CN117471620A

CN117471620A - Optical module

Info

Publication number: CN117471620A
Application number: CN202210858621.8A
Authority: CN
Inventors: 杨世海; 张洪浩; 刘飞; 崔伟; 张强; 赵其圣
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-07-20
Filing date: 2022-07-20
Publication date: 2024-01-30

Abstract

The optical module comprises a circuit board, an optical transceiver component and an optical fiber adapter, wherein a first data processor is arranged on the front surface of the circuit board, and a protruding plate and a notch are arranged at one end of the circuit board; the optical transceiver component comprises a tube shell, a first cover plate, a second cover plate, an optical transmitting device and an optical receiving device, wherein the tube shell comprises a first cavity, a second cavity, a third cavity and a fourth cavity, the first cavity and the third cavity are arranged in a stacked mode, the first cavity, the second cavity, the third cavity and the fourth cavity are arranged side by side, and the first cavity and the third cavity are hard-connected with the optical fiber adapter through an optical port; the circuit board at the notch is inserted into the first cavity, the protruding plate is inserted into the second cavity, the first cover plate covers the first cavity, and the light emitting device is arranged in the first cavity and is electrically connected with the first data processor; the second cover plate covers the third cavity, and the light receiving device is arranged in the third cavity and is electrically connected with the first data processor. The circuit and the optical engine layout are optimized in the optical module, so that the light emitting devices and the light receiving devices share one tube shell and are arranged back to back.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in the optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology, such as 1.6T/3.2T.

In general, in order to increase the transmission rate of the optical module, a transmission channel in the optical module may be increased, for example, an optical module conventionally including a group of optical emission components and a group of optical reception components is improved to include a plurality of groups of optical emission components and a plurality of groups of optical reception components, so that the occupied volumes of the optical emission components and the optical reception components in the optical module are continuously increased, which is not beneficial to the miniaturization development of the optical module.

Disclosure of Invention

The embodiment of the application provides an optical module, which is used for optimizing a circuit and an optical engine layout inside the optical module and is convenient for miniaturization of the optical module.

The application provides an optical module, comprising:

the circuit board is provided with a first data processor on the front surface, and one end of the circuit board is provided with a protruding plate and a notch;

the optical transceiver component is electrically connected with the circuit board and is used for transmitting and receiving multiple paths of light;

the optical fiber adapter is hard-connected with the optical transceiver component and is used for transmitting light;

wherein, the optical transceiver module includes:

the shell comprises a first cavity, a second cavity, a third cavity and a fourth cavity, wherein the first cavity and the third cavity are arranged in a stacked mode, the first cavity and the second cavity are arranged side by side, and the third cavity and the fourth cavity are arranged side by side; the circuit board at the notch is inserted into the first cavity, the protruding plate is inserted into the second cavity, and the third cavity is positioned below the back surface of the circuit board; the first cavity and the third cavity are hard-connected with the optical fiber adapter through an optical port;

The first cover plate is covered on the first cavity and forms an emission cavity with the first cavity;

the light emitting device is arranged in the emitting cavity and is electrically connected with the first data processor; for emitting multiple paths of emitted light;

the second cover plate is covered in the third cavity and forms a receiving cavity with the third cavity;

and the light receiving device is arranged in the receiving cavity, is electrically connected with the first data processor and is used for receiving multiple paths of received light.

As can be seen from the above embodiments, the optical module provided in the embodiments of the present application includes a circuit board, an optical transceiver assembly, and an optical fiber adapter, where a first data processor is disposed on the front surface of the circuit board, and one end of the circuit board is provided with a protruding board and a notch; the optical transceiver component is electrically connected with the first data processor and is used for transmitting and receiving multiple paths of light; the optical fiber adapter is hard-connected with the optical transceiver component and is used for transmitting light; the optical transceiver component comprises a tube shell, a first cover plate, a light emitting device, a second cover plate and a light receiving device, wherein the tube shell comprises a first cavity, a second cavity, a third cavity and a fourth cavity, the first cavity and the third cavity are arranged in a stacked mode, the first cavity and the second cavity are arranged side by side, the third cavity and the fourth cavity are arranged side by side, and the first cavity and the third cavity are hard-connected with the optical fiber adapter through an optical port; the circuit board at the notch is inserted into the first cavity, and the protruding plate is inserted into the second cavity, so that the assembly of the tube shell and the circuit board is realized; the light emitting device is arranged in the first cavity, is electrically connected with the first data processor on the front surface of the circuit board and is used for emitting multiple paths of emitted light; the first cover plate covers the first cavity so as to arrange the light emitting device in an emitting cavity formed by the first cover plate and the first cavity; the third cavity is positioned below the back surface of the circuit board, the light receiving device is arranged in the third cavity and is electrically connected with the first data processor and used for receiving multiple paths of received light; the second cover plate covers the third cavity so as to arrange the light receiving device in a receiving cavity formed by the second cover plate and the third cavity; the light emitting device and the light receiving device in the light receiving and transmitting assembly share one tube shell and are arranged in a back-to-back lamination mode, so that the light emitting device and the light receiving device are integrated into an integrated light receiving and transmitting assembly, an optical port of the light receiving and transmitting assembly is hard connected with the optical fiber adapter, and the optimal layout of the light emitting device and the light receiving device connected with the first data processor can be achieved. This application is for improving optical module transmission rate, is provided with multiunit light emission subassembly, multiunit optical receiving module in optical module, carries out circuit, optical engine overall arrangement optimization through optical module for light emitting device, light receiving device share a tube shell range upon range of setting back to back, can reduce the volume that multiunit light emission subassembly, multiunit optical receiving module occupy in the optical module, thereby do benefit to optical module's miniaturization.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

fig. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

fig. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is a schematic diagram illustrating an assembly of a circuit board, a light emitting assembly and a light receiving assembly in an optical module according to an embodiment of the present application;

fig. 6 is a second schematic assembly diagram of a circuit board, a light emitting assembly and a light receiving assembly in an optical module according to an embodiment of the present application;

Fig. 7 is a partially exploded schematic view of a circuit board, a light emitting assembly, a light receiving assembly and an optical fiber adapter in an optical module according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of a circuit board in an optical module according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of an optical transceiver component in an optical module according to an embodiment of the present application;

fig. 10 is a partially exploded schematic diagram of an optical transceiver component in an optical module according to an embodiment of the present application;

fig. 11 is a schematic diagram showing a partial exploded view of an optical transceiver component in an optical module according to an embodiment of the present application;

fig. 12 is a schematic structural diagram of a package in an optical module according to an embodiment of the present disclosure;

fig. 13 is a schematic structural diagram of an optical transceiver component in an optical module according to an embodiment of the present application;

fig. 14 is a schematic structural diagram II of a tube shell in an optical module according to an embodiment of the present application;

fig. 15 is a second schematic structural diagram of an optical transceiver component in an optical module according to an embodiment of the present application;

fig. 16 is a partial assembly sectional view of an optical transceiver module and a circuit board in an optical module according to an embodiment of the present application;

fig. 17 is a schematic structural diagram of a light emitting component in an optical module according to an embodiment of the present application;

Fig. 18 is a partially exploded schematic view of a light emitting component and a circuit board in an optical module according to an embodiment of the present application;

fig. 19 is a schematic structural diagram of a second emission cover plate in an optical module according to an embodiment of the present application;

fig. 20 is a schematic partial structure diagram of a light emitting component in an optical module according to an embodiment of the present application;

fig. 21 is a partial assembled sectional view of a light emitting component and a circuit board in an optical module according to an embodiment of the present application;

fig. 22 is a schematic structural diagram of a light receiving component in an optical module according to an embodiment of the present application;

fig. 23 is a partially exploded schematic view of a light receiving assembly and a circuit board in an optical module according to an embodiment of the present application;

fig. 24 is a schematic partial structure diagram of a light receiving component in an optical module according to an embodiment of the present application;

fig. 25 is a partial assembly sectional view of a light receiving assembly and a circuit board in an optical module according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

In an optical communication system, an optical signal is used to carry information to be transmitted, and the optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since light has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost, low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and the electric connection is mainly used for power supply, I2C signal transmission, data information transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system. As shown in fig. 1, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-range signal transmission, such as several kilometers (6 kilometers to 8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to achieve unlimited distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing apparatus 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port configured to access the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. Illustratively, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. Since the optical module 200 is a tool for implementing the mutual conversion between the optical signal and the electrical signal, it has no function of processing data, and the information is not changed during the above-mentioned photoelectric conversion process.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. Illustratively, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits an electrical signal from the network cable 103 to the optical module 200, so that the optical network terminal 100, as a host computer of the optical module 200, can monitor the operation of the optical module 200. The upper computer of the optical module 200 may include an optical line terminal (Optical Line Terminal, OLT) or the like in addition to the optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal, and fig. 2 shows only the configuration of the optical network terminal 100 related to the optical module 200 in order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 propose a bi-directional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, and an optical transceiver module.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being covered on the lower housing 202 to form the above-mentioned housing having two openings; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate that is covered on both lower side plates of the lower case 202 to form the above-described case.

In some embodiments, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate and two upper side plates disposed at two sides of the cover plate and perpendicular to the cover plate, and the two upper side plates are combined with the two lower side plates to realize that the upper case 201 is covered on the lower case 202.

The direction in which the two openings 204 and 205 are connected may be the same as the longitudinal direction of the optical module 200 or may be different from the longitudinal direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical port, and the golden finger 301 of the circuit board 300 extends out from the electrical port and is inserted into an upper computer (for example, the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101 such that the external optical fiber 101 connects to an optical transceiver component inside the optical module 200.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that devices such as the circuit board 300 and the optical transceiver component are conveniently installed in the shell, and packaging protection is formed on the devices by the upper shell 201 and the lower shell 202. In addition, when devices such as the circuit board 300 and the optical transceiver assembly are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are convenient to deploy, and the automatic production implementation is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located outside the housing thereof, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates of the lower housing 202, with a snap-in member that mates with an upper computer cage (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a limiting amplifier (limiting amplifier), a clock data recovery (Clock and Data Recovery, CDR) chip, a power management chip, a digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; when the optical transceiver component is positioned on the circuit board, the hard circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger 301 formed on an end surface thereof, the gold finger 301 being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers 301. The golden finger 301 may be disposed on only one surface (such as the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to adapt to the situation where the pin number is large. The golden finger 301 is configured to establish electrical connection with an upper computer to achieve power supply, grounding, I2C signal transfer, data signal transfer, and the like.

Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board. For example, a flexible circuit board may be used to connect the hard circuit board and the optical transceiver.

The DSP chip on the circuit board 300 receives the electric signal transmitted by the golden finger 301, then transmits the electric signal to the laser driving chip on the circuit board 300 through a signal line, and the laser driving chip converts the electric signal into a driving signal which is used for driving the light emitting device in the light receiving and transmitting assembly to emit the light signal; and the external optical signal is converted into an electric signal by the light receiving device in the optical transceiver component, the electric signal is transmitted to the DSP chip for processing by the signal wire, and is transmitted to the upper computer by the golden finger 301 after being processed by the DSP chip.

With the development of optical communication technology, the transmission rate of the optical module is continuously improved, such as 1.6T/3.2T, for the transmission rate of 1.6T, an optical module with 8 channels of 200Gb/s can be adopted, and an optical module with 16 channels of 100Gb/s can also be adopted, wherein the 100G optical module plays a vital role in constructing a high-rate network system, so that the application can select the optical module with 16 channels of 100 Gb/s.

However, limited by industry development, only an 8-channel 800G DSP chip is provided at the present stage, that is, the DSP chip can only provide 8-channel 100G PAM4 data transmission, or 16-channel 50G PAM4 data transmission, which cannot meet 1.6T capacity transmission, and thus cannot meet 2km application scenarios of a data center.

In order to solve the problems, the application is developed based on the 800G DSP technology at the present stage, and the layout of a circuit and an optical engine is optimized in the optical module, so that 16-channel 100G PAM4 data transmission is adopted for both an optical port and an electric port, and 1.6T data transmission of 16 channels is realized.

Fig. 5 is a first schematic assembly diagram of a circuit board, a light emitting assembly and a light receiving assembly in an optical module provided in an embodiment of the present application, and fig. 6 is a second schematic assembly diagram of a circuit board, a light emitting assembly and a light receiving assembly in an optical module provided in an embodiment of the present application. As shown in fig. 5 and fig. 6, the optical module provided in the embodiment of the present application includes an optical transceiver module 400, an optical transmitting module 500 and an optical receiving module 600, where the optical transceiver module 400 is disposed at an end of the circuit board 300 and is connected to the optical fiber adapter 700 in a hard connection manner, so as to implement emission of 8-channel emitted light and reception of 8-channel received light; the light emitting component 500 is arranged on the front surface of the circuit board 300 and is connected with the optical fiber adapter 700 in a tail fiber type connection mode so as to realize the emission of 8-channel emitted light; the light receiving assembly 600 is disposed on the back of the circuit board 300, and is connected to the optical fiber adapter 700 by adopting a pigtail connection manner, so as to receive 8-channel received light.

The transmission of 100G data of 16 channels is realized by the emission light of 8 channels in the optical transceiver module 400 and the emission light of 8 channels in the optical transmitter module 500, and the transmission of 100G data of 16 channels is realized by the receiving light of 8 channels in the optical transceiver module 400 and the receiving light of 8 channels in the optical receiver module 600.

Fig. 7 is a partially exploded schematic view of a circuit board, a light emitting assembly, a light receiving assembly and an optical fiber adapter in an optical module according to an embodiment of the present application, and fig. 8 is a schematic structural view of the circuit board in the optical module according to an embodiment of the present application. As shown in fig. 7 and 8, a first DSP chip 310 and a second DSP chip 320 are disposed on the front surface of the circuit board 300, and the first DSP chip 310 and the second DSP chip 320 are respectively connected to the golden finger 301 through signal lines. The first DSP chip 310 and the second DSP chip 320 may be disposed on the surface of the circuit board 300 along the left-right direction, and the first DSP chip 310 is close to the optical fiber adapter 700, and the second DSP chip 320 is located on the right side of the first DSP chip 310.

In some embodiments, the first DSP chip 310 and the second DSP chip 320 may be located on the same side of the circuit board 300, such as the first DSP chip 310 and the second DSP chip 320 being located on the front side or the back side of the circuit board 300; the first DSP chip 310 and the second DSP chip 320 may also be located on different sides of the circuit board 300, such as the first DSP chip 310 being located on the front or back side of the circuit board 300 and the second DSP chip 320 being located on the back or front side of the circuit board 300.

Since the wind of the system fan mainly goes away from the upper case of the optical module, the portion close to the upper case 201 dissipates heat better, and therefore, the first DSP chip 310 and the second DSP chip 320 are located on the same side and disposed at the front surface of the circuit board 300 for heat dissipation.

The end of the circuit board 300 opposite to the golden finger 301 is provided with a protruding plate 303, the protruding plate 303 extends from the left side end surface of the circuit board 300 towards the direction of the optical fiber adapter 700, the rear side surface of the protruding plate 303 is flush with the rear side surface of the circuit board 300, and a notch 304 is arranged between the front side surface of the protruding plate 303 and the front side surface of the circuit board 300, so that the left side part of the circuit board 300 is L-shaped.

The protruding board 303 of the circuit board 300 is inserted into the optical transceiver module 400, so that the light emitting device in the optical transceiver module 400 is disposed opposite to the notch 304 of the circuit board 300, and the light receiving device in the optical transceiver module 400 is located at the back of the circuit board 300, so that the front of the circuit board 300 can be flush with the light emitting device, and the back of the circuit board 300 is flush with the light receiving device, so as to facilitate the electrical connection between the first DSP chip 310 and the optical transceiver module 400.

In some embodiments, the circuit board 300 is provided with a mounting hole 302 penetrating therethrough, the light emitting component 500 is embedded in the mounting hole 302, and the second DSP chip 320 is electrically connected to the light emitting component 500 through a signal line to drive the light emitting component 500 to emit signal light; the light receiving assembly 600 is electrically connected to the second DSP chip 320 through a signal line to transmit the electrical signal output from the light receiving assembly 600 into the second DSP chip 320.

