CN117479744A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN117479744A CN117479744A CN202310432685.6A CN202310432685A CN117479744A CN 117479744 A CN117479744 A CN 117479744A CN 202310432685 A CN202310432685 A CN 202310432685A CN 117479744 A CN117479744 A CN 117479744A
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- Prior art keywords
- display module
- layer
- display
- carbon
- heat dissipation
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- 239000010410 layer Substances 0.000 claims abstract description 66
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 239000002131 composite material Substances 0.000 claims abstract description 35
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000002346 layers by function Substances 0.000 claims abstract description 20
- 238000005452 bending Methods 0.000 claims description 30
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 229910002804 graphite Inorganic materials 0.000 claims description 13
- 239000010439 graphite Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000872 buffer Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910021392 nanocarbon Inorganic materials 0.000 claims description 3
- 239000003351 stiffener Substances 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 abstract description 10
- 239000000843 powder Substances 0.000 abstract description 4
- 239000003292 glue Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000008093 supporting effect Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920003225 polyurethane elastomer Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000006173 Good's buffer Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display module and a display device, wherein the display module comprises a display panel, a back plate, a reinforcing plate and a heat dissipation composite layer, wherein the heat dissipation composite layer is positioned between the first back plate and the second back plate and comprises a main functional layer, and a first bonding layer and a second bonding layer which are positioned on two sides of the main functional layer; the main functional layer comprises a metal heat conduction part and a carbon-based heat conduction part which are connected with each other, and the metal heat conduction part is arranged on the periphery of the carbon-based heat conduction part in a surrounding mode. The heat dissipation composite layer ensures the bonding performance and the overall support, simultaneously ensures that heat is quickly transferred in the heat dissipation composite layer, effectively improves the heat dissipation capacity of the area where the IC is located, and reduces risks such as uneven brightness, side powder emission of the IC, poor reliability and the like.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
The organic light emitting diode (Organic Light Emitting Diode, OLED) gives the flexible bending capability to the screen, and the Bonding (Bonding) area, the flexible printed circuit board (Flexible Print Circuit, FPC) and the integrated circuit (Integrate Circuit, IC) are folded back to the back side of the display screen body and fixed by a Pad bending (Pad Bonding) process, so as to reduce the size of the lower frame.
However, the OLED also has a problem of large heat productivity, and the local temperature of the OLED module is too high, which may cause problems such as screen burn and uneven screen brightness. Particularly, the IC components of the module have large operation amount, small volume and closed space after Pad bonding, so that the IC generates huge heat when in operation, and the heat is accumulated in the area where the IC is located, which may cause reliability problems of the IC body and the screen. In the related art, after Pad bonding, a two-stage Back Plate (BP) is adhered to other film layers in the OLED module by using a filling tape (Stiffener, BP), but since the STF is a common PET substrate double sided tape, the heat conducting property is not outstanding, so that heat is deposited on the IC, and the risk of poor screen brightness is greatly increased.
In summary, the present application provides a display module and a display device to solve the problem of heat accumulation around the IC of the conventional OLED module.
Disclosure of Invention
The embodiment of the application provides a display module, which can solve the problem of heat accumulation around an IC from the source.
The embodiment of the application provides a display module, which comprises
The display panel comprises a display area and a non-display area, wherein the non-display area is defined with a bending area and a non-bending area, and the non-bending area is bent to the back side of the display panel through the bending area;
the backboard is positioned in the opposite space between the display area and the non-bending area and comprises a first backboard and a second backboard which are disconnected and arranged oppositely, wherein the first backboard is positioned in the display area, and the second backboard is positioned in the non-bending area;
the heat dissipation composite layer is positioned between the first backboard and the second backboard, and comprises a main functional layer, and a first bonding layer and a second bonding layer which are positioned on two sides of the main functional layer;
the main functional layer comprises a metal heat conduction part and a carbon-based heat conduction part which are connected with each other, and the metal heat conduction part is arranged on the periphery of the carbon-based heat conduction part in a surrounding mode.
According to an embodiment of the present application, the thermal conductivity of the carbon-based thermal conductive portion in the horizontal direction is greater than the thermal conductivity of the metal thermal conductive portion in the horizontal direction.
According to an embodiment of the application, a plurality of through holes which are uniformly distributed are formed in the carbon-based heat conducting portion, and the first bonding layer and the second bonding layer are partially in the through holes.
According to an embodiment of the present application, the material of the carbon-based heat conducting portion includes any one of a graphite film, a nano carbon film, and a graphene film.
According to an embodiment of the present application, the metal heat conducting part includes any one of copper and aluminum.
According to an embodiment of the present application, the first adhesive layer and the second adhesive layer are heat-conductive double-sided adhesive tapes.
According to an embodiment of the application, the display module includes an integrated circuit electrically connected to the display panel, the integrated circuit is located at a side of the non-bending area away from the second back plate, and the integrated circuit and the heat dissipation composite layer are aligned.
According to an embodiment of the present application, the distribution manner of the through holes includes any one of array distribution and m-shaped distribution.
According to an embodiment of the application, the display module comprises a buffer layer and a reinforcing plate, wherein the buffer layer and the reinforcing plate are located between the first back plate and the heat dissipation composite layer, the buffer layer is attached to the first back plate, and the reinforcing plate is attached to the heat dissipation composite layer.
A display device comprising a display module according to any of the above embodiments.
The beneficial effects of the embodiment of the application are that: the application provides a display module and a display device, wherein the display module comprises a display panel, a back plate, a reinforcing plate and a heat dissipation composite layer, the heat dissipation composite layer is positioned between the first back plate and the second back plate, and the heat dissipation composite layer comprises a main functional layer, a first bonding layer and a second bonding layer which are positioned on two sides of the main functional layer; the main functional layer comprises a metal heat conduction part and a carbon-based heat conduction part which are connected with each other, and the metal heat conduction part is arranged on the periphery of the carbon-based heat conduction part in a surrounding mode. The heat dissipation composite layer ensures the bonding performance and the overall support, and simultaneously enables heat to be quickly transferred in the heat dissipation composite layer, so that the heat dissipation capacity of an area where an IC is located is effectively improved, and risks such as uneven brightness, side powder emission and poor reliability of the IC are reduced.
Drawings
In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following description will briefly introduce the drawings that are required to be used in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the application, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat dissipation composite layer in a display module according to an embodiment of the present disclosure;
FIG. 2 is a side view of a heat dissipating composite layer provided in an embodiment of the present application;
fig. 3 is a front view of a heat dissipation composite layer according to an embodiment of the present application.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. The directional terms mentioned in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., are only referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the application and is not intended to be limiting of the application. In the drawings, like elements are designated by like reference numerals.
It will be understood that, although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.
The present application is further described below with reference to the drawings and specific examples.
As shown in fig. 1, the embodiment of the present application provides a display module 100, where the display module 100 includes a display panel 12, and the display panel 12 may be an OLED display panel, and the display panel 12 includes a display area AA and a non-display area, where the non-display area defines a bending area (not shown in the figure) and a non-bending area NB, and the non-bending area NB is bent to the back side of the display panel 12 through the bending area; a back plate 13, located in the opposite space between the display area AA and the non-bending area NB, including a first back plate 131 and a second back plate 132 that are disconnected and disposed opposite to each other, where the first back plate 131 is located in the display area AA, the second back plate 132 is located in the non-bending area NB, and the first back plate 131 and the second back plate 132 are flush towards the end of the bending area; and a reinforcing plate 15 positioned between the first back plate 131 and the second back plate 132. The display module 100 further includes an integrated circuit 14 electrically connected to the display panel 12, where the integrated circuit 14 is located at a side of the non-bending area NB away from the second back plate 132.
In this embodiment, the display module 100 includes a heat dissipation composite layer 11 disposed between the first back plate 131 and the second back plate 132, and further, the integrated circuit 14 is aligned with the heat dissipation composite layer 11. As shown in fig. 2, the heat dissipation composite layer 11 includes a main functional layer 116, and a first adhesive layer 113 and a second adhesive layer 114 located at both sides of the main functional layer 116. The reinforcing plate 15 is attached to the heat dissipation composite layer 11 through the first adhesive layer 113, and the second back plate 132 is attached to the heat dissipation composite layer 11 through the second adhesive layer 114. The main functional layer 116 includes a metal heat conducting portion 111 and a carbon-based heat conducting portion 112 connected to each other, and the metal heat conducting portion 111 is disposed around the periphery of the carbon-based heat conducting portion 112. Further, the thermal conductivity of the carbon-based thermal conductive portion 112 in the horizontal direction is greater than the thermal conductivity of the metal thermal conductive portion 111 in the horizontal direction.
It should be noted that, the metal heat conducting portion 111 is disposed around the functional layer, so that the overall supporting performance of the display module 100 can be improved, the Peeling problem caused by bending the flexible circuit board (Flexible Printed Circuit, FPC) to the back of the display module 100 is avoided, meanwhile, the main functional layer 116 can enable heat to be quickly transferred in the heat dissipation composite layer 11, the heat dissipation capability of the area where the IC 14 is located is effectively improved, and risks such as uneven brightness, powder emission on the side of the IC 14 and poor reliability are reduced.
The back sheet 13 includes a glue layer, a base material layer, and the like, and the material of the back sheet 13 includes, but is not limited to, an organic material such as Polyimide (PI) or polyethylene terephthalate (PET). The reinforcing plate 15 is made of an inorganic material, and the material of the reinforcing plate 15 includes, but is not limited to, SUS (stainless steel).
It should be noted that the display module 100 includes a protective adhesive (not shown in the drawings), which covers the bending region of the display panel 12, and materials of the protective adhesive include, but are not limited to, ultraviolet (UV) curable adhesive, thermosetting adhesive, and visible light curable adhesive. The protection glue covers the bending area, so that the stress of the bending area can be integrally relieved, and the wire of the bending area is prevented from being broken in the bending process.
Specifically, in the present embodiment, the material of the metal heat conducting part 111 includes any one of copper and aluminum. The material of the carbon-based heat conduction part 112 includes any one of a graphite film, a nano carbon film, and a graphene film. In this embodiment, the material of the metal heat conducting part 111 is copper, and the material of the carbon-based heat conducting part 112 is a graphite film. Since graphite is generally anisotropic in thermal conductivity, and since graphite has a special hexagonal planar network structure, heat can be uniformly distributed on a two-dimensional plane and effectively transferred. The coefficient of thermal conductivity of graphite in the horizontal direction is 300-1900W/(m.K), but the coefficient of thermal conductivity in the vertical direction is only 5-20W/(m.K); copper has an isotropic thermal conductivity, and the thermal conductivity in both the horizontal and vertical directions is about 400W/(mK).
Further, the heat capacity of graphite is about 2 times that of copper, which means that after absorbing the same heat, the temperature of graphite rises only by half that of copper. In addition, the density of graphite is only 0.7-2.1 g/cm 3 Far below 8.96g/cm of copper 3 Therefore, the weight can be reduced. Based on high heat conductivity and high specific heatThe carbon-based heat conducting part 112 is arranged in the middle area of the heat dissipation composite layer 11, so that the heat can be quickly transferred in the length and width directions of the heat dissipation composite layer 11, the display module 100 is light, and the metal heat conducting part 111 is arranged around the carbon-based heat conducting part 112 in a surrounding manner, so that the heat can be quickly transferred in the thickness direction. Therefore, the heat dissipation composite layer 11 can be quickly diffused and transferred in the length, width and thickness directions by combining the two layers, so that the heat dissipation capacity of the area where the IC 14 is located is improved. Meanwhile, based on the advantages of the carbon-based heat conducting part 112, such as high heat conductivity, high specific heat capacity, low density, and the like, the area of the metal heat conducting part 111 is as small as possible on the premise of meeting the overall supporting performance, so that the area occupation ratio of the carbon-based heat conducting part 112 is improved, and the heat dissipation effect is improved.
As shown in fig. 3, the carbon-based heat conducting portion 112 is provided with a plurality of through holes 115 that are uniformly distributed, and the through holes may be formed by an etching process, and in this embodiment, the through holes 115 are distributed in an array. Since graphite is generally layered, there is a risk of delamination, and the provision of the through-holes 115 may allow part of the first bonding layer 113 and the second bonding layer 114 to be glued to each other in the through-holes 115, thereby avoiding delamination of graphite. It should be noted that the distribution mode of the through holes further includes distribution in a shape of a Chinese character mi, and is not limited thereto. The shape of the through hole 115 in fig. 3 is only illustrative, and not limited thereto. In addition, the number and the size of the through holes 115 should be reduced as much as possible on the premise of avoiding graphite delamination, so as to increase the area ratio of the carbon-based heat conducting portion 112, and further increase the heat dissipation effect of the heat dissipation composite layer 11.
In this embodiment, in order to further improve the heat dissipation effect of the heat dissipation composite layer 11, the first adhesive layer 113 and the second adhesive layer 114 may be heat-conductive double-sided tape. The materials of the first bonding layer 113 and the second bonding layer 114 include, but are not limited to, one of silicone heat-conductive glue, epoxy glue, acrylic heat-conductive glue, polyurethane heat-conductive glue, or a combination thereof.
In this embodiment, as shown in fig. 1, the display module 100 includes a Buffer layer 16 (BFL), and the material of the Buffer layer 16 includes, but is not limited to PI, polyurethane rubber, silicon-containing polyurethane rubber, acryl resin, or the like. The buffer layer 16 has a certain supporting property, a good buffer property and an antistatic property.
In this embodiment, the display module 100 further includes a polarizer 17 and a cover plate 19 stacked on the light emitting side of the display area AA, where the polarizer 17 and the cover plate 19 are bonded through the transparent adhesive layer 18. In an embodiment, the polarizer 17 is a circular polarizer, and the circular polarizer includes a linear polarizer and a 1/4 wave plate, and the circular polarizer is used for reducing reflection of external environment light, so as to improve the display effect of the display module 100. The material of the transparent glue layer 18 includes, but is not limited to, OCA (Optically Clear Adhesive) optical glue. The cover plate 19 comprises Ultra Thin flexible Glass (UTG).
Further, the display panel 12 further includes a protective layer 20 (PWO) on a side of the cover 19 away from the polarizer 17 to protect the display module 100 from scratches and the like. The protective layer 20 may be a PET substrate.
Optionally, the display module 100 may further include a touch function layer (not shown in the figure) disposed between the polarizer 17 and the display panel 12, where the touch function layer is directly disposed on the display panel 12, and a DOT touch scheme is adopted to implement a touch function. Of course, the application is not limited thereto, and the display module 100 of the application may also adopt a plug-in touch scheme.
The embodiment of the application also provides a display device, which includes the display module 100 described in any of the foregoing embodiments. The display device can be applied to a wearable device, such as a flexible OLED display and lighting device which can only be used for a bracelet, a watch, a virtual display device, a television, a personal portable computer, a foldable/rollable OLED and the like.
The beneficial effects of the embodiment of the application are that: the application provides a display module and a display device, wherein the display module comprises a display panel, a back plate, a reinforcing plate and a heat dissipation composite layer, wherein the heat dissipation composite layer is positioned between the first back plate and the second back plate and comprises a main functional layer, and a first bonding layer and a second bonding layer which are positioned on two sides of the main functional layer; the main functional layer comprises a metal heat conduction part and a carbon-based heat conduction part which are connected with each other, and the metal heat conduction part is arranged on the periphery of the carbon-based heat conduction part in a surrounding mode. The heat dissipation composite layer ensures the bonding performance and the overall support, simultaneously ensures that heat is quickly transferred in the heat dissipation composite layer, effectively improves the heat dissipation capacity of the area where the IC is located, and reduces risks such as uneven brightness, side powder emission of the IC, poor reliability and the like.
In summary, although the present application discloses the preferred embodiments, the preferred embodiments are not intended to limit the application, and those skilled in the art can make various modifications and alterations without departing from the spirit and scope of the application, so the scope of the application is defined by the claims.
Claims (10)
1. A display module, comprising:
the display panel comprises a display area and a non-display area, wherein the non-display area is defined with a bending area and a non-bending area, and the non-bending area is bent to the back side of the display panel through the bending area;
the backboard is positioned in the opposite space between the display area and the non-bending area and comprises a first backboard and a second backboard which are disconnected and arranged oppositely, wherein the first backboard is positioned in the display area, and the second backboard is positioned in the non-bending area;
the heat dissipation composite layer is positioned between the first backboard and the second backboard, and comprises a main functional layer, and a first bonding layer and a second bonding layer which are positioned on two sides of the main functional layer;
the main functional layer comprises a metal heat conduction part and a carbon-based heat conduction part which are connected with each other, and the metal heat conduction part is arranged on the periphery of the carbon-based heat conduction part in a surrounding mode.
2. The display module of claim 1, wherein the carbon-based thermally conductive portion has a thermal conductivity in a horizontal direction that is greater than a thermal conductivity of the metal thermally conductive portion in a horizontal direction.
3. The display module of claim 1, wherein the carbon-based thermally conductive portion has a plurality of through holes uniformly distributed therein, and the first adhesive layer and the second adhesive layer are partially disposed in the through holes.
4. The display module of claim 1, wherein the material of the carbon-based heat conductive portion comprises any one of a graphite film, a nano carbon film, and a graphene film.
5. The display module of claim 1, wherein the metal heat conducting portion comprises any one of copper and aluminum.
6. The display module of claim 1, wherein the first adhesive layer and the second adhesive layer are thermally conductive double sided tape.
7. The display module of claim 1, wherein the display module comprises an integrated circuit electrically connected to the display panel, the integrated circuit is located at a side of the non-bending region away from the second back plate, and the integrated circuit is aligned with the heat dissipation composite layer.
8. A display module according to claim 3, wherein the distribution of the through holes includes any one of an array distribution and a m-shaped distribution.
9. The display module of claim 1, wherein the display module includes a buffer layer and a stiffener between the first back plate and the heat dissipating composite layer, the buffer layer being bonded to the first back plate, the stiffener being bonded to the heat dissipating composite layer.
10. A display device comprising a display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310432685.6A CN117479744A (en) | 2023-04-18 | 2023-04-18 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310432685.6A CN117479744A (en) | 2023-04-18 | 2023-04-18 | Display module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117479744A true CN117479744A (en) | 2024-01-30 |
Family
ID=89626283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310432685.6A Pending CN117479744A (en) | 2023-04-18 | 2023-04-18 | Display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117479744A (en) |
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2023
- 2023-04-18 CN CN202310432685.6A patent/CN117479744A/en active Pending
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