CN117499524A - Equipment interaction method, electronic equipment and communication system - Google Patents
Equipment interaction method, electronic equipment and communication system Download PDFInfo
- Publication number
- CN117499524A CN117499524A CN202311438443.4A CN202311438443A CN117499524A CN 117499524 A CN117499524 A CN 117499524A CN 202311438443 A CN202311438443 A CN 202311438443A CN 117499524 A CN117499524 A CN 117499524A
- Authority
- CN
- China
- Prior art keywords
- chip
- communication interface
- module
- instruction
- called
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004891 communication Methods 0.000 title claims abstract description 255
- 238000000034 method Methods 0.000 title claims abstract description 65
- 230000003993 interaction Effects 0.000 title abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims description 27
- 238000012360 testing method Methods 0.000 claims description 17
- 230000000694 effects Effects 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 claims description 6
- 230000006870 function Effects 0.000 description 18
- 238000004590 computer program Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72403—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality
- H04M1/72409—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality by interfacing with external accessories
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72403—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality
- H04M1/72409—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality by interfacing with external accessories
- H04M1/72412—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality by interfacing with external accessories using two-way short-range wireless interfaces
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72403—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality
- H04M1/72409—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality by interfacing with external accessories
- H04M1/72415—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality by interfacing with external accessories for remote control of appliances
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
- H04W52/02—Power saving arrangements
- H04W52/0209—Power saving arrangements in terminal devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
- H04W52/02—Power saving arrangements
- H04W52/0209—Power saving arrangements in terminal devices
- H04W52/0261—Power saving arrangements in terminal devices managing power supply demand, e.g. depending on battery level
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Telephone Function (AREA)
Abstract
The application relates to a device interaction method, electronic equipment and a communication system. Under the condition that the first communication interface is connected with the second communication interface and receives the first configuration signal, the first communication interface is in a main control state, and a resource request instruction is sent to the second chip through the second communication interface; receiving information of a module to be called fed back from a second chip based on a resource request instruction; and outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute the target operation. According to the chip communication interaction method and device, chip communication interaction in two devices is achieved through the first communication interface and the second communication interface, operation control of the controlled device where the chip in the controlled state is located by the master control device where the chip in the master control state is located is further achieved, and interaction rate between the devices is improved.
Description
Technical Field
The present disclosure relates to the field of chip technologies, and in particular, to a device interaction method, an electronic device, and a communication system.
Background
Under the same physical process, the main way to improve the performance of the mobile processor is to improve the running main frequency and use parallel processing. Increasing the dominant frequency is the most direct and efficient approach, but with the consequent surge in power consumption; also increasing the number of processor cores can exacerbate cost pressures.
The traditional implementation method is to extend the functions of the mobile device to the operation and running in the fixed device through the WIFI, but the interconnection performance of the method is limited by the bandwidth and time delay of the WIFI.
Disclosure of Invention
Based on the foregoing, it is necessary to provide a device interaction method, an electronic device and a communication system.
In a first aspect, the present application provides a device interaction method, applied to a first device, where the first device includes a first chip and a first communication interface; the second device is provided with a second chip, a second communication interface and a plurality of modules to be called; the method comprises the following steps:
when the first communication interface is connected with the second communication interface and receives a first configuration signal, the first communication interface is in a main control state, and a resource request instruction is sent to the second chip through the second communication interface;
receiving information of a module to be called fed back from the second chip based on the resource request instruction;
and outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute target operation.
In one embodiment, the first execution instruction includes a first call instruction; when the first device and the second device are mobile devices, outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute a target operation includes:
Determining a target calling module according to the first configuration signal and the information of the module to be called, and outputting a corresponding first calling instruction to enable the second chip to control the target calling module to work and control other modules except the target calling module in the module to be called to stop working.
In one embodiment, the first execution instruction includes a second call instruction; the plurality of modules to be called comprise a functional module, a heat dissipation module and a charging module; when at least one of the first device and the second device is a fixed device, outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be invoked, so as to instruct the second chip to execute a target operation includes:
and working at a preset voltage and a preset frequency, and outputting a corresponding second calling instruction according to the first configuration signal and the information of the module to be called so as to instruct the second chip to control each functional module to work under the heat dissipation effect of the heat dissipation module and the power supply effect of the charging module based on the second calling instruction under the preset voltage and the preset frequency.
In one embodiment, before the sending, through the second communication interface, the resource request instruction to the second chip further includes:
Performing a communication test on the first communication interface and the second communication interface;
and when the communication test result is normal communication, sending a resource request instruction to the second chip through the second communication interface.
In one embodiment, before the sending, through the second communication interface, the resource request instruction to the second chip further includes:
and under the condition that the result of the communication test is normal communication, configuring the first communication interface and the second communication interface so as to enable the first communication interface and the second communication interface to perform signal transmission at a target rate.
In a second aspect, the application further provides a device interaction method, which is applied to a first device, wherein the first device comprises a first chip, a first communication interface and a plurality of modules to be called; the second device is provided with a second chip and a second communication interface; the method comprises the following steps:
under the condition that the first communication interface is connected with the second communication interface and receives a second configuration signal, the first communication interface is in a controlled state, and a resource request instruction from the second chip is received through the first communication interface;
feeding back module information to be called to the second chip based on the resource request instruction;
And receiving a second operation instruction output by the second chip according to the second configuration signal and the module to be called, and executing target operation according to the second operation instruction.
In a third aspect, the present application further provides an electronic device, including:
a first communication interface for connecting with a second communication interface of another electronic device;
the first chip is connected with the first communication interface, and is used for being in a master control state and sending a resource request instruction to a second chip of the other electronic device through the second communication interface when the first communication interface is connected with the second communication interface and a first configuration signal is received; the method comprises the steps of,
receiving module information to be called fed back by a second chip in another electronic device based on the resource request instruction; the method comprises the steps of,
and outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute target operation.
In a fourth aspect, the present application further provides an electronic device, including:
a plurality of modules to be called;
a first communication interface for connecting with a second communication interface of another electronic device;
The first chip is connected with the first communication interface, and is used for being in a controlled state and receiving a resource request instruction of a second chip from another electronic device through the first communication interface when the first communication interface is connected with the second communication interface and a second configuration signal is received; the method comprises the steps of,
feeding back module information to be called to the second chip based on the resource request instruction; the method comprises the steps of,
and receiving a second operation instruction output by the second chip according to the second configuration signal and the module to be called, and executing target operation according to the second operation instruction.
In one embodiment, the first communication interface and the second communication interface include any one of a PCIe interface, a CXL interface, and a USB interface.
In a fifth aspect, the present application also provides a communication system, including:
the electronic device comprises first electronic equipment and second electronic equipment, wherein the first electronic equipment comprises a first communication interface and a first chip, and the second electronic equipment comprises a second communication interface and a second chip;
the first communication interface is respectively connected with the first chip and the second communication interface, and the second communication interface is connected with the second chip;
The first chip is used for being in a master control state when the first communication interface is connected with the second communication interface and a first configuration signal is received, and sending a resource request instruction to the second chip through the second communication interface;
the first chip is further configured to receive information of a module to be invoked fed back from the second chip based on the resource request instruction, and output a first operation instruction to the second chip according to the first configuration signal and the information of the module to be invoked, so as to instruct the second chip to execute a target operation.
The device interaction method, the electronic device and the communication system. Under the condition that the first communication interface is connected with the second communication interface and receives the first configuration signal, the first communication interface is in a main control state, and a resource request instruction is sent to the second chip through the second communication interface; receiving information of a module to be called fed back from a second chip based on a resource request instruction; and outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute the target operation. According to the chip communication interaction method and device, chip communication interaction in two devices is achieved through the first communication interface and the second communication interface, operation control of the controlled device where the chip in the controlled state is located by the master control device where the chip in the master control state is located is further achieved, and interaction rate between the devices is improved.
Drawings
FIG. 1 is one of the flow diagrams of a device interaction method in one embodiment;
FIG. 2 is a schematic flow chart before sending a resource request instruction to a second chip through a second communication interface in one embodiment;
FIG. 3 is a second flow chart of a method of device interaction in one embodiment;
FIG. 4 is a third flow chart of a method of device interaction in one embodiment;
FIG. 5 is a block diagram of the structural schematic of the device interaction apparatus in one embodiment;
FIG. 6 is a block diagram of a communication system in one embodiment;
fig. 7 is an internal structural diagram of a computer device in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
The device interaction method provided by the embodiment of the application can be applied to first devices, wherein the first devices comprise a first chip and a first communication interface; the second device is provided with a second chip, a second communication interface and a plurality of modules to be called. The first device and the second device may be, but not limited to, various personal computers, notebook computers, smart phones, tablet computers, internet of things devices and portable wearable devices, and the internet of things devices may be smart speakers, smart televisions, smart air conditioners, smart vehicle devices and the like. The portable wearable device may be a smart watch, smart bracelet, headset, or the like. The first communication interface and the second communication interface may be any high-speed interface, such as a PCIe interface and its derivative interface, a CXL interface and its derivative interface, a USB interface and its derivative interface.
In one embodiment, as shown in fig. 1, a device interaction method is provided, and an example of application of the method to a first device is described, where the first device is used as a master device because the first chip is in a master state. The device interaction method includes the following steps 102 to 106.
Step 102, under the condition that the first communication interface is connected with the second communication interface and the first configuration signal is received, the first communication interface is in a master control state, and a resource request instruction is sent to the second chip through the second communication interface.
The information carried by the first configuration signal comprises configuration information for configuring the main control state object and control information of the first chip to the second chip. The working states of the first chip and the second chip are different, namely, when the first chip is configured to be in a master control state, the corresponding working state of the second chip is a controlled state. Further, the first chip can be configured as a main control chip in the first equipment terminal, and the second chip can be configured as a main control chip in the first equipment terminal, so that the flexible configuration of the working states of the first chip and the second chip is realized. The control information refers to information of confirming a target calling module in the modules to be called, and in an exemplary embodiment, the first device is a mobile phone, the second device is a projection device, and the first configuration signal is a signal for confirming that the mobile phone is a master control preparation on the mobile phone and confirming that the projection module of the projection device is called.
And 104, receiving information of a module to be called fed back from the second chip based on the resource request instruction.
The information to be called refers to all functional modules available for calling in the second device and operation information, interface information, communication protocol information and the like corresponding to the functional modules. For example, when the second device is a computer, the function module in the information to be called may be a display screen module, a charging module, a heat dissipation module, etc.
It will be appreciated that the resource request instruction, i.e. the process of establishing a communication connection between the first device and the second device, is sent to the second chip via the second communication interface. When the second chip feeds back the information of the module to be called to the first device based on the resource request instruction, the first device and the second device are indicated to establish stable communication connection.
And step 106, outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute the target operation.
The first operation instruction refers to a signal for controlling the second chip to call the target call module. Specifically, because the first configuration signal carries the control information of the first chip to the second chip, the first device can confirm the target calling module to be called according to the received first configuration information and the information of the module to be called fed back by the second chip, and output a first operation instruction to the second chip, so that the second chip calls the target calling module based on the first operation instruction.
In the device interaction method, when the first communication interface is connected with the second communication interface and the first configuration signal is received, the device is in a master control state, and a resource request instruction is sent to the second chip through the second communication interface; receiving information of a module to be called fed back from a second chip based on a resource request instruction; and outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute the target operation. In the embodiment, the chip communication interaction in the two devices is realized through the first communication interface and the second communication interface, so that the operation control of the controlled device where the chip in the controlled state is located by the master control device where the chip in the master control state is located is further realized, and the interaction rate between the devices is improved.
In one embodiment, the first execution instruction includes a first call instruction; when the first device and the second device are mobile devices, outputting a first operation instruction to the second chip according to the first configuration signal and the information of the module to be invoked to instruct the second chip to execute target operation, wherein the step of determining the target invoking module according to the first configuration signal and the information of the module to be invoked, and outputting a corresponding first invoking instruction to enable the second chip to control the target invoking module to work and control other modules except the target invoking module in the module to be invoked to stop working.
The function modules in the module information to be called can comprise a common group module and a standby group module, and the standby group module can be a module with the same performance as the common group module or a module with further performance improvement on the basis of the common group module. When the first device and the second device are both mobile devices, the target call module may be part of the modules in the standby group module. Therefore, under the condition of ensuring the interaction endurance of the first device and the second device, the performance doubling is further realized, for example, when the first device and the second device are independently operated, 8-core operation can be realized, and the endurance time is 10 hours, when the first device and the second device are both mobile devices, the first device outputs a first calling instruction to the second chip according to the first configuration signal and the information of the module to be called so as to instruct the second chip to call the target calling module to work, and when other modules except the target calling module in the module to be called are controlled to stop working, the combined device formed by the first device and the second device realizes 16-core operation, and the endurance time is 10 hours. Further, the mobile device may be a smart phone, a tablet computer, a notebook computer, or the like.
In this embodiment, when the first device and the second device are both mobile devices, the target calling module is determined according to the first configuration signal and the information of the module to be called, and a corresponding first calling instruction is output to enable the second chip to control the target calling module to work, and control other modules except the target calling module in the module to be called to stop working. The target calling module can work in a low power consumption mode as required, and other modules except the target calling module stop working, so that the power consumption can be further saved through a clock and power supply regulation technology.
In one embodiment, the first execution instruction includes a second call instruction; the plurality of modules to be called comprise a functional module, a heat dissipation module and a charging module; when at least one of the first device and the second device is a fixed device, outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute the target operation comprises: and operating at a preset voltage and a preset frequency, outputting a second calling instruction according to the first configuration signal and the information of the module to be called, and indicating the second chip to control the function module to operate under the heat dissipation function of the heat dissipation module and the power supply function of the charging module based on the second calling instruction under the preset voltage and the preset frequency.
It will be appreciated that the first device may be a mobile device or a fixed device and that the device type of the second device is different from the device type of the first device. That is, when the first device is a mobile device, the second device is a fixed device. The first device and the second device may also both be stationary devices. The fixed equipment can be a base, a desktop computer or a mini-host computer, and the fixed equipment is arranged in a fixed place and used for realizing high-performance expansion by combining the first equipment in office and entertainment.
In this embodiment, when at least one of the first device and the second device is a fixed device, the module to be invoked includes a functional module, a heat dissipation module, and a charging module, where the charging module can ensure the endurance of each module, and the heat dissipation module can timely dissipate heat for the chip. That is, the first chip, the second chip and the functional modules can all operate at high speed at full frequency and full voltage, and the operation performance of the first device and the second device can be improved. Therefore, the device works at a preset voltage and a preset frequency, and outputs a second calling instruction according to the first configuration signal and the module to be called, so that the second chip is instructed to control the work of each functional module under the heat dissipation function of the heat dissipation module and the power supply function of the charging module based on the second instruction signal, the heat dissipation performance of the combined device formed by the first device and the second device can be improved, the endurance time can be prolonged, and the modules can work at high speed under full voltage and full frequency. Meanwhile, the first device and the second device at the moment are combined into a combined device, the first chip and the second chip can also be used as a combined chip with stronger performance, the combined device can execute an OS (Operating System) to execute tasks, and the network is fully utilized to realize the calculation of cloud computing, so that desktop and application virtualization are realized from a single platform, a unified working space for the fusion access of the fixed and mobile terminals is provided, and a user is helped to uniformly manage, release and aggregate the desktop, the application and the data in the fixed office and mobile office environments.
In one embodiment, as shown in the flow chart before the resource request instruction is sent to the second chip through the second communication interface in fig. 2, the following steps 202 to 204 are further included before the resource request instruction is sent to the second chip through the second communication interface.
Step 202, performing communication test on the first communication interface and the second communication interface.
Step 204, when the result of the communication test is normal communication, sending a resource request instruction to the second chip through the second communication interface.
In this embodiment, before a resource request instruction is sent to the second chip through the second communication interface, a communication test is performed on the first communication interface and the second communication interface, so that a communication protocol and a data transmission rate of the first communication interface and the second communication interface can be confirmed, so as to ensure the fitness of the first communication interface and the second communication interface, and ensure that communication between the first communication interface and the second communication interface is normal. Further, under the condition that the communication of the first communication interface and the second communication interface is normal, a resource request instruction is sent to the second chip through the second communication interface, and normal transmission of the resource request instruction is ensured.
In one embodiment, before the resource request command is sent to the second chip through the second communication interface, configuring the first communication interface and the second communication interface to enable the first communication interface and the second communication interface to perform signal transmission at a target rate when the result of the communication test is normal communication.
The target rate can be flexibly configured according to actual requirements.
In this embodiment, when the result of the communication test is normal communication, the first communication interface and the second communication interface are configured, so that the first communication interface and the second communication interface perform signal transmission according to the rate required by the application scenario, flexible configuration of signal transmission between the interfaces is ensured, and further stability of device interaction between the first device and the second device is ensured.
As shown in fig. 3, a second flowchart of the device interaction method is further provided, and the application of the device interaction method to the first device is illustrated by way of example, where the first device is used as a controlled device because the first chip is in a controlled state, and the method includes the following steps 302 to 306.
Step 302, under the condition that the first communication interface is connected with the second communication interface and receives the second configuration signal, the first communication interface is in a controlled state, and a resource request instruction from the second chip is received through the first communication interface.
And step 304, feeding back module information to be called to the second chip based on the resource request instruction.
And 306, receiving a second running instruction output by the second chip according to the second configuration signal and the module to be called, and executing the target operation according to the second running instruction.
It can be understood that, the device interaction method in this embodiment is applied to the first device as the controlled device, and the effect that can be achieved corresponds to the beneficial effect that can be achieved when the device interaction method is applied to the first device as the master control device, so when the device interaction method in this embodiment is applied to the controlled device, chip communication interaction in the two devices is achieved through the first communication interface and the second communication interface, operation interaction of the device where the controlled chip is located on the device where the master control chip is further achieved, and interaction rate between the devices can also be improved.
In one embodiment, when the device interaction method is applied to the controlled device and the first device and the second device are both mobile devices, the second operation instruction includes a third call instruction, and receiving, by the second chip, the second operation instruction according to the second configuration signal and the second operation instruction output by the module to be called, and executing, according to the second operation instruction, the target operation includes: and controlling the target calling module to work according to the received third calling instruction, and controlling other modules except the target calling module in the modules to be called to stop working.
The information carried by the second configuration signal comprises configuration information for configuring the controlled state object and control information of the chip in the main control state to the chip in the controlled state.
In this embodiment, when the first device and the second device are both mobile devices, the target calling module is controlled to work according to the received third calling instruction, and other modules except for the target calling module in the to-be-called modules are controlled to stop working, so that the target calling module can work in a low power consumption mode as required, and other modules except for the target calling module stop working, and power consumption can be further saved through a clock and power supply regulation technology.
In one embodiment, when the device interaction method is applied to the controlled device and at least one of the first device and the second device is a fixed device, the second operation instruction includes a fourth call instruction, receiving, by the second chip, the second operation instruction according to the second configuration signal and the second operation instruction output by the module to be called, and executing, according to the second operation instruction, the target operation includes: and working at a preset voltage and a preset frequency, and controlling the functional module to work under the heat dissipation function of the heat dissipation module and the power supply function of the charging module according to the fourth calling instruction.
In this embodiment, the operation is performed with the preset voltage and the preset frequency, and the operation of the functional module is controlled according to the fourth call instruction under the heat dissipation effect of the heat dissipation module and the power supply effect of the charging module, so that the heat dissipation performance of the combined device composed of the first device and the second device can be improved, the endurance time can be prolonged, and each module can be ensured to operate at high speed under the full voltage and the full frequency.
In one embodiment, as shown in FIG. 4, the third flow chart of the device interaction method, the device interaction method includes the following steps 402 to 4122.
Step 402, a communication test is performed on the first communication interface and the second communication interface.
In step 404, when the result of the communication test is normal communication, the first communication interface and the second communication interface are configured so that the first communication interface and the second communication interface perform signal transmission at a target rate.
Step 4061, when the first communication interface is connected to the second communication interface and the first configuration signal is received, the first communication interface is in a master control state, and a resource request instruction is sent to the second chip through the second communication interface.
Step 4081, information of the module to be invoked fed back from the second chip based on the resource request instruction is received.
In step 4101, when the device interaction method is applied to the master control device and the first device and the second device are both mobile devices, determining a target calling module according to the first configuration signal and the information of the to-be-called modules, and outputting a corresponding first calling instruction to enable the second chip to control the target calling module to work, and controlling other modules except the target calling module in the to-be-called modules to stop working.
In step 4121, when the device interaction method is applied to the master control device and at least one of the first device and the second device is a fixed device, the device interaction method works at a preset voltage and a preset frequency, and outputs a second calling instruction according to the first configuration signal and the information of the module to be called, so as to instruct the second chip to control the function module to work under the heat dissipation function of the heat dissipation module and the power supply function of the charging module based on the second calling instruction under the preset voltage and the preset frequency.
Step 4062, in the case that the first communication interface is connected to the second communication interface and the second configuration signal is received, the device is in a controlled state, and receives a resource request instruction from the second chip through the first communication interface.
Step 4082, feeding back the module information to be called to the second chip based on the resource request instruction.
In step 4102, when the device interaction method is applied to the controlled device and the first device and the second device are both mobile devices, the target calling module is controlled to work according to the received third calling instruction, and other modules except the target calling module in the to-be-called modules are controlled to stop working.
In step 4122, when the device interaction method is applied to the controlled device and at least one of the first device and the second device is a fixed device, the device interaction method works at the preset voltage and the preset frequency, and the function module is controlled to work under the heat dissipation function of the heat dissipation module and the power supply function of the charging module according to the fourth call instruction.
In the embodiment, the chip communication interaction in the two devices is realized through the first communication interface and the second communication interface, so that the operation control of the controlled device where the chip in the controlled state is located by the master control device where the chip in the master control state is located is further realized, and the interaction rate between the devices is improved.
It should be understood that, although the steps in the flowcharts related to the above embodiments are sequentially shown as indicated by arrows, these steps are not necessarily sequentially performed in the order indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in the flowcharts described in the above embodiments may include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of the steps or stages is not necessarily performed sequentially, but may be performed alternately or alternately with at least some of the other steps or stages.
Based on the same inventive concept, the embodiment of the application also provides a device interaction device for realizing the above related device interaction method. The implementation of the solution provided by the device is similar to the implementation described in the above method, so the specific limitation in the embodiment of one or more device interaction devices provided below may refer to the limitation of the device interaction method hereinabove, and will not be repeated herein.