Fig. 9 is a schematic structural diagram of an optical transceiver in an optical module provided in an embodiment of the present application, fig. 10 is a partially exploded schematic first view of the optical transceiver in the optical module provided in an embodiment of the present application, and fig. 11 is a partially exploded schematic second view of the optical transceiver in the optical module provided in an embodiment of the present application. As shown in fig. 9, 10 and 11, the optical transceiver module 400 includes a package 401, where the package 401 includes a first cavity 402, a second cavity 403, a third cavity 404 and a fourth cavity 405, the first cavity 402 and the second cavity 403 are located above the front surface of the circuit board 300, the third cavity 404 and the fourth cavity 405 are located below the back surface of the circuit board 300, the first cavity 402 is opposite to the third cavity 404, the second cavity 403 is opposite to the fourth cavity 405, and the first cavity 402 and the third cavity 404, and the second cavity 403 and the fourth cavity 405 are separated by a partition board.

In some embodiments, the first cavity 402 and the third cavity 404 are stacked one above the other, and the first cavity 402 and the third cavity 404 are located in the notch 304 of the circuit board 300, and the circuit board 300 is inserted into the first cavity 402; the second cavity 403 and the fourth cavity 405 are arranged one above the other, and the second cavity 403 and the fourth cavity 405 are opposite to the protruding plate 303, and the protruding plate 303 is inserted into the second cavity 403.

The optical transceiver module 400 further includes a first cover 4101, where the first cover 4101 covers the first cavity 402; a light emitting device such as a laser and a lens is disposed in the first cavity 402, and the first cavity 402 and the first cover plate 4101 form a sealed cavity in which the light emitting device such as a laser and a lens is disposed.

The optical transceiver module 400 further comprises a second cover plate 4201, and the second cover plate 4201 is covered on the third cavity 404; a light receiving device such as a lens and a reflecting prism is disposed in the third cavity 404, and the third cavity 404 and the second cover 4201 form a sealed cavity in which the light receiving device such as a lens and a reflecting prism is disposed.

In some embodiments, since the light emitting port is disposed on the top layer and the light receiving port is disposed on the bottom layer in the protocol, the light emitting device and the light receiving device are disposed back-to-back through the first cavity 402 and the third cavity 404, and the light emitting device is located on the front side of the circuit board 300, and the light receiving device is located on the back side of the circuit board 300.

Fig. 12 is a schematic structural diagram of a first tube shell in an optical module provided in an embodiment of the present application, and fig. 13 is a schematic structural diagram of an optical transceiver component in an optical module provided in an embodiment of the present application. As shown in fig. 12 and 13, the package 401 includes a first side plate 4013, a second side plate 4011 and a third side plate 4012, the second side plate 4011 is disposed opposite to the third side plate 4012, the second side plate 4011 and the third side plate 4012 are respectively connected to the first side plate 4013, and the first side plate 4013, the second side plate 4011 and the third side plate 4012 enclose a first cavity 402.

In some embodiments, the first side plate 4013 is located on the left side of the first cavity 402, the second side plate 4011 is located on the front side of the first cavity 402, the third side plate 4012 is located on the rear side of the first cavity 402, the right side of the first cavity 402 is open, and thus the first cavity 402 is a right side open U-shaped cavity.

The first side plate 4013 extends rearward from the third side plate 4012 such that the first side plate 4013 protrudes from the third side plate 4012, the first side plate 4013 and the third side plate 4012 enclosing the second cavity 403. The first side plate 4013 is located at the left side of the second cavity 403, the third side plate 4012 is located at the front side of the second cavity 403, and both the rear side and the right side of the second cavity 403 are provided with openings, so that the second cavity 403 is separated from the first cavity 402 by the third side plate 4012.

The first cavity 402 includes a first mounting surface 4021, a second mounting surface 4022, a third mounting surface 4023, and a fourth mounting surface 4024, the first mounting surface 4021 faces the circuit board 300, the second mounting surface 4022 is connected to the first mounting surface 4021, the fourth mounting surface 4024 is connected to the first side board 4013, and the third mounting surface 4023 is connected to the second mounting surface 4022 and the fourth mounting surface 4024, respectively.

In some embodiments, the second mounting surface 4022 is recessed from the first mounting surface 4021, the fourth mounting surface 4024 is recessed from the third mounting surface 4023, and one end of the circuit board 300 including the notch 304 is inserted into the first cavity 402 through an opening of the first cavity 402, and a back surface of the circuit board 300 is in contact with the first mounting surface 4021.

The second mounting surface 4022 is provided with a first semiconductor refrigerator 4102, the cooling surface of the first semiconductor refrigerator 4102 is provided with a first laser group 4103 and a second laser group 4104, and the first laser group 4103 and the second laser group 4104 are arranged side by side in the front-rear direction on the first semiconductor refrigerator 4102.

In some embodiments, the first laser set 4103 may include four lasers, the four lasers being arranged side-by-side in the front-to-back direction; the second laser group 4104 may include four lasers, which are arranged side by side in the front-rear direction. As described above, 8 lasers are provided side by side in the front-rear direction on the cooling surface of the first semiconductor refrigerator 4102.

In some embodiments, the first DSP chip 310 on the front side of the circuit board 300 is an 8-channel 800G DSP such that each channel of the first DSP chip 310 is capable of transmitting 100Gb/s electrical signals, the 100Gb/s electrical signals are capable of driving 100Gb/s lasers, and such that each laser within the first cavity 402 is a 100Gb/s laser.

Under the supporting action of the first semiconductor refrigerator 4102, the bonding heights of the first laser set 4103 and the second laser set 4104 are on the same plane with the front surface of the circuit board 300, so that the bonding distances between the first laser set 4103 and the second laser set 4104 and the front surface of the circuit board 300 are shortest, and the loss can be reduced.

In some embodiments, a first laser driving chip is further disposed on the front surface of the circuit board 300, and the first laser driving chip is located between the first DSP chip 310 and the optical transceiver component 400, the first DSP chip 310 transmits an electrical signal to the first laser driving chip via a signal line, and the first laser driving chip converts the electrical signal into a driving electrical signal, and the driving electrical signal is transmitted to the first laser set 4103 and the second laser set 4104 to drive the first laser set 4103 and the second laser set 4104 to generate 4 paths of emitted light respectively.

The first semiconductor refrigerator 4102 is further provided with a first collimating lens group 4105 and a second collimating lens group 4106 on a cooling surface, the first collimating lens group 4105 is located in a light emitting direction of the first laser group 4103, the second collimating lens group 4106 is located in a light emitting direction of the second laser group 4104, and the collimating lenses are arranged in a one-to-one correspondence with the lasers, so that emitted light emitted by each laser is converted into collimated light through the collimating lenses.

The third mounting surface 4023 is provided with a first wavelength division multiplexer 4107 and a second wavelength division multiplexer 4108, the first wavelength division multiplexer 4107 includes four input ends and one output end, the four input ends are arranged in one-to-one correspondence with the first collimating lens group 4105, so that four paths of collimated light output by the first collimating lens group 4105 all enter the first wavelength division multiplexer 4107, the four paths of collimated light are multiplexed into one path of composite light through the first wavelength division multiplexer 4107, and the one path of composite light is emitted through the output end; the second wavelength division multiplexer 4108 includes four input ends and one output end, the four input ends are arranged in one-to-one correspondence with the second collimating lens group 4106, so that four paths of collimated light output by the second collimating lens group 4106 all enter the second wavelength division multiplexer 4108, and the four paths of collimated light are multiplexed into one path of composite light by the second wavelength division multiplexer 4108, and one path of composite light is emitted through the output end.

The fourth mounting surface 4024 is provided with a first converging lens 4109 and a second converging lens 4110, where the first converging lens 4109 is disposed corresponding to the output end of the first wavelength division multiplexer 4107, so as to convert one path of composite light output by the first wavelength division multiplexer 4107 into converging light; the second focusing lens 4110 is disposed corresponding to the second wavelength division multiplexer 4108, so as to convert one path of the composite light output by the second wavelength division multiplexer 4108 into a focused light.

The first side board 4013 is provided with a first light outlet 4025 and a second light outlet 4026, the first light outlet 4025 and the second light outlet 4026 are both communicated with the first cavity 402, so that the first cavity 402 is hard-connected with the optical fiber adapter 700 through the first light outlet 4025 and the second light outlet 4026, the converged light emitted by the first converging lens 4109 is emitted into the optical fiber adapter 700 through the first light outlet 4025, the converged light emitted by the second converging lens 4110 is emitted into the optical fiber adapter 700 through the second light outlet 4026, and the emission of 2 paths of composite light (8 paths of emitted light) is realized.

In some embodiments, the first and second light outlets 4025, 4026 are hardwired to the fiber optic adapter 700 using MDC light ports, enabling hardwired assembly of the first cavity 402 to the fiber optic adapter 700.

In some embodiments, the first cover 4101 may include a first top surface, a first side surface, a second side surface and a third side surface, where the first side surface and the second side surface are opposite to each other, and the first side surface and the second side surface are connected to two opposite sides of the first top surface, the third side surface is opposite to the first side plate 4013, and the third side surface is connected to the first top surface, the first side surface and the third side surface, respectively, and the length dimensions of the first side surface and the second side surface in the left-right direction are smaller than the length dimension of the first top surface in the left-right direction.

The left side of the first top surface is abutted against the first side plate 4013, and the inner wall of the first top surface abuts against the tops of the second side plate 4011 and the third side plate 4012, so that the first cover plate 4101 covers the first side plate 4013, the second side plate 4011 and the third side plate 4012. The first side surface of the first cover plate 4101 is abutted against the right side of the second side plate 4011, the second side surface is abutted against the right side of the third side plate 4012, and the bottom side of the third side surface is abutted against the front surface of the circuit board inserted into the first cavity 402, so that the first cover plate 4101 and the first cavity 402 form a sealed cavity, and the first laser set 4103, the second laser set 4104, the first collimating lens set 4105, the second collimating lens set 4106, the first wavelength division multiplexer 4107, the second wavelength division multiplexer 4108, the first converging lens 4109 and the second converging lens 4110 are all arranged in the sealed cavity.

In some embodiments, the second cavity 403 includes a fifth mounting surface 4031, the fifth mounting surface 4031 extends from the first side plate 4013 in the direction of the circuit board 300, the fifth mounting surface 4031 is disposed side by side with the mounting surface in the first cavity 402, and a length dimension of the fifth mounting surface 4031 in the left-right direction is smaller than a length dimension of the third side plate 4012 in the left-right direction. The protruding plate 303 of the circuit board 300 is inserted into the second cavity 403, and the back surface of the protruding plate 303 is in contact with the fifth mounting surface 4031.

The first side board 4013 is further provided with a third light outlet 4032 and a fourth light outlet 4033, and the third light outlet 4032 and the fourth light outlet 4033 are all communicated with the second cavity 403, so that the second cavity 403 is connected with the optical fiber adapter 700 through the third light outlet 4032 and the fourth light outlet 4033.

Fig. 14 is a schematic structural diagram of a second tube shell in the optical module provided in the embodiment of the present application, and fig. 15 is a schematic structural diagram of a second optical transceiver component in the optical module provided in the embodiment of the present application. As shown in fig. 14 and 15, the package 401 further includes a fourth side plate 4014 and a fifth side plate 4015, the fourth side plate 4014 is disposed opposite to the fifth side plate 4015, the fourth side plate 4014 and the fifth side plate 4015 are respectively connected to the first side plate 4013, and the first side plate 4013, the fourth side plate 4014 and the fifth side plate 4015 enclose a third cavity 404.

In some embodiments, the first side plate 4013 is located on the left side of the third cavity 404, the fourth side plate 4014 is located on the rear side of the third cavity 404, the fifth side plate 4015 is located on the front side of the third cavity 404, the right side of the third cavity 404 is open, and thus the third cavity 404 is a right side open U-shaped cavity. The second side plate 4011 may be flush with the fourth side plate 4014, and the third side plate 4012 may be flush with the fifth side plate 4015.

The first side plate 4013 extends forward from the fifth side plate 4015 such that the first side plate 4013 protrudes from the fifth side plate 4015, and the first side plate 4013 and the fifth side plate 4015 enclose a fourth cavity 405. The first side plate 4013 is located on the left side of the fourth cavity 405, the fifth side plate 4015 is located on the rear side of the fourth cavity 405, and both the front side and the rear side of the fourth cavity 405 are provided with openings, so that the fourth cavity 405 is separated from the third cavity 404 by the fifth side plate 4015.

The third cavity 404 includes a sixth mounting surface 4041, a seventh mounting surface 4045, and an eighth mounting surface 4046, the sixth mounting surface 4041 is connected to the first side board 4013, the eighth mounting surface 4046 faces the circuit board 300, the seventh mounting surface 4045 is located between the sixth mounting surface 4041 and the eighth mounting surface 4046, and the eighth mounting surface 4046 is recessed from the seventh mounting surface 4045.

The seventh mounting surface 4045 is provided with a stopper 4042 at an end facing the sixth mounting surface 4041, the stopper 4042 dividing the seventh mounting surface 4045 into a first passage 4043 and a second passage 4044, and the sixth mounting surface 4041 communicates with the seventh mounting surface 4045 through the first passage 4043 and the second passage 4044.

The first side plate 4013 is provided with a first light inlet 4047 and a second light inlet 4048, and the first light inlet 4047 and the second light inlet are both communicated with the third cavity 404, that is, two paths of composite received light transmitted by the optical fiber adapter 700 are respectively injected into the third cavity 404 through the first light inlet 4047 and the second light inlet 4048.

In some embodiments, the first light inlet 4047 and the second light inlet 4048 are connected to the fiber optic adapter 700 using MDC light ports, enabling a hard-wired assembly of the third cavity 404 and the fiber optic adapter 700.

The sixth mounting surface 4041 is provided with a first collimating lens 4202 and a second collimating lens 4203, and the first collimating lens 4202 and the second collimating lens 4203 are arranged side by side on the sixth mounting surface 4041. The first collimating lens 4202 is disposed corresponding to the first light inlet 4047, such that a path of the composite light entering through the first light inlet 4047 is converted into collimated light by the first collimating lens 4202; the second collimator lens 4203 is disposed corresponding to the second light inlet 4048, and another path of the combined light entering through the second light inlet 4048 is converted into collimated light by the second collimator lens 4203.

The seventh mounting surface 4045 is provided with a first wavelength division demultiplexer 4204 and a second wavelength division demultiplexer 4205, the first wavelength division demultiplexer 4204 has one input end and four output ends, the input end of the first wavelength division demultiplexer 4204 is arranged corresponding to the first collimating lens 4202, so that the collimated light emitted from the first collimating lens 4202 is incident into the first wavelength division demultiplexer 4204, the first wavelength division demultiplexer 4204 demultiplexes one path of composite light into four paths of received light, and the four paths of received light are emitted through the four output ends, respectively.

The second wavelength division demultiplexer 4205 has one input end and four output ends, and the input end of the second wavelength division demultiplexer 4205 is disposed corresponding to the second collimating lens 4203, so that the collimated light emitted from the second collimating lens 4203 is incident into the second wavelength division demultiplexer 4205, and the second wavelength division demultiplexer 4205 demultiplexes one path of composite light into four paths of received light, and the four paths of received light are emitted through the four output ends, respectively.

The eighth mounting surface 4046 is provided with a first converging lens group 4206 and a second converging lens group 4207, and the first converging lens group 4206 includes four converging lenses, each of which is disposed corresponding to each output end of the first wavelength division demultiplexer 4204, so that four paths of received light output by the first wavelength division demultiplexer 4204 are converted into converging light by the first converging lens group 4206.

The second collection lens group 4207 includes four collection lenses, each of which is disposed corresponding to each output end of the second wavelength division demultiplexer 4205, so that four paths of received light output from the second wavelength division demultiplexer 4205 are converted into collected light by the second collection lens group 4207.

In some embodiments, since the first detector group 305 and the second detector group 306 are disposed on the back surface of the circuit board 300, there is a height difference between the first detector group 305, the second detector group 306, and the eighth mounting surface 4046; and the receiving directions of the first detector set 305 and the second detector set 306 are perpendicular to the back surface of the circuit board 300, and the transmitting directions of the received light emitted by the first converging lens set 4206 and the second converging lens set 4207 are parallel to the back surface of the circuit board 300. In this way, a mirror needs to be disposed between the first converging lens group 4206 and the second converging lens group 4207 and the first detector group 305 and the second detector group 306, so as to change the transmission direction of the received light emitted from the first converging lens group 4206 and the second converging lens group 4207, so that the received light is incident on the first detector group 305 and the second detector group 306.

The eighth mounting surface 4046 is further provided with a first reflection prism 4208 and a second reflection prism 4209, one end of the first reflection prism 4208 is disposed corresponding to the first focusing lens group 4206, and the other end of the first reflection prism 4208 is provided with a reflection surface above the first detector group 305. In this way, the reflection surface of the first reflection prism 4208 reflects the four paths of received light emitted from the first focusing lens group 4206, and the reflected four paths of received light are respectively emitted into the corresponding detectors of the first detector group 305.

One end of the second reflection prism 4209 is disposed corresponding to the second converging lens group 4207, and the other end of the second reflection prism 4209 is provided with a reflection surface, which is located above the second detector group 306. In this way, the reflection surface of the second reflection prism 4209 reflects the four paths of received light emitted from the second focusing lens group 4207, and the reflected four paths of received light are respectively emitted into the corresponding detectors of the second detector group 306.

In some embodiments, the second cover 4201 may include a second top surface, a bevel, a fourth side surface and a fifth side surface, the fourth side surface being disposed opposite the fifth side surface, and the fourth side surface, the fifth side surface being connected to the side surface opposite the second top surface; the inclined plane is disposed opposite to the first side board 4013, and the distance between the inclined plane and the front surface of the circuit board 300 is gradually reduced from left to right, and the inclined plane is respectively connected with the second top surface, the fourth side surface, and the fifth side surface.

The left side of the second top surface is abutted against the first side plate 4013, the fourth side surface is abutted against the right side of the fourth side plate 4014, the fifth side surface is abutted against the right side of the fifth side plate 4015, the inclined surface is positioned above the first and second reflection prisms 4208 and 4209, and the bottom side of the inclined surface is abutted against the back surface of the circuit board 300, so that the second cover plate 4201 and the third cavity 404 form a sealed cavity to dispose the first collimating lens 4202, the second collimating lens 4203, the first wavelength-division multiplexer 4204, the second wavelength-division multiplexer 4205, the first converging lens group 4206, the second converging lens group 4207, the first reflection prism 4208, the second reflection prism 4209, the first detector group 305, the second detector group 306, and the like therein.

In some embodiments, the fourth cavity 405 includes a ninth mounting surface 4051, the ninth mounting surface 4051 is disposed opposite the fifth mounting surface 4031 in a vertical direction, the ninth mounting surface 4051 extends from the first side plate 4013 toward the circuit board 300, the ninth mounting surface 4051 is disposed side by side with the mounting surface in the third cavity 404, and a length dimension of the ninth mounting surface 4051 in the lateral direction is smaller than a length dimension of the fifth side plate 4015 in the lateral direction. The protruding plate 303 of the circuit board 300 is inserted into the second cavity 403, and the ninth mounting surface 4051 is located below the back surface of the circuit board 300.

The first side plate 4013 is further provided with a third light inlet 4052 and a fourth light inlet 4053, and the third light inlet 4052 and the fourth light inlet 4053 are all communicated with the fourth cavity 405, so that the fourth cavity 405 is connected with the optical fiber adapter 700 through the third light inlet 4052 and the fourth light inlet 4053.

Fig. 16 is a partial assembly sectional view of an optical transceiver module and a circuit board in an optical module according to an embodiment of the present application. As shown in fig. 16, the first cavity 402 and the third cavity 404 are stacked up and down, and after the first laser set 4103, the second laser set 4104, the first collimating lens set 4105, the second collimating lens set 4106, the first wavelength division multiplexer 4107, the second wavelength division multiplexer 4108, the first converging lens 4109 and the second converging lens 4110 are respectively mounted in the first cavity 402, the Tx pad of the first DSP chip 310 is connected to the first laser driving chip through a high-speed signal line, and the first laser driving chip is connected to the first laser set 4103 and the second laser set 4104 through signal lines, respectively, so that the electric signals output by the first DSP chip 310 are transmitted to the first laser driving chip, and the first laser driving chip outputs driving electric signals according to the electric signals to drive the first laser set 4103 and the second laser set 4104 to generate multiple emission light.

The four emitted lights emitted by the second laser set 4104 are converted into four collimated lights by the second collimating lens set 4106, the four collimated lights are multiplexed into one composite light by the second wavelength division multiplexer 4108, the one composite light is converted into converging light by the second converging lens 4110, and the converging light is coupled to the optical fiber adapter 700 through the second light outlet 4026.

In some embodiments, when the collected light is coupled to the fiber optic adapter 700 through the second light outlet 4026, a portion of the collected light may be reflected at the fiber end face within the fiber optic adapter 700, and the reflected light returns to the laser via the primary path, affecting the light emitting performance of the laser. To avoid reflected light from returning to the laser, a first isolator, which is disposed between the first wavelength division multiplexer 4107 and the first condensing lens 4109, for isolating reflected light occurring at the fiber end face to avoid reflected light from returning to the first laser group 4103, and a second isolator 4111 may be provided on the fourth mounting surface 4024.

A second isolator 4111 is disposed between the second wavelength division multiplexer 4108 and the second converging lens 4110, the second isolator 4111 being configured to isolate reflected light occurring at the fiber end face to avoid the reflected light returning to the second laser group 4104.

After the first collimating lens 4202, the second collimating lens 4203, the first wavelength-division multiplexer 4204, the second wavelength-division multiplexer 4205, the first converging lens group 4206, the second converging lens group 4207, the first reflecting prism 4208, and the second reflecting prism 4209 are respectively mounted in the third cavity 404, two paths of composite light transmitted by the optical fiber adapter 700 are respectively injected into the third cavity 404 through the first light inlet 4047 and the second light inlet 4048.

One path of the composite light entering the second cavity 403 is converted into collimated light by the second collimating lens 4203, the collimated light is demultiplexed into four paths of receiving light by the second wavelength division demultiplexer 4205, the four paths of receiving light are converted into four paths of converging light by the second converging lens group 4207, and the four paths of converging light are reflected by the second reflecting prism 4209 and then enter the second detector group 306.

The second detector group 306 is electrically connected to the Rx pad of the first DSP chip 310 through a high-speed signal line, so that after the second detector group 306 converts the optical signal into an electrical signal, the electrical signal is transmitted to the first DSP chip 310 through the high-speed signal line, and the first DSP chip 310 transmits the processed electrical signal to the upper computer through the golden finger 301.

In some embodiments, since the detector is disposed on the back surface of the circuit board 300, and the first DSP chip 310 is disposed on the front surface of the circuit board 300, a via hole may be disposed on the circuit board 300, an Rx pad of the first DSP chip 310 is connected to one end of the via hole, a high-speed signal line is disposed on the back surface of the circuit board 300, one end of the high-speed signal line is connected to the other end of the via hole, and the other end of the high-speed signal line is connected to the detector, so that the electrical connection between the detector and the first DSP chip 310 is realized.

This application is with 2 light emitting device of group and 2 light receiving device integration body structures, and light emitting device and light receiving device share a tube shell back-to-back setting, and light emitting device is located the upper strata of tube shell, and light receiving device is located the lower floor of tube shell, has realized that 8 passageway 800G transmits data transmission and 8 passageway 800G receives data transmission.

Fig. 17 is a schematic structural diagram of a light emitting component in an optical module provided in an embodiment of the present application, and fig. 18 is a schematic partially exploded view of the light emitting component and a circuit board in the optical module provided in the embodiment of the present application. As shown in fig. 17 and 18, the optical module provided in this embodiment of the present application further includes an optical emission assembly 500, where the optical emission assembly 500 includes a first emission cover plate 501, a second emission cover plate 502, and a support plate 504, the support plate 504 is disposed on the front surface of the circuit board 300, and a light emitting device such as a lens is disposed on the support plate 504, and the first emission cover plate 501 covers the support plate 504, so that the light emitting device such as a lens is disposed in a cavity formed by the first emission cover plate 501 and the support plate 504.

The circuit board 300 is provided with a mounting hole 302, a laser is embedded in the mounting hole 302, and is fixed in the second transmitting cover plate 502, and the top surface of the second transmitting cover plate 502 is in contact connection with the back surface of the circuit board 300, so that the laser located in the mounting hole 302 is arranged in a cavity formed by the second transmitting cover plate 502 and the circuit board 300.

Fig. 19 is a schematic structural diagram of a second emission cover plate in an optical module provided in an embodiment of the present application, and fig. 20 is a schematic structural diagram of a portion of an optical emission assembly in an optical module provided in an embodiment of the present application. As shown in fig. 19 and 20, the second emission cover plate 502 includes a mounting groove 5021 and a supporting block 5022, a mounting bottom surface of the mounting groove 5021 is recessed in a top surface of the second emission cover plate 502, a second semiconductor refrigerator 503 is disposed in the mounting groove 5021, a first laser array 505 and a second laser array 511 are disposed on a cooling surface of the second semiconductor refrigerator 503, and the first laser array 505 and the second laser array 511 are disposed side by side on the cooling surface of the second semiconductor refrigerator 503 along a front-rear direction.

The first laser array 505 may include four lasers arranged side-by-side in the front-to-back direction; the second laser array 511 may include four lasers, which are arranged side by side in the front-to-rear direction. In this way, 8 lasers are arranged side by side in the front-rear direction on the cooling surface of the second semiconductor refrigerator 503.

The second DSP chip 320 on the front side of the circuit board 300 is an 8-channel 800G DSP, so that each channel of the second DSP chip 320 can transmit 100Gb/s electrical signals, and the 100Gb/s electrical signals can drive 100Gb/s lasers, so that each laser of the first laser array 505 and the second laser array 511 is a 100Gb/s laser.

Under the supporting action of the second semiconductor refrigerator 503, the wire bonding heights of the first laser array 505 and the second laser array 511 are on the same plane with the front surface of the circuit board 300, so that the wire bonding distance between the first laser array 505 and the second laser array 511 and the front surface of the circuit board 300 is shortest, and the loss can be reduced.

In some embodiments, a second laser driving chip is further disposed on the front surface of the circuit board 300, and the second laser driving chip is located between the second DSP chip 320 and the light emitting component 500, the second DSP chip 320 transmits an electrical signal to the second laser driving chip via a signal line, and the second laser driving chip converts the electrical signal into a driving electrical signal, and the driving electrical signal is transmitted to the first laser array 505 and the second laser array 511, so as to drive the first laser array 505 and the second laser array 511 to generate 4 paths of emitted light, respectively.

The cooling surface of the second semiconductor refrigerator 503 is further provided with a first collimating lens array 506 and a second collimating lens array 512, the first collimating lens array 506 is located in the light emitting direction of the first laser array 505, the second collimating lens array 512 is located in the light emitting direction of the second laser array 511, and the collimating lenses are arranged in one-to-one correspondence with the lasers, so that the emitted light emitted by each laser is converted into collimated light through the collimating lenses.

Since the wire bonding heights of the lasers in the first laser array 505 and the second laser array 511 are in the same plane with the front surface of the circuit board 300, and the supporting board 504 is disposed on the front surface of the circuit board 300, a height difference exists between the wire bonding heights of the lasers and the mounting surface on the supporting board 504, and therefore, a translating prism 507 may be disposed between the first collimating lens array 506, the second collimating lens array 512 and the supporting board 504, and the propagation direction of the emitted light may be changed by the translating prism 507.

Specifically, one end of the translating prism 507 is disposed on the supporting block 5022 through the mounting hole 302, and the other end of the translating prism 507 is located above the front surface of the circuit board 300 to reflect and translate the emitted light flush with the front surface of the circuit board 300 to above the front surface of the circuit board 300.

The support plate 504 is provided with a first mounting surface 5041, a second mounting surface 5042 and a third mounting surface 5043, the first mounting surface 5041 is recessed in the second mounting surface 5042, the second mounting surface 5042 is recessed in the third mounting surface 5043, the third mounting surface 5043 faces the translation prism 507, the first mounting surface 5041 faces the optical fiber adapter 700, and the second mounting surface 5042 is located between the first mounting surface 5041 and the third mounting surface 5043.

The third assembling surface 5043 is provided with a third wavelength division multiplexer 508 and a fourth wavelength division multiplexer 513 side by side, the third wavelength division multiplexer 508 comprises four input ends and an output end, the four input ends are correspondingly arranged with the output end of the translation prism 507, so that four paths of collimated light emitted by the first collimating lens array 506 are translated by the light path of the translation prism 507 and then are emitted into the third wavelength division multiplexer 508, the third wavelength division multiplexer 508 multiplexes the four paths of emitted light into one path of composite light, and one path of composite light is emitted by one output end.

The fourth wavelength division multiplexer 513 includes four input ends and one output end, the four input ends are disposed corresponding to the output ends of the translation prism 507, so that the four paths of collimated light emitted by the second collimating lens array 512 are translated by the optical path of the translation prism 507 and then are emitted into the fourth wavelength division multiplexer 513, and the fourth wavelength division multiplexer 513 multiplexes the four paths of emitted light into one path of composite light, and the one path of composite light is emitted by one output end.

A third converging lens 509 and a fourth converging lens 514 are arranged on the second assembling surface 5042 in parallel, the third converging lens 509 is arranged corresponding to the output end of the third wavelength division multiplexer 508, and the composite light output by the third wavelength division multiplexer 508 is converted into converging light through the third converging lens 509. The fourth converging lens 514 is disposed corresponding to the output end of the fourth wavelength division multiplexer 513, and the composite light output by the fourth wavelength division multiplexer 513 is converted into converging light by the fourth converging lens 514.

A first optical coupler 510 and a second optical coupler 515 are arranged on the first assembling surface 5041 side by side, and one end of the first optical coupler 510 is arranged corresponding to the third converging lens 509, so that converging light emitted by the third converging lens 509 is coupled to the first optical coupler 510; the other end of the first optical coupler 510 is connected to the optical fiber adapter 700 through an internal optical fiber to transmit a path of composite light to the optical fiber adapter 700.

One end of the second optical coupler 515 is disposed corresponding to the fourth converging lens 514, such that the converging light emitted from the fourth converging lens 514 is coupled to the second optical coupler 515; the other end of the second optical coupler 515 is connected to the optical fiber adapter 700 through an internal optical fiber to transmit one path of the combined light to the optical fiber adapter 700.

One internal optical fiber connected to the first optical coupler 510 is connected to the optical fiber adapter 700 through the third light outlet 4032, and the other internal optical fiber connected to the second optical coupler 515 is connected to the optical fiber adapter 700 through the fourth light outlet 4033, so that the optical transmitting assembly 500 is connected to the optical fiber adapter 700 by adopting a pigtail connection mode.

Fig. 21 is a partial assembled sectional view of a light emitting assembly and a circuit board in an optical module according to an embodiment of the present application. As shown in fig. 21, the second semiconductor refrigerator 503 is mounted in the mounting groove 5021 of the second transmitting cover plate 502, and the first laser array 505 and the second laser array 511 are arranged side by side on the cooling surface of the second semiconductor refrigerator 503; then, the first collimating lens array 506 and the second collimating lens array 512 are arranged side by side on the cooling surface of the second semiconductor refrigerator 503, and the first collimating lens array 506 is located in the light emitting direction of the first laser array 505, and the second collimating lens array 512 is located in the light emitting direction of the second laser array 511; then mounting the translating prism 507 to the support block 5022 of the second transmitting cover plate 502; the top surface of the assembled second emitter cap plate 502 is then secured to the back surface of the circuit board 300, and the first laser array 505, the second laser array 511, the first collimating lens array 506, the second collimating lens array 512, and the translating prism 507 within the second emitter cap plate 502 are positioned within the mounting hole 302; the third wavelength division multiplexer 508, the fourth wavelength division multiplexer 513 are then mounted to the third mounting face 5043 of the support plate 504, the third converging lens 509, the fourth converging lens 514 are mounted to the second mounting face 5042 of the support plate 504, and the first optical coupler 510, the second optical coupler 515 are mounted to the first mounting face 5041 of the support plate 504.

In some embodiments, when the converged light is converged into the internal optical fiber through the first optical coupler 510, a part of the converged light may be reflected at the fiber end surface of the internal optical fiber, and the reflected light returns to the laser through the original path, so as to affect the light emitting performance of the laser. To avoid reflected light returning to the laser, a third isolator may be provided within the first optical coupler 510 for isolating reflected light occurring at the fiber end face to avoid reflected light returning to the first laser array 505. A fourth isolator 516 is provided within the second optical coupler 515, the fourth isolator 516 being used to isolate reflected light occurring at the fiber end face to avoid the reflected light returning to the second laser array 511.

After the light emitting component 500 is assembled, the Tx pad of the second DSP chip 320 is connected with a second laser driving chip through a high-speed signal line, the second laser driving chip is respectively connected with the first laser array 505 and the second laser array 511 through signal lines, the second laser driving chip outputs driving signals to drive the first laser array 505 to generate four paths of emitting light, the four paths of emitting light are converted into four paths of collimated light through the first collimating lens array 506, the four paths of collimated light are reflected and translated through the translating prism 507 and then are injected into the third wavelength division multiplexer 508, the third wavelength division multiplexer 508 multiplexes the four paths of reflected light into one path of composite light, the one path of composite light is converged to the first optical coupler 510 through the third converging lens 509, and the composite light output by the first optical coupler 510 is transmitted to the optical fiber adapter 700 through an internal optical fiber, so that the emission of the four paths of emitting light is realized.

The second laser driving chip outputs driving electric signals to drive the second laser array 511 to generate four paths of emission light, the four paths of emission light are converted into four paths of collimation light through the second collimation lens array 512, the four paths of collimation light are reflected and translated through the translation prism 507 and then are emitted into the fourth wavelength division multiplexer 513, the fourth wavelength division multiplexer 513 multiplexes the four paths of reflection light into one path of composite light, the one path of composite light is converged to the second optical coupler 515 through the fourth converging lens 514, and the composite light output by the second optical coupler 515 is transmitted to the optical fiber adapter 700 through an internal optical fiber, so that the emission of the four paths of emission light is realized.

Fig. 22 is a schematic structural diagram of a light receiving assembly in an optical module provided in an embodiment of the present application, fig. 23 is a schematic partially exploded view of the light receiving assembly and a circuit board in the optical module provided in an embodiment of the present application, and fig. 24 is a schematic partially structural diagram of the light receiving assembly in the optical module provided in an embodiment of the present application. As shown in fig. 22, 23 and 24, the optical module provided in this embodiment of the present application further includes an optical receiving assembly 600, where the optical receiving assembly 600 includes a receiving cover plate 601, and a first fixing plate 602 and a second fixing plate 603 disposed on the receiving cover plate 601, and light receiving devices such as a wavelength division multiplexer, a lens, a reflecting prism and the like are disposed on the first fixing plate 602 and the second fixing plate 603, and the light receiving devices are located in a cavity between the first fixing plate 602, the second fixing plate 603 and the receiving cover plate 601.

Specifically, the first fixing plate 602 is disposed in the left-right direction, and the first fixing plate 602 is fixed on the back surface of the circuit board 300. The left side of the first fixing plate 602 is provided with a first light collimator 604, one end of the first light collimator 604 is connected with the optical fiber adapter 700 through an internal optical fiber, one path of composite light transmitted by the optical fiber adapter 700 is transmitted to the first light collimator 604 through the internal optical fiber, and the first light collimator 604 collimates the composite light; a third wavelength-division demultiplexer 606 is disposed on the right side of the first optical collimator 604, and the third wavelength-division demultiplexer 606 demultiplexes the collimated light output from the first optical collimator 604 into four paths of received light; the right side of the third wavelength division demultiplexer 606 is provided with a first converging lens array 608, and four paths of received light are converted into four paths of converging light through the first converging lens array 608.

In some embodiments, one end of the internal optical fiber is connected to the first light collimator 604, and the other end is connected to the optical fiber adapter 700 through the third light inlet 4052, so that external light transmitted by the optical fiber adapter 700 is transmitted to the first light collimator 604 of the light receiving module 600 via the internal optical fiber.

The back surface of the circuit board 300 is provided with a first detector array 307, the first converging lens array 608 is disposed on the first fixing plate 602, so that a height difference exists between the first detector array 307 and the first converging lens array 608, the receiving direction of the first detector array 307 is perpendicular to the back surface of the circuit board 300, and the transmitting direction of the received light emitted by the first converging lens array 608 is parallel to the back surface of the circuit board 300. In this way, a third mirror 610 is disposed between the first converging lens array 608 and the first detector array 307, and the transmission direction of the received light emitted from the first converging lens array 608 is changed by the third mirror 610, so that the reflected received light is incident on the first detector array 307.

The second fixing plate 603 is disposed side by side with the first fixing plate 602, and the second fixing plate 603 is fixed to the back surface of the circuit board 300. The left side of the second fixing plate 603 is provided with a second light collimator 605, one end of the second light collimator 605 is connected with the optical fiber adapter 700 through an internal optical fiber, another path of composite light transmitted by the optical fiber adapter 700 is transmitted to the second light collimator 605 through the internal optical fiber, and the second light collimator 605 collimates the composite light; a fourth wavelength-division demultiplexer 607 is arranged on the right side of the second optical collimator 605, and the fourth wavelength-division demultiplexer 607 demultiplexes the collimated light output from the second optical collimator 605 into four paths of received light; the second condensing lens array 609 is disposed on the right side of the fourth wavelength division demultiplexer 607, and four paths of received light are converted into four paths of condensed light by the second condensing lens array 609.

In some embodiments, one end of the internal optical fiber is connected to the second light collimator 605, and the other end is connected to the optical fiber adapter 700 through the fourth light inlet 4053, so that external light transmitted by the optical fiber adapter 700 is transmitted to the second light collimator 605 of the light receiving assembly 600 via the internal optical fiber.

The back of the circuit board 300 is provided with a second detector array 308, a fourth reflecting mirror 611 is arranged between the second converging lens array 609 and the second detector array 308, and the transmission direction of the received light emitted by the second converging lens array 609 is changed by the fourth reflecting mirror 611, so that the reflected received light enters the second detector array 308.

In some embodiments, the internal optical fibers connected to the first light collimator 604 are connected to the optical fiber adapter 700 through the third light outlet 4032, and the internal optical fibers connected to the second light collimator 605 are connected to the optical fiber adapter 700 through the fourth light outlet 4033, so that the light receiving module 600 is connected to the optical fiber adapter 700 in a pigtail connection.

Fig. 25 is a partial assembly sectional view of a light receiving assembly and a circuit board in an optical module according to an embodiment of the present application. As shown in fig. 25, a first fixing plate 602 is fixed on the back surface of the circuit board 300, a first light collimator 604, a third wavelength-division demultiplexer 606, a first converging lens array 608, and a third reflecting mirror 610 are sequentially disposed on the first fixing plate 602 along the left-right direction, so that one path of composite light transmitted by the optical fiber adapter 700 is transmitted to the first light collimator 604 through an internal optical fiber, the first light collimator 604 converts the composite light into collimated light, the collimated light is demultiplexed into four paths of received light through the third wavelength-division demultiplexer 606, the four paths of received light are converted into four paths of converging light through the first converging lens array 608, and the four paths of converging light are reflected by the third reflecting mirror 610 and then are reflected into the first detector array 307.

The second fixing plate 603 is fixed on the back surface of the circuit board 300, the second light collimator 605, the fourth wavelength-division demultiplexer 607, the second convergent lens array 609 and the fourth reflecting mirror 611 are sequentially arranged on the second fixing plate 603 along the left-right direction, so that another path of composite light transmitted by the optical fiber adapter 700 is transmitted to the second light collimator 605 through the internal optical fiber, the second light collimator 605 converts the composite light into collimated light, the collimated light is demultiplexed into four paths of received light through the fourth wavelength-division demultiplexer 607, the four paths of received light are converted into four paths of convergent light through the second convergent lens array 609, and the four paths of convergent light are reflected by the fourth reflecting mirror 611 and then are injected into the second detector array 308.

After the light receiving devices such as the first light collimator 604, the third wavelength division demultiplexer 606, the first converging lens array 608, the third reflecting mirror 610, the second light collimator 605, the fourth wavelength division demultiplexer 607, the second converging lens array 609, and the fourth reflecting mirror 611 are assembled, the top surface of the receiving cover plate 601 is fixed to the back surface of the circuit board 300, and thus the light receiving devices, the first detector array 307, and the second detector array 308 are disposed in the cavity formed by the receiving cover plate 601 and the back surface of the circuit board 300.

The first detector array 307 and the second detector array 308 are electrically connected with the Rx pad of the second DSP chip 320 through the high-speed signal line, so that after the first detector array 307 and the second detector array 308 convert the optical signals into the electrical signals, the electrical signals are transmitted to the second DSP chip 320 through the high-speed signal line, and the second DSP chip 320 transmits the processed electrical signals to the upper computer through the golden finger 301.

In some embodiments, since the first detector array 307 and the second detector array 308 are disposed on the back surface of the circuit board 300, and the second DSP chip 320 is disposed on the front surface of the circuit board 300, a via hole may be disposed on the circuit board 300, an Rx pad of the second DSP chip 320 is connected to one end of the via hole, a high-speed signal line is disposed on the back surface of the circuit board 300, one end of the high-speed signal line is connected to the other end of the via hole, and the other end of the high-speed signal line is connected to the first detector array 307 and the second detector array 308, so that the first detector array 307, the second detector array 308 and the second DSP chip 320 are electrically connected.

The application sets up the light emission subassembly 500 in the front of circuit board 300, and the laser instrument of light emission subassembly 500 inlays and establishes in the mounting hole 302 of circuit board 300, and light receiving module 600 sets up the back at circuit board 300, and light emission subassembly 500 and light receiving module 600 are connected with second DSP chip 320 electricity respectively, have realized 8 passageway 800G transmission data and 8 passageway 800G reception data transmission.

In some embodiments, the optical transceiver module 400, the optical transmitter module 500, and the optical receiver module 600 cannot all be connected to the optical fiber adapter 700 by a pigtail connection method, or cannot all be connected to the optical fiber adapter 700 by a hard connection method, due to the structural size of the optical module.

The optical module that this application embodiment provided altogether includes 4 light emitting device of group and 4 light receiving device of group, and 2 light emitting device of group and 2 light receiving device integrated structure of group, and a tube shell back-to-back setting is shared to both, and 2 light emitting device of group, 2 light receiving device of group are connected with first DSP chip electricity, and adopt MDC optical port and optical fiber adapter hard connection equipment. The 2 groups of light emitting devices form a light emitting component which is arranged on the front surface of the circuit board, and part of structures of the light emitting component are embedded in the mounting hole of the circuit board; the 2 groups of light receiving devices form a light receiving assembly, and the light receiving assembly is arranged on the back surface of the circuit board; the optical transmitting assembly and the optical receiving assembly are electrically connected with the second DSP chip and are connected with the optical fiber adapter in a tail fiber connection mode.

Thus, based on the 800G DSP chip technology at the present stage, two 800G DSP chips are arranged on a circuit board, so that an electric port in an optical module adopts 16-channel 100G PAM4 data transmission; and an optical transceiver component, an optical emission component and an optical receiving component are arranged on the circuit board to perform layout optimization on an optical engine, so that an optical port in the optical module adopts 16-channel 100G PAM4 data transmission. Thereby realizing the 1.6T capacity transmission of 16 channels and meeting the application scene of 2km of the data center.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. An optical module, comprising:

wherein, the optical transceiver module includes:

2. The light module of claim 1 wherein the package comprises a first side plate, a second side plate, and a third side plate, the second side plate being disposed opposite the third side plate, the second side plate and the third side plate each being connected to the first side plate, the second side plate, and the third side plate forming the first cavity;

An opening is formed in one end, opposite to the first side plate, of the tube shell, and the circuit board is inserted into the first cavity through the opening;

the first side plate is provided with a light outlet, the light emitting port of the optical fiber adapter is inserted into the light outlet, and the emitted light generated by the light emitting device is emitted into the optical fiber adapter through the light outlet.

3. The optical module of claim 2, wherein the first cavity includes a first mounting surface, a second mounting surface, a third mounting surface, and a fourth mounting surface, and the back surface of the circuit board inserted into the first cavity is in contact with the first mounting surface; the second mounting surface is sunken in the first mounting surface, the fourth mounting surface is connected with the first side plate, the third mounting surface is connected with the second mounting surface and the fourth mounting surface respectively, and the fourth mounting surface is sunken in the third mounting surface.

4. A light module as recited in claim 3, wherein a semiconductor refrigerator is provided on the second mounting surface, a laser group and a collimator lens group are provided on a refrigeration surface of the semiconductor refrigerator, and the collimator lens group is located in a light emitting direction of the laser group;

The third mounting surface is provided with a wavelength division multiplexer, and the wavelength division multiplexer is used for compositing multiple paths of emitted light emitted by the laser group into one path of composite light;

and a converging lens is arranged on the fourth mounting surface and is used for converging and coupling the composite light to the optical fiber adapter.

5. The optical module of claim 4, wherein an isolator is further disposed on the third mounting surface, the isolator being located between the wavelength division multiplexer and the converging lens, the isolator being configured to isolate the reflected light of the composite light reflected by the fiber end face within the fiber optic adapter.

6. The optical module of claim 2, wherein the package further comprises a fourth side plate and a fifth side plate, the fourth side plate and the fifth side plate being disposed opposite to each other, the fourth side plate and the fifth side plate being connected to the first side plate, the fourth side plate and the fifth side plate forming the third cavity;

the first side plate is provided with a light inlet, and a light receiving port of the optical fiber adapter is inserted into the light inlet; the back of the circuit board is provided with a detector, and the received light which is injected into the third cavity through the light inlet is transmitted to the detector through the light receiving device.

7. The light module of claim 6 wherein the third cavity comprises a sixth mounting surface, a seventh mounting surface, and an eighth mounting surface, the sixth mounting surface being connected to the first side plate, the seventh mounting surface being located between the sixth mounting surface and the eighth mounting surface, and the eighth mounting surface being recessed from the seventh mounting surface;

the eighth mounting surface is located below the back surface of the circuit board, and the back surface of the circuit board is provided with a detector group.

8. The light module of claim 7 wherein the first side plate has a light inlet and the sixth mounting surface has a collimating lens for converting received light entering the third cavity through the light inlet into collimated light;

a wavelength division demultiplexer is arranged on the seventh mounting surface and is used for demultiplexing the collimated light into multipath received light;

and a reflecting prism is arranged on the eighth mounting surface, the reflecting surface of the reflecting prism is positioned right below the detector group, and the reflecting prism is used for reflecting multiple paths of received light to the detector group.

9. The optical module of claim 8, wherein an end of the seventh mounting surface facing the sixth mounting surface is provided with a stopper dividing the seventh mounting surface into a first channel and a second channel, the collimated light being incident to the wavelength-division-multiplexer via the first channel and the second channel.

10. The optical module of claim 7, wherein a via is provided on the circuit board, and the receiving pad of the first data processor is electrically connected to one end of the via;

the back of the circuit board is provided with a signal wire, one end of the signal wire is electrically connected with the detector group, and the other end of the signal wire is electrically connected with the other end of the through hole.