CN117506121A - Laser power monitoring system, laser processing method, device, system and medium - Google Patents
Laser power monitoring system, laser processing method, device, system and medium Download PDFInfo
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- CN117506121A CN117506121A CN202410016016.5A CN202410016016A CN117506121A CN 117506121 A CN117506121 A CN 117506121A CN 202410016016 A CN202410016016 A CN 202410016016A CN 117506121 A CN117506121 A CN 117506121A
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 45
- 238000003672 processing method Methods 0.000 title claims abstract description 12
- 238000012545 processing Methods 0.000 claims abstract description 64
- 230000003287 optical effect Effects 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000004590 computer program Methods 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 7
- 238000012806 monitoring device Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The embodiment of the invention discloses a laser power monitoring system, a laser processing method, a laser processing device, a laser power monitoring system and a laser processing medium. The system comprises: the optical gate is used for receiving the light beam emitted by the laser and dividing the light beam into a first path of light beam and a second path of light beam for processing; the beam splitter is used for splitting the second path of light beam into a third path of light beam and a fourth path of light beam for monitoring; the optical trap is used for absorbing redundant third paths of light beams; the photodetector is used for receiving the fourth path light beam so as to monitor the fourth path light beam. The method comprises the following steps: receiving a mode selection instruction, and controlling the optical gate not to split beams when the mode is a time-sharing mode; when the mode is the energy-division mode, the control optical shutter divides the light beam emitted by the laser into a first light beam for processing and a second light beam for realizing monitoring. The method can solve the problem that the laser power cannot be effectively monitored in the prior art.
Description
Technical Field
The invention relates to the technical field of additive manufacturing, in particular to a laser power monitoring system, a laser processing method, a device, a system and a medium.
Background
With the development of technology, additive manufacturing is becoming an advanced manufacturing technology. In the prior art, high-power laser is generally focused on metal powder on a substrate after being reflected to a field lens through a collimating lens and a vibrating lens, and the powder on the substrate is melted in a point-by-point scanning way according to a path, so that the control of the laser power is also indispensable, a spectroscope is usually placed on a laser path, the laser power is collected for monitoring the laser power, but the installation of an on-line monitoring lens can influence an original laser path and increase the damage risk of the whole printing system because of the placement of the lens, and the space optical path is complex to install and adjust and has poor stability, so that the laser power cannot be effectively monitored.
Disclosure of Invention
The embodiment of the invention provides a laser power monitoring system, a laser processing method, a laser power monitoring device, a laser processing device and a laser processing medium, and aims to solve the problem that the laser power cannot be effectively monitored in the prior art.
In a first aspect, an embodiment of the present invention provides a laser power monitoring system and a laser processing method, including: a laser power monitoring system, comprising: the optical gate is used for receiving the light beam emitted by the laser and dividing the light beam into a first path of light beam and a second path of light beam, wherein the power of the second path of light beam is smaller than that of the first path of light beam; the beam splitter is used for splitting the second light beam into a third light beam and a fourth light beam for monitoring, wherein the power of the fourth light beam is smaller than that of the third light beam; the optical trap is used for absorbing the superfluous third light beams; the photodetector is configured to receive the fourth beam of light to monitor the fourth beam of light.
In a second aspect, embodiments of the present invention also provide a laser processing system, including: the laser emits light beams to the optical gate; the collimating mirror is used for collimating the first path of light beams emitted from the optical shutter; the galvanometer is used for reflecting the first path of light beams emitted from the collimating lens; the field lens is used for focusing the first path of light beam emitted from the vibrating mirror, so that the first path of light beam is focused on the metal powder of the substrate to be processed.
In a third aspect, an embodiment of the present invention further provides a laser processing method, applied to a laser processing system, including: receiving a mode selection instruction, wherein the modes comprise a time-sharing mode and an energy-sharing mode; when the mode is a time-sharing mode, the optical shutter is controlled not to split so that all light beams emitted by the laser are used for processing; when the mode is an energy splitting mode, the optical shutter is controlled to split beams so as to split the beams emitted by the laser into a first beam and a second beam for processing and monitoring.
In a fourth aspect, an embodiment of the present invention further provides a laser processing apparatus, which is applied to a laser processing system, including: a selection unit for receiving a mode selection instruction, wherein the modes comprise a time-sharing mode and an energy-sharing mode; the time-sharing unit is used for controlling the optical shutter not to split the beam when the mode is a time-sharing mode so that all the light beams emitted by the laser are used for processing; and the energy splitting unit is used for controlling the optical shutter to split beams when the mode is an energy splitting mode so as to split the beam emitted by the laser into a first beam and a second beam for processing and monitoring.
In a fifth aspect, an embodiment of the present invention further provides a laser processing system, where the laser processing system includes a memory and a processor, where the memory stores a computer program, and the processor executes the computer program to implement the method according to the third aspect.
In a sixth aspect, embodiments of the present invention also provide a computer readable storage medium storing a computer program comprising program instructions which, when executed by a processor, implement the above-described method.
The embodiment of the invention provides a laser power monitoring system, a laser processing method, a laser power monitoring device, laser processing equipment and a laser processing medium. Wherein the method comprises the following steps: receiving a mode selection instruction, wherein the modes comprise a time-sharing mode and an energy-sharing mode; when the mode is a time-sharing mode, the optical shutter is controlled not to split so that all light beams emitted by the laser are used for processing; when the mode is an energy splitting mode, the optical shutter is controlled to split beams so as to split the beams emitted by the laser into a first beam and a second beam for processing and monitoring. According to the embodiment of the invention, by selecting the required mode, if the energy splitting mode is selected, the light beams emitted by the laser are split, and are respectively used for processing and monitoring, so that the position error of focusing the laser on the substrate, which is introduced by putting the lens in the light path, is avoided while the original light path is not influenced, the possibility of damage to the lens, which is caused by high-power laser striking the lens put in the light path, is avoided, and the power of the laser can be effectively monitored.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a laser processing system according to an embodiment of the present invention;
fig. 2 is a schematic flow chart of a laser processing method according to an embodiment of the present invention;
FIG. 3 is a schematic block diagram of a laser processing apparatus according to an embodiment of the present invention;
fig. 4 is a schematic block diagram of a laser processing system according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1, fig. 1 is a schematic diagram of a laser processing system according to an embodiment of the invention. The laser processing system is monitored by a laser power monitoring system. The monitoring system of laser power in this embodiment includes: the laser device comprises a laser 10, a light gate 20, a beam splitter 30, an optical trap 40 and a photoelectric detector 50, wherein the light gate 20 is arranged at a laser outlet and can split laser emitted by the laser 10, the beam splitter 30 is positioned behind the light gate 20 and is used for dividing the laser again, the optical trap 40 absorbs redundant laser and the photoelectric detector 50 detects power according to the received laser. The method can avoid the possibility of damaging the lens due to the fact that high-power laser is beaten on the lens placed in the light path, and effectively monitor the power of the laser.
The optical shutter is used for receiving a light beam emitted by the laser and dividing the light beam into a first path of light beam and a second path of light beam, wherein the power of the second path of light beam is smaller than that of the first path of light beam.
In this embodiment, the shutter is a beam splitter, and may split the laser light into two paths. The light beam emitted by the laser firstly encounters the optical shutter, the optical shutter divides the laser into a first light beam and a second light beam according to the light splitting ratio, the power of the second light beam is smaller than that of the first light beam, for example, the total power of the light beam emitted by the laser is 500W, then the light beam can be divided into a first light beam with 300W and a second light beam with 200W through the optical shutter, wherein the first light beam is used for printing work in a substrate, and the second light beam is used for monitoring the laser power after being processed.
In addition, the present embodiment further includes: the spectral ratio of the shutter is 99:1, the first path of light beam has a duty ratio of 99%, and the second path of light beam has a duty ratio of 1%. Wherein 99% of the laser is used for the print job and 1% of the laser is used for the monitoring system. For example, the total power of the beams emitted by the laser is 500W, the laser power for the printing operation is 495W, and the laser power of the second beam is 5W. The beam is split according to the splitting ratio, so that the monitoring of the laser power is realized through the second path of beam power, the influence on the printing of a workpiece due to the reduction of the laser power can be avoided, and the light beam emitted by the laser is received by the optical gate first, so that the beam is split before the laser beam enters the collimating mirror, and the original light path is not influenced. The position error of focusing the laser on the substrate, which is caused by the lens placed in the optical path, is avoided.
The beam splitter is used for splitting the second light beam into a third light beam and a fourth light beam for monitoring, wherein the power of the fourth light beam is smaller than that of the third light beam.
In this embodiment, the beam splitter is a lens for splitting the laser light into two paths. The beam splitter is positioned behind the optical gate and is positioned in the range of a second path of light beam, the beam splitter receives the second path of light beam, splits the second path of light beam according to a beam splitting ratio and can be divided into a third path of light beam and a fourth path of light beam, wherein the third path of light beam is a redundant light beam and is not used for executing any operation, and the power of the fourth path of light beam is far smaller than the power of the third path of light beam and is used for monitoring laser emitted by the laser. In this embodiment, the method further includes: the beam splitting ratio of the beam splitter is 99.9:0.1, wherein the third path of light beam has a duty ratio of 99.9%, and the fourth path of light beam has a duty ratio of 0.1%. The beam splitter receives the second path of light beam according to 99.9: the fraction ratio of 0.1 is used for splitting, for example, the laser power of the second path of light beam is 5W, the laser power of the fourth path of light beam is 5mW, and the residual power is the laser power of the third path of light beam. By following the beam splitter cases 99.9: the beam splitting ratio of 0.1 splits the second beam to obtain the fourth beam, so that the power of the obtained fourth beam is in the acceptable power range of the photoelectric detector, and the monitoring of the laser power is completed without damaging the detector.
The optical trap is used for absorbing the superfluous third light beam.
In this embodiment, the optical trap is composed of a partially transparent mirror, a thin and weak absorber, two converging lenses and a full mirror for collecting the excess laser light. The third path of light beam is absorbed by using the optical trap, so that no redundant laser reaches the subsequent photoelectric detector, and the detector is not damaged.
The photodetector is configured to receive the fourth beam of light to monitor the fourth beam of light.
In this embodiment, the photoelectric detector is a detector for implementing photoelectric conversion, the photoelectric detector converts the received laser power into a current signal through photoelectric conversion, the current signal is converted into a voltage signal through a transimpedance amplifying circuit and output, and the output voltage signal characterizes the laser power stability. Specifically, the photodetector converts the received fourth path light beam into a current signal, converts the current signal into a voltage signal, and outputs the voltage signal. The stability of the laser can be determined by the stability of the output voltage signal, for example, the voltage signal is stable, which is used to illustrate that the power of the laser received by the detector is stable, i.e. the laser output power of the laser is stable. The stability of the laser is monitored by a photodetector.
The embodiment of the invention also provides a laser processing system, as shown in fig. 1, which comprises the laser power detection system, the laser 10, the collimating mirror 60, the galvanometer 70 and the field lens 80 in the embodiment, wherein the laser 10 is used for emitting a light beam to the optical gate; the collimating mirror 60 is configured to collimate the first path of light beam exiting the optical shutter; the galvanometer 70 is configured to reflect the first path of light beam emitted from the collimator lens; the field lens 80 is configured to focus the first beam exiting from the galvanometer, so that the first beam is focused on the metal powder of the substrate to be processed.
In this embodiment, the laser is configured to emit a light beam to the shutter. The laser is a light source of laser and is used for emitting a divergent Gaussian beam to the optical gate, wherein the wavelength of the beam emitted by the laser is 1064nm. The light beam emitted by the laser is transmitted by an optical fiber. The emitted laser beam is transmitted by the optical fiber, so that the structural tolerance of the laser processing system is small, and the alignment is easy to install and adjust.
In this embodiment, the collimating mirror is configured to collimate the first path of light beam exiting from the optical shutter. The collimator lens is an optical element for converting a light beam into parallel light or quasi-parallel light, and specifically, since a laser beam emitted from the laser is transmitted by an optical fiber, the collimator lens is required to shape the laser beam into parallel light. And after the optical shutter splits the light beam, generating the first path of light beam. The first path of light beam is collimated by the collimating lens, so that aberration caused by the fact that laser subsequently passes through a scene can be reduced, and the possibility of damage to the lens caused by high-power laser striking on the lens placed in the light path is avoided.
In this embodiment, the galvanometer is configured to reflect the first path of light beam exiting from the collimator lens. The galvanometer is an optical device that reflects and controls the direction of the beam. The first path of light beam passes through the collimating mirror and then strikes the surface of the 45-degree scanning galvanometer, and the galvanometer can reflect the first path of light beam. The first path of light beam emitted from the collimating lens is reflected by using the vibrating lens, so that the light beam can accurately reach the field lens and the substrate to be processed, and the laser processing part can be smoothly used.
In this embodiment, the field lens is configured to focus the first beam exiting from the galvanometer, so that the first beam is focused on the metal powder of the substrate to be processed. The field lens works near the focal plane of the objective lens, which can effectively reduce the size of the detector. The field lens receives the first path of light beam emitted from the vibrating mirror and focuses the first path of light beam. The field lens focuses the first path of light beam so that the first path of light beam can be focused into the substrate to be processed, and parts on the substrate can be processed.
Fig. 2 is a schematic flow chart of a laser processing method according to an embodiment of the present invention. The method is applied to the laser processing system, and as shown in the figure, the method comprises the following steps S110-S130.
S110, receiving a mode selection instruction, wherein the modes comprise a time-sharing mode and an energy-sharing mode.
In this embodiment, the mode selection instruction is an instruction for controlling the operation mode of the shutter, and the shutter is divided into a time-sharing mode and a energy-sharing mode. Specifically, after receiving the mode selection instruction, corresponding measures are executed according to the instruction, for example, selecting the time-sharing mode, all lasers are used for processing the part, the lasers are not additionally divided into lasers for monitoring the laser power, if the lasers are in the energy-division mode, the laser beams are split, and a small part of the lasers are taken out for monitoring the laser power. And receiving the selection instruction to select a mode suitable for the current scene and meet the application of multiple laser conditions.
And S120, when the mode is a time-sharing mode, the optical shutter is controlled not to split so that all light beams emitted by the laser are used for processing.
In this embodiment, the time-sharing mode is a mode in which only one workstation uses the laser at any given time, and the power of the laser may not be monitored in this mode, and the laser emitted by the laser is not split by the shutter and is used for processing the metal powder on the substrate. Specifically, if in the time-sharing mode, the laser emits the light beam, the light beam is transmitted to the collimating mirror through the optical fiber, the collimating mirror shapes the light beam into parallel light, the parallel light is emitted to the surface of the 45-degree scanning vibrating mirror, the vibrating mirror refracts the parallel light to the field mirror, and the field mirror focuses the parallel light into metal powder of the substrate to be processed, so that the processing of the part to be printed is realized. The light beam emitted by the laser can be used for processing by controlling the optical shutter to not split in a time-sharing mode.
And S130, when the mode is an energy splitting mode, controlling the optical shutter to split the beam so as to split the beam emitted by the laser into a first beam and a second beam for processing and monitoring.
In this embodiment, the energy splitting mode is a mode in which two workstations simultaneously receive laser power. I.e. one for receiving the beam for workpiece processing and the other for monitoring the laser power, it is then necessary to control the shutter to split the laser beam in order to split the beam emitted by the laser into a first beam for processing and a second beam for monitoring. Specifically, the laser emits a beam and transmits the beam in an optical fiber manner, and when the beam passes through the shutter, the shutter performs the following steps according to 99: the beam splitting ratio of 1 divides the laser beam into a first path of light beam and a second path of light beam, wherein the first path of light beam occupies 99% of laser power, and the second path of light beam has 1% of laser power. And transmitting the second path of light beam to a beam splitter by an optical fiber, dividing the second path of light beam by the beam splitter according to the beam splitting ratio of 99.9:0.1 to generate a third path of light beam and a fourth path of light beam, wherein the laser power of the fourth path of light beam is smaller than that of the third path of light beam, absorbing the third path of light beam by the optical fiber, and monitoring the power of the laser beam by a photoelectric detector and the fourth path of light beam. Specifically, the photoelectric detector converts the fourth path of light beam into a current signal and then converts the current signal into a voltage signal so as to realize monitoring of laser power. The optical shutter is controlled to split the beam so as to divide the beam emitted by the laser into a first beam and a second beam for processing and monitoring, so that the laser power can be monitored under the conditions of not influencing the printing process of the part and not damaging the detector.