In one embodiment, as shown in the schematic block diagram of the structure of the device interaction apparatus in fig. 5, the present application further provides a device interaction apparatus 500, which is applied to a first device, for example, and the first device includes a first chip and a first communication interface; the second device is provided with a second chip, a second communication interface and a plurality of modules to be called; the device interaction apparatus 500 includes: a chip configuration module 510, an interaction module 520, and a control module 530.
The chip configuration module 510 is configured to be in a master control state when the first communication interface is connected to the second communication interface and the first configuration signal is received, and send a resource request instruction to the second chip through the second communication interface.
The interaction module 520 is configured to receive information of a module to be invoked, which is fed back from the second chip based on the resource request instruction.
The control module 530 is configured to output a first operation instruction to the second chip according to the first configuration signal and the module information to be invoked, so as to instruct the second chip to execute the target operation.
In one embodiment, the first execution instruction includes a first call instruction; when the first device and the second device are mobile devices, the control module is further configured to determine a target calling module according to the first configuration signal and the information of the module to be called, and output a corresponding first calling instruction to enable the second chip to control the target calling module to work, and control other modules except the target calling module in the module to be called to stop working.
In one embodiment, the first execution instruction includes a second call instruction; the plurality of modules to be called comprise a functional module, a heat dissipation module and a charging module; when the first device and the second device are mobile device and fixed device respectively, the control module is further used for working at preset voltage and preset frequency, outputting a second calling instruction according to the first configuration signal and the information of the module to be called so as to instruct the second chip to work under the heat dissipation function of the heat dissipation module and the power supply function of the charging module based on the second calling instruction under the preset voltage and the preset frequency.
In one embodiment, the device interaction apparatus further comprises a test module for performing a communication test on the first communication interface and the second communication interface before sending the resource request instruction to the second chip through the second communication interface; and when the communication test result is normal communication, sending a resource request instruction to the second chip through the second communication interface.
In one embodiment, the device interaction apparatus further includes an interface configuration module configured to configure the first communication interface and the second communication interface to signal the first communication interface and the second communication interface at a target rate when a result of the communication test is normal communication before the resource request instruction is sent to the second chip through the second communication interface.
The modules in the device interaction apparatus described above may be implemented in whole or in part by software, hardware, and combinations thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.
The application also provides electronic equipment, which is exemplified by a main control equipment, and comprises a first communication interface and a first chip, wherein the first communication interface is used for being connected with a second communication interface of another electronic equipment; the first chip is connected with the first communication interface, and is used for being in a master control state and sending a resource request instruction to a second chip of another electronic device through the second communication interface under the condition that the first communication interface is connected with the second communication interface and a first configuration signal is received; receiving module information to be called fed back by a second chip in another electronic device based on a resource request instruction; and outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute the target operation.
In one embodiment, the application further provides an electronic device, which is exemplified by the controlled device, and the electronic device comprises a first communication interface, a first chip and a plurality of modules to be invoked. The first communication interface is used for being connected with a second communication interface of another electronic device; the first chip is connected with the first communication interface, and is used for being in a controlled state under the condition that the first communication interface is connected with the second communication interface and receives the second configuration signal, and receiving a resource request instruction of the second chip from another electronic device through the first communication interface; and feeding back module information to be called to the second chip based on the resource request instruction; and receiving a second running instruction output by the second chip according to the second configuration signal and the module to be called, and executing the target operation according to the second running instruction.
The first communication interface and the second communication interface in this embodiment may be any high-speed connection interface, such as a PCIe interface and a derivative interface thereof, a CXL interface and a derivative interface thereof, and a USB interface and a derivative interface thereof.
As shown in the schematic block diagram of the communication system shown in fig. 6, the present application further provides a communication system 600, where the communication system 600 includes a first electronic device 610 and a second electronic device 620, where the first electronic device 610 and the second electronic device 620 may be electronic devices in any of the foregoing embodiments, and the first electronic device 610 is taken as a master device, and the second electronic device 620 is taken as a controlled device for illustration. The first electronic device 610 comprises a first communication interface 611 and a first chip 612, and the second electronic device 620 comprises a second communication interface 621 and a second chip 622; the first communication interface 611 is connected to the first chip 612 and the second communication interface 621, and the second communication interface 621 is connected to the second chip 622; the first chip 612 is configured to be in a master control state when the first communication interface 611 is connected to the second communication interface 621 and the first configuration signal is received, and send a resource request instruction to the second chip 622 through the second communication interface 621; and the second chip 622 is further configured to receive module information to be invoked fed back from the second chip 622 based on the resource request instruction, and output a first operation instruction to the second chip 622 according to the first configuration signal and the module information to be invoked, so as to instruct the second chip 622 to execute the target operation.
