CN117524970A - Stop gear is used in semiconductor chip processing - Google Patents
Stop gear is used in semiconductor chip processing Download PDFInfo
- Publication number
- CN117524970A CN117524970A CN202311761324.2A CN202311761324A CN117524970A CN 117524970 A CN117524970 A CN 117524970A CN 202311761324 A CN202311761324 A CN 202311761324A CN 117524970 A CN117524970 A CN 117524970A
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- Prior art keywords
- plate
- rod
- semiconductor chip
- friction
- fixed
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- Pending
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 113
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 238000004140 cleaning Methods 0.000 claims description 38
- 238000007790 scraping Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 10
- 239000000428 dust Substances 0.000 claims description 10
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 230000003139 buffering effect Effects 0.000 claims 1
- 230000002457 bidirectional effect Effects 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 24
- 239000012535 impurity Substances 0.000 description 18
- 229910052742 iron Inorganic materials 0.000 description 12
- 230000006378 damage Effects 0.000 description 6
- 230000001012 protector Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 206010024796 Logorrhoea Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a limiting mechanism for processing a semiconductor chip, and relates to the technical field of limiting mechanisms for processing semiconductor chips. The invention comprises a bottom plate, wherein an operation table is fixed at the top of the bottom plate through supporting legs, a bidirectional screw is rotatably arranged at the top of the operation table, clamping plates are connected to the left side and the right side of the outer wall of the bidirectional screw in a threaded manner, a buffer device is arranged above the operation table and comprises a fixing plate, a sliding rod and a pressing plate, the sliding rod penetrates through and is slidably arranged on one side of the clamping plate far away from the center of the operation table, and the fixing plate is fixed on one side of the sliding rod far away from the center of the operation table. According to the invention, through the arrangement of the buffer device, the clamping plate, the pressing plate and the fixing plate are matched, so that the force of the pressing plate touching the semiconductor chip can be buffered by the corresponding spring of the fixing plate, and the problem that the edge of the semiconductor chip is damaged due to direct contact between the semiconductor chip and the clamping plate is avoided.
Description
Technical Field
The invention relates to the technical field of limiting mechanisms for processing semiconductor chips, in particular to a limiting mechanism for processing semiconductor chips.
Background
Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. A semiconductor refers to a material with controllable conductivity ranging from an insulator to a conductor. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, etc., and semiconductor chips can shift positions during processing, thereby causing processing errors.
Patent publication No. CN210325748U discloses a fixing mechanism for processing a semiconductor chip, which comprises a bottom plate, a fixing mechanism and a limiting device; a bottom plate: the bottom plate is a solid flat plate, two L-shaped sliding rails are fixedly arranged on the left side and the right side of the upper surface of the bottom plate respectively, short arms of the two sliding rails correspond to each other, the two sliding rails are connected with the left side surface and the right side surface of the sliding table in a slotting sliding manner respectively, and a slotting is arranged in the middle of the upper surface of the sliding table; the fixing mechanism comprises: the fixing mechanism comprises a rotating shaft, an upper cover, a pressing plate and a spring, wherein the upper cover is a U-shaped cover, a U-shaped groove of the upper cover is downward, the left side of the lower surface of the left side wall of the upper cover is rotationally connected with the left side of the upper surface of the sliding table through the rotating shaft, the four sides of the semiconductor chip are fixed through a locating plate, so that the position of the semiconductor chip is prevented from shifting during processing, the fixing mechanism can compress the side edge of the semiconductor chip, and the chip is prevented from being lifted during processing to cause chip shifting.
However, the conventional limit mechanism for semiconductor chip processing has the following problems: the semiconductor chip processing equipment uses the clamping plate to clamp the semiconductor chip, which can easily cause the damage of the edge of the semiconductor chip, so we propose a limit mechanism for the semiconductor chip processing.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a limiting mechanism for processing a semiconductor chip, which solves the problems in the prior art.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a stop gear for semiconductor chip processing includes the bottom plate, the bottom plate top is fixed with the operation panel through the supporting leg, the top of operation panel rotates installs bi-directional screw rod, the equal threaded connection in outer wall left side and the right side of bi-directional screw rod has splint, the operation panel top is provided with buffer, buffer is including fixed plate, slide bar, clamp plate, the slide bar runs through and slidable mounting splint keep away from one side at the operation panel center, the fixed plate is fixed in one side that the slide bar kept away from the operation panel center, be equipped with the spring between one side that fixed plate and clamp plate kept away from the operation panel center, the clamp plate is fixed in one side that the slide bar is close to the operation panel center, one side that the clamp plate kept away from the clamp plate is rubber material setting, leave five centimetres clearance between clamp plate and the clamp plate, the clamp plate drives clamp plate and semiconductor chip's edge contact, under the spring force effect that the fixed plate corresponds the spring can cushion the clamp plate to the force that the semiconductor chip touched to avoid semiconductor chip direct contact, lead to the semiconductor chip edge receives the problem of damage, the clamp plate setting of easy to be soft contact with semiconductor chip, when the soft contact with the semiconductor chip has avoided the soft contact quality to have avoided the semiconductor chip to touch.
According to the technical scheme, buffer still includes hose, gas outlet, gasbag, the outer wall at the clamp plate is fixed to the gasbag, gas outlet is fixed in the clamp plate and is kept away from gasbag one end outer wall department, through the hose connection between the top of gasbag and the top of gas outlet the gas outlet sets up the top at the clamp plate, the gas outlet department of gas outlet is provided with the dust screen, and when the clamp plate moved to the direction of splint, the clamp plate was extruded the gasbag work with splint, and the gas that the gasbag was extruded out exports the gas outlet blowout from the hose, and the blowout gas makes things such as garrulous miscellaneous iron fillings clear up on the semiconductor chip, thereby makes the semiconductor chip cleaner, is provided with the dust screen on the gas outlet, and the dust screen can block the impurity such as inhale iron fillings when breathing in to the gas outlet, makes the gasbag clear up impurity such as these iron fillings debris can not blowout next time.
According to the technical scheme, the clamping injury prevention device is arranged on one side of the clamping plate and comprises the hinged plate, the friction rod and the friction plate, the friction rod is connected to one side of the clamping plate in a sliding mode, the hinged plate is hinged between the front face of the friction rod and the front face of the pressing plate, the friction plate is fixed to the side face of the bottom plate, a five-centimeter gap is reserved between the bottom of the friction rod and the top of the friction plate, the bottom of the friction rod and the top of the friction plate are rough surfaces, when the pressing plate moves towards the clamping plate, the pressing plate pushes the hinged plate to drive the friction rod to move downwards, the friction rod drives the L-shaped rough surface rod to move up and down, the L-shaped rough surface rod can push the convex rod to drive the friction plate to move backwards when the L-shaped rough surface rod moves downwards, the L-shaped rough surface rod is contacted with the friction plate when the L-shaped rough surface rod moves downwards, the pressing plate is limited by the friction rod to continuously clamp a semiconductor chip, and the problem of clamping the semiconductor chip is caused. When the friction plate moves backwards, the nicking tool can move forwards and backwards along with the friction plate to increase the friction force of the friction plate, so that the friction plate is promoted to have friction force all the time, excessive contact between the friction rod and the friction plate is avoided, the friction force of the friction plate disappears, the friction rod cannot be directly scratched when being contacted with the friction plate, and the pressing plate cannot be limited to directly clamp and damage a semiconductor chip.
According to the technical scheme, the cleaning device comprises a chute box, a sliding plate, a triangular groove plate, a reciprocating screw rod, a T-shaped frame and an L-shaped electric telescopic rod, wherein a chute is formed in one side of the operating platform, the reciprocating screw rod is slidably arranged in the chute of the operating platform, the sliding plate is in threaded connection with the outer surface of the reciprocating screw rod, the triangular groove plate is fixedly arranged above the sliding plate, a triangular groove is formed in the outer surface of the triangular groove plate, the telescopic end of the L-shaped electric telescopic rod is slidably arranged in the triangular groove, the fixed end of the L-shaped electric telescopic rod is fixedly arranged at the bottom of the inner wall of the T-shaped frame, the T-shaped frame is fixedly arranged at the fixed end of the L-shaped electric telescopic rod, the sliding chute box is fixedly arranged at one end of the T-shaped frame, the cleaning device further comprises a telescopic rod, a cleaning scraping plate and an electric telescopic bar, the fixed end of the telescopic rod is fixedly arranged at the top of the outer surface of the T-shaped frame, the cleaning scraping plate is fixedly arranged on the telescopic end of the electric telescopic bar, so that the output end of the motor is opened to drive the reciprocating screw rod, the sliding block and the triangular groove to move left and right, and when the electric telescopic bar pushes the cleaning scraping plate on the T-shaped frame to contact the edge of the semiconductor chip, the cleaning scraping plate moves left and right along with the sliding block, and redundant impurities at the edge of the semiconductor chip are scraped by the cleaning scraping plate; the electric telescopic rod and the T-shaped frame are matched to drive the L-shaped electric telescopic rod to reciprocate in the triangular groove, when the L-shaped electric telescopic rod moves to the highest point of the triangular groove, the L-shaped electric telescopic rod drives the T-shaped frame to move to the highest point, then the L-shaped electric telescopic rod reciprocates, when the L-shaped electric telescopic rod moves to the lowest point in the triangular groove, the T-shaped frame also moves to the lower side, and the T-shaped frame moves to the lower side to take away impurities scraped by the cleaning scraping plate, so that the edge of a semiconductor chip is prevented from contacting with the impurities during processing, and better processing of the semiconductor chip is promoted.
According to the technical scheme, pressure detection device is including manometer, pressure plate, pressure contactor, pressure piece fixed mounting is in the slider top, manometer fixed mounting is in pressure quick one end, pressure contactor fixed mounting is at the pressure piece other end, pressure detection device is still including L shape rapping bar, U-shaped telescopic link, brush, U-shaped telescopic link fixed mounting is in the pressure plate top, the brush passes through articulated shaft fixed mounting on the flexible end of U-shaped telescopic link, L shape rapping bar one end passes through fixed block fixed mounting on the flexible end of electric telescopic end, L shape rapping bar other end is fixed with the protruding ball, the last surface fixation of brush articulated shaft has the protruding ball, protruding ball is located the motion trail of L shape rapping bar protruding ball on the articulated shaft, when pressure contactor contacted the semiconductor chip edge, and if the semiconductor chip edge has unnecessary or less than the time, the protruding ball on the L shape rapping bar on the electric telescopic link can strike protruding brush on the articulated shaft, can throw away the pressure contactor from the left and right side, can avoid rust to throw away from the pressure contactor to drive the rust-proof liquid, can be prevented from touching the pressure vessel, rust-proof liquid from the left side of the brush from the side, and the rust-proof device can be damaged by the pressure contactor.
The invention provides a limiting mechanism for processing a semiconductor chip. The beneficial effects are as follows:
(1) According to the invention, through the arrangement of the buffer device, the clamping plate, the pressing plate and the fixing plate are matched, so that the force of the pressing plate touching the semiconductor chip is buffered by the corresponding spring of the fixing plate, thereby avoiding the problem that the edge of the semiconductor chip is damaged due to direct contact between the semiconductor chip and the clamping plate, and meanwhile, due to the arrangement of the rubber material of the pressing plate, the pressing plate is in soft contact with the semiconductor chip when in contact, so that the problem of easy pressure loss caused by contact between the semiconductor chip and a hard object is avoided; the pressing plate, the clamping plate and the air bag are matched to enable the air outlet to spray out the body onto the semiconductor chip, so that the air can clean the broken scrap iron and other things, and the semiconductor chip is cleaner; be provided with the dust screen on the gas outlet, the dust screen can block impurities such as suction iron fillings when the gas outlet is inhaled, makes the gasbag clear up the gas outlet and can not spout impurity such as these iron fillings debris next time.
(2) According to the invention, through the arrangement of the anti-pinch device, when the pressing plate moves towards the direction of the clamping plate, the pressing plate, the hinge plate and the friction rod are matched to drive the L-shaped rough surface rod to move up and down, when the L-shaped rough surface rod moves upwards, the convex rod is pushed to drive the friction plate to move backwards, when the L-shaped rough surface rod moves downwards, the friction plate is driven to move forwards, when the friction rod moves downwards, the L-shaped rough surface rod is driven to move downwards, the L-shaped rough surface rod contacts with the friction plate, so that the friction rod limits the pressing plate to continuously clamp a semiconductor through the hinge rod, and the problem of pinching the semiconductor chip is caused. When the friction plate moves backwards, the nicking tool can move forwards and backwards along with the friction plate to increase the friction force of the friction plate, so that the friction plate is promoted to have friction force all the time, excessive contact between the friction rod and the friction plate is avoided, the friction force of the friction plate disappears, the friction rod cannot be directly scratched when being contacted with the friction plate, and the pressing plate cannot be limited to directly clamp and damage a semiconductor chip.
(3) According to the invention, through the arrangement of the cleaning device, the output end of the motor is opened to drive the reciprocating screw rod, the sliding block and the triangular groove to move left and right, and when the electric telescopic bar pushes the cleaning scraping plate on the T-shaped frame to contact the edge of the semiconductor chip, the cleaning scraping plate moves left and right along with the sliding block, and the cleaning scraping plate moves left and right to scrape redundant impurities at the edge of the semiconductor chip; the electric telescopic rod and the T-shaped frame are matched to drive the L-shaped electric telescopic rod to reciprocate in the triangular groove, when the L-shaped electric telescopic rod moves to the highest point of the triangular groove, the L-shaped electric telescopic rod drives the T-shaped frame to move to the highest point, then the L-shaped electric telescopic rod reciprocates, when the L-shaped electric telescopic rod moves to the lowest point in the triangular groove, the T-shaped frame also moves to the lower side, and the T-shaped frame moves to the lower side to take away impurities scraped by the cleaning scraping plate, so that the edge of a semiconductor chip is prevented from contacting with the impurities during processing, and better processing of the semiconductor chip is promoted.
(4) According to the invention, through the arrangement of the pressure detection device, when the pressure contactor contacts the edge of the semiconductor chip, if the edge of the semiconductor chip is excessive or less, the pressure gauge is more or less, when the electric telescopic bar stretches, the convex ball on the L-shaped knocking rod on the electric telescopic bar can collide with the convex ball of the hinge shaft on the brush, after the electric telescopic bar is impacted, the brush can swing left and right, the brush can drive the antirust liquid container on the brush to throw out the antirust liquid, the antirust liquid is thrown out to the pressure contactor, the brush can brush the outer surface of the pressure contactor left and right, and the pressure contactor is prevented from rusting, so that the pressure contactor is prevented from contacting the semiconductor chip and being damaged.
Drawings
FIG. 1 is a schematic diagram of the overall invention;
FIG. 2 is a schematic view of a cushioning device of the present invention;
FIG. 3 is a schematic view of an anti-pinch device of the present invention;
FIG. 4 is a schematic view of a cleaning apparatus of the present invention;
FIG. 5 is a schematic view of a left side view of the cleaning apparatus of the present invention;
FIG. 6 is a schematic view of a triangular groove of the cleaning apparatus of the present invention;
fig. 7 is a schematic view of a pressure detecting device according to the present invention.
In the figure: 1. a bottom plate; 2. a clamping plate; 3. an operation table; 4. a bidirectional screw; 5. a buffer device; 6. an anti-pinch device; 51. a fixing plate; 52. a slide bar; 53. a pressing plate; 54. a hose; 55. an air outlet; 56. an air bag; 61. a hinged plate; 62. a friction lever; 63. a friction plate; 64. an L-shaped rough surface bar; 65. a nicking tool; 66. a protruding rod; 7. a cleaning device; 70. a chute box; 71. a slide plate; 72. a triangular groove plate; 73. a reciprocating screw rod; 74. a T-shaped frame; 75. a telescopic column; 76. a cleaning blade; 77. an electric telescopic bar; 78. l-shaped electric telescopic rod; 8. a pressure detection device; 81. a pressure gauge; 82. a pressure plate; 83. an L-shaped knocking rod; 84. a pressure contactor; 85. a U-shaped telescopic rod; 86. a brush; 87. and (5) an antirust liquid container.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a stop gear for semiconductor chip processing includes bottom plate 1, bottom plate 1 top is fixed with operation panel 3 through the supporting leg, two-way screw rod 4 is installed in the rotation of operation panel 3's top, the equal threaded connection in outer wall left side and right side of two-way screw rod 4 has splint 2, operation panel 3 top is provided with buffer 5, buffer 5 is including fixed plate 51, slide bar 52, clamp plate 53, slide bar 52 runs through and slide mounting splint 2 keep away from one side at operation panel 3 center, fixed plate 51 is fixed in slide bar 52 keep away from one side at operation panel 3 center, be equipped with the spring between one side at operation panel 3 center of fixed plate 51 and splint 2, clamp plate 53 is fixed in one side that slide bar 52 is close to operation panel 3 center, clamp plate 2 drives clamp plate 53 and semiconductor chip's edge contact, under the spring force that fixed plate 51 corresponds can cushion the force of clamp plate 53 touching semiconductor chip, thereby avoided semiconductor chip direct contact with splint 2, lead to the semiconductor chip edge to receive the problem of damage, one side that clamp plate 53 kept away from 2 is rubber material setting, five rubber material clearance between clamp plate 53 and clamp plate 2, the soft and the soft chip contact problem has been avoided when leaving the clamp plate 53 to touch the semiconductor chip.
The buffer device 5 further comprises a hose 54, an air outlet 55 and an air bag 56, the air bag 56 is fixed on the outer wall of the pressing plate 53, the air outlet 55 is fixed on the outer wall of one end of the pressing plate 53 away from the air bag 56, the air outlet 55 is connected between the top of the air bag 56 and the top of the air outlet 55 through the hose 54 and is arranged above the pressing plate 53, the pressing plate 53 and the clamping plate 2 cooperate to squeeze the air bag 56 to work, air extruded by the air bag 56 is output from the hose 54 to the air outlet 55 to be sprayed out, and the sprayed air is sprayed onto a semiconductor chip to clean scrap iron and other things, so that the semiconductor chip is cleaner, a dust screen is arranged at the air outlet 55 of the air outlet 55, the dust screen is arranged on the air outlet 55, impurities such as scrap iron and the like are sucked when the air outlet 55 is sucked, and the air bag 56 is enabled not to spray out of the impurities such as scrap iron and the like next time.
The clamp plate 2 is provided with the anti-pinch device 6 on one side, the anti-pinch device 6 comprises a hinged plate 61, a friction rod 62 and a friction plate 63, the friction rod 62 is connected to one side of the clamp plate 2 in a sliding mode, the hinged plate 61 is hinged between the front face of the friction rod 62 and the front face of the pressure plate 53, when the pressure plate 53 moves towards the clamp plate 2, the pressure plate 53 pushes the hinged plate 61 to drive the friction rod 62 to move downwards, the friction rod 62 drives the L-shaped rough surface rod 64 to move upwards, the convex rod 66 is pushed to drive the friction plate 63 to move backwards when the L-shaped rough surface rod 64 moves downwards to drive the friction plate 63 to move forwards, the friction rod 62 moves downwards to drive the L-shaped rough surface rod 64 to contact the friction plate 63 when the friction rod 62 moves downwards, the friction rod 62 is used for limiting the pressure plate 53 to continuously clamp a semiconductor chip through the hinged rod, the friction plate 63 is fixed on the side face of the bottom plate 1, a five cm gap is reserved between the bottom of the friction rod 62 and the top of the friction plate 63, the friction plate 63 is prevented from being in direct contact with the friction plate 63 when the friction plate 63 is not scratched, and the friction plate 63 is prevented from being in direct contact with the friction plate 63 when the friction plate 63 is in the movement, and the friction plate 63 is not damaged when the friction plate 63 is in the movement is in the direct contact with the top 63, and the friction plate 63 is not damaged, and the friction plate 63 is caused.
When the semiconductor chip is used, the operation table 3 is placed on the semiconductor chip, the bidirectional screw 4 is rotated, the bidirectional screw 4 drives the two clamping plates 2 to move towards the center along the top surface of the operation table 3, the two clamping plates 2 can clamp the semiconductor chip at the middle part of the operation table 3, the clamping plates 2 can preferentially drive the pressing plates 53 to contact with the edges of the semiconductor chip in the process of clamping the semiconductor chip, under the action of the spring force corresponding to the fixing plate 51, the force of the pressing plates 53 touching the semiconductor chip is buffered by the springs corresponding to the fixing plate 51, so that the problem that the edges of the semiconductor chip are damaged due to direct contact of the semiconductor chip with the clamping plates 2 is avoided, meanwhile, the pressing plates 53 are in soft contact with the semiconductor chip due to the arrangement of rubber materials, and the problem that the pressing plates 53 are in contact with the semiconductor chip, so that the semiconductor chip is in contact with a hard object, and pressure loss is easy to occur is avoided.
When the clamping plate 2 drives the pressing plate 53 to contact with the edge of the semiconductor chip, the pressing plate 53 moves towards the direction of the clamping plate 2, the pressing plate 53 and the clamping plate 2 squeeze the air bag 56 to work, gas squeezed out by the air bag 56 is output from the hose 54 to the air outlet 55 to be sprayed out, and the sprayed gas is sprayed onto the semiconductor chip to clean scrap iron and other things, so that the semiconductor chip is cleaner; the air outlet 55 is provided with a dust screen, and the dust screen can block impurities such as iron filings sucked in when the air outlet 55 sucks air, so that the air bag 56 can clean the air outlet 55 next time and cannot spray the impurities such as the iron filings.
When the pressing plate 53 moves towards the direction of the clamping plate 2, the pressing plate 53 pushes the hinge plate 61 to drive the friction rod 62 to move downwards, the friction rod 62 drives the L-shaped rough surface rod 64 to move upwards and downwards, the convex rod 66 is pushed to drive the friction plate 63 to move backwards when the L-shaped rough surface rod 64 moves upwards, the friction plate 63 is driven to move forwards when the friction rod 62 moves downwards, the L-shaped rough surface rod 64 is driven to move downwards, the L-shaped rough surface rod 64 contacts with the friction plate 63 when moving downwards, and the position of the pressing plate 53 is limited by the friction rod 62 through the hinge rod to continuously clamp a semiconductor, so that the problem of clamping a semiconductor chip is caused. When the friction plate 63 moves backwards, the nicking knife 65 can increase the friction force of the friction plate 63 along with the forward and backward movement of the friction plate 63, so that the friction force of the friction plate 63 is promoted, excessive contact between the friction rod 62 and the friction plate 63 is avoided, the friction force of the friction plate 63 disappears, the friction rod 62 cannot directly scratch away when being contacted with the friction plate 63, and the pressing plate 53 cannot be limited to directly clamp a semiconductor chip.
Referring to fig. 1-7, the present invention provides a technical solution: also comprises a cleaning device 7 and a pressure detection device 8;
the cleaning device 7 comprises a chute box 70, a sliding plate 71, a triangular chute plate 72, a reciprocating screw rod 73, a T-shaped frame 74 and an L-shaped electric telescopic rod 78, wherein one side of the operating platform 3 is provided with a chute, the reciprocating screw rod 73 is slidably arranged in the chute of the operating platform 3, the sliding plate 71 is in threaded connection with the outer surface of the reciprocating screw rod 73, the triangular chute plate 72 is fixedly arranged above the sliding plate 71, the triangular chute is arranged on the outer surface of the triangular chute plate 72, the telescopic end of the L-shaped electric telescopic rod 78 is slidably arranged in the triangular chute, the fixed end of the L-shaped electric telescopic rod 78 is fixedly arranged at the bottom of the inner wall of the T-shaped frame 74, the T-shaped frame 74 is fixedly arranged at the fixed end of the L-shaped electric telescopic rod 78, the chute box 70 is fixedly arranged at one end of the T-shaped frame 74, the motor output end drives the reciprocating screw rod 73 to rotate, the reciprocating screw rod 73 rotates to drive the sliding plate 71 to move left and right, the sliding plate 71 moves left and right to drive the triangular chute plate 72 to move left and right, the electric telescopic rod 77 is started, pushing the T-shaped frame 74 to move forwards, when the cleaning scraping plate 76 on the T-shaped frame 74 contacts the edge of the semiconductor chip, the cleaning scraping plate 76 moves left and right along with the sliding block, the cleaning scraping plate 76 moves left and right to scrape redundant impurities at the edge of the semiconductor chip, the cleaning device 7 further comprises a telescopic column 75, the cleaning scraping plate 76 and an electric telescopic rod 77, the fixed end of the telescopic column 75 is fixedly arranged at the top of the outer surface of the T-shaped frame 74, the cleaning scraping plate 76 is fixedly arranged on the telescopic end of the electric telescopic rod 77, the electric telescopic rod 77 and the T-shaped frame 74 cooperate to drive the L-shaped electric telescopic rod 78 to reciprocate on the triangular groove plate 72, when the L-shaped electric telescopic rod 78 moves to the highest point of the triangular groove plate 72, the L-shaped electric telescopic rod 78 drives the T-shaped frame 74 to reciprocate, and when the L-shaped electric telescopic rod 78 moves to the lowest point in the triangular groove plate 72, the T-shaped frame 74 is also moved downward, and the T-shaped frame 74 is moved downward to take away the foreign substances scraped off by the cleaning blade 76, thereby preventing the semiconductor chip from being edge-contacted with the foreign substances during processing, and promoting better processing of the semiconductor chip.
The pressure detection device 8 comprises a pressure gauge 81, a pressure plate 82 and a pressure contactor 84, wherein the pressure plate 82 is fixedly arranged above a sliding plate 71, the pressure gauge 81 is fixedly arranged at one end of the pressure plate 82, the pressure contactor 84 is fixedly arranged at the other end of the pressure plate 82, when the pressure contactor 84 contacts the edge of a semiconductor chip, if the edge of the semiconductor chip is redundant or less, the pressure gauge 81 can be seen by a few workers, so that the processing failure of the semiconductor chip is promoted, the processing failure of the semiconductor chip is avoided when the semiconductor chip is more and less, the pressure detection device 8 also comprises an L-shaped knocking rod 83, a U-shaped telescopic rod 85 and a brush 86, the U-shaped telescopic rod 85 is fixedly arranged above the pressure plate 82, the brush 86 is fixedly arranged at the telescopic end of the U-shaped telescopic rod 85 through a hinge shaft, one end of the L-shaped knocking rod 83 is fixedly arranged at the telescopic end of the electric telescopic rod 77, a convex ball is fixedly arranged at the other end of the L-shaped knocking rod 83, the outer surface of the hinge shaft is fixedly provided with the convex ball, the convex ball is positioned on the motion track of the L-shaped knocking rod 83, the convex ball is prevented from being in the L-shaped knocking rod 83, the left and the electric rod 86 is prevented from being in contact with the left and right side of the electric rod, the brush 86 is prevented from being swung, and the left side of the electric rod is prevented from being damaged, the left side of the brush 86 is prevented from being in contact with the electric rod and the electric rod is prevented from being in contact with the left side of the electric rod, the electric rod is prevented from being in the contact with the left side, the brush rod and the left side, the brush 84 is prevented from the rust protector, and the rust protector is prevented from the left and the rust protector is prevented from the left and the contact rod 84 is prevented from the contact is swing rod and the left side and the side the ultrasonic rod is the side and the ultrasonic rod is the has the ultrasonic rod is has the ultrasonic rod and the has the ultrasonic rod.
Turning on a motor, wherein the output end of the motor drives a reciprocating screw rod 73 to rotate, the reciprocating screw rod 73 rotates to drive a sliding plate 71 to move left and right, the sliding plate 71 moves left and right to drive a triangular groove plate 72 to move left and right, an electric telescopic bar 77 is started to push a T-shaped frame 74 to move forward, and when a cleaning scraper 76 on the T-shaped frame 74 contacts the edge of a semiconductor chip, the cleaning scraper 76 moves left and right along with the sliding block, and the cleaning scraper 76 moves left and right to scrape redundant impurities at the edge of the semiconductor chip; the electric telescopic rod 77 drives the T-shaped frame 74 to move forwards, the T-shaped frame 74 moves forwards to drive the L-shaped electric telescopic rod 78 to reciprocate on the triangular groove plate 72, when the L-shaped electric telescopic rod 78 moves to the highest point of the triangular groove plate 72, the L-shaped electric telescopic rod 78 drives the T-shaped frame 74 to move to the highest point, then the L-shaped electric telescopic rod 78 reciprocates, when the L-shaped electric telescopic rod 78 moves to the lowest point in the triangular groove plate 72, the T-shaped frame 74 also moves to the lower side, the T-shaped frame 74 moves to the lower side to take away impurities scraped by the cleaning scraping plate 76, and therefore the edge of a semiconductor chip is prevented from contacting the impurities during processing, and better processing of the semiconductor chip is promoted.
When the pressure contactor 84 contacts the edge of the semiconductor chip, if the edge of the semiconductor chip is redundant or less, the pressure gauge 81 can be seen by more or less workers, so that the failure of the semiconductor chip during processing is promoted, and the failure of the semiconductor chip during processing is avoided; when the electric telescopic rod 77 stretches out and draws back, the convex ball on the L-shaped knocking rod 83 on the electric telescopic rod 77 can hit the convex ball of the hinge shaft on the hairbrush 86, after hitting, the hairbrush 86 can swing left and right to drive the anti-rust liquid container 87 on the hairbrush to throw out the anti-rust liquid, the anti-rust liquid is thrown out to the pressure contactor 84, the hairbrush 86 can brush the outer surface of the pressure contactor 84 left and right, the pressure contactor 84 is prevented from being rusted, and therefore the semiconductor chip is prevented from being damaged when the pressure contactor 84 contacts the semiconductor chip.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (8)
1. The utility model provides a stop gear is used in semiconductor chip processing, includes bottom plate (1), bottom plate (1) top is fixed with operation panel (3) through the supporting leg, bi-directional screw (4) are installed in the top rotation of operation panel (3), equal threaded connection in outer wall left side and right side of bi-directional screw (4) has splint (2), its characterized in that: the utility model discloses a cleaning device for the automobile, including operation panel (3), buffer (5) are provided with, splint (2) one side is provided with prevents pressing from both sides wound device (6), operation panel (3) top is provided with cleaning device (7), cleaning device (7) left side is provided with pressure detection device (8), buffer (5) are including fixed plate (51), slide bar (52), clamp plate (53), slide bar (52) run through and slidable mounting splint (2) keep away from one side at operation panel (3) center, fixed plate (51) are fixed in slide bar (52) and are kept away from one side at operation panel (3) center, be equipped with the spring between one side at operation panel (3) center is kept away from to fixed plate (51) and splint (2), one side that clamp plate (53) are kept away from splint (2) is rubber material setting in slide bar (52), leave five centimetres clearance between clamp plate (53) and the splint (2).
2. The spacing mechanism for semiconductor chip processing according to claim 1, wherein: the buffering device (5) further comprises a hose (54), an air outlet (55) and an air bag (56), the air bag (56) is fixed on the outer wall of the pressing plate (53), the air outlet (55) is fixed on the outer wall of one end of the pressing plate (53) away from the air bag (56), the top of the air bag (56) is connected with the top of the air outlet (55) through the hose (54), the air outlet (55) is arranged above the pressing plate (53), and a dust screen is arranged at the air outlet (55) of the air outlet (55).
3. The limit mechanism for semiconductor chip processing according to claim 2, wherein: the anti-pinch device (6) comprises a hinged plate (61), a friction rod (62), a friction plate (63), an L-shaped rough surface rod (64), a nicking tool (65) and a protruding rod (66), wherein the friction rod (62) is slidably connected to one side of the clamping plate (2), the hinged plate (61) is hinged between the front surface of the friction rod (62) and the front surface of the pressing plate (53), the friction plate (63) is fixed to the side surface of the bottom plate (1), the L-shaped rough surface rod (64) is fixedly arranged at the bottom of the outer surface of the friction rod (62), the nicking tool (65) is fixedly arranged on one side of the bottom plate (1), and the protruding rod (66) is fixedly arranged above the friction plate (63).
4. A spacing mechanism for semiconductor chip processing as defined in claim 3, wherein: a five-centimeter gap is reserved between the bottom of the friction rod (62) and the top of the friction plate (63), and the bottom of the friction rod (62) and the top of the friction plate (63) are both rough surfaces.
5. The limit mechanism for semiconductor chip processing as set forth in claim 4, wherein: the cleaning device comprises a chute box (70), a sliding plate (71), a triangular groove plate (72), a reciprocating screw rod (73), a T-shaped frame (74) and an L-shaped electric telescopic rod (78), wherein one side of an operating table (3) is provided with a chute, the reciprocating screw rod (73) is slidably arranged in the chute of the operating table (3), the sliding plate (71) is in threaded connection with the outer surface of the reciprocating screw rod (73), the triangular groove plate (72) is fixedly arranged above the sliding plate (71), the triangular groove is formed in the outer surface of the triangular groove plate (72), the telescopic end of the L-shaped electric telescopic rod (78) is slidably arranged in the triangular groove, the fixed end of the L-shaped electric telescopic rod (78) is fixedly arranged at the bottom of the inner wall of the T-shaped frame (74), the T-shaped frame (74) is fixedly arranged at the fixed end of the L-shaped electric telescopic rod (78), and the chute box (70) is fixedly arranged at one end of the T-shaped frame (74).
6. The limit mechanism for semiconductor chip processing as set forth in claim 5, wherein: the cleaning device (7) further comprises a telescopic column (75), a cleaning scraper (76) and an electric telescopic bar (77). The telescopic column (75) is fixedly arranged at the top of the outer surface of the T-shaped frame (74) at the fixed end, and the cleaning scraping plate (76) is fixedly arranged on the electric telescopic strip (77). And the telescopic end.
7. The spacing mechanism for semiconductor chip processing as defined in claim 6, wherein: the pressure detection device (8) comprises a pressure gauge (81), a pressure plate (82) and a pressure contactor (84), wherein the pressure plate (82) is fixedly arranged above the sliding plate (71), the pressure gauge (81) is fixedly arranged at one end of the pressure plate (82), and the pressure contactor (84) is fixedly arranged at the other end of the pressure plate (82).
8. The spacing mechanism for semiconductor chip processing as defined in claim 7, wherein: pressure detection device (8) still including L shape strike pole (83), U-shaped telescopic link (85), brush (86), rust-resistant liquid container (87), L shape strikes pole (83) fixed mounting in pressure board (82) top, brush (86) are through articulated shaft fixed mounting on the flexible end of U-shaped telescopic link (85), rust-resistant liquid container (87) fixed mounting is in brush (86) left side, L shape strikes pole (83) one end through fixed block fixed mounting on the flexible end of electric telescopic strip (77), L shape strikes pole (83) other end and is fixed with protruding ball, the last surface mounting of brush (86) articulated shaft has protruding ball, protruding ball is located the motion trail of protruding ball of L shape strike pole (83).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311761324.2A CN117524970A (en) | 2023-12-20 | 2023-12-20 | Stop gear is used in semiconductor chip processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311761324.2A CN117524970A (en) | 2023-12-20 | 2023-12-20 | Stop gear is used in semiconductor chip processing |
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| CN117524970A true CN117524970A (en) | 2024-02-06 |
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| CN202311761324.2A Pending CN117524970A (en) | 2023-12-20 | 2023-12-20 | Stop gear is used in semiconductor chip processing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117945150A (en) * | 2024-03-11 | 2024-04-30 | 苏州玖钧智能装备有限公司 | Deviation rectifying and righting mechanism for photovoltaic silicon wafer conveyor |
| CN118002843A (en) * | 2024-04-08 | 2024-05-10 | 无锡天辰冷拉型钢有限公司 | Cutting equipment for cold-drawing deformed steel production |
-
2023
- 2023-12-20 CN CN202311761324.2A patent/CN117524970A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117945150A (en) * | 2024-03-11 | 2024-04-30 | 苏州玖钧智能装备有限公司 | Deviation rectifying and righting mechanism for photovoltaic silicon wafer conveyor |
| CN117945150B (en) * | 2024-03-11 | 2024-06-25 | 苏州玖钧智能装备有限公司 | Deviation rectifying and righting mechanism for photovoltaic silicon wafer conveyor |
| CN118002843A (en) * | 2024-04-08 | 2024-05-10 | 无锡天辰冷拉型钢有限公司 | Cutting equipment for cold-drawing deformed steel production |
| CN118002843B (en) * | 2024-04-08 | 2024-06-07 | 无锡天辰冷拉型钢有限公司 | Cutting equipment for cold-drawing deformed steel production |
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