CN117467117A - Organic silicon modified epoxy resin, preparation method thereof and packaging material - Google Patents
Organic silicon modified epoxy resin, preparation method thereof and packaging material Download PDFInfo
- Publication number
- CN117467117A CN117467117A CN202310118771.XA CN202310118771A CN117467117A CN 117467117 A CN117467117 A CN 117467117A CN 202310118771 A CN202310118771 A CN 202310118771A CN 117467117 A CN117467117 A CN 117467117A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- modified epoxy
- packaging material
- silicone
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 51
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 13
- 239000010703 silicon Substances 0.000 title claims abstract description 13
- 239000005022 packaging material Substances 0.000 title abstract description 33
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000013067 intermediate product Substances 0.000 claims abstract description 18
- 238000006243 chemical reaction Methods 0.000 claims abstract description 14
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 claims abstract description 12
- -1 3-methacryloxypropyl dimethyl siloxane Chemical class 0.000 claims abstract description 12
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 11
- BPYFPNZHLXDIGA-UHFFFAOYSA-N diphenylsilicon Chemical compound C=1C=CC=CC=1[Si]C1=CC=CC=C1 BPYFPNZHLXDIGA-UHFFFAOYSA-N 0.000 claims abstract description 10
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000007259 addition reaction Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 34
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 26
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 24
- 239000002904 solvent Substances 0.000 claims description 21
- 229920001296 polysiloxane Polymers 0.000 claims description 17
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000002105 nanoparticle Substances 0.000 claims description 13
- 239000008393 encapsulating agent Substances 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000006884 silylation reaction Methods 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 5
- 230000003373 anti-fouling effect Effects 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000002444 silanisation Methods 0.000 abstract description 2
- 239000012752 auxiliary agent Substances 0.000 description 7
- 238000003848 UV Light-Curing Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012949 free radical photoinitiator Substances 0.000 description 1
- 239000013538 functional additive Substances 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- WKGDNXBDNLZSKC-UHFFFAOYSA-N oxido(phenyl)phosphanium Chemical compound O=[PH2]c1ccccc1 WKGDNXBDNLZSKC-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Abstract
The embodiment of the application discloses an organosilicon modified epoxy resin, a preparation method thereof and a packaging material, wherein the preparation method of the organosilicon modified epoxy resin comprises the following steps of S1: enabling diphenyl silicon glycol and 3-methacryloxypropyl dimethyl siloxane to carry out silanization reaction to prepare an intermediate product; s2: the intermediate product and 3, 4-epoxy-1-vinyl cyclohexane are subjected to addition reaction to prepare the organosilicon modified epoxy resin; the novel organic silicon modified epoxy resin prepared by the preparation method contains double bonds and epoxy groups, the epoxy groups can improve the heat resistance of the organic silicon modified epoxy resin, and the organic silicon modified epoxy resin is added into the packaging material, so that the packaging material has higher heat resistance, and the technical problem of poor heat resistance of the existing packaging material is solved.
Description
Technical Field
The application relates to the technical field of packaging, in particular to an organic silicon modified epoxy resin, a preparation method thereof and a packaging material.
Background
The packaging material is used as a key material of an electronic device, not only is used for isolating water and oxygen to protect the device, but also needs to have higher light transmittance and a certain refractive index to ensure the light extraction efficiency of the device, besides, the heat resistance of the packaging material containing the resin material needs to be improved, and the heat resistance of the packaging material is related to the heat resistance of the resin material, so that the novel resin material with high heat resistance is needed to be provided.
Therefore, the conventional packaging material has a technical problem of poor heat resistance.
Disclosure of Invention
The embodiment of the application provides an organosilicon modified epoxy resin, a preparation method thereof and an encapsulating material, which can alleviate the technical problem that the existing encapsulating material has poor heat resistance.
Embodiments of the present application provide a silicone modified epoxy resin that includes a double bond and an epoxy group.
Optionally, in some embodiments of the present application, the silicone modified epoxy resin is
The embodiment of the application provides a preparation method of organosilicon modified epoxy resin, which comprises the following steps:
under the acidic condition, adding diphenyl silicon glycol and 3-methacryloxypropyl dimethyl siloxane into a first solvent, and allowing the diphenyl silicon glycol and 3-methacryloxypropyl dimethyl siloxane to have silylation reaction at the reaction temperature of 30-50 ℃ to prepare an intermediate product
Adding the intermediate product and 3, 4-epoxy-1-vinylcyclohexane into a second solvent at a reaction temperature of 70-120 ℃ to perform an addition reaction between the intermediate product and 3, 4-epoxy-1-vinylcyclohexane to prepare the organosilicon modified epoxy resin
Alternatively, in some embodiments of the present application, the first solvent comprises isopropanol and water, and the second solvent comprises any one of isopropanol, toluene, xylene.
An embodiment of the present application provides an encapsulating material, which includes 20 to 50 parts by weight of the silicone modified epoxy resin described in any one of the embodiments above, 1 to 5 parts by weight of a UV initiator, and a solvent.
Optionally, in some embodiments of the present application, the encapsulating material further includes 5 parts to 20 parts by weight of zirconia nanoparticles, and the encapsulating material has a refractive index ranging from 1.55 to 1.7.
Optionally, in some embodiments of the present application, the crystalline form of the zirconia nanoparticle is a tetragonal crystalline form.
Optionally, in some embodiments of the present application, the encapsulating material further comprises 0-10 parts by weight of an anti-fouling auxiliary agent.
Optionally, in some embodiments of the present application, a water drop angle of the encapsulation material surface is greater than 110 degrees.
Optionally, in some embodiments of the present application, the encapsulant has a haze of less than 1%.
The beneficial effects are that: through providing a novel organosilicon modified epoxy resin, it contains double bond and epoxy simultaneously, epoxy can promote organosilicon modified epoxy's heat resistance, adds organosilicon modified epoxy in the packaging material, can make the packaging material have higher heat resistance, has alleviateed the technical problem that current packaging material has the heat resistance poor.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic illustration of a silicone modified epoxy resin provided herein;
FIG. 2 is a first reaction equation diagram of a method for preparing a silicone modified epoxy resin provided herein;
FIG. 3 is a second reaction equation diagram of a method for preparing a silicone modified epoxy resin provided herein;
fig. 4 is a schematic flow chart of a preparation method of the organosilicon modified epoxy resin.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
Referring to fig. 1, the present application provides a silicone modified epoxy resin comprising double bonds and epoxy groups.
Wherein the epoxy group has high heat resistance and the double bond can promote UV curing.
In this embodiment, by providing a novel silicone modified epoxy resin, which contains a double bond and an epoxy group at the same time, the epoxy group can improve the heat resistance of the silicone modified epoxy resin, and adding the silicone modified epoxy resin into the packaging material can make the packaging material have higher heat resistance, and alleviate the technical problem that the existing packaging material has poor heat resistance.
The technical solutions of the present application will now be described with reference to specific embodiments.
The embodiment of the application only aims at
The preparation process of (2) is exemplified, and the organosilicon modified epoxy resin can be other resin materials containing double bonds and epoxy groups.
In addition, the reaction temperature, ph, reaction time, selected materials, etc. in the present application are only described in the best or preferred embodiments, and other conditions that can meet the requirements of the process and the modification reaction should also belong to the protection scope of the present invention, and are not described herein.
In one embodiment, the silicone modified epoxy resin is
Referring to fig. 2, 3 and 4, the embodiment of the present application provides a preparation method of an organosilicon modified epoxy resin, which includes:
s1: under the acidic condition, adding diphenyl silicon glycol and 3-methacryloxypropyl dimethyl siloxane into a first solvent, and allowing the diphenyl silicon glycol and 3-methacryloxypropyl dimethyl siloxane to have silylation reaction at the reaction temperature of 30-50 ℃ to prepare an intermediate product
S2: adding the intermediate product and 3, 4-epoxy-1-vinylcyclohexane into a second solvent at a reaction temperature of 70-120 ℃ to perform an addition reaction between the intermediate product and 3, 4-epoxy-1-vinylcyclohexane to prepare the organosilicon modified epoxy resin
Referring to fig. 2, the chemical equation of the step of preparing the intermediate product is that diphenyl silicon glycol and 3-methacryloxypropyl dimethyl siloxane undergo silylation reaction:
referring to fig. 3, the intermediate product and 3, 4-epoxy-1-vinylcyclohexane undergo an addition reaction, and the chemical equation of the step of preparing the silicone modified epoxy resin is as follows:
in one embodiment, the first solvent comprises isopropanol and water, and the second solvent comprises any one of isopropanol, toluene, xylene.
It is understood that the addition of diphenylsilanediol and 3-methacryloxypropyl dimethylsiloxane to isopropanol and water is sufficiently soluble to facilitate better silylation of diphenylsilanediol with 3-methacryloxypropyl dimethylsiloxane.
It will be appreciated that the addition of the intermediate product and 3, 4-epoxy-1-vinylcyclohexane to any of isopropanol, toluene, xylene is sufficiently soluble to facilitate better addition reaction of the intermediate product with 3, 4-epoxy-1-vinylcyclohexane.
In this embodiment, by providing a first solvent including isopropyl alcohol and water and a second solvent including any one of isopropyl alcohol, toluene, and xylene, each reactant can be sufficiently dissolved in the first solvent and the second solvent, so that a silylation reaction and an addition reaction sufficiently occur.
The embodiment of the application provides an encapsulating material, which comprises 20-50 parts by weight of organosilicon modified epoxy resin, 1-5 parts by weight of UV initiator and solvent.
In one embodiment, the UV initiator is a free radical photoinitiator.
Wherein the UV initiator may be phenylphosphine oxide.
It will be appreciated that the UV initiator acts to initiate and promote polymerization of the silicone modified epoxy resin to effect UV curing.
It should be noted that the double bonds contained in the organosilicon modified epoxy resin can also be beneficial to realizing UV curing, and the efficiency of UV curing is further improved.
In this embodiment, by limiting the initiator, the effect of the oligomer polymerization is improved, and the reaction process is accelerated.
In one embodiment, the encapsulating material further comprises 5 parts to 20 parts by weight of zirconia nanoparticles, and the encapsulating material has a refractive index ranging from 1.55 to 1.7.
The zirconia nanoparticle is synthesized by a hydrothermal method, the hydroxyl on the surface is modified by KH570, and the terminal double bond can be bonded into a system through UV curing, so that the refractive index of the zirconia nanoparticle is adjusted, and meanwhile, the physical and mechanical properties and the water-oxygen barrier property of the packaging material can be ensured.
It is understood that the larger the weight part of the zirconia nanoparticles is, the larger the refractive index of the encapsulating material is, further, when the weight part of the zirconia nanoparticles is 5 parts, the refractive index of the encapsulating material is about 1.55, and when the weight part of the zirconia nanoparticles is 20 parts, the refractive index of the encapsulating material is about 1.7.
In one embodiment, the zirconia nanoparticles are tetragonal in crystal form.
Wherein the particle size of the zirconia nanoparticles ranges from 5 nanometers to 50 nanometers.
In one embodiment, the encapsulating material further comprises 0-10 parts by weight of an anti-fouling auxiliary agent.
In this embodiment, the antifouling auxiliary agent is added into the packaging material, so that the packaging material has a larger water drop angle, and the packaging material has the characteristic of low water absorption, so that the capability of the packaging material for isolating water and oxygen to protect devices is improved.
In one embodiment, the drop angle of the encapsulant surface is greater than 110 degrees.
It will be appreciated that the larger the drop angle, the better the hydrophobicity, i.e. the better the dirt and water repellency, is represented by the surface of the encapsulating material.
In this embodiment, by further defining that the water drop angle of the surface of the encapsulation material is greater than 110 degrees, the surface hydrophobicity of the encapsulation material is further improved.
In one embodiment, the encapsulant has a haze of less than 1%.
In one embodiment, the encapsulation material also has a high film hardness, high abrasion resistance, low dielectric constant.
Wherein the organosilicon modified epoxy resin has high film forming hardness, high wear resistance and low dielectric constant.
Wherein the high film forming hardness is greater than 2H.
It can be understood that the packaging material with the organosilicon modified epoxy resin has improved film forming hardness, wear resistance, low dielectric constant and heat resistance, and especially has greatly improved heat resistance, thereby realizing the packaging material with high heat resistance.
In one embodiment, the encapsulating material further comprises an auxiliary agent in a certain weight portion.
In one embodiment, the auxiliary agent is at least one of a leveling agent, a curing agent, a diluent and a toughening agent.
It can be understood that the auxiliary agent mainly comprises functional additives such as a leveling agent, and the function of a certain aspect of the packaging material can be improved through the auxiliary agent, for example, the dispersibility of each component in the solution can be improved through the leveling agent, and the higher the dispersibility is, the higher the refractive index of the prepared packaging material is.
In this embodiment, by adding an additive to the encapsulating material, the function of the encapsulating material can be improved, and the refractive index of the encapsulating material can be further improved.
The novel organic silicon modified epoxy resin with high heat resistance is prepared, the packaging material prepared from the organic silicon modified epoxy resin has the characteristic of high heat resistance, and meanwhile, a certain weight part of zirconia nano particles and an antifouling additive can be added into the packaging material, so that the characteristics of high refractive index and low water absorption are realized, and the packaging material with high refraction, high heat resistance and low water absorption is obtained.
The preparation method of the organic silicon modified epoxy resin provided by the embodiment comprises the following steps of S1: under the acidic condition, adding diphenyl silicon glycol and 3-methacryloxypropyl dimethyl siloxane into a first solvent, and performing silanization reaction on the diphenyl silicon glycol and the 3-methacryloxypropyl dimethyl siloxane at the reaction temperature of 30-50 ℃ to prepare an intermediate product; s2: adding the intermediate product and 3, 4-epoxy-1-vinylcyclohexane into a second solvent at a reaction temperature of 70-120 ℃ to perform an addition reaction between the intermediate product and 3, 4-epoxy-1-vinylcyclohexane to prepare an organosilicon modified epoxy resin; the novel organic silicon modified epoxy resin prepared by the preparation method contains double bonds and epoxy groups, the epoxy groups can improve the heat resistance of the organic silicon modified epoxy resin, and the organic silicon modified epoxy resin is added into the packaging material, so that the packaging material has higher heat resistance, and the technical problem of poor heat resistance of the existing packaging material is solved.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The above describes the silicone modified epoxy resin, the preparation method of the silicone modified epoxy resin and the packaging material in detail, and specific examples are applied to illustrate the principles and embodiments of the present application, and the above description of the examples is only used to help understand the method and core idea of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (10)
1. A silicone modified epoxy resin, characterized in that the silicone modified epoxy resin comprises double bonds and epoxy groups.
2. The silicone-modified epoxy resin of claim 2, wherein the silicone-modified epoxy resin is
3. The preparation method of the organic silicon modified epoxy resin is characterized by comprising the following steps:
under the acidic condition, adding diphenyl silicon glycol and 3-methacryloxypropyl dimethyl siloxane into a first solvent, and allowing the diphenyl silicon glycol and 3-methacryloxypropyl dimethyl siloxane to have silylation reaction at the reaction temperature of 30-50 ℃ to prepare an intermediate product
Adding the intermediate product and 3, 4-epoxy-1-vinylcyclohexane into a second solvent at a reaction temperature of 70-120 ℃ to perform an addition reaction between the intermediate product and 3, 4-epoxy-1-vinylcyclohexane to prepare the organosilicon modified epoxy resin
4. The method for producing a silicone-modified epoxy resin as set forth in claim 3, wherein said first solvent comprises isopropyl alcohol and water, and said second solvent comprises any one of isopropyl alcohol, toluene, and xylene.
5. An encapsulating material, characterized in that the encapsulating material comprises 20 to 50 parts by weight of the silicone-modified epoxy resin according to any one of claims 1 to 2, 1 to 5 parts by weight of a UV initiator, and a solvent.
6. The encapsulant of claim 5, further comprising 5 to 20 parts by weight of zirconia nanoparticles, wherein the encapsulant has a refractive index in the range of 1.55 to 1.7.
7. The encapsulating material of claim 6 wherein the zirconia nanoparticles are tetragonal in crystal form.
8. The encapsulating material of claim 5 further comprising 0 to 10 parts by weight of an anti-fouling auxiliary.
9. The encapsulation material of claim 8, wherein the encapsulation material surface has a water drop angle greater than 110 degrees.
10. The encapsulant of claim 5, wherein the encapsulant has a haze of less than 1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310118771.XA CN117467117A (en) | 2023-01-31 | 2023-01-31 | Organic silicon modified epoxy resin, preparation method thereof and packaging material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310118771.XA CN117467117A (en) | 2023-01-31 | 2023-01-31 | Organic silicon modified epoxy resin, preparation method thereof and packaging material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117467117A true CN117467117A (en) | 2024-01-30 |
Family
ID=89626245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310118771.XA Pending CN117467117A (en) | 2023-01-31 | 2023-01-31 | Organic silicon modified epoxy resin, preparation method thereof and packaging material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117467117A (en) |
-
2023
- 2023-01-31 CN CN202310118771.XA patent/CN117467117A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9150698B2 (en) | Composite composition of inorganic oxide particles and silicone resin, method of manufacturing the same, transparent composite, and method of manufacturing the same | |
| CN107075289B (en) | Surface-modified metal oxide particle dispersion, silicone resin composite composition and composite, optical member, and light-emitting device | |
| TWI525140B (en) | A complex composition including an inorganic oxide particle and a silicone resin, and a transparent composite | |
| CN102574692B (en) | Soft silica and preparation method thereof | |
| JP5555167B2 (en) | Silicone resin composition, metal oxide particles and method for producing the same | |
| WO2013133430A1 (en) | Surface-modified-metal-oxide-particle material, composition for sealing optical semiconductor element, and optical semiconductor device | |
| US20130164444A1 (en) | Manufacturing method for surface-modified titanium particles, dispersion of titanium particles, and resin having titanium particles dispersed therein | |
| EP2509710B1 (en) | Polymeric hybrid organometalloglass | |
| KR20110091559A (en) | Coating composition, coating film, laminate, and process for production of laminate | |
| JP4398500B2 (en) | Resin composition and optical member | |
| CN106459482A (en) | Hybrid material for optoelectronic applications | |
| Huang et al. | Preparation of ZrO2/silicone hybrid materials for LED encapsulation via in situ sol‐gel reaction | |
| JP5332101B2 (en) | Inorganic oxide transparent dispersion and transparent composite, composition for sealing light-emitting device, light-emitting device, and method for producing transparent composite | |
| JP5162879B2 (en) | METAL OXIDE PARTICLE-SILICONE RESIN COMPOSITION, OPTICAL MEMBER AND LIGHT EMITTING DEVICE PROVIDED WITH THE SAME, AND METHOD FOR PRODUCING METAL OXIDE PARTICLE-SILICONE RESIN COMPOSITION | |
| US8268175B2 (en) | Method for transferring inorganic oxide nanoparticles from aqueous phase to organic phase | |
| JP6339889B2 (en) | Method for producing metal oxide hollow particles | |
| JP2004346288A (en) | Thermosetting resin composition and manufacturing method therefor | |
| CN117467117A (en) | Organic silicon modified epoxy resin, preparation method thereof and packaging material | |
| US20110318587A1 (en) | Radiation shielding with polyhedral oligomeric silsesquioxanes and metallized additives | |
| JP5769154B2 (en) | Composite composition of inorganic oxide particles and silicone resin, transparent composite and method for producing the same | |
| Lu | Synthesis of PDMS-metal oxide hybrid nanocomposites using an in situ sol-gel route | |
| JPH06104768B2 (en) | Light-transmissive epoxy resin composition and optical semiconductor device | |
| WO2008097274A2 (en) | Radiation shielding with polyhedral oligomeric silsesquioxanes and metallized additives | |
| JP2008266629A (en) | Resin composition and optical member | |
| Yashchenko et al. | Nanocomposites based on silicon dioxide. Preparation and properties |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |