CN117439565A - Bulk acoustic wave resonance device, forming method thereof, filter device and radio frequency front-end device - Google Patents
Bulk acoustic wave resonance device, forming method thereof, filter device and radio frequency front-end device Download PDFInfo
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- CN117439565A CN117439565A CN202211349092.5A CN202211349092A CN117439565A CN 117439565 A CN117439565 A CN 117439565A CN 202211349092 A CN202211349092 A CN 202211349092A CN 117439565 A CN117439565 A CN 117439565A
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02062—Details relating to the vibration mode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/023—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the membrane type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
A bulk acoustic wave resonance device and a forming method thereof, a filtering device and a radio frequency front end device, wherein the bulk acoustic wave resonance device comprises: a cavity; a first electrode layer having at least one end located over or within the cavity; the piezoelectric layer, the cavity and the first electrode layer are positioned on the first side of the piezoelectric layer; a second electrode layer located on the second side; the first passive structure is positioned on the first side and provided with a first superposition part with at least one edge of the first electrode layer; the second passive structure is positioned on the second side and is provided with a second superposition part with at least one edge of the second electrode layer; the first passive structure includes: a first lifting part positioned at the inner side of the resonance region; a first extension portion located outside the resonance region; a first dielectric layer; the second passive structure includes: a second lifting part positioned at the inner side of the resonance region; second extension part, positionOutside the resonance region; and a second dielectric layer. The invention suppresses parasitic edge modes and improves Z p And the corresponding Q value, and the isolation and reliability of the electrode layer and the passive structure are improved.
Description
The present application claims priority from China patent office, application No. 202210816674.3, entitled "bulk Acoustic wave resonator device and method of Forming the same, filter device and radio frequency front end device", filed on 7/12 of 2022, the contents of which are incorporated herein by reference.
Technical Field
The invention relates to the technical field of semiconductors, in particular to a bulk acoustic wave resonance device, a forming method thereof, a filtering device and a radio frequency front-end device.
Background
A Radio Frequency (RF) front-end chip of a wireless communication device comprising: a Power Amplifier (PA), an antenna switch, an RF filter, a multiplexer (multiplexer) including a duplexer (doubler), a low noise Amplifier (Low Noise Amplifier, LNA), and the like. Among other things, RF filters include piezoelectric surface acoustic wave (Surface Acoustic Wave, SAW) filters, piezoelectric bulk acoustic wave (Bulk Acoustic Wave, BAW) filters, microelectromechanical system (Micro-Electro-Mechanical System, MEMS) filters, integrated passive device (Integrated Passive Devices, IPD) filters, and the like.
The SAW resonator and the BAW resonator have high quality factor values (Q values), and are manufactured into RF filters with low insertion loss (insertion loss) and high out-of-band rejection (out-band rejection), that is, SAW filters and BAW filters, which are mainstream RF filters currently used in wireless communication devices such as mobile phones and base stations. Where the Q value is the quality factor value of the resonator, defined as the center frequency divided by the resonator 3dB bandwidth. SAW filters are typically used at frequencies from 0.4GHz to 2.7GHz and baw filters are typically used at frequencies from 0.7GHz to 7GHz.
As wireless communication technology evolves gradually, the frequency bands used are more and more, and meanwhile, with the application of frequency band superposition using technology such as carrier aggregation, mutual interference between wireless frequency bands becomes more and more serious. High performance BAW techniques can solve the problem of inter-band interference. With the advent of the 5G era, wireless mobile networks introduced higher communication frequency bands, and only BAW technology can solve the problem of filtering in the high frequency bands.
Fig. 1 shows a circuit of a BAW filter, comprising a ladder circuit of a plurality of BAW resonators, a first end of the circuit being connected to a receiving transmit end, and a second end of the circuit being connected to an antenna, wherein f1, f2, f3, f4 respectively represent 4 different frequencies. In each BAW resonator, metal electrodes on two sides of a piezoelectric layer of the resonator generate alternating positive and negative voltages, the piezoelectric layer generates sound waves through the alternating positive and negative voltages, and the sound waves in the resonator vertically propagate along the thickness direction of the piezoelectric layer. To form resonance, the acoustic wave needs to be totally reflected at the upper surface of the upper metal electrode and the lower surface of the lower metal electrode to form a standing acoustic wave. The condition of the reflection of the sound wave is that the acoustic impedance of the area contacting the upper surface of the upper metal electrode and the lower surface of the lower metal electrode is greatly different from that of the metal electrode.
The performance of the RF filter depends on the performance of the resonator, which is determined by the minimum series impedance (Z) of the resonator s Maximum parallel impedance (parallel impedance) Z p Electromechanical coupling coefficient (electromechanical couplingfactor) Kt 2 Isoparametric representation, wherein Z s And Z p Representing electrical losses in the resonator, such as thermal losses, acoustic losses, etc. The resonator operating at a series resonant frequency f s When the input impedance is minimum, Z is reached s The method comprises the steps of carrying out a first treatment on the surface of the The resonator operating at a parallel resonant frequency f p At the maximum value of input impedance, Z is reached p . Electromechanical coupling coefficient Kt 2 Representing Z s And Z is p The frequency difference between them affects the passband (passband) bandwidth of the RF filter. Has higher Kt 2 Or Z is p Lower Z s The performance of the resonator is better. Those skilled in the art know that resonator design needs to be at Kt 2 And Z is p The trade-offs are made, i.e. the Kt is raised 2 At the same time reduce Z p Lifting Z p At the same time reduce Kt 2 。
A thin film bulk acoustic resonator (Film Bulk Acoustic Wave Resonator, FBAR) is a BAW resonator that can localize acoustic energy within the device, with a cavity above the resonating region of the resonator being vacuum or air and below the resonating region, because the acoustic impedance of the vacuum or air differs significantly from that of the metal electrodes, the acoustic waves can reflect off the upper surface of the upper metal electrode and the lower surface of the lower metal electrode, forming standing waves.
Fig. 2 shows a schematic structural diagram of an FBAR 200. The FBAR 200 includes: a substrate 201; a cavity 203 embedded in the substrate 201; a first electrode layer 205 (i.e., a lower electrode layer) on the substrate 201 and the cavity 203, covering the cavity 203; a piezoelectric layer 207 on the first electrode layer 205; and a second electrode layer 209 (i.e., an upper electrode layer) on the piezoelectric layer 207; the overlapping area of the first electrode layer 205, the piezoelectric layer 207, and the second electrode layer 209 is a resonance area of the FBAR 200. Two sets of acoustic waves are generated in the resonance region, the first set of acoustic waves comprises a compression wave (longitudinal wave) and a shear wave (shear wave) which propagate along a direction perpendicular to the piezoelectric layer 207, the second set of acoustic waves comprises an acoustic wave which propagates towards the lateral edge of the piezoelectric layer 207, wherein the acoustic wave comprises a Rayleigh-Lamb wave (RL wave) which propagates along the lateral surfaces of the two electrode layers to the lateral edge of the piezoelectric layer 207, and is excited at the edge to generate parasitic edge modes (spurious lateral mode), parasitic resonance is generated, thereby reducing Z p And a corresponding Q value.
Disclosure of Invention
The invention solves the problem of providing a bulk acoustic wave resonance device, a forming method thereof, a filtering device and a radio frequency front end device, and inhibiting parasitic edge modes and improving Z by attenuating transversely-propagating acoustic waves generated by a resonance region p And corresponding Q value, at the same time to Kt 2 Less impact, and increased isolation and reliability between the passive structure and the corresponding electrode layer.
In order to solve the above problems, the present invention provides a bulk acoustic wave resonator device, including: a cavity; a first electrode layer, at least one end of the first electrode layer being located over or within the cavity; a piezoelectric layer including a first side and a second side opposite to the first side in a vertical direction, the cavity being located at the first side, the first electrode layer contacting the piezoelectric layer; the second electrode layer is positioned on the second side and is contacted with the piezoelectric layer, and a region where the first electrode layer, the second electrode layer and the piezoelectric layer are overlapped is a resonance region; the first passive structure is positioned on the first side and provided with a first superposition part with at least one edge of the first electrode layer; a second passive structure located on the second side and having a second overlapping portion with at least one edge of the second electrode layer; wherein the first passive structure comprises: a first lifting part, which is positioned at the inner side of the resonance region and is provided with the first superposition part with at least one edge of the first electrode layer, wherein the first lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region at the outer side of the resonance region so that more sound waves generated in the resonance region enter at least one attenuation region; a first dielectric portion between the first raised portion and the first electrode layer for electrically isolating the first electrode layer from the first passive structure; a first extension located outside the resonance region and within at least one of the attenuation regions for attenuating sound waves entering the at least one attenuation region, the first lift-up portion being raised relative to the first extension; a first dielectric layer located on the first side, located between the first dielectric portion and the first lifting portion, and in contact with the first dielectric portion and the first lifting portion, respectively; the second passive structure includes: the second lifting part is positioned at the inner side of the resonance region and provided with a second merging part with at least one edge of the second electrode layer, and the second lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region so that more sound waves generated in the resonance region enter the at least one attenuation region; a second dielectric portion between the second raised portion and the second electrode layer for electrically isolating the second electrode layer from the second passive structure; a second extension located outside the resonance region and located in at least one of the attenuation regions, for attenuating sound waves entering at least one of the attenuation regions, the second raised portion being raised relative to the second extension; and a second dielectric layer positioned on the second side, positioned between the second dielectric part and the second lifting part, and respectively contacted with the second dielectric part and the second lifting part.
Optionally, the first passive structure and the second passive structure enclose the resonant area.
Optionally, the thickness of the first passive structure is equal to or less than the thickness of the first electrode layer, and the thickness of the second passive structure is equal to or less than the thickness of the second electrode layer.
Optionally, at least one of the attenuation regions includes a first attenuation region, a first cut-off frequency of the first attenuation region is equal to or smaller than a cut-off frequency of the resonance region, and the first attenuation region corresponds to a superposition area of the first extension portion, the piezoelectric layer and the second extension portion.
Optionally, the method further comprises: the first electrode extension layer is positioned on the first side and connected with the first electrode layer; and the second electrode extension layer is positioned on the second side and connected with the second electrode layer.
Optionally, at least one of the attenuation regions includes a second attenuation region, a second cut-off frequency of the second attenuation region is equal to or smaller than a cut-off frequency of the resonance region, and the second attenuation region corresponds to a superposition area of the second electrode extension layer, the piezoelectric layer and the first extension portion.
Optionally, at least one of the attenuation regions includes a third attenuation region, a third cutoff frequency of the third attenuation region is equal to or less than a cutoff frequency of the resonance region, and the third attenuation region corresponds to a superposition area of the second extension, the piezoelectric layer and the first electrode extension.
Optionally, at least one edge of the first electrode layer is in a downhill shape, corresponding to the first passive structure, and at least one edge of the second electrode layer is in a downhill shape, corresponding to the second passive structure.
Optionally, the width of the first lifting part is an integer multiple of one half wavelength of the sound wave generated in the resonance area, and the width of the second lifting part is an integer multiple of one half wavelength of the sound wave generated in the resonance area.
Optionally, the thickness of the first extension is smaller than the thickness of the first electrode layer, and the thickness of the second extension is smaller than the thickness of the second electrode layer.
Optionally, the first extension portion includes a first sub-portion and a second sub-portion, the second sub-portion and the piezoelectric layer are located at two sides of the first sub-portion, and a material of the first sub-portion is different from a material of the second sub-portion.
Optionally, the second extension portion includes a third sub-portion and a fourth sub-portion, the piezoelectric layer and the fourth sub-portion are located at two sides of the third sub-portion, and a material of the third sub-portion is different from a material of the fourth sub-portion.
Optionally, the first extension contacts the piezoelectric layer and the second extension contacts the piezoelectric layer.
Optionally, the first dielectric portion is further located between the piezoelectric layer and the first extension portion, and the second dielectric portion is further located between the piezoelectric layer and the second extension portion.
Optionally, a first empty slot is included between the first extension and the piezoelectric layer, and a second empty slot is included between the piezoelectric layer and the second extension.
Optionally, the first dielectric layer is further located between the first dielectric portion and the first extension portion, and the first dielectric layer is in contact with the first extension portion.
Optionally, the second dielectric layer is further located between the second dielectric portion and the second extension portion, and the second dielectric layer is in contact with the second extension portion.
Optionally, the material of the first dielectric layer is different from the material of the first dielectric portion; the material of the first dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide; the material of the second dielectric layer is different from the material of the second dielectric part; the material of the second dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide.
Optionally, the method further comprises: a third dielectric portion located on the second side and in contact with the second electrode layer; and a surrounding groove which is positioned in the third dielectric part, positioned inside the resonance area, positioned inside the second lifting part and adjacent to the second lifting part.
Optionally, the shape of the surrounding groove includes: circular, elliptical or polygonal.
Optionally, the method further comprises: a third dielectric portion located on the first side and in contact with the first electrode layer; and a surrounding groove which is positioned in the third dielectric part, positioned inside the resonance area, positioned inside the first lifting part and adjacent to the first lifting part.
Optionally, the shape of the surrounding groove includes: circular, elliptical or polygonal.
Correspondingly, the technical scheme of the invention also provides a filtering device, which comprises: at least one bulk acoustic wave resonator device as claimed in any one of the preceding claims.
Correspondingly, the technical scheme of the invention also provides a radio frequency front-end device, which comprises: a power amplifying device and at least one filtering device as described above; the power amplifying device is connected with the filtering device.
Correspondingly, the technical scheme of the invention also provides a radio frequency front-end device, which comprises: a low noise amplifying device and at least one filtering device as described above; the low noise amplifying device is connected with the filtering device.
Correspondingly, the technical scheme of the invention also provides a radio frequency front-end device, which comprises: multiplexing means comprising at least one filtering means as described above.
Correspondingly, the invention also provides a method for forming the bulk acoustic wave resonance device, which comprises the following steps: forming a piezoelectric layer, wherein the piezoelectric layer comprises a first side and a second side opposite to the first side in the vertical direction; forming a first electrode layer on the first side in contact with the piezoelectric layer; forming a second electrode layer positioned on the second side and contacting the piezoelectric layer, wherein the overlapping area of the first electrode layer, the second electrode layer and the piezoelectric layer is a resonance area; forming a first passive structure, which is positioned on the first side and has a first overlapping part with at least one edge of the first electrode layer; wherein the first passive structure comprises: a first raised portion, a first extension portion, a first dielectric portion, and a first dielectric layer, the first raised portion protruding relative to the first extension portion; the first lifting part is positioned at the inner side of the resonance region and provided with the first superposition part with at least one edge of the first electrode layer, and the first lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region at the outer side of the resonance region so that more sound waves generated in the resonance region enter at least one attenuation region; the first dielectric part is positioned between the first lifting part and the first electrode layer and is used for electrically isolating the first electrode layer from the first passive structure; the first extension part is positioned outside the resonance region and in at least one attenuation region and used for attenuating sound waves entering the at least one attenuation region; the first dielectric layer is positioned on the first side, positioned between the first dielectric part and the first lifting part, and respectively contacted with the first dielectric part and the first lifting part; forming a second passive structure on the second side, having a second overlap with at least one edge of the second electrode layer, wherein the second passive structure comprises: a second raised portion, a second extension portion, a second dielectric portion, and a second dielectric layer, the second raised portion protruding relative to the second extension portion; the second lifting part is positioned at the inner side of the resonance region and provided with the second overlapping part with at least one edge of the second electrode layer, and the second lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region so that more sound waves generated in the resonance region enter the at least one attenuation region; the second dielectric part is positioned between the second lifting part and the second electrode layer and is used for electrically isolating the second electrode layer from the second passive structure; the second extension part is positioned outside the resonance region and in at least one attenuation region and used for attenuating sound waves entering the at least one attenuation region; the second dielectric layer is located on the second side, located between the second dielectric portion and the second raised portion, and in contact with the second dielectric portion and the second raised portion, respectively.
Optionally, the first passive structure and the second passive structure enclose the resonant area.
Optionally, the thickness of the first passive structure is equal to or less than the thickness of the first electrode layer, and the thickness of the second passive structure is equal to or less than the thickness of the second electrode layer.
Optionally, forming the first electrode layer includes forming at least one downhill edge corresponding to the first passive structure, and forming the second electrode layer includes forming at least one downhill edge corresponding to the second passive structure.