Fig. 3 is another schematic block diagram of a laser processing apparatus 200 according to an embodiment of the present invention. As shown in fig. 3, the present invention also provides a laser processing apparatus corresponding to the above laser processing method. The laser processing apparatus comprises means for performing the above-described method of monitoring laser power, which apparatus may be configured in a laser processing system. Specifically, referring to fig. 3, the laser power monitoring device includes a selecting unit 210, a time-sharing unit 220, and an energy-sharing unit 230.
A selection unit 210 for receiving a mode selection instruction, wherein the modes include a time-sharing mode and a energy-sharing mode.
And the time-sharing unit 220 is used for controlling the optical shutter not to split the beam when the mode is the time-sharing mode so that all the beams emitted by the laser are used for processing.
And the energy splitting unit 230 is configured to control the shutter to split the beam when the mode is an energy splitting mode, so as to split the beam emitted by the laser into a first beam and a second beam for processing and monitoring.
It should be noted that, as a person skilled in the art can clearly understand the specific implementation process of the above-mentioned monitoring device 200 for laser power and each unit, reference may be made to the corresponding descriptions in the foregoing method embodiments, and for convenience and brevity of description, the description is omitted here.
The above-described laser power monitoring device may be implemented in the form of a computer program that is operable on a laser machining system as shown in fig. 4.
Referring to fig. 4, fig. 4 is a schematic block diagram of a laser processing system according to an embodiment of the present application. The laser processing system comprises a laser, a collimating mirror, a galvanometer, a field lens, a light gate, a beam splitter, an optical trap and a photoelectric detector.
Referring to fig. 4, the laser processing system 500 includes a processor 502, a memory, and a network interface 505, which are connected by a system bus 501, wherein the memory may include a non-volatile storage medium 503 and an internal memory 504.
The non-volatile storage medium 503 may store an operating system 5031 and a computer program 5032. The computer program 5032 includes program instructions that, when executed, cause the processor 502 to perform a laser power monitoring system and a laser machining method.
The processor 502 is used to provide computing and control capabilities to support the operation of the overall laser processing system 500.
The internal memory 504 provides an environment for the execution of a computer program 5032 in the non-volatile storage medium 503, which computer program 5032, when executed by the processor 502, causes the processor 502 to perform a laser power monitoring system and a laser machining method.
The network interface 505 is used for network communication with other devices. Those skilled in the art will appreciate that the structure shown in fig. 4 is merely a block diagram of a portion of the structure associated with the present application and is not limiting of the laser processing system 500 to which the present application is applied, and that a particular laser processing system 500 may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
Wherein the processor 502 is adapted to run a computer program 5032 stored in a memory for implementing the steps of the above method.
It should be appreciated that in embodiments of the present application, the processor 502 may be a central processing unit (Central Processing Unit, CPU), the processor 502 may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSPs), application specific integrated circuits (Application Specific Integrated Circuit, ASICs), off-the-shelf programmable gate arrays (Field-Programmable Gate Array, FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. Wherein the general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
Those skilled in the art will appreciate that all or part of the flow in a method embodying the above described embodiments may be accomplished by computer programs instructing the relevant hardware. The computer program comprises program instructions, and the computer program can be stored in a storage medium, which is a computer readable storage medium. The program instructions are executed by at least one processor in the computer system to implement the flow steps of the embodiments of the method described above.
Accordingly, the present invention also provides a storage medium. The storage medium may be a computer readable storage medium. The storage medium stores a computer program, wherein the computer program includes program instructions. The program instructions, when executed by a processor, cause the processor to perform the steps of the method as described above.
The storage medium may be a U-disk, a removable hard disk, a Read-Only Memory (ROM), a magnetic disk, or an optical disk, or other various computer-readable storage media that can store program codes.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps described in connection with the embodiments disclosed herein may be embodied in electronic hardware, in computer software, or in a combination of the two, and that the elements and steps of the examples have been generally described in terms of function in the foregoing description to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the several embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the device embodiments described above are merely illustrative. For example, the division of each unit is only one logic function division, and there may be another division manner in actual implementation. For example, multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed.
The steps in the method of the embodiment of the invention can be sequentially adjusted, combined and deleted according to actual needs. The units in the device of the embodiment of the invention can be combined, divided and deleted according to actual needs. In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The integrated unit may be stored in a storage medium if implemented in the form of a software functional unit and sold or used as a stand-alone product. Based on such understanding, the technical solution of the present invention is essentially or a part contributing to the prior art, or all or part of the technical solution may be embodied in the form of a software product stored in a storage medium, comprising several instructions for causing a laser processing system (which may be a personal computer, a terminal, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention.
While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (10)
1. A laser power monitoring system, comprising: a shutter, a beam splitter, an optical trap, and a photodetector,
the optical shutter is used for receiving a light beam emitted by the laser and dividing the light beam into a first path of light beam and a second path of light beam, wherein the power of the second path of light beam is smaller than that of the first path of light beam;
the beam splitter is used for splitting the second light beam into a third light beam and a fourth light beam for monitoring, wherein the power of the fourth light beam is smaller than that of the third light beam;
the optical trap is used for absorbing the superfluous third light beams;
the photodetector is configured to receive the fourth beam of light to monitor the fourth beam of light.
2. The laser power monitoring system of claim 1, wherein the optical shutter has a split ratio of 99:1, the first path of light beam has a duty ratio of 99%, and the second path of light beam has a duty ratio of 1%.
3. The laser power monitoring system of claim 1, wherein the beam splitter has a beam splitting ratio of 99.9:0.1, wherein the third path of light beam has a duty ratio of 99.9%, and the fourth path of light beam has a duty ratio of 0.1%.
4. A laser processing system for processing metal powder on a substrate to be processed, comprising a laser power monitoring system according to any one of claims 1-3.
5. The laser machining system of claim 4, further comprising: a laser, a collimating lens, a vibrating lens and a field lens,
the laser is used for emitting light beams to the optical gate;
the collimating mirror is used for collimating the first path of light beams emitted from the optical shutter;
the galvanometer is used for reflecting the first path of light beams emitted from the collimating lens;
the field lens is used for focusing the first path of light beam emitted from the vibrating mirror, so that the first path of light beam is focused on the metal powder of the substrate to be processed.
6. The laser processing system of claim 4, wherein the laser emits laser light having a wavelength of 1064nm.
7. A laser processing method, characterized by being applied to the laser processing system according to any one of claims 4 to 6, the method comprising:
receiving a mode selection instruction, wherein the modes comprise a time-sharing mode and an energy-sharing mode;
when the mode is a time-sharing mode, the optical shutter is controlled not to split so that all light beams emitted by the laser are used for processing;
when the mode is an energy splitting mode, the optical shutter is controlled to split beams so as to split the beams emitted by the laser into a first beam and a second beam for processing and monitoring.
8. A laser processing apparatus, comprising:
a selection unit for receiving a mode selection instruction, wherein the modes comprise a time-sharing mode and an energy-sharing mode;
the time-sharing unit is used for controlling the optical shutter not to split the beam when the mode is a time-sharing mode so that all the light beams emitted by the laser are used for processing;
and the energy splitting unit is used for controlling the optical shutter to split beams when the mode is an energy splitting mode so as to split the beam emitted by the laser into a first beam and a second beam for processing and monitoring.
9. A laser machining system comprising a memory and a processor, the memory having a computer program stored thereon, the processor implementing the method of claim 7 when executing the computer program.
10. A storage medium storing a computer program comprising program instructions which, when executed by a processor, implement the method of claim 7.
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| CN202410016016.5A CN117506121A (en) | 2024-01-05 | 2024-01-05 | Laser power monitoring system, laser processing method, device, system and medium |
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