CN117434304A

CN117434304A - Common-ground chip test socket

Info

Publication number: CN117434304A
Application number: CN202210831943.3A
Authority: CN
Inventors: 黄瀚民; 曾照晖; 苏伟志
Original assignee: Taiwan Zhonghua Precision Measurement Technology Co ltd
Current assignee: Taiwan Zhonghua Precision Measurement Technology Co ltd
Priority date: 2022-07-14
Filing date: 2022-07-14
Publication date: 2024-01-23

Abstract

The invention discloses a common-ground chip test socket. The common ground chip test socket includes a metal housing, a metal holder, and a plurality of ground spring probes. The metal holder is mounted on the metal outer frame to jointly enclose and form a containing groove. The grounding spring probes are tightly fixed on the metal fixing seat in a matching way, so that the grounding spring probes, the metal fixing seat and the metal outer frame are electrically coupled with each other to form a common grounding connection framework. Wherein, each ground spring probe's both ends respectively wear out the metal holder, and each ground spring probe's one of them tip movably is located in the accommodation groove. Therefore, the common ground connection architecture can effectively achieve shielding and crosstalk suppression during signal transmission, so as to be beneficial to meeting higher performance test requirements.

Description

Common-ground chip test socket

Technical Field

The present disclosure relates to test sockets, and more particularly, to a common ground chip test socket.

Background

The conventional chip testing socket comprises an outer frame, an insulating plate arranged on the outer frame and a plurality of conductive terminals arranged on the insulating plate. The insulating board is made of engineering plastics, but the insulating board still has many defects (such as buckling deformation, hygroscopic expansion or poor heat conduction performance) which are difficult to overcome and affect the testing quality. Furthermore, as the communication frequency increases, the carrier frequency of the chip becomes higher and higher, so that the architecture of the existing chip test socket cannot meet the test requirements of the chip performance.

Accordingly, the present inventors considered that the above-mentioned drawbacks could be improved, and have intensively studied and combined with the application of scientific principles, and finally have proposed an invention which is reasonable in design and effectively improves the above-mentioned drawbacks.

Disclosure of Invention

An objective of the present invention is to provide a common ground chip test socket, which can effectively improve the defects possibly generated in the conventional chip test socket.

The embodiment of the invention discloses a common-ground chip test socket, which comprises: a metal outer frame; the metal holder is arranged on the metal outer frame so that the metal outer frame and the metal holder jointly enclose a containing groove; wherein, the metal holder is concavely provided with a plurality of grounding holes which are penetrated and communicated with the accommodating groove along a preset direction; the grounding spring probes are respectively arranged in the grounding holes of the metal holder; two ends of each grounding spring probe penetrate out of the metal holder respectively, and one end of each grounding spring probe is movably positioned in the accommodating groove along a preset direction; the grounding spring probes are respectively and tightly fixed in the grounding holes of the metal fixing seat, so that the grounding spring probes, the metal fixing seat and the metal outer frame are electrically coupled with each other to form a common grounding connection structure.

Preferably, each ground spring probe has a shank portion located between the two ends, and each ground spring probe is held in close fit with the shank portion in the corresponding ground aperture.

Preferably, in each grounding spring probe, a gap is formed between the block adjacent to each end of the needle body and the corresponding grounding hole.

Preferably, the metal holder comprises: a first metal plate forming the bottom of the accommodating groove; the second metal plate is connected to the first metal plate, and the thickness of the second metal plate is 50% -100% of the thickness of the first metal plate; each grounding hole is concavely formed on the first metal plate and the second metal plate along a preset direction, and each grounding spring probe is tightly fixed on at least one of the first metal plate and the second metal plate in a matching way.

Preferably, the metal holder is formed with a plurality of signal holes penetrating through and communicating with the accommodating groove, and each signal hole is concavely formed on the first metal plate and the second metal plate along a preset direction; wherein the common ground chip test socket further comprises: the signal spring probes are respectively arranged in the signal holes of the metal holder; and the plurality of insulating matching bodies are respectively arranged in the plurality of signal holes, and the plurality of insulating matching bodies are respectively coated on the plurality of signal spring probes, so that each signal spring probe is separated from the metal holder through the corresponding insulating matching body.

Preferably, each insulating matching body has a matching length in a preset direction, which is 30% -100% of a hole length of the corresponding signal hole in the preset direction.

Preferably, the matching length of any one of the insulating matching bodies is equal to the hole length of the corresponding signal hole, so as to generate a parasitic capacitance effect through the corresponding signal spring probe.

Preferably, the hole lengths of the plurality of signal holes are all the same, and the matching lengths of the plurality of insulating matching bodies have at least two different values.

Preferably, each insulation matching body comprises two lantern rings which are respectively positioned at two ends of the corresponding signal hole and respectively sleeved at two ends of the corresponding signal spring probe; the two lantern rings of each insulating matching body are respectively positioned in the first metal plate and the second metal plate.

Preferably, the bottom edge of the metal housing is formed with an annular groove, the metal holder is fixed in the annular groove, and the other end of each grounding spring probe protrudes out of the bottom edge of the metal housing.

In summary, the embodiment of the present invention provides the common-ground chip test socket, which uses the metal frame and the metal holder as the main structure of the whole, so that the common-ground chip test socket can achieve the technical effects of enhancing the structural rigidity, improving the heat conduction performance, and avoiding the expansion caused by absorbing moisture, thereby effectively maintaining the test quality stability of the common-ground chip test socket.

Furthermore, the common ground chip test socket disclosed in the embodiments of the present invention forms the common ground connection architecture through the plurality of grounding spring probes, the metal holder and the metal outer frame, so as to effectively achieve shielding and suppress crosstalk during signal transmission, so as to facilitate meeting the higher performance test requirements of the chip to be tested.

For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are included to illustrate and not to limit the scope of the invention.

Drawings

Fig. 1 is a schematic perspective view of a common-ground chip test socket according to an embodiment of the invention.

Fig. 2 is a schematic cross-sectional view of fig. 1 along section line II-II.

Fig. 3 is a schematic cross-sectional view of the common-ground chip test socket of fig. 2 mounted on a circuit board and used for testing a chip under test.

Fig. 4 is an exploded view of fig. 1.

Fig. 5 is an exploded view of the other view of fig. 1.

Fig. 6 is a partially exploded view of fig. 4.

Fig. 7 is a schematic cross-sectional view of fig. 4 along section line VII-VII.

Fig. 8 is a schematic cross-sectional view of fig. 4 along section line VIII-VIII.

Fig. 9 is a schematic perspective view of another embodiment of fig. 6.

Fig. 10 is a schematic perspective view of a further embodiment of fig. 6.

Detailed Description

The following specific examples are presented to illustrate the embodiments of the present invention disclosed herein with respect to a "common ground chip test socket" and those skilled in the art will appreciate the advantages and effects of the present invention from the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modifications and various other uses and applications, all of which are obvious from the description, without departing from the spirit of the invention. The drawings of the present invention are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or signal from another signal. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.

Please refer to fig. 1 to 10, which illustrate an embodiment of the present invention. As shown in fig. 1 to 3, the present embodiment discloses a common ground chip test socket 100, which includes a metal housing 1, a metal holder 2 mounted on the metal housing 1, a plurality of grounding spring probes 3 (pogo pins) and a plurality of signal spring probes 4 mounted on the metal holder 2, and a plurality of insulating matching bodies 5 respectively covering the plurality of signal spring probes 4, but the present invention is not limited thereto. For example, in other embodiments of the invention not shown, the plurality of signal spring probes 4 and the plurality of insulating matches 5 may be replaced by other configurations.

As shown in fig. 3 to 5, the metal frame 1 and the metal holder 2 together enclose a receiving slot S for a chip 200 to be tested to be placed therein. In this embodiment, the notch of the accommodating groove S is formed in the metal frame 1; that is, the bottom edge of the metal frame 1 is formed with an annular groove 11, and the metal holder 2 is fixed (e.g., locked) in the annular groove 11, so that the metal frame 1 and the metal holder 2 can be commonly used for mounting on a circuit board 300.

Accordingly, the metal casing 1 and the metal holder 2 are used as the main structure of the common-ground chip test socket 100 in the present embodiment, so that the common-ground chip test socket 100 can achieve the technical effects of enhancing the structural rigidity, improving the heat conduction performance, and avoiding swelling due to moisture absorption, thereby effectively maintaining the test quality stability of the common-ground chip test socket 100.

Further, as shown in fig. 3, 6, 7 and 8, the metal holder 2 is substantially plate-shaped and is concavely provided with a plurality of grounding holes 23 and a plurality of signal holes 24 along a predetermined direction D, wherein the grounding holes 23 and the signal holes are penetrating and are communicated with the accommodating groove S; that is, the ground holes 23 and the signal holes 24 have the same hole length L24 in the predetermined direction D. Wherein the preset direction D corresponds to a direction perpendicular to the metal holder 2, a plurality of the ground holes 23 and a plurality of the signal holes 24 are spaced apart from each other, and at least one signal hole 24 is disposed between any two adjacent ground holes 23.

In this embodiment, the metal holder 2 includes a first metal plate 21 and a second metal plate 22 connected to the first metal plate 21. The first metal plate 21 forms a bottom of the accommodating groove S, and the thickness T22 of the second metal plate 22 is 50% -100% of the thickness T21 of the first metal plate 21, but the present invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the metal holder 2 may be a single-layer plate or a stack of more than three layers.

Furthermore, the contours of the first metal plate 21 and the second metal plate 22 are aligned with each other, and each of the ground holes 23 and the signal holes 24 are concavely formed in the first metal plate 21 and the second metal plate 22 along the predetermined direction D; that is, the first metal plate 21 is formed with a portion of each of the ground holes 23 and a portion of each of the signal holes 24, and the second metal plate 22 is formed with the remaining portion of each of the ground holes 23 and the remaining portion of each of the signal holes 24.

The grounding spring probes 3 are respectively mounted in the grounding holes 23 of the metal holder 2, two end portions 31a and 31b of each grounding spring probe 3 respectively penetrate out of the metal holder 2, one end portion 31a of each grounding spring probe 3 is movably located in the accommodating groove S along the preset direction D and is defined as a testing end portion 31a, and the other end portion 31b of each grounding spring probe 3 protrudes out of the bottom edge of the metal outer frame 1 and is defined as a mounting end portion 31b for being mounted on the circuit board 300.

The grounding spring probes 3 are respectively and tightly held in the grounding holes 23 of the metal holder 2, so that the grounding spring probes 3, the metal holder 2 and the metal frame 1 are electrically coupled to each other to form a common ground connection structure, thereby effectively achieving shielding during signal transmission and suppressing crosstalk (for example, the common ground connection structure completely covers the periphery of the signal spring probes 4), so as to be beneficial to meeting the higher performance test requirements of the chip 200 to be tested.

Note that, the configuration and type of the plurality of grounding spring probes 3 are substantially the same as those in the present embodiment, so that only a single grounding spring probe 3 will be described below for convenience of description, but the present invention is not limited thereto. For example, in other embodiments of the invention not shown, the configuration or type of the plurality of said ground spring probes 3 may also differ slightly.

In more detail, the grounding spring probe 3 has a shank portion 32 located between the two end portions 31a, 31b and a conductive spring 33 located within the shank portion 32. The two ends of the conductive spring 33 are respectively elastically abutted against the two end portions 31a and 31b, so that the two end portions 31a and 31b can be electrically connected with each other. The test end 31a and the mounting end 31b may be movable in the predetermined direction D relative to the needle body 32 in the present embodiment, but the present invention is not limited thereto. For example, in other embodiments of the invention not shown, the mounting end 31b may also be of unitary construction with the needle body 32.

The grounding spring probes 3 are tightly held in the corresponding grounding holes 23 by the needle body 32; that is, the (needle body 32 of the) grounding spring probe 3 is held in close fit to at least one of the first metal plate 21 and the second metal plate 22. Furthermore, a gap G3 is formed between the block adjacent to each end 31a, 31b of the shank 32 and the corresponding ground hole 23, so as to facilitate the installation operation between the ground spring probe 3 and the corresponding ground hole 23.

The signal spring probes 4 are respectively mounted in the signal holes 24 of the metal holder 2, two end portions 41a and 41b of each signal spring probe 4 respectively penetrate through the metal holder 2, one end portion 41a of each signal spring probe 4 is movably located in the accommodating groove S along the preset direction D and is defined as a test end portion 41a, and the other end portion 41b of each signal spring probe 4 protrudes out of the bottom edge of the metal outer frame 1 and is defined as a mounting end portion 41b for being mounted on the circuit board 300.

The test end 41a and the mounting end 41b of each signal spring probe 4 are preferably coplanar with the test end 31a and the mounting end 31b of each ground spring probe 3, respectively, so as to facilitate the propping test of the chip 200 to be tested together and the mounting on the circuit board 300, but the invention is not limited thereto.

Furthermore, a plurality of the insulating matching bodies 5 are respectively disposed in a plurality of the signal holes 24, and a plurality of the insulating matching bodies 5 are respectively wrapped on a plurality of the signal spring probes 4, so that each signal spring probe 4 can be separated from the metal holder 2 by the corresponding insulating matching body 5 in the present embodiment.

Accordingly, each signal spring probe 4 can be more smoothly inserted into the metal holder 2 through the corresponding insulating matching body 5, and the metal holder 2 is provided with the insulating matching body 5 which is convenient for adjusting the external dimension, so that the aperture of the signal hole 24 can be adjusted according to the frequency band of signal transmission or the impedance requirement, thereby realizing the impedance matching effect.

In more detail, each of the insulating matching blocks 5 has a matching length in the predetermined direction D, which is 30% to 100% of the hole length L24 corresponding to the signal hole 24. That is, the insulating matching body 5 of the metal holder 2 can adjust the matching length according to the frequency band of signal transmission or the impedance requirement, so as to achieve the effect of impedance matching.

In this embodiment, each insulating matching body 5 includes two collars 51 respectively located at two ends of the corresponding signal hole 24 (for example, the two collars 51 are respectively located in the first metal plate 21 and the second metal plate 22), so that the two collars 51 of each insulating matching body 5 are respectively sleeved on the two ends 41a, 41b of the corresponding signal spring probe 4; in this embodiment, the two collars 51 can only be inserted into the first metal plate 21 and the second metal plate 22 along the predetermined direction D, but the invention is not limited thereto. For example, in other embodiments of the invention not shown, the insulating matching body 5 may be of a single-piece construction or be formed with three or more collars 51; alternatively, any one of the collars 51 may be inserted therein by the outer surface of the metal holder 2.

In addition, the matching lengths of the insulating matching members 5 (e.g., the sum of the lengths L51 of the two collars 51) may be the same according to design requirements (e.g., fig. 9 and 10), or may have at least two different values (e.g., fig. 6-8).

For example, as shown in fig. 7, the matching length is approximately 30% -85% of the hole length L24 corresponding to the signal hole 24; wherein the two collars 51 of any one of the insulating matching blocks 5 are disposed at a distance from each other and are separated by a medium (e.g., air); alternatively, as shown in fig. 8, the matching length (i.e., the sum of the lengths L51 of the two collars 51) of any one of the insulating matching members 5 is equal to the hole length L24 of the corresponding signal hole 24, so as to generate a parasitic capacitance effect by the corresponding signal spring probe 4.

As shown in fig. 3, 6, 7 and 8, the configuration and type of the plurality of signal spring probes 4 are substantially the same as those in the present embodiment, so that only a single signal spring probe 4 will be described below for convenience of explanation, but the present invention is not limited thereto. For example, in other embodiments of the invention not shown, the configuration or type of the plurality of signal spring probes 4 may also differ slightly.

In more detail, the signal spring probe 4 has a shank portion 42 located between the two end portions 41a, 41b and a conductive spring 43 located within the shank portion 42. Wherein, both ends of the conductive spring 43 are respectively elastically abutted against the two end portions 41a, 41b, so that the two end portions 41a, 41b can be electrically connected with each other. The test end 41a and the mounting end 41b may be movable in the predetermined direction D with respect to the needle body 42 in the present embodiment, but the present invention is not limited thereto. For example, in other embodiments of the invention not shown, the mounting end 41b may also be of unitary construction with the needle body 42.

The signal spring probe 4 is abutted against the corresponding insulation matching body 5 by the needle body part 42; that is, the two ends of the shank 42 of the signal spring probe 4 are respectively inserted into the two collars 51. Furthermore, a gap G4 is formed between the block adjacent to each end 41a, 41b of the shank 42 and the corresponding insulating matching member 5 (e.g. the collar 51), so as to facilitate the mounting operation between the signal spring probe 4 and the corresponding insulating matching member 5 (e.g. the collar 51).

It should be noted that, in the present embodiment, the signal spring probe 4 is preferably configured identically to the ground spring probe 3, but the present invention is not limited thereto. For example, in other embodiments of the invention not shown, the signal spring probe 4 and the ground spring probe 3 may be slightly different in structure.

[ technical Effect of embodiments of the invention ]

In addition, the common-ground chip test socket disclosed by the embodiment of the invention is provided with a plurality of insulating matching bodies, so that each signal spring probe can be more smoothly inserted into the metal holder. Furthermore, the metal holder can adjust the aperture of the signal hole or the matching length of the insulating matching body according to the frequency band of signal transmission or the impedance requirement, thereby realizing the impedance matching effect, and being beneficial to meeting the higher performance test requirement of the chip to be tested.

The foregoing disclosure is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, as all changes which come within the meaning and range of equivalency of the description and drawings are therefore intended to be embraced therein.

Claims

1. A common ground chip test socket, the common ground chip test socket comprising:

a metal outer frame;

the metal holder is arranged on the metal outer frame so that the metal outer frame and the metal holder are jointly surrounded to form a containing groove; wherein, the metal holder is concavely provided with a plurality of grounding holes which are penetrated and communicated with the accommodating groove along a preset direction; and

a plurality of grounding spring probes respectively mounted to a plurality of the grounding holes of the metal holder; wherein, two ends of each grounding spring probe respectively penetrate out of the metal holder, and one of the ends of each grounding spring probe is movably positioned in the accommodating groove along the preset direction;

the grounding spring probes are respectively and tightly fixed in the grounding holes of the metal fixing seat, so that the grounding spring probes, the metal fixing seat and the metal outer frame are electrically coupled to form a common grounding connection framework.

2. The common ground chip test socket of claim 1, wherein each of said ground spring probes has a shank portion between two of said ends, and each of said ground spring probes is held in close fit with said shank portion in a corresponding one of said ground holes.

3. The common ground chip test socket of claim 2, wherein a gap is formed between each of said ground spring probes and a corresponding one of said ground holes in a block adjacent to each of said ends of said shank.

4. The common-ground chip test socket of claim 1, wherein the metal holder comprises:

a first metal plate forming the bottom of the accommodating groove; a kind of electronic device with high-pressure air-conditioning system

The second metal plate is connected to the first metal plate, and the thickness of the second metal plate is 50% -100% of the thickness of the first metal plate;

each grounding hole is concavely formed on the first metal plate and the second metal plate along the preset direction, and each grounding spring probe is tightly fixed on at least one of the first metal plate and the second metal plate in a matching way.

5. The test socket of claim 4, wherein the metal holder is formed with a plurality of signal holes penetrating through and communicating with the receiving groove, and each signal hole is concavely formed in the first metal plate and the second metal plate along the predetermined direction; wherein the common ground chip test socket further comprises:

a plurality of signal spring probes respectively installed on a plurality of signal holes of the metal holder; a kind of electronic device with high-pressure air-conditioning system

The signal spring probes are respectively covered by the insulating matching bodies, so that each signal spring probe is separated from the metal holder through the corresponding insulating matching body.

6. The common-ground chip test socket of claim 5, wherein each of said dielectric matches has a matching length in said predetermined direction that is 30% to 100% of a hole length of said corresponding signal hole in said predetermined direction.

7. The common-ground chip test socket of claim 6, wherein said matching length of any one of said dielectric matches is equal to said hole length of the corresponding signal hole for enabling a parasitic capacitance effect to be generated by the corresponding signal spring probe.

8. The common-ground chip test socket of claim 6, wherein said hole lengths of said signal holes are all the same and said matching lengths of said insulating matches have at least two different values.

9. The common-ground chip test socket of claim 5, wherein each of said dielectric matches comprises two collars respectively positioned at opposite ends of said signal hole and respectively sleeved at opposite ends of said signal spring probe; the two collars of each insulating matching body are respectively positioned in the first metal plate and the second metal plate.

10. The common ground chip test socket of claim 1, wherein a bottom edge of said metal housing is formed with an annular groove, said metal retainer is secured within said annular groove, and one of said other ends of each of said ground spring probes protrudes beyond said bottom edge of said metal housing.