CN117467357A - Outer protection layer, display module and bonding method of outer protection layer and display panel - Google Patents

Outer protection layer, display module and bonding method of outer protection layer and display panel Download PDF

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Publication number
CN117467357A
CN117467357A CN202310587209.1A CN202310587209A CN117467357A CN 117467357 A CN117467357 A CN 117467357A CN 202310587209 A CN202310587209 A CN 202310587209A CN 117467357 A CN117467357 A CN 117467357A
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CN
China
Prior art keywords
protective layer
outer protective
edge
bonding
layer body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310587209.1A
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Chinese (zh)
Inventor
杨俊�
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202310587209.1A priority Critical patent/CN117467357A/en
Publication of CN117467357A publication Critical patent/CN117467357A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Abstract

The application provides an outer protective layer, display module assembly and laminating method of outer protective layer and display panel, the outer protective layer includes outer protective layer body, and is located the tie coat of outer protective layer body laminating side, wherein, outer protective layer body covers the tie coat, at least one side of tie coat is relative outer protective layer body edge is the indent setting. Through setting up at least one side for the external protective layer body contracts certain distance inwards to improve the external protective layer and be located the display membrane layer laminating back of external protective layer below, the excessive glue that overflows of tie coat in the external protective layer is outside the external protective layer body, and the adhesion foreign matter that the glue that overflows caused, adhesion shipment membrane, lamination foreign matter lead to the bad problem of display module assembly surface pit behind the shipment membrane tectorial membrane.

Description

Outer protection layer, display module and bonding method of outer protection layer and display panel
Technical Field
The application relates to the technical field of display, in particular to an outer protective layer, a display module and a bonding method of the outer protective layer and a display panel.
Background
With the rapid development of display technologies, an Organic Light-Emitting Diode (OLED) display module gradually enters the field of view of people, and the OLED display module comprises flexible foldable display modes, curls and the like. The OLED display module is typically formed by compounding multiple layers of expensive films. In order to prevent the cover plate of the display module from being scratched and reduce damage of external impact force to a film layer below the cover plate, a layer of relatively low-price replaceable protective film (Changeable Protective Film, CPF) is usually attached to the surface of the cover plate, and the CPF boundary is usually retracted in the middle frame of the mobile phone, i.e. the CPF appearance is smaller than that of the middle frame of the mobile phone, so that consumers can observe the boundary.
However, in the CPF bonding process, the adhesive that adheres to a large lower layer such as the CPF is prone to pressure overflow. The overflow glue not only causes irregular edge vision, but also can adhere to foreign matters to cause the CPF edge to be dirty. Meanwhile, the production of the display module is completed, and the covered shipment film can be adhered to overflowed glue materials in the packaging shipment process, so that the shipment film is difficult to tear during assembly. In addition, the foreign matters pressed by the shipment film can cause the defect of pit formation of the cover plate below the CPF.
In summary, the application provides an outer protective layer, a display module and a bonding method of the outer protective layer and a display panel to solve the problem that the surface pits of the display module are poor due to excessive glue overflow to the outside of the CPF body after the existing glue material is bonded, adhesion foreign matters, adhesion shipment films and lamination foreign matters after lamination of shipment films caused by glue overflow.
Disclosure of Invention
The embodiment of the application provides an outer protective layer, a display module and a laminating method of the outer protective layer and a display panel, which can solve the problems that the existing display module overflows glue, adhesion foreign matters, adhesion shipment films and lamination foreign matters after lamination of shipment films are caused by the overflow glue, so that pits on the surface of the display module are bad.
The embodiment of the application provides an outer protective layer for display module assembly screen protection, include:
an outer protective layer body and a bonding layer positioned on the bonding side of the outer protective layer body;
the outer protective layer body covers the bonding layer, and at least one side of the bonding layer is arranged in a shrinking mode relative to the edge of the outer protective layer body.
According to an embodiment of the present application, the outer protective layer body includes a lamination start edge, a first edge adjacent to the lamination start edge, and an opposite second edge;
the projection of the bonding layer on the outer protective layer body comprises a third edge opposite to the bonding initial edge, a fourth edge adjacent to the third edge and an opposite fifth edge;
the third edge and the fitting starting edge are provided with a first interval.
According to an embodiment of the present application, the first edge is flush with the fourth edge, and the second edge is flush with the fifth edge.
According to an embodiment of the present application, the first edge and the fourth edge have a second interval therebetween, and the second edge and the fifth edge have a second interval therebetween.
According to an embodiment of the present application, the first pitch is greater than or equal to the second pitch.
According to an embodiment of the present application, the first pitch is set to a range of 10-150 μm, and the second pitch is set to a range of 10-50 μm.
According to an embodiment of the application, the bonding layer is set up in a four-sided equilateral inward shrinking manner relative to the outer protective layer body, and the projected edge of the bonding layer on the outer protective layer body and the edge of the outer protective layer body have a third interval.
A display module, comprising:
a display panel;
the cover plate is positioned above the display panel;
the cover plate protection layer is positioned above the cover plate;
the outer protective layer according to any one of the above embodiments, comprising an outer protective layer body and a bonding layer positioned on a bonding side below the outer protective layer body;
the outer protective layer is arranged above the cover plate protective layer in a shrinking manner, and the outer protective layer body is connected with the cover plate protective layer through the bonding layer;
wherein, the edge of tie coat flushes with the edge of outer protective layer body.
A bonding method of an outer protective layer and a display panel comprises the following steps:
providing a display panel, wherein at least a cover plate and a cover plate protection layer positioned on the cover plate are arranged above the display panel;
providing the outer protective layer according to any one of the above embodiments, including an outer protective layer body and a bonding layer located on a bonding side below the outer protective layer body, where the outer protective layer body covers the bonding layer, and at least one side of the bonding layer is disposed in a shrinking manner with respect to an edge of the outer protective layer body;
and attaching the outer protective layer to the cover plate protective layer, and expanding the bonding layer to be flush with the edge of the outer protective layer body under pressure.
According to an embodiment of the application, the outer protection layer and the cover protection layer are bonded by using the bonding start edge as the bonding start end in a line-to-surface bonding mode, and the outer protection layer and the cover protection layer are bonded;
or the outer protective layer and the cover plate protective layer are directly and wholly bonded in a face-to-face bonding mode;
the line-to-surface laminating mode comprises one of roller laminating, net cage laminating or steel belt laminating, and the face-to-face laminating mode comprises vacuum laminating.
The beneficial effects of the embodiment of the application are that: the application provides an outer protective layer, display module assembly and laminating method of outer protective layer and display panel, the outer protective layer includes outer protective layer body, and is located the tie coat of outer protective layer body laminating side, wherein, outer protective layer body covers the tie coat, at least one side of tie coat is relative outer protective layer body edge is the indent setting. Through setting up at least one side for the external protective layer body contracts certain distance inwards to improve the external protective layer and be located the display membrane layer laminating back of external protective layer below, the excessive glue that overflows of tie coat in the external protective layer is outside the external protective layer body, and the adhesion foreign matter that the glue that overflows caused, adhesion shipment membrane, lamination foreign matter lead to the bad problem of display module assembly surface pit behind the shipment membrane tectorial membrane.
Drawings
In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following description will briefly introduce the drawings that are required to be used in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the application, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a display module provided in an embodiment of the present application;
FIG. 2A is a side view of a one-sided, retracted design of an adhesive layer according to one embodiment of the present application;
FIG. 2B is a top view of a single sided retracted design of an adhesive layer according to one embodiment of the present application;
FIG. 3A is a top view of a four sided retracted design of an adhesive layer according to another embodiment of the present application;
FIG. 3B is a schematic illustration showing the bonding of an outer protective layer comprising a four sided tie layer to an underlying film layer according to another embodiment of the present disclosure;
FIG. 3C is a front view of a four sided retracted design of an adhesive layer according to another embodiment of the present application;
FIG. 3D is a side view of a four sided retracted design of an adhesive layer according to another embodiment of the present application;
FIG. 4 is a top view of a three sided retracted design of an adhesive layer according to yet another embodiment of the present application;
FIG. 5 is a top view of a two sided retracted design of an adhesive layer according to yet another embodiment of the present application;
fig. 6 is a top view of a four sided, equilateral, interior shrink design of an adhesive layer according to yet another embodiment of the present application.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. The directional terms mentioned in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., are only referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the application and is not intended to be limiting of the application. In the drawings, like elements are designated by like reference numerals.
It will be understood that, although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.
The present application is further described below with reference to the drawings and specific examples.
As shown in fig. 1, an embodiment of the present application provides a display module 100, where the display module 100 includes a display panel 17, and the display panel 17 includes a display area, a binding area (not shown in the figure), and a bending area (not shown in the figure) located between the display area and the binding area. The display panel 17 may be an OLED, micro LED, or the like. A cover plate 14 positioned above the display panel 17; a cover protection layer 13 (PWO) is located above the cover 14. The outer protective layer 10 is arranged above the cover protective layer 13 in a retracted manner, and the outer protective layer 10 is used for preventing the cover protective layer 13 from being scratched and reducing damage of external impact force to a film layer below the cover protective layer 13. The outer protective layer 10 includes an outer protective layer body 11, and an adhesive layer 12 located on the attaching side of the outer protective layer body 11, wherein the outer protective layer body 11 is connected with the display panel 17 through the adhesive layer 12. Wherein, the edge of the adhesive layer 12 at least does not exceed the edge of the outer protective layer body 11, it should be noted that the outer protective layer body 11 can be reworked and replaced, i.e. the CPF film. The adhesive layer 12 is for example a transparent optical adhesive layer OCA (Optical Clear Adhesive), in a preferred embodiment the thickness of the adhesive layer 12 is 25 μm and the edge of the adhesive layer 12 is flush with the edge of the outer protective layer body 11.
It should be noted that, since the edge of the outer protective layer 10 is disposed at the edge of the cover protective layer 13 in a retracted manner, if the outer protective layer body 11 and the adhesive layer 12 are equal in size before lamination, after the outer protective layer 10 and the cover protective layer 13 are laminated, the adhesive layer 12 overflows to the outside of the outer protective layer body 11, and the overflow is liable to cause adhesion of foreign matters, adhesion of the shipment film, lamination of the foreign matters after lamination of the shipment film, and poor pits on the surface of the cover protective layer 13 of the display module.
Therefore, in order to solve the above glue overflow problem, in this embodiment, before the outer protective layer 10 is attached to the display film layer below the outer protective layer 10, the projection of the outer protective layer body 11 on the display panel 17 is set to cover the projection of the adhesive layer 12 on the display panel 17, at least one side of the adhesive layer 12 is set to be retracted relative to the edge of the outer protective layer body 11, so that after the outer protective layer 10 is attached to the cover protective layer 13, the edge of the adhesive layer 12 at least does not exceed the edge of the outer protective layer body 11, thereby avoiding the problem that after the outer protective layer 10 including the adhesive layer 12 is attached to the display film layer below the outer protective layer body 11, glue overflow is caused outside the outer protective layer body 11, and the surface pits of the display module are bad due to adhesion, adhesion shipment film and lamination of the foreign matters after lamination of the shipment film.
Further, an embodiment of the present application provides a method for attaching an outer protective layer to a display panel, including the following steps:
providing a display panel 17, wherein at least a cover plate 14 and a cover plate protection layer 13 positioned on the cover plate 14 are arranged above the display panel 17;
providing an outer protective layer 10, which comprises an outer protective layer body 11 and a bonding layer 12 positioned on the bonding side below the outer protective layer body 11, wherein the outer protective layer body 11 covers the bonding layer 12, and at least one side of the bonding layer 12 is arranged in a shrinking manner relative to the edge of the outer protective layer body 11;
bonding the outer protective layer 10 and the cover protective layer 13 by using the bonding initial edge as a bonding initial end in a line-to-line bonding mode, wherein the bonding layer 12 is pressed and expanded to be flush with the edge of the outer protective layer body 11; wherein, the line opposite laminating mode includes one of gyro wheel laminating, box with a net laminating or steel band laminating.
As shown in fig. 2A, in this embodiment, the outer protective layer 10 is combined with the cover protective layer 13 by using a roller 40 bonding method.
As shown in fig. 2B, the outer protective layer body 11 includes a lamination start edge 111, and a first edge 112 and an opposite second edge 113 adjacent to the lamination start edge 111, and the projection of the adhesive layer 12 on the outer protective layer body 11 includes a third edge 121 opposite to the lamination start edge 111, and a fourth edge 122 and an opposite fifth edge 123 adjacent to the third edge 121. In this embodiment, the third edge 121 is disposed in a retracted manner with respect to the fitting start edge 111, and a first space 31 is provided between the third edge 121 and the fitting start edge 111. Meanwhile, the first edge 112 is flush with the fourth edge 122, and the second edge 113 is flush with the fifth edge 123. That is, in this embodiment, the adhesive layer 12 is provided with a single-sided retracted configuration with respect to the outer protective layer body 11.
It should be noted that, in the roller 40 bonding mode, the bonding start edge 111 is used as the bonding start end, after the bonding start edge 111 receives the initial bonding pressure, the maximum glue overflow amount is easy to generate, so at least the third edge 121 opposite to the bonding start edge 111 is set in a shrinking manner, so as to reserve the glue overflow position, avoid the glue overflow of the bonding layer 12 to the outside of the outer protection layer body 11 after the outer protection layer 10 is bonded with the cover protection layer 13, and further avoid the problems of poor surface pits of the display module 100 caused by the adhesion of foreign matters and the adhesion of the shipment film due to glue overflow and lamination of the foreign matters after the shipment film lamination.
In this embodiment, the first distance 31 is set to be 10-150 μm, and in this embodiment, the first distance 31 is 40 μm, that is, the third edge 121 corresponds to the shrinkage of the fitting start edge 111 of 40 μm.
The amount of inward shrinkage of the adhesive layer 12 with respect to the outer protective layer body 11, that is, the size of the first gap 31 in this embodiment, is positively correlated with the bonding pressure, the bonding press-in amount, and the thickness of the adhesive layer 12, and is negatively correlated with the elastic modulus of the adhesive layer 12. Specifically, the thicker the adhesive material of the adhesive layer 12 below the outer protective layer body 11, the lower the elastic modulus, the larger the bonding pressure and the bonding press-in amount, and the larger the inner shrinkage.
As shown in fig. 3A to 3D, the outer protective layer 10 and the cover protective layer 13 are combined by adopting a roller 40 bonding mode, in this embodiment, the third edge 121 is disposed in a retracted manner with respect to the bonding start edge 111, and a first space 31 is provided between the third edge 121 and the bonding start edge 111. Meanwhile, the fourth edge 122 is disposed in a retracted manner with respect to the first edge 112, the fifth edge 123 is disposed in a retracted manner with respect to the second edge 113, a second space 32 is provided between the first edge 112 and the fourth edge 122, and a second space 32 is provided between the second edge 113 and the fifth edge 123. In other words, in this embodiment, the adhesive layer 12 is disposed with four sides retracted with respect to the outer protective layer body 11.
It should be noted that, four sides shrink setting compares unilateral shrink design, can be better avoid outer protective layer 10 with after the laminating of apron protective layer 13, tie coat 12 glue overflow extremely outer protective layer body 11 is outer, and then avoids causing adhesion foreign matter, adhesion shipment membrane because of glue overflow to and pressfitting foreign matter leads to the problem such as display module assembly 100 surface pit is bad behind the shipment membrane tectorial membrane.
The first distance 31 is greater than or equal to the second distance 32, and the second distance 32 is set to be in the range of 10-50 μm. In this embodiment, the first distance 31 is 40 μm, that is, the shrinkage of the third edge 121 with respect to the fitting start edge 111 is 40 μm; the second spacing 32 is 20 μm, i.e. the fourth edge 122 is 20 μm inward relative to the first edge 112 and the fifth edge 123 is 20 μm inward relative to the second edge 113.
As shown in fig. 4, the outer protective layer 10 and the cover protective layer 13 are combined by adopting a roller 40 bonding manner, in this embodiment, the third edge 121 is disposed in a retracted manner with respect to the bonding start edge 111, and a first space 31 is provided between the third edge 121 and the bonding start edge 111. Meanwhile, the fourth edge 122 is disposed in a retracted manner with respect to the first edge 112, and a second space 32 is provided between the first edge 112 and the fourth edge 122; the second edge 113 is flush with the fifth edge 123. Namely, in this embodiment, the adhesive layer 12 is configured to be three-sided retracted with respect to the outer protective layer body 11.
In the present embodiment, the first pitch 31 is 40 μm and the second pitch 32 is 20 μm.
As shown in fig. 5, the outer protective layer 10 and the cover protective layer 13 are combined by adopting a roller 40 bonding manner, in this embodiment, the third edge 121 is disposed in a retracted manner with respect to the bonding start edge 111, and a first space 31 is provided between the third edge 121 and the bonding start edge 111. At the same time, the first edge 112 is flush with the fourth edge 122; the fifth edge 123 is disposed in a retracted manner with respect to the second edge 113, and the second edge 113 and the fifth edge 123 have a second distance 32. In this embodiment, the adhesive layer 12 is disposed in a double-sided retracted manner with respect to the outer protective layer body 11.
In the present embodiment, the first pitch 31 is 40 μm and the second pitch 32 is 20 μm.
As shown in fig. 6, in other embodiments of the present application, the bonding mode of the outer protective layer 10 and the cover protective layer 13 may also be a face-to-face bonding mode, that is, the outer protective layer 10 and the cover protective layer 13 are directly bonded to each other, and in the bonding process, the bonding layer 12 is pressed and expanded to be flush with the edge of the outer protective layer body 11. In this embodiment, the outer protective layer 10 is bonded to the cover protective layer 13 by vacuum bonding. In the face-to-face bonding mode, the whole surfaces of the outer protective layer body 11 and the bonding layer 12 are uniformly stressed, so that the four sides of the outer protective layer body 11 are uniformly overflowed, in this embodiment, the bonding layer 12 is disposed in a four-sided equilateral inward shrinkage manner relative to the outer protective layer body 11, and the projected edge 124 of the bonding layer 12 on the outer protective layer body 11 and the edge 114 of the outer protective layer body have a third interval 33.
In this embodiment, the third pitch 33 is set to be in the range of 10 to 150 μm, and in this embodiment, the third pitch 33 is 50 μm, that is, the four-sided equilateral inward shrinkage of the adhesive layer 12 is 50 μm.
With continued reference to fig. 1, the display module 100 provided in the embodiment of the present application further includes a polarizer 16 located between the display panel 17 and the cover plate 14. Specifically, the polarizer 16 is a circular polarizer, and the circular polarizer includes a linear polarizer and a 1/4 wave plate, and the circular polarizer is used for reducing reflection of external environment light, so as to improve the display effect of the display module 100. Further, the polarizer 16 is bonded to the cover plate 14 through an optical adhesive layer 15, and the material of the optical adhesive layer 15 includes, but is not limited to, OCA (Optically Clear Adhesive) optical adhesive. The cover plate 14 includes any one of a flexible cover plate 14 (CW) and an ultra-thin flexible glass (UTG). The cover protection layer 13 may be a polyethylene terephthalate (PET) substrate.
The display module 100 further includes a back plate located on the back side of the display panel 17, where the back plate includes a first back plate 18 and a second back plate (not shown in the figure) that are disposed in a disconnected manner, the first back plate 18 is located in the display area, and the second back plate is located in the binding area. The first supporting layer 19 is located below the first back plate 18, the first supporting layer 19 includes Foam materials such as Foam, the mechanical strength of the Foam is moderate, and meanwhile, the first supporting layer has a good heat insulation function, and heat generated when the driving chip and the external wiring work is prevented from affecting the display area AA. A second support layer 20 is located below the first support layer 19, the second support side layer including but not limited to one of SUS (stainless steel), an alloy.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The beneficial effects of the embodiment of the application are that: the application provides an outer protective layer, display module assembly and laminating method and of outer protective layer and display panel, the outer protective layer includes outer protective layer body, and is located the tie coat of outer protective layer body laminating side, wherein, outer protective layer body covers the tie coat, at least one side of tie coat is relative outer protective layer body edge is the indent setting. Through setting up at least one side for the external protective layer body contracts certain distance inwards to after improving to contain the external protective layer and being located the laminating of the display film layer of external protective layer below, the excessive glue that overflows of tie coat in the external protective layer is outside the external protective layer body, and adhesion foreign matter, adhesion shipment membrane, shipment membrane tectorial membrane back pressfitting foreign matter that the glue that overflows causes the poor problem of display module assembly surface pit.
In summary, although the present application discloses the preferred embodiments, the preferred embodiments are not intended to limit the application, and those skilled in the art can make various modifications and alterations without departing from the spirit and scope of the application, so the scope of the application is defined by the claims.

Claims (10)

1. An outer protective layer for protecting a display module screen, comprising
An outer protective layer body and a bonding layer positioned on the bonding side of the outer protective layer body;
the outer protective layer body covers the bonding layer, and at least one side of the bonding layer is arranged in a shrinking mode relative to the edge of the outer protective layer body.
2. The outer protective layer of claim 1, wherein the outer protective layer body comprises a bond initiation edge, a first edge adjacent the bond initiation edge, and an opposing second edge;
the projection of the bonding layer on the outer protective layer body comprises a third edge opposite to the bonding initial edge, a fourth edge adjacent to the third edge and an opposite fifth edge;
the third edge and the fitting starting edge are provided with a first interval.
3. The outer protective layer according to claim 2, wherein the first edge is flush with the fourth edge and the second edge is flush with the fifth edge.
4. The outer protective layer according to claim 2, wherein the first edge and the fourth edge have a second spacing therebetween, and the second edge and the fifth edge have a second spacing therebetween.
5. The outer protective layer according to claim 4, wherein the first pitch is greater than or equal to the second pitch.
6. The outer protective layer according to claim 5, wherein the first pitch is set in a range of 10 to 150 μm and the second pitch is set in a range of 10 to 50 μm.
7. The outer protective layer according to claim 1, wherein the adhesive layer is disposed in a four-sided equilateral inward shrinkage relative to the outer protective layer body, and a projected edge of the adhesive layer on the outer protective layer body has a third spacing from an edge of the outer protective layer body.
8. A display module, comprising:
a display panel;
the cover plate is positioned above the display panel;
the cover plate protection layer is positioned above the cover plate;
and an outer protective layer as claimed in any one of claims 1 to 7, comprising an outer protective layer body, and an adhesive layer on the lower lamination side of the outer protective layer body;
the outer protective layer is arranged above the cover plate protective layer in a shrinking manner, and the outer protective layer body is connected with the cover plate protective layer through the bonding layer;
wherein the edge of the adhesive layer at least does not exceed the edge of the outer protective layer body.
9. The bonding method of the outer protective layer and the display panel is characterized by comprising the following steps of:
providing a display panel, wherein at least a cover plate and a cover plate protection layer positioned on the cover plate are arranged above the display panel;
providing an outer protective layer according to any one of claims 1 to 7, comprising an outer protective layer body and an adhesive layer positioned on the attaching side below the outer protective layer body, wherein the outer protective layer body covers the adhesive layer, and at least one side of the adhesive layer is arranged in a shrinking manner relative to the edge of the outer protective layer body;
and attaching the outer protective layer to the cover plate protective layer, and expanding the bonding layer to be flush with the edge of the outer protective layer body under pressure.
10. The method of attaching an outer protective layer to a display panel according to claim 9, wherein the outer protective layer and the cover protective layer are attached to each other by a line-to-line attachment method using an attachment start edge as an attachment start edge;
or the outer protective layer and the cover plate protective layer are directly and wholly bonded in a face-to-face bonding mode;
the line-to-surface laminating mode comprises one of roller laminating, net cage laminating or steel belt laminating, and the face-to-face laminating mode comprises vacuum laminating.
CN202310587209.1A 2023-05-23 2023-05-23 Outer protection layer, display module and bonding method of outer protection layer and display panel Pending CN117467357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310587209.1A CN117467357A (en) 2023-05-23 2023-05-23 Outer protection layer, display module and bonding method of outer protection layer and display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310587209.1A CN117467357A (en) 2023-05-23 2023-05-23 Outer protection layer, display module and bonding method of outer protection layer and display panel

Publications (1)

Publication Number Publication Date
CN117467357A true CN117467357A (en) 2024-01-30

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Application Number Title Priority Date Filing Date
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