It will be appreciated that the communication system 600 includes a first electronic device 610 and a second electronic device 620, and that when the beneficial effects of the device interaction method applied to the first electronic device 610 and the second electronic device 620 are improved, the interaction between the first electronic device 610 and the second electronic device 620 in the communication system 600 is correspondingly improved.
In one embodiment, a computer device is provided, which may be a terminal, and the internal structure of which may be as shown in fig. 7. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The communication interface of the computer device is used for carrying out wired or wireless communication with an external terminal, and the wireless mode can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer program is executed by a processor to implement a device interaction method. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be keys, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.
It will be appreciated by those skilled in the art that the structure shown in fig. 7 is merely a block diagram of some of the structures associated with the present application and is not limiting of the computer device to which the present application may be applied, and that a particular computer device may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided, comprising a memory and a processor, the memory having stored therein a computer program, the processor implementing the steps of the method embodiments described above when the computer program is executed.
In an embodiment, a computer program product is provided, comprising a computer program which, when executed by a processor, implements the steps of the method embodiments described above.
Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the various embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high density embedded nonvolatile Memory, resistive random access Memory (ReRAM), magnetic random access Memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric Memory (Ferroelectric Random Access Memory, FRAM), phase change Memory (Phase Change Memory, PCM), graphene Memory, and the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, and the like. By way of illustration, and not limitation, RAM can be in the form of a variety of forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), and the like. The databases referred to in the various embodiments provided herein may include at least one of relational databases and non-relational databases. The non-relational database may include, but is not limited to, a blockchain-based distributed database, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic units, quantum computing-based data processing logic units, etc., without being limited thereto.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the present application. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application shall be subject to the appended claims.
Claims (10)
1. A device interaction method is characterized by being applied to first equipment, wherein the first equipment comprises a first chip and a first communication interface; the second device is provided with a second chip, a second communication interface and a plurality of modules to be called; the method comprises the following steps:
when the first communication interface is connected with the second communication interface and receives a first configuration signal, the first communication interface is in a main control state, and a resource request instruction is sent to the second chip through the second communication interface;
Receiving information of a module to be called fed back from the second chip based on the resource request instruction;
and outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute target operation.
2. The device interaction method of claim 1, wherein the first execution instruction comprises a first call instruction; when the first device and the second device are mobile devices, outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute a target operation includes:
determining a target calling module according to the first configuration signal and the information of the module to be called, and outputting a corresponding first calling instruction to enable the second chip to control the target calling module to work and control other modules except the target calling module in the module to be called to stop working.
3. The device interaction method of claim 1, wherein the first execution instruction comprises a second call instruction; the plurality of modules to be called comprise a functional module, a heat dissipation module and a charging module; when at least one of the first device and the second device is a fixed device, outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be invoked, so as to instruct the second chip to execute a target operation includes:
And working at a preset voltage and a preset frequency, and outputting a corresponding second calling instruction according to the first configuration signal and the information of the module to be called so as to instruct the second chip to control each functional module to work under the heat dissipation effect of the heat dissipation module and the power supply effect of the charging module based on the second calling instruction under the preset voltage and the preset frequency.
4. The device interaction method of claim 1, further comprising, before sending a resource request instruction to the second chip through the second communication interface:
performing a communication test on the first communication interface and the second communication interface;
and when the communication test result is normal communication, sending a resource request instruction to the second chip through the second communication interface.
5. The device interaction method of claim 4, further comprising, before sending a resource request instruction to the second chip through the second communication interface:
and under the condition that the result of the communication test is normal communication, configuring the first communication interface and the second communication interface so as to enable the first communication interface and the second communication interface to perform signal transmission at a target rate.
6. The device interaction method is characterized by being applied to first equipment, wherein the first equipment comprises a first chip, a first communication interface and a plurality of modules to be called; the second device is provided with a second chip and a second communication interface; the method comprises the following steps:
under the condition that the first communication interface is connected with the second communication interface and receives a second configuration signal, the first communication interface is in a controlled state, and a resource request instruction from the second chip is received through the first communication interface;
feeding back module information to be called to the second chip based on the resource request instruction;
and receiving a second operation instruction output by the second chip according to the second configuration signal and the module to be called, and executing target operation according to the second operation instruction.
