CN117476507A - Silicon product etching cleaning machine - Google Patents

Silicon product etching cleaning machine Download PDF

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Publication number
CN117476507A
CN117476507A CN202311681483.1A CN202311681483A CN117476507A CN 117476507 A CN117476507 A CN 117476507A CN 202311681483 A CN202311681483 A CN 202311681483A CN 117476507 A CN117476507 A CN 117476507A
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CN
China
Prior art keywords
etching
groove
silicon product
negative pressure
cover plate
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Granted
Application number
CN202311681483.1A
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Chinese (zh)
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CN117476507B (en
Inventor
祝建敏
刘志彪
郑小松
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Zhejiang Dunyuan Juxin Semiconductor Technology Co ltd
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Zhejiang Dunyuan Juxin Semiconductor Technology Co ltd
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Priority to CN202311681483.1A priority Critical patent/CN117476507B/en
Publication of CN117476507A publication Critical patent/CN117476507A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Weting (AREA)

Abstract

The invention relates to the technical field of etching devices, in particular to a silicon product etching cleaning machine, which comprises: an etching container having an etching space therein; the carrier plate is arranged in the etching space and comprises a planar carrying surface for carrying the silicon product, and the carrier plate also comprises a suction channel, wherein one end of the suction channel penetrates through the carrying surface to form a suction port; the negative pressure system comprises a negative pressure space capable of forming negative pressure, and the other end of the suction channel is communicated with the negative pressure space; the cover plate is used for being covered and pressed on the front surface of the silicon product to cover the inner ring and the groove of the silicon product, under the working state, the telecentric end of the groove is exposed out of the cover plate to form a liquid inlet end, the suction opening is positioned in the inner ring range of the silicon product, and during etching, as the acid liquor in the groove continuously flows, the flowing acid liquor can continuously flush out impurities in the groove and take out of the groove, so that the groove wall of the groove can be etched better.

Description

Silicon product etching cleaning machine
Technical Field
The invention relates to the technical field of etching devices, in particular to a silicon product etching cleaning machine.
Background
Silicon is a commonly used semiconductor material, and has wide application in various fields, and common silicon products include silicon rings and the like, which can be used as electrodes and the like.
In the related art, some silicon rings are provided with additional processing features, for example, a plurality of grooves are uniformly formed on one side surface of some silicon rings, and the grooves formed by grooving on the silicon rings are generally rough in wall, so that the groove wall is generally etched and cleaned by acid liquor, so that the smoothness of the groove wall of the groove is improved.
In the conventional etching and cleaning mode, a silicon ring is directly immersed in acid liquor, and the groove wall of a groove is etched by means of the acid liquor penetrating into the groove; however, the etching cleaning mode has a relatively general etching effect on the groove, mainly because the acid liquor basically stands and does not flow after the acid liquor etches the wall of the groove after penetrating into the groove, and the groove is relatively narrow, so that the impurities formed by etching the wall of the groove are difficult to discharge in the groove, and the impurities accumulated in the groove can prevent the acid liquor from further etching the wall of the groove, so that the etching effect of the groove is relatively poor, and the improvement is still needed.
Disclosure of Invention
In order to solve at least one technical problem mentioned in the background art, the invention aims to provide a silicon product etching and cleaning machine.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a silicon product etching and cleaning machine, the silicon product is in an annular structure, and one or more grooves extending radially are arranged on the front surface of the silicon product, and the silicon product etching and cleaning machine comprises:
an etching container having an etching space therein;
the carrier plate is arranged in the etching space and comprises a planar carrying surface for carrying the silicon product, and the carrier plate also comprises a suction channel, wherein one end of the suction channel penetrates through the carrying surface to form a suction port;
the negative pressure system comprises a negative pressure space capable of forming negative pressure, and the other end of the suction channel is communicated with the negative pressure space;
and the cover plate is used for being pressed on the front surface of the silicon product to cover the inner ring and the groove of the silicon product, the distal end of the groove is exposed out of the cover plate to form a liquid inlet end in a working state, and the suction port is positioned in the range of the inner ring of the silicon product.
In some embodiments of the present invention, the cover plate is provided with a ring groove penetrating through the cover plate in an axial direction, and the ring groove is sequentially separated in a circumferential direction to form a plurality of mutually independent partitions; the liquid inlet ends of the grooves are all positioned in the annular groove; wherein the partitions can be intermittently opened and closed.