Optionally, forming the first passive structure includes forming a first passivation layer on the first side, covering the first electrode layer; forming a first overlap layer in contact with the first passivation layer, wherein at least one edge of the first overlap layer and at least one edge of the first electrode layer are provided with the first overlapping part; wherein the first passivation layer includes the first dielectric portion; wherein the first overlap layer includes the first raised portion and the first extension portion.
Optionally, forming the second passive structure includes forming a second passivation layer on the second side, covering the second electrode layer; forming a second overlap layer in contact with the second passivation layer, at least one edge of the second overlap layer and the second electrode layer having the second overlap portion; wherein the second passivation layer includes the second dielectric portion; wherein the second overlap layer includes the second raised portion and the second extension portion.
Optionally, the thickness of the first extension is smaller than the thickness of the first electrode layer, and the thickness of the second extension is smaller than the thickness of the second electrode layer.
Optionally, at least one of the attenuation regions includes a first attenuation region, a first cut-off frequency of the first attenuation region is equal to or smaller than a cut-off frequency of the resonance region, and the first attenuation region corresponds to a superposition area of the first extension portion, the piezoelectric layer and the second extension portion.
Optionally, the method further comprises: forming a first electrode extension layer positioned on the first side and connected with the first electrode layer; and forming a second electrode extension layer positioned on the second side and connected with the second electrode layer.
Optionally, at least one of the attenuation regions includes a second attenuation region, a second cut-off frequency of the second attenuation region is equal to or smaller than a cut-off frequency of the resonance region, and the second attenuation region corresponds to a superposition area of the second electrode extension layer, the piezoelectric layer and the first extension portion.
Optionally, at least one of the attenuation regions includes a third attenuation region, a third cutoff frequency of the third attenuation region is equal to or less than a cutoff frequency of the resonance region, and the third attenuation region corresponds to a superposition area of the second extension, the piezoelectric layer and the first electrode extension.
Optionally, the width of the first lifting part is an integer multiple of one half wavelength of the sound wave generated in the resonance area, and the width of the second lifting part is an integer multiple of one half wavelength of the sound wave generated in the resonance area.
Optionally, forming the first overlap layer includes; and forming a first bonding sub-layer and a second bonding sub-layer, wherein the second bonding sub-layer and the piezoelectric layer are positioned on two sides of the first bonding sub-layer, and the material of the first bonding sub-layer is different from the material of the second bonding sub-layer.
Optionally, forming the second overlap layer includes; and forming a third bonding sub-layer and a fourth bonding sub-layer, wherein the fourth bonding sub-layer and the piezoelectric layer are positioned on two sides of the third bonding sub-layer, and the material of the third bonding sub-layer is different from the material of the fourth bonding sub-layer.
Optionally, the method further comprises: forming a first sacrificial layer between the first extension and the piezoelectric layer; a second sacrificial layer is formed between the second extension and the piezoelectric layer.
Optionally, the method further comprises: removing the first sacrificial layer to form a first empty slot which is positioned between the first extension part and the piezoelectric layer; and removing the second sacrificial layer to form a second empty slot which is positioned between the second extension part and the piezoelectric layer.
Optionally, the first dielectric layer is further located between the first dielectric portion and the first extension portion, and the first dielectric layer is in contact with the first extension portion.
Optionally, the second dielectric layer is further located between the second dielectric portion and the second extension portion, and the second dielectric layer is in contact with the second extension portion.
Optionally, the material of the first dielectric layer is different from the material of the first dielectric portion; the material of the first dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide; the material of the second dielectric layer is different from the material of the second dielectric part; the material of the second dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide.
Optionally, the method further comprises: forming a third dielectric portion on the second side and in contact with the second electrode layer; a surrounding groove is formed in the third dielectric portion, inside the resonance region, inside the second raised portion, and adjacent to the second raised portion.
Optionally, the shape of the surrounding groove includes: circular, elliptical or polygonal.
Optionally, the method further comprises: forming a third dielectric portion on the first side and in contact with the first electrode layer; a surrounding groove is formed in the third dielectric portion, inside the resonance region, inside the first raised portion, and adjacent to the first raised portion.
Optionally, the shape of the surrounding groove includes: circular, elliptical or polygonal.
Compared with the prior art, the technical scheme of the invention has the following advantages:
in the bulk acoustic wave resonator device according to the technical scheme of the invention, the first lifting part of the first passive structure is positioned at the inner side of the resonance region and is provided with the superposition part with the first electrode layer, the second lifting part of the second passive structure is positioned at the inner side of the resonance region and is provided with the superposition part with the second electrode layer, and acoustic impedances of the resonance region and an attenuation region (evanescent region) at the outer side of the resonance region can be matched, so that more acoustic waves generated by the resonance region are transmitted into the attenuation region. In addition, the cut-off frequency (cutoff frequency) of the attenuation region is matched (for example, equal to or smaller than) that of the resonance region, so that the acoustic wave entering the attenuation region can be attenuated, parasitic edge modes can be suppressed, and Z is improved p And a corresponding Q value. The cutoff frequency is a frequency corresponding to a wave number (wave number) of 0 on a dispersion curve (dispersion curve). Furthermore, the first passive structure is not electrically connected to the first electrode layer, and the second passive structure is not electrically connected to the second electrode layer, so that the first passive structure and the second passive structure have a pair Kt 2 The influence of (a) is small, so that the performance of the filter device including the bulk acoustic wave resonator device, such as insertion loss, out-of-band rejection, can be improved.
In addition, since the first dielectric layer and the second dielectric layer are both insulating materials, isolation and reliability between the first electrode layer and the first passive structure can be effectively improved through the first dielectric layer, and isolation and reliability between the second electrode layer and the second passive structure can be effectively improved through the second dielectric layer.
Further, the material of the first dielectric layer is different from the material of the first dielectric portion, a wet etching process can be adopted in the process of forming the first dielectric layer, the etching rate of the used etching solution on the first dielectric layer is larger than that on the first dielectric portion, and therefore the first dielectric portion is less damaged in the process of forming the first dielectric layer, and reliability and yield of products are improved. The material of the second dielectric layer is different from the material of the second dielectric portion, a wet etching process can be adopted in the process of forming the second dielectric layer, and the etching rate of the used etching solution on the second dielectric layer is larger than that on the second dielectric portion, so that the second dielectric portion is less damaged in the process of forming the second dielectric layer, and the reliability and the yield of products are improved.
Further, the method further comprises the following steps: a third dielectric portion in contact with the electrode layer; and a surrounding groove located in the third dielectric portion, located inside the resonance region, located inside the lifting portion, and adjacent to the lifting portion. By adding the surrounding type groove inside the resonance region, a first segment region constituted by the surrounding type groove and a second segment region constituted by the raised portion. By setting the cut-off frequency of the first section area to be larger than that of the middle part of the resonance area inside the surrounding type groove, the cut-off frequency of the second section area is smaller than that of the middle part, a piston mode (piston mode) is formed, high-order parasitic modes of transverse sound waves are restrained, and the series resonance frequency (f) is reduced s ) Near and less than f s Is not shown).
In the method for forming a bulk acoustic wave resonator according to the aspect of the present invention, the first raised portion of the first passive structure is formed to have a portion overlapping the first electrode layer inside the resonance regionThe second raised portion of the second passive structure is located inside the resonance region and has an overlapping portion with the second electrode layer, and acoustic impedances of the resonance region and an attenuation region (evanescent region) outside the resonance region can be matched, so that more sound waves generated by the resonance region propagate into the attenuation region. In addition, the cut-off frequency (cutoff frequency) of the attenuation region is matched (for example, equal to or smaller than) that of the resonance region, so that the acoustic wave entering the attenuation region can be attenuated, parasitic edge modes can be suppressed, and Z is improved p And a corresponding Q value. The cutoff frequency is a frequency corresponding to a wave number (wave number) of 0 on a dispersion curve (dispersion curve). Furthermore, the first passive structure is not electrically connected to the first electrode layer, and the second passive structure is not electrically connected to the second electrode layer, so that the first passive structure and the second passive structure have a pair Kt 2 The influence of (a) is small, so that the performance of the filter device including the bulk acoustic wave resonator device, such as insertion loss, out-of-band rejection, can be improved.
In addition, since the first dielectric layer and the second dielectric layer are both insulating materials, isolation and reliability between the first electrode layer and the first passive structure can be effectively improved through the first dielectric layer, and isolation and reliability between the second electrode layer and the second passive structure can be effectively improved through the second dielectric layer.
Further, the material of the first dielectric layer is different from the material of the first dielectric portion, a wet etching process can be adopted in the process of forming the first dielectric layer, the etching rate of the used etching solution on the first dielectric layer is larger than that on the first dielectric portion, and therefore the first dielectric portion is less damaged in the process of forming the first dielectric layer, and reliability and yield of products are improved. The material of the second dielectric layer is different from the material of the second dielectric portion, a wet etching process can be adopted in the process of forming the second dielectric layer, and the etching rate of the used etching solution on the second dielectric layer is larger than that on the second dielectric portion, so that the second dielectric portion is less damaged in the process of forming the second dielectric layer, and the reliability and the yield of products are improved.
Further, the method further comprises the following steps: forming a third dielectric portion in contact with the electrode layer; and forming a surrounding groove in the third dielectric part, inside the resonance region, inside the lifting part and adjacent to the lifting part. By adding the surrounding type groove inside the resonance region, a first segment region constituted by the surrounding type groove and a second segment region constituted by the raised portion. By setting the cut-off frequency of the first section area to be larger than that of the middle part of the resonance area inside the surrounding type groove, the cut-off frequency of the second section area is smaller than that of the middle part, a piston mode (piston mode) is formed, high-order parasitic modes of transverse sound waves are restrained, and the series resonance frequency (f) is reduced s ) Near and less than f s Is not shown).
Drawings
FIG. 1 is a schematic diagram of a bulk acoustic wave filter circuit;
fig. 2 is a schematic structural diagram of an FBAR 200;
fig. 3 to 6 are schematic structural views of a bulk acoustic wave resonator device 3000 according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a hexagonal crystal grain structure;
FIG. 8 (i) is a schematic diagram of the structure of an orthorhombic grain;
FIG. 8 (ii) is a schematic structural view of a tetragonal crystal grain;
FIG. 8 (iii) is a schematic diagram of the structure of a cubic grain system;
FIG. 9 is a graph 600 illustrating the dispersion of sound waves in a bulk acoustic wave resonator device according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of a parallel impedance curve 700 of a bulk acoustic wave resonator device according to an embodiment of the present invention;
fig. 11 to 14 are schematic structural views of a bulk acoustic wave resonator device 3000 according to another embodiment of the present invention;
FIG. 15 is a schematic view of an acoustic dispersion curve of a bulk acoustic wave resonator device according to an embodiment of the present invention;
fig. 16 is a schematic view of a first cross-sectional structure of a bulk acoustic wave resonator device 3000 and a schematic view of sound velocity distribution in a corresponding region according to another embodiment of the present invention;
fig. 17 and 18 are schematic structural views of a bulk acoustic wave resonator device 3000 according to another embodiment of the present invention;
fig. 19 is a schematic view of a first cross-sectional structure of a bulk acoustic wave resonator device 3000 and a schematic view of sound velocity distribution in a corresponding region according to another embodiment of the present invention;
fig. 20 is a schematic diagram of a wireless communication device 900;
fig. 21 is a schematic flow chart of a method 1000 for forming a bulk acoustic wave resonator according to an embodiment of the present invention;
fig. 22 to 25 are schematic cross-sectional a structural views of a method for forming a bulk acoustic wave resonator device 1100 according to an embodiment of the present invention;
Fig. 26 is a schematic cross-sectional a structure of a method for forming a bulk acoustic wave resonator device 1100 according to another embodiment of the present invention;
fig. 27 and 28 are schematic cross-sectional a structural views of a method for forming a bulk acoustic wave resonator device 1100 according to another embodiment of the present invention;
fig. 29 to 32 are schematic cross-sectional a structural views of a method of forming a bulk acoustic wave resonator device 1200 according to an embodiment of the present invention;
fig. 33 is a schematic cross-sectional a structure diagram of a method for forming a bulk acoustic wave resonator device 1200 according to another embodiment of the present invention;
fig. 34 and 35 are schematic cross-sectional a structural views of a method for forming a bulk acoustic wave resonator device 1200 according to another embodiment of the present invention;
FIG. 36 is a schematic diagram of a comparison of two series admittance curves.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than as described herein, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, the acoustic wave generated in the resonance region propagates along the side surfaces of the two electrode layers to the lateral edges of the piezoelectric layer, and excites at the edges to generate parasitic edge modes, thereby generating parasitic resonance, thereby reducing Z p And a corresponding Q value.
The inventor of the invention finds that the lifting part of the passive structure is positioned at the inner side of the resonance region and has an overlapped part with the electrode layer, and can match acoustic impedances of the resonance region and the attenuation region at the outer side of the resonance region, so that more sound waves generated by the resonance region are transmitted into the attenuation region. In addition, the cut-off frequency of the attenuation region is matched with (for example, equal to or smaller than) the cut-off frequency of the resonance region, so that the sound waves entering the attenuation region can be attenuated, parasitic edge modes are suppressed, and Z is improved p And a corresponding Q value. Furthermore, the passive structure is not electrically connected to the electrode layer, so the passive structure has a specific resistance to Kt 2 Less of an effect of (a) is present.
In order to solve the above problems, an embodiment of the present invention provides a bulk acoustic wave resonator device including: a cavity; a first electrode layer, at least one end of the first electrode layer being located over or within the cavity; a piezoelectric layer including a first side and a second side opposite to the first side in a vertical direction, the cavity being located at the first side, the first electrode layer contacting the piezoelectric layer; the second electrode layer is positioned on the second side and is contacted with the piezoelectric layer, and a region where the first electrode layer, the second electrode layer and the piezoelectric layer are overlapped is a resonance region; the first passive structure is positioned on the first side and provided with a first superposition part with at least one edge of the first electrode layer; a second passive structure located on the second side and having a second overlapping portion with at least one edge of the second electrode layer;
Wherein the first passive structure comprises: a first lifting part, which is positioned at the inner side of the resonance region and is provided with the first superposition part with at least one edge of the first electrode layer, wherein the first lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region at the outer side of the resonance region so that more sound waves generated in the resonance region enter the at least one attenuation region; a first dielectric portion between the first raised portion and the first electrode layer for electrically isolating the first electrode layer from the first passive structure; a first extension located outside the resonance region and within the at least one attenuation region for attenuating sound waves entering the at least one attenuation region, the first elevation protruding relative to the first extension; a first dielectric layer located on the first side, located between the first dielectric portion and the first lifting portion, and in contact with the first dielectric portion and the first lifting portion, respectively;
wherein the second passive structure comprises: the second lifting part is positioned at the inner side of the resonance region and provided with the second merging part with at least one edge of the second electrode layer, and the second lifting part is used for matching acoustic impedances of the resonance region and the at least one attenuation region so that more sound waves generated in the resonance region enter the at least one attenuation region; a second dielectric portion between the second raised portion and the second electrode layer for electrically isolating the second electrode layer from the second passive structure; a second extension located outside the resonance region and within the at least one attenuation region for attenuating sound waves entering the at least one attenuation region, the second elevation protruding relative to the second extension; and a second dielectric layer positioned on the second side, positioned between the second dielectric part and the second lifting part, and respectively contacted with the second dielectric part and the second lifting part.
In some embodiments, the first passive structure and the second passive structure surround the resonant area.
In some embodiments, the thickness of the first passive structure is equal to or less than the thickness of the first electrode layer, and the thickness of the second passive structure is equal to or less than the thickness of the second electrode layer.
In some embodiments, the at least one attenuation region includes a first attenuation region having a first cut-off frequency equal to or less than a cut-off frequency of the resonant region, the first attenuation region corresponding to a region of coincidence of the first extension, the piezoelectric layer, and the second extension.
In some embodiments, the bulk acoustic wave resonator device further comprises: the first electrode extension layer is positioned on the first side and connected with the first electrode layer; and the second electrode extension layer is positioned on the second side and connected with the second electrode layer.
In some embodiments, the at least one attenuation region includes a second attenuation region having a second cutoff frequency equal to or less than a cutoff frequency of the resonant region, the second attenuation region corresponding to a region of coincidence of the second electrode extension layer, the piezoelectric layer, and the first extension.
In some embodiments, the at least one attenuation region includes a third attenuation region having a third cutoff frequency equal to or less than a cutoff frequency of the resonant region, the third attenuation region corresponding to a region of overlap of the second extension, the piezoelectric layer, and the first electrode extension.
In some embodiments, at least one edge of the first electrode layer is downhill shaped corresponding to the first passive structure and at least one edge of the second electrode layer is downhill shaped corresponding to the second passive structure.
In some embodiments, the width of the first raised portion is an integer multiple of one-half wavelength of sound waves generated within the resonance region, and the width of the second raised portion is an integer multiple of one-half wavelength of sound waves generated within the resonance region.
In some embodiments, the thickness of the first extension is less than the thickness of the first electrode layer, and the thickness of the second extension is less than the thickness of the second electrode layer.
In some embodiments, the first extension includes a first sub-portion and a second sub-portion, the second sub-portion and the piezoelectric layer being located on both sides of the first sub-portion, the first sub-portion being of a different material than the second sub-portion.
In some embodiments, the second extension includes a third sub-portion and a fourth sub-portion, the piezoelectric layer and the fourth sub-portion being located on opposite sides of the third sub-portion, the third sub-portion being of a different material than the fourth sub-portion.
In some embodiments, the first extension contacts the piezoelectric layer and the second extension contacts the piezoelectric layer.
In some embodiments, the first dielectric portion is also located between the piezoelectric layer and the first extension, and the second dielectric portion is also located between the piezoelectric layer and the second extension.
In some embodiments, a first void is included between the first extension and the piezoelectric layer, and a second void is included between the piezoelectric layer and the second extension.
In some embodiments, the first dielectric layer is also located between the first dielectric portion and the first extension, and the first dielectric layer is in contact with the first extension.
In some embodiments, the second dielectric layer is also located between the second dielectric portion and the second extension, and the second dielectric layer is in contact with the second extension.
In some embodiments, the material of the first dielectric layer is different from the material of the first dielectric portion; the material of the first dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide; the material of the second dielectric layer is different from the material of the second dielectric part; the material of the second dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide.
In some embodiments, further comprising: a third dielectric portion located on the second side and in contact with the second electrode layer; and a surrounding groove which is positioned in the third dielectric part, positioned inside the resonance area, positioned inside the second lifting part and adjacent to the second lifting part.
In some embodiments, the shape of the circumferential groove comprises: circular, elliptical or polygonal.
In some embodiments, further comprising: a third dielectric portion located on the first side and in contact with the first electrode layer; and a surrounding groove which is positioned in the third dielectric part, positioned inside the resonance area, positioned inside the first lifting part and adjacent to the first lifting part.
In some embodiments, the shape of the circumferential groove comprises: circular, elliptical or polygonal.
The first lifting part of the first passive structure is positioned at the inner side of the resonance region and has an overlapping part with the first electrode layer, the second lifting part of the second passive structure is positioned at the inner side of the resonance region and has an overlapping part with the second electrode layer, and acoustic impedances of the resonance region and an attenuation region (evanescent region) at the outer side of the resonance region can be matched, so that more acoustic waves generated by the resonance region propagate into the attenuation region. In addition, the cut-off frequency (cutoff frequency) of the attenuation region is matched (for example, equal to or smaller than) that of the resonance region, so that the acoustic wave entering the attenuation region can be attenuated, parasitic edge modes can be suppressed, and Z is improved p And a corresponding Q value. The cutoff frequency is a frequency corresponding to a wave number (wave number) of 0 on a dispersion curve (dispersion curve). Furthermore, the first passive structure is not electrically connected to the first electrode layer, and the second passive structure is not electrically connected to the second electrode layer, so that the first passive structure and the second passive structure have a pair Kt 2 The influence of (a) is small, so that the performance of the filter device including the bulk acoustic wave resonator device, such as insertion loss, out-of-band rejection, can be improved.
In addition, since the first dielectric layer and the second dielectric layer are both insulating materials, isolation and reliability between the first electrode layer and the first passive structure can be effectively improved through the first dielectric layer, and isolation and reliability between the second electrode layer and the second passive structure can be effectively improved through the second dielectric layer.
Fig. 3 to 6 show one embodiment of the bulk acoustic wave resonator device of the present invention, but the present invention can be implemented in other ways than described herein, and thus the present invention is not limited by the embodiments disclosed below. Wherein fig. 3 is a schematic view of a first cross-sectional structure of the bulk acoustic wave resonator device, fig. 4 is a schematic view of a second cross-sectional structure of the bulk acoustic wave resonator device, fig. 5 is a schematic view of a first top view structure of a first electrode layer of the bulk acoustic wave resonator device with respect to the first cross-section, and fig. 6 is a schematic view of a second top view structure of a second electrode layer of the bulk acoustic wave resonator device with respect to the first cross-section.
Fig. 3 is a schematic cross-sectional a structure of a bulk acoustic wave resonator device 3000 according to an embodiment of the present invention.
As shown in fig. 3, the bulk acoustic wave resonator device 3000 includes: a piezoelectric layer 3001, the piezoelectric layer 3001 comprising a first side 3002 and a second side 3003 opposite the first side 3002 in a vertical direction; a first electrode layer 3004 located on the first side 3002 and contacting the piezoelectric layer 3001, where the first electrode layer 3004 includes a first edge and a second edge opposite to the first edge in a horizontal direction, and the first edge is in a downhill shape; a first electrode extension layer 3005, located on the first side 3002, contacting the piezoelectric layer 3001, connected to the second edge; a second electrode layer 3006 located on the second side 3003 and contacting the piezoelectric layer 3001, where the second electrode layer 3006 includes a third edge and a fourth edge opposite to the third edge in a horizontal direction, and the fourth edge is in a downhill shape; a second electrode extension layer 3007 located on the second side 3003 and contacting the piezoelectric layer 3001 and connected to the third edge; the overlapping area of the first electrode layer 3004, the second electrode layer 3006, and the piezoelectric layer 3001 is a resonance area 3100, where the first edge corresponds to the third edge in the vertical direction, and the second edge corresponds to the fourth edge in the vertical direction; the first electrode extension layer 3005 and the second electrode extension layer 3007 are positioned outside the resonance region 3100, and no overlapping portion exists; a first passivation layer 3008 on the first side 3002, the first passivation layer 3008 on the inner side of the resonance region 3100 covering the first electrode layer 3004, the first passivation layer 3008 on the outer side of the resonance region 3100 covering the piezoelectric layer 3001 on the outer side of the first edge and the first electrode extension layer 3005 on the outer side of the second edge; a second passivation layer 3009 located on the second side 3003, the second passivation layer 3009 located inside the resonance region 3100 covering the second electrode layer 3006, the second passivation layer 3009 located outside the resonance region 3100 covering the second electrode extension layer 3007 outside the third edge and the piezoelectric layer 3001 outside the fourth edge; a first overlap layer 3010 located on the first side 3002 and contacting the first passivation layer 3008, where the first overlap layer 3010 includes a first raised portion (not labeled) and a first extension portion (not labeled), the first raised portion is raised with respect to the first extension portion, the first raised portion is located inside the resonance region 3100 and has an overlapping portion with the first electrode layer 3004 on the first edge side, the first raised portion and the first electrode layer 3004 are located on both sides of the first passivation layer 3008, the first extension portion is located outside the resonance region 3100 and is located outside the first edge and has no overlapping portion with the first electrode layer 3004, and the first extension portion and the piezoelectric layer 3001 are located on both sides of the first passivation layer 3008 in the vertical direction; a second overlap layer 3011 located on the second side 3003 and contacting the second passivation layer 3009, where the second overlap layer 3011 includes a second raised portion (not labeled) and a second extension portion (not labeled), the second raised portion is raised with respect to the second extension portion, the second raised portion is located inside the resonance region 3100 and has an overlapping portion with the second electrode layer 3006 on the fourth edge side, the second raised portion and the second electrode layer 3006 are located on both sides of the second passivation layer 3009, the second extension portion is located outside the fourth edge and is located on both sides of the second passivation layer 3009 in a vertical direction, and the second extension portion and the piezoelectric layer 3001 are located on both sides of the second passivation layer 3009; a first dielectric layer 3019 located on the first side 3002, located between the first dielectric portion and the first raised portion, and in contact with the first dielectric portion and the first raised portion, respectively; a second dielectric layer 3020 located on the second side 3003 and between the second dielectric portion and the second raised portion, and in contact with the second dielectric portion and the second raised portion, respectively.
In this embodiment, the material of the piezoelectric layer 3001 includes, but is not limited to, one of the following: aluminum nitride, aluminum nitride alloys, gallium nitride, zinc oxide, lithium tantalate, lithium niobate, lead zirconate titanate (PZT), lead magnesium niobate-lead titanate.
In this embodiment, the piezoelectric layer 3001 is a flat layer, and the piezoelectric layer 3001 includes a plurality of crystal grains, where the plurality of crystal grains includes a first crystal grain and a second crystal grain, and the first crystal grain and the second crystal grain are any two crystal grains of the plurality of crystal grains. Those skilled in the art know that the crystal orientation, crystal plane, etc. of a crystal grain can be expressed based on a coordinate system. As shown in fig. 7, for a crystal grain of a hexagonal system, for example, an aluminum nitride crystal grain, an ac three-dimensional coordinate system (including an a-axis and a c-axis) is used. As shown in fig. 8, crystal grains of (i) orthorhombic system (a+.b+.c), (ii) tetragonal system (a=b+.c), and (iii) cubic system (a=b=c) are represented by xyz three-dimensional coordinate system (including x-axis, y-axis, and z-axis). In addition to the two examples described above, the grains may also be represented based on other coordinate systems known to those skilled in the art, and thus the present invention is not limited by the two examples described above.
In this embodiment, the first die may be represented based on a first three-dimensional coordinate system, and the second die may be represented based on a second three-dimensional coordinate system, where the first three-dimensional coordinate system includes at least a first coordinate axis along a first direction and a third coordinate axis along a third direction, and the second three-dimensional coordinate system includes at least a second coordinate axis along a second direction and a fourth coordinate axis along a fourth direction, where the first coordinate axis corresponds to a height of the first die, and the second coordinate axis corresponds to a height of the second die.
In this embodiment, the first direction and the second direction are the same or opposite. The first direction and the second direction are the same as each other: the range of angles between the vector in the first direction and the vector in the second direction comprises 0 to 5 degrees; the first direction and the second direction are opposite to each other: the range of angles between the vector in the first direction and the vector in the second direction includes 175 degrees to 180 degrees.
In another embodiment, the first three-dimensional coordinate system is an ac three-dimensional coordinate system, wherein the first coordinate axis is a first c-axis, and the third coordinate axis is a first a-axis; the second three-dimensional coordinate system is an ac three-dimensional coordinate system, the second coordinate axis is a second c-axis, and the fourth coordinate axis is a second a-axis, wherein the directions of the first c-axis and the second c-axis are the same or opposite.
In another embodiment, the first three-dimensional coordinate system further includes a fifth coordinate axis along a fifth direction, and the second three-dimensional coordinate system further includes a sixth coordinate axis along a sixth direction. In another embodiment, the first direction and the second direction are the same or opposite, and the third direction and the fourth direction are the same or opposite. The third direction and the fourth direction are the same as each other: the range of angles between the vector in the third direction and the vector in the fourth direction comprises 0 to 5 degrees; the third direction and the fourth direction are opposite to each other: the range of angles between the vector in the third direction and the vector in the fourth direction includes 175 degrees to 180 degrees.
In another embodiment, the first three-dimensional coordinate system is an xyz three-dimensional coordinate system, wherein the first coordinate axis is a first z axis, the third coordinate axis is a first y axis, and the fifth coordinate axis is a first x axis; the second three-dimensional coordinate system is an xyz three-dimensional coordinate system, the second coordinate axis is a second z axis, the fourth coordinate axis is a second y axis, and the sixth coordinate axis is a second x axis. In another embodiment, the first z-axis and the second z-axis are oriented in the same direction, and the first y-axis and the second y-axis are oriented in the same direction. In another embodiment, the first z-axis and the second z-axis are oppositely directed, and the first y-axis and the second y-axis are oppositely directed. In another embodiment, the first z-axis and the second z-axis are oriented in the same direction, and the first y-axis and the second y-axis are oriented in opposite directions. In another embodiment, the first z-axis and the second z-axis are oriented in opposite directions, and the first y-axis and the second y-axis are oriented in the same direction.
In this embodiment, the piezoelectric layer 3001 includes a plurality of crystal grains, and the rocking curve half-width of the crystal formed by the plurality of crystal grains is less than 2.5 degrees. It should be noted that, the Rocking curve (Rocking curve) describes the angular divergence of a specific crystal plane (the crystal plane determined by the diffraction angle) in a sample, and is represented by a planar coordinate system, where the abscissa is the angle between the crystal plane and the surface of the sample, and the ordinate represents the diffraction intensity of the crystal plane under a certain angle, and the Rocking curve is used to represent the crystal quality, and the smaller the half-width angle is, the better the crystal quality is. Further, the half width (Full Width at Half Maximum, FWHM) refers to the distance between points at which, among one peak of the function, the front and rear two function values are equal to half the peak.
In this embodiment, the material of the first electrode layer 3004 includes, but is not limited to, at least one of the following: molybdenum, ruthenium, tungsten, platinum, iridium, aluminum, beryllium, the material of the first electrode extension layer 3005 includes, but is not limited to, at least one of: molybdenum, ruthenium, tungsten, platinum, iridium, aluminum, beryllium, copper, gold. In this embodiment, the material of the first electrode layer 3004 is the same as the material of the first electrode extension layer 3005.
In this embodiment, the material of the second electrode layer 3006 includes, but is not limited to, at least one of the following: molybdenum, ruthenium, tungsten, platinum, iridium, aluminum, beryllium, the material of the second electrode extension layer 3007 includes, but is not limited to, at least one of: molybdenum, ruthenium, tungsten, platinum, iridium, aluminum, beryllium, copper, gold. In this embodiment, the material of the second electrode layer 3006 is the same as the material of the second electrode extension layer 3007.
In another embodiment, the material of the electrode layer and the material of the electrode extension layer may be different.
In this embodiment, the material of the first passivation layer 3008 includes, but is not limited to, one of the following: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide. In this embodiment, the material of the second passivation layer 3009 includes, but is not limited to, one of the following: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide. In this embodiment, the material of the first passivation layer 3008 is the same as the material of the second passivation layer 3009. In another embodiment, the material of the first passivation layer (e.g., the first passivation layer 3008) and the material of the second passivation layer (e.g., the second passivation layer 3009) may be different.
In this embodiment, the material of the first overlap layer 3010 includes, but is not limited to, at least one of the following: molybdenum, ruthenium, tungsten, platinum, iridium, aluminum, beryllium. In this embodiment, the material of the first bonding layer 3010 is the same as the material of the electrode 3004.
In this embodiment, the material of the second overlap layer 3011 includes, but is not limited to, at least one of the following: molybdenum, ruthenium, tungsten, platinum, iridium, aluminum, beryllium. In this embodiment, the material of the second bonding layer 3011 is the same as the material of the electrode 3006.
In another embodiment, the material of the border layer may be different from the material of the electrode layer, for example, tungsten or platinum, and molybdenum.
In another embodiment, the bonding layer comprises a first bonding sub-layer and a second bonding sub-layer, the first bonding sub-layer contacts the passivation layer, the second bonding sub-layer contacts the first bonding sub-layer, the second bonding sub-layer and the passivation layer are located on two sides of the first bonding sub-layer, and the material of the first bonding sub-layer is different from the material of the second bonding sub-layer, for example, the material of the first bonding sub-layer is molybdenum, and the material of the second bonding sub-layer is platinum or tungsten.
In this embodiment, the first dielectric layer 3019 is further located between the first dielectric portion and the first extension portion, and is in contact with the first dielectric portion, the first raised portion, and the first extension portion, respectively. That is, the first dielectric layer 3019 is located between the first dielectric portion and the first bonding layer 3010, and the first dielectric layer 3019 is in contact with the first dielectric portion and the first bonding layer 3010, respectively.
In this embodiment, the second dielectric layer 3020 is further located between the second dielectric portion and the second extension portion and is in contact with the second dielectric portion, the second raised portion, and the second extension portion, respectively. That is, the second dielectric layer 3020 is located between the second dielectric portion and the second bonding layer 3011, and the second dielectric layer 3020 is in contact with the second dielectric portion and the second bonding layer 3011, respectively.
In this embodiment, the material of the first dielectric layer 3019 is different from the material of the first dielectric portion; the material of the first dielectric layer 3019 includes one of the following: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide.
In this embodiment, the material of the second dielectric layer 3020 is different from the material of the second dielectric portion; the material of the second dielectric layer 3020 includes one of: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide.
In this embodiment, since the first dielectric layer 3019 and the second dielectric layer 3020 are made of insulating materials, isolation and reliability between the first electrode layer 3004 and the first passive structure 3012 can be effectively improved through the first dielectric layer 3019, and isolation and reliability between the second electrode layer 3006 and the second passive structure 3013 can be effectively improved through the second dielectric layer 3020.
In this embodiment, the material of the first dielectric layer 3019 is different from the material of the first dielectric portion, a wet etching process may be used in the process of forming the first dielectric layer 3019, and the etching rate of the etching solution used for etching the first dielectric layer 3019 is greater than the etching rate of the first dielectric portion, so that the first dielectric portion is less damaged in the process of forming the first dielectric layer 3019, thereby improving reliability and yield of the product.
In this embodiment, the material of the second dielectric layer 3020 is different from the material of the second dielectric portion, and a wet etching process may be used in the process of forming the second dielectric layer 3020, where the etching rate of the second dielectric layer 3020 by the etching solution used is greater than the etching rate of the second dielectric portion, so that the second dielectric portion is less damaged in the process of forming the second dielectric layer 3020, thereby improving reliability and yield of the product.
In this embodiment, the bulk acoustic wave resonator device 3000 further includes: a first passive structure 3012 located on the first side 3002 and contacting the first edge of the first electrode layer 3004 and the piezoelectric layer 3001 outside the first edge, the first passive structure 3012 including the first bank layer 3010, a first dielectric portion (not labeled) on the first passivation layer 3008 that coincides with the first bank layer 3010, and the first dielectric layer 3019; and a second passive structure 3013 located on the second side 3003 and contacting the fourth edge of the second electrode layer 3006 and the piezoelectric layer 3001 outside the fourth edge, wherein the second passive structure 3013 includes the second bonding layer 3011, a second dielectric portion (not labeled) overlapping the second bonding layer 3011 on the second passivation layer 3009, and the second dielectric layer 3020. The dielectric portion may electrically isolate the electrode layer and the bonding layer from each other, and the bonding layer may be passive, and the combination of the dielectric portion and the bonding layer may be passive.
In this embodiment, the first thickness of the first passive structure 3012 is smaller than the thickness of the first electrode layer 3004, and the second thickness of the second passive structure 3013 is smaller than the thickness of the second electrode layer 3006, and the first thickness is equal to or approximately the second thickness.
In this embodiment, the first width of the first lifting portion matches the transverse acoustic main mode generated by the resonance region 3100, for example, the mode Li Lanm S1 (1 st order Symmetrical mode), orTE1 mode (1) st order Thickness Extension mode), the second width of the second lift-off portion matching the acoustic wavelength of the transverse acoustic principal mode generated by the resonating region 3100 (e.g., the second width being equal to an integer multiple of one-half wavelength), the first width being equal to or approximately the second width. The first lifting part and the second lifting part are used for matching acoustic impedances of the resonance region and the attenuation region, so that more sound waves generated by the resonance region propagate into the attenuation region.
In this embodiment, the third thickness of the first extension is smaller than the thickness of the first electrode layer 3004, and the fourth thickness of the second extension is smaller than the thickness of the second electrode layer 3006, and the third thickness is equal to or approximately the fourth thickness.
In this embodiment, the area where the first extension portion, the second electrode extension layer 3007 and the piezoelectric layer 3001 overlap is the attenuation area 3200; the region where the second extension portion, the first electrode extension layer 3005 and the piezoelectric layer 3001 overlap is an attenuation region 3300; the first cut-off frequency of the attenuation region 3200 matches (e.g., is equal to or less than) the cut-off frequency of the resonance region 3100, and the second cut-off frequency of the attenuation region 3300 matches (e.g., is equal to or less than) the cut-off frequency of the resonance region 3100, the first cut-off frequency being equal to or approximately the second cut-off frequency.
It should be noted that, the cut-off frequency of the attenuation region is matched (for example, equal to or smaller than) that of the resonance region, so that the sound wave entering the attenuation region is in an attenuation mode (evanescent mode), that is, the wave number (wave number) in the attenuation region includes only an imaginary part, and thus the sound wave is exponentially attenuated. To more clearly illustrate the benefits of embodiments of the present invention, referring to FIG. 9, two exemplary second-Type (Type II) sonic dispersion curves 600 are shown. The horizontal axis of the dispersion curve coordinate system represents the wave number, the vertical axis represents the frequency, the origin of the coordinate system represents the wave number as 0, the left side of the origin represents the wave number only including the imaginary part, and the right side of the origin represents the wave number only including the real part. As shown in FIG. 9, a first dispersion curve 601 represents the resonance region A dispersion relation (dispersion relation), the intersection of the first dispersion curve 601 with the vertical axis representing a first cut-off frequency 602 of the resonant region; a second dispersion curve 603 represents the dispersion relation of the attenuation region, the intersection of the second dispersion curve 603 with the vertical axis represents a second cut-off frequency 604 of the attenuation region, the second cut-off frequency 604 being smaller than the first cut-off frequency 602. Referring again to fig. 9, for the parallel resonant frequency f p The wave number of the first dispersion curve 601 only includes a real part, the wave number of the second dispersion curve 603 only includes an imaginary part, so that the sound wave propagates from the resonance region into the attenuation region and becomes an attenuation mode, the sound wave becomes exponentially attenuated, specifically, the expression of the sound wave displacement includes exp (-jkx), wherein the wave number k only includes the imaginary part. It should be noted that the first Type (Type I) acoustic dispersion curve also has similar dispersion characteristics.
Fig. 10 shows two parallel impedance curves, wherein the abscissa represents frequency, the ordinate represents the relative parallel impedance value, and the relative parallel impedance value represents the ratio of the absolute parallel impedance value to a specific parallel impedance value, for example, 300 ohms for the absolute parallel impedance value and 500 ohms for the specific parallel impedance value, and the relative parallel impedance value is 0.6 (300/500). Referring to fig. 10, a first parallel impedance curve 701 represents a relative parallel impedance curve of a bulk acoustic wave resonator device that does not include a passive structure, and a second parallel impedance curve 703 represents a relative parallel impedance curve of a bulk acoustic wave resonator device that includes a passive structure. As shown in fig. 10, for the parallel resonance frequency f p The corresponding value on the second parallel impedance curve 703 is greater than the corresponding value on the first parallel impedance curve 701. The passive structure can attenuate the transversely-propagating sound wave generated by the resonance region, inhibit parasitic edge modes and promote Z p And a corresponding Q value. In addition, the passive structure is not electrically connected to the electrode layer, and therefore the passive structure has a specific resistance to Kt 2 Less of an effect of (a) is present.
In this embodiment, the bulk acoustic wave resonator device 3000 further includes: a cavity 3014, the first electrode layer 3004 being located within the cavity 3014, one end of the first electrode extension layer 3005 being located within the cavity 3014, the first passive structure 3012 being located within the cavity 3014. In another embodiment, a lower electrode layer (e.g., the first electrode layer 3004) may be positioned over the cavity, covering the cavity; the passive structure corresponding to the lower electrode layer is positioned outside the cavity.
Fig. 4 is a schematic cross-sectional B structure of a bulk acoustic wave resonator device 3000 according to an embodiment of the present invention.
As shown in fig. 4, the bulk acoustic wave resonator device 3000 includes: the piezoelectric layer 3001, the piezoelectric layer 3001 comprising the first side 3002 and the second side 3003; the first electrode layer 3004 is located on the first side 3002 and contacts the piezoelectric layer 3001, and the first electrode layer 3004 further includes a fifth edge and a sixth edge opposite to the fifth edge in a horizontal direction, where the fifth edge is in a downhill shape, and the sixth edge is in a downhill shape; the second electrode layer 3006 is located on the second side 3003 and contacts the piezoelectric layer 3001, where the second electrode layer 3006 further includes a seventh edge and an eighth edge opposite to the seventh edge in a horizontal direction, the seventh edge is in a downhill shape, and the eighth edge is in a downhill shape; within the resonance region 3100, the fifth edge corresponds to the seventh edge in a vertical direction, and the sixth edge corresponds to the eighth edge in a vertical direction; the first passivation layer 3008 is located on the first side 3002, the first passivation layer 3008 located inside the resonance region 3100 covers the first electrode layer 3004, and the first passivation layer 3008 located outside the resonance region 3100 also covers the piezoelectric layer 3001 located outside the fifth edge and the piezoelectric layer 3001 located outside the sixth edge; the second passivation layer 3009 is located on the second side 3003, the second passivation layer 3009 located inside the resonance region 3100 covers the second electrode layer 3006, and the second passivation layer 3009 located outside the resonance region 3100 also covers the piezoelectric layer 3001 located outside the seventh edge and the piezoelectric layer 3001 located outside the eighth edge; the first bonding layer 3010 is located on the first side 3002 and contacts the first passivation layer 3008, the first bonding layer 3010 includes the first raised portion and the first extension portion, the first raised portion protrudes from the first extension portion, the first raised portion is located inside the resonance region 3100, and further has an overlapping portion with the first electrode layer 3004 on the fifth edge side and the sixth edge side, the first raised portion and the first electrode layer 3004 are located on both sides of the first passivation layer 3008, the first extension portion is located outside the resonance region 3100, and further located outside the fifth edge and outside the sixth edge, and is not overlapping with the first electrode layer 3004, and the first extension portion and the piezoelectric layer 3001 are located on both sides of the first passivation layer 3008 in the vertical direction; the second bonding layer 3011 is located on the second side 3003 and contacts the second passivation layer 3009, the second bonding layer 3011 includes a second raised portion and a second extension portion, the second raised portion is raised with respect to the second extension portion, the second raised portion is located inside the resonance region 3100, and further has an overlapping portion with the second electrode layer 3006 on the seventh edge side and the eighth edge side, the second raised portion and the second electrode layer 3006 are located on both sides of the second passivation layer 3009, the second extension portion is located outside the resonance region 3100, and further located outside the seventh edge and outside the eighth edge, and is not overlapping with the second electrode layer 3006, and the second extension portion and the piezoelectric layer 3001 are located on both sides of the second passivation layer 3009 in the vertical direction.
In this embodiment, the area where the first extension portion, the second extension portion, and the piezoelectric layer 3001 overlap is an attenuation area 3400; the third cutoff frequency of the attenuation region 3400 matches (e.g., is equal to or less than) the cutoff frequency of the resonance region 3100.
Fig. 5 is a schematic structural diagram of a first top view of a bulk acoustic wave resonator device 3000 according to an embodiment of the present invention, based on the first electrode layer 3004, with respect to the cross section a.
As shown in fig. 5, the bulk acoustic wave resonator device 3000 includes: the first electrode layer 3004 (indicated by dotted lines), the first electrode layer 3004 having a hexagonal shape including the first edge, the second edge, the fifth edge, the sixth edge, a ninth edge, and a tenth edge; the first electrode extension layer 3005 connected to the second edge; the first overlap layer 3010 has overlapping portions with the plurality of edge sides of the first electrode layer 3004, and is adjacent to the first electrode extension layer 3005, and the first overlap layer 3010 includes the first raised portion 3015 and the first extension portion 3016; wherein the first raised portion 3015 is located inside the edge of the first electrode layer 3004, and has overlapping portions with the fifth edge side, the ninth edge side, the first edge side, the sixth edge side, and the tenth edge side; the first extension 3016 is located outside the fifth edge, the ninth edge, the first edge, the sixth edge, and the tenth edge, and has no overlapping portion with the first electrode layer 3004.
In this embodiment, the width w of the first overlap 3010 corresponding to each edge is the same, and accordingly, the width of the first lifting portion 3015 corresponding to each edge is the same, and the width of the first extending portion 3016 corresponding to each edge is the same.
In this embodiment, the first passive structure 3012 includes the first overlap layer 3010 adjacent to the first electrode extension layer 3005. In this embodiment, the first passive structure 3012 includes the first raised portion 3015, and has overlapping portions with the fifth edge side, the ninth edge side, the first edge side, the sixth edge side, and the tenth edge side. In this embodiment, the first passive structure 3012 further includes the first extension 3016, which is located outside the fifth edge, the ninth edge, the first edge, the sixth edge, and the tenth edge, and has no overlapping portion with the first electrode layer 3004.
In this embodiment, the width w of each edge of the first passive structure 3012 is the same.
Fig. 6 is a schematic diagram of a second top plan view of a bulk acoustic wave resonator device 3000 according to an embodiment of the present invention, based on the second electrode layer 3006, with respect to the cross section a.
As shown in fig. 6, the bulk acoustic wave resonator device 3000 includes: the second electrode layer 3006 (indicated by dotted lines), the second electrode layer 3006 having a hexagonal shape including the third edge, the fourth edge, the seventh edge, the eighth edge, the eleventh edge, and the twelfth edge; the second electrode extension layer 3007 connected to the third edge; the second overlap layer 3011 has overlapping portions with the plurality of edge sides of the second electrode layer 3006, and is adjacent to the second electrode extension layer 3007, and the second overlap layer 3011 includes the second raised portion 3017 and the second extension portion 3018; wherein the second raised portion 3017 is located inside the edge of the second electrode layer 3006, and has overlapping portions with the seventh edge side, the eleventh edge side, the fourth edge side, the eighth edge side, and the twelfth edge side; wherein the second extension 3018 is located outside the seventh edge, the eleventh edge, the fourth edge, the eighth edge, and the twelfth edge, and has no overlapping portion with the second electrode layer 3006.
In this embodiment, the width w of the second overlap 3011 corresponding to each edge is the same, and accordingly, the width of the second lifting portion 3017 corresponding to each edge is the same, and the width of the second extending portion 3018 corresponding to each edge is the same.
In this embodiment, the second passive structure 3013 includes the second bonding layer 3011 adjacent to the second electrode extension layer 3007. In this embodiment, the second passive structure 3013 includes the second raised portion 3017, and has overlapping portions with the seventh edge side, the eleventh edge side, the fourth edge side, the eighth edge side, and the twelfth edge side. In this embodiment, the second passive structure 3013 further includes a second extension 3018, which is located outside the seventh edge, the eleventh edge, the fourth edge, the eighth edge, and the twelfth edge, and has no overlapping portion with the second electrode layer 3006.
In this embodiment, the width w of each edge of the second passive structure 3013 is the same.
In this embodiment, the first passive structure 3012 and the second passive structure 3013 surround the first electrode layer 3004 and the second electrode layer 3006, that is, surround the resonance region 3100.
It should be noted that, in the embodiment of the present invention, the top view of the electrode layer is hexagonal, which is a specific embodiment, so the present invention is not limited to the specific embodiment disclosed, and the top view of the electrode layer may also be polygonal (e.g., pentagonal, heptagonal), elliptical, etc.
In another embodiment, the bulk acoustic wave resonator device includes a plurality of electrode extension layers respectively connected to a plurality of edges of the electrode layer, the passive structure corresponding to the electrode layer is adjacent to the plurality of electrode extension layers, has passive overlapping portions with edges other than the plurality of edges, and further includes passive extension portions located outside the other edges.
In another embodiment, a bulk acoustic wave resonator device includes three or more passive structures surrounding a resonating region of the bulk acoustic wave resonator device.
Fig. 11 to 14 show another embodiment of the bulk acoustic wave resonator device of the present invention, but the present invention can be implemented in other ways than described herein, and thus the present invention is not limited by the embodiments disclosed below. Fig. 11 is a schematic diagram of a first cross-sectional structure of the bulk acoustic wave resonator device and a schematic diagram of sound velocity distribution in a corresponding region, fig. 12 is a schematic diagram of a second cross-sectional structure of the bulk acoustic wave resonator device, fig. 13 is a schematic diagram of a first top view structure of a first electrode layer of the bulk acoustic wave resonator device with respect to the first cross-section, and fig. 14 is a schematic diagram of a second top view structure of a second electrode layer of the bulk acoustic wave resonator device with respect to the first cross-section.
The present embodiment is a description of the bulk acoustic wave resonator device based on the structure of the section a (fig. 3) of the bulk acoustic wave resonator device 3000 in the above embodiment, and the difference between the present embodiment and the above embodiment is that: the bulk acoustic wave resonator device 3000 further includes: a third dielectric portion and a surrounding recess in the third dielectric portion as shown. The following will make a detailed description with reference to the accompanying drawings.
As shown in fig. 11 to 14, the bulk acoustic wave resonator device 3000 further includes: a third dielectric portion (not shown) located on the second side 3003 and in contact with the second electrode layer 3006; a surrounding groove 3021 is located in the third dielectric portion, located inside the resonance region 3100, located inside the second raised portion, and adjacent to the second raised portion.
In this embodiment, the surrounding groove 3021 has a polygonal shape. In other embodiments, the circumferential groove may also be circular or oval.
The second passivation layer 3009 includes the third dielectric portion and the second dielectric portion.
In the present embodiment, by adding the surrounding type groove 3021 inside the resonance region 3100, a first stage region I constituted by the surrounding type groove 3021, and a second stage region II constituted by the first raised portion 3015 and the second raised portion 3017, respectively. By setting the cut-off frequency of the first segment region I to be larger than that of the middle portion (not labeled) of the resonance region 3100 inside the circumferential groove 3021 and the cut-off frequency of the second segment region II to be smaller than that of the middle portion, a piston mode (piston mode) is formed, see fig. 11, showing a sound velocity distribution diagram in a piston mode, the sound velocity being proportional to the cut-off frequency, the excitation piston mode can suppress a higher order parasitic mode of a transverse sound wave, as shown in fig. 36, the series resonance frequency (f s ) Near and less than f s Is not shown).
To more clearly illustrate the beneficial effects of embodiments of the present invention, referring to FIG. 15, three exemplary second Type (Type II) sonic dispersion curves (curve 1, curve 2, and curve 3 in FIG. 15) are shown. The horizontal axis of the dispersion curve coordinate system represents the wave number, the vertical axis represents the frequency, the origin of the coordinate system represents the wave number as 0, the left side of the origin represents the wave number only including the imaginary part, and the right side of the origin represents the wave number only including the real part. As shown in fig. 15, a first dispersion curve (curve 1 in fig. 15) representing a dispersion relation (dispersion relation) of the middle portion of the resonance region, the intersection of the first dispersion curve with the vertical axis representing a first cut-off frequency (a in fig. 15) of the resonance region; a second dispersion curve (curve 2 in fig. 15) representing the dispersion relation of the first segment region I, the second dispersion curve being related toThe intersection of the vertical axes represents a second cut-off frequency (b in fig. 15) of the first segment region I, which is greater than the first cut-off frequency; a third dispersion curve (curve 3 in fig. 15) represents the dispersion relation of the second segment region II, and the intersection of the third dispersion curve and the vertical axis represents a third cut-off frequency (c in fig. 15) of the second segment region II, which is smaller than the first cut-off frequency. Referring again to fig. 15, for the series resonant frequency (straight line f in fig. 15 s ) The wave number of the first dispersion curve is 0 and is in a resonance mode, the wave number of the second dispersion curve only comprises a real part, so that a standing wave is formed in a first section area I by a high-order parasitic mode of the transverse sound wave, the propagation of the sound wave in a resonance area and a second section area II can be transited, the wave number of the third dispersion curve only comprises an imaginary part, and therefore the high-order parasitic mode of the transverse sound wave is in an attenuation mode after the high-order parasitic mode of the transverse sound wave propagates from the first section area I to the second section area II, and particularly, the expression of the displacement of the transverse sound wave comprises exp (-jkx), wherein the wave number k only comprises the imaginary part.
Fig. 36 shows two series admittance curves, wherein the abscissa represents frequency and the ordinate represents relative series admittance value, which represents the ratio of absolute series admittance value to specific series admittance value, for example, absolute series admittance value of 1 siemens and specific series admittance value of 2 siemens, the relative series admittance value of 0.5 (1/2). Referring to fig. 36, a first series admittance curve (curve 1 in fig. 36) represents a relative series admittance curve of a bulk acoustic wave resonator device that does not include the surrounding groove 3021 and the passive structure, and a second series admittance curve (curve 2 in fig. 36) represents a relative series admittance curve of a bulk acoustic wave resonator device that includes the surrounding groove 3021 and the passive structure. As shown in fig. 36, for the series resonance frequency f s Near and less than f s The corresponding ripple on the second series admittance curve is smaller than the corresponding ripple on the first series admittance curve. It should be noted that, the surrounding type groove 3021 and the passive structure may form a piston mode in the resonance region 3100, suppress the high-order parasitic mode of the transverse sound wave, improve the performance of the resonator, and reduce the series resonance frequency f s Near and less than f s Is not shown).
Fig. 16 shows another embodiment of the bulk acoustic wave resonator device of the present invention, but the present invention can also be implemented in other ways than described herein, and thus the present invention is not limited by the embodiments disclosed below. Fig. 16 is a schematic diagram of a first cross-sectional structure of the bulk acoustic wave resonator device and a schematic diagram of sound velocity distribution in a corresponding region.
The present embodiment is a description of the bulk acoustic wave resonator device based on the structure of the section a (fig. 3) of the bulk acoustic wave resonator device 3000 in the above embodiment, and the difference between the present embodiment and the above embodiment is that: the bulk acoustic wave resonator device 3000 further includes: a third dielectric portion and a surrounding recess in the third dielectric portion as shown. The following will make a detailed description with reference to the accompanying drawings.
As shown in fig. 16, the bulk acoustic wave resonator device 3000 further includes: a third dielectric portion (not shown) located on the first side 3002 and in contact with the first electrode layer 3004; a surrounding groove 3021 is located in the third dielectric portion, located inside the resonance region 3100, located inside the first raised portion, and adjacent to the first raised portion.
In this embodiment, the surrounding groove 3021 has a polygonal shape. In other embodiments, the circumferential groove may also be circular or oval.
The first passivation layer 3008 includes the third dielectric portion and the first dielectric portion.
In the present embodiment, by adding the surrounding type groove 3021 inside the resonance region 3100, a first stage region I constituted by the surrounding type groove 3021, and a second stage region II constituted by the first raised portion 3015 and the second raised portion 3017, respectively. By setting the cut-off frequency of the first segment region I to be larger than that of the middle portion (not labeled) of the resonance region 3100 inside the circumferential groove 3021 and the cut-off frequency of the second segment region II to be smaller than that of the middle portion, a piston mode (piston mode) is formed, see fig. 16, showing The sound velocity distribution diagram under the piston mode is shown, the sound velocity is in direct proportion to the cut-off frequency, the excitation piston mode can restrain the high-order parasitic mode of the transverse sound wave, as shown in fig. 36, the series resonance frequency (f s ) Near and less than f s Is not shown).
Fig. 17 to 18 show another embodiment of the bulk acoustic wave resonator device of the present invention, but the present invention can be implemented in other ways than described herein, and thus the present invention is not limited by the embodiments disclosed below. Fig. 17 is a schematic diagram of a first cross-sectional structure of the bulk acoustic wave resonator device, and fig. 18 is a schematic diagram of a second cross-sectional structure of the bulk acoustic wave resonator device.
The present embodiment is a description of the bulk acoustic wave resonator device based on the structure of the section a of the bulk acoustic wave resonator device 3000 (fig. 11 and 12) in the above embodiment, and the difference between the present embodiment and the above embodiment is that: the bulk acoustic wave resonator device 3000 further includes: a first void and a second void. The following will make a detailed description with reference to the accompanying drawings.
As shown in fig. 17 and 18, the bulk acoustic wave resonator device 3000 further includes: a first empty slot 3022 located at the first side 3002 and located between the first extension and the piezoelectric layer 3001; a second void 3023 is located on the second side 3003 and is located between the second extension and the piezoelectric layer 3001.
In this embodiment, the method for forming the first empty slot 3022 includes: after the first dielectric layer 3019 is formed on the first passivation layer 3008, the first passivation layer 3008 overlapping the first extension is removed, and the first empty groove 3022 is formed.
In this embodiment, the method for forming the second empty slot 3023 includes: after the second dielectric layer 3020 is formed on the second passivation layer 3009, the second passivation layer 3009 overlapping the second extension is removed to form the second empty groove 3023.
In this embodiment, the first dielectric layer 3019 is completely overlapped with the first overlap layer 3010, that is, the first dielectric layer 3019 is respectively contacted with the first lifting portion and the first extension portion; the first dielectric layer 3020 is completely overlapped with the second overlap layer 3011, i.e. the second dielectric layer 3020 is in contact with the second raised portion and the second extension portion, respectively.
In other embodiments, the first dielectric layer may also completely overlap with only the first raised portion in the first overlap layer, that is, the first dielectric layer contacts only the first raised portion; the second dielectric layer may also completely overlap only the second raised portion in the second overlap layer, i.e. the second dielectric layer is in contact only with the second raised portion.
In other embodiments, the first void and the second void may also be located on the bulk acoustic wave resonator device based on fig. 3 and 4.
Fig. 19 shows another embodiment of the bulk acoustic wave resonator device of the present invention, but the present invention can also be implemented in other ways than described herein, and thus the present invention is not limited by the embodiments disclosed below. Wherein fig. 19 is a schematic view of a first cross-sectional structure of the bulk acoustic wave resonator device.
The present embodiment is a description of the bulk acoustic wave resonator device based on the structure of the section a (fig. 16) of the bulk acoustic wave resonator device 3000 in the above embodiment, and the difference between the present embodiment and the above embodiment is that: the bulk acoustic wave resonator device 3000 further includes: a first void and a second void. The following will make a detailed description with reference to the accompanying drawings.
As shown in fig. 19, the bulk acoustic wave resonator device 3000 further includes: a first empty slot 3022 located at the first side 3002 and located between the first extension and the piezoelectric layer 3001; a second void 3023 is located on the second side 3003 and is located between the second extension and the piezoelectric layer 3001.
In this embodiment, the method for forming the first empty slot 3022 includes: after the first dielectric layer 3019 is formed on the first passivation layer 3008, the first passivation layer 3008 overlapping the first extension is removed, and the first empty groove 3022 is formed.
In this embodiment, the method for forming the second empty slot 3023 includes: after the second dielectric layer 3020 is formed on the second passivation layer 3009, the second passivation layer 3009 overlapping the second extension is removed to form the second empty groove 3023.
In this embodiment, the first dielectric layer 3019 is completely overlapped with the first overlap layer 3010, that is, the first dielectric layer 3019 is respectively contacted with the first lifting portion and the first extension portion; the first dielectric layer 3020 is completely overlapped with the second overlap layer 3011, i.e. the second dielectric layer 3020 is in contact with the second raised portion and the second extension portion, respectively.
In other embodiments, the first dielectric layer may also completely overlap with only the first raised portion in the first overlap layer, that is, the first dielectric layer contacts only the first raised portion; the second dielectric layer may also completely overlap only the second raised portion in the second overlap layer, i.e. the second dielectric layer is in contact only with the second raised portion.
Fig. 20 is a schematic diagram of a wireless communication device 900. As shown in fig. 20, the wireless communication apparatus 900 includes: the antenna 950 comprises a radio frequency front-end device 910, a baseband processing device 930 and the antenna 950, wherein a first end of the radio frequency front-end device 910 is connected with the baseband processing device 930, and a second end of the radio frequency front-end device 910 is connected with the antenna 950. Wherein, the radio frequency front end device 910 includes: a first filtering device 911, a second filtering device 913, a multiplexing device 915, a power amplifying device 917, and a low noise amplifying device 919; wherein the first filtering means 911 is connected to the power amplifying means 917; wherein the second filtering means 913 is electrically connected to the low noise amplifying means 919; wherein the multiplexing device 915 comprises at least one transmit filter device (not shown) and at least one receive filter device (not shown). Wherein the first filtering device 911 comprises at least one of the bulk acoustic wave resonant devices provided in one of the above embodiments, and the second filtering device 913 comprises at least one of the bulk acoustic wave resonant devices provided in one of the above embodiments. Wherein the at least one transmitting filter device comprises at least one bulk acoustic wave resonator device provided in one of the above embodiments, or the at least one receiving filter device comprises at least one bulk acoustic wave resonator device provided in one of the above embodiments.
Fig. 21 shows one embodiment of a method of forming a bulk acoustic wave resonator device of the present invention, but the invention may be practiced otherwise than as described herein, and thus the invention is not limited by the embodiments disclosed below.
Fig. 21 is a flowchart illustrating a method 1000 for forming a bulk acoustic wave resonator according to an embodiment of the present invention.
The embodiment of the invention also provides a method 1000 for forming a bulk acoustic wave resonator device, which comprises the following steps:
s1001, forming a piezoelectric layer, where the piezoelectric layer includes a first side and a second side opposite to the first side in a vertical direction; forming a first electrode layer on the first side in contact with the piezoelectric layer; forming a second electrode layer on the second side in contact with the piezoelectric layer; the overlapping area of the first electrode layer, the second electrode layer and the piezoelectric layer is a resonance area;
s1003, forming a first passive structure, located on the first side, having a first overlapping portion with at least one edge of the first electrode layer, where the first passive structure includes: a first raised portion, a first extension portion, a first dielectric portion, and a first dielectric layer, the first raised portion protruding relative to the first extension portion; the first lifting part is positioned at the inner side of the resonance region and provided with the first superposition part with at least one edge of the first electrode layer, and the first lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region at the outer side of the resonance region so that more sound waves generated in the resonance region enter the at least one attenuation region; the first dielectric part is positioned between the first lifting part and the first electrode layer and is used for electrically isolating the first electrode layer from the first passive structure; the first extension part is positioned outside the resonance region and in the at least one attenuation region and used for attenuating sound waves entering the at least one attenuation region; the first dielectric layer is positioned on the first side, positioned between the first dielectric part and the first lifting part, and respectively contacted with the first dielectric part and the first lifting part;
S1005, forming a second passive structure, located on the second side, having a second overlapping portion with at least one edge of the second electrode layer, where the second passive structure includes: a second raised portion, a second extension portion, a second dielectric portion, and a second dielectric layer, the second raised portion protruding relative to the second extension portion; the second lifting part is positioned at the inner side of the resonance region and provided with the second overlapping part with at least one edge of the second electrode layer, and the second lifting part is used for matching acoustic impedances of the resonance region and the at least one attenuation region so that more sound waves generated in the resonance region enter the at least one attenuation region; the second dielectric part is positioned between the second lifting part and the second electrode layer and is used for electrically isolating the second electrode layer from the second passive structure; the second extension part is positioned outside the resonance region and in the at least one attenuation region and used for attenuating sound waves entering the at least one attenuation region; the second dielectric layer is located on the second side, located between the second dielectric portion and the second raised portion, and in contact with the second dielectric portion and the second raised portion, respectively.
In some embodiments, the first passive structure and the second passive structure surround the resonant area.
In some embodiments, the thickness of the first passive structure is equal to or less than the thickness of the first electrode layer, and the thickness of the second passive structure is equal to or less than the thickness of the second electrode layer.
In some embodiments, forming the first electrode layer includes forming at least one downslope edge corresponding to the first passive structure, and forming the second electrode layer includes forming at least one downslope edge corresponding to the second passive structure.
In some embodiments, forming the first passive structure comprises: forming a first passivation layer on the first side and covering the first electrode layer; forming a first overlap layer in contact with the first passivation layer, wherein at least one edge of the first overlap layer and at least one edge of the first electrode layer are provided with the first overlapping part; wherein the first passivation layer includes the first dielectric portion; wherein the first overlap layer includes the first raised portion and the first extension portion.
In some embodiments, forming the second passive structure includes: forming a second passivation layer on the second side to cover the second electrode layer; forming a second overlap layer in contact with the second passivation layer, at least one edge of the second overlap layer and the second electrode layer having the second overlap portion; wherein the second passivation layer includes the second dielectric portion; wherein the second overlap layer includes the second raised portion and the second extension portion.
In some embodiments, the thickness of the first extension is less than the thickness of the first electrode layer, and the thickness of the second extension is less than the thickness of the second electrode layer.
In some embodiments, the at least one attenuation region includes a first attenuation region having a first cut-off frequency equal to or less than a cut-off frequency of the resonant region, the first attenuation region corresponding to a region of coincidence of the first extension, the piezoelectric layer, and the second extension.
In some embodiments, the method of forming a bulk acoustic wave resonator device further comprises: forming a first electrode extension layer positioned on the first side and connected with the first electrode layer; and forming a second electrode extension layer positioned on the second side and connected with the second electrode layer.
In some embodiments, the at least one attenuation region includes a second attenuation region having a second cutoff frequency equal to or less than a cutoff frequency of the resonant region, the second attenuation region corresponding to a region of coincidence of the second electrode extension layer, the piezoelectric layer, and the first extension.
In some embodiments, the at least one attenuation region includes a third attenuation region having a third cutoff frequency equal to or less than a cutoff frequency of the resonant region, the third attenuation region corresponding to a region of overlap of the second extension, the piezoelectric layer, and the first electrode extension.
In some embodiments, the width of the first raised portion is an integer multiple of one-half wavelength of sound waves generated within the resonance region, and the width of the second raised portion is an integer multiple of one-half wavelength of sound waves generated within the resonance region.
In some embodiments, forming the first overlap layer comprises; and forming a first bonding sub-layer and a second bonding sub-layer, wherein the second bonding sub-layer and the piezoelectric layer are positioned on two sides of the first bonding sub-layer, and the material of the first bonding sub-layer is different from the material of the second bonding sub-layer.
In some embodiments, forming the second overlap layer comprises; and forming a third bonding sub-layer and a fourth bonding sub-layer, wherein the fourth bonding sub-layer and the piezoelectric layer are positioned on two sides of the third bonding sub-layer, and the material of the third bonding sub-layer is different from the material of the fourth bonding sub-layer.
In some embodiments, the method of forming a bulk acoustic wave resonator device further comprises: forming a first sacrificial layer between the first extension and the piezoelectric layer; a second sacrificial layer is formed between the second extension and the piezoelectric layer.
In some embodiments, the method of forming a bulk acoustic wave resonator device further comprises: removing the first sacrificial layer to form a first empty slot which is positioned between the first extension part and the piezoelectric layer; and removing the second sacrificial layer to form a second empty slot which is positioned between the second extension part and the piezoelectric layer.
In some embodiments, the first dielectric portion is also located between the piezoelectric layer and the first extension, and the second dielectric portion is also located between the piezoelectric layer and the second extension.
In some embodiments, the first dielectric layer is also located between the first dielectric portion and the first extension, and the first dielectric layer is in contact with the first extension.
In some embodiments, the second dielectric layer is also located between the second dielectric portion and the second extension, and the second dielectric layer is in contact with the second extension.
In some embodiments, the material of the first dielectric layer is different from the material of the first dielectric portion; the material of the first dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide; the material of the second dielectric layer is different from the material of the second dielectric part; the material of the second dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide.
In some embodiments, further comprising: forming a third dielectric portion on the second side and in contact with the second electrode layer; a surrounding groove is formed in the third dielectric portion, inside the resonance region, inside the second raised portion, and adjacent to the second raised portion.
In some embodiments, the shape of the circumferential groove comprises: circular, elliptical or polygonal.
In some embodiments, further comprising: forming a third dielectric portion on the first side and in contact with the first electrode layer; a surrounding groove is formed in the third dielectric portion, inside the resonance region, inside the first raised portion, and adjacent to the first raised portion.
In some embodiments, the shape of the circumferential groove comprises: circular, elliptical or polygonal.
The lifting part of the passive structure is positioned at the inner side of the resonance region and is provided with an overlapping part with the electrode layer, and the acoustic impedance of the resonance region and the acoustic impedance of the attenuation region at the outer side of the resonance region can be matched, so that more acoustic waves generated by the resonance region are transmitted into the attenuation region. In addition, the cut-off frequency of the attenuation region matches (e.g., is equal to or less than) the cut-off of the resonance region The frequency can attenuate the sound wave entering the attenuation region, inhibit parasitic edge modes and promote Z p And a corresponding Q value. The cut-off frequency is the frequency corresponding to the wave number of 0 on the dispersion curve. Furthermore, the passive structure is not electrically connected to the electrode layer, so the passive structure has a specific resistance to Kt 2 Less of an effect of (a) is present.
In addition, the dielectric layers are all made of insulating materials, so that isolation and reliability between the electrode layers and the passive structure can be effectively improved through the dielectric layers.
Fig. 22 to 25 show one embodiment of a method of forming a bulk acoustic wave resonator device of the present invention, but the present invention can be implemented in other ways than described herein, and thus the present invention is not limited by the embodiments disclosed below.
Fig. 22 to 25 are schematic cross-sectional a structural views of a method for forming a bulk acoustic wave resonator device 1100 according to an embodiment of the present invention.
As shown in fig. 22, the method for forming the bulk acoustic wave resonator device 1100 includes: forming a piezoelectric layer 1101, wherein the piezoelectric layer 1101 comprises a first side 1102 and a second side 1103 opposite to the first side 1102 in the vertical direction; forming a first electrode layer 1104 on the first side 1102 in contact with the piezoelectric layer 1101, the first electrode layer 1104 including a first edge and a second edge opposite to the first edge in a horizontal direction; a first electrode extension layer 1105 is formed on the first side 1102 in contact with the piezoelectric layer 1101, the first electrode extension layer 1105 being connected to the second edge.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1100 further includes: a first substrate (not shown) is provided prior to forming the piezoelectric layer 1101. In this embodiment, the piezoelectric layer 1101 is formed on one side of the first substrate, and the first substrate is located on the second side 1103.
In this embodiment, forming the first electrode layer 1104 includes: a first downslope-shaped edge is formed at the first edge.
As shown in fig. 23, the method for forming the bulk acoustic wave resonator device 1100 further includes: forming a first passivation layer 1106 on the first side 1102, the first passivation layer 1106 covering the first electrode layer 1104, the first passivation layer 1106 also covering the piezoelectric layer 1101 outside the first edge, the first passivation layer 1106 also covering the first electrode extension layer 1105 outside the second edge; forming a first dielectric layer 1116 on the first side 1102; forming a first overlap layer 1107 on the first side 1102 and contacting the first passivation layer 1106, wherein the first overlap layer 1107 includes a first raised portion (not labeled) and a first extension portion (not labeled), the first raised portion is raised with respect to the first extension portion, the first raised portion is located inside the first edge and has an overlapping portion with the first electrode layer 1104 on the first edge side, the first raised portion and the first electrode layer 1104 are located on both sides of the first passivation layer 1106, the first extension portion is located outside the first edge and has no overlapping portion with the first electrode layer 1104, and the first extension portion and the piezoelectric layer 1101 are located on both sides of the first passivation layer 1106 in a vertical direction; the first dielectric layer 1116 is also located between the first dielectric portion and the first raised portion, between the first dielectric portion and the first extension portion, and in contact with the first dielectric portion, the first raised portion, and the first extension portion, respectively.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1100 further includes: a sacrificial layer 1108 is formed on the first side 1102 and covers the first electrode layer 1104, the end connected to the second edge on the first electrode extension layer 1105, and the first overlap layer 1107, wherein the first passivation layer 1106 is included between the sacrificial layer 1108 and the first electrode layer 1104 and between the sacrificial layer 1108 and the first electrode extension layer 1105.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1100 further includes: a first connection layer (not shown) is formed on the first side 1102 covering the sacrificial layer 1108 and the first passivation layer 1106.
In another embodiment, the method of forming a bulk acoustic wave resonator device further includes: forming a sacrificial layer, wherein the sacrificial layer and the first electrode layer are provided with an overlapping part, a first passivation layer is arranged between the sacrificial layer and the first electrode layer, a first overlap edge layer corresponding to the first electrode layer is positioned on a first side of the sacrificial layer in the horizontal direction, and a first electrode extension layer is positioned on a second side of the sacrificial layer in the horizontal direction; and forming a connecting layer to cover the sacrificial layer and the first passivation layer.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1100 further includes: providing a second substrate (not shown); forming a second connection layer (not shown) on one side of the second substrate to cover the second substrate; bonding the first and second tie layers to form an intermediate layer (not shown), the second substrate and intermediate layer being located on the first side 1102; and removing the first substrate. In this embodiment, bonding the first connection layer and the second connection layer includes: bonding the first connection layer and the second connection layer or bonding the first connection layer and the second connection layer.
As shown in fig. 24, the method for forming the bulk acoustic wave resonator device 1100 further includes: forming a second electrode layer 1109 on the second side 1103 and contacting the piezoelectric layer 1101, wherein the second electrode layer 1109 includes a third edge and a fourth edge opposite to the third edge in a horizontal direction; a second electrode extension layer 1110 is formed on the second side 1103 and contacts the piezoelectric layer 1101, where the second electrode extension layer 1110 is connected to a third edge of the second electrode layer 1109, and the third edge corresponds to the first edge in a vertical direction, and the fourth edge corresponds to the second edge in a vertical direction.
In this embodiment, forming the second electrode layer 1109 includes: a second downhill edge is formed at the fourth edge.
As shown in fig. 25, the method for forming the bulk acoustic wave resonator device 1100 further includes: forming a second passivation layer 1111 on the second side 1103, the second passivation layer 1111 covering the second electrode layer 1109, the second passivation layer 1111 further covering the piezoelectric layer 1101 outside the fourth edge, the second passivation layer 1111 further covering the second electrode extension layer 1110 outside the third edge; forming a second dielectric layer 1117 on the second side 1103; forming a second overlap layer 1112 on the second side 1103, contacting the second passivation layer 1111, where the second overlap layer 1112 includes a second raised portion (not labeled) and a second extension portion (not labeled), the second raised portion protruding with respect to the second extension portion, the second raised portion being located inside the fourth edge and having a superposition portion with the second electrode layer 1109 on the fourth edge side, the second raised portion and the second electrode layer 1109 being located on both sides of the second passivation layer 1111, the second extension portion being located outside the fourth edge and not superposed with the second electrode layer 1109, and the second extension portion and the piezoelectric layer 1101 being located on both sides of the second passivation layer 1111 in a vertical direction; the second dielectric layer 1117 is further located between the second dielectric portion and the second raised portion, located between the second dielectric portion and the second extension portion, and in contact with the second dielectric portion, the second raised portion, and the second extension portion, respectively.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1100 further includes: the sacrificial layer 1108 is removed to form a cavity 1113, and the first electrode layer 1104, the end of the first electrode extension layer 1105 connected to the second edge, and the first overlap layer 1107 are located in the cavity 1113.
In this embodiment, the first bonding layer 1107, a first dielectric portion (not labeled) on the first passivation layer 1106 and overlapping the first bonding layer 1107, and the first dielectric layer 1116 form a first passive structure 1114, which is located on the first side 1102 and contacts the first edge of the first electrode layer 1104 and the piezoelectric layer 1101 outside the first edge; the second bonding layer 1112, a second dielectric portion (not labeled) overlapping the second bonding layer 1112 on the second passivation layer 1111, and the second dielectric layer 1117 form a second passive structure 1115, which is located on the second side 1103 and contacts the fourth edge of the second electrode layer 1109 and the piezoelectric layer 1101 outside the fourth edge. The dielectric portion may electrically isolate the electrode layer and the bonding layer from each other, and the bonding layer may be passive, and the combination of the dielectric portion and the bonding layer may be passive.
In this embodiment, the first thickness of the first passive structure 1114 is smaller than the thickness of the first electrode layer 1104, and the second thickness of the second passive structure 1115 is smaller than the thickness of the second electrode layer 1109, and the first thickness is equal to or approximately the second thickness.
In this embodiment, the overlapping area of the first electrode layer 1104, the second electrode layer 1109, and the piezoelectric layer 1101 is a resonance area 1120, and the overlapping area of the first extension portion, the second electrode extension layer 1110, and the piezoelectric layer 1101 is an attenuation area 1130; the region where the second extension portion, the first electrode extension layer 1105 and the piezoelectric layer 1101 overlap is an attenuation region 1140; a first cut-off frequency of the attenuation region 1130 matches (e.g., is equal to or less than) a cut-off frequency of the resonance region 1120, and a second cut-off frequency of the attenuation region 1140 matches (e.g., is equal to or less than) a cut-off frequency of the resonance region 1120, the first cut-off frequency being equal to or approximately the second cut-off frequency.
In this embodiment, the first width of the first lifting portion matches the acoustic wavelength of the transverse acoustic main mode generated by the resonance region, for example, the rayleigh Li Lanm S1 mode, or the TE1 mode (for example, the first width is equal to an integer multiple of half a wavelength), the second width of the second lifting portion matches the acoustic wavelength of the transverse acoustic main mode generated by the resonance region (for example, the second width is equal to an integer multiple of half a wavelength), and the first width is equal to or similar to the second width. The first lifting part and the second lifting part are used for matching acoustic impedances of the resonance region and the attenuation region, so that more sound waves generated by the resonance region propagate into the attenuation region.
In this embodiment, the third thickness of the first extension is smaller than the thickness of the first electrode layer 1104, and the fourth thickness of the second extension is smaller than the thickness of the second electrode layer 1109, and the third thickness is equal to or similar to the fourth thickness.
The cut-off frequency of the attenuation regionThe cut-off frequency of the rate-matching resonance region can lead the sound wave entering the attenuation region to be in an attenuation mode, namely, the wave number in the attenuation region only comprises an imaginary part, and the sound wave is in exponential attenuation, thereby being capable of attenuating the transversely-propagating sound wave generated by the resonance region, inhibiting parasitic edge modes and improving Z p And a corresponding Q value. In addition, the passive structure is not electrically connected to the electrode layer, and therefore the passive structure has a specific resistance to Kt 2 Less of an effect of (a) is present.
In addition, since the first dielectric layer 1116 and the second dielectric layer 1117 are both insulating materials, isolation and reliability between the first electrode layer 1104 and the first passive structure 1114 can be effectively improved by the first dielectric layer 1116, and isolation and reliability between the second electrode layer 1111 and the second passive structure 1115 can be effectively improved by the second dielectric layer 1117.
In another embodiment, forming the overlap layer includes: forming a first overlap sub-layer, contacting the passivation layer; and forming a second bonding sub-layer, contacting the first bonding sub-layer, wherein the passivation layer and the second bonding sub-layer are positioned on two sides of the first bonding sub-layer, and the material of the first bonding sub-layer is different from the material of the second bonding sub-layer, for example, the material of the first bonding sub-layer is molybdenum, and the material of the second bonding sub-layer is platinum or tungsten.
Fig. 26 shows another embodiment of the method of forming a bulk acoustic wave resonator device of the present invention, but the invention may be practiced otherwise than as described herein, and therefore the invention is not limited by the embodiments disclosed below.
The present embodiment is a description of a bulk acoustic wave resonator device based on the method of forming the bulk acoustic wave resonator device 1100 in the above embodiment, and the difference between the present embodiment and the above embodiment is that: the bulk acoustic wave resonator device 1100 further includes a third dielectric portion and a surrounding groove. The following will make a detailed description with reference to the accompanying drawings.
As shown in fig. 26, fig. 26 is a continuation of the description of fig. 25, and the method for forming the bulk acoustic wave resonator device 1100 further includes: forming a third dielectric portion (not shown) on the second side 1103 and in contact with the second electrode layer 1109; a surrounding recess 1118 is in the third dielectric part inside the resonance region 1120 and inside the second elevation and adjacent to the second elevation.
In this embodiment, the circumferential groove 1118 is polygonal. In other embodiments, the circumferential groove may also be circular or oval.
The second passivation layer 1111 includes the third dielectric portion and the second dielectric portion.
In this embodiment, by adding the surrounding type recess 1118 inside the resonance region 1120, a first segment region I formed by the surrounding type recess 1118, and a second segment region II formed by the first raised portion and the second raised portion, respectively. By setting the cut-off frequency of the first segment region I to be larger than that of the middle portion (not labeled) of the resonance region 1120 inside the surrounding groove 1118, and the cut-off frequency of the second segment region II to be smaller than that of the middle portion, a piston mode (piston mode) is formed, see fig. 26, showing a sound velocity distribution diagram in a piston mode, the sound velocity being proportional to the cut-off frequency, the excitation piston mode can suppress a higher order parasitic mode of a transverse sound wave, as shown in fig. 36, the series resonance frequency (f s ) Near and less than f s Is not shown).
Fig. 27 and 28 show one embodiment of a method of forming a bulk acoustic wave resonator device of the present invention, but the present invention can also be practiced in other ways than as described herein, and therefore the present invention is not limited by the embodiments disclosed below.
The present embodiment is a description of a bulk acoustic wave resonator device based on the method of forming the bulk acoustic wave resonator device 1100 in the above embodiment, and the difference between the present embodiment and the above embodiment is that: the bulk acoustic wave resonator device 1100 further includes a third dielectric portion and a surrounding groove. The following will make a detailed description with reference to the accompanying drawings.
As shown in fig. 27, fig. 27 is a continuation of the description of fig. 23, and the method for forming the bulk acoustic wave resonator device 1100 further includes: forming a third dielectric portion (not shown) on the first side 1102 and in contact with the first electrode layer 1104; a surrounding recess 1118 is in the third dielectric part inside the resonance region 1120 and inside the first elevation and adjacent to the first elevation.
In this embodiment, the circumferential groove 1118 is polygonal. In other embodiments, the circumferential groove may also be circular or oval.
The first passivation layer 1108 includes the third dielectric portion and the first dielectric portion.
After forming the surrounding type groove, the subsequent process is consistent with fig. 24 and 25 and the corresponding description, until the bulk acoustic wave resonator device 1100 (shown in fig. 28) is formed.
In this embodiment, by adding the surrounding type recess 1118 inside the resonance region 1120, a first segment region I formed by the surrounding type recess 1118, and a second segment region II formed by the first raised portion and the second raised portion, respectively. By setting the cut-off frequency of the first segment region I to be larger than that of the middle portion (not labeled) of the resonance region 1120 inside the surrounding groove 1118, and the cut-off frequency of the second segment region II to be smaller than that of the middle portion, a piston mode (piston mode) is formed, see fig. 28, showing a sound velocity distribution diagram in a piston mode, the sound velocity being proportional to the cut-off frequency, the excitation piston mode can suppress a higher order parasitic mode of a transverse sound wave, as shown in fig. 36, the series resonance frequency (f s ) Near and less than f s Is not shown).
Fig. 29 to 32 are schematic cross-sectional a structural views of a method for forming a bulk acoustic wave resonator device 1200 according to an embodiment of the present invention.
As shown in fig. 29, the method for forming the bulk acoustic wave resonator device 1200 includes: forming a piezoelectric layer 1201, the piezoelectric layer 1201 including a first side 1202 and a second side 1203 opposite to the first side 1202 in a vertical direction; forming a first electrode layer 1204 on the first side 1202 in contact with the piezoelectric layer 1201, the first electrode layer 1204 including a first edge and a second edge opposite to the first edge in a horizontal direction; a first electrode extension 1205 is formed on the first side 1202 in contact with the piezoelectric layer 1201, the first electrode extension 1205 being connected to the second edge.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1200 further includes: a first substrate (not shown) is provided prior to forming the piezoelectric layer 1201. In this embodiment, the piezoelectric layer 1201 is formed on one side of the first substrate, and the first substrate is located on the second side 1203.
In this embodiment, forming the first electrode layer 1204 includes: a first downslope-shaped edge is formed at the first edge.
As shown in fig. 30, the method for forming the bulk acoustic wave resonator device 1200 further includes: forming a first passivation layer 1206 on the first side 1202, the first passivation layer 1206 covering the first electrode layer 1204 and also covering the first electrode extension 1205 outside the second edge; forming a first sacrificial layer 1207 on the first side 1202 outside the first edge, contacting the piezoelectric layer 1201 and the first passivation layer 1206; forming a first dielectric layer 1219 on the first side 1202; forming a first overlap layer 1208 on the first side 1202, contacting the first passivation layer 1206 and the first sacrificial layer 1207, wherein the first overlap layer 1208 includes a first raised portion (not labeled) and a first extension portion (not labeled), the first raised portion is raised with respect to the first extension portion, the first raised portion is located inside the first edge and has an overlapping portion with the first electrode layer 1204 on the first edge side, the first raised portion and the first electrode layer 1204 are located on both sides of the first passivation layer 1206, the first extension portion is located outside the first edge and has no overlapping portion with the first electrode layer 1204, and the first extension portion and the piezoelectric layer 1201 are located on both sides of the first sacrificial layer 1207 in a vertical direction; the first dielectric layer 1219 is further located between the first dielectric portion and the first raised portion, and is in contact with the first dielectric portion and the first raised portion, respectively.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1200 further includes: a second sacrificial layer 1209 is formed on the first side 1202 and covers the first electrode layer 1204, the end of the first electrode extension layer 1205 connected to the second edge, the first overlap layer 1208, and the first sacrificial layer 1207, wherein the second sacrificial layer 1209 includes the first passivation layer 1206 between the first electrode layer 1204 and the first electrode extension layer 1205.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1200 further includes: a first connection layer (not shown) is formed on the first side 1202 to cover the second sacrificial layer 1209 and the piezoelectric layer 1201.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1200 further includes: providing a second substrate (not shown); forming a second connection layer (not shown) on one side of the second substrate to cover the second substrate; bonding the first connection layer and the second connection layer to form an intermediate layer (not shown), the second substrate and the intermediate layer being located on the first side 1202; and removing the first substrate. In this embodiment, bonding the first connection layer and the second connection layer includes: bonding the first connection layer and the second connection layer or bonding the first connection layer and the second connection layer.
As shown in fig. 31, the method for forming the bulk acoustic wave resonator device 1200 further includes: forming a second electrode layer 1210 on the second side 1203 and contacting the piezoelectric layer 1201, wherein the second electrode layer 1210 includes a third edge and a fourth edge opposite to the third edge in a horizontal direction; a second electrode extension layer 1211 is formed on the second side 1203 to contact the piezoelectric layer 1201, and the second electrode extension layer 1211 is connected to a third edge of the second electrode layer 1210, wherein the third edge corresponds to the first edge in a vertical direction, and the fourth edge corresponds to the second edge in a vertical direction.
In this embodiment, forming the second electrode layer 1210 includes: a second downhill edge is formed at the fourth edge.
As shown in fig. 32, the method for forming the bulk acoustic wave resonator device 1200 further includes: forming a second passivation layer 1212 on the second side 1203, the second passivation layer 1212 covering the second electrode layer 1210 and also covering the second electrode extension layer 1211 outside the third edge; a void sacrificial layer (not shown, for example, the first sacrificial layer 1207) is formed on the second side 1203, outside the fourth edge, and in contact with the piezoelectric layer 1201 and the second passivation layer 1212; forming a second dielectric layer 1221 on the second side 1203; forming a second overlap layer 1213 on the second side 1203, contacting the second passivation layer 1212 and the empty trench sacrificial layer, wherein the second overlap layer 1213 includes a second raised portion (not labeled) and a second extension portion (not labeled), the second raised portion is raised with respect to the second extension portion, the second raised portion is located inside the fourth edge and has an overlapping portion with the second electrode layer 1210 on the fourth edge side, the second raised portion and the second electrode layer 1210 are located on both sides of the second passivation layer 1212, the second extension portion is located outside the fourth edge and has no overlapping portion with the second electrode layer 1210, and the second extension portion and the piezoelectric layer 1201 are located on both sides of the empty trench sacrificial layer in the vertical direction; the second dielectric layer 1221 is further located between the second dielectric portion and the second raised portion and is in contact with the second dielectric portion and the second raised portion, respectively.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1200 further includes: the second sacrificial layer 1209 is removed to form a cavity 1214, and the first electrode layer 1204, the end of the first electrode extension layer 1205 connected to the second edge, and the first overlap layer 1208 are located in the cavity 1214.
In this embodiment, the method for forming the bulk acoustic wave resonator device 1200 further includes: the first sacrificial layer 1207 and the empty trench sacrificial layer are removed, forming first empty trenches 1215 and second empty trenches 1216, respectively.
In this embodiment, the first dielectric layer 1219 is completely overlapped with the first overlap layer 1208, that is, the first dielectric layer 1219 is in contact with the first raised portion and the first extension portion, respectively; the first dielectric layer 1221 is fully overlapped with the second overlap layer 1213, i.e. the second dielectric layer 1221 is in contact with the second raised portion and the second extension portion, respectively.
In other embodiments, the first dielectric layer may also completely overlap with only the first raised portion in the first overlap layer, that is, the first dielectric layer contacts only the first raised portion; the second dielectric layer may also completely overlap only the second raised portion in the second overlap layer, i.e. the second dielectric layer is in contact only with the second raised portion.
In this embodiment, the first overlap layer 1208, a first dielectric portion (not labeled) on the first passivation layer 1206 overlapping the first overlap layer 1208, the first empty slot 1215, and the first dielectric layer 1219 form a first passive structure 1217, which is located on the first side 1202 and contacts a first edge of the first electrode layer 1204; the second overlap layer 1213, a second dielectric portion (not labeled) on the second passivation layer 1212 that overlaps the second overlap layer 1213, the second empty trench 1216, and the second dielectric layer 1221 form a second passive structure 1218, which is located on the second side 1203 and contacts a fourth edge of the second electrode layer 1210. The dielectric portion may electrically isolate the electrode layer and the bonding layer from each other, and the bonding layer may be passive, and the combination of the dielectric portion and the bonding layer may be passive.
In this embodiment, the first thickness of the first passive structure 1217 is smaller than the thickness of the first electrode layer 1204, and the second thickness of the second passive structure 1218 is smaller than the thickness of the second electrode layer 1210, and the first thickness is equal to or approximately the second thickness.
In this embodiment, the overlapping area of the first electrode layer 1204, the second electrode layer 1210 and the piezoelectric layer 1201 is a resonance area 1220, and the overlapping area of the first extension portion, the second electrode extension layer 1211 and the piezoelectric layer 1201 is a first attenuation area 1230; the overlapping area of the second extension portion, the first electrode extension layer 1205 and the piezoelectric layer 1201 is a second attenuation area 1240; the first cut-off frequency of the first attenuation region 1230 matches (e.g., is equal to or less than) the cut-off frequency of the resonance region 1220, and the second cut-off frequency of the second attenuation region 1240 matches (e.g., is equal to or less than) the cut-off frequency of the resonance region 1220, the first cut-off frequency being equal to or approximately the second cut-off frequency.
In this embodiment, the first width of the first lifting portion matches the wavelength of the transverse acoustic wave generated by the resonance region 1220 (for example, the first width is equal to an integer multiple of a half wavelength), the second width of the second lifting portion matches the wavelength of the transverse acoustic wave generated by the resonance region 1220 (for example, the second width is equal to an integer multiple of a half wavelength), and the first width is equal to or approximately the second width. The first lifting part and the second lifting part are used for matching acoustic impedances of the resonance region and the attenuation region, so that more sound waves generated by the resonance region propagate into the attenuation region.
In this embodiment, the third thickness of the first extension is smaller than the thickness of the first electrode layer 1204, and the fourth thickness of the second extension is smaller than the thickness of the second electrode layer 1210, and the third thickness is equal to or similar to the fourth thickness.
It should be noted that, the cut-off frequency of the attenuation region matches the cut-off frequency of the resonance region, so that the sound wave entering the attenuation region presents an attenuation mode, that is, the wave number in the attenuation region only includes an imaginary part, the sound wave decays exponentially, so that the transversely propagating sound wave generated by the resonance region can be attenuated, parasitic edge modes are suppressed, and Z is raised p And a corresponding Q value. In addition, the passive structure is not electrically connected to the electrode layer, and therefore the passive structure has a specific resistance to Kt 2 Less of an effect of (a) is present.
In another embodiment, forming the overlap layer includes: forming a first overlap sub-layer, contacting the passivation layer; and forming a second bonding sub-layer, contacting the first bonding sub-layer, wherein the passivation layer and the second bonding sub-layer are positioned on two sides of the first bonding sub-layer, and the material of the first bonding sub-layer is different from the material of the second bonding sub-layer, for example, the material of the first bonding sub-layer is molybdenum, and the material of the second bonding sub-layer is platinum or tungsten.
In summary, the passive structure includes a lifting portion, which is located at the inner side of the resonance region, and has a superposition portion with the electrode layer, so that acoustic impedances of the resonance region and the attenuation region can be matched, and thus more acoustic waves generated by the resonance region propagate into the attenuation region. In addition, the cut-off frequency of the attenuation region is matched with (for example, equal to or smaller than) the cut-off frequency of the resonance region, so that the sound wave entering the attenuation region can be attenuated, parasitic edge modes are restrained, and Z is improved p And a corresponding Q value. Furthermore, the passive structure is not electrically connected to the electrode layer, so the passive structure has a specific resistance to Kt 2 Less of an effect of (a) is present.
In addition, since the first dielectric layer 1219 and the second dielectric layer 1221 are both insulating materials, isolation and reliability between the first electrode layer 1204 and the first passive structure 1217 can be effectively improved through the first dielectric layer 1219, and isolation and reliability between the second electrode layer 1212 and the second passive structure 1218 can be effectively improved through the second dielectric layer 1221.
Fig. 33 shows one embodiment of a method of forming a bulk acoustic wave resonator device of the present invention, but the invention may be practiced otherwise than as described herein, and thus the invention is not limited by the embodiments disclosed below.
The present embodiment is a description of a bulk acoustic wave resonator device based on the method of forming the bulk acoustic wave resonator device 1200 in the above embodiment, and the difference between the present embodiment and the above embodiment is that: the bulk acoustic wave resonator device 1200 further includes a third dielectric portion and a surrounding groove. The following will make a detailed description with reference to the accompanying drawings.
As shown in fig. 33, fig. 33 is a continuation of the description of fig. 32, and the method for forming the bulk acoustic wave resonator device 1200 further includes: forming a third dielectric portion (not shown) on the second side 1203 and in contact with the second electrode layer 1210; a circumferential groove 1222 is located in the third dielectric portion, inside the resonating region 1220, inside the second raised portion, and adjacent to the second raised portion.
In this embodiment, the circumferential groove 1222 has a polygonal shape. In other embodiments, the circumferential groove may also be circular or oval.
The second passivation layer 1212 includes the third dielectric portion and the second dielectric portion.
In the present embodiment, the surrounding type recess 1222 is added to the inside of the resonance region 1220 to form a first segment region I of the surrounding type recess 1222 and a second segment region II of the first and second raised portions, respectively. By setting the cut-off frequency of the first segment region I to be larger than that of the middle portion (not labeled) of the resonance region 1220 inside the circumferential groove 1222 and the cut-off frequency of the second segment region II to be smaller than that of the middle portion, a piston mode (piston mode) is formed, see fig. 33, showing a sound velocity distribution diagram in a piston mode, the sound velocity being proportional to the cut-off frequency, the excitation piston mode can suppress a higher order parasitic mode of a transverse sound wave, as shown in fig. 36, the series resonance frequency (f s ) Near and less than f s Is not shown).
Fig. 34 and 35 show one embodiment of a method of forming a bulk acoustic wave resonator device of the present invention, but the present invention can also be practiced in other ways than described herein, and therefore the present invention is not limited by the embodiments disclosed below.
The present embodiment is a description of a bulk acoustic wave resonator device based on the method of forming the bulk acoustic wave resonator device 1200 in the above embodiment, and the difference between the present embodiment and the above embodiment is that: the bulk acoustic wave resonator device 1200 further includes a third dielectric portion and a surrounding groove. The following will make a detailed description with reference to the accompanying drawings.
As shown in fig. 34, fig. 34 is a continuation of the description of fig. 30, and the method for forming the bulk acoustic wave resonator device 1200 further includes: forming a third dielectric portion (not shown) on the first side 1202 and in contact with the first electrode layer 1204; a surrounding recess 1222 is located within the third dielectric portion, inside the resonating region 1220, inside the first raised portion, and adjacent to the first raised portion.
In this embodiment, the circumferential groove 1222 has a polygonal shape. In other embodiments, the circumferential groove may also be circular or oval.
The first passivation layer 1206 includes the third dielectric portion and the first dielectric portion.
After forming the circumferential groove 1222, the subsequent process is identical to that of fig. 31 and 32 and the corresponding description until the bulk acoustic wave resonator device 1200 (shown in fig. 35) is formed.
In the present embodiment, the surrounding type recess 1222 is added to the inside of the resonance region 1220 to form a first segment region I of the surrounding type recess 1222 and a second segment region II of the first and second raised portions, respectively. By setting the cut-off frequency of the first segment region I to be larger than that of the middle portion (not labeled) of the resonance region 1220 inside the circumferential groove 1222 and the cut-off frequency of the second segment region II to be smaller than that of the middle portion, a piston mode (piston mode) is formed, see fig. 35, showing a sound velocity distribution diagram in a piston mode, the sound velocity being proportional to the cut-off frequency, the excitation piston mode can suppress a higher order parasitic mode of a transverse sound wave, as shown in fig. 36, the series resonance frequency (f s ) Near and less than f s Is not shown).
It should be understood that the examples and embodiments herein are illustrative only and that various modifications and changes can be made by one skilled in the art without departing from the spirit and scope of the invention as defined by the application and the appended claims.
Claims (49)
1. A bulk acoustic wave resonator device, comprising:
a cavity;
a first electrode layer, at least one end of the first electrode layer being located over or within the cavity;
a piezoelectric layer including a first side and a second side opposite to the first side in a vertical direction, the cavity being located at the first side, the first electrode layer contacting the piezoelectric layer;
the second electrode layer is positioned on the second side and is contacted with the piezoelectric layer, and a region where the first electrode layer, the second electrode layer and the piezoelectric layer are overlapped is a resonance region;
the first passive structure is positioned on the first side and provided with a first superposition part with at least one edge of the first electrode layer;
a second passive structure located on the second side and having a second overlapping portion with at least one edge of the second electrode layer;
wherein the first passive structure comprises:
A first lifting part, which is positioned at the inner side of the resonance region and is provided with the first superposition part with at least one edge of the first electrode layer, wherein the first lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region at the outer side of the resonance region so that more sound waves generated in the resonance region enter at least one attenuation region;
a first dielectric portion between the first raised portion and the first electrode layer for electrically isolating the first electrode layer from the first passive structure;
a first extension located outside the resonance region and within at least one of the attenuation regions for attenuating sound waves entering the at least one attenuation region, the first lift-up portion being raised relative to the first extension;
a first dielectric layer located on the first side, located between the first dielectric portion and the first lifting portion, and in contact with the first dielectric portion and the first lifting portion, respectively;
the second passive structure includes:
the second lifting part is positioned at the inner side of the resonance region and provided with a second merging part with at least one edge of the second electrode layer, and the second lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region so that more sound waves generated in the resonance region enter the at least one attenuation region;
A second dielectric portion between the second raised portion and the second electrode layer for electrically isolating the second electrode layer from the second passive structure;
a second extension located outside the resonance region and located in at least one of the attenuation regions, for attenuating sound waves entering at least one of the attenuation regions, the second raised portion being raised relative to the second extension;
and a second dielectric layer positioned on the second side, positioned between the second dielectric part and the second lifting part, and respectively contacted with the second dielectric part and the second lifting part.
2. The bulk acoustic wave resonator device of claim 1, wherein the first passive structure and the second passive structure enclose the resonating region.
3. The bulk acoustic wave resonator device of claim 1, wherein the thickness of the first passive structure is equal to or less than the thickness of the first electrode layer and the thickness of the second passive structure is equal to or less than the thickness of the second electrode layer.
4. The bulk acoustic wave resonator device of claim 1, wherein at least one of the attenuation regions comprises a first attenuation region having a first cut-off frequency equal to or less than a cut-off frequency of the resonance region, the first attenuation region corresponding to a region of overlap of the first extension, the piezoelectric layer, and the second extension.
5. The bulk acoustic wave resonator device of claim 1, further comprising: the first electrode extension layer is positioned on the first side and connected with the first electrode layer; and the second electrode extension layer is positioned on the second side and connected with the second electrode layer.
6. The bulk acoustic wave resonator device of claim 5, wherein at least one of the attenuation regions comprises a second attenuation region having a second cut-off frequency equal to or less than the cut-off frequency of the resonance region, the second attenuation region corresponding to a region of overlap of the second electrode extension layer, the piezoelectric layer, and the first extension.
7. The bulk acoustic wave resonator device of claim 5, wherein at least one of the attenuation regions comprises a third attenuation region having a third cutoff frequency equal to or less than the cutoff frequency of the resonance region, the third attenuation region corresponding to a region of overlap of the second extension, the piezoelectric layer, and the first electrode extension.
8. The bulk acoustic wave resonator device of claim 1, wherein at least one edge of the first electrode layer is downhill shaped corresponding to the first passive structure and at least one edge of the second electrode layer is downhill shaped corresponding to the second passive structure.
9. The bulk acoustic wave resonator device of claim 1, wherein the width of the first raised portion is an integer multiple of one-half wavelength of the acoustic wave generated in the resonance region and the width of the second raised portion is an integer multiple of one-half wavelength of the acoustic wave generated in the resonance region.
10. The bulk acoustic wave resonator device of claim 1, wherein the thickness of the first extension is less than the thickness of the first electrode layer and the thickness of the second extension is less than the thickness of the second electrode layer.
11. The bulk acoustic wave resonator device of claim 1, wherein the first extension includes a first sub-portion and a second sub-portion, the second sub-portion and the piezoelectric layer being located on either side of the first sub-portion, the first sub-portion being of a different material than the second sub-portion.
12. The bulk acoustic wave resonator device of claim 1, wherein the second extension includes a third sub-portion and a fourth sub-portion, the piezoelectric layer and the fourth sub-portion being located on opposite sides of the third sub-portion, the third sub-portion being of a different material than the fourth sub-portion.
13. The bulk acoustic wave resonator device of claim 1, wherein the first extension contacts the piezoelectric layer and the second extension contacts the piezoelectric layer.
14. The bulk acoustic wave resonator device of claim 1, wherein the first dielectric portion is further located between the piezoelectric layer and the first extension and the second dielectric portion is further located between the piezoelectric layer and the second extension.
15. The bulk acoustic wave resonator device of claim 1, wherein a first void is included between the first extension and the piezoelectric layer, and a second void is included between the piezoelectric layer and the second extension.
16. The bulk acoustic wave resonator device of claim 1, wherein the first dielectric layer is further located between the first dielectric portion and the first extension, and the first dielectric layer is in contact with the first extension.
17. The bulk acoustic wave resonator device of claim 1, wherein the second dielectric layer is further located between the second dielectric portion and the second extension, and the second dielectric layer is in contact with the second extension.
18. The bulk acoustic wave resonator device of claim 1, wherein a material of the first dielectric layer is different from a material of the first dielectric portion; the material of the first dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide; the material of the second dielectric layer is different from the material of the second dielectric part; the material of the second dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide.
19. The bulk acoustic wave resonator device of claim 1, further comprising: a third dielectric portion located on the second side and in contact with the second electrode layer; and a surrounding groove which is positioned in the third dielectric part, positioned inside the resonance area, positioned inside the second lifting part and adjacent to the second lifting part.
20. The bulk acoustic wave resonator device of claim 19, wherein the shape of the surrounding groove comprises: circular, elliptical or polygonal.
21. The bulk acoustic wave resonator device of claim 1, further comprising: a third dielectric portion located on the first side and in contact with the first electrode layer; and a surrounding groove which is positioned in the third dielectric part, positioned inside the resonance area, positioned inside the first lifting part and adjacent to the first lifting part.
22. The bulk acoustic wave resonator device of claim 21, wherein the shape of the surrounding groove comprises: circular, elliptical or polygonal.
23. A filtering apparatus, comprising: at least one bulk acoustic wave resonator device as claimed in any one of claims 1 to 22.
24. A radio frequency front end device, comprising: power amplifying means and at least one filtering means as claimed in claim 23; the power amplifying device is connected with the filtering device.
25. A radio frequency front end device, comprising: low noise amplifying means and at least one filtering means as claimed in claim 23; the low noise amplifying device is connected with the filtering device.
26. A radio frequency front end device, comprising: multiplexing means comprising at least one filtering means according to claim 23.
27. A method of forming a bulk acoustic wave resonator device, comprising:
forming a piezoelectric layer, wherein the piezoelectric layer comprises a first side and a second side opposite to the first side in the vertical direction;
forming a first electrode layer on the first side in contact with the piezoelectric layer;
forming a second electrode layer positioned on the second side and contacting the piezoelectric layer, wherein the overlapping area of the first electrode layer, the second electrode layer and the piezoelectric layer is a resonance area;
forming a first passive structure, which is positioned on the first side and has a first overlapping part with at least one edge of the first electrode layer;
Wherein the first passive structure comprises:
a first raised portion, a first extension portion, a first dielectric portion, and a first dielectric layer, the first raised portion protruding relative to the first extension portion; the first lifting part is positioned at the inner side of the resonance region and provided with the first superposition part with at least one edge of the first electrode layer, and the first lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region at the outer side of the resonance region so that more sound waves generated in the resonance region enter at least one attenuation region; the first dielectric part is positioned between the first lifting part and the first electrode layer and is used for electrically isolating the first electrode layer from the first passive structure; the first extension part is positioned outside the resonance region and in at least one attenuation region and used for attenuating sound waves entering the at least one attenuation region; the first dielectric layer is positioned on the first side, positioned between the first dielectric part and the first lifting part, and respectively contacted with the first dielectric part and the first lifting part;
forming a second passive structure on the second side, having a second overlapping portion with at least one edge of the second electrode layer,
Wherein the second passive structure comprises:
a second raised portion, a second extension portion, a second dielectric portion, and a second dielectric layer, the second raised portion protruding relative to the second extension portion; the second lifting part is positioned at the inner side of the resonance region and provided with the second overlapping part with at least one edge of the second electrode layer, and the second lifting part is used for matching acoustic impedances of the resonance region and at least one attenuation region so that more sound waves generated in the resonance region enter the at least one attenuation region; the second dielectric part is positioned between the second lifting part and the second electrode layer and is used for electrically isolating the second electrode layer from the second passive structure; the second extension part is positioned outside the resonance region and in at least one attenuation region and used for attenuating sound waves entering the at least one attenuation region; the second dielectric layer is located on the second side, located between the second dielectric portion and the second raised portion, and in contact with the second dielectric portion and the second raised portion, respectively.
28. The method of forming a bulk acoustic wave resonator device of claim 27 wherein the first passive structure and the second passive structure surround the resonating region.
29. The method of forming a bulk acoustic wave resonator device of claim 27 wherein the thickness of the first passive structure is equal to or less than the thickness of the first electrode layer and the thickness of the second passive structure is equal to or less than the thickness of the second electrode layer.
30. The method of forming a bulk acoustic wave resonator device of claim 27 wherein forming the first electrode layer comprises forming at least one downslope edge corresponding to the first passive structure and forming the second electrode layer comprises forming at least one downslope edge corresponding to the second passive structure.
31. The method of forming a bulk acoustic wave resonator device of claim 27, wherein forming the first passive structure comprises forming a first passivation layer on the first side covering the first electrode layer; forming a first overlap layer in contact with the first passivation layer, wherein at least one edge of the first overlap layer and at least one edge of the first electrode layer are provided with the first overlapping part; wherein the first passivation layer includes the first dielectric portion; wherein the first overlap layer includes the first raised portion and the first extension portion.
32. The method of forming a bulk acoustic wave resonator device of claim 27, wherein forming the second passive structure comprises forming a second passivation layer on the second side covering the second electrode layer; forming a second overlap layer in contact with the second passivation layer, at least one edge of the second overlap layer and the second electrode layer having the second overlap portion; wherein the second passivation layer includes the second dielectric portion; wherein the second overlap layer includes the second raised portion and the second extension portion.
33. The method of forming a bulk acoustic wave resonator device of claim 27 wherein the thickness of the first extension is less than the thickness of the first electrode layer and the thickness of the second extension is less than the thickness of the second electrode layer.
34. The method of forming a bulk acoustic wave resonator device of claim 27 wherein at least one of the attenuation regions comprises a first attenuation region having a first cut-off frequency equal to or less than the cut-off frequency of the resonator region, the first attenuation region corresponding to the region of overlap of the first extension, the piezoelectric layer, and the second extension.
35. The method of forming a bulk acoustic wave resonator device of claim 27, further comprising: forming a first electrode extension layer positioned on the first side and connected with the first electrode layer; and forming a second electrode extension layer positioned on the second side and connected with the second electrode layer.
36. The method of forming a bulk acoustic wave resonator device of claim 35 wherein at least one of the attenuation regions comprises a second attenuation region having a second cut-off frequency equal to or less than the cut-off frequency of the resonator region, the second attenuation region corresponding to a region of overlap of the second electrode extension layer, the piezoelectric layer, and the first extension.
37. The method of forming a bulk acoustic wave resonator device of claim 35 wherein at least one of the attenuation regions comprises a third attenuation region having a third cutoff frequency equal to or less than the cutoff frequency of the resonator region, the third attenuation region corresponding to the region of overlap of the second extension, the piezoelectric layer, and the first electrode extension.
38. The method of forming a bulk acoustic wave resonator device of claim 27 wherein the width of the first raised portion is an integer multiple of one half wavelength of the acoustic wave generated in the resonating region and the width of the second raised portion is an integer multiple of one half wavelength of the acoustic wave generated in the resonating region.
39. The method of forming a bulk acoustic wave resonator device of claim 31 wherein forming the first overlap layer comprises; and forming a first bonding sub-layer and a second bonding sub-layer, wherein the second bonding sub-layer and the piezoelectric layer are positioned on two sides of the first bonding sub-layer, and the material of the first bonding sub-layer is different from the material of the second bonding sub-layer.
40. The method of forming a bulk acoustic wave resonator device of claim 32 wherein forming the second overlap layer comprises; and forming a third bonding sub-layer and a fourth bonding sub-layer, wherein the fourth bonding sub-layer and the piezoelectric layer are positioned on two sides of the third bonding sub-layer, and the material of the third bonding sub-layer is different from the material of the fourth bonding sub-layer.
41. The method of forming a bulk acoustic wave resonator device of claim 27, further comprising: forming a first sacrificial layer between the first extension and the piezoelectric layer; a second sacrificial layer is formed between the second extension and the piezoelectric layer.
42. The method of forming a bulk acoustic wave resonator device of claim 41, further comprising: removing the first sacrificial layer to form a first empty slot which is positioned between the first extension part and the piezoelectric layer; and removing the second sacrificial layer to form a second empty slot which is positioned between the second extension part and the piezoelectric layer.
43. The method of forming a bulk acoustic wave resonator device of claim 27 wherein the first dielectric layer is further between the first dielectric portion and the first extension and the first dielectric layer is in contact with the first extension.
44. The method of forming a bulk acoustic wave resonator device of claim 27 wherein the second dielectric layer is further between the second dielectric portion and the second extension and the second dielectric layer is in contact with the second extension.
45. The method of forming a bulk acoustic wave resonator device of claim 27, wherein the material of the first dielectric layer is different from the material of the first dielectric portion; the material of the first dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide; the material of the second dielectric layer is different from the material of the second dielectric part; the material of the second dielectric layer comprises one of the following materials: silicon dioxide, silicon oxynitride, silicon oxycarbide, silicon nitride, titanium oxide, aluminum oxide, hafnium silicate, zirconium silicate, hafnium dioxide, zirconium dioxide.
46. The method of forming a bulk acoustic wave resonator device of claim 27, further comprising: forming a third dielectric portion on the second side and in contact with the second electrode layer; a surrounding groove is formed in the third dielectric portion, inside the resonance region, inside the second raised portion, and adjacent to the second raised portion.
47. The method of forming a bulk acoustic wave resonator device of claim 46 wherein the shape of the surrounding groove comprises: circular, elliptical or polygonal.
48. The method of forming a bulk acoustic wave resonator device of claim 27, further comprising: forming a third dielectric portion on the first side and in contact with the first electrode layer; a surrounding groove is formed in the third dielectric portion, inside the resonance region, inside the first raised portion, and adjacent to the first raised portion.
49. The method of forming a bulk acoustic wave resonator device of claim 48 wherein the shape of the surrounding groove comprises: circular, elliptical or polygonal.
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