7. An electronic device, comprising:
a first communication interface for connecting with a second communication interface of another electronic device;
the first chip is connected with the first communication interface, and is used for being in a master control state and sending a resource request instruction to a second chip of the other electronic device through the second communication interface when the first communication interface is connected with the second communication interface and a first configuration signal is received; the method comprises the steps of,
Receiving module information to be called fed back by a second chip in another electronic device based on the resource request instruction; the method comprises the steps of,
and outputting a first operation instruction to the second chip according to the first configuration signal and the module information to be called so as to instruct the second chip to execute target operation.
8. An electronic device, comprising:
a plurality of modules to be called;
a first communication interface for connecting with a second communication interface of another electronic device;
the first chip is connected with the first communication interface, and is used for being in a controlled state and receiving a resource request instruction of a second chip from another electronic device through the first communication interface when the first communication interface is connected with the second communication interface and a second configuration signal is received; the method comprises the steps of,
feeding back module information to be called to the second chip based on the resource request instruction; the method comprises the steps of,
and receiving a second operation instruction output by the second chip according to the second configuration signal and the module to be called, and executing target operation according to the second operation instruction.
9. The electronic device of claim 7 or 8, wherein the first communication interface and the second communication interface comprise any one of a PCIe interface, a CXL interface, and a USB interface.
10. A communication system, comprising:
the electronic device comprises first electronic equipment and second electronic equipment, wherein the first electronic equipment comprises a first communication interface and a first chip, and the second electronic equipment comprises a second communication interface and a second chip;
the first communication interface is respectively connected with the first chip and the second communication interface, and the second communication interface is connected with the second chip;
the first chip is used for being in a master control state when the first communication interface is connected with the second communication interface and a first configuration signal is received, and sending a resource request instruction to the second chip through the second communication interface;
the first chip is further configured to receive information of a module to be invoked fed back from the second chip based on the resource request instruction, and output a first operation instruction to the second chip according to the first configuration signal and the information of the module to be invoked, so as to instruct the second chip to execute a target operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311438443.4A CN117499524A (en) | 2023-10-31 | 2023-10-31 | Equipment interaction method, electronic equipment and communication system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311438443.4A CN117499524A (en) | 2023-10-31 | 2023-10-31 | Equipment interaction method, electronic equipment and communication system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117499524A true CN117499524A (en) | 2024-02-02 |
Family
ID=89684120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311438443.4A Pending CN117499524A (en) | 2023-10-31 | 2023-10-31 | Equipment interaction method, electronic equipment and communication system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117499524A (en) |
-
2023
- 2023-10-31 CN CN202311438443.4A patent/CN117499524A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI746878B (en) | High bandwidth memory system and logic die | |
| US9600330B2 (en) | Method and system for regulation and control of a multi-core central processing unit | |
| US11144085B2 (en) | Dynamic maximum frequency limit for processing core groups | |
| CN106095622A (en) | Data back up method and device | |
| JP2016534484A (en) | System and method for reducing memory bus bandwidth according to workload | |
| US11784946B2 (en) | Method for improving data flow and access for a neural network processor | |
| CN114817120A (en) | Cross-domain data sharing method, system-on-chip, electronic device and medium | |
| US11023825B2 (en) | Platform as a service cloud server and machine learning data processing method thereof | |
| US8762607B2 (en) | Mechanism for facilitating dynamic multi-mode memory packages in memory systems | |
| CN114900699A (en) | Video coding and decoding card virtualization method and device, storage medium and terminal | |
| US20160378551A1 (en) | Adaptive hardware acceleration based on runtime power efficiency determinations | |
| CN111274044A (en) | GPU (graphics processing unit) virtualized resource limit processing method and device | |
| CN116541336B (en) | Software running method of multi-core chip and coprocessor | |
| US20200242067A1 (en) | System and Method for I/O Aware Processor Configuration | |
| CN103678244B (en) | A kind of smart machine without using application processor | |
| CN117499524A (en) | Equipment interaction method, electronic equipment and communication system | |
| WO2022179427A1 (en) | Configuration method of data transmission bandwidth and related device | |
| CN112564924B (en) | Computer expansion card and block chain terminal equipment | |
| CN111475454B (en) | PCIe interface-based communication method and device, computer equipment and computer-readable storage medium | |
| US10848179B1 (en) | Performance optimization and support compatibility of data compression with hardware accelerator | |
| CN209962174U (en) | Cloud computer display screen based on same screen and push technology | |
| US20140189408A1 (en) | System and method for reducing power consumption | |
| US10175903B2 (en) | N plane to 2N plane interface in a solid state drive (SSD) architecture | |
| CN109542531A (en) | A kind of file layout method of adjustment and device | |
| WO2024001192A1 (en) | System on chip, voltage control method for system on chip, and terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |