CN117455978A - Device defect length determining method, device, computer equipment and storage medium - Google Patents
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Abstract
The application relates to a device defect length determining method, device, computer equipment and storage medium. The method comprises the following steps: acquiring a target image comprising a device to be identified; identifying a defect boundary of the device to be identified in the target image; determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified; and determining the defect length of the device to be identified according to at least two projection points. By adopting the method, the accuracy and the determination efficiency of the device defect length determination result can be improved.
Description
Technical Field
The present disclosure relates to the field of device detection technologies, and in particular, to a device defect length determining method, device, computer apparatus, and storage medium.
Background
In recent years, with the development of electronic manufacturing technologies such as integrated circuit processes, electronic devices such as chips have been developed toward high integration and high speed, and control of quality problems of the electronic devices has been made urgent.
And defects such as holes of electronic devices belong to common quality problems. Currently, the defect degree of a device is generally quantified according to parameters such as a defect area or a defect length.
In the conventional technology, the defect degree of the device is quantified usually by means of manual visual inspection. However, visual inspection results are often more erroneous and less efficient. In particular, when the device defect is measured according to the length, the accuracy of the device defect length determination result is further reduced due to the error accumulation of visual inspection of the multiple lengths.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a device defect length determining method, apparatus, computer device, and storage medium, which are capable of improving accuracy and determining efficiency of a device defect length determining result.
In a first aspect, the present application provides a device defect length determining method, including:
acquiring a target image comprising a device to be identified;
identifying a defect boundary of the device to be identified in the target image;
determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and determining the defect length of the device to be identified according to at least two projection points.
In one embodiment, determining projections of at least two boundary points in the defect boundary in the reference direction to obtain projection points of corresponding boundary points includes:
obtaining the device type of the device to be identified;
determining the reference direction according to the device class;
and determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain the projection point of the wanted boundary point.
In one embodiment, determining the reference direction according to the device class includes:
taking a device subarea to which the defect boundary belongs as a region to be identified; the device subareas are determined by the device classification corresponding to the device classification modes;
and determining the reference direction according to the position distribution of the region to be identified in each device subarea.
In one embodiment, determining the defect length of the device to be identified according to at least two projection points includes:
selecting two target projection points from the at least two projection points according to the position distribution of the at least two projection points;
and determining the defect length of the device to be identified according to the distance between the two target projection points.
In one embodiment, selecting two target projection points from the at least two projection points according to the position distribution of the at least two projection points includes:
and according to the position distribution of the at least two projection points, determining two projection points with a longer distance as the target projection points.
In one embodiment, determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain the projection points of the corresponding boundary points includes:
sampling the defect boundary to obtain at least two boundary points;
and determining the projection of the at least two boundary points in the reference direction to obtain projection points of the corresponding boundary points.
In a second aspect, the present application further provides a device defect length determining apparatus, including:
the image acquisition module is used for acquiring a target image comprising a device to be identified;
the boundary identification module is used for identifying the defect boundary of the device to be identified in the target image;
the projection module is used for determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and the length determining module is used for determining the defect length of the device to be identified according to at least two projection points.
In a third aspect, the present application also provides a computer device comprising a memory and a processor, the memory storing a computer program, the processor implementing the following steps when executing the computer program:
acquiring a target image comprising a device to be identified;
identifying a defect boundary of the device to be identified in the target image;
determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and determining the defect length of the device to be identified according to at least two projection points.
In a fourth aspect, the present application also provides a computer readable storage medium having stored thereon a computer program which when executed by a processor performs the steps of:
acquiring a target image comprising a device to be identified;
identifying a defect boundary of the device to be identified in the target image;
determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and determining the defect length of the device to be identified according to at least two projection points.
In a fifth aspect, the present application also provides a computer program product comprising a computer program which, when executed by a processor, performs the steps of:
acquiring a target image comprising a device to be identified;
identifying a defect boundary of the device to be identified in the target image;
determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and determining the defect length of the device to be identified according to at least two projection points.
According to the device defect length determining method, device, computer equipment and storage medium, the projection of at least two boundary points in the defect boundary in the reference direction can be further determined by acquiring the target image comprising the device to be identified and identifying the defect boundary of the device to be identified in the target image, so that the projection points of the corresponding boundary points are obtained, wherein the reference direction corresponds to the actual presentation direction of the device to be identified; and finally, determining the defect length of the device to be identified according to at least two projection points. According to the scheme, the reference direction corresponding to the actual presentation direction of the device to be identified is introduced, the boundary point on the defect boundary of the device to be identified is projected to the reference direction, and the projection point obtained by projection is used for automatically determining the defect length, so that the defect length determination efficiency is improved, meanwhile, the mode does not need manual intervention, the labor cost is reduced, and the condition that the defect length determination result accuracy is poor due to human subjective factors is avoided. In addition, the reference direction corresponds to the actual presentation direction of the device to be identified, so that the reference basis of different defects in defect length determination is the same, the rationality of boundary point projection and the accuracy of the projection point position are improved, and the accuracy of the defect length determination result is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for a person having ordinary skill in the art.
FIG. 1 is a diagram of an application environment for a device defect length determination method in one embodiment;
FIG. 2 is a flow chart of a method of determining a defect length of a device in one embodiment;
FIG. 3 is a flow diagram of determining projection points of corresponding boundary points in one embodiment;
FIG. 4 is a flow chart of determining a defect length of a device to be identified in one embodiment;
FIG. 5 is a flow chart of a method for determining a defect length of a device according to another embodiment;
FIG. 6 is a block diagram of a device defect length determination apparatus in one embodiment;
FIG. 7 is a block diagram showing a device defect length determining apparatus according to another embodiment;
FIG. 8 is a block diagram showing the structure of a device defect length determining apparatus in yet another embodiment;
fig. 9 is an internal structural diagram of a computer device in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
The method for determining the defect length of the device, provided by the embodiment of the application, can be applied to an application environment shown in fig. 1. Wherein the image acquisition device 101 communicates with the computer device 102 via a network. For example, the computer device 102 acquires a target image including a device to be identified from the image pickup device 101; identifying a defect boundary of a device to be identified in the target image; determining projections of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified; and determining the defect length of the device to be identified according to at least two projection points. Wherein the computer device 102 may be implemented as a stand-alone server or as a cluster of servers.
In an exemplary embodiment, as shown in fig. 2, a device defect length determining method is provided, and the method is applied to the computer device 102 in fig. 1 for illustration, and specifically includes the following steps:
s201, acquiring a target image comprising a device to be identified.
Wherein a device refers to a mechanism or part for achieving a particular purpose or a particular function, and may be, for example, an electronic device such as a chip, a circuit board, etc.; the device to be identified is a device that requires defect length measurement, typically a packaged device. The target image is an image which is acquired by the image acquisition device and comprises at least part of the device to be identified, for example, the image acquisition can be carried out by a camera and other devices.
Optionally, the target image may be acquired in real time by the image acquisition device and then transmitted, or may be acquired in advance by the image acquisition device and then stored in the computer device, where the computer device may directly read out from its own storage space. For example, a CCD (charge coupled device ) camera may be used to capture an image in a preset direction (e.g., directly above) of the device to be identified, and the captured image may be transmitted to a computer device, where the image is a target image including the device to be identified.
S202, identifying the defect boundary of the device to be identified in the target image.
Wherein, the defects can be layering, hollowness and the like generated in the packaging process of the device; defect boundaries refer to edges of device defects to be identified.
Alternatively, the defect boundary of the device to be identified in the target image may be identified by special software (e.g., labelimg software) installed in the computer apparatus, and the position coordinates of at least two boundary points in the identified defect boundary may be stored. It should be noted that, the position coordinates of enough boundary points may be stored to ensure the accuracy of the defect length determination result of the device to be identified later.
S203, determining the projection of at least two boundary points in the defect boundary in the reference direction, and obtaining projection points of the corresponding boundary points.
The reference direction corresponds to the actual presentation direction of the device to be identified, namely the reference direction does not change along with the angle of the target image of the device to be identified, namely the relative position of the reference direction and the device to be identified is unchanged.
Alternatively, the projection points of the corresponding boundary points may be obtained by projecting the boundary points in the reference direction by using a linear projection method, such as an orthogonal projection method.
S204, determining the defect length of the device to be identified according to at least two projection points.
Wherein, the defect length of the device to be identified refers to the length of the defect of the device to be identified relative to the reference direction.
Alternatively, statistics and analysis can be performed on all the projection points, and the defect length of the device to be identified can be obtained through calculation according to the relation between the projection points. For example, all the projection points can be clustered and classified, and the defect length of the device to be identified is determined according to the classification result; alternatively, the defect length of the device to be identified may be determined according to the position distribution of all the projection points.
In the device defect length determining method, by acquiring the target image comprising the device to be identified and identifying the defect boundary of the device to be identified in the target image, the projection of at least two boundary points in the defect boundary in the reference direction can be further determined, so as to obtain the projection point of the corresponding boundary point, wherein the reference direction corresponds to the actual presentation direction of the device to be identified; and finally, determining the defect length of the device to be identified according to at least two projection points. According to the scheme, the reference direction corresponding to the actual presentation direction of the device to be identified is introduced, the boundary point on the defect boundary of the device to be identified is projected to the reference direction, and the projection point obtained by projection is used for automatically determining the defect length, so that the defect length determination efficiency is improved, meanwhile, the mode does not need manual intervention, the labor cost is reduced, and the condition that the defect length determination result accuracy is poor due to human subjective factors is avoided. In addition, the reference direction corresponds to the actual presentation direction of the device to be identified, so that the reference basis of different defects in defect length determination is the same, the rationality of boundary point projection and the accuracy of the projection point position are improved, and the accuracy of the defect length determination result is further improved.
Since the defect length is essentially the projected length of the defect boundary in the reference direction, the choice of the projected point is critical. Therefore, in order to improve the effectiveness and accuracy of the defect length determination result, based on the technical solutions of the foregoing embodiments, in one embodiment, as shown in fig. 3, a method for determining a projection point of a corresponding boundary point is further provided, which specifically includes the following steps:
s301, obtaining the device type of the device to be identified.
Among other things, devices may be classified into different categories depending on the function or role of the device.
Alternatively, the device type of the device to be identified may be determined by means of device identification software or manual labeling, etc.
S302, determining a reference direction according to the device type.
In an alternative embodiment, the same device class may correspond to the same reference direction; different device classes may correspond to different reference directions.
When the device size is larger, in an alternative embodiment, different device sub-regions may also be divided for the same device, and different reference directions may be further set for the different device sub-regions.
For example, a device sub-region to which the defect boundary belongs may be used as the region to be identified; determining a reference direction according to the position distribution of the area to be identified in each device subarea; the device subareas are determined by device division modes corresponding to device categories.
Specifically, dividing a target image into a plurality of sub-regions serving as device sub-regions according to relevant standards of different device types, and taking the device sub-region where the defect of the device to be identified is located as the region to be identified; and taking the specified direction specified by the area to be identified as a reference direction according to the position of the area to be identified. It will be appreciated that by combining the device sub-regions to which the device defects to be identified belong to determine the reference direction, the flexibility and rationality of determining the reference direction is improved.
S303, determining the projection of at least two boundary points in the defect boundary in the reference direction, and obtaining projection points of the corresponding boundary points.
Optionally, the defect boundary may be sampled to obtain at least two boundary points; and determining the projection of at least two boundary points in the reference direction to obtain projection points of the corresponding boundary points. Specifically, after the defect boundary of the device to be identified is identified, sampling is performed by taking the pixel point of the defect boundary as a boundary point, for example, sampling is performed by uniformly sampling the pixel point of the defect boundary as a boundary point, and projection is performed on each boundary point obtained by sampling in the reference direction, so that the projection point of the corresponding boundary point in the reference direction can be obtained. It can be understood that the boundary points of the defects of the device to be identified can be obtained rapidly and accurately by a sampling method, so that the number of the boundary points is reduced to a certain extent, and the data operation amount is reduced; further, the rationality of boundary points which participate in subsequent operation is improved, and the accuracy of the determination result of the defect length of the device to be identified is further improved.
Alternatively, a projection matrix can be constructed according to the coordinates of all boundary points by a linear projection method, and the matrix is usedThe representation is as shown in the following formula:
wherein,、、respectively the 1 st boundary point, the 2 nd boundary pointThe abscissa of the individual boundary points;、、respectively the 1 st boundary point, the 2 nd boundary pointThe ordinate of the individual boundary points.
Vector for reference directionRepresenting vectorsVector for unit vector of (a)Representing the unit vectorThe method can be calculated by the following formula:
wherein,representing reference vectorsIs a mold of (a).
Further, projection matrixThe projection of n boundary points in the reference direction, namely the projection of the defect of the device to be identified in the reference direction, can be calculated by the following formula:
wherein,representing a projection of a defect of the device to be identified in a reference direction.
In this embodiment, the reference direction is determined according to the device type of the device to be identified, and the projection point of the boundary point in the reference direction is further determined, so that the rationality and effectiveness of the selection of the reference direction are ensured to a certain extent, and the accuracy of the determination result of the defect length of the device to be identified is further improved.
In order to ensure accuracy and convenience of defect length calculation of a device to be identified, in one embodiment, a method for determining defect length of a device to be identified is provided, as shown in fig. 4, and specifically includes the following steps:
s401, selecting two target projection points from the at least two projection points according to the position distribution of the at least two projection points.
Alternatively, two projection points farther from each other may be determined as the target projection points according to the position distribution of at least two projection points. Specifically, according to the position distribution of the projection points of the boundary points of the device defect to be identified in the reference direction, two projection points with the farthest distance can be selected as target projection points. It can be understood that the defect length of the device to be identified can be reasonably and accurately calculated by selecting the projection point with a longer distance as the target projection point.
It should be noted that, according to the position distribution of all the projection points, the distance of each projection point can be calculated.
S402, determining the defect length of the device to be identified according to the distance between the two target projection points.
Optionally, the distance between the two target projection points is calculated, and the distance is used as the defect length of the device to be identified. Specifically, the method can be calculated by the following formula:
wherein,representing the defect length of the device to be identified;representing the maximum distance of the projection points;representing the minimum distance of the proxels.
In this embodiment, by selecting two target projection points according to the distribution on the positions of the projection points and determining the defect length of the device to be identified according to the distance between the two target projection points, the rationality and accuracy of the defect length determination result of the device to be identified are improved.
Fig. 5 is a schematic flow chart of a method for determining a device defect length in another embodiment, and on the basis of the foregoing embodiment, this embodiment provides an alternative example of the method for determining a device defect length. With reference to fig. 6, the specific implementation procedure is as follows:
s501, a target image including a device to be identified is acquired.
S502, identifying the defect boundary of the device to be identified in the target image.
S503, obtaining the device type of the device to be identified.
S504, taking the device subarea to which the defect boundary belongs as a region to be identified.
The device subareas are determined by the device classification corresponding to the device division modes.
S505, determining a reference direction according to the position distribution of the area to be identified in each device subarea.
S506, sampling the defect boundary to obtain at least two boundary points.
S507, determining the projection of at least two boundary points in the reference direction, and obtaining projection points of the corresponding boundary points.
S508, according to the position distribution of at least two projection points, determining two projection points with a longer distance as target projection points.
S509, determining the defect length of the device to be identified according to the distance between the two target projection points.
The specific process of S501-S509 may be referred to the description of the above method embodiment, and its implementation principle and technical effects are similar, and are not repeated here.
It should be understood that, although the steps in the flowcharts related to the embodiments described above are sequentially shown as indicated by arrows, these steps are not necessarily sequentially performed in the order indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in the flowcharts described in the above embodiments may include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of the steps or stages is not necessarily performed sequentially, but may be performed alternately or alternately with at least some of the other steps or stages.
Based on the same inventive concept, the embodiment of the application also provides a device defect length determining device for implementing the device defect length determining method. The implementation of the solution provided by the device is similar to the implementation described in the above method, so the specific limitation in the embodiments of the device defect length determining device or devices provided below may be referred to the limitation of the device defect length determining method hereinabove, and will not be repeated herein.
In an exemplary embodiment, as shown in fig. 6, there is provided a device defect length determining apparatus 1 including: an image recognition module 10, a boundary recognition module 20, a projection module 30, and a length determination module 40, wherein:
an image acquisition module 10 for acquiring an image of a target including a device to be identified.
The boundary recognition module 20 is configured to recognize a defect boundary of the device to be recognized in the target image.
The projection module 30 is configured to determine projections of at least two boundary points in the defect boundary in the reference direction, and obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified.
A length determining module 40, configured to determine a defect length of the device to be identified according to at least two projection points.
According to the device defect length determining device, the target image comprising the device to be identified is obtained, the defect boundary of the device to be identified in the target image is identified, projection of at least two boundary points in the defect boundary in the reference direction can be further determined, and projection points of the corresponding boundary points are obtained, wherein the reference direction corresponds to the actual presentation direction of the device to be identified; and finally, determining the defect length of the device to be identified according to at least two projection points. According to the scheme, the reference direction corresponding to the actual presentation direction of the device to be identified is introduced, the boundary point on the defect boundary of the device to be identified is projected to the reference direction, and the projection point obtained by projection is used for automatically determining the defect length, so that the defect length determination efficiency is improved, meanwhile, the mode does not need manual intervention, the labor cost is reduced, and the condition that the defect length determination result accuracy is poor due to human subjective factors is avoided. In addition, the reference direction corresponds to the actual presentation direction of the device to be identified, so that the reference basis of different defects in defect length determination is the same, the rationality of boundary point projection and the accuracy of the projection point position are improved, and the accuracy of the defect length determination result is further improved.
In one embodiment, based on fig. 6, as shown in fig. 7, the projection module 30 includes:
an obtaining unit 31, configured to obtain a device class of the device to be identified.
A first determining unit 32 for determining a reference direction according to the device class;
the second determining unit 33 is configured to determine projections of at least two boundary points in the defect boundary in the reference direction, and obtain projection points of the corresponding boundary points.
In one embodiment, the first determining unit 32 is specifically configured to:
taking a device subarea to which the defect boundary belongs as a region to be identified; the device subareas are determined by device classification corresponding to the device classification modes; and determining a reference direction according to the position distribution of the area to be identified in each device subarea.
In one embodiment, based on fig. 6 or fig. 7, as shown in fig. 8, the length determining module 40 includes:
and a selecting unit 41, configured to select two target projection points from the at least two projection points according to the position distribution of the at least two projection points.
And a third determining unit 42, configured to determine a defect length of the device to be identified according to a distance between the two target projection points.
In one embodiment, the selecting unit 41 is specifically configured to:
and determining two projection points with a longer distance as target projection points according to the position distribution of at least two projection points.
In one embodiment, projection module 30 may also be used to:
sampling the defect boundary to obtain at least two boundary points; and determining the projection of at least two boundary points in the reference direction to obtain projection points of the corresponding boundary points.
The respective modules in the above-described device defect length determination apparatus may be implemented in whole or in part by software, hardware, and a combination thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.
In one exemplary embodiment, a computer device is provided, which may be a server, the internal structure of which may be as shown in fig. 9. The computer device includes a processor, a memory, an Input/Output interface (I/O) and a communication interface. The processor, the memory and the input/output interface are connected through a system bus, and the communication interface is connected to the system bus through the input/output interface. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database of the computer device is used for storing target picture data of the device to be identified. The input/output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a device defect length determination method.
It will be appreciated by those skilled in the art that the structure shown in fig. 9 is merely a block diagram of a portion of the structure associated with the present application and is not limiting of the computer device to which the present application applies, and that a particular computer device may include more or fewer components than shown, or may combine some of the components, or have a different arrangement of components.
In one exemplary embodiment, a computer device is provided comprising a memory and a processor, the memory having stored therein a computer program, the processor when executing the computer program performing the steps of:
acquiring a target image comprising a device to be identified;
identifying a defect boundary of a device to be identified in the target image;
determining projections of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and determining the defect length of the device to be identified according to at least two projection points.
In one embodiment, when the processor executes the computer program to determine projections of at least two boundary points in the defect boundary in the reference direction, and obtains projection points of the corresponding boundary points, the following steps are further implemented:
obtaining the device type of the device to be identified; determining a reference direction according to the device type; and determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points.
In one embodiment, when the processor executes the computer program to determine the reference direction according to the device class, the following steps are also implemented:
taking a device subarea to which the defect boundary belongs as a region to be identified; the device subareas are determined by device classification corresponding to the device classification modes; and determining a reference direction according to the position distribution of the area to be identified in each device subarea.
In one embodiment, when the processor executes the computer program to determine the defect length of the device to be identified according to at least two projection points, the following steps are further implemented:
selecting two target projection points from the at least two projection points according to the position distribution of the at least two projection points; and determining the defect length of the device to be identified according to the distance between the two target projection points.
In one embodiment, when the processor executes the computer program to select two target projection points from the at least two projection points according to the position distribution of the at least two projection points, the following steps are further implemented:
and determining two projection points with a longer distance as target projection points according to the position distribution of at least two projection points.
In one embodiment, when the processor executes the computer program to determine the projection of at least two boundary points in the defect boundary in the reference direction, and obtains the projection points of the corresponding boundary points, the following steps are further implemented:
sampling the defect boundary to obtain at least two boundary points; and determining the projection of at least two boundary points in the reference direction to obtain projection points of the corresponding boundary points.
In one embodiment, a computer readable storage medium is provided having a computer program stored thereon, which when executed by a processor, performs the steps of:
acquiring a target image comprising a device to be identified;
identifying a defect boundary of a device to be identified in the target image;
determining projections of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and determining the defect length of the device to be identified according to at least two projection points.
In an embodiment, the computer program determines projections in reference directions of at least two boundary points in the defect boundary, and when the projection points of the corresponding boundary points are executed by the processor, the following steps are further implemented:
obtaining the device type of the device to be identified; determining a reference direction according to the device type; and determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points.
In one embodiment, the computer program further performs the following steps when determining the reference direction based on the device class, when executed by the processor:
taking a device subarea to which the defect boundary belongs as a region to be identified; the device subareas are determined by device classification corresponding to the device classification modes; and determining a reference direction according to the position distribution of the area to be identified in each device subarea.
In one embodiment, the computer program further performs the following steps when determining the defect length of the device to be identified based on the at least two projection points, when executed by the processor:
selecting two target projection points from the at least two projection points according to the position distribution of the at least two projection points; and determining the defect length of the device to be identified according to the distance between the two target projection points.
In one embodiment, the computer program further implements the following steps when selecting two target proxels from the at least two proxels according to the position distribution of the at least two proxels, for execution by the processor:
and determining two projection points with a longer distance as target projection points according to the position distribution of at least two projection points.
In an embodiment, the computer program determines the projection of at least two boundary points in the defect boundary in the reference direction, and when the projection points of the corresponding boundary points are executed by the processor, the following steps are further implemented:
sampling the defect boundary to obtain at least two boundary points; and determining the projection of at least two boundary points in the reference direction to obtain projection points of the corresponding boundary points.
In one embodiment, a computer program product is provided comprising a computer program which, when executed by a processor, performs the steps of:
acquiring a target image comprising a device to be identified;
identifying a defect boundary of a device to be identified in the target image;
determining projections of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and determining the defect length of the device to be identified according to at least two projection points.
In an embodiment, the computer program determines projections in reference directions of at least two boundary points in the defect boundary, and when the projection points of the corresponding boundary points are executed by the processor, the following steps are further implemented:
obtaining the device type of the device to be identified; determining a reference direction according to the device type; and determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points.
In one embodiment, the computer program further performs the following steps when determining the reference direction based on the device class, when executed by the processor:
taking a device subarea to which the defect boundary belongs as a region to be identified; the device subareas are determined by device classification corresponding to the device classification modes; and determining a reference direction according to the position distribution of the area to be identified in each device subarea.
In one embodiment, the computer program further performs the following steps when determining the defect length of the device to be identified based on the at least two projection points, when executed by the processor:
selecting two target projection points from the at least two projection points according to the position distribution of the at least two projection points; and determining the defect length of the device to be identified according to the distance between the two target projection points.
In one embodiment, the computer program further implements the following steps when selecting two target proxels from the at least two proxels according to the position distribution of the at least two proxels, for execution by the processor:
and determining two projection points with a longer distance as target projection points according to the position distribution of at least two projection points.
In an embodiment, the computer program determines the projection of at least two boundary points in the defect boundary in the reference direction, and when the projection points of the corresponding boundary points are executed by the processor, the following steps are further implemented:
sampling the defect boundary to obtain at least two boundary points; and determining the projection of at least two boundary points in the reference direction to obtain projection points of the corresponding boundary points.
It should be noted that, the data (including, but not limited to, data for analysis, data stored, data displayed, etc.) referred to in the present application are information and data fully authorized by each party, and the collection, use and processing of the relevant data are required to meet the relevant regulations.
Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the various embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high density embedded nonvolatile Memory, resistive random access Memory (ReRAM), magnetic random access Memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric Memory (Ferroelectric Random Access Memory, FRAM), phase change Memory (Phase Change Memory, PCM), graphene Memory, and the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, and the like. By way of illustration, and not limitation, RAM can be in the form of a variety of forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), and the like. The databases referred to in the various embodiments provided herein may include at least one of relational databases and non-relational databases. The non-relational database may include, but is not limited to, a blockchain-based distributed database, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic units, quantum computing-based data processing logic units, etc., without being limited thereto.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the present application. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application shall be subject to the appended claims.
Claims (10)
1. A device defect length determination method, the method comprising:
acquiring a target image comprising a device to be identified;
identifying a defect boundary of the device to be identified in the target image;
determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and determining the defect length of the device to be identified according to at least two projection points.
2. The method according to claim 1, wherein determining projections of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points comprises:
obtaining the device type of the device to be identified;
determining the reference direction according to the device class;
and determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points.
3. The method of claim 2, wherein said determining said reference direction based on said device class comprises:
taking a device subarea to which the defect boundary belongs as a region to be identified; the device subareas are determined by the device classification corresponding to the device classification modes;
and determining the reference direction according to the position distribution of the region to be identified in each device subarea.
4. A method according to any of claims 1-3, wherein said determining the defect length of the device to be identified from at least two proxels comprises:
selecting two target projection points from the at least two projection points according to the position distribution of the at least two projection points;
and determining the defect length of the device to be identified according to the distance between the two target projection points.
5. The method of claim 4, wherein selecting two target proxels from the at least two proxels based on the location distribution of the at least two proxels comprises:
and according to the position distribution of the at least two projection points, determining two projection points with a longer distance as the target projection points.
6. A method according to any one of claims 1-3, wherein said determining the projection of at least two boundary points in the defect boundary in the reference direction, resulting in projection points of the respective boundary points, comprises:
sampling the defect boundary to obtain at least two boundary points;
and determining the projection of the at least two boundary points in the reference direction to obtain projection points of the corresponding boundary points.
7. A device defect length determining apparatus, the apparatus comprising:
the image acquisition module is used for acquiring a target image comprising a device to be identified;
the boundary identification module is used for identifying the defect boundary of the device to be identified in the target image;
the projection module is used for determining the projection of at least two boundary points in the defect boundary in the reference direction to obtain projection points of the corresponding boundary points; the reference direction corresponds to the actual presentation direction of the device to be identified;
and the length determining module is used for determining the defect length of the device to be identified according to at least two projection points.
8. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor implements the steps of the method of any of claims 1 to 6 when the computer program is executed.
9. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 1 to 6.
10. A computer program product comprising a computer program, characterized in that the computer program, when being executed by a processor, implements the steps of the method of any of claims 1 to 6.
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