CN117436224A - An analog circuit yield optimization method based on preference learning model - Google Patents
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Abstract
本发明属于集成电路技术领域,涉及一种基于偏好学习模型的模拟电路成品率优化方法。本方法中采用多尺度采样方法,逐渐提高工艺参数分布的标准差σ并执行成品率分析,通过放大不同设计点成品率之间的差距,更容易分辨设计点成品率的高低;采用基于偏好学习的高斯过程分类GPC模型对设计点间多尺度采样成品率的比较结果建模;采用偏好贝叶斯优化框架对GPC模型进行优化,利用汤普森采样获取函数平衡优化过程中的利用和探索,寻找在成品率比较中获胜概率最大的设计点;采用多置信度建模方法对不同工艺参数标准差下的成品率进行建模,进一步提高汤普森采样获取函数的准确度。本方法能够大幅减少模拟电路成品率优化所需的仿真次数。The invention belongs to the technical field of integrated circuits and relates to an analog circuit yield optimization method based on a preference learning model. This method uses a multi-scale sampling method to gradually increase the standard deviation σ of the process parameter distribution and perform yield analysis. By amplifying the gap between the yields of different design points, it is easier to distinguish the level of the yield of the design points; preference-based learning is used The Gaussian process classification GPC model models the comparison results of multi-scale sampling yields between design points; the preference Bayesian optimization framework is used to optimize the GPC model, and Thompson sampling is used to obtain the utilization and exploration of the function balance optimization process to find the The design point with the highest probability of winning in the yield comparison; the multi-confidence modeling method is used to model the yield under different process parameter standard deviations to further improve the accuracy of the Thompson sampling acquisition function. This method can significantly reduce the number of simulations required for yield optimization of analog circuits.
Description
技术领域Technical Field
本发明属于集成电路技术领域,涉及集成电路可制造性设计中模拟电路成品率优化。具体涉及一种基于偏好学习模型的模拟电路成品率优化方法。本方法能够大幅减少模拟电路成品率优化所需的仿真次数。The present invention belongs to the technical field of integrated circuits, and relates to analog circuit yield optimization in integrated circuit manufacturability design. Specifically, it relates to an analog circuit yield optimization method based on a preference learning model. The method can significantly reduce the number of simulations required for analog circuit yield optimization.
背景技术Background Art
据现有技术记载,随着半导体制造工艺特征尺寸缩小至纳米尺度,工艺扰动对模拟电路的成品率产生了巨大影响,模拟电路设计中可靠性挑战日益严峻,近来工业界日益关注模拟电路成品率优化问题[1]。According to existing technical records, as the feature size of semiconductor manufacturing processes shrinks to the nanoscale, process disturbances have a huge impact on the yield of analog circuits. The reliability challenge in analog circuit design is becoming increasingly severe. Recently, the industry has paid more and more attention to the issue of analog circuit yield optimization [1].
通常,模拟电路成品率优化采用迭代优化循环,在每一次迭代优化步骤中,需调整设计参数,如晶体管的宽长等,然后执行非常耗时的成品率分析。成品率分析一般采用不同工艺角下仿真或蒙特卡洛仿真,需要执行上千次仿真才能保证成品率分析结果准确,因此模拟电路成品率优化的时间成本极高,减少模拟电路成品率优化的整体仿真时间成为最迫切需求。Typically, analog circuit yield optimization uses an iterative optimization cycle. In each iterative optimization step, design parameters such as the width and length of the transistor need to be adjusted, and then a very time-consuming yield analysis is performed. Yield analysis generally uses simulations under different process corners or Monte Carlo simulations, and thousands of simulations need to be performed to ensure that the yield analysis results are accurate. Therefore, the time cost of analog circuit yield optimization is extremely high, and reducing the overall simulation time of analog circuit yield optimization has become the most urgent need.
关于模拟电路成品率优化问题,目前主要的方法包括以下三类。Regarding the problem of analog circuit yield optimization, the current main methods include the following three categories.
基于工艺角的方法[2]-[4],该方法优化模拟电路在所有工艺角下的“最差”性能。这种处理方式避免了代价高昂的成品率分析过程,但优化结果精度不高,且经常导致过度设计。此外,若工艺空间维度很高,这种方法搜索“最差”性能的代价高昂。Corner-based methods [2]-[4] optimize the “worst” performance of analog circuits under all process corners. This approach avoids the costly yield analysis process, but the optimization results are not very accurate and often lead to over-design. In addition, if the process space is very high, this method is expensive to search for the “worst” performance.
基于蒙特卡洛(Monte Carlo,MC)的方法,由于其高精度和通用性被广泛使用。文献[5,6]将最佳计算预算分配(Optimal Computational Budget Allocation,OCBA)技术应用于MC加速,利用进化算法进行优化问题求解。文献[7]采用核密度估计方法进行成品率建模,并提出了一种多起点期望最大化算法来解决该问题。文献[8]提出了一种自适应成品率分析方法,并利用基于加权期望提升函数的贝叶斯优化算法寻找最优设计。文献[9]在文献[8]的基础上进一步采用结合神经网络的高斯过程回归和最大值熵搜索方法进行优化。尽管贝叶斯优化方法已经显示出一定的优势,但所需的总仿真次数过多。例如,目前最先进的方法[8]和[9]进行一次成品率优化需要6000~20000次仿真,对于大规模的模拟电路在时间上是难以接受的。Monte Carlo (MC) based methods are widely used due to their high accuracy and versatility. References [5,6] applied the Optimal Computational Budget Allocation (OCBA) technique to MC acceleration and used evolutionary algorithms to solve optimization problems. Reference [7] used the kernel density estimation method to model yield and proposed a multi-starting point expectation maximization algorithm to solve the problem. Reference [8] proposed an adaptive yield analysis method and used a Bayesian optimization algorithm based on a weighted expected lift function to find the optimal design. Reference [9] further used Gaussian process regression combined with neural network and maximum entropy search method for optimization based on reference [8]. Although the Bayesian optimization method has shown certain advantages, the total number of simulations required is too high. For example, the current most advanced methods [8] and [9] require 6,000 to 20,000 simulations for a yield optimization, which is time-consuming for large-scale analog circuits.
基于代理模型(surrogate model)的方法,文献[10]试图建立一个电路性能的代理模型来代替昂贵的电路仿真,从而降低成品率优化的成本。然而,这些方法往往需要大量的仿真样本点来保证建模的准确性,并且建模所需的样本点数量随工艺空间维度指数增长[8],在FinFET先进工艺下,建立代理模型的难度极大。Based on the surrogate model method, the literature [10] attempts to establish a surrogate model of circuit performance to replace expensive circuit simulation, thereby reducing the cost of yield optimization. However, these methods often require a large number of simulation sample points to ensure the accuracy of modeling, and the number of sample points required for modeling increases exponentially with the dimension of the process space [8]. Under the advanced FinFET process, it is extremely difficult to establish a surrogate model.
有研究公开了,变尺度采样(scaled-sigma sampling,SSS)[11]方法已成功应用于SRAM电路的成品率分析和优化。由于SRAM电路的失效率极低,变尺度采样方法人为地增加了工艺扰动所服从高斯分布的标准差σ值,例如芯片代工厂提供的标准差为1,而SSS方法将其提升到3,从而提升设计点的失效率,降低了成品率分析的仿真成本。文献[7,8]表明,采用SSS方法执行成品率分析不会改变两个设计点的成品率优劣关系。此外,本研究团队发现模拟电路不同设计点成品率之间的差异,可以通过改变工艺标准差σ值放大。Research has shown that the scaled-sigma sampling (SSS) [11] method has been successfully applied to yield analysis and optimization of SRAM circuits. Since the failure rate of SRAM circuits is extremely low, the scaled-sigma sampling method artificially increases the standard deviation σ of the Gaussian distribution of process disturbances. For example, the standard deviation provided by the chip foundry is 1, and the SSS method increases it to 3, thereby increasing the failure rate of the design point and reducing the simulation cost of yield analysis. References [7, 8] show that using the SSS method to perform yield analysis will not change the yield relationship between the two design points. In addition, this research team found that the difference between the yields of different design points of the analog circuit can be amplified by changing the process standard deviation σ.
如图1所示,横轴表示工艺参数扰动所服从高斯分布标准差σ,纵轴表示电荷泵电路(参见图8)的成品率,不同颜色的曲线对应不同的设计点。可以看出,随着工艺参数的标准差σ增大,工艺扰动幅度增加,设计点成品率明显降低。更重要的是,任意两个设计点间的成品率差距随着σ变化而变化,一般设计点间成品率差距最大的地方主要在σ=[2,2.5]。例如,设计点1和设计点3之间的成品率差距从原来的0.3%(σ=1)变为6%(σ=2.5),这意味着如果采用σ=2.5进行成品率分析,最多只需要200个仿真样本就足以区分它们。但是,并不是任意两个设计点成品率之间的差距都在σ=2.5时达到最大。例如,图1中设计点2和设计点4的成品率差距从15%(σ=1)减小到2%(σ=2.5),因此此时应采用σ=1进行成品率分析以提升成品率分析效率。为此,必须在优化过程中动态选择不同的σ值来最大化成品率差距,而不能使用预设的固定σ值。As shown in FIG1 , the horizontal axis represents the standard deviation σ of the Gaussian distribution obeyed by the process parameter perturbation, and the vertical axis represents the yield of the charge pump circuit (see FIG8 ). Curves of different colors correspond to different design points. It can be seen that as the standard deviation σ of the process parameters increases, the amplitude of the process perturbation increases, and the yield of the design point decreases significantly. More importantly, the yield difference between any two design points changes with the change of σ. Generally, the place where the yield difference between design points is the largest is mainly when σ=[2, 2.5]. For example, the yield difference between design point 1 and design point 3 changes from the original 0.3% (σ=1) to 6% (σ=2.5), which means that if σ=2.5 is used for yield analysis, only 200 simulation samples are needed at most to distinguish them. However, not all the yield differences between any two design points reach the maximum when σ=2.5. For example, the yield difference between design point 2 and design point 4 in FIG1 decreases from 15% (σ=1) to 2% (σ=2.5), so at this time, σ=1 should be used for yield analysis to improve the efficiency of yield analysis. To this end, different σ values must be dynamically selected during the optimization process to maximize the yield gap, rather than using a preset fixed σ value.
目前国际上先进的模拟电路成品率优化方法[8,9]采用高斯过程回归(Gaussianprocess regression,GPR)模型,它是针对成品率的连续性模型。The most advanced analog circuit yield optimization method in the world [8,9] uses the Gaussian process regression (GPR) model, which is a continuity model for yield.
基于现有技术的现状,针对现有模拟电路成品率优化方法中优化效率低的问题,本申请的发明人拟提出一种基于偏好学习模型的模拟电路成品率优化方法,其中采用高斯过程分类GPC模型对多尺度采样成品率的比较结果进行建模,尤其是一种基于比较的离散型模型。通过动态选择设计点处的σ值,最大化设计点间的成品率差距,以较小仿真代价获取设计点成品率比较结果,降低仿真成本。Based on the current status of the prior art, in order to solve the problem of low optimization efficiency in the existing analog circuit yield optimization method, the inventor of this application proposes an analog circuit yield optimization method based on a preference learning model, in which a Gaussian process classification GPC model is used to model the comparison results of multi-scale sampling yields, especially a discrete model based on comparison. By dynamically selecting the σ value at the design point, the yield gap between the design points is maximized, and the design point yield comparison results are obtained at a relatively low simulation cost, thereby reducing the simulation cost.
与本发明相关的现有技术有,The prior art related to the present invention includes:
[1]G.Gielen,T.Eeckelaert,E.Martens,and T.McConaghy,“Automatedsynthesis of complex analog circuits,”in European Conference on CircuitTheory and Design,2007.[1]G.Gielen, T.Eeckelaert, E.Martens, and T.McConaghy, "Automatedsynthesis of complex analog circuits," in European Conference on CircuitTheory and Design, 2007.
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[6]I.Guerra-Gomez,E.Tlelo-Cuautle,and L.G.de la Fraga,“Ocba in theyield optimization of analog integrated circuits by evolutionary algorithms,”in Proc.ISCAS,2015.[6] I. Guerra-Gomez, E. Tlelo-Cuautle, and L.G. de la Fraga, "Ocba in theyield optimization of analog integrated circuits by evolutionary algorithms," in Proc.ISCAS, 2015.
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[8]M.Wang,W.Lv,F.Yang,C.Yan,W.Cai,D.Zhou,and X.Zeng,“Efficient yieldoptimization for analog and sram circuits via Gaussian process regression andadaptive yield estimation,”IEEE TCAD,2018.[8] M.Wang, W.Lv, F.Yang, C.Yan, W.Cai, D.Zhou, and X.Zeng, “Efficient yieldoptimization for analog and sram circuits via Gaussian process regression and adaptive yield estimation,” IEEE TCAD,2018.
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发明内容Summary of the invention
本发明的目的在于,基于现有技术的现状,针对现有模拟电路成品率优化方法中优化效率低的问题,提供一种模拟电路成品率优化方法,具体涉及一种基于偏好学习模型的模拟电路成品率优化方法。The purpose of the present invention is to provide an analog circuit yield optimization method based on the current status of the prior art and to address the problem of low optimization efficiency in existing analog circuit yield optimization methods, specifically relating to an analog circuit yield optimization method based on a preference learning model.
本发明包括:首先,基于偏好学习方法将模拟电路成品率优化问题转化为排序得分优化问题;第二,采用高斯过程分类模型对不同设计点成品率的比较结果建模;第三,采用多置信度建模方法对不同工艺参数标准差下的成品率进行建模,并基于该模型选择代表点,近似计算排序得分;第四,利用偏好贝叶斯优化进行求解,其中汤普森采样获取函数平衡优化中利用和探索过程,不断迭代直到成品率满足要求或达到最大迭代次数。The present invention includes: first, based on the preference learning method, the analog circuit yield optimization problem is converted into a ranking score optimization problem; second, the Gaussian process classification model is used to model the comparison results of the yields of different design points; third, the multi-confidence modeling method is used to model the yields under different process parameter standard deviations, and representative points are selected based on the model to approximately calculate the ranking scores; fourth, the preferred Bayesian optimization is used to solve the problem, in which the Thompson sampling acquisition function balance optimization utilizes and explores the process, and iterates continuously until the yield meets the requirements or reaches the maximum number of iterations.
本发明中,(1)采用多尺度采样方法,逐渐提高工艺参数分布的标准差σ并执行成品率分析,通过放大不同设计点成品率之间的差距,更容易分辨设计点成品率的高低;(2)采用基于偏好学习的高斯过程分类GPC模型对设计点间多尺度采样成品率的比较结果进行建模;(3)采用偏好贝叶斯优化框架对GPC模型进行优化,即基于预测偏好的后验分布,利用汤普森采样获取函数平衡优化过程中的利用和探索,寻找在成品率比较中获胜概率最大的设计点;(4)采用多置信度建模方法对不同工艺参数标准差下的成品率进行建模,进一步提高汤普森采样获取函数的准确度。In the present invention, (1) a multi-scale sampling method is used to gradually increase the standard deviation σ of the process parameter distribution and perform yield analysis. By amplifying the difference between the yields of different design points, it is easier to distinguish the high and low yields of the design points; (2) a Gaussian process classification GPC model based on preference learning is used to model the comparison results of the multi-scale sampling yields between design points; (3) a preference Bayesian optimization framework is used to optimize the GPC model, that is, based on the posterior distribution of the predicted preference, the utilization and exploration in the Thompson sampling acquisition function balance optimization process are used to find the design point with the highest probability of winning in the yield comparison; (4) a multi-confidence modeling method is used to model the yields under different process parameter standard deviations, thereby further improving the accuracy of the Thompson sampling acquisition function.
更具体的,本发明采用多尺度采样(varying-sigma sampling)方法,通过逐渐提高工艺参数分布的标准差并执行成品率分析,放大不同设计点成品率之间的差距,更容易分辨设计点成品率的高低;不同于当前主流的连续型高斯过程回归(Gaussian processregression,GPR)模型,本方法采用基于偏好学习的离散型高斯过程分类(Gaussianprocess classification,GPC)模型对设计点间多尺度采样成品率的比较结果进行建模;采用偏好贝叶斯优化框架对GPC模型进行优化,即基于预测偏好的后验分布,利用汤普森采样(Thompson sampling,TS)获取函数平衡优化过程中的利用(exploitation)和探索(exploration),寻找在成品率比较中获胜概率最大的设计点;以及,采用多置信度(multi-fidelity)建模方法对不同工艺参数标准差下的成品率进行建模,进一步提高汤普森采样获取函数的准确度。本方法能够大幅减少模拟电路成品率优化所需的仿真次数。More specifically, the present invention adopts a varying-sigma sampling method, by gradually increasing the standard deviation of the process parameter distribution and performing yield analysis, the gap between the yields of different design points is enlarged, and it is easier to distinguish the high and low yields of the design points; different from the current mainstream continuous Gaussian process regression (Gaussian process regression, GPR) model, the present method adopts a discrete Gaussian process classification (Gaussian process classification, GPC) model based on preference learning to model the comparison results of multi-scale sampling yields between design points; the GPC model is optimized using a preference Bayesian optimization framework, that is, based on the posterior distribution of the predicted preference, the Thompson sampling (Thompson sampling, TS) is used to obtain the utilization (exploitation) and exploration (exploration) in the process of function balance optimization, and the design point with the highest probability of winning in the yield comparison is found; and the multi-fidelity modeling method is used to model the yields under different process parameter standard deviations, further improving the accuracy of the Thompson sampling acquisition function. The present method can significantly reduce the number of simulations required for analog circuit yield optimization.
本发明的模拟电路成品率优化方法的流程图如图2所示。The flowchart of the analog circuit yield optimization method of the present invention is shown in FIG2 .
输入参数:Input parameters:
1.模拟电路网表;1. Analog circuit netlist;
2.工艺参数的概率分布密度函数;2. Probability distribution density function of process parameters;
3.电路性能指标的失效阈值ci,i=1,...,k,其中k为关心的电路性能指标的数量,并假设对电路的第i个性能指标yi,如果仿真结果yi≥ci则认为电路成功,否则为失败;3. Failure threshold of circuit performance index c i , i=1, ..., k, where k is the number of circuit performance indexes of interest, and it is assumed that for the i-th performance index y i of the circuit, if the simulation result y i ≥ c i, the circuit is considered successful, otherwise it is considered a failure;
4.高斯过程分类模型初始数据集的点数Ninit;偏好贝叶斯优化的最大迭代次数Npbo;排序得分代表点数Nrep;变尺度采样成品率分析最大仿真次数Nmax;调用模拟电路性能优化解法器的最大仿真次数Npre;迭代式成品率分析每批仿真点数目Nbatch。4. The number of points N init of the initial data set of the Gaussian process classification model; the maximum number of iterations N pbo of the preferred Bayesian optimization; the number of representative points of the sorting score N rep ; the maximum number of simulations N max for variable scale sampling yield analysis; the maximum number of simulations N pre for calling the analog circuit performance optimization solver; the number of simulation points per batch N batch for iterative yield analysis.
输出结果:Output:
模拟电路成品率优化得到的最优设计参数和成品率值。Optimal design parameters and yield values obtained by analog circuit yield optimization.
具体步骤包括:The specific steps include:
步骤1:基于偏好学习的方法,将模拟电路成品率优化问题转化为排序得分优化问题;Step 1: Based on the preference learning method, the analog circuit yield optimization problem is transformed into a ranking score optimization problem;
步骤2:数据集初始化,即采用TT(Typical-Typical)工艺角性能优化方法获取Ninit个先验解,并执行低精度成品率分析,作为偏好贝叶斯优化热启动的数据集初始点,并将当前最优设计点加入最优成品率候选集B(Basket);Step 2: Data set initialization, i.e., using the TT (Typical-Typical) process corner performance optimization method to obtain N init prior solutions, and perform low-precision yield analysis as the data set initial point for the preferred Bayesian optimization hot start, and add the current optimal design point to the optimal yield candidate set B (Basket);
步骤3:采用高斯过程分类模型对数据集中不同设计点成品率的比较结果建模;Step 3: Use the Gaussian process classification model to model the comparison results of the yield of different design points in the data set;
步骤4:对不同工艺参数标准差下的成品率,建立多置信度高斯过程模型,利用马尔科夫链蒙特卡洛(Markov Chain Monte Carlo,MCMC)方法选择代表点,用于计算排序得分;Step 4: For the yield rate under different process parameter standard deviations, a multi-confidence Gaussian process model is established, and the Markov Chain Monte Carlo (MCMC) method is used to select representative points for calculating the ranking score;
步骤5:采用偏好贝叶斯优化对排序得分优化问题进行求解,其中利用排序得分计算汤普森采样获取函数;采用多尺度采样方法比较下一个候选点xnext与当前最优设计点xτ的成品率;根据比较结果更新最优成品率候选集B,并从B中选出最优设计点,对其增加Nbatch次仿真,提升该点成品率分析精度;不断迭代直到成品率满足要求或达到最大迭代次数Npbo,最终得到最优设计参数和相应的成品率结果。Step 5: Use the preferred Bayesian optimization to solve the sorting score optimization problem, in which the sorting score is used to calculate the Thompson sampling acquisition function; use the multi-scale sampling method to compare the yield of the next candidate point x next with the current optimal design point x τ ; update the optimal yield candidate set B according to the comparison result, and select the optimal design point from B, increase N batch simulations for it, and improve the yield analysis accuracy of this point; continue to iterate until the yield meets the requirements or reaches the maximum number of iterations N pbo , and finally obtain the optimal design parameters and the corresponding yield results.
本发明步骤1中,基于偏好学习的方法,将模拟电路成品率优化问题转化为排序得分优化问题。In step 1 of the present invention, based on the preference learning method, the analog circuit yield optimization problem is converted into a ranking score optimization problem.
对于模拟电路而言,设计参数是指晶体管的长、宽、电容值、电阻值等可由电路设计师控制的变量。工艺参数是指由芯片制造厂提供的阈值电压等表征工艺扰动的变量。所涉及的成品率是指由工艺扰动产生的成品率。For analog circuits, design parameters refer to variables such as transistor length, width, capacitance, and resistance that can be controlled by circuit designers. Process parameters refer to variables such as threshold voltage provided by chip manufacturers that characterize process disturbances. The yield involved refers to the yield caused by process disturbances.
针对一个模拟电路,设计参数x是设计空间D中的dx维向量,表示晶体管的长宽等可由电路设计师控制的变量。工艺参数s是工艺空间V中的ds维向量,表示阈值电压等变量,其概率分布通常由工艺厂商提供,且满足正态分布。不失一般性,假设工艺参数彼此独立并且和设计参数无关,工艺参数s的概率密度函数(probability density function,PDF)为For an analog circuit, the design parameter x is a d x- dimensional vector in the design space D, It represents the variables such as the length and width of the transistor that can be controlled by the circuit designer. The process parameter s is a d s -dimensional vector in the process space V. represents variables such as threshold voltage, and its probability distribution is usually provided by the process manufacturer and satisfies the normal distribution. Without loss of generality, assuming that the process parameters are independent of each other and have nothing to do with the design parameters, the probability density function (PDF) of the process parameter s is
给定设计参数和工艺参数(x,s)∈(D,V),x∈D,s∈V,通过SPICE仿真可以得到关心的电路性能y=[y1,y2,…,yk]T,相应的阈值条件c=[c1,c2,…,ck]T由设计师确定;只有当电路性能满足所有的条件时,即yi≥ci,i=1,…,k,才认为它是合格的,否则认为其失效。Given design parameters and process parameters (x, s)∈(D, V), x∈D, s∈V, the circuit performance of interest y=[ y1 , y2 ,…, yk ] T can be obtained through SPICE simulation. The corresponding threshold condition c=[ c1 , c2 ,…, ck ] T is determined by the designer; only when the circuit performance meets all conditions, that is , yi≥ci , i=1,…,k, is it considered qualified, otherwise it is considered failed.
给定设计参数x,模拟电路成品率Y(x)定义为Given a design parameter x, the analog circuit yield Y(x) is defined as
Y(x)=∫VI(x,s)p(s)ds (2)Y(x)=∫ V I(x,s)p(s)ds (2)
其中,指标函数I(x,s)=AND(yi≥ci),i=1,…,k,AND(·)表示逻辑函数AND。Here, the index function I(x, s)=AND(y i ≥c i ), i=1, ..., k, and AND(·) represents the logical function AND.
模拟电路成品率优化问题是要找到具有最大成品率Y的设计点x*,即The analog circuit yield optimization problem is to find the design point x * with the maximum yield Y, that is,
实践中,一个合理的模拟电路设计应当保证该电路在TT工艺角下满足所有性能指标。通过添加该个约束,可以减小算法的搜索空间,提升收敛速度;因此,传统模拟电路成品率优化问题形式化定义为:In practice, a reasonable analog circuit design should ensure that the circuit meets all performance indicators under the TT process angle. By adding this constraint, the search space of the algorithm can be reduced and the convergence speed can be improved; therefore, the traditional analog circuit yield optimization problem is formally defined as:
其中yi(x,TT)为待优化模拟电路在TT工艺角下设计参数为x时的第i个性能值。Wherein yi (x, TT) is the i-th performance value of the analog circuit to be optimized when the design parameter is x under the TT process angle.
为了处理优化问题中的约束,本发明将(4)中定义的带约束优化问题转换为无约束形式,设计目标(Figure of Merit,FOM)描述为:In order to deal with the constraints in the optimization problem, the present invention converts the constrained optimization problem defined in (4) into an unconstrained form, and the design objective (Figure of Merit, FOM) is described as:
其中ωi,i=1,2,…,k是权重,代表第i个性能指标的重要性。Wherein ω i , i=1, 2, ..., k is a weight representing the importance of the i-th performance indicator.
给定两个设计点x和x′构成的设计对(design duel)[x,x′]∈D×D,其成品率比较结果h([x,x′])∈{0,1}可以通过计算t(x)和t(x′)得到。如果t(x)≥t(x′),则h=1,表示x优于x′。否则h=0,表示x不优于x′。Given a design duel [x, x']∈D×D consisting of two design points x and x', the yield comparison result h([x, x'])∈{0,1} can be obtained by calculating t(x) and t(x'). If t(x)≥t(x'), then h=1, indicating that x is better than x'. Otherwise, h=0, indicating that x is not better than x'.
形式上,定义π([x,x′])为偏好函数(preferencefunction),表示t(x)≥t(x′)的概率。设计对[x,x′]的比较结果遵循伯努利分布(Bernoulli distribution):Formally, we define π([x, x′]) as a preference function, which represents the probability that t(x) ≥ t(x′). The comparison result of [x, x′] is designed to follow the Bernoulli distribution:
由此,定义排序得分(rankingscore)为:Therefore, the ranking score is defined as:
R(x)=Vol(D)-1∫Dπ([x,x′])dx′, (7)R(x)=Vol(D) -1 ∫ D π([x, x′])dx′, (7)
其中Vol(D)表示设计空间体积,是一个常数,优化过程中可以忽略。R(x)的物理含义是在设计空间D中统计所有比设计点x差的设计点的比例,也即x的成品率高于其它设计点成品率的平均概率。Where Vol(D) represents the volume of the design space, which is a constant and can be ignored during the optimization process. The physical meaning of R(x) is the proportion of all design points in the design space D that are worse than the design point x, that is, the average probability that the yield of x is higher than the yield of other design points.
直观地说,与设计空间中其它设计点相比,全局最优设计点应该总是获胜。如果按照成品率的值对所有设计点进行排序,那么寻找成品率最优的设计点就相当于找到排序得分最高的设计点。Intuitively, the globally optimal design point should always win when compared to other design points in the design space. If all design points are sorted by their yield value, then finding the design point with the best yield is equivalent to finding the design point with the highest sorting score.
图3展示了一个比较器电路的成品率曲线与相应排序得分曲线之间的关系,其中横轴表示设计参数,即晶体管M17的宽度(参见图7),左边纵轴表示电路成品率,右边纵轴表示排序得分。黑色实线是电路成品率曲线,而红色虚线则为排序得分曲线。显然,排序得分曲线的最高点与成品率曲线的最大值位于同一设计点。Figure 3 shows the relationship between the yield curve and the corresponding ranking score curve of a comparator circuit, where the horizontal axis represents the design parameter, i.e., the width of transistor M17 (see Figure 7), the left vertical axis represents the circuit yield, and the right vertical axis represents the ranking score. The black solid line is the circuit yield curve, and the red dotted line is the ranking score curve. Obviously, the highest point of the ranking score curve and the maximum value of the yield curve are at the same design point.
因此,模拟电路成品率优化问题可转化为排序得分优化问题:Therefore, the analog circuit yield optimization problem can be transformed into a ranking score optimization problem:
本发明步骤2中,进行数据集初始化,采用文献[12]中提出的基于TT工艺角性能优化方法获取Ninit个先验解,并执行低精度成品率分析,作为偏好贝叶斯优化热启动的数据集初始点,并将当前最优设计点加入最优成品率候选集B(Basket)。包括以下子步骤:In step 2 of the present invention, the data set is initialized, and the TT process corner performance optimization method proposed in the literature [12] is used to obtain N init prior solutions, and a low-precision yield analysis is performed as the data set initial point for the preferred Bayesian optimization hot start, and the current optimal design point is added to the optimal yield candidate set B (Basket). It includes the following sub-steps:
步骤2.1:采用文献[12]中提出的基于TT工艺角性能优化方法获取Ninit个先验解。Step 2.1: Use the TT process corner performance optimization method proposed in reference [12] to obtain N init prior solutions.
文献[12]根据模拟电路成品率和TT工艺角下性能的折衷关系,将模拟电路成品率优化初始解的构造,转化为模拟电路TT工艺角下性能优化问题:Reference [12] transforms the construction of the initial solution for analog circuit yield optimization into the performance optimization problem of analog circuit under TT process corner based on the trade-off relationship between analog circuit yield and performance under TT process corner:
其中该公式含义是搜索性能略大于约束阈值的设计点,ωi是给定的权重,代表第i个性能指标的重要性。∈是一个常系数,用于衡量TT工艺角下标称性能yi(x,TT)与阈值ci之间的距离。本发明中设置ωi=1,i∈1..k和 The formula means searching for a design point whose performance is slightly greater than the constraint threshold, ω i is a given weight, representing the importance of the i-th performance indicator. ∈ is a constant coefficient used to measure the distance between the nominal performance y i (x, TT) and the threshold ci under the TT process angle. In the present invention, ω i = 1, i∈1..k and
然后采用加权期望提升(weighted Expected Improvement,wEI)贝叶斯优化算法WEIBO[13],求解(9)定义的模拟电路TT工艺角下性能优化问题,记录所有迭代优化中产生的设计点,其中调用该解法器的最大仿真次数设置为Npre。从迭代优化产生的设计点中,选择TT下标称性能满足失效阈值并且具有最小f(x)值的Ninit个点,作为偏好贝叶斯优化热启动的初始点。Then, the weighted expected improvement (WEI) Bayesian optimization algorithm WEIBO[13] is used to solve the performance optimization problem of the analog circuit under the TT process corner defined in (9), and the design points generated in all iterative optimizations are recorded, where the maximum number of simulations calling the solver is set to N pre . From the design points generated by the iterative optimization, N init points whose nominal performance under TT meets the failure threshold and has the minimum f(x) value are selected as the initial points for the preferred Bayesian optimization hot start.
步骤2.2:将得到的Ninit个初始设计点执行低精度成品率分析,建立初始数据集,并将当前最优设计点加入最优成品率候选集B。Step 2.2: Perform low-precision yield analysis on the obtained N init initial design points, establish an initial data set, and add the current optimal design point to the optimal yield candidate set B.
本发明中针对步骤2.1得到的Ninit个初始设计点,采用通用性强的MC方法,在工艺参数标准差σ=1下,分配2*Nbatch个采样点,执行低精度成品率分析,获得相应的低精度成品率值,其中Nbatch设置为30,远低于高精度成品率分析所需仿真次数,例如1000。In the present invention, for the N init initial design points obtained in step 2.1, a highly versatile MC method is adopted. Under the process parameter standard deviation σ=1, 2*N batch sampling points are allocated to perform low-precision yield analysis to obtain the corresponding low-precision yield value, where N batch is set to 30, which is much lower than the number of simulations required for high-precision yield analysis, for example 1000.
将不同设计点两两结合,组成设计对比较成品率,建立初始数据集。MC方法基于工艺参数s的概率密度函数p(s)在工艺空间采N个样本点si,i=1,…,N,通过统计其中合格样本的数量,计算成品率为Different design points are combined in pairs to form design pairs to compare the yield rate and establish an initial data set. The MC method is based on the probability density function p(s) of the process parameter s. N sample points s i , i = 1, ..., N are collected in the process space. The yield rate is calculated by counting the number of qualified samples.
成品率估计的方差与估计值YMC(x)和采样点数N的关系为:Variance of Yield Estimate The relationship between the estimated value Y MC (x) and the number of sampling points N is:
其中置信水平kγ为常数。例如,kγ=1.645对应90%的置信度。The confidence level kγ is a constant. For example, kγ = 1.645 corresponds to a confidence level of 90%.
从上述初始数据集中,选择成品率最高的设计点加入最优成品率候选集B中。From the above initial data set, select the design point with the highest yield and add it to the optimal yield candidate set B.
本发明步骤3中,采用高斯过程分类模型对数据集中不同设计点成品率的比较结果建模。In step 3 of the present invention, a Gaussian process classification model is used to model the comparison results of the yields of different design points in the data set.
由于设计对[x,x′]的比较结果是二值数据,而回归模型一般适用于连续数据,难以对这类离散数据建模。本发明使用高斯过程分类[14]方法对成品率比较结果,即偏好信息进行建模,作为一种概率模型,GPC能够提供比较结果的预测后验分布,有助设计搜索策略实现利用和探索的平衡。Since the comparison result of the design pair [x, x′] is binary data, and the regression model is generally applicable to continuous data, it is difficult to model this type of discrete data. The present invention uses the Gaussian process classification [14] method to model the yield comparison result, that is, the preference information. As a probability model, GPC can provide a predicted posterior distribution of the comparison result, which helps the design search strategy to achieve a balance between utilization and exploration.
通常,为了处理分类问题,高斯过程分类模型使用非线性激活函数,例如Logistic函数,将高斯过程回归模型的连续型输出转换为二值输出。如,GPC模型定义一个隐函数z([x,x′]),并假设其服从GP先验,其取值包含整个实数范围,然后通过Logistic函数将z([x,x′])压缩,得到π([x,x′])的先验概率分布:Usually, in order to deal with classification problems, the Gaussian process classification model uses a nonlinear activation function, such as the Logistic function, to convert the continuous output of the Gaussian process regression model into a binary output. For example, the GPC model defines an implicit function z([x, x′]), and assumes that it obeys the GP prior, and its value covers the entire real number range. Then z([x, x′]) is compressed by the Logistic function to obtain the prior probability distribution of π([x, x′]):
其中,偏好函数π([x,x′])即为GPC模型建模的结果,可用于预测不同设计点成品率之间的高低关系。Among them, the preference function π([x, x′]) is the result of GPC modeling, which can be used to predict the high and low relationship between the yields of different design points.
图4展示了真实偏好函数π([x,x′])和GPC模型预测结果的比较,其中,图4(a)为真实的偏好函数,x轴和x′轴均表示设计参数,颜色条对应偏好函数值,揭示了设计点x相对于设计点x′的偏好信息,红色越深,设计点x的成品率Y(x)比x′的成品率Y(x′)高的概率越大;黑色交叉点标出了偏好函数取值最大的区域,也即需关注的设计区域;图4(b)为采用GPC模型预测的偏好函数,选择图3中成品率曲线(黑色实线)上的5个数据点(黑色圆点),通过两两结合形成设计对并比较的方式,构造一个包含25个数据点的分类模型训练集,并基于此数据集训练GPC模型;图中显示,虽然GPC模型预测的偏好函数与真实偏好函数并不完全相同,但其准确捕获了真实偏好函数的高偏好区域,并且图4(b)中最优设计点的位置接近于图4(a)中的最优位置。FIG4 shows a comparison between the true preference function π([x, x′]) and the prediction results of the GPC model, where FIG4(a) is the true preference function, the x-axis and the x′-axis both represent design parameters, the color bar corresponds to the preference function value, and reveals the preference information of the design point x relative to the design point x′. The darker the red, the greater the probability that the yield rate Y(x) of the design point x is higher than the yield rate Y(x′) of x′. The black intersection marks the area where the preference function takes the largest value, that is, the design area that needs attention. FIG4(b) is the preference function predicted by the GPC model. Five data points (black dots) on the yield curve (black solid line) in FIG3 are selected, and a classification model training set containing 25 data points is constructed by combining them two by two to form design pairs and comparing them. The GPC model is trained based on this data set. The figure shows that although the preference function predicted by the GPC model is not exactly the same as the true preference function, it accurately captures the high preference area of the true preference function, and the position of the optimal design point in FIG4(b) is close to the optimal position in FIG4(a).
本发明步骤4中,对不同工艺参数标准差下的成品率,建立多置信度高斯过程模型,利用马尔科夫链蒙特卡洛方法选择代表点,用于计算排序得分。包括以下子步骤:In step 4 of the present invention, for the yield rate under different process parameter standard deviations, a multi-confidence Gaussian process model is established, and a Markov chain Monte Carlo method is used to select representative points for calculating the ranking score. The following sub-steps are included:
步骤4.1:对不同工艺参数标准差下的成品率,建立多置信度高斯过程模型。Step 4.1: Establish a multi-confidence Gaussian process model for the yield rate under different process parameter standard deviations.
由于(7)中的积分没有解析解,本方法采用MC方法对其进行近似计算,即:Since the integral in (7) has no analytical solution, this method uses the MC method to approximate it, namely:
其中是一组挑选的代表点。在对设计点进行比较的过程中,会产生一些不同标准差σ下的低精度成品率数值,本方法采用多置信度模型学习不同标准差σ下成品率之间的相关性,并基于此模型产生所述代表点。in is a set of selected representative points. In the process of comparing the design points, some low-precision yield values with different standard deviations σ are generated. This method uses a multi-confidence model to learn the correlation between yields with different standard deviations σ, and generates the representative points based on this model.
更具体的本发明采用多置信度高斯过程回归模型NARGP方法[15],该方法表述为:More specifically, the present invention adopts the multi-confidence Gaussian process regression model NARGP method [15], which is expressed as:
Yh(x)=gh(x,Yl(x)), (14)Y h (x) = g h (x, Y l (x)), (14)
其中Yl(·)是低置信度模型的输出,即低σ下的成品率,Yh(·)是高置信度模型的输出,即高σ下的成品率,gh(·)表示建立在设计参数x和低σ成品率Yl(x)之上的高斯过程回归模型。where Y l (·) is the output of the low-confidence model, i.e., the yield under low σ, Y h (·) is the output of the high-confidence model, i.e., the yield under high σ, and gh(·) represents the Gaussian process regression model based on the design parameters x and the low-σ yield Y l (x).
本发明将1-σ和2-σ下的成品率作为两个低置信度源,选择2.5-σ下的成品率作为高置信度源。为建立2.5-σ下成品率的回归模型,传统单置信度GPR方法仅使用2.5-σ下获得的成品率数据,但NARGP方法可以利用1-σ和2-σ下的成品率数据,有助于对2.5-σ下的成品率进行准确建模。The present invention uses the yields under 1-σ and 2-σ as two low-confidence sources, and selects the yield under 2.5-σ as a high-confidence source. To establish a regression model for the yield under 2.5-σ, the traditional single-confidence GPR method only uses the yield data obtained under 2.5-σ, but the NARGP method can use the yield data under 1-σ and 2-σ, which helps to accurately model the yield under 2.5-σ.
图5比较了传统单置信度GPR模型和多置信度NARGP模型的拟合效果,其中横轴表示设计参数,纵轴表示成品率;黑色实线是电路在2.5-σ下的真实成品率,蓝色虚线是多置信度模型预测成品率,绿色虚线是单置信度模型预测成品率;训练数据来自一个比较器电路(参见图7)。具体来说,单置信度GPR模型仅使用2.5-σ下的5个高置信度数据点训练。多置信度模型由相同的5个高置信度点和来自两个低置信度源的额外20个低σ成品率点构建。图中显示,多置信度NARGP模型相比于单置信度GPR模型提高了拟合准确度。Figure 5 compares the fitting effects of the traditional single-confidence GPR model and the multi-confidence NARGP model, where the horizontal axis represents the design parameters and the vertical axis represents the yield; the black solid line is the actual yield of the circuit at 2.5-σ, the blue dashed line is the yield predicted by the multi-confidence model, and the green dashed line is the yield predicted by the single-confidence model; the training data comes from a comparator circuit (see Figure 7). Specifically, the single-confidence GPR model is trained using only 5 high-confidence data points at 2.5-σ. The multi-confidence model is constructed from the same 5 high-confidence points and an additional 20 low-σ yield points from two low-confidence sources. The figure shows that the multi-confidence NARGP model improves the fitting accuracy compared to the single-confidence GPR model.
步骤4.2:利用马尔科夫链蒙特卡洛方法选择代表点,用于计算排序得分。Step 4.2: Use the Markov Chain Monte Carlo method to select representative points for calculating the ranking score.
建立NARGP模型后,i-σ下成品率的期望提升(EI)函数[16]可以通过以下公式计算:After establishing the NARGP model, the expected improvement (EI) function of yield under i-σ[16] can be calculated by the following formula:
其中I(Yi(x))为多置信度模型预测成品率Yi(x)的提升量,为数学期望,max(,)为取最大值。Where I(Y i (x)) is the improvement of the yield Yi (x) predicted by the multi-confidence model, is the mathematical expectation, and max(,) is the maximum value.
为了获得式(13)中的代表点,本发明使用EIi函数选择代表点,用于计算排序得分。具体采用MCMC采样法,以EIi作为目标分布在设计空间中进行采样,EIi倾向于在高成品率区域生成采样点,实际中在每个EIi中采样约Nrep/3个点,最终从所有采样点中选择Nrep个设计点作为代表点。In order to obtain the representative points in formula (13), the present invention uses the EI i function to select representative points for calculating the ranking score. Specifically, the MCMC sampling method is adopted, and sampling is performed in the design space with EI i as the target distribution. EI i tends to generate sampling points in the high yield area. In practice, about N rep /3 points are sampled in each EI i , and finally N rep design points are selected from all sampling points as representative points.
本发明步骤5中,采用偏好贝叶斯优化对排序得分优化问题进行求解,其中利用排序得分计算汤普森采样获取函数;采用多尺度采样方法比较下一个候选点xnext与当前最优设计点xτ的成品率;根据比较结果更新最优成品率候选集B,并从B中选出最优设计点,对其增加Nbatch次仿真,提升该点成品率分析精度;不断迭代直到成品率满足要求或达到最大迭代次数Npbo,最终得到最优设计参数和相应的成品率结果。包括以下子步骤:In step 5 of the present invention, the preferred Bayesian optimization is used to solve the sorting score optimization problem, wherein the sorting score is used to calculate the Thompson sampling acquisition function; the multi-scale sampling method is used to compare the yield of the next candidate point x next with the current optimal design point x τ ; the optimal yield candidate set B is updated according to the comparison result, and the optimal design point is selected from B, and N batches of simulations are added to it to improve the yield analysis accuracy of the point; it is continuously iterated until the yield meets the requirements or reaches the maximum number of iterations N pbo , and finally the optimal design parameters and the corresponding yield results are obtained. It includes the following sub-steps:
步骤5.1:采用偏好贝叶斯优化对排序得分优化问题进行求解,其中利用排序得分计算汤普森采样获取函数。Step 5.1: Use the preferred Bayesian optimization to solve the ranking score optimization problem, where the ranking score is used to calculate the Thompson sampling acquisition function.
在贝叶斯优化中,获取函数基于概率模型提供包括均值和方差在内的后验分布,寻找下一个可能的最优点。本发明采用汤普森采样函数[17]作为获取函数,指导优化过程中的探索和利用。In Bayesian optimization, the acquisition function provides a posterior distribution including mean and variance based on the probability model to find the next possible optimal point. The present invention adopts the Thompson sampling function [17] as the acquisition function to guide the exploration and utilization in the optimization process.
汤普森采样获取函数首先从GPC模型预测的后验高斯分布中随机生成一个样本样本生成的随机性保证了算法的探索能力,避免陷入局部最优。然后基于这个随机的汤普森采样函数选择具有最大预测排序得分的设计点作为下一个候选点,本方法选择最优得分设计点保证算法的利用能力。The Thompson sampling function first randomly generates a sample from the posterior Gaussian distribution predicted by the GPC model The randomness of sample generation ensures the algorithm's exploration ability and avoids falling into local optimality. The Thompson sampling function selects the design point with the maximum prediction ranking score as the next candidate point. This method selects the optimal scoring design point to ensure the utilization capacity of the algorithm.
汤普森采样为:Thompson sampling is:
其中,(16)中省略了式(13)中的常数项Vol(D)-1,其不影响优化结果,是步骤4中精心挑选的代表点,本方法选择一个和所述代表点相比,平均获胜概率最高的设计点作为下一个候选点xnext。The constant term Vol(D) -1 in equation (13) is omitted in (16), which does not affect the optimization result. is the representative point carefully selected in step 4. This method selects a design point with the highest average winning probability compared with the representative point as the next candidate point x next .
具体的,本发明基于多起始点BFGS(multiple startingpointBroyden-Fletcher-Goldfarb-Shanno,MSP-BFGS)[18]全局优化算法对(16)中定义的优化问题进行求解,得到下一个候选点xnext。Specifically, the present invention solves the optimization problem defined in (16) based on the multiple starting point Broyden-Fletcher-Goldfarb-Shanno, MSP-BFGS) [18] global optimization algorithm to obtain the next candidate point x next .
图6显示了使用汤普森采样获取函数选择下一个候选点的步骤,其中,图6(a)展示了从偏好函数后验分布中随机采样得到的样本其中蓝色三角形对应最终选择的下一个候选点,沿着x′轴对偏好函数样本进行积分,可以得到相应的排序得分如图6(b)所示,具有最大排序得分的设计点(蓝色虚线所处位置)被选为xnext。可以看到,图6(a)中xnext处的蓝色虚线最大程度地穿过了深红色区域,表明其的成品率比其它设计点成品率高的概率最大。Figure 6 shows the steps of using Thompson sampling to obtain the function to select the next candidate point, where Figure 6(a) shows the sample randomly sampled from the posterior distribution of the preference function. The blue triangle corresponds to the next candidate point that is finally selected, and the preference function sample along the x′ axis By integrating, you can get the corresponding ranking score As shown in Figure 6(b), the design point with the maximum ranking score (the position of the blue dashed line) is selected as x next . It can be seen that the blue dashed line at x next in Figure 6(a) passes through the dark red area to the greatest extent, indicating that its yield is most likely to be higher than the yields of other design points.
步骤5.2:采用多尺度采样方法比较下一个候选点xnext与当前最优设计点xτ的成品率。Step 5.2: Use the multi-scale sampling method to compare the yield of the next candidate point xnext with the current optimal design point xτ .
下一个待比较设计对为[xnext,xτ],其中xτ表示当前最优成品率设计点。针对变尺度采样方法中工艺参数的标准差σ选择三个值,即1-σ、2-σ和2.5-σ。为每个σ下的成品率分析分配最大仿真次数Nmax,本发明取Nmax=100。依次将工艺参数的标准差σ值从1增加到2.5,对xnext进行成品率分析,获得比较结果hnext为:The next design pair to be compared is [x next , x τ ], where x τ represents the current optimal yield design point. Three values are selected for the standard deviation σ of the process parameters in the variable scale sampling method, namely 1-σ, 2-σ and 2.5-σ. The maximum number of simulations N max is assigned to the yield analysis under each σ, and the present invention takes N max = 100. The standard deviation σ of the process parameters is increased from 1 to 2.5 in sequence, and the yield analysis is performed on x next , and the comparison result h next is obtained as:
其中,设计点xa显著(dominantly)优于或者显著差于设计点xb定义为:The design point xa is significantly better or significantly worse than the design point xb, which is defined as:
其中τi表示i-σ下的当前最大成品率值,和σYi(x)分别为设计点x在i-σ下执行MC分析,得到的成品率值和相应的标准差,可由(10)和(11)计算得到。显著性表示在1-σ或2-σ或2.5-σ下,基于MC分析得到的xa的成品率概率意义上是否优于或者差于xb的成品率。Where τ i represents the current maximum yield value under i-σ, and σ Yi (x) are the yield values and corresponding standard deviations obtained by performing MC analysis on design point x under i-σ, which can be calculated by (10) and (11). The significance indicates whether the yield of x a obtained based on MC analysis is better or worse than the yield of x b in a probabilistic sense under 1-σ, 2-σ or 2.5-σ.
步骤5.3:根据步骤5.2的比较结果更新最优成品率候选集B,并从B中选出最优设计点,对其增加Nbatch次仿真,提升该点成品率分析精度。Step 5.3: Update the optimal yield candidate set B according to the comparison result of step 5.2, and select the optimal design point from B, increase N batches of simulations for it, and improve the yield analysis accuracy of this point.
如果下一个候选点xnext与当前最优设计点xτ的成品率比较结果hnext=1,最优成品率候选集B将被清空并加入xnext。如果在这3个工艺参数的标准差σ下,xnext与xτ的成品率始终没有显著差异,则将xnext加入最优成品率候选集B中。If the yield comparison result of the next candidate point x next and the current optimal design point x τ is h next = 1, the optimal yield candidate set B will be cleared and x next will be added. If there is no significant difference in the yield between x next and x τ under the standard deviation σ of the three process parameters, x next will be added to the optimal yield candidate set B.
为了获得最优成品率设计点x*的1-σ高精度成品率,本发明采用文献[12]提出的迭代式成品率分析方法逐渐提升其成品率分析精度。即,在每次迭代中,计算最优成品率候选集B中所有设计点的排序得分,然后选择排序得分最高的设计点,工艺参数标准差σ=1下在工艺空间采样Nbatch个仿真点,并进行SPICE仿真,逐渐提高其1-σ成品率分析精度。In order to obtain the 1-σ high-precision yield of the optimal yield design point x * , the present invention adopts the iterative yield analysis method proposed in the literature [12] to gradually improve its yield analysis accuracy. That is, in each iteration, the ranking scores of all design points in the optimal yield candidate set B are calculated, and then the design point with the highest ranking score is selected. N batches of simulation points are sampled in the process space under the process parameter standard deviation σ=1, and SPICE simulation is performed to gradually improve its 1-σ yield analysis accuracy.
步骤5.4:将步骤5.2新得到的数据点([xnext,xτ],hnext)加入数据集中。Step 5.4: Add the new data point ([x next , x τ ], h next ) obtained in step 5.2 to the data set.
步骤5.5:若成品率未满足要求并且迭代次数小于最大迭代次数Npbo,则跳转至步骤3,进行迭代优化;否则优化结束,输出最优设计参数和相应的成品率结果。Step 5.5: If the yield rate does not meet the requirement and the number of iterations is less than the maximum number of iterations N pbo , jump to step 3 and perform iterative optimization; otherwise, the optimization ends and the optimal design parameters and the corresponding yield rate results are output.
本发明提供了一种基于偏好学习模型的模拟电路成品率优化方法,其中,为了能够快速确定不同设计点成品率之间的优劣,采用多尺度采样方法,逐渐提高工艺参数分布的标准差σ并执行成品率分析,通过放大不同设计点成品率之间的差距降低分辨设计点优劣的仿真成本;其次,采用基于偏好学习的离散型高斯过程分类模型对设计点间多尺度采样成品率的比较结果进行建模;继而,利用高斯过程分类模型对比较结果建模,基于预测偏好的后验分布,利用汤普森采样获取函数平衡优化过程中的探索和利用,寻找在成品率比较中获胜概率最大的设计点,再接着,为利用多尺度采样时获得的成品率数值信息,采用多置信度建模方法,学习不同工艺参数标准差下成品率的相关性,将其用于排序得分近似,进一步提高算法的建模和优化效率。The present invention provides an analog circuit yield optimization method based on a preference learning model, wherein, in order to quickly determine the pros and cons of the yields of different design points, a multi-scale sampling method is adopted to gradually increase the standard deviation σ of the process parameter distribution and perform yield analysis, and the simulation cost of distinguishing the pros and cons of the design points is reduced by amplifying the gap between the yields of different design points; secondly, a discrete Gaussian process classification model based on preference learning is adopted to model the comparison results of the multi-scale sampling yields between the design points; then, the Gaussian process classification model is used to model the comparison results, based on the posterior distribution of the predicted preference, the exploration and utilization in the process of obtaining the function balance optimization by using Thompson sampling, and the design point with the highest probability of winning in the yield comparison is found, and then, in order to utilize the yield numerical information obtained during multi-scale sampling, a multi-confidence modeling method is adopted to learn the correlation of the yields under different process parameter standard deviations, and use it for sorting score approximation, so as to further improve the modeling and optimization efficiency of the algorithm.
本发明的优点在于:The advantages of the present invention are:
1.本发明提出基于偏好学习的方法将模拟电路成品率优化问题转化为排序得分优化问题,避免了频繁执行高精度成品率分析;1. The present invention proposes a method based on preference learning to transform the analog circuit yield optimization problem into a ranking score optimization problem, thereby avoiding the frequent execution of high-precision yield analysis;
2.将偏好贝叶斯优化方法应用于模拟电路的成品率优化,采用多尺度采样方法快速确定不同设计点成品率之间的优劣,根据偏好信息进行设计空间搜索,利用了贝叶斯优化方法采样效率高和多尺度采样成品率分析代价低的优势,提升模拟电路成品率优化效率;2. The preferred Bayesian optimization method is applied to the yield optimization of analog circuits. The multi-scale sampling method is used to quickly determine the advantages and disadvantages of the yields of different design points. The design space is searched based on the preference information. The advantages of the high sampling efficiency of the Bayesian optimization method and the low cost of multi-scale sampling yield analysis are utilized to improve the efficiency of analog circuit yield optimization.
3.实验结果表明,本发明与目前最好的模拟电路成品率优化方法相比,在不降低优化精度的条件下,仿真时间加速比为5.90~12.66倍。3. Experimental results show that, compared with the best analog circuit yield optimization method currently available, the simulation time acceleration ratio of the present invention is 5.90 to 12.66 times without reducing the optimization accuracy.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为模拟电路成品率和工艺参数分布标准差σ关系的示意图。FIG1 is a schematic diagram showing the relationship between the yield rate of an analog circuit and the standard deviation σ of the process parameter distribution.
图2为本发明流程图。FIG. 2 is a flow chart of the present invention.
图3为比较器电路的成品率曲线与相应排序得分曲线关系的示意图。FIG. 3 is a schematic diagram showing the relationship between a yield curve of a comparator circuit and a corresponding ranking score curve.
图4为真实偏好函数和GPC模型预测结果的比较图。Figure 4 is a comparison chart of the true preference function and the predicted results of the GPC model.
图5为单置信度GPR模型和多置信度NARGP模型拟合效果比较图。Figure 5 is a comparison of the fitting effects of the single-confidence GPR model and the multi-confidence NARGP model.
图6为利用汤普森采样获取函数获得下一个候选点的示意图。FIG. 6 is a schematic diagram of obtaining the next candidate point using the Thompson sampling acquisition function.
图7为比较器电路的电路图。FIG7 is a circuit diagram of a comparator circuit.
图8为电荷泵电路的电路图。FIG8 is a circuit diagram of a charge pump circuit.
具体实施方式DETAILED DESCRIPTION
以下通过具体实例的实施过程,进一步描述本发明方法。The method of the present invention is further described below through the implementation process of a specific example.
实施算例1Implementation Example 1
本算例采用如图7所示的电路。图7是在180nm工艺下具有1.8V供电电压的比较器电路的电路图。This example uses the circuit shown in Figure 7. Figure 7 is a circuit diagram of a comparator circuit with a 1.8V supply voltage in a 180nm process.
输入参数中,设计参数为晶体管的宽,共有12维;工艺参数包括所有全局和局部工艺扰动参数;电路性能的失效阈值为30℃下200MHz采样频率时的失调电压Voff≤30mV,灵敏电压Vsen≤2mV,最大工作频率speed≥1GHz;高斯过程分类模型的初始数据集的点数Ninit=30;偏好贝叶斯优化的最大迭代次数Npbo=800;排序得分代表点数量Nrep=100;变尺度采样成品率分析最大仿真次数Nmax=100;调用模拟电路性能优化解法器的最大仿真次数Npre=300;迭代式成品率分析每批仿真点数目Nbatch=30。Among the input parameters, the design parameter is the width of the transistor, which has a total of 12 dimensions; the process parameters include all global and local process perturbation parameters; the failure threshold of the circuit performance is the offset voltage V off ≤30mV at a sampling frequency of 200MHz at 30°C, the sensitive voltage V sen ≤2mV, and the maximum operating frequency speed≥1GHz; the number of points in the initial data set of the Gaussian process classification model N init =30; the maximum number of iterations of the preferred Bayesian optimization N pbo =800; the number of representative points of the sorting score N rep =100; the maximum number of simulations for variable scale sampling yield analysis N max =100; the maximum number of simulations for calling the analog circuit performance optimization solver N pre =300; the number of simulation points per batch for iterative yield analysis N batch =30.
本发明方法与Ref.[8]、Ref.[9]算法的比较结果如表1所示,其中PBO表示本发明提出的成品率优化算法。为了降低随机波动的影响,本算例所有算法均运行10次。模拟电路TT工艺角下性能优化解法器调用的仿真次数已经加入到PBO的结果中。The comparison results of the method of the present invention and the algorithms of Ref.[8] and Ref.[9] are shown in Table 1, where PBO represents the yield optimization algorithm proposed by the present invention. In order to reduce the impact of random fluctuations, all algorithms in this example are run 10 times. The number of simulations called by the performance optimization solver under the TT process corner of the analog circuit has been added to the results of PBO.
表1比较器电路的成品率优化结果和速度比较Table 1 Comparator circuit yield optimization results and speed comparison
由于Ref.[8]为本实例中最快的算法,因此以Ref.[8]作为速度基准。PBO方法在保证优化结果成品率高于99%的前提下,相对Ref.[8]方法加速比为12.66倍。实验结果验证了本方法的有效性。Since Ref.[8] is the fastest algorithm in this example, Ref.[8] is used as the speed benchmark. The PBO method has a speedup ratio of 12.66 times that of the Ref.[8] method while ensuring that the yield of the optimization result is higher than 99%. The experimental results verify the effectiveness of this method.
实施算例2Implementation Example 2
本算例采用如图8所示的电路。图8是在40nm工艺下的电荷泵电路的电路图。This example uses the circuit shown in Figure 8. Figure 8 is a circuit diagram of a charge pump circuit in a 40nm process.
输入参数中,设计参数为晶体管的长宽,共有36维;工艺参数包括所有全局和局部工艺扰动参数;电路性能的失效阈值为diff1≤25μA,diff2≤25μA,diff3≤10μA,diff4≤10μA,deviation≤6μA;其它输入参数同实施算例1。Among the input parameters, the design parameters are the length and width of the transistor, which has a total of 36 dimensions; the process parameters include all global and local process perturbation parameters; the failure threshold of the circuit performance is diff1≤25μA, diff2≤25μA, diff3≤10μA, diff4≤10μA, deviation≤6μA; other input parameters are the same as those in Example 1.
本方法与Ref.[8]和Ref.[9]算法的比较结果参见表2。由于Ref.[9]为本实例中最快的算法,因此以Ref.[9]作为速度基准。PBO方法在保证优化结果成品率高于99%的前提下,相对Ret.[9]方法加速比为6.07倍。实验结果验证了本方法的有效性。The comparison results of this method with the algorithms of Ref.[8] and Ref.[9] are shown in Table 2. Since Ref.[9] is the fastest algorithm in this example, Ref.[9] is used as the speed benchmark. The PBO method has a speedup ratio of 6.07 times relative to the Ret.[9] method while ensuring that the yield of the optimization result is higher than 99%. The experimental results verify the effectiveness of this method.
表2电荷泵电路的成品率优化结果和速度比较Table 2 Yield optimization results and speed comparison of charge pump circuit
实施算例3Implementation Example 3
本算例采用TSMC 65nm工艺设计的功率放大器,其工作频率为2.4GHz。它采用基于阵列的设计,包含2048个重复单元,每个单元包含4个晶体管,共有8192个晶体管。This example uses a power amplifier designed using TSMC 65nm technology, which operates at 2.4GHz. It uses an array-based design that contains 2048 repeating units, each unit contains 4 transistors, and a total of 8192 transistors.
输入参数中,设计参数为晶体管的长宽,共有5维;工艺参数包括所有全局和局部工艺扰动参数;电路性能的失效阈值为输出效率Eff≥57%,输出功率Pout≥22.5dBm和总谐波失真thd≤12.65dB;由于该功率放大器仿真时间极长,计算资源占用量高,该实验只重复6次并对结果进行统计,每次优化的最大仿真次数限制为30000次;其它输入参数同实施算例1。Among the input parameters, the design parameters are the length and width of the transistor, which have a total of 5 dimensions; the process parameters include all global and local process perturbation parameters; the failure threshold of the circuit performance is the output efficiency Eff ≥ 57%, the output power Pout ≥ 22.5dBm and the total harmonic distortion thd ≤ 12.65dB; due to the extremely long simulation time of the power amplifier and the high computing resource usage, the experiment was repeated only 6 times and the results were statistically analyzed, and the maximum number of simulations for each optimization was limited to 30,000 times; the other input parameters are the same as those in Example 1.
本方法与Ref.[8]和Ref.[9]算法的比较结果如表3所示。由于Ref.[9]为本实例中最快的算法,因此以Ref.[9]作为速度基准。Ref.[8]和Ref.[9]在6次重复实验中分别有2次和4次成功获得了目标成品率大于99%的设计点。本方法可以在所有六次重复实验中找到目标成品率设计点,平均需要4017次仿真,相比于Ref.[9]获得了5.90倍的加速比。实验结果验证了本方法的有效性。The comparison results of this method with the algorithms of Ref.[8] and Ref.[9] are shown in Table 3. Since Ref.[9] is the fastest algorithm in this example, Ref.[9] is used as the speed benchmark. Ref.[8] and Ref.[9] successfully obtained the design point with the target yield greater than 99% in 2 and 4 times in 6 repeated experiments respectively. This method can find the target yield design point in all six repeated experiments, requiring an average of 4017 simulations, and achieved a 5.90 times acceleration ratio compared to Ref.[9]. The experimental results verify the effectiveness of this method.
表3功率放大器电路的成品率优化结果和速度比较Table 3 Yield optimization results and speed comparison of power amplifier circuit
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