In some embodiments of the present invention, the carrier disc can rotate circumferentially, and a baffle is arranged on the upper wall of the cover plate, and the baffle can rotate relative to the cover plate in a manner of being attached to the upper wall of the cover plate; the baffle plate covers the annular groove and extends along the annular groove; the baffle is configured such that it can cover at least one of the sections and expose at least one of the sections.
In some embodiments of the present invention, a rotating shaft is arranged at the bottom of the carrying disc, and the rotating shaft is rotatably arranged on the etching container; the inside of the rotating shaft is hollow to form the suction channel.
In some embodiments of the invention, a locking assembly is also included for locking the shutter, which, when locked, maintains its relative positioning in the circumferential direction with respect to the etch container.
In some embodiments of the present invention, the locking assembly includes a swing link provided on the etching container and capable of being turned up and down with respect to the etching container, and a locking groove provided on the baffle for insertion of the swing link, and the baffle and the etching container are maintained in relative positioning in a circumferential direction when the swing link is inserted into the locking groove.
In some embodiments of the present invention, the baffle is provided with two blocking rods, and the locking groove is formed between the two blocking rods at intervals.
In certain embodiments of the invention, the pendulum bar is magnetically attractable to the baffle.
In certain embodiments of the present invention, a clamping assembly is also included for clamping the silicon product between the cover plate and the carrier plate.
In some embodiments of the invention, the negative pressure system comprises a liquid return tank and a negative pressure generating device, wherein one end of the suction channel away from the suction port is communicated with the liquid return tank, and the negative pressure generating device is used for generating negative pressure in the liquid return tank.
Compared with the prior art, the scheme has the advantages that:
in the scheme, when etching and cleaning are performed, a silicon product (namely a silicon ring) can be pressed on a carrier disc by virtue of a cover plate, at the moment, the cover plate covers the inner ring of the silicon ring and the part of the groove close to the inner ring at the upper part of the silicon ring, and the telecentric end of the groove (namely one end of the groove far away from the inner ring of the silicon ring) is exposed to form a liquid inlet end; at this time, a suction space is formed by surrounding the cover plate, the carrying disc and the inner ring of the silicon ring; after the cover plate covers the groove, the groove is equivalent to a flow passage, one end (namely a liquid inlet end) of the flow passage is communicated with the etching space, and the other end of the flow passage is communicated with the suction space; the suction space is in turn communicated with the negative pressure space through the suction channel.
Therefore, when etching, only after enough etching acid liquor is injected into the etching space, the negative pressure system is started to enable the negative pressure space to generate negative pressure, so that the suction channel cannot start sucking the etching space acid liquor, and the acid liquor flow paths in the etching space are sequentially a liquid inlet end, a groove, a suction space and a suction channel, and the negative pressure space is formed. So that the acid liquid can continuously flow through the grooves, and is contacted with the walls of the grooves to etch the walls of the grooves; and because the acid liquor in the groove continuously flows, the impurities in the groove can be continuously flushed out by the flowing acid liquor, and the acid liquor is taken out of the groove, so that the groove wall of the groove can be etched better.
Drawings
FIG. 1 is a schematic structural view of a silicon product of the present invention;
FIG. 2 is a schematic diagram of the structure of the present invention;
FIG. 3 is a cross-sectional view of the present invention;
FIG. 4 is an enlarged view of the etch container of FIG. 3;
FIG. 5 is a partial exploded view of the present invention;
FIG. 6 is a schematic view of the structure of the silicon product of the present invention clamped to a carrier plate;
FIG. 7 is a schematic view of the structure of FIG. 6 with the baffle removed;
FIG. 8 is a schematic view of a partial structure in an etching space according to the present invention;
fig. 9 is a schematic structural view of a cover plate of the present invention.
Detailed Description
The technical solutions of the embodiments of the present invention will be explained and illustrated below with reference to the drawings of the embodiments of the present invention, but the following embodiments are only preferred embodiments of the present invention, and not all embodiments. Based on the examples in the implementation manner, other examples obtained by a person skilled in the art without making creative efforts fall within the protection scope of the present invention.
In the following description, directional or positional relationships such as the terms "inner", "outer", "upper", "lower", "left", "right", etc., are presented for convenience in describing the embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
Referring to fig. 1 to 9, the present embodiment provides an etching cleaning machine, which is mainly used for etching a silicon product M, and in this embodiment, for convenience of understanding, a specific description is made for the silicon product M:
as shown in fig. 1, the silicon product M has a circular ring structure, the inner peripheral wall of which forms an inner ring, and the corresponding outer peripheral wall forms an outer ring; the silicon product M comprises a front surface and a back surface which are oppositely arranged, wherein the back surface and the front surface of the silicon product M are both plane, the front surface of the silicon product M is provided with one or more grooves M1 which extend radially (specifically to the radial direction of the silicon product M), and one end of each groove M1 penetrates through the inner ring of the silicon product M.
