CN117508654A - High-stability temperature control device for internal device of spacecraft cabin load - Google Patents
High-stability temperature control device for internal device of spacecraft cabin load Download PDFInfo
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- CN117508654A CN117508654A CN202311315951.3A CN202311315951A CN117508654A CN 117508654 A CN117508654 A CN 117508654A CN 202311315951 A CN202311315951 A CN 202311315951A CN 117508654 A CN117508654 A CN 117508654A
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- 239000004065 semiconductor Substances 0.000 claims abstract description 43
- 238000005253 cladding Methods 0.000 claims abstract description 41
- 238000009413 insulation Methods 0.000 claims abstract description 9
- 238000012546 transfer Methods 0.000 claims description 21
- 230000005855 radiation Effects 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 description 11
- 239000004519 grease Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Abstract
The invention discloses a high-stability temperature control device for an internal device of an external load of a spacecraft, which comprises a first module, wherein a temperature sensitive device, a circuit component and a first cladding piece are connected in the first module; the outer part of the first module is contacted with a semiconductor refrigerator, one end of the semiconductor refrigerator, which is far away from the first module, is contacted with a steam cavity, a first heat insulation piece is arranged between the steam cavity and the first module, and the steam cavity is connected with a heat sink; and the heat sink is connected with a second coating part, and the second coating part is coated outside the first module, the semiconductor refrigerator and the steam cavity. The invention can perform high-stability temperature control on the temperature sensitive device in the outside load of the aircraft cabin, can solve the problem of temperature interference of surrounding circuit components on the temperature sensitive device, and remarkably improves the temperature control efficiency and the temperature control stability.
Description
Technical Field
The invention belongs to the technical field of spacecrafts, and particularly relates to a high-stability temperature control device for an internal device of an external load of a spacecraft.
Background
In a spacecraft, the key components of the high-precision time-frequency system have high requirements on temperature stability, and temperature fluctuation can have great influence on performance. However, the load of the high-precision time-frequency system is generally installed outside the cabin of the spacecraft, and the radiation environment, the high-low temperature alternating environment and the heat flow in the load, which are greatly changed outside the cabin, all interfere with the high-precision time-frequency system, so that if the heat control is performed only through the platform of the spacecraft and the heat control is performed outside the load, the temperature fluctuation of key components is difficult to control in a small range.
In addition, the objects of high-precision thermal control of the spacecraft at home and abroad at present are mainly load and single machine, the temperature control position is often the position where the sensor is arranged, the temperature control of the temperature sensitive device is not reported by penetrating into the load, and the difficulty of thermal control of the temperature sensitive device in the load is increased due to the limitation of thermal interference, electric interference and internal space of a surrounding circuit in the load.
Disclosure of Invention
The invention provides a high-stability temperature control device for an internal device of a spacecraft cabin external load, which is used for overcoming the defects of the prior art and can be used for high-stability temperature control of a temperature-sensitive device.
The aim of the invention is achieved by the following technical scheme:
an internal device high stability temperature control device for spacecraft cabin external load, comprising:
a first module, the first module is connected with a temperature sensitive device and a circuit component, a groove body for blocking heat conduction between the circuit component and the temperature sensitive device is arranged on the first module, a first cladding piece for blocking heat radiation between the circuit component and the temperature sensitive device is connected on the first module,
the first cladding piece is coated outside the temperature sensitive device;
a semiconductor refrigerator in contact with an outside of the first module;
the steam cavity is contacted with one end of the semiconductor refrigerator, which is far away from the first module, a first heat insulation piece is arranged between the steam cavity and the first module, and the steam cavity is connected to the heat sink;
and the second coating part is connected to the heat sink and coats the first module, the semiconductor refrigerator and the steam cavity.
In one embodiment, an installation cavity is formed in the first module, the temperature sensitive device, the first cladding piece and the circuit component are all connected to the bottom of the installation cavity, the groove body is formed in the bottom of the installation cavity, and the groove body is located on one side, away from the temperature sensitive device, of the first cladding piece.
The beneficial effects of adopting above-mentioned technical scheme are: the groove body is positioned on one side of the first cladding piece far away from the temperature sensitive device, namely the groove body surrounds the temperature sensitive device, and when the circuit components conduct heat, the groove body around the temperature sensitive device can cut off the heat conduction path so as to reduce the influence of heat conduction generated by the circuit components on the temperature sensitive device.
In one embodiment, the temperature sensitive device includes a temperature sensitive portion and an electrical connector at one end of the temperature sensitive portion, the temperature sensitive portion being located within the first overmold.
The beneficial effects of adopting above-mentioned technical scheme are: the electric connector is located outside the first cladding piece, and is convenient to connect with the circuit components and parts, and meanwhile, the first cladding piece can isolate heat radiation from the temperature sensitive part.
In one embodiment, a second thermal shield is disposed between the temperature sensitive portion and the electrical connector.
The beneficial effects of adopting above-mentioned technical scheme are: a second heat insulation piece is arranged between the temperature sensitive part and the electric connector so as to reduce the influence of the electric connector on the temperature fluctuation of the temperature sensitive part.
In one embodiment, a temperature sensor is disposed within the temperature sensitive portion.
The beneficial effects of adopting above-mentioned technical scheme are: the temperature sensor can detect the temperature in the temperature sensitive part so as to monitor the temperature fluctuation of the temperature sensitive part.
In one embodiment, an internal device high stability temperature control device for spacecraft off-board loads includes a second module and a third module coupled to a heat sink, the first module being positioned between the second module and the third module.
The beneficial effects of adopting above-mentioned technical scheme are: the second module and the third module may be used to provide other functional components, and the first module is connected to the heat sink through the second module.
In one embodiment, a third thermal shield is disposed between the first module and the second module, and between the first module and the third module.
The beneficial effects of adopting above-mentioned technical scheme are: the functional components in the second module and the third module can generate heat during operation, and the third heat insulation piece can separate the heat, so that the influence of the heat generated by the second module and the third module on the first module is reduced, and the temperature of the temperature sensitive device is controlled in a high-stability mode.
In one embodiment, the vapor chamber includes a vertical portion in contact with the semiconductor refrigerator and a horizontal portion connected to the heat sink, with a first heat transfer layer disposed between the vertical portion and the semiconductor refrigerator.
The beneficial effects of adopting above-mentioned technical scheme are: the steam cavity conducts heat with the semiconductor refrigerator by means of the vertical part, and is connected with the heat sink by means of the horizontal part and conducts heat; the first heat transfer layer can improve heat conduction efficiency between the vertical part and the semiconductor refrigerator, so that heat generated in the first module is efficiently conducted to the steam cavity through the semiconductor refrigerator.
In one embodiment, the vertical portion is located inside the second cladding member and the horizontal portion is located outside the second cladding member.
The beneficial effects of adopting above-mentioned technical scheme are: the horizontal part is positioned outside the second cladding part, which is beneficial to transferring heat outwards.
In one embodiment, a second heat transfer layer is disposed between the semiconductor refrigerator and the first module.
The beneficial effects of adopting above-mentioned technical scheme are: the second heat transfer layer may improve heat transfer efficiency between the semiconductor refrigerator and the first module, thereby facilitating efficient transfer of heat generated in the first module to the semiconductor refrigerator.
