CN117512725A - Tin-zinc wire silver plating process for high-current fuse - Google Patents
Tin-zinc wire silver plating process for high-current fuse Download PDFInfo
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- CN117512725A CN117512725A CN202311472310.9A CN202311472310A CN117512725A CN 117512725 A CN117512725 A CN 117512725A CN 202311472310 A CN202311472310 A CN 202311472310A CN 117512725 A CN117512725 A CN 117512725A
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- 238000007747 plating Methods 0.000 title claims abstract description 138
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 title claims abstract description 100
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 94
- 239000004332 silver Substances 0.000 title claims abstract description 91
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 53
- 239000010949 copper Substances 0.000 claims abstract description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000005238 degreasing Methods 0.000 claims abstract description 45
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims abstract description 25
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229940098221 silver cyanide Drugs 0.000 claims abstract description 18
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 230000004913 activation Effects 0.000 claims abstract description 8
- 239000000243 solution Substances 0.000 claims description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 230000003213 activating effect Effects 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 16
- 238000011010 flushing procedure Methods 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 238000005868 electrolysis reaction Methods 0.000 claims description 10
- 239000004519 grease Substances 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000011259 mixed solution Substances 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical group [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- 230000001804 emulsifying effect Effects 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 2
- 229910021641 deionized water Inorganic materials 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 238000001994 activation Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 5
- 238000006467 substitution reaction Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- -1 silver ions Chemical class 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
- C25F1/04—Pickling; Descaling in solution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention relates to a tin-zinc wire silver plating process for a heavy-current fuse tube, which belongs to the field of tin-zinc wire silver plating processes, and comprises the following steps of: the method comprises the steps of electrolytic degreasing, second step activation, third step, basic copper plating, fourth step, pre-silver plating, fifth step, silver plating, high-cyanide low-copper alkaline copper plating solution guaranteeing the binding force of a plating layer, and the protection of a copper layer in the subsequent silver plating process can effectively prevent a basal body from polluting a silver plating solution, thereby protecting the silver plating solution and preventing the plating solution from being polluted, the alkaline copper plating solution prepared by mixing potassium cyanide and copper has the characteristics of good dispersibility and firm bonding of the plating layer, in addition, the pre-silver plating solution used in the pre-silver plating process can prevent displacement reaction of Cu and Ag in a high-cyanide low-silver state, the bonding force of the silver plating layer is guaranteed, finally, the silver plating solution prepared by mixing silver cyanide and potassium cyanide has the characteristics of good dispersibility and firm bonding of the plating layer on the surface of a tin-zinc wire, and the purity of the silver plating layer can reach 99.95%.
Description
Technical Field
The invention relates to the field of tin-zinc wire silver plating processes, in particular to a tin-zinc wire silver plating process for a heavy-current protective tube.
Background
The tin-zinc wire of the high-current fuse tube is a special fuse, and has excellent conductive performance and fusing characteristics. In the circuit, when the current exceeds the rated value, the tin-zinc wire can be quickly fused to play a role of protecting the circuit.
Tin-zinc wires are usually composed of one or more tin-zinc alloy wires, and the surface of the tin-zinc wires is covered with a silver layer to improve the conductivity and corrosion resistance of the tin-zinc wires. Because the melting point of the tin-zinc wire is low and is only about 230 ℃, the tin-zinc wire can be quickly fused when the current is excessive, and the circuit is protected from being damaged by the overcurrent.
The tin-zinc wire of the heavy-current protective tube needs to be subjected to multiple procedures in the manufacturing process, including wiredrawing, heat treatment, silver plating and the like. In the silver plating process, specific plating solutions and conditions are required to ensure adhesion and corrosion resistance of the silver layer to the tin-zinc wire.
However, the existing silver plating process has some problems. Since tin and zinc are relatively reactive metals, they may react with chemical agents during the electroplating degreasing and activation process, corroding the substrate of the protective tube. In addition, due to the reactivity of tin and zinc, they are susceptible to substitution reactions with silver during plating, which can contaminate the plating solution, affecting the effectiveness and efficiency of the plating.
Disclosure of Invention
The invention aims to solve the defects and provide a tin-zinc wire silver plating process for a high-current protective tube, which can protect a substrate in the oil removal and activation processes and can also protect silver plating solution in the electroplating process. Solves the technical problems that the substrate is easy to corrode and the plating solution is easy to be polluted by substitution reaction during electroplating in the prior art.
The object of the invention is achieved by:
the tin-zinc wire silver plating process for the high-current protective tube is characterized by comprising the following steps of:
firstly, electrolytic degreasing, namely preparing degreasing liquid, adding degreasing powder with the concentration of 18-22g/L into a degreasing tank, mixing the degreasing powder with water to prepare degreasing liquid, controlling the PH value of the degreasing liquid to be 7-9, immersing all tin-zinc wires into the degreasing liquid, electrifying to enable current to pass through the degreasing powder and the tin-zinc wires in the degreasing tank, enabling the degreasing powder to generate chemical reaction with grease on the surface of the tin-zinc wires under the action of the current, decomposing, emulsifying and dissolving the grease, closing a power supply after the preset time, taking out the tin-zinc wires, flushing the surface of the tin-zinc wires with clear water, and removing the residual degreasing powder and the decomposed grease;
secondly, activating, namely preparing an activating solution, mixing 8-12ml/L sulfuric acid with water, controlling the pH value to be 1-3, preparing the activating solution, putting tin-zinc wires into the activating solution, ensuring that the tin-zinc wires are completely immersed in the activating solution, adjusting the current intensity according to actual conditions, closing a power supply after the activation is finished, taking out the tin-zinc wires, flushing the surfaces of the tin-zinc wires with clear water, and removing residual activating solution;
thirdly, performing basic copper plating, namely preparing a mixed solution with the concentration of 100-150g/L of potassium cyanide and the concentration of 15-30g/L of copper, adjusting the pH value of the mixed solution to 9.5-10.0 to obtain an alkaline copper plating solution, immersing all activated tin-zinc wires into the alkaline copper plating solution, starting a power supply to enable the current to pass through the alkaline copper plating solution and the tin-zinc wires in a copper plating tank, and after the electrolysis is completed, turning off the power supply, taking out the tin-zinc wires to form copper plating layers on the surfaces of the tin-zinc wires;
fourthly, pre-plating silver, namely mixing silver cyanide and potassium cyanide according to a proportion to prepare a pre-plating silver solution, wherein the concentration of the silver cyanide is 2-7g/L, the concentration of the potassium cyanide is 100-150g/L, then immersing all the tin-zinc wires subjected to copper plating into the pre-plating silver solution, starting a power supply to enable current to pass through the pre-plating silver solution and the tin-zinc wires, taking out the tin-zinc wires after the pre-plating silver is finished, flushing the surfaces of the tin-zinc wires with clear water, and removing residual pre-plating silver solution;
fifthly, silver plating, namely, mixing silver cyanide and potassium cyanide in proportion to prepare silver plating solution, wherein the concentration of the silver cyanide is 35-100g/L, the concentration of the potassium cyanide is 80-120g/L, then, immersing all the pre-silver plated tin-zinc wires into the silver plating solution, starting a power supply to enable current to pass through the silver plating solution and the tin-zinc wires, taking out the tin-zinc wires after silver plating is finished, flushing the surfaces of the tin-zinc wires with clear water, and removing residual silver plating solution.
Further, in the first step, the concentration of the oil removal powder is 20g/L, the water mixed with the oil removal powder is deionized water, the current passing through the oil removal groove is 2A, the electrolysis time lasts for 2-5 seconds, and the PH value of the oil removal liquid is controlled to be 8.
Further, in the third step, the alkaline copper plating solution is required to be continuously stirred in the electrolysis process so as to promote the deposition of copper ions and prevent the temperature of the alkaline copper plating solution from being too high, and after the tin-zinc wire is taken out after the electrolysis is completed, the tin-zinc wire is put on filter paper and is gently wiped.
Further, in the second step, the concentration of sulfuric acid is 10ml/L, the pH value of the activating solution is controlled to be 2, and in the third step, the concentration of potassium cyanide is 120g/L, and the concentration of copper is 20g/L.
Further, in the fourth step, the concentration of silver cyanide was 5g/L, the concentration of potassium cyanide was 120g/L, and in the fifth step, the concentration of silver cyanide was 70g/L, and the concentration of potassium cyanide was 90g/L.
The beneficial effects of the invention are as follows: the degreasing process is carried out by adopting the degreasing liquid of weak base, tin-zinc wires (matrixes) can be effectively protected, meanwhile, the activation process is carried out by adopting the activation liquid of weak acid, tin-zinc wires (matrixes) can be effectively protected, then, a layer of thin copper is rapidly plated on the surface of the tin-zinc wires in a high-cyanide low-copper state, displacement reaction is prevented, the high-cyanide low-copper alkaline copper plating solution ensures the binding force of a plating layer, the silver plating solution can be effectively prevented from being polluted by the silver plating process by protecting the copper layer, the silver plating solution is further protected, the plating solution is prevented from being polluted, the alkaline copper plating solution mixed by potassium cyanide and copper is provided with good dispersibility, the plating layer is firmly combined, the purity of the copper plating layer can be ensured to be 99.95%, in addition, the pre-silver plating solution used in the pre-silver plating process can prevent the displacement reaction of Cu and Ag in a high-cyanide low-silver state, the binding force of the silver plating layer is ensured, and finally, the silver plating solution mixed by silver cyanide and potassium cyanide on the surface of the tin-zinc wires has the good dispersibility, the plating layer is firmly combined by the plating layer, and the purity of the plating layer can be ensured to be up to 99.95%.
Detailed Description
The invention is described in further detail below in connection with specific embodiments.
The embodiment of the tin-zinc wire silver plating process for the heavy-current protective tube comprises the following steps: the method comprises the following steps of electrolytic degreasing, second step, activation, third step, basic copper plating, fourth step, pre-silver plating, fifth step and silver plating.
The electroplating process requires preparation of a de-oiling tank, an activation tank, a copper plating tank, a pre-silver plating tank, a power supply and a controller, which are commonly used in the art, the power supply being used to supply the current required for electrolysis, electroplating. The controller is used for controlling the time and the temperature of each step.
The following details each procedure:
firstly, electrolytic degreasing, namely preparing degreasing liquid, adding degreasing powder with the concentration of 20g/L into a degreasing tank, mixing the degreasing powder and water to prepare degreasing liquid, controlling the PH value of the degreasing liquid to be 8, immersing all tin-zinc wires into the degreasing liquid, electrifying to enable current to pass through the degreasing powder and the tin-zinc wires in the degreasing tank, enabling the degreasing powder to generate chemical reaction with grease on the surface of the tin-zinc wires under the action of the current, decomposing, emulsifying and dissolving the grease for 2-5 seconds, closing a power supply, taking out the tin-zinc wires, flushing the surface of the tin-zinc wires with clear water, and removing the residual degreasing powder and the decomposed grease. Through the steps, the oil marks on the surface of the tin-zinc wire can be removed, and the attention is paid to safety because a certain amount of gas and heat are generated in the electrolytic degreasing process. The electrolytic degreasing is to remove greasy dirt on the substrate by an electrochemical reaction principle, and meanwhile, in order to ensure the cleaning effect, degreasing powder needs to be replaced regularly and the cleaning of a degreasing groove is kept.
And secondly, activating, namely preparing an activating solution, mixing 10ml/L sulfuric acid with water, controlling the pH value to be 3, so that the substrate can not be corroded, preparing the activating solution, putting the tin-zinc wire into the activating solution, ensuring that the tin-zinc wire is completely immersed in the activating solution, activating for 2-5 seconds, adjusting the current intensity according to actual conditions, closing a power supply after the activation is finished, taking out the tin-zinc wire, flushing the surface of the tin-zinc wire by clean water, and removing the residual activating solution. The purpose of the activation is to remove the oxide layer from the substrate surface and expose the substrate to the plating solution.
Thirdly, performing basic copper plating, namely preparing a mixed solution with the concentration of 120g/L of potassium cyanide and the concentration of 20g/L of copper, adjusting the pH value of the mixed solution to 10.0 to obtain an alkaline copper plating solution, then immersing all the activated tin-zinc wires into the alkaline copper plating solution, starting a power supply to enable current to pass through the alkaline copper plating solution and the tin-zinc wires in a copper plating tank, continuously stirring the alkaline copper plating solution in the electrolytic process so as to promote deposition of copper ions and prevent the temperature of the alkaline copper plating solution from being too high, and then turning off the power supply when the electrolytic process is completed, taking out the tin-zinc wires, and forming a copper plating layer on the surface of the tin-zinc wires; after the electrolysis is completed and the tin-zinc wire is taken out, the tin-zinc wire is put on filter paper and is lightly wiped. The alkaline copper plating solution of the embodiment has the characteristics of good dispersibility, firm combination of the plating layer and ensuring that the purity of the plating layer can reach 99.95 percent.
Fourthly, pre-plating silver, namely mixing silver cyanide and potassium cyanide according to a proportion to prepare a pre-plating silver solution, wherein the concentration of the silver cyanide is 5g/L, the concentration of the potassium cyanide is 120g/L, then immersing all the tin-zinc wires subjected to copper plating into the pre-plating silver solution, starting a power supply to enable current to pass through the pre-plating silver solution and the tin-zinc wires, adjusting the current intensity according to actual conditions, taking out the tin-zinc wires after the pre-plating silver is finished, flushing the surfaces of the tin-zinc wires with clear water, and removing the residual pre-plating silver solution. It should be noted that safety is required to be paid attention to in the basic copper plating process, and accidents such as electric shock and scald are avoided. Meanwhile, in order to ensure the quality and stability of the plating layer, the silver plating bath and related equipment need to be inspected and maintained periodically. The pre-silver plating solution of the embodiment is characterized in that the substitution reaction of Cu and Ag can be prevented under the high-cyanide low-silver state, and the binding force of a silver layer is ensured.
Fifthly, silver plating, namely, mixing silver cyanide and potassium cyanide in proportion to prepare silver plating solution, wherein the concentration of the silver cyanide is 70g/L, the concentration of the potassium cyanide is 90g/L, then, immersing all the tin-zinc wires subjected to pre-silver plating into the silver plating solution, starting a power supply to enable current to pass through the silver plating solution and the tin-zinc wires, taking out the tin-zinc wires after silver plating is finished, flushing the surfaces of the tin-zinc wires with clear water, and removing residual silver plating solution. It should be noted that silver plating aims to form a smooth and compact silver film on the surface of a substrate so as to improve the conductivity and appearance quality of the tin-zinc wire. In order to obtain the ideal silver plating effect, parameters such as current intensity, time and solution concentration need to be strictly controlled, and attention needs to be paid to continuously stirring the solution so as to promote the deposition of silver ions and prevent the solution from being excessively high in temperature. The silver plating solution of the embodiment has the characteristics of good dispersibility, firm combination of the plating layer and ensuring that the purity of the plating layer can reach 99.95 percent.
The foregoing is a further detailed description of the invention in connection with specific preferred embodiments, and is not intended to limit the practice of the invention to such description. It will be apparent to those skilled in the art that several simple deductions or substitutions can be made without departing from the spirit of the invention, and the scope of the invention is to be considered as the scope of the invention.
Claims (5)
1. The tin-zinc wire silver plating process for the high-current protective tube is characterized by comprising the following steps of:
firstly, electrolytic degreasing, namely preparing degreasing liquid, adding degreasing powder with the concentration of 18-22g/L into a degreasing tank, mixing the degreasing powder with water to prepare degreasing liquid, controlling the PH value of the degreasing liquid to be 7-9, immersing all tin-zinc wires into the degreasing liquid, electrifying to enable current to pass through the degreasing powder and the tin-zinc wires in the degreasing tank, enabling the degreasing powder to generate chemical reaction with grease on the surface of the tin-zinc wires under the action of the current, decomposing, emulsifying and dissolving the grease, closing a power supply after the preset time, taking out the tin-zinc wires, flushing the surface of the tin-zinc wires with clear water, and removing the residual degreasing powder and the decomposed grease;
secondly, activating, namely preparing an activating solution, mixing 8-12ml/L sulfuric acid with water, controlling the pH value to be 1-3, preparing the activating solution, putting tin-zinc wires into the activating solution, ensuring that the tin-zinc wires are completely immersed in the activating solution, adjusting the current intensity according to actual conditions, closing a power supply after the activation is finished, taking out the tin-zinc wires, flushing the surfaces of the tin-zinc wires with clear water, and removing residual activating solution;
thirdly, performing basic copper plating, namely preparing a mixed solution with the concentration of 100-150g/L of potassium cyanide and the concentration of 15-30g/L of copper, adjusting the pH value of the mixed solution to 9.5-10.0 to obtain an alkaline copper plating solution, immersing all activated tin-zinc wires into the alkaline copper plating solution, starting a power supply to enable the current to pass through the alkaline copper plating solution and the tin-zinc wires in a copper plating tank, and after the electrolysis is completed, turning off the power supply, taking out the tin-zinc wires to form copper plating layers on the surfaces of the tin-zinc wires;
fourthly, pre-plating silver, namely mixing silver cyanide and potassium cyanide according to a proportion to prepare a pre-plating silver solution, wherein the concentration of the silver cyanide is 2-7g/L, the concentration of the potassium cyanide is 100-150g/L, then immersing all the tin-zinc wires subjected to copper plating into the pre-plating silver solution, starting a power supply to enable current to pass through the pre-plating silver solution and the tin-zinc wires, taking out the tin-zinc wires after the pre-plating silver is finished, flushing the surfaces of the tin-zinc wires with clear water, and removing residual pre-plating silver solution;
fifthly, silver plating, namely, mixing silver cyanide and potassium cyanide in proportion to prepare silver plating solution, wherein the concentration of the silver cyanide is 35-100g/L, the concentration of the potassium cyanide is 80-120g/L, then, immersing all the pre-silver plated tin-zinc wires into the silver plating solution, starting a power supply to enable current to pass through the silver plating solution and the tin-zinc wires, taking out the tin-zinc wires after silver plating is finished, flushing the surfaces of the tin-zinc wires with clear water, and removing residual silver plating solution.
2. The tin-zinc wire silver plating process for a high current fuse of claim 1, wherein: in the first step, the concentration of the oil removing powder is 20g/L, the water mixed with the oil removing powder is deionized water, the current passing through the oil removing groove is 2A, the electrolysis time lasts for 2-5 seconds, and the PH value of the oil removing liquid is controlled to be 8.
3. The tin-zinc wire silver plating process for a high current fuse of claim 1, wherein: in the third step, the alkaline copper plating solution is required to be continuously stirred in the electrolysis process so as to promote the deposition of copper ions and prevent the temperature of the alkaline copper plating solution from being too high, and after the tin-zinc wire is taken out after the electrolysis is completed, the tin-zinc wire is put on filter paper and is gently wiped.
4. The tin-zinc wire silver plating process for a high current fuse of claim 1, wherein: in the second step, the concentration of sulfuric acid is 10ml/L, the pH value of the activating solution is controlled to be 2, and in the third step, the concentration of potassium cyanide is 120g/L, and the concentration of copper is 20g/L.
5. The tin-zinc wire silver plating process for a high current fuse of claim 1, wherein: in the fourth step, the concentration of silver cyanide is 5g/L, the concentration of potassium cyanide is 120g/L, and in the fifth step, the concentration of silver cyanide is 70g/L, and the concentration of potassium cyanide is 90g/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311472310.9A CN117512725A (en) | 2023-11-07 | 2023-11-07 | Tin-zinc wire silver plating process for high-current fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311472310.9A CN117512725A (en) | 2023-11-07 | 2023-11-07 | Tin-zinc wire silver plating process for high-current fuse |
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| CN117512725A true CN117512725A (en) | 2024-02-06 |
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| CN202311472310.9A Pending CN117512725A (en) | 2023-11-07 | 2023-11-07 | Tin-zinc wire silver plating process for high-current fuse |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000051998A (en) * | 1999-01-28 | 2000-08-16 | 김계형 | Method of Silver-plating Microwave Band Pass Cavity Filter Products |
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