The etching cleaning machine provided in this embodiment is specifically described below:
the embodiment mainly comprises an etching container 1, a carrying disc 2, a negative pressure system 3 and a cover plate 4. The following describes each component in detail:
as shown in fig. 2, the etching container 1 is provided with an etching space 11, and the etching space 11 is mainly used for containing etching acid liquor.
For example, in this embodiment, the etching container 1 is selected to have a substantially cylindrical tank structure with an opening at the top, and of course, a container cover (not shown) capable of covering the opening at the top of the container may be provided.
Referring to fig. 5, the carrier plate 2 is disposed in the etching space 11, and includes a planar carrying surface 21 for carrying the silicon product M, for example, in this embodiment, the carrier plate 2 has a disc structure, and the top surface has a planar structure, so as to serve as the carrying surface 21.
As shown in fig. 3 and 4, the tray 2 further includes a suction channel 221, and one end of the suction channel 221 penetrates through the supporting surface 21 to form a suction port 222, wherein the suction port 222 is located at the center of the tray 2, as shown in fig. 5.
As shown in fig. 3, the negative pressure system 3 includes a negative pressure space capable of forming a negative pressure, and the other end of the suction passage 221 communicates with the negative pressure space.
For convenience of description, in this embodiment, an end of the groove M1 near the inner ring of the silicon product M is denoted as a proximal end, and correspondingly, the other end of the groove M1 is denoted as a distal end.
As shown in fig. 6 and fig. 7, the cover plate 4 is used for being pressed on the front surface of the silicon product M to cover the inner ring of the silicon product M and the groove M1, and it should be noted that, the cover plate 4 does not cover the groove M1 completely, but only covers a partial area of the groove M1, so as to ensure that the distal end of the groove M1 is exposed to the cover plate 4 (i.e. not blocked by the cover plate 4), so that the distal end of the groove M1 forms a liquid inlet end M2; as shown in fig. 4, the suction port 222 is located within the range of the inner circumference of the silicon product M, that is, the suction port 222 is located within the range of the axial projection of the inner circumference of the silicon product M.
In operation, as shown in fig. 4, silicon product M (i.e. a silicon ring) is pressed against carrier plate 2 by means of cover plate 4, the front side of the silicon ring (i.e. the side with grooves M1) facing cover plate 4. At this time, the cover plate 4, the silicon ring, and the carrier plate 2 are coaxially arranged.
Thus, as shown in fig. 4, the cover plate 4 covers the inner ring of the silicon ring and the portion of the groove M1 near the inner ring at the upper portion of the silicon ring, and exposes the distal end of the groove M1 (i.e. the end of the groove M1 far from the inner ring of the silicon ring) to form the liquid inlet end M2; at this time, a suction space L1 is formed by surrounding the cover plate 4, the carrying disc 2 and the inner ring of the silicon ring; after the cover plate 4 covers the groove M1, the groove M1 corresponds to a flow channel, one end (i.e., the liquid inlet end M2) of the flow channel is communicated with the etching space 11, and the other end is communicated with the suction space L1; the suction space L1 in turn communicates with the negative pressure space through the suction passage 221.
Thus, during etching, only after a sufficient amount of etching acid solution is injected into the etching space 11, the negative pressure system 3 is started to generate negative pressure in the negative pressure space, so that the suction channel 221 cannot start sucking the acid solution in the etching space 11 into the negative pressure space, and the acid solution flow paths in the etching space 11 are sequentially the liquid inlet end M2, the groove M1, the suction space L1, the suction channel 221 and the negative pressure space. So that the acid liquid can continuously flow through the groove M1, and is contacted with the wall of the groove M1 to etch the wall of the groove M1; and because the acid liquor in the groove M1 continuously flows, the flowing acid liquor can continuously wash out impurities in the groove M1 and take out the groove M1, so that the groove wall of the groove M1 can be etched better.
In this embodiment, the negative pressure system 3 includes a liquid return tank 31 and a negative pressure generating device, where the negative pressure generating device is used to generate a negative pressure in the liquid return tank 31 in this embodiment, and a vacuum pump 32 may be selected. The end of the suction passage 221 remote from the suction port 222 (i.e., the lower end of the suction passage 221) communicates with the liquid return tank 31.
In this embodiment, as shown in fig. 3, the liquid return tank 31 is basically in a closed structure, and the suction port of the vacuum pump 32 is communicated with the inside of the liquid return tank 31; in addition, in this embodiment, a partition plate 33 is disposed in the liquid return tank 31, and the liquid return tank 31 is partitioned by the partition plate 33 to form two sub-chambers, wherein a gap is disposed between the top of the partition plate 33 and the top wall of the liquid return tank 31 to serve as a port for communicating the two sub-chambers; the suction channel 221 is located in the left sub-chamber and the suction end of the vacuum pump 32 is located in the right sub-chamber.
The baffle 33 is mainly used for blocking acid liquid flowing into the liquid return tank 31, and preventing the acid liquid from flowing to the right too far to approach to the connection point of the liquid return tank 31 and the vacuum pump 32; further, by providing the partition 33, the connection point between the vacuum pump 32 and the liquid return tank 31 may be provided at the top or at the bottom of the right sub-chamber.
The present embodiment further comprises a plurality of sets of clamping assemblies circumferentially arranged on the carrier plate 2 for clamping the silicon products M between the cover plate 4 and the carrier plate 2. Specifically, as shown in fig. 4 and 6, the clamping assembly includes a screw 61, a clamping block 62, and a nut 63; the screw 61 is fixed on the carrier plate 2 and extends axially along the carrier plate 2; the clamping block 62 and the nut 63 are both arranged on the screw 61 in a penetrating way, and the nut 63 is positioned on the upper side of the clamping block 62 to press the clamping block 62 downwards.
When the clamping device is used, after the silicon products M and the cover plate 4 are sequentially stacked on the carrying disc 2, the clamping blocks 62 and the nuts 63 are sequentially threaded on the screw 61, the nuts 63 are continuously rotated, and the clamping blocks 62 are pressed on the edge of the upper wall of the cover plate 4 under the pushing of the nuts 63, so that the silicon products M and the cover plate 4 are pressed between the clamping blocks 62 and the carrying disc 2, and clamping is realized.
In addition, in order to ensure that the silicon product M can be positioned during clamping so that the silicon product M and the carrier plate 2 can be in a concentric state, in this embodiment, as shown in fig. 5, an annular boss 23 is provided on the top surface of the carrier plate 2, the annular boss 23 is coaxially provided with the carrier plate 2, and the outer diameter of the annular boss 23 is the same as the inner ring of the silicon product M. The annular boss 23 is equivalent to a positioning component, and the inner ring of the silicon product M can be sleeved on the periphery of the annular boss 23 to realize positioning.
As can be seen from the foregoing description, this embodiment is equivalent to pumping acid solution by negative pressure suction, so that the acid solution continuously flows through the trench M1, thereby achieving the purpose of etching; one groove M1 corresponds to one negative pressure suction point, so that if all suction points (i.e. grooves M1) are exposed to the acid liquor at one time, the negative pressure applied by the negative pressure system 3 is dispersed to all suction points, so that the suction force of a single suction point is smaller, the rapid circulation of the acid liquor in the groove M1 is not facilitated, and the scouring effect of the acid liquor on impurities in the groove M1 is affected.
Based on this, in this embodiment, further improvement is made:
as shown in fig. 9, the cover plate 4 is provided with a ring groove 40 which axially penetrates through the cover plate 4, and the ring groove 40 and the cover plate 4 are coaxially arranged; the ring groove 40 is sequentially divided in the circumferential direction to form a plurality of mutually independent partitions 41, that is, two adjacent partitions 41 are separated by a separating block 42.
The embodiment specifically shows that the ring groove 40 is uniformly divided into 6 equal parts along the circumferential direction thereof, thereby forming 6 partitions 41.
As shown in fig. 6, the liquid inlet ends M2 of the grooves M1 are all located in the ring groove 40; further, each partition 41 is configured as: each partition 41 can be intermittently opened and closed; when the partition 41 is opened, the liquid inlet end M2 of the groove M1 corresponding to the partition 41 is completely exposed in the etching space 11; accordingly, when the partition 41 is closed, the liquid inlet end M2 of the groove M1 corresponding to the partition 41 is isolated from the etching space 11, i.e. no or little acid flows into the liquid inlet end M2 of the groove M1 corresponding to the partition 41.
Thus, during etching, one part of the partition 41 is ensured to be opened, and the other part of the partition 41 is ensured to be closed; this corresponds to a reduction in the number of suction points that are opened during a suction action, which helps to ensure the suction force of the opened suction points so that the acid liquid can flow through the channel M1 more rapidly.
The partitions 41 can be intermittently opened, so that each partition 41 can have an opened state, and the grooves M1 corresponding to each partition 41 can be etched by the acid solution.
The present embodiment provides a structure in which the partition 41 can be intermittently opened:
the carrier plate 2 can circumferentially rotate, specifically, as shown in fig. 3, a rotating shaft 22 is arranged at the center of the bottom of the carrier plate 2, and the turntable synchronously rotates along with the rotating shaft 22; the rotating shaft 22 is rotatably connected to the bottom wall of the etching container 1; the lower end extends into the liquid return tank 31 and is rotationally connected with the upper wall of the liquid return tank 31; it will be appreciated that mechanical seals or packing seals are provided at the rotational connection points of the shaft 22 and the etching container 1 and at the rotational connection points of the shaft 22 and the liquid return tank 31 to improve the tightness of the connection points.
The embodiment further includes a motor 8 for driving the carrier plate 2 to rotate, specifically, a belt 81 is adopted between the motor 8 and the rotating shaft 22 for transmission, specifically, belt pulleys are fixed on the rotating shaft 22 and a main shaft of the motor 8, a belt 81 is sleeved between the two belt pulleys, and power transmission between the rotating shaft 22 and the motor 8 is achieved through the belt 81.
Of course, chain transmission, worm gear transmission, or the like may be adopted between the rotation shaft 22 and the motor 8, and the present invention is not limited thereto.
The hollow portion of the shaft 22 forms the suction channel 221, the suction channel 221 extends along the shaft 22, the upper end of the suction channel 221 is connected with the inner portion of the liquid return tank 31 through the supporting surface 21, and the lower end of the suction channel is connected with the upper end of the suction channel.
As shown in fig. 6, a baffle 5 is arranged on the upper wall of the cover plate 4, the baffle 5 is attached to the upper wall of the cover plate 4, and the baffle 5 can be attached to the upper wall of the cover plate 4 to rotate relative to the cover plate 4; specifically, in this embodiment, the baffle 5 has an arc structure, and is coaxially disposed with the ring groove 40, and the width of the baffle 5 is greater than the width of the ring groove 40; the inner side of the baffle plate 5 is provided with a support arm which is rotationally connected with the axle center of the cover plate 4, so that the cover plate 4 and the baffle plate 5 are rotationally connected.
The baffle plate 5 covers the annular groove 40 and extends along the annular groove 40; it should be noted that the outer side of the cover plate 4 extends radially beyond the baffle 5 by a distance to act as a clamping area for the clamping blocks 62, the clamping blocks 62 mainly pressing against this extended portion of the cover plate 4.
The baffle 5 is configured such that it covers at least one of the sections 41 and exposes at least one of the sections 41, and it is understood that the length of the baffle 5 is at least greater than the length of one section 41 and less than the sum of the lengths of N-1 sections 41, where N refers to the number of all sections 41.
For example, in this embodiment, it is shown that the length of the baffle 5 is satisfied, 2 partitions 41 can be covered at a time, at this time, the remaining 4 partitions 41 are in a state of not being covered by the baffle 5, which is equivalent to that two covered partitions 41 are in a closed state, and the other 4 uncovered partitions 41 are equivalent to that in an open state, so that pumping acid solution to the corresponding grooves M1 can be performed normally.
The baffle 5 is arranged to be matched with the rotatable carrier disc 2, so that the partitions 41 can be intermittently opened and closed, for example, the carrier disc rotates for an angle once every set time interval, for example, 120 degrees once every 30 seconds interval, and the partitions 41 can be ensured to be capable of pumping acid liquor finally.
It will be appreciated that the baffle 5 is disposed on the cover plate 4, if the baffle 5 is not limited circumferentially, the carrier disc 2 will simultaneously drive the baffle 5 to rotate together when rotating, so that the baffle 5 cannot replace the covered partition 41, and in this embodiment:
a locking assembly for locking the shutter 5 is also included, which shutter 5, when locked, maintains a relative positioning in the circumferential direction with respect to the etching container 1. That is, during operation, the baffle 5 is kept relatively stationary in the etching container 1, so that the carrier disc 2 drives the silicon product M and the cover plate 4 to rotate synchronously, and the relative positions of the partition 41 on the cover plate 4 and the baffle 5 can be adjusted to realize switching covering of the partition 41.
As shown in fig. 8 and 9, the locking assembly includes a swing rod 71 and a locking groove 73, one end of the swing rod 71 is hinged on the etching container 1 and can be turned up and down relative to the etching container 1, the locking groove 73 is arranged on the baffle 5 for inserting the swing rod 71, and when the swing rod 71 is inserted into the locking groove 73, the baffle 5 and the etching container 1 are kept relatively positioned in the circumferential direction. At this time, the swing rod 71 is equivalent to locking the baffle 5 in the circumferential direction, and the baffle 5 cannot rotate under the limitation of the swing rod 71 and is always kept at the current position.
The lock groove 73 is specifically configured in such a manner that two blocking rods 72 are provided on the baffle 5, and the lock groove 73 is formed by arranging the two blocking rods 72 at intervals. In addition, in order to avoid the swing rod 71 from easily turning upwards and falling out of the locking groove 73, in this embodiment, the swing rod 71 may be magnetically attracted to the baffle 5, for example, in this embodiment, the front end of the swing rod 71 is a magnet, and the swing rod 72 and/or the baffle 5 are/is a material that can be attracted by the magnet, such as iron, etc.; thus, when the swing link 71 is inserted between the two stop bars 72, the swing link 71 is magnetically attracted to the swing link 71 and/or the baffle 5.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (10)

1. A silicon product etching cleaning machine, the silicon product is in an annular structure, and one or more grooves extending radially are arranged on the front surface of the silicon product, and the silicon product etching cleaning machine is characterized by comprising:
an etching container having an etching space therein;
the carrier plate is arranged in the etching space and comprises a planar carrying surface for carrying the silicon product, and the carrier plate also comprises a suction channel, wherein one end of the suction channel penetrates through the carrying surface to form a suction port;
the negative pressure system comprises a negative pressure space capable of forming negative pressure, and the other end of the suction channel is communicated with the negative pressure space;
and the cover plate is used for being pressed on the front surface of the silicon product to cover the inner ring and the groove of the silicon product, the distal end of the groove is exposed out of the cover plate to form a liquid inlet end in a working state, and the suction port is positioned in the range of the inner ring of the silicon product.
2. The etching and cleaning machine for silicon products according to claim 1, wherein the cover plate is provided with annular grooves which axially penetrate through the cover plate, and the annular grooves are sequentially separated along the circumferential direction to form a plurality of mutually independent partitions; the liquid inlet ends of the grooves are all positioned in the annular groove; wherein the partitions can be intermittently opened and closed.
3. The silicon product etching and cleaning machine according to claim 2, wherein the carrier disc can rotate circumferentially, a baffle is arranged on the upper wall of the cover plate, and the baffle can be attached to the upper wall of the cover plate to rotate relative to the cover plate; the baffle plate covers the annular groove and extends along the annular groove; the baffle is configured such that it can cover at least one of the sections and expose at least one of the sections.
4. A silicon product etching and cleaning machine according to claim 3, wherein the bottom of the carrying disc is provided with a rotating shaft, and the rotating shaft is rotatably arranged on the etching container; the inside of the rotating shaft is hollow to form the suction channel.
5. A silicon product etching cleaning machine according to claim 3 further comprising a locking assembly for locking the baffle which, when locked, maintains its relative positioning in the circumferential direction with respect to the etching container.
6. The silicon product etching and cleaning machine according to claim 5, wherein the locking assembly comprises a swing rod and a locking groove, the swing rod is arranged on the etching container and can be turned up and down relative to the etching container, the locking groove is arranged on the baffle plate for inserting the swing rod, and when the swing rod is inserted into the locking groove, the baffle plate and the etching container are kept in relative positioning in the circumferential direction.
7. The etching and cleaning machine for silicon products according to claim 6, wherein two blocking rods are arranged on the baffle plate, and the locking grooves are formed between the two blocking rods at intervals.
8. The silicon product etching and cleaning machine according to claim 6, wherein the swing rod can be magnetically attracted on the baffle plate.
9. The silicon product etching and cleaning machine of claim 1, further comprising a clamping assembly for clamping the silicon product between the cover plate and the carrier plate.
10. The silicon product etching and cleaning machine according to claim 1, wherein the negative pressure system comprises a liquid return tank and a negative pressure generating device, wherein one end of the suction channel away from the suction port is communicated with the liquid return tank, and the negative pressure generating device is used for generating negative pressure in the liquid return tank.
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