The invention has the beneficial effects that:
the groove body can block heat conduction from the circuit components, and the first cladding piece can block heat radiation from the circuit components, so that heat conduction and heat radiation generated by the circuit components around the temperature sensitive device are prevented from affecting the temperature stability of the temperature sensitive device; the first heat insulation piece can prevent the temperature fluctuation of the heat sink on the satellite platform from influencing the temperature of the first module, so that the temperature fluctuation of the heat sink on the satellite platform is prevented from influencing the temperature of each device of the first module; the semiconductor refrigerator can conduct heat with the first module to conduct heat generated in the first module to the semiconductor refrigerator and transfer the heat to the heat sink through the steam cavity, and the second coating piece can reduce the influence of external heat flow on the first module, the steam cavity and the semiconductor refrigerator, so that the temperature stability of the temperature sensitive device is further ensured. In conclusion, the invention can perform high-stability temperature control on the temperature sensitive devices in the outside load of the aircraft cabin, can solve the problem of temperature interference of surrounding circuit components on the temperature sensitive devices, and remarkably improves the temperature control efficiency and the temperature control stability.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
FIG. 1 shows a schematic diagram of the structure of the first module of the present invention;
FIG. 2 shows an exploded view of the present invention at a first module;
FIG. 3 shows a partial enlarged view at A in FIG. 2;
FIG. 4 shows a schematic installation of the present invention;
FIG. 5 shows a partial enlarged view at B in FIG. 4;
FIG. 6 shows an exploded view of the present invention;
FIG. 7 shows a schematic structural view of the present invention;
in the drawings, like parts are designated with like reference numerals. The figures are not to scale.
Reference numerals:
1-first module, 101-mounting cavity, 2-temperature sensitive device, 201-temperature sensitive part, 202-electric connector, 3-first cladding, 4-cell body, 5-circuit component, 6-second heat insulator, 7-semiconductor refrigerator, 8-third heat insulator, 9-third module, 10-heat sink, 11-steam cavity, 1101-vertical part, 1102-horizontal part, 12-second module, 13-first heat insulator, 14-second cladding.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
The invention provides a high-stability temperature control device for an internal device of an external load of a spacecraft, which is shown in figures 1-7 and comprises the following components:
the temperature sensor comprises a first module 1, wherein a temperature sensor 2 and a circuit component 5 are connected in the first module 1, a groove body 4 for blocking heat conduction between the circuit component 5 and the temperature sensor 2 is arranged on the first module 1, a first cladding piece 3 for blocking heat radiation between the circuit component 5 and the temperature sensor 2 is connected on the first module 1, and the first cladding piece 3 is clad outside the temperature sensor 2;
a semiconductor refrigerator 7, the semiconductor refrigerator 7 being in contact with the outside of the first module 1;
a steam cavity 11, the steam cavity 11 contacts one end of the semiconductor refrigerator 7 far away from the first module 1, a first heat insulation piece 13 is arranged between the steam cavity 11 and the first module 1, and the steam cavity 11 is connected to the heat sink 10;
the second cladding piece 14, the second cladding piece 14 is connected on the heat sink 10, and the second cladding piece 14 cladding is outside the first module 1, the semiconductor refrigerator 7 and the steam cavity 11.
It can be understood that the groove body 4 can block heat conduction from the circuit component 5, and the first cladding member 3 can block heat radiation from the circuit component 5, so that heat conduction and heat radiation generated by the circuit component 5 around the temperature sensitive device 2 are prevented from affecting the temperature stability of the temperature sensitive device 2; the semiconductor refrigerator 7 can conduct heat with the first module 1 to conduct heat generated in the first module 1 to the semiconductor refrigerator 7 and transfer the heat to the heat sink 10 through the steam cavity 11, and the second cladding member 14 can reduce the influence of external heat flow on the first module 1, the steam cavity 11 and the semiconductor refrigerator 7, thereby further ensuring the temperature stability of the temperature sensitive device 2. In summary, the invention can perform high-stability temperature control on the temperature sensitive device 2 in the outside load of the aircraft, can solve the problem of temperature interference of the surrounding circuit components 5 on the temperature sensitive device 2, and remarkably improves the temperature control efficiency and the temperature control stability.
It should be noted that there may be a plurality of temperature sensitive devices 2 and circuit components 5, and each temperature sensitive device 2 is covered with a first covering member 3; the second coating 14 may be a multi-layer coating.
It should be noted that, the present invention can also stabilize the temperature of the temperature sensitive device 2 at a certain value according to the heat sink 10 and resource conditions of the satellite platform, so that the present invention can form a decoupling design with the satellite platform within a certain range without depending on the temperature change of the heat sink 10 on the satellite platform.
It should be further noted that, the first heat insulating member 13 may prevent the temperature fluctuation of the heat sink 10 on the satellite platform from affecting the temperature of the first module 1, so as to avoid the temperature fluctuation of the heat sink 10 on the satellite platform from affecting the temperature of each device of the first module 1.
In one embodiment, as shown in fig. 1-2, a mounting cavity 101 is provided in the first module 1, the temperature sensitive device 2, the first cladding member 3 and the circuit component 5 are all connected to the bottom of the mounting cavity 101, the tank body 4 is provided at the bottom of the mounting cavity 101, and the tank body 4 is located on one side of the first cladding member 3 away from the temperature sensitive device 2.
It can be understood that the groove body 4 is located at one side of the first cladding member 3 away from the temperature sensitive device 2, that is, the groove body 4 surrounds the temperature sensitive device 2, and when the circuit component 5 conducts heat, the groove body 4 around the temperature sensitive device can block the heat conduction path, so as to reduce the influence of the heat conduction generated by the circuit component 5 on the temperature sensitive device 2.
It should be noted that, compared with the circuit components 5, the number of the temperature sensitive devices 2 is relatively small, so that the tank body 4 is arranged around the temperature sensitive devices 2, which can reduce the workload during processing; and the groove body 4 is arranged around the temperature sensitive device 2, so that the heat conduction path can be lengthened, and part of heat generated by the circuit component 5 is dissipated in the heat conduction process.
In one embodiment, as shown in fig. 3, the temperature sensitive device 2 includes a temperature sensitive portion 201 and an electrical connector 202 located at one end of the temperature sensitive portion 201, the temperature sensitive portion 201 being located within the first cladding 3.
It will be appreciated that the electrical connector 202 is located outside the first cover member 3 to facilitate connection with the circuit component 5, and at the same time, the first cover member 3 may thermally isolate the temperature sensitive portion 201.
In one embodiment, as shown in fig. 3, a second thermal shield 6 is provided between the temperature sensitive portion 201 and the electrical connector 202.
It will be appreciated that the second thermal insulator 6 is provided between the temperature sensitive portion 201 and the electrical connector 202 to reduce the influence of the electrical connector 202 on the temperature fluctuation of the temperature sensitive portion 201.
In one embodiment, a temperature sensor is disposed within the temperature sensitive portion 201.
It will be appreciated that the temperature sensor may detect the temperature within the temperature sensitive portion 201 to monitor the magnitude of the temperature fluctuation of the temperature sensitive portion 201.
In one embodiment, as shown in fig. 4 and 6, the high stability temperature control device for the internal components of the load outside the spacecraft cabin comprises a second module 12 and a third module 9 connected with a heat sink 10, and the first module 1 is located between the second module 12 and the third module 9.
It will be appreciated that the second module 12 and the third module 9 may be used to provide other functional components and that the first module 1 is connected to the heat sink 10 via the second module 12.
In one embodiment, as shown in fig. 4 and 6, a third heat insulator 8 is provided between the first module 1 and the second module 12, and between the first module 1 and the third module 9.
It will be appreciated that the functional components of the second module 12 and the third module 9 generate heat during operation, and the third heat insulator 8 can block the heat, so as to reduce the influence of the heat generated by the second module 12 and the third module 9 on the first module 1, thereby performing high-stability temperature control on the temperature sensitive device 2.
In one embodiment, as shown in fig. 6, the steam cavity 11 includes a vertical portion 1101 contacting the semiconductor refrigerator 7 and a horizontal portion 1102 connected to the heat sink 10, i.e., the steam cavity 11 is generally "L" shaped, with a first heat transfer layer disposed between the vertical portion 1101 and the semiconductor refrigerator 7.
It will be appreciated that the vapor chamber 11 is thermally conductive to the semiconductor refrigerator 7 by means of the vertical portion 1101 and is connected and thermally conductive to the heat sink 10 by means of the horizontal portion 1102; among other things, the first heat transfer layer may improve heat transfer efficiency between the vertical portion 1101 and the semiconductor refrigerator 7, thereby facilitating efficient transfer of heat generated in the first module 1 to the steam cavity 11 via the semiconductor refrigerator 7.
The first heat transfer layer may be a thermal grease, and the thermal grease is coated between the vertical portion 1101 and the semiconductor refrigerator 7.
In one embodiment, as shown in fig. 7, the vertical portion 1101 is located inside the second cladding member 14, and the horizontal portion 1102 is located outside the second cladding member 14 and in good contact with the heat sink 10.
It will be appreciated that the horizontal portion 1102 is located outside the second cladding member 14 and in good contact with the heat sink 10, facilitating the transfer of heat outwardly.
In one embodiment, a second heat transfer layer is provided between the semiconductor refrigerator 7 and the first module 1.
It will be appreciated that the second heat transfer layer may increase the efficiency of heat transfer between the semiconductor refrigerator 7 and the first module 1, thereby facilitating efficient transfer of heat generated in the first module 1 to the semiconductor refrigerator 7.
The second heat transfer layer may be a thermal grease, and the thermal grease is coated between the semiconductor refrigerator 7 and the first module 1.
The invention provides a practical project, wherein the high-stability temperature control device for the internal device of the external load of the spacecraft is 220mm long, 200mm wide, 180mm high and 13kg in mass, and the external load of the spacecraft is arranged on the heat sink 10 of the satellite platform outside the satellite cabin. In the orbit running process of the satellite, the orbit attitude mode is more, and the external heat flow changes greatly; in-orbit device, the high-stability temperature control device of the internal device of the spacecraft cabin external load is in a 4K space environment, the surface of the high-stability temperature control device also receives external heat flows such as direct sunlight, earth infrared radiation, earth albedo and the like, the temperature change range of the satellite cabin external is +/-100 ℃, and the temperature range of the cabin plate is 20+/-10 ℃ through the thermal control measure of the satellite platform.
The outer load of the spacecraft is provided with two temperature sensitive devices 2, the heat consumption of the temperature sensitive devices 2 is 1W/each, the average total heat consumption of the outer load of the spacecraft is not more than 140W, the total heat consumption of each circuit component 5 in the first module 1 is 10W, and the temperature fluctuation range of the temperature sensitive devices 2 is required to be less than +/-0.05 ℃ in the in-orbit operation process.
Specifically, the temperature sensitive device 2 has a length of 17mm, a width of 20mm, and a height of 8mm; the first cladding piece 3 is made of polyimide material, the length of the first cladding piece 3 is 27mm, the width is 30mm, and the height is 10mm; the second heat insulation piece 6 is a glass fiber reinforced plastic plate with the thickness of 5mm, and the width of the groove body 4 is more than 3mm; the semiconductor refrigerator 7 has a length of 40mm, a width of 30mm, a height of 4.7mm, and a maximum refrigerating power of not less than 50W; when the steam cavity 11 conducts heat of less than 30W, the temperature difference between the cold end and the hot end is not more than 3 ℃; the third heat insulating piece 8 is made of glass fiber reinforced plastic plate with the thickness of 10mm, and the first heat insulating piece 13 is made of polyimide with the thickness of 3mm; the second coating member 14 was made of 10 units of heat insulating material, and a white atomic oxygen preventing composite film was coated on the outside of the heat insulating material, and a polyimide film 20 μm thick was formed on the inside.
The high-stability temperature control device for the internal device of the spacecraft cabin external load designed and installed according to the specific parameters is successfully transmitted along with the satellite, and the temperature sensitive device 2 is always stable between 32.6 ℃ and 32.64 ℃ in the in-orbit operation process, so that the temperature fluctuation requirement of +/-0.05 ℃ is met.
In the description of the present invention, it should be understood that the terms "upper," "lower," "bottom," "top," "front," "rear," "inner," "outer," "left," "right," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the different dependent claims and the features described herein may be combined in ways other than as described in the original claims. It is also to be understood that features described in connection with separate embodiments may be used in other described embodiments.
Claims (10)
1. An internal device high-stability temperature control device of a spacecraft cabin external load, which is arranged on a heat sink (10) of a satellite platform, and is characterized by comprising:
the temperature sensor comprises a first module (1), wherein a temperature sensitive device (2) and a circuit component (5) are connected in the first module (1), a groove body (4) for blocking heat conduction between the circuit component (5) and the temperature sensitive device (2) is arranged on the first module (1), a first cladding piece (3) for blocking heat radiation between the circuit component (5) and the temperature sensitive device (2) is connected on the first module (1), and the first cladding piece (3) is clad outside the temperature sensitive device (2);
-a semiconductor refrigerator (7), the semiconductor refrigerator (7) being in contact with the outside of the first module (1);
a steam cavity (11), wherein the steam cavity (11) contacts one end of the semiconductor refrigerator (7) far away from the first module (1), a first heat insulation piece (13) is arranged between the steam cavity (11) and the first module (1), and the steam cavity (11) is connected to the heat sink (10);
and the second cladding piece (14), the second cladding piece (14) is connected to the heat sink (10), and the second cladding piece (14) is clad outside the first module (1), the semiconductor refrigerator (7) and the steam cavity (11).
2. The high-stability temperature control device for the internal device of the spacecraft cabin external load according to claim 1, wherein a mounting cavity (101) is arranged in the first module (1), the temperature sensitive device (2), the first cladding piece (3) and the circuit component (5) are all connected to the bottom of the mounting cavity (101), the groove body (4) is arranged at the bottom of the mounting cavity (101), and the groove body (4) is positioned at one side, far away from the temperature sensitive device (2), of the first cladding piece (3).
3. An internal device highly stable temperature control device for spacecraft off-board loads according to claim 1, characterized in that the temperature sensitive device (2) comprises a temperature sensitive part (201) and an electrical connector (202) at one end of the temperature sensitive part (201), the temperature sensitive part (201) being located in the first cladding (3).
4. A spacecraft cabin load internal device high stability temperature control device according to claim 3, wherein a second insulation (6) is provided between the temperature sensitive part (201) and the electrical connector (202).
5. A spacecraft extravehicular load internal device high stability temperature control apparatus according to claim 3, wherein a temperature sensor is disposed within said temperature sensitive portion (201).
6. An external load internal device high stability temperature control device according to claim 1, characterized in that the external load internal device high stability temperature control device comprises a second module (12) and a third module (9) connected to the heat sink (10), the first module (1) being located between the second module (12) and the third module (9).
7. The high-stability temperature control device for the internal components of the load outside the spacecraft cabin according to claim 6, wherein a third heat insulator (8) is arranged between the first module (1) and the second module (12) and between the first module (1) and the third module (9).
8. An internal device high stability temperature control arrangement for spacecraft off-board loads according to claim 1, characterized in that the steam cavity (11) comprises a vertical part (1101) in contact with the semiconductor refrigerator (7) and a horizontal part (1102) connected with the heat sink (10), a first heat transfer layer being provided between the vertical part (1101) and the semiconductor refrigerator (7).
9. The high stability temperature control device for an internal component of an outboard load of a spacecraft of claim 8 wherein said vertical portion (1101) is located within said second cladding (14) and said horizontal portion (1102) is located outside said second cladding (14).
10. An internal device high stability temperature control device for spacecraft off-board loads according to claim 1, characterized in that a second heat transfer layer is provided between the semiconductor refrigerator (7) and the first module (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311315951.3A CN117508654A (en) | 2023-10-11 | 2023-10-11 | High-stability temperature control device for internal device of spacecraft cabin load |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311315951.3A CN117508654A (en) | 2023-10-11 | 2023-10-11 | High-stability temperature control device for internal device of spacecraft cabin load |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117508654A true CN117508654A (en) | 2024-02-06 |
Family
ID=89740786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311315951.3A Pending CN117508654A (en) | 2023-10-11 | 2023-10-11 | High-stability temperature control device for internal device of spacecraft cabin load |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117508654A (en) |
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2023
- 2023-10-11 CN CN202311315951.3A patent/CN117508654A/en active Pending
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