of the laser angle adjusting assembly, and the beam focusing assembly is used for receiving the laser beam emitted by the laser angle adjusting assembly and carrying out flat field focusing on the laser beam. Through the mechanism, the laser beam can be reduced to the micron level, and the laser beam power is ensured to be uniform, so that the process requirement of current chip manufacturing on laser welding is met.

Description

Laser beam adjusting mechanism and laser auxiliary bonding equipment
Technical Field
The application relates to the technical field of chip manufacturing, in particular to a laser beam adjusting mechanism and laser auxiliary bonding equipment.
Background
In the laser-assisted bonding process, the power density distribution and spatial characteristics of the laser beam are very important. If the power distribution of the laser beam is uneven, it may result in uneven temperature at the spot of the weld during welding. If the power of the welding area is insufficient, defects such as poor contact and the like are caused.
The laser beam size of the existing laser auxiliary bonding equipment is in millimeter level, and is applied to the welding in the field of chip manufacturing, on one hand, the laser beam is difficult to effectively ensure that the laser beam accurately reaches the welding point, on the other hand, the uniformity of the power distribution of the laser beam at each position of the welding area is difficult to effectively ensure, and the uniformity is required to be improved,
therefore, it is desirable to provide a laser-assisted bonding apparatus capable of reducing the laser beam to the micrometer level and ensuring the laser beam power to be uniform so as to meet the process requirements of current chip manufacturing for laser welding.
Disclosure of Invention
In view of this, the embodiments of the present disclosure provide a laser beam adjusting mechanism and a laser-assisted bonding apparatus, which can reduce the laser beam to a micrometer level and ensure the laser beam power to be uniform, so as to meet the process requirements of the current chip manufacturing for laser welding.
The embodiment of the specification provides the following technical scheme:
the embodiment of the specification provides a laser beam adjusting mechanism, which comprises a laser, a shaping beam expanding assembly, a laser angle adjusting assembly and a beam focusing assembly;
the entrance of the shaping beam expanding assembly is arranged corresponding to the exit of the laser, so as to receive the laser beam emitted by the laser and perform beam shaping and zooming beam expanding on the laser beam;
the laser angle adjusting assembly is used for receiving the laser beam emitted by the shaping beam expanding assembly and adjusting the emission angle of the laser beam;
the entrance of the beam focusing assembly is correspondingly arranged with the exit of the laser angle adjusting assembly, and the beam focusing assembly is used for receiving the laser beam emitted by the laser angle adjusting assembly and carrying out flat field focusing on the laser beam.
Through above-mentioned technical scheme, set up plastic beam expanding subassembly, laser angle adjustment subassembly and beam focusing subassembly, wherein, through the beam shaping to the laser beam, can form the laser beam shaping that the laser instrument was emergent into the even light beam of energy distribution, the rethread is to the varifocal beam expanding of laser beam, can change the facula size of output laser beam, control the diameter of laser beam at the micron level, afterwards, through the angle of emission of change laser beam and the flat field focus to the laser beam for the laser beam can reach each solder joint position on the chip that waits to weld, accomplishes the welding, satisfies the technological requirement of chip manufacturing to laser welding at present.
Preferably, the laser power controller is further included;
the input end of the laser power controller is connected with the outlet of the shaping beam expanding component and/or the outlet of the beam focusing component so as to measure the output power of the laser beam;
the output end of the laser power controller is connected with the input end of the laser so as to feed back the output power of the laser beam to the laser.
Through the technical scheme, the laser power controller is arranged, so that power feedback about the output laser beam can be obtained, and in the actual application process, the output power or the laser irradiation time of the laser can be adjusted according to the requirements, so that closed-loop control is realized.
Preferably, the laser angle adjusting component comprises an X-axis galvanometer and a Y-axis galvanometer;
the X-axis vibrating mirror and the Y-axis vibrating mirror are respectively adjustable in angle in the X-axis direction and the Y-axis direction, and are mutually matched to receive the laser beam emitted by the shaping beam expanding assembly and adjust the emission angle of the laser beam.
Preferably, the beam focusing assembly comprises an F-Theta lens;
the F-Theta lens is arranged corresponding to the emergent opening of the laser angle adjusting assembly, and can always receive the laser beam emitted by the laser angle adjusting assembly.
Preferably, the shaping beam expander assembly comprises a beam shaper and a variable focus beam expander;
the entrance port of the beam shaper is in butt joint with the exit port of the laser, and the beam shaper is used for receiving the laser beam incident by the laser and performing beam shaping on the laser beam;
the zoom beam expander is used for receiving the laser beam subjected to beam shaping and carrying out zoom beam expansion on the laser beam.
The embodiment of the specification also provides laser auxiliary bonding equipment, which comprises a workbench and any one of the laser beam adjusting mechanisms;
the workbench is used for placing a workpiece;
the outlet of the beam focusing assembly is arranged corresponding to the workbench, and the beam focusing assembly is used for outputting laser beams to the workbench.
Preferably, the table is translatably adjustable in a first direction, a second direction and a third direction.
Through the technical scheme, even under the condition of large chip size or multi-chip bonding, the laser beam emitted by the beam focusing assembly can cover the whole welding area through the matching of the translation of the workbench and the laser angle adjusting assembly, and the laser beam can accurately irradiate the position of each welding spot.
Preferably, the alignment system is further included for detecting alignment marks on the workbench and/or alignment marks on the workpiece so as to position the initial position of the workpiece.
According to the technical scheme, the alignment system can determine the initial position of the workpiece by detecting the alignment mark, and then the positions of all welding spots on the workpiece are determined in the actual bonding process, so that the motion trail of the workpiece and the workbench in the welding process can be generated according to the initial position of the workpiece.
Preferably, the alignment system is a camera or vision sensor.
Preferably, the workbench is provided with an alignment mark;
and when the alignment system detects the alignment mark on the workbench, the workbench and/or the workpiece are/is adjusted to an initial position.
Compared with the prior art, the beneficial effects that above-mentioned at least one technical scheme that this description embodiment adopted can reach include at least:
through setting up plastic beam expanding subassembly, laser angle adjustment subassembly and beam focusing subassembly, can accomplish beam shaping, varifocal beam expanding, emission angle adjustment and flat field focus in proper order to the laser beam that the laser instrument launched, on the one hand can reduce the laser beam to the micron level, on the other hand, can make the laser beam can reach each solder joint position on the chip that waits to weld, accomplish the welding, satisfy the technological requirement of chip manufacturing to laser welding at present.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is an overall schematic diagram of a laser assisted bonding apparatus of the present application.
Reference numerals: 1. a laser; 2. a shaping beam expanding assembly; 201. a beam shaper; 202. a zoom beam expander; 3. a laser angle adjustment assembly; 4. a beam focusing assembly; 5. a laser power controller; 6. a work table; 7. an alignment system; 8. a driving mechanism.
Detailed Description
Embodiments of the present application are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the application by way of illustration, and only the components related to the application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details.
The following describes the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.
As shown in fig. 1, the embodiment of the present specification provides a laser beam adjusting mechanism including a laser 1, a shaping beam expanding assembly 2, a laser angle adjusting assembly 3, a beam focusing assembly 4, and a laser power controller 5.
Wherein, laser 1, plastic beam expanding subassembly 2, laser angle adjustment subassembly 3 and beam focusing subassembly 4 set gradually.
In the embodiment of the application, the laser 1 adopts an infrared semiconductor laser, the wavelength of a laser beam output by the infrared semiconductor laser is 900-1000nm, the output power is 0.5-4kw, and the output power and the output time of the infrared semiconductor laser can be adjusted in real time.
The entrance of the shaping beam expanding component 2 is arranged corresponding to the exit of the laser 1, and the shaping beam expanding component 2 is used for receiving the laser beam emitted by the laser 1, shaping the laser beam and zooming the laser beam.
Specifically, the shaping beam expander assembly 2 includes a beam shaper 201 and a variable focus beam expander 202.
Wherein the entrance of the beam shaper 201 interfaces with the exit of the laser 1.
The beam shaper 201 includes a plurality of lenses and a diaphragm, and the beam shaper 201 is configured to receive the laser beam incident by the laser 1 and perform beam shaping on the laser beam, so that the laser beam emitted by the laser 1 is shaped into a laser beam with uniform energy distribution.
The entrance of the zoom beam expander 202 interfaces with the exit of the beam shaper 201.
The zoom beam expander 202 is configured to receive the laser beam after beam shaping and zoom-expand the laser beam.
Specifically, the zoom beam expander 202 includes a plurality of lenses and a lens adjusting mechanism, and the distance between the lenses is adjusted by the lens adjusting mechanism, so as to realize zoom beam expansion, so as to adjust the spot size of the laser beam, and the adjustment range of the spot size is 20-120um.
The beam shaping and zooming of the laser beam by the beam shaper 201 and the zooming beam expander 202 can control the spot size of the laser beam to be in the micrometer level, and can also ensure the energy distribution of the laser beam to be uniform.
It should be noted that, the entrance of the beam shaper 201 is the entrance of the shaping and beam expanding assembly 2, and the exit of the variable-focal-length beam expander 202 is the exit of the shaping and beam expanding assembly 2.
In other embodiments, the shaping and beam expanding assembly 2 may further include a plano-concave aspheric lens, a biconvex aspheric lens, a negative lens, and a positive lens sequentially disposed along the same axis, and the shaping and zooming of the laser beam are achieved by adjusting the negative lens and the positive lens along the axis.
The entrance of the laser angle adjusting component 3 is correspondingly arranged with the exit of the shaping beam expanding component 2. The laser angle adjusting component 3 is used for receiving the laser beam emitted by the shaping beam expanding component 2 and adjusting the emission angle of the laser beam.
Specifically, the laser angle adjusting assembly 3 includes an X-axis galvanometer and a Y-axis galvanometer.
The entrance of the X-axis galvanometer corresponds to the exit of the zoom beam expander 202. The X-axis galvanometer is used to receive the laser beam emitted by the zoom beam expander 202 and reflect the laser beam to the Y-axis galvanometer.
The entrance of the Y-axis vibrating mirror is correspondingly arranged with the exit of the X-axis vibrating mirror. The Y-axis galvanometer is configured to receive the laser beam reflected from the X-axis galvanometer and reflect the laser beam to the beam focusing assembly 4.
Further, the X-axis vibrating mirror and the Y-axis vibrating mirror are respectively adjustable in angle in the X-axis direction and the Y-axis direction.
The angle adjustment range of the X-axis galvanometer is set so as to always receive the laser beam emitted from the zoom beam expander 202 and complete the reflection adjustment of the laser beam, and the angle adjustment range of the Y-axis galvanometer is set so as to always receive the laser beam reflected from the X-axis galvanometer and always emit the laser beam to the entrance of the beam focusing assembly 4.
In the practical application process, the adjustable angles of the X-axis vibrating mirror and the Y-axis vibrating mirror are only set in a smaller range, and only small-amplitude angle fine adjustment can be realized. By changing the angle of emission of the laser beam, the laser beam can reach each welding spot position on the workpiece.
The entrance and exit of the X-axis galvanometer refer to the incident direction and the reflection direction of the X-axis galvanometer, respectively. The incident port and the emergent port of the Y-axis galvanometer refer to the incident direction and the reflecting direction of the Y-axis galvanometer respectively. The workpiece is referred to as a chip in the embodiments of the present application, but may be other components that require laser to perform high-precision welding.
In other embodiments, the entrance of the Y-axis galvanometer may be positioned corresponding to the exit of the zoom beam expander 202, and the entrance of the X-axis galvanometer may be positioned corresponding to the exit of the Y-axis galvanometer.
In other embodiments, the laser angle adjusting component 3 may further include a Z-axis galvanometer, and by setting an X-axis galvanometer, a Y-axis galvanometer, and a Z-axis galvanometer, the angle adjustment of the laser beam in the X-axis direction, the Y-axis direction, and the Z-axis direction is achieved, so that the adjustable range of the laser beam is larger. It should be noted that the laser angle adjustment assembly 3 may also include a greater number of galvanometers to achieve finer laser beam angle adjustment.
In other embodiments, the X-axis galvanometer may be further configured to translate by a small amount along the X-axis direction, and the Y-axis galvanometer may be further configured to translate by a small amount along the Y-axis direction, so that after the angle adjustment of the X-axis galvanometer and the Y-axis galvanometer, the laser beam may always strike the entrance of the beam focusing assembly 4 through the small-amount translation adjustment of the X-axis galvanometer and the Y-axis galvanometer. Specifically, the translation adjustable distance of the X-axis vibrating mirror and the Y-axis vibrating mirror is 0.1-0.5mm, and the adjusting mechanism can use the same micro-motion adjusting mechanism as the microscope.
In other embodiments, the laser angle adjusting component 3 may be a prism rotated by a motor, and the angle of the laser beam may be adjusted by the prism angle, or may be other laser angle adjusting components, so long as the angle of the laser beam can be adjusted, which is not limited herein.
The entrance of the beam focusing assembly 4 is correspondingly arranged with the exit of the laser angle adjusting assembly 3, and the beam focusing assembly 4 is used for receiving the laser beam emitted by the laser angle adjusting assembly 3 and carrying out flat field focusing on the laser beam.
Specifically, the beam focusing assembly 4 includes an F-Theta lens.
The F-Theta lens is arranged corresponding to the emergent port of the Y-axis vibrating mirror, and is configured to: the laser beam emitted from the laser angle adjusting unit 3 can always be received.
In the practical application process, the angle adjustable range of the X-axis vibrating mirror and the Y-axis vibrating mirror is limited, so that laser beams reflected by the X-axis vibrating mirror and the Y-axis vibrating mirror can be always shot into the F-Theta lens. Specifically, the angle adjustable range of the X-axis vibrating mirror and the Y-axis vibrating mirror is set to be 1-3 degrees.
In other embodiments, the F-Theta lens can be set to be translatable and adjustable along the X-axis direction, the Y-axis direction and the Z-axis direction, so that the X-axis galvanometer and the Y-axis galvanometer can set a larger angle adjustable range, and the F-Theta lens can always receive the laser beam emitted by the laser angle adjusting component 3 and perform flat field focusing on the laser beam through displacement adjustment. Thereby achieving larger laser welding coverage area so as to weld welding spots at all positions of the workpiece.
The input end of the laser power controller 5 is connected with the output port of the shaping beam expanding assembly 2 and/or the output port of the beam focusing assembly 4 to measure the output power of the laser beam. The output of the laser power controller 5 is connected to the input of the laser 1 to feed back the output power of the laser beam to the laser 1.
In this embodiment of the present application, the input end of the laser power controller 5 corresponds to the exit port of the shaping and beam expanding assembly 2, and is connected to the exit port of the shaping and beam expanding assembly 2, so as to receive a part of the laser beams emitted by the shaping and beam expanding assembly 2, and perform power measurement on the laser beams of the part, where the measured power value is the output power of the laser beams. In the practical application process, the laser 1 can receive feedback from the laser power controller 5, so that the output laser beam power can be obtained in real time, and the output laser power and the laser irradiation time can be adjusted in real time according to the requirements of each welding spot position on the laser power and the laser irradiation time, so that the output laser beam can meet the process requirements of each welding spot during welding. Or, the welding sequence of each welding spot of the workpiece can be set in advance, a welding path is established, and the parameters of laser beams required by each welding spot are preset according to the sequence of the welding spots passing through the welding path, so that the output power and the irradiation time of the laser beams can be automatically adjusted during welding, and the welding efficiency and the welding quality are improved.
Specifically, the input end of the laser power controller 5 is connected to the output port of the zoom beam expander 202. After the laser beam is emitted from the exit of the zoom beam expander 202, 2% of the laser beam is input to the laser power controller 5, the output power of the laser beam is measured, and 98% of the laser beam is output to the laser angle adjusting component 3, so that laser welding is performed.
In other embodiments, the input end of the laser power controller 5 may also be connected to the output port of the F-Theta lens, and receive the laser beam emitted from the output port of the F-Theta lens, so as to perform output power measurement of the laser beam.
The laser 1, the shaping and beam expanding assembly 2, the laser angle adjusting assembly 3, the beam focusing assembly 4, and the laser power controller 5 may be mounted on a welding machine or on a specific bracket, so long as the corresponding functions can be realized, and the present invention is not limited thereto.
In the practical application process, the laser beam emitted by the laser 1 is sequentially subjected to beam shaping, zooming and beam expanding, emission angle adjustment and flat field focusing through the shaping and beam expanding assembly 2, the laser angle adjusting assembly 3, the beam focusing assembly 4, the laser power controller 5 and other assemblies, so that the following effects can be generated: 1. the spot of the laser beam can be controlled to be in the micron order; 2. the output laser beam can reach more areas, and welding of welding spots at different positions on the workpiece is completed; 3. the output laser beam power can be ensured to be uniform, and the process requirement of the current chip manufacture on laser welding is met; 4. the welding spot size, output power and irradiation time of the welding spot can be adjusted in real time according to the type of the welding spot and the welding spot area to be welded, so that the welding spot at each position of the workpiece can be welded to reach a higher process level, and the problems of poor contact, BUMP bridging defect and the like caused by welding problems are effectively reduced.
The embodiment of the present specification also provides a laser-assisted bonding apparatus, which includes a table 6, an alignment system 7, and a laser beam adjustment mechanism as described in any of the above.
Wherein, workstation 6 is used for supplying the work piece to place, and the outlet of beam focusing assembly 4 among the laser beam adjustment mechanism sets up with workstation 6 correspondence, and beam focusing assembly 4 is used for exporting the laser beam to workstation 6 to carry out the welding operation to the work piece of placing on workstation 6.
Further, the table 6 is translatable in the first direction, the second direction, and the third direction.
In this embodiment of the present application, the first direction is a direction parallel to the X axis, the second direction is a direction parallel to the Y axis, and the third direction is a direction parallel to the Z axis.
In other embodiments, the first direction may be a direction parallel to the Y-axis or the Z-axis, or a direction at an angle to the X-axis, the Y-axis, and the Z-axis; the second direction may be a direction parallel to the X-axis or the Z-axis, or a direction at an angle to the X-axis, the Y-axis, and the Z-axis; the third direction may be a direction parallel to the X-axis or the Y-axis, or a direction at an angle to the X-axis, the Y-axis, and the Z-axis.
Wherein, the workbench 6 is connected with a driving mechanism 8, and the driving mechanism 8 is an XYZ mobile carrier. By moving the stage in XYZ, translational adjustment of the stage 6 in the X-axis, Y-axis, and Z-axis directions is achieved.
In other embodiments, the drive mechanism 8 may be an XYZ three-degree-of-freedom mechanical arm.
The drive mechanism 8 to which the table 6 is connected is not limited to this, as long as it can perform translational adjustment in the X-axis, Y-axis, and Z-axis directions.
In the practical application process, the workbench 6 is set to be capable of translational adjustment along the X-axis, Y-axis and Z-axis directions, and the workpiece can be adjusted along the X-axis, Y-axis and Z-axis directions through the workbench 6. In the welding process, the workpiece is translated in the directions of the X axis, the Y axis and the Z axis and matched with the laser angle adjusting component 3 in the laser beam adjusting mechanism, so that the laser beam emitted by the laser beam adjusting mechanism can reach the position of a welding spot at any position on the workpiece, and the welding is completed. And the laser beam emitted by the laser beam adjusting mechanism can be subjected to spot size adjustment, output power adjustment and irradiation time adjustment in a certain range, and the laser beam emitted by the laser beam adjusting mechanism can fully meet the requirements of each welding spot on the technological parameters of the laser beam, so that the welding quality can be fully ensured after welding, and the problems of poor contact, BUMP bridging defect and the like caused by welding problems are reduced.
In other embodiments, the worktable 6 may further perform fine adjustment of angles in the directions of the X axis, the Y axis and the Z axis, and in particular, may be implemented by providing a micro-stage at the bottom of the worktable 6.
An alignment system 7 is provided corresponding to the table 6 for detecting an alignment mark on the table 6 and/or an alignment mark on the workpiece to locate an initial position of the workpiece.
In the embodiment of the present application, the alignment system 7 is a camera or a vision sensor, and obtains an alignment mark through an image so as to obtain an initial position of the workpiece.
Further, an alignment mark is provided on the table 6. In the embodiment of the present application, after the workpiece is placed on the table 6, the position of the workpiece with respect to the table 6 is determined. When the alignment system 7 detects the alignment mark of the workbench 6, the current position of the workbench 6 relative to the alignment system 7 can be obtained, the alignment system 7 sends a position signal about the workbench 6 to the controller, the workbench 6 is controlled to move by the controller, the workbench 6 is moved to the initial position, and after the workbench 6 is moved to the initial position, the workpiece placed on the workbench 6 is also moved to the initial position.
In the practical application process, after the workpiece is positioned to the initial position through the movement of the workbench 6, the welding positions of all welding spots to be welded on the workpiece are determined, so that a welding route of laser beam welding can be made from the initial position of the workpiece, all welding spots are sequentially moved to positions where the laser beam can be irradiated according to a preset welding route according to a preset welding sequence, and full-process automatic welding is realized.
In other embodiments, alignment marks may be provided on the workpiece, and the alignment system 7 is used to position the alignment marks on the workpiece, and control the stage 6 to move the workpiece to the initial position, so as to perform the subsequent automatic welding process.
In other embodiments, the model and structure of the table 6 are adapted according to the model of the workpiece, and the table 6 is detachable with respect to the XYZ moving stage so that when the alignment mark is set on the XYZ moving stage, autonomous adaptation can be performed according to the model of the workpiece.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment focuses on differences from other embodiments.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The laser beam adjusting mechanism is characterized by comprising a laser, a shaping beam expanding assembly, a laser angle adjusting assembly and a beam focusing assembly;
the entrance of the shaping beam expanding assembly is arranged corresponding to the exit of the laser, so as to receive the laser beam emitted by the laser and perform beam shaping and zooming beam expanding on the laser beam;
the laser angle adjusting assembly is used for receiving the laser beam emitted by the shaping beam expanding assembly and adjusting the emission angle of the laser beam;
the entrance of the beam focusing assembly is correspondingly arranged with the exit of the laser angle adjusting assembly, and the beam focusing assembly is used for receiving the laser beam emitted by the laser angle adjusting assembly and carrying out flat field focusing on the laser beam.
2. The laser beam adjustment mechanism of claim 1, further comprising a laser power controller;
the input end of the laser power controller is connected with the outlet of the shaping beam expanding component and/or the outlet of the beam focusing component so as to measure the output power of the laser beam;
the output end of the laser power controller is connected with the input end of the laser so as to feed back the output power of the laser beam to the laser.
3. The laser beam adjustment mechanism of claim 1, wherein the laser angle adjustment assembly comprises an X-axis galvanometer and a Y-axis galvanometer;
the X-axis vibrating mirror and the Y-axis vibrating mirror are respectively adjustable in angle in the X-axis direction and the Y-axis direction, and are mutually matched to receive the laser beam emitted by the shaping beam expanding assembly and adjust the emission angle of the laser beam.
4. The laser beam adjustment mechanism of claim 1, wherein the beam focusing assembly comprises an F-Theta lens;
the F-Theta lens is arranged corresponding to the emergent opening of the laser angle adjusting assembly, and can always receive the laser beam emitted by the laser angle adjusting assembly.
5. The laser beam adjustment mechanism of claim 1, wherein the shaping beam expander assembly comprises a beam shaper and a zoom beam expander;
the entrance port of the beam shaper is in butt joint with the exit port of the laser, and the beam shaper is used for receiving the laser beam incident by the laser and performing beam shaping on the laser beam;
the zoom beam expander is used for receiving the laser beam subjected to beam shaping and carrying out zoom beam expansion on the laser beam.
6. A laser assisted bonding apparatus comprising a table and a laser beam adjustment mechanism according to any one of claims 1 to 5;
the workbench is used for placing a workpiece;
the outlet of the beam focusing assembly is arranged corresponding to the workbench, and the beam focusing assembly is used for outputting laser beams to the workbench.
7. The laser assisted bonding apparatus of claim 6, wherein the stage is translatably adjustable in a first direction, a second direction, and a third direction.
8. The laser assisted bonding apparatus of claim 7, further comprising an alignment system for detecting alignment marks on the table and/or alignment marks on a workpiece to locate an initial position of the workpiece.
9. The laser assisted bonding apparatus of claim 8, wherein the alignment system is a camera or vision sensor.
10. The laser assisted bonding apparatus of claim 8, wherein the table is provided with alignment marks;
and when the alignment system detects the alignment mark on the workbench, the workbench and/or the workpiece are/is adjusted to an initial position.
CN202311395147.0A 2023-10-25 2023-10-25 Laser beam adjusting mechanism and laser auxiliary bonding equipment Pending CN117532141A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311395147.0A CN117532141A (en) 2023-10-25 2023-10-25 Laser beam adjusting mechanism and laser auxiliary bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311395147.0A CN117532141A (en) 2023-10-25 2023-10-25 Laser beam adjusting mechanism and laser auxiliary bonding equipment

Publications (1)

Publication Number Publication Date
CN117532141A true CN117532141A (en) 2024-02-09

Family

ID=89794845

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311395147.0A Pending CN117532141A (en) 2023-10-25 2023-10-25 Laser beam adjusting mechanism and laser auxiliary bonding equipment

Country Status (1)

Country Link
CN (1) CN117532141A (en)

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