CN117448904A - High-efficiency wafer prewetting equipment - Google Patents

Abstract

The invention discloses high-efficiency wafer pre-wetting equipment, which is characterized in that a wafer is pressed and fixed on a wafer carrier from the edge of the front surface through a conducting ring, wherein the pre-wetting equipment comprises a wetting groove, the wetting groove forms an opening from the top for the wafer carrier to be inserted into or taken out of the wetting groove, and the wetting groove is opened from the bottom; the prewetting device also comprises a liquid discharge groove, a vacuum unit and a liquid supply unit, wherein the liquid discharge groove is arranged below the wetting groove and is opened from the top. On one hand, the invention realizes that the size of the vacuum cavity is matched with the surface of the wafer, thereby effectively shortening the time required for forming vacuum and injecting wetting liquid, realizing continuous and uninterrupted prewetting of a plurality of wafers, obviously improving the production efficiency, saving a large amount of wetting liquid and effectively reducing the production cost; on the other hand, the sealing performance of the vacuum cavity where the wafer wetting surface is located can be effectively improved, so that the pre-wetting effect is ensured to meet the production requirement.

Description

High-efficiency wafer prewetting equipment

Technical Field

The invention belongs to the technical field of semiconductor processing, and particularly relates to efficient wafer prewetting equipment.

Background

Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon crystal bar is ground, polished and sliced to form a silicon wafer. Further, a conductive metal layer is electroplated on the wafer, and the conductive metal layer is processed to form the conductive circuit.

Currently, due to the processing requirements of the wafer surface, there are some features such as through holes and holes on the wafer surface, for example TSV trenches, which easily form wet voids (dry spots), that is, during the electroplating process, gas bubbles are easily formed at the solid-liquid interface between the electroplating solution and the wafer surface due to the surface tension of the electroplating solution, and the electroplating solution cannot fully fill the wet voids, so that the plated metal of the wafer is pinched off, and further, voids are left at the bottom of the features of the wafer, which causes defects such as blocked circuit lines. Therefore, prior to electroplating a wafer, a pretreatment of wetting the surface of the wafer is generally required to improve the electroplating quality of the wafer. The existing wafer wetting method generally comprises spray wetting and vacuum wetting, wherein in the vacuum wetting, a wafer carrier loaded with a wafer is placed in a wetting groove in the traditional working procedure, then the wetting groove is vacuumized through vacuumizing equipment, then wetting liquid is injected and kept for a certain time, the wetting liquid is discharged, the air pressure in the wetting groove is restored, and finally the wafer carrier is taken out to complete the pre-wetting of the wafer.

However, during actual operation, existing wafer pre-wetting apparatuses suffer from the following drawbacks:

1. in order to accommodate the wafer carrier, the volume of the conventional wetting tank is usually made larger, so that the vacuumizing time is longer, a large amount of wetting liquid needs to be injected to fill the wetting tank to fully cover the surface of the wafer, the time consumption is long, the efficiency is low, the waste of the wetting liquid is caused, and the production cost is high;

2. the top of the wetting groove is provided with an opening for the wafer carrier to enter and exit, and a sealing door is arranged, so that the wafer carrier can be taken and placed each time the sealing door at the opening is required to be opened, the sealing door is closed to form sealing, the operation is complex, certain air leakage probability exists, and the wafer wetting effect is difficult to ensure;

3. after the pre-wetting is finished, the existing wetting tank can only discharge wetting liquid through a bottom liquid discharge pipeline, so that the liquid discharge efficiency is low, and the pre-wetting operation of the next wafer cannot be performed rapidly.

Disclosure of Invention

The invention aims to solve the technical problem of overcoming the defects of the prior art and providing a brand-new high-efficiency wafer pre-wetting device.

In order to solve the technical problems, the invention adopts the following technical scheme:

the wafer is pressed and fixed on the wafer carrier from the edge of the front face through the conducting ring, and the pre-wetting equipment comprises a wetting groove, wherein the wetting groove forms an open opening from the top for the wafer carrier to be inserted into or taken out of the wetting groove, and the wetting groove is arranged in an open manner from the bottom; the pre-wetting equipment further comprises a liquid discharge groove, a vacuum unit and a liquid supply unit, wherein the liquid discharge groove is arranged below the wetting groove and is opened from the top, the vacuum unit comprises a pressure plate, an adjusting part and a vacuum part, the pressure plate is arranged on the inner wall of the wetting groove, the pressure plate is opposite to and parallel to a wafer in the wetting groove, and the adjusting part drives the pressure plate to be close to or far away from the wafer; the pressure plate is also provided with an annular sealing ring, when the pressure plate is driven by the adjusting component to be close to the wafer, the sealing ring is abutted against the conducting ring, a first cavity is formed among the wafer, the pressure plate and the sealing ring, a second cavity which is symmetrical to the first cavity is formed between the back surface of the wafer and the wafer carrier, the vacuum component is respectively communicated with the first cavity and the second cavity, and the first cavity and the second cavity are driven to synchronously form vacuum or return to normal air pressure from vacuum; the liquid supply unit is communicated with the first cavity and is used for conveying wetting liquid into the first cavity, when liquid is discharged, the pressure plate is separated from the wafer, and the wetting liquid between the pressure plate and the wafer downwards passes through the bottom opening of the wetting groove and enters the liquid discharge groove.

According to a specific implementation and preferred aspect of the present invention, the wetting tank comprises two tank plates arranged side by side at intervals, two side plates respectively connected between opposite sides of the two tank plates, wherein the two tank plates are respectively erected at the top of the liquid discharge tank from the bottom; the two side plates are respectively provided with a supporting block extending inwards from the bottom, and the wafer carrier is inserted into the wetting groove and supported on the supporting blocks. The structure is simple, and the installation and the implementation are convenient.

According to a further specific and preferred aspect of the invention, the bottom of the drain tank extends obliquely up and down, wherein the wetting tank is arranged near the upper end of the bottom of the drain tank and the lower end of the bottom of the drain tank is provided with a drain pipe. The wetting liquid in the liquid discharge groove is discharged quickly, and the liquid accumulation is prevented from flowing into the wetting groove.

According to a further specific implementation and preferred aspect of the present invention, the center lines of the wafer, the pressure plate and the sealing ring are arranged in a coincident manner. The three are precisely positioned to ensure that the vacuum area covers the front surface of the wafer; meanwhile, the front surface of the wafer is ensured to be stressed uniformly, and deformation is avoided.

According to a further specific implementation and preferred aspect of the present invention, the pressure plate is formed with an annular groove, wherein the cross section of the annular groove is in a trapezoid shape with a narrow outer side, and the sealing ring is clamped in the annular groove. The sealing ring is made of conventional elastic materials. Here, as the pressure plate approaches to the wafer, the sealing ring is gradually deformed and extruded into the annular groove, and the clamping force on the sealing ring can be gradually improved by utilizing the narrow notch of the annular groove, so that the stability of the sealing ring is ensured, and the tightness of the edge of the first cavity is effectively improved; meanwhile, the sealing ring is easy and convenient to assemble and disassemble;

preferably, the pressure plate is further provided with a plurality of limiting blocks, wherein the limiting blocks are distributed around the periphery of the sealing ring, and when the first cavity is formed, the limiting blocks are synchronously abutted against the conductive ring to prevent the pressure plate from approaching to the wafer. By the arrangement, the platen is prevented from excessively approaching and contacting the wafer, and the wafer is prevented from being damaged.

Specifically, when the limiting blocks are synchronously abutted against the conducting ring, the distance between the pressure plate and the front surface of the wafer is 8-15 mm. In some embodiments, the spacing is 10mm, and the deformation of the seal ring is 30%, so that the vacuum pressure generated by the cavity formed between the platen and the wafer in the vacuum state is optimal.

According to a further specific implementation and preferred aspect of the present invention, the adjusting component includes a chassis disposed in parallel on a side of the platen away from the wafer, and an air bag disposed between the chassis and the platen, the platen being synchronously moved toward the wafer as the air bag inflates, and the platen being synchronously moved away from the wafer as the air bag deflates. Here, simple structure, and the position of the accurate control pressure disk of being convenient for.

Preferably, the adjusting part further comprises a tension spring connected to one side of the pressure plate, which is far away from the wafer, and the tension spring drives the pressure plate to keep moving away from the wafer when the air bag is inflated. Here, automatic platen reset is achieved.

Specifically, the tension springs are multiple, and the tension springs are distributed in a circumferential array around the central line of the pressure plate.

According to yet another specific and preferred aspect of the present invention, the vacuum component includes a first connector connected to the platen and in communication with the first chamber, a second connector connected to the wafer carrier and in communication with the second chamber, and a gas line connecting the first connector and the second connector, respectively, and a vacuum pump connected to the gas line.

Preferably, an air flow channel penetrating through the pressure plate in the thickness direction is formed at the upper part of the pressure plate, wherein an outer side port of the air flow channel is in butt joint with the first joint, an inner side port of the air flow channel is communicated with the first cavity, the inner side port is arranged close to the top of the first cavity, and the outer side port is positioned below the inner side port; the second connector is arranged at the top opening of the wetting groove, and when the wafer carrier is inserted into the wetting groove from top to bottom, the second connector is in butt joint with the top of the wafer carrier so as to be communicated with the second cavity. In this case, a vacuum is drawn from the top of the first chamber, so that, during the wetting process by injecting a wetting liquid into the chamber, the wetting liquid can be prevented from entering the gas flow channel; on the other hand, when the cavity is filled with nitrogen through the airflow channel to remove vacuum, the nitrogen flows from top to bottom, so that the air pressure between the pressure plate and the wafer can be uniformly recovered.

Preferably, the vacuum component further comprises a sensor and a nitrogen supply pipeline which are arranged on the air pipe, wherein a monitoring cavity is formed in the sensor, the nitrogen supply pipeline is communicated with the monitoring cavity, and when liquid is supplied, wetting liquid in the first cavity enters the monitoring cavity through the air pipe, and the liquid supply unit stops supplying liquid; during liquid discharge, nitrogen is blown into the monitoring cavity by the nitrogen supply pipeline so as to drive wetting liquid in the monitoring cavity to enter the wetting groove through the air pipe and be discharged. Here, the monitoring of the wetting liquid in the first cavity is realized, and the wetting liquid is ensured to fully fill the first cavity so as to ensure the wetting effect; meanwhile, when liquid is discharged, the whole discharge of the wetting liquid in the sensor can be ensured by nitrogen so as to prevent false detection.

In addition, a liquid supply channel penetrating the pressure plate in the thickness direction is formed at the lower part of the pressure plate, wherein an inner side port of the liquid supply channel is close to the bottom of the first cavity and is communicated with the first cavity, and an outer side port of the liquid supply channel is positioned above the inner side port; the liquid supply unit comprises a third joint in butt joint with the outer side port of the liquid supply channel, a liquid supply pipeline communicated with the third joint, a degassing component arranged on the liquid supply pipeline and a water source. The liquid level in the first cavity stably rises from the bottom, so that the wafer wetting effect is improved; simultaneously, realize that first cavity bottom feed liquor, top evacuation reduce the interference between the two, improve the life of equipment.

Due to the implementation of the technical scheme, compared with the prior art, the invention has the following advantages:

the wafer prewetting equipment in the prior art has the defects of low efficiency, high production cost and poor wetting effect easily caused by the problem of tightness; the structure of the pre-wetting equipment is designed integrally, the defects and the defects of the prior art are effectively overcome, after the pre-wetting equipment is adopted, firstly a wafer carrier loaded with a wafer is inserted into a wetting groove, secondly a pressure plate is driven to move towards the wafer through an adjusting part until a sealing ring is abutted against a conducting ring, so that a first cavity with the size matched with the front surface of the wafer is formed among the wafer, the pressure plate and the sealing ring, and under the working of a vacuum part, a vacuum is synchronously and quickly formed by the first cavity, a second cavity formed among the wafer and the wafer carrier, then a liquid supply unit inputs wetting liquid into the first cavity to pre-wet the surface of the wafer, finally the vacuum part enables the first cavity and the second cavity to recover normal air pressure, and the wafer is separated from the adjusting part, and the wetting liquid can fall into a liquid discharge groove through an opening at the bottom of the wetting groove, so that the pre-wetting operation of the next wafer can be immediately performed, on the one hand, compared with the prior art, the vacuum injection device can realize the size of the vacuum cavity and the surface of the wafer, the pre-wetting operation can be effectively shortened, and the continuous production cost can be remarkably reduced, and the continuous production time is remarkably reduced; on the other hand, the sealing performance of the vacuum cavity where the wafer wetting surface is located can be effectively improved, so that the pre-wetting effect is ensured to meet the production requirement.

Drawings

FIG. 1 is a schematic perspective view (partially omitted) of a high-efficiency wafer pre-wetting apparatus according to the present invention;

FIG. 2 is a schematic front view of a high efficiency wafer pre-wetting apparatus of the present invention;

FIG. 3 is a schematic cross-sectional view of section I-I of FIG. 2;

FIG. 4 is an enlarged schematic view of the structure of FIG. 3 (1);

FIG. 5 is an enlarged schematic view of the structure of FIG. 3 (2);

FIG. 6 is a left side schematic view of FIG. 2;

FIG. 7 is a schematic view in section II-II of FIG. 6;

FIG. 8 is a partially exploded schematic view of the high-efficiency wafer pre-wetting apparatus of the present invention;

FIG. 9 is a schematic diagram of an assembly structure of a wafer carrier, wafer, and conductive ring according to the present invention;

FIG. 10 is a schematic diagram of a high efficiency wafer prewetting apparatus of the invention;

wherein: A. a wetting tank; a0, groove plates; a1, side plates; a10, supporting blocks;

B. a liquid discharge tank; g0, a liquid discharge pipeline;

C. a vacuum unit; 1. a pressure plate; 10. a seal ring; q 1, a first cavity; 11. an annular groove; 12. a limiting block; 13. an air flow channel; 14. a liquid supply channel; 2. an adjusting member; 20. a chassis; 21. an air bag; 210. an air tap; 22. a tension spring; 3. a vacuum member; 31. a first joint; 311. a first channel; 312. a second channel; 32. a second joint; 33. an air pipe; 34. a vacuum pump; 35. a sensor; q3, monitoring the cavity; 36. a nitrogen supply line;

D. a liquid supply unit; d3, a third joint; d4, a liquid supply pipeline; d5, a degassing component;

y, wafer; H. a conductive ring; J. a wafer carrier; q2, second cavity.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

As shown in fig. 1 to 10, the high-efficiency wafer pre-wetting apparatus of the present embodiment includes a wetting tank a, a liquid discharge tank B, a vacuum unit C, and a liquid supply unit D; the wafer Y of this embodiment is pressed and fixed on the wafer carrier J from the edge of the front surface by the conductive ring H.

Specifically, the wetting groove A is opened from the top and the bottom respectively, wherein the wafer carrier J is inserted into or taken out of the wetting groove A through the opening at the top of the wetting groove A; the drain tank B is disposed below the wetting tank a and is open from the top. In some embodiments, the wetting tank a comprises two tank plates A0 arranged side by side at intervals, and two side plates A1 respectively connected between two opposite sides of the two tank plates A0, wherein the two tank plates A0 are respectively erected at the top of the liquid draining tank B from the bottom; the two side plates A1 are respectively provided with a supporting block A10 extending inwards from the bottom, and the wafer carrier J is inserted into the wetting groove A and supported on the supporting block A10; meanwhile, the bottom of the liquid discharge groove B extends in an up-down inclined mode, wherein the wetting groove A is arranged close to the higher end of the bottom of the liquid discharge groove B, and a liquid discharge pipeline g0 is arranged at the lower end of the bottom of the liquid discharge groove B.

For convenient implementation, rollers distributed up and down are arranged on the inner side edges of the two side plates A1 so as to reduce friction between the side plates of the wafer carrier J and the two sides A1, thereby facilitating the up-and-down movement of the wafer carrier J in the wetting tank A.

In this example, the vacuum unit C includes a platen 1, an adjusting member 2, and a vacuum member 3 disposed on an inner wall of the wetting tank a, wherein the platen 1 is disposed opposite to and parallel to a wafer Y located in the wetting tank a, and the adjusting member 2 drives the platen 1 to approach or separate from the wafer Y. In some embodiments, the wafer carrier J is loaded with a wafer Y on both the front and back surfaces, and the platen 1 and the adjusting member 2 of this embodiment form a vacuum group, and the vacuum groups are two and are respectively disposed on the inner walls of the two groove plates A0. The structure of one of the vacuum sets will be described below, and the other will be apparent.

Specifically, an annular sealing ring 10 is arranged on the corresponding side surface of the pressure plate 1, and when the pressure plate 1 is driven by the adjusting component 2 to be close to the wafer Y, the sealing ring 10 is abutted against the conducting ring H, and a first cavity q 1 is formed among the wafer Y, the pressure plate 1 and the sealing ring 10.

In some specific embodiments, the center lines of the wafer Y, the pressure plate 1 and the sealing ring 10 are overlapped; the corresponding side surface of the pressure plate 1 is inwards recessed and is provided with an annular groove 11, wherein the cross section of the annular groove 11 is in a trapezoid shape with a narrow outer side, and a sealing ring 10 is clamped in the annular groove 11 and protrudes out of the notch of the annular groove 11 from one side; the seal ring 10 is made of a conventional elastic material such as rubber.

In order to facilitate implementation, the pressure plate 1 is further provided with a plurality of limiting blocks 12, wherein the limiting blocks 12 are distributed at intervals around the periphery of the sealing ring 10, and when the first cavity q 1 is formed, the limiting blocks 12 synchronously abut against the conducting ring H to prevent the pressure plate 1 from approaching the wafer Y; when the plurality of limiting blocks 12 are synchronously abutted against the conducting ring H, the distance between the pressure plate 1 and the front surface of the wafer Y is 10mm, the deformation of the sealing ring 10 is 30%, and the vacuum pressure generated by the first cavity q 1 formed between the pressure plate 1 and the wafer Y in the vacuum state is optimal. In some embodiments, each stopper 12 is detachably connected to the platen 1 by a bolt.

In this example, the adjusting component 2 includes a chassis 20 disposed in parallel on a side of the platen 1 away from the wafer Y, an air bag 21 disposed between the chassis 20 and the platen 1, and a tension spring 22 connected to the side of the platen 1 away from the wafer Y, where the tension spring 22 deforms synchronously and drives the platen 1 to keep away from the movement trend of the wafer Y as the air bag 21 inflates and the platen 1 approaches the wafer Y; as the bladder deflates, the tension spring 22 simultaneously pulls the platen 1 away from the wafer Y.

For further convenient implementation, the inner wall of the groove plate A0 is provided with a groove matched with the bottom plate 20, and the bottom plate 20 is correspondingly inserted in the groove and fixedly connected to the wetting groove A through a bolt piece; the air bag 21 is an annular air bag with an air tap 210 extending outwards from one side to form a wetting groove A, the central line of the annular air bag is overlapped with the central line of the pressure plate 1, and an external air source is connected with the air tap to realize inflation and deflation of the air bag; the tension springs 22 are multiple, and the tension springs 22 are distributed in a circumferential array around the central line of the pressure plate 1, wherein one end of each tension spring 22 is fixedly connected to the corresponding groove plate A0, and the other end passes through the chassis 20 and is connected with the pressure plate 1.

In this example, the vacuum part 3 is used to draw gas from the chamber to form a vacuum, and also to reverse the input of gas to return the chamber to normal pressure. The wafer Y is formed with a second cavity q2 symmetrical with the first cavity q 1 from the back and the wafer carrier J, the vacuum component 3 is respectively communicated with the first cavity q 1 and the second cavity q2, and can drive the first cavity q 1 and the second cavity q2 to synchronously form vacuum (the front and the back of the wafer keep consistent pressure to avoid deformation), or drive the first cavity q 1 and the second cavity q2 to synchronously recover normal air pressure from a vacuum state.

Specifically, the vacuum part 3 includes a first joint 31 connected to the platen 1 and communicating with the first chamber q 1, a second joint 32 connected to the wafer carrier J and communicating with the second chamber q2, and an air pipe 33 connecting the first joint 31 and the second joint 32, respectively, a vacuum pump 34 connected to the air pipe 33, a sensor 35 provided on the air pipe 33, and a nitrogen gas supply line 36.

The pressure plate 1 is provided with an air flow channel 13 penetrating through the pressure plate 1 in the thickness direction, wherein an outer side port of the air flow channel 13 is in butt joint with the first joint 31, an inner side port is communicated with the first cavity q 1, the inner side port is arranged close to the top of the first cavity q 1, and the outer side port is positioned below the inner side port; the second connector 32 is disposed at the top opening of the wetting tank a, and when the wafer carrier J is inserted into the wetting tank a from top to bottom, the second connector 32 is in butt joint with the gas port at the top of the wafer carrier J to be communicated with the second cavity q2, and the butt joint manner can be any conventional connection structure, for example, a vacuum gas nozzle and a cylinder are disposed on the second connector 32, wherein the cylinder drives the vacuum gas nozzle to be capable of stretching out and into and out, when the wafer carrier J is inserted into the wetting tank a from top to bottom, the cylinder drives the vacuum gas nozzle to extend out and butt joint with the gas port at the top of the wafer carrier J, and the cylinder drives the vacuum gas nozzle to shrink to be separated from the gas port at the top of the wafer carrier J.

A monitoring cavity q3 is formed in the sensor 35, a nitrogen supply pipeline 36 is communicated with the monitoring cavity q3, and when liquid is supplied, the nitrogen supply pipeline 36 does not work, the wetting liquid in the first cavity q 1 enters the monitoring cavity q3 through the air pipe 33, and the liquid supply unit D stops supplying liquid; during draining, nitrogen gas is blown into the monitoring chamber q3 by the nitrogen gas supply line 36 to drive the wetting fluid in the monitoring chamber q3 into the wetting tank a through the gas pipe 33 for draining.

In this example, the liquid supply unit D is connected to the first cavity q 1, and is configured to convey the wetting liquid into the first cavity q 1, when the liquid is discharged, the platen 1 is separated from the wafer Y, and the wetting liquid between the platen 1 and the wafer Y passes through the bottom opening of the wetting tank a downward and enters the liquid discharge tank B to be discharged.

Specifically, a liquid supply channel 14 penetrating the pressure plate in the thickness direction is formed at the lower part of the pressure plate 1, wherein an inner side port of the liquid supply channel 14 is close to the bottom of the first cavity q 1 and is communicated with the first cavity q 1, and an outer side port of the liquid supply channel 14 is positioned above the inner side port; the liquid supply unit D includes a third joint D3 that interfaces with an outer port of the liquid supply passage 14, a liquid supply pipe D4 that communicates with the third joint D3, a degassing part D5 provided on the liquid supply pipe D4, and a water source.

For further convenience of implementation, the chassis 20 is an annular tray body, wherein notches are formed at the top and bottom of the chassis 20; the first joint 31 is provided with an upper connecting end part and a lower connecting end part, wherein the upper connecting end part is higher than the top part of the chassis 20 and is connected with the pressure plate 1, the lower connecting end part passes through the notch and is connected with the pressure plate 1, and when the vacuum unit is assembled, the top part of the chassis 20 can be fixed between the upper connecting end part and the lower connecting end part so that each layer of the vacuum unit is compact and stable; meanwhile, a first passage 311 extending horizontally and communicating with the outer side port of the air flow passage 13, a second passage 312 extending vertically upward from the first passage 311, and an air pipe communicating with the upper end of the second passage 312 are formed in the first joint 31. The third connector D3 is vertically symmetrical to the first connector 31, and will not be described here. The degassing part D5 is a conventional degassing device. The wetting fluid used in this example was deionized water.

In summary, after the pre-wetting equipment is adopted, firstly, a wafer carrier loaded with a wafer is inserted into a wetting groove, secondly, a pressure plate is driven to move towards the wafer through an adjusting component until a sealing ring is abutted against a conducting ring, so that a first cavity with the size matched with the front surface of the wafer is formed among the wafer, the pressure plate and the sealing ring, and under the working of a vacuum component, a second cavity formed among the first cavity, the wafer and the wafer carrier synchronously and rapidly forms vacuum, then, a liquid supply unit inputs wetting liquid into the first cavity to pre-wet the surface of the wafer, finally, the vacuum component enables the first cavity and the second cavity to recover normal air pressure, and the adjusting component drives the pressure plate to separate from the wafer, and the wetting liquid can rapidly fall into a liquid discharge groove through an opening at the bottom of the wetting groove, so that the pre-wetting operation of the next wafer can be immediately performed. On the other hand, the sealing performance of the vacuum cavity where the wafer wetting surface is positioned can be effectively improved, so that the pre-wetting effect is ensured to meet the production requirement; in the third aspect, the arrangement of the liquid discharge groove and the wetting groove is beneficial to the rapid discharge of wetting liquid in the liquid discharge groove, so that the liquid accumulation is prevented from flowing into the wetting groove; in the fourth aspect, monitoring of the wetting liquid in the first cavity is realized, and the wetting liquid is ensured to fully fill the first cavity so as to ensure the wetting effect; meanwhile, during liquid discharge, the whole discharge of the wetting liquid in the sensor can be ensured by nitrogen so as to prevent false detection; in the fifth aspect, the wafer, the pressure plate and the sealing ring are precisely positioned to ensure that the vacuum area covers the front surface of the wafer; meanwhile, the front side of the wafer is ensured to be stressed uniformly, and deformation is avoided; in the sixth aspect, as the pressure plate and the wafer approach each other, the sealing ring is gradually deformed and extruded into the annular groove, and the clamping force on the sealing ring can be gradually increased by utilizing the narrow notch of the annular groove, so that the stability of the sealing ring is ensured, and the tightness of the edge of the first cavity is effectively improved; meanwhile, the sealing ring is easy and convenient to assemble and disassemble; in the seventh aspect, by arranging the limiting block, the platen is prevented from excessively approaching and contacting the wafer, and the wafer is prevented from being damaged; in the eighth aspect, vacuum is pumped from the top of the first cavity, so that in the process of injecting the wetting liquid into the cavity to perform wetting, the wetting liquid can be prevented from entering the airflow channel; and when nitrogen is filled into the cavity through the airflow channel to remove vacuum, the nitrogen flows from top to bottom, so that the air pressure between the pressure plate and the wafer can be uniformly recovered.

The present invention has been described in detail with the purpose of enabling those skilled in the art to understand the contents of the present invention and to implement the same, but not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims (10)

1. The utility model provides a high-efficient wafer pre-wetting equipment, the wafer compresses tightly and fixes on the wafer carrier through the conducting ring from positive edge, pre-wetting equipment includes the wetting tank, wherein the wetting tank forms uncovered opening for the wafer carrier inserts or takes out from the top the wetting tank, its characterized in that: the wetting groove is opened from the bottom; the pre-wetting equipment further comprises a liquid discharge groove, a vacuum unit and a liquid supply unit, wherein the liquid discharge groove is arranged below the wetting groove and is opened from the top, the vacuum unit comprises a pressure plate, an adjusting part and a vacuum part, the pressure plate is arranged on the inner wall of the wetting groove, the pressure plate is opposite to and is arranged in parallel with a wafer in the wetting groove, and the adjusting part drives the pressure plate to be close to or far away from the wafer; the wafer carrier is provided with a first cavity, a second cavity which is symmetrical to the first cavity is formed between the back surface of the wafer and the wafer carrier, and the vacuum component is respectively communicated with the first cavity and the second cavity and drives the first cavity and the second cavity to synchronously form vacuum or restore normal air pressure from vacuum; the liquid supply unit is communicated with the first cavity and used for conveying wetting liquid into the first cavity, when liquid is discharged, the pressure plate is separated from the wafer, and the wetting liquid between the pressure plate and the wafer downwards passes through the bottom opening of the wetting tank and enters the liquid discharge tank.

2. The Gao Xiaojing round prewetting apparatus of claim 1, wherein: the wetting tank comprises two tank plates arranged side by side at intervals and two side plates respectively connected between two opposite sides of the two tank plates, wherein the two tank plates are respectively erected at the top of the liquid discharge tank from the bottom; the two side plates are respectively provided with a supporting block extending inwards from the bottom, and the wafer carrier is inserted into the wetting groove and supported on the supporting blocks.

3. A Gao Xiaojing round prewetting apparatus as claimed in claim 1 or 2, wherein: the bottom of the liquid draining groove extends obliquely up and down, wherein the wetting groove is arranged close to one end of the liquid draining groove, which is higher than the bottom of the liquid draining groove, and one end of the liquid draining groove, which is lower than the bottom of the liquid draining groove, is provided with a liquid draining pipeline.

4. The Gao Xiaojing round prewetting apparatus of claim 1, wherein: the central lines of the wafer, the pressure plate and the sealing ring are overlapped; the pressure plate is provided with an annular groove, wherein the cross section of the annular groove is in a trapezoid shape with a narrow outside, and the sealing ring is clamped in the annular groove.

5. The Gao Xiaojing round prewetting apparatus of claim 1, wherein: the pressure plate is also provided with a plurality of limiting blocks, wherein the limiting blocks are distributed around the periphery of the sealing ring, and when the first cavity is formed, the limiting blocks synchronously abut against the conducting ring to prevent the pressure plate from approaching the wafer; when the limiting blocks are synchronously abutted against the conducting ring, the distance between the pressure plate and the front surface of the wafer is 8-15 mm.

6. The Gao Xiaojing round prewetting apparatus of claim 1, wherein: the adjusting component comprises a chassis and an air bag, wherein the chassis is arranged on one side of the pressure plate, far away from the wafer, in parallel, the air bag is arranged between the chassis and the pressure plate, the pressure plate synchronously approaches the wafer along with the inflation and the expansion of the air bag, and the pressure plate synchronously keeps away from the wafer along with the deflation and the contraction of the air bag; the adjusting part further comprises a tension spring connected to one side of the pressure plate, which is far away from the wafer, and the tension spring drives the pressure plate to keep a movement trend, which is far away from the wafer, when the air bag is inflated and expanded; the tension springs are multiple, and the tension springs are distributed in a circumferential array around the central line of the pressure plate.

7. The Gao Xiaojing round prewetting apparatus of claim 1, wherein: the vacuum component comprises a first connector connected with the pressure plate and communicated with the first cavity, a second connector connected with the wafer carrier and communicated with the second cavity, an air pipe connected with the first connector and the second connector respectively, and a vacuum pump connected with the air pipe.

8. The Gao Xiaojing round prewetting apparatus of claim 7, wherein: an air flow channel penetrating through the pressure plate in the thickness direction is formed at the upper part of the pressure plate, wherein an outer side port of the air flow channel is in butt joint with the first joint, an inner side port of the air flow channel is communicated with the first cavity, the inner side port is arranged close to the top of the first cavity, and the outer side port is positioned below the inner side port; the second connector is arranged at the top opening of the wetting groove, and when the wafer carrier is inserted into the wetting groove from top to bottom, the second connector is in butt joint with the top of the wafer carrier so as to be communicated with the second cavity.

9. The Gao Xiaojing round prewetting apparatus of claim 7, wherein: the vacuum component further comprises a sensor and a nitrogen supply pipeline which are arranged on the air pipe, wherein a monitoring cavity is formed in the sensor, the nitrogen supply pipeline is communicated with the monitoring cavity, when liquid is supplied, wetting liquid in the first cavity enters the monitoring cavity through the air pipe, and the liquid supply unit stops supplying liquid; during liquid discharge, the nitrogen supply pipeline blows nitrogen into the monitoring cavity so as to drive the wetting liquid in the monitoring cavity to enter the wetting groove through the air pipe and discharge.

10. The Gao Xiaojing round prewetting apparatus of claim 1, wherein: the lower part of the pressure plate is provided with a liquid supply channel penetrating through the pressure plate in the thickness direction, wherein an inner side port of the liquid supply channel is close to the bottom of the first cavity and is communicated with the first cavity, and an outer side port of the liquid supply channel is positioned above the inner side port; the liquid supply unit comprises a third joint in butt joint with the outer side port of the liquid supply channel, a liquid supply pipeline communicated with the third joint, a degassing component arranged on the liquid supply pipeline and a water source.