CN117457279A - Multi-pass cable and electronic device - Google Patents

Abstract

The embodiment of the invention discloses a multi-channel cable and electronic equipment, wherein a radio frequency signal wire is arranged at the center of a first dielectric layer, and a transmission wire is arranged on a layout layer. Therefore, on one hand, the layout layer is arranged on the outer side of the first conductor layer, and the transmission lines are arranged around the center of the radio frequency signal line, so that the roundness of the section of the multi-way cable in the length direction is improved, and the multi-way cable is more attractive. On the other hand, each group of transmission lines and the radio frequency signal lines extend in parallel, the positions of the transmission lines in the circumferential direction of the multi-channel cables can be adjusted by rotating the multi-channel cables, and after the radio frequency signal lines are in communication connection with the radio frequency devices, the transmission lines can be enabled to be closer to the target devices, and then low-frequency analog signals or digital signals can be transmitted with the target devices. In another aspect, the first conductor layer is used for shielding electromagnetic signals on the radio frequency signal line, so that the isolation degree of the multi-channel cable to the electromagnetic signals is improved.

Description

Multi-pass cable and electronic device

Technical Field

The invention relates to the technical field of wires, in particular to a multi-channel cable and electronic equipment.

Background

With the continuous development of communication technology, more and more devices are provided with antennas for transmitting radio frequency signals such as bluetooth signals or WIFI signals, which also makes the space inside the electronic device more limited. Taking the bluetooth headset as an example, the main circuit board needs to send audio signals to the speaker in addition to the bluetooth signals for the bluetooth antenna. This makes the lines inside the bluetooth headset more complex, further increasing the signal interference between the lines. How to simplify the arrangement of the circuits in the electronic device and reduce the signal interference between the circuits becomes a problem to be solved.

Disclosure of Invention

In view of this, the embodiment of the invention provides a multi-channel cable and an electronic device, in which a radio frequency signal line and a transmission line are disposed together at a cladding portion, so that the cable inside the electronic device is more orderly, and interference of electromagnetic signals on other parts is reduced.

According to a first aspect of an embodiment of the present invention, there is provided a multi-pass cable including:

the coating part comprises a layout layer, a first conductor layer and a first dielectric layer, wherein the first conductor layer is arranged on the inner side of the layout layer, and the first dielectric layer is positioned on the inner side of the first conductor layer;

the transmission part comprises a radio frequency signal line and at least one group of transmission lines, the radio frequency signal line is arranged in the center of the first dielectric layer, each group of transmission lines are arranged on the layout layer and comprise a plurality of adjacent transmission lines, and the plurality of transmission lines extend in parallel with the radio frequency signal line and are laid along the circumferential direction of the radio frequency signal line;

the transmission section is configured to transmit a low-frequency analog signal and/or a digital signal through the transmission line.

Further, the wrapping portion further includes:

the second dielectric layer is arranged between the layout layer and the first conductor layer, and the second dielectric layer and the first dielectric layer are insulating elements.

Further, the layout layer is an injection molding piece and is coated on the outer side of the second dielectric layer, and in injection molding of the layout layer, each transmission line is laid around the second dielectric layer.

Further, the wrapping portion further includes:

the second conductor layer is coated on the layout layer;

the cladding part further comprises a protective layer, and the protective layer is cladded on the second conductor layer.

Further, the transmission line group comprises a plurality of audio lines or a plurality of antenna switch control lines, and the thickness of the layout layer in each direction is consistent in the radial direction of the multi-channel cable.

Further, at least one group of transmission lines are a plurality of groups of transmission lines, and the plurality of groups of transmission lines are uniformly distributed around the circumference of the radio frequency signal line.

Further, the radio frequency signal line comprises a first lead-out section, the transmission line comprises a second lead-out section, and the first lead-out section and the second lead-out section are respectively positioned at the end part of the radio frequency signal line and the end part of the transmission line;

the first lead-out section and the second lead-out section extend to the outer side of the coating portion.

In a second aspect, an embodiment of the present invention further provides an electronic device, including:

a main circuit board;

a functional module; and

the multi-channel cable comprises a coating part and a transmission part, wherein the coating part comprises a layout layer, a first conductor layer and a first medium layer, the first conductor layer is arranged on the inner side of the layout layer, the first medium layer is positioned on the inner side of the first conductor layer, the transmission part comprises a radio frequency signal line and at least one group of transmission lines, the radio frequency signal line is arranged in the center of the first medium layer, each group of transmission lines is arranged on the layout layer and comprises a plurality of adjacent transmission lines, and the transmission lines extend in parallel with the radio frequency signal line and are arranged along the circumferential direction of the radio frequency signal line;

the transmission part is configured to transmit a radio frequency signal through the radio frequency signal line and transmit a control signal and/or an audio signal through the transmission line between the main circuit board and the functional module.

Further, the functional module comprises an antenna assembly, wherein the antenna assembly comprises a radiation part and a radio frequency transceiver switch in communication connection with the radiation part;

the radio frequency signal wire comprises a first lead-out section, the transmission wire comprises a second lead-out section, and the first lead-out section and the second lead-out section are respectively positioned at the end part of the radio frequency signal wire and the end part of the transmission wire;

the transmission part is configured to feed radio frequency signals to the radiation part through the first lead-out section, and the second lead-out section adjusts the working state of the radiation part through the radio frequency receiving and transmitting switch.

Further, the functional module comprises an audio component, the audio component comprises a basin frame, a radiation pattern and a loudspeaker, the basin frame is provided with a sound cavity, the loudspeaker is arranged in the sound cavity, and the radiation pattern is arranged on the inner wall of the sound cavity;

the radio frequency signal wire comprises a first lead-out section, the transmission wire comprises a second lead-out section, and the first lead-out section and the second lead-out section are respectively positioned at the end part of the radio frequency signal wire and the end part of the transmission wire;

the transmission part is configured to feed radio frequency signals to the radiation pattern through the first lead-out section, and the second lead-out section is in communication connection with the speaker and transmits audio signals.

According to the multi-channel cable and the electronic device, the radio frequency signal line is arranged in the center of the first dielectric layer, and the transmission line is arranged on the layout layer. Therefore, on one hand, the layout layer is arranged on the outer side of the first conductor layer, and the transmission lines are arranged around the center of the radio frequency signal line, so that the roundness of the section of the multi-way cable in the length direction is improved, and the multi-way cable is more attractive. On the other hand, each group of transmission lines and the radio frequency signal lines extend in parallel, the positions of the transmission lines in the circumferential direction of the multi-channel cables can be adjusted by rotating the multi-channel cables, and after the radio frequency signal lines are in communication connection with the radio frequency devices, the transmission lines can be enabled to be closer to the target devices, and then low-frequency analog signals or digital signals can be transmitted with the target devices. In another aspect, the first conductor layer is used for shielding electromagnetic signals on the radio frequency signal line, so that the isolation degree of the multi-channel cable to the electromagnetic signals is improved.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

FIG. 1 is a schematic diagram of a multi-pass cable side structure according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of another side of a multi-pass cable according to an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of a multi-pass cable of an embodiment of the present invention in some implementations;

FIG. 4 is a schematic cross-sectional view of a multi-pass cable of an embodiment of the present invention in other implementations;

FIG. 5 is a schematic cross-sectional view of a multi-pass cable of an embodiment of the present invention in still other implementations;

FIG. 6 is a schematic diagram of an architecture of an electronic device in some implementations of an embodiment of the invention;

fig. 7 is a schematic diagram of an architecture of an electronic device according to an embodiment of the present invention in other implementations.

Reference numerals illustrate:

1-a coating part;

11-laying layers; 12-protecting layer;

a 2-transmission unit;

21-a radio frequency signal line; 211-a first lead-out section;

22-transmission lines; 221-a second lead-out section;

31-a first conductor layer; 32-a second conductor layer;

41-a first dielectric layer; 42-a second dielectric layer;

5-a main circuit board;

6-a functional module;

61-radiating part;

62-a radio frequency transceiver switch;

63-basin stand; 631-an acoustic cavity;

64-radiation pattern;

65-speakers;

7-a microphone;

81-functional circuit board.

Detailed Description

The present invention is described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in detail. The present invention will be fully understood by those skilled in the art without the details described herein. Well-known methods, procedures, flows, components and circuits have not been described in detail so as not to obscure the nature of the invention.

Moreover, those of ordinary skill in the art will appreciate that the drawings are provided herein for illustrative purposes and that the drawings are not necessarily drawn to scale.

Unless the context clearly requires otherwise, the words "comprise," "comprising," and the like throughout the application are to be construed as including but not being exclusive or exhaustive; that is, it is the meaning of "including but not limited to".

In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured" and the like should be construed broadly, as they may be fixed, removable, or integral, for example; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Spatially relative terms, such as "inner," "outer," "lower," "upper," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Fig. 1 and 2 are schematic structural views of the multi-path cable of the present embodiment in different directions. Fig. 3, 4 and 5 are schematic cross-sectional views of the multi-pass cable of the present embodiment in different implementations. In fig. 5, only the outline of the whole of each group of transmission lines 22 is shown, and the outline of the transmission section 2 in each figure is shown with a thick solid line. The first conductor layer 31 and the second conductor layer 32 in fig. 3 and 4 are shown with cross hatching.

In some embodiments, as shown in fig. 1-2, the multi-pass cable in the present example includes a cladding portion 1 and a transmission portion 2. Referring still further to fig. 3-4, the cladding 1 includes a routing layer 11, a first conductor layer 31, and a first dielectric layer 41. The first conductor layer 31 is disposed inside the layout layer 11, and the first dielectric layer 41 is located inside the first conductor layer 31. The transmission section 2 includes a radio frequency signal line 21 and at least one set of transmission lines 22. The radio frequency signal lines 21 are disposed at the center of the first dielectric layer 41, and each group of transmission lines 22 is disposed on the layout layer 11 and includes a plurality of adjacent transmission lines 22, where the plurality of transmission lines 22 extend parallel to the radio frequency signal lines 21 and are disposed along the circumferential direction of the radio frequency signal lines 21.

Meanwhile, the transmission section 2 is configured to transmit a radio frequency signal through a radio frequency signal line 21 and transmit a low frequency analog signal and/or a digital signal through a transmission line 22.

Specifically, the low-frequency analog signal in the present embodiment may be an audio signal, a video signal, or the like. The digital signal in this embodiment may be a control signal. Such as control signals that control the on and off of the rf transceiver switch 62. In contrast, the signal transmitted by the radio frequency signal line 21 is a radio frequency signal. Such as bluetooth signals, WIFI signals, 4G signals, or 5G signals, etc. That is, the radio frequency signal line 21 may form a first path in the electronic device.

Alternatively, at least one set of transmission lines 22 in the present embodiment may be configured as one or more sets of transmission lines 22, such as 4 sets (as shown in fig. 4) or 8 sets (as shown in fig. 5). That is, the plurality of sets of transmission lines 22 may form a plurality of second vias in the electronic device, respectively. At the same time, sets of transmission lines 22 are evenly distributed around the first dielectric layer 41. Taking fig. 5 as an example, the included angle between two adjacent group transmission lines 22 in the circumferential direction is 45 degrees (as shown by angle α in fig. 5). Further, the roundness in the axial section of the multi-path cable is improved. When the multi-pass cable is bent, the flexibility in each direction is made as uniform as possible.

Preferably, the first dielectric layer 41 in this embodiment is an insulating layer. The insulating layer may be made of rubber or fluorinated ethylene propylene copolymer (FEP). The fluorinated ethylene propylene copolymers have a certain flexibility and a low dielectric constant over a wide temperature and frequency range. The radio frequency signal line 21 and the transmission line 22 are copper wires and silver-plated on the surfaces, and the transmission line 22 is further provided with an insulating coating layer on the outer side of the silver-plated layer. The insulating coating layer can be made of insulating paint or rubber and the like. Meanwhile, the diameter of the radio frequency signal line 21 is configured to be larger than that of each transmission line 22 to reduce the insertion loss of the multi-pass cable. The multiple transmission lines 22 of each set of transmission lines 22 are spaced apart to avoid shorting.

It is to be readily understood that the frequency range of the electromagnetic signal transmitted by the radio frequency signal line 21 in the present embodiment may be between 300kHz and 300 GHz. For example, a bluetooth signal operating in the 2400MHz-2483.5MHz frequency range. In contrast, the frequency of the signal transmitted by the transmission line 22 is lower or far lower than the operating frequency of the radio frequency signal line 21. Such as audio signals having frequencies in the range of 150Hz to 500 Hz. And may be a pulse signal for controlling the on/off of the rf transceiver switch 62, for example. Therefore, compared to the low frequency signal of the transmission line 22, the high frequency signal of the radio frequency signal line 21 is more likely to leak to the outside of the multi-path cable, thereby causing interference with other radio frequency devices of the electronic apparatus.

For this reason, the radio frequency signal line 21 is disposed at the center of the multi-pass cable in the present embodiment, and the first conductor layer 31 is used to space the radio frequency signal line 21 from the transmission line 22 and the radio frequency devices outside the multi-pass cable, so as to improve the isolation of electromagnetic signals in the multi-pass cable.

The signals transmitted by the transmission line 22 are in a lower frequency band, so that the mutual interference is smaller, and the mutual influence of the signals and the peripheral radio frequency devices is smaller. For this reason, the plurality of transmission lines 22 are adjacently disposed and laid outside the first conductor layer 31, so that the structure of the multi-pass cable can be made more compact. Meanwhile, the electronic equipment is not affected excessively.

In summary, in the multi-channel cable of the present embodiment, the rf signal line 21 is disposed at the center of the first dielectric layer 41, and the transmission line 22 is disposed on the layout layer 11. Thus, on the one hand, the layout layer 11 is disposed on the outer side of the first conductor layer 31, and the plurality of transmission lines 22 are disposed around the center of the radio frequency signal line 21, so that the roundness of the section in the length direction of the multi-pass cable is improved, and the multi-pass cable is more attractive. On the other hand, each group of transmission lines 22 extends parallel to the rf signal line 21, and by rotating the multi-channel cable, the position of the transmission line 22 in the circumferential direction of the multi-channel cable can be adjusted, and after the rf signal line 21 is communicatively connected with the rf device, the transmission line 22 can be closer to the target device, so that the low-frequency analog signal or the digital signal can be transmitted with the target device. On the other hand, the first conductor layer 31 is used for shielding the electromagnetic signals on the radio frequency signal line 21, so that the isolation degree of the multi-channel cable to the electromagnetic signals is improved.

In some embodiments, as shown in fig. 2-4, the cover 1 further includes a second dielectric layer 42. The second dielectric layer 42 is disposed between the layout layer 11 and the first conductor layer 31, and the second dielectric layer 42 and the first dielectric layer 41 are both insulation elements.

In this embodiment, the radio frequency signal line 21, the first dielectric layer 41, the first conductor layer 31 and the second dielectric layer 42 may be first made into a radio frequency transmission line. Then, according to the application scenario of the multi-channel cable, the layout layer 11 is disposed on the outer side of the rf transmission wire, so as to adjust the layout number and layout position of the transmission wires 22 according to different usage scenarios of the multi-channel cable.

In some embodiments, as shown in fig. 3-5, the routing layer 11 is an injection molded piece and is coated outside the second dielectric layer 42. In the injection molding of the layer 11, the transmission lines 22 are routed around the second dielectric layer 42.

Specifically, in this embodiment, the radio frequency signal line 21, the first dielectric layer 41, the first conductor layer 31 and the second dielectric layer 42 are first made into a radio frequency transmission line. The second dielectric layer 42 is then injection molded with the layout layer 11. The relative positional relationship between the plurality of transmission lines 22 and the radio frequency transmission line is ensured to be unchanged in the process. After the layer 11 is cured, the transmission lines 22 are arranged around the axis of the radio frequency signal line 21. Fig. 3 shows the positional relationship between four transmission lines 22 and the radio frequency signal line 21. The centers of the four transmission lines 22 are arranged along an arc. The center of the arc coincides with the center of the radio frequency signal line 21.

In some embodiments, as shown in fig. 2-4, the cladding 1 further includes a second conductor layer 32. The second conductor layer 32 is coated on the layout layer 11. The cladding portion 1 further includes a protective layer 12, and the protective layer 12 is wrapped on the second conductor layer 32.

The second conductor layer 32 in this embodiment is located outside the layout layer 11, so that signal interference between the transmission portion 2 and the rf device outside the multi-path cable can be avoided, and isolation of electromagnetic signals in the rf signal line 21 can be further improved.

Alternatively, the materials of the layout layer 11, the first dielectric layer 41, the second dielectric layer 42, and the protective layer 12 in the above embodiment may be all fluorinated ethylene propylene copolymers.

Further, the set of transmission lines 22 includes a plurality of transmission lines 22. The plurality of transmission lines 22 includes a plurality of audio lines or a plurality of antenna switch control lines. And the thickness of the routing layer 11 in each direction is uniform in the radial direction of the multi-path cable.

Specifically, the plurality of transmission lines 22 are three antenna switch control lines, and the multi-path cable in the present embodiment can be applied to an antenna assembly. The rf signal line 21 is used for being in communication with a feeding point of the antenna to feed the guided electromagnetic wave to the antenna. The three antenna switch control lines are connected with the radio frequency transceiver switch 62 in a communication manner to transmit pulse signals so as to control the connection state of the antennas. Thus, the connection between the radio frequency transceiver circuit and the antenna assembly is simplified by the multi-pass cable. Meanwhile, the flexibility of the multi-way cable in all directions is as consistent as possible through controlling the thickness of the layout layer 11 in all directions. The transmission lines 22 are arranged on a single side of the radio frequency signal line 21, so that the multi-channel cable is protruded in the circumferential direction.

Specifically, the plurality of transmission lines 22 are two audio lines. Taking a bluetooth headset as an example, the radio frequency signal line 21 is used for feeding a guided electromagnetic wave to a bluetooth antenna in the bluetooth headset, and the two transmission lines 22 are used for connecting with a speaker 65 or a microphone 7 in the bluetooth headset, so as to transmit a low frequency analog signal. Thereby, wiring inside the earphone is simplified.

In some embodiments, as shown in fig. 4-5, at least one set of transmission lines 22 is a plurality of sets of transmission lines 22. The plurality of sets of transmission lines 22 are evenly distributed around the circumference of the radio frequency signal line 21. The multiple sets of transmission lines 22 in this embodiment may be used to transmit audio signals and control signals, respectively, while the angles between two adjacent sets of transmission lines 22 are the same in the circumferential direction of the multi-path cable. Thus, the roundness of the cross section in the length direction of the multi-pass cable is made higher, that is, the outer wall of the protective layer 12 is made closer to a perfect circle. In addition, when the multi-way cable is bent, the flexibility of the multi-way cable in all directions can be ensured to be consistent.

In some embodiments, as shown in fig. 1-2, the radio frequency signal line 21 includes a first lead-out section 211. The transmission line 22 includes a second lead-out section 221, and the first lead-out section 211 and the second lead-out section 221 are located at the end of the radio frequency signal line 21 and the end of the transmission line 22, respectively. The first and second lead-out sections 211 and 221 extend to the outside of the cladding 1.

In this embodiment, the first lead-out section 211 and the second lead-out section 221 can enable one multi-channel cable to be connected with the connection areas at different positions at the same time, and especially when the distances between the connection areas are far, the adaptability of the multi-channel cable can be greatly improved.

It is easy to understand that the cladding portion 1 in this embodiment includes the first dielectric layer 41, the first conductor layer 31, the second dielectric layer 42, the layout layer 11, the second conductor layer 32, and the protective layer 12, which are sequentially nested. If the radio frequency signal line 21 and the transmission line 22 are exposed to the outside of the covering portion 1 at the same time by a tool such as a cutter or a wire stripper, damage to the transmission portion 2 may be caused in the process.

For this reason, the first lead-out section 211 and the second lead-out section 221 in the present embodiment are always outside the coating portion 1, that is, during the manufacturing process of the multi-pass cable. The overall length of the transmission part 2 is configured to be greater than the axial length of the cladding part 1 so that both ends of the radio frequency signal line 21 and both ends of the transmission line 22 are exposed to the outside (e.g., 5CM or 10 CM) of the cladding part 1. In the assembly process of the electronic device, the dimensions of the two ends of the transmission line 22 can be cut according to actual needs, so as to form the first lead-out section 211 and the second lead-out section 221, so that the multi-channel cable can adapt to different application scenarios.

Fig. 6 and 7 are schematic diagrams of architectures of electronic devices in different embodiments.

The multi-pass cable in the above-described embodiments may be applied to an electronic device. In an alternative implementation, as shown in fig. 6-7, the electronic device in this embodiment includes a main circuit board 5, a functional module 6, and a multi-pass cable. The multi-channel cable comprises a coating part 1 and a transmission part 2, wherein the coating part 1 comprises a layout layer 11, a first conductor layer 31 and a first dielectric layer 41, the first conductor layer 31 is arranged on the inner side of the layout layer 11, the first dielectric layer 41 is positioned on the inner side of the first conductor layer 31, the transmission part 2 comprises a radio frequency signal wire 21 and at least one group of transmission wires 22, the radio frequency signal wire 21 is arranged at the center of the first dielectric layer 41, each group of transmission wires 22 is arranged on the layout layer 11 and comprises a plurality of adjacent transmission wires 22, and the plurality of transmission wires 22 extend in parallel with the radio frequency signal wire 21 and are arranged along the circumferential direction of the radio frequency signal wire 21.

The transmission section 2 is configured to transmit radio frequency signals between the main circuit board 5 and the functional module 6 through a radio frequency signal line 21 and to transmit low frequency analog signals and/or digital signals through a transmission line 22.

In summary, in the electronic device of the present embodiment, the radio frequency signal line 21 is disposed at the center of the first dielectric layer 41, and the transmission line 22 is disposed on the layout layer 11. Thus, on the one hand, the layout layer 11 is disposed on the outer side of the first conductor layer 31, and the plurality of transmission lines 22 are disposed around the center of the radio frequency signal line 21, so that the roundness of the section in the length direction of the multi-pass cable is improved, and the multi-pass cable is more attractive. On the other hand, each group of transmission lines 22 extends parallel to the rf signal line 21, and by rotating the multi-pass cable, the position of the transmission line 22 in the circumferential direction of the multi-pass cable can be adjusted, and after the rf signal line 21 is communicatively connected to the rf device, the transmission line 22 can be brought closer to the target device (the transmission line 22 is located closer to the right in fig. 6 and 7). And in turn communicates low frequency analog or digital signals with the target device. On the other hand, the first conductor layer 31 is used for shielding the electromagnetic signals on the radio frequency signal line 21, so that the isolation degree of the multi-channel cable to the electromagnetic signals is improved.

Further, as shown in fig. 6, the functional module 6 in the present embodiment includes an antenna assembly. The antenna assembly includes a radiating portion 61 and a radio frequency transceiver switch 62 communicatively coupled to the radiating portion 61.

The radio frequency signal line 21 comprises a first lead-out section 211 and the transmission line 22 comprises a second lead-out section 221. The first and second lead-out sections 211 and 221 are located at the end of the radio frequency signal line 21 and the end of the transmission line 22, respectively.

The transmission part 2 is configured to feed the radio frequency signal to the radiation part 61 through the first lead-out section 211, and the second lead-out section 221 adjusts the operation state of the radiation part 61 through the radio frequency transceiving switch 62.

Specifically, the functional module 6 in the present embodiment further includes a functional circuit board 81. The radiation portion 61 and the rf transceiver switch 62 are both disposed on the functional circuit board 81.

The rf transceiver switch 62 in this embodiment includes, but is not limited to, a single pole double throw switch, an IGBT tube, a PIN diode, or the like. The radiation portion 61 in the present embodiment is an IFA antenna. The IFA antenna is a resonant antenna, and when the antenna length is one quarter wavelength of the working frequency band, the current on the antenna can meet the boundary condition, so that resonance can be generated and electromagnetic signals can be radiated at the same time. The resonant length of such an antenna is H, h=l1+l2. Wherein L1 is a distance between the feeding end and the ground end, and L2 is a distance between the feeding end and the ground end and an outward extending portion of L1. Therefore, a distance is provided between the feeding end and the grounding end in this embodiment.

In this embodiment, the rf signal line 21 is connected to the feeding terminal through the first lead-out section 211, and the transmission line 22 is connected to the ground terminal through the rf transceiver switch 62 by using the second lead-out section 221. Therefore, the connection requirement of the IFA antenna is met.

Further, as shown in fig. 7, the functional module 6 includes an audio component. The audio component comprises a frame 63, a radiation pattern 64 and a speaker 65. The frame 63 has a sound cavity 631, the speaker 65 is disposed in the sound cavity 631, and the radiation pattern 64 is disposed on an inner wall of the sound cavity 631.

The radio frequency signal line 21 comprises a first lead-out section 211 and the transmission line 22 comprises a second lead-out section 221. The first and second lead-out sections 211 and 221 are located at the end of the radio frequency signal line 21 and the end of the transmission line 22, respectively.

The transmission part 2 is configured to feed the radio frequency signal to the radiation pattern 64 through the first lead-out section 211, and the second lead-out section 221 is communicatively connected to the speaker 65 and transmits the audio signal.

The radiation pattern 64 in this embodiment is formed on the inner wall of the acoustic cavity 631 by a laser direct structuring process. The laser direct forming process (Laser Direct Structuring) is called LDS process for short, and the principle is that the common plastic element and substrate are endowed with electric interconnection function, so that the plastic shell and structural member have the functions of shielding, antenna and the like generated by combining with a conductive circuit besides the functions of supporting, protecting and the like. Accordingly, the radiation pattern 64 is in a state of being adjacently disposed to the speaker 65. The radiation pattern 64 can be fed with guided electromagnetic waves by means of the radio frequency signal line 21 and an audio signal can be output to the loudspeaker 65 via the transmission line 22. The transmission line 22 can also be connected to the microphone 7 for collecting sound signals in the vicinity of the audio component.

Specifically, the radiation pattern 64 in the present embodiment includes a feeding point and a ground point. The first conductor layer 31 and the second conductor layer 32 in this embodiment are aluminum materials, and tin plating is performed on the surfaces of the aluminum materials. Thus, the end of the first lead-out section 211 in this embodiment may overlap the feeding point while overlapping the first conductor layer 31 on the ground point, thereby achieving grounding of the radiation pattern 64.

Preferably, as shown in fig. 2, the end of the wrapping portion 1 is stepped. That is, the end portion of the first dielectric layer 41 is exposed to the outside of the first conductor layer 31, and the end portion of the first conductor layer 31 is exposed to the outside of the second dielectric layer 42. The end of the second dielectric layer 42 is exposed to the outside of the layout layer 11, and the end of the layout layer 11 is exposed to the outside of the second conductor layer 32. As a result, the extraction positions of the second extraction section 221 and the first extraction section 211 on the coating portion 1 are offset from each other, and the ends of the second extraction section 221 and the first and second conductor layers 31 and 32 are offset from each other, so that the transmission portion 2 and the coating portion 1 are prevented from shorting.

The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and various modifications and variations may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A multi-pass cable, the multi-pass cable comprising:

the coating part (1) comprises a layout layer (11), a first conductor layer (31) and a first dielectric layer (41), wherein the first conductor layer (31) is arranged on the inner side of the layout layer (11), and the first dielectric layer (41) is positioned on the inner side of the first conductor layer (31);

the transmission part (2) comprises a radio frequency signal line (21) and at least one group of transmission lines (22), wherein the radio frequency signal line (21) is arranged in the center of the first dielectric layer (41), each group of transmission lines (22) are arranged on the layout layer (11) and comprise a plurality of adjacent transmission lines (22), and the plurality of transmission lines (22) extend in parallel with the radio frequency signal line (21) and are distributed along the circumferential direction of the radio frequency signal line (21);

the transmission section (2) is configured to transmit a low frequency analog signal and/or a digital signal through the transmission line (22).

2. The multi-pass cable according to claim 1, characterized in that the cladding (1) further comprises:

the second dielectric layer (42) is arranged between the layout layer (11) and the first conductor layer (31), and the second dielectric layer (42) and the first dielectric layer (41) are insulating elements.

3. The multi-pass cable according to claim 2, characterized in that the routing layer (11) is an injection-molded part and is coated outside the second dielectric layer (42), and in the injection-molding of the routing layer (11), each transmission line (22) is routed around the second dielectric layer (42).

4. The multi-pass cable according to claim 1, characterized in that the cladding (1) further comprises:

a second conductor layer (32), wherein the second conductor layer (32) is coated on the layout layer (11);

the cladding part (1) further comprises a protective layer (12), and the protective layer (12) is cladded on the second conductor layer (32).

5. The multi-pass cable according to claim 1, characterized in that a set of the transmission lines (22) comprises a plurality of audio lines or a plurality of antenna switch control lines, and in that the thickness of the routing layer (11) is uniform in each direction in the radial direction of the multi-pass cable.

6. The multi-pass cable according to claim 1, wherein at least one set of the transmission lines (22) is a plurality of sets of the transmission lines (22), the plurality of sets of the transmission lines (22) being evenly distributed around the circumference of the radio frequency signal line (21).

7. The multi-pass cable according to claim 1, characterized in that the radio frequency signal line (21) comprises a first lead-out section (211), the transmission line (22) comprises a second lead-out section (221), the first lead-out section (211) and the second lead-out section (221) being located at an end of the radio frequency signal line (21) and an end of the transmission line (22), respectively;

the first lead-out section (211) and the second lead-out section (221) extend to the outer side of the coating part (1).

8. An electronic device, the electronic device comprising:

a main circuit board (5);

a functional module (6); and

the multi-channel cable comprises a coating part (1) and a transmission part (2), wherein the coating part (1) comprises a layout layer (11), a first conductor layer (31) and a first medium layer (41), the first conductor layer (31) is arranged on the inner side of the layout layer (11), the first medium layer (41) is positioned on the inner side of the first conductor layer (31), the transmission part (2) comprises a radio frequency signal wire (21) and at least one group of transmission wires (22), the radio frequency signal wire (21) is arranged in the center of the first medium layer (41), each group of transmission wires (22) is arranged on the layout layer (11) and comprises a plurality of adjacent transmission wires (22), and the transmission wires (22) extend in parallel with the radio frequency signal wire (21) and are distributed along the circumferential direction of the radio frequency signal wire (21);

the transmission part (2) is configured to transmit radio frequency signals between the main circuit board (5) and the functional module (6) through the radio frequency signal line (21) and control signals and/or audio signals through the transmission line (22).

9. The electronic device according to claim 8, characterized in that the functional module (6) comprises an antenna assembly comprising a radiating portion (61) and a radio frequency transceiver switch (62) in communicative connection with the radiating portion (61);

the radio frequency signal line (21) comprises a first lead-out section (211), the transmission line (22) comprises a second lead-out section (221), and the first lead-out section (211) and the second lead-out section (221) are respectively positioned at the end part of the radio frequency signal line (21) and the end part of the transmission line (22);

the transmission part (2) is configured to feed radio frequency signals to the radiation part (61) through the first lead-out section (211), and the second lead-out section adjusts the working state of the radiation part (61) through the radio frequency transceiving switch (62).

10. The electronic device according to claim 8, characterized in that the functional module (6) comprises an audio component comprising a frame (63), a radiation pattern (64) and a speaker (65), the frame (63) having a sound cavity (631), the speaker (65) being arranged in the sound cavity (631) and the radiation pattern (64) being arranged in an inner wall of the sound cavity (631);

the radio frequency signal line (21) comprises a first lead-out section (211), the transmission line (22) comprises a second lead-out section (221), and the first lead-out section (211) and the second lead-out section (221) are respectively positioned at the end part of the radio frequency signal line (21) and the end part of the transmission line (22);

the transmission part (2) is configured to feed radio frequency signals to the radiation pattern (64) through the first lead-out section (211), and the second lead-out section (221) is communicatively connected with the speaker (65) and transmits audio signals.