CN117497298A - Terminal structure of patch inductor and manufacturing method - Google Patents
Terminal structure of patch inductor and manufacturing method Download PDFInfo
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- CN117497298A CN117497298A CN202311566796.2A CN202311566796A CN117497298A CN 117497298 A CN117497298 A CN 117497298A CN 202311566796 A CN202311566796 A CN 202311566796A CN 117497298 A CN117497298 A CN 117497298A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002002 slurry Substances 0.000 claims abstract description 17
- 239000000178 monomer Substances 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- VRUVRQYVUDCDMT-UHFFFAOYSA-N [Sn].[Ni].[Cu] Chemical compound [Sn].[Ni].[Cu] VRUVRQYVUDCDMT-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000004070 electrodeposition Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 239000000696 magnetic material Substances 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 2
- 239000012212 insulator Substances 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The invention provides a terminal structure of a patch inductor and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: preparing a full-page patch inductor, wherein electrodes of the patch inductor and a magnet are arranged on the same plane, and the electrodes of the full-page patch inductor are arranged in an array; convex parts are arranged along the second direction, the convex parts are arranged at intervals along the first direction, and the convex parts are arranged corresponding to the electrodes; setting the arrangement direction of two electrodes of the same patch inductor as a first direction, wherein the second direction is perpendicular to the first direction; cutting the whole-version patch inductor provided with the convex part; coating an insulating layer on the monomer; laser windowing, exposing the metal slurry layer and the electrode position corresponding to the metal slurry layer to the insulating layer; electroplating copper nickel tin layer at the window opening position. The convex part is arranged on one surface of the electrode of the full-page patch inductor, so that after the insulator is coated by the single body, the electrode surface is marked through the convex part, the position of a window can be rapidly confirmed, and the production efficiency is improved.
Description
Technical Field
The invention relates to the field of inductors, in particular to a terminal structure of a patch inductor and a manufacturing method thereof.
Background
In batch manufacturing, the whole-edition inductor main body is manufactured, the electrodes and the magnets which are arranged in an array are positioned on the same plane, then the electrodes and the magnets are cut into single bodies, then the insulating bodies are wrapped, and the window is opened at the place where the lower lead electrode needs to be manufactured, then silver paste is brushed, and copper nickel tin electroplating is performed for end sealing. However, after the monomer is coated by the insulator, the surface color of the monomer is uniform, so that the position where the window needs to be opened cannot be determined in time during the window opening.
Disclosure of Invention
The invention aims to provide a terminal structure of a patch inductor and a manufacturing method thereof.
The invention aims to solve the problem that the windowing position is not easy to be confirmed quickly after an insulator is wrapped in the mass production process.
In order to solve the problems, the invention is realized by the following technical scheme:
the terminal structure of the patch inductor comprises an inductor main body and a soft magnet coating the inductor main body, wherein an electrode of the inductor main body is exposed out of the outer surface of the magnet; further comprises: the convex parts are arranged along the second direction corresponding to the electrodes, are arranged at intervals in the first direction, and have gaps between the convex parts corresponding to the two electrodes; setting the arrangement direction of two electrodes of the same patch inductor as a first direction, wherein the second direction is perpendicular to the first direction; a plating layer covering the convex part and the electrode, wherein the plating layers on the convex part and the electrode are communicated; the electroplated layer has conductivity; and an insulating layer provided on an outer surface of the magnet except for the plating layer.
Further, in the first direction, the end of the electrode is flush with or both ends of the end of the protrusion, or the end of the electrode is located between both ends of the protrusion.
Further, the protruding portion is a metal slurry layer corresponding to the electrode, the metal slurry layer is located at one side of the electrode corresponding to the protruding portion, or the metal slurry layer is located at two sides of the electrode corresponding to the protruding portion, and the metal slurry layer avoids the electrode.
Further, the protruding portion is integrally formed with the soft magnetic body, and the electrode is disposed on the protruding portion.
A method of making a terminal comprising: preparing a full-page patch inductor, wherein electrodes of the patch inductor and a magnet are arranged on the same plane, and the electrodes of the full-page patch inductor are arranged in an array; convex parts are arranged along the second direction, the convex parts are arranged at intervals along the first direction, and the convex parts are arranged corresponding to the electrodes; setting the arrangement direction of two electrodes of the same patch inductor as a first direction, wherein the second direction is perpendicular to the first direction; cutting the whole-version patch inductor provided with the convex part, wherein the cut single body comprises the patch inductor and a magnet coating the patch inductor; coating an insulating layer on the monomer; laser windowing, exposing the metal slurry layer and the electrode position corresponding to the metal slurry layer to the insulating layer; electroplating copper nickel tin layer at the window opening position.
Further, in the first direction, the end of the electrode is flush with or both ends of the end of the protrusion, or the end of the electrode is located between both ends of the protrusion.
Further, the scheme of providing the convex portion includes: and printing a metal slurry layer on one surface of the whole patch inductor, which is provided with an electrode, wherein the metal slurry layer and the electrode are arranged at intervals in a second direction.
Further, the method of providing the convex portion further includes: preparing a pressing bottom plate, wherein grooves are formed in the pressing bottom plate at intervals, and the width of each groove is larger than that of each electrode in the first direction; placing the pressing bottom plate and one surface of the full-page patch inductor with the electrode correspondingly, wherein the groove corresponds to the electrode along the second direction; and applying an external force to press the pressing bottom plate against the full-page patch inductor, and forming a convex part on the electrode surface of the full-page patch inductor.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
(1) According to the terminal structure of the patch inductor, the electrode is directly and electrically connected with the electroplated layer, and the bottom electrode of the patch inductor does not need to be blocked by high-conductivity silver paste, so that the cost is saved.
(2) According to the terminal manufacturing method, the convex part is arranged on one surface of the integral patch inductor, which is provided with the electrode, so that the electrode surface is marked through the convex part after the integral patch inductor is cut into the single body to cover the insulator, and the position of the window is rapidly confirmed. And the production efficiency is improved.
Drawings
Fig. 1 is a perspective view of a patch inductor according to a first embodiment of the present invention;
FIG. 2 is a cross-sectional view A-A of FIG. 1;
FIG. 3 is a cross-sectional view B-B of FIG. 1;
fig. 4 is a perspective view of a patch inductor according to a second embodiment of the present invention;
FIG. 5 is a cross-sectional view A-A of FIG. 1;
FIG. 6 is a cross-sectional view B-B of FIG. 1;
fig. 7 is a top view of a full-page chip inductor according to a third embodiment of the present invention, where the side with the electrodes is facing upward;
fig. 8 is a top view of a full-page chip inductor according to a third embodiment of the present invention, in which a side with an electrode is facing upward and a protrusion is disposed;
fig. 9 is a structural diagram of a pressing base plate provided in the third embodiment of the present invention, and a matching relationship with a full-page patch inductance;
FIG. 10 is a perspective view of a cut monomer according to a third embodiment of the present invention;
fig. 11 and 12 are block diagrams of a monomer coated insulating layer according to a third embodiment of the present invention;
fig. 13 and 14 are block diagrams of a third embodiment of the present invention after a single body of a clad insulating layer is windowed;
fig. 15 and 16 are perspective view of a product formed by electroplating a side-by-side window according to a third embodiment of the present invention;
FIG. 17 is a top view of a full-page chip inductor according to a fourth embodiment of the present invention, wherein the side with the electrodes is facing upward, and a metal paste layer is printed;
FIG. 18 is a perspective view of a cut monomer according to a fourth embodiment of the present invention;
fig. 19 is a block diagram of a monomer coated insulating layer according to a fourth embodiment of the present invention;
fig. 20 is a structural diagram of a fourth embodiment of the present invention after a single body of a clad insulation layer is windowed;
fig. 21 is a perspective view of a product formed by electroplating a side-by-side window according to a fourth embodiment of the present invention.
Illustration of:
an inductor main body-1; an electrode-11; magnet-2; plating layer-3; an insulating layer-4; patch inductance-5; a bottom electrode-51; and a convex portion-6.
Full-page patch inductance-100; an inductor body-101; an electrode-102; a magnet-103; monomer-110; a convex part-200; product-300; a lower lead electrode-301; pressing the bottom plate-400; groove-401; protrusion-402; copper nickel tin layer-500; insulating layer 600.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1 to 3, a soft terminal structure of a chip inductor, the chip inductor 5 includes an inductor body 1 and a magnet 2 covering the inductor body 1, and an electrode 11 of the inductor body 1 is exposed on an outer surface of the magnet 2. Also comprises a plating layer 3, an insulating layer 4 and a convex part 6. The convex parts 6 are corresponding to the electrodes 11 and are arranged along the second direction Y, and gaps are reserved between the convex parts corresponding to the two electrodes, so that the short circuit caused by the conduction of the two electrodes is avoided. The arrangement direction of the two electrodes of the same patch inductor is set to be the first direction X direction, and the second direction Y direction is perpendicular to the first direction X direction. The electroplated layer 3 covers the convex part 6 and the electrode 11, and the electroplated layers 3 on the convex part 6 and the electrode 11 are communicated; the plating layer 3 has conductivity so as to guide the current of the electrode 11 to the surface of the convex portion 6, thereby forming the bottom electrode 51. An insulating layer 4 is provided on the outer surface of the magnet 2 except for the plating layer 3. The width of the protruding portion 6 in the first direction X is larger than the width of its corresponding electrode 11 in the first direction X, so that the bottom electrode 51 is stably electrically connected to the electrode 11.
The protruding portion 6 of the present embodiment is also a magnet, and is integrally formed with the magnet 2, and the electrode 11 is disposed on the protruding portion 6. The magnet 2 is made of soft magnetic alloy, soft magnetic composite material, soft magnetic ferrite or other soft magnetic materials.
Example two
Referring to fig. 4 to 6, the present embodiment is different from the first embodiment in that the convex portion of the present embodiment is different from the first embodiment.
In this embodiment, the protruding portion 6 is a metal paste layer disposed corresponding to the electrode 11, and the metal paste layer is located at one side of the corresponding electrode, or the metal paste layer is located at two sides of the corresponding electrode, and the metal paste layer avoids the electrode. According to the winding shape, winding number and electrode lead-out position of the inductor main body 1, the ends of the electrodes 11 can be symmetrically arranged on the middle line of the inductor main body 1 or close to one side of the inductor main body, so that the protruding part 6 is positioned on one side of the corresponding electrode 11, or the protruding part 6 is positioned on two sides of the corresponding electrode 11.
Example III
The present embodiment provides a method for manufacturing a soft terminal structure of a chip inductor according to the first embodiment, including:
s1, preparing a full-page patch inductor 100, wherein electrodes 102 of the patch inductor and a magnet 103 are arranged on the same plane, and the full-page electrodes 102 are arranged in an array, as shown in FIG. 7.
Specifically, the method for manufacturing the full-page patch inductor 100 is as follows:
s11, paving a first conductive coil. The conductive film is laid on the carrier, and a plurality of first conductive coils which are arranged in an array are formed through photoetching and/or etching, wherein the first conductive coils can be spiral, elliptical, rectangular and the like, and the number of turns of the first conductive coils can be half-turn, one-turn, two-turn, three-turn and the like. It is understood that the initial end of the first conductive coil is integrally formed with the first electrode. In yet another embodiment, the first conductive coil is formed by stacking a plurality of conductive films along the first direction.
S12, a first insulating film is overlapped on the first conductive coil. The insulating films are paved on the first conductive coils, and the first insulating films corresponding to each first conductive coil are formed through photoetching and/or etching. The first via hole is formed in the first insulating film, and a first contact is provided in the first via hole.
S13, the second conductive coil is overlapped on the first insulating film. Similarly, the second conductive coil is stacked on the first insulating film, and the first conductive coil and the second conductive coil are electrically contacted through the first through hole. The second conductive coil includes one conductive film or a plurality of conductive films stacked in the first direction.
And S14, stacking a second insulating film on the second conductive coil, and analogizing to the fact that the top layer is the conductive coil, so as to form an inductor main body which is arranged in an array and is stacked with the conductive coils and the insulating films in a staggered manner. The end of the top conductive coil is provided with an electrode terminal. It can be understood that the conductive coils of each layer of the array arrangement are formed by photoetching/etching on the same conductive film, the insulating film of the same layer is formed by photoetching/etching the same insulating film, and the inductor main bodies formed by stacking a plurality of conductive coils and a plurality of insulating films are connected with the adjacent inductor main bodies to form an array group of the inductor main bodies.
S15, all the electrode terminals are uniformly bent towards the reverse direction of the first direction. The electrode ends of the inductor main bodies of the same array group are uniformly bent downwards through the bending jig, so that the two electrodes of each inductor main body face to the same direction. The bending of the electrode end of the inductor main body in the array group is completed at one time, and the production efficiency is greatly improved.
And S16, the electrode ends of the array group of the inductor main bodies face downwards, and the magnetic material slurry is tiled to cover all the inductor main bodies, so that the inductor group is formed.
S17, a planarization operation may be further performed on the surface of the magnet to improve the roughness of the surface roughened magnet surface after the soft medium compression. After the planarization operation, a polishing process, for example, polishing the side of the magnet near the electrode end, so that the end of the electrode is completely exposed to the magnet, i.e., the polished end, may be further included. Thus, the full-page chip inductor 100 is obtained in which the end face of each electrode 102 is flush with the end face of the magnetic material 103.
S2, protruding portions 200 are disposed along the second direction Y, the protruding portions 200 are disposed at intervals along the first direction X, and the protruding portions 200 are disposed corresponding to the 102 electrodes, as shown in fig. 8. The arrangement direction of the two electrodes of the same patch inductor is set to be a first direction, and a second direction is perpendicular to the first direction.
As shown in fig. 9, the method for setting the convex portion includes:
s21, preparing a pressing bottom plate 400, and arranging grooves 401 at intervals on the pressing bottom plate 400, wherein protrusions 402 are arranged between the corresponding grooves 401. The width of the recess 401 is larger than the width of the electrode in the first direction X.
The pressing base 400 is placed corresponding to the side of the full-page chip inductor 100 having the electrode, and the groove 401 corresponds to the electrode 102 along the second direction Y.
An external force is applied to press the pressing bottom plate 400 to the integral chip inductor 100, or the integral chip inductor 100 is pressed to the pressing bottom plate 400, or the integral chip inductor 100 and the pressing bottom plate 400 are close to each other and are pressed against each other. It will be appreciated that the electrode 102 corresponds to the recess of the pressing base 400, so that contact with the pressing base 400 is avoided during the pressing of the two, while the protrusion 402 presses recesses on both sides of the electrode arranged in the second direction, and the corresponding recess corresponds to the position of the full-page chip inductor 100, so that the protrusions 200 are formed at intervals in the first direction X by the recesses.
S3, cutting the full-page chip inductor 100 provided with the protruding portion 200, where the cut single body 110 includes an inductor main body 101, a magnet 103 covering the inductor main body 101, and protruding portions 200 corresponding to the two electrodes 102 of the inductor main body, respectively, as shown in fig. 10.
S4, coating the single body 110 with an insulating layer. The monomer is immersed in the insulating material, so that the outer surface of the monomer is coated with the insulating layer, as shown in fig. 11 and 12, it is easy to understand that the outer circumferential surface of the monomer 110 is coated with the insulating layer 600, the color is uniform and cannot be distinguished, and the side surface of the monomer 110, on which the convex portion 200 is arranged, i.e. the side surface of the electrode 102 is non-planar, and the other five side surfaces are planar, so that the side surface of the electrode 102 can be rapidly marked.
In the first direction X, the end of the electrode 102 is flush with one or both ends of the protrusion 200, or the end of the electrode 102 is located between both ends of the protrusion 200, so that the electrode position can be fully exposed when the windowing position is calibrated according to the protrusion 200.
S5, laser windowing exposes the convex portion 200 and the electrode 102 corresponding to the convex portion 200 to the insulating layer, as shown in fig. 13 and 14. Thanks to the characteristics that the surface of the electrode 102 is non-planar and the other five surfaces are planar, the positions of the surface of the electrode 102 and the convex part 200 can be rapidly determined during laser windowing, so that the position requiring laser windowing is determined.
S6, electroplating a copper nickel tin layer at the windowing position to form a product 300, as shown in fig. 15 and 16. Copper, nickel and tin are electroplated at the windowing position, and electric conduction is realized between the electroplated copper and the electrode 102, so that the lower electrode 301 of the product 300 is led to the surface of the convex part 200 from the electrode 102, the area of the lower electrode 301 is enlarged, and the connection stability and the electric connection reliability during subsequent installation with a PCB (printed circuit board) are improved. The electrotinning is convenient for installing the chip inductor and the PCB, and the electrotinning realizes heat insulation.
Example IV
The present embodiment is different from the third embodiment in that the manufacturing method of the convex portion 200 is different.
Referring to fig. 17 to 21, in the present embodiment, a metal paste layer is printed on a surface of the whole chip inductor 100 having the electrode 102, the metal paste layer forms a protrusion 200, and the metal paste layer avoids the electrode 102, as shown in fig. 17, wherein a gap E is provided between the metal paste layers of the same chip inductor, so as to avoid conducting between two electrodes of the same chip inductor in a subsequent step, thereby causing a short circuit.
More preferably, the metal paste layer is printed between two adjacent electrodes in the second direction Y, and the two electrodes of the same patch inductor are arranged along the first direction X, and the second direction Y is perpendicular to the first direction X. The width of the metal paste layer (convex portion) in the first direction X is W, the width of the electrode 102 in the first direction X is B, W is 1 to 1.5 times B, and in the first direction X, the end of the electrode 102 is flush with one or both ends of the convex portion 200, or the end of the electrode 102 is located between both ends of the convex portion 200.
The metal paste layer protrudes from the plane of the magnet 103, so that the surface of the electrode 102 is uneven.
The metal paste layer has no direct contact with the electrode 102, plays a role in calibrating the electrode surface and forming a bottom electrode (pin) support, so that no higher conductive requirement exists, therefore, the metal paste layer of the embodiment can adopt silver paste or other metal pastes, such as copper paste, nickel paste and the like, if the metal paste layer is printed by adopting silver paste, compared with the silver paste adopted in the traditional end capping, the silver particle concentration in the silver paste of the embodiment can be reduced, the silver particle size can be reduced, and the silver paste cost is greatly reduced.
Cutting the full-page patch inductor 100 provided with the convex parts 200; coating the single body 110 with an insulating layer; a laser window is opened to expose the convex portion 200 and the electrode 102 corresponding to the convex portion 200 to the insulating layer 600; and electroplating a copper nickel tin layer 500 at the windowing position, thereby obtaining the chip inductor product.
While the foregoing description illustrates and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, but is capable of use in various other combinations, modifications and environments and is capable of changes or modifications within the scope of the inventive concept, either as described above or as a matter of skill or knowledge in the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (10)
1. The terminal structure of the patch inductor comprises an inductor main body and a magnet wrapping the inductor main body, wherein an electrode of the inductor main body is exposed out of the outer surface of the magnet; characterized by further comprising:
the convex parts are arranged along the second direction corresponding to the electrodes, are arranged at intervals in the first direction, and have gaps between the convex parts corresponding to the two electrodes; setting the arrangement direction of two electrodes of the same patch inductor as a first direction, wherein the second direction is perpendicular to the first direction;
a plating layer covering the convex part and the electrode, wherein the plating layers on the convex part and the electrode are communicated; the electroplated layer has conductivity;
and an insulating layer provided on an outer surface of the magnet except for the plating layer.
2. A terminal structure of a chip inductor according to claim 1, wherein in the first direction, the ends of the electrodes are flush with or both ends of the protrusions, or the ends of the electrodes are located between both ends of the protrusions.
3. The terminal structure of a chip inductor according to claim 2, wherein the protruding portion is a metal paste layer disposed corresponding to the electrode, the metal paste layer is located on one side of the corresponding electrode, or the metal paste layer is located on two sides of the corresponding electrode, and the metal paste layer avoids the electrode.
4. The terminal structure of a chip inductor according to claim 2, wherein the protruding portion is integrally formed with the soft magnetic body, and the electrode is disposed on the protruding portion.
5. A method of manufacturing a terminal, comprising:
preparing a full-page patch inductor, wherein electrodes of the patch inductor and a magnet are arranged on the same plane, and the electrodes of the full-page patch inductor are arranged in an array;
convex parts are arranged along the second direction, the convex parts are arranged at intervals along the first direction, and the convex parts are arranged corresponding to the electrodes; setting the arrangement direction of two electrodes of the same patch inductor as a first direction, wherein the second direction is perpendicular to the first direction;
cutting the whole-version patch inductor provided with the convex part, wherein the cut single body comprises the patch inductor and a magnet coating the patch inductor;
coating an insulating layer on the monomer;
laser windowing, exposing the metal slurry layer and the electrode position corresponding to the metal slurry layer to the insulating layer;
electroplating copper nickel tin layer at the window opening position.
6. The method of manufacturing a terminal according to claim 5, wherein the end of the electrode is flush with or both ends of the end of the protrusion in the first direction, or the end of the electrode is located between both ends of the protrusion.
7. The method according to claim 6, wherein the step of providing the convex portion in the second direction corresponding to the electrode comprises:
and printing a metal slurry layer on one surface of the whole patch inductor, which is provided with an electrode, wherein the metal slurry layer and the electrode are arranged at intervals in a second direction.
8. The method of manufacturing a terminal according to claim 6, wherein the method of providing the convex portion in the second direction corresponding to the electrode further comprises:
preparing a pressing bottom plate, wherein grooves are formed in the pressing bottom plate at intervals, and the width of each groove is larger than that of each electrode in the first direction;
placing the pressing bottom plate and one surface of the full-page patch inductor with the electrode correspondingly, wherein the groove corresponds to the electrode along the second direction;
and applying an external force to press the pressing bottom plate against the full-page patch inductor, and forming a convex part on the electrode surface of the full-page patch inductor.
9. The method for manufacturing a terminal according to claim 5, wherein the method for manufacturing a full-page chip inductor comprises:
forming a plurality of inductor main bodies arranged in an array, wherein each inductor main body comprises two electrode ends;
uniformly bending all electrode terminals towards the direction away from the inductor main body;
the electrode ends of a plurality of inductor main bodies arranged in an array are downwards, and magnetic material slurry is paved to cover the inductor main bodies;
after the magnetic material slurry is flatly paved to cover the inductor main body, the soft medium is used for compressing the magnetic material; and/or
Performing a planarization operation on a surface of the inductor group; and/or grinding the inductor group so that all the electrode terminals are positioned on the same plane with the surface of the magnet formed by the magnetic material;
forming the integral patch inductor.
10. The method of manufacturing a terminal according to claim 9, wherein the method of forming a plurality of inductor bodies arranged in an array comprises:
paving a first conductive coil;
the first insulating film is overlapped on the first conductive coil and comprises a first through hole, and a first contact is arranged in the first through hole;
the second conductive coil is overlapped on the first insulating film;
the second insulating film is overlapped on the second conductive coil and comprises a second through hole which is staggered with the first through hole, and a second contact is arranged in the second through hole;
and the conductive coils are sequentially analogized to the top layer, so that an inductor main body which is arranged in an array and is formed by alternately stacking the conductive coils and the insulating film is formed;
wherein, the starting end of the first conductive coil and the tail end of the top layer are electrode ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311566796.2A CN117497298A (en) | 2023-11-22 | 2023-11-22 | Terminal structure of patch inductor and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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