CN117529068B - PCS liquid cooling system - Google Patents
PCS liquid cooling system Download PDFInfo
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- CN117529068B CN117529068B CN202410018060.XA CN202410018060A CN117529068B CN 117529068 B CN117529068 B CN 117529068B CN 202410018060 A CN202410018060 A CN 202410018060A CN 117529068 B CN117529068 B CN 117529068B
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- 239000007788 liquid Substances 0.000 title claims abstract description 260
- 238000001816 cooling Methods 0.000 title claims abstract description 257
- 239000000110 cooling liquid Substances 0.000 claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 30
- 238000009413 insulation Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000005057 refrigeration Methods 0.000 abstract description 4
- 230000008859 change Effects 0.000 description 3
- 238000004146 energy storage Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- SAPGTCDSBGMXCD-UHFFFAOYSA-N (2-chlorophenyl)-(4-fluorophenyl)-pyrimidin-5-ylmethanol Chemical compound C=1N=CN=CC=1C(C=1C(=CC=CC=1)Cl)(O)C1=CC=C(F)C=C1 SAPGTCDSBGMXCD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20354—Refrigerating circuit comprising a compressor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20372—Cryogenic cooling; Nitrogen liquid cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
Abstract
The invention discloses a PCS liquid cooling system, which comprises a liquid cooling unit and a PCS, wherein the liquid cooling unit is communicated with the PCS through a liquid cooling pipeline, the liquid cooling unit at least comprises a refrigerating system, a flow system and a control system, the PCS at least comprises a heat exchange plate, a circulating fan, a liquid cooling plate and a temperature sensor, the circulating fan is arranged on one side of the heat exchange plate, the heat exchange plate is communicated with the liquid cooling plate through the liquid cooling pipeline, an IGBT is tightly adhered to the surface of the liquid cooling plate, and the control system is electrically connected with the refrigerating system, the flow system, the circulating fan and the temperature sensor. The invention can collect the temperature of each node in the circulation and the flow of the cooling liquid in the liquid cooling unit, and the liquid cooling system achieves an efficient and energy-saving heat exchange effect by controlling the refrigeration temperature and flow of the cooling liquid and the rotating speed of the circulating fan.
Description
Technical Field
The invention relates to the technical field of energy storage, in particular to a PCS liquid cooling system.
Background
The PCS is a bi-directional energy storage converter, and functions to convert alternating current into direct current and direct current into alternating current. The PCS cooling method mainly comprises forced air cooling and liquid cooling, compared with air cooling, the liquid cooling has the advantages of fast cooling, low noise, low energy consumption and the like, but in the existing PCS cooling technology, mainly cooling liquid exchanges heat with a power device IGBT with larger heating value through a runner, other electric elements in the PCS exchange heat in a heat radiation mode, and the normal working temperature of the IGBT is higher, the heat exchange efficiency of the heat radiation mode is lower, the temperature except the IGBT in a conventional liquid cooling system is limited in a safety range, the temperature born by other electric elements is relatively higher, the integral failure rate of the PCS is greatly improved, and the service life is shortened. Therefore, how to comprehensively improve the heat exchange efficiency of each component in the PCS is an urgent problem to be solved in the field of energy storage equipment at present.
Disclosure of Invention
In view of this, the invention provides a PCS liquid cooling system, which can collect the temperature of each node in the circulation and the flow of the cooling liquid in the liquid cooling unit, and can achieve an efficient and energy-saving heat exchange effect by controlling the cooling temperature and flow of the cooling liquid and the rotating speed of the circulating fan.
The PCS liquid cooling system comprises a liquid cooling unit and a PCS, wherein the liquid cooling unit is communicated with the PCS through a liquid cooling pipeline, the liquid cooling unit at least comprises a refrigerating system, a flow system and a control system, the PCS at least comprises a heat exchange plate, a circulating fan, a liquid cooling plate and a temperature sensor, the circulating fan is arranged on one side of the heat exchange plate, the heat exchange plate is communicated with the liquid cooling plate through the liquid cooling pipeline, an IGBT is tightly adhered to the surface of the liquid cooling plate, and the control system is electrically connected with the refrigerating system, the flow system, the circulating fan and the temperature sensor.
Further, the liquid cooling pipeline includes low temperature liquid cooling pipeline, well temperature liquid cooling pipeline and high temperature liquid cooling pipeline, low temperature liquid cooling pipeline with high temperature liquid cooling pipeline is located the liquid cooling unit with between the PCS, just low temperature liquid cooling pipeline with the periphery of high temperature liquid cooling pipeline all wraps up has the insulating layer, well temperature liquid cooling pipeline sets up the inside of PCS, the intercommunication the heat exchanger plate with the liquid cooling plate.
Further, a water outlet and a water inlet are formed in the liquid cooling unit, and the water outlet and the water inlet are formed in the same side of the liquid cooling unit; one end of the low-temperature liquid cooling pipeline is communicated with the heat exchange plate, the other end of the low-temperature liquid cooling pipeline is communicated with the water outlet on the liquid cooling unit, one end of the medium-temperature liquid cooling pipeline is communicated with the heat exchange plate, the other end of the medium-temperature liquid cooling pipeline is communicated with the liquid cooling plate, one end of the high-temperature liquid cooling pipeline is communicated with the liquid cooling plate, and the other end of the high-temperature liquid cooling pipeline is communicated with the water inlet on the liquid cooling unit.
Further, the heat exchange plate comprises a first transverse pipe, a second transverse pipe and a plurality of heat exchange calandria, wherein the first transverse pipe is parallel to the second transverse pipe, a distance is arranged between the first transverse pipe and the second transverse pipe, the heat exchange calandria are vertically arranged between the first transverse pipe and the second transverse pipe, two ends of each heat exchange calandria are respectively communicated with the first transverse pipe and the second transverse pipe, and the adjacent heat exchange calandria are parallel and have a distance.
Further, one end of the low-temperature liquid cooling pipeline is communicated with the water outlet, the other end of the low-temperature liquid cooling pipeline is communicated with one end, close to the liquid cooling unit, of the first transverse pipe, and one end, far away from the liquid cooling unit, of the first transverse pipe is arranged in a closed mode; one end of the medium-temperature liquid cooling pipeline is communicated with one end, far away from the liquid cooling unit, of the second transverse pipe, the other end of the medium-temperature liquid cooling pipeline is communicated with the liquid cooling plate, and one end, close to the liquid cooling unit, of the second transverse pipe is closed; one end of the high-temperature liquid cooling pipeline is communicated with the liquid cooling plate, and the other end of the high-temperature liquid cooling pipeline is communicated with the water inlet.
Further, the temperature sensor includes a first temperature sensor, a second temperature sensor, a third temperature sensor, a fourth temperature sensor, and a fifth temperature sensor, which are all disposed in the PCS cavity and distributed at different positions in the PCS cavity.
Further, the first temperature sensor is arranged at the position, connected with the low-temperature liquid cooling pipeline, in the first transverse pipe, and the acquired temperature is recorded as T1; the second temperature sensor is arranged at the position, connected with the medium-temperature liquid cooling pipeline, in the liquid cooling plate, and the acquired temperature is recorded as T2; the third temperature sensor is arranged at the position, connected with the high-temperature liquid cooling pipeline, in the liquid cooling plate, and the acquired temperature is recorded as T3; the fourth temperature sensor is arranged in the liquid cooling plate and is positioned at the bottom of the liquid cooling plate, and the acquired temperature is recorded as T4; the fifth temperature sensor is arranged between the heat exchange plate and the circulating fan, and the collected temperature is recorded as T5.
Further, the control system controls the circulating fan, the flow system and the refrigerating system according to the temperature acquired by the temperature sensor, and when the temperature T4 is more than 50 ℃, the refrigerating system in the liquid cooling unit is started; when the temperature T4 is less than or equal to 40 ℃, closing a refrigerating system in the liquid cooling unit; when T5 is more than 45 ℃, starting a circulating fan in the PCS; and when T5 is less than or equal to 40 ℃, turning off a circulating fan in the PCS.
Further, half of the maximum rotation speed of the circulation fan is denoted as V1, and in a state where the circulation fan is turned on, the rotation speed of the circulation fan is automatically operated at a rotation speed of V1 times S1, s1= [ (T5-T2)/(T2-T1) ]×100%, and S1 is 10% or more and 200% or less.
Further, the half of the maximum flow rate of the cooling liquid in the refrigerating system is recorded as Q1, and in the starting state of the refrigerating system, the flow rate of the cooling liquid in the refrigerating system is automatically set at the Q1 operation flow rate which is S2 times, S2= [ (T4-T3)/(T3-T2) ]multipliedby 100%, and S2 is more than or equal to 10% and less than or equal to 200%.
Compared with the prior art, the invention has the following beneficial technical effects:
the PCS liquid cooling system provided by the invention is mainly characterized in that low-temperature cooling liquid flowing out of a liquid cooling unit sequentially passes through a heat exchange plate and a liquid cooling plate, the cooling liquid in the heat exchange plate is matched with a circulating fan to reduce the internal ring temperature of the PCS, the IGBT exchanges heat with the cooling liquid in the liquid cooling plate in a contact manner to reduce the temperature, then the high-temperature cooling liquid flows back to the liquid cooling unit, and the cooling liquid enters the next cycle after being cooled by a compressor; the system can collect the temperature of each node in the circulation and the flow of the cooling liquid in the liquid cooling unit, and the liquid cooling system achieves an efficient and energy-saving heat exchange effect by controlling the refrigerating temperature and flow of the cooling liquid and the rotating speed of an internal circulation fan.
Drawings
Fig. 1 is a schematic structural diagram of a PCS liquid cooling system according to the present invention.
Wherein: 10-cooling units; 10 a-water outlet; 10 b-water inlet; 11-a refrigeration system; 12-flow system; 13-a control system; 20-PCS; 21-a heat exchange plate; 211-a first transverse tube; 212-a second transverse tube; 213-heat exchange calandria; 22-a circulation fan; 23-liquid cooling plate; 30-liquid cooling pipeline; 31-a low temperature liquid cooling pipeline; 32-medium temperature liquid cooling pipeline; 33-a high temperature liquid cooling pipeline; 40-a temperature sensor; 41-a first temperature sensor; 42-a second temperature sensor; 43-a third temperature sensor; 44-a fourth temperature sensor; 45-fifth temperature sensor.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that the orientation or positional relationship indicated in the present description is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description, and does not indicate or imply that the pieces or elements to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1, the PCS liquid cooling system provided by the invention includes a liquid cooling unit 10 and a PCS 20, the liquid cooling unit 10 is communicated with the PCS 20 through a liquid cooling pipeline 30, the liquid cooling unit 10 at least includes a refrigerating system 11, a flow system 12 and a control system 13, the PCS 20 at least includes a heat exchange plate 21, a circulating fan 22, a liquid cooling plate 23 and a temperature sensor 40, the circulating fan 22 is arranged at one side of the heat exchange plate 21, the heat exchange plate 21 is communicated with the liquid cooling plate 23 through the liquid cooling pipeline 30, an IGBT (insulated gate bipolar transistor) is closely attached to the surface of the liquid cooling plate 23, and the control system 13 is electrically connected with the refrigerating system 11, the flow system 12, the circulating fan 22 and the temperature sensor 40. The PCS liquid cooling system provided by the invention can collect the temperature of each node in the circulation and the flow of the cooling liquid in the liquid cooling unit 10, and the liquid cooling system achieves an efficient and energy-saving heat exchange effect by controlling the refrigerating temperature and flow of the cooling liquid and the rotating speed of the internal circulation fan 22.
Specifically, the refrigeration system 11 is responsible for refrigerating the high temperature liquid flowing into the liquid cooling unit 10 to a low temperature liquid, the flow system 12 can detect and control the flow of the liquid out of the liquid cooling unit 10, and the control system 13 can be programmed to control the start and stop of the refrigeration system 11, the flow system 12 and the circulation fan 22 according to the program. In one cycle, the low-temperature cooling liquid flowing out of the liquid cooling unit 10 sequentially passes through the heat exchange plate 21 and the liquid cooling plate 23, the cooling liquid in the heat exchange plate 21 is matched with the circulating fan 22 to reduce the internal ring temperature of the PCS 20, the IGBT exchanges heat with the cooling liquid in the liquid cooling plate 23 in a contact mode to reduce the temperature, then the high-temperature cooling liquid flows back to the liquid cooling unit 10, and the cooling liquid enters the next cycle after being cooled by the compressor.
Further, the liquid cooling pipe 30 includes a low temperature liquid cooling pipe 31, a medium temperature liquid cooling pipe 32, and a high temperature liquid cooling pipe 33; the low-temperature liquid cooling pipeline 31 and the high-temperature liquid cooling pipeline 33 are positioned between the liquid cooling unit 10 and the PCS 20, and the peripheries of the low-temperature liquid cooling pipeline 31 and the high-temperature liquid cooling pipeline 33 are wrapped with heat insulation layers, so that the heat insulation layers can ensure that the temperature of cooling liquid in the low-temperature liquid cooling pipeline 31 and the high-temperature liquid cooling pipeline 33 is not influenced by external ring temperature; the medium-temperature liquid cooling pipeline 32 is arranged in the PCS 20 and is communicated with the heat exchange plate 21 and the liquid cooling plate 23;
specifically, the liquid cooling unit 10 is provided with a water outlet 10a and a water inlet 10b, and the water outlet 10a and the water inlet 10b are arranged on the same side of the liquid cooling unit 10; one end of the low-temperature liquid cooling pipeline 31 is communicated with the heat exchange plate 21, the other end of the low-temperature liquid cooling pipeline 31 is communicated with the water outlet 10a on the liquid cooling unit 10, low-temperature cooling liquid in the liquid cooling unit 10 flows out through the water outlet 10a and then enters the heat exchange plate 21 through the low-temperature liquid cooling pipeline 31, and the heat exchange plate 21 is matched with the circulating fan 22 to exchange heat with the ambient temperature in the PCS 20, so that the ambient temperature in the PCS 20 is reduced; one end of the medium-temperature liquid cooling pipeline 32 is communicated with the heat exchange plate 21, the other end of the medium-temperature liquid cooling pipeline is communicated with the liquid cooling plate 23, and cooling liquid in the heat exchange plate 21 subjected to heat exchange with the environment temperature in the PCS 20 enters the liquid cooling plate 23 through the medium-temperature liquid cooling pipeline 32; one end of the high-temperature liquid cooling pipeline 33 is communicated with the liquid cooling plate 23, the other end of the high-temperature liquid cooling pipeline is communicated with the water inlet 10b on the liquid cooling unit 10, and cooling liquid in the liquid cooling plate 23 sequentially returns to the liquid cooling unit 10 through the high-temperature liquid cooling pipeline 33 and the water inlet 10b after contacting and exchanging heat with the IGBT, so that the next cycle is performed.
Further, the heat exchange plate 21 includes a first horizontal tube 211, a second horizontal tube 212, and a plurality of heat exchange tubes 213, the first horizontal tube 211 and the second horizontal tube 212 are arranged in parallel, a space is provided between the first horizontal tube 211 and the second horizontal tube 212, the plurality of heat exchange tubes 213 are vertically arranged between the first horizontal tube 211 and the second horizontal tube 212, two ends of each heat exchange tube 213 are respectively communicated with the first horizontal tube 211 and the second horizontal tube 212, adjacent heat exchange tubes 213 are parallel and have a space, and the heat exchange tubes 213 are copper heat exchange tubes; the circulating fan 22 is arranged on one side of the heat exchange calandria 213 and is arranged in parallel with the heat exchange calandria 213, so that high-temperature air in the PCS 20 cavity can be conveniently blown to the heat exchange calandria 213 for heat exchange; the first transverse tube 211 is used for introducing the cooling liquid in the liquid cooling unit 10 into the heat exchange tube 213, the circulating fan 22 blows the high-temperature air in the cavity of the PCS 20 to the heat exchange tube 213 to exchange heat with the low-temperature liquid in the heat exchange tube 213, the low-temperature air after heat exchange is left in the cavity of the PCS 20, and the second transverse tube 212 is used for leading the cooling liquid after heat exchange in the heat exchange tube 213 into the liquid cooling plate 23. The number of heat exchange tubes 213 is not limited, and may be adjusted according to the temperature in the cavity of the PCS 20.
Specifically, one end of the low-temperature liquid cooling pipeline 31 is communicated with the water outlet 10a, the other end of the low-temperature liquid cooling pipeline is communicated with one end, close to the liquid cooling unit 10, of the first transverse pipe 211, and one end, far away from the liquid cooling unit 10, of the first transverse pipe 211 is arranged in a closed manner; one end of the medium-temperature liquid cooling pipeline 32 is communicated with one end, far away from the liquid cooling unit 10, of the second transverse pipe 212, the other end of the medium-temperature liquid cooling pipeline is communicated with the liquid cooling plate 23, and one end, close to the liquid cooling unit 10, of the second transverse pipe 212 is closed; one end of the high-temperature liquid cooling pipe 33 communicates with the liquid cooling plate 23, and the other end communicates with the water inlet 10 b.
Further, the PCS liquid cooling system provided by the invention is provided with a temperature sensor 40, the temperature sensor 40 is electrically connected with a control system 13, and the control system 13 controls the refrigerating system 11, the flow system 12 and the circulating fan 22 according to the temperature signal transmitted by the temperature sensor 40; the temperature sensor 40 includes a first temperature sensor 41, a second temperature sensor 42, a third temperature sensor 43, a fourth temperature sensor 44, and a fifth temperature sensor 45, where the first temperature sensor 41, the second temperature sensor 42, the third temperature sensor 43, the fourth temperature sensor 44, and the fifth temperature sensor 45 are all disposed in the PCS 20 cavity and distributed at different positions in the PCS 20 cavity for acquiring the temperatures of the nodes in the cycle; since the cooling liquid in the liquid cooling unit 10 enters the PCS 20 and generates a temperature change when passing through the heat exchange plate 21 and the circulating fan 22 and generates a temperature change when exchanging heat with the IGBTs in the liquid cooling plate 23 when passing through the liquid cooling plate 23, the invention is provided with a temperature sensor 40 at the inlet and the outlet of the heat exchange plate 21 (the inlet of the liquid cooling plate 23) and between the heat exchange plate 21 and the circulating fan 22, at the outlet of the liquid cooling plate 23 and in the matrix of the liquid cooling plate 23 respectively for collecting the temperature change; specifically, the first temperature sensor 41 is disposed at a position connected to the low-temperature liquid cooling pipeline 31 in the first transverse tube 211, that is, at the inlet of the heat exchange plate 21, for collecting the temperature before the cooling liquid exchanges heat, denoted by T1; the second temperature sensor 42 is arranged at the position of the liquid cooling plate 23 connected with the medium-temperature liquid cooling pipeline 32, namely, at the outlet of the heat exchange plate 21 or at the inlet of the liquid cooling plate 23, and is used for collecting the temperature of the cooling liquid after heat exchange with the heat exchange plate 21 and is recorded as T2; the third temperature sensor 43 is disposed at a position of the liquid cooling plate 23 connected to the high-temperature liquid cooling pipeline 33, that is, at an outlet of the liquid cooling plate 23, and is used for collecting the temperature of the cooling liquid after heat exchange with the liquid cooling plate 23, and is denoted as T3; the fourth temperature sensor 44 is arranged in the liquid cooling plate 23 and is positioned at the bottom of the liquid cooling plate 23, and is used for collecting the temperature of the substrate of the liquid cooling plate 23, namely the temperature closest to the IGBT of the power device in the PCS 20, and is marked as T4; a fifth temperature sensor 45 is provided between the heat exchange plate 21 and the circulation fan 22 for sensing the temperature of the air blown into the PCS cavity at the heat exchange gauntlet 213 via the circulation fan 22, denoted T5. The use of the first temperature sensor 41, the second temperature sensor 42, and the fifth temperature sensor 45 enables effective use of the control of the ambient temperature within the PCS 20 by the circulation fan 22 and the heat exchange plate 21; the use of the second temperature sensor 42, the third temperature sensor 43, and the fourth temperature sensor 44 can control the temperature of the refrigerant liquid supplied from the liquid cooling unit 10.
Further, the working method of the PCS liquid cooling system provided by the invention specifically comprises the following steps:
in one cycle, firstly, low-temperature liquid flowing out of a water outlet 10a on a liquid cooling unit 10 enters a first transverse tube 211 in a heat exchange plate 21 through a low-temperature liquid cooling pipeline 31, enters a copper heat exchange calandria 213 through the first transverse tube 211, high-temperature air in a PCS 20 cavity is blown to the heat exchange calandria 213 to exchange heat with the low-temperature liquid in the PCS 20 cavity, the low-temperature air after heat exchange stays in the PCS 20 cavity, the low-temperature liquid after heat exchange flows out of the heat exchange plate 21 through a second transverse tube 212 and then flows into a liquid cooling plate 23 through a medium-temperature liquid cooling pipeline 32, a flow channel is arranged in the liquid cooling plate 23, the low-temperature liquid exchanges heat through the flow channel, the liquid cooling plate 23 is in surface mounting and is closely attached to a power device IGBT of the PCS 20, a large amount of heat is generated in the operation of the IGBT through contact with the liquid cooling plate 23, the heat is transferred to the low-temperature liquid in the flow channel through the liquid cooling plate 23, the high-temperature liquid is sequentially discharged out of the PCS 20 through the high-temperature liquid cooling pipeline 33 and the water inlet 10b, and enters the liquid cooling unit 10, and then enters the next cycle after passing through the liquid cooling system 11 in the liquid cooling unit 10;
in the circulation process, the control system 13 controls the internal circulation fan 22 and the flow system 12 according to the temperature acquired by the temperature sensor 40, and starts the refrigerating system 11 in the liquid cooling unit 10 to refrigerate when the temperature T4 is more than 50 ℃ in the design according to the optimal operation temperature range of the power device IGBT in the PCS 20 and the optimal operation temperature range of other electric elements; when the temperature T4 is less than or equal to 40 ℃, the refrigerating system 11 in the liquid cooling unit 10 is turned off; when T5 > 45 ℃, the circulation fan 22 in the PCS 20 is started; when T5 is less than or equal to 40 ℃, the circulating fan 22 in the PCS 20 is turned off; half of the maximum rotation speed of the circulation fan 22 is denoted as V1, and in the state that the circulation fan 22 is turned on, the rotation speed of the circulation fan 22 automatically runs at the rotation speed of V1 which is S1 times, S1= [ (T5-T2)/(T2-T1) ]x100%, and S1 is more than or equal to 10% and less than or equal to 200%; half of the maximum flow rate of the cooling liquid in the refrigerating system 11 is recorded as Q1, and in the state that the refrigerating system 11 is opened, the cooling liquid flow rate of the refrigerating system 11 is automatically set at the Q1 operation flow rate which is S2 times, S2= [ (T4-T3)/(T3-T2) ]multipliedby 100%, and S2 is more than or equal to 10% and less than or equal to 200%.
As can be seen from the above description, in the PCS liquid cooling system provided by the present invention, the low-temperature cooling liquid flowing out of the liquid cooling unit 10 passes through the heat exchange plate 21 and the liquid cooling plate 23 in sequence, the cooling liquid in the heat exchange plate 21 cooperates with the circulating fan 22 to reduce the internal ring temperature of the PCS 20, the IGBT performs heat exchange and temperature reduction with the cooling liquid in the liquid cooling plate 23 in a contact manner, and then the high-temperature cooling liquid flows back to the liquid cooling unit 10, and enters the next cycle after being cooled by the compressor; the system can collect the temperature of each node in the circulation and the flow of the cooling liquid in the liquid cooling unit 10, and the liquid cooling system achieves an efficient and energy-saving heat exchange effect by controlling the refrigerating temperature and flow of the cooling liquid and the rotating speed of the internal circulation fan 22.
The present invention is not limited to the above embodiments, but is capable of modification and variation in all aspects, including those of ordinary skill in the art, without departing from the spirit and scope of the present invention.
Claims (8)
1. A PCS liquid cooling system, characterized in that: the intelligent cooling system comprises a liquid cooling unit (10) and a PCS (20), wherein the liquid cooling unit (10) is communicated with the PCS (20) through a liquid cooling pipeline (30), the liquid cooling unit (10) at least comprises a refrigerating system (11), a flow system (12) and a control system (13), the PCS (20) at least comprises a heat exchange plate (21), a circulating fan (22), a liquid cooling plate (23) and a temperature sensor (40), the circulating fan (22) is arranged on one side of the heat exchange plate (21), the heat exchange plate (21) is communicated with the liquid cooling plate (23) through the liquid cooling pipeline (30), the surface of the liquid cooling plate (23) is tightly adhered with an IGBT, and the control system (13) is electrically connected with the refrigerating system (11), the flow system (12), the circulating fan (22) and the temperature sensor (40). The liquid cooling pipeline (30) comprises a low-temperature liquid cooling pipeline (31), a medium-temperature liquid cooling pipeline (32) and a high-temperature liquid cooling pipeline (33); the heat exchange plate (21) comprises a first transverse tube (211), a second transverse tube (212) and a plurality of heat exchange calandria (213); the temperature sensor (40) comprises a first temperature sensor (41), a second temperature sensor (42), a third temperature sensor (43), a fourth temperature sensor (44) and a fifth temperature sensor (45), the first temperature sensor (41) is arranged at the position, connected with the low-temperature liquid cooling pipeline (31), in the first transverse pipe (211), and the acquired temperature is recorded as T1; the second temperature sensor (42) is arranged at a position connected with the medium-temperature liquid cooling pipeline (32) in the liquid cooling plate (23), and the acquired temperature is recorded as T2; the third temperature sensor (43) is arranged at the position of the liquid cooling plate (23) connected with the high-temperature liquid cooling pipeline (33), and the acquired temperature is recorded as T3; the fourth temperature sensor (44) is arranged in the liquid cooling plate (23) and is positioned at the bottom of the liquid cooling plate (23), and the acquired temperature is recorded as T4; the fifth temperature sensor (45) is arranged between the heat exchange plate (21) and the circulating fan (22), and the acquired temperature is recorded as T5; the control system (13) controls the circulating fan (22), the flow system (12) and the refrigerating system (11) according to the temperature acquired by the temperature sensor (40), and when the temperature T4 is more than 50 ℃, the refrigerating system (11) in the liquid cooling unit (10) is started; when the temperature T4 is less than or equal to 40 ℃, the refrigerating system (11) in the liquid cooling unit (10) is closed; when T5 > 45 ℃, the circulating fan (22) in the PCS (20) is started; when T5 is less than or equal to 40 ℃, the circulating fan (22) in the PCS (20) is turned off.
2. The PCS liquid cooling system of claim 1 wherein: the low-temperature liquid cooling pipeline (31) and the high-temperature liquid cooling pipeline (33) are located between the liquid cooling unit (10) and the PCS (20), the periphery of the low-temperature liquid cooling pipeline (31) and the periphery of the high-temperature liquid cooling pipeline (33) are wrapped with heat insulation layers, and the medium-temperature liquid cooling pipeline (32) is arranged in the PCS (20) and is communicated with the heat exchange plate (21) and the liquid cooling plate (23).
3. The PCS liquid cooling system of claim 2 wherein: a water outlet (10 a) and a water inlet (10 b) are arranged on the liquid cooling unit (10), and the water outlet (10 a) and the water inlet (10 b) are arranged on the same side of the liquid cooling unit (10); one end of the low-temperature liquid cooling pipeline (31) is communicated with the heat exchange plate (21), the other end of the low-temperature liquid cooling pipeline is communicated with the water outlet (10 a) on the liquid cooling unit (10), one end of the medium-temperature liquid cooling pipeline (32) is communicated with the heat exchange plate (21), the other end of the medium-temperature liquid cooling pipeline is communicated with the liquid cooling plate (23), one end of the high-temperature liquid cooling pipeline (33) is communicated with the liquid cooling plate (23), and the other end of the high-temperature liquid cooling pipeline is communicated with the water inlet (10 b) on the liquid cooling unit (10).
4. The PCS liquid cooling system of claim 3 wherein: the heat exchange tube comprises a first transverse tube (211) and a second transverse tube (212), wherein the first transverse tube (211) and the second transverse tube (212) are arranged in parallel, a distance is reserved between the first transverse tube (211) and the second transverse tube (212), a plurality of heat exchange tube banks (213) are vertically arranged between the first transverse tube (211) and the second transverse tube (212), two ends of each heat exchange tube bank (213) are respectively communicated with the first transverse tube (211) and the second transverse tube (212), and adjacent heat exchange tube banks (213) are parallel and have a distance.
5. The PCS liquid cooling system of claim 4 wherein: one end of the low-temperature liquid cooling pipeline (31) is communicated with the water outlet (10 a), the other end of the low-temperature liquid cooling pipeline is communicated with one end, close to the liquid cooling unit (10), of the first transverse pipe (211), and one end, far away from the liquid cooling unit (10), of the first transverse pipe (211) is arranged in a closed mode; one end of the medium-temperature liquid cooling pipeline (32) is communicated with one end, far away from the liquid cooling unit (10), of the second transverse pipe (212), the other end of the medium-temperature liquid cooling pipeline is communicated with the liquid cooling plate (23), and one end, close to the liquid cooling unit (10), of the second transverse pipe (212) is arranged in a closed mode; one end of the high-temperature liquid cooling pipeline (33) is communicated with the liquid cooling plate (23), and the other end of the high-temperature liquid cooling pipeline is communicated with the water inlet (10 b).
6. The PCS liquid cooling system of claim 4 wherein: the first temperature sensor (41), the second temperature sensor (42), the third temperature sensor (43), the fourth temperature sensor (44), and the fifth temperature sensor (45) are all disposed within the PCS (20) cavity and distributed at different locations within the PCS (20) cavity.
7. The PCS liquid cooling system of claim 1 wherein: and (3) recording half of the maximum rotation speed of the circulating fan (22) as V1, wherein the rotation speed of the circulating fan (22) automatically runs at the rotation speed of V1 which is S1 times when the circulating fan (22) is in an on state, and S1 is more than or equal to 10 percent and less than or equal to 200 percent, wherein the ratio of S1 to [ (T5-T2)/(T2-T1) ]multipliedby 100 percent.
8. The PCS liquid cooling system of claim 1 wherein: and (3) recording half of the maximum flow of the cooling liquid in the refrigerating system (11) as Q1, wherein the cooling liquid flow of the refrigerating system (11) is automatically set at the Q1 operation flow which is S2 times, S2= [ (T4-T3)/(T3-T2) ]multipliedby 100%, and S2 is more than or equal to 10% and less than or equal to 200% in the state that the refrigerating system (11) is started.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208317253U (en) * | 2018-06-26 | 2019-01-01 | 深圳市汇川技术股份有限公司 | A kind of frequency converter control cabinet |
| CN208316557U (en) * | 2018-06-28 | 2019-01-01 | 深圳市汇川技术股份有限公司 | A kind of radiating structure of frequency converter |
| CN114867306A (en) * | 2022-05-09 | 2022-08-05 | 中网电(北京)节能科技有限公司 | 5G base station room energy-saving liquid cooling system taking nanofluid as medium |
| CN116404309A (en) * | 2023-06-08 | 2023-07-07 | 深圳市首航新能源股份有限公司 | Method for preventing battery compartment from condensation, cooling system and energy storage system |
| CN116437639A (en) * | 2023-04-21 | 2023-07-14 | 中国移动通信集团设计院有限公司 | Liquid cooling system, liquid cooling cabinet, control method, electronic equipment and storage medium |
| CN117331387A (en) * | 2023-07-31 | 2024-01-02 | 浙江南都能源科技有限公司 | Temperature control method of liquid cooling energy storage unit |
-
2024
- 2024-01-05 CN CN202410018060.XA patent/CN117529068B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208317253U (en) * | 2018-06-26 | 2019-01-01 | 深圳市汇川技术股份有限公司 | A kind of frequency converter control cabinet |
| CN208316557U (en) * | 2018-06-28 | 2019-01-01 | 深圳市汇川技术股份有限公司 | A kind of radiating structure of frequency converter |
| CN114867306A (en) * | 2022-05-09 | 2022-08-05 | 中网电(北京)节能科技有限公司 | 5G base station room energy-saving liquid cooling system taking nanofluid as medium |
| CN116437639A (en) * | 2023-04-21 | 2023-07-14 | 中国移动通信集团设计院有限公司 | Liquid cooling system, liquid cooling cabinet, control method, electronic equipment and storage medium |
| CN116404309A (en) * | 2023-06-08 | 2023-07-07 | 深圳市首航新能源股份有限公司 | Method for preventing battery compartment from condensation, cooling system and energy storage system |
| CN117331387A (en) * | 2023-07-31 | 2024-01-02 | 浙江南都能源科技有限公司 | Temperature control method of liquid cooling energy storage